JP2017094619A - Resin molding die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology capable of securing a gap between die blocks.SOLUTION: A resin molding die (10) includes a base (22) acting as a first die block, a cavity piece (26) which is fixed and assembled to the base (22) and acts as a second die block, a clamper (28) which is adjacent to the cavity piece (26), is assembled so as to be separated from the base (22), and acts as a third block, a heater (20) which is housed in the base (22), and an auxiliary heater (50) which is housed in the clamper (28).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technique effective when applied to a resin molding die.

  Japanese Patent Application Laid-Open No. 2010-179507 (Patent Document 1) describes a heater incorporated in each of the upper mold pressure block and the lower mold base (see paragraphs [0016] and [0018] in particular). ).

JP 2010-179507 A

  The resin mold is configured by assembling a plurality of mold blocks (also referred to as mold plates) so as to have a cavity (resin molding space) when the mold is closed. In the resin mold, for example, a detachable (replaceable) mold block such as a chase or a clamper is assembled to the base. In addition, a heater is built in the resin mold, and the entire mold including the removable mold block such as a chase is heated by the heater so that heat is applied to the resin filled in the cavity.

  By the way, in the resin molding die, the cavity piece is fixedly held with respect to the chase held in the base with the built-in heater, while being held apart via a spring member so that the clamper can move. There are some (see, for example, Patent Document 1). In this resin molding die, heat from the base is not directly transmitted to the clamper, so the clamper is difficult to receive heat from the heater, and a temperature difference occurs between the clamper and the cavity piece. That is, the cavity piece becomes larger with respect to the clamper due to thermal expansion. In particular, the cavity piece for WLP (Wafer Level Package) is large, but becomes larger than the clamper due to thermal expansion. For this reason, the gap between the cavity piece and the clamper is not ensured with a desired dimension, and becomes small. As a result, for example, the sliding resistance of the clamper increases, and there is a possibility that a malfunction of the clamper may be caused.

  The objective of this invention is providing the technique which can ensure the clearance gap between die blocks. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  A resin mold according to one solution of the present invention includes a first mold block (for example, a base) and a second mold block (for example, a cavity piece) fixedly assembled to the first mold block. ), A third mold block (for example, a clamper) which is assembled adjacent to the second mold block and spaced apart from the first mold block, and a first mold block built in the first mold block. 1 heater and a second heater built in the third mold block.

  According to this, since the third mold block easily receives heat and is thermally expanded together with the second mold block, a gap between the second mold block and the third mold block can be secured.

  In the resin mold according to the one solution, the second mold block is surrounded by the third mold block formed in an annular shape, and the third mold block includes the linear second mold block. It is preferable that the heater is provided in an annular shape surrounding the second mold block. According to this, the whole third mold block can be heated around the second mold block.

  In the resin molding die according to the one solving means, the third mold block includes a first divided portion and a second divided portion that are divided in a mold opening / closing direction, and the first divided portion is arranged with respect to the second divided portion. More preferably, the dividing portion is provided on the first mold block side, and the second heater is housed in the first dividing portion. According to this, the second heater can be easily attached and detached.

  More preferably, the resin molding die according to the one solving means further includes a spring member, and the third die block is assembled to the first die block via the spring member so as to move. . According to this, heat is transmitted from both the first mold block (base) and the third mold block (clamper), and the spring member can be stabilized.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin mold according to one solution of the present invention, it is possible to ensure a gap between the second mold block (cavity piece) and the third mold block (clamper).

It is a typical sectional view of a resin mold in one embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a resin molding die in an operation following FIG. 1. FIG. 3 is a schematic cross-sectional view of a resin molding die in an operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of a resin molding die in an operation following FIG. 3. It is explanatory drawing of the heater and auxiliary heater of the resin mold shown in FIG. It is explanatory drawing of the heater and auxiliary heater of the resin mold shown in FIG.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

  A resin molding die 10 (also referred to as a resin molding die mechanism) according to this embodiment will be described with reference to FIGS. 1 to 4 are schematic cross-sectional views of the resin molding die 10 and show a series of operation states. According to the operation of the resin molding die 10, the workpiece W is resin-molded from the state of the molded product to be in the state of the molded product 100 (see FIG. 4). FIG. 5 is an explanatory diagram of the heater 20 and the auxiliary heater 50 of the resin mold 10, and is a schematic plan view of the lower mold 14 in a parting surface view (plan view). FIG. 6 is an explanatory view of the heater 20 and the auxiliary heater 50 of the resin molding die 10 and is a schematic cross-sectional view of the lower die 14.

