KR200466082Y1 - Apparatus for molding semiconductor device - Google Patents

Abstract

In the apparatus for molding a semiconductor device, the device includes an upper mold and a lower mold and molds the semiconductor device by using a cavity formed between the upper mold and the lower mold. The upper mold has a rectangular frame shape and an upper chase block providing side surfaces of the cavity, an upper cavity block arranged to be movable vertically within the chase block and providing an upper surface of the cavity; And a height adjusting part connected to the upper cavity block and adjusting the height of the upper cavity block. Therefore, the trouble of disassembling and reassembling the upper mold can be eliminated according to the desired molding thickness, and the operation rate of the molding apparatus can be greatly improved.

Description

Apparatus for molding semiconductor devices

Embodiments of the present invention relate to an apparatus for molding a semiconductor device. More specifically, the present invention relates to an apparatus for molding a semiconductor element mounted on a substrate using molten or liquid resin.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor devices formed as described above may be individualized by a dicing process, and the individualized semiconductor devices may be bonded through a die bonding process on a substrate such as a printed circuit board.

The semiconductor device mounted on the substrate as described above may be manufactured into a semiconductor package through a molding process. In this case, the molding process may be performed using a mold having a cavity supplied with molten resin or liquid resin. For example, the apparatus for performing the molding process may include an upper mold and a lower mold, and a cavity for molding the semiconductor device may be formed between the upper mold and the lower mold.

Specifically, after the substrate on which the semiconductor element is mounted is loaded onto the lower mold, the lower mold and the upper mold are coupled to thereby form the cavity on the upper portion of the substrate. Subsequently, molten or liquid resin may be supplied into the cavity, and the semiconductor element on the substrate may be molded by curing the resin supplied into the cavity.

Meanwhile, as the types of semiconductor devices have recently diversified, the thickness of the molding on the substrate, that is, the thickness of the package, needs to be variously adjusted. For this purpose, the upper mold needs to be replaced. However, when the upper mold is replaced as necessary as described above, a considerable time is required, and thus the operation rate of the molding apparatus may be greatly reduced, and the manufacturing cost of the semiconductor device may be greatly increased.

Embodiments of the present invention provide a semiconductor device molding apparatus that can easily adjust the molding thickness of the semiconductor device in order to solve the above problems.

According to embodiments of the present invention, an apparatus for molding a semiconductor device by using a cavity formed between the upper mold and the lower mold, the upper mold and the lower mold, wherein the upper mold, An upper chase block having a frame shape and providing side surfaces of the cavity, an upper cavity block disposed vertically movable within the chase block to provide an upper surface of the cavity, and the upper cavity block It may be connected to and may include a height adjuster for adjusting the height of the upper cavity block.

According to embodiments of the present invention, the upper press may be further provided with the upper chase block is mounted, the height adjustment portion may be mounted to the upper press.

According to embodiments of the present invention, the height adjusting portion, the screw member mounted to the upper press on the upper cavity block to have a predetermined inclination angle, and moves along the screw member by the rotation of the screw member A nut member coupled to the screw member and a slide member mounted to be movable in a horizontal direction on the upper surface of the upper cavity block and connected to the nut member may be included.

According to embodiments of the present invention, a guide member for guiding a horizontal movement of the slide member may be installed on the upper surface of the cavity block.

According to the embodiments of the present invention, the height adjusting portion may be mounted in the horizontal direction on the upper press in the upper portion of the cavity block and may further include a shim plate for limiting the height of the cavity block.

According to embodiments of the present invention, the shim plate may be selected from among a plurality of shim plates that are interchangeably mounted to the upper press and have different thicknesses to adjust the height of the cavity block.

According to embodiments of the present invention, the shim plate may be formed with a slit through which the slide member passes.

According to embodiments of the present invention, a flow path for supplying a resin for molding the semiconductor device into the cavity may be formed in the upper chase block.

According to embodiments of the present invention, the lower mold may include a lower cavity block supporting a substrate on which the semiconductor device is mounted, and a lower chase block disposed to surround the lower cavity block.

According to embodiments of the present invention, the lower surface of the upper chase block may be in close contact with the edge portion of the substrate supported by the lower cavity block and the upper surface of the lower chase block for molding the semiconductor device. .

According to the embodiments of the present invention as described above, when the size of the semiconductor devices mounted on the substrate is changed, it is possible to easily change the molding thickness on the substrate by adjusting the height of the upper cavity block. That is, since the process of disassembling and reassembling the upper mold may be omitted as in the prior art, the operation rate of the semiconductor device molding apparatus may be greatly improved, and as a result, the manufacturing cost of the semiconductor devices may be greatly reduced.

In addition, since the number of shim plates having different thicknesses can be selected and used as necessary, the height of the upper cavity block can be adjusted very accurately.

