JPWO2015159743A1 - Resin mold and resin molding method - Google Patents

Abstract

It is an object of the present invention to provide a technique capable of improving the production yield of a resin mold product (molded product). As a solution, a resin mold that clamps a work (W) having a mounting component (102) with an upper mold (11) and a lower mold (12), and thermally cures the resin (R) filled in the cavity (C). A workpiece (W) is arranged on the parting surface (11a) of the upper die (11), and a cavity (C) is placed on the parting surface (12a) of the lower die (12). ) Forming a cavity recess (14). A cavity piece (16) is provided at the bottom of the cavity recess (14). The cavity piece (16) includes a clamping piece (20) and a pressure piece (21) provided so as to be relatively movable back and forth in the mold opening / closing direction, and the clamping piece (20) is a mounted component ( 102) is provided so as to clamp the mounting component (102), and the pressurizing piece (21) is provided so as to pressurize the resin (R) without contacting the mounting component (102). .

Description

  The present invention relates to a technique effective when applied to a resin mold and a resin molding method.

  Japanese Unexamined Patent Publication No. 2013-187351 (hereinafter referred to as “Patent Document 1”) describes a technique of resin molding by compression molding on a substrate on which a semiconductor chip is flip-chip bonded. In this technique, the resin mold is performed so that the surface opposite to the substrate side of the semiconductor chip is brought into contact with the inner bottom surface (surface) of the cavity to expose the surface opposite to the substrate.

JP 2013-187351 A

  As a measure for reducing the occurrence of voids and unfilled resin mold parts molded in the cavity, it is conceivable to increase the resin molding pressure in the cavity. In order to increase the resin molding pressure, it is necessary to increase the clamping force of the resin mold so as to withstand the pressure.

  In this regard, the technique described in Patent Document 1 is such that the inner bottom surface (surface) of the cavity and the surface opposite to the substrate side of the semiconductor chip are brought into contact with a substrate (workpiece) on which a plurality of semiconductor chips are flip-chip bonded. Resin molding is performed, and if the clamping force is increased too much, the semiconductor chip may be damaged. On the other hand, if the resin molding pressure is not increased, air is trapped between the flip-chip bonded semiconductor chip and the substrate, and so-called mold underfill (MUF) may not be sufficiently performed. .

  In addition, the technique described in Patent Document 1 (especially, see FIG. 5) is that a resin is supplied to a resin mold mold (inner bottom surface of the cavity) at a predetermined temperature, and then the inner bottom surface of the cavity and the anti-substrate of the semiconductor chip The side surface is brought into contact. It is conceivable that the resin melts and spreads due to the mold temperature before this contact, and the surface opposite to the substrate of the semiconductor chip cannot be reliably exposed, and flash (resin burr) may occur.

  Further, in the technique described in Patent Document 1, if there is a height variation among a plurality of semiconductor chips flip-chip bonded to a substrate, it becomes difficult to absorb the difference in height for each chip. Specifically, even if the semiconductor chip with a high height is in contact with the inner bottom surface of the cavity and the surface opposite to the substrate is exposed, the clamping force is too weak with the semiconductor chip with a low height, and flashing occurs. There is a risk. On the other hand, even if the semiconductor chip with a low height can contact the inner bottom surface of the cavity to expose the surface opposite to the substrate, the semiconductor chip with a high height is too strong to damage the semiconductor chip. There is a risk that.

  A resin molded product (molded product) in which a semiconductor chip is damaged does not operate as a product and is handled as a defective product. In addition, a resin mold product having a void in the resin mold part cannot sufficiently protect the semiconductor chip and is treated as a defective product. In other words, the production yield of the resin mold product is reduced.

  Moreover, in the resin mold product in which the flash has occurred, for example, the connectivity of the heat sink to the side opposite to the substrate of the semiconductor chip is degraded. In such a case, the resin mold product is treated as a defective product, and its manufacturing yield is reduced, or the flash removal process is required, and the manufacturing cost is increased.

  The objective of this invention is providing the technique which can improve the manufacture yield of a resin mold product. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The resin mold mold according to an embodiment of the present invention is a resin mold mold that clamps a workpiece having mounting parts with one mold and the other mold and thermally cures the resin filled in the cavity. The workpiece is arranged on the parting surface of the mold, and a cavity concave part that constitutes the cavity is provided on the parting surface of the other mold, and a cavity piece is formed at the bottom of the cavity concave part. The cavity piece includes a first piece and a second piece that are provided so as to be relatively movable back and forth in the mold opening and closing direction, and the first piece abuts the mounting component to It is provided to clamp, and the second piece is provided so as to pressurize the resin without coming into contact with the mounting component.

  According to this, since the cavity piece is divided into the first piece for clamping the mounted component and the second piece for pressing and compressing (pressing) the resin, for example, the damage of the mounted component is prevented. However, the occurrence of flash can be prevented. Therefore, the production yield of the resin mold product can be improved.

  In the resin mold according to the embodiment, the second piece is fixedly assembled to the support block of the other die, and the plurality of first pieces are inserted into the second piece, respectively. A plurality of through-holes for a piece are formed, and the first piece is formed in the support block via an elastic member so that the plurality of first pieces are provided independently in each of the plurality of through-holes for the piece. More preferably, it is assembled.

  According to this, even when the workpiece has a plurality of mounted components, for example, it is possible to prevent the occurrence of flash while preventing damage to each mounted component.

  In the resin mold according to the embodiment, the first piece is formed with a protrusion protruding in a curved shape from the end surface along an outer peripheral edge of the end surface that contacts the mounting component, and the other mold is formed. More preferably, a film is provided on the parting surface of the mold, and the first piece is in contact with the mounting component via the film.

  According to this, it is possible to prevent the occurrence of a resin burr formed by the resin entering the boundary between the first piece and the second piece by the film, or to prevent the first and second pieces from moving forward and backward. be able to. Moreover, a film tear can be prevented by making the outer peripheral edge part of a 1st piece into a curved surface shape (round chamfering). Moreover, although the peripheral groove corresponding to a projection part is formed in the resin mold part by making the outer peripheral edge part of a 1st piece into a curved-surface-like projection part, for example, using a heat sink with a flat connection surface In addition, the surface of the mounted component on the side opposite to the substrate and the surface of the resin mold portion can be brought into contact and connected.

  A resin molding method according to an embodiment of the present invention is a resin molding method in which a workpiece having a mounting component is clamped with one and the other molds, and the resin filled in the cavity is thermally cured. Providing a resin mold mold comprising one mold and the other mold having a cavity piece provided at the bottom of a cavity recess that constitutes the cavity; and (b) a party of the one mold. (C) a step of placing the workpiece on the mold surface such that the other mold side is the mounting component; (c) supplying the resin to the bottom of the cavity recess or to the workpiece; ) Using the cavity piece provided with first and second pieces that are provided so as to be relatively movable back and forth in the mold opening and closing direction, the first piece is brought into contact with the mounting component. After clamping the mounting component, the second piece is moved relative to the first piece, and the resin is pressurized without contacting the mounting component to fill the cavity with the resin. And a step of allowing

  According to this, since the cavity piece is divided into the first piece that clamps the mounting component and the second piece that presses and compresses (pressurizes) the resin, the breakage of the mounting component is prevented, for example. However, the occurrence of flash can be prevented. Therefore, the production yield of the resin mold product can be improved.

  In the resin molding method according to the embodiment, in the step (a), the second piece is fixedly assembled to the support block of the other mold, and the second piece includes a plurality of the first pieces. A plurality of through-holes for the respective pieces to be inserted are formed, and the first piece has an elastic member so that each of the plurality of first through-pieces is provided independently in each of the plurality of through-holes for the piece. The resin mold mold provided with the other mold assembled to the support block is prepared, and in the step (b), the work having a plurality of the mounting parts is arranged in the one mold. In the step (d), it is more preferable that the plurality of first pieces are brought into contact with each of the plurality of mounting components.

