WO2015107758A1 - Resin mold tooling and resin-molding method - Google Patents

Resin mold tooling and resin-molding method Download PDF

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Publication number
WO2015107758A1
WO2015107758A1 PCT/JP2014/079747 JP2014079747W WO2015107758A1 WO 2015107758 A1 WO2015107758 A1 WO 2015107758A1 JP 2014079747 W JP2014079747 W JP 2014079747W WO 2015107758 A1 WO2015107758 A1 WO 2015107758A1
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WO
WIPO (PCT)
Prior art keywords
elastic body
resin
mold
mounting component
cavity
Prior art date
Application number
PCT/JP2014/079747
Other languages
French (fr)
Japanese (ja)
Inventor
川口　誠
正明 涌井
Original Assignee
アピックヤマダ株式会社
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Filing date
Publication date
Application filed by アピックヤマダ株式会社 filed Critical アピックヤマダ株式会社
Priority to JP2015557719A priority Critical patent/JP6422447B2/en
Priority to KR1020167019898A priority patent/KR102335853B1/en
Priority to CN201480073241.7A priority patent/CN105917451B/en
Publication of WO2015107758A1 publication Critical patent/WO2015107758A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the present invention relates to a technique effective when applied to a resin mold and a resin molding method.
  • Patent Document 1 exposes the back surface (surface opposite to the mounted surface) of a semiconductor chip flip-chip mounted on a wiring board.
  • a technique for resin molding is described. Specifically, it is a technique of performing resin molding by covering the back surface of the exposed semiconductor chip with a release film.
  • An object of the present invention is to provide a resin mold mold capable of improving the production yield of resin mold products.
  • a resin mold mold according to an embodiment of the present invention is a resin mold mold that clamps a workpiece having a mounting component with one and the other mold, and performs resin molding so that a clamp surface of the mounting component is exposed.
  • a cavity recess is provided on the parting surface of the one mold, and the workpiece is disposed on the parting surface of the other mold so as to protrude from the inner bottom surface of the cavity recess.
  • an elastic body that presses the mounting component is provided, the opposing surface of the elastic body that protrudes from the inner bottom surface of the cavity recess and faces the mounting component is wider than the clamping surface of the mounting component.
  • the resin molding method according to an embodiment of the present invention is a resin molding method in which a workpiece having a mounting component is clamped by one and the other molds, and the resin molding is performed so as to expose a clamp surface of the mounting component.
  • a cavity recess is provided in the parting surface of the one mold, and an elastic body protruding from the inner bottom surface is provided on the inner bottom surface of the cavity recess, and the mounting component protrudes from the inner bottom surface of the cavity recess.
  • the elastic body whose opposing surface is wider than the clamping surface of the mounting component, disposing the work on the parting surface of the other mold and clamping the work, and mounting the elastic body with the elastic body
  • the elastic body is recessed in the mounting component, and the elastic body protrudes so as to exceed the clamp surface around the mounting component.
  • the elastic body is recessed in the mounting component, the elastic body protrudes so as to exceed the clamp surface around the mounting component, and the resin is prevented from leaking to the clamp surface of the mounting component (for example, a semiconductor chip). (Blocks the flow of resin). Thereby, it is possible to prevent a flash (resin burr) from being generated on the clamp surface of the mounted component. Further, even if the mounting component is uneven in height between the workpieces or the mounting component is curved, it can be absorbed by the elastic body. Therefore, the production yield of the resin mold product can be improved.
  • the elastic body is formed in a shape in which a portion facing the mounting component is thin and a portion facing the periphery of the mounting component is thick.
  • the elastic body more easily protrudes so as to exceed the clamp surface around the mounted component.
  • the one die is provided with a cavity piece constituting an inner bottom surface of the cavity recess, and the cavity piece is provided with the elastic body. Is more preferable.
  • the cavity piece can prevent the elastic body from spreading in the direction intersecting with the clamping direction.
  • the cavity piece is provided in the one mold through a liner.
  • the position adjustment of the cavity piece and the height variation adjustment of each workpiece can be easily performed.
  • a film is provided on the parting surface of the one mold including the opposing surface of the elastic body and the inner surface of the cavity recess.
  • the elastic body can be protected by the film, the occurrence of cracks and deterioration can be prevented, the durability of the elastic body can be improved, and the chemical resistance of the elastic body to the resin can also be improved.
  • the protruding thickness of the elastic body is thicker than the flatness of the clamp surface of the mounted component.
  • the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
  • the compressive stress of the elastic body is lower than the yield strength of the mounted component and higher than the molding pressure.
  • the production yield of resin mold products can be improved.
  • the number of components is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less.
  • the shape of a component, etc. it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .
  • FIG. 1 to FIG. 3 schematically show a cross section of the main part of the resin mold 10 during operation (during the manufacturing process).
  • FIG. 4 schematically shows a resin mold product 100 (work W) obtained from the resin mold 10.
  • the resin mold 10 is configured to include a pair of molds (upper mold 11 and lower mold 12). In the resin mold 10, the workpiece C is clamped by the upper mold 11 and the lower mold 12 to form a cavity C, and the resin R filled in the cavity C is thermally cured in a state where the resin R is held and is molded into a resin mold. Processing to manufacture (form) 100 is performed.
  • the workpiece W includes a substrate 101 (for example, a wiring substrate) and a mounting component 102 (for example, a chip component such as a semiconductor chip).
  • a substrate 101 for example, a wiring substrate
  • a mounting component 102 for example, a chip component such as a semiconductor chip.
  • the mounting component 102 is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed.
  • the other surfaces (main surface, side surface) are resin-molded.
  • the substrate 101 is clamped by the upper mold 11 and the lower mold 12, and the back surface 102a of the mounting component 102 is also clamped. For this reason, in this embodiment, the back surface 102a becomes a clamp surface.
  • the mounting component 102 includes various types of memory and logic chips that require heat dissipation, optical chips having a light emitting surface and a light receiving surface, and TSV type chips having electrical connection terminals on the upper and lower surfaces.
  • a semiconductor chip can also be used.
  • the mounting component 102 is connected to a conductor functioning as an upper and lower through electrode in the work W, a heat radiating plate for radiating heat from a semiconductor chip included in the work W, and a semiconductor chip included in the work W.
  • An interposer substrate may be used.
  • a process of pumping (injecting) resin into the cavity C via a resin path communicating with the cavity C is performed by a known transfer mechanism.
  • molding the resin mold part is performed by a well-known press mechanism.
  • the resin mold 10 may be configured such that the upper mold 11 is a fixed mold and the lower mold 12 is a movable mold, and the mold can be opened and closed by a press mechanism.
  • the upper mold 11 is a movable mold and the lower mold 12 is a fixed mold. Alternatively, the upper mold 11 and the lower mold 12 may be movable.
  • the lower mold 12 is provided with a pot (not shown) and a workpiece placement portion 13 on which the workpiece W is placed (arranged).
  • the work placement unit 13 is provided so as to be recessed from the parting surface 12 a of the lower mold 12.
  • the upper die 11 is provided with a cull (not shown), a runner gate 14, and a cavity recess 15 that constitutes a cavity C.
  • the cull, the runner gate 14 and the cavity recess 15 are provided so as to be recessed from the parting surface 11 a of the upper mold 11.
  • the resin mold 10 is provided with a heater (not shown). With this heater, the resin mold 10 can be heated to a predetermined temperature (for example, 180 ° C.).
  • the resin mold 10 includes an elastic body 16 that presses the mounting component 102 and is provided so as to protrude from the inner bottom surface 15 a of the cavity recess 15 (the lower surface of the cavity piece 17) into the cavity recess 15. .
  • An elastic body recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided, and the elastic body 16 is provided in the elastic body recess 21.
  • the elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the back surface 102a (clamping surface) of the mounting component 102.
  • the elastic body 16 may be made of, for example, a rubber material such as fluorine rubber or silicone rubber, or an engineering plastic such as a PEEK (polyether ether ketone) material.
  • the resin mold 10 when assembling the elastic body 16 to the upper mold 11, the resin mold 10 is provided with a cavity piece 17 (mold block) provided on the upper mold 11 and constituting the inner bottom surface 15 a of the cavity recess 15.
  • the upper die 11 is provided with a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15.
  • a cavity piece 17 is provided (assembled) in the piece recess 20 without protruding from the inner bottom surface 15 a of the cavity recess 15.
  • the cavity piece 17 is provided with a recess 21 for an elastic body.
  • the elastic body 16 is fixed to the cavity piece 17 by, for example, an adhesive. For this reason, the cavity piece 17 holds the elastic body 16. Therefore, in this embodiment, the cavity piece 17 is provided with the elastic body 16, and the cavity piece 17 integrated with the elastic body 16 is assembled to the upper mold 11. Although it is conceivable to attach the elastic body 16 directly to the upper mold 11 without using the cavity piece 17, the elastic body 16 can be easily assembled to the upper mold 11 through the cavity piece 17.
  • the elastic body 16 can be replaced and used when a desired sealing property cannot be ensured due to, for example, heating or deformation.
  • the resin mold 10 includes a liner 22 provided on the inner bottom surface 20a of the piece recess 20.
  • the cavity piece 17 is provided on the upper mold 11 via the liner 22.
  • the position adjustment (height adjustment) of the cavity piece 17 within the piece recess 20 can be easily performed.
  • a spring whose thickness can be changed according to pressure, and a wedge member whose thickness can be changed by inserting and removing are also applied. It is also possible to adjust the height (thickness) variation of each workpiece W by sliding the cavity piece 17 within the piece recess 20.
  • a release film (hereinafter, referred to as “parting surface 11 a”) of the upper mold 11 including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15 is formed. It is also simply called “film”.) F is stretched. Further, the workpiece W is arranged on the parting surface 12a (work placement portion 13) including the inner surface of the workpiece placement portion 13 of the lower mold 12.
  • a cavity C including the cavity recess 15 is formed, and the pot, the cal, the runner, A communication path (resin path) including the gate 14 is formed.
  • the elastic body 16 presses the mounting component 102, and the elastic body 16 is recessed by the mounting component 102 due to the reaction, so that the mounting component 102 The elastic body 16 protrudes into the cavity C so as to exceed the back surface 102a. For this reason, it is possible to prevent (seal) the resin R from leaking to the back surface 102a of the mounting component 102 at the time of resin injection / filling.
  • the elastic body 16 has a pressure-resistant region at a portion 16a (the central portion of the elastic body 16) facing the mounting component 102, and a portion 16b (the outer peripheral portion of the elastic body 16) facing the periphery of the mounting component 102. It becomes a seal area.
  • the elastic body 16 By pressing the film F against the back surface 102a of the mounting component 102 by the elastic body 16, there is no gap in the edge portion of the mounting component 102.
  • the resin R can be prevented from entering the gap. That is, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounted component 102. Therefore, according to the resin mold 10 in the present embodiment, the manufacturing yield of the resin molded product 100 can be improved, and the manufacturing cost can be reduced by eliminating the need for flash removal.
  • the height of the mounting component 102 between the workpieces W, or the back surface 102a of the mounting component 102 is curved or uneven. Even so, it can be absorbed by the elastic body 16.
  • the film F is considerably thin considering the followability to the uneven shape of the upper mold 11, dimensional accuracy, economy, etc., the film F alone is caused by the mounting component 102 as described above. In some cases, the generated gap cannot be sufficiently buried to prevent flashing. On the other hand, by using the elastic body 16 having an arbitrary thickness together with the film F, the gap generated at the edge portion of the back surface 102a of the mounting component 102 can be surely buried.
  • the protruding thickness A of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 is larger than the flatness of the back surface 102a of the mounting component 102, for example. Can be. According to this, in a state where the workpiece W is clamped (see FIG. 2), the elastic body 16 can be protruded more reliably around the mounting component 102 so as to exceed the back surface 102a of the mounting component 102. However, the elastic body 16 does not necessarily have to protrude from the inner bottom surface 15 a of the cavity recess 15.
  • the position of the back surface 102 a of the mounting component 102 can be made higher than the position of the inner bottom surface 15 a of the cavity recess 15.
  • the thickness of the elastic body 16 can be set arbitrarily.
  • the operation of the resin mold 10 in one embodiment of the present invention (resin molding method, resin mold product 100 manufacturing method) will be described with reference to FIGS.
  • the upper mold 11 is provided with the elastic body 16 in the elastic recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 as shown in FIG. 1. Yes.
  • the upper mold 11 stretches the film F on the parting surface 11 a including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15.
  • the workpiece W is disposed on the parting surface 12a (work placement portion 13), and the resin R is supplied to the pot.
  • the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. Then, the film F is adsorbed and held on the parting surface 11a of the upper mold 11 by a known suction mechanism (vacuum pump) using a gap between the cavity pieces 17 and a suction path (suction hole) (not shown). 11a is stretched.
  • the elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15. For this reason, the film F will be stretched also in the part which protrudes from the inner bottom face 15a.
  • This film F is heat resistant enough to withstand the heating temperature of the resin mold 10 and is easily peeled off from the parting surface 11a of the upper mold 11 and is a film material having flexibility and extensibility. is there.
  • the film F for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.
  • the elastic body concave portion 21 is provided in the cavity piece 17, and the cavity piece 17 is provided in the piece concave portion 20. For this reason, the film F can be sucked and held between the outer peripheral side surface of the cavity piece 17 and the inner wall surface of the concave portion 20 for the piece as a suction path.
  • the work W is transported to the resin mold 10 by a loader (not shown), and the work W is arranged on the parting surface 12a.
  • a resin R for example, a tablet, granule, powder, or liquid mold resin
  • the resin R is supplied to the pot. Since the resin mold 10 is heated to a predetermined temperature by the built-in heater, the resin R supplied to the pot is melted.
  • the workpiece W is clamped via the film F to form the cavity C including the cavity recess 15.
  • the upper die 11 and the lower die 12 are brought close to each other by a press mechanism, and the workpiece W is clamped by the upper die 11 and the lower die 12.
  • the elastic body 16 is provided in the elastic body recess 21 of the cavity piece 17, the cavity piece 17 presses (clamps) the workpiece W via the elastic body 16.
  • the elastic body 16 since the elastic body 16 having a strength lower than that of the mounting component 102 and the bump 103 and easily deformable is used, the elastic body 16 is deformed so as to be recessed by the mounting component 102 while the workpiece W is clamped. . As a result, the elastic body 16 is recessed by the mounting component 102, and the elastic body 16 protrudes from the inner bottom surface 15 a of the cavity recess 15 around the mounting component 102. That is, the surface of the portion 16 a of the elastic body 16 (facing surface 16 ab) is flush with the inner bottom surface 15 a of the cavity recess 15 and the portion 16 b of the elastic body 16 exceeds the back surface 102 a of the mounting component 102. It protrudes into the cavity C from the inner bottom surface 15a.
  • the elastic body 16 is entirely made of the same material (for example, fluororubber), and includes a portion 16a facing the mounting component 102 and a portion 16b facing the periphery of the mounting component 102. It has a plate shape with the same thickness. For this reason, for example, by using the elastic body 16 having an elastic modulus that can be crushed and deformed to the outside, the compressed volume of the elastic body 16 and the mounting can be obtained in a state where the workpiece W is clamped (see FIG. 2). The volume of the portion 16b of the elastic body 16 protruding so as to surround the component 102 is the same.
  • the elastic body 16 does not protrude downward on the outer periphery of the mounting component 102 by being compressed and deformed outward in this way, but rather the elastic body 16 in the pressure resistant region is simply compressed, so that the elasticity in the seal region is relatively increased.
  • the body 16 may protrude.
  • the elastic body 16 in addition to the fluororesin, a silicone resin and various engineering plastics can be used.
  • a high strength material such as a PEEK (polyetheretherketone) material
  • the liner 22 includes a spring to prevent damage to the mounting component 102 and the bump 103. Is preferred.
  • the concave portion 21 for the elastic body is provided in the cavity piece 17.
  • the elastic body 16 can be easily held in the upper mold 11 through the cavity piece 17.
  • the inner wall surface (edge) of the elastic body recess 21 provided in the cavity piece 17 serves as a wall, and the direction in which the elastic body 16 intersects the clamping direction when the workpiece W is clamped (the horizontal direction in FIG. 2). Can be prevented from spreading).
  • the elastic body 16 since the outer periphery of the elastic body 16 is surrounded by the cavity piece 17, the elastic body 16 does not spread laterally, for example, the outer peripheral side surface of the cavity piece 17 for adsorbing and holding the film F as described above The space between the inner wall surface of the recess 20 for the piece is not blocked, and the film F can be securely held by suction.
  • the film F is provided on the parting surface 11a of the upper mold 11 including the opposing surface 16ab of the elastic body 16 and the inner surface of the cavity recess 15, and the film F is clamped while the workpiece W is clamped.
  • the elastic body 16 is preferably recessed by the mounting component 102.
  • the structure which does not use the film F is also considered, by using the film F, the elastic body 16 can be protected. Specifically, the angular mounting component 102 can be prevented from being pressed and damaged, and the durability of the elastic body 16 can be improved by preventing the occurrence of cracks and deterioration. Further, direct contact with the resin R can be prevented, and deterioration of the elastic body 16 due to the resin R can also be prevented.
