TWI440104B - Resin encapsulating apparatus and resin encapsulating method - Google Patents
Resin encapsulating apparatus and resin encapsulating method Download PDFInfo
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- TWI440104B TWI440104B TW100128703A TW100128703A TWI440104B TW I440104 B TWI440104 B TW I440104B TW 100128703 A TW100128703 A TW 100128703A TW 100128703 A TW100128703 A TW 100128703A TW I440104 B TWI440104 B TW I440104B
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- substrate
- mold
- resin
- frame guide
- female mold
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- 229920005989 resin Polymers 0.000 title claims description 131
- 239000011347 resin Substances 0.000 title claims description 131
- 238000000034 method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 132
- 239000000463 material Substances 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000005381 potential energy Methods 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 24
- 230000003287 optical effect Effects 0.000 description 13
- 239000007788 liquid Substances 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
本發明係有關於一種用以將搭載於基板之至少一面之半導體裝置、例如積體電路、光半導體元件封裝樹脂之樹脂封裝裝置及樹脂封裝方法。The present invention relates to a resin package device and a resin package method for mounting a semiconductor device mounted on at least one surface of a substrate, for example, an integrated circuit, an optical semiconductor element encapsulating resin.
用以將搭載於表面之半導體元件等電子零件封裝樹脂之基板有由散熱特性優異之陶瓷材料構成，且搭載有LED、半導體雷射等光電子零件、功率半導體元件等之陶瓷基板。又，有將樹脂封裝材料供至設在下模具之模穴，以浸漬基板之電子零件，封裝樹脂，於封裝樹脂後，將成形品從模具脫模之情形。舉例言之，如專利文獻1之第1圖所示，有下述結構，前述結構係將樹脂封裝材料8供至設在下模具2之模穴3，並將基板裝設固定於可動銷6，以上模具1與下模具2夾持基板，合模後，封裝樹脂，再以可動銷6頂出成形品之基板10者。A substrate made of an electronic component encapsulating resin such as a semiconductor element mounted on a surface is made of a ceramic material having excellent heat dissipation characteristics, and a ceramic substrate such as an optoelectronic component such as an LED or a semiconductor laser or a power semiconductor element is mounted. Further, a resin encapsulating material is supplied to a cavity provided in the lower mold to impregnate the electronic component of the substrate, and the resin is encapsulated, and after the resin is encapsulated, the molded article is released from the mold. For example, as shown in the first drawing of Patent Document 1, there is a structure in which the resin encapsulating material 8 is supplied to the cavity 3 provided in the lower mold 2, and the substrate is mounted and fixed to the movable pin 6. The mold 1 and the lower mold 2 sandwich the substrate, and after the mold is closed, the resin is sealed, and the substrate 10 of the molded product is ejected by the movable pin 6.
專利文獻1 日本專利公開公報2006-245151號Patent Document 1 Japanese Patent Laid-Open Publication No. 2006-245151
然而，在前述樹脂封裝裝置中，在開啟上模具1與下模具2之狀態下，使樹脂封裝材料供給裝置進入上模具1與下模具2間，將樹脂封裝材料8供至設在下模具2之模穴3後，使樹脂封裝材料供給裝置退出。然後，使基板搬送裝置(圖中未示)進入上模具1與下模具2間，將基板10裝設固定於下模具2之可動銷6後，使基板搬送裝置退出。接著，藉以上模具1與下模具2夾持基板10後，合模，以封裝樹脂。因此，由於將樹脂封裝材料供至模穴後至封裝樹脂為止費時，故無法使用硬化時間短之樹脂封裝材料。However, in the resin encapsulating apparatus described above, in a state where the upper mold 1 and the lower mold 2 are opened, the resin encapsulating material supply device is introduced between the upper mold 1 and the lower mold 2, and the resin encapsulating material 8 is supplied to the lower mold 2 After the cavity 3, the resin encapsulating material supply device is withdrawn. Then, a substrate transfer device (not shown) is placed between the upper mold 1 and the lower mold 2, and the substrate 10 is attached and fixed to the movable pin 6 of the lower mold 2, and then the substrate transfer device is ejected. Next, after the substrate 10 is sandwiched between the upper mold 1 and the lower mold 2, the mold is closed to encapsulate the resin. Therefore, since it takes time to supply the resin encapsulating material to the cavity after encapsulating the resin, it is not possible to use a resin encapsulating material having a short curing time.
又，由於上模具1與下模具2加熱至適合樹脂成形之溫度，而基板10為常溫，故直接在此狀態下封裝樹脂時，已熔融之樹脂材料被基板10奪熱，流動性降低，而易產生未填充或空隙等問題。因此，於封裝樹脂之際，需預先將基板10加熱，而在前述樹脂封裝裝置，需要將上模具1壓抵基板1後加熱，達到預定溫度為止之等待時間。Further, since the upper mold 1 and the lower mold 2 are heated to a temperature suitable for resin molding, and the substrate 10 is at normal temperature, when the resin is directly encapsulated in this state, the molten resin material is heated by the substrate 10, and the fluidity is lowered. It is easy to cause problems such as unfilled or voids. Therefore, when encapsulating the resin, it is necessary to heat the substrate 10 in advance, and in the above-described resin encapsulating apparatus, it is necessary to press the upper mold 1 against the substrate 1 and heat it to a predetermined temperature.
再者，在前述樹脂封裝裝置，使成形品以可動銷6頂出而脫模時，基板10可以前述頂出銷6之狹窄前端面頂出。因此，有基板10自身因被頂出之際之衝擊力而破損之虞。特別是於為成形品之封裝樹脂8產生裂縫時，有為被封裝物之半導體元件9或Au線11破損之虞，而有成品率差之問題點。Further, in the resin sealing device, when the molded article is ejected by the movable pin 6 and released, the substrate 10 can be ejected from the narrow front end surface of the ejector pin 6. Therefore, there is a flaw in the substrate 10 itself due to the impact force at the time of ejection. In particular, when a crack occurs in the encapsulating resin 8 of the molded article, there is a problem that the semiconductor element 9 or the Au wire 11 of the package is damaged, and the yield is poor.
本發明鑑於前述問題點，其課題係提供一種防止將安裝在基板之半導體元件業經封裝樹脂之成形品從模具脫模之際可能產生之基板的破損，成品率高之樹脂封裝裝置及樹脂封裝方法。In view of the above-mentioned problems, the present invention provides a resin encapsulating apparatus and a resin encapsulating method which prevent damage of a substrate which may occur when a molded article of a semiconductor element mounted on a substrate is released from a mold by a mold, and which has a high yield. .
為解決前述課題，本發明之樹脂封裝裝置之結構係由上模具組及下模具組構成，該上模具組於下面具有可保持基板之保持機構，該下模具組於上面搭載具有模穴部之陰模，且可透過水平移動機構，沿著底板在成形位置及待機位置間來回移動，且藉由以合模機構使位於前述成形位置之前述陰模上下移動，可以前述上模具組之下面與前述下模具組之陰模，夾持安裝有電子零件之前述基板而合模，且將前述基板之電子零件浸漬於供給至前述模穴部之樹脂封裝材料，以進行樹脂封裝，並於前述陰模之外周中至少對向之2邊配置框架導件，而可以前述框架導件頂推前述基板之外周緣部而脫模。In order to solve the above problems, the resin encapsulating apparatus of the present invention is constituted by an upper mold set and a lower mold set having a holding mechanism for holding a substrate on the lower surface, and the lower mold set is provided with a cavity portion on the upper surface. a female mold, which is movable back and forth between the forming position and the standby position along the bottom plate through the horizontal moving mechanism, and can move the female mold located at the forming position up and down by a clamping mechanism to be under the upper mold group The female mold of the lower mold set is clamped by sandwiching the substrate on which the electronic component is mounted, and the electronic component of the substrate is immersed in a resin encapsulating material supplied to the cavity portion for resin encapsulation, and the The frame guide is disposed on at least two of the outer circumferences of the mold, and the frame guide can be pushed out by pushing the outer peripheral portion of the substrate.
根據本發明，配置於陰模之外周之至少2邊的框架導件不是以點，而是以線抬起基板之外周緣部而脫模。因此，由於可分散、緩和負載於基板之外周緣部之外力的集中，故不僅可防止前述基板之破損，亦可防止安裝於前述基板之半導體元件、金屬線之破損。According to the present invention, the frame guides disposed on at least two sides of the outer circumference of the female mold are not demolded by dots, but are lifted by the outer peripheral portion of the substrate by the wire. Therefore, since the concentration of the force other than the peripheral portion of the substrate can be dispersed and moderated, the damage of the substrate can be prevented, and the semiconductor element or the metal wire attached to the substrate can be prevented from being damaged.