  According to this, even when the workpiece has a plurality of mounted components, for example, it is possible to prevent the occurrence of flash while preventing damage to each mounted component.

  In the resin molding method according to the embodiment, in the step (a), the plurality of first pieces are arranged in a matrix shape, and an air vent groove communicating with the outside from the cavity recess is provided on the parting surface. The resin mold die provided with the other die is prepared, and in the step (b), the work in which a plurality of the mounting parts are arranged in a matrix is arranged in the one die, c) In the step, when preparing the rod-shaped resin and supplying the resin to the bottom of the cavity recess so as to be parallel to the extending direction of the air vent groove, between the plurality of the first pieces, When supplying the resin to the workpiece, it is more preferable to dispose the resin between a plurality of the mounted components.

  According to this, since the air in the cavity is pressed by the flow front of the resin melted in the cavity and easily discharged to the outside through the air vent groove, it is possible to prevent the air from being trapped.

  Further, in the resin molding method according to the one embodiment, in the step (a), the plurality of first pieces are arranged and arranged, and an air vent groove communicating with the outside from the cavity recess is provided on the parting surface. The resin mold mold provided with the other mold is prepared, and in the step (b), the work in which a plurality of the mounting components are arranged is arranged in the one mold, and the ( In the step c), a plate having a plurality of through holes formed in alignment and a groove formed in communication with each through hole so as to extend in one direction over the plurality of through holes. When the resin is supplied to the bottom of the cavity recess so that the direction in which the air vent groove extends and the one direction in which the groove extends are parallel to each other, a plurality of the through holes are provided. Multiple fronts in each of the holes A first frame disposed, when supplying the resin to the work it is more preferable to dispose a plurality of the mounting part to each of the plurality of the through-hole.

  According to this, since the groove | channel provided in plate-shaped resin acts as an air vent within a cavity, it can prevent that air is trapped.

  In another embodiment of the present invention, the resin molding method clamps a workpiece having a mounting component flip-chip mounted on a mounting surface of a substrate with one and the other molds, and thermosets the resin filled in the cavity. (A) a step of preparing a resin mold mold including the one mold and the other mold having a cavity piece provided at the bottom of a cavity recess constituting the cavity. And (b) a step of placing the workpiece on the parting surface of the one mold so that the other mold side becomes the mounting part, and (c) a relatively movable in the mold opening / closing direction. Using the cavity piece provided with the first and second pieces provided in a divided manner, and abutting the first piece against the mounting component to clamp the mounting component; ) After the step (c), the step of injecting the resin into the cavity and filling the cavity including the space between the substrate and the mounting component with the resin; (e) the step (d) Later, the second piece is moved relative to the first piece so that the end face of the second piece and the surface opposite to the substrate of the mounting component are horizontal, and the cavity is filled. And pressurizing the resin.

  According to this, the resin can be filled even in a narrow space between the substrate and the mounted component. Therefore, the production yield of the resin mold product can be improved.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to the resin mold in one embodiment of the present invention, the production yield of resin mold products can be improved.

It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement in Embodiment 1 of this invention. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the principal part of the resin mold metal mold | die of the state shown in FIG. It is sectional drawing which shows typically the principal part of the resin mold metal mold | die of the state shown in FIG. It is a perspective view which shows typically the principal part of a metal mold | die provided with a cavity piece. It is sectional drawing which shows typically the resin mold product in Embodiment 1 of this invention. It is a figure for demonstrating the shape of resin supplied to a resin mold metal mold | die. It is a figure for demonstrating the shape of resin supplied to a resin mold metal mold | die. It is a figure for demonstrating the shape of resin supplied to a resin mold metal mold | die. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement in Embodiment 2 of this invention. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement in Embodiment 3 of this invention. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. FIG. 20 is a cross-sectional view schematically showing a resin mold in operation following FIG. 19. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is a figure for demonstrating the modification of a workpiece | work. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement in Embodiment 4 of this invention. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement in Embodiment 5 of this invention. It is sectional drawing which shows typically the resin mold metal mold | die in the operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. FIG. 30 is a cross-sectional view schematically showing a resin mold during operation following FIG. 29. It is sectional drawing which shows typically the resin mold metal mold | die in operation | movement following FIG. FIG. 32 is a cross-sectional view schematically showing the resin mold in operation following FIG. 31.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

  In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin mold 10 (resin mold mechanism) corresponding to compression molding in the present embodiment will be described with reference to FIGS. 1-5 is sectional drawing which shows typically the resin mold metal mold 10 in operation | movement (during a manufacturing process). 6 and 7 are cross-sectional views schematically showing the main part of the resin mold 10 in the state shown in FIGS. 2 and 5, respectively. FIG. 8 is a perspective view schematically showing a main part of a mold (lower mold 12) including the cavity piece 16. As shown in FIG. Moreover, FIG. 9 is sectional drawing which shows typically the resin mold product 100 formed by dividing a molded article into pieces.

  As shown in FIG. 1, the resin mold 10 includes a pair of molds (one and the other mold), and is configured to be openable and closable by contact and separation. In the present embodiment, one mold is the upper mold 11 and the other mold is the lower mold 12. In the resin mold 10, the work W is clamped by the upper mold 11 and the lower mold 12 to form a cavity C (see FIG. 5), and the resin R filled in the cavity C is heated with the pressure maintained. A process for producing (forming) a molded product (resin molded product 100) by curing is performed. The resin mold 10 is provided with a heater (not shown) so that the resin mold 10 can be heated to a predetermined temperature (for example, 180 ° C.).

  A workpiece W to be processed by the resin mold 10 includes a substrate 101 (for example, a wiring substrate) and a mounting component 102 (for example, a chip component such as a semiconductor chip). In the present embodiment, a plurality of mounting components 102 are arranged in a matrix and are flip-chip mounted on the substrate 101 via bumps 103.

  When the molded product is singulated into the resin molded product 100 (see FIG. 9), the workpiece W has a back surface 102b (anti-substrate side surface) opposite to the main surface 102a (substrate side surface) on the substrate 101 side. The other surface (main surface 102a, side surface) is exposed and covered with the resin mold part 104. That is, the back surface 102b of the mounting component 102 is clamped as a clamp surface, and the main surface 102a and the side surface of the mounting component are resin-molded in the cavity C.

  In the resin mold 10, a known press mechanism (not shown) is used for opening and closing the mold and pressurizing (pressing) the resin R in the cavity C. The resin mold 10 may be configured such that the upper mold 11 is a fixed mold, the lower mold 12 is a movable mold, and the mold can be opened and closed by a press mechanism, or the upper mold 11 is a movable mold and the lower mold 12 is a fixed mold. The upper mold 11 and the lower mold 12 may be movable.

  In the resin mold 10, as shown in FIG. 1, a work placement portion 13 in which a work W is placed on the upper die 11 is provided. The workpiece placement unit 13 is provided so as to be recessed from the parting surface 11a of the upper mold 11, and is configured to suck and hold the workpiece W from the substrate 101 side through a suction path (not shown).

  In the resin mold 10, the lower mold 12 is provided with a cavity concave portion 14 that constitutes a cavity C. The cavity recess 14 is provided so as to be recessed from the parting surface 12 a of the lower mold 12. On the parting surface 12a of the lower mold 12 including the inner surface of the cavity recess 14, a release film F (hereinafter also simply referred to as “film”) shown in FIG. In FIG. 1 to FIG. 5, as an example, a description is given assuming that the film F is omitted. In addition, although it is preferable to use the film F from the viewpoint of prevention of resin leakage and chip exposure described later, it is not always necessary.