  • the elastic body 16 can be selected without considering the corrosion resistance due to the resin R. Furthermore, since the resin F can be prevented from entering the gap between the cavity piece 17 and the cavity recess 15 by using the film F, the elastic body 16 is deformed by filling the gap with the resin R. And the elastic body 16 does not come off with the release of the resin R.
  • the transfer mechanism is driven to inject the resin R into the cavity C, and the filling of the resin R into the cavity C is completed.
  • the plunger provided in the pot of the lower mold 12 so as to be movable back and forth is advanced to the cull side (upper mold 11 side), and the resin R melted in the pot is moved by the plunger (tip portion). Press.
  • the resin R pressed by the plunger enters the cavity C through the cull and runner gate 14. That is, the resin R is poured into the cavity C.
  • the plunger is further advanced toward the cull side to inject (pressure feed) the resin R into the cavity C, and the cavity C is filled with the resin R. At this time, the resin R is pressurized in the cavity C so as to press the film F.
  • the workpiece W is flip-chip mounted on the substrate 101 via a plurality of bumps 103, the surface of the substrate 101 (mounting surface) and the main surface of the mounting component 102 (bump 103 is formed).
  • the resin R is also filled in a narrow area with the formed surface) (mold underfill).
  • the resin R used for the mold underfill can be filled in a narrow space such as between the bumps 103 or under the mounting component 102, and on the other hand, flashing on the mounting component 102 is also likely to occur.
  • the seal structure as described above is very effective.
  • the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby a resin mold portion 104 (resin R) as shown in FIG.
  • the resin molded product 100 (work W) provided with is almost completed as a molded product.
  • the back surface 102 a of the mounting component 102 is exposed from the resin mold portion 104.
  • a peripheral groove 105 formed by the elastic body 16 (part 16b) protruding from the inner bottom surface 15a of the cavity recess 15 is formed in the resin mold portion 104 so as to surround the back surface 102a of the mounting component 102 having a rectangular shape in plan view. Has been.
  • the elastic body 16 having a compressive stress higher than the molding pressure at the time of holding pressure is used to face the periphery of the mounting component 102 in a state where the resin R filled in the cavity C is held. It is also possible to prevent the portion 16b of the elastic body 16 from being deformed.
  • the resin 16 is prevented from leaking to the back surface 102a of the mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the mounting component 102 (flow of the resin R). Can be interrupted). Thereby, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounting component 102. Therefore, the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
  • the back surface 102 a of the mounting component 102 is sealed while being buried in the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15. For this reason, the back surface 102a of the mounting component 102 and the front surface (upper surface in FIG. 4) of the resin mold portion 104 are flush with each other. For example, even if a heat sink having a flat connection surface is used, the back surface 102a and the resin mold portion 104 are used. It is possible to use an inexpensive heat sink.
  • FIG. 5 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16A In the state where the mold is opened, the elastic body 16A has a flat opposing surface 16ab, and with reference to this, the thickness is thin at the center (part 16a) of the elastic body 16A and thick at the outer peripheral part (part 16b). It has a concave shape.
  • the elastic body 16A is provided in the elastic body recess 21 of the cavity piece 17A, the cavity piece 17A is provided with a protrusion 17a protruding from the inner bottom surface 21a of the elastic body recess 21.
  • the elastic body 16A is provided (assembled) in the elastic concave portion 21 of the cavity piece 17A so that the convex portion 17a is fitted into the concave elastic body 16A.
  • the thickness of the elastic body 16A in the pressure-resistant region is reduced, and the mounting component 102 is lifted by the pressure of the resin R filled in the cavity C. Can be prevented. That is, when the elastic body 16A is thick due to the resin pressure of the resin R filled between the substrate 101 and the mounting component 102, the mounting component 102 supported by the elastic body 16A is deformed so as to have a medium height. Sometimes. On the other hand, such deformation of the mounting component 102 can be prevented by reducing the thickness of the elastic body 16A in the pressure resistant region (in other words, providing the convex portion 17a).
  • the elastic body 16 is bonded and fixed to the cavity piece 17 has been described. Not limited to this, as shown in the present embodiment, the elastic body 16 may be secured to the cavity piece 17A by being prevented from coming off.
  • the cavity piece 17c is fitted into the concave part 17b provided so as to be recessed from the outer wall surface of the convex part 17a of the cavity piece 17A, and the convex part 16c provided so as to protrude from the inner wall surface of the concave elastic body 16A.
  • the elastic body 16 is secured to the 17A and fixed.
  • the elastic body 16A can be fixed by forming an internal thread on the outer wall surface of the convex portion 17a of the cavity piece 17A and an external thread on the inner wall surface of the concave elastic body 16A and tightening the cavity piece 17A.
  • FIG. 6 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16B is provided with a convex portion 16d (flange portion) so as to protrude from the outer wall surface on the inner bottom surface 21a side of the concave portion 21 for elastic body.
  • the cavity piece 17B is provided with a recess 17c so as to be recessed from the inner wall surface of the elastic body recess 21.
  • the cavity piece 17B is configured to be divided into an upper block 17d and a lower block 17e.
  • the upper block 17d and the lower block 17e are divided on the same plane as the inner bottom surface 21a of the elastic body recess 21. For this reason, the lower block 17e becomes a ring-shaped hollow part, and the upper block 17d becomes a cover part.
  • the elastic body 16B In order to fix the elastic body 16B to the cavity piece 17B, first, the upper block 17d and the lower block 17e are divided. Next, the elastic body 16B is fitted into the ring-shaped lower block 17e so that the convex portion 16d of the elastic body 16B is hooked on the concave portion 17c of the lower block 17e (cavity piece 17B). Next, the lower block 17e and the upper block 17d are assembled so as to cover the elastic body 16B and the lower block 17e with the upper block 17d, and screwed with, for example, a bolt (not shown), so that the elastic body 16B is cavity piece. Secure to 17B. Thereafter, the cavity piece 17B integrated with the elastic body 16B is provided (assembled) in the concave part 20 for the piece. Thereby, the elastic body 16B can be reliably fixed to the cavity piece 17B. Further, it is possible to cope with a change in the arrangement of the mounting component 102 by simply replacing the elastic body 16B and the lower block 17e.
  • FIG. 7 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • FIG. 14 is a cross-sectional view schematically showing the resin molded product 100 during the manufacturing process.
  • the workpiece W in the present embodiment includes a substrate 101 (for example, a wiring substrate), a chip component 102A such as a semiconductor chip as a mounting component, and a columnar conductor 102B (via member) made of a conductive material such as copper. It has.
  • the chip component 102A is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed.
  • the other surfaces (main surface, side surface) are resin-molded.
  • the columnar conductor 102B is mounted on the substrate 101, the other end surface 102b opposite to the one end surface on the mounting side is exposed, and the other surface (side surface) is resin-molded. Thereby, not only the board
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 in a state where the mold is opened.
  • the elastic body 16 has a facing surface 16ab facing the chip component 102A and the columnar conductor 102B (mounting component) wider than the back surface 102a of the chip component 102A to be clamped and the other end surface 102b (clamping surface) of the columnar conductor 102B. It has a shape.
  • the elastic body 16 is deformed so as to be recessed by the chip component 102A and the columnar conductor 102B.
  • the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of the chip component 102A or the columnar conductor 102B. It protrudes into the cavity C from the inner bottom surface 15a of the cavity recess 15 so as to exceed the other end surface 102b.
  • resin is applied to the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the chip component 102A and the columnar conductor 102B.
  • R can be prevented from leaking.
  • the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
  • the chip parts 102A and the columnar conductors 102B which are likely to be different in height due to being manufactured separately, are collectively resin-molded, the height variations that cannot be absorbed by the film F alone are compensated. It is possible to prevent the flash from occurring on the end surfaces (the back surface 102a and the other end surface 102b) of the member.
  • the resin molded product 100 manufactured with the resin mold 10 in this embodiment is formed on the substrate 101 with the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B exposed.
  • the resin mold portion 104 is provided.
  • the resin mold portion 104 has a circumferential groove 105 (105A, 105B) that is molded by a portion 16b of the elastic body 16 that prevents the occurrence of flash in the resin molding process.
  • the circumferential groove 105A is formed around the back surface 102a of the chip component 102A
  • the circumferential groove 105B is formed around the other end surface 102b of the columnar conductor 102B.
  • a resin mold product 100 having high shielding properties can be obtained.
  • the manufacturing method will be described as applied to a resin molded product 100 (semiconductor package) including a semiconductor chip (chip component 102A) as having high shielding properties.
  • the film F is peeled off and the resin mold 10 is resin-molded. Remove product 100.
  • shielding ink or shielding paste is applied to the package surface (resin mold portion 104, chip component 102 ⁇ / b> A and columnar conductor 102 ⁇ / b> B exposed from resin mold portion 104) to form shield layer 120. .
  • the shield layer 120 is electrically connected to the columnar conductor 102B.
  • a plurality of mounting bumps 121 for mounting the resin mold product 100 on another mounting substrate is formed on the back surface of the substrate 101 (the surface opposite to the surface on which the resin mold portion 104 is formed). At this time, a certain mounting bump 121 is electrically connected to the columnar conductor 102 ⁇ / b> B via the in-substrate wiring 122.
  • the in-substrate wiring 122 constituted by the multilayer wiring layers provided in the substrate 101 and vias between them is schematically shown by broken lines.
  • electromagnetic waves are allowed to flow to the ground (GND) through the shield layer 120, the columnar conductor 102B, the in-substrate wiring 122, and the mounting bumps 121 to exert a shielding function.
  • GND ground
  • the shielding ink or shielding paste using a material having high thermal conductivity the heat radiation area can be increased, and a heat radiation function of the semiconductor chip (chip component 102A) can be expected.
  • the conductive shield layer 120 When forming the conductive shield layer 120, it is possible to use an electrostatic coating method in which a coating liquid as described later is discharged from the nozzle while applying a potential difference between the nozzle and an object to be coated. Also, inkjet method, plating method, PVD ( A physical vapor deposition (CVD) method, a chemical vapor deposition (CVD) method, a spray coating method, a printing method, or the like can also be used.
  • a coating liquid (ink) in which fine powder (metal such as Ag or carbon) having conductivity or magnetism and a binder resin are dissolved in a solvent can be used.
  • the resin mold 10 in the present embodiment it is possible to reliably expose all the columnar conductors 102B that are difficult to install at a uniform height.
  • a separate process for exposing the columnar conductor 102 ⁇ / b> B is not performed, and the shielding function is reliably exhibited in all the resin molded products 100. Can be made.
  • FIG. 8 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • a plurality of elastic bodies 16 are provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened.
  • Each elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the mounting component 102a (clamp surface).
  • each elastic body 16 is deformed so as to be recessed by the respective mounting component 102. More specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the cavity 16 so that the portion 16b of the elastic body 16 exceeds the back surface 102a of the mounting component 102.
  • the recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • each mounted component 102 since each mounted component 102 inevitably varies in height from the substrate 101 when mounted, it may be difficult to absorb the variation in height with only the thin film F. is there. For this reason, it is possible to absorb variations in the mounting height of the mounting component 102 by providing the elastic body 16 at each position of the mounting component 102.
  • the resin R can be prevented from leaking to the back surface 102a of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. .
  • the resin R can be prevented from leaking to the back surface 102a of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. .
  • the resin R is molded on the outer periphery of the elastic body 16 at the end face of the cavity piece 17, the resin can be molded with a desired dimensional accuracy, and the surface of the molded product supporting the heat sink can be set to an arbitrary height. It can be reliably molded. Further, since the elastic body 16 is provided for each mounting component 102, it can be partially replaced, and there is an effect that maintenance is easy.
  • FIG. 9 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened.
  • the elastic body 16 has a facing surface 16ab facing the plurality of mounting components 102 wider than the back surfaces 102a (clamp surfaces) of the plurality of mounting components 102. In this case, since it is not necessary to provide the elastic body recesses 21 by the number of the mounting components 102, a simple mold configuration can be achieved.
  • the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the back surface 102a of each mounting component 102.
  • the cavity recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • each mounting component 102 when molding is performed using one elastic body 16, the back surface of each mounting component 102 is formed by the portion 16 b of the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15 around each mounting component 102. It is possible to prevent the resin R from leaking to 102. Thereby, it is possible to prevent the flash from occurring on the back surface 102a of each mounted component 102 with a simple configuration. Therefore, a resin mold product capable of preventing flashing can be manufactured at a low cost.
  • FIGS. 10 and 11 are cross-sectional views schematically showing the main part of the resin mold 10 in the present embodiment.
  • the workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips).
  • a substrate 101 for example, a wiring substrate
  • a plurality of mounting components 102 for example, chip components such as semiconductor chips.
  • a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
  • a part 16e (protruding facing surface) of the facing surface 16ab of the elastic body 16C is formed in the cavity recess 15 so as to correspond to each mounting component 102. Is provided so as to protrude from the inner bottom surface 15a.
  • the other part excluding the part 16e of the facing surface 16ab of the elastic body 16C is provided so as to be flush with the inner bottom surface 15a of the cavity recess 15.
  • the elastic body 16 ⁇ / b> C has a shape in which a part 16 e of the facing surface 16 ab facing the mounting component 102 is wider than the back surface 102 a (clamp surface) of the mounting component 102.
  • the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface of the portion 16a of the elastic body 16 (a part 16e of the facing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of each mounting component 102. So as to protrude from the inner bottom surface 15a of the cavity recess 15 into the cavity C.
  • the resin R can be prevented from leaking to the back surface 102 of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. . Accordingly, the upper surface of the molded product can be formed flat by the facing surface 16ab that is maintained flat in the elastic body 16C while preventing flash from occurring on the back surface 102a of each mounted component 102. Therefore, it is possible to efficiently produce a resin mold product with high heat generation using a heat sink. Further, unlike the fifth embodiment, there is no need to provide the recesses 21 for the elastic body according to the number of the mounting components 102, so that a resin mold product using a heat sink can be produced with a simple mold.
  • FIG. 12 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the resin mold 10 in the present embodiment has a swivel structure in which the upper mold 11A can tilt the swivel piece 17C.
  • the upper mold 11A of the swivel structure includes a swivel piece 17C, a guide piece 18 that supports the swivel piece 17C in a suspended manner, and a spring 19 that is elastically mounted between the swivel piece 17C and the guide piece 18.
  • a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided.
  • a swivel piece 17C constituting the inner bottom surface 15a of the cavity concave portion 15 is provided (assembled) together with the guide piece 18 in the concave portion 20 for the piece.
  • a convex spherical surface portion 17f is provided on the surface opposite to the inner bottom surface 15a of the swivel piece 17C.
  • the guide piece 18 facing the convex spherical portion 17f is provided with a concave spherical portion 18a.
  • a spring 19 is provided around the convex spherical portion 17f and the concave spherical portion 18a.
  • the swivel piece 17C which is a cavity piece, tilts with the convex spherical portion 17f guided by the concave spherical portion 18a.
  • the swivel piece 17 ⁇ / b> C is provided with an elastic recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15.
  • the elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 into the cavity recess 15.
  • the workpiece W in the present embodiment is a workpiece in which a plurality of semiconductor chips 112 are sandwiched between an upper electrode 110 and a lower electrode 111 formed of, for example, a lead frame.
  • the semiconductor chip 112 is joined to the upper electrode 110 on the upper surface side and the lower electrode 111 on the lower surface side by solder.
  • the upper electrode 110 and the lower electrode 111 are also used as a heat sink.
  • different types of semiconductor chips 112 for example, IGBT elements and flywheel diode elements used in an inverter structure
  • the upper electrode 110 is inclined with respect to the lower electrode 111.
  • work W in this embodiment is arrange
  • the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to the upper electrode 110 in a state where the mold is opened.
  • the elastic body 16 has a shape in which the facing surface 16ab facing the upper electrode 110 is wider than the upper surface (clamp surface) of the upper electrode 110.
  • the elastic body 16 is deformed so as to be recessed by the upper electrode 110. Specifically, the surface of the portion 16a of the elastic body 16 (opposing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the upper surface 110a of the upper electrode 110.
  • the recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
  • the swivel piece 17C tilts following the inclination, so that the workpiece W can be clamped while preventing the one-side contact.
  • the resin R can be prevented from leaking to the upper surface 110a of the upper electrode 110 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the upper electrode 110. Thereby, it is possible to prevent the flash from occurring on the upper surface 110a of the upper electrode 110. Therefore, it is possible to prevent the occurrence of flash even with a workpiece W having a variation in thickness or tilting.
  • FIG. 13 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
  • the elastic body 16D is formed in a rectangular frame shape that is arranged along the outer periphery of the mounting component 102.
  • the cavity piece 17D is provided with a convex portion 17a protruding from the inner bottom surface 21a of the elastic body concave portion 21. That is, the elastic body 16D is provided in the elastic body concave portion 21 of the cavity piece 17D so as to be fitted into the rectangular frame-shaped elastic body 16D along the outer periphery of the convex portion 17a.
  • the elastic body 16D is formed to have such a width that the position of the inner peripheral surface thereof covers the position of the outermost bump 103. According to this, the deformation of the mounting component 102 when clamped is prevented. can do.
