TWI641092B - Circuit component, method for manufacturing circuit component, and device for manufacturing circuit component - Google Patents

Abstract

The present invention relates to a circuit component, a method for manufacturing a circuit component, and a device for manufacturing a circuit component. A method for manufacturing a circuit component having an electromagnetic shielding function includes the steps of preparing a pre-package substrate (1) having a substrate (2), an electronic component (3) mounted on the substrate, and a ground electrode (7) provided around the electronic component. ; A first molding step, which uses a first mold to mold the insulating curing resin (18) on the substrate; and a second molding step, which uses a second mold to mold the conductive curing resin (27), on the substrate To make a packaged substrate (28). In the first molding step, a part of the ground electrode (7a) and the electronic component are covered with an insulating curable resin, and the remaining part of the ground electrode (7b) is exposed from the insulating curable resin to form an exposed ground electrode (7b). In the second molding step, the insulating curing resin is covered with the conductive curing resin and the ground electrode is exposed, thereby electrically connecting the exposed ground electrode and the conductive curing resin.

Description

Circuit component, method for manufacturing circuit component, and device for manufacturing circuit component

The present invention relates to a circuit component having an electromagnetic shielding function, a method for manufacturing a circuit component, and a device for manufacturing a circuit component.

Among electronic components used in wireless communication devices such as mobile phones and smartphones, there is widely used a circuit element surrounding the circuit element in order to prevent leakage of electromagnetic waves generated from circuit elements constituting the electronic component or to isolate electromagnetic waves from the outside. A technique for performing electromagnetic masking (electromagnetic masking, hereinafter referred to as “masking” as appropriate). For example, a technique is disclosed in which a groove reaching a substrate is formed in an insulating resin applied to a plurality of circuit elements, and an electronic component is masked by filling the groove with a conductive resin (see Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2010-238717

However, the electronic component disclosed in Patent Document 1 has the following problems. As shown in FIG. 5 of Patent Document 1, in order to manufacture an electronic component, circuit elements 2A and 2B are mounted on a substrate 1A, and an insulating resin 13A is applied. Next, at a position where a plurality of electronic components are divided, a half-cut groove 5 is formed using a cutter. The half cut groove 5 is formed to a depth from the surface of the insulating resin 13A to the inner layer electrode of the substrate 1A. Next, the half-groove 5 is filled with the conductive resin 13B by placing the conductive resin 13B on the top surface of the insulating resin 13A and pressing it to flow. As described above, in order to manufacture a masked electronic component, in addition to the pressure flow step of applying a resin and applying pressure to flow, a groove forming step and a device for forming the half-cut groove 5 are required. Therefore, there is a problem that equipment costs increase and manufacturing costs of electronic components increase.

The present invention is intended to solve the above-mentioned problems, and an object thereof is to provide a circuit component capable of manufacturing a circuit component having an electromagnetic shielding function with a conductive curing resin and capable of reducing manufacturing costs, a method for manufacturing a circuit component, and a device for manufacturing a circuit component .

In order to solve the above problems, the method for manufacturing a circuit component according to the present invention is a circuit component manufacturing method for manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function. The method for manufacturing a circuit component includes the steps of preparing a substrate before packaging, The pre-package substrate includes at least a substrate having a first surface, electronic components mounted on the first surface of the substrate, and a ground electrode provided around the electronic components. In a first molding step, a first molding die is used to On the first side of the substrate, an insulating curing resin is molded; and in the second molding step, followed by the first molding step, a second molding die is used to realize the molding of the conductive curing resin on the first side of the substrate to produce a package. In the first molding step, a part of the ground electrode and electronic components are covered with an insulating curing resin in the first molding step, and the remaining portion of the ground electrode is exposed from the insulating curing resin to form an exposed ground electrode. In the step, the insulating curing resin is covered with the conductive curing resin and exposed. The ground electrode so as to expose the ground electrode and electrically connected to the conductive cured resin.

In addition, in the method of manufacturing a circuit component according to the present invention, the “remaining portion of the ground electrode” means other portions of the ground electrode that do not include a portion of the portions. The interpretation of this expression is also applicable to other inventions and embodiments in the present invention.

In order to solve the above problems, the method for manufacturing a circuit component according to the present invention is a circuit component manufacturing method for manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function. The method for manufacturing a circuit component includes the steps of preparing a substrate before packaging, The pre-package substrate includes at least a substrate having a first surface, electronic components mounted on the first surface of the substrate, and a ground provided around the electronic components. Electrode; the first molding step, using a first molding mold, to realize the molding of an insulating curing resin on the first side of the substrate, so as to cover the electronic component, a part of the ground electrode, and the remainder of the ground electrode with the insulating curing resin The first molding step, using a removal mechanism to remove the insulating curing resin covering the remaining portion of the ground electrode, thereby exposing the remaining portion of the ground electrode to form an exposed ground electrode; and the second molding step, using the first Two molding dies are used to form the conductive cured resin on the first side of the substrate to produce a packaged substrate. In the second molding step, the conductive cured resin is used to cover the insulating cured resin and expose the ground electrode. The exposed ground electrode and the conductive cured resin were electrically connected, and as the first molding die, the removal mechanism, and the second molding die, the first molding die, the removal mechanism, and the second molding die provided in the same manufacturing apparatus were used.

In order to solve the above-mentioned problems, the method for manufacturing a circuit component according to the present invention uses a molding mold having a first mold and a second mold disposed opposite to the first mold to manufacture an electronic circuit and an electromagnetic shielding function. A circuit component manufacturing method for a circuit component. The method for manufacturing a circuit component includes a step of preparing a substrate before packaging. The substrate before packaging includes at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and an electronic component. A surrounding ground electrode; a step of supplying a solid, pasty, or liquid conductive resin material to a cavity provided in a first mold at a normal temperature; a method in which a first surface of a substrate is opposed to the cavity A step of disposing a substrate before packaging in a molding die; a step of supplying a solid, paste or liquid insulating resin material at a normal temperature to a cavity to which a conductive resin material has been supplied; Mold, so that a part of the ground electrode and the electronic component are immersed in an insulating current generated from an insulating resin material in the cavity Resins, and the remaining portion of the ground electrode is immersed in the step of the conductive resin flow generated by the conductive resin material; in the mold cavity by flow of the insulating resin is cured so that the first surface of the substrate, Forming the insulating cured resin on the side, curing the conductive flowing resin and forming the conductive curing resin on the first side of the substrate, and manufacturing the packaged substrate according to this step; and opening the molding mold In the step of manufacturing the packaged substrate, the remaining portion of the ground electrode is electrically connected to the conductive curing resin.

In order to solve the above problems, a device for manufacturing a circuit component according to the present invention includes: a first molding module having a first molding mold; a second molding module having a second molding mold; a substrate supply module before being packaged A substrate, a substrate before packaging, at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module that supplies an insulating resin material and a conductive material. In the first molding mold, the insulating resin material is cured to realize the molding of the insulating curing resin. At least a part of the ground electrode and the electronic component are covered with the insulating curing resin in the second molding mold. In order to cure the conductive resin material to realize the molding of the conductive curing resin that covers at least the insulating curing resin, a package substrate is produced based on the package substrate. At least a part of the ground electrode and the electronic component are covered with the insulating curing resin on the package substrate. Covering, the insulating curing resin is covered with the conductive curing resin, The module and the second molding module can be detached from each other. At least one of the first molding module and the second molding module and at least one of the substrate supply module and the resin material supply module can be detached from each other. The conductive curing resin is connected to the ground electrode and has an electromagnetic shielding function.

In order to solve the above problems, a device for manufacturing a circuit component according to the present invention includes: a first molding module having a first molding mold; a substrate supply module for supplying a substrate before packaging, and the substrate before packaging includes at least a first surface A substrate, an electronic component mounted on a first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module that supplies an insulating resin material and a conductive resin material, and a substrate supply module and a resin material supply At least one of the modules and the first A molding module can be attached to and detached from each other. The first molding mold simultaneously molds the insulating curing resin and the conductive curing resin covering the insulating curing resin to form a packaged substrate. On the packaged substrate, at least the ground electrode Some parts and electronic components are covered with an insulating curing resin, the insulating curing resin is covered with a conductive curing resin, the conductive curing resin is connected to a ground electrode, and has an electromagnetic shielding function.

In order to solve the above problems, a circuit component according to the present invention includes: an electronic component mounted on a substrate; a ground electrode provided on the substrate; an insulating curing resin covering a part of the ground electrode and the electronic component; a conductive curing resin; The remaining portion of the ground electrode and the insulating curing resin are electrically connected to the remaining portion of the ground electrode and have an electromagnetic shielding function; and a boundary portion is formed at the boundary between the insulating curing resin and the conductive curing resin.