  As shown in FIGS. 5 and 8, the lower mold 12 includes a clamper block 15 that forms the side of the cavity recess 14, a cavity piece 16 that forms the bottom of the cavity recess 14, and the clamper block 15 and the cavity piece 16. And a support block 17 for supporting.

  The clamper block 15 is assembled to the support block 17 via an elastic member 18 (for example, a spring), and is provided so as to be movable back and forth in the mold opening and closing direction. A through hole 15 a is formed in the clamper block 15, and an inner wall surface of the through hole 15 a becomes an inner side surface of the cavity recess 14. A cavity piece 16 is inserted into the through hole 15 a of the clamper block 15, and the end face of the cavity piece 16 becomes the inner bottom surface of the cavity recess 14.

  Further, an air vent groove 19 communicating from the cavity recess 14 to the outside may be provided on the end surface of the clamper block 15 (parting surface 12a of the lower mold 12) (see FIG. 8). The air vent groove 19 is connected to communicate with a suction mechanism (for example, a vacuum pump) provided outside.

  The cavity piece 16 includes a clamping piece 20 and a pressure piece 21 that are provided so as to be relatively movable in the mold opening / closing direction. The clamping piece 20 is provided at a position corresponding to the arrangement of the mounting component 102 and is provided so as to abut the back surface 102b of the mounting component 102 and clamp the mounting component 102. Further, the pressing piece 21 is provided so as to press and compress (pressurize) the resin R without contacting the mounting component 102. As described above, the cavity piece 16 is divided into an area for clamping the mounting component 102 and an area for pressurizing the resin R.

  A plurality of through-holes 21a for inserting a plurality of clamp pieces 20 are arranged in the pressurizing piece 21 so as to be arranged in a matrix (see FIG. 8). The plurality of clamping pieces 20 are respectively provided via the plurality of elastic members 22 (for example, springs) so that the plurality of clamping pieces 20 are independently provided in each of the plurality of piece through holes 21a. It is assembled to. For this reason, the plurality of clamping pieces 20 are also arranged in a matrix at the bottom of the cavity recess 14.

  As shown in FIG. 1, when the mold is opened, the clamping piece 20 is supported by the elastic member 22 so that the clamping piece 20 protrudes from the bottom of the cavity recess 14. That is, the end surface 20a (upper surface) of the clamping piece 20 is located on the upper mold 11 side with respect to the end surface 21b (upper surface) of the pressing piece 21. The end surface (upper surface) of the clamper block 15 is also located on the upper mold 11 side with respect to the end surface 21b of the pressing piece 21.

  In the present embodiment, the end surface 20a of the clamping piece 20 is wider than the back surface 102b of the mounting component 102, for example, has a rectangular shape in plan view (see FIG. 8). And the protrusion 20b which protrudes in the cross-sectional curved surface shape from the end surface 20a is formed in the clamp piece 20 along the outer peripheral edge part of the end surface 20a (refer FIG. 6, FIG. 7).

  Since the outer peripheral edge of the end face 20a of the clamp piece 20 is rounded without being squared by the curved projection 20b, the film F is stretched on the parting surface 12a of the lower mold 12. However, it is possible to prevent the film F from being torn. Even if the film F is not used, the protrusion 20b may not be provided if there is little influence on the occurrence of resin burrs and the advance / retreat of the clamping piece 20 and the pressing piece 21.

  Further, by forming the outer peripheral edge of the clamp piece 20 as a curved projection 20b, a circumferential groove 104a corresponding to the projection 20b is formed in the resin mold 104 as shown in FIG. Since such a circumferential groove 104a is formed, for example, the resin mold portion 104 that is outside the circumferential groove 104a is used as a stiffener, and the heat sink 105 is brought into contact with the back surface 102b of the mounting component 102, for example. The outer periphery of the heat sink 105 can be supported by the surface of the mold part 104. On the other hand, for example, the film F can be prevented from being broken by simply chamfering the clamping piece 20 without protruding like the protruding portion 20b. In this case, the resin mold portion 104 is positioned at the circumferential groove 104a. Since protrusions are formed, it becomes difficult to hold the heat sink 105. On the other hand, by providing the projecting portion 20b having a curved cross section, for example, a mounting member such as the heat sink 105 can be easily supported. In addition to the heat sink such as the heat sink 105, a shield plate or a wiring board can be used as the mounting member. Further, the mounting member can be a wavelength conversion member capable of wavelength conversion by using, for example, a plate-like member containing or coated with a phosphor.

  As described above, in the resin mold 10, the cavity piece 16 is in contact with the back surface 102 b of the mounting part 102 to clamp the mounting part 102 (clamping piece 20), and the resin R is pressed and compressed (pressurized). ) Function (pressing piece 21) is divided and made independent. Since each function acts independently, for example, it is possible to prevent the occurrence of flash and pressurize the resin R while clamping the mounting component 102 with an appropriate pressure by preventing the mounting component 102 from being damaged. That is, it is possible to improve the production yield of a molded product (resin molded product 100) that is resin molded using the resin mold 10.

  Next, the operation (resin molding method) of the resin mold 10 in this embodiment will be described. Here, a case where the above-described resin mold 10 is prepared and a molded product (resin molded product 100) is manufactured by compression molding using the mold 10 will be described.

  First, as shown in FIG. 1, in the state where the resin mold 10 is opened, in the upper mold 11, the workpiece W is placed on the parting surface 11a (work placement portion 13) so that the lower mold 12 side becomes the mounting component 102. ) Placed (supplied). On the other hand, in the lower mold 12, after a film F (see FIG. 6) is stretched on the parting surface 12 a including the inner surface of the cavity recess 14, the resin R is supplied to the bottom of the cavity recess 14 via the film F.

  Specifically, in the upper mold 11, the work W is conveyed to the parting surface 11 a of the upper mold 11 by a loader (not shown), and the work W is arranged on the work arrangement unit 13. The workpiece W is adsorbed and held by a known suction mechanism (for example, a vacuum pump) using a suction path (not shown) formed in the upper mold 11 and disposed on the parting surface 11a.

  Moreover, in the lower mold | type 12, the film F is provided so that it may be drawn out from the delivery roll wound up by roll shape, may pass through the parting surface 12a of the lower mold | type 12, and may be wound up by the winding roll. This film F has heat resistance that can withstand the heating temperature of the resin mold 10 and is easily peeled off from the parting surface 12a of the lower mold 12, and is a film material having flexibility and extensibility. is there. As the film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.

  As shown in FIG. 6, the film F is, for example, a known suction mechanism (for example, a vacuum) using a gap G <b> 1 between the clamping piece 20 and the pressing piece 21 or a suction path G <b> 2 formed in the clamping piece 20. It is adsorbed and held by a pump) and stretched on the parting surface 12a. By providing the film F in this way, the occurrence of a resin burr formed by the resin R entering the boundary (gap G1) between the clamping piece 20 and the pressing piece 21 can be prevented, or the clamping piece 20 and the pressing piece 21 can be prevented. It is possible to prevent the relative advance and retreat of the camera from becoming impossible.

  Further, a resin R (for example, granular, powdery or liquid mold resin) is conveyed to the parting surface 12a of the lower mold 12 by a loader (not shown), and resin is applied to the end surface 21b of the pressurizing piece 21 at the bottom of the cavity recess 14. R is supplied. Since the resin mold 10 is heated to a predetermined temperature by the built-in heater, the resin R is melted from a position in contact with the bottom of the cavity recess 14.

