TWI614109B - Compression molding method and apparatus for reflector of light-emitting device - Google Patents
Compression molding method and apparatus for reflector of light-emitting device Download PDFInfo
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- TWI614109B TWI614109B TW101128863A TW101128863A TWI614109B TW I614109 B TWI614109 B TW I614109B TW 101128863 A TW101128863 A TW 101128863A TW 101128863 A TW101128863 A TW 101128863A TW I614109 B TWI614109 B TW I614109B
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- 238000000748 compression moulding Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 86
- 229920005989 resin Polymers 0.000 claims abstract description 84
- 239000011347 resin Substances 0.000 claims abstract description 84
- 238000000465 moulding Methods 0.000 claims abstract description 62
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 210000002445 nipple Anatomy 0.000 description 16
- 239000002585 base Substances 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000001721 transfer moulding Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 238000007373 indentation Methods 0.000 description 5
- -1 gallium sulfide compound Chemical class 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052747 lanthanoid Inorganic materials 0.000 description 3
- 150000002602 lanthanoids Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
本發明之目的在提供一種改善模造樹脂的利用率，不產生樹脂溢料，提高成形品質的發光裝置用之反射體的壓縮成形方法以及裝置。 An object of the present invention is to provide a compression molding method and apparatus for a reflector for a light-emitting device which can improve the utilization ratio of a mold resin without causing resin flash and improve the molding quality.
為達到此目的之本發明，係將模造樹脂供給至吸附固定離型膜之空腔凹部，填充於按壓插梢周圍，被加工物對準空腔凹部的位置，介隔著離型膜與夾塊及按壓插梢抵接而載置，以成型鑄模夾壓被加工物，藉由被加工物進一步的夾壓動作’使空腔凹部底部相對移動更接近被加工物，壓縮成形為反射體。 In order to achieve the object of the present invention, the mold resin is supplied to the cavity concave portion of the adsorption-fixing release film, and is filled around the pressing spigot, and the workpiece is aligned with the concave portion of the cavity, and the release film and the separator are interposed. The block and the pressing tip are placed in contact with each other, and the workpiece is pressed by the molding die, and the bottom portion of the cavity concave portion is relatively moved closer to the workpiece by the further pinching operation of the workpiece, and is compression-molded into a reflector.
Description
本發明係關於例如LED等發光裝置用之反射體的壓縮成形方法以及裝置。 The present invention relates to a compression molding method and apparatus for a reflector for a light-emitting device such as an LED.
關於LED等之表面實裝型發光裝置用反射體，已有人提出以轉注成形模造樹脂之裝置的構想。反射體成形用的樹脂使用了例如混合了粒徑70μm以下之大粒徑填料和粒徑1μm以下之填料、流動性低的模造樹脂(環氧類熱硬化性樹脂)。因此，脫氣孔封閉，容易出現未填充空間，若擴大脫氣孔寬度，則容易發生樹脂外洩。再者，隨著空腔內樹脂流動的改變，也容易產生底部空洞。因此，往往會在空腔底部設置凸部，以降低樹脂流速，或者重疊設置深度不同的脫氣孔(參照專利文獻1)。 Regarding a reflector for a surface-mounted light-emitting device such as an LED, a concept of a device for molding a resin by transfer molding has been proposed. For the resin for forming the reflector, for example, a large-diameter filler having a particle diameter of 70 μm or less and a filler having a particle diameter of 1 μm or less and a moldable resin (epoxy thermosetting resin) having low fluidity are used. Therefore, the degassing hole is closed, and an unfilled space is likely to occur. If the width of the degassing hole is enlarged, resin leakage is likely to occur. Furthermore, as the flow of the resin in the cavity changes, the bottom void is also likely to occur. Therefore, a convex portion is often provided at the bottom of the cavity to lower the flow rate of the resin, or to provide a degassing hole having a different depth (see Patent Document 1).
專利文獻1：特開2011-121046號公報 Patent Document 1: JP-A-2011-121046
然而，若採用轉注成形，相當於從轉注壺至空腔的樹脂路徑之成形品(樹脂硬化物、樹脂流道等)，皆視為不需要的樹脂，加以廢棄，因此模造樹脂的利用率低。特別是反射體成形用的樹脂，材料價格為封裝成形用樹脂的五倍以上，相當昂貴，良率很低。 However, in the case of transfer molding, a molded article (resin cured product, resin flow path, etc.) corresponding to the resin path from the transfer pot to the cavity is regarded as an unnecessary resin and discarded, so that the utilization ratio of the molded resin is low. . In particular, the resin for forming a reflector has a material cost of five times or more that is a resin for encapsulation molding, which is relatively expensive and has a low yield.
再者，因為安裝LED用晶片區域有可能發生樹脂溢料，若以成型鑄模強力夾壓被加工物(導線架、樹脂基板等)，可能產生壓痕，導致成形品質降低。 Further, since the resin flash is likely to occur in the wafer area for mounting the LED, if the workpiece (a lead frame, a resin substrate, or the like) is strongly sandwiched by the molding die, an indentation may occur, resulting in a decrease in molding quality.
本發明之目的係在解決上述既有技術之課題，提供一種改善模造樹脂的利用率，不產生樹脂溢料，提高成形品質的發光裝置用之反射體的壓縮成形方法以及裝置。 An object of the present invention is to solve the above problems of the prior art and to provide a compression molding method and apparatus for a reflector for a light-emitting device which can improve the utilization ratio of a mold resin without causing resin flash and improve the molding quality.
為達到上述目的本發明，本發明具備下列結構。 In order to achieve the above object, the present invention has the following structure.
本發明係以成型鑄模夾壓被加工物，壓縮成形反射體之發光裝置用反射體的壓縮成形方法，具有：周圍被夾壓器所包圍、底部設置可昇降按壓插梢之空腔凹部的其中一邊之鑄模，對包含該空腔凹部的鑄模夾壓面吸附固定離型膜之步驟；供給封止樹脂至吸附固定離型膜的上述空腔凹部，填充於按壓插梢周圍之步驟；將上述被加工物定位於上述空腔凹部，介隔著上述離型膜抵接於上述夾壓器以及按壓插梢而載置之步驟；將上述被加工物按壓向另一邊之鑄模，將上述夾壓器以及按壓插梢介隔著上述離型膜按壓向上述被加工物，使上述另一邊之鑄模與其中一邊之鑄模夾壓之步驟；以及以上述成型鑄模以更進一步的夾壓動作，使上述空腔凹部底部相對移動更接近上述被加工物，壓縮成形反射體之步驟。 The present invention is a compression molding method for a reflector for a light-emitting device that compresses a molded body by a molding die, and has a cavity recessed portion surrounded by a pinch and a bottom portion which is provided with a cavity for lifting and lowering the pin. a mold for one side, a step of adsorbing and fixing the release film on the mold clamping surface including the concave portion of the cavity; a step of supplying the sealing resin to the cavity concave portion of the adsorption-fixing release film, and filling the periphery of the pressing insertion tip; The workpiece is positioned in the cavity recess, and the step of placing the release film against the nip and the pressing spigot is performed; and the workpiece is pressed against the other mold to clamp the workpiece And a step of pressing the mold to the workpiece by the release film, and clamping the mold of the other side with the mold of the other side; and further clamping the mold with the mold The bottom portion of the cavity recess is relatively moved closer to the workpiece, and the step of compressing the reflector is performed.
