CN108010902B - Circuit component, method for manufacturing circuit component, and apparatus for manufacturing circuit component - Google Patents

Circuit component, method for manufacturing circuit component, and apparatus for manufacturing circuit component Download PDF

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Publication number
CN108010902B
CN108010902B CN201710804097.5A CN201710804097A CN108010902B CN 108010902 B CN108010902 B CN 108010902B CN 201710804097 A CN201710804097 A CN 201710804097A CN 108010902 B CN108010902 B CN 108010902B
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resin
substrate
molding
cured resin
insulating
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CN108010902A (en
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竹内慎
田头史明
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a circuit component, a method for manufacturing the circuit component and an apparatus for manufacturing the circuit component. The method for manufacturing a circuit component having an electromagnetic shielding function includes: preparing a pre-package substrate (1) having a substrate (2), an electronic component (3) mounted on the substrate, and a ground electrode (7) provided around the electronic component; a first molding step of molding an insulating cured resin (18) on a substrate using a first molding die; and a second molding step of molding the conductive cured resin (27) on the substrate using a second molding die (20) to produce a packaged substrate (28). In a first molding step, a part (7a) of the ground electrode and the electronic component are covered with an insulating cured resin, and the remaining part (7b) of the ground electrode is exposed from the insulating cured resin to form an exposed ground electrode (7 b); in the second molding step, the insulating cured resin and the exposed ground electrode are covered with the conductive cured resin, and the exposed ground electrode and the conductive cured resin are electrically connected.

Description

Circuit component, method for manufacturing circuit component, and apparatus for manufacturing circuit component
Technical Field
The present invention relates to a circuit member having an electromagnetic shielding function, a method for manufacturing the circuit member, and an apparatus for manufacturing the circuit member.
Background
In electronic components used in wireless communication devices such as mobile phones and smartphones, there is widely adopted a technique of electromagnetically shielding (hereinafter, referred to as "shielding" as appropriate) the surroundings of circuit elements in order to prevent leakage of electromagnetic waves generated from the circuit elements constituting the electronic components or to isolate electromagnetic waves that invade from the outside. For example, a technique is disclosed in which a groove reaching a substrate is formed in an insulating resin applied to a plurality of circuit elements, and a conductive resin is filled in the groove to shield an electronic component (see patent document 1).
Patent document 1: japanese patent application laid-open No. 2010-238717
However, the electronic component disclosed in patent document 1 has the following problems. As shown in fig. 5 of patent document 1, in order to manufacture an electronic component, circuit elements 2A and 2B are mounted on a substrate 1A, and an insulating resin 13A is applied. Next, at the positions where the plurality of electronic components are divided, the half-cuts 5 are formed using a dicing machine. The half-cut grooves 5 are formed to a depth of: reaches the inner layer electrode of the substrate 1A from the surface of the insulating resin 13A. Next, the conductive resin 13B is filled in the half-cut groove 5 by placing the conductive resin 13B on the top surface of the insulating resin 13A and pressurizing and flowing it. In order to manufacture the shielded electronic component, a groove forming step and an apparatus for forming the half-cut groove 5 are required in addition to the pressure flowing step of applying resin and pressurizing and flowing the resin. Therefore, there are problems that the equipment cost increases and the manufacturing cost of the electronic component increases.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a circuit member, a method of manufacturing the circuit member, and an apparatus for manufacturing the circuit member, which can manufacture a circuit member having an electromagnetic shielding function by a conductive cured resin and can reduce manufacturing cost.
In order to solve the above problems, a method for manufacturing a circuit member according to the present invention is a method for manufacturing a circuit member having an electromagnetic shield function and an electronic circuit, the method including:
preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component;
a first molding step of molding an insulating cured resin on the first surface side of the substrate using a first molding die; and
a second molding step of molding a conductive cured resin on the first surface side of the substrate using a second molding die to produce a packaged substrate,
in the first molding step, a part of the ground electrode and the electronic component are covered with the insulating cured resin, and a remaining part of the ground electrode is exposed from the insulating cured resin to form an exposed ground electrode,
in the second molding step, the exposed ground electrode and the conductive cured resin are electrically connected to each other by covering the insulating cured resin and the exposed ground electrode with the conductive cured resin.
In the method for manufacturing a circuit member according to the present invention, the "remaining portion of the ground electrode" refers to another portion of the ground electrode excluding the partial portion. The explanation of the expression applies equally to other inventions and embodiments of the present invention.
In order to solve the above problems, a method for manufacturing a circuit member according to the present invention is a method for manufacturing a circuit member having an electromagnetic shield function and an electronic circuit, the method including:
preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component;
a first molding step of molding an insulating cured resin on the first surface side of the substrate using a first molding die so as to cover the electronic component, a part of the ground electrode, and the remaining part of the ground electrode with the insulating cured resin;
a step of forming an exposed ground electrode by removing the insulating cured resin covering the remaining portion of the ground electrode using a removing mechanism, followed by the first molding step, thereby exposing the remaining portion of the ground electrode; and
a second molding step of molding the conductive cured resin on the first surface side of the substrate using a second molding die to produce a packaged substrate,
in the second molding step, the exposed ground electrode and the conductive cured resin are electrically connected to each other by covering the insulating cured resin and the exposed ground electrode with the conductive cured resin,
the first molding die, the removing mechanism, and the second molding die provided in the same manufacturing apparatus are used as the first molding die, the removing mechanism, and the second molding die.
In order to solve the above-described problems, a method for manufacturing a circuit member according to the present invention is a method for manufacturing a circuit member having an electromagnetic shielding function and an electronic circuit, using a molding die including a first die and a second die disposed to face the first die, the method including:
preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component;
a step of supplying a conductive resin material that is solid, paste, or liquid at normal temperature to a cavity provided in the first mold;
disposing the pre-package substrate in the molding die such that the first surface of the substrate faces the cavity;
supplying an insulating resin material that is solid, paste, or liquid at normal temperature to the cavity to which the conductive resin material has been supplied;
a step of immersing a part of the ground electrode and the electronic component in an insulating fluid resin made of the insulating resin material and immersing the remaining part of the ground electrode in a conductive fluid resin made of the conductive resin material in the cavity by clamping the molding die;
a step of producing a packaged substrate by curing the insulating fluidized resin in the cavity to mold the insulating cured resin on the first surface side of the substrate and curing the conductive fluidized resin to mold the conductive cured resin on the first surface side of the substrate; and
a step of opening the molding die,
in the step of manufacturing the substrate after encapsulation, the remaining portion of the ground electrode and the conductive cured resin are electrically connected.
In order to solve the above problem, an apparatus for manufacturing a circuit member according to the present invention includes:
a first molding module having a first molding die;
a second molding module having a second molding die;
a substrate supply module that supplies a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and
a resin material supply module for supplying an insulating resin material and a conductive resin material,
in the first molding die, the insulating resin material is cured to mold an insulating cured resin, and at least a part of the ground electrode and the electronic component are covered with the insulating cured resin,
forming a substrate after encapsulation by curing the conductive resin material in the second forming mold to form a conductive cured resin covering at least the insulating cured resin,
on the rear substrate, at least the part of the ground electrode and the electronic component are covered with the insulating cured resin, and the insulating cured resin is covered with the conductive cured resin,
the first molding module and the second molding module are detachable from each other,
at least one of the first molding module and the second molding module and at least one of the substrate supply module and the resin material supply module are detachable from each other,
the conductive cured resin is attached to the ground electrode, and has an electromagnetic shielding function.
In order to solve the above problem, an apparatus for manufacturing a circuit member according to the present invention includes:
a first molding module having a first molding die;
a substrate supply module that supplies a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and
a resin material supply module for supplying an insulating resin material and a conductive resin material,
at least one of the substrate supply module and the resin material supply module and the first molding module are detachable from each other,
the first molding die is used for molding an insulating cured resin and a conductive cured resin for covering the insulating cured resin together to manufacture a packaged substrate,
on the rear substrate, at least the part of the ground electrode and the electronic component are covered with the insulating cured resin, and the insulating cured resin is covered with the conductive cured resin,
the conductive cured resin is attached to the ground electrode, and has an electromagnetic shielding function.
In order to solve the above problem, a circuit component according to the present invention includes:
an electronic component mounted on the substrate;
a ground electrode disposed on the substrate;
an insulating cured resin covering a part of the ground electrode and the electronic component,
a conductive cured resin covering the remaining portion of the ground electrode and the insulating cured resin, electrically connected to the remaining portion of the ground electrode, and having an electromagnetic shielding function; and
and a boundary portion formed at a boundary between the insulating cured resin and the conductive cured resin.
According to the present invention, a circuit component having an electromagnetic shielding function can be manufactured by covering an insulating cured resin with a conductive cured resin which is electrically connected to a ground electrode.
Drawings
Fig. 1 is a schematic diagram showing a package front substrate used in a circuit component according to the present embodiment, where (a) is a plan view and (b) is a cross-sectional view taken along line a-a of (a).
Fig. 2 (a) to (c) are schematic cross-sectional views showing a step of resin-molding the pre-package substrate shown in fig. 1 using a resin material having insulation properties (insulating resin material) to mold an intermediate body in embodiment 1.
Fig. 3 (a) to (c) are schematic cross-sectional views showing steps of resin-molding the intermediate body shown in fig. 2 using a resin material having conductivity (conductive resin material) to mold the substrate after encapsulation in embodiment 1.
Fig. 4 (a) to (c) are schematic cross-sectional views showing a process of manufacturing a circuit component by singulating the post-package substrate shown in fig. 3 in embodiment 1.
Fig. 5 (a) to (c) are schematic cross-sectional views showing steps of resin-molding the intermediate shown in fig. 2 using a conductive resin material in embodiment 2.
Fig. 6 (a) to (c) are schematic cross-sectional views showing a process of manufacturing a circuit component by singulating the resin-molded packaged substrate in embodiment 2.
Fig. 7 (a) to (c) are schematic cross-sectional views showing a step of supplying the pre-package substrate shown in fig. 1 to the upper mold and supplying the conductive resin material and the insulating resin material to the lower mold in embodiment 3.
Fig. 8 (a) to (c) are schematic cross-sectional views showing steps of curing the conductive resin material and the insulating resin material shown in fig. 7 to mold the substrate after encapsulation in embodiment 3.