  Subsequently, as shown in FIG. 2, the upper mold 11 and the lower mold 12 of the resin mold 10 are closed close to each other, and the clamping piece 20 is attached to the back surface 102 b of the mounting component 102 via the film F. To clamp the mounting component 102.

  Specifically, since the end face of the clamping piece 20 is positioned on the upper mold 11 side with respect to the end face 21b of the pressing piece 21, the mounted component 102 is clamped first when the mold is closed. In the cavity piece 16, the clamping piece 20 and the pressure piece 21 are divided so as to be relatively movable back and forth in the mold opening / closing direction. Therefore, the mounting part 102 is prevented from being damaged and mounted with an appropriate pressure. Is clamped.

  Moreover, in this embodiment, the some clamp piece 20 is each assembled | attached to the support block 17 via the some elastic member 22 so that the some clamp piece 20 may be provided independently, respectively. For this reason, even if there is a variation between the respective heights of the plurality of mounting components 102 mounted on the substrate 101, they are absorbed and the end surface 20a of the clamping piece 20 and the back surface 102b of the mounting component 102 are respectively detected. And the mounting component 102 are clamped, and variations are absorbed.

  Subsequently, as shown in FIG. 3, the resin mold 10 is further closed, and the end surface of the clamper block 15 is brought into contact with the mounting surface 101 a of the substrate 101 through the film F so that the substrate 101 (work W ) Is clamped. At this time, since the elastic member 22 is compressed, the clamping force of the clamping piece 20 on the mounting component 102 is arbitrarily adjusted.

  As a result, a cavity C is formed as a space surrounded by the cavity recess 14 and the mounting surface 101 a of the substrate 101. At this time, the inside of the cavity C is depressurized through the air vent groove 19 (see FIG. 8).

  Subsequently, as shown in FIG. 4, the resin mold die 10 is further closed, and the pressurizing piece 21 is moved relative to the clamping piece 20 to start pressurizing the resin R. Subsequently, as shown in FIG. 5, the resin mold 10 is further closed, and the final position where the end surface 20 a of the clamping piece 20 and the end surface 21 b of the pressing piece 21 become horizontal (see FIG. 7). The pressure piece 21 is moved relative to the clamping piece 20 so that The resin R is pressurized by the movement of the pressing piece 21 so that the cavity C is filled with the resin R. At this time, a narrow portion such as between the substrate 101 and the mounting component 102 is also filled with the resin R (mold underfill).

  Next, the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby the workpiece W becomes a molded product. Thereafter, the molded product is separated into individual pieces, whereby a resin molded product 100 having a resin mold portion 104 (resin R) as shown in FIG. 9 is substantially completed.

  As described above, in the resin mold 10, in the cavity piece 16, the clamp piece 20 that clamps the mounting component 102 and the pressure piece 21 that presses and compresses (presses) the resin R in the mold opening / closing direction. It is divided so that it can move forward and backward. For this reason, for example, it is possible to press the resin R while preventing the breakage of the mounting component 102 and clamping the mounting component 102 with an appropriate pressure while preventing the occurrence of flashing on the back surface 102b of the mounting component 102. Therefore, according to the resin mold 10 in the present embodiment, the manufacturing yield of the resin molded product 100 can be improved, and the manufacturing cost can be reduced by eliminating the need for flash removal.

  In the present embodiment, the case where the shape of the resin R is, for example, granular, powdery, or liquid is described. However, the present invention is not limited to this, and the shape of the resin R is a rod shape (see FIG. 10). A plate-like (see FIGS. 11 and 12) may be prepared and supplied to the resin mold 10. By making the shape of the resin R into a rod shape or a plate shape, handling becomes easy, and conveyance with a loader becomes easy.

  For example, as shown in FIG. 10, when using a rod-shaped resin R, the resin R is placed between the clamping pieces 20 at the bottom of the cavity recess 14 so as to be parallel to the direction in which the air vent groove 19 extends. Supply to place. That is, the rod-shaped resin R is arranged along the direction in which the resin R and the air flow.

  According to this, it is possible to prevent the air in the cavity C from being surrounded by the resin R melted in the cavity C and becoming difficult to be discharged outside by the air vent groove 19, and the air is trapped. It is possible to prevent the generation of voids and improve the production yield of the resin molded product 100. Further, the shape of the rod-shaped resin R may be straight, but as shown in FIG. 10, the central portion is made high and thick, and the tip portion on the air vent groove 19 side is made low and thin, so that the central portion The resin R can also flow more easily from the outer side (air vent groove 19 side).

  For example, as shown in FIGS. 11 and 12, a plate-like resin R can be used. The plate-shaped resin R communicates with each of the through holes 30 so as to extend in one direction across the plurality of through holes 30 and the plurality of through holes 30 arranged in a matrix, for example. It is formed into a tablet so as to have a groove 31 formed.

  When the plate-shaped resin R is used, each of the plurality of through holes 30 is formed at the bottom of the cavity recess 14 so that the direction in which the air vent groove 19 extends and the one direction in which the groove 31 extends are parallel to each other. A plurality of clamping pieces 20 are supplied so as to be arranged.

  According to this, since the groove | channel 31 provided in plate-shaped resin R acts as an air vent in the cavity C, it can prevent that air is trapped. Further, as shown in FIG. 11, the plate-like resin R can have the same thickness at the central portion and the outer peripheral portion, but as shown in FIG. 12, the height is varied in the air flow direction. In addition, by increasing the central portion and lowering the outer peripheral portion on the air vent groove 19 side, the resin R can easily flow from the central portion to the air vent groove 19 side, and air can be further prevented from being trapped. Therefore, the production yield of the resin mold product 100 can be improved.

(Embodiment 2)
In the embodiment, the case where the cavity recess 14 is provided in the lower mold 12 has been described. In the present embodiment, the case where the cavity recess 14 is provided in the upper mold 11 will be described with reference to FIGS. 13 to 16. 13 to 16 are cross-sectional views schematically showing the resin mold 10A during operation (during the manufacturing process) in the present embodiment. In addition, about the structure of 10 A of resin molds, since the structure of the resin mold metal mold 10 in the said Embodiment 1 was replaced upside down, description is abbreviate | omitted.

  The operation (resin molding method) of the resin mold 10 in this embodiment will be described. Here, a case where a resin mold mold 10A is prepared and a molded product (resin mold product 100) is manufactured by compression molding using the mold 10A will be described.

  First, in the state where the resin mold 10A is opened, in the lower mold 12, the workpiece W is arranged (supplied) on the parting surface 12a (work arrangement portion 13) so that the upper mold 11 side becomes the mounting component 102. Thereafter, the resin R is supplied onto the substrate 101. On the other hand, in the upper mold 11, a film F (see FIG. 6) is stretched on the parting surface 11 a including the inner surface of the cavity recess 14.

  Subsequently, as shown in FIG. 13, the resin mold 10 </ b> A is closed, and the clamping piece 20 is brought into contact with the back surface 102 b of the mounting component 102 via the film F to clamp the mounting component 102. In the cavity piece 16, the clamping piece 20 and the pressure piece 21 are divided so as to be relatively movable in the mold opening / closing direction, so that the mounting part 102 is prevented from being damaged and the mounting part 102 is clamped. .

  Subsequently, as shown in FIG. 14, the resin mold 10 </ b> A is further closed, and the end surface of the clamper block 15 is brought into contact with the mounting surface 101 a of the substrate 101 through the film F so that the substrate 101 (work W ) Is clamped. As a result, a cavity C is formed as a space surrounded by the cavity recess 14 and the mounting surface 101 a of the substrate 101. At this time, the inside of the cavity C is depressurized through the air vent groove 19 (see FIG. 8).