  The resin mold 10 includes a pair of molds having a cavity C that are opened and closed (for example, a plurality of mold blocks made of alloy tool steel are assembled). In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 12, and the other mold on the lower side is the lower mold 14. The resin molding die 10 is opened and closed when the upper die 12 and the lower die 14 are separated or approached. For this reason, the vertical direction is also the mold opening / closing direction. The cavity C in the resin molding die 10 is a resin molding space (see FIG. 4) when the mold is closed, and a concave portion (this is provided in a recess in the parting surface 14a of the lower mold 14 when the mold is opened. (Refer to FIG. 1). That is, in the resin mold 10, the cavity C is formed by closing the opening of the cavity recess C ′ when the mold is closed.

  The resin mold 10 includes a known mold opening / closing mechanism (not shown) for opening and closing the mold. For example, the mold opening / closing mechanism includes a pair of platens, a plurality of tie bars on which the pair of platens are mounted, a drive source (for example, an electric motor) that moves (lifts) the platen, and a drive transmission mechanism (for example, a toggle link). Prepare. In this mold opening / closing mechanism, a resin molding die 10 is provided between a pair of platens. In this embodiment, the upper mold 12 serving as a fixed mold is assembled to a fixed platen (a platen fixed to a tie bar), and the lower mold 14 serving as a movable mold is assembled to a movable platen 52 (a platen that moves up and down along the tie bar). . In the mold opening / closing of the resin mold 10, the upper mold 12 may be a movable mold, the lower mold 14 may be a fixed mold, both the upper mold 12 and the lower mold 14 may be movable molds, or a mold opening / closing mechanism. It is good also as manual without using.

  In addition, the resin molding die 10 includes a work set part 16 and a resin set part (in this embodiment, the cavity concave part C ′ is also used) on which the work W and the resin R are set (arranged). The workpiece W includes a substrate 102 (for example, a wiring substrate) and a plurality of mounting components 104 (for example, semiconductor chips). For example, a plurality of mounting components 104 are surface-mounted (mounted) in a matrix on the substrate 102. For example, when the substrate 102 has a circular shape in plan view, the work W is a plate-like body having a circular shape in plan view as a whole, and can be said to have a plurality of mounting components 104. The resin R is, for example, a thermosetting resin (for example, a filler-containing epoxy resin), and the state thereof may be liquid, powder, sheet, or granule.

  The work set portion 16 is provided on the parting surface 12 a of the upper die 12 so as to face the cavity concave portion C ′ of the lower die 14. The work set unit 16 includes a suction path (ventilation path) (not shown) and a suction device (for example, a vacuum pump) leading to the suction path. One end of this suction path leads to the parting surface 12a of the upper mold 12, and the other end is connected to a suction device provided outside the upper mold 12. According to the work setting unit 16, it is possible to drive the suction device outside the mold to suck the work W from the suction path, and to hold the work W by adsorbing to the parting surface 12a. The work setting unit 16 includes a gripping unit 18 that grips the work W. Since the gripping part 18 sandwiches the outer peripheral side surface of the workpiece W and grips the workpiece W, the workpiece W can be prevented from falling and the workpiece W can be held on the parting surface 12a of the upper mold 12.

  The resin molding die 10 includes a known pressure reducing mechanism (not shown). The decompression mechanism includes, for example, a chamber containing the upper mold 12 and the lower mold 14 and a decompression device (for example, a vacuum pump) communicating with the chamber. By the decompression mechanism, the decompression device outside the chamber can be driven to decompress the interior of the chamber. As a result, even when the mold is closed (see FIG. 3), the cavity C can be deaerated through an air vent groove (not shown) formed in the parting surface 14 a of the lower mold 14.