又，由於可使下模具組在成形位置及待機位置間來回移動，故不需使樹脂封裝材料供給裝置及基板搬送裝置進入至上下模具間，可縮小上下模具之開啟量，而可縮小樹脂封裝裝置全體。特別是因可縮小開啟量，故亦可縮小合模機構，而可使樹脂封裝裝置更進一步小型化。Moreover, since the lower mold set can be moved back and forth between the forming position and the standby position, the resin sealing material supply device and the substrate transfer device do not need to enter between the upper and lower molds, and the opening amount of the upper and lower molds can be reduced, and the resin package can be reduced. The whole device. In particular, since the opening amount can be reduced, the mold clamping mechanism can be reduced, and the resin packaging device can be further miniaturized.
再者，由於合模機構僅使陰模運作，故相較於使下模具組全體運作之情形，可抑制合模所需之驅動力，而可獲得小型且低價之樹脂封裝裝置。Further, since the mold clamping mechanism operates only the female mold, the driving force required for the mold clamping can be suppressed as compared with the case where the entire lower mold group is operated, and a small and inexpensive resin packaging device can be obtained.
又，由於上模具組之下面具有可保持基板之保持機構，故將樹脂封裝材料供至下模具組之模穴部，移動至成形位置後，可直接將前述基板進行合模，來封裝樹脂。因此，由於亦可使用硬化時間短之樹脂封裝材料，故不僅可獲得通用性高之樹脂封裝裝置，還可獲得成形週期短，生產性高之樹脂封裝裝置。Further, since the lower mold layer has a holding mechanism for holding the substrate, the resin sealing material is supplied to the cavity portion of the lower mold set, and after moving to the molding position, the substrate can be directly clamped to encapsulate the resin. Therefore, since a resin encapsulating material having a short curing time can be used, not only a highly versatile resin encapsulating device but also a resin encapsulating device having a short molding cycle and high productivity can be obtained.
特別是框架導件被賦與朝脫模方向之勢能時，當前述框架導件位於待機位置時，將基板搭載於前述框架導件之內側緣部之際或使搭載有前述基板之前述框架導件從待機位置移動至成形位置時，基板呈懸空狀態。因此，可防止安裝於前述基板之下面之電子零件及將前述電子零件與基板連接之金屬線等抵接陰模。In particular, when the frame guide is biased in the direction of the mold release, when the frame guide is at the standby position, the substrate is mounted on the inner edge of the frame guide or the frame guide on which the substrate is mounted When the piece moves from the standby position to the forming position, the substrate is suspended. Therefore, it is possible to prevent the electronic component mounted on the lower surface of the substrate and the metal wire or the like connecting the electronic component to the substrate from coming into contact with the female mold.
本發明之實施形態其結構亦可為將框架導件以彈簧力賦與朝向從陰模將成形品脫模之方向之勢能。The embodiment of the present invention may be configured to impart a potential force in a direction in which the frame guide is released from the female mold by a spring force.
根據本實施形態，可利用依據彈力之框架導件之賦與勢能力，將成形品從陰模脫模。因此，由於使用其他脫模用構件時，亦可減低前述脫模用構件之驅動力，故可獲得易設計，且生產能量低之樹脂封裝裝置。According to the present embodiment, the molded article can be released from the female mold by the imparting ability of the frame guide according to the elastic force. Therefore, when other members for mold release are used, the driving force of the above-mentioned mold release member can be reduced, so that a resin package device which is easy to design and has low production energy can be obtained.
本發明另一實施形態其結構亦可為將框架導件形成包圍陰模之外周之框狀。According to another embodiment of the present invention, the frame guide may be formed in a frame shape surrounding the outer periphery of the female mold.
根據本實施形態，由於可以框狀框架導件抬起基板之外周緣部，故可更進一步分散、緩和負載於前述基板之外力。因此，可更進一步有效地防止前述基板之破損。According to the present embodiment, since the frame-shaped frame guide can lift the outer peripheral portion of the substrate, the force applied to the substrate can be further dispersed and relaxed. Therefore, the damage of the aforementioned substrate can be further effectively prevented.
本發明又另一實施形態其結構亦可為將框架導件形成可將前述基板之外周緣部定位之定位用段部。According to still another embodiment of the present invention, the frame guide may be formed as a positioning segment that can position the outer peripheral edge portion of the substrate.
根據本實施形態，由於基板之定位作業簡單，且正確，故生產性可提高，而且，成形不良減少，成品率可提高。According to the present embodiment, since the positioning operation of the substrate is simple and correct, the productivity can be improved, and the molding failure is reduced, and the yield can be improved.
本發明之不同之實施形態其結構亦可為於隔著陰模對向之框架導件之至少1邊設有用以拉起基板之缺口部。According to a different embodiment of the present invention, the structure may be provided with a notch portion for pulling up the substrate on at least one side of the frame guide opposed to the female mold.
根據本實施形態，在成形前及成形後之基板對框架導件之定位作業及取出作業簡單，生產性可更進一步提高。According to the present embodiment, the positioning work and the take-out operation of the frame guide before and after the molding are simple, and the productivity can be further improved.
本發明一新實施形態其結構為前述實施形態之樹脂封裝裝置，其包含有對供給至模穴部之樹脂封裝材料施予預定壓力之傳送銷，並包含有具有配置於下面且抵接於基板之抵接構件、及緩衝在脫模時負載於前述抵接構件之衝擊力之緩衝構件的保持裝置，並且以前述傳送銷將以陰模與前述保持裝置之抵接構件所夾持之樹脂封裝後的前述基板從前述陰模頂出，而將前述傳送銷也用於脫模。According to a new embodiment of the present invention, the resin sealing device according to the embodiment includes a transfer pin for applying a predetermined pressure to the resin encapsulating material supplied to the cavity portion, and includes a sub-disposed and abutting the substrate The abutting member and the holding device for buffering the cushioning member that is loaded against the impact force of the abutting member at the time of demolding, and the resin encapsulating the female mold and the abutting member of the holding device with the transfer pin The latter substrate is ejected from the aforementioned female mold, and the aforementioned transfer pin is also used for demolding.
根據本實施形態，由於以傳送銷將以陰模與抵接構件所夾持之封裝樹脂後之基板從前述陰模頂出，故緩衝構件可吸收、緩和傳送銷之衝擊力，而防止基板之破損。因此，亦可防止於前述基板安裝在表面之半導體元件之破損。According to the embodiment, since the substrate after the encapsulating resin sandwiched between the female mold and the abutting member is ejected from the female mold by the transfer pin, the cushioning member can absorb and alleviate the impact force of the transport pin, thereby preventing the substrate from being damaged. damaged. Therefore, it is also possible to prevent breakage of the semiconductor element on which the substrate is mounted on the surface.
又，可以傳送銷調整成形壓力，並且，亦可進行成形後之脫模作業。因此，由於不再需要頂出銷及具有此之頂出驅動裝置，故樹脂封裝裝置之零件件數減少，而可獲得構造簡單且低價之樹脂封裝裝置。Further, the pin can be adjusted to form the molding pressure, and the mold release operation after the molding can be performed. Therefore, since the ejection pin and the ejection driving device having the above are no longer required, the number of parts of the resin packaging device is reduced, and a resin packaging device having a simple structure and low cost can be obtained.
為解決前述課題，本發明之樹脂封裝方法係使用以進行樹脂封裝之結構由下面具有可保持基板之保持機構的上模具組及於上面搭載具有模穴部之陰模，且可透過水平移動機構，沿著底板在成形位置及待機位置間來回移動的下模具組構成，而將安裝於前述基板之電子零件浸漬於供給至前述模穴部之樹脂封裝材料，而進行樹脂封裝，其包含下列步驟：使前述下模具組移動至待機位置後，將下面安裝有電子零件之前述基板定位於配置在前述陰模之外周中至少對向之2邊之框架導件；使前述下模具組移動至成形位置，並且使前述陰模及框架導件上升，以使前述基板保持於前述上模具組之保持機構；使前述陰模及框架導件下降，並且使前述下模具組移動至前述待機位置；將樹脂封裝材料供給至前述陰模之模穴部；使由前述下模具組移動至成形位置後，藉使前述陰模及框架導件上升，而以前述上模具組、前述下模具組之陰模及前述框架導件將前述基板進行合模，藉此，進行樹脂封裝；及使前述陰模及框架導件下降，並且，將業經樹脂封裝之前述基板之外周緣部以前述框架導件頂推而脫模。In order to solve the above problems, the resin encapsulation method of the present invention uses a structure in which a resin is packaged, an upper mold group having a holding mechanism capable of holding a substrate, and a female mold having a cavity portion mounted thereon, and a horizontally movable mechanism The lower mold group is configured to move back and forth along the bottom plate between the molding position and the standby position, and the electronic component mounted on the substrate is immersed in the resin encapsulating material supplied to the cavity portion to perform resin encapsulation, which includes the following steps : after moving the lower mold set to the standby position, positioning the substrate on which the electronic component is mounted below the frame guide disposed at least opposite sides of the outer circumference of the female mold; moving the lower mold set to the forming Positioning, and raising the female die and the frame guide to hold the substrate in the holding mechanism of the upper mold set; lowering the female die and the frame guide, and moving the lower die set to the standby position; a resin encapsulating material is supplied to the cavity portion of the female mold; after the lower mold group is moved to the forming position, The female mold and the frame guide are raised, and the substrate is clamped by the upper mold set, the negative mold of the lower mold set, and the frame guide, thereby performing resin encapsulation; and the female mold and the frame guide The outer peripheral portion of the substrate which is encapsulated by the resin is pushed up by the frame guide to be demolded.
