KR20100000950A - Apparatus for molding a electronic device - Google Patents

Apparatus for molding a electronic device Download PDF

Info

Publication number
KR20100000950A
KR20100000950A KR1020080060639A KR20080060639A KR20100000950A KR 20100000950 A KR20100000950 A KR 20100000950A KR 1020080060639 A KR1020080060639 A KR 1020080060639A KR 20080060639 A KR20080060639 A KR 20080060639A KR 20100000950 A KR20100000950 A KR 20100000950A
Authority
KR
South Korea
Prior art keywords
cavity
electronic component
molding
mold
disposed
Prior art date
Application number
KR1020080060639A
Other languages
Korean (ko)
Other versions
KR101448490B1 (en
Inventor
김선오
Original Assignee
세크론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Priority to KR1020080060639A priority Critical patent/KR101448490B1/en
Publication of KR20100000950A publication Critical patent/KR20100000950A/en
Application granted granted Critical
Publication of KR101448490B1 publication Critical patent/KR101448490B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The electronic component molding apparatus is disposed to face the lower mold and the lower mold, each having a lower die forming a bottom of a cavity covered with a release film and a cavity member surrounding the lower die and forming sidewalls of the cavity for molding the electronic component, The part is secured, disposed between the upper die, the lower die and the upper die, which is closed with the lower die and the cavity member to form a molding area for molding the electronic component, and lifts the clamping member and the cavity member clamping the release film together with the lower die, And adjusting the height of the cavity relative to the upper surface of the lower die to adjust the volume of the molding region. Therefore, the electronic component molding apparatus can adjust the height of the cavity according to the type of the electronic component.

Description

Electronic component molding device {APPARATUS FOR MOLDING A ELECTRONIC DEVICE}

The present invention relates to a molding apparatus for an electronic component. More specifically, the present invention relates to an electronic component molding apparatus for molding an electronic component with a resin in a cavity using a release film.

Generally, resin sealing molding of a semiconductor chip mounted on a substrate is performed. In the said resin sealing molding, the electronic component molding apparatus provided with the metal mold | die which provides the resin sealing molding space of an electronic component, and a release film is used.

Conventional electronic molding apparatus includes a release film supply unit for supplying a release film to the upper and lower molds while applying a constant tension to the mold and the release film consisting of the upper and lower molds. The lower mold is formed with a cavity filled with a resin. The electronic component is contained in a cavity filled with a resin so that the electronic component is resin molded. The release film is also disposed to cover the cavity inner surface. Therefore, after molding the electronic component using a resin, the release film can be easily released from the lower mold.

However, as the thickness of the electronic component varies depending on the type of the electronic component, the amount of resin contained in the cavity may vary. The volume in the cavity should be adjusted according to the amount of resin changed. Therefore, a problem arises in that the lower mold needs to be replaced whenever the type of electronic component is changed.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to omit an operation of replacing a lower mold according to the type of electronic component to be molded, thereby improving the workability of the molding operation. To provide.

In order to achieve the object of the present invention described above, the electronic component molding apparatus according to an embodiment of the present invention wraps the lower die and the lower die forming a bottom surface of the cavity coated with a release film for molding the electronic component A lower mold having a cavity member forming a sidewall of the cavity, disposed to face the lower mold, wherein the electronic component is fixed and closed with the lower die and the cavity member to form a molding region for molding the electronic component Disposed between the upper mold, the lower mold and the upper mold, and lifting the clamping member and the cavity member to clamp the release film together with the lower mold, thereby adjusting the volume of the molding region, The height is adjusted to include a height adjustment. The height adjusting unit may include a storage tank for storing fluid, a driving cylinder connected to the cavity member to lift the cavity member, and a fluid line through which the fluid flows to interconnect the storage tank and the cylinder. In addition, the fluid may comprise air or a liquid. The lower mold may further include: an elastic member disposed on the lower panel and surrounding the cavity member on the lower panel, and elastically clamping the release film together with the clamping member; And a lower seal disposed on a periphery of the lower panel and defining a vacuum region formed together with the upper mold. The upper mold may also include an upper panel, an upper die disposed on the upper panel, an upper die on which the electronic component is fixed, and an upper seal disposed on the periphery of the upper panel and defining a vacuum region formed together with the lower mold. can do. Here, the upper mold may further include a first sealing member disposed at an end of the upper seal, and sealing the vacuum region.