  Moreover, the resin molding die 10 includes a heater 20 (for example, an electric heater). The heater 20 is built in each of the upper mold 12 and the lower mold 14. The resin molding die 10 is adjusted to a predetermined temperature (for example, 180 ° C.) by the heater 20 and heated. In addition to the heater 20, the resin molding die 10 includes an auxiliary heater 50 (for example, an electric heater), which will be described later.

  The resin molding die 10 includes a film F (also referred to as a release film) (see FIG. 2). The film F is provided so as to cover the parting surface 14a of the lower mold 14 including the inner surface of the cavity recess C '. By providing the film F, the molded product 100 (work W) can be easily taken out from the resin mold 10. The film F has heat resistance that can withstand the heating temperature of the resin molding die 10, is easily peeled off from the parting surface 14 a of the lower mold 14, and is a film material having flexibility and extensibility. . As the film F, for example, a resin film such as PTFE (polytetrafluoroethylene) or ETFE (polytetrafluoroethylene polymer) can be used.

  Further, the resin molding die 10 includes a film suction mechanism that sucks the film F from the parting surface 14 a side of the lower die 14. The film suction mechanism includes suction paths 14b and 14c (ventilation paths) that penetrate the clamper 28 and a suction device (not shown) (for example, a vacuum pump) that leads to the suction paths 14b and 14c (ventilation paths). One end of the suction paths 14 b and 14 c communicates with the parting surface 14 a of the lower mold 14, and the other end is connected to a suction device provided outside the lower mold 14. According to this film suction mechanism, the suction device outside the mold is driven to suck the film F from the suction paths 14b and 14c, and the film F is adsorbed to the parting surface 14a including the inner surface of the cavity recess C ′. Can be held (pasted).

  Next, the lower mold 14 of the resin molding die 10 will be specifically described. The lower die 14 includes a base 22, a chase 24, a cavity piece 26, a clamper 28, and a holder 30, and these die blocks are assembled.

  The cavity piece 26 is fixedly assembled to the upper surface of the chase 24 (the surface on the upper mold 12 side). The clamper 28 is formed in an annular shape so as to surround the cavity piece 26, and is assembled adjacent to the cavity piece 26 and separated (floating) from the upper surface of the chase 24.

  In the present embodiment, the lower mold 14 has a cavity recess C ′ that is recessed from the parting surface 14a. However, the cavity piece 26 forms the back (bottom) of the cavity recess C ′, and the clamper 28 is located on the side of the cavity recess C ′. Parts. Specifically, a through-hole 28a having a circular shape in a parting plane view (plan view) is formed in the central portion of the clamper 28 in the thickness direction (mold opening / closing direction). By inserting and assembling the cavity piece 26 into the through hole 28a of the clamper 28, a cavity recess C 'is formed.

  The resin mold 10 includes a spring member 32 (for example, a coil spring) as a movable member (elastic member). The spring member 32 is provided between the chase 24 and the clamper 28. A clamper 28 is movably assembled to the chase 24 via the spring member 32. That is, the cavity piece 26 is surrounded by the clamper 28, and the cavity piece 26 and the clamper 28 are relatively movable (reciprocating) in the mold opening / closing direction. At this time, the gap g (see FIG. 6) between the inner peripheral surface of the through hole 28a of the clamper 28 and the outer peripheral surface of the cavity piece 26 is secured with a predetermined dimension, so that the clamper 28 can move smoothly. As described above, in the resin molding die 10, the cavity piece 26 is fixedly held with respect to the chase 24, while being held apart (floating) via the spring member 32 so that the clamper 28 can move. .

  By the way, the gap g is included in the suction path 14c of the film suction mechanism described above, and sucks the film F at the boundary between the cavity piece 26 and the clamper 28 (corner portion of the cavity recess C '). For this reason, the film suction mechanism includes a seal member 34 (for example, an O-ring). The sealing member 34 is provided between the cavity piece 26 and the clamper 28 (lower part) so that the gap g serves as the suction path 14c and does not leak air, and performs sealing.