Fig. 9 (a) to (c) are schematic cross-sectional views showing a process of manufacturing a circuit component by singulating the resin-molded packaged substrate in embodiment 3.
Fig. 10 is a plan view schematically showing a resin molding apparatus according to embodiment 4.
Fig. 11 is a plan view schematically showing a manufacturing apparatus in embodiment 5.
Fig. 12 (a) to (c) are schematic cross-sectional views showing various circuit components manufactured by resin molding a plurality of electronic components in embodiment 6.
Description of the reference numerals
1 packaging front substrate
2. 77, 88, 95 base plate
3 semiconductor chip (electronic component)
4. 79, 89, 96 substrate electrode
5 pad electrode
6. 78 welding wire
7. 80, 90, 97 ground electrode
7a part of
7b remaining part
8 solder resist
9 cutting line
10 area
11 first forming die
12 mould
13 lower die
14 mold cavity (first mold cavity)
15. 25, 31, 36 Release films
16. 38 granular resin (insulating resin material)
17 flowable resin (insulating flowable resin)
18. 43, 82, 91, 98 insulating cured resin
19 intermediate
20 second forming die
21 Upper mould (first mould, second mould)
22 lower die (second die, first die)
23 mold cavity (second mold cavity)
24 configuration area
26. 37 flake resin (conductive resin material)
27. 33, 42, 83, 92, 99 conductive cured resin
28. 34, 35 packaging rear substrate
29 rotary blade
30. 35, 46, 74, 84, 93 circuit components
32 liquid resin (conductive flowing resin)
39 conductive flowable resin
40 insulating fluid resin
41 fluid resin mixing layer
44. 100 cured resin mixing section
47 resin molding apparatus (manufacturing apparatus)
48 substrate supply storage module (substrate supply module)
49 first molding module
50 second molding module
51 resin material supply module
52 substrate supply part before packaging
53 substrate receiving part after packaging
54 substrate placing part
55 substrate conveying mechanism
56. 57 mould clamping mechanism
58 material conveying mechanism
59 Material delivery portion
60 granular resin supply mechanism
61 granular resin feeding mechanism
62 sheet-like resin supply mechanism
63 liquid resin ejection mechanism
64 mold release film supply mechanism
65 manufacturing device
66 cutting module
67 cutting table
68 moving mechanism
69 rotating mechanism
70. 71 mandrel
72. 73 rotating blade
75. 76, 85, 86, 87, 94 electronic component
81 projection
Detailed Description
Hereinafter, embodiments according to the present invention will be described with reference to the drawings. With respect to any one of the drawings in this document, it is appropriately depicted in an illustrative manner, omitted or exaggerated for ease of understanding. The same reference numerals are given to the same components, and the description thereof is omitted as appropriate. In the present specification, the term "electronic component" includes a so-called semiconductor chip which is not encapsulated with a resin or the like, and a semiconductor chip in which at least a part of the semiconductor chip is encapsulated with a resin or the like. Further, the "circuit component" includes a circuit component of a structure in which at least one electronic component is shielded by a conductive cured resin.
[ embodiment 1]
(Structure of substrate before packaging)
A structure of a pre-package substrate used for a circuit component according to embodiment 1 of the present invention will be described with reference to fig. 1.
As shown in fig. 1 (a), the pre-package substrate 1 is a substrate in which a substrate is virtually divided into a plurality of regions in a lattice shape, and electronic components are mounted in each region. In this embodiment, a package front substrate on which a plurality of semiconductor chips as electronic components are mounted is shown. The package front substrate 1 includes a substrate 2 and a plurality of semiconductor chips 3 mounted on the substrate 2. As the substrate 2, for example, a glass epoxy laminate, a printed board, a ceramic substrate, or the like is used. As the semiconductor chip 3, for example, a microprocessor, a high frequency device, a power device, and the like are mounted. In fig. 1, the semiconductor chip 3 is mounted on the substrate 2 with the main surface of the semiconductor chip 3 on which the circuit is formed facing upward.
The surface of the substrate 2 is provided with a plurality of substrate electrodes 4. Although not shown, the substrate electrodes 4 are connected to the external electrodes provided on the back surface of the substrate 2 via the wiring provided on the front surface of the substrate 2 and via hole wiring provided inside the substrate 2. For example, copper (Cu), aluminum (Al), or the like having a small resistivity is preferably used for the substrate electrode 4, the wiring, the via wiring, and the external electrode. As shown in fig. 1 (b), the plurality of substrate electrodes 4 are electrically connected to the pad electrodes 5 formed on the semiconductor chip 3, respectively. The substrate electrode 4 and the pad electrode 5 are connected by bonding wires 6 made of gold wires or copper wires, respectively.
A specific electrode among the plurality of substrate electrodes 4 constitutes a ground electrode (ground electrode) 7 for setting the potential of the semiconductor chip 3 to a ground potential. As shown in fig. 1 (a), the ground electrode 7 includes a frame-shaped wiring pattern surrounding the semiconductor chip 3 and the plurality of substrate electrodes 4. In the present embodiment, each region where the semiconductor chip 3 is mounted is referred to as a ground electrode 7 including a portion of the ground electrode 7 to which the bonding wire 6 is directly connected and a frame-shaped wiring pattern formed on the outermost periphery.
A solder resist 8 as an insulating resin coating is provided on the surface of the substrate 2 in addition to the surfaces of the substrate electrode 4 and the ground electrode 7.
On the pre-package substrate 1, the substrate 2 is divided into a plurality of regions in a lattice shape, and cutting lines 9 for cutting the respective regions are provided along the X direction and the Y direction (broken lines shown in the lateral direction and the longitudinal direction in fig. 1 (a)). Each of the regions 10 surrounded by the plurality of cutting lines 9 corresponds to a region to be a circuit component shielded by the conductive cured resin.
(resin Molding Process and singulation Process)
Referring to fig. 2 to 4, a process of manufacturing a circuit component by resin molding a pre-package substrate 1 shown in fig. 1 to manufacture a post-package substrate and singulating the post-package substrate using a resin molding apparatus using a compression molding method, for example, will be described. As described below, the resin molding apparatus (see fig. 10) used in the present embodiment is a manufacturing apparatus including a first molding die for molding an insulating cured resin and a second molding die for molding an electroconductive cured resin.
With reference to fig. 2, a description will be given of a structure of a first molding die for molding an insulating cured resin in a resin molding apparatus. As shown in fig. 2 (a), the first molding die 11 includes an upper die 12 and a lower die 13 disposed to face the upper die 12. In the lower mold 13, a cavity 14 is provided, and an insulating resin material is supplied to the cavity 14.
Referring to fig. 2, a process of resin-molding the pre-package substrate 1 using an insulating resin material will be described. First, the first molding die 11 is set in a state in which the upper die 12 and the lower die 13 are opened. Next, the pre-package substrate 1 shown in fig. 1 is conveyed to a predetermined position below the upper mold 12 by using a substrate conveying mechanism (see fig. 10).
Next, the front package substrate 1 is raised by the substrate transfer mechanism, and the front package substrate 1 is fixed to the mold surface of the upper mold 12 by suction or clamping (not shown). The package front substrate 1 is fixed to the mold surface of the upper mold 12 such that the surface on which the semiconductor chip 3 is mounted faces downward.
Next, the release film 15 is supplied to the lower die 13. The release film 15 is sucked along the mold surface of the lower mold 13 in the cavity 14 by a suction mechanism (not shown) provided in the lower mold 13. As the release film 15, any of a release film cut into a thin and long shape and a release film in a long shape can be used. Further, depending on the resin material, the release film 15 may not be used. Fig. 1 shows an example of supplying the release film 15 cut into a thin and rectangular shape.
Next, using a material conveying mechanism (refer to fig. 10), the insulating resin material is supplied to the cavity 14 provided in the lower mold 13. As the insulating resin material, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be used. As the resin material, a solid resin in a powder form, a granular form, a sheet form, or the like at normal temperature, a resin in a liquid form (liquid resin) regardless of the viscosity or the like at normal temperature (hereinafter, the same), or the like can be used. In the present embodiment, an example is shown in which a resin (granular resin) 16 in a granular form is supplied as an insulating resin material. Specifically, the granular resin 16 is supplied onto the release film 15 adsorbed to the cavity 14.
Here, an example in which the release film 15 and the granular resin 16 are carried to the lower die 13 in different steps is described, but the present invention is not limited to this. For example, a material housing frame is disposed on the release film 15, and the granular resin 16 is put into the material housing frame. In this state, the release film 15 and the material storage frame are collectively (simultaneously) conveyed to the lower die 13 by the material conveying mechanism. In this way, the release film 15 and the granular resin 16 can be supplied to the cavity 14 together.
Next, the granular resin 16 is heated by a heater (not shown) provided in the lower mold 13. By heating, the granular resin 16 is melted to produce an insulating fluid resin (insulating fluid resin) 17. In the case where a liquid resin is supplied as an insulating resin material to the cavity 14, the liquid resin itself corresponds to the insulating fluidized resin 17.
Next, as shown in fig. 2b, the lower mold 13 is raised by using a mold clamping mechanism (see fig. 10) to clamp the upper mold 12 and the lower mold 13. By performing the mold clamping, the semiconductor chip 3 mounted on the pre-package substrate 1 is immersed in the insulating fluid resin 17 filled in the cavity 14. After the upper mold 12 and the lower mold 13 are clamped, the insulating fluidized resin 17 in the cavity 14 is pressurized by using the upper mold 12 and the lower mold 13.
Next, the insulating fluidized resin 17 is heated by a heater (not shown) provided in the lower mold 13 for a time necessary for curing the insulating fluidized resin 17 having the insulating property. The insulating fluidized resin 17 is cured to mold an insulating cured resin (insulating cured resin) 18. A part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the pre-package substrate 1 are resin-packaged by an insulating cured resin 18 molded in accordance with the shape of the cavity 14. The semiconductor chip 3 and a part 7a of the ground electrode 7 are resin-encapsulated with an insulating cured resin 18 with respect to the pre-encapsulation substrate 1. Through the steps up to this point, the intermediate body 19 is molded. The hardness of the cured resin may be sufficient for protecting the semiconductor chip 3 and the like covered with the cured resin from external force, external environment, and the like.