根據本發明，配置於陰模之外周之至少2邊的框架導件不是以點，而是以線抬起基板之外周緣部而脫模。因此，由於可分散、緩和負載於基板之外周緣部之外力的集中，故不僅可防止前述基板之破損，亦可防止安裝於前述基板之半導體元件、金屬線之破損。According to the present invention, the frame guides disposed on at least two sides of the outer circumference of the female mold are not demolded by dots, but are lifted by the outer peripheral portion of the substrate by the wire. Therefore, since the concentration of the force other than the peripheral portion of the substrate can be dispersed and moderated, the damage of the substrate can be prevented, and the semiconductor element or the metal wire attached to the substrate can be prevented from being damaged.
又，由於上模具組之下面具有可保持基板之保持機構，故將樹脂封裝材料供至下模具組之模穴部，移動至成形位置後，可直接將前述基板進行合模，來封裝樹脂。因此，由於亦可使用硬化時間短之樹脂封裝材料，故具有不僅可獲得通用性高之樹脂封裝方法，還可獲得成形週期短，生產性高之樹脂封裝方法之效果。Further, since the lower mold layer has a holding mechanism for holding the substrate, the resin sealing material is supplied to the cavity portion of the lower mold set, and after moving to the molding position, the substrate can be directly clamped to encapsulate the resin. Therefore, since a resin encapsulating material having a short curing time can be used, it is possible to obtain a resin encapsulating method which is not only highly versatile, but also has an effect of a resin encapsulating method which has a short molding cycle and high productivity.
又，根據本發明，將下面安裝有電子零件之前述基板定位於前述框架導件，使前述下模具組移動至成形位置，並且，使前述陰模及框架導件上升，而使前述基板保持於前述上模具組之保持機構，使前述陰模及框架導件下降，並且，使前述下模組移動至前述待機位置，將樹脂封裝材料供至前述陰模之模穴部，使前述下模具組移動至成形位置後，使前述陰模及框架導件上升，而可以前述上模具組與前述下模具組之陰模及前述框架導件將前述基板進行合模，來封裝樹脂。因此，可於使基板保持於上模具組之保持機構後，至封裝樹脂為止之期間預備加熱，而具有不需用以將基板加熱之等待時間之效果。Moreover, according to the present invention, the substrate on which the electronic component is mounted is positioned on the frame guide, the lower die set is moved to the forming position, and the female die and the frame guide are raised to hold the substrate in the substrate. The holding mechanism of the upper mold set lowers the female mold and the frame guide, and moves the lower module to the standby position, and supplies the resin sealing material to the cavity portion of the female mold to make the lower mold group After moving to the forming position, the female mold and the frame guide are raised, and the substrate can be sealed by the mold of the upper mold set and the lower mold group and the frame guide. Therefore, after the substrate is held by the holding means of the upper mold set, the heating is performed until the resin is encapsulated, and there is an effect that the waiting time for heating the substrate is not required.
第1A圖、第1B圖、第1C圖係顯示經以本案發明之樹脂封裝裝置封裝樹脂之成形品之立體圖、正面圖及經裁切之光半導體裝置單體之立體圖。1A, 1B, and 1C are perspective views, front views, and perspective views of a single cut optical semiconductor device in which a resin is encapsulated in a resin package device of the present invention.
第2圖係本案發明之樹脂封裝裝置之正面圖。Fig. 2 is a front elevational view showing the resin encapsulating apparatus of the present invention.
第3圖係第2圖所示之樹脂封裝裝置之主要部份截面圖。Fig. 3 is a cross-sectional view showing the main part of the resin package device shown in Fig. 2.
第4圖係本案發明之樹脂封裝裝置之側視圖。Fig. 4 is a side view of the resin encapsulating device of the invention of the present invention.
第5圖係本案發明之樹脂封裝裝置之平面截面圖。Fig. 5 is a plan sectional view showing a resin encapsulating apparatus of the present invention.
第6圖係第4圖所示之樹脂封裝裝置之主要部份放大截面圖。Fig. 6 is an enlarged cross-sectional view showing the main part of the resin package device shown in Fig. 4.
第7圖係第5圖所示之樹脂封裝裝置之主要部份放大平面圖。Fig. 7 is an enlarged plan view showing the main part of the resin package device shown in Fig. 5.
第8圖係第4圖、第5圖所示之保持裝置之放大側視圖。Fig. 8 is an enlarged side view of the holding device shown in Figs. 4 and 5.
第9圖係第8圖所示之保持裝置之主要部份放大平面圖。Fig. 9 is an enlarged plan view showing the main part of the holding device shown in Fig. 8.
第10A圖、第10B圖係用以說明本案發明之樹脂封裝裝置之成形步驟的截面圖。10A and 10B are cross-sectional views for explaining a forming step of the resin sealing device of the present invention.
第11A圖、第11B圖係接續第10B圖之截面圖。Fig. 11A and Fig. 11B are cross-sectional views taken along line 10B.
第12A圖、第12B圖係接續第11B圖之截面圖。Fig. 12A and Fig. 12B are cross-sectional views taken along line 11B.
第13A圖、第13B圖係接續第12B圖之截面圖。Fig. 13A and Fig. 13B are cross-sectional views taken along line 12B.
第14圖係接續第13B圖之截面圖。Figure 14 is a cross-sectional view taken along line 13B.
根據第1圖至第14圖之附加圖式，說明本發明之樹脂封裝裝置之實施形態。Embodiments of the resin sealing device of the present invention will be described with reference to the additional drawings of Figs. 1 to 14 .
如第1A圖、第1B圖所示，本實施形態之樹脂封裝裝置係用以將以預定間距安裝於印刷有導電圖形之陶瓷製基板1之一面的例如LED之光半導體元件2封裝樹脂者。As shown in FIG. 1A and FIG. 1B, the resin sealing device of the present embodiment is for encapsulating a resin such as an LED optical semiconductor element 2 which is mounted on one surface of a ceramic substrate 1 on which a conductive pattern is printed at a predetermined pitch.
本實施形態之LED用樹脂封裝材料係使用以耐熱性、透光性優異之矽材為主原料之材料。此種前述樹脂封裝材料不僅指迄今使用之稱為片劑之固態者，亦可藉將液狀樹脂封裝材料注入模具內，使其加熱，而熱硬化，藉此，獲得所期之形狀。舉例言之，在本案中，如後述，亦可為具有與設在基板1上之成形部6相鄰之無用樹脂4之成形品3。又，前述成形品3在後步驟之切割步驟被切斷成諸個光半導體裝置5(第1C圖)，進行凸塊連接等處理後，被搭載至母基板。In the resin encapsulating material for LEDs of the present embodiment, a material having a heat-resistant and light-transmitting coffin as a main raw material is used. Such a resin encapsulating material is not limited to a solid body called a tablet which has hitherto been used, and can be obtained by injecting a liquid resin encapsulating material into a mold, heating it, and thermally hardening it, thereby obtaining a desired shape. For example, in the present invention, as will be described later, the molded article 3 having the unnecessary resin 4 adjacent to the molded portion 6 provided on the substrate 1 may be used. Further, the molded article 3 is cut into the optical semiconductor devices 5 (first FIG. 1C) in the dicing step in the subsequent step, and is attached to the mother substrate after the bump connection or the like.
如第2圖所示，將前述基板1封裝樹脂之樹脂封裝裝置係由固定在直立設置於底板10上之4根繫桿11之上端部的平台12、固定在前述平台12之下面之上模具組20、位於前述上模具組20之下方側，且配置成可沿著前述底板10之上面滑動之滑動板30、設置在前述滑動板30上之下模具組40構成者。又，如第5圖所示，保持裝置90及分配裝置100係配置成朝前述底板10之待機位置P交互來回移動。As shown in Fig. 2, the resin encapsulating device for encapsulating the substrate 1 is made of a platform 12 fixed to the upper end portion of the four tie bars 11 which are erected on the bottom plate 10, and is fixed to the lower surface of the platform 12 The group 20 is located on the lower side of the upper mold set 20, and is configured to be slidable along the upper surface of the bottom plate 10, and is disposed on the lower mold group 40 of the slide plate 30. Further, as shown in Fig. 5, the holding device 90 and the dispensing device 100 are arranged to alternately move back and forth toward the standby position P of the bottom plate 10.