  In the lower mold 14, the chase 24, the cavity piece 26, and the clamper 28 are configured to be easily exchanged (detached) with respect to the base 22 as a set of exchange blocks. Specifically, a holder 30 is provided on the upper surface of the base 22 (the surface on the upper mold 12 side), and an exchange block such as the chase 24 is easily exchanged by the holder 30. The holder 30 can fix (hold) or release the chase 24 (replacement block) by pressing the outer peripheral edge of the chase 24 toward the base 22 side. In a state where the chase 24 is fixed to the base 22, the cavity piece 26 is fixed and assembled to the base 22 via the chase 24, and the clamper 28 is assembled separately from the base 22 via the chase 24. .

  As shown in FIGS. 5 and 6, the lower mold 14 of the resin molding die 10 includes a heater 20, an auxiliary heater 50, temperature sensors 54 and 56, a control unit 58, and a power supply 60. A heater 20 (for example, an electric heater) of the lower mold 14 is built in the base 22 of the lower mold 14 and mainly applies heat to the entire lower mold 14. The auxiliary heater 50 (for example, an electric heater) is built in the clamper 28 and supplementarily applies heat to the clamper 28 in which heat from the heater 20 of the lower mold 14 is difficult to be transmitted. The heater 20 and the auxiliary heater 50 of the lower mold 14 are heated by receiving power from the power source 60.

  According to such a configuration of the lower mold 14, the clamper 28 is easily subjected to heat, and is thermally expanded together with the cavity piece 26 while the temperature difference between the cavity piece 26 and the clamper 28 is reduced. For this reason, the gap g between the cavity piece 26 and the clamper 28 can be ensured (not too narrow). Therefore, it is possible to prevent a malfunction of the clamper 28. In addition, the heater 20 is required to raise the temperature of the clamper 28 by heating the clamper 28 with the auxiliary heater 50 separately from the heater 20 of the lower mold 14 as compared with the configuration in which the auxiliary heater 50 is not provided. There is no need for a higher temperature than that, and it does not take time to raise the temperature.

  In addition, when the gap g (suction path 14c) between the cavity piece 26 and the clamper 28 is appropriately secured, the film F is not sucked at the boundary between the cavity piece 26 and the clamper 28 (the corner portion of the cavity recess C ′). Can be prevented. Therefore, the film F can be stably adsorbed on the parting surface 14a.

  Further, a spring member 32 is provided between the base 22 incorporating the heater 20 and the clamper 28 incorporating the auxiliary heater 50, and the clamper 28 can be raised and lowered by the spring member 32 only by opening and closing the mold. Yes. For this reason, the spring member 32 is contracted by clamping the mold, and the depth of the cavity C is configured to be variable. In such a configuration, if the gap g does not have an appropriate width, the sliding resistance between the mold surfaces increases, and an appropriate resin pressure is applied to the resin R in the cavity C with a prescribed mold closing force. There are also things you can't do. As described above, even in the compression molding mold in which the depth of the cavity C is variable by the expansion and contraction of the spring member 32, the gap g is appropriately maintained, so that the resin pressure can be made appropriate and the production quality can be improved. Can be maintained. In addition, the configuration in which the depth of the cavity C is variable is not limited to that by the spring member 32, and the cavity piece 26 and the clamper 28 are relatively moved by a power different from the mold opening / closing mechanism, such as a hydraulic pressure or a pneumatic pressure. Alternatively, the position may be variable.

  Further, since the auxiliary heater 50 that is a heat source is built in the clamper 28 that forms the side of the cavity recess C ′, temperature variation (temperature decrease) on the cavity C surface due to heat radiation from the cavity piece 26 can be suppressed. it can. In the configuration in which the cavity C is provided in the lower mold 14 as in the present embodiment, the heat of the surface of the cavity piece 26 diffuses upward, so that it is easy to dissipate heat. Further, assuming a configuration in which the auxiliary heater 50 is not provided in the clamper 28, since the heat is more easily radiated outside the center of the cavity piece 26, the temperature at the center of the cavity piece 26 is higher and the temperature outside the cavity piece 26 is higher. It tends to be in a biased state that becomes lower. On the other hand, by providing the auxiliary heater 50, the heat radiation outside the cavity piece 26 can be suppressed, and the difference between the center temperature and the outside temperature in the cavity C can be reduced. Thereby, the thermosetting resin R filled in the cavity C can be optimally cured. That is, the molded product 100 (work W) having excellent molding quality can be manufactured.