  • the mounting component 102 By using the elastic body 16D arranged along the outer periphery of the mounting component 102, since the elastic body 16D is not provided in the pressure-resistant region, the mounting component 102 is pressed by the pressure of the resin R filled in the cavity C. It can be surely prevented from floating. Accordingly, the above-described deformation of the mounting component 102 can be prevented while reliably preventing flash. Also in the present embodiment, a gap directed toward the cavity C is formed between the elastic body 16D and the cavity piece 17D, but the resin F enters the gap by using the film F. It can be formed continuously.
  • the recessed part 17b provided so that it might dent in the outer wall surface of the convex part 17a of cavity piece 17D, and the wall surface facing this wall surface so that it might protrude from the inner wall surface and outer wall surface of rectangular-frame-shaped elastic body 16D. It is also possible to fix the elastic body 16D to the cavity piece 17D by fitting the convex portion 16c.
  • the elastic body 16 made of the same material has a plate shape in which the thickness of the portion 16a facing the mounting component 102 and the thickness of the portion 16b facing the periphery of the mounting component 102 are the same.
  • the elastic body is made of a material having a hard portion facing the mounting component and a softness in the portion facing the mounting component, and facing the mounting component and the periphery of the mounting component. It may have a plate-like shape with the same thickness. According to this, the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
  • the configuration example in which the elastic body 16 is fitted in the recess 21 for the elastic body provided on the lower surface of the cavity piece 17 has been described.
  • the elastic body is attached to the cavity piece having the flat lower surface. It is good also as a structure to attach. According to this, since it is not necessary to form the concave portion for the elastic body according to the arrangement of the mounting component 102, the same cavity piece can be used even if the arrangement of the mounting component 102 changes. Moreover, it is good also as a structure which can provide the unevenness

Abstract

The problem addressed by the present invention is to provide a resin mold tooling allowing the production yield of a resin-molded product to be improved. As a solution, provided is a resin mold tooling (10) whereby a workpiece (W) having a to-be-mounted component (102) is clamped with an upper mold (11) and a lower mold (12) and resin-molded in such a way that the back face (102a) of the to-be-mounted component (102) is left exposed, wherein: a parting face (11a) of the upper mold (11) is provided with a cavity recess (15); the workpiece (W) is disposed on a parting face (12a) of the lower mold (12); the resin mold tooling is provided with an elastic body (16) which is provided so as to protrude from an internal bottom face (15a) of the cavity recess (15) and which is for pressing onto the to-be-mounted component (102); and an opposing face (16ab) of the elastic body (16) which opposes the to-be-mounted component (102) and protrudes from the internal bottom face (15a) of the cavity recess (15) is larger than a back face (102a) of the to-be-mounted component (102).

Description

樹脂モールド金型および樹脂モールド方法Resin mold and resin molding method
　本発明は、樹脂モールド金型および樹脂モールド方法に適用して有効な技術に関する。 The present invention relates to a technique effective when applied to a resin mold and a resin molding method.
　特開２０１０－１０９２５２号公報（以下、「特許文献１」という。）には、配線基板にフリップチップ実装された半導体チップの裏面（実装された側の面と反対側の面）を露出させて樹脂モールド成形する技術が記載されている。具体的には、露出させる半導体チップの裏面をリリースフィルムで覆って樹脂モールドを行う技術である。 Japanese Unexamined Patent Application Publication No. 2010-109252 (hereinafter referred to as “Patent Document 1”) exposes the back surface (surface opposite to the mounted surface) of a semiconductor chip flip-chip mounted on a wiring board. A technique for resin molding is described. Specifically, it is a technique of performing resin molding by covering the back surface of the exposed semiconductor chip with a release film.
特開２０１０－１０９２５２号公報JP 2010-109252 A
　しかしながら、特許文献１に記載の技術では、樹脂モールドの際に半導体チップの裏面とリリースフィルムとの境界に樹脂が入り込んで、半導体チップの裏面にフラッシュ（樹脂バリ）が発生してしまうおそれがある。フラッシュが発生した樹脂モールド製品（成形品）では、例えば、半導体チップの裏面へのヒートシンクの接続性が低下してしまう。このような場合の樹脂モールド製品は不良品として扱われ、その製造歩留まりが低下したり、フラッシュの除去の工程が必要となり製造コストが増加したりする。 However, in the technique described in Patent Document 1, there is a possibility that the resin enters the boundary between the back surface of the semiconductor chip and the release film during resin molding, and flash (resin burr) is generated on the back surface of the semiconductor chip. . In the resin mold product (molded product) in which the flash is generated, for example, the connectivity of the heat sink to the back surface of the semiconductor chip is deteriorated. In such a case, the resin molded product is treated as a defective product, and its manufacturing yield is reduced, or a flash removal process is required, resulting in an increase in manufacturing cost.
　本発明の目的は、樹脂モールド製品の製造歩留まりを向上させることのできる樹脂モールド金型を提供することにある。本発明の前記ならびにその他の目的と新規な特徴は、本明細書の記述および添付図面から明らかになるであろう。 An object of the present invention is to provide a resin mold mold capable of improving the production yield of resin mold products. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
　本願において開示される発明のうち、代表的なものの概要を簡単に説明すれば、次のとおりである。 Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.
　本発明の一実施形態における樹脂モールド金型は、一方および他方の金型で実装部品を有するワークをクランプし、前記実装部品のクランプ面を露出させるように樹脂モールドする樹脂モールド金型であって、前記一方の金型のパーティング面には、キャビティ凹部が設けられ、前記他方の金型のパーティング面には、前記ワークが配置され、前記キャビティ凹部の内底面から突出するように設けられた前記実装部品を押圧する弾性体を備え、前記キャビティ凹部の内底面から突出し、前記実装部品と対向する前記弾性体の対向面が、前記実装部品のクランプ面よりも広いことを特徴とする。 A resin mold mold according to an embodiment of the present invention is a resin mold mold that clamps a workpiece having a mounting component with one and the other mold, and performs resin molding so that a clamp surface of the mounting component is exposed. A cavity recess is provided on the parting surface of the one mold, and the workpiece is disposed on the parting surface of the other mold so as to protrude from the inner bottom surface of the cavity recess. In addition, an elastic body that presses the mounting component is provided, the opposing surface of the elastic body that protrudes from the inner bottom surface of the cavity recess and faces the mounting component is wider than the clamping surface of the mounting component.
　また、本発明の一実施形態における樹脂モールド方法は、一方および他方の金型で実装部品を有するワークをクランプし、前記実装部品のクランプ面を露出させるように樹脂モールドする樹脂モールド方法であって、前記一方の金型のパーティング面にはキャビティ凹部が設けられ、前記キャビティ凹部の内底面には該内底面から突出する弾性体が設けられ、前記キャビティ凹部の内底面から突出して前記実装部品と対向する対向面が、前記実装部品のクランプ面よりも広い前記弾性体を用い、前記他方の金型のパーティング面に前記ワークを配置して該ワークをクランプし、前記弾性体で前記実装部品を押圧することによって、前記実装部品で前記弾性体が凹まされて、前記実装部品の周囲でクランプ面を越えるように前記弾性体を突出させた後、前記キャビティ凹部内に樹脂を注入し、前記キャビティ凹部内で充填された前記樹脂を熱硬化させることを特徴とする樹脂モールド方法。 The resin molding method according to an embodiment of the present invention is a resin molding method in which a workpiece having a mounting component is clamped by one and the other molds, and the resin molding is performed so as to expose a clamp surface of the mounting component. A cavity recess is provided in the parting surface of the one mold, and an elastic body protruding from the inner bottom surface is provided on the inner bottom surface of the cavity recess, and the mounting component protrudes from the inner bottom surface of the cavity recess. Using the elastic body whose opposing surface is wider than the clamping surface of the mounting component, disposing the work on the parting surface of the other mold and clamping the work, and mounting the elastic body with the elastic body By pressing the component, the elastic body is recessed in the mounting component, and the elastic body protrudes so as to exceed the clamp surface around the mounting component. After the resin is injected into the cavities, the resin molding method for causing the resin filled in the cavity recesses thermoset.
　これによれば、実装部品で弾性体が凹まされて、実装部品の周囲でクランプ面を越えるように弾性体が突出し、実装部品（例えば、半導体チップ）のクランプ面へ樹脂が漏れるのを防止する（樹脂の流れを遮る）ことができる。これにより、実装部品のクランプ面でフラッシュ（樹脂バリ）が発生してしまうのを防止することができる。また、各ワーク間での実装部品の高さばらつきや、実装部品が湾曲していた場合であっても、弾性体で吸収することができる。したがって、樹脂モールド製品の製造歩留まりを向上させることができる。 According to this, the elastic body is recessed in the mounting component, the elastic body protrudes so as to exceed the clamp surface around the mounting component, and the resin is prevented from leaking to the clamp surface of the mounting component (for example, a semiconductor chip). (Blocks the flow of resin). Thereby, it is possible to prevent a flash (resin burr) from being generated on the clamp surface of the mounted component. Further, even if the mounting component is uneven in height between the workpieces or the mounting component is curved, it can be absorbed by the elastic body. Therefore, the production yield of the resin mold product can be improved.
　また、前記一実施形態における樹脂モールド金型において、前記弾性体は、前記実装部品と対向する部分が薄く、該実装部品の周囲と対向する部分が厚い形状に構成されていることがより好ましい。 Further, in the resin mold according to the embodiment, it is more preferable that the elastic body is formed in a shape in which a portion facing the mounting component is thin and a portion facing the periphery of the mounting component is thick.
　これによれば、実装部品の周囲でクランプ面を越えるように、弾性体がより突出しやすくなる。 According to this, the elastic body more easily protrudes so as to exceed the clamp surface around the mounted component.
　また、前記一実施形態における樹脂モールド金型において、前記一方の金型には、前記キャビティ凹部の内底面を構成するキャビティ駒が設けられ、前記キャビティ駒に、前記弾性体が設けられていることがより好ましい。 Moreover, in the resin mold die according to the embodiment, the one die is provided with a cavity piece constituting an inner bottom surface of the cavity recess, and the cavity piece is provided with the elastic body. Is more preferable.
　これによれば、キャビティ駒を介することで、一方の金型において弾性体を組み付けやすくなる。また、ワークをクランプした際に弾性体がクランプ方向と交差する方向に広がろうとするのを、キャビティ駒が壁となって防止することができる。 According to this, it becomes easy to assemble the elastic body in one mold through the cavity piece. Further, when the workpiece is clamped, the cavity piece can prevent the elastic body from spreading in the direction intersecting with the clamping direction.
　また、前記一実施形態における樹脂モールド金型において、前記キャビティ駒は、ライナーを介して前記一方の金型に設けられていることがより好ましい。 In the resin mold according to the embodiment, it is more preferable that the cavity piece is provided in the one mold through a liner.
　これによれば、キャビティ駒の位置調整や、各ワークの高さばらつき調整を容易に行うことができる。 According to this, the position adjustment of the cavity piece and the height variation adjustment of each workpiece can be easily performed.
　また、前記一実施形態における樹脂モールド金型において、前記弾性体の対向面および前記キャビティ凹部の内面を含む前記一方の金型のパーティング面にフィルムが設けられていることが好ましい。 In the resin mold according to the embodiment, it is preferable that a film is provided on the parting surface of the one mold including the opposing surface of the elastic body and the inner surface of the cavity recess.
　これによれば、フィルムで弾性体を保護することができ、ヒビや劣化などの発生を防止して弾性体の耐久性を向上させ、また弾性体の樹脂に対する耐薬品性も向上させることができる。 According to this, the elastic body can be protected by the film, the occurrence of cracks and deterioration can be prevented, the durability of the elastic body can be improved, and the chemical resistance of the elastic body to the resin can also be improved. .
　前記一実施形態における樹脂モールド金型において、前記弾性体の突出厚みが、前記実装部品のクランプ面の平坦度よりも厚いことがより好ましい。 In the resin mold according to the embodiment, it is more preferable that the protruding thickness of the elastic body is thicker than the flatness of the clamp surface of the mounted component.
　これによれば、ワークをクランプした状態で、より確実に、実装部品の周囲で弾性体をキャビティ凹部の内底面から突出させることができる。 According to this, the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
　また、前記一実施形態における樹脂モールド金型において、前記弾性体の圧縮応力が、前記実装部品の耐力よりも低く、成形圧力よりも高いことがより好ましい。 In the resin mold according to the embodiment, it is more preferable that the compressive stress of the elastic body is lower than the yield strength of the mounted component and higher than the molding pressure.
　これによれば、実装部品によって弾性体が凹まされるように変形される一方、成形圧力によって弾性体が変形されるのを防止することができる。 According to this, it is possible to prevent the elastic body from being deformed by the molding pressure while the elastic body is deformed so as to be recessed by the mounting component.
　本願において開示される発明のうち、代表的なものによって得られる効果を簡単に説明すれば次のとおりである。 Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.
　本発明の一実施形態における樹脂モールド金型によれば、樹脂モールド製品の製造歩留まりを向上させることができる。 According to the resin mold in one embodiment of the present invention, the production yield of resin mold products can be improved.
本発明の一実施形態における動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement in one Embodiment of this invention. 図１に続く動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement following FIG. 図２に続く動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement following FIG. 本発明の一実施形態における樹脂モールド製品を模式的に示す断面図である。It is sectional drawing which shows typically the resin mold product in one Embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement in other embodiment of this invention. 図１０に続く動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement following FIG. 本発明の他の実施形態における動作中の樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in operation | movement in other embodiment of this invention. 本発明の他の実施形態における樹脂モールド金型の要部を模式的に示す断面図である。It is sectional drawing which shows typically the principal part of the resin mold metal mold | die in other embodiment of this invention. 本発明の他の実施形態における製造工程中の樹脂モールド製品を模式的に示す断面図である。It is sectional drawing which shows typically the resin mold product in the manufacturing process in other embodiment of this invention.
　以下の本発明における実施形態では、必要な場合に複数のセクションなどに分けて説明するが、原則、それらはお互いに無関係ではなく、一方は他方の一部または全部の変形例、詳細などの関係にある。このため、全図において、同一の機能を有する部材には同一の符号を付し、その繰り返しの説明は省略する。 In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.
　また、構成要素の数（個数、数値、量、範囲などを含む）については、特に明示した場合や原理的に明らかに特定の数に限定される場合などを除き、その特定の数に限定されるものではなく、特定の数以上でも以下でも良い。また、構成要素などの形状に言及するときは、特に明示した場合および原理的に明らかにそうではないと考えられる場合などを除き、実質的にその形状などに近似または類似するものなどを含むものとする。 In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .
　（実施形態１）
　まず、本実施形態における樹脂モールド金型１０（樹脂モールド金型機構）の概略構成について、図１～図４を参照して説明する。図１～図３には、動作中（製造工程中）の樹脂モールド金型１０の要部断面が模式的に示されている。図４には、樹脂モールド金型１０から得られた樹脂モールド製品１００（ワークＷ）が模式的に示されている。 (Embodiment 1)
First, a schematic configuration of the resin mold 10 (resin mold mechanism) in the present embodiment will be described with reference to FIGS. FIG. 1 to FIG. 3 schematically show a cross section of the main part of the resin mold 10 during operation (during the manufacturing process). FIG. 4 schematically shows a resin mold product 100 (work W) obtained from the resin mold 10.
　樹脂モールド金型１０は、一対の金型（上型１１、下型１２）を備えて構成されている。樹脂モールド金型１０では、上型１１と下型１２でワークＷをクランプしてキャビティＣが形成され、そのキャビティＣ内に充填された樹脂Ｒを保圧した状態で熱硬化させて樹脂モールド製品１００を製造（形成）する処理が行われる。 The resin mold 10 is configured to include a pair of molds (upper mold 11 and lower mold 12). In the resin mold 10, the workpiece C is clamped by the upper mold 11 and the lower mold 12 to form a cavity C, and the resin R filled in the cavity C is thermally cured in a state where the resin R is held and is molded into a resin mold. Processing to manufacture (form) 100 is performed.
　ここで、ワークＷは、基板１０１（例えば、配線基板）と、実装部品１０２（例えば、半導体チップなどのチップ部品）とを備えている。このワークＷが成形品（樹脂モールド製品１００）となると、複数のバンプ１０３を介して基板１０１上に実装部品１０２がフリップチップ実装され、実装された側の主面と反対側の裏面１０２ａが露出され、その他の面（主面、側面）が樹脂モールドされる。ワークＷがクランプされた状態では、上型１１と下型１２とで基板１０１がクランプされるとともに、実装部品１０２の裏面１０２ａもクランプされる。このため、本実施形態では、裏面１０２ａがクランプ面となる。 Here, the workpiece W includes a substrate 101 (for example, a wiring substrate) and a mounting component 102 (for example, a chip component such as a semiconductor chip). When the workpiece W becomes a molded product (resin mold product 100), the mounting component 102 is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed. The other surfaces (main surface, side surface) are resin-molded. In a state where the workpiece W is clamped, the substrate 101 is clamped by the upper mold 11 and the lower mold 12, and the back surface 102a of the mounting component 102 is also clamped. For this reason, in this embodiment, the back surface 102a becomes a clamp surface.