According to the present invention, a circuit component having an electromagnetic shielding function can be manufactured by a conductive curable resin covered with an insulating curable resin and electrically connected to a ground electrode.

1‧‧‧ package front substrate

10‧‧‧ area

11‧‧‧The first molding mold

12‧‧‧Up mold

13‧‧‧mould

14‧‧‧ cavity

15, 25, 31, 36‧‧‧ release film

16, 38‧‧‧ granular resin

17‧‧‧ insulating fluid resin

18, 43, 82, 91, 98‧‧‧ insulating curing resin

19‧‧‧ Intermediate

2, 77, 88, 95‧‧‧ substrate

20‧‧‧Second molding mold

21‧‧‧Up mold

22‧‧‧ Lower mold

23‧‧‧cavity

24‧‧‧Configuration area

26, 37‧‧‧ Sheet resin

27, 33, 42, 83, 92, 99‧‧‧ conductive curing resin

28, 34, 45‧‧‧ after packaging substrate

29‧‧‧rotating blade

3‧‧‧ semiconductor wafer

30, 35, 46, 74, 84, 93‧‧‧ circuit components

32‧‧‧Liquid resin

39‧‧‧ conductive flow resin

4, 79, 89, 96‧‧‧ substrate electrodes

40‧‧‧ insulating fluid resin

41‧‧‧ fluid resin mixed layer

44, 100‧‧‧cured resin mixing department

47‧‧‧resin molding device

48‧‧‧ substrate supply storage module

49‧‧‧The first molding module

5‧‧‧ pad electrode

50‧‧‧Second molding module

51‧‧‧Resin material supply module

52‧‧‧Pre-package substrate supply unit

53‧‧‧Packaging board storage section

54‧‧‧ Substrate placement section

55‧‧‧ substrate transport mechanism

56, 57‧‧‧ clamping mechanism

58‧‧‧Material delivery agency

59‧‧‧Material Delivery Department

6, 78‧‧‧ welding wire

60‧‧‧ granular resin supply mechanism

61‧‧‧Particle resin input mechanism

62‧‧‧Flake resin supply mechanism

63‧‧‧Liquid resin ejection mechanism

64‧‧‧Release film supply mechanism

65‧‧‧Manufacturing equipment

66‧‧‧Cutting Module

67‧‧‧cutting table

68‧‧‧ Mobile agency

69‧‧‧ rotating mechanism

7, 80, 90, 97‧‧‧ ground electrode

70, 71‧‧‧ mandrel

72, 73‧‧‧rotating blade

75, 76, 85, 86, 87, 94‧‧‧ electronic components

7a‧‧‧Some parts

7b‧‧‧Remaining parts

8‧‧‧solder resist

81‧‧‧ bump

9‧‧‧ cut line

FIG. 1 is a schematic view showing a pre-package substrate used in a circuit component according to the present embodiment, (a) is a plan view, and (b) is a cross-sectional view taken along the line A-A of (a).

(A) to (c) of FIG. 2 show the use of an insulating resin material (insulating resin material) in the first embodiment to resin-mold the package front substrate shown in FIG. 1 to realize an intermediate. A schematic cross-sectional view of the molding steps.

(A) to (c) of FIG. 3 show the use of a conductive resin material (conductive resin material) in Embodiment 1 to resin-mold the intermediate body shown in FIG. 2 to realize a substrate after encapsulation. A schematic cross-sectional view of the molding steps.

(A) to (c) of FIG. 4 are schematic cross-sectional views illustrating a step of singulating the packaged substrate shown in FIG. 3 to produce a circuit component in the first embodiment.

(A)-(c) of FIG. 5 are schematic cross-sectional views which show the process of resin-molding the intermediate body shown in FIG. 2 using a conductive resin material in Embodiment 2.

(A)-(c) of FIG. 6 is a schematic cross-sectional view which shows the process of singulating a resin-molded package substrate in a second embodiment to manufacture a circuit component.

(A)-(c) of FIG. 7 shows a step of supplying the pre-package substrate shown in FIG. 1 to the upper mold and supplying the conductive resin material and the insulating resin material to the lower mold in the third embodiment. A schematic cross-sectional view.

(A)-(c) of FIG. 8 is a schematic cross-sectional view showing a step of curing the conductive resin material and the insulating resin material shown in FIG. 7 to form a substrate after encapsulation in the third embodiment.

(A)-(c) of FIG. 9 is a schematic sectional view which shows the process of singulating the resin-molded package substrate in the third embodiment to manufacture a circuit component.

FIG. 10 is a plan view showing an outline of a resin molding apparatus in Embodiment 4. FIG.

FIG. 11 is a plan view showing an outline of a manufacturing apparatus in a fifth embodiment.

(A) to (c) of FIG. 12 are schematic cross-sectional views showing various circuit components manufactured by resin-molding a plurality of electronic components in the sixth embodiment.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Regarding any one of the drawings in the present invention, for ease of understanding, they are appropriately omitted or exaggerated and are schematically depicted. For the same structural elements, the same reference numerals are attached, and the description is appropriately omitted. In addition, in the present invention, the "electronic component" includes a so-called semiconductor wafer which is not packaged with a resin or the like, and a semiconductor wafer in which at least a part of the semiconductor wafer is packaged with a resin or the like. In addition, The “circuit component” includes a circuit component having a structure in which at least one electronic component is covered with a conductive curable resin.

[Embodiment 1]

(Structure of the substrate before packaging)

The structure of the pre-package substrate used in the circuit component according to the first embodiment of the present invention will be described with reference to FIG. 1.

As shown in FIG. 1 (a), the pre-package substrate 1 is a substrate in which the substrate is virtually divided into a plurality of regions in a grid pattern, and electronic components are mounted in each region. This embodiment shows a package front substrate on which a plurality of semiconductor wafers as electronic components are mounted. The pre-package substrate 1 includes a substrate 2 and a plurality of semiconductor wafers 3 mounted on the substrate 2. As the substrate 2, for example, a glass epoxy laminate, a printed substrate, a ceramic substrate, or the like is used. As the semiconductor wafer 3, for example, a microprocessor, a high-frequency device, a power device, and the like are mounted. In FIG. 1, the semiconductor wafer 3 is mounted on the substrate 2 with the main surface of the semiconductor wafer 3 on which the circuit is formed facing upward.

A plurality of substrate electrodes 4 are provided on the surface of the substrate 2. Although not shown, the substrate electrode 4 is connected to external electrodes provided on the back surface of the substrate 2 via wirings provided on the surface of the substrate 2 and via holes provided inside the substrate 2, respectively. As the substrate electrode 4, the wiring, the via wiring, and the external electrode, for example, copper (Cu) or aluminum (Al) having a small resistivity is preferably used. As shown in FIG. 1 (b), each of the plurality of substrate electrodes 4 is electrically connected to a pad electrode 5 formed on the semiconductor wafer 3. The substrate electrode 4 and the pad electrode 5 are connected by a bonding wire 6 made of a gold wire or a copper wire, respectively.

A specific electrode among the plurality of substrate electrodes 4 constitutes a ground electrode (ground electrode) 7 for setting the potential of the semiconductor wafer 3 to a ground potential. As shown in FIG. 1A, the ground electrode 7 includes a frame-shaped wiring pattern that surrounds the periphery of the semiconductor wafer 3 and the plurality of substrate electrodes 4. In this embodiment In each region where the semiconductor wafer 3 is mounted, the portion including the ground electrode 7 directly connected to the bonding wire 6 and the frame-shaped wiring pattern formed on the outermost periphery are referred to as the ground electrode 7.

On the surface of the substrate 2, in addition to the surfaces of the substrate electrode 4 and the ground electrode 7, a solder resist 8 is provided as an insulating resin film.

On the substrate 1 before packaging, the substrate 2 is divided into a plurality of grid-like regions, and the cutting lines 9 for cutting each region are along the X direction and the Y direction (horizontal in FIG. 1 (a)). And dotted lines shown in the vertical direction). Each region 10 surrounded by a plurality of cutting lines 9 corresponds to a region that becomes a circuit component masked by a conductive curable resin.

(Resin molding step and singulation step)

Referring to FIGS. 2 to 4, for example, a resin molding apparatus using a compression molding method is used to resin-mold the pre-package substrate 1 shown in FIG. 1 to produce a package substrate, and the package substrate is singulated to The steps for manufacturing circuit components will be described. In addition, as described below, the resin molding apparatus (refer to FIG. 10) used in this embodiment is provided with a first molding die for molding an insulating curing resin and a second molding for molding a conductive curing resin. Device for manufacturing molds.

Referring to FIG. 2, the structure of a first molding die for molding an insulating cured resin in a resin molding apparatus will be described. As shown in FIG. 2 (a), the first molding die 11 includes an upper die 12 and a lower die 13 which is disposed to face the upper die 12. In the lower mold 13, a cavity 14 is provided, and an insulating resin material is supplied to the cavity 14.