使用上述壓縮成形方法，可極度抑制昂貴反射體成形用樹脂的廢棄不用樹脂，除了可提高模造樹脂利用率，還可令按壓插梢對被加工物夾壓力的增強，藉由對空腔凹部底部的相對移動加以釋放，壓縮成形，故成形後的被加工物上不會殘留壓痕。再者，與進行轉注成形時相比，壓縮成形不會形成成形品樹脂流道以及澆口，故不需要去除澆口步驟，可簡化製造步驟，且不會發生起因於去除澆口的澆口殘留或被加工物變形。 By using the above-described compression molding method, the resin for discarding the expensive reflector molding resin can be extremely suppressed, and in addition to improving the utilization ratio of the molding resin, the pressing force of the pressing insert to the workpiece can be enhanced by the bottom of the cavity recess. The relative movement is released and compressed and formed, so that no indentation remains on the workpiece after molding. Further, since the compression molding does not form the molded resin flow path and the gate as compared with the case of performing the transfer molding, the step of removing the gate is not required, the manufacturing step can be simplified, and the gate resulting from the removal of the gate does not occur. Residual or processed material is deformed.
再者，在上述壓縮成形步驟中，令上述空腔凹部底部相對移動接近上述被加工物時，理想的是令剩餘樹脂由上述空腔凹部往溢流空腔溢出，進行壓縮成形。 Further, in the compression molding step, when the bottom portion of the cavity concave portion is relatively moved close to the workpiece, it is preferable that the remaining resin is overflowed from the cavity concave portion into the overflow cavity to be compression-molded.
根據上述步驟，可避免模造樹脂未填入空腔凹部，即使模造樹脂中混入空氣，亦可將該空氣透過溢流空腔排出，提高成形品質。 According to the above steps, it is possible to prevent the molding resin from being filled into the cavity concave portion, and even if air is mixed into the molding resin, the air can be discharged through the overflow cavity to improve the molding quality.
再者，以成型鑄模夾壓上述被加工物時，亦可驅動驅動源，令上述按壓插梢推壓上述被加工物，再以更進一步的夾壓動作驅動上述驅動源，令上述按壓插梢以抵接上述被加工物的狀態退回。 Further, when the workpiece is pressed by the molding die, the driving source may be driven to press the pressing target to press the workpiece, and the driving source may be driven by a further nip operation to cause the pressing pin to be inserted. It is returned in a state of abutting the above-mentioned workpiece.
可調整按壓插梢對上述被加工物的夾壓力，使其不過度作用，還可避免裝設發光元件區域產生樹脂溢料。 The clamping pressure of the pressing insert on the workpiece can be adjusted so as not to excessively act, and it is also possible to avoid the occurrence of resin flash in the region where the light emitting element is installed.
再者，以成型鑄模夾壓上述被加工物時，亦可令上述按壓插梢與上述夾壓器共同推壓被加工物，以更進一步的夾壓動作，與上述夾壓器共同令上述按壓插梢以抵接上述被加工物的狀態退回。 Further, when the workpiece is sandwiched by the molding die, the pressing nipper and the nipper may be pressed together to press the workpiece, and the nip may be further pressed together with the nipper to cause the pressing. The spigot is returned in a state in which the workpiece is abutted.
可利用簡易結構令夾壓器和按壓插梢的昇降動作連動，因不需要專用驅動源等，故可簡化裝置結構。 The simple structure can be used to interlock the lifting operation of the crimper and the pressing spigot. Since a dedicated driving source or the like is not required, the device structure can be simplified.
再者，亦可包含供給封止樹脂至上述離型膜所吸附固定的下模空腔凹部，定位導線架，介隔著上述離型膜抵接上述夾壓器及按壓插梢而載置之步驟。 Furthermore, the lower mold cavity recessed portion to which the sealing resin is supplied and fixed to the release film may be included, and the lead frame may be positioned to be placed against the crimper and the presser tip via the release film. step.
根據上述步驟，被加工物之封止樹脂或導線架可輕易供給至下模，可簡化包含上模之鑄模構造。 According to the above steps, the sealing resin or the lead frame of the workpiece can be easily supplied to the lower mold, and the mold structure including the upper mold can be simplified.
本發明係以成型鑄模夾壓被加工物，壓縮成形反射體之發光裝置用反射體的壓縮成形裝置，其特徵係上述成型鑄模具備：其中一邊之鑄模，其係具有周圍被夾壓器包圍，底部設置可昇降按壓插梢之空腔凹部者；另外一邊之鑄模，其係與上述夾壓器一同夾壓定位於上述空腔凹部而載置的被加工物者；離型膜，其係吸附固定於包含上述空腔凹部之其中一邊之鑄模夾壓面者；以及按壓插梢昇降部，其係以上述成型鑄模夾壓上述被加工物時，上述夾壓器及按壓插梢介隔著上述離型膜推壓上述被加工物，藉由上述成型鑄模更進一步的夾壓動作，使上述按壓插梢在抵接上述被加工物的狀態下，對上述空腔凹部底部相對退回者。 The present invention is a compression molding apparatus that compresses a workpiece by a molding die and compresses a reflector for a light-emitting device, wherein the molding die includes one of the molds, and the periphery thereof is surrounded by a crimper. The bottom part is provided with a cavity recess for lifting and lowering the insertion tip; and the other side of the mold is clamped and placed on the concave portion of the cavity together with the crimper; the release film is adsorbed a mold clamping surface fixed to one of the cavity recesses; and a pressing tip lifting portion for sandwiching the workpiece by the molding die, wherein the crimper and the pressing insert are interposed therebetween The release film presses the workpiece, and the pressing mold is further subjected to a pinching operation to cause the pressing tip to be relatively returned to the bottom of the cavity recess in a state in which the pressing tip abuts against the workpiece.
使用上述壓縮裝置，可抑制昂貴反射體成形用樹脂的廢棄不用樹脂至最小限度，除了可提高模造樹脂利用率，還可因按壓插梢對被加工物之夾壓力增強，藉由對空腔凹部底部的相對移動加以釋放，壓縮成形，故成形後的被加工物上不會殘留壓痕。再者，與進行轉注成形時相比，壓縮成形不需要樹脂流道以及澆口，故成形後的被加工物上不會有模造樹脂附著。因此，不會發生起因於去除澆口的澆口殘留或被加工物變形。 By using the above-described compression device, it is possible to suppress the disposal of the resin for forming an expensive reflector to a minimum, and in addition to improving the utilization ratio of the molded resin, the clamping pressure of the workpiece can be enhanced by the pressing of the nip, by recessing the cavity. The relative movement of the bottom is released and compression-molded, so that no indentation remains on the workpiece after molding. Further, since the resin flow path and the gate are not required for the compression molding as compared with the case of the transfer molding, the molded resin does not adhere to the workpiece after the molding. Therefore, there is no possibility that the gate due to the removal of the gate remains or the workpiece is deformed.
再者，在上述另外一邊之鑄模上，理想的是設置連通上述空腔凹部的溢流空腔。根據上述構成，可減少模造樹脂未填充至空腔凹部，即使模造樹脂中混入空氣，亦可將該空氣透過溢流空腔排出，提高成形品質。 Further, in the mold of the other side, it is preferable to provide an overflow cavity that communicates with the cavity recess. According to the above configuration, it is possible to reduce the filling of the mold resin into the cavity recess, and even if air is mixed into the mold resin, the air can be discharged through the overflow cavity to improve the molding quality.