　なお、実装部品１０２としては、放熱が必要となるようなメモリやロジック用チップや、発光面や受光面を有する光チップ、上下面に電気的な接続端子を有するＴＳＶ型のチップなどの各種の半導体チップを用いることもできる。また、実装部品１０２として、ワークＷにおける上下貫通電極として機能する導電体や、ワークＷに含まれる半導体チップからの熱を放熱するための放熱板や、ワークＷに含まれる半導体チップに接続されるインタポーザ基板を用いてもよい。 The mounting component 102 includes various types of memory and logic chips that require heat dissipation, optical chips having a light emitting surface and a light receiving surface, and TSV type chips having electrical connection terminals on the upper and lower surfaces. A semiconductor chip can also be used. Further, the mounting component 102 is connected to a conductor functioning as an upper and lower through electrode in the work W, a heat radiating plate for radiating heat from a semiconductor chip included in the work W, and a semiconductor chip included in the work W. An interposer substrate may be used.
　樹脂モールド金型１０では、キャビティＣに連通する樹脂路を介してキャビティＣへ樹脂を圧送（注入）する処理が公知のトランスファ機構によって行われる。また、樹脂モールド金型１０を開閉したり、樹脂モールド部を成形する際の成形圧力に耐えうるようプレスしたりする処理が公知のプレス機構によって行われる。また、樹脂モールド金型１０は、上型１１を固定型、下型１２を可動型として、プレス機構によって型開閉可能な構成としてもよいし、上型１１を可動型、下型１２を固定型としたり、上型１１と下型１２とも可動型としたりしてもよい。 In the resin mold 10, a process of pumping (injecting) resin into the cavity C via a resin path communicating with the cavity C is performed by a known transfer mechanism. Moreover, the process which opens and closes the resin mold metal mold | die 10, or presses it so that it can endure the molding pressure at the time of shape | molding the resin mold part is performed by a well-known press mechanism. The resin mold 10 may be configured such that the upper mold 11 is a fixed mold and the lower mold 12 is a movable mold, and the mold can be opened and closed by a press mechanism. The upper mold 11 is a movable mold and the lower mold 12 is a fixed mold. Alternatively, the upper mold 11 and the lower mold 12 may be movable.
　樹脂モールド金型１０では、下型１２にポット（図示せず）およびワークＷが載置（配置）されるワーク載置部１３が設けられている。ワーク載置部１３は、下型１２のパーティング面１２ａから凹むように設けられている。また、樹脂モールド金型１０では、上型１１にカル（図示せず）、ランナ・ゲート１４、キャビティＣを構成するキャビティ凹部１５が設けられている。カル、ランナ・ゲート１４、およびキャビティ凹部１５は、上型１１のパーティング面１１ａから凹むように設けられている。また、樹脂モールド金型１０では、図示しないヒータが設けられている。このヒータによって樹脂モールド金型１０は所定温度（例えば１８０℃）まで加熱可能な構成となっている。 In the resin mold 10, the lower mold 12 is provided with a pot (not shown) and a workpiece placement portion 13 on which the workpiece W is placed (arranged). The work placement unit 13 is provided so as to be recessed from the parting surface 12 a of the lower mold 12. In the resin mold 10, the upper die 11 is provided with a cull (not shown), a runner gate 14, and a cavity recess 15 that constitutes a cavity C. The cull, the runner gate 14 and the cavity recess 15 are provided so as to be recessed from the parting surface 11 a of the upper mold 11. Further, the resin mold 10 is provided with a heater (not shown). With this heater, the resin mold 10 can be heated to a predetermined temperature (for example, 180 ° C.).
　また、樹脂モールド金型１０は、キャビティ凹部１５の内底面１５ａ（キャビティ駒１７の下面）からキャビティ凹部１５内へ突出するように設けられた、実装部品１０２を押圧する弾性体１６を備えている。キャビティ凹部１５の内底面１５ａから凹む弾性体用凹部２１が設けられており、弾性体１６は、弾性体用凹部２１に設けられている。 The resin mold 10 includes an elastic body 16 that presses the mounting component 102 and is provided so as to protrude from the inner bottom surface 15 a of the cavity recess 15 (the lower surface of the cavity piece 17) into the cavity recess 15. . An elastic body recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided, and the elastic body 16 is provided in the elastic body recess 21.
　この弾性体１６は、実装部品１０２と対向する対向面１６ａｂが、実装部品１０２の裏面１０２ａ（クランプ面）よりも広い形状をしている。また、弾性体１６は、例えば、フッ素ゴムやシリコーンゴムなどのゴム材質から構成されるものや、ＰＥＥＫ（ポリエーテルエーテルケトン）材などのエンジニアリングプラスチックから構成されるものであってもよい。 The elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the back surface 102a (clamping surface) of the mounting component 102. The elastic body 16 may be made of, for example, a rubber material such as fluorine rubber or silicone rubber, or an engineering plastic such as a PEEK (polyether ether ketone) material.
　本実施形態では、弾性体１６を上型１１に組み付けるにあたり、樹脂モールド金型１０は、上型１１に設けられた、キャビティ凹部１５の内底面１５ａを構成するキャビティ駒１７（金型ブロック）を備えている。この上型１１では、キャビティ凹部１５の内底面１５ａから凹む駒用凹部２０が設けられている。この駒用凹部２０に、キャビティ凹部１５の内底面１５ａから突出されずに、キャビティ駒１７が設けられる（組み付けられる）。 In this embodiment, when assembling the elastic body 16 to the upper mold 11, the resin mold 10 is provided with a cavity piece 17 (mold block) provided on the upper mold 11 and constituting the inner bottom surface 15 a of the cavity recess 15. I have. The upper die 11 is provided with a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15. A cavity piece 17 is provided (assembled) in the piece recess 20 without protruding from the inner bottom surface 15 a of the cavity recess 15.
　このキャビティ駒１７には、弾性体用凹部２１が設けられている。弾性体１６は、例えば、接着剤によってキャビティ駒１７に接着して固定される。このため、キャビティ駒１７は、弾性体１６を保持するものとなる。したがって、本実施形態では、キャビティ駒１７に弾性体１６が設けられて、弾性体１６と一体となったキャビティ駒１７が上型１１に組み付けられる。キャビティ駒１７を用いずに直接上型１１に弾性体１６を組み付けることも考えられるが、キャビティ駒１７を介することで、上型１１において弾性体１６を組み付けやすくなる。また、弾性体１６は例えば加熱や変形などによって所望のシール性を確保できなくなったときには、交換して用いることができる。 The cavity piece 17 is provided with a recess 21 for an elastic body. The elastic body 16 is fixed to the cavity piece 17 by, for example, an adhesive. For this reason, the cavity piece 17 holds the elastic body 16. Therefore, in this embodiment, the cavity piece 17 is provided with the elastic body 16, and the cavity piece 17 integrated with the elastic body 16 is assembled to the upper mold 11. Although it is conceivable to attach the elastic body 16 directly to the upper mold 11 without using the cavity piece 17, the elastic body 16 can be easily assembled to the upper mold 11 through the cavity piece 17. The elastic body 16 can be replaced and used when a desired sealing property cannot be ensured due to, for example, heating or deformation.
　また、樹脂モールド金型１０は、駒用凹部２０の内底面２０ａに設けられたライナー２２を備えている。このライナー２２を介してキャビティ駒１７は上型１１に設けられている。ライナー２２を用いることで、駒用凹部２０内でのキャビティ駒１７の位置調整（高さ調整）を容易に行うことができる。なお、ライナー２２としては、本実施形態のような板状の金型ブロックの他に、圧力に応じて厚みを可変可能なスプリングや、挿抜することで厚みを可変可能なウエッジ部材も適用することができ、駒用凹部２０内でキャビティ駒１７を摺動させて、各ワークＷの高さ（厚み）ばらつきを調整することもできる。 Also, the resin mold 10 includes a liner 22 provided on the inner bottom surface 20a of the piece recess 20. The cavity piece 17 is provided on the upper mold 11 via the liner 22. By using the liner 22, the position adjustment (height adjustment) of the cavity piece 17 within the piece recess 20 can be easily performed. As the liner 22, in addition to the plate-like mold block as in the present embodiment, a spring whose thickness can be changed according to pressure, and a wedge member whose thickness can be changed by inserting and removing are also applied. It is also possible to adjust the height (thickness) variation of each workpiece W by sliding the cavity piece 17 within the piece recess 20.
　このような樹脂モールド金型１０において、型開きした状態では（図１参照）、弾性体１６の対向面１６ａｂおよびキャビティ凹部１５の内面を含む上型１１のパーティング面１１ａにリリースフィルム（以下、単に「フィルム」ともいう。）Ｆが張設される。また、下型１２のワーク載置部１３の内面を含むパーティング面１２ａ（ワーク載置部１３）にワークＷが配置される。また、型閉じ（型締め）した状態では（図２、図３参照）、キャビティ凹部１５を含んで構成されるキャビティＣが形成され、このキャビティＣと連通するように、ポット、カル、ランナ・ゲート１４を含んで構成される連通路（樹脂路）が形成される。 In such a resin mold 10, when the mold is opened (see FIG. 1), a release film (hereinafter, referred to as “parting surface 11 a”) of the upper mold 11 including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15 is formed. It is also simply called “film”.) F is stretched. Further, the workpiece W is arranged on the parting surface 12a (work placement portion 13) including the inner surface of the workpiece placement portion 13 of the lower mold 12. When the mold is closed (clamped) (see FIGS. 2 and 3), a cavity C including the cavity recess 15 is formed, and the pot, the cal, the runner, A communication path (resin path) including the gate 14 is formed.
　そして、図２、図３に示すように、ワークＷをクランプすることによって、弾性体１６が実装部品１０２を押圧し、その反作用で実装部品１０２によって弾性体１６が凹まされて、実装部品１０２の周囲で裏面１０２ａを越えるようにキャビティＣ内へ弾性体１６が突出する。このため、樹脂注入・充填の際に、実装部品１０２の裏面１０２ａへ樹脂Ｒが漏れるのを防止する（シールする）ことができる。 As shown in FIGS. 2 and 3, by clamping the workpiece W, the elastic body 16 presses the mounting component 102, and the elastic body 16 is recessed by the mounting component 102 due to the reaction, so that the mounting component 102 The elastic body 16 protrudes into the cavity C so as to exceed the back surface 102a. For this reason, it is possible to prevent (seal) the resin R from leaking to the back surface 102a of the mounting component 102 at the time of resin injection / filling.
　より具体的に説明する。本実施形態では、弾性体１６は、実装部品１０２と対向する部分１６ａ（弾性体１６の中央部）が耐圧領域となり、実装部品１０２の周囲と対向する部分１６ｂ（弾性体１６の外周部）がシール領域となる。この弾性体１６によって実装部品１０２の裏面１０２ａに対してフィルムＦを押し付けることで実装部品１０２の縁部分における隙間が無くなった状態となり、例えば、キャビティＣ内に充填された樹脂Ｒを保圧する際の成形圧力によっても、その隙間に樹脂Ｒが入り込むのを防止することができる。すなわち、実装部品１０２の裏面１０２ａでフラッシュ（樹脂バリ）が発生してしまうのを防止することができる。したがって、本実施形態における樹脂モールド金型１０によれば、樹脂モールド製品１００の製造歩留まりを向上させ、フラッシュ除去を不要として製造コストを削減させることができる。 More specific explanation. In the present embodiment, the elastic body 16 has a pressure-resistant region at a portion 16a (the central portion of the elastic body 16) facing the mounting component 102, and a portion 16b (the outer peripheral portion of the elastic body 16) facing the periphery of the mounting component 102. It becomes a seal area. By pressing the film F against the back surface 102a of the mounting component 102 by the elastic body 16, there is no gap in the edge portion of the mounting component 102. For example, when holding the resin R filled in the cavity C, Even with the molding pressure, the resin R can be prevented from entering the gap. That is, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounted component 102. Therefore, according to the resin mold 10 in the present embodiment, the manufacturing yield of the resin molded product 100 can be improved, and the manufacturing cost can be reduced by eliminating the need for flash removal.
　また、弾性体１６を用いることで、ワークＷのクランプの際、各ワークＷ間での実装部品１０２の高さばらつきや、実装部品１０２の裏面１０２ａが湾曲したり、凹凸したりしていた場合であっても、弾性体１６で吸収することができる。 In addition, when the workpiece W is clamped by using the elastic body 16, the height of the mounting component 102 between the workpieces W, or the back surface 102a of the mounting component 102 is curved or uneven. Even so, it can be absorbed by the elastic body 16.
　なお、フィルムＦは上型１１の凹凸形状への追従性、寸法精度、経済性などを考慮してかなり薄いものが用いられるために、フィルムＦだけでは上述したような実装部品１０２に起因して発生する隙間を十分に埋没させてフラッシュの防止をすることができないことがある。これに対し、フィルムＦと共に任意の厚みの弾性体１６を用いることで、実装部品１０２の裏面１０２ａの縁部分に発生する隙間を確実に埋没させることが可能となる。 In addition, since the film F is considerably thin considering the followability to the uneven shape of the upper mold 11, dimensional accuracy, economy, etc., the film F alone is caused by the mounting component 102 as described above. In some cases, the generated gap cannot be sufficiently buried to prevent flashing. On the other hand, by using the elastic body 16 having an arbitrary thickness together with the film F, the gap generated at the edge portion of the back surface 102a of the mounting component 102 can be surely buried.
　また、本実施形態では、型開きした状態で（図１参照）、キャビティ凹部１５の内底面１５ａから突出する弾性体１６の突出厚みＡは、例えば実装部品１０２の裏面１０２ａの平坦度よりも大きくなるようにすることができる。これによれば、ワークＷをクランプした状態で（図２参照）、より確実に、実装部品１０２の周囲で弾性体１６を、実装部品１０２の裏面１０２ａを越えるように突出させることができる。ただし、弾性体１６は、必ずしもキャビティ凹部１５の内底面１５ａから突出させる必要はない。この場合、実装部品１０２を弾性体１６に埋没させることで、実装部品１０２の裏面１０２ａの位置をキャビティ凹部１５の内底面１５ａの位置よりも高くさせることが可能となる。このように、弾性体１６の厚みは任意に設定することが可能である。 In the present embodiment, when the mold is opened (see FIG. 1), the protruding thickness A of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 is larger than the flatness of the back surface 102a of the mounting component 102, for example. Can be. According to this, in a state where the workpiece W is clamped (see FIG. 2), the elastic body 16 can be protruded more reliably around the mounting component 102 so as to exceed the back surface 102a of the mounting component 102. However, the elastic body 16 does not necessarily have to protrude from the inner bottom surface 15 a of the cavity recess 15. In this case, by burying the mounting component 102 in the elastic body 16, the position of the back surface 102 a of the mounting component 102 can be made higher than the position of the inner bottom surface 15 a of the cavity recess 15. Thus, the thickness of the elastic body 16 can be set arbitrarily.
　次に、本発明の一実施形態における樹脂モールド金型１０の動作（樹脂モールド方法、樹脂モールド製品１００の製造方法）について、図１～図４を参照して説明する。なお、樹脂モールド金型１０の組み付け段階において、上型１１には、図１に示すように、キャビティ凹部１５の内底面１５ａから突出するように弾性体用凹部２１に弾性体１６が設けられている。 Next, the operation of the resin mold 10 in one embodiment of the present invention (resin molding method, resin mold product 100 manufacturing method) will be described with reference to FIGS. In the assembly stage of the resin mold 10, the upper mold 11 is provided with the elastic body 16 in the elastic recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 as shown in FIG. 1. Yes.
　まず、図１に示すように、樹脂モールド金型１０が型開きした状態において、上型１１では、弾性体１６の対向面１６ａｂおよびキャビティ凹部１５の内面を含むパーティング面１１ａにフィルムＦを張設する。下型１２では、パーティング面１２ａ（ワーク載置部１３）にワークＷを配置し、ポットに樹脂Ｒを供給する。 First, as shown in FIG. 1, in the state where the resin mold 10 is opened, the upper mold 11 stretches the film F on the parting surface 11 a including the opposing surface 16 ab of the elastic body 16 and the inner surface of the cavity recess 15. Set up. In the lower mold 12, the workpiece W is disposed on the parting surface 12a (work placement portion 13), and the resin R is supplied to the pot.
　具体的には、上型１１では、フィルムＦが、ロール状に巻き取られた繰出しロールから引き出されて上型１１のパーティング面１１ａを通過して巻取りロールへ巻き取られるようにして設けられる。そして、フィルムＦが、上型１１のパーティング面１１ａにキャビティ駒１７間の隙間や図示しない吸引路（吸引孔）を利用した公知の吸引機構（真空ポンプ）により吸着保持されて、パーティング面１１ａに張設される。上型１１では、キャビティ凹部１５の内底面１５ａから突出するように弾性体用凹部２１に弾性体１６が設けられている。このため、内底面１５ａから突出している部分にもフィルムＦが張設されることとなる。 Specifically, the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. Then, the film F is adsorbed and held on the parting surface 11a of the upper mold 11 by a known suction mechanism (vacuum pump) using a gap between the cavity pieces 17 and a suction path (suction hole) (not shown). 11a is stretched. In the upper mold 11, the elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15. For this reason, the film F will be stretched also in the part which protrudes from the inner bottom face 15a.