  The temperature sensor 54 (for example, a thermocouple) is provided so as to be inserted into a hole provided in the chase 24 of the lower mold 14, and the temperature of the base 22 heated by the heater 20 of the lower mold 14 is measured. Thereby, the temperature of the chase 24 of the lower mold 14 that receives heat from the base 22 can be indirectly measured. The temperature sensor 56 (for example, a thermocouple) is provided so as to be inserted into a hole provided in the clamper 28, and measures the temperature of the clamper 28 that is also heated from the auxiliary heater 50. These temperature sensors 54 and 56 are connected to the control unit 58 through an appropriate conversion function unit (not shown). Further, the control unit 58 controls the power source 60 that operates the heater 20 and the auxiliary heater 50. The controller 58 controls power supply to the heater 20 and the auxiliary heater 50 of the lower mold 14 based on the measurement data of the temperature sensors 54 and 56. Note that the control unit 58 increases the temperature of the auxiliary heater 50 in order to increase the temperature of the clamper 28 when the sliding of the clamper 28 with respect to the cavity piece 26 is awkward (sliding resistance is high). The power source 60 may be controlled.

  As the auxiliary heater 50 (shown by a broken line in FIG. 5), a linear (thin tubular) heater whose shape can be deformed relatively freely (flexible) can be used. Such an auxiliary heater 50 is provided on the clamper 28 in an annular shape surrounding the cavity piece 26 by being arranged so as to be wound at a predetermined distance from the cavity piece 26. In the case of forming an annular shape by winding a linear heater, it may be wound a plurality of times so as to form a spiral shape in a plan view, or may be wound only once. You may wind so that a heater wire may overlap with a perpendicular direction. By using the annular auxiliary heater 50 in this way, the entire clamper 28 can be uniformly heated around the cavity piece 26. In this case, the temperature around the cavity concave portion C ′ can be adjusted to be uniform, whereby the thermosetting resin R can be heated uniformly. That is, the molded product 100 (work W) having excellent molding quality can be manufactured.

  Further, the clamper 28 incorporating the auxiliary heater 50 includes and is constituted by a dividing unit 28A and a dividing unit 28B that are divided in the mold opening / closing direction. In other words, the clamper 28 is configured to be divided into two upper and lower members. A dividing portion 28A is provided on the base 22 side with respect to the dividing portion 28B. Through holes that form the suction paths 14b and 14c are formed in the divided portion 28B. On the other hand, the auxiliary heater 50 is housed in the divided portion 28A. Specifically, a groove is formed on the separation surface between the divided portion 28A and the divided portion 28B, and the auxiliary heater 50 is accommodated in the groove. Since the clamper 28 can be divided in this way, the auxiliary heater 50 can be easily attached and detached (replaced). Further, it is preferable that the position of the separation surface between the divided portion 28A and the divided portion 28B is disposed below the center in the height direction as a whole in order to uniformly heat the clamper 28 itself.

  Next, the upper mold 12 of the resin molding die 10 will be specifically described. The upper mold 12 includes a base 22, a chase 24, an insert 36, and a holder 30, and is configured by assembling these mold blocks. In the upper mold 12, an insert 36 is used instead of the cavity piece 26 and the movable clamper 28 fixed to the base 22 (chase 24) of the lower mold 14 described above. The insert 36 is fixedly assembled to the lower surface of the chase 24 (the surface on the lower mold 14 side). In the upper mold 12, the chase 24 and the insert 36 can be easily exchanged (detached) with respect to the base 22 by the holder 30 as a set of exchange blocks.

  Next, the operation of the resin molding die 10 as a compression molding according to this embodiment (process of the resin molding method) will be described.