In a state where the upper mold 12 and the lower mold 13 are clamped, the outer peripheral portion of the cavity 14 overlaps the ground electrode 7 of the front substrate 1 in plan view. Therefore, a part 7a (a side close to the semiconductor chip 3) of the ground electrode 7 is impregnated in the insulating flowable resin 17. On the other hand, the remaining portion 7b of the ground electrode 7 (the side remote from the semiconductor chip 3) is not impregnated in the insulating flowable resin 17, but is held by the mold surface of the lower mold 13. Accordingly, when the substrate 1 is resin-molded with the insulating resin material (the granular resin 16) before the package, the part 7a of the ground electrode 7 and the semiconductor chip 3 are resin-molded. On the other hand, the remaining portion 7b of the ground electrode 7 is not resin-molded, but is exposed from the surface of the ground electrode 7.
Next, as shown in fig. 2 (c), the upper mold 12 and the lower mold 13 are opened by using a mold clamping mechanism. An intermediate body 19 is fixed to the profile of the upper die 12. The remaining portion 7b of the ground electrode 7 is exposed from the surface of the ground electrode 7 without being encapsulated with resin. Next, the intermediate body 19 is taken out from the first molding die 11 by using the substrate conveying mechanism.
In the intermediate body 19, it is required that no cured resin be formed in a region desired to be exposed from the insulating cured resin 18 (a region including at least the remaining portion 7b of the ground electrode 7). In order to make this requirement possible, the following method can be employed. The first method is to use the above-described release film 15. The second method is to attach a resin film having an opening corresponding to the range where the insulating cured resin 18 is formed, to the pre-package substrate 1. By removing the resin film after the insulating cured resin 18 is formed, the region to which the resin film is attached is exposed from the insulating cured resin 18. The third method is to remove the thin insulating cured resin formed in the region desired to be exposed from the insulating cured resin 18 by sand blasting, water jet machining, cleaning, or the like.
With reference to fig. 3, a structure of a second molding die for molding a conductive cured resin in a resin molding apparatus will be described. As shown in fig. 3 (a), the second molding die 20 includes an upper die 21 and a lower die 22 disposed to face the upper die 21. In the lower mold 22, a cavity 23 is provided, and the conductive resin material is supplied to the cavity 23. Around the cavity 23, for example, an arrangement region 24 in which a sheet-like resin is arranged is provided. The arrangement region 24 is provided to encompass the entire cavity 23 provided in the lower mold 22 in a plan view.
The expression "B is contained in a" in a plan view means "when a and B overlap each other as viewed in a direction drawn as a plan view, a completely contains B, and a part of a exists outside B over the entire periphery of B".
The cavity 23 provided in the lower die 22 of the second molding die 20 includes the cavity 14 provided in the lower die 13 of the first molding die 11, viewed in perspective (refer to fig. 2). In other words, the volume (volume) of the cavity 23 is set to be larger than the volume (volume) of the cavity 14 in a state where the mold surface of the lower mold 22 and the mold surface of the lower mold 13 are overlapped. The size of the cavity 23 is set larger than the size of the cavity 14 in the X direction, the Y direction, and the Z direction.
Referring to fig. 3 to 4, a process of resin-molding the intermediate body 19 with a conductive resin material to produce a substrate after encapsulation and singulating the substrate after encapsulation to produce a circuit component will be described. As the insulating resin material, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be used. As the resin material, a solid resin in a powder form, a granule form, a sheet form, or the like at normal temperature, a resin in a liquid form at normal temperature, or the like can be used.
First, as shown in fig. 3 (a), the second molding die 20 is in a state in which the upper die 21 and the lower die 22 are opened. Next, the intermediate body 19 taken out of the first molding die 11 (see fig. 2) is carried to a predetermined position below the upper die 21 by the substrate carrying mechanism (see fig. 10). Next, the intermediate body 19 is raised by the substrate transfer mechanism, and the intermediate body 19 is fixed to the mold surface of the upper mold 21 by suction or clamping.
Next, the release film 25 and the conductive resin material are supplied to the lower die 22. In the present embodiment, an example is shown in which the release film 25 and the conductive resin material are supplied to the cavity 23 together. For example, an example is shown in which a sheet-shaped resin (sheet-shaped resin) 26 is supplied to the cavity 23 in a state where the sheet-shaped resin 26 is adhered to the mold release film 25 as a conductive resin material. The sheet-like resin 26 used in the present embodiment is a sheet-like resin having flexibility. Therefore, the sheet-like resin 26 is stretched by heating.
As shown in fig. 3 (a), the release film 25 to which the sheet-shaped resin 26 is adhered is supplied to the lower die 22 by using a material conveying mechanism (see fig. 10). The sheet-like resin 26 is disposed on the disposition region 24 with the release film 25 interposed therebetween, and the disposition region 24 provided in the lower mold 22. Here, an example is shown in which a release film cut into a thin and rectangular shape is used as the release film 25 to which the sheet-like resin 26 is adhered. Not limited to this, a sheet-like resin may be adhered to a long release film.
The sheet-like resin 26 having conductivity is formed by adding metal particles such as silver (Ag), copper (Cu), aluminum (Al), and nickel (Ni), and conductive particles such as carbon particles to a thermosetting resin such as an epoxy resin or a silicone resin. The sheet-like resin 26 can be controlled in conductivity and warpage by the type and amount of the conductive particles added. The sheet-shaped resin 26 containing conductive particles has a thermal conductivity larger than that of the insulating granular resin 16. This point is also the same in the following embodiments.
Next, as shown in fig. 3b, the release film 25 is sucked along the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24 by using a suction mechanism (not shown) provided in the lower mold 22. In this case, since the sheet-like resin 26 having flexibility is adhered, the sheet-like resin 26 is also arranged along the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24 together with the release film 25. The release film 25 and the sheet-like resin 26 are stretched by radiant heat from a heater provided in the lower mold 22, and therefore can be arranged along the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24. In this way, the sheet-like resin 26 having conductivity is supplied to the cavity 23.
Next, as shown in fig. 3 c, the lower mold 22 is raised by using a mold clamping mechanism (see fig. 10) to clamp the upper mold 21 and the lower mold 22. The cavity 23 provided in the lower die 22 of the second molding die 20 includes the cavity 14 provided in the lower die 13 of the first molding die 11, viewed in perspective (refer to fig. 2). Therefore, the insulating cured resin 18 molded in the intermediate 19 is contained in the cavity 23. By performing the mold clamping, the insulating cured resin 18 molded in the intermediate body 19 is inserted seamlessly (substantially strictly) into the space surrounded by the cavity 23, strictly speaking, the sheet-like resin 26. In this state, the remaining portion 7b of the exposed surface of the ground electrode 7 is in contact with the sheet-like resin 26 having conductivity.
Next, the sheet-like resin 26 is heated and melted by a heater (not shown) provided in the lower mold 22. Further, the flowable resin (conductive flowable resin) is heated for a time necessary for the molten flowable resin to be solidified. The flowable resin is cured, and thereby molding of the cured resin (conductive cured resin) 27 having conductivity is realized. The conductive cured resin 27 is fixed to the insulating resin 18 by curing. The remaining portion 7b of the ground electrode 7 is electrically connected to the conductive cured resin 27. Therefore, the ground electrode 7 and the conductive cured resin 27 can be electrically conducted. Accordingly, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 27. Through the steps up to this point, the packaged substrate 28 is molded. An interface is formed at the boundary between the insulating cured resin 18 and the conductive cured resin 27.
Next, as shown in fig. 4 (a), the upper mold 21 and the lower mold 22 are opened by using a mold clamping mechanism. The encapsulated substrate 28 obtained by resin molding the intermediate body 19 is fixed to the mold surface of the upper mold 21. Next, the packaged substrate 28 is taken out from the second molding die 20 by using the substrate transfer mechanism.
Next, as shown in fig. 4 (b), the packaged substrate 28 is cut (completely cut) using, for example, a cutting device having a rotary blade 29. The sealed substrate 28 is cut along a cutting line 9 (see fig. 1 a) provided in the sealed substrate 28 by a rotary blade 29.
As shown in fig. 4 (c), the post-package substrate 28 is cut and singulated to manufacture the circuit components 30. The conductive cured resin 27 and the ground electrode 7 are electrically connected. Therefore, the circuit member 30 has a structure in which the semiconductor chip 3 is electromagnetically shielded by being surrounded by the conductive cured resin 27. An interface is formed at the boundary between the insulating cured resin 18 and the conductive cured resin 27.
(Effect)
The method for manufacturing a circuit member according to the present embodiment is a method for manufacturing a circuit member 30 having an electromagnetic shield function and including an electronic circuit, and includes: preparing a pre-package substrate 1, the pre-package substrate 1 including at least a substrate 2 having a first surface, a semiconductor chip 3 as an electronic component mounted on the first surface of the substrate 2, and a ground electrode 7 provided around the semiconductor chip 3; a first molding step of molding the insulating cured resin 18 on the first surface side of the substrate 2 using the first molding die 11; and a second molding step, subsequent to the first molding step, of molding the conductive cured resin 27 on the first surface side of the substrate 2 using the second molding die 20 to produce a packaged substrate 28. In the first molding step, a part 7a of the ground electrode 7 and the semiconductor chip 3 are covered with the insulating cured resin 18, and the remaining part 7b of the ground electrode 7 is exposed from the insulating cured resin 18 to form an exposed ground electrode 7 b; in the second molding step, the insulating cured resin 18 and the exposed ground electrode 7b are covered with the conductive cured resin 27, and the exposed ground electrode 7b and the conductive cured resin 27 are electrically connected to each other.
According to this manufacturing method, the part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the main surface of the substrate 2 are resin-sealed with the insulating cured resin 18. The remaining portion 7b of the ground electrode 7 is resin-encapsulated with a conductive cured resin 27. Thereby, the conductive cured resin 27 and the ground electrode 7 are electrically connected. Therefore, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 27. Further, the manufacturing cost of the circuit member 30 can be reduced.
The circuit component of the present embodiment is configured as follows, including: a semiconductor chip 3 which is an electronic component mounted on the substrate; a ground electrode 7 provided on the substrate 2; an insulating cured resin 18 covering a part 7a of the ground electrode 7 and the semiconductor chip 3; a conductive cured resin 27 which covers the remaining portion 7b of the ground electrode 7 and the insulating cured resin 18, is electrically connected to the remaining portion 7b of the ground electrode 7, and has an electromagnetic shielding function; and a boundary portion formed at the boundary between insulating cured resin 18 and conductive cured resin 27.