　このフィルムＦは、樹脂モールド金型１０の加熱温度に耐えられる耐熱性を有し、上型１１のパーティング面１１ａから容易に剥離するものであって、柔軟性、伸展性を有するフィルム材である。フィルムＦとしては、例えば、ＰＴＦＥ、ＥＴＦＥ、ＰＥＴ、ＦＥＰ、フッ素含浸ガラスクロス、ポリプロピレン、ポリ塩化ビニリジンなどが好適に用いられる。 This film F is heat resistant enough to withstand the heating temperature of the resin mold 10 and is easily peeled off from the parting surface 11a of the upper mold 11 and is a film material having flexibility and extensibility. is there. As the film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.
　ここで、上型１１では、弾性体用凹部２１がキャビティ駒１７に設けられ、駒用凹部２０にキャビティ駒１７が設けられている。このため、キャビティ駒１７の外周側面と、駒用凹部２０の内壁面との間を吸引路としてフィルムＦが吸着保持させることができる。 Here, in the upper mold 11, the elastic body concave portion 21 is provided in the cavity piece 17, and the cavity piece 17 is provided in the piece concave portion 20. For this reason, the film F can be sucked and held between the outer peripheral side surface of the cavity piece 17 and the inner wall surface of the concave portion 20 for the piece as a suction path.
　また、下型１２では、図示しないローダによってワークＷが樹脂モールド金型１０まで搬送され、パーティング面１２ａにワークＷが配置される。また、図示しないローダによって樹脂Ｒ（例えば、タブレット状、顆粒状、粉状あるいは液状のモールド樹脂）が樹脂モールド金型１０まで搬送され、ポットに樹脂Ｒが供給される。樹脂モールド金型１０は内蔵ヒータによって所定温度に加熱されているため、ポットに供給された樹脂Ｒが溶融することとなる。 In the lower mold 12, the work W is transported to the resin mold 10 by a loader (not shown), and the work W is arranged on the parting surface 12a. In addition, a resin R (for example, a tablet, granule, powder, or liquid mold resin) is conveyed to the resin mold 10 by a loader (not shown), and the resin R is supplied to the pot. Since the resin mold 10 is heated to a predetermined temperature by the built-in heater, the resin R supplied to the pot is melted.
　続いて、図２に示すように、フィルムＦを介してワークＷをクランプし、キャビティ凹部１５を含めたキャビティＣを形成する。 Subsequently, as shown in FIG. 2, the workpiece W is clamped via the film F to form the cavity C including the cavity recess 15.
　具体的には、プレス機構によって上型１１と下型１２とを近接させていき、上型１１と下型１２とでワークＷをクランプする。本実施形態では、弾性体１６をキャビティ駒１７の弾性体用凹部２１に設けているので、キャビティ駒１７が弾性体１６を介してワークＷを押さえる（クランプする）こととなる。 Specifically, the upper die 11 and the lower die 12 are brought close to each other by a press mechanism, and the workpiece W is clamped by the upper die 11 and the lower die 12. In the present embodiment, since the elastic body 16 is provided in the elastic body recess 21 of the cavity piece 17, the cavity piece 17 presses (clamps) the workpiece W via the elastic body 16.
　本実施形態では、実装部品１０２やバンプ１０３よりも強度が低く変形しやすい弾性体１６を用いているため、ワークＷをクランプした状態で弾性体１６が実装部品１０２によって凹まされるように変形される。これによって、実装部品１０２で弾性体１６を凹ませて、実装部品１０２の周囲で弾性体１６をキャビティ凹部１５の内底面１５ａから突出させる。すなわち、弾性体１６の部分１６ａの表面（対向面１６ａｂ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂが実装部品１０２の裏面１０２ａを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。 In the present embodiment, since the elastic body 16 having a strength lower than that of the mounting component 102 and the bump 103 and easily deformable is used, the elastic body 16 is deformed so as to be recessed by the mounting component 102 while the workpiece W is clamped. . As a result, the elastic body 16 is recessed by the mounting component 102, and the elastic body 16 protrudes from the inner bottom surface 15 a of the cavity recess 15 around the mounting component 102. That is, the surface of the portion 16 a of the elastic body 16 (facing surface 16 ab) is flush with the inner bottom surface 15 a of the cavity recess 15 and the portion 16 b of the elastic body 16 exceeds the back surface 102 a of the mounting component 102. It protrudes into the cavity C from the inner bottom surface 15a.
　また、本実施形態では、弾性体１６は、全体が同一材料（例えば、フッ素ゴム）から構成されているものとし、実装部品１０２と対向する部分１６ａおよび実装部品１０２の周囲と対向する部分１６ｂの厚みが同じである板状の形状をしている。このため、例えば押し潰されて外側に変形させることができるような弾性率の弾性体１６を用いることで、ワークＷをクランプした状態で（図２参照）、弾性体１６の圧縮体積と、実装部品１０２を取り囲むように突出している弾性体１６の部分１６ｂの体積とが同じとなる。なお、このように圧縮させ外側に変形させることによって弾性体１６を実装部品１０２の外周で下方に突出させるのではなく、耐圧領域における弾性体１６を単に圧縮させるだけとして相対的にシール領域における弾性体１６を突出させてもよい。 Further, in the present embodiment, the elastic body 16 is entirely made of the same material (for example, fluororubber), and includes a portion 16a facing the mounting component 102 and a portion 16b facing the periphery of the mounting component 102. It has a plate shape with the same thickness. For this reason, for example, by using the elastic body 16 having an elastic modulus that can be crushed and deformed to the outside, the compressed volume of the elastic body 16 and the mounting can be obtained in a state where the workpiece W is clamped (see FIG. 2). The volume of the portion 16b of the elastic body 16 protruding so as to surround the component 102 is the same. The elastic body 16 does not protrude downward on the outer periphery of the mounting component 102 by being compressed and deformed outward in this way, but rather the elastic body 16 in the pressure resistant region is simply compressed, so that the elasticity in the seal region is relatively increased. The body 16 may protrude.
　なお、弾性体１６としては、フッ素樹脂の他にも、シリコーン樹脂や各種のエンジニアリングプラスチックを用いることもできる。この場合、弾性体１６としてＰＥＥＫ（ポリエーテルエーテルケトン）材のように強度の高いものを用いるときには、実装部品１０２やバンプ１０３の破損を防止するために、ライナー２２にスプリングを含む構成とするのが好ましい。 In addition, as the elastic body 16, in addition to the fluororesin, a silicone resin and various engineering plastics can be used. In this case, when a high strength material such as a PEEK (polyetheretherketone) material is used as the elastic body 16, the liner 22 includes a spring to prevent damage to the mounting component 102 and the bump 103. Is preferred.
　また、本実施形態では、弾性体用凹部２１がキャビティ駒１７に設けられている。上型１１に直接弾性体１６を設けることも考えられるが、キャビティ駒１７を介することで、上型１１において弾性体１６を保持しやすくなる。また、キャビティ駒１７に設けられた弾性体用凹部２１の内壁面（縁部）が壁となって、ワークＷをクランプした際に弾性体１６がクランプ方向と交差する方向（図２では左右方向が対応している）に広がるのを防止することができる。即ち、弾性体１６の外周がキャビティ駒１７に囲われているため、弾性体１６が側方に拡がることなく、例えば、上述したようにフィルムＦを吸着保持させるためのキャビティ駒１７の外周側面と駒用凹部２０の内壁面との間が塞がれてしまうことがなく、フィルムＦを確実に吸着保持することができる。 Further, in the present embodiment, the concave portion 21 for the elastic body is provided in the cavity piece 17. Although it is conceivable to provide the elastic body 16 directly on the upper mold 11, the elastic body 16 can be easily held in the upper mold 11 through the cavity piece 17. Further, the inner wall surface (edge) of the elastic body recess 21 provided in the cavity piece 17 serves as a wall, and the direction in which the elastic body 16 intersects the clamping direction when the workpiece W is clamped (the horizontal direction in FIG. 2). Can be prevented from spreading). That is, since the outer periphery of the elastic body 16 is surrounded by the cavity piece 17, the elastic body 16 does not spread laterally, for example, the outer peripheral side surface of the cavity piece 17 for adsorbing and holding the film F as described above The space between the inner wall surface of the recess 20 for the piece is not blocked, and the film F can be securely held by suction.
　また、本実施形態では、弾性体１６の対向面１６ａｂおよびキャビティ凹部１５の内面を含む上型１１のパーティング面１１ａにフィルムＦが設けられており、ワークＷをクランプした状態で、フィルムＦを介して弾性体１６が実装部品１０２で凹まされることが好ましい。フィルムＦを用いない構成も考えられるが、フィルムＦを用いることで、弾性体１６を保護することができる。具体的には、角張った実装部品１０２が押し付けられて損傷するのを防止したり、ヒビや劣化などの発生を防止して弾性体１６の耐久性を向上させたりすることができる。また、樹脂Ｒとの直接的な接触を防止して弾性体１６の樹脂Ｒによる劣化も防止することができる。換言すれば、樹脂Ｒによる耐食性を考慮せずに弾性体１６を選定することもできる。さらに、フィルムＦを用いることで、キャビティ駒１７とキャビティ凹部１５との隙間への樹脂Ｒの侵入を防止することができるため、この隙間に樹脂Ｒが充填されてしまうことで弾性体１６が変形したり、弾性体１６が樹脂Ｒの離型と共に外れたりするようなことがない。 In the present embodiment, the film F is provided on the parting surface 11a of the upper mold 11 including the opposing surface 16ab of the elastic body 16 and the inner surface of the cavity recess 15, and the film F is clamped while the workpiece W is clamped. The elastic body 16 is preferably recessed by the mounting component 102. Although the structure which does not use the film F is also considered, by using the film F, the elastic body 16 can be protected. Specifically, the angular mounting component 102 can be prevented from being pressed and damaged, and the durability of the elastic body 16 can be improved by preventing the occurrence of cracks and deterioration. Further, direct contact with the resin R can be prevented, and deterioration of the elastic body 16 due to the resin R can also be prevented. In other words, the elastic body 16 can be selected without considering the corrosion resistance due to the resin R. Furthermore, since the resin F can be prevented from entering the gap between the cavity piece 17 and the cavity recess 15 by using the film F, the elastic body 16 is deformed by filling the gap with the resin R. And the elastic body 16 does not come off with the release of the resin R.
　続いて、図３に示すように、トランスファ機構を駆動させてキャビティＣへ樹脂Ｒを注入し、キャビティＣ内に樹脂Ｒを充填完了させる。 Subsequently, as shown in FIG. 3, the transfer mechanism is driven to inject the resin R into the cavity C, and the filling of the resin R into the cavity C is completed.
　具体的には、下型１２のポット内で進退動可能に設けられたプランジャをカル側（上型１１側）へ進めて、ポット内で溶融している樹脂Ｒをプランジャ（の先端部）で押圧していく。プランジャで押圧された樹脂Ｒは、カル、ランナ・ゲート１４を通じてキャビティＣへ進入していく。すなわち、キャビティＣへ樹脂Ｒが注入されていく。そして、プランジャをカル側へさらに進めて、樹脂ＲをキャビティＣへ注入（圧送）していき、キャビティＣ内を樹脂Ｒで充填する。このとき、キャビティＣ内では樹脂ＲがフィルムＦを押圧するよう加圧される。 Specifically, the plunger provided in the pot of the lower mold 12 so as to be movable back and forth is advanced to the cull side (upper mold 11 side), and the resin R melted in the pot is moved by the plunger (tip portion). Press. The resin R pressed by the plunger enters the cavity C through the cull and runner gate 14. That is, the resin R is poured into the cavity C. Then, the plunger is further advanced toward the cull side to inject (pressure feed) the resin R into the cavity C, and the cavity C is filled with the resin R. At this time, the resin R is pressurized in the cavity C so as to press the film F.
　ところで、ワークＷは、基板１０１上に複数のバンプ１０３を介して実装部品１０２がフリップチップ実装されたものであるため、基板１０１の表面（実装面）と実装部品１０２の主面（バンプ１０３が形成された面）との狭隘な箇所にも樹脂Ｒが充填される（モールドアンダーフィル）。このようにモールドアンダーフィルに用いられる樹脂Ｒはバンプ１０３の間や実装部品１０２の下のような狭隘な箇所に充填可能であり、その一方で実装部品１０２上へのフラッシュも発生しやすいため、上述したようなシール構造が非常に効果的となる。 By the way, since the workpiece W is flip-chip mounted on the substrate 101 via a plurality of bumps 103, the surface of the substrate 101 (mounting surface) and the main surface of the mounting component 102 (bump 103 is formed). The resin R is also filled in a narrow area with the formed surface) (mold underfill). As described above, the resin R used for the mold underfill can be filled in a narrow space such as between the bumps 103 or under the mounting component 102, and on the other hand, flashing on the mounting component 102 is also likely to occur. The seal structure as described above is very effective.
　その後、キャビティＣ内で充填された樹脂Ｒを保圧した状態で熱硬化させ、離型した後にさらに熱硬化（ポストキュア）させることによって、図４に示すような樹脂モールド部１０４（樹脂Ｒ）を備えた樹脂モールド製品１００（ワークＷ）が成形品として略完成する。本実施形態では、樹脂モールド部１０４からは実装部品１０２の裏面１０２ａが露出している。また、平面視矩形状の実装部品１０２の裏面１０２ａを囲むように樹脂モールド部１０４に、キャビティ凹部１５の内底面１５ａから突出する弾性体１６（部分１６ｂ）に型取りされた周溝１０５が形成されている。 Thereafter, the resin R filled in the cavity C is thermally cured in a pressure-holding state, and after being released from the mold, it is further thermally cured (post-cure), whereby a resin mold portion 104 (resin R) as shown in FIG. The resin molded product 100 (work W) provided with is almost completed as a molded product. In the present embodiment, the back surface 102 a of the mounting component 102 is exposed from the resin mold portion 104. Further, a peripheral groove 105 formed by the elastic body 16 (part 16b) protruding from the inner bottom surface 15a of the cavity recess 15 is formed in the resin mold portion 104 so as to surround the back surface 102a of the mounting component 102 having a rectangular shape in plan view. Has been.
　本実施形態において、例えば保圧のときの成形圧力よりも高い圧縮応力の弾性体１６を用いることで、キャビティＣ内に充填された樹脂Ｒを保圧した状態で実装部品１０２の周囲と対向する弾性体１６の部分１６ｂが変形されるのを防止することもできる。 In the present embodiment, for example, the elastic body 16 having a compressive stress higher than the molding pressure at the time of holding pressure is used to face the periphery of the mounting component 102 in a state where the resin R filled in the cavity C is held. It is also possible to prevent the portion 16b of the elastic body 16 from being deformed.
　本実施形態では、実装部品１０２の周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、実装部品１０２の裏面１０２ａに樹脂Ｒが漏れるのを防止する（樹脂Ｒの流れを遮る）ことができる。これにより、実装部品１０２の裏面１０２ａでフラッシュ（樹脂バリ）が発生してしまうのを防止することができる。したがって、樹脂モールド製品１００の製造歩留まりを向上させ、フラッシュ除去を不要として製造コストを削減させることができる。 In this embodiment, the resin 16 is prevented from leaking to the back surface 102a of the mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the mounting component 102 (flow of the resin R). Can be interrupted). Thereby, it is possible to prevent a flash (resin burr) from occurring on the back surface 102a of the mounting component 102. Therefore, the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
　また、実装部品１０２の裏面１０２ａは、キャビティ凹部１５の内底面１５ａから突出している弾性体１６に埋没させながら封止されている。このため、実装部品１０２の裏面１０２ａと、樹脂モールド部１０４の表面（図４では上面）とが面一となり、例えば、接続面が平坦面となるヒートシンクを用いても裏面１０２ａと樹脂モールド部１０４の表面とに接触させて接続することができ、安価なヒートシンクを用いることが可能である。 Further, the back surface 102 a of the mounting component 102 is sealed while being buried in the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15. For this reason, the back surface 102a of the mounting component 102 and the front surface (upper surface in FIG. 4) of the resin mold portion 104 are flush with each other. For example, even if a heat sink having a flat connection surface is used, the back surface 102a and the resin mold portion 104 are used. It is possible to use an inexpensive heat sink.
　（実施形態２）
　前記実施形態１では、弾性体１６の形状が、耐圧領域とシール領域との厚みを同じにした板状のものを用いた場合について説明した。本実施形態では、弾性体１６Ａの形状が、耐圧領域とシール領域との厚みが異なるものを用いる場合について、図５を参照して説明する。図５は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 2)
In the first embodiment, the case where the elastic body 16 has a plate shape in which the pressure-resistant region and the seal region have the same thickness has been described. In the present embodiment, the case where the elastic body 16A has a different shape between the pressure resistant region and the seal region will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　型開きした状態では、弾性体１６Ａは、対向面１６ａｂが平坦であり、これを基準として肉厚が弾性体１６Ａの中央部（部分１６ａ）で薄く、その外周部（部分１６ｂ）で厚くなった凹状の形状で構成されている。この弾性体１６Ａをキャビティ駒１７Ａの弾性体用凹部２１に設けるにあたり、キャビティ駒１７Ａには、弾性体用凹部２１の内底面２１ａから突出する凸部１７ａを設けている。すなわち、この凸部１７ａを凹状の弾性体１６Ａに嵌め込むようにして、キャビティ駒１７Ａの弾性体用凹部２１に弾性体１６Ａが設けられる（組み付けられる）。 In the state where the mold is opened, the elastic body 16A has a flat opposing surface 16ab, and with reference to this, the thickness is thin at the center (part 16a) of the elastic body 16A and thick at the outer peripheral part (part 16b). It has a concave shape. When the elastic body 16A is provided in the elastic body recess 21 of the cavity piece 17A, the cavity piece 17A is provided with a protrusion 17a protruding from the inner bottom surface 21a of the elastic body recess 21. In other words, the elastic body 16A is provided (assembled) in the elastic concave portion 21 of the cavity piece 17A so that the convex portion 17a is fitted into the concave elastic body 16A.
