CN103764363A - Compression molding method and device for light-emitting device reflector - Google Patents
Compression molding method and device for light-emitting device reflector Download PDFInfo
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- CN103764363A CN103764363A CN201280041513.6A CN201280041513A CN103764363A CN 103764363 A CN103764363 A CN 103764363A CN 201280041513 A CN201280041513 A CN 201280041513A CN 103764363 A CN103764363 A CN 103764363A
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- 238000000748 compression moulding Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000000465 moulding Methods 0.000 claims abstract description 90
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 239000011347 resin Substances 0.000 claims abstract description 72
- 230000009471 action Effects 0.000 claims description 26
- 238000010521 absorption reaction Methods 0.000 claims description 14
- 238000007667 floating Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229910052747 lanthanoid Inorganic materials 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 3
- -1 alkaline-earth metal phosphorus Halides Chemical class 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Provided are a compression molding method and device for light-emitting device reflectors for which mold resin utilization rate is improved and molding quality is improved such that resin flash does not occur. A reflector (3) is compression molded by: supplying molding resin (26) into recessed cavities (16), in which a release film (21) is held by adsorption, and filling the resin around pressing pins (17); aligning a workpiece with the recessed cavities (16) and placing the workpiece in contact with a clamper block (14) and the pressing pins (17) through the release film (21); clamping the workpiece using the mold (8); and moving the bottoms of the recessed cavities (16) relative to the workpiece to bring same closer to the workpiece by further clamping of the workpiece.
Description
Technical field
The present invention relates to compress moulding method and the device of the light-emitting devices such as a kind of such as LED reflecting element.
Background technology
Propose a kind of utilize transfer modling be shaped the surface-mount light-emitting devices such as LED reflecting element is carried out to resin moulded device.As the resin of reflecting element shaping use, the lower moulding resin (epoxy is thermosetting resin) of mobility that for example large particle size filler below use mixing particle diameter 70 μ m and the filler below particle diameter 1 μ m form.Therefore, air flue is easily inaccessible and produce not fill area, when expanding the width of air flue, easily produces resin leakage.In addition, the easy traps air due to the mobile change of the resin in die cavity.Therefore, in die cavity bottom, be provided with protuberance to reduce the flow velocity of resin or to have overlapped the different air flue (with reference to patent documentation 1) of the degree of depth.
Patent documentation 1: TOHKEMY 2011-121246 communique
But carrying out transfer modling while being shaped, playing with self filler chamber (Japanese: Port ッ ト) formed products (defective material portion, runner etc.) that resin stream till die cavity is suitable becomes unnecessary resin and go out of use, therefore, the utilization rate of moulding resin is lower.Especially, the resin of reflecting element shaping use expensive, be the more than 5 times of material price of the resin of use in package shape, thereby yield rate is low.
In addition, owing to likely producing resin burr at LED with chip carrying region, therefore, if by molding die strength holding workpiece (lead frame, resin substrate etc.) significantly, likely produce impression, thereby the quality that makes to be shaped reduces.
Summary of the invention
The present invention provides in order to solve the problem of above-mentioned conventional art and can improve the utilization rate of moulding resin and improve like that compress moulding method and the device of reflecting element for the light-emitting device of shaping quality such as not producing resin burr.
To achieve these goals, the present invention has following technical scheme.
The compress moulding method of reflecting element for a kind of light-emitting device, it utilizes molding die holding workpiece and reflecting element is carried out to compression molding, it is characterized in that, this compress moulding method is including following operation: by mould release membrance absorption be held in have die cavity recess a mould comprise the mould holding face this die cavity recess, clamped of the surrounding of this die cavity recess surrounds and is provided with in bottom pushpin that can lifting; To absorption, keeping the die cavity recess of above-mentioned mould release membrance to supply with sealing resin and be filled to pushpin around; By above-mentioned workpiece and the contraposition of above-mentioned die cavity recess and so that above-mentioned workpiece loads above-mentioned workpiece across above-mentioned mould release membrance with the mode that above-mentioned clamping element and pushpin connect; To another mold compresses, make above-mentioned clamping element and pushpin press on above-mentioned workpiece across above-mentioned mould release membrance above-mentioned workpiece, and utilize above-mentioned another mould and an above-mentioned workpiece of mould holding; By the further holding action of above-mentioned molding die, so that the bottom of above-mentioned die cavity recess makes the bottom of above-mentioned die cavity recess and above-mentioned workpiece relatively move and reflecting element is carried out to compression molding near the mode of above-mentioned workpiece.