According to such an electronic component molding apparatus, the height of the cavity sidewall can be adjusted from the bottom of the lower die as the cavity member constituting the sidewall of the cavity is elevated. As the height of the cavity in which the resin is accommodated can be adjusted, the electronic component can be molded without replacing the lower mold according to the change in the amount of the resin. As a result, the electronic component molding apparatus can have improved efficiency.

A molding apparatus for an electronic component according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a cross-sectional view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view for describing a method of adjusting a height of a cavity member of the electronic component molding apparatus of FIG. 1.

1 and 2, the electronic component molding apparatus according to the exemplary embodiment includes a lower mold 120, an upper mold 110, a clamping member 130, and a height adjuster 140. The electronic component 10 according to the present invention includes a substrate 11 and a semiconductor chip 13 formed on the substrate 11. The board | substrate 11 contains a printed circuit board. The substrate 11 may have a circular or polygonal shape.

The lower mold 120 is disposed to face each other with the upper mold 110. Lower mold 120 is clamped with upper mold 110 to form a vacuum region. The lower mold 124 is formed with a cavity 129 to mold the electronic component. The cavity 129 is coated with a release film 20 to mold the electronic component 10 with a resin and then release the molded electronic component 10 from the cavity.

The lower mold 120 includes a lower die 122 and a cavity member 123. Here, the lower die 122 and the cavity member 123 may be disposed on the lower panel 121 supporting the lower die 122 and the cavity member 123.

The lower die 122 is disposed opposite the upper die 110. The upper surface of the lower die 122 corresponds to the bottom of the cavity 129 for molding the electronic component 10 fixed to the upper die 110. The lower die 122 may have a plate shape, for example.

In one embodiment of the invention, the lower die 122 is in communication with the cavity 129 and a vacuum suction port (not shown) for vacuum suction the release film 20 on the bottom and side of the cavity 129 is formed do.

The cavity member 123 is disposed to surround the lower die 122. In addition, the cavity member 123 may be disposed on the lower panel 121. The cavity member 123 may have a cylindrical shape having a hollow capable of receiving the lower die 122. The inner wall of the cavity member 123 corresponds to the inner surface of the cavity 129. As a result, the upper surface of the lower die 122 forms the bottom surface of the cavity 129 and the inner surface of the cavity member 123 forms the inner surface of the cavity 129.

The distance from the bottom of the lower die 122 to the measured end of the cavity member 123 is defined as the height of the cavity member 123. The height of the cavity member 123 may be adjusted. For example, as shown in FIG. 1, when the cavity member 123 rises, the height of the cavity member 123 corresponds to the first height h1. Alternatively, as shown in FIG. 2, when the cavity member 123 descends, the height of the cavity member 123 may have a second height h2. Here, the first height h1 is smaller than the second height h2. Therefore, the height of the cavity member 123 may be adjusted from the upper surface of the lower die 122 according to the amount of resin for molding the electronic component 10. Therefore, there is no need to replace the lower mold 120 including the cavity member 123 when there is a change in the amount of resin required.

In one embodiment of the present invention, the cavity member 123 may have a tapered shape such that the height thereof becomes smaller toward the outside. The cavity member 123 having a tapered shape increases the contact surface with the release film 20 so that the release film 20 may be firmly fixed to the cavity member 123.

The upper mold 110 is disposed to face the lower mold 120. The electronic component 10 is fixed to the upper mold 110. Upper mold 110 defines a vacuum region with lower mold 120. That is, the inside of the vacuum region formed by closing the upper mold 110 and the lower mold 120 may be evacuated. In addition, the upper die 110 is formed with a cavity 129 formed by the lower die 122 and the cavity member 123. The molding space is filled with a resin so that the electronic component is molded with the resin.