A procedure for resin-molding the pre-package substrate 1 using an insulating resin material will be described with reference to FIG. 2. First, in the first molding die 11, the upper die 12 and the lower die are set in advance. The state after the mold 13 is opened. Next, using the substrate transfer mechanism (refer to FIG. 10), the pre-package substrate 1 shown in FIG. 1 is transferred to a predetermined position below the upper mold 12.

Next, the pre-package substrate 1 is raised using a substrate transport mechanism, and the pre-package substrate 1 is fixed to the profile of the upper mold 12 by suction or clamping (not shown). The pre-package substrate 1 is fixed to the profile of the upper mold 12 such that the surface on which the semiconductor wafer 3 is mounted faces downward.

Next, the release film 15 is supplied to the lower mold 13. A suction mechanism (not shown) provided in the lower mold 13 is used to adsorb the release film 15 along the profile of the lower mold 13 in the cavity 14. As the release film 15, any of a release film cut into a thin rectangular shape or a long release film can be used. In addition, depending on the resin material, there are cases where the release film 15 is not used. FIG. 1 shows an example in which the release film 15 cut into a thin rectangular shape is supplied.

Next, an insulating resin material is supplied to the cavity 14 provided in the lower mold 13 using a material transport mechanism (refer to FIG. 10). As the insulating resin material, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be used. As the resin material, solid resins such as powder, granules, and flakes at room temperature, or resins (liquid resins) at liquid temperature (regardless of the viscosity. The same applies hereinafter) can be used. In this embodiment, an example in which a granular resin (granular resin 16) is supplied as an insulating resin material is shown. Specifically, the particulate resin 16 is supplied onto the release film 15 adsorbed on the cavity 14.

Here, although the example which conveyed the release film 15 and the granular resin 16 to the lower mold 13 in a different process was demonstrated, it is not limited to this. For example, a material storage frame is placed on the release film 15 and the granular resin 16 is put into the material storage frame. In this state, the release film 15 and the material storage frame are transported (simultaneously) to the lower mold 13 using the material transport mechanism. Accordingly, the release film 15 and the particulate resin 16 can be supplied to the cavity 14 together.

Next, the granular resin 16 is heated by a heater (not shown) provided in the lower mold 13. By heating, the particulate resin 16 is melted to produce an insulating fluid resin (insulating fluid resin 17). When a liquid resin is supplied to the cavity 14 as an insulating resin material, the liquid resin itself corresponds to the insulating flow resin 17.

Next, as shown in FIG. 2 (b), the lower mold 13 is raised using a mold clamping mechanism (refer to FIG. 10) to close the upper mold 12 and the lower mold 13. The mold clamping is performed so that the semiconductor wafer 3 mounted on the package front substrate 1 is immersed in the insulating flowing resin 17 filled in the cavity 14. After the upper mold 12 and the lower mold 13 are closed, the upper mold 12 and the lower mold 13 are used to apply pressure to the insulating flowing resin 17 in the cavity 14.

Next, using a heater (not shown) provided in the lower mold 13, the insulating flowing resin 17 is heated for the time required to cure the insulating flowing resin 17 having insulation. The insulating flowing resin 17 is cured, thereby molding an insulating cured resin (the insulating cured resin 18). A portion 7a of the ground electrode 7 and the semiconductor wafer 3 mounted on the package front substrate 1 are resin-encapsulated with an insulating curing resin 18 molded in accordance with the shape of the cavity 14. A part of the ground electrode 7 and the semiconductor wafer 3 with respect to the front substrate 1 are resin-sealed with an insulating curing resin 18. Through the steps so far, the intermediate body 19 is molded. The hardness of the cured resin may be any hardness that is sufficient to protect the semiconductor wafer 3 and the like covered with the cured resin from external forces, the external environment, and the like.

In a state where the upper mold 12 and the lower mold 13 are closed, the outer peripheral portion of the cavity 14 overlaps the ground electrode 7 of the package front substrate 1 in a plan view. Therefore, a part of the ground electrode 7 (the side closer to the semiconductor wafer 3) is immersed in the insulating flowing resin 17. On the other hand, the remaining portion 7b of the ground electrode 7 (the side far from the semiconductor wafer 3) is not impregnated into the insulating flowing resin 17, Instead, it is clamped by the profile of the lower mold 13. According to this, when the pre-package substrate 1 is resin-molded with an insulating resin material (granular resin 16), a part of the ground electrode 7a and the semiconductor wafer 3 are resin-molded. On the other hand, the remaining portion 7 b of the ground electrode 7 is not resin-molded and is exposed from the surface of the ground electrode 7.

Next, as shown in FIG. 2 (c), the upper mold 12 and the lower mold 13 are opened using a mold clamping mechanism. An intermediate body 19 is fixed to the surface of the upper mold 12. The remaining portion 7 b of the ground electrode 7 is in a state exposed from the surface of the ground electrode 7 without being resin-sealed. Next, the intermediate body 19 is taken out from the first molding die 11 using a substrate transport mechanism.

In the intermediate body 19, it is required that no cured resin is formed in a region (at least a region including the remaining portion 7 b of the ground electrode 7) that is desired to be exposed from the insulating cured resin 18. To make this requirement possible, the following method can be used. The first method is to use the above-mentioned release film 15. The second method is to stick a resin film on the front substrate 1 of the package, and the resin film has an opening corresponding to a range where the insulating cured resin 18 is formed. After the resin film is formed after the insulating cured resin 18 is formed, a region to which the resin film is adhered is exposed from the insulating cured resin 18. The third method is to remove a thin insulating curable resin formed in a region exposed from the insulating curable resin 18 by sand blasting, water jet processing, cleaning, or the like.

The structure of a second molding die for molding a conductive cured resin in a resin molding apparatus will be described with reference to FIG. 3. As shown in FIG. 3 (a), the second molding die 20 includes an upper die 21 and a lower die 22 that is disposed to face the upper die 21. The lower mold 22 is provided with a cavity 23 to which a conductive resin material is supplied. Around the cavity 23, there is provided an arrangement region 24 in which, for example, a sheet-like resin is disposed. The arrangement area 24 is provided so as to include the entire cavity 23 provided in the lower mold 22 in a plan view.

The expression "A contains B when viewed from the top" means "When A and B are overlapped when viewed in the direction in which the work is depicted as a top view, A contains B completely and exists outside the B on the entire periphery of B. Part of A. "

Seen three-dimensionally, the cavity 23 provided in the lower mold 22 of the second molding mold 20 includes a cavity 14 (refer to FIG. 2) provided in the lower mold 13 of the first molding mold 11. In other words, the volume (volume) of the cavity 23 is set to be larger than the volume (volume) of the cavity 14 in a state where the profile of the lower mold 22 and the profile of the lower mold 13 are overlapped. The size of the cavity 23 is set to be larger than the size of the cavity 14 in the X, Y, and Z directions.

3 and 4, the steps of resin-molding the intermediate body 19 with a conductive resin material to produce a packaged substrate, and singulating the packaged substrate to manufacture circuit components will be described. As the insulating resin material, for example, a thermosetting resin such as an epoxy resin or a silicone resin can be used. As the resin material, solid resins such as powder, granules, and flakes at room temperature, or resins that are liquid at room temperature can be used.

First, as shown in FIG. 3 (a), in the second molding die 20, the upper die 21 and the lower die 22 are opened. Next, using a substrate transfer mechanism (refer to FIG. 10), the intermediate body 19 taken out from the first molding die 11 (refer to FIG. 2) is transferred to a predetermined position below the upper mold 21. Next, the intermediate body 19 is raised using a substrate transfer mechanism, and the intermediate body 19 is fixed to the profile of the upper mold 21 by suction or clamping.

Next, the release film 25 and the conductive resin material are supplied to the lower mold 22. In this embodiment, an example in which the release film 25 and the conductive resin material are supplied to the mold cavity 23 is shown. For example, it is shown that a sheet-like resin (sheet-like resin 26) is adhered to the release film 25 as a conductive resin material. An example in which the sheet-like resin 26 is supplied to the cavity 23 in the above state. The sheet-like resin 26 used in this embodiment is a sheet-like resin having flexibility. Therefore, the sheet-like resin 26 is stretched by being heated.

As shown in FIG. 3 (a), a release film 25 having a sheet-shaped resin 26 adhered thereto is supplied to the lower mold 22 using a material transport mechanism (see FIG. 10). The sheet-like resin 26 is disposed on the arrangement region 24 with the release film 25 interposed therebetween and the arrangement region 24 provided in the lower mold 22. Here, an example is shown in which a release film cut into a thin rectangular shape is used as the release film 25 to which the sheet-shaped resin 26 is adhered. Not limited to this, a sheet-like resin may be adhered to a long release film.