If adopt above-mentioned compress moulding method, expensive reflecting element is shaped few with the discarded unnecessary resin in resin, therefore can improve the utilization rate of moulding resin, in addition, owing to carrying out compression molding in the increase that relatively moves to discharge the chucking power to workpiece producing because of pushpin with respect to the bottom of die cavity recess in utilization, therefore, on the workpiece after shaping, can not remain impression.In addition, compared with carrying out the situation of transfer modling shaping, in compression molding, there is no forming shaped product runner and cast gate, therefore, do not need cast gate to remove operation and can simplify manufacturing process, can not produce in addition cast gate and remove that the cast gate causing is residual, the distortion of workpiece.
In addition, preferably, in above-mentioned compression molding operation, so that the bottom of above-mentioned die cavity recess while relatively moving near the mode of above-mentioned workpiece, so that the mode that residual resin overflows to overflow die cavity from above-mentioned die cavity recess is carried out compression molding.
Adopt above-mentioned operation, can eliminate moulding resin and not be filled to the situation in die cavity recess, even if sneaked into air in moulding resin, also can this Bas Discharged be improved to shaping quality via overflow die cavity.
In addition, also can be, when utilizing molding die to clamp above-mentioned workpiece, drive drive source and above-mentioned pushpin is pressed on to above-mentioned workpiece, by further holding action, drive above-mentioned drive source and above-mentioned pushpin is kept out of the way keeping being connected under the state of above-mentioned workpiece.
Can adjust, make pushpin can not need above chucking power to above-mentioned workpiece effect, and can eliminate at light-emitting component lift-launch region generation tree fat burr.
In addition, also can be that, when utilizing molding die to clamp above-mentioned workpiece, above-mentioned pushpin presses on workpiece together with above-mentioned clamping element, by further holding action, above-mentioned pushpin is kept out of the way keeping being connected to together with above-mentioned clamping element under the state of workpiece.
Can utilize simple structure to make the lifting action interlock of clamping element and pushpin, and not need special drive source etc., therefore, can simplification device structure.
In addition, also can be, above-mentioned compress moulding method comprises following operation: to absorption, keeping the die cavity recess of the counterdie of above-mentioned mould release membrance to supply with sealing resin, lead frame is carried out to contraposition and so that the mode that lead frame connects across above-mentioned mould release membrance and above-mentioned clamping element and pushpin loads above-mentioned lead frame.
Adopt above-mentioned operation, be easy to supply with sealing resin, the lead frame as workpiece to counterdie, can simplify the mold structure including patrix.
The compression molding apparatus of reflecting element for a kind of light-emitting device, it carries out compression molding for utilizing molding die holding workpiece to reflecting element, it is characterized in that, above-mentioned molding die comprises: a mould, it has die cavity recess, and clamped of the surrounding of this die cavity recess surrounds and be provided with in bottom pushpin that can lifting; Another mould, its for together with above-mentioned clamping element to clamping with the workpiece after loading with the mode of above-mentioned die cavity recess contraposition; Mould release membrance, its absorption is held in a mould holding face including above-mentioned die cavity recess; And pushpin lifting unit, when utilizing above-mentioned molding die to clamp above-mentioned workpiece, make above-mentioned clamping element and pushpin press on above-mentioned workpiece across above-mentioned mould release membrance, by the further holding action of above-mentioned molding die, this pushpin lifting unit is relatively kept out of the way above-mentioned pushpin under the state that keeps being connected to above-mentioned workpiece with respect to the bottom of above-mentioned die cavity recess.
If adopt above-mentioned compression molding apparatus, expensive reflecting element is shaped few with the discarded unnecessary resin in resin, therefore can improve the utilization rate of moulding resin, in addition, owing to carrying out compression molding in the increase that relatively moves to discharge the chucking power to workpiece producing because of pushpin with respect to the bottom of die cavity recess in utilization, therefore, on the workpiece after shaping, can not remain impression.In addition, compared with carrying out the situation of transfer modling shaping, compression molding does not need runner and cast gate, therefore, can not adhere to moulding resin on the workpiece after shaping.Therefore, also can not produce that the cast gate causing is residual, the distortion of workpiece because cast gate is removed.
In addition, preferably on above-mentioned another mould, be provided with the overflow die cavity being connected with above-mentioned die cavity recess.Adopt said structure, can eliminate moulding resin and not be filled to the situation in die cavity recess, even if sneaked into air in moulding resin, also can this Bas Discharged be improved to shaping quality via overflow die cavity.
In addition, also can be, above-mentioned pushpin is supported on by the drive source mobile circular cone that slides, when utilizing molding die to clamp above-mentioned workpiece, drive above-mentioned drive source and above-mentioned circular cone is slided to prescribed direction, and above-mentioned pushpin is pressed on to above-mentioned workpiece, by further holding action, drive above-mentioned drive source and above-mentioned circular cone is slided round about, and above-mentioned pushpin is kept out of the way under the state that keeps being connected to above-mentioned workpiece.Thus, can adjust, make pushpin can not need above chucking power to above-mentioned workpiece effect, and can eliminate at light-emitting component lift-launch region generation tree fat burr.
