KR101148850B1

KR101148850B1 - Apparatus for molding an electric device

Info

Publication number: KR101148850B1
Application number: KR1020100007703A
Authority: KR
Inventors: 김태기
Original assignee: 주식회사 휘닉스 디지탈테크
Priority date: 2010-01-28
Filing date: 2010-01-28
Publication date: 2012-05-29
Also published as: KR20110088001A

Abstract

The electronic component molding apparatus includes a mold part having an upper mold on which an electronic component is mounted and a lower mold disposed to face the upper mold and having a cavity formed at a position corresponding to the electronic component, and between the upper mold and the lower mold, a release film is formed in the cavity. A film supply unit for supplying the release film on the cavity to cover the cavity, the upper mold and the lower mold, a clamping unit for clamping the release film, and a liquid resin for molding the electronic component on the release film. A resin supply unit for supplying to the lower mold, a driving unit for providing a driving force to raise and lower the lower mold relative to the upper mold, and an elastic member for elastically connecting the clamping unit and the lower mold; In conjunction with the lifting motion of the lower mold through the elastic member By lifting the clamping unit comprises a linkage unit which the clamping unit to clamp to the release film.

Description

Electronic component molding device {APPARATUS FOR MOLDING AN ELECTRIC DEVICE}

The present invention relates to an electronic component molding apparatus. More specifically, the present invention relates to a molding apparatus for an electronic component for molding the electronic component with a resin in a cavity using a release film.

In general, molding of an electronic component including a semiconductor chip mounted on a substrate using resin is performed. The semiconductor chip inside the electronic component may be protected from external moisture or impact through a molding process of molding the electronic component.

For the molding process, an electronic component molding apparatus including a mold unit having a cavity for a molding space and a film supply unit is used. Conventional electronic molding apparatus includes a film supply unit for supplying a release film to the upper and lower molds while applying a constant tension to the mold unit and the release film consisting of the upper and lower molds. The lower mold is formed with a cavity filled with a resin or a liquid resin in powder form. The electronic component is contained in a cavity filled with a resin so that the electronic component is resin molded. The release film is also arranged to cover the cavity inner surface. Therefore, after molding the electronic component using a resin, the electronic component molded using the release film can be easily separated from the lower mold.

Accordingly, it is an object of the present invention to provide an electronic component molding apparatus capable of effectively driving a release film and a lower mold.

Another object of the present invention is to provide an electronic component molding method capable of effectively driving the release film and the lower mold.

In order to achieve the object of the present invention described above, the electronic component molding apparatus according to an embodiment of the present invention is disposed on the upper mold and the upper mold to which the electronic component is mounted, and the lower mold having a cavity formed at a position corresponding to the electronic component. And a film supply unit for supplying the release film on the cavity, the upper mold and the lower mold such that a release film covers the cavity, between the mold portion having the upper mold and the lower mold. A clamping unit for clamping, a resin supply unit for supplying a liquid resin for molding the electronic component on the release film, disposed below the lower mold, and providing a driving force to raise and lower the lower mold relative to the upper mold By lifting and lowering the clamping unit in conjunction with the lifting motion of the driving unit and the lower die, It comprises a linkage unit which groups a clamping unit to clamp to the release film. Here, the cranking unit is disposed between the upper mold and the lower mold, the first plate for pressing the release film toward the upper surface of the lower mold, the second plate disposed to face the first plate below the lower mold It may include a guide bar penetrating the plate and the lower mold, interconnecting the first and second plates, and guides the lifting movement of the first plate. The linkage unit may further include a holding member configured to hold the second plate in order to control the lifting motion of the first and second plates during the lifting motion of the lower mold and the elastic member interconnecting the lower mold and the second plate. It may include. The holding part may include a support plate disposed below the second plate, extending upwardly from the support plate, and horizontally moving along the upper surface of the support plate, and holding or relaxing the second plate to move the lower plate up and down. And a holder for controlling the lifting movement of the second plate and a driving cylinder for providing a driving force to the holder.

The electronic component molding apparatus according to the exemplary embodiment of the present invention extends downward from the upper mold and penetrates the lower mold, and may further include guide posts for guiding the lifting motion of the lower mold.

In one embodiment of the present invention, the lower mold may be formed with vacuum holes for evacuating the cavity formed in the lower mold in order to coat the release film on the bottom surface of the cavity.