The conductive sheet-like resin 26 is made of, for example, a conductive resin such as silver (Ag), copper (Cu), aluminum (Al), or nickel (Ni), and carbon particles added to a thermosetting resin such as epoxy resin or silicone resin. Sex particles. With respect to the sheet-like resin 26, the conductivity and the degree of warpage can be controlled by the type and amount of the conductive particles to be added. The sheet-like resin 26 containing conductive particles has a thermal conductivity larger than that of the particulate resin 16 having insulating properties. This point is the same in the following embodiments.

Next, as shown in FIG. 3 (b), an adsorption mechanism (not shown) provided in the lower mold 22 is used to align the mold cavity 23 and the placement area 24 with the mold surface of the lower mold 22. The release film 25 is adsorbed. In this case, since the sheet-like resin 26 having flexibility is adhered, the sheet-like resin 26 is also arranged along the mold surface of the lower mold 22 in the cavity 23 and the arrangement area 24 together with the release film 25. . Since the release film 25 and the sheet-like resin 26 are stretched by radiant heat from a heater provided in the lower mold 22, they can be arranged along the molding surface of the lower mold 22 in the cavity 23 and the arrangement area 24. In this manner, the sheet-like resin 26 having conductivity is supplied to the cavity 23.

Next, as shown in FIG. 3 (c), the lower mold 22 is raised using a mold clamping mechanism (refer to FIG. 10), and the upper mold 21 and the lower mold 22 are clamped. Seen three-dimensionally, set in the second The cavity 23 in the lower mold 22 of the mold 20 includes a cavity 14 (refer to FIG. 2) provided in the lower mold 13 of the first molding mold 11. Therefore, the cavity 23 contains the insulating curable resin 18 molded on the intermediate body 19. By performing the mold clamping, the insulating curable resin 18 molded on the intermediate body 19 is seamlessly (substantially tightly) inserted into the space surrounded by the mold cavity 23 and, strictly speaking, the sheet-like resin 26. In this state, the remaining portion 7b of the exposed surface of the ground electrode 7 is in contact with the sheet-like resin 26 having conductivity.

Next, using a heater (not shown) provided in the lower mold 22, the sheet-like resin 26 is heated and melted. Furthermore, the flowable resin is heated for the time required to cure the melted flowable resin (conductive flowable resin). By curing the flowable resin, molding of a conductive cured resin (conductive cured resin 27) is achieved. The conductive curable resin 27 is fixed to the insulating curable resin 18 by being cured. The remaining portion 7 b of the ground electrode 7 and the conductive curing resin 27 are electrically connected. Therefore, the ground electrode 7 and the conductive curing resin 27 can be electrically conducted. Accordingly, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 27. Through the steps so far, the package substrate 28 is molded. An interface is formed at a boundary portion between the insulating curable resin 18 and the conductive curable resin 27.

Next, as shown in FIG. 4 (a), the upper mold 21 and the lower mold 22 are opened using a mold clamping mechanism. The packaged substrate 28 obtained by resin-molding the intermediate body 19 is fixed to the surface of the upper mold 21. Next, using the substrate transfer mechanism, the packaged substrate 28 is taken out from the second molding die 20.

Next, as shown in FIG. 4 (b), the package substrate 28 is cut (completely cut) using, for example, a cutting device having a rotary blade 29. The rotary blade 29 is used to cut the packaged substrate 28 along a cutting line 9 (see (a) in FIG. 1) provided on the packaged substrate 28.

As shown in FIG. 4 (c), each of the circuit components 30 is manufactured by cutting the packaged substrate 28 into individual pieces. The conductive curable resin 27 and the ground electrode 7 are electrically connected. Therefore, the circuit component 30 has a structure in which the semiconductor wafer 3 is surrounded by the conductive curing resin 27 and is electromagnetically shielded. An interface is formed at a boundary portion between the insulating curable resin 18 and the conductive curable resin 27.

(Effect)

The method for manufacturing a circuit component according to this embodiment is a circuit component manufacturing method for manufacturing a circuit component 30 having an electronic circuit and an electromagnetic shielding function, and includes a step of preparing a package front substrate 1 that includes at least a One-sided substrate 2, a semiconductor wafer 3 as an electronic component mounted on the first surface of the substrate 2, and a ground electrode 7 provided around the semiconductor wafer 3; the first molding step uses a first molding die 11 on the substrate 2 is formed on the first side of the insulating curing resin 18; and a second molding step, followed by the first molding step, using the second molding die 20 to achieve conductive curing on the first side of the substrate 2 The resin 27 is molded to produce a packaged substrate 28. In the first molding step, a portion 7a of the ground electrode 7 and the semiconductor wafer 3 are covered with the insulating curing resin 18, and the remaining portion 7b of the ground electrode 7 is exposed from the insulating curing resin 18 to form an exposed ground electrode; In the second molding step, the conductive curable resin 27 covers the insulating curable resin 18 and exposes the ground electrode, thereby electrically connecting the exposed ground electrode and the conductive curable resin 27.

According to this manufacturing method, a part of the ground electrode 7 and the semiconductor wafer 3 mounted on the main surface of the substrate 2 are resin-encapsulated with the insulating curing resin 18. The remaining portion 7 b of the ground electrode 7 is resin-sealed with a conductive curing resin 27. Accordingly, the conductive cured resin 27 and the ground electrode 7 are electrically connected. Therefore, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 27. In addition, the manufacturing cost of the circuit component 30 can be reduced.

The circuit component of this embodiment has a structure including a semiconductor wafer 3 as an electronic component mounted on a substrate, a ground electrode 7 provided on the substrate 2, and an insulating curing resin 18 covering a part of the ground electrode 7 and the semiconductor. Wafer 3; a conductive curing resin 27 covering the remaining portion 7b of the ground electrode 7 and an insulating curing resin 18 and electrically connected to the remaining portion 7b of the ground electrode 7 and having an electromagnetic shielding function; The boundary between the cured resin 18 and the conductive cured resin 27 is formed.

According to this structure, a part of the ground electrode 7 and the semiconductor wafer 3 mounted on the substrate 2 can be covered with the insulating curing resin 18, and the remaining portion 7 b of the ground electrode 7 and the conductive curing resin 27 can be electrically connected. Therefore, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 27.

According to this embodiment, first, an insulating resin material (granular resin 16) is used to resin-mold the pre-package substrate 1. According to this, a part of the ground electrode 7 and the semiconductor wafer 3 mounted on the front substrate 1 are resin-sealed with the insulating curing resin 18 to realize the molding of the intermediate body 19. The remaining part 7b of the ground electrode 7 is not resin-sealed, and is in a state where the surface is exposed. Next, the intermediate body 19 is resin-molded using a conductive resin material (sheet resin 26). Accordingly, the remaining portion 7 b of the ground electrode 7 of the intermediate body 19 is resin-sealed with the conductive curing resin 27 to realize the molding of the substrate 28 after the packaging. The conductive cured resin 27 and the ground electrode 7 are electrically connected. Therefore, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 27. The circuit component 30 manufactured by singulating the packaged substrate 28 has a structure in which the semiconductor wafer 3 is surrounded by the conductive cured resin 27 and is electromagnetically shielded.

In addition, the thermal conductivity of the conductive cured resin 27 containing conductive particles is larger than the thermal conductivity of the insulating cured resin 18. Therefore, the conductive curing resin 27 has a heat dissipation function Yes, the circuit component 30 having excellent heat dissipation properties is manufactured. This point is the same in the following embodiments.

According to the present embodiment, the resin molding apparatus is provided with the first molding die 11 for molding the insulating curable resin 18 and the second molding die 20 for molding the conductive curable resin 27. Using the first molding die 11, a part of the ground electrode 7 a and the semiconductor wafer 3 mounted on the pre-package substrate 1 are resin-encapsulated with an insulating curing resin 18. Using the second molding die 20, the remaining portion 7 b of the ground electrode 7 is resin-encapsulated with the conductive curing resin 27. Accordingly, the conductive cured resin 27 and the ground electrode 7 can be electrically connected, and the semiconductor wafer 3 can be electromagnetically shielded by the conductive cured resin 27. Using a resin molding apparatus, the circuit component 30 having a mask structure can be manufactured by two resin moldings. The circuit component 30 having a mask structure can be manufactured without using a device other than a resin molding device. Therefore, it is possible to reduce the equipment cost and reduce the manufacturing cost of the circuit component 30.

In this embodiment, resin molding of both the insulating curable resin 18 and the conductive curable resin 27 is achieved by a compression molding method. Not limited to this, resin molding of the insulating curable resin 18 can be achieved by a transfer molding method or injection molding method, and resin molding of the conductive curable resin 27 can be achieved by a compression molding method. Alternatively, resin molding of both the insulating curable resin 18 and the conductive curable resin 27 may be performed by a transfer molding method or an injection molding method. In addition, the resin molding of the insulating curable resin 18 and the conductive curable resin 27 may be performed by separate devices.