如第6圖所示，前述上模具組20以固定於前述平台12之下面之上模具模組21、固定於此上模具模組21之下面之上模具槽22構成。於前述上模具槽22形成有供後述引導銷26c插入之引導孔23。再者，在前述上模具槽22之下面中，於前述基板1之投影面內均等地設有可吸引前述基板1之吸引孔24。前述吸引孔24藉由形成於前述上模具模組21與上模具槽22之透氣路徑25，連接於圖中未示之真空產生裝置。同樣地，用以使成形時之密閉空間呈真空之透氣路徑26連接於圖中未示之真空產生裝置。As shown in FIG. 6, the upper mold set 20 is formed by a mold module 21 fixed to the lower surface of the stage 12 and a mold groove 22 fixed to the lower surface of the upper mold module 21. A guide hole 23 into which the guide pin 26c to be described later is inserted is formed in the upper mold groove 22. Further, on the lower surface of the upper mold groove 22, a suction hole 24 for attracting the substrate 1 is uniformly provided on the projection surface of the substrate 1. The suction hole 24 is connected to a vacuum generating device (not shown) by a gas permeable path 25 formed in the upper mold block 21 and the upper mold groove 22. Similarly, a gas permeable path 26 for evacuating the sealed space during molding is connected to a vacuum generating device (not shown).
下模具組40係依序於設置成可沿著底板10上面滑動之滑動板30上面組裝有下模具模組41及下模具槽60者。又，下模具組40於位於其成形位置之前述滑動板30之正下方具有組裝於前述底板10之升降裝置80。The lower mold set 40 is sequentially assembled with the lower mold module 41 and the lower mold groove 60 on the upper surface of the slide plate 30 which is disposed to slide along the upper surface of the bottom plate 10. Further, the lower mold set 40 has a lifting device 80 assembled to the bottom plate 10 directly below the sliding plate 30 at its forming position.
前述滑動板30組裝成可沿著平行設置於前述底板10上面之一對引導軌道13，在待機位置P(第4圖)與成形位置(第6圖)間滑動移動。又，如第4圖所示，藉以電動馬達14使滾珠螺桿15旋動，前述滑動板30可在待機位置P與成形位置間來回移動。又，如第6圖所示，前述滑動板30內藏有驅動位於其側邊之電動馬達31，藉由帶32，旋動第3圖所示之螺帽33，藉此而上下移動之滾珠螺桿34。再者，藉由配置於前述螺帽33兩側之套筒35，吊掛上接頭36。又，前述滑動板30之構造係以位於其中央下部，且固定在底板10上之支撐塊16於合模時支撐者。The slide plate 30 is assembled so as to be slidably movable between a standby position P (Fig. 4) and a forming position (Fig. 6) along one of the pair of guide rails 13 provided on the upper surface of the bottom plate 10 in parallel. Further, as shown in Fig. 4, the ball screw 15 is rotated by the electric motor 14, and the slide plate 30 is movable back and forth between the standby position P and the forming position. Further, as shown in Fig. 6, the slide plate 30 houses an electric motor 31 that drives the side of the slide plate 30, and the nut 33 is rotated by the belt 32, thereby moving the ball up and down. Screw 34. Further, the joint 36 is suspended by the sleeve 35 disposed on both sides of the nut 33. Further, the structure of the slide plate 30 is such that the support block 16 located at the lower portion of the center thereof and fixed to the bottom plate 10 is supported at the time of mold clamping.
下模具模組41依序於前述滑動板30堆疊氣缸基座42、中間基座43而構成。又，前述下模具模組41於前述中間基座43之上面緣部堆疊有環狀固定框44。前述固定框44將上面具有環狀密封材45之可動框47配置成可藉由驅動裝置46(參照第2圖)上下移動。The lower mold module 41 is configured by sequentially stacking the cylinder base 42 and the intermediate base 43 on the slide plate 30. Further, the lower mold module 41 has an annular fixing frame 44 stacked on the upper edge portion of the intermediate base 43. The fixed frame 44 is disposed such that the movable frame 47 having the annular seal member 45 thereon is vertically movable by the drive unit 46 (see FIG. 2).
在前述氣缸基座42內，如第3圖所示，配置成可以前述滾珠螺桿34頂推之中心板48滑動卡合於內支持器49。又，直立設置於前述內支持器49之角部之連結軸50的上端部連結於下模具槽60之傳送板64而一體化。又，配置成可藉由套筒35頂推之外板51滑動卡合於外支持器52。又，直立設置於前述外支持器52之連結軸53的上端部連結於配置在前述中間基座43內之下層板54而一體化。In the cylinder base 42, as shown in Fig. 3, the center plate 48, which can be pushed by the ball screw 34, is slidably engaged with the inner holder 49. Further, the upper end portion of the connecting shaft 50 that is erected at the corner of the inner holder 49 is coupled to the conveying plate 64 of the lower mold groove 60 and integrated. Further, it is configured such that the outer plate 51 can be slidably engaged with the outer holder 52 by the sleeve 35. Further, the upper end portion of the connecting shaft 53 that is erected on the outer holder 52 is connected to the lower layer plate 54 disposed in the intermediate base 43 and integrated.
於前述氣缸基座42及中間基座43內形成有收納以2根為1組而排列成4列之共8根之活塞55，並且，以活塞蓋56密閉之空間。前述空間可填充為壓力媒體之液體，並且，從圖中未示之注入口、排出口使液體流出流入，藉此，使活塞55上下移動，透過下層板54，對後述陰模63施予預定壓力。In the cylinder base 42 and the intermediate base 43, a piston 55 in which a total of eight pistons 55 arranged in four rows are arranged in a row is provided, and the piston cover 56 is sealed. The space can be filled with a liquid of a pressure medium, and the liquid flows out from the injection port and the discharge port (not shown), whereby the piston 55 is moved up and down, and the lower plate 54 is passed through to feed the negative mold 63 to be described later. pressure.
如第3圖及第6圖所示，下模具槽60係設置於以前述中間基座43及前述固定框44形成之空間內者，於框狀支持器基座61之外側面安裝有側面蓋61a，並且，於前述支持器基座61內配置有背板62。此外，本實施形態為可同時成形2片基板1之結構，下模具6內具備2組構成零件，亦可成形1片基板，片數不限。前述背板62藉由直立設置於前述下模具模組41之下層板54之支撐銷54a支撐，並且，藉由插通下層板54之凸肩螺栓62a防止脫落。又，如第7圖所示，前述背板62於其上面中央部載置有陰模63，並且，於其上面外周緣部藉由彈簧62b，支撐有框狀框架導件65。前述框架導件65以前述彈簧62b賦與從前述陰模63之上面朝上方頂出之勢能。又，前述框架導件65於其內周緣部形成有用以定位基板1之環狀段部65a，另一方面，直立設置於前述背板62之引導銷62c以可突出沒入之方式從其上面突出。再者，為使以手動作業放置基板1時之定位作業及取出作業容易，於前述框架導件65形成有缺口部65b。As shown in FIGS. 3 and 6, the lower mold groove 60 is provided in a space formed by the intermediate base 43 and the fixed frame 44, and a side cover is attached to the outer side of the frame holder base 61. 61a, and a backing plate 62 is disposed in the aforementioned holder base 61. Further, in the present embodiment, the two substrates 1 can be simultaneously formed, and the lower mold 6 is provided with two sets of components, and one substrate can be formed, and the number of sheets is not limited. The back plate 62 is supported by a support pin 54a that is erected on the lower plate 54 of the lower mold module 41, and is prevented from falling off by the shoulder bolt 62a inserted through the lower plate 54. Further, as shown in Fig. 7, the back plate 62 has a female mold 63 placed on the upper center portion thereof, and a frame-shaped frame guide 65 is supported by the spring 62b on the outer peripheral edge portion thereof. The frame guide 65 is biased with the aforementioned spring 62b to be ejected upward from the upper surface of the female die 63. Further, the frame guide 65 is formed at its inner peripheral portion to position the annular segment portion 65a of the substrate 1, and on the other hand, the guide pin 62c erected on the back plate 62 is protruded from above. protruding. Further, in order to facilitate the positioning work and the take-out operation when the substrate 1 is placed by manual work, the frame guide 65 is formed with a notch portion 65b.
又，如前述，配置於前述背板62之下方側之傳送板64藉由前述下模具模組41之連結軸50支撐。前述傳送板64插通有以彈簧66a之彈力賦與勢能之傳送銷66之下方部。另一方面，前述傳送銷66之上方部對背板62及陰模63以可突出沒入之方式插通，其前端部份插通後述樹脂積存部69。因此，前述傳送銷66藉驅動電動馬達31，使其上下移動，可對供至陰模63之樹脂封裝材料9施予一定壓力，並且可頂出成形後之成形品3。Further, as described above, the transport plate 64 disposed on the lower side of the back plate 62 is supported by the connecting shaft 50 of the lower mold module 41. The transfer plate 64 is inserted through a lower portion of the transfer pin 66 that imparts potential energy by the spring force of the spring 66a. On the other hand, the upper portion of the transport pin 66 is inserted into the back plate 62 and the female mold 63 so as to be protruded, and the distal end portion thereof is inserted into the resin reservoir 69 to be described later. Therefore, the transfer pin 66 can be moved up and down by driving the electric motor 31, and a certain pressure can be applied to the resin encapsulating material 9 supplied to the female mold 63, and the molded article 3 can be ejected.