　このような厚みが異形状の弾性体１６Ａを用いることで、耐圧領域における弾性体１６Ａの厚みを薄くして、キャビティＣ内に充填された樹脂Ｒの圧力によって実装部品１０２が浮き上がってしまうのを防止することができる。すなわち、基板１０１と実装部品１０２との間に充填された樹脂Ｒの樹脂圧により、弾性体１６Ａが厚い場合には弾性体１６Ａに支持された実装部品１０２は中高になるように変形してしまうことがある。これに対して、耐圧領域における弾性体１６Ａの厚みを薄くする（言い換えると、凸部１７ａを設ける）ことでこのような実装部品１０２の変形を防止することができる。 By using the elastic body 16A having an irregular shape, the thickness of the elastic body 16A in the pressure-resistant region is reduced, and the mounting component 102 is lifted by the pressure of the resin R filled in the cavity C. Can be prevented. That is, when the elastic body 16A is thick due to the resin pressure of the resin R filled between the substrate 101 and the mounting component 102, the mounting component 102 supported by the elastic body 16A is deformed so as to have a medium height. Sometimes. On the other hand, such deformation of the mounting component 102 can be prevented by reducing the thickness of the elastic body 16A in the pressure resistant region (in other words, providing the convex portion 17a).
　ところで、前記実施形態１では、キャビティ駒１７に弾性体１６を接着させて固定する場合について説明した。これに限らず、本実施形態に示すように、キャビティ駒１７Ａに弾性体１６を抜け止めして固定する場合であってもよい。 In the first embodiment, the case where the elastic body 16 is bonded and fixed to the cavity piece 17 has been described. Not limited to this, as shown in the present embodiment, the elastic body 16 may be secured to the cavity piece 17A by being prevented from coming off.
　本実施形態では、キャビティ駒１７Ａの凸部１７ａの外壁面から凹むよう設けられた凹部１７ｂに、凹状の弾性体１６Ａの内壁面から突出するよう設けられた凸部１６ｃを嵌め込むようにして、キャビティ駒１７Ａに弾性体１６を抜け止めして固定している。なお、例えば、キャビティ駒１７Ａの凸部１７ａの外壁面に雌ねじ、凹状の弾性体１６Ａの内壁面に雄ねじを形成して、キャビティ駒１７Ａに締め付けるようにして弾性体１６Ａを固定することもできる。 In the present embodiment, the cavity piece 17c is fitted into the concave part 17b provided so as to be recessed from the outer wall surface of the convex part 17a of the cavity piece 17A, and the convex part 16c provided so as to protrude from the inner wall surface of the concave elastic body 16A. The elastic body 16 is secured to the 17A and fixed. For example, the elastic body 16A can be fixed by forming an internal thread on the outer wall surface of the convex portion 17a of the cavity piece 17A and an external thread on the inner wall surface of the concave elastic body 16A and tightening the cavity piece 17A.
　（実施形態３）
　前記実施形態１では、１つ部材として形成されるキャビティ駒１７に弾性体１６を接着させて固定する場合について説明した。本実施形態では、キャビティ駒１７Ｂに弾性体１６Ｂを抜け止めして固定する場合について、図６を参照して説明する。図６は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 3)
In the first embodiment, the case where the elastic body 16 is bonded and fixed to the cavity piece 17 formed as one member has been described. In the present embodiment, the case where the elastic body 16B is secured to the cavity piece 17B while being detached will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　本実施形態では、弾性体１６Ｂは、弾性体用凹部２１の内底面２１ａ側の外壁面から突出するように凸部１６ｄ（フランジ部）が設けられている。また、キャビティ駒１７Ｂは、弾性体用凹部２１の内壁面から凹むように凹部１７ｃが設けられている。このキャビティ駒１７Ｂは、上ブロック１７ｄと、下ブロック１７ｅとに分割可能に構成されている。この上ブロック１７ｄと下ブロック１７ｅとは、弾性体用凹部２１の内底面２１ａと同一面で分割される。このため、下ブロック１７ｅがリング状の中空部となり、上ブロック１７ｄが蓋部となる。 In the present embodiment, the elastic body 16B is provided with a convex portion 16d (flange portion) so as to protrude from the outer wall surface on the inner bottom surface 21a side of the concave portion 21 for elastic body. Further, the cavity piece 17B is provided with a recess 17c so as to be recessed from the inner wall surface of the elastic body recess 21. The cavity piece 17B is configured to be divided into an upper block 17d and a lower block 17e. The upper block 17d and the lower block 17e are divided on the same plane as the inner bottom surface 21a of the elastic body recess 21. For this reason, the lower block 17e becomes a ring-shaped hollow part, and the upper block 17d becomes a cover part.
　弾性体１６Ｂをキャビティ駒１７Ｂへ固定するには、まず、上ブロック１７ｄと、下ブロック１７ｅとに分割した状態とする。次いで、下ブロック１７ｅ（キャビティ駒１７Ｂ）の凹部１７ｃに弾性体１６Ｂの凸部１６ｄを引っ掛けるように、リング状の下ブロック１７ｅに弾性体１６Ｂを嵌め込む。次いで、弾性体１６Ｂおよび下ブロック１７ｅ上を上ブロック１７ｄで蓋をするように下ブロック１７ｅと上ブロック１７ｄを組み付けて例えばボルト（図示せず）でネジ止めすることで、弾性体１６Ｂをキャビティ駒１７Ｂに固定する。その後は、弾性体１６Ｂと一体になったキャビティ駒１７Ｂが駒用凹部２０に設けられる（組み付けられる）。これにより、弾性体１６Ｂをキャビティ駒１７Ｂに確実に固定することができる。また、弾性体１６Ｂと下ブロック１７ｅを交換するだけで、実装部品１０２の配置の変更に対応することもできる。 In order to fix the elastic body 16B to the cavity piece 17B, first, the upper block 17d and the lower block 17e are divided. Next, the elastic body 16B is fitted into the ring-shaped lower block 17e so that the convex portion 16d of the elastic body 16B is hooked on the concave portion 17c of the lower block 17e (cavity piece 17B). Next, the lower block 17e and the upper block 17d are assembled so as to cover the elastic body 16B and the lower block 17e with the upper block 17d, and screwed with, for example, a bolt (not shown), so that the elastic body 16B is cavity piece. Secure to 17B. Thereafter, the cavity piece 17B integrated with the elastic body 16B is provided (assembled) in the concave part 20 for the piece. Thereby, the elastic body 16B can be reliably fixed to the cavity piece 17B. Further, it is possible to cope with a change in the arrangement of the mounting component 102 by simply replacing the elastic body 16B and the lower block 17e.
　（実施形態４）
　前記実施形態１では、ワークＷが有する実装部品１０２として、一種類のものを用いた場合について説明した。本実施形態では、実装部品として、複数種類のもの（チップ部品１０２Ａ、柱状導体１０２Ｂ）を用いる場合について、図７および図１４を参照して説明する。図７は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。図１４は、製造工程中の樹脂モールド製品１００を模式的に示す断面図である。 (Embodiment 4)
In the first embodiment, the case where one type of mounting component 102 included in the workpiece W is used has been described. In the present embodiment, a case where a plurality of types of mounting components (chip component 102A and columnar conductor 102B) are used will be described with reference to FIGS. FIG. 7 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment. FIG. 14 is a cross-sectional view schematically showing the resin molded product 100 during the manufacturing process.
　本実施形態におけるワークＷは、基板１０１（例えば、配線基板）と、実装部品として、例えば、半導体チップなどのチップ部品１０２Ａ、および、銅などの導電性材料からなる柱状導体１０２Ｂ（ビア部材）とを備えている。このワークＷが成形品（樹脂モールド製品１００）となると、複数のバンプ１０３を介して基板１０１上にチップ部品１０２Ａがフリップチップ実装され、実装された側の主面と反対側の裏面１０２ａが露出され、その他の面（主面、側面）が樹脂モールドされる。また、基板１０１上に柱状導体１０２Ｂが実装され、実装された側の一端面と反対側の他端面１０２ｂが露出され、その他の面（側面）が樹脂モールドされる。これにより、基板１０１側だけでなく、柱状導体１０２Ｂにも電気的な接続が可能となり三次元的に接続可能な成形品とすることができる。 The workpiece W in the present embodiment includes a substrate 101 (for example, a wiring substrate), a chip component 102A such as a semiconductor chip as a mounting component, and a columnar conductor 102B (via member) made of a conductive material such as copper. It has. When the workpiece W becomes a molded product (resin mold product 100), the chip component 102A is flip-chip mounted on the substrate 101 via the plurality of bumps 103, and the back surface 102a opposite to the main surface on the mounting side is exposed. The other surfaces (main surface, side surface) are resin-molded. Further, the columnar conductor 102B is mounted on the substrate 101, the other end surface 102b opposite to the one end surface on the mounting side is exposed, and the other surface (side surface) is resin-molded. Thereby, not only the board | substrate 101 side but the columnar conductor 102B can be electrically connected, and it can be set as the molded article which can be connected in three dimensions.
　前記実施形態１と同様に、型開きした状態で、弾性体１６は、キャビティ凹部１５の内底面１５ａから突出するように設けられる。そして、弾性体１６は、チップ部品１０２Ａおよび柱状導体１０２Ｂ（実装部品）と対向する対向面１６ａｂが、クランプされるチップ部品１０２Ａの裏面１０２ａおよび柱状導体１０２Ｂの他端面１０２ｂ（クランプ面）よりも広い形状をしている。 As in the first embodiment, the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 in a state where the mold is opened. The elastic body 16 has a facing surface 16ab facing the chip component 102A and the columnar conductor 102B (mounting component) wider than the back surface 102a of the chip component 102A to be clamped and the other end surface 102b (clamping surface) of the columnar conductor 102B. It has a shape.
　このため、ワークＷをクランプした状態では、弾性体１６がチップ部品１０２Ａおよび柱状導体１０２Ｂによって凹むように変形される。具体的には、弾性体１６の部分１６ａの表面（対向面１６ａｂ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂがチップ部品１０２Ａの裏面１０２ａや柱状導体１０２Ｂの他端面１０２ｂを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。 Therefore, in a state where the workpiece W is clamped, the elastic body 16 is deformed so as to be recessed by the chip component 102A and the columnar conductor 102B. Specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of the chip component 102A or the columnar conductor 102B. It protrudes into the cavity C from the inner bottom surface 15a of the cavity recess 15 so as to exceed the other end surface 102b.
　本実施形態では、チップ部品１０２Ａおよび柱状導体１０２Ｂの周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、チップ部品１０２Ａの裏面１０２ａおよび柱状導体１０２Ｂの他端面１０２ｂに樹脂Ｒが漏れるのを防止することができる。これにより、チップ部品１０２Ａの裏面１０２ａおよび柱状導体１０２Ｂの他端面１０２ｂでフラッシュが発生してしまうのを防止することができる。したがって、樹脂モールド製品１００の製造歩留まりを向上させ、フラッシュ除去を不要として製造コストを削減させることができる。 In the present embodiment, resin is applied to the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the chip component 102A and the columnar conductor 102B. R can be prevented from leaking. Thereby, it is possible to prevent flash from occurring on the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B. Therefore, the manufacturing yield of the resin mold product 100 can be improved, and the manufacturing cost can be reduced because the flash removal is unnecessary.
　また、別々に製造されることで高さの相違が発生しやすいチップ部品１０２Ａと柱状導体１０２Ｂとを一括して樹脂モールドするときに、フィルムＦだけでは吸収しきれない高さのばらつきを補い各部材の端面（裏面１０２ａ、他端面１０２ｂ）へのフラッシュの発生を防止することができる。 Further, when the chip parts 102A and the columnar conductors 102B, which are likely to be different in height due to being manufactured separately, are collectively resin-molded, the height variations that cannot be absorbed by the film F alone are compensated. It is possible to prevent the flash from occurring on the end surfaces (the back surface 102a and the other end surface 102b) of the member.
　本実施形態における樹脂モールド金型１０で製造された樹脂モールド製品１００は、図１４に示すように、チップ部品１０２Ａの裏面１０２ａおよび柱状導体１０２Ｂの他端面１０２ｂを露出して、基板１０１上に形成された樹脂モールド部１０４を備える。この樹脂モールド部１０４は、樹脂モールド工程においてフラッシュの発生を防止する弾性体１６の部分１６ｂによって型取りされた周溝１０５（１０５Ａ、１０５Ｂ）を有している。なお、周溝１０５Ａは、チップ部品１０２Ａの裏面１０２ａの周囲に形成され、周溝１０５Ｂは、柱状導体１０２Ｂの他端面１０２ｂの周囲に形成されている。 As shown in FIG. 14, the resin molded product 100 manufactured with the resin mold 10 in this embodiment is formed on the substrate 101 with the back surface 102a of the chip component 102A and the other end surface 102b of the columnar conductor 102B exposed. The resin mold portion 104 is provided. The resin mold portion 104 has a circumferential groove 105 (105A, 105B) that is molded by a portion 16b of the elastic body 16 that prevents the occurrence of flash in the resin molding process. The circumferential groove 105A is formed around the back surface 102a of the chip component 102A, and the circumferential groove 105B is formed around the other end surface 102b of the columnar conductor 102B.
　そして、露出する柱状導体１０２Ｂ（ビア部材）と電気的に接続して樹脂モールド部１０４を覆う導電性のシールド層１２０を形成することで、高シールド性を有する樹脂モールド製品１００を得ることができる。以下では、高シールド性を有するものとして、半導体チップ（チップ部品１０２Ａ）を備える樹脂モールド製品１００（半導体パッケージ）に適用して、その製造方法について説明する。 Then, by forming a conductive shield layer 120 that is electrically connected to the exposed columnar conductor 102B (via member) and covers the resin mold portion 104, a resin mold product 100 having high shielding properties can be obtained. . Hereinafter, the manufacturing method will be described as applied to a resin molded product 100 (semiconductor package) including a semiconductor chip (chip component 102A) as having high shielding properties.
　図７を参照して説明したように、チップ部品１０２Ａおよび柱状導体１０２Ｂを樹脂モールドした後（これにより樹脂モールド部１０４が形成される）、フィルムＦを剥離して樹脂モールド金型１０から樹脂モールド製品１００を取り出す。次いで、図１４に示すように、パッケージ表面（樹脂モールド部１０４、樹脂モールド部１０４から露出するチップ部品１０２Ａおよび柱状導体１０２Ｂ）にシールド用インクまたはシールド用ペーストを塗布してシールド層１２０を形成する。このとき、シールド層１２０は、柱状導体１０２Ｂと電気的に接続される。また、基板１０１の裏面（樹脂モールド部１０４が形成される面とは反対側の面）に他の実装基板に樹脂モールド製品１００を実装するための複数の実装用バンプ１２１を形成する。このとき、ある実装用バンプ１２１は、基板内配線１２２を介して柱状導体１０２Ｂと電気的に接続される。なお、図１４では、基板１０１が備える多層の配線層とそれらの間のビアとによって構成される基板内配線１２２を模式的に破線で示している。 As described with reference to FIG. 7, after the chip component 102 </ b> A and the columnar conductor 102 </ b> B are resin-molded (therefore, the resin mold portion 104 is formed), the film F is peeled off and the resin mold 10 is resin-molded. Remove product 100. Next, as shown in FIG. 14, shielding ink or shielding paste is applied to the package surface (resin mold portion 104, chip component 102 </ b> A and columnar conductor 102 </ b> B exposed from resin mold portion 104) to form shield layer 120. . At this time, the shield layer 120 is electrically connected to the columnar conductor 102B. A plurality of mounting bumps 121 for mounting the resin mold product 100 on another mounting substrate is formed on the back surface of the substrate 101 (the surface opposite to the surface on which the resin mold portion 104 is formed). At this time, a certain mounting bump 121 is electrically connected to the columnar conductor 102 </ b> B via the in-substrate wiring 122. In FIG. 14, the in-substrate wiring 122 constituted by the multilayer wiring layers provided in the substrate 101 and vias between them is schematically shown by broken lines.
　このような樹脂モールド製品１００では、シールド層１２０、柱状導体１０２Ｂ、基板内配線１２２および実装用バンプ１２１を介して電磁波（ノイズなど）をグランド（ＧＮＤ）に流して、シールド機能を発揮させることができる。さらに、熱伝導性の高い材質を使用したシールド用インクまたはシールド用ペーストによれば、放熱面積を増大させることができ、半導体チップ（チップ部品１０２Ａ）における発熱の放熱機能も期待できる。 In such a resin molded product 100, electromagnetic waves (noise, etc.) are allowed to flow to the ground (GND) through the shield layer 120, the columnar conductor 102B, the in-substrate wiring 122, and the mounting bumps 121 to exert a shielding function. it can. Furthermore, according to the shielding ink or shielding paste using a material having high thermal conductivity, the heat radiation area can be increased, and a heat radiation function of the semiconductor chip (chip component 102A) can be expected.