  Subsequently, as shown in FIG. 15, the resin mold 10 </ b> A is further closed, and the pressurizing piece 21 is moved relative to the clamping piece 20 to start pressurizing the resin R.

  Subsequently, as shown in FIG. 16, the resin mold 10 </ b> A is further closed, and the pressing piece 21 is moved relative to the clamping piece 20. The resin R is pressurized by the movement of the pressurizing piece 21 to fill the cavity C with the resin R. At this time, a narrow portion such as between the substrate 101 and the mounting component 102 is also filled with the resin R (mold underfill).

  Next, the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby the workpiece W becomes a molded product. Thereafter, the molded product is separated into individual pieces, whereby a resin molded product 100 having a resin mold portion 104 (resin R) as shown in FIG. 9 is substantially completed. Also in this embodiment, the same effects as those of the first embodiment can be obtained. According to the resin mold die 10A, the manufacturing yield of the resin mold product 100 is improved, and the flash removal is not required, thereby reducing the manufacturing cost. be able to.

  In addition, as resin R, the shape can use the thing of rod shape (refer FIG. 10) and plate shape (refer FIG. 11, FIG. 12) other than a granular form, a powder form, or a liquid form, for example. . When the rod-shaped resin R is used, the resin R can be supplied so as to be disposed between the plurality of mounted components 102 on the substrate 101 so as to be parallel to the extending direction of the air vent groove 19. Further, in the case where the plate-like resin R is used, each of the plurality of through holes 30 is formed on the substrate 101 so that the direction in which the air vent groove 19 extends and the one direction in which the groove 31 extends are parallel to each other. It is also possible to supply a plurality of mounting components 102 so as to be arranged.

(Embodiment 3)
In the first and second embodiments, the resin mold dies 10 and 10A corresponding to compression molding have been described. In the present embodiment, a resin mold 10B corresponding to TCM (Transfer Compression Mold) that performs compression molding with the cavity piece 16 after injecting and filling the resin R into the cavity C by transfer, see FIGS. To explain. FIGS. 17-21 is sectional drawing which shows typically the resin mold 10B in operation | movement (during a manufacturing process) in this embodiment.

  The resin mold die 10B includes a pair of dies (upper die 11 and lower die 12). In the resin mold 10B, the cavity C is formed by clamping the workpiece W with the upper mold 11 and the lower mold 12, and the resin R filled in the cavity C is thermally cured in a state where the pressure is maintained, and a molded product ( A process for manufacturing (forming) a resin molded product 100) is performed.

  In the resin mold 10 </ b> B, a known transfer mechanism is used for the process of pressure-feeding (injecting) the resin into the cavity C through a resin path communicating with the cavity C. In addition, a known press mechanism is used for the process of opening and closing the resin mold 10B and pressing it to the molding pressure.

  The lower mold 12 is provided with a work placement unit 13 in which a pot (not shown) and a work W are placed. Further, the upper die 11 is provided with a cavity (not shown), a runner gate 23, and a cavity recess 14 constituting the cavity C. In the opened state, the film F (see FIG. 6) is stretched on the parting surface 11a of the upper mold 11 including the inner surface of the cavity recess 14. When the mold is closed (clamped), the cavity C including the cavity recess 14 is formed, and the communication path including the pot, the cull, and the runner gate 23 is connected to the cavity C. (Resin passage) is formed. In FIGS. 17 to 21, the film F is omitted for clarity of explanation.

  As in the first and second embodiments, a cavity piece 16 is provided at the bottom of the cavity recess 14. The cavity piece 16 includes a clamp piece 20 and a pressure piece 21 that are provided so as to be relatively movable in the mold opening / closing direction. Further, the clamping piece 20 is provided so as to abut the mounting component 102 and clamp the mounting component 102. Further, the pressure piece 21 is provided so as to pressurize the resin R without coming into contact with the mounting component 102.

  In the present embodiment, the projection 20b described with reference to FIG. 6 is not provided, but the projection 20b may be provided. When the protrusion 20b is provided in the TCM resin mold 10B, the load from the pressurizing piece 21 is likely to be applied to the film F. Therefore, along the outer peripheral edge of the end surface 21b of the pressurizing piece 21, It is conceivable to provide a protruding portion that protrudes in a curved shape from the end surface 21b.

  Next, the operation (resin molding method) of the resin mold 10B in this embodiment will be described. Here, a case where the above-described resin mold 10B is prepared and a molded product (resin mold product 100) is manufactured by TCM using the mold 10B will be described.

  First, in a state where the resin mold 10B is opened, in the lower mold 12, the workpiece W is arranged on the parting surface 12a (work arrangement portion 13) so that the upper mold 11 side becomes the mounting component 102, and is placed in the pot. Resin R (for example, tablet, granule, powder or liquid mold resin) is supplied. On the other hand, in the upper mold 11, a film F (see FIG. 6) is stretched on the parting surface 11 a including the inner surface of the cavity recess 14.

  Subsequently, as shown in FIG. 17, the resin mold 10 </ b> B is closed, the mounting component 102 is clamped by the clamping piece 20 via the film F, and the clamper block 15 is clamped via the film F. The substrate 101 (work W) is clamped. In this substrate clamping position, the position of the end surface 21 b of the pressing piece 21 can be horizontal with the end surface 20 a of the clamping piece 20. At this time, a cavity C is formed as a space surrounded by the cavity recess 14 and the mounting surface 101 a of the substrate 101. At this time, the inside of the cavity C is depressurized through the air vent groove 19 (see FIG. 8).

  Subsequently, as shown in FIG. 18, the mold of the resin mold 10B is further closed, and the end face 21b of the pressing piece 21 exceeds the back face 102b of the mounting component 102, and the end face 21b of the pressing piece 21 is mounted. The pressing piece 21 is moved relative to the clamping piece 20 so that the main surface 102a of the component 102 is horizontal. Since the end surface 21b of the pressure piece 21 and the main surface 102a of the mounting component 102 are horizontal (underfill position), mold underfill is facilitated. Specifically, the resin R can be preferentially filled between the substrate 101 and the mounting component 102 as compared with the case where the pressing piece 21 is positioned as shown in FIG.

  Subsequently, as illustrated in FIG. 19, the resin R is injected into the cavity C, and the cavity C including a narrow portion between the substrate 101 and the mounting component 102 is filled with the resin R.

  Specifically, the plunger provided in the pot of the lower mold 12 so as to be movable back and forth is advanced to the cull side (upper mold 11 side), and the resin R melted in the pot is moved by the plunger (tip portion). Press. The resin R pressed by the plunger enters the cavity C through the cal, runner gate 23. That is, the resin R is injected into the cavity C. Then, the plunger is further advanced toward the cull side to inject (pressure feed) the resin R into the cavity C, and the cavity C is filled with the resin R. At this time, since the end surface 21b of the pressing piece 21 is in the underfill position, the narrow portion between the substrate 101 and the mounting component 102 can be easily filled with the resin R.

  Next, as shown in FIG. 20, the upper mold 11 and the lower mold 12 of the resin mold 10B are separated from each other with the mold closed, and the end face 21b of the pressurizing piece 21 attaches the back face 102b of the mounted component 102. The pressurizing piece 21 is moved relative to the clamping piece 20 so as to retreat from the inner bottom surface of the cavity recess 14. At the position of the end face 21b of the pressing piece 21, the amount of the resin R filled in the cavity C is maximized (maximum filling position).

  Subsequently, as shown in FIG. 21, the pressing piece 21 is relatively positioned with respect to the clamping piece 20 so that the end face 21 b of the pressing piece 21 and the back surface 102 b of the mounting component 102 are horizontal (molding position). To pressurize the resin R filled in the cavity C.