1 and 2 are schematic cross-sectional views illustrating a semiconductor device molding apparatus according to an embodiment of the present invention.
3 is a schematic cross-sectional view illustrating a state in which the height of the upper cavity block shown in FIG. 1 is adjusted to be low.
4 is a schematic cross-sectional view taken along the line IV-IV shown in FIG. 2.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the present invention to those skilled in the art, rather than to allow the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used below is for the purpose of describing particular embodiments only and is not intended to limit the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by one of ordinary skill in the art to which this invention belongs, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed as having a meaning consistent with their meaning in the context of the description of the relevant art and the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not intended to be limited to the particular shapes of the areas described as illustrations, but include deviations in the shapes, and the areas described in the figures are entirely schematic and their shapes. Are not intended to describe the precise shape of the region nor are they intended to limit the scope of the present invention.

1 and 2 are schematic cross-sectional views illustrating a semiconductor device molding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the semiconductor device molding apparatus 100 according to an exemplary embodiment of the present invention may mold the semiconductor device 10 mounted on the substrate 20 using molten or liquid resin (not shown). Can be used. In particular, the semiconductor device molding apparatus 100 is configured to easily change the molding thickness on the substrate 20, that is, the thickness of the semiconductor package according to the type of the semiconductor device 10 mounted on the substrate 20. Can be.

The semiconductor device molding apparatus 10 may include an upper mold 200 and a lower mold 300. Although not shown, the upper mold 200 and the lower mold 300 may be coupled to each other in a vertical direction by a driving unit (not shown) as shown in FIG. 2, whereby the upper mold 200 and A cavity 202 may be formed between the lower molds 300 to mold the semiconductor device 10. That is, the semiconductor device 10 may be located in the cavity 202, and the semiconductor device 10 may be molded by supplying molten or liquid resin into the cavity 202.

The upper mold 200 has a rectangular frame shape and is disposed to be movable in a vertical direction in the upper chase block 210, which provides side surfaces of the cavity 202, and in the upper chase block 210. It may include an upper cavity block 220 that provides an upper surface of the cavity 202.

The upper chase block 210 may be mounted below the upper press 230. In addition, the upper mold 200 is a height adjusting unit 240 for adjusting the height of the cavity 202, that is, the height of the upper cavity block 220 in order to adjust the molding thickness of the semiconductor device 10. It may include. The height adjusting part 240 may be mounted to the upper press 230 and may be connected to the upper cavity block 220.

The height adjusting part 240 may adjust the height of the upper cavity block 220 by using nut members 244 that are movably disposed along the screw member 242 having a predetermined inclination angle. Specifically, the screw member 242 may be mounted to the upper press 230 to have a predetermined inclination angle at the upper portion of the upper cavity block 220 as shown. In this case, the screw member 242 may be mounted to the upper press 230 to be rotatable. Although it is shown that the screw member 242 is mounted to the upper press 230 through only bearings, the mounting method of the screw member 242 may be made in various ways.

The nut members 244 may be coupled to the screw member 242 to move along the screw member 242 by the rotation of the screw member 242. In this case, a slide member 246 mounted on the upper surface of the upper cavity block 220 to be movable in a horizontal direction may be provided, and the nut members 244 may be connected to the slide member 246. have. That is, the nut members 244 may be moved upwards or downwards at a predetermined inclination angle by clockwise or counterclockwise rotation of the screw member 242, whereby the slide member 246 is moved to the upper cage. The upper cavity member 220 may be moved in a horizontal direction on the top surface of the butt block 220, and the upper cavity member 220 may be moved in a vertical direction.

FIG. 3 is a schematic cross-sectional view showing a state in which the height of the upper cavity block shown in FIG. 1 is adjusted low, and FIG. 4 is a schematic cross-sectional view cut along the line IV-IV shown in FIG. 2.

As described above, when the nut members 244 move downward by the rotation of the screw member 242, the upper cavity block 220 may move downward, as shown in FIG. 3. The molding thickness of the semiconductor device 10 can be adjusted by this. As a result, as shown in FIGS. 1 and 3, when the sizes of the semiconductor devices 10 are changed, molding thicknesses of the semiconductor devices 10 may be adjusted by appropriately adjusting the height of the upper cavity block 220. Can be adjusted.

On the other hand, as shown in Figure 4, the upper surface of the upper cavity block 220 may be provided with a guide member 248 for guiding the horizontal movement of the slide member 246. As shown, although a pair of guide 248 members having a cross section of the letter "L" is installed on the upper cavity block 220, the structure of the guide member 248 is variously changed. Can be. For example, a Linear Motion (LM) guide may be used in place of the guide member 248.

In addition, the height adjusting unit 240 is mounted in the horizontal direction on the upper press 230 in the upper portion of the upper cavity block 220 and the shim plate 250 for limiting the height of the cavity block 220. ) May be included. In particular, the shim plate 250 may be used to limit the rising height of the upper cavity block 220.