According to this configuration, the part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the substrate 2 are covered with the insulating cured resin 18, and the remaining part 7b of the ground electrode 7 and the conductive cured resin 27 can be electrically connected. Therefore, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 27.
According to the present embodiment, first, the pre-package substrate 1 is resin-molded using an insulating resin material (granular resin 16). In this way, the intermediate body 19 is molded by resin-encapsulating the part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the pre-package substrate 1 with the insulating cured resin 18. The remaining portion 7b of the ground electrode 7 is not encapsulated with resin, and is exposed at its surface. Next, the intermediate 19 is resin-molded using a conductive resin material (sheet-like resin 26). Accordingly, the remaining portion 7b of the ground electrode 7 of the intermediate body 19 is resin-encapsulated with the conductive cured resin 27, so that the encapsulated substrate 28 is molded. The conductive cured resin 27 and the ground electrode 7 are electrically connected. Therefore, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 27. The circuit component 30 manufactured by singulating the post-package substrate 28 has a structure in which the semiconductor chip 3 is surrounded by the conductive cured resin 27 and electromagnetically shielded.
The thermal conductivity of the conductive cured resin 27 containing conductive particles is larger than the thermal conductivity of the insulating cured resin 18. Therefore, the conductive cured resin 27 has a heat dissipation function, and thus the circuit component 30 having excellent heat dissipation is manufactured. This point is also the same in the following embodiments.
According to the present embodiment, the resin molding apparatus is provided with the first molding die 11 for molding the insulating cured resin 18 and the second molding die 20 for molding the conductive cured resin 27. The first molding die 11 is used to resin-encapsulate the part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the pre-encapsulation substrate 1 with the insulating cured resin 18. The remaining portion 7b of the ground electrode 7 is resin-sealed with a conductive cured resin 27 using a second molding die 20. Accordingly, the conductive cured resin 27 and the ground electrode 7 can be electrically connected, and the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 27. The circuit component 30 of the shield structure can be manufactured by two times of resin molding using a resin molding apparatus. The circuit component 30 of the shield structure can be manufactured without using a device other than the resin molding device. Therefore, the manufacturing cost of the circuit component 30 can be reduced while suppressing the equipment cost.
In the present embodiment, resin molding of both the insulating cured resin 18 and the conductive cured resin 27 is realized by compression molding. Without being limited thereto, the resin molding of the insulating cured resin 18 may be realized by a transfer molding method or an injection molding method, and the resin molding of the conductive cured resin 27 may be realized by a compression molding method. Alternatively, resin molding of both the insulating cured resin 18 and the conductive cured resin 27 may be realized by transfer molding or injection molding. Further, the resin molding of the insulating cured resin 18 and the conductive cured resin 27 may be realized by using separate devices.
In the present embodiment, the cavities 14 and 23 corresponding to the respective regions 10 (the regions corresponding to the circuit components 30) surrounded by the plurality of cutting lines 9 are provided in the respective molding dies 11 and 20 (the lower dies 13 and 22). Without being limited thereto, a cavity containing each region 10 may also be provided in each molding die 11, 20. In this case, in the circuit component 30 obtained by cutting and singulating the post-package substrate 28, a part of the conductive cured resin 27 is electrically connected to the ground electrode 7, and the semiconductor chip 3 can be electromagnetically shielded. The conductive cured resin 27 described above corresponds to a left end portion and a right end portion in fig. 4 (b).
As a modification, the surface (the lower surface and the side surfaces shown in fig. 2 (c)) of the insulating cured resin 18 may be a rough surface. The surface of the release film 15 (the surface on the side in contact with the insulating fluidized resin 17) can be roughened, whereby the surface of the insulating cured resin 18 can be roughened. This increases the area of adhesion between insulating cured resin 18 and conductive cured resin 27. Therefore, the adhesion between the insulating cured resin 43 and the conductive cured resin 42 can be improved.
Thermosetting resins are used as the main material constituting the insulating resin material and the main material constituting the conductive resin material. As these main materials, a thermoplastic resin may be used instead of the thermosetting resin.
The embodiment in which the post-package substrate 28 corresponds to the plurality of circuit components 30 has been described. Without being limited thereto, the package rear substrate 28 may be configured to correspond to one circuit component 30. For example, the large-sized circuit component 30 for power control or the like corresponds to the circuit board having the above-described configuration. In addition, the post-package substrate 28 corresponding to the plurality of circuit components 30 may be a transaction target. Therefore, the package rear substrate 28 may correspond to a circuit component as a product.
As the conductive resin material, a sheet-like resin 26 in which conductive particles are added to a thermosetting resin is used. Instead of the conductive particles, conductive fibers (metal fibers, carbon fibers, etc.) and conductive foils (metal foils, etc.) may be used. The above-described modifications can be applied to other embodiments.
[ embodiment 2]
(resin Molding Process and singulation Process)
With reference to fig. 5 to 6, description will be made of a process in embodiment 2 in which the intermediate body 19 shown in embodiment 1 (fig. 2) is resin-molded to produce a post-package substrate, and the post-package substrate is singulated to produce a circuit component. The difference from embodiment 1 is that the release film and the resin material are not supplied to the cavity 23 of the second molding die 20 together, but are supplied in different steps. The other steps are the same as those in embodiment 1 in the configuration of the first molding die 11 and the second molding die 20, and therefore, the description thereof is omitted.
First, as shown in fig. 5 (a), in the second molding die 20, the intermediate body 19 is fixed to the molding surface of the upper die 21.
Next, the release film 31 is supplied to the lower die 22. As the release film 31, any of a release film cut into a thin and long shape and a release film in a long shape can be used. Next, the release film 31 is sucked along the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24 by using a suction mechanism (not shown) provided in the lower mold 22.
Next, as shown in fig. 5 b, for example, a liquid resin (liquid resin) 32 is supplied as a conductive resin material to the cavity 23 by using a material conveying mechanism (see fig. 10). The liquid resin 32 is supplied to the cavity 23 by, for example, a liquid resin discharge mechanism (dispenser). In this case, a low viscosity (flowable) liquid resin is preferably used.
Next, as shown in fig. 5 c, the upper mold 21 and the lower mold 22 are clamped by using a clamping mechanism (see fig. 10). Similarly to embodiment 1, the cavity 23 provided in the lower die 22 of the second molding die 20 includes the cavity 14 provided in the lower die 13 of the first molding die 11 in a three-dimensional view. Therefore, by clamping the second molding die 20, the liquid resin 32 is made to flow between the molding surface of the lower die 22 and the insulating cured resin 18 in the cavity 23 and between the molding surface of the lower die 22 and the intermediate body 19 in the arrangement region 24. Accordingly, the surface of the insulating cured resin 18 and the remaining portion 7b of the ground electrode 7 are impregnated with a liquid resin (conductive flowable resin) 32 having conductivity.
Next, as shown in fig. 6 (a), the conductive fluidized resin 32 is heated by a heater (not shown) provided in the lower mold 22 to mold a cured resin (conductive cured resin) 33 having conductivity. The conductive cured resin 33 is fixed to the insulating cured resin 18 by curing. The remaining portion 7b of the ground electrode 7 is electrically connected to the conductive cured resin 33. Therefore, the ground electrode 7 and the conductive cured resin 33 can be electrically conducted. Accordingly, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 33. Through the steps up to this point, the post-package substrate 34 is molded.
Next, as shown in fig. 6 (b), the upper mold 21 and the lower mold 22 are opened. Next, the packaged substrate 34 is taken out from the second molding die 20 by using the substrate transfer mechanism.
Next, as shown in fig. 6 (c), the packaged substrate 34 is cut by using a cutting device having a rotary blade 29. The post-package substrate 34 is cut along the cutting line 9 provided on the post-package substrate 34 to be singulated, thereby manufacturing each circuit component 35. The conductive cured resin 33 and the ground electrode 7 are electrically connected. Therefore, the circuit member 35 has a structure in which the semiconductor chip 3 is surrounded by the conductive cured resin 33 to be electromagnetically shielded.
Since the circuit component 35 manufactured in embodiment 2 can achieve the same effects as those of the circuit component 30 shown in embodiment 1, the description thereof is omitted.
In the present embodiment, the liquid resin 32 is supplied as the conductive resin material to the cavity 23 provided in the lower die 22 of the second molding die 20. Not limited to this, a sheet-like resin having conductivity that is preliminarily preformed in accordance with the shape of the cavity 23 may be used. In this case, after the mold release film 31 is adsorbed to the cavity 23, a sheet-like resin that is preformed in accordance with the shape of the cavity 23 may be supplied.
[ embodiment 3]
(resin Molding Process and singulation Process)
With reference to fig. 7 to 9, description will be made of a process in embodiment 3 in which a pre-package substrate 1 shown in embodiment 1 (fig. 1) is resin-molded to produce a post-package substrate, and the post-package substrate is singulated to produce circuit components. The difference from embodiment 1 is that both the conductive resin material and the insulating resin material are supplied to one molding die (second molding die) to perform resin molding. Therefore, in embodiment 3, an example in which the package front substrate 1 is resin-molded using only the second molding die 20 shown in embodiments 1 and 2 will be described.
First, as shown in fig. 7 (a), in the second molding die 20, the package front substrate 1 is fixed to the mold surface of the upper die 21.
Next, the release film 36 is supplied to the lower die 22. The release film 36 is sucked along the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24 by using a suction mechanism provided in the lower mold 22.
Next, as shown in fig. 7b, a sheet-like resin (sheet-like resin) 37 is supplied as a conductive resin material to the cavity 23 by using a material conveying mechanism (see fig. 10). The sheet-shaped resin 37 is a sheet-shaped resin that is pre-molded in advance in accordance with the shape of the cavity 23. Therefore, the sheet-like resin 37 is arranged so as to follow the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24.
Next, as shown in fig. 7 c, a material conveying mechanism (see fig. 10) is used to supply a granular resin (granular resin) 38 as an insulating resin material to the cavity 23. Specifically, the granular resin 38 is supplied onto the sheet-like resin 37.