  Next, the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby the workpiece W becomes a molded product. Thereafter, the molded product is separated into individual pieces, whereby a resin molded product 100 having a resin mold portion 104 (resin R) as shown in FIG. 9 is substantially completed. Also in this embodiment, the same effects as those of the first and second embodiments can be obtained. According to the resin mold 10B, the production yield of the resin mold product 100 is improved, and the flash removal is not required and the production cost is reduced. Can be reduced.

  In the present embodiment, when the end face 21b of the pressure piece 21 is in the underfill position (see FIG. 19), the resin R is filled in the cavity C including the narrow portion between the substrate 101 and the mounting component 102. Explained the case of starting. Not limited to this, when the end face 21b of the pressure piece 21 is at the maximum filling position (see FIG. 20), filling of the resin R into the cavity C is started, and then the underfill position (see FIG. 19) is formed. Even if the pressing piece 21 is moved relative to the clamping piece 20 in order to the position (see FIG. 21), the same effect can be obtained.

(Embodiment 4)
A resin mold 10C (resin mold mechanism) corresponding to compression molding in Embodiment 4 of the present invention will be described with reference to FIGS. 23 and 24 are cross-sectional views schematically showing the resin mold 10C in operation (during the manufacturing process). The resin mold 10C is different from the resin mold 10 shown in the first embodiment in that a wedge mechanism for the clamping piece 20 is provided. Other configurations are the same as those shown in the first embodiment, and thus the description thereof may be omitted.

  Similar to the resin mold 10 shown in the first embodiment, a cavity piece 16 is provided at the bottom of the cavity recess 14 in the resin mold 10C. The cavity piece 16 includes a clamp piece 20 and a pressure piece 21 that are provided so as to be relatively movable in the mold opening / closing direction. The clamping piece 20 is provided at a position corresponding to the mounting component 102 disposed on the parting surface 11 a of the upper mold 11, and is provided so as to contact the back surface 102 b of the mounting component 102 and clamp the mounting component 102. Yes. The pressurizing piece 21 is provided so as to press and compress (pressurize) the resin R without coming into contact with the mounting component 102, and a plurality of pieces penetrating through each of which the plurality of clamping pieces 20 are inserted. The holes 21a are formed so as to be arranged in a matrix (see FIG. 8). The plurality of clamping pieces 20 are supported via a plurality of elastic members 22 (for example, springs) so that the plurality of clamping pieces 20 are independently provided in each of the plurality of piece through holes 21a. The block 17 is assembled.

  As described above, in the resin mold 10C, the cavity piece 16 is in contact with the back surface 102b of the mounted part 102 to clamp the mounted part 102 (clamping piece 20), and the resin R is pressed and compressed (pressurized). ) Function (pressing piece 21) is divided and made independent. Since each function works independently, for example, the mounting component 102 is prevented from being damaged, and the mounting component 102 is weakly clamped (soft clamp) with an appropriate pressure, while the flash R is prevented and the resin R is added. Can be pressed. That is, it is possible to improve the production yield of a molded product (resin molded product 100 shown in FIG. 9) molded with resin using the resin mold 10C.

  The resin mold 10C further includes a multi-step taper plate 40 having a plurality of taper portions 40a, a drive mechanism 41 for driving the multi-step taper plate 40, and a plurality of tapers corresponding to the taper portions 40a as a wedge mechanism. Plate 20c (tapered portion). The plurality of taper plates 20c are individually arranged on the end surface (lower surface) opposite to the end surface 20a of the clamp piece 20. Further, the multi-stage taper plate 40 is provided on the upper surface of the support block 17 so that the taper (taper portion 40a) corresponding to the taper of the taper plate 20c is arranged in multiple stages. In addition, the lower surface of the pressing piece 21 is formed with a recessed portion 21c having a shape recessed on an extended line (in the column direction) where the clamping pieces 20 are arranged. Thereby, the multistage plate 40 can pass through the space formed by the recess 21c.

  According to such a wedge mechanism, as shown in FIG. 24, by pressing the multistage plate 40, the state is changed from the state in which the clamp piece 20 is supported by the elastic member 22 to the state in which the clamp piece 20 is supported and fixed. The mounting component 102 can be clamped (hard clamp) more strongly than when the clamp piece 20 is supported by the elastic member 22. For this reason, even if the resin R is pressurized by the pressure piece 21 in the cavity C, the clamping piece 20 is pushed down by the resin pressure, and a force that causes the mounting component 102 to peel off from the substrate 101 is applied. Can be prevented. Therefore, it is possible to improve the production yield of molded products molded with resin using the resin mold 10C. As described above, in this embodiment, the mounting component 102 can be soft-clamped or hard-clamped by the support mechanism that supports the clamping piece 20 by switching the elastic member 22 and the multistage plate 40 (wedge mechanism). it can.

  Next, the operation (resin molding method) of the resin mold 10C in this embodiment will be described. Here, the case where the above-described resin mold 10C is prepared and a molded product is manufactured by compression molding using the mold 10C will be described.

  First, as shown in FIG. 23, in the state where the resin mold 10C is opened, in the upper mold 11, the workpiece W is placed on the parting surface 11a (work placement portion 13) so that the lower mold 12 side becomes the mounting component 102. ) Placed (supplied). In the lower mold 12, the resin R is supplied to the bottom of the cavity recess 14 (the end surface 21 b of the pressing piece 21). Next, the upper mold 11 and the lower mold 12 of the resin mold 10 are close to each other, and the clamping piece 20 is brought into contact with the back surface 102b of the mounting component 102 to clamp the mounting component 102 (soft clamp). The end surface (parting surface 12a) of the clamper block 15 is brought into contact with the mounting surface 101a of the substrate 101 to clamp the substrate 101 (work W). In this way, before the resin R is pressed by the pressing piece 21, the clamping piece 20 is brought into contact with the back surface 102b of the mounting part 102 to clamp the mounting part 102 (soft clamping), thereby preventing the occurrence of flash. can do.

  Next, the resin mold 10 </ b> C is further closed, and the pressurization piece 21 is moved relative to the clamp piece 20 to start pressurizing the resin R. At this time, as shown in FIG. 24, the multistage plate 40 is slid on the upper surface of the support block 17 by the drive mechanism 41 so as to push the taper portion 40a between the support block 17 and the taper plate 20c. . Thereby, the clamp piece 20 supported by the elastic member 22 is supported and fixed by the multistage plate 40, and the mounting component 102 is clamped (hard clamp). By such an operation, even if the resin R is pressed by the pressing piece 21 in the cavity C, the clamping piece 20 is pushed down by the resin pressure, and a force that causes the mounting component 102 to peel off from the substrate 101 is generated. It can be prevented from joining. Note that such an operation may be performed at the timing from the step shown in FIG. 4 described in the first embodiment to the state of the step shown in FIG.

  Thereafter, the pressing piece 21 is moved relative to the clamping piece 20 so that the end face 20a of the clamping piece 20 and the end face 21b of the pressing piece 21 are in the horizontal position. The inside of C is filled with resin R, and mold underfill is performed. Next, the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby the workpiece W becomes a molded product. According to the present embodiment, it is possible to prevent the clamping piece 20 from being pushed down by the resin pressure while clamping the mounting component 102 with the clamping piece 20 to prevent the occurrence of flash, and the resin-molded molding can be performed. The production yield of the product can be improved. In addition, although what combined the elastic member 22 and the wedge mechanism was demonstrated as a support mechanism, it is not restricted to this wedge mechanism, For example, the clamp piece 20 with the pin, block, etc. which used air, a motor, etc. as a drive source. It is also possible to use a mechanism that pushes up and supports (fixes).