In addition, also can be, above-mentioned pushpin and above-mentioned clamping element are integratedly by helical spring floating support, when utilizing molding die to clamp above-mentioned workpiece, above-mentioned pushpin presses on workpiece together with above-mentioned clamping element, by further holding action, to keep above-mentioned pushpin and above-mentioned clamping element to be connected under the state of above-mentioned workpiece above-mentioned helical spring compressed and above-mentioned pushpin is kept out of the way together with above-mentioned clamping element.
Adopt said structure, can utilize simple structure to make the lifting action interlock of clamping element and pushpin, and not need special drive source etc., therefore, can simplification device structure.
In addition, also can be, mould release membrance absorption is held in including the counterdie clamping face being formed at the die cavity recess of counterdie, by lead frame and the contraposition of above-mentioned die cavity recess also so that the mode that lead frame connects across above-mentioned mould release membrance and above-mentioned clamping element and pushpin loads above-mentioned lead frame.Adopt said structure, be easy to carry out Workpiece supply action to counterdie, and can simplify the mold structure including patrix.
In addition, state in the use in the formed products with reflecting element that compress moulding method or compression molding apparatus make, owing to there is no the distortion that is also difficult for occurring formed products of adhering to of unnecessary resin, therefore the quality that is shaped is higher, in subsequent handling, can simplify the manufacturing process relevant with the shaping of the laminating of light-emitting component, lens section and singualtion etc.
If adopt compress moulding method and the device of above-mentioned light-emitting device reflecting element, can provide and can improve the utilization rate of moulding resin and improve like that compress moulding method and the device of reflecting element for the light-emitting device of shaping quality such as not producing resin burr.
Accompanying drawing explanation
Fig. 1 be the 1st embodiment compression molding apparatus analyse and observe key diagram.
Fig. 2 be the 2nd embodiment compression molding apparatus analyse and observe key diagram.
Fig. 3 A～Fig. 3 E is the counterdie part key diagram of Fig. 2.
Fig. 4 A and Fig. 4 B are that the counterdie top view and the mould that represent the forming technology of compress moulding method are analysed and observe key diagram.
Fig. 5 A and Fig. 5 B are that the counterdie top view and the mould that represent the forming technology of the compress moulding method of following Fig. 4 A and Fig. 4 B are analysed and observe key diagram.
Fig. 6 A and Fig. 6 B are that the counterdie top view and the counterdie that represent the forming technology of the compress moulding method of following Fig. 5 A and Fig. 5 B are analysed and observe key diagram.
Fig. 7 A and Fig. 7 B are that the counterdie top view and the mould that represent the forming technology of the compress moulding method of following Fig. 6 A and Fig. 6 B are analysed and observe key diagram.
Fig. 8 A and Fig. 8 B are that the counterdie top view and the mould that represent the forming technology of the compress moulding method of following Fig. 7 A and Fig. 7 B are analysed and observe key diagram.
Fig. 9 A and Fig. 9 B are that the counterdie top view and the mould that represent the structure of the molding die of other examples are analysed and observe key diagram.
Figure 10 A and Figure 10 B are top view and the side views of lead frame.
Figure 11 A and Figure 11 B are top view and the side views of the lead frame after compression molding.
Figure 12 A～Figure 12 C is respectively cutaway view, top view and the right side view of LED matrix (light-emitting device).
The specific embodiment
Together with accompanying drawing, describe the light-emitting device of the present invention compress moulding method of reflecting element and the preferred embodiment of device in detail below.
The general configuration of light-emitting device (LED matrix) first, is described with reference to Figure 12 A～Figure 12 C.
Surface-mount light-emitting device comprises: light-emitting component 1; Leading part 2, it is for loading light-emitting component 1; Reflecting element 3, it is for the diffusion of the light irradiation that prevents self-emission device 1 and irradiate; And lens section 4, it is for covering luminous element 1.Reflecting element 3 is integrally formed with the 1st lead-in wire 2a for loading light-emitting component 1 and the 2nd lead-in wire 2b being electrically connected with light-emitting component 1.
Light-emitting component 1 has pair of positive and negative in the same face side.Below, the light-emitting component 1 in the same face side with pair of positive and negative is described, but also can uses the light-emitting component 1 at upper surface and lower surface with pair of positive and negative.In this case, the electrode of the lower surface of light-emitting component is not used electric wire but uses the laminating member with electrical conductivity to be electrically connected with the 1st lead-in wire 2a.
The 1st lead-in wire 2a has consecutive inner lead part and outer lead part.Light-emitting component 1 is positioned on inner lead part in the mode of laminating.In light-emitting component 1, use electric wire 5 respectively the inner lead part of the 1st lead-in wire 2a and the 2nd lead-in wire 2b to be coupled together with wire bonding.