再者，上述按壓插梢受因驅動源而滑動移動的錐狀塊所支撐，在成型鑄模夾壓上述被加工物時，驅動上述驅動源，令上述錐狀塊往特定方向滑動，使上述按壓插梢推壓至上述被加工物，再以更進一步的夾壓動作驅動上述驅動源，讓上述錐狀塊往反方向滑動，令上述按壓插梢以抵接上述被加工物的狀態退回。 Further, the pressing nip is supported by a tapered block that is slidably moved by the driving source, and when the forming mold clamps the workpiece, the driving source is driven to slide the tapered block in a specific direction to cause the pressing The insertion tip is pressed against the workpiece, and the driving source is driven by a further nip operation, and the tapered block is slid in the opposite direction, and the pressing nip is retracted in a state of abutting against the workpiece.
藉此，可調整按壓插梢對上述被加工物的夾壓力，使其不過度作用，還可避免裝設發光元件區域產生樹脂溢料。 Thereby, the pressing force of the pressing nip to the workpiece can be adjusted so as not to excessively act, and the occurrence of resin flashing in the illuminating element region can be avoided.
再者，上述按壓插梢亦可為與上述夾壓器為一體 受螺旋彈簧浮動支撐，以成型鑄模夾壓上述被加工物時，與上述夾壓器共同推壓被加工物，以更進一步的夾壓動作，在抵接上述被加工物的狀態下壓縮上述螺旋彈簧，令上述按壓插梢與上述夾壓器共同退回。 Furthermore, the above-mentioned pressing spigot can also be integrated with the above-mentioned crimper. When the workpiece is crimped by the coil spring, the workpiece is pressed together with the nip, and the workpiece is pressed together to further compress the spiral while abutting the workpiece. The spring causes the above-mentioned pressing spigot to be retracted together with the above-mentioned crimper.
可利用簡易結構令夾壓器和按壓插梢的昇降動作連動，因不需要專用驅動源等，故可簡化裝置結構。 The simple structure can be used to interlock the lifting operation of the crimper and the pressing spigot. Since a dedicated driving source or the like is not required, the device structure can be simplified.
再者，亦可使包含於下模所形成之空腔凹部的下模夾壓面吸附固定著離型膜，對準上述空腔凹部的位置，介隔著上述離型膜使導線架抵接於上述夾壓器及按壓插梢而載置。根據上述構成，被加工物供給至下模的動作較容易，且可簡化包含上模的鑄模構造。 Furthermore, the release film may be adhered and fixed to the lower mold clamping surface of the cavity concave portion formed by the lower mold, and the position of the concave portion of the cavity may be aligned, and the lead frame may be abutted via the release film. The pinch and the pusher are placed on the pinch. According to the above configuration, the operation of supplying the workpiece to the lower mold is easy, and the mold structure including the upper mold can be simplified.
再者，使用前述壓縮成形方法或壓縮成形裝置所製造的附反射體成形品，無附著不必要樹脂，成形品不易變形，故成形品質高，可簡化進行在後段製程中與發光元件的黏著、鏡片部的成形、切割等相關製造步驟。 Further, the reflector-formed product produced by the compression molding method or the compression molding apparatus has no unnecessary resin attached, and the molded article is not easily deformed, so that the molding quality is high, and the adhesion to the light-emitting element in the subsequent process can be simplified. Manufacturing steps related to forming, cutting, and the like of the lens portion.
以下將參照附圖，詳細說明關於本發明的發光裝置用之反射體的壓縮成形方法以及裝置其理想實施形態。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of a compression molding method and apparatus for a reflector for a light-emitting device of the present invention will be described in detail with reference to the accompanying drawings.
首先將參照第12A~12C圖說明發光裝置(LED裝置)概略構成。 First, a schematic configuration of a light-emitting device (LED device) will be described with reference to FIGS. 12A to 12C.
表面實裝型發光裝置具備：發光元件1；載置發 光元件1的導線部2；防止來自發光元件1所照射的照射光之擴散的反射體3，以及覆蓋發光元件1的鏡片部4。反射體3係與載置發光元件1之用的第1導線2a和發光元件1電性連接的第2導線2b一體成形。 The surface-mounted light-emitting device includes: a light-emitting element 1; The lead portion 2 of the optical element 1; the reflector 3 for preventing diffusion of the illumination light irradiated from the light-emitting element 1, and the lens portion 4 covering the light-emitting element 1. The reflector 3 is integrally formed with the first lead wire 2a on which the light-emitting element 1 is placed and the second lead wire 2b electrically connected to the light-emitting element 1.
發光元件1係在同一面具有正負成對的電極。以下將對於同一面具有正負成對電極者進行說明，但亦可使用在發光元件1的上面和下面具有正負成對電極者。此時發光元件下面的電極不使用引線，而使用具導電性的接合構件與第1導線2a電性連接。 The light-emitting element 1 has electrodes that are positive and negative in the same plane. Hereinafter, those having positive and negative paired electrodes on the same surface will be described, but those having positive and negative paired electrodes on the upper and lower sides of the light-emitting element 1 may be used. At this time, the electrode under the light-emitting element is electrically connected to the first lead 2a using a conductive member without using a lead.
第1導線2a係連續具有內導線部和外導線部。發光元件1係黏著而載置在內導線部上。發光元件1係以引線5各自與第1、第2導線2a、2b之內導線部引線接合。 The first wire 2a continuously has an inner lead portion and an outer lead portion. The light-emitting element 1 is adhered and placed on the inner lead portion. In the light-emitting element 1, each of the lead wires 5 is wire-bonded to the inner lead portions of the first and second lead wires 2a and 2b.
此外，為了避免第1導線2a和第2導線2b之間短路，在內側接近第1導線2a與第2導線2b(內導線部)的部分裝設了絕緣構件6。再者，本實施例的發光裝置導線有兩根，但亦可為三根以上。 Further, in order to avoid short-circuiting between the first wire 2a and the second wire 2b, the insulating member 6 is attached to a portion of the inner side that is close to the first wire 2a and the second wire 2b (inner wire portion). Furthermore, the light-emitting device of the present embodiment has two wires, but it may have three or more wires.
反射體3係於第1、第2導線2a、2b的外導線部上站立形成。反射體3係於外導線部上形成凹部。反射體3係如後述般使用熱硬化性樹脂(例如環氧樹脂、變性環氧樹脂、矽膠樹脂、變性矽膠樹脂等)以壓縮成形而形成者。反射體3的開口部設計為傾斜，令上端部較下端部更廣。傾斜角係以導線面為基準，為95度以上、150度以下，更理想的是100度以上、 120度以下。 The reflector 3 is formed to stand on the outer lead portions of the first and second lead wires 2a and 2b. The reflector 3 is formed on the outer lead portion to form a recess. The reflector 3 is formed by compression molding using a thermosetting resin (for example, an epoxy resin, a denatured epoxy resin, a silicone resin, a denatured silicone resin, or the like) as described later. The opening of the reflector 3 is designed to be inclined so that the upper end portion is wider than the lower end portion. The tilt angle is 95 degrees or more and 150 degrees or less, more preferably 100 degrees or more, based on the lead surface. Below 120 degrees.