　導電性のシールド層１２０を形成するときには、ノズルと被塗布物とに電位差を付与しながらノズルから後述するような塗布液を吐出する静電塗布法を利用することができる。また、インクジェット法、メッキ法、ＰＶＤ（
Physical Vapor Deposition）法、ＣＶＤ（Chemical Vapor Deposition）法、スプレーコーティング法、印刷法などを利用することもできる。また、シールド層１２０としては、例えば、導電性や磁性を有する微粉（Ａｇのような金属やカーボン）とバインダー樹脂を溶媒で溶かした塗布液（インク）などを用いることができる。 When forming the conductive shield layer 120, it is possible to use an electrostatic coating method in which a coating liquid as described later is discharged from the nozzle while applying a potential difference between the nozzle and an object to be coated. Also, inkjet method, plating method, PVD (
A physical vapor deposition (CVD) method, a chemical vapor deposition (CVD) method, a spray coating method, a printing method, or the like can also be used. As the shield layer 120, for example, a coating liquid (ink) in which fine powder (metal such as Ag or carbon) having conductivity or magnetism and a binder resin are dissolved in a solvent can be used.
　このように、本実施形態における樹脂モールド金型１０によれば、均一高さに設置することが困難な柱状導体１０２Ｂを全て確実に露出することができる。また、１つの樹脂モールド金型１０で複数の樹脂モールド製品１００を製造しても、柱状導体１０２Ｂを露出する別途の工程を行うことがなく、全ての樹脂モールド製品１００においてシールド機能を確実に発揮させることができる。 Thus, according to the resin mold 10 in the present embodiment, it is possible to reliably expose all the columnar conductors 102B that are difficult to install at a uniform height. In addition, even when a plurality of resin molded products 100 are manufactured with one resin mold 10, a separate process for exposing the columnar conductor 102 </ b> B is not performed, and the shielding function is reliably exhibited in all the resin molded products 100. Can be made.
　（実施形態５）
　前記実施形態１では、一つのキャビティ凹部１５内に、一つの実装部品１０２に対応させて一つの弾性体１６を設ける場合について説明した。本実施形態では、一つのキャビティ凹部１５内に、複数の実装部品１０２に対応させて複数の弾性体１６を設ける場合について、図８を参照して説明する。図８は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 5)
In the first embodiment, the case where one elastic body 16 is provided in one cavity recess 15 corresponding to one mounting component 102 has been described. In the present embodiment, a case where a plurality of elastic bodies 16 are provided in one cavity recess 15 corresponding to a plurality of mounting components 102 will be described with reference to FIG. FIG. 8 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　本実施形態におけるワークＷは、基板１０１（例えば、配線基板）と、複数の実装部品１０２（例えば、半導体チップなどのチップ部品）とを備えている。このワークＷが成形品となると、複数のバンプ１０３を介して基板１０１上に複数の実装部品１０２がフリップチップ実装され、各裏面１０２ａが露出され、その他の面（主面、側面）が樹脂モールドされる。 The workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips). When this workpiece W becomes a molded product, a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
　前記実施形態１と同様に、型開きした状態で、各実装部品１０２に対応するように、弾性体１６は、キャビティ凹部１５の内底面１５ａから突出するように複数設けられる。そして、各弾性体１６は、実装部品１０２と対向する対向面１６ａｂが、実装部品１０２ａ（クランプ面）よりも広い形状をしている。 As in the first embodiment, a plurality of elastic bodies 16 are provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened. Each elastic body 16 has a facing surface 16ab facing the mounting component 102 wider than the mounting component 102a (clamp surface).
　このため、ワークＷをクランプした状態では、各弾性体１６がそれぞれの実装部品１０２によって凹むように変形される。具体的には、弾性体１６の部分１６ａの表面（対向面１６ａｂ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂが実装部品１０２の裏面１０２ａを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。この場合、各々の実装部品１０２は実装されたときの基板１０１からの高さには必然的にばらつきが生じるため、薄いフィルムＦだけでこの高さのばらつきを吸収するのは困難となることがある。このため、実装部品１０２のそれぞれの位置に弾性体１６を設けることで実装部品１０２の実装高さのばらつきを吸収することが可能となる。 Therefore, in a state where the workpiece W is clamped, each elastic body 16 is deformed so as to be recessed by the respective mounting component 102. More specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the cavity 16 so that the portion 16b of the elastic body 16 exceeds the back surface 102a of the mounting component 102. The recess 15 protrudes from the inner bottom surface 15 a into the cavity C. In this case, since each mounted component 102 inevitably varies in height from the substrate 101 when mounted, it may be difficult to absorb the variation in height with only the thin film F. is there. For this reason, it is possible to absorb variations in the mounting height of the mounting component 102 by providing the elastic body 16 at each position of the mounting component 102.
　本実施形態では、各実装部品１０２の周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、各実装部品１０２の裏面１０２ａに樹脂Ｒが漏れるのを防止することができる。これにより、各実装部品１０２の裏面１０２ａでフラッシュが発生してしまうのを防止することができ、複数の実装部品１０２を一括して封止可能な生産性の高い金型であっても、全ての実装部品１０２の裏面１０２ａにおけるフラッシュの発生を確実に防止することができる。また、弾性体１６の外周にはキャビティ駒１７の端面で樹脂Ｒが成形されるため所望の寸法精度で樹脂成形が可能となっており、ヒートシンクを支持する成形品の表面を任意の高さに確実に成形することができる。また、弾性体１６が実装部品１０２毎に設けられているため、部分的に交換することができ、メンテナンスが容易であるという効果も有する。 In the present embodiment, the resin R can be prevented from leaking to the back surface 102a of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. . As a result, it is possible to prevent flash from occurring on the back surface 102a of each mounting component 102, and even a highly productive mold that can seal a plurality of mounting components 102 in a batch. Generation of flash on the back surface 102a of the mounted component 102 can be reliably prevented. Further, since the resin R is molded on the outer periphery of the elastic body 16 at the end face of the cavity piece 17, the resin can be molded with a desired dimensional accuracy, and the surface of the molded product supporting the heat sink can be set to an arbitrary height. It can be reliably molded. Further, since the elastic body 16 is provided for each mounting component 102, it can be partially replaced, and there is an effect that maintenance is easy.
　（実施形態６）
　前記実施形態１では、一つの実装部品１０２に対応する一つの弾性体１６を設ける場合について説明した。本実施形態では、複数の実装部品１０２をまとめて対応する一つの弾性体１６を設ける場合について、図９を参照して説明する。図９は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 6)
In the first embodiment, the case where one elastic body 16 corresponding to one mounting component 102 is provided has been described. In the present embodiment, a case where a single elastic body 16 corresponding to a plurality of mounted components 102 is provided will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　本実施形態におけるワークＷは、基板１０１（例えば、配線基板）と、複数の実装部品１０２（例えば、半導体チップなどのチップ部品）とを備えている。このワークＷが成形品となると、複数のバンプ１０３を介して基板１０１上に複数の実装部品１０２がフリップチップ実装され、各裏面１０２ａが露出され、その他の面（主面、側面）が樹脂モールドされる。 The workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips). When this workpiece W becomes a molded product, a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
　前記実施形態１と同様に、型開きした状態で、各実装部品１０２に対応するように、弾性体１６は、キャビティ凹部１５の内底面１５ａから突出するように設けられる。そして、弾性体１６は、複数の実装部品１０２と対向する対向面１６ａｂが、複数の実装部品１０２の裏面１０２ａ（クランプ面）よりも広い形状をしている。この場合、弾性体用凹部２１は実装部品１０２の数だけ設ける必要がないため、簡易な型構成とすることができる。 As in the first embodiment, the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to each mounting component 102 in a state where the mold is opened. The elastic body 16 has a facing surface 16ab facing the plurality of mounting components 102 wider than the back surfaces 102a (clamp surfaces) of the plurality of mounting components 102. In this case, since it is not necessary to provide the elastic body recesses 21 by the number of the mounting components 102, a simple mold configuration can be achieved.
　このため、ワークＷをクランプした状態では、弾性体１６がそれぞれの実装部品１０２によって凹むように変形される。具体的には、弾性体１６の部分１６ａの表面（対向面１６ａｂ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂが各実装部品１０２の裏面１０２ａを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。 Therefore, in a state where the workpiece W is clamped, the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface (opposing surface 16ab) of the portion 16a of the elastic body 16 is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the back surface 102a of each mounting component 102. The cavity recess 15 protrudes from the inner bottom surface 15 a into the cavity C.
　本実施形態では、一つの弾性体１６を用いて成形する際に、各実装部品１０２の周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、各実装部品１０２の裏面１０２に樹脂Ｒが漏れるのを防止することができる。これにより、簡易な構成で各実装部品１０２の裏面１０２ａでフラッシュが発生してしまうのを防止することができる。したがって、フラッシュが防止可能な樹脂モールド製品を安価に製造することができる。 In the present embodiment, when molding is performed using one elastic body 16, the back surface of each mounting component 102 is formed by the portion 16 b of the elastic body 16 protruding from the inner bottom surface 15 a of the cavity recess 15 around each mounting component 102. It is possible to prevent the resin R from leaking to 102. Thereby, it is possible to prevent the flash from occurring on the back surface 102a of each mounted component 102 with a simple configuration. Therefore, a resin mold product capable of preventing flashing can be manufactured at a low cost.
　（実施形態７）
　前記実施形態１では、弾性体１６の対向面１６ａｂの全体が、キャビティ凹部１５の内底面１５ａから均一な高さで突出する場合について説明した。本実施形態では、弾性体１６Ｃの対向面１６ａｂの一部１６ｅが、キャビティ凹部１５の内底面１５ａから突出する場合について、図１０および図１１を参照して説明する。図１０、図１１は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 7)
In the first embodiment, the case where the entire opposing surface 16ab of the elastic body 16 protrudes from the inner bottom surface 15a of the cavity recess 15 at a uniform height has been described. In the present embodiment, a case where a part 16e of the facing surface 16ab of the elastic body 16C protrudes from the inner bottom surface 15a of the cavity recess 15 will be described with reference to FIGS. 10 and 11 are cross-sectional views schematically showing the main part of the resin mold 10 in the present embodiment.
　本実施形態におけるワークＷは、基板１０１（例えば、配線基板）と、複数の実装部品１０２（例えば、半導体チップなどのチップ部品）とを備えている。このワークＷが成形品となると、複数のバンプ１０３を介して基板１０１上に複数の実装部品１０２がフリップチップ実装され、各裏面１０２ａが露出され、その他の面（主面、側面）が樹脂モールドされる。 The workpiece W in this embodiment includes a substrate 101 (for example, a wiring substrate) and a plurality of mounting components 102 (for example, chip components such as semiconductor chips). When this workpiece W becomes a molded product, a plurality of mounting components 102 are flip-chip mounted on the substrate 101 via a plurality of bumps 103, each back surface 102a is exposed, and the other surface (main surface, side surface) is a resin mold. Is done.
　前記実施形態１と同様に、型開きした状態で（図１０参照）、各実装部品１０２に対応するように、弾性体１６Ｃの対向面１６ａｂの一部１６ｅ（突出対向面）は、キャビティ凹部１５の内底面１５ａから突出するように設けられる。弾性体１６Ｃの対向面１６ａｂの一部１６ｅを除いた他部は、キャビティ凹部１５の内底面１５ａと面一となるように設けられる。そして、弾性体１６Ｃは、実装部品１０２と対向する対向面１６ａｂの一部１６ｅが、実装部品１０２の裏面１０２ａ（クランプ面）よりも広い形状をしている。 As in the first embodiment, when the mold is opened (see FIG. 10), a part 16e (protruding facing surface) of the facing surface 16ab of the elastic body 16C is formed in the cavity recess 15 so as to correspond to each mounting component 102. Is provided so as to protrude from the inner bottom surface 15a. The other part excluding the part 16e of the facing surface 16ab of the elastic body 16C is provided so as to be flush with the inner bottom surface 15a of the cavity recess 15. The elastic body 16 </ b> C has a shape in which a part 16 e of the facing surface 16 ab facing the mounting component 102 is wider than the back surface 102 a (clamp surface) of the mounting component 102.
　このため、ワークＷをクランプした状態では（図１１参照）、弾性体１６がそれぞれの実装部品１０２によって凹むように変形される。具体的には、弾性体１６の部分１６ａの表面（対向面１６ａｂの一部１６ｅ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂが各実装部品１０２の裏面１０２ａを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。 Therefore, in a state where the workpiece W is clamped (see FIG. 11), the elastic body 16 is deformed so as to be recessed by the respective mounting components 102. Specifically, the surface of the portion 16a of the elastic body 16 (a part 16e of the facing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 is the back surface 102a of each mounting component 102. So as to protrude from the inner bottom surface 15a of the cavity recess 15 into the cavity C.
　本実施形態では、各実装部品１０２の周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、各実装部品１０２の裏面１０２に樹脂Ｒが漏れるのを防止することができる。これにより、各実装部品１０２の裏面１０２ａでフラッシュが発生してしまうのを防止しながら、弾性体１６Ｃにおいて平坦に維持される対向面１６ａｂによって成形品の上面を平坦に成形することができる。したがって、ヒートシンクを用いるような高発熱の樹脂モールド製品を効率的に生産することができる。また、前記実施形態５のように実装部品１０２の個数に応じた弾性体用凹部２１を設ける必要がないため、ヒートシンクを用いるような樹脂モールド製品を簡易な金型で生産することができる。 In the present embodiment, the resin R can be prevented from leaking to the back surface 102 of each mounting component 102 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around each mounting component 102. . Accordingly, the upper surface of the molded product can be formed flat by the facing surface 16ab that is maintained flat in the elastic body 16C while preventing flash from occurring on the back surface 102a of each mounted component 102. Therefore, it is possible to efficiently produce a resin mold product with high heat generation using a heat sink. Further, unlike the fifth embodiment, there is no need to provide the recesses 21 for the elastic body according to the number of the mounting components 102, so that a resin mold product using a heat sink can be produced with a simple mold.
　（実施形態８）
　前記実施形態１では、弾性体１６を板状のキャビティ駒１７に設ける場合について説明した。本実施形態では、弾性体１６をスイベル駒１７Ｃ（キャビティ駒）に設ける場合について、図１２を参照して説明する。図１２は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 8)
In the first embodiment, the case where the elastic body 16 is provided in the plate-like cavity piece 17 has been described. In this embodiment, the case where the elastic body 16 is provided in the swivel piece 17C (cavity piece) will be described with reference to FIG. FIG. 12 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　本実施形態における樹脂モールド金型１０は、上型１１Ａがスイベル駒１７Ｃを傾斜可能なスイベル構造で構成されている。スイベル構造の上型１１Ａは、スイベル駒１７Ｃと、スイベル駒１７Ｃを吊り下げ支持するガイド駒１８と、スイベル駒１７Ｃとガイド駒１８との間で弾装されたばね１９とを備えている。上型１１Ａでは、キャビティ凹部１５の内底面１５ａから凹む駒用凹部２０が設けられている。この駒用凹部２０に、キャビティ凹部１５の内底面１５ａを構成するスイベル駒１７Ｃが、ガイド駒１８とともに設けられる（組み付けられる）。 The resin mold 10 in the present embodiment has a swivel structure in which the upper mold 11A can tilt the swivel piece 17C. The upper mold 11A of the swivel structure includes a swivel piece 17C, a guide piece 18 that supports the swivel piece 17C in a suspended manner, and a spring 19 that is elastically mounted between the swivel piece 17C and the guide piece 18. In the upper mold 11 </ b> A, a piece recess 20 that is recessed from the inner bottom surface 15 a of the cavity recess 15 is provided. A swivel piece 17C constituting the inner bottom surface 15a of the cavity concave portion 15 is provided (assembled) together with the guide piece 18 in the concave portion 20 for the piece.
　スイベル駒１７Ｃの内底面１５ａとは反対側の面には、凸状球面部１７ｆが設けられている。この凸状球面部１７ｆと対向するガイド駒１８には凹状球面部１８ａが設けられている。また、凸状球面部１７ｆと凹状球面部１８ａの周りにばね１９が設けられている。このようなスイベル構造の上型１１では、キャビティ駒であるスイベル駒１７Ｃは、凸状球面部１７ｆが凹状球面部１８ａにガイドされて傾動する。スイベル駒１７Ｃには、キャビティ凹部１５の内底面１５ａから凹む弾性体用凹部２１が設けられている。この弾性体用凹部２１に、キャビティ凹部１５の内底面１５ａからキャビティ凹部１５内へ突出するように、弾性体１６が設けられている。 A convex spherical surface portion 17f is provided on the surface opposite to the inner bottom surface 15a of the swivel piece 17C. The guide piece 18 facing the convex spherical portion 17f is provided with a concave spherical portion 18a. A spring 19 is provided around the convex spherical portion 17f and the concave spherical portion 18a. In the upper mold 11 having such a swivel structure, the swivel piece 17C, which is a cavity piece, tilts with the convex spherical portion 17f guided by the concave spherical portion 18a. The swivel piece 17 </ b> C is provided with an elastic recess 21 that is recessed from the inner bottom surface 15 a of the cavity recess 15. The elastic body 16 is provided in the elastic body recess 21 so as to protrude from the inner bottom surface 15 a of the cavity recess 15 into the cavity recess 15.