In addition, in order not make the 1st lead-in wire 2a and the 2nd lead-in wire 2b short circuit, the part closely connecing of the 1st of side the lead-in wire 2a and the 2nd lead-in wire 2b(inner lead part overleaf) the part closely connecing be provided with insulating component 6.In addition, the lead-in wire of the light-emitting device of the present embodiment is two, but can be also more than 3.
Reflecting element 3 is erected to be formed on the outer lead part of the 1st lead-in wire 2a and the outer lead part of the 2nd lead-in wire 2b.Reflecting element 3 forms recess on outer lead part.Reflecting element 3 is that for example, compression molding by using thermosetting resin (, epoxy resin, modified epoxy, organic siliconresin and modified organic silicone resin etc.) forms as described later.The peristome of reflecting element 3 is provided with the wide such inclination of opening of the aperture efficiency bottom of upper end.Inclination angle is preferably 95 degree～150 degree take lead-in wire face as benchmark, more preferably 100 degree～120 degree.
Next, the compression molding apparatus of light-emitting device reflecting element is described.
Compression molding apparatus utilizes molding die holding workpiece W and reflecting element 3 is carried out to compression molding.As workpiece W, the lead frame 7 that uses the leading part 2 being formed by multiple lines and multiple rows to form as shown in Figure 10 A and Figure 10 B.Each leading part 2 is that relative mode forms so that the 1st lead-in wire 2a goes between 2b across space with the 2nd.As workpiece W, be not limited to lead frame 7, can be also the resin substrate that is formed with Wiring pattern.
With reference to Fig. 1, compression molding apparatus is described.
Molding die 8 has the mould of counterdie 9(that carrys out holding workpiece W by matched moulds) and another mould of patrix 10().Below, using counterdie 9 as But moving die, patrix 10 is described as fixed die.Use utilizes drive source (electro-motor etc.) to carry out the known mould switching mechanisms such as the toggle link, ball-screw of lifting to carry out mould on-off action.
In counterdie 9, in lower die base 11, be placed with counterdie rest pad 12.At counterdie rest pad 12 upper supports, there is counterdie mold cavity block 13.In addition, around counterdie mold cavity block 13, clamp 14 by helical spring 15 floating supports in counterdie rest pad 12.By the medial surface after the upper surface of counterdie mold cavity block 13 and the chamfer machining of clamp 14, form die cavity recess 16.
In above-mentioned die cavity recess 16 with run through the mode of counterdie rest pad 12 and counterdie mold cavity block 13 be provided with can lifting pushpin 17.Pushpin 17 is erect and is arranged at pin rest pad 18.Pushpin 17 is rounded shape when overlooking, but is not limited to this, can be also for example rectangular-shaped pin.In addition, near the top of pushpin 17, be provided with inclination angle.This inclination angle is relative with the inclination angle of peristome that is formed at reflecting element 3, and is provided with the narrow such inclination of opening of the aperture efficiency upper end side of upper end side.In addition, pin rest pad 18 is supported on circular cone 19 in its taper surface and the taper surface of circular cone 19 of being located at lower die base 11 mode against each other.Pin rest pad 18 and circular cone 19 are accommodated in the spatial portion forming between counterdie rest pad 12 and lower die base 11.Circular cone 19 can utilize the drive sources such as driver 20(motor, working cylinder) and slide in lower die base 11.Thus, make pin rest pad 18 relatively slide and make pushpin 17 liftings (pushpin lifting unit) along taper surface.
In addition, the counterdie clamping face including the outstanding die cavity recess 16 that is provided with pushpin 17 is covered by mould release membrance 21.Gap between counterdie mold cavity block 13 and the clamp 14 of this counterdie mold cavity block 13 of encirclement is adsorbed as aspiration path and is kept mould release membrance 21.Mould release membrance 21 has heat resistance and is easy to be peeled off from die face, and the preferred film with flexibility, extensibility, such as PTFE, ETFE, PET, fep film, the glass cloth that is impregnated with fluorine, polypropylene screen, the Vingon (polyvinylidene chloride) etc. of using.
In patrix 10, patrix latch segment (Japanese: チ ェ イ ス Block ロ ッ Network) 23 and patrix embedded block 24 support upper die base 22 overlappingly.The clamping face of patrix embedded block 24 is provided with air SS 24a.Air SS 24a for carrying out decompress from the interior suction air of die cavity recess 16 when molding die 8 clamps lead frame 7.In the present embodiment, utilize suction that lead frame 7 suctions are fixed on to patrix 10, but be not limited to suction, also can lead frame clamping element be set on patrix 10 and clamp lead frame 7.In addition, except lead frame 7 is arranged at patrix 10, also lead frame 7 can be arranged to counterdie 9.