鏡片部4以包覆發光元件1的狀態封止了包圍反射體3的凹部。鏡片部4使用了包含螢光物質(例如由主要由Eu、Ce等鑭系元素賦活之氮化物系螢光體。氮氧化物系螢光體‧塞隆(Sialon)系螢光體、Eu等鑭系、主要由Mn等過渡金屬元素賦活之鹼土類鹵磷螢光體、鹼土類金屬鹵硼酸螢光體、鹼土類金屬鋁酸鹽螢光體、鹼土類矽酸鹽、鹼土類硫化物、鹼土鎵硫化合物、鹼土類氮化矽、鍺酸鹽或主要由Ce等鑭系元素賦活之稀土類鋁酸鹽、稀土類矽酸鹽或主要由Eu等鑭系元素賦活之有機以及有機錯合物等中所選之至少其中任一項中一種以上的物質)之熱硬化性樹脂(例如環氧樹脂、變性環氧樹脂、矽膠樹脂、變性矽膠樹脂等)。由於螢光物質使用比重較熱硬化性樹脂更大者，故沈降於被反射體3包圍的凹部底面側(導線面上)。由於令熱硬化性樹脂具備耐熱性、耐候性、耐光性等，故可從填料、擴散劑、顏料、螢光物質、反射性物質等所選之至少1種以上的物質加以混合。反射體3和鏡片部4皆使用熱硬化性樹脂，膨張係數等物理性質接近，故密合性極佳。 The lens portion 4 seals the concave portion surrounding the reflector 3 in a state of covering the light-emitting element 1. The lens unit 4 is made of a fluorescent substance (for example, a nitride-based phosphor mainly activated by a lanthanoid element such as Eu or Ce. Nitrogen oxide-based phosphor, Sialon-based phosphor, Eu, etc.) An alkali-based halogen phosphor, an alkaline earth metal haloborate phosphor, an alkaline earth metal aluminate phosphor, an alkaline earth niobate, an alkaline earth sulfide, or the like, which is mainly activated by a transition metal element such as Mn. Alkaline earth gallium sulfide compound, alkaline earth type tantalum nitride, niobate or rare earth aluminate activated by lanthanoid elements such as Ce, rare earth silicate or organic and organic miscognition mainly activated by lanthanides such as Eu A thermosetting resin (for example, an epoxy resin, a denatured epoxy resin, a silicone resin, a denatured silicone resin, or the like) of at least one of at least one selected from the group of materials. Since the fluorescent material has a larger specific gravity than the thermosetting resin, it settles on the bottom surface side (the wire surface) of the concave portion surrounded by the reflector 3. Since the thermosetting resin is provided with heat resistance, weather resistance, light resistance, and the like, it can be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, and a reflective material. Both the reflector 3 and the lens portion 4 are made of a thermosetting resin, and the physical properties such as the expansion coefficient are close to each other, so that the adhesion is excellent.
接著說明發光裝置用反射體的壓縮成形裝置。 Next, a compression molding apparatus for a reflector for a light-emitting device will be described.
壓縮成形裝置係以成型鑄模夾壓被加工物W，壓縮成形為反射體3。被加工物W如第10A及10B圖所示。使用形成為多行多列導線部2的導線架7。各 導線部2係介隔著空隙與第1導線2a和第2導線2b對向而形成。被加工物W不限於導線架7，亦可為形成有佈線圖案之樹脂基板。 In the compression molding apparatus, the workpiece W is pressed by a molding die and compression-molded into the reflector 3. The workpiece W is as shown in Figs. 10A and 10B. A lead frame 7 formed as a plurality of rows and columns of lead portions 2 is used. each The lead portion 2 is formed to face the first lead 2a and the second lead 2b via a gap. The workpiece W is not limited to the lead frame 7, and may be a resin substrate on which a wiring pattern is formed.
以下參照第1圖說明壓縮成形裝置。 The compression molding apparatus will be described below with reference to Fig. 1 .
成型鑄模8具備以合模夾壓被加工物W的下模9(其中一邊之鑄模)和上模10(另外一邊之鑄模)。以下將下模9視為動模、上模10視為定模加以說明。模開關動作係使用藉由驅動源(電動馬達等)驅動昇降之肘節連接杆或滾珠螺桿等周知之模開關機構來進行。 The molding die 8 includes a lower die 9 (one of which is a mold) that clamps the workpiece W by a mold clamping, and an upper die 10 (the other die). Hereinafter, the lower mold 9 will be regarded as a movable mold, and the upper mold 10 will be described as a fixed mold. The mode switching operation is performed using a well-known mode switching mechanism such as a toggle link or a ball screw that is driven by a drive source (electric motor or the like).
下模9係在下模底座11載置了下模支撐塊12。下模支撐塊12上，支撐著下模空腔塊13。再者，下模空腔塊13的周圍，有下模支撐塊12介隔著螺旋彈簧15浮動支撐著夾塊14。下模空腔塊13的上面以及夾塊14去角之內側面形成了空腔凹部16。 The lower mold 9 is provided with a lower mold supporting block 12 on the lower mold base 11. The lower mold cavity block 13 is supported on the lower mold support block 12. Further, around the lower mold cavity block 13, there is a lower die support block 12 floatingly supporting the clamp block 14 via a coil spring 15. The upper surface of the lower mold cavity block 13 and the inner side of the chamfered portion of the clamp block 14 form a cavity recess 16.
上述空腔凹部16內，設置了可昇降的按壓插梢17貫穿了下模支撐塊12以及下模空腔塊13。按壓插梢17立設於插梢支撐塊18上。按壓插梢17從平面看來為圓形，但不限於此，亦可為例如矩形之插梢。再者，按壓插梢17的前端附近設有傾斜角。此傾斜角之設計係與形成於反射體3開口部的傾斜角對向，令上端部較下端部窄。此外，插梢支撐塊18係由設於下模底座11的錐狀塊19之錐狀面彼此抵接所支撐。插梢支撐塊18和錐狀塊19收納於下模支撐塊 12和下模底座11之間所形成的空間。錐狀塊19係由致動器20(馬達、汽缸等驅動源)滑動至下模底座11上。藉此，插梢支撐塊18沿著錐狀面相對滑動令按壓插梢17昇降(按壓插梢昇降部)。 In the cavity recess 16 described above, a press-fit tip 17 that can be raised and lowered is inserted through the lower die support block 12 and the lower die cavity block 13. The pressing spigot 17 is erected on the lance support block 18. The pressing lance 17 is circular in plan view, but is not limited thereto, and may be, for example, a rectangular spigot. Further, a tilt angle is provided in the vicinity of the front end of the press nipple 17. The design of the inclination angle is opposite to the inclination angle formed at the opening of the reflector 3, so that the upper end portion is narrower than the lower end portion. Further, the lance support block 18 is supported by the tapered faces of the tapered blocks 19 provided on the lower die base 11 abutting each other. The lance support block 18 and the tapered block 19 are received in the lower die support block The space formed between the 12 and the lower mold base 11. The tapered block 19 is slid onto the lower mold base 11 by an actuator 20 (a driving source such as a motor or a cylinder). Thereby, the ferrule support block 18 slides along the tapered surface to cause the press nipple 17 to move up and down (pressing the ferrule lifter).