In this embodiment, the cavity 14 and 23 corresponding to each area 10 (the area corresponding to the circuit component 30) surrounded by a plurality of cutting lines 9 are provided in the first molding die 11 and the second molding die. 20 (lower molds 13, 22). Not limited to this, a cavity including each region 10 may be provided in the first molding die 11 and the second molding die 20. In this case, in the circuit component 30 after the packaged substrate 28 is cut and singulated, a part of the conductive cured resin 27 is electrically connected to the connection. The ground electrode 7 enables electromagnetic shielding of the semiconductor wafer 3. A part of the above-mentioned conductive cured resin 27 corresponds to the left end portion and the right end portion in (b) of FIG. 4.

As a modification, the surface (the lower surface and the side surface shown in (c) of FIG. 2) of the insulating cured resin 18 may be a rough surface. By making the surface of the release film 15 (the surface in contact with the insulating flow resin 17) a rough surface, the surface of the insulating cured resin 18 can be made rough. This increases the bonding area of the insulating curable resin 18 and the conductive curable resin 27. Therefore, the adhesion between the insulating curable resin 43 and the conductive curable resin 42 can be improved.

As a main material constituting the insulating resin material and a main material constituting the conductive resin material, a thermosetting resin is used. As these main raw materials, a thermoplastic resin may be used instead of a thermosetting resin.

An embodiment in which the packaged substrate 28 corresponds to a plurality of circuit components 30 has been described. Not limited to this, a structure in which the packaged substrate 28 corresponds to one circuit component 30 may also be adopted. For example, a large-sized circuit component 30 for power control or the like corresponds to a circuit board having the above-mentioned structure. In addition, there may be a case where the post-package substrate 28 corresponding to the plurality of circuit components 30 becomes a transaction target. Therefore, the packaged substrate 28 may correspond to a circuit component as a product.

As the conductive resin material, a sheet-like resin 26 obtained by adding conductive particles to a thermosetting resin is used. Instead of conductive particles, conductive fibers (such as metal fibers and carbon fibers) and conductive foils (such as metal foils) can also be used. The modifications described above may be applied to other embodiments.

[Embodiment 2]

(Resin molding step and singulation step)

5 and 6, in Embodiment 2, the intermediate body 19 shown in Embodiment 1 (FIG. 2) is resin-molded to make a packaged substrate, and the packaged substrate is singulated to manufacture a circuit The steps of the components are explained. The difference from Embodiment 1 is that instead of supplying the release film and the resin material to the cavity 23 of the second molding die 20 at the same time, different steps are used to supply the release film and the resin material. With regard to the other steps, the configuration of the first molding die 11 and the second molding die 20 is the same as that of the first embodiment, and therefore description thereof is omitted.

First, as shown in (a) of FIG. 5, in the second molding die 20, the intermediate body 19 is fixed to the profile of the upper die 21.

Next, the release film 31 is supplied to the lower mold 22. As the release film 31, any one of a thin and long rectangular release film and a long release film can be used. Next, using a suction mechanism (not shown) provided in the lower mold 22, the release film 31 is adsorbed so as to follow the mold surface of the lower mold 22 in the cavity 23 and the arrangement region 24.

Next, as shown in FIG. 5 (b), for example, a material conveying mechanism (refer to FIG. 10) is used to supply a liquid resin (liquid resin 32) as a conductive resin material to the cavity 23. The liquid resin 32 is supplied to the cavity 23 using, for example, a liquid resin ejection mechanism (dispenser) or the like. In this case, a low-viscosity (flowable) liquid resin is preferably used.

Next, as shown in FIG. 5 (c), the upper mold 21 and the lower mold 22 are clamped using a mold clamping mechanism (refer to FIG. 10). As in the first embodiment, three-dimensionally, the cavity 23 provided in the lower mold 22 of the second molding die 20 includes the cavity 14 provided in the lower mold 13 of the first molding die 11. Therefore, by clamping the second molding die 20, the liquid resin 32 is placed between the molding surface of the lower die 22 and the insulating curing resin 18 in the cavity 23, and the lower die in the arrangement area 24. 22's The surface flows between the profile and the intermediate body 19. Accordingly, the surface of the insulating curable resin 18 and the remaining portion 7 b of the ground electrode 7 are immersed in a liquid resin (conductive fluid resin) 32 having conductivity.

Next, as shown in FIG. 6 (a), a conductive flow resin (liquid resin 32) is heated using a heater (not shown) provided in the lower mold 22 to realize a conductive cured resin ( Molding of the conductive curable resin 33). The conductive curable resin 33 is fixed to the insulating curable resin 18 by being cured. The remaining portion 7b of the ground electrode 7 and the conductive cured resin 33 are electrically connected. Therefore, the ground electrode 7 and the conductive curing resin 33 can be electrically conducted. Accordingly, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curable resin 33. Through the steps so far, the post-package substrate 34 is molded.

Next, as shown in FIG. 6 (b), the upper mold 21 and the lower mold 22 are opened. Next, using the substrate transfer mechanism, the packaged substrate 34 is taken out from the second molding die 20.

Next, as shown in FIG. 6 (c), the packaged substrate 34 is cut using a cutting device having a rotary blade 29. Each of the circuit components 35 is manufactured by cutting the packaged substrate 34 along the cutting line 9 provided on the packaged substrate 34 to be singulated. The conductive curable resin 33 and the ground electrode 7 are electrically connected. Therefore, the circuit component 35 has a structure in which the semiconductor wafer 3 is surrounded by the conductive cured resin 33 and is electromagnetically shielded.

Since the circuit component 35 manufactured in the second embodiment can achieve the same effects as the circuit component 30 shown in the first embodiment, the description is omitted.

Further, in the present embodiment, the liquid resin 32 is supplied as a conductive resin material to the cavity 23 provided in the lower mold 22 of the second molding mold 20. Not limited to this, a sheet-like resin having conductivity after being pre-formed in accordance with the shape of the cavity 23 may be used. under these circumstances, After the release film 31 is adsorbed on the cavity 23, a sheet-shaped resin that has been preformed in accordance with the shape of the cavity 23 may be supplied.

[Embodiment 3]

(Resin molding step and singulation step)

Referring to FIGS. 7 to 9, in the third embodiment, the pre-package substrate 1 shown in the first embodiment (FIG. 1) is resin-molded to produce a package substrate, and the package substrate is singulated to manufacture The steps of the circuit components will be described. The difference from Embodiment 1 is that both the conductive resin material and the insulating resin material are supplied to one molding die (second molding die) to perform resin molding. Therefore, in the third embodiment, an example of resin-molding the pre-package substrate 1 using only the second molding die 20 shown in the first and second embodiments will be described.

First, as shown in (a) of FIG. 7, in the second molding die 20, the pre-package substrate 1 is fixed to the profile of the upper die 21.

Next, the release film 36 is supplied to the lower mold 22. Using the adsorption mechanism provided in the lower mold 22, the release film 36 is adsorbed so as to follow the profile of the lower mold 22 in the cavity 23 and the arrangement area 24.

Next, as shown in FIG. 7 (b), a sheet-like resin (sheet-like resin 37) is supplied to the cavity 23 as a conductive resin material using a material transport mechanism (refer to FIG. 10). The sheet-like resin 37 is a sheet-like resin that has been pre-formed in advance in accordance with the shape of the cavity 23. Therefore, the sheet-like resin 37 is arranged along the profile of the lower mold 22 in the cavity 23 and the arrangement area 24.

Next, as shown in FIG. 7 (c), a granular resin (granular resin 38) is supplied to the cavity 23 as an insulating resin material using a material transport mechanism (refer to FIG. 10). Specifically, the particulate resin 38 is supplied onto the sheet-like resin 37.

The sheet resin 37 and the particulate resin 38 preferably contain the same kind of resin material (for example, epoxy resin, silicone resin, etc.) as a main material. In addition, the main material included in the sheet resin 37 and the main material included in the particulate resin 38 preferably have the same characteristics (for example, the relationship between time and viscosity at a certain temperature, etc.). In the resin molding process, a fluid resin mixed layer (described later) formed by mixing a conductive resin and an insulating resin is formed. The fluid resin mixed layer is formed by thermally diffusing the molecules constituting the conductive resin and the molecules constituting the insulating resin.

Next, as shown in FIG. 8 (a), the sheet resin 37 and the particulate resin 38 are heated by a heater (not shown) provided in the lower mold 22. The sheet-like resin 37 is melted by heating to produce a conductive fluid resin (conductive fluid resin 39). Similarly, the particulate resin 38 is melted to produce an insulating fluid resin (insulating fluid resin 40). A fluid resin mixed layer 41 (a portion sandwiched by a broken line in the figure) is formed at a boundary portion between the conductive fluid resin 39 and the insulating fluid resin 40. The fluid resin mixed layer 41 is formed by thermally diffusing the molecules constituting the conductive resin and the insulating resin, and corresponds to an intermediate layer each containing an adjacent resin material.