The sheet-shaped resin 37 and the granular resin 38 preferably contain the same kind of resin material (for example, epoxy resin, silicone resin, or the like) as a main material. It is preferable that the main material contained in the sheet-like resin 37 and the main material contained in the granular resin 38 have the same characteristics (for example, a relationship between time and viscosity at a certain temperature). In the resin molding process, a fluid resin mixed layer (described later) in which a conductive resin and an insulating resin are mixed is formed. The flowable resin mixed layer is formed by thermally diffusing molecules constituting the conductive resin and molecules constituting the insulating resin with each other.
Next, as shown in fig. 8 (a), the sheet-shaped resin 37 and the granular resin 38 are heated by a heater (not shown) provided in the lower die 22. The sheet-like resin 37 is melted by heating to produce a flowable resin (conductive flowable resin) 39 having conductivity. Similarly, the granular resin 38 is melted to produce an insulating fluid resin (insulating fluid resin) 40. A mixed layer 41 of a flowable resin (a portion sandwiched by broken lines in the drawing) is formed at the boundary between the conductive flowable resin 39 and the insulating flowable resin 40. The flowable resin mixed layer 41 is formed by thermally diffusing molecules constituting the conductive resin and the insulating resin, and corresponds to an intermediate layer including adjacent resin materials.
Next, as shown in fig. 8 b, the upper mold 21 and the lower mold 22 are clamped by using a clamping mechanism (see fig. 10). Accordingly, a part 7a of the ground electrode 7 and the semiconductor chip 3 are impregnated into the insulating flowable resin 40, and the remaining part 7b of the ground electrode 7 is impregnated into the conductive flowable resin. At the boundary between the conductive fluidized resin 39 and the insulating fluidized resin 40, the state in which the fluidized resin mixture layer 41 is interposed is maintained.
Next, as shown in fig. 8 (c), the fluid resin is heated for a time necessary for curing each fluid resin, thereby molding the cured resin. The conductive flowable resin 39 is heated to effect molding of the conductive curable resin 42. The insulating fluidized resin 40 is heated to mold the insulating cured resin 43. The flowing resin mixed layer 41 is heated to realize molding of the cured resin mixed portion 44. Accordingly, the part 7a of the ground electrode 7 and the semiconductor chip 3 are resin-sealed with the insulating cured resin 43. The remaining portion 7b of the ground electrode 7 is resin-encapsulated with a conductive cured resin 42. A cured resin mixture portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42. The remaining portion 7b of the ground electrode 7 is electrically connected to the conductive cured resin 42. Therefore, the ground electrode 7 and the conductive cured resin 42 can be electrically connected. Accordingly, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 42. Through the steps up to this point, the post-package substrate 45 is molded.
In the present embodiment, a cured resin mixture portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42. The cured resin mixture portion 44 is a region in which molecules constituting the insulating cured resin 43 and the conductive cured resin 42 are thermally diffused and bonded to each other. Accordingly, a strong bonding force is obtained between the insulating cured resin 43 and the conductive cured resin 42. Therefore, the insulating cured resin 43 and the conductive cured resin 42 can be more firmly fixed.
Next, as shown in fig. 9 (a), the upper mold 21 and the lower mold 22 are opened by using a mold clamping mechanism. A rear package substrate 45 is fixed to the mold surface of the upper mold 21. Next, the packaged substrate 45 is taken out from the second molding die 20 by using the substrate transfer mechanism.
Next, as shown in fig. 9 (b), the packaged substrate 45 is cut by using a cutting device having a rotary blade 29. The sealed substrate 45 is cut along a cutting line 9 provided in the sealed substrate 45 by using a rotary blade 29.
As shown in (c) of fig. 9, the post-package substrate 45 is cut and singulated to manufacture the circuit components 46. A cured resin mixed portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42, and the conductive cured resin 42 and the ground electrode 7 are electrically connected. Therefore, the circuit member 46 has a structure in which the semiconductor chip 3 is surrounded by the conductive cured resin 42 so as to be electromagnetically shielded.
(Effect)
A method of manufacturing a circuit component according to the present embodiment is a method of manufacturing a circuit component 46 having an electronic circuit and an electromagnetic shielding function using a mold 20, the mold 20 including a lower mold 22 as a first mold and an upper mold 21 as a second mold disposed to face the lower mold 22, the method including: preparing a pre-package substrate 1, the pre-package substrate 1 including at least a substrate 2 having a first surface, a semiconductor chip 3 as an electronic component mounted on the first surface of the substrate 2, and a ground electrode 7 provided around the semiconductor chip 3; a step of supplying a conductive resin material 37 which is solid, paste, or liquid at normal temperature to a cavity 23 provided in a lower mold 22; a step of disposing the pre-package substrate 1 in the molding die 20 such that the first surface of the substrate 2 faces the cavity 23; a step of supplying an insulating resin material 38 which is solid, paste-like or liquid at normal temperature to the cavity 23 to which the conductive resin material 37 has been supplied; a step of immersing a part 7a of the ground electrode 7 and the semiconductor chip 3 in an insulating fluid resin 40 formed of an insulating resin material 38 and immersing the remaining part 7b of the ground electrode 7 in a conductive fluid resin 39 formed of a conductive resin material 37 in the cavity 23 by clamping the molding die 20; a step of producing a post-package substrate 45 by curing the insulating fluidized resin 40 in the cavity 23 to mold the insulating cured resin 43 on the first surface side of the substrate 2 and curing the conductive fluidized resin 39 to mold the conductive cured resin 42 on the first surface side of the substrate 2; and opening the molding die 20. In the step of manufacturing the post-package substrate 45, the remaining portion 7b of the ground electrode 7 is electrically connected to the conductive cured resin 42.
According to this manufacturing method, a sheet-like resin 37 having conductivity and a granular resin 38 having insulation are supplied to a cavity 23 provided in a molding die 20 (lower die 22). By heating the sheet-shaped resin 37 and the granular resin 38 at the same time, the part 7a of the ground electrode 7 and the semiconductor chip 3 are resin-encapsulated by the insulating cured resin 43, and the remaining part 7b of the ground electrode 7 is resin-encapsulated by the conductive cured resin 42. Accordingly, the conductive cured resin 42 and the ground electrode 7 can be electrically connected. The semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 42 by the primary resin molding. Therefore, the manufacturing cost of the circuit member 46 can be further reduced.
According to the present embodiment, first, the conductive resin material (sheet-like resin 37) is supplied to the cavity 23. Next, an insulating resin material (granular resin 38) is supplied. The sheet-like resin 37 is melted to produce a conductive flowable resin 39. The granular resin 38 is melted to produce an insulating flowable resin 40. The conductive fluidized resin 39 and the insulating fluidized resin 40 are cured, and the conductive cured resin 42 and the insulating cured resin 43 are molded. The semiconductor chip 3 and a part 7a of the ground electrode 7 are resin-sealed with an insulating cured resin 43, and the remaining part 7b of the ground electrode 7 is resin-sealed with a conductive cured resin 42. This enables the ground electrode 7 and the conductive cured resin 42 to be electrically connected. Therefore, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 42. The circuit component 46 produced by singulating the post-package substrate 45 has a structure in which the semiconductor chip 3 is surrounded by the conductive cured resin 42 and electromagnetically shielded.
According to the present embodiment, both the conductive resin material (sheet-like resin 37) and the insulating resin material (granular resin 38) are supplied to one molding die (second molding die 20) to perform resin molding. Accordingly, the part 7a of the ground electrode 7 and the semiconductor chip 3 are resin-sealed with the insulating cured resin 43, and the remaining part 7b of the ground electrode 7 is resin-sealed with the conductive cured resin 42. The ground electrode 7 and the conductive cured resin 42 can be electrically connected by primary resin molding. Therefore, the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin 42. Further, since the semiconductor chip 3 can be electromagnetically shielded by one-time resin molding using one molding die, the equipment cost can be suppressed, and the manufacturing cost of the circuit component 46 can be further reduced.
According to the present embodiment, the cured resin mixed portion 44 is formed between the conductive cured resin 42 and the insulating cured resin 43. By forming the cured resin mixture portion 44, a strong bonding force is obtained between the insulating cured resin 43 and the conductive cured resin 42. Therefore, the adhesion between the insulating cured resin 43 and the conductive cured resin 42 can be further improved.
[ embodiment 4]
(Structure of resin Molding apparatus)
A resin molding apparatus (manufacturing apparatus) according to embodiment 4 will be described with reference to fig. 10. A resin molding apparatus 47 shown in fig. 10 is a resin molding apparatus that employs a compression molding method used in embodiments 1 to 3.
The resin molding apparatus 47 includes a substrate supply and storage module 48, a first molding module 49, a second molding module 50, and a resin material supply module 51, which are components. The substrate supply and storage module 48, the first molding module 49, the second molding module 50, and the resin material supply module 51, which are components, are detachable from and replaceable with respect to other components.
The substrate supply and storage module 48 is provided with: a package front substrate supply unit 52 that supplies the package front substrate 1 (see fig. 1); a rear package substrate storage 53 that stores the rear package substrates 28, 34, and 45 (see fig. 4 (a), 6 (b), and 9 (a)); a substrate placing section 54 for transferring the front substrate 1 and the rear substrates 28, 34, 45; and a substrate carrying mechanism 55 for carrying the pre-package substrate 1 and the post-package substrates 28, 34, 45. The substrate placement unit 54 moves in the Y direction in the substrate supply and storage module 48. The substrate transport mechanism 55 moves in the X direction, the Y direction, and the Z direction in the substrate supply and storage module 48, the first molding module 49, and the second molding module 50. The predetermined position S1 is a position at which the substrate transport mechanism 55 is on standby in an inoperative state.
In the first molding module 49, a first molding die 11 (refer to fig. 2) that mainly realizes molding of the insulating cured resin is provided. The first molding die 11 includes an upper die 12 (see fig. 2) and a lower die 13 which is disposed to face the upper die 12 and is movable up and down. The first molding die 11 is provided with a mold clamping mechanism 56 (a circular portion indicated by a two-dot chain line) for clamping and opening the upper die 12 and the lower die 13. A cavity 14 is provided in the lower mold 13, and an insulating resin material 16 (see fig. 2 (a)) is supplied to the cavity 14.