(Embodiment 5)
In the first embodiment, the case where the back surface 102b of the mounting component 102 is exposed and the mold underfill (resin mold) is efficiently performed has been described. In the present embodiment, a case where resin molding is performed while the main surface 102a of the mounting component 102 (for example, a sensor surface in the case of a sensor component) is exposed will be described. A resin mold 10D (resin mold mechanism) corresponding to compression molding in the fifth embodiment of the present invention will be described with reference to FIGS. 25 to 32 are cross-sectional views schematically showing the resin mold 10D during operation (during the manufacturing process). In the following, description of the same components as those shown in the first embodiment may be omitted.

  A workpiece W to be processed by the resin mold 10D includes a substrate 101 (for example, a wiring substrate) and a mounting component 102 (for example, a sensor component), and a plurality of mounting components 102 are arranged in a matrix. Then, it is mounted on the substrate 101 via the bonding wire 104. When the workpiece W is divided into individual pieces and becomes a resin mold product, a part of the main surface 102a on the substrate 101 side is exposed and the other surface is covered with the resin mold portion.

  In the resin mold 10 </ b> D, the clamping piece 20 is prevented from coming off at the lower surface of the pressing piece 21 and is assembled to the support block 17 via the elastic member 22. In contrast to the clamping piece 20, the resin mold 10 </ b> D includes an elastic body 50 (for example, a fluororesin) that covers the end surface 20 a of the clamping piece 20. By providing the elastic body 50, it is possible to prevent the mounting component 102 from being damaged when the mounting component 102 is clamped (pressurized) by the main surface 102a. In particular, even if the mounting component 102 has a brittle sensor chip such as glass placed on the surface, or is hollow and weak against pressure, it can be prevented from being damaged. Further, the mounting component 102 can be further prevented from being damaged by adsorbing and stretching the film F on the parting surface 12 a including the inner surface of the cavity recess 14 so as to cover the elastic body 50.

  Next, the operation (resin molding method) of the resin mold 10D in this embodiment will be described. First, as shown in FIG. 25, in the state where the resin mold 10D is opened, in the upper mold 11, the workpiece W is placed on the parting surface 11a (work placement portion 13) so that the lower mold 12 side becomes the mounting component 102. ) Placed (supplied). On the other hand, in the lower mold 12, the film F is adsorbed and stretched on the parting surface 12 a including the inner surface of the cavity recess 14. As a film suction mechanism, the resin mold 10D includes suction paths 52 and 53 connected to a suction mechanism (for example, a vacuum pump) (not shown) provided outside the mold, and a seal member 54 (for example, an O-ring). I have. The suction path 52 opens at the upper surface (parting surface 12a) of the clamper block 15 and sucks the film F. The suction path 53 opens at the inner surface of the recess recessed from the lower surface of the clamper block 15, and the clearance between the through hole 15 a of the clamper block 15 and the pressurizing piece 21, and the through hole 21 a for the piece of the pressurizing piece 21. The film F is adsorbed from the gap with the clamp piece 20. Although the support block 17 is provided in the recess of the clamper block 15, a seal member 54 is provided between the inner wall surface of the recess and the outer peripheral side surface of the support block 17. A sealed space is formed.

  Next, a transport supply mechanism 60 (dispensing mechanism) for transporting and supplying the resin R (for example, granular, powdery, liquid) is entered into the mold. The transport and supply mechanism 60 includes a main body 61, a plurality of through holes 62 (resin storage portions) provided penetrating in the thickness direction, a lid 63 covering the plurality of through holes 62 on the upper surface of the main body 61, The shutter 64 provided in the bottom face of each through-hole 62 and the cap part 65 which covers the end surface 20a of the clamp piece 20 provided in the lower surface of the main-body part 61 are provided. Thus, the transport supply mechanism 60 is an openable / closable resin transport mechanism by the shutter 64. 25 feeds the resin R to the through-hole 62 in a state where the shutter 64 is closed outside the mold and the through-hole 62 is covered with the lid 63, and then enters the inside of the mold. It is in the state. In addition, the cap part 65 which covers the whole outer edge part of the end surface 20a of the clamp piece 20 is formed in a sectional view concave shape.

  Next, as shown in FIG. 26, before dropping the resin R, the end surface 20 a of the clamping piece 20 and the upper surface (parting surface 12 a) of the clamper block 15 are covered with the lower structure of the conveyance supply mechanism 60. To do. That is, the cap portion 65 covers the end surface 20 a of the clamping piece 20 and the upper surface of the clamper block 15. As a result, the resin R is prevented from being dropped or placed on the end face 20a of the clamping piece 20, so that the resin R is not caught during clamping. Subsequently, as shown in FIG. 27, the shutter 64 is released, and the resin R is dropped (supplied) onto the end face 21b of the pressurizing piece 21 in the cavity concave portion 14, and then, as shown in FIG. Is retracted from the inside of the mold to the outside of the mold.

  Subsequently, the upper mold 11 and the lower mold 12 of the resin mold 10D are closed close to each other, and the clamping piece 20 is brought into contact with the main surface 102a of the mounting component 102 as shown in FIG. Then, the mounting component 102 is clamped. Before and after this, the inside of the mold is preferably decompressed. As a decompression mechanism, the resin mold 10D includes a suction path 55 connected to a decompression mechanism (for example, a vacuum pump) (not shown) provided outside the mold, and a seal member 56 (for example, an O-ring). . The suction path 55 opens at the parting surface 11a of the upper mold 11 and sucks the inside of the mold to reduce the pressure. Further, when the upper mold 11 and the lower mold 12 come close to each other and come into contact with the seal member 56 (sealing touch), the inside of the mold is sealed. Next, the resin mold 10 is further closed, and the end surface of the clamper block 15 is brought into contact with the mounting surface 101a of the substrate 101 to clamp the substrate 101 (work W) as shown in FIG. The clamp of the workpiece W and the clamp of the mounting component 102 may be performed before and after.

  Subsequently, as shown in FIG. 31, the resin mold die 10 </ b> D is further closed, the pressurization piece 21 is moved relative to the clamp piece 20 to pressurize the resin R, and the mounting component 102. The cavity C including the periphery of is filled with the resin R. Subsequently, the resin R filled in the cavity C is heat-cured in a pressure-holding state, and as shown in FIG. 32, after the resin mold 10D is opened, the resin R is further heat-cured (post-cured). The workpiece W becomes a molded product. That is, a molded product (package) in which the main surface 102a of the mounting component 102 is exposed and the periphery and side surfaces thereof are resin-molded is completed. With respect to this molded product, an arbitrary wiring structure can be formed by forming the outermost wiring structure or forming a connection portion such as a bump.

  The workpiece W (molded product) in the present embodiment has a package configuration in which the main surface 102a serving as a sensor surface is exposed, such as an image sensor or a fingerprint sensor, and the other (including the bonding wire 104) is molded. Yes. Of course, in addition to these, it is also effective when molding what has a hole for sensing on the main surface 102a of the mounting component 102 such as a sensor such as a microphone. In this case, the resin can be prevented from entering the sensing hole by clamping the main surface 102a and sealing the outer periphery. Further, what is exposed in the mounting component 102 is not limited to the main surface 102 a and the back surface 102 b, but may be a heat sink mounted on the mounting component 102. It is also effective for an acceleration sensor (MEMS sensor) that is hollow in order to displace the detection element inside the chip. In these cases, as described above, a configuration of further underfilling is also possible.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the above-described embodiment, the case where the resin molding (mold underfill) is performed on the workpiece W in which the plurality of mounting components 102 are flip-chip mounted on the substrate 101 has been described. However, the present invention is not limited to this, and a resin mold can be applied to the workpiece W as shown in FIG. FIG. 22 is a diagram for explaining a modification of the workpiece W.