Next, as shown in FIG. 8 (b), the upper mold 21 and the lower mold 22 are clamped using a mold clamping mechanism (refer to FIG. 10). Accordingly, a part of the ground electrode 7 and the semiconductor wafer 3 are immersed in the insulating flowing resin 40, and the remaining portion 7 b of the ground electrode 7 is immersed in the conductive flowing resin. In a boundary portion between the conductive flow resin 39 and the insulating flow resin 40, a state where the flow resin mixed layer 41 is maintained is maintained.

Next, as shown in FIG. 8 (c), the flowable resin is heated for the time required to cure each flowable resin to form a cured resin. The conductive flow resin 39 is heated to realize the molding of the conductive cured resin 42. The insulating flowing resin 40 is heated to realize the molding of the insulating cured resin 43. Heating the flowable resin mixed layer 41 to achieve a cured tree Molding of the fat mixing portion 44. Accordingly, a part of the ground electrode 7 a and the semiconductor wafer 3 are resin-sealed with the insulating curing resin 43. The remaining portion 7 b of the ground electrode 7 is resin-sealed with a conductive curing resin 42. A cured resin mixing portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42. The remaining portion 7 b of the ground electrode 7 and the conductive cured resin 42 are electrically connected. Therefore, the ground electrode 7 and the conductive cured resin 42 can be electrically conducted. Accordingly, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curable resin 42. Through the steps so far, the package substrate 45 is molded.

In this embodiment, a cured resin mixing portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42. The cured resin mixed portion 44 is a region where molecules constituting the insulating cured resin 43 and the conductive cured resin 42 are thermally diffused to each other and each molecule is bonded. Accordingly, a strong bonding force is obtained between the insulating curable resin 43 and the conductive curable resin 42. Therefore, the insulating curable resin 43 and the conductive curable resin 42 can be more firmly fixed.

Next, as shown in FIG. 9A, the upper mold 21 and the lower mold 22 are opened using a mold clamping mechanism. A post-package substrate 45 is fixed to the profile of the upper mold 21. Next, using the substrate transfer mechanism, the packaged substrate 45 is taken out of the second molding die 20.

Next, as shown in FIG. 9 (b), the post-package substrate 45 is cut using a cutting device having a rotary blade 29. The rotary blade 29 is used to cut the packaged substrate 45 along the cutting line 9 provided on the packaged substrate 45.

As shown in (c) of FIG. 9, each of the circuit components 46 is manufactured by cutting the packaged substrate 45 to be singulated. A cured resin mixing portion 44 is formed between the insulating cured resin 43 and the conductive cured resin 42, and the conductive cured resin 42 and the ground electrode 7 are electrically connected. Therefore, the circuit component 46 has a structure in which the semiconductor wafer 3 is surrounded by the conductive cured resin 42 and is electromagnetically shielded.

(Effect)

The method for manufacturing a circuit component according to this embodiment is a circuit component manufacturing method for manufacturing a circuit component 46 having an electronic circuit and an electromagnetic shielding function using a second molding mold 20 having a first mold The lower mold 22 and the upper mold 21 as a second mold disposed opposite to the lower mold 22, the manufacturing method includes a step of preparing a pre-packaged substrate 1 which includes at least a substrate 2 having a first surface. A semiconductor wafer 3 as an electronic component mounted on the first surface of the substrate 2 and a ground electrode 7 provided around the semiconductor wafer 3; and a conductive resin material (sheet, solid, paste or liquid) at room temperature A step of supplying the shaped resin 37) to the cavity 23 provided in the lower mold 22; a step of disposing the pre-package substrate 1 on the second molding mold 20 so that the first surface of the substrate 2 faces the cavity 23; A step of supplying a solid, pasty, or liquid insulating resin material (granular resin 38) at room temperature to a cavity 23 to which a conductive resin material (sheet resin 37) has been supplied; The mold 20 is closed, so that a part 7a of the ground electrode 7 and the semiconductor wafer 3 are immersed in an insulating flowing resin 40 made of an insulating resin material (granular resin 38) in the cavity 23 and grounded. A step of immersing the remaining portion 7b of the electrode 7 in a conductive flowing resin 39 made of a conductive resin material (sheet-like resin 37); in the cavity 23, the insulating flowing resin 40 is cured, so that the On the first side, the insulating curable resin 43 is molded, and the conductive fluid resin 39 is cured, so that the conductive curable resin 42 is molded on the first surface side of the substrate 2, and the packaged substrate is manufactured accordingly. 45; and a step of opening the second molding die 20. In the step of manufacturing the post-package substrate 45, the remaining portion 7 b of the ground electrode 7 and the conductive cured resin 42 are electrically connected.

According to this manufacturing method, a sheet-like resin 37 having conductivity and a particulate resin 38 having insulation properties are supplied to the cavity 23 provided in the second molding die 20 (lower die 22). The sheet resin 37 and the particulate resin 38 are simultaneously heated, so that a part of the ground electrode 7 and the semiconductor wafer 3 are resin-encapsulated with the insulating curing resin 43, and the conductive curing resin 42 is used to The remaining portion 7 b of the ground electrode 7 is resin-sealed. Accordingly, the conductive curable resin 42 and the ground electrode 7 can be electrically connected. By one-time resin molding, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 42. Therefore, the manufacturing cost of the circuit component 46 can be further reduced.

According to this embodiment, first, a conductive resin material (sheet-like resin 37) is supplied to the cavity 23. Next, an insulating resin material (granular resin 38) is supplied. The sheet-like resin 37 is melted to produce a conductive flowing resin 39. The particulate resin 38 is melted to produce an insulating flowing resin 40. The conductive flow resin 39 and the insulating flow resin 40 are cured, thereby forming the conductive curable resin 42 and the insulating curable resin 43. A part of the ground electrode 7 and the semiconductor wafer 3 are resin-sealed with the insulating curable resin 43, and the remaining part 7 b of the ground electrode 7 is resin-sealed with the conductive curable resin 42. Accordingly, the ground electrode 7 and the conductive cured resin 42 can be electrically connected. Therefore, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 42. The circuit component 46 manufactured by singulating the packaged substrate 45 has a structure in which the semiconductor wafer 3 is surrounded by the conductive curing resin 42 and is electromagnetically shielded.

According to the present embodiment, both the conductive resin material (sheet resin 37) and the insulating resin material (granular resin 38) are supplied to one molding die (second molding die 20) to perform resin molding. Accordingly, a part of the ground electrode 7 and the semiconductor wafer 3 are resin-sealed with the insulating curable resin 43, and the remaining part 7 b of the ground electrode 7 is resin-sealed with the conductive curable resin 42. The ground electrode 7 and the conductive cured resin 42 can be electrically connected by a single resin molding. Therefore, the semiconductor wafer 3 can be electromagnetically shielded by the conductive curing resin 42. In addition, since the semiconductor wafer 3 can be electromagnetically shielded by one resin molding using one molding die, the equipment cost can be suppressed, and the manufacturing cost of the circuit component 46 can be further reduced.

According to this embodiment, a cured resin mixing portion 44 is formed between the conductive cured resin 42 and the insulating cured resin 43. By forming the cured resin mixing portion 44, a strong bonding force is obtained between the insulating cured resin 43 and the conductive cured resin 42. Therefore, the adhesiveness between the insulating curable resin 43 and the conductive curable resin 42 can be further improved.

[Embodiment 4]

(Structure of resin molding device)

A resin molding apparatus (manufacturing apparatus) according to the fourth embodiment will be described with reference to FIG. 10. The resin molding apparatus 47 shown in FIG. 10 is a resin molding apparatus using a compression molding method used in the first to third embodiments.

The resin molding device 47 includes a substrate supply storage module 48, a first molding module 49, a second molding module 50, and a resin material supply module 51 as structural elements, respectively. The substrate supply storage module 48, the first molding module 49, the second molding module 50, and the resin material supply module 51 which are structural elements can be attached to and detached from each other and can be replaced.

The substrate supply and storage module 48 is provided with a pre-package substrate supply unit 52 to supply the pre-package substrate 1 (refer to FIG. 1), and a post-package substrate storage unit 53 to store the post-package substrates 28, 34, and 45 (refer to 4 (A), (b) of FIG. 6, (a) of FIG. 9); the substrate placing section 54 transfers the pre-packaged substrate 1 and the post-packaged substrates 28, 34, and 45; The front substrate 1 and the rear substrates 28, 34, and 45 are packaged. The substrate placement section 54 moves in the Y direction in the substrate supply storage module 48. The substrate transfer mechanism 55 moves in the X direction, the Y direction, and the Z direction within the substrate supply storage module 48, the first molding module 49, and the second molding module 50. The predetermined position S1 is a position where the substrate transport mechanism 55 is in a standby state in a non-operating state.