In the method of molding an electronic component according to an embodiment of the present invention, an upper mold on which an electronic component is mounted and a lower mold having a cavity corresponding to a molding shape of the electronic component are provided, and a movable mold part and a space between the upper mold and the lower mold are provided. It is disposed, and prepares a clamping plate provided to move in conjunction with the lifting motion of the lower mold. A release film is supplied over the cavity between the clamping plate and the lower mold. The lower mold is raised toward the clamping plate so that the lower mold and the clamping plate contact to clamp the release film. A liquid resin is supplied onto the release film, the upper mold and the lower mold are clamped to each other to immerse the electronic component in the cavity in which the liquid resin remains. The lower mold is first lowered to open the lower mold from the upper mold, and then the lower mold is second lowered to separate the lower mold from the clamping plate. Here, before the upper mold and the lower mold are mutually clamped, the release film may be adhered to the cavity as a whole by vacuum adsorbing the release film on the bottom surface of the cavity.

According to the embodiments of the present invention, the lower mold and the clamping unit for clamping the release film includes an interlocking unit for driving in conjunction, so that the lifting motion and the clamping unit of the lower mold are driven independently without driving independently to release. The film can be clamped or released effectively. In addition, the control unit for driving the clamping unit can be omitted.

1 is a cross-sectional view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention.
2 is a side view of the electronic component molding apparatus of FIG. 1.
3 and 4 are side views for explaining driving of the electronic component molding apparatus of FIG. 2.

An electronic component molding apparatus and an electronic component molding method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a plan view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention. 2 is a side view of the electronic component molding apparatus of FIG. 1.

1 and 2, an electronic component molding apparatus according to an exemplary embodiment of the present invention may be used to mold an electronic component with a resin or to form a lens on the electronic component. In addition, examples of the electronic component may include a semiconductor chip or an LED chip.

Meanwhile, the electronic component 10 may include a substrate 11 and a plurality of chips 13 mounted on the substrate 11. The substrate 11 may be a PCB substrate and the chips 13 may be mounted on the substrate 11 through a wire bonding process or a solder reflow process.

The electronic component molding apparatus 100 includes a mold unit 110 having two molds disposed to face each other, a film supply unit 120, a clamping unit 130, a resin supply unit 140, and a driving unit 150. ) And the interlocking unit 160.

In the molding apparatus 100, two molds 111 and 114 may be disposed to face each other. The molds 111 and 114 may be used to mold the electronic components 10 using a resin, for example, a liquid resin.

The mold part 110 may include an upper mold 111 and a lower mold 114, and the lower mold 114 may be disposed to be movable in the vertical direction.

The upper die 111 may include an upper press 112 and an upper die 113. The upper die 113 may be disposed on the lower surface of the upper press 112. In addition, the upper die 113 may have a lower surface on which the electronic component 10 is loaded.

Although not shown, the upper mold 111 may be configured to hold vacuum holes and / or grip the electronic component 10 on the lower surface of the upper die 113 to adsorb and fix the electronic component 10. It may include a gripping portion.

The lower mold 114 may include a lower press 115, a lower die 116, a cavity member 117, and a clamping member 118. The lower die 116 may be disposed on the lower press 115, and the cavity member 117 may be disposed on the lower press 115 to surround the lower die 116. For example, the cavity member 117 may be elastically supported by the first elastic member 117a disposed on the lower press 115.

On the other hand, the bottom surface of the lower die 116 and the inner surface of the cavity member 117 define the cavity CA. In particular, the lower die 116 may have an upper surface that forms a bottom surface of the cavity CA for molding the electronic component 10 with a resin. The cavity member 117 may have a ring shape disposed to surround the lower die 116. In particular, the cavity member 117 may be disposed to protrude upward from the lower die 116, and may have inner surfaces defining the cavity CA.

The lower die 116 may have vacuum holes 119 for sucking the release film 20 and covering the bottom and side surfaces of the cavity CA.

The clamping member 118 clamps the release film 20 together with the clamping unit 130. In addition, the clamping member 118 may be elastically supported by the second elastic member 118a disposed on the lower press 115. Therefore, the clamping member 118 having elasticity can stably clamp the release film 20.

The electronic component molding apparatus 100 according to the exemplary embodiment of the present invention may further include a guide post 180 connecting the upper mold 111 and the lower mold 114. The guide post 180 extends downward from the lower surface of the upper mold 111 to pass through the lower mold 114. The guide post 180 may guide the lifting motion of the lower mold 114.