To absorption, keeping the die cavity recess 16 of the counterdie 9 of mould release membrance 21 to supply with moulding resin, after having loaded lead frame 7, make counterdie 9 increase and with patrix 10 matched moulds, carry out thus compression molding.When utilizing molding die 8 to clamp lead frame 7, clamp 14 presses on lead frame 7, and the light-emitting component that pushpin 17 presses on lead frame 7 carries face (leading part 2).
In addition; by the further holding action of molding die 8; the pressing force of the clamp 14 increasing discharges because of the contraction of helical spring 15; and drive driver 20 and circular cone 19 is slided in lower die base 11; and pin rest pad 18 is declined, make thus pushpin 17 decline and discharge the pressing force of the pushpin 17 of increase.
If adopt above-mentioned compression molding apparatus, expensive reflecting element is shaped few with the discarded unnecessary resin in resin, therefore can improve the utilization rate of moulding resin, in addition, owing to carrying out compression molding in the chucking power that relatively moves to be released in the upper increase of workpiece (lead frame 7) of bottom of utilizing die cavity recess 16, therefore, on the lead frame 7 after shaping, can not remain impression.In addition, compared with carrying out the situation of transfer modling shaping, compression molding does not need runner and cast gate, therefore, can not adhere to moulding resin on the workpiece after shaping.Therefore, also can not produce that the cast gate causing is residual, the distortion of workpiece because cast gate is removed.
In addition, also can on the clamping face of the clamp of counterdie 9 14, be provided with the overflow die cavity 27(being connected with die cavity recess 16 with reference to Fig. 9 A and Fig. 9 B).Adopt this structure, can eliminate moulding resin and not be filled to the situation in die cavity recess 16, even if sneaked into air in moulding resin, also can this Bas Discharged be improved to shaping quality via overflow die cavity 27.
Pushpin 17 is supported on utilizes the driver 20 mobile circular cone 19 that slides, when utilizing molding die 8 holding workpiece, drive driver 20 and circular cone 19 is slided to prescribed direction, and pushpin 17 is pressed on to workpiece, by further holding action, drive driver 20 and circular cone 19 is slided round about, and pushpin 17 is remained under the state that is connected to workpiece, keep out of the way.Thus, can adjust, make pushpin 17 can not need above chucking power to workpiece effect, and can eliminate at the lift-launch region of light-emitting component 1 generation tree fat burr.
Next, other examples of compression molding apparatus are described with reference to Fig. 2.Because the structure of the patrix 10 in molding die 8 shares, therefore centered by the structure of counterdie 9, describe.
In Fig. 1, by the driving different from clamp 14, pushpin 17 is carried out to lifting.In the present embodiment, be pushpin 17 and clamp 14 structure of carrying out lifting that links.
In Fig. 2, in lower die base 11, mounting is fixed with counterdie rest pad 12.On counterdie rest pad 12, mounting is fixed with counterdie mold cavity block 13.Around counterdie mold cavity block 13, clamp 14 by helical spring 15 floating supports in counterdie rest pad 12.
As shown in Fig. 3 A～Fig. 3 C, in the bottom side hollow hole 14a of clamp 14, along each two places of X-Y direction, set up a pair of web 25.On the cross part of 4 crossing one another at this web 25, erect and be provided with pushpin 17.Web 25 is fixed on the bottom of clamp 14 in the mode of screw threads for fastening at two ends.In addition, pushpin 17 is fixed on web 25(with reference to Fig. 3 C in the mode of screw threads for fastening).
In addition, as shown in Fig. 3 D and Fig. 3 E, in the bottom of counterdie mold cavity block 13, be provided with the groove 13a(step groove of the thickness of slab of the web 25 for receiving cross-over configuration), 4 places on this groove 13a are provided with the through hole 13b running through for pushpin 17.
In Fig. 2, pushpin 17 with clamp 14 integratedly by helical spring 15 floating supports on counterdie rest pad 12.When utilizing molding die 8 holding workpieces (lead frame 7), pushpin 17 presses on lead frame 7 together with clamp 14 across mould release membrance 21, by further holding action, to keep clamp 14 and pushpin 17 to be connected under the state of lead frame 7 helical spring 15 compressed and pushpin 17 is kept out of the way together with clamp 14.
Adopt said structure, can utilize simple structure to make the lifting action interlock of clamp 14 and pushpin 17, and not need special drive source etc., therefore, can simplification device structure.
With reference to the light-emitting device of Fig. 4 A and Fig. 4 B～Figure 11 A and the above-mentioned compression molding apparatus of Figure 11 B explanation use, use the compress moulding method of reflecting element.In addition, in order to simplify, it is the figure of 4 that Fig. 1～Fig. 3 A～Fig. 3 E has been used pushpin, but in figure after Fig. 4 A and Fig. 4 B, the figure of the pushpin being listed as with 6 row 5 describes.