如第7圖所示，陰模63平面呈約方形，於形成於其上面之凹處67內將半球狀模穴部68配置成格子狀，並且沿著前述凹處67之對向之2邊形成有樹脂積存部69。前述樹脂積存部69藉由連通路徑70，連通於前述凹處67，並且，於其預定位置形成可供傳送銷66插通之銷孔71。又，於連通於前述凹處67之位置設有可探測陰模63內之樹脂填充壓力之壓力感測器72。As shown in Fig. 7, the plane of the female mold 63 is approximately square, and the hemispherical cavity portions 68 are arranged in a lattice shape in the recess 67 formed thereon, and along the opposite sides of the aforementioned recess 67 A resin reservoir 69 is formed. The resin reservoir 69 communicates with the recess 67 via the communication path 70, and a pin hole 71 through which the transfer pin 66 can be inserted is formed at a predetermined position. Further, a pressure sensor 72 capable of detecting the resin filling pressure in the female mold 63 is provided at a position communicating with the recess 67.
如第3圖所示，升降裝置80係於安裝在底板10下面之支撐軸81之下端部配置有螺帽82。又，如第6圖所示，以電動馬達83旋動前述螺帽82，而使安裝於滾珠螺桿84上端部之引導板85上下移動，藉此，可使安裝在前述引導板85之角部之引導軸86上下移動。又，相鄰之一對引導軸86之上端部以下接頭87連結。As shown in Fig. 3, the lifting device 80 is provided with a nut 82 at a lower end portion of the support shaft 81 attached to the lower surface of the bottom plate 10. Further, as shown in Fig. 6, the nut 82 is rotated by the electric motor 83, and the guide plate 85 attached to the upper end portion of the ball screw 84 is moved up and down, whereby the corner portion of the guide plate 85 can be attached. The guide shaft 86 moves up and down. Further, one of the adjacent pairs is connected to the joint 87 below the upper end portion of the guide shaft 86.
如第4圖、第5圖所示，保持裝置90係用以吸引保持封裝樹脂前後之基板1之裝置，可朝底板10之待機位置來回移動，並且，支撐成可上下移動。又，保持裝置90也與下模具槽60同樣地，為保持2片基板之結構。又，如第8圖、第9圖所示，前述保持裝置90於長方形上板91藉由以4根為1組之柱92，分別吊掛有2片正方形下板93。As shown in FIGS. 4 and 5, the holding device 90 is a device for sucking the substrate 1 before and after the encapsulating resin, and is movable back and forth toward the standby position of the bottom plate 10, and is supported to be movable up and down. Further, similarly to the lower mold groove 60, the holding device 90 has a structure in which two substrates are held. Further, as shown in Figs. 8 and 9, the holding device 90 has two square lower plates 93 suspended from the rectangular upper plate 91 by four columns 92 having one set.
又，在前述上板91與前述下板93間，於4個角落共4處夾持有由橡膠材等構成之緩衝構件94，其位置配置於前述傳送銷66之軸心上。再者，前述上板91藉由設在其兩側下面緣部之引導部95，將引導軸96支撐成可於軸心方向滑動。又，前述引導軸96、96組裝有彈簧96a，而賦與其一直朝向外側之勢能，並且，藉由設在其前端部之連結桿97連結。再者，於前述連結桿97之兩端部分別設有卡止爪97a。Further, between the upper plate 91 and the lower plate 93, a cushion member 94 made of a rubber material or the like is sandwiched between four corners, and the position is placed on the axial center of the transport pin 66. Further, the upper plate 91 supports the guide shaft 96 so as to be slidable in the axial direction by the guide portions 95 provided at the lower edge portions of both sides thereof. Further, the guide shafts 96 and 96 are assembled with the springs 96a, and are provided with potential energy which is always directed outward, and are coupled by a connecting rod 97 provided at the front end portion thereof. Further, locking claws 97a are provided at both end portions of the connecting rod 97.
另一方面，下板93於其下面接著有由海綿等構成之板狀抵接構件98。前述板狀抵接構件98於其下面設有最深之底面正方形凹部98a，並且，設有格子狀凸部98b，以於與最下面間形成一些間隙。又，吸引凸塊99分別連通於前述凹部98a，而可吸引前述基板1。On the other hand, the lower plate 93 is followed by a plate-shaped abutting member 98 made of a sponge or the like. The plate-shaped abutting member 98 is provided with a deepest bottom square concave portion 98a on the lower surface thereof, and a lattice-like convex portion 98b is formed to form a gap with the lowermost portion. Further, the attraction bumps 99 are respectively connected to the concave portions 98a to attract the substrate 1.
此外，前述保持裝置90亦可利用提高搬送距離及搬送功能之卸載裝置是無須贅言的。Further, it is needless to say that the holding device 90 can also utilize an unloading device that increases the transport distance and the transport function.
如第5圖所示，分配裝置100可藉由圖中未示之驅動裝置，朝底板10上之待機位置P來回移動。又，前述分配裝置100將已計量之液狀樹脂封裝材料注入至被拉出至待機位置P之下模具模組41之陰模63。As shown in Fig. 5, the dispensing device 100 can be moved back and forth toward the standby position P on the bottom plate 10 by a driving device not shown. Further, the dispensing device 100 injects the metered liquid resin encapsulating material into the female mold 63 of the mold module 41 that is pulled out to the standby position P.
接著，主要根據第10圖至第14圖之附加圖式，說明本實施形態之樹脂封裝裝置所行之封裝方法。Next, the packaging method of the resin package device of the present embodiment will be mainly described based on the additional drawings of Figs. 10 to 14 .
首先，藉驅動電動馬達14，使滾珠螺桿15旋動，而使滑動板30滑動移動至在第4圖中以二點鏈線所示之待機位置P。然後，以手動或圖中未示之負載裝置將基板1定位於露出之框架導件65之環狀段部65a。First, by driving the electric motor 14, the ball screw 15 is rotated, and the slide plate 30 is slidably moved to the standby position P indicated by the two-dot chain line in Fig. 4 . Then, the substrate 1 is positioned to the annular segment portion 65a of the exposed frame guide 65 by hand or a load device not shown.
在本實施形態中，由於於框架導件65形成有環狀段部65a，故以手動定位基板1之作業便簡單，且正確。又，由於於框架導件65形成有缺口部65b，故作業者定位基板1之際，形成為抓持基板1之手指之出口，以手動定位基板1之作業簡單且正確。In the present embodiment, since the annular segment portion 65a is formed in the frame guide 65, the operation of manually positioning the substrate 1 is simple and correct. Further, since the frame guide 65 is formed with the notch portion 65b, the operator can form the exit of the finger of the substrate 1 while positioning the substrate 1, and the operation of manually positioning the substrate 1 is simple and correct.
此外，前述基板1之定位亦可以設在框架導件65之定位銷(圖中未示)進行。In addition, the positioning of the substrate 1 described above may also be performed on a positioning pin (not shown) of the frame guide 65.
然後，當藉驅動電動馬達14，使前述滾珠螺桿15逆旋轉，而使陰模63移動至成形位置時(第10A圖)，上接頭36卡合於下接頭87(第6圖)。Then, when the electric motor 14 is driven to rotate the aforementioned ball screw 15 to move the female mold 63 to the forming position (Fig. 10A), the upper joint 36 is engaged with the lower joint 87 (Fig. 6).
此外，根據本實施形態，基板1定位於框架導件65之內周緣部，前述框架導件65被賦與勢能，而可從陰模63之上面朝上方頂出之。因此，前述基板1在懸空狀態。結果，於陰模63移動至成形位置之際，即使施加振動、衝擊等，仍可防止搭載於基板1之光半導體元件2或連接前述光半導體元件2與基板1之Au線抵接前述陰模63。Further, according to the present embodiment, the substrate 1 is positioned at the inner peripheral edge portion of the frame guide 65, and the frame guide 65 is given the potential energy, and can be ejected upward from the upper surface of the female mold 63. Therefore, the aforementioned substrate 1 is in a suspended state. As a result, when the female mold 63 is moved to the molding position, even if vibration, impact, or the like is applied, the optical semiconductor element 2 mounted on the substrate 1 or the Au line connecting the optical semiconductor element 2 and the substrate 1 can be prevented from coming into contact with the female mold. 63.