再者，包含突設了按壓插梢17的空腔凹部16之下模夾壓面，係由離型膜21所包覆。離型膜21係以下模空腔塊13和包圍其之夾塊14之間的空隙為引道，受到吸附固定。離型膜21係具有耐熱性，容易從鑄模面剝離，具有柔軟性、伸展性者，例如PTFE、ETFE、PET、FEP膜、含浸氟素之玻璃布、聚丙烯膜、聚偏二氯乙烯等皆適用。 Further, the mold clamping surface below the cavity recess 16 in which the pressing tip 17 is protruded is covered by the release film 21. The release film 21 is a channel between the lower mold cavity 13 and the clamp 14 surrounding it, and is adsorbed and fixed. The release film 21 has heat resistance and is easily peeled off from the mold surface, and has flexibility and stretchability, such as PTFE, ETFE, PET, FEP film, glass cloth impregnated with fluorine, polypropylene film, polyvinylidene chloride, etc. Suitable for all.
上模10係在上模底座22重疊上模模套塊23、上模鑲塊24而支撐。上模鑲塊24的夾壓面上設有空氣吸引孔24a。成型鑄模8夾壓導線架7時，空氣吸引孔24a可經導線架7上所形成的空隙而由空腔凹部16內吸引空氣進行減壓成形。本實施例係藉由吸引使導線架7吸引固定於上模10，但並不限於吸引，亦可於上模10設置導線架夾壓器來夾壓。再者，除了在上模10安設導線架7以外，亦可在下模9安設導線架7。 The upper mold 10 is supported by the upper mold base 22 overlapping the upper mold insert 23 and the upper mold insert 24. An air suction hole 24a is provided on the nip surface of the upper mold insert 24. When the molding die 8 clamps the lead frame 7, the air suction hole 24a can be formed by depressurizing air from the cavity recess 16 via the gap formed in the lead frame 7. In the present embodiment, the lead frame 7 is attracted and fixed to the upper mold 10 by suction, but it is not limited to suction, and the lead frame crimper may be provided in the upper mold 10 to be pinched. Further, in addition to the lead frame 7 being attached to the upper mold 10, the lead frame 7 may be attached to the lower mold 9.
模造樹脂供給至離型膜21所吸附固定的下模9之空腔凹部16，載置導線架7後，令下模9上昇與上模10合模以進行壓縮成形。以成型鑄模8夾壓導線架7時，夾塊14被推壓至導線架7，按壓插梢17 被推壓至導線架7之裝設發光元件面(導線部2)。 The mold resin is supplied to the cavity recess 16 of the lower mold 9 to which the release film 21 is attached and fixed, and after the lead frame 7 is placed, the lower mold 9 is raised and the upper mold 10 is clamped to perform compression molding. When the lead frame 7 is clamped by the molding mold 8, the clamp 14 is pushed to the lead frame 7, and the insertion tip 17 is pressed. It is pushed to the surface of the lead frame 7 on which the light-emitting element is mounted (the lead portion 2).
再者，藉由成型鑄模8更進一步之夾壓動作，夾塊14押壓力的加強可藉由螺旋彈簧15的壓縮而釋放，而按壓插梢17押壓力的加強，則可藉由驅動致動器20使錐狀塊19在下模底座11上滑動，令插梢支撐塊18下降，讓按壓插梢17下降而釋放。 Furthermore, by the further clamping action of the molding die 8, the pressing force of the clamping block 14 can be released by the compression of the coil spring 15, and the pressing force of the pressing pin 17 can be actuated by driving. The device 20 slides the tapered block 19 on the lower mold base 11, so that the insertion support block 18 is lowered, and the pressing insertion piece 17 is lowered and released.
使用上述壓縮裝置，昂貴的反射體成形用樹脂中廢棄不要樹脂極少，所以除了可以提高模造樹脂的利用率，更可令對被加工物(導線架7)的夾壓力之增強，藉由空腔凹部16底部的相對移動進行釋放、同時壓縮成形，所以成形後的導線架7不會留下壓痕。再者，與進行轉注成形時比較，壓縮成形不需要樹脂流道及澆口，所以成形後的被加工物上不會附著模造樹脂。因此，也不會發生起因於去除澆口的澆口殘留或被加工物的變形。 By using the above-described compression device, the resin for forming an expensive reflector is not required to be repelled with a small amount of resin, so that in addition to improving the utilization ratio of the molded resin, the clamping force against the workpiece (the lead frame 7) can be enhanced by the cavity. The relative movement of the bottom of the recess 16 is released and simultaneously compression-molded, so that the formed lead frame 7 does not leave an indentation. Further, as compared with the case of performing the transfer molding, the resin flow path and the gate are not required for the compression molding, so that the molded resin is not adhered to the workpiece after the molding. Therefore, the gate residue due to the removal of the gate or the deformation of the workpiece is not caused.
再者，下模9的夾塊14之夾壓面上，亦可設置與空腔凹部16連通的溢流空腔27(參照第9A及9B圖)。根據此構成，可避免空腔凹部16未填充入模造樹脂，即使空氣混入模造樹脂，亦可令該空氣通過溢流空腔27排氣提高成形品質。 Further, an overflow cavity 27 that communicates with the cavity recess 16 may be provided on the nip surface of the chuck 14 of the lower mold 9 (see FIGS. 9A and 9B). According to this configuration, it is possible to prevent the cavity recessed portion 16 from being filled with the molding resin, and even if the air is mixed into the molding resin, the air can be vented through the overflow cavity 27 to improve the molding quality.
按壓插梢17係由以致動器20所滑動移動的錐狀塊19所支撐，以成型鑄模8夾壓被加工物時，驅動致動器20令錐狀塊19往特定方向滑動，令按壓插梢17推壓被加工物，以更進一步的夾壓動作驅動致動 器20，令錐狀塊19往反方向滑動，使按壓插梢17以抵接被加工物狀態退回。藉此，可調整按壓插梢17對被加工物的夾壓力，使其不過度作用，還可避免裝設發光元件1區域產生樹脂溢料。 The pressing lance 17 is supported by a tapered block 19 that is slidably moved by the actuator 20, and when the molding die 8 is pressed against the workpiece, the actuator 20 is driven to slide the tapered block 19 in a specific direction, so that the pressing insertion is performed. The tip 17 pushes the workpiece to drive the actuation with further clamping action In the device 20, the tapered block 19 is slid in the opposite direction, and the pressing nipper 17 is retracted in a state of abutting against the workpiece. Thereby, the nip pressure of the press nip 17 against the workpiece can be adjusted so as not to excessively act, and the occurrence of resin flash in the region where the light-emitting element 1 is mounted can be avoided.
接著將參照第2圖說明壓縮成形裝置的其他例子。成型鑄模8與上模10結構共通，故以下說明以下模9的結構為主。 Next, another example of the compression molding apparatus will be described with reference to Fig. 2 . Since the molding die 8 and the upper die 10 have the same structure, the structure of the following die 9 will be mainly described below.
第1圖中按壓插梢17和夾塊14係由不同驅動而昇降。在本實施形態中按壓插梢17和夾塊14係為連動而昇降的結構。 In Fig. 1, the pressing lances 17 and the nipples 14 are lifted and lowered by different driving. In the present embodiment, the pressing nipple 17 and the nipple 14 are configured to move up and down in conjunction with each other.