When the upper die 110 is closed with the lower die 120, which will be described later, the upper die 113 forms a molding space together with the lower die 122 and the cavity member 123. In the molding space, the electronic component 10 is molded with a resin therein.

Meanwhile, the electronic component 10 is fixed to the upper mold 110. The upper mold 113 includes an adsorption member (not shown) that adsorbs the substrate 11 of the electronic component 10. The said adsorption member adsorb | sucks the board | substrate 11, for example through vacuum adsorption.

The clamping member 130 is disposed between the upper mold 110 and the lower mold 120. The clamping member 130 clamps the release film 20. That is, the clamping member 130 is lowered to clamp the release film 20 through the release film 20 between the lower molds 120.

In one embodiment of the present invention, the clamping member 130 may have a hollow plate shape, for example. In this case, the hollow position may correspond to the position of the cavity 127. At this time, the clamping member 130 clamps the release film 20 through the release film 20 between the lower mold 120. In addition, the clamping member 130 may be interposed between the upper mold 110 and the lower mold 120 to clamp the release film 20.

In another embodiment of the present invention, the clamping member 130 may be disposed adjacent to the cavity member 123 and may independently clamp the release film 20. For example, the clamping member 130 may clamp the release film 20 like a gripper.

The height adjusting unit 140 may raise and lower the cavity member 123 to adjust the height of the cavity member 123 measured from the upper surface of the lower die 122. For example, when the height adjusting part 140 raises the cavity member 123, the height of the cavity member 123 measured from the upper surface of the lower die 122 increases. On the contrary, when the height adjusting unit 140 lowers the cavity member 123, the height of the cavity member 123 measured from the upper surface of the lower die 122 is reduced.

In one embodiment of the present invention, the height adjuster 141 includes a storage tank 141, a flow line 143, and a drive cylinder 145.

Storage tank 141 stores the fluid. Examples of the fluid include a gas such as oxygen gas, nitrogen gas, a mixture thereof, or a liquid such as water.

The driving cylinder 145 is connected to the cavity member 123 to elevate the cavity member 123. The drive cylinder 145 includes a hollow body capable of accommodating a fluid, and a drive shaft interconnecting the drive cylinder 145 and the cavity member 123 according to the amount of fluid contained in the hollow.

Flow line 143 interconnects storage tank 141 and drive cylinder 145. Flow line 143 allows fluid to flow between storage tank 141 and drive cylinder 145.

As shown in FIG. 1, when the fluid stored in the storage tank 141 flows into the driving cylinder 145 through the flow line 143, the driving shaft is raised by the pressure of the introduced fluid. When the driving shaft is raised, the cavity member 123 connected with the driving shaft is raised. The height of the side wall of the cavity is increased by the raised cavity member 123. As a result, when the amount of resin required is relatively large, the volume of the molding region containing the resin increases.

 Alternatively, as shown in FIG. 2, when the fluid introduced into the drive cylinder 145 is recovered to the storage tank 141 through the flow line 143, the pressure of the fluid introduced into the drive cylinder decreases. The drive shaft is lowered. When the driving shaft is lowered, the cavity member 123 connected with the driving shaft is lowered. The height of the side wall of the cavity is reduced by the lowered cavity member 123. As a result, when the required amount of resin is small, the volume of the molding region containing the resin is reduced.

In one embodiment of the present invention, the lower mold 120 includes an elastic member 131 and the lower seal 125.

The elastic member 131 is disposed on the lower panel 121. In addition, the elastic member 131 is disposed to surround the cavity member 123. In addition, the elastic member 131 is disposed spaced apart from the cavity member 123. The elastic member 131 clamps the release film 20 through the release film 20 together with the clamping member 130.