The film supply unit 120 supplies a release film 20 between the upper mold 111 and the lower mold 114. The release film 20 covers the bottom and side surfaces of the cavity CA. Therefore, the release film 20 can easily separate the electronic component 10 from the cavity CA. For example, the film supply unit 120 may include a supply roller 122 and a winding roller 124 disposed on both sides of the mold unit 110. The supply roller 122 rotates to supply the unused release film 20 into the mold unit 110, and the winding roller 124 rotates the release film 20 used for the engineer in the mold unit 101. Recover.

The clamping unit 130 clamps the release film 20. Thus, the clamping unit 130 prevents the release film 20 from deviating from the upper surface of the lower die 116 and the inner surface of the cavity member 117 defining the cavity CA.

The resin supply unit 140 may be disposed adjacent to the mold unit 110. The resin supply unit 140 may supply resin into the cavity CA while the release film 20 covers the bottom and side surfaces of the cavity CA. Alternatively, the resin supply unit 140 may supply the resin onto the release film 20 in a state in which the release film 20 is spaced apart from the bottom surface of the cavity CA.

The driving unit 150 is disposed below the lower mold 114. The driving unit 150 provides a driving force to raise and lower the lower mold 114 relative to the upper mold 111. The drive unit 150 may include, for example, a hydraulic jack.

The driving unit 150 may lift the lower mold 114 to contact the lower mold 114 with the upper mold 111. In addition, when the driving unit 150 raises and lowers the lower mold 114, the clamping unit 130 may interlock to clamp the release film 20. A detailed description thereof will be given later.

The linkage unit 160 raises and lowers the clamping unit 130 in association with the lifting movement of the lower mold 114. The interlocking unit 160 does not drive the clamping unit 130 independently of the lifting motion of the lower die 114, while the lower die 114 and the clamping unit may be driven through the interlocking unit 160. 130 to move in conjunction with. Therefore, the driving unit for independently driving the clamping unit 130 may be omitted. Furthermore, the controller for independently controlling the clamping unit 130 according to the lifting motion of the lower mold 114 may be omitted.

In one embodiment of the present invention, the clamping unit 130 may include a first plate 131, a second plate 132 and guide bars 135.

The first plate 131 is disposed between the upper mold 111 and the lower mold 114. In addition, the first plate 131 contacts the lower mold 114 to clamp the release film 20. The first plate 131 has a hollow 131a at a position corresponding to the cavity CA. Therefore, the first plate 131 is clamped with the clamping member 118 included in the lower mold 114 to clamp the release film 20.

The second plate 132 is disposed below the lower mold 114. The second plate 132 is disposed to face the first plate 131 with the lower mold 114 therebetween. The second plate 132 is connected to the lower mold 114.

The guide bars 135 are disposed to penetrate the lower mold 114. The guide bars 135 interconnect the first and second plates 131 and 132. That is, the guide bars 135 maintain the first and second plates 131 and 132 at predetermined intervals through the through holes 115a formed in the lower press 115. That is, when the second plate 132 is elevated, the first plate 131 may also be elevated. When the second plate 132 maintains a certain height, the height of the first plate 131 is also increased. Can be maintained.

In one embodiment of the present invention, the interlocking unit 160 may include a third elastic member 161 and a holding unit 166.

The elastic member 161 is disposed between the lower mold 114 and the second plate 132. The elastic member 161 elastically connects the lower press 115 and the second plate 132 to each other. The elastic member 161 may include, for example, a spring. For example, when the elastic member 161 is relaxed, the distance between the lower mold 114 and the second plate 132 may be narrowed by the restoring force of the elastic member 161. Accordingly, the first plate 131 connected to the second plate 132 by the guide bars 135 is raised relative to the lower mold 114 so that the first plate 131 opens the release film. . Thus, the film supply unit 120 may supply a new release film.

Unlike this, when the elastic member 161 is contracted, the distance between the lower mold 114 and the second plate 132 may be increased by the restoring force of the elastic member 161. Accordingly, the first plate 131 connected to the second plate 132 by the guide bars 135 descends relative to the lower mold 114 so that the first plate 131 clamps the release film. .