接著，當驅動電動馬達83時，螺合於螺帽82之滾珠螺桿84旋動，頂推引導軸86，藉此，藉由下接頭87及上接頭36，頂推板51及支持器52。因此，藉由直立設置於前述支持器52之連結軸53，頂推下層板54、支撐銷54a，而頂推背板62。結果，藉由彈簧62b彈性支撐於前述背板62之框架導件65上升，基板1亦上升。然後，引導銷62c嵌入引導孔23，而正確地定位於預定位置，同時，前述基板1壓接上模具槽22之下面(第10B圖)。Next, when the electric motor 83 is driven, the ball screw 84 screwed to the nut 82 is rotated to push the guide shaft 86, whereby the plate 51 and the holder 52 are pushed up by the lower joint 87 and the upper joint 36. Therefore, the backing plate 62 is pushed up by pushing up the lower plate 54 and the support pin 54a by being erected on the connecting shaft 53 of the aforementioned holder 52. As a result, the frame guide 65 elastically supported by the spring 62b on the back plate 62 rises, and the substrate 1 also rises. Then, the guide pin 62c is fitted into the guide hole 23 to be correctly positioned at a predetermined position, while the aforementioned substrate 1 is crimped to the lower surface of the upper mold groove 22 (Fig. 10B).
此外，於前述下層板54上升時，連結於下層板54之活塞55上升，存在於大徑部55a之上面之液體從圖中未示之排出口排出，追隨下層板54之動作。Further, when the lower plate 54 is raised, the piston 55 connected to the lower plate 54 rises, and the liquid existing on the upper surface of the large diameter portion 55a is discharged from the discharge port (not shown) to follow the operation of the lower plate 54.
藉驅動圖中未示之真空裝置，設在上模具槽22之下面之吸引孔24吸附保持基板1後，藉驅動電動馬達83，使陰模63下降(第11A圖)。此外，由於於陰模63下降前，框架導件65藉由彈簧62b之彈力，將基板1按壓至上模具槽22之下面，故不致於基板1產生翹曲或不平坦。After the suction means 24 provided under the upper mold groove 22 sucks and holds the substrate 1 by a vacuum device (not shown), the negative mold 63 is lowered by driving the electric motor 83 (Fig. 11A). Further, since the frame guide 65 presses the substrate 1 under the upper mold groove 22 by the elastic force of the spring 62b before the female mold 63 is lowered, warpage or unevenness of the substrate 1 is not caused.
然後，藉驅動電動馬達14，使下模具組40從成形位置再度移動至待機位置P。接著，使分配裝置100滑動移動至前述陰模63之上方後，將已計量之液狀樹脂封裝材料9注入至模穴部68(第11B圖)。Then, by driving the electric motor 14, the lower mold set 40 is moved again from the forming position to the standby position P. Next, after the dispensing device 100 is slidably moved over the female mold 63, the metered liquid resin sealing material 9 is injected into the cavity portion 68 (Fig. 11B).
之後，藉驅動電動馬達14，使滾珠螺桿15逆旋轉，而使滑動板30回復至成形位置，藉此，上接頭36與下接頭87卡合。然後，可動框47上升，使密封材45密合於上模具槽22之下面後，藉驅動圖中未示之真空產生裝置，藉由透氣路徑26，排出形成於上模具槽22與中間基座43間之密閉空間之空氣，以減壓至預定壓力(第12A圖)。Thereafter, by driving the electric motor 14, the ball screw 15 is reversely rotated to return the slide plate 30 to the forming position, whereby the upper joint 36 is engaged with the lower joint 87. Then, the movable frame 47 is raised, and after the sealing material 45 is adhered to the lower surface of the upper mold groove 22, the vacuum generating device, not shown, is driven to form the upper mold groove 22 and the intermediate base by the gas permeable path 26. The air in the confined space of 43 is depressurized to a predetermined pressure (Fig. 12A).
進一步，藉驅動電動馬達83，螺合於螺帽82之滾珠蜾桿84旋動，頂推引導軸86，藉此，藉由下接頭87及上接頭36，頂推板51及支持器52。因此，藉由直立設置於前述支持器52之連結軸53，頂推下層板54、支撐銷54a，而頂推背板62。結果，藉由彈簧62b彈性支撐於前述背板62之框架導件65上升。Further, by driving the electric motor 83, the ball mast 84 screwed to the nut 82 is rotated to push the guide shaft 86, whereby the plate 51 and the holder 52 are pushed up by the lower joint 87 and the upper joint 36. Therefore, the backing plate 62 is pushed up by pushing up the lower plate 54 and the support pin 54a by being erected on the connecting shaft 53 of the aforementioned holder 52. As a result, the frame guide 65 elastically supported by the spring 62b to the aforementioned backing plate 62 rises.
此外，於前述下層板54上升時，連結於下層板54之活塞55上升，存在於大徑部55a之上面之液體從圖中未示之排出口排出，而追隨下層板54之動作。Further, when the lower deck 54 is raised, the piston 55 connected to the lower deck 54 rises, and the liquid existing on the upper surface of the large diameter portion 55a is discharged from the discharge port (not shown) to follow the operation of the lower deck 54.
然後，引導銷62嵌入至引導孔23，而正確地定位於預定位置，保持在預定位置之基板1便嵌合於環狀段部65a。然後，前述基板1以上模具槽22之下面與框架導件65及陰模63夾持(第12B圖)。因此，可將安裝於基板1之光半導體元件2浸於模穴部68內之樹脂封裝材料9。在此步驟中，預先保持在上模具槽22之基板1之光半導體元件2及連接於光半導體元件2之金屬線等在接觸注入至陰模63之模穴部68之樹脂封裝材料前，較高速地移動，之後，以低速及低壓力進行合模。Then, the guide pin 62 is fitted into the guide hole 23, and is correctly positioned at a predetermined position, and the substrate 1 held at the predetermined position is fitted to the annular segment portion 65a. Then, the lower surface of the substrate 1 and the upper mold groove 22 is sandwiched between the frame guide 65 and the female mold 63 (Fig. 12B). Therefore, the optical semiconductor element 2 mounted on the substrate 1 can be immersed in the resin encapsulating material 9 in the cavity portion 68. In this step, the optical semiconductor element 2 of the substrate 1 and the metal wire connected to the optical semiconductor element 2, which are previously held in the upper mold groove 22, are in contact with the resin encapsulating material injected into the cavity portion 68 of the female mold 63, Move at high speed, then clamp at low speed and low pressure.
接著，藉驅動圖中未示之加壓裝置，將液體注入至活塞55之大徑部55a之下部後加壓，進行合模。Next, the liquid is injected into the lower portion of the large diameter portion 55a of the piston 55 by a pressurizing device (not shown), and then pressurized to perform mold clamping.
上模具槽22與陰模63藉由基板1密合時，在模穴部68剩餘之樹脂封裝材料9藉由連通路徑70，流入至樹脂積存部69。然後，藉驅動電動馬達31，使傳送銷66上下移動，藉此，解決樹脂封裝材料9之注入量之偏差，並且，對模穴部68施予預定壓力。傳送銷66之上下移動依據設在下模具陰模63之壓力感測器72所探測之壓力，以電動馬達31控制成達到設定壓力，並且，藉由活塞55，控制成產生必要最小限度之合模壓力。然後，藉傳送銷66之動作，以圖中未示之前述加壓裝置使合模壓力增加為與壓力感測器72所探測之壓力成比例，以進行最後合模。When the upper mold groove 22 and the female mold 63 are brought into close contact with each other by the substrate 1, the resin encapsulating material 9 remaining in the cavity portion 68 flows into the resin reservoir portion 69 via the communication path 70. Then, by driving the electric motor 31, the transfer pin 66 is moved up and down, whereby the deviation of the injection amount of the resin encapsulating material 9 is solved, and the predetermined pressure is applied to the cavity portion 68. The upper and lower movement of the conveying pin 66 is controlled by the electric motor 31 to reach the set pressure according to the pressure detected by the pressure sensor 72 provided in the female mold 63 of the lower mold, and is controlled by the piston 55 to produce the necessary minimum clamping. pressure. Then, by the action of the transfer pin 66, the mold clamping pressure is increased to be proportional to the pressure detected by the pressure sensor 72 by the aforementioned pressurizing means not shown, to perform the final mold clamping.
經過預定硬化時間後，藉驅動電動馬達31，使傳送銷66下降，而使前述傳送銷66從已硬化之樹脂封裝材料9分離。接著，使可動框47下降，並且停止加壓裝置，呈無負載狀態後，驅動電動馬達83，使陰模63下降。上模具槽22之真空產生裝置於瞬間吐出空氣後，停止。然後，成形品3藉陰模63與已硬化之樹脂封裝材料9之貼附，隨著前述陰模63下降(第13A圖)。After the predetermined hardening time, the electric motor 31 is driven to lower the transfer pin 66, and the transfer pin 66 is separated from the hardened resin encapsulating material 9. Next, the movable frame 47 is lowered, the pressurizing device is stopped, and the electric motor 83 is driven to lower the female mold 63 after the load is not applied. The vacuum generating device of the upper mold groove 22 stops after instantaneously discharging air. Then, the molded article 3 is attached to the hardened resin encapsulating material 9 by the female mold 63, and is lowered as the above-mentioned female mold 63 is lowered (Fig. 13A).