In the second molding module 50, a second molding die 20 (refer to fig. 3) that mainly realizes molding of the conductive cured resin is provided. The second molding die 20 includes an upper die 21 (see fig. 3) and a lower die 22 which is disposed to face the upper die 21 and is capable of being lifted. The second molding die 20 is provided with a clamping mechanism 57 (a circular portion indicated by a two-dot chain line) for clamping and opening the upper die 21 and the lower die 22. The cavity 23 is provided in the lower mold 22, and the conductive resin materials 26, 32, and 37 (see fig. 3 (b), 5 (b), and 7 (b)) and the insulating resin material 38 (see fig. 7 (c)) are supplied to the cavity 23. In perspective, the mold cavity 23 contains the mold cavity 14.
The resin material supply module 51 is provided with: a material conveying mechanism 58 that supplies the resin material or the mold release film cut into thin rectangular shapes to the cavity; and a material transfer unit 59 that transfers the material to the material transport mechanism 58. Further, the resin material supply module 51 is provided with: a granular resin supply mechanism 60 for supplying granular resin; a granular resin feeding mechanism 61 for feeding the granular resin into the granular resin supply mechanism 60; a sheet-like resin supply mechanism 62 for supplying a sheet-like resin; a liquid resin ejection mechanism 63 for supplying liquid resin; and a release film supply mechanism 64 for supplying a thin and rectangular release film.
In the resin material supply module 51, the material transfer portion 59 moves in the X direction and the Y direction. The material conveying mechanism 58 moves in the X direction, the Y direction, and the Z direction in the resin material supply module 51, the first molding module 49, and the second molding module 50. The material transfer unit 59 transfers the granular resin supply mechanism 60, the liquid resin supply mechanism 63, the sheet-like resin, and the thin and long mold release film to the material conveying mechanism 58. The material conveying mechanism 58 conveys the granular resin supply mechanism 60, the liquid resin ejection mechanism 63, the sheet-like resin, and the thin rectangular release film to the first molding module 49 or the second molding module 50. The predetermined position R1 is a position at which the material conveying mechanism 58 is on standby in an inoperative state.
The substrate supply and storage module 48 is provided with a control unit CTL. The control unit CTL controls conveyance of the pre-package substrate 1 and the post-package substrates 28, 34, and 45, selection and conveyance of resin materials, heating of the molding die, mold clamping and mold opening of the molding die, and the like. In other words, the control section CTL performs control of operations of the substrate supply and storage module 48, the first molding module 49, the second molding module 50, and the resin material supply module 51. The control unit CTL may be provided in the first molding module 49 or the second molding module 50, in the resin material supply module 51, or outside each module. The control unit CTL may be configured by a plurality of control units, at least a part of which is separated according to an operation to be controlled.
The operation of the resin molding device 47 will be described in detail in embodiments 1 to 3, and therefore, the step of resin molding the pre-package substrate 1 will not be described here.
(Effect)
The resin molding device 47 as an apparatus for manufacturing a circuit component according to the present embodiment includes: a first molding module 49 having a first molding die 11; a second molding die 50 having a second molding die 20; a substrate supply module 48 configured to supply a pre-package substrate 1, the pre-package substrate 1 including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module 51 for supplying an insulating resin material and a conductive resin material. In the first molding die 11, the insulating resin material is cured to mold the insulating cured resin, and at least a part of the ground electrode and the electronic component are covered with the insulating cured resin; forming a conductive cured resin at least covering the insulating cured resin by curing the conductive resin material in the second forming die 20, thereby producing a packaged substrate 28; on the rear package substrate 28, at least a part of the ground electrode and the electronic component are covered with an insulating cured resin, and the insulating cured resin is covered with a conductive cured resin; the first molding module 49 and the second molding module 50 are detachable from each other; at least one of the first molding module 49 and the second molding module 50 and at least one of the substrate supply module 48 and the resin material supply module 51 are detachable from each other; the conductive cured resin is connected to the ground electrode, and has an electromagnetic shielding function.
According to this configuration, in the resin molding device 47, the package front substrate 1 is resin-molded with the insulating cured resin using the first molding die 11, and the package front substrate 1 is resin-molded with the conductive cured resin using the second molding die 20. The conductive cured resin and the ground electrode are electrically connected by resin molding twice using the resin molding device 47. Accordingly, the semiconductor chip can be electromagnetically shielded. Therefore, the equipment cost can be suppressed, and the manufacturing cost of the circuit component can be reduced.
According to the present embodiment, the resin material supply module 51 is provided with: a granular resin supply mechanism 60 for supplying granular resin having insulation properties; a sheet-shaped resin supply mechanism 62 for supplying a sheet-shaped resin having conductivity; and a liquid resin ejection mechanism 63 for supplying a liquid resin having conductivity. Therefore, by using the resin molding apparatus 47, the insulating cured resin and the conductive cured resin can be molded by various manufacturing methods as shown in embodiments 1 to 3. In this way, the part 7a of the ground electrode 7 and the semiconductor chip 3 can be resin-encapsulated with the insulating cured resin, and the remaining part 7b of the ground electrode 7 can be resin-encapsulated with the conductive cured resin.
According to the present embodiment, in the resin molding device 47, the part 7a of the ground electrode 7 and the semiconductor chip 3 mounted on the package front substrate 1 can be resin-encapsulated with the insulating cured resin, and the remaining part 7b of the ground electrode 7 can be resin-encapsulated with the conductive cured resin. Accordingly, the conductive cured resin and the ground electrode 7 are electrically connected, and the semiconductor chip 3 can be electromagnetically shielded by the conductive cured resin. Therefore, the semiconductor chip 3 can be electromagnetically shielded only by using the resin molding device 47. The circuit members 30, 35, 46 of the shield structure can be manufactured without using a device other than the resin molding device. Therefore, the manufacturing cost of the circuit components 30, 35, 46 can be reduced while suppressing the equipment cost.
In the present embodiment, in order to cope with various manufacturing methods as shown in embodiments 1 to 3, the resin material supply module 51 is provided with: a granular resin supply mechanism 60 for supplying granular resin having insulation properties; a sheet-shaped resin supply mechanism 62 for supplying a sheet-shaped resin having conductivity; and a liquid resin ejection mechanism 63 for supplying a liquid resin having conductivity. The apparatus configuration capable of supplying the granular resin, the sheet-like resin, and the liquid resin as the resin material to the cavity is shown, but not limited thereto. Any device configuration may be used as long as it can supply at least the insulating resin material and the conductive resin material. Therefore, the structure of the resin material supply module 51 can be further simplified.
For example, in the manufacturing method of embodiment 1, the liquid resin ejection mechanism 63 for supplying the liquid resin having conductivity may be omitted. In the manufacturing method of embodiment 2, the sheet-like resin supply mechanism 62 for supplying the sheet-like resin having conductivity may be omitted. In the manufacturing method of embodiment 3, the liquid resin ejection mechanism 63 and the molding module 49 for supplying the liquid resin having conductivity may be omitted. This can further reduce the equipment cost. Therefore, the manufacturing cost of the circuit components 30, 35, 46 can be further reduced.
In the sheet-like resin supply mechanism 62, depending on the manufacturing method, a flexible sheet-like resin 26 adhered to a mold release film or a sheet-like resin 37 preliminarily molded in accordance with the shape of the cavity may be prepared.
The release film supply module 51 is provided with a release film supply mechanism 64 for supplying a thin and long release film, but the release film supply mechanism is not limited thereto. For example, a release film supply mechanism that supplies a long release film may be provided in the molding die 11 of the first molding module 49 and the molding die 20 of the second molding module 50.
In the resin molding apparatus 47, if the manufacturing method is limited to one, an apparatus configuration corresponding thereto may be provided. By configuring the apparatus as described above, the facility cost can be further reduced.
The substrate supply storage module 48 and the resin material supply module 51 may be integrated into a material supply product storage module. The material supply product housing module is detachable from and replaceable with at least one of the first and second molding modules 49, 50 (e.g., the first molding module 49). This corresponds to the case where the first molding module 49 is attached to and detached from both the substrate supply and storage module and the resin material supply module.
[ embodiment 5]
A manufacturing apparatus according to embodiment 5 will be described with reference to fig. 11. The manufacturing apparatus 65 shown in fig. 11 is a manufacturing apparatus in which a cutting module 66 is further added to the resin molding apparatus 47 shown in embodiment 4. The configuration and operation other than the cutting module 66 are the same as those of the resin molding apparatus 47 shown in embodiment 4, and therefore, the description thereof is omitted.
As shown in fig. 11, in the manufacturing apparatus 65, for example, a cutting module 66 is provided between the second molding module 50 and the resin material supply module 51. The cutting module 66 is detachable from and replaceable with other components.
The cutting module 66 is provided with a cutting table 67 used in a process of cutting the packaged substrate, for example. The cutting table 67 is movable in the Y direction by a moving mechanism 68, and rotatable in the θ direction by a rotating mechanism 69. The packaged substrate is placed on the cutting table 67 by the substrate conveyance mechanism 55.
The cutting module 66 is provided with two mandrels 70 and 71 for cutting the resin-encapsulated substrate, for example. The two spindles 70, 71 are provided with rotary blades 72, 73, respectively. The rotary blades 72, 73 are rotary blades having the same thickness. The sealed substrate is cut along the cutting line by the two mandrels 70 and 71 and singulated.
According to the present embodiment, a cutting module 66 is further additionally provided to the manufacturing apparatus 65. Accordingly, the post-package substrate subjected to the resin package can be cut into individual pieces by the same apparatus. Therefore, the step of transferring the packaged substrate to a separate cutting device or the like can be omitted, and the manufacturing cost of the circuit component can be further reduced.
In the present embodiment, the description has been given of the case where the rotary blades 72 and 73 of the two spindles 70 and 71 have the same thickness. The thickness of the rotary blades 72 and 73 may be different from each other. For example, the thickness of the rotary blade 72 may be made thick, and the thickness of the rotary blade 73 may be made thin. By utilizing the thickness of the rotary blades 72 and 73, the mandrels 70 and 71 can be used for different purposes.
In this case, the packaged substrate is cut using a mandrel 70 having a rotating blade 72 with a thick thickness. The thick rotary blade 72 is a rotary blade for cutting the substrate after the package at the cutting line. On the other hand, by using the mandrel 71 having the thin rotary blade 73, for example, a narrow groove can be formed in the insulating cured resin sealed with resin. The rotating edge 73 having a small thickness is a rotating edge for forming the groove. By filling the groove formed by cutting with the conductive cured resin, the shielded circuit member can be manufactured.