According to one embodiment of the present invention, the shim plate 250 may be mounted to the upper press 230 to be replaceable. That is, in order to precisely adjust the required molding thickness, one shim plate 250 selected from a plurality of shim plates having different thicknesses may be mounted on the upper cavity block 220 so that the upper cavity block ( 220 can be used as a stopper for limiting the rising height. For example, a relatively thin thickness of the shim plate 250 may be used when the molding thickness is relatively thick as shown in FIG. 1, and when the molding thickness is relatively thin as shown in FIG. 3. As a result, a thick shim plate 250 may be used.

In addition, the shim plate 250 may have a slit 252 through which the slide member 246 passes. For example, as illustrated in FIG. 4, the slide member 246 may have a cross-section of the letter “T”, and the shim plate 250 may move the slide member 246 in a horizontal direction. A straight slit 252 may be formed at the center portion thereof.

On the other hand, according to an embodiment of the present invention, the upper chase block 210 flow channel 204 for supplying a molten or liquid resin for molding the semiconductor elements 10 into the cavity 202 Can be formed. In particular, although not shown, as an example, the flow path 204 may be used to supply the resin supplied by the plunger (not shown) mounted to the lower mold 300 into the cavity 202.

The lower mold 300 may include a lower cavity block 310 supporting the substrate 20 on which the semiconductor devices 10 are mounted, and a lower chase block disposed to surround the lower cavity block 310. 320). In addition, the lower chase block 320 may be disposed on the lower press 330. In particular, as illustrated, the substrate 20 may be disposed on the lower cavity block 310, wherein the upper surface of the substrate 20 and the upper surface of the substrate 20 located on the lower cavity block 310 are formed. The height of the lower cavity block 310 may be adjusted such that the upper surface of the lower chase block 320 is located on the same plane. That is, the lower mold 300 may be configured to adjust the height of the lower cavity block 310 according to the thickness of the substrate 10.

In addition, when the upper mold 200 and the lower mold 300 are combined to mold the semiconductor devices 10, the lower surface of the upper chase block 210 may be formed on the substrate as illustrated in FIG. 2. The edge of 20 may be in close contact with the upper surface of the lower chase block 320.

According to the embodiments of the present invention as described above, when the size of the semiconductor devices 10 mounted on the substrate 20 is changed by adjusting the height of the upper cavity block 220 on the substrate 20 Molding thickness can be easily changed. That is, since the process of disassembling and reassembling the upper mold may be omitted as in the related art, the operation rate of the molding apparatus 100 may be greatly improved, and as a result, the manufacturing cost of the semiconductor devices 10 may be greatly increased. Can be saved.

In addition, since one of the plurality of shim plates 250 having different thicknesses may be selected and used as necessary, the height of the upper cavity block 220 may be adjusted very accurately.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as set forth in the following claims And changes may be made without departing from the spirit and scope of the invention.

10 semiconductor device 20 substrate
100 molding device 200 upper mold
202: Cavity 204: Euro
210: upper chase block 220: upper cavity block
230: upper press 240: height adjustment unit
242: screw member 244: nut member
246: slide member 248: guide member
250: shim plate 252: slit
300: lower mold 310: lower cavity block
320: lower chase block 330: lower press

Claims (10)

An apparatus for molding a semiconductor device using a cavity formed between the upper mold and the lower mold, the upper mold and the lower mold,
The upper mold includes:
An upper chase block having a rectangular frame shape and providing side surfaces of the cavity;
An upper cavity block disposed in the chase block to be movable in a vertical direction and providing an upper surface of the cavity; And
It is connected to the upper cavity block and includes a height adjusting unit for adjusting the height of the upper cavity block,
The lower mold,
A lower cavity block supporting a substrate on which the semiconductor device is mounted; And
And a lower chase block disposed to surround the lower cavity block. The apparatus of claim 1, further comprising an upper press on which the upper chase block is mounted, wherein the height adjusting unit is mounted on the upper press. The method of claim 2, wherein the height adjustment unit,
A screw member mounted to the upper press at an upper portion of the upper cavity block to have a predetermined inclination angle:
A nut member coupled to the screw member so as to be movable along the screw member by the rotation of the screw member; And
And a slide member mounted on the upper surface of the upper cavity block to be movable in a horizontal direction and connected to the nut member. 4. The apparatus of claim 3, wherein a guide member for guiding a horizontal movement of the slide member is provided on an upper surface of the cavity block. 4. The semiconductor device of claim 3, wherein the height adjusting part further includes a shim plate mounted horizontally to the upper press at the upper portion of the cavity block and configured to limit a height of the cavity block. Device for The semiconductor device of claim 5, wherein the shim plate is mounted to the upper press so as to be interchangeable and is selected from a plurality of shim plates having different thicknesses to adjust the height of the cavity block. Device for 6. The apparatus of claim 5, wherein the shim plate is formed with slits through which the slide member passes. The apparatus of claim 1, wherein a flow path for supplying a resin for molding the semiconductor device is formed in the upper chase block. delete The semiconductor of claim 1, wherein a lower surface of the upper chase block is in close contact with an edge portion of a substrate supported by the lower cavity block and an upper surface of the lower chase block to mold the semiconductor device. Apparatus for molding the device.

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