  First, as shown in FIG. 1, a resin molding die 10 including a pair of molds (upper mold 12 and lower mold 14) that can be opened and closed is prepared. In the resin mold 10, the upper mold 12 and the lower mold 14 are heated to a predetermined temperature (for example, about 150 ° C.) by the heater 20 and the auxiliary heater 50. Here, several temperatures on the upper surface (surface on the upper mold 12 side) of the cavity piece 26 are measured in a state where the resin mold 10 is opened. For example, when the temperature of the outer edge portion is lower than the central portion of the upper surface of the cavity piece 26, that is, when the temperature difference between the facing cavity piece 26 and the clamper 28 becomes large, the output of the auxiliary heater 50 built in the clamper 28 is output. By increasing the temperature and adjusting the temperature, it is possible to prevent the gap g from becoming narrow. Here, for example, by sucking air from the suction path 14c via the gap g, the gap g is calculated by measuring the resistance (output) of the motor that drives the pump of the suction device, and whether or not the gap g is appropriate. May be judged.

  In addition, in a state where the resin molding die 10 is opened, the workpiece W is set in the workpiece setting unit 16. Specifically, the workpiece W is transported to the parting surface 12a of the upper mold 12 by, for example, a loader (transport mechanism) (not shown). Then, the workpiece W is sucked by a suction path (not shown) with the mounting component 104 facing the lower mold 14, and is gripped by the grip portion 18 and set on the work set portion 16.

  Subsequently, as shown in FIG. 2, in a state where the resin molding die 10 is opened, the film F is set so as to cover the parting surface 14a of the lower mold 14 including the inner surface of the cavity recess C '. Specifically, in the lower mold 14, the film F is provided so as to be drawn out from a feeding roll wound in a roll shape, passed through the parting surface 14 a of the lower mold 14, and wound onto the winding roll. It is done. Then, the film F is sucked and held (attached) to the parting surface 14a of the lower mold 14 including the inner surface of the cavity recess C 'by being sucked by the suction paths 14b and 14c of the film suction mechanism.

  As described above, since the temperature is adjusted by the auxiliary heater 50 so that the temperature difference between the cavity piece 26 and the clamper 28 is reduced, the gap g constituting the suction path 14c is secured with a predetermined dimension. Accordingly, the film suction mechanism can suck the film F through the suction paths 14b and 14c and stably adsorb it to the parting surface 14a.

  Further, in a state where the resin molding die 10 is opened, the resin R is set in the cavity concave portion C ′ that is a resin setting portion. For example, when the resin R is granular, the resin R is dropped into the cavity recess C ′ by a dispenser (not shown). At this time, since the film F is adsorbed so as to cover the inner surface of the cavity recess C ′, the resin R does not leak from the gap g. Moreover, the film F and resin R can also be supplied integrally. That is, the film F is prepared outside the resin mold 10 and the resin R is supplied thereon. Next, if the film F supplied with the resin R is held and transported and placed on the lower mold 14, the film F and the resin R can be supplied integrally.

  Subsequently, the resin molding die 10 is closed (the upper die 12 and the lower die 14 are brought closer to each other), and as shown in FIG. 3, the upper surface of the clamper 28 ( That is, the mold clamping is performed by applying the parting surface 14a) of the lower mold 14. Accordingly, the cavity C is formed by closing the opening of the cavity recess C ′ that is recessed from the parting surface 14 a of the lower mold 14. Note that the cavity C can be smoothly deaerated by driving the decompression mechanism before the opening of the cavity recess C 'is closed.

  By the way, since the workpiece W is provided on the parting surface 12a of the upper die 12 and the film F is provided on the parting surface 14a of the lower die 14, the workpiece is interposed via the film F at the time of mold clamping. W (substrate 102) is clamped by the clamper 28. Therefore, actually, the opening of the cavity recess C ′ of the lower mold 14 is closed by the substrate 102 of the workpiece W, and the mounting component 104 of the workpiece W is accommodated in the cavity C.

  Subsequently, the resin molding die 10 is further closed, and the resin R is pressurized (compressed) so that the cavity C is filled with the resin R as shown in FIG. Specifically, it is fixed to the base 22 of the lower mold 14 with the upper surface of the clamper 28 of the lower mold 14 (the parting surface 14a of the lower mold 14) being applied to the parting surface 12a of the upper mold 12. Resin R is pressurized by approaching the cavity piece 26 that has been made. At this time, the clamper 28 held by the base 22 via the spring member 32 moves (slids) relative to the cavity piece 26 when the spring member 32 is biased (compressed). It becomes.