In addition, a laser machining device may be added to the cutting module 66. With this laser processing apparatus, it is also possible to form a narrow groove in the insulating cured resin encapsulated with the resin. In this case, the rotary blades 72 and 73 of the two mandrels 70 and 71 may be made thick, and both the mandrels 70 and 71 may be used as a mandrel for cutting the substrate after sealing to singulate the substrate.
[ embodiment 6]
Various circuit components manufactured by the embodiment of the present invention will be described with reference to fig. 12. These circuit components are module-structured circuit components in which a plurality of electronic components (including semiconductor chips before resin encapsulation) are electromagnetically shielded by a conductive cured resin.
As shown in fig. 12 (a), the circuit component 74 is a circuit component in which two electronic components 75 and one electronic component 76 (all in a state of a semiconductor chip) are electromagnetically shielded by a conductive cured resin.
The circuit component 74 includes a substrate 77, and two electronic components 75 and one electronic component 76 mounted on the substrate 77. The two electronic components 75 are connected to the substrate electrode 79 or the ground electrode 80 by bonding wires 78, respectively. The electronic component 76 is connected to the substrate electrode 79 or the ground electrode 80 through the bump 81.
A part of the ground electrode 80, the two electronic components 75, and the one electronic component 76 are resin-sealed with an insulating cured resin 82. The remaining portion of the ground electrode 80 is resin-encapsulated with a conductive cured resin 83. Accordingly, the ground electrode 80 and the conductive cured resin 83 are electrically connected. Therefore, the circuit component 74 in which the two electronic components 75 and the electronic component 76 are modularized is electromagnetically shielded by the conductive cured resin 83.
As shown in fig. 12 (b), the circuit component 84 is a circuit component in which an electronic component 85, an electronic component 86, and an electronic component 87 (all electronic components encapsulated with resin) are electromagnetically shielded by a conductive cured resin.
The circuit component 84 includes a substrate 88 and electronic components 85, 86, 87 mounted on the substrate 88. The electronic components 85, 86, 87 are connected to the substrate electrode 89 or the ground electrode 90 through the bumps 81, respectively.
A part of the ground electrode 90 and the electronic components 85, 86, 87 are resin-sealed by an insulating cured resin 91. The remaining portion of the ground electrode 90 is resin-encapsulated with a conductive cured resin 92. Accordingly, the ground electrode 90 and the conductive cured resin 92 are electrically connected. Therefore, the circuit component 84 formed by modularizing the electronic components 85, 86, 87 is electromagnetically shielded by the conductive cured resin 92.
As shown in fig. 12 (c), the circuit component 93 is a circuit component in which the electronic components 75 and 76 (in the state of a semiconductor chip) are electromagnetically shielded by the conductive cured resin, and the electronic component 94 (in the state of a semiconductor chip) is not electromagnetically shielded.
The circuit component 93 includes a substrate 95 and electronic components 75, 76, and 94 mounted on the substrate 95. The electronic components 75, 94 are connected to the substrate electrode 96 or the ground electrode 97 by bonding wires 78, respectively. The electronic component 76 is connected to the substrate electrode 96 or the ground electrode 97 by bumps (convex electrodes) 81 using flip chip bonding.
A part of the ground electrode 97, the electronic components 75, 76, and 94, and the substrate electrode 96 are resin-sealed with an insulating cured resin 98. The remaining portion of the ground electrode 97 is resin-encapsulated with a conductive cured resin 99. A cured resin mixture portion 100 is formed between the insulating cured resin 98 and the conductive cured resin 99. Accordingly, the ground electrode 97 and the conductive cured resin 99 are electrically connected. Therefore, the circuit component 93 is a circuit component in which the electronic components 75 and 76 are electromagnetically shielded by the conductive cured resin 99, and the electronic component 94 is not electromagnetically shielded. Thus, a circuit component that electromagnetically shields only a specific electronic component can be manufactured.
According to the present embodiment, a resin molding apparatus is used to resin-mold a plurality of electronic components with an insulating cured resin and a conductive cured resin. Accordingly, the ground electrode surrounding the plurality of electronic components can be electrically connected to the conductive cured resin. Therefore, a circuit component having a module structure in which a plurality of electronic components are electromagnetically shielded by the conductive cured resin can be manufactured. In addition, the manufacturing cost of the circuit component can be reduced.
In each embodiment, a resin molding apparatus using a compression molding method is used to produce a packaged substrate, and the packaged substrate is singulated to produce a circuit component. Not limited to this, a resin molding apparatus using a transfer molding method or an injection molding method may be used. Even when these apparatuses are used, the same effects as those of the embodiments can be achieved. In the case of using these apparatuses, in the resin molding apparatus, it is preferable to separate the cured resin remaining in the circuit part as a product from the cured resin (unnecessary resin) not remaining in the circuit part (gate cutting (ゲートカット), gate cutting (ゲートブレーク)).
In each embodiment, a case where a release film is supplied to a cavity provided in a lower mold is shown. Without being limited thereto, the circuit member can be manufactured without supplying the mold release film to the cavity.
In various embodiments, the mold cavity is shown disposed in a lower mold. Not limited to this, the same effect can be achieved also in the case where the cavity is provided in the upper mold. In the case where the cavity is provided in the upper mold, the package front substrate may be placed in the lower mold, and the resin material that is liquid at room temperature may be supplied onto the package front substrate. When mounting an electronic component on a substrate by flip-chip bonding, a solid resin or a resin material that is pasty at room temperature may be used in addition to a resin material that is liquid at room temperature.
In each embodiment, a method for manufacturing a circuit component including one or more semiconductor chips (or an electronic component encapsulated with a resin) is described. The object of the resin molding may be a chip of an active element such as an IC chip, a transistor chip, or an LED chip, or may be a chip set in which a chip of an active element and a chip of a passive element such as a resistor, a capacitor, or an inductor are mixed. Further, in the object of resin molding, a sensor, an oscillator, an actuator, and the like may also be included.
In each embodiment, a part of the ground electrode and the semiconductor chip are covered with an insulating cured resin, and the remaining part of the ground electrode and the conductive cured resin are electrically connected. Thus, the circuit member is electromagnetically shielded by the conductive cured resin. Further, since the entire surface of the circuit member is covered with the conductive cured resin, the electromagnetic shielding effect and the heat dissipation effect can be improved.
A structure in which the ground electrode and the conductive cured resin are not electrically connected may also be employed. In this case, the conductive cured resin has a heat dissipation function without having an electromagnetic shielding function.
As described above, the method for manufacturing a circuit member according to the above embodiment is a method for manufacturing a circuit member including an electronic circuit and having an electromagnetic shielding function, and includes: preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; a first molding step of molding an insulating cured resin on the first surface side of the substrate using a first molding die; and a second molding step of molding the conductive cured resin on the first surface side of the substrate using a second molding die, subsequent to the first molding step, to produce a packaged substrate. In the first molding step, a part of the ground electrode and the electronic component are covered with an insulating cured resin, and the remaining part of the ground electrode is exposed from the insulating cured resin to form an exposed ground electrode; in the second molding step, the insulating cured resin and the exposed ground electrode are covered with the conductive cured resin, and the exposed ground electrode and the conductive cured resin are electrically connected.
According to this manufacturing method, a part of the ground electrode and the electronic component can be covered with the insulating cured resin, and the remaining part of the ground electrode and the conductive cured resin can be electrically connected. Therefore, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured. In addition, the manufacturing cost of the circuit component can be reduced.
Further, in the method for manufacturing a circuit component according to the above-described embodiment, the first molding die and the second molding die are included in the same manufacturing apparatus.
According to this production method, the insulating cured resin and the conductive cured resin can be molded using the same production apparatus. Therefore, the manufacturing cost of the circuit component can be reduced.
The method for manufacturing a circuit member according to the above embodiment is a method for manufacturing a circuit member including an electronic circuit and having an electromagnetic shielding function, and includes: preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; a first molding step of molding an insulating cured resin on the first surface side of the substrate using a first molding die so as to cover the electronic component, a part of the ground electrode, and the remaining part of the ground electrode with the insulating cured resin; a step of forming an exposed ground electrode by removing the insulating cured resin covering the remaining portion of the ground electrode by using a removing means, and exposing the remaining portion of the ground electrode; and a second molding step of molding the conductive cured resin on the first surface side of the substrate using a second molding die to produce a packaged substrate. In the second molding step, the insulating cured resin and the exposed ground electrode are covered with the conductive cured resin, and the exposed ground electrode and the conductive cured resin are electrically connected. The first molding die, the removing mechanism, and the second molding die are included in the same manufacturing apparatus.
According to this manufacturing method, the remaining portion of the ground electrode can be exposed by the removing means to electrically connect the remaining portion of the ground electrode and the conductive cured resin. Therefore, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured.
Further, in the method for manufacturing a circuit component according to the above-described embodiment, the first molding step includes the steps of:
(1) a step of clamping the first molding die;
(2) supplying an insulating flowable resin to a cavity of a first mold from the outside of the cavity of the first mold after clamping, the insulating flowable resin being sequentially passed through a flow path and an opening of the first mold;
(3) a step of curing the insulating fluidized resin supplied to the cavity to thereby realize molding of the insulating cured resin;
(4) and opening the first molding die.
According to this production method, resin molding of the insulating cured resin can be achieved by transfer molding or injection molding.
Further, in the method for manufacturing a circuit component according to the above-described embodiment, the first molding step includes the steps of:
(1) supplying an insulating resin material which is solid, pasty, or liquid at normal temperature to a cavity of a first molding die after opening the die;
(2) a step of immersing at least a part of the ground electrode and the electronic component in an insulating fluid resin formed of an insulating resin material in the cavity by clamping the first molding die;
(3) a step of curing the insulating fluidized resin in the cavity to thereby realize molding of the insulating cured resin;
(4) and opening the first molding die.
According to this production method, resin molding of the insulating cured resin can be achieved by compression molding.