第2圖中在下模底座11上載置固定著下模支撐塊12。下模支撐塊12載置固定著下模空腔塊13。下模空腔塊13的周圍，有下模支撐塊12介隔著螺旋彈簧15浮動支撐著夾塊14。 In Fig. 2, the lower mold supporting block 12 is placed and fixed on the lower mold base 11. The lower mold support block 12 mounts and holds the lower mold cavity block 13. Around the lower mold cavity block 13, a lower die support block 12 is floatingly supported by the clamp block 14 via a coil spring 15.
如第3A~3C圖所示，在夾塊14的底部側中空孔14a上，連結板25於X-Y方向兩處各架設一對。此連結板25彼此交叉的四處之交叉部，立設有按壓插梢17。連結板25在夾塊14下端部於兩端鎖螺絲固定。再者，按壓插梢17係鎖螺絲固定於連結板25(參照第3C圖)。 As shown in Figs. 3A to 3C, on the bottom side hollow hole 14a of the holder 14, the connecting plate 25 is placed in a pair at each of the X-Y directions. The intersection portion of the four connecting plates 25 intersecting each other is provided with a pressing insertion end 17. The connecting plate 25 is fixed at the lower end of the clamp block 14 at both ends by a locking screw. Further, the pressing nipple 17 is fixed to the connecting plate 25 by a lock screw (see FIG. 3C).
再者，如第3D圖以及第3E圖所示，下模空腔塊13底部設有四處收納交叉配置的連結板25之板厚的凹溝13a(階狀溝)，以及按壓插梢17貫穿該凹溝13a的貫穿孔13b。 Further, as shown in FIG. 3D and FIG. 3E, the bottom portion of the lower mold cavity block 13 is provided with four recessed grooves 13a (stepped grooves) for accommodating the cross-connecting connecting plates 25, and the pressing insertion end 17 is penetrated. The through hole 13b of the groove 13a.
在第2圖中，按壓插梢17和夾塊14為一體，在下模支撐塊12上由螺旋彈簧15浮動支撐。以成型鑄模8夾壓被加工物(導線架7)時，按壓插梢17與夾塊14共同介隔著離型膜21被推壓至導線架7，藉由更進一步的夾壓動作，夾塊14以及按壓插梢17以抵接導線架7的狀態，壓縮螺旋彈簧15，使按壓插梢17與夾塊14一同退回。 In Fig. 2, the pressing nipple 17 and the nipple 14 are integrated, and are supported by the coil spring 15 on the lower die supporting block 12. When the workpiece (the lead frame 7) is pinched by the molding die 8, the pressing nipple 17 and the nipple 14 are pressed together with the release film 21 to the lead frame 7, and the nip is further clamped. The block 14 and the pressing lance 17 abut against the lead frame 7, and the coil spring 15 is compressed to retract the pressing nipple 17 together with the nip 14.
根據上述構成，可利用簡易結構令夾塊14與按壓插梢17的昇降動作連動，因不需要專用驅動源等，故可簡化裝置結構。 According to the above configuration, the clip 14 can be interlocked with the lifting operation of the pressing spigot 17 by a simple structure, and a dedicated driving source or the like is not required, so that the device configuration can be simplified.
關於使用上述壓縮成形裝置之發光裝置用反射體的壓縮成形方法，參照第4A及4B圖至第11A及11B圖進行說明。另外，第1圖至第3A~3E圖為求簡化，使用4根按壓插梢之圖，但第4A及4B圖以後則使用6行5列之圖加以說明。 The compression molding method of the reflector for a light-emitting device using the above-described compression molding apparatus will be described with reference to Figs. 4A and 4B to Figs. 11A and 11B. In addition, in FIGS. 1 to 3A to 3E, for the sake of simplification, four press-pull inserts are used, but FIGS. 4A and 4B are later described using six rows and five columns.
如第4A圖所示，下模空腔塊13內有按壓插梢17貫穿突設於空腔凹部16內。成型鑄模8為模開啟狀態，如第4B圖所示，具有周圍被夾塊14所包圍、底部設置可昇降按壓插梢17的空腔凹部16之下模9，含該空腔凹部16的下模夾壓面係以離型膜21覆蓋而吸附固定。 As shown in FIG. 4A, a press nip 17 is formed in the lower cavity block 13 and protrudes into the cavity recess 16. The molding die 8 is in a die-opening state, as shown in FIG. 4B, having a lower cavity 13 of the cavity recess 16 surrounded by the clamping block 14 and having a bottom portion capable of lifting and lowering the pressing tip 17, including the lower portion of the cavity recess 16 The mold clamping surface is covered by the release film 21 and adsorbed and fixed.
如第5A圖所示，下模空腔塊13的按壓插梢17所貫穿之貫穿孔13b的周圍，設有空氣吸引孔13c。如第5B圖所示，離型膜21在空腔凹部16內係通過 空氣吸引孔13c，以及下模空腔塊13和夾塊14之間的縫隙所形成的空氣吸引孔13d，受到空氣吸引，包覆在按壓插梢17周圍以吸附固定。 As shown in Fig. 5A, an air suction hole 13c is provided around the through hole 13b through which the pressing nip 17 of the lower mold cavity block 13 is inserted. As shown in FIG. 5B, the release film 21 passes through the cavity recess 16 The air suction hole 13c, and the air suction hole 13d formed by the gap between the lower mold cavity block 13 and the clamp block 14, are attracted by the air, and are wrapped around the pressing insertion piece 17 to be suction-fixed.
接著如第6A及6B圖所示，供給模造樹脂26至離型膜21受吸附固定的空腔凹部16，填充至按壓插梢17周圍。模造樹脂26使用如前述般反射體3成形用之熱硬化性樹脂(例如環氧樹脂、變性環氧樹脂、矽膠樹脂、變性矽膠樹脂等)。模造樹脂26的形態可採用片狀樹脂、顆粒樹脂、粉體樹脂、液狀樹脂、片狀樹脂等種種形態。 Next, as shown in FIGS. 6A and 6B, the cavity resin portion 26 to which the mold resin 26 is supplied and fixed to the release film 21 is filled and filled around the press nipple 17. As the mold-forming resin 26, a thermosetting resin (for example, an epoxy resin, a denatured epoxy resin, a silicone resin, a denatured silicone resin, or the like) for molding the reflector 3 as described above is used. The form of the mold resin 26 can be various forms such as a sheet resin, a pellet resin, a powder resin, a liquid resin, and a sheet resin.
接著如第7A及7B圖所示，將導線架7定位於下模9的空腔凹部16上，介隔著離型膜21抵接夾塊14及按壓插梢17而載置。載置導線架7時，應使按壓插梢17抵接導線部2(第1導線2a、第2導線2b)中之內導線部。 Next, as shown in FIGS. 7A and 7B, the lead frame 7 is positioned on the cavity concave portion 16 of the lower mold 9, and the release film 21 is placed against the clamp block 14 and the pressing spigot 17 via the release film 21. When the lead frame 7 is placed, the pressing spigot 17 is brought into contact with the inner lead portion of the lead portion 2 (the first lead 2a and the second lead 2b).