The first molding module 49 is provided with a first molding die 11 (refer to FIG. 2) that mainly performs molding of an insulating curing resin. The first molding die 11 includes an upper die 12 (refer to FIG. 2) and a lower die 13 which is disposed opposite to the upper die 12 and can be raised and lowered. The first molding die 11 is provided with a mold clamping mechanism 56 (a circular portion indicated by a two-dot chain line) for clamping and opening the upper mold 12 and the lower mold 13. The cavity 14 is provided in the lower mold 13, and an insulating resin material (granular resin 16) (refer to (a) in FIG. 2) is supplied to the cavity 14.

The second molding module 50 is provided with a second molding die 20 (refer to FIG. 3) that mainly performs molding of a conductive curing resin. The second molding die 20 includes an upper die 21 (refer to FIG. 3) and a lower die 22 which is disposed opposite to the upper die 21 and can be raised and lowered. The second molding die 20 is provided with a mold clamping mechanism 57 (a circular portion indicated by a two-dot chain line) for clamping and opening the upper mold 21 and the lower mold 22. The cavity 23 is provided in the lower mold 22, and a conductive resin material (a sheet resin 26, a liquid resin 32, and a sheet resin 37) (refer to FIG. 3 (b), FIG. 5 (b), and FIG. 7) (B)) and an insulating resin material (granular resin 38) (refer to (c) of FIG. 7) are supplied to the cavity 23. Viewed three-dimensionally, the cavity 23 contains a cavity 14.

The resin material supply module 51 is provided with a material conveying mechanism 58 that supplies a resin material or a release film cut into a thin rectangular shape to a mold cavity; and a material transfer unit 59 that transfers the material to the material transfer mechanism 58 . Further, the resin material supply module 51 is provided with a granular resin supply mechanism 60 that supplies granular resin; a granular resin input mechanism 61 that inputs the granular resin into the granular resin supply mechanism 60; and a sheet resin supply mechanism 62. The sheet resin is supplied; the liquid resin ejection mechanism 63 supplies the liquid resin; and the release film supply mechanism 64 supplies a thin rectangular release film.

In the resin material supply module 51, the material transfer portion 59 moves in the X and Y directions. The material conveying mechanism 58 is provided in the resin material supply module 51, the first molding module 49, and the second molding die. The group 50 moves in the X direction, the Y direction, and the Z direction. The material transfer unit 59 transfers the granular resin supply mechanism 60, the liquid resin ejection mechanism 63, the sheet resin, and the thin and rectangular release film to the material transfer mechanism 58. The material conveyance mechanism 58 conveys the granular resin supply mechanism 60, the liquid resin ejection mechanism 63, the sheet resin, and the thin and rectangular release film to the first molding module 49 or the second molding module 50. The predetermined position R1 is a position where the material transport mechanism 58 is in a standby state when it is not in operation.

A control unit CTL is provided in the substrate supply storage module 48. The control unit CTL controls the transportation of the pre-package substrate 1 and the post-package substrates 28, 34, 45, selection and transportation of resin materials, heating of the mold, and clamping and opening of the mold. In other words, the control unit CTL controls each operation of the substrate supply housing module 48, the first molding module 49, the second molding module 50, and the resin material supply module 51. The control unit CTL may be provided in the first forming module 49 and the second forming module 50, may be provided in the resin material supply module 51, and may be provided outside each module. The control unit CTL may be configured by a plurality of control units that are separated from each other by at least a part according to an operation as a control object.

Regarding the operation of the resin molding device 47, the steps of resin molding the pre-package substrate 1 have been described in detail in Embodiments 1 to 3, and therefore description thereof is omitted here.

(Effect)

The resin molding device 47 as the circuit component manufacturing apparatus of the present embodiment is configured as follows, including a first molding module 49 having a first molding die 11 and a second molding module 50 having a second molding die 20; The substrate supply and storage module 48 supplies a pre-package substrate 1, which includes at least a substrate having a first surface, electronic components mounted on the first surface of the substrate, and a ground electrode provided around the electronic components; The resin material supply module 51 supplies an insulating resin material and a conductive resin material. In the first molding die 11, the insulating resin material is cured, so that The insulation curing resin is molded, and at least a part of the ground electrode and the electronic component are covered with the insulation curing resin. In the second molding die 20, the conductive resin material is cured to achieve at least the conductivity of the insulation curing resin. Forming a cured resin substrate to produce a packaged substrate 28; on the packaged substrate 28, at least a part of the ground electrode and electronic components are covered with an insulating curing resin, and the insulating curing resin is covered with a conductive curing resin; first The molding module 49 and the second molding module 50 can be detached from each other; at least one of the first molding module 49 and the second molding module 50 and the substrate supply storage module 48 and the resin material supply module 51 At least one module can be attached to and detached from each other; a conductive curing resin is connected to the ground electrode and has an electromagnetic shielding function.

According to this configuration, in the resin molding apparatus 47, the first molding die 11 is used to resin-mold the pre-package substrate 1 with an insulating curing resin, and the second molding die 20 is used to mold the pre-package substrate with a conductive curing resin. 1 Perform resin molding. The resin molding device 47 is used to electrically connect the conductive cured resin and the ground electrode by two resin moldings. This makes it possible to electromagnetically shield the semiconductor wafer. Therefore, it is possible to reduce the equipment cost and reduce the manufacturing cost of circuit components.

According to this embodiment, each of the resin material supply modules 51 is provided with: a granular resin supply mechanism 60 that supplies granular resin having insulation properties; and a sheet resin supply mechanism 62 that supplies a sheet resin having conductivity; And the liquid resin discharge mechanism 63 supplies a liquid resin having conductivity. Therefore, using the resin molding apparatus 47, as shown in Embodiments 1 to 3, it is possible to realize the molding of the insulating curing resin and the conductive curing resin by various manufacturing methods. Accordingly, a part of the ground electrode 7 and the semiconductor wafer 3 can be resin-sealed with the insulating curable resin, and the remaining portion 7b of the ground electrode 7 can be resin-sealed with the conductive curable resin.

According to the present embodiment, in the resin molding apparatus 47, a part of the ground electrode 7a and the semiconductor wafer 3 mounted on the front package substrate 1 can be resin-bonded with an insulating curing resin. And the remaining portion 7b of the ground electrode 7 is resin-sealed with a conductive curing resin. According to this, the conductive cured resin and the ground electrode 7 can be electrically connected, and the semiconductor wafer 3 can be electromagnetically shielded by the conductive cured resin. Therefore, it is possible to electromagnetically shield the semiconductor wafer 3 using only the resin molding device 47. Without using a device other than the resin molding device, the circuit components 30, 35, and 46 of the mask structure can be manufactured. Therefore, it is possible to reduce the equipment cost and reduce the manufacturing cost of the circuit components 30, 35, and 46.

In this embodiment, in order to correspond to the various manufacturing methods described in Embodiments 1 to 3, the resin material supply module 51 is provided with a granular resin supply mechanism 60 for supplying granular particles having insulation properties. Resin; sheet resin supply mechanism 62 supplies sheet resin having conductivity; and liquid resin ejection mechanism 63 supplies liquid resin having conductivity. A device structure capable of supplying granular resin, sheet resin, and liquid resin as resin materials to the cavity is shown, but is not limited thereto. What is necessary is just a device structure capable of supplying at least an insulating resin material and a conductive resin material. Therefore, the structure of the resin material supply module 51 can be further simplified.

For example, in the manufacturing method of the first embodiment, the liquid resin ejection mechanism 63 for supplying a liquid resin having conductivity may be omitted. In the manufacturing method of Embodiment 2, the sheet-like resin supply mechanism 62 which supplies the sheet-like resin which has electroconductivity can be omitted. In the manufacturing method of the third embodiment, the liquid resin ejection mechanism 63 and the first molding module 49 that supply the liquid resin having conductivity can be omitted. Accordingly, it is possible to further reduce the equipment cost. Therefore, the manufacturing cost of the circuit components 30, 35, and 46 can be further reduced.

In addition, in the sheet-like resin supply mechanism 62, a sheet-like resin 26 having flexibility and adhered to a release film may be prepared according to a different manufacturing method, or a sheet-like shape which is pre-formed according to the shape of the cavity in advance Resin 37.

In addition, as for the release film, the resin material supply module 51 is provided with the release film supply mechanism 64 which supplies a thin rectangular release film, but it is not limited to this. For example, a release film supply mechanism for supplying a long release film may be provided in the first molding die 11 of the first molding module 49 and the second molding die 20 of the second molding module 50.