　また、本実施形態におけるワークＷは、例えばリードフレームなどで形成される上部電極１１０と下部電極１１１とで複数の半導体チップ１１２が挟み込まれたものである。半導体チップ１１２は、上面側で上部電極１１０と、下面側で下部電極１１１と、はんだによって接合されている。この上部電極１１０および下部電極１１１は、放熱板としても用いられる。このようなワークＷでは、種類の異なる半導体チップ１１２（例えば、インバータ構造に用いられるＩＧＢＴ素子やフライホイールダイオード素子）の場合、それぞれの高さも異なるため、下部電極１１１に対して上部電極１１０が傾斜することもある。なお、本実施形態におけるワークＷは、下部電極１１１を基板として下型１２のワーク載置部１３に配置され、上部電極１１０を実装部品として弾性体１６によって押圧される。 In addition, the workpiece W in the present embodiment is a workpiece in which a plurality of semiconductor chips 112 are sandwiched between an upper electrode 110 and a lower electrode 111 formed of, for example, a lead frame. The semiconductor chip 112 is joined to the upper electrode 110 on the upper surface side and the lower electrode 111 on the lower surface side by solder. The upper electrode 110 and the lower electrode 111 are also used as a heat sink. In such a workpiece W, different types of semiconductor chips 112 (for example, IGBT elements and flywheel diode elements used in an inverter structure) have different heights, and therefore the upper electrode 110 is inclined with respect to the lower electrode 111. Sometimes. In addition, the workpiece | work W in this embodiment is arrange | positioned at the workpiece | work mounting part 13 of the lower mold | type 12 by using the lower electrode 111 as a board | substrate, and is pressed by the elastic body 16 by using the upper electrode 110 as a mounting component.
　前記実施形態１と同様に、型開きした状態で、上部電極１１０に対応するように、弾性体１６は、キャビティ凹部１５の内底面１５ａから突出するように設けられる。そして、弾性体１６は、上部電極１１０と対向する対向面１６ａｂが、上部電極１１０の上面（クランプ面）よりも広い形状をしている。 As in the first embodiment, the elastic body 16 is provided so as to protrude from the inner bottom surface 15a of the cavity recess 15 so as to correspond to the upper electrode 110 in a state where the mold is opened. The elastic body 16 has a shape in which the facing surface 16ab facing the upper electrode 110 is wider than the upper surface (clamp surface) of the upper electrode 110.
　このため、ワークＷをクランプした状態では、弾性体１６が上部電極１１０によって凹むように変形される。具体的には、弾性体１６の部分１６ａの表面（対向面１６ａｂ）がキャビティ凹部１５の内底面１５ａと面一とされ、弾性体１６の部分１６ｂが上部電極１１０の上面１１０ａを越えるようにキャビティ凹部１５の内底面１５ａからキャビティＣ内へ突出される。さらに、本実施形態では、上部電極１１０が傾斜していた場合であっても、スイベル駒１７Ｃがその傾斜に追従して傾動するため、片当たりを防止してワークＷをクランプすることができる。 Therefore, in a state where the workpiece W is clamped, the elastic body 16 is deformed so as to be recessed by the upper electrode 110. Specifically, the surface of the portion 16a of the elastic body 16 (opposing surface 16ab) is flush with the inner bottom surface 15a of the cavity recess 15, and the portion 16b of the elastic body 16 exceeds the upper surface 110a of the upper electrode 110. The recess 15 protrudes from the inner bottom surface 15 a into the cavity C. Furthermore, in the present embodiment, even if the upper electrode 110 is inclined, the swivel piece 17C tilts following the inclination, so that the workpiece W can be clamped while preventing the one-side contact.
　本実施形態では、上部電極１１０の周囲でキャビティ凹部１５の内底面１５ａから突出している弾性体１６の部分１６ｂによって、上部電極１１０の上面１１０ａに樹脂Ｒが漏れるのを防止することができる。これにより、上部電極１１０の上面１１０ａでフラッシュが発生してしまうのを防止することができる。したがって、厚みにばらつきがあったり傾斜してしまうようなワークＷであってもフラッシュの発生を防止可能となる。 In this embodiment, the resin R can be prevented from leaking to the upper surface 110a of the upper electrode 110 by the portion 16b of the elastic body 16 protruding from the inner bottom surface 15a of the cavity recess 15 around the upper electrode 110. Thereby, it is possible to prevent the flash from occurring on the upper surface 110a of the upper electrode 110. Therefore, it is possible to prevent the occurrence of flash even with a workpiece W having a variation in thickness or tilting.
　（実施形態９）
　前記実施形態１では、弾性体１６が実装部品１０２の全面を押圧する場合について説明した。本実施形態では、キャビティ駒１７Ｄにおいて実装部品１０２の外周位置に枠状の弾性体１６Ｄを固定する場合について、図１３を参照して説明する。図１３は、本実施形態における樹脂モールド金型１０の要部を模式的に示す断面図である。 (Embodiment 9)
In the first embodiment, the case where the elastic body 16 presses the entire surface of the mounting component 102 has been described. In the present embodiment, a case where the frame-shaped elastic body 16D is fixed to the outer peripheral position of the mounting component 102 in the cavity piece 17D will be described with reference to FIG. FIG. 13 is a cross-sectional view schematically showing a main part of the resin mold 10 in the present embodiment.
　型開きした状態では、弾性体１６Ｄは、実装部品１０２の外周に沿って配置されるような矩形枠状に形成されている。この弾性体１６Ｄをキャビティ駒１７Ｄの弾性体用凹部２１に設けるにあたり、キャビティ駒１７Ｄには、弾性体用凹部２１の内底面２１ａから突出する凸部１７ａを設けている。すなわち、この凸部１７ａの外周に沿って矩形枠状の弾性体１６Ｄに嵌め込むようにして、キャビティ駒１７Ｄの弾性体用凹部２１に弾性体１６Ｄが設けられる。この場合、弾性体１６Ｄは、その内周面の位置が最外周のバンプ１０３の位置にかかるような幅に形成されるのが好ましく、これによればクランプした際の実装部品１０２の変形を防止することができる。 In a state where the mold is opened, the elastic body 16D is formed in a rectangular frame shape that is arranged along the outer periphery of the mounting component 102. When the elastic body 16D is provided in the elastic body concave portion 21 of the cavity piece 17D, the cavity piece 17D is provided with a convex portion 17a protruding from the inner bottom surface 21a of the elastic body concave portion 21. That is, the elastic body 16D is provided in the elastic body concave portion 21 of the cavity piece 17D so as to be fitted into the rectangular frame-shaped elastic body 16D along the outer periphery of the convex portion 17a. In this case, it is preferable that the elastic body 16D is formed to have such a width that the position of the inner peripheral surface thereof covers the position of the outermost bump 103. According to this, the deformation of the mounting component 102 when clamped is prevented. can do.
　このような実装部品１０２の外周に沿って配置される弾性体１６Ｄを用いることで、耐圧領域には弾性体１６Ｄを設けないため、キャビティＣ内に充填された樹脂Ｒの圧力で実装部品１０２が浮き上がってしまうのを確実に防止することができる。これにより、フラッシュを確実に防止しながら、上述した実装部品１０２の変形も防止することができる。本実施形態においても、弾性体１６Ｄとキャビティ駒１７Ｄとの間にはキャビティＣに向けられた隙間が形成されるが、フィルムＦを用いていることでこの隙間に樹脂Ｒが侵入してしまうことはなく、連続的に成形することができる。 By using the elastic body 16D arranged along the outer periphery of the mounting component 102, since the elastic body 16D is not provided in the pressure-resistant region, the mounting component 102 is pressed by the pressure of the resin R filled in the cavity C. It can be surely prevented from floating. Accordingly, the above-described deformation of the mounting component 102 can be prevented while reliably preventing flash. Also in the present embodiment, a gap directed toward the cavity C is formed between the elastic body 16D and the cavity piece 17D, but the resin F enters the gap by using the film F. It can be formed continuously.
　なお、キャビティ駒１７Ｄの凸部１７ａの外壁面とこの壁面に対向する壁面とにおいて凹むよう設けられた凹部１７ｂに、矩形枠状の弾性体１６Ｄの内壁面及び外壁面から突出するよう設けられた凸部１６ｃを嵌め込むようにして、キャビティ駒１７Ｄに弾性体１６Ｄを抜け止めして固定することもできる。 In addition, it provided in the recessed part 17b provided so that it might dent in the outer wall surface of the convex part 17a of cavity piece 17D, and the wall surface facing this wall surface so that it might protrude from the inner wall surface and outer wall surface of rectangular-frame-shaped elastic body 16D. It is also possible to fix the elastic body 16D to the cavity piece 17D by fitting the convex portion 16c.
　以上、本発明を実施形態に基づき具体的に説明したが、本発明は前記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能であることはいうまでもない。 As mentioned above, although this invention was concretely demonstrated based on embodiment, it cannot be overemphasized that this invention can be variously changed in the range which is not limited to the said embodiment and does not deviate from the summary.
　例えば、前記実施形態１では、同一材料から構成される弾性体１６の形状が、実装部品１０２と対向する部分１６ａおよび実装部品１０２の周囲と対向する部分１６ｂの厚みを同じにした板状のものを用いた場合について説明した。これに限らず、弾性体は、実装部品と対向する部分が硬く、実装部品の周囲と対向する部分の硬さが柔らかい異なる材料で構成され、実装部品と対向する部分および実装部品の周囲と対向する部分の厚みが同じである板状の形状のものであってもよい。これによれば、ワークをクランプした状態で、より確実に、実装部品の周囲で弾性体をキャビティ凹部の内底面から突出させることができる。 For example, in the first embodiment, the elastic body 16 made of the same material has a plate shape in which the thickness of the portion 16a facing the mounting component 102 and the thickness of the portion 16b facing the periphery of the mounting component 102 are the same. The case where is used has been described. Not limited to this, the elastic body is made of a material having a hard portion facing the mounting component and a softness in the portion facing the mounting component, and facing the mounting component and the periphery of the mounting component. It may have a plate-like shape with the same thickness. According to this, the elastic body can be more reliably projected from the inner bottom surface of the cavity recess around the mounted component in a state where the workpiece is clamped.
　また、前記実施形態１では、弾性体１６は、キャビティ駒１７の下面に設けた弾性体用凹部２１にはめ込まれる構成例について説明したが、下面が平坦に形成されたキャビティ駒に弾性体を貼り付ける構成としてもよい。これによれば、実装部品１０２の配置に応じて弾性体用凹部を成形する必要がないため、実装部品１０２の配置が変わっても同一のキャビティ駒を利用することができる。また、弾性体とキャビティ駒との一部の領域にのみに固定用の凹凸をそれぞれに設け、この凹凸によって固定できる構成としてもよい。 Further, in the first embodiment, the configuration example in which the elastic body 16 is fitted in the recess 21 for the elastic body provided on the lower surface of the cavity piece 17 has been described. However, the elastic body is attached to the cavity piece having the flat lower surface. It is good also as a structure to attach. According to this, since it is not necessary to form the concave portion for the elastic body according to the arrangement of the mounting component 102, the same cavity piece can be used even if the arrangement of the mounting component 102 changes. Moreover, it is good also as a structure which can provide the unevenness | corrugation for fixation only in the partial area | region of an elastic body and a cavity piece, and can fix by this unevenness | corrugation, respectively.
　また、前記実施形態１では、上型１１においてキャビティ駒１７が別体となる構成例について説明したが、一体としてもよい。 In the first embodiment, the configuration example in which the cavity piece 17 is separate from the upper mold 11 has been described, but may be integrated.

Claims (8)

  1. 　一方および他方の金型で実装部品を有するワークをクランプし、前記実装部品のクランプ面を露出させるように樹脂モールドする樹脂モールド金型であって、
    　前記一方の金型のパーティング面には、キャビティ凹部が設けられ、
    　前記他方の金型のパーティング面には、前記ワークが配置され、
    　前記キャビティ凹部の内底面から突出するように設けられた、前記実装部品を押圧する弾性体を備え、
    　前記キャビティ凹部の内底面から突出し、前記実装部品と対向する前記弾性体の対向面が、前記実装部品のクランプ面よりも広いことを特徴とする樹脂モールド金型。     A resin mold mold that clamps a workpiece having a mounting component with one and the other mold and performs resin molding so as to expose a clamp surface of the mounting component,
    A cavity recess is provided in the parting surface of the one mold,
    The workpiece is arranged on the parting surface of the other mold,
    Provided with an elastic body that is provided so as to protrude from the inner bottom surface of the cavity recess and presses the mounting component;
    A resin mold according to claim 1, wherein an opposing surface of the elastic body that protrudes from an inner bottom surface of the cavity recess and faces the mounting component is wider than a clamping surface of the mounting component.
  2. 　請求項１記載の樹脂モールド金型において、
    　前記弾性体は、前記実装部品と対向する部分が薄く、該実装部品の周囲と対向する部分が厚い形状に構成されていることを特徴とする樹脂モールド金型。     The resin mold according to claim 1,
    The elastic body is configured such that a portion facing the mounting component is thin and a portion facing the periphery of the mounting component is thick.
  3. 　請求項１または２記載の樹脂モールド金型において、
    　前記一方の金型には、前記キャビティ凹部の内底面を構成するキャビティ駒が設けられ、前記キャビティ駒に前記弾性体が設けられていることを特徴とする樹脂モールド金型。     In the resin mold die according to claim 1 or 2,
    The one mold is provided with a cavity piece constituting an inner bottom surface of the cavity recess, and the elastic piece is provided on the cavity piece.
  4. 　請求項３記載の樹脂モールド金型において、
    　前記キャビティ駒は、ライナーを介して前記一方の金型に設けられていることを特徴とする樹脂モールド金型。     In the resin mold die according to claim 3,
    The cavity piece is provided in the one mold through a liner.
  5. 　請求項１～４のいずれか一項に記載の樹脂モールド金型において、
    　前記弾性体の対向面および前記キャビティ凹部の内面を含む前記一方の金型のパーティング面にフィルムが設けられていることを特徴とする樹脂モールド金型。     In the resin mold according to any one of claims 1 to 4,
    A resin mold, wherein a film is provided on a parting surface of the one mold including the opposing surface of the elastic body and the inner surface of the cavity recess.
  6. 　請求項１～５のいずれか一項に記載の樹脂モールド金型において、
    　前記弾性体の突出厚みが、前記実装部品のクランプ面の平坦度よりも厚いことを特徴とする樹脂モールド金型。     In the resin mold according to any one of claims 1 to 5,
    The resin mold mold, wherein the protruding thickness of the elastic body is thicker than the flatness of the clamp surface of the mounting component.
  7. 　請求項１～６のいずれか一項に記載の樹脂モールド金型において、
    　前記弾性体の圧縮応力が、前記実装部品の耐力よりも低く、成形圧力よりも高いことを特徴とする樹脂モールド金型。     In the resin mold according to any one of claims 1 to 6,
    A resin mold, wherein the compressive stress of the elastic body is lower than the yield strength of the mounted component and higher than the molding pressure.
  8. 　一方および他方の金型で実装部品を有するワークをクランプし、前記実装部品のクランプ面を露出させるように樹脂モールドする樹脂モールド方法であって、
    　前記一方の金型のパーティング面にはキャビティ凹部が設けられ、前記キャビティ凹部の内底面から突出するように弾性体が設けられ、前記キャビティ凹部の内底面から突出して前記実装部品と対向する対向面が、前記実装部品のクランプ面よりも広い前記弾性体を用い、
    　前記他方の金型のパーティング面に前記ワークを配置して該ワークをクランプし、前記弾性体で前記実装部品を押圧することによって、前記実装部品で前記弾性体が凹まされて、前記実装部品の周囲でクランプ面を越えるように前記弾性体を突出させた後、前記キャビティ凹部内に樹脂を注入し、前記キャビティ凹部内で充填された前記樹脂を熱硬化させることを特徴とする樹脂モールド方法。     It is a resin molding method of clamping a work having mounting parts with one and the other molds, and resin-molding so as to expose a clamp surface of the mounting parts,
    A cavity recess is provided in the parting surface of the one mold, and an elastic body is provided so as to protrude from the inner bottom surface of the cavity recess, and is opposed to the mounting component by protruding from the inner bottom surface of the cavity recess. Using the elastic body whose surface is wider than the clamping surface of the mounted component,
    By placing the workpiece on the parting surface of the other mold, clamping the workpiece, and pressing the mounting component with the elastic body, the elastic body is recessed by the mounting component, and the mounting component The resin molding method is characterized in that after the elastic body is projected so as to exceed the clamp surface around the periphery of the resin, a resin is injected into the cavity recess and the resin filled in the cavity recess is thermally cured. .
PCT/JP2014/079747 2014-01-14 2014-11-10 Resin mold tooling and resin-molding method WO2015107758A1 (en)

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