接著如第8B圖所示，令未圖示的模開關機構動作，使下模9上昇，將載置於下模夾壓面的導線架7推壓至對向之上模10進行夾壓。藉由成型鑄模8之導線架7更進一步的夾壓動作，令空腔凹部16底部(下模空腔塊13)相對移動接近導線架7，壓縮成形為反射體。第8A圖顯示成形後之導線架7的平面圖。導梢孔7a係將導線架7定位於下模9安設時之下模導梢(未圖示)的插入孔。 Next, as shown in Fig. 8B, the mold opening and closing mechanism (not shown) is operated to raise the lower mold 9, and the lead frame 7 placed on the lower mold clamping surface is pressed to the opposing upper mold 10. By further clamping operation of the lead frame 7 of the molding mold 8, the bottom portion of the cavity recess 16 (the lower mold cavity block 13) is relatively moved closer to the lead frame 7, and is compression-molded into a reflector. Fig. 8A shows a plan view of the lead frame 7 after forming. The guide hole 7a is for positioning the lead frame 7 at the insertion hole of the lower mold tip (not shown) when the lower mold 9 is installed.
具體而言，如第1的圖壓縮成形裝置中，以成型 鑄模8夾壓被加工物(導線架7)時，按壓插梢17與夾塊14共同介隔著離型膜21被推壓至導線架7。而藉由成型鑄模8更進一步的夾壓動作，夾塊14押壓力的增強可藉著螺旋彈簧15的壓縮而釋放，按壓插梢17押壓力的增強可藉著驅動致動器20令錐狀塊19在下模底座11上滑動使插梢支撐塊18，讓按壓插梢17下降而釋放，進行壓縮成形。 Specifically, in the compression molding apparatus of the first drawing, molding is performed. When the mold 8 is pressed against the workpiece (the lead frame 7), the pressing nipple 17 and the nipple 14 are pressed together with the release film 21 to the lead frame 7. By the further clamping action of the molding die 8, the pressing force of the clamping block 14 can be released by the compression of the coil spring 15, and the pressing force of the pressing pin 17 can be increased by driving the actuator 20. The block 19 slides on the lower mold base 11 to release the tip supporting block 18, and the pressing plunger 17 is lowered and released for compression molding.
再者，如第2圖的壓縮成形裝置中，藉由更進一步的夾壓動作，使夾塊14及按壓插梢17以抵接導線架7的狀態壓縮螺旋彈簧15，令按壓插梢17與夾塊14一同退回，進行壓縮成形。 Further, in the compression molding apparatus of Fig. 2, by further nip operation, the clip 14 and the pressing nipple 17 are compressed in a state of abutting against the lead frame 7, and the pressing spigot 17 is pressed. The clamps 14 are retracted together for compression molding.
使用上述壓縮成形方法，可極度抑制昂貴反射體成形用樹脂的廢棄不用樹脂，除了可提高模造樹脂利用率，還可令對被加工物夾壓力的增強，藉由對空腔凹部底部的相對移動加以釋放，壓縮成形，故成形後的被加工物上不會殘留壓痕。再者，與進行轉注成形時相比，壓縮成形不會形成成形品樹脂流道以及澆口，故不需要去除澆口步驟，可簡化製造步驟，且不會發生起因於去除澆口的澆口殘留或被加工物變形。 By using the above-described compression molding method, the resin for discarding the expensive reflector molding resin can be extremely suppressed, and in addition to improving the utilization ratio of the molding resin, the pressure applied to the workpiece can be enhanced by the relative movement of the bottom of the cavity recess. It is released and compressed and formed, so that no indentation remains on the workpiece after molding. Further, since the compression molding does not form the molded resin flow path and the gate as compared with the case of performing the transfer molding, the step of removing the gate is not required, the manufacturing step can be simplified, and the gate resulting from the removal of the gate does not occur. Residual or processed material is deformed.
再者，在壓縮成形步驟中，如第9B圖所示，令空腔凹部16底部相對移動接近導線架7時，亦可令剩餘樹脂由空腔凹部16往溢流空腔27溢出，進行壓縮成形。溢流空腔27係於夾塊14的夾壓面接續著空腔凹部16而形成。溢流空腔27可於形成為矩形的空 腔凹部16之一邊形成多處，亦可於一邊僅形成一處。第9A圖顯示成形後導線架7的平面圖。 Further, in the compression molding step, as shown in Fig. 9B, when the bottom portion of the cavity recess 16 is relatively moved closer to the lead frame 7, the remaining resin may be overflowed from the cavity recess 16 to the overflow cavity 27 for compression. Forming. The overflow cavity 27 is formed by the nip surface of the clamp 14 following the cavity recess 16. The overflow cavity 27 can be formed into a rectangular space One side of the cavity recess 16 is formed in a plurality of places, and only one side can be formed on one side. Fig. 9A shows a plan view of the lead frame 7 after forming.
根據上述步驟，可避免模造樹脂26未填入空腔凹部16，即使模造樹脂26中混入空氣，亦可將該空氣透過溢流空腔27排出，提高成形品質。 According to the above steps, the mold resin 26 can be prevented from being filled into the cavity recessed portion 16, and even if air is mixed into the mold resin 26, the air can be discharged through the overflow cavity 27 to improve the molding quality.
再者，使用如第1圖之壓縮成形裝置時，以成型鑄模8夾壓導線架7時，亦可驅動致動器20，令按壓插梢17推壓導線架7，再以更進一步的夾壓動作驅動致動器20，令按壓插梢17以抵接導線架7的狀態退回。 Further, when the compression molding apparatus as shown in Fig. 1 is used, when the lead frame 7 is pinched by the molding mold 8, the actuator 20 can be driven to push the insertion tip 17 against the lead frame 7, and further clamped The actuator 20 is driven by the pressing operation to retract the pressing lance 17 in a state of abutting against the lead frame 7.
藉此，可調整按壓插梢17對導線架7的夾壓力，使其不過度作用，還可避免裝設發光元件區域產生樹脂溢料。 Thereby, the clamping force of the pressing spigot 17 to the lead frame 7 can be adjusted so as not to excessively act, and the occurrence of resin flashing in the region where the illuminating element is mounted can be avoided.
再者，使用如第2圖之壓縮成形裝置時，以成型鑄模8夾壓導線架7時，亦可令按壓插梢17與夾塊14共同推壓導線架7，以更進一步的夾壓動作，與夾塊共同令按壓插梢17以抵接導線架7的狀態退回。 Further, when the compression molding apparatus according to Fig. 2 is used, when the lead frame 7 is pinched by the molding mold 8, the pressing spigot 17 and the nipple 14 can be pressed together to push the lead frame 7 for further nip operation. Together with the clamp block, the pressing lance 17 is retracted in a state of abutting against the lead frame 7.
藉此，可利用簡易結構令夾塊14和按壓插梢17的昇降動作連動，因不需要專用驅動源等，故可簡化裝置結構。 Thereby, the simple structure can be used to interlock the lifting operation of the clip 14 and the pressing lance 17, and the dedicated drive source or the like is not required, so that the device structure can be simplified.
導線架7形成反射體3之附反射體成形品示於第11A及11B圖。空腔凹部16內除了按壓插梢17所抵接的導線部2(第1導線2a、第2導線2b)，皆為以模造樹脂26形成的成形品。 The reflector of the lead frame 7 forming the reflector 3 is shown in Figs. 11A and 11B. In the cavity recessed portion 16, the lead wire portion 2 (the first lead wire 2a and the second wire 2b) that the pressing tip 17 abuts is a molded article formed of the molded resin 26.