驅動電動馬達14，將下模具組40移動至待機位置P後，保持裝置90滑動移動至前述下模具組40之正上方。然後，藉保持裝置90之圖中未示之驅動裝置，將連結蓋96拉進至內側後，使其下降至預定位置。然後，解放圖中未示之前述驅動裝置，使卡止爪97a卡止於側面蓋61a，藉此，使基板1抵接抵接構件98之下面，同時，以前述抵接構件98與框架導件65夾持前述基板1之外周緣部(第13B圖)。接著，藉由吸引管99吸引，藉此，使抵接構件98吸附至成形品3之基板1。藉將卡止爪97a卡止於此側面蓋61a，可於頂出後述傳送銷66之際，有效地吸收負載於保持裝置90之衝擊力。After the electric motor 14 is driven to move the lower mold set 40 to the standby position P, the holding device 90 is slidably moved right above the lower mold set 40. Then, the connecting cover 96 is pulled inward by the driving means (not shown) of the holding device 90, and then lowered to a predetermined position. Then, the driving device (not shown) is released, and the locking claws 97a are locked to the side cover 61a, whereby the substrate 1 is brought into contact with the lower surface of the abutting member 98, and the abutting member 98 and the frame are guided. The member 65 sandwiches the outer peripheral portion of the substrate 1 (Fig. 13B). Then, the suction member 99 is sucked, whereby the contact member 98 is adsorbed to the substrate 1 of the molded article 3. By locking the locking claws 97a to the side cover 61a, the impact force on the holding device 90 can be effectively absorbed when the transfer pin 66 described later is pushed out.
藉使電動馬達31驅動，使傳送銷66上升，可頂出在銷孔71內硬化之無用樹脂4，框架導件65以彈簧62b之彈力頂推基板1之外周緣部，並且，以抵接構件98之吸引力吸引基板1，藉此，可將成形品3在不撓曲下從陰模63脫模(第14圖)。此時，以複數傳送銷66頂出以穩固地貼附於陰模63而硬化之樹脂封裝材料9形成之成形部6的外周，同時，以框架導件65之環狀段部65a頂推基板1之外周緣部。進一步，藉以抵接構件98吸引基板1之投影面全體，可將成形部6從陰模63之凹處67強力且平衡性佳地脫模。進而，於脫模之際產生之傳送銷66之衝擊力可為抵接構件98、緩衝構件94吸收、緩和。因此，不僅成形品3之基板1不致破損，亦可防止光半導體元件2之破損。When the electric motor 31 is driven to raise the transfer pin 66, the unnecessary resin 4 hardened in the pin hole 71 can be ejected, and the frame guide 65 pushes the outer peripheral portion of the substrate 1 by the elastic force of the spring 62b, and abuts against The attraction force of the member 98 attracts the substrate 1, whereby the molded article 3 can be released from the female mold 63 without being bent (Fig. 14). At this time, the outer periphery of the formed portion 6 formed by the resin encapsulating material 9 which is firmly adhered to the female mold 63 and firmly adhered by the plurality of transfer pins 66, while pushing the substrate by the annular segment portion 65a of the frame guide 65 1 outside the peripheral part. Further, by the abutting member 98 attracting the entire projection surface of the substrate 1, the molded portion 6 can be released from the recess 67 of the female mold 63 with strong strength and balance. Further, the impact force of the conveying pin 66 generated at the time of demolding can be absorbed and moderated by the abutting member 98 and the cushioning member 94. Therefore, not only the substrate 1 of the molded article 3 is not damaged, but also the optical semiconductor element 2 can be prevented from being damaged.
又，由於藉將抵接構件98之下面形成格子狀，可確保均一之吸附力，並且可使基板1之撓曲為最小，故可防止基板1之損傷。Further, since the lower surface of the abutting member 98 is formed in a lattice shape, uniform adsorption force can be secured, and deflection of the substrate 1 can be minimized, so that damage of the substrate 1 can be prevented.
又，由於設在保持裝置90之緩衝構件94設置於前述傳送銷66之軸心上，故以傳送銷66頂出基板1之際，不致於基板1負載多餘之力矩載重，而可更進一步有效地防止損傷。Further, since the cushioning member 94 provided in the holding device 90 is disposed on the axial center of the transport pin 66, when the transport pin 66 is ejected from the substrate 1, the substrate 1 is not loaded with an excess torque load, which is further effective. Prevent damage.
最後，驅動電動馬達31，使傳送銷66返回原本之位置，另一方面，驅動保持裝置90之圖中未示之驅動裝置，拉進連結蓋96後，直接在吸附基板1之狀態下使保持裝置90移動至上方。然後，使前述保持裝置90滑動移動至原本之位置後，確保成形品3。之後，藉反覆進行相同之作業，可連續進行樹脂封裝作業。Finally, the electric motor 31 is driven to return the transfer pin 66 to the original position. On the other hand, the drive device (not shown) of the drive holding device 90 is pulled into the joint cover 96 and held directly in the state of adsorbing the substrate 1. Device 90 is moved to the top. Then, after the holding device 90 is slid and moved to the original position, the molded article 3 is secured. After that, the same operation can be performed repeatedly, and the resin packaging operation can be continuously performed.
例示了陶瓷基板作為前述基板，但未必限於此，亦可為金屬基板、由環氧樹脂等構成之樹脂基板。Although a ceramic substrate is exemplified as the substrate, the present invention is not limited thereto, and may be a metal substrate or a resin substrate made of an epoxy resin or the like.
又，半導體元件不限安裝於前述基板之一面，亦可安裝於兩面是無須贅言的。Further, the semiconductor element is not limited to being mounted on one surface of the substrate, and it is not necessary to say that it can be mounted on both sides.
再者，在本實施形態中，例示了緩衝構件94為橡膠之情形，只要為如彈簧等具有彈性者即可。In the present embodiment, the case where the cushion member 94 is made of rubber is exemplified as long as it has elasticity such as a spring.
又，在本實施形態中，板狀抵接構件98係以海綿來舉例說明，材質未特別限定，亦可為鋁、鋼鐵等金屬製。特別是在本實施形態中，就於板狀抵接構件98之下面配置底面正方形凹部98a及格子狀凸部98b之情形作了說明，但未必限於此。舉例言之，亦可於撓曲最大之抵接構件之中央部形成凸部，以該凸部為中心，將凹部形成放射狀。Further, in the present embodiment, the plate-shaped abutting member 98 is exemplified by a sponge, and the material is not particularly limited, and may be made of metal such as aluminum or steel. In the present embodiment, the case where the bottom surface square concave portion 98a and the lattice-like convex portion 98b are disposed on the lower surface of the plate-shaped abutting member 98 has been described, but the present invention is not limited thereto. For example, a convex portion may be formed at a central portion of the abutting member having the largest deflection, and the concave portion may be formed radially around the convex portion.
本發明不限於前述實施形態之樹脂封裝裝置，當然亦可適用於用以將兩面安裝有半導體元件之基板封裝樹脂之樹脂封裝裝置。The present invention is not limited to the resin package device of the above embodiment, and can of course be applied to a resin package device for mounting a substrate encapsulating resin having semiconductor elements on both sides.