The holding part 166 controls the lifting motion of the second plate 132 during the lifting motion of the lower mold 114. For example, the holding unit 166 may hold the second plate 132 to fix the height of the second plate 132. Therefore, the height of the first plate 131 connected to the second plate 132 is fixed so that the first plate 131 is caught with the clamping member 128 of the lower mold 114 to release the release film 20. Can be clamped Alternatively, the holding part 166 may be relaxed from the second plate 132 so that the second plate 132 may also be lifted with the lower mold 114. Therefore, the lower mold 114 and the second plate 132 may maintain a constant interval.

In one embodiment of the present invention, the holding part 166 may include a support plate 167, a holder 168 and a driving cylinder 169.

The support plate 167 is disposed below the second plate 132. The guide posts 180 are fastened to the side of the support plate 167.

The holder 168 extends upward from the support plate 167. The holder 168 is provided to horizontally move along an upper surface of the support plate 167. The holder 168 controls the lifting motion of the second plate 132 according to the lifting motion of the lower mold 114 by holding or relaxing the second plate 132. That is, when the holder 168 advances toward the center of the second plate 132 along the upper surface of the support plate 167, the holder 168 holds the side of the second plate 132. Therefore, when the holder 168 holds the second plate 132, the second plate 132 is maintained at a height. As a result, the height of the first plate 131 is maintained when the lower mold 114 is raised and lowered, and the release film 20 can be clamped when the lower mold 114 is clamped with the first plate 132. Can be. Alternatively, when the holder 168 is away from the center of the second plate 132, the holder 168 relaxes the second plate 132. Therefore, the third elastic member 161 disposed between the second plate 132 and the lower mold 114 lifts the second plate 132 by a restoring force. Therefore, the first plate 131 connected to the second plate 132 is also lifted so that the first plate 131 can release the clamping of the release film 20.

Meanwhile, an inner space of the cavity CA may be covered by the release film 20. That is, the release film 20 may be coated on the bottom and inner surfaces of the cavity CA by the vacuum pressure provided through the vacuum hole 119 of the lower die 116.

The electronic component molding apparatus 100 according to the exemplary embodiment may further include a sealing unit 170.

The sealing unit 170 includes a lower tube 176 disposed on the upper surface of the lower press 115 and an upper tube 171 disposed on the lower surface of the upper press 111. Here, the lower tube 176 may be in close contact with the upper tube 171 by raising the lower mold 120. In addition, a first sealing member 175 may be interposed between the upper tube 171 and the lower tube 176. In addition, a second sealing member 177 may be interposed between the lower tube 176 and the lower press 115. As a result, a space enclosed by the upper press 111, the upper tube 171, the first sealing member 175, the lower tube 176, the second sealing member 177, and the lower press 115 is formed. Can be. The pressure inside the sealed space may be kept lower than atmospheric pressure during the molding process of the electronic component 10.

3 and 4 are side views for explaining driving of the electronic component molding apparatus of FIG. 2.

1 and 2, a mold unit 110 including an upper mold 111 and a lower mold 114 is prepared. In this case, the electronic component 10 may be mounted on the upper mold 111. In addition, the lower mold 114 is provided with a cavity CA corresponding to the molding shape of the electronic component 10. In addition, the first mold 131 is disposed between the lower mold 114 and the upper mold 111 and is elevated in conjunction with the lifting motion of the lower mold 114. In this case, the second plate 132 connected to the first plate 131 and the lower mold may be spaced apart from each other by a first distance d1.

Subsequently, the release film 20 is positioned between the upper mold 111 and the lower mold 114 while the upper mold 111 and the lower mold 114 are spaced apart from each other. In this case, the upper die 113 included in the upper mold 111 may hold the substrate 11 on which the chips 13 are mounted. The release film 20 may be supplied through, for example, a supply roller 122 and a winding roller 124 disposed to face each other outside the upper mold 111 and the lower mold 114.

Referring to FIG. 3, the lower mold 114 is raised toward the first plate 131 to contact the lower mold 114 and the first plate 131 to clamp the release film 20. At this time, the height of the first plate 131 is maintained. That is, the height of the second plate 132 connected to the first plate 131 is fixed by the interlocking unit 160 so that the height of the first plate 131 is also fixed. At this time, the elastic member 161 is relaxed so that the elastic member 161 and the lower mold 114 has a second distance (d2).

The release film 20 is sucked with a vacuum force through a vacuum hole (see 119 of FIG. 1) formed in the lower die 116 to cover the bottom and side surfaces of the cavity CA.