The lower seal 125 is disposed on the periphery of the lower panel 121. The lower seal 125 contacts the upper seal 115 included in the upper mold 110 to form a vacuum area. In addition, the lower seal 125 is disposed to surround the lower die 122. The lower seal 125 is disposed to face the upper seal 151. Accordingly, when the upper mold 110 and the lower mold 120 are close to each other, the upper and lower seals 115 and 125 contact each other. As a result, the upper die 110, the lower die 120 and the upper and lower seals 115 and 125 form the vacuum region.

In one embodiment of the present invention, the upper die 110 includes an upper panel 111, an upper die 113, and an upper seal 115.

The upper panel 111 corresponds to the lower panel 121 described above. The upper panel 111 supports the upper die 113 and the upper seal 115.

The upper die 113 is disposed to face the lower die 120. Electronic components are fixed to the upper die 113. The upper die 113 may have a plate shape, for example.

The upper seal 115 is disposed on the periphery of the upper panel 111. The upper seal 115 contacts the lower seal 125 included in the lower mold 120 to form a vacuum area. In addition, the upper seal 115 is arranged to surround the upper die 113. The lower seal 125 is disposed to face the upper seal 151. Accordingly, when the upper mold 110 and the lower mold 120 are close to each other, the upper and lower seals 115 and 125 contact each other. As a result, the upper die 110, the lower die 120 and the upper and lower seals 115 and 125 form the vacuum region.

In an embodiment of the present invention, the upper mold 110 may further include a first sealing member 155 disposed at an end of the upper seal 115 and sealing the vacuum region. In addition, the lower mold 120 may further include a second sealing member 127 disposed at an end of the lower seal 115 and sealing the vacuum area. When the upper mold 110 and the lower mold 120 come close to each other so that the upper and lower seals 115 and 125 contact each other, the first sealing member 117 and the second sealing member 127 seal the vacuum region. Let's do it.

Electronic component molding apparatus 100 according to an embodiment of the present invention further includes a supply unit 150 for providing a release film (20).

The supply unit 150 is disposed adjacent to the cavity. The supply unit 150 supplies the release film 20 between the upper mold 110 and the lower mold 120. The supply unit 150 supplies the release film 20 to mold the electronic component 10 to the resin in the cavity of the lower mold 120, and then to the release film 20 to which the electronic component 10 molded in the cavity is attached. It can be easily released from this cavity.

 The supply unit 150 may include a supply roller 151 for supplying the release film 20 to the cavity and a winding roller 153 for collecting the release film 20 from the cavity. The release film 20 moves from the feed roller 151 to the take-up roller 153 as shown in FIG. 1. On the other hand, the supply roller 151 and the take-up roller 153 may apply tension to or relax the release film 20 supplied in the cavity.

3 to 5 are cross-sectional views illustrating a molding process of the electronic component molding apparatus illustrated in FIG. 1.

1 and 2, the release film 20 is positioned between the upper mold 110 and the lower mold 120 while the upper mold 110 and the lower mold 120 are spaced apart from each other. In this case, the upper mold 110 may hold the substrate 11 on which the electronic component 10 is mounted. The release film 20 may be supplied through, for example, a supply roller (not shown) and a winding roller (not shown) disposed to face each other on one side of the lower mold 120.

At this time, when the fluid stored in the storage tank 141 is introduced into the drive cylinder 145 through the flow line 143, the drive shaft is raised by the pressure of the introduced fluid. When the driving shaft is raised, the cavity member 123 connected with the driving shaft is raised. The height of the side wall of the cavity is increased by the raised cavity member 123. As a result, when the required amount of resin is relatively large, the volume of the molding region containing the resin increases. Alternatively, as shown in FIG. 2, when the fluid introduced into the drive cylinder 145 is recovered to the storage tank 141 through the flow line 143, the pressure of the fluid introduced into the drive cylinder decreases. The cavity member 123 descends. The height of the side wall of the cavity is reduced by the lowered cavity member 123. As a result, when the required amount of resin is small, the volume of the molding region containing the resin is reduced.

Referring to FIG. 3, the clamping member 130 is lowered to clamp the release film 20 using the clamping member 130 and the elastic member 131.