  As described above, the temperature difference between the cavity piece 26 and the clamper 28 is adjusted by the auxiliary heater 50 so that the gap g between the cavity piece 26 and the clamper 28 is ensured with a predetermined dimension. Therefore, the clamper 28 can move smoothly (slid relative to the cavity piece 26).

  Next, after the resin R filled in the cavity C is thermally cured in a pressure-holding state, the mold is opened and the workpiece W is taken out from the resin molding die 10. Thereafter, the workpiece W is further thermally cured (post-cured), whereby the molded product 100 in which the mounting component 104 is sealed with the resin R is substantially completed. According to the resin molding die 10, since the clamper 28 can be stably moved, the resin R can be compressed and molded with an appropriate pressure.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the embodiment, the case where the auxiliary heater is built in the clamper has been described. Not limited to this, an auxiliary heater (heat source) may be incorporated in the chase. According to this, the temperature raising time can be shortened, and the temperature variation of the chase can be reduced.

  In the above-described embodiment, the planar view shape of the workpiece is circular, but it may be rectangular or polygonal. In addition to the wiring substrate, the substrate is used for manufacturing, for example, a wafer used for manufacturing WLP or the like, or a FOWLP (Fan-Out Wafer Level Package) such as eWLB (embeded Wafer Level Ball Grid Array). It may be a plate-like carrier (metal, glass) on which a semiconductor chip to be mounted is mounted. In such a case, the cavity piece 26 may have a rectangular outer shape, and the clamper 28 may have a rectangular annular shape. In this case, the auxiliary heater 50 also has a linear heater arranged in a rectangular ring shape in the clamper 28. In addition to the semiconductor chip, the mounting component may be, for example, an active component such as an electronic component, a passive component, a wiring pattern that requires an exposed terminal such as a lead frame, or a wiring block body (for example, a post).

  In the above embodiment, the case where the cavity piece is fixedly assembled to the base and the clamper is assembled so as to be movable by the spring member has been described. However, the present invention is not limited to this, and the clamper may be fixedly assembled to the base, and the cavity piece may be assembled so as to be moved by the spring member. Further, the clamper or the like may be moved by a drive mechanism such as a ball screw without using the spring member.

  Moreover, although the said embodiment demonstrated the structure which can ensure the predetermined clearance gap g between metal mold | die in the lower mold | type 14, this invention is not limited to this. For example, when the depth of the cavity C is configured to be variable in the upper mold 12, a predetermined gap g may be secured, and the gap g may be arbitrarily set in both the upper mold 12 and the lower mold 14. It can also be set as the structure ensured in this.

  Moreover, in the said embodiment, the example which comprises the resin molding die 10 as compression molding was demonstrated. However, the resin molding die to which the present invention is applied may be a transfer molding die. That is, even in the transfer molding die for injecting the resin supplied to the pot into the cavity C, the cavity C and the clamper 28 may be provided to vary the depth of the cavity C. Even in such a case, the gap g can be appropriately maintained so that smooth sliding is possible.

10 Resin Mold 20 Heater 22 Base 26 Cavity Piece 28 Clamper 50 Auxiliary Heater

Claims (4)

A first mold block;
A second mold block fixedly assembled to the first mold block;
A third mold block, which is assembled adjacent to the second mold block and spaced apart from the first mold block;
A first heater built in the first mold block;
A second heater built in the third mold block;
A resin molding die comprising: In the resin molding die according to claim 1,
The second mold block is surrounded by the third mold block formed in an annular shape;
The resin mold according to claim 3, wherein the third mold block is provided with the linear second heater in an annular shape surrounding the second mold block. In the resin molding die according to claim 1 or 2,
The third mold block includes a first divided portion and a second divided portion that are divided in the mold opening and closing direction,
The first divided portion is provided on the first mold block side with respect to the second divided portion,
The resin molding die, wherein the second heater is housed in the first divided portion. In the resin mold as described in any one of Claims 1-3,
A spring member;
A resin molding die, wherein the third die block is assembled so as to be movable to the first die block via the spring member.

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