將發光元件1黏著於此第1導線部2a，再進行第1導線部2a和第2導線部2b的引線接合後，該發光元件1係在形成鏡片部4的熱硬化性樹脂進行成形(壓縮成形、轉注成形等)之後，將其切割為個片，製造出如第12A圖之表面實裝型發光裝置。 After the light-emitting element 1 is adhered to the first lead portion 2a and the first lead portion 2a and the second lead portion 2b are wire-bonded, the light-emitting element 1 is molded (compressed) by a thermosetting resin forming the lens portion 4. After forming, transfer molding, etc., it is cut into individual pieces to produce a surface-mounting type light-emitting device as shown in Fig. 12A.
使用前述方法所製造的附反射體成形品，無附著不必要樹脂，成形品不易變形，故成形品質高，可簡化進行在後段製程中與發光元件的黏著、鏡片部的成形、切割等相關製造步驟。 The molded article with a reflector produced by the above method has no unnecessary resin attached, and the molded article is not easily deformed, so that the molding quality is high, and the adhesion to the light-emitting element, the molding of the lens portion, and the cutting can be simplified in the subsequent process. step.
上述成型鑄模係以上模10為定模、下模9為動模，但亦可任意設定上模10和下模9任一者為定模、任一者為動模。再者，上述實施例中說明了被加工物以模造樹脂一次成形，所謂MAP型的製品，但亦適用於發光裝置(LED裝置)個別樹脂成形之矩陣型被加工物。 In the above-described molding die, the upper mold 10 is a fixed mold, and the lower mold 9 is a movable mold. However, any of the upper mold 10 and the lower mold 9 may be arbitrarily set as a fixed mold, and either of them may be a movable mold. Further, in the above-described embodiment, the workpiece is molded in one time by molding resin, and the MAP type product is used. However, the present invention is also applicable to a matrix type workpiece in which a light-emitting device (LED device) is formed by individual resin.
使用上述發光裝置用之反射體的壓縮成形方法以及裝置，可提供一種改善模造樹脂的利用率，不產生樹脂溢料，提高成形品質的發光裝置用之反射體的壓縮成形方法以及裝置。 According to the compression molding method and apparatus for a reflector for a light-emitting device, it is possible to provide a compression molding method and apparatus for a reflector for a light-emitting device which can improve the utilization ratio of the mold resin without causing resin flash and improve the molding quality.
1‧‧‧發光元件 1‧‧‧Lighting elements
2‧‧‧導線部 2‧‧‧Wire section
2a‧‧‧第1導線部 2a‧‧‧1st lead
2b‧‧‧第2導線部 2b‧‧‧2nd wire section
3‧‧‧反射體 3‧‧‧Reflector
4‧‧‧鏡片部 4‧‧‧ lens department
5‧‧‧引線 5‧‧‧Lead
6‧‧‧絶緣構件 6‧‧‧Insulating components
7‧‧‧導線架 7‧‧‧ lead frame
7a‧‧‧導梢孔 7a‧‧‧ Guide hole
8‧‧‧成型鑄模 8‧‧‧Molding mould
9‧‧‧下模 9‧‧‧Down
10‧‧‧上模 10‧‧‧上模
11‧‧‧下模底座 11‧‧‧Mold base
12‧‧‧下模支撐塊 12‧‧‧Mold support block
13‧‧‧下模空腔塊 13‧‧‧Down cavity block
13a‧‧‧凹溝 13a‧‧‧ Groove
13b‧‧‧貫穿孔 13b‧‧‧through holes
13c、13d‧‧‧空氣吸引孔 13c, 13d‧‧‧ air suction holes
14‧‧‧夾塊 14‧‧‧Clamp
14a‧‧‧底部側中空孔 14a‧‧‧Bottom side hollow hole
15‧‧‧螺旋彈簧 15‧‧‧Coil spring
16‧‧‧空腔凹部 16‧‧‧cavity recess
17‧‧‧按壓插梢 17‧‧‧ Pressing the tip
18‧‧‧插梢支撐塊 18‧‧‧Tip support block
19‧‧‧錐狀塊 19‧‧‧Cone
20‧‧‧致動器 20‧‧‧Actuator
21‧‧‧離型膜 21‧‧‧ Release film
22‧‧‧上模底座 22‧‧‧Upper base
23‧‧‧上模模套塊 23‧‧‧Upper mold sleeve
24‧‧‧上模鑲塊 24‧‧‧Upper insert
24a‧‧‧空氣吸引孔 24a‧‧‧Air suction hole
25‧‧‧連結板 25‧‧‧Link board
26‧‧‧模造樹脂 26‧‧‧Molded resin
27‧‧‧溢流空腔 27‧‧‧Overflow cavity
第1圖係第1實施例之相關壓縮成形裝置的剖面說明圖。 Fig. 1 is a cross-sectional explanatory view showing a compression molding apparatus according to a first embodiment.
第2圖係第2實施例之相關壓縮成形裝置的剖面說明圖。 Fig. 2 is a cross-sectional explanatory view showing a compression molding apparatus according to a second embodiment.
第3A~3E圖係圖2的下模零件說明圖。 3A to 3E are explanatory views of the lower mold part of Fig. 2.
第4A及4B圖係顯示壓縮成形方法之成形過程的下模平面圖及鑄模剖面說明圖。 4A and 4B are plan views showing a lower mold and a cross-sectional explanatory view of a molding process of the compression molding method.
第5A及5B圖係接續第4A及4B圖，為顯示壓縮成形方法之成形過程的下模平面圖及鑄模剖面說明圖。 Figs. 5A and 5B are views showing the lower mold and the cross-sectional view of the mold in the forming process of the compression molding method, in conjunction with Figs. 4A and 4B.
第6A及6B圖係接續第5A及5B圖，為顯示壓縮成形方法之成形過程的下模平面圖及下模剖面說明圖。 Figs. 6A and 6B are views showing the lower mold and the lower mold, showing the forming process of the compression molding method, in conjunction with Figs. 5A and 5B.
第7A及7B圖係接續第6A及6B圖，為顯示壓縮成形方法之成形過程的下模平面圖及鑄模剖面說明圖。 Figs. 7A and 7B are views showing the lower mold plane and the mold cross-sectional view showing the forming process of the compression molding method.
第8A及8B圖係接續第7A及7B圖，為顯示壓縮成形方法之成形過程的下模平面圖及鑄模剖面說明圖。 Figs. 8A and 8B are views showing the lower mold plan and the mold cross-sectional view showing the forming process of the compression molding method.
第9A及9B圖係接續與他例相關之成型鑄模結構的下模平面圖及鑄模剖面說明圖。 Figs. 9A and 9B are plan views of the lower mold and a cross-sectional view of the mold, which are connected to the molded mold structure associated with the examples.
第10A及10B圖係導線架的平面圖及側面圖。 Figures 10A and 10B are plan and side views of the lead frame.
第11A及11B圖係壓縮成形後的導線架之平面 圖及側面圖。 Figures 11A and 11B show the plane of the lead frame after compression molding Figure and side view.
第12A~12C圖係LED裝置(發光裝置)的剖面圖、平面圖、右側面圖。 12A to 12C are a cross-sectional view, a plan view, and a right side view of an LED device (light-emitting device).
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| KR101504256B1 (en) * | 2013-12-11 | 2015-03-20 | 주식회사 루멘스홀딩스 | Molding apparatus for light emitting device package |
| JP6298719B2 (en) * | 2014-06-09 | 2018-03-20 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
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