For example, the clamping member 130 descends toward the elastic member 131. Therefore, the release film 20 is interposed between the clamping member 130 and the elastic member 131. The clamping member 130 is further lowered to clamp the release film 20 using the elastic force of the elastic member 131. In addition, the release film 20 is disposed in surface contact with the tapered portion of the cavity member 123. Accordingly, the clamping member 130, the elastic member 131, and the tapered cavity member 123 firmly clamp the release film 20.

Referring to FIG. 4, the release film 20 covers the bottom surface of the cavity through a vacuum suction hole (not shown) formed in the lower die 121.

Referring to FIG. 5, the release film 20 is adsorbed on the bottom surface of the cavity 127, and then the resin 30 is supplied to the cavity. In one embodiment of the present invention, the liquid resin may be directly supplied into the cavity. Alternatively, the powdered resin may be supplied into the cavity and then melted into the liquid resin by melting the powdered resin. In this case, the upper mold 110 and the lower mold 120 may be maintained at a constant temperature to maintain the molten state of the resin.

Subsequently, the lower mold 120 is raised toward the upper mold 110 to completely seal the vacuum region using the upper and lower mills 115 and 125. Subsequently, the vacuum region is evacuated through a vacuum exhaust port (not shown) formed in the upper mold 110. Then, the electronic component fixed to the upper mold 110 is precipitated in the cavity containing the molten resin. Thereafter, after a predetermined time, the liquid resin is cured to form the electronic component 10 using the cured resin. For example, the electronic component 13 mounted on one surface of the substrate 11 may be molded of a cured resin. Alternatively, a plurality of electronic components mounted on both surfaces of the substrate 11 may be molded of a cured resin. Subsequently, air is introduced into the cavity through the vacuum suction port formed in the lower mold 120 to release the release film 20 from the cavity. Therefore, the molded electronic component 10 may be separated from the lower mold 120.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

According to such an electronic component molding apparatus and an electronic component molding method, it is possible to suppress release of the release film from the cavity during the molding process by holding the release film with the holding unit. In addition, the mold structure can be simplified by fixing the release film with a holding unit instead of the intermediate mold.

On the other hand, by omitting the intermediate type, the driving time required for driving the intermediate type can be saved, and the process efficiency of the overall molding process can be improved.

1 is a cross-sectional view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view for describing a method of adjusting a height of a cavity member of the electronic component molding apparatus of FIG. 1.

3 to 5 are cross-sectional views for describing a method of molding an electronic component by using the electronic component molding apparatus of FIG. 1.

Claims (6)

A lower die having a lower die forming a bottom of a cavity covered with a release film for molding an electronic component, and a cavity member surrounding the lower die and forming sidewalls of the cavity; An upper mold disposed to face the lower mold, wherein the electronic component is fixed and closed with the lower die and the cavity member to form a molding region for molding the electronic component; A clamping member disposed between the lower mold and the upper mold and clamping the release film together with the lower mold; And And elevating the cavity member to adjust a height of the cavity with respect to the upper surface of the lower die to adjust a volume of the molding region. According to claim 1, wherein the height adjustment unit A storage tank for storing the fluid; A driving cylinder connected to the cavity member to lift the cavity member; And And a fluid line interconnecting said storage tank and said cylinder and through which said fluid flows. The apparatus of claim 2, wherein the fluid is air or liquid. The method of claim 1, wherein the lower mold, Lower panel; An elastic member disposed on the lower panel to surround the cavity member and elastically clamp the release film together with the clamping member; And And a lower seal disposed on the periphery of the lower panel and defining a vacuum region formed with the upper die. According to claim 1, wherein the upper form; Upper panel; An upper die disposed on the upper panel, to which the electronic component is fixed; And And an upper seal disposed on the periphery of the upper panel and defining a vacuum region formed with the lower mold. 6. The electronic component molding apparatus according to claim 5, wherein the upper mold further comprises a first sealing member disposed at an end of the upper seal, and sealing the vacuum region.
KR1020080060639A 2008-06-26 2008-06-26 Apparatus for molding a electronic device KR101448490B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080060639A KR101448490B1 (en) 2008-06-26 2008-06-26 Apparatus for molding a electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080060639A KR101448490B1 (en) 2008-06-26 2008-06-26 Apparatus for molding a electronic device