The method for manufacturing a circuit member according to the above-described embodiment is a method for manufacturing a circuit member having an electronic circuit and an electromagnetic shielding function, using a mold having a first mold and a second mold disposed to face the first mold, the method including: preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; a step of supplying a conductive resin material that is solid, paste, or liquid at normal temperature to a cavity provided in a first mold; disposing the substrate before the package in a molding die such that the first surface of the substrate faces the cavity; a step of supplying an insulating resin material that is solid, paste, or liquid at normal temperature to a cavity to which a conductive resin material has been supplied; a step of immersing a part of the ground electrode and the electronic component in an insulating fluid resin made of an insulating resin material and immersing the remaining part of the ground electrode in a conductive fluid resin made of a conductive resin material in a cavity by clamping a molding die; a step of producing a packaged substrate by curing the insulating fluidized resin in the cavity to mold the insulating cured resin on the first surface side of the substrate and curing the conductive fluidized resin to mold the conductive cured resin on the first surface side of the substrate; and opening the molding die. In the step of manufacturing the substrate after the package, the remaining portion of the ground electrode is electrically connected to the conductive cured resin.
According to this manufacturing method, by primary resin molding, a part of the ground electrode and the electronic component can be covered with the insulating cured resin, and the remaining part of the ground electrode and the conductive cured resin can be electrically connected. Therefore, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured. In addition, the manufacturing cost of the circuit component can be further reduced.
Further, in the method of manufacturing a circuit component according to the above-described embodiment, the substrate has a plurality of regions partitioned by the dummy lines, and the electronic component mounted on the first surface of the substrate and the ground electrode provided around the electronic component are provided in each of the plurality of regions, and the method further includes: and a step of cutting the substrate after the package along the virtual line to produce a plurality of circuit components corresponding to each of the plurality of regions.
According to this manufacturing method, the post-package substrate that has been resin-packaged is cut along the virtual line, thereby manufacturing the circuit component. Therefore, the manufacturing cost of the circuit component can be further reduced.
Further, in the method for manufacturing a circuit component according to the above-described embodiment, the dummy line is formed of any one of:
(1) interdigitated line segments extending across the substrate;
(2) interdigitated curves extending across the substrate;
(3) a line segment or a curve extending over the entire substrate, and a broken line included in each region;
(4) a line segment or curve extending over the entire substrate, and a curve contained in each region.
According to this manufacturing method, circuit components having various shapes can be manufactured.
The apparatus for manufacturing a circuit member according to the above embodiment includes: a first molding module having a first molding die; a second molding module having a second molding die; a substrate supply module that supplies a package front substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module for supplying the insulating resin material and the conductive resin material. Forming an insulating cured resin by curing an insulating resin material in a first forming die, and covering at least a part of the ground electrode and the electronic component with the insulating cured resin; forming a conductive cured resin at least covering the insulating cured resin by curing the conductive resin material in a second forming mold, thereby producing a substrate after encapsulation; on the rear substrate, at least a part of the ground electrode and the electronic component are covered with an insulating cured resin, and the insulating cured resin is covered with a conductive cured resin; the first molding module and the second molding module can be assembled and disassembled with each other; at least one of the first molding module and the second molding module and at least one of the substrate supply module and the resin material supply module are detachable from each other; the conductive cured resin is connected to the ground electrode, and has an electromagnetic shielding function.
With this configuration, the insulating cured resin and the conductive cured resin can be molded by one manufacturing apparatus. The conductive cured resin and the ground electrode can be electrically connected to electromagnetically shield the electronic component. Therefore, the equipment cost can be suppressed, and the manufacturing cost of the circuit component can be reduced.
Further, the circuit component manufacturing apparatus according to the above embodiment is configured as follows: the first molding block and the second molding block are formed by any one of compression molding, transfer molding, and injection molding.
With this structure, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured by using various molding methods. In addition, the manufacturing cost of the circuit component can be reduced.
Further, the circuit component manufacturing apparatus according to the above embodiment is configured as follows: the first molding die has a first cavity, and the second molding die has a second cavity, and the shape of the second cavity includes the shape of the first cavity when viewed in a three-dimensional manner.
According to this configuration, the insulating cured resin is molded in the first cavity, and the conductive cured resin covering the insulating cured resin is molded in the second cavity. Therefore, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured.
Further, the circuit component manufacturing apparatus according to the above embodiment is configured as follows: further comprises a cutting module having a cutting mechanism; at least one of the first molding module, the second molding module, the substrate supply module, and the resin material supply module and the cutting module are detachably attached to each other; the cutting mechanism performs at least one of the following operations:
(1) an operation of cutting the insulating cured resin to expose a remaining portion excluding a part of the ground electrode provided on the first surface of the substrate out of the insulating cured resin;
(2) and cutting off the packaged substrates together.
According to this structure, the cutting module having the cutting mechanism is further added to the manufacturing apparatus. The insulating cured resin can be cut by using a cutting mechanism so as to expose the ground electrode or to cut the substrate after the package.
The apparatus for manufacturing a circuit member according to the above embodiment includes: a first molding module having a first molding die; a substrate supply module that supplies a package front substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module for supplying the insulating resin material and the conductive resin material. At least one of the substrate supply module and the resin material supply module and the first molding module are detachably attachable to each other; a first molding die for molding an insulating cured resin and a conductive cured resin covering the insulating cured resin together to produce a packaged substrate; on the rear substrate, at least a part of the ground electrode and the electronic component are covered with an insulating cured resin, and the insulating cured resin is covered with a conductive cured resin; the conductive cured resin is connected to the ground electrode, and has an electromagnetic shielding function.
With this configuration, the insulating cured resin and the conductive cured resin can be molded together using only one molding die. The conductive cured resin and the ground electrode can be electrically connected to electromagnetically shield the electronic component. Therefore, the equipment cost can be further suppressed, and the manufacturing cost of the circuit component can be further reduced.
Further, the circuit component manufacturing apparatus according to the above embodiment is configured as follows: further comprises a cutting module having a cutting mechanism; at least one of the first molding module, the substrate supply module, and the resin material supply module and the cutting module are detachable from each other; the cutting mechanism cuts the packaged substrates together.
According to this structure, the cutting module having the cutting mechanism is further added to the manufacturing apparatus. The packaged substrate can be cut by using a cutting mechanism.
The circuit component of the above embodiment is configured as follows, and includes: an electronic component mounted on the substrate; a ground electrode provided on the substrate; an insulating cured resin covering a part of the ground electrode and the electronic component; a conductive cured resin which covers the remaining portion of the ground electrode and the insulating cured resin, is electrically connected to the remaining portion of the ground electrode, and has an electromagnetic shielding function; and a boundary portion formed at a boundary between the insulating cured resin and the conductive cured resin.
According to this configuration, a part of the ground electrode and the electronic component can be covered with the insulating cured resin, and the remaining part of the ground electrode and the conductive cured resin can be electrically connected. Therefore, a circuit member electromagnetically shielded by the conductive cured resin can be manufactured.
Further, the boundary portion of the circuit component of the above embodiment is an interface formed at the boundary between the insulating cured resin and the conductive cured resin.
According to this structure, an interface is present at the boundary between the insulating cured resin and the conductive cured resin.
Further, the boundary portion of the circuit component of the above embodiment is a cured resin mixed portion formed at the boundary between the insulating cured resin and the conductive cured resin.
According to this structure, since the cured resin mixed portion is interposed, a strong bonding force is obtained between the insulating cured resin and the conductive cured resin. Therefore, the adhesion between the insulating cured resin and the conductive cured resin can be further improved.
Further, the circuit component of the above embodiment further includes: a side having a processing trace.
According to this configuration, the circuit component can be manufactured by cutting the post-package substrate that has been resin-packaged.
The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selectively employed as needed without departing from the scope of the present invention.

Claims (6)

1. A method for manufacturing a circuit member having an electronic circuit and an electromagnetic shielding function, the method comprising:
preparing a pre-package substrate including at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode, the ground electrode being a frame-shaped wiring pattern surrounding a periphery of the electronic component;
a first molding step of molding an insulating cured resin on the first surface side of the substrate using a first molding die having a plurality of first cavities corresponding to the circuit components; and
a second molding step of molding a conductive cured resin on the first surface side of the substrate using a second molding die having a plurality of second cavities each containing one of the plurality of first cavities when viewed in a three-dimensional manner, to produce a packaged substrate, subsequent to the first molding step,
in the first molding step, a mold release film is brought into contact with an outer peripheral portion of the ground electrode in a clamped state to mold the ground electrode, an inner peripheral portion of the ground electrode and the electronic component are covered with the insulating cured resin, and the outer peripheral portion of the ground electrode is exposed from the insulating cured resin to form an exposed ground electrode,
in the second molding step, a compression molding method is used to cover the insulating cured resin and the exposed ground electrode with the conductive cured resin in direct contact, thereby electrically connecting the exposed ground electrode and the conductive cured resin.
2. The method for manufacturing a circuit member according to claim 1,
the first molding die and the second molding die provided in the same manufacturing apparatus are used as the first molding die and the second molding die.
3. The method for manufacturing a circuit member according to claim 1,
the first molding step includes the steps of:
(1) a step of clamping the first molding die;
(2) supplying an insulating flowable resin to a cavity of the first molding die from outside the cavity, the cavity being closed, sequentially through a flow path and an opening of the first molding die;
(3) a step of curing the insulating fluidized resin supplied to the cavity to thereby mold the insulating cured resin;
(4) and opening the first molding die.
4. The method for manufacturing a circuit member according to claim 1,
the first molding step includes the steps of:
(1) supplying an insulating resin material which is solid, pasty, or liquid at normal temperature to a cavity of the first molding die after opening the die;
(2) a step of immersing at least a part of the ground electrode and the electronic component in an insulating fluid resin generated from the insulating resin material in the cavity by clamping the first molding die;
(3) a step of curing the insulating fluidized resin in the cavity to thereby realize molding of the insulating cured resin;
(4) and opening the first molding die.
5. The method for manufacturing a circuit member according to claim 1,
the substrate has a plurality of regions partitioned by a dummy line,
in the plurality of regions, the electronic component mounted on the first surface of the substrate and the ground electrode provided around the electronic component are provided, respectively,
also, the method of manufacturing a circuit member further includes: and a step of cutting the post-package substrate along the virtual line to produce a plurality of circuit components corresponding to each of the plurality of regions.
6. The method for manufacturing a circuit member according to claim 5,
the virtual line is composed of any one of the following lines:
(1) interdigitated line segments extending across the substrate;
(2) interdigitated curves extending across the substrate;
(3) a line segment or a curve extending over the entire substrate, and a broken line included in each of the regions;
(4) a line segment or curve extending across the substrate, and a curve contained in each of the regions.
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