As shown in Figure 4 A, pushpin 17 runs through counterdie mold cavity block 13 and outstanding being arranged in die cavity recess 16.State at molding die 8 in die sinking, as shown in Figure 4 B, utilize mould release membrance 21 to cover the counterdie clamping face including this die cavity recess 16 of the counterdie 9 with die cavity recess 16 and mould release membrance 21 absorption are held in to this counterdie clamping face, clamped 14 of the surrounding of die cavity recess 16 surrounds and is provided with in bottom pushpin 17 that can lifting.
As shown in Figure 5A, around the through hole 13b running through at the pin 17 that is pressed of counterdie mold cavity block 13, be provided with air SS 13c.As shown in Figure 5 B, via the air SS 13d that is formed at the gap between air SS 13c and counterdie mold cavity block 13 and clamp 14, carry out air suction, thereby mould release membrance 21 is covered in to the surrounding of pushpin 17 and mould release membrance 21 absorption are held in die cavity recess 16.
Next, as shown in Figure 6 A and 6 B, to absorption, keeping the die cavity recess 16 of mould release membrance 21 to supply with moulding resin 26 and be filled to pushpin 17 around.As mentioned above, as moulding resin 26, use the thermosetting resin (such as epoxy resin, modified epoxy, organic siliconresin and modified organic silicone resin etc.) of the shaping use of reflecting element 3.As the form of moulding resin 26, can adopt the various forms such as fritter resin, particulate resin, powdex, aqueous resin and flaky resin.
Next, as shown in Fig. 7 A and Fig. 7 B, by die cavity recess 16 contrapositions of lead frame 7 and counterdie 9 and so that lead frame 7 loads lead frame 7 across mould release membrance 21 and the mode that clamp 14 and pushpin 17 connect.So that pushpin 17 and leading part 2(the 1st lead-in wire 2a, the 2nd lead-in wire 2b) in the mode that connects of inner lead part load lead frame 7.
Next, as shown in Figure 8 B, make not shown mould switching mechanism work and make counterdie 9 increase, thereby press on relative patrix 10 and clamping lead frame 7 by loading in the lead frame 7 of counterdie clamping face.The action of the further clamping lead frame 7 by molding die 8, so that the bottom of die cavity recess 16 (counterdie mold cavity block 13) makes the bottom (counterdie mold cavity block 13) of die cavity recess 16 and lead frame 7 relatively move and reflecting element is carried out to compression molding near the mode of lead frame 7.The top view of the lead frame 7 after being shaped shown in Fig. 8 A.Guide pin hole 7a is the patchhole for the counterdie directing pin (not shown) with counterdie 9 contrapositions and when lead frame 7 is arranged to counterdie 9 by lead frame 7.
Particularly, in the compression molding apparatus of Fig. 1, when utilizing molding die 8 holding workpieces (lead frame 7), pushpin 17 presses on lead frame 7 together with clamp 14 across mould release membrance 21.And; by the further holding action of molding die 8; the pressing force of the clamp 14 increasing discharges because of the contraction of helical spring 15; and drive driver 20 and circular cone 19 is slided in lower die base 11; and pin rest pad 18 is declined; make thus pushpin 17 decline and discharge the pressing force of the pushpin 17 of increase, thereby carrying out compression molding.
In addition, in the compression molding apparatus of Fig. 2, by further holding action, to keep clamp 14 and pushpin 17 to be connected under the state of lead frame 7 helical spring 15 compressed, pushpin 17 is kept out of the way together with clamp 14, carry out thus compression molding.
If adopt above-mentioned compress moulding method, expensive reflecting element is shaped few with the discarded unnecessary resin in resin, therefore can improve the utilization rate of moulding resin, in addition, due to can utilize die cavity recess bottom relatively move to be released in the chucking power increasing on workpiece in carry out compression molding, therefore, on the workpiece after shaping, can not remain impression.In addition, compared with carrying out the situation of transfer modling shaping, in compression molding, be not formed with formed products runner and cast gate, therefore, do not need cast gate to remove operation and can simplify manufacturing process, in addition, also can not produce that the cast gate causing is residual, the distortion of workpiece because cast gate is removed.
In addition, in compression molding operation, as shown in Figure 9 B, can be also, while relatively moving near lead frame 7 ground in the bottom that makes die cavity recess 16, so that the mode that residual resin overflows to overflow die cavity 27 from die cavity recess 16 is carried out compression molding.Overflow die cavity 27 is to be formed at the clamping face of clamp 14 with the consecutive mode of die cavity recess 16.Overflow die cavity 27 both can be formed at many places on one side of the die cavity recess 16 of rectangular formation, also can only be formed at a place on one side of die cavity recess 16.The top view of the lead frame 7 after being shaped shown in Fig. 9 A.
Adopt above-mentioned operation, can eliminate moulding resin 26 and not be filled to the situation in die cavity recess 16, even sneaked into air in moulding resin 26, also can this Bas Discharged be improved to shaping quality via overflow die cavity 27.