  In the workpiece W shown in FIG. 22, for example, an IGBT (Insulated Gate Bipolar Transistor) element 112 and an FWD (Free Wheeling Diode) element 113 are sandwiched between an upper electrode 110 and a lower electrode 111 formed of, for example, a lead frame. The mounting component 102 is configured. The mounting component 102 is fixed on the substrate 101 (carrier) via a fixing layer 114 (adhesive layer). The upper electrode 110 and the lower electrode 111 are also used as a heat sink.

  In such a workpiece W, since the IGBT element 112 and the FWD element 113 which are different types of semiconductor chips have different heights, the upper electrode 110 may be inclined with respect to the lower electrode 111. In the present invention, the clamping piece 20 is provided so as to contact the mounting component 102 and clamp the mounting component 102, and the pressing piece 21 is provided so as to pressurize the resin R without contacting the mounting component 102. ing. For this reason, even when the mounting component 102 on the substrate 101 is inclined, the end surface 20a of the clamping piece 20 and the back surface 102b of the mounting component 102 are reliably brought into contact with each other, thereby clamping the mounting component 102 and absorbing the inclination. Is done. Further, the resin R can be filled even in a narrow portion between the upper electrode 110 and the lower electrode 111.

  The mounting component 102 includes a semiconductor chip for memory or logic that requires heat dissipation, an optical chip having a light emitting surface or a light receiving surface, a sensor chip that needs to expose the sensor surface, Various semiconductor chips such as a TSV type chip having a typical connection terminal can also be used. Further, the mounting component 102 is connected to a conductor functioning as an upper and lower through electrode in the work W, a heat radiating plate for radiating heat from a semiconductor chip included in the work W, and a semiconductor chip included in the work W. An interposer substrate may be used. Also, a combination of these may be used. For example, it is good also as a structure which has arrange | positioned the conductor around the semiconductor chip. Further, the resin R can be filled between a plurality of stacked semiconductor chips via the bumps 103.

  In the embodiment, the example in which one mounting component 102 is clamped by each of the clamping pieces 20 has been described. However, a plurality of mounting components 102 may be clamped by one clamping piece 20. In this case, when there is a variation in the height of the plurality of mounting components 102 mounted on the substrate 101, the variation is absorbed by arranging an elastic body such as an engineering plastic on the surface of the clamping piece 20. You can also. Further, the resin mold may have a configuration other than a configuration including a plurality of clamping pieces 20 and a single pressing piece 21 or a configuration including a single clamping piece 20 and a single pressing piece 21. Alternatively, a plurality of clamping pieces 20 and a plurality of pressing pieces 21 may be provided.

Claims (8)

It is a resin mold mold that clamps a workpiece having mounting parts with one and the other mold, and thermosets the resin filled in the cavity,
The workpiece is arranged on the parting surface of the one mold,
A cavity recess that constitutes the cavity is provided on the parting surface of the other mold,
A cavity piece is provided at the bottom of the cavity recess,
The cavity piece includes a first piece and a second piece that are provided so as to be relatively movable back and forth in the mold opening / closing direction, and the first piece is in contact with the mounting component to clamp the mounting component. And the second piece is provided so as to pressurize the resin without coming into contact with the mounting component. The resin mold according to claim 1,
The second piece is fixed and assembled to the support block of the other mold,
The second piece is formed with a plurality of piece through holes into which the plurality of first pieces are inserted,
A resin characterized in that the first piece is assembled to the support block via an elastic member so that the plurality of first pieces are provided independently in each of the plurality of through holes for the pieces. Mold mold. In the resin mold die according to claim 1 or 2,
The first piece is formed with a protruding portion that protrudes in a curved shape from the end surface along the outer peripheral edge portion of the end surface that comes into contact with the mounting component.
A resin mold mold, wherein a film is provided on a parting surface of the other mold, and the first piece is in contact with the mounting component via the film. It is a resin molding method for clamping a work having mounting parts with one and the other molds, and thermosetting the resin filled in the cavity,
(A) preparing a resin mold including the one mold and the other mold having a cavity piece provided at the bottom of a cavity recess that constitutes the cavity; and (b) the one mold. Placing the workpiece on the parting surface of the mold so that the other mold side is the mounting component; and
(C) supplying the resin to the bottom of the cavity recess or to the workpiece; and (d) first and second pieces divided and provided so as to be relatively movable in the mold opening / closing direction. The cavity piece is used, the first piece is brought into contact with the mounting component and the mounting component is clamped, and then the second piece is moved relative to the first piece, and the mounting piece is mounted. Pressurizing the resin without abutting against a component to fill the cavity with the resin;
A resin molding method comprising: The resin molding method according to claim 4,
In the step (a), the second piece is fixedly assembled to the support block of the other mold, and the plurality of first pieces are inserted into the second piece, respectively. A through hole is formed, and the first piece is assembled to the support block via an elastic member so that the plurality of first pieces are independently provided in each of the plurality of through holes for the piece. Preparing the resin mold mold provided with the other mold;
In the step (b), the work having a plurality of the mounting components is arranged in the one mold,
In the step (d), a plurality of the first pieces are brought into contact with each of the plurality of mounting components. In the resin molding method according to claim 4 or 5,
In the step (a), the resin mold die provided with the other die in which a plurality of the first pieces are arranged in a matrix and an air vent groove communicating with the outside from the cavity recess is provided on the parting surface. Prepare the mold,
In the step (b), the work in which a plurality of the mounting components are arranged in a matrix is arranged in the one mold,
In the step (c), the rod-shaped resin is prepared, and when the resin is supplied to the bottom of the cavity recess so as to be parallel to the extending direction of the air vent groove, a plurality of the first pieces are provided. In addition, when the resin is supplied to the workpiece, the resin is disposed between a plurality of the mounted components. In the resin molding method according to claim 4 or 5,
In the step (a), the resin mold die provided with the other die in which a plurality of the first pieces are arranged and arranged and an air vent groove communicating with the outside from the cavity recess is provided on the parting surface. Prepare the mold,
In the step (b), the work in which a plurality of the mounting components are arranged and arranged is arranged in the one mold,
The step (c) includes a plurality of through holes formed in alignment and a groove formed in communication with each through hole so as to extend in one direction across the plurality of through holes. When preparing the plate-shaped resin and supplying the resin to the bottom of the cavity recess so that the direction in which the air vent groove extends and the one direction in which the groove extends are parallel to each other, a plurality of A plurality of the first pieces are disposed in each of the through holes, and when the resin is supplied to the workpiece, a plurality of the mounting components are disposed in each of the plurality of through holes. . A resin mold method in which a workpiece having a mounting component flip-chip mounted on a mounting surface of a substrate is clamped with one and the other mold, and the resin filled in the cavity is thermally cured,
(A) preparing a resin mold including the one mold and the other mold having a cavity piece provided at the bottom of a cavity recess constituting the cavity;
(B) placing the workpiece on the parting surface of the one mold so that the other mold side is the mounting component;
(C) Using the cavity piece provided with first and second pieces that are provided so as to be relatively movable back and forth in the mold opening and closing direction, the first piece is brought into contact with the mounting component and the mounting is performed. Clamping the part;
(D) after the step (c), injecting the resin into the cavity and filling the cavity including the space between the substrate and the mounting component with the resin;
(E) After the step (d), the second piece is moved relative to the first piece so that the end face of the second piece and the surface opposite to the substrate of the mounting component are horizontal. Pressing the resin filled in the cavity;
A resin molding method comprising:

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