Subsequently, a liquid resin is supplied onto the release film 20 through the hollow 131a of the first plate 131. The liquid resin may supply a resin to fill the cavity CA by the resin supply unit (140 of FIG. 1).

Subsequently, although not shown, the lower mold 114 is raised to contact the upper mold 111, and the electronic component 10 fixed to the upper mold 111 is precipitated in the cavity CA in which the liquid resin is accommodated. Thereafter, after a predetermined time, the liquid resin is cured to form the electronic component 10 using the cured resin. For example, the electronic component 13 mounted on one surface of the substrate 11 may be molded of a cured resin. Alternatively, a plurality of electronic components mounted on both surfaces of the substrate 11 may be molded of a cured resin.

Referring to FIG. 4, the lower mold 114 is first lowered until the lower mold 114 is lower than the film supply unit 120. Thereafter, the interlocking unit 160, particularly the holding unit 166, is relaxed with the second plate 132. Therefore, since the second plate 132 is in a floating state, the second plate 132 is raised by the restoring force of the elastic member 161, so that the distance between the lower mold 114 and the second plate 132 is the first distance d1. To recover. In this case, the first plate 131 is raised relative to the lower mold 114 so that the first plate 131 and the lower mold 114 are spaced apart from each other, thereby providing a space for resupplying the release film 20. Can be secured. Subsequently, the lower mold 120 is further lowered secondly.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Such an electronic component molding apparatus according to the present invention includes an interlocking unit in which the clamping unit for clamping the lower mold and the release film is interlocked to drive the lower mold and the clamping unit. The release film can be clamped or released effectively. Further, the control unit for driving the clamping unit can be omitted. The present invention can be applied to a method and apparatus for molding an electronic component using a liquid resin.

100: electronic component molding device 110: mold part
111: upper type 112: upper press
113: upper die 114: lower die
115: lower press 115a: through hole
116: lower die 117: cavity member
117a: first elastic member 118: clamping member
118a: second elastic member 119: vacuum hole
120: film supply unit 122: feed roller
124: winding roller 130: clamping unit
131: first plate 131a: hollow
132: second plate 135: guide bar
140: resin supply unit 150: drive unit
160: linkage unit 161: third elastic member
166: holding part 167: support plate
168: holder 169: drive cylinder
170: sealing portion 171: upper tube
175: first sealing member 176: lower tube
177: second sealing member 180: guide post
10: electronic component 11: substrate
13: Chip CA: Cavity

Claims

A mold part having an upper mold to which the electronic component is mounted and a lower mold disposed to face the upper mold and having a cavity formed at a position corresponding to the electronic component;
A film supply unit for supplying the release film on the cavity between the upper mold and the lower mold such that a release film covers the cavity;
A clamping unit disposed between the upper mold and the lower mold, for clamping the release film;
A resin supply unit for supplying a liquid resin for molding the electronic component on the release film;
A driving unit disposed below the lower mold and providing a driving force to raise and lower the lower mold relative to the upper mold;
And an elastic member for elastically connecting the clamping unit and the lower mold, and interlocking the elevating motion of the lower mold through the elastic member to elevate the clamping unit so that the clamping unit clamps the release film. unit; And
And a guide posts extending downwardly from the upper mold to penetrate the lower mold and for guiding the lifting motion of the lower mold.

The method of claim 1, wherein the clamping unit,
A first plate disposed between the upper mold and the lower mold, for urging the release film toward the upper surface of the lower mold;
A second plate disposed below the lower mold so as to face the first plate; And
And guide bars penetrating the lower mold to interconnect the first and second plates and maintain the first and second plates at a predetermined interval.

The method of claim 2, wherein the elastic member of the linkage unit interconnects the lower mold and the second plate,
The interlocking unit,
And a holding part holding the second plate to control the lifting motion of the first and second plates during the lifting motion of the lower die.

The method of claim 3, wherein the holding unit,
A support plate disposed below the second plate;
A holder extending upwardly from the support plate and horizontally moving along an upper surface of the support plate, the holder controlling the lifting movement of the second plate during the lifting movement of the lower die by holding or relaxing the second plate; And
And a drive cylinder for providing a driving force to the holder.

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The electronic component molding apparatus of claim 1, wherein the lower mold includes vacuum holes for evacuating the cavity formed in the lower mold to coat the release film on the bottom surface of the cavity.

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