In addition, in the case of using the compression molding apparatus of Fig. 1, also can be, when utilizing molding die 8 to clamp lead frame 7, drive driver 20 and pushpin 17 is pressed on to lead frame 7, by further holding action, drive driver 20 and pushpin 17 is kept out of the way keeping being connected under the state of lead frame 7.
Thus, can adjust, make pushpin 17 can not need above chucking power to lead frame 7 effects, and can eliminate at light-emitting component lift-launch region generation tree fat burr.
In addition, in the case of using the compression molding apparatus of Fig. 2, also can be, when utilizing molding die 8 to clamp lead frame 7, pushpin 17 presses on lead frame 7 together with clamp 14, by further holding action, pushpin 17 is kept out of the way keeping being connected to together with clamp under the state of lead frame 7.
Thus, can utilize simple structure to make the lifting action interlock of clamp 14 and pushpin 17, and not need special drive source etc., therefore, can simplification device structure.
The formed products with reflecting element that is formed with reflecting element 3 on lead frame 7 is illustrated in Figure 11 A and Figure 11 B.In die cavity recess 16, except leading part 2(the 1st lead-in wire 2a, the 2nd lead-in wire 2b that connect with pushpin 17), be formed with the formed products being formed by moulding resin 26.
Light-emitting component 1 is fitted in to the 1st leading part 2a, and with wire bonding, the 1st leading part 2a is connected with the 2nd leading part 2b, utilize afterwards the thermosetting resin that forms lens section 4 to form (compression molding, transfer modling shaping etc.) to this light-emitting component 1, cut into afterwards monolithic, thereby made the light-emitting device of the surface installing type of Figure 12 A.
In the formed products with reflecting element making in the above described manner, owing to there is no the distortion that is also difficult for occurring formed products of adhering to of unnecessary resin, therefore the quality that is shaped is higher, in subsequent handling, can simplify the manufacturing process relevant with the shaping of the laminating of light-emitting component, lens section and singualtion etc.
In above-mentioned molding die, patrix 10 has been set as to fixed die, counterdie 9 has been set as to But moving die, but can be at random any one in patrix 10 and counterdie 9 has been set for to fixed die and set another one for But moving die.In addition, in the above-described embodiments, as workpiece, the product of the so-called MAP type being formed a unified one by moulding resin has been described, but the present invention can also be applicable to light-emitting device (LED matrix) to carry out the workpiece of the matrix-type of independent ester moulding.
Claims (11)
1. a compress moulding method for reflecting element for light-emitting device, it utilizes molding die holding workpiece and reflecting element is carried out to compression molding, it is characterized in that,
This compress moulding method comprises following operation:
Mould release membrance absorption is held in to the mould holding face including this die cavity recess of a mould with die cavity recess, clamped of the surrounding of this die cavity recess surrounds and is provided with in bottom pushpin that can lifting;
To absorption, keeping the die cavity recess of above-mentioned mould release membrance to supply with sealing resin and be filled to pushpin around;
By above-mentioned workpiece and the contraposition of above-mentioned die cavity recess and so that above-mentioned workpiece loads above-mentioned workpiece across above-mentioned mould release membrance with the mode that above-mentioned clamping element and pushpin connect;
To another mold compresses, make above-mentioned clamping element and pushpin press on above-mentioned workpiece across above-mentioned mould release membrance above-mentioned workpiece, and utilize above-mentioned another mould and an above-mentioned workpiece of mould holding;
By the further holding action of above-mentioned molding die, so that the bottom of above-mentioned die cavity recess makes the bottom of above-mentioned die cavity recess and above-mentioned workpiece relatively move and reflecting element is carried out to compression molding near the mode of above-mentioned workpiece.
2. the compress moulding method of reflecting element for light-emitting device according to claim 1, is characterized in that,
In above-mentioned compression molding operation, so that the bottom of above-mentioned die cavity recess while relatively moving near the mode of above-mentioned workpiece, so that the mode that residual resin overflows to overflow die cavity from above-mentioned die cavity recess is carried out compression molding.
3. the compress moulding method of reflecting element for light-emitting device according to claim 1 and 2, is characterized in that,
When utilizing molding die to clamp above-mentioned workpiece, drive drive source and above-mentioned pushpin is pressed on to above-mentioned workpiece, by further holding action, drive above-mentioned drive source and above-mentioned pushpin is kept out of the way keeping being connected under the state of above-mentioned workpiece.
4. the compress moulding method of reflecting element for light-emitting device according to claim 1 and 2, is characterized in that,
When utilizing molding die to clamp above-mentioned workpiece, above-mentioned pushpin presses on workpiece together with above-mentioned clamping element, by further holding action, above-mentioned pushpin is kept out of the way keeping being connected to together with above-mentioned clamping element under the state of workpiece.