Publications (2)

Publication Number Publication Date
KR20100000950A true KR20100000950A (en) 2010-01-06
KR101448490B1 KR101448490B1 (en) 2014-10-10

Family

ID=41811297

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080060639A KR101448490B1 (en) 2008-06-26 2008-06-26 Apparatus for molding a electronic device

Country Status (1)

Country Link
KR (1) KR101448490B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148850B1 (en) * 2010-01-28 2012-05-29 주식회사 휘닉스 디지탈테크 Apparatus for molding an electric device
KR200466082Y1 (en) * 2011-08-17 2013-04-03 삼성전자주식회사 Apparatus for molding semiconductor device
KR101416114B1 (en) * 2013-05-31 2014-07-09 주식회사 케이엔제이 Resin molding apparatus and method of the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252311A (en) * 1999-03-04 2000-09-14 Apic Yamada Corp Resin sealing apparatus
JP2000299334A (en) 1999-04-14 2000-10-24 Apic Yamada Corp Resin-sealing apparatus
JP4358501B2 (en) 2002-10-31 2009-11-04 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold
JP4676735B2 (en) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 Optical semiconductor device manufacturing method and optical semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148850B1 (en) * 2010-01-28 2012-05-29 주식회사 휘닉스 디지탈테크 Apparatus for molding an electric device
KR200466082Y1 (en) * 2011-08-17 2013-04-03 삼성전자주식회사 Apparatus for molding semiconductor device
KR101416114B1 (en) * 2013-05-31 2014-07-09 주식회사 케이엔제이 Resin molding apparatus and method of the same

Also Published As

Publication number Publication date
KR101448490B1 (en) 2014-10-10

Similar Documents

Publication Publication Date Title
KR100931295B1 (en) Electronic component molding device and electronic component molding method
KR102228644B1 (en) Resin-sealing device and resin-sealing method
JP2013123849A (en) Resin sealing device and resin sealing method
WO2017081881A1 (en) Resin-sealing device and resin-sealing method
KR20100000950A (en) Apparatus for molding a electronic device
JP2016101743A (en) Molded article manufacturing apparatus, and molded article manufacturing method
KR101000776B1 (en) Apparatus for molding a electronic device
JP2010287635A (en) Reflow device
KR20100000962A (en) Apparatus for molding a electronic device
JP2012045839A (en) Cooling device of resin sealed substrate, cooling method, feed device, and resin sealing device
KR20100126910A (en) Method of molding an electric device and apparatus for molding an electric device
KR101087625B1 (en) Apparatus for molding a electronic device
JP5474212B2 (en) Sealing material forming apparatus and method
KR101209527B1 (en) Molding block and apparatus for molding an electric device and method of molding an electrical device
KR101148850B1 (en) Apparatus for molding an electric device
TWI718447B (en) Molding mold, resin molding device, and manufacturing method of resin molded product
KR20090081500A (en) Apparatus for molding a electronic device and method of molding a electronic device
KR20090075942A (en) Nozzle for injecting melted solder into cavities of template and apparatus having the same
KR101015585B1 (en) Apparatus for molding a electronic device
JP7394798B2 (en) Conveyance mechanism, resin molding device, and method for manufacturing resin molded products
KR20130006380U (en) Apparatus for molding semiconductor devices
KR20180005112A (en) Substrate processing apparatus, substrate processing method and recording medium
KR102361912B1 (en) Resin molding device and method of manufacturing resin molded product
JP4587881B2 (en) Resin sealing device
KR20090066452A (en) Method of injecting melted solder including ferromagnetic material into cavities of template and apparatus for performing the same

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20181001

Year of fee payment: 5