In the resin molding apparatus 47, if a manufacturing method is limited to one type, it can be set as the apparatus structure corresponding to it. By adopting such a device structure, it is possible to further reduce the equipment cost.

The substrate supply storage module 48 and the resin material supply module 51 can be integrated into a material supply product storage module. The material supply product storage module and at least one of the first molding module 49 and the second molding module 50 (for example, the first molding module 49) can be attached to and detached from each other and can be replaced. This case corresponds to a case where the first molding module 49 is detached from both the substrate supply storage module and the resin material supply module.

[Embodiment 5]

The manufacturing apparatus according to the fifth embodiment will be described with reference to FIG. 11. The manufacturing apparatus 65 shown in FIG. 11 is a manufacturing apparatus in which a cutting module 66 is further added to the resin molding apparatus 47 shown in the fourth embodiment. The configuration and operation other than the cutting module 66 are the same as those of the resin molding apparatus 47 shown in the fourth embodiment, and therefore description thereof is omitted.

As shown in FIG. 11, in the manufacturing apparatus 65, for example, a cutting module 66 is provided between the second molding module 50 and the resin material supply module 51. The cutting module 66 can be attached to and detached from other components and can be replaced.

The cutting module 66 includes, for example, a cutting table 67 used in a step of cutting the packaged substrate. The cutting table 67 can be moved in the Y direction by the moving mechanism 68, and The rotation mechanism 69 is capable of rotating in the θ direction. The packaged substrate is placed on a cutting table 67 by a substrate transfer mechanism 55.

The cutting module 66 includes, for example, two mandrels 70 and 71 for cutting a resin-encapsulated substrate after encapsulation. Rotating blades 72 and 73 are provided on the two mandrels 70 and 71, respectively. The rotating blades 72 and 73 are rotating blades having the same thickness. With the two mandrels 70 and 71, the packaged substrate is cut along the cutting line and singulated.

According to this embodiment, a cutting module 66 is further added to the manufacturing device 65. According to this, it is possible to cut the resin-encapsulated substrate to be singulated using the same device. Therefore, a step of transferring the packaged substrate to another cutting device or the like can be omitted, and the manufacturing cost of the circuit component can be further reduced.

In the present embodiment, a case where the thicknesses of the rotating blades 72 and 73 included in the two spindles 70 and 71 are the same has been described. Not limited to this, the thicknesses of the rotating blades 72 and 73 may be made different. For example, the thickness of the rotary blade 72 may be made thicker, and the thickness of the rotary blade 73 may be made thin. The flexible use of the thickness of the rotary blades 72 and 73 enables the use of the mandrels 70 and 71 for different purposes.

In this case, a mandrel 70 having a thicker rotating blade 72 is used to cut the packaged substrate. The thick rotating blade 72 is a rotating blade for cutting the packaged substrate at a cutting line. On the other hand, by using the mandrel 71 having the thin rotating blade 73, for example, a narrow groove can be formed in a resin-encapsulated insulating cured resin. The thin rotating blade 73 is a rotating blade for forming a groove. By filling a groove formed by cutting with a conductive curing resin, a covered circuit component can be manufactured.

In addition, a laser processing device may be added to the cutting module 66. This laser processing apparatus can also form a narrow groove in a resin-encapsulated insulating cured resin. if In this case, the thickness of the rotating blades 72 and 73 of the two mandrels 70 and 71 can be made thick, and both of the mandrels 70 and 71 can be used to cut the packaged substrate for single chip. Mandrel.

[Embodiment 6]

Various circuit components manufactured by the embodiment of the present invention will be described with reference to FIG. 12. These circuit components are circuit components of a module structure in which a plurality of electronic components (including a semiconductor wafer before resin encapsulation) are electromagnetically shielded by a conductive curing resin.

As shown in (a) of FIG. 12, the circuit component 74 is a circuit component that is electromagnetically shielded by two electronic components 75 and one electronic component 76 (all of which are in a semiconductor wafer state) with a conductive curing resin.

The circuit component 74 includes a substrate 77 and two electronic components 75 and one electronic component 76 mounted on the substrate 77. The two electronic components 75 are connected to the substrate electrode 79 or the ground electrode 80 through the bonding wires 78, respectively. The electronic component 76 is connected to the substrate electrode 79 or the ground electrode 80 through the bump 81.

A part of the ground electrode 80, two electronic components 75, and one electronic component 76 are resin-encapsulated with an insulating curable resin 82. The remaining portion of the ground electrode 80 is resin-sealed with a conductive curing resin 83. Accordingly, the ground electrode 80 and the conductive cured resin 83 are electrically connected. Therefore, the circuit component 74 modularized by the two electronic components 75 and the one electronic component 76 is electromagnetically shielded by the conductive curing resin 83.

As shown in FIG. 12 (b), the circuit component 84 is a circuit component in which the electronic component 85, the electronic component 86, and the electronic component 87 (all of which are resin-encapsulated electronic components) are electromagnetically shielded by a conductive curing resin.

The circuit component 84 includes a substrate 88 and electronic components 85, 86, and 87 mounted on the substrate 88. The electronic components 85, 86, 87 are connected to the substrate electrode 89 or the ground electrode 90 through the bumps 81, respectively.

A part of the ground electrode 90 and the electronic components 85, 86, and 87 are resin-sealed with an insulating curable resin 91. The remaining portion of the ground electrode 90 is resin-sealed with a conductive curing resin 92. Accordingly, the ground electrode 90 and the conductive cured resin 92 are electrically connected. Therefore, the circuit components 84 formed by modularizing the electronic components 85, 86, and 87 are electromagnetically shielded by the conductive curing resin 92.

As shown in FIG. 12 (c), the circuit component 93 is an electronic component 75, 76 (state of a semiconductor wafer), and is electrically shielded by a conductive curing resin, and the electronic component 94 (state of the semiconductor wafer) is not electromagnetically shielded. Circuit components.

The circuit component 93 includes a substrate 95 and electronic components 75, 76, and 94 mounted on the substrate 95. The electronic components 75 and 94 are connected to the substrate electrode 96 or the ground electrode 97 through a bonding wire 78, respectively. The electronic component 76 is connected to the substrate electrode 96 or the ground electrode 97 through a bump (bump-shaped electrode) 81 using flip-chip bonding.

Part of the ground electrode 97, the electronic components 75, 76, and 94, and the substrate electrode 96 are resin-sealed with an insulating curing resin 98. The remaining portion of the ground electrode 97 is resin-sealed with a conductive curable resin 99. A cured resin mixing portion 100 is formed between the insulating cured resin 98 and the conductive cured resin 99. Accordingly, the ground electrode 97 and the conductive cured resin 99 are electrically connected. Therefore, the circuit component 93 becomes a circuit component in which the electronic components 75 and 76 are electromagnetically shielded by the conductive curing resin 99 and the electronic component 94 is not electromagnetically shielded. In this way, it is possible to manufacture a circuit component that electromagnetically shields only a specific electronic component.

According to this embodiment, a resin molding apparatus is used, and resin molding is performed on a plurality of electronic components using an insulating curing resin and a conductive curing resin. Accordingly, the ground electrode surrounding the plurality of electronic components can be electrically connected to the conductive cured resin. Therefore, it is possible to produce conductive curing Resin is a circuit component of a module structure in which a plurality of electronic components are electromagnetically shielded. In addition, it is possible to reduce the manufacturing cost of circuit components.

In each embodiment, a resin molding apparatus using a compression molding method is used to produce a packaged substrate, and the packaged substrate is singulated to manufacture a circuit component. Not limited to this, a resin molding apparatus using a transfer molding method or an injection molding method may be used. Even when these devices are used, the same effects as those of the respective embodiments can be achieved. In the case of using these devices, in the resin molding device, it is preferable to separate the cured resin remaining in the circuit part as a product from the cured resin (unwanted resin) not left in the circuit part (gate cut ( ), Gate cut ( )).

In each embodiment, the case where the release film is supplied to the cavity provided in the lower mold is shown. Without being limited to this, a circuit component can be manufactured without supplying a release film to a cavity.

In each embodiment, the case where the cavity is set in the lower mold is shown. Not limited to this, the same effect can be achieved even when the cavity is set in the upper mold. In addition, when the cavity is set in the upper mold, the pre-package substrate can be placed in the lower mold, and a resin material that is liquid at normal temperature can be supplied to the pre-package substrate. When an electronic component is mounted on a substrate using flip-chip bonding, a solid resin or a paste-like resin material may be used in addition to a liquid resin material at normal temperature.

In each of the embodiments, a method of manufacturing a circuit component including one or more semiconductor wafers (or electronic components or resin-encapsulated electronic components) has been described. The resin-molded object may be a wafer of active elements such as an IC wafer, a transistor wafer, an LED wafer, or a wafer group in which active element wafers are mixed with passive elements