1．．．基板1. . . Substrate
2．．．光半導體元件2. . . Optical semiconductor component
3．．．成形品3. . . Molded product
4．．．無用樹脂4. . . Useless resin
5．．．光半導體裝置5. . . Optical semiconductor device
6．．．成形部6. . . Forming department
9．．．樹脂封裝材料9. . . Resin packaging material
10．．．底板10. . . Bottom plate
11．．．繫桿11. . . Tie
12．．．平台12. . . platform
13．．．引導軌道13. . . Guide track
14，31，83．．．電動馬達14,31,83. . . electric motor
15，34，84．．．滾珠螺桿15,34,84. . . Ball screw
16．．．支撐塊16. . . Support block
20．．．上模具組20. . . Upper mold set
21．．．上模具模組twenty one. . . Upper mold module
22．．．上模具槽twenty two. . . Upper mold slot
23．．．引導孔twenty three. . . Guide hole
24．．．吸引孔twenty four. . . Attraction hole
25，26．．．透氣路徑25,26. . . Breathable path
30．．．滑動板30. . . Sliding plate
32．．．帶32. . . band
33，82．．．螺帽33,82. . . Nut
35．．．套筒35. . . Sleeve
36．．．上接頭36. . . Upper joint
40．．．下模具組40. . . Lower mold set
41．．．下模具模組41. . . Lower mold module
42．．．氣缸基座42. . . Cylinder base
43．．．中間基座43. . . Intermediate base
44．．．固定框44. . . Fixed frame
45．．．密封材45. . . Sealing material
46．．．驅動裝置46. . . Drive unit
47．．．可動框47. . . Movable frame
48．．．中心板48. . . Center board
49．．．內支持器49. . . Internal support
50，53．．．連結軸50,53. . . Connecting shaft
51．．．外板51. . . Outer panel
52．．．外支持器52. . . External support
54．．．下層板54. . . Lower deck
54a，81．．．支撐銷54a, 81. . . Support pin
55．．．活塞55. . . piston
56．．．活塞蓋56. . . Piston cover
60．．．下模具槽60. . . Lower mold slot
61．．．支持器基座61. . . Holder base
61a．．．側面蓋61a. . . Side cover
62．．．背板62. . . Backplane
62a．．．凸肩螺栓62a. . . Shoulder bolt
62b，66a，96a．．．彈簧62b, 66a, 96a. . . spring
62c．．．引導銷62c. . . Guide pin
63．．．陰模63. . . Feminine model
64．．．傳送板64. . . Transfer board
65．．．框架導件65. . . Frame guide
65a．．．環狀段部65a. . . Annular section
65b．．．缺口部65b. . . Notch
66．．．傳送銷66. . . Delivery pin
67．．．凹處67. . . Recess
68．．．模穴部68. . . Cavity
69．．．樹脂積存部69. . . Resin reservoir
70．．．連通路徑70. . . Connected path
71．．．銷孔71. . . Pin hole
72．．．壓力感測器72. . . Pressure sensor
80．．．升降裝置80. . . Lifting device
85．．．引導板85. . . Guide board
86，96．．．引導軸86,96. . . Guide axis
87．．．下接頭87. . . Lower joint
90．．．保持裝置90. . . Holding device
91．．．上板91. . . On board
92．．．柱92. . . column
93．．．下板93. . . Lower plate
94．．．緩衝構件94. . . Cushion member
95．．．引導部95. . . Guide
97．．．連結桿97. . . Connecting rod
97a．．．卡止爪97a. . . Claw claw
98．．．板狀抵接構件98. . . Plate abutment member
98a．．．凹部98a. . . Concave
98b．．．凸部98b. . . Convex
99．．．吸引管99. . . Suction tube
100．．．分配裝置100. . . Distribution device
P．．．待機位置P. . . Standby position
第1A圖、第1B圖、第1C圖係顯示經以本案發明之樹脂封裝裝置封裝樹脂之成形品之立體圖、正面圖及經裁切之光半導體裝置單體之立體圖。1A, 1B, and 1C are perspective views, front views, and perspective views of a single cut optical semiconductor device in which a resin is encapsulated in a resin package device of the present invention.
第2圖係本案發明之樹脂封裝裝置之正面圖。Fig. 2 is a front elevational view showing the resin encapsulating apparatus of the present invention.
第3圖係第2圖所示之樹脂封裝裝置之主要部份截面圖。Fig. 3 is a cross-sectional view showing the main part of the resin package device shown in Fig. 2.
第4圖係本案發明之樹脂封裝裝置之側視圖。Fig. 4 is a side view of the resin encapsulating device of the invention of the present invention.
第5圖係本案發明之樹脂封裝裝置之平面截面圖。Fig. 5 is a plan sectional view showing a resin encapsulating apparatus of the present invention.
第6圖係第4圖所示之樹脂封裝裝置之主要部份放大截面圖。Fig. 6 is an enlarged cross-sectional view showing the main part of the resin package device shown in Fig. 4.
第7圖係第5圖所示之樹脂封裝裝置之主要部份放大平面圖。Fig. 7 is an enlarged plan view showing the main part of the resin package device shown in Fig. 5.
第8圖係第4圖、第5圖所示之保持裝置之放大側視圖。Fig. 8 is an enlarged side view of the holding device shown in Figs. 4 and 5.
第9圖係第8圖所示之保持裝置之主要部份放大平面圖。Fig. 9 is an enlarged plan view showing the main part of the holding device shown in Fig. 8.
第10A圖、第10B圖係用以說明本案發明之樹脂封裝裝置之成形步驟的截面圖。10A and 10B are cross-sectional views for explaining a forming step of the resin sealing device of the present invention.
第11A圖、第11B圖係接續第10B圖之截面圖。Fig. 11A and Fig. 11B are cross-sectional views taken along line 10B.
第12A圖、第12B圖係接續第11B圖之截面圖。Fig. 12A and Fig. 12B are cross-sectional views taken along line 11B.
第13A圖、第13B圖係接續第12B圖之截面圖。Fig. 13A and Fig. 13B are cross-sectional views taken along line 12B.
第14圖係接續第13B圖之截面圖。Figure 14 is a cross-sectional view taken along line 13B.
1．．．基板1. . . Substrate
3．．．成形品3. . . Molded product
9．．．樹脂封裝材料9. . . Resin packaging material
21．．．上模具模組twenty one. . . Upper mold module
22．．．上模具槽twenty two. . . Upper mold slot
23．．．引導孔twenty three. . . Guide hole
43．．．中間基座43. . . Intermediate base
44．．．固定框44. . . Fixed frame
47．．．可動框47. . . Movable frame
54．．．下層板54. . . Lower deck
54a．．．支撐銷54a. . . Support pin
55．．．活塞55. . . piston
61．．．支持器基座61. . . Holder base
61a．．．側面蓋61a. . . Side cover
62．．．背板62. . . Backplane
62a．．．凸肩螺栓62a. . . Shoulder bolt
62b，66a，96a．．．彈簧62b, 66a, 96a. . . spring
62c．．．引導銷62c. . . Guide pin
63．．．陰模63. . . Feminine model
64．．．傳送板64. . . Transfer board
65．．．框架導件65. . . Frame guide
66．．．傳送銷66. . . Delivery pin
71．．．銷孔71. . . Pin hole
90．．．保持裝置90. . . Holding device
91．．．上板91. . . On board
92．．．柱92. . . column
94．．．緩衝構件94. . . Cushion member
96．．．引導軸96. . . Guide axis
97．．．連結桿97. . . Connecting rod
97a．．．卡止爪97a. . . Claw claw
98．．．板狀抵接構件98. . . Plate abutment member
99．．．吸引管99. . . Suction tube
Claims (6)
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| JP2010224093A JP5229292B2 (en) | 2010-10-01 | 2010-10-01 | Resin sealing device and resin sealing method |
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| TW201246404A TW201246404A (en) | 2012-11-16 |
| TWI440104B true TWI440104B (en) | 2014-06-01 |
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| KR (1) | KR101324843B1 (en) |
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| KR19990063586A (en) * | 1996-07-12 | 1999-07-26 | 아끼구사 나오유끼 | Method for manufacturing semiconductor device, mold for manufacturing semiconductor device, semiconductor device and mounting method thereof |
| JPH1119971A (en) * | 1997-06-30 | 1999-01-26 | Tsukuba Seiko Kk | Sealing molding machine |
| JP4215593B2 (en) * | 2003-08-06 | 2009-01-28 | アピックヤマダ株式会社 | Resin molding equipment |
| KR100598459B1 (en) * | 2004-12-10 | 2006-07-11 | 주식회사 쎄크 | Chip bonding apparatus |
| US8342837B2 (en) * | 2006-09-19 | 2013-01-01 | Dai-Ichi Seiko Co., Ltd. | Resin sealing apparatus |
| JP5148175B2 (en) * | 2007-06-06 | 2013-02-20 | 住友重機械工業株式会社 | Resin sealing device and resin sealing method |
| KR20100001690A (en) * | 2008-06-27 | 2010-01-06 | (주)티.에스정밀 | Molding apparatus for manufacturing semi-conductor package |
| CN101677071A (en) * | 2008-09-16 | 2010-03-24 | 玉晶光电股份有限公司 | Demoulding mechanism used in encapsulation process of light-emitting diode |
-
2010
- 2010-10-01 JP JP2010224093A patent/JP5229292B2/en not_active Expired - Fee Related
-
2011
- 2011-08-11 TW TW100128703A patent/TWI440104B/en not_active IP Right Cessation
- 2011-08-22 KR KR1020110083537A patent/KR101324843B1/en not_active IP Right Cessation
- 2011-09-28 CN CN201110308979.5A patent/CN102555135B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678741B (en) * | 2015-12-23 | 2019-12-01 | 貝西荷蘭有限公司 | Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators |
| TWI720526B (en) * | 2017-08-21 | 2021-03-01 | 日商Ｔｏｗａ股份有限公司 | Resin molding apparatus and method for manufacturing resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102555135B (en) | 2014-07-30 |
| CN102555135A (en) | 2012-07-11 |
| TW201246404A (en) | 2012-11-16 |
| KR20120034556A (en) | 2012-04-12 |
| KR101324843B1 (en) | 2013-11-01 |
| JP2012079937A (en) | 2012-04-19 |
| JP5229292B2 (en) | 2013-07-03 |
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