5. the compress moulding method with reflecting element according to the light-emitting device described in any one in claim 1 to 4, is characterized in that,
This compress moulding method comprises following operation:
To absorption, keeping the die cavity recess of the counterdie of above-mentioned mould release membrance to supply with sealing resin, lead frame is being carried out to contraposition and so that the mode that lead frame connects across above-mentioned mould release membrance and above-mentioned clamping element and pushpin loads above-mentioned lead frame.
6. a compression molding apparatus for reflecting element for light-emitting device, it carries out compression molding for utilizing molding die holding workpiece to reflecting element, it is characterized in that,
Above-mentioned molding die comprises:
A mould, it has die cavity recess, and clamped of the surrounding of this die cavity recess surrounds and is provided with in bottom pushpin that can lifting;
Another mould, its for together with above-mentioned clamping element to clamping with the workpiece after loading with the mode of above-mentioned die cavity recess contraposition;
Mould release membrance, its absorption is held in a mould holding face including above-mentioned die cavity recess; And
Pushpin lifting unit, when utilizing above-mentioned molding die to clamp above-mentioned workpiece, make above-mentioned clamping element and pushpin press on above-mentioned workpiece across above-mentioned mould release membrance, by the further holding action of above-mentioned molding die, this pushpin lifting unit is relatively kept out of the way above-mentioned pushpin under the state that keeps being connected to above-mentioned workpiece with respect to the bottom of above-mentioned die cavity recess.
7. the compression molding apparatus of reflecting element for light-emitting device according to claim 6, is characterized in that,
Above-mentioned another mould is provided with the overflow die cavity being connected with above-mentioned die cavity recess.
8. the compression molding apparatus of reflecting element for light-emitting device according to claim 7, is characterized in that,
Above-mentioned pushpin is supported on by the drive source mobile circular cone that slides, when utilizing molding die to clamp above-mentioned workpiece, drive above-mentioned drive source and above-mentioned circular cone is slided to prescribed direction, and above-mentioned pushpin is pressed on to above-mentioned workpiece, by further holding action, drive above-mentioned drive source and above-mentioned circular cone is slided round about, and above-mentioned pushpin is kept out of the way under the state that keeps being connected to above-mentioned workpiece.
9. the compression molding apparatus with reflecting element according to the light-emitting device described in claim 6 or 7, is characterized in that,
Above-mentioned pushpin and above-mentioned clamping element are integratedly by helical spring floating support, when utilizing molding die to clamp above-mentioned workpiece, above-mentioned pushpin presses on workpiece together with above-mentioned clamping element, by further holding action, to keep above-mentioned pushpin and above-mentioned clamping element to be connected under the state of above-mentioned workpiece above-mentioned helical spring compressed and above-mentioned pushpin is kept out of the way together with above-mentioned clamping element.
10. the compression molding apparatus with reflecting element according to the light-emitting device described in any one in claim 6 to 9, is characterized in that,
Mould release membrance absorption is held in including the counterdie clamping face being formed at the die cavity recess of counterdie, by lead frame and the contraposition of above-mentioned die cavity recess also so that the mode that lead frame connects across above-mentioned mould release membrance and above-mentioned clamping element and pushpin loads above-mentioned lead frame.
11. 1 kinds of formed products with reflecting element, is characterized in that,
This formed products with reflecting element is that right to use requires the compression molding apparatus manufacture described in any one in the compress moulding method described in any one in 1 to 5 or claim 6 to 10 to form.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011183501A JP5764821B2 (en) | 2011-08-25 | 2011-08-25 | Compression molding method and apparatus |
| JP2011-183501 | 2011-08-25 | ||
| PCT/JP2012/070368 WO2013027601A1 (en) | 2011-08-25 | 2012-08-09 | Compression molding method and device for light-emitting device reflector |
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| KR (1) | KR101927827B1 (en) |
| CN (1) | CN103764363B (en) |
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| CN108463324A (en) * | 2016-05-26 | 2018-08-28 | 山田尖端科技株式会社 | Resin molding mold and resin molding method |
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| JP6127660B2 (en) * | 2013-03-29 | 2017-05-17 | 株式会社カネカ | Light emitting element mounting lead frame, light emitting element mounting resin molded body and manufacturing method thereof, and transfer molding die |
| KR101504256B1 (en) * | 2013-12-11 | 2015-03-20 | 주식회사 루멘스홀딩스 | Molding apparatus for light emitting device package |
| JP6298719B2 (en) * | 2014-06-09 | 2018-03-20 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
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| WO2013027601A1 (en) | 2013-02-28 |
| KR101927827B1 (en) | 2018-12-11 |
| CN103764363B (en) | 2016-09-14 |
| SG2014009468A (en) | 2014-04-28 |
| KR20140053208A (en) | 2014-05-07 |
| JP2013043391A (en) | 2013-03-04 |
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| TW201309457A (en) | 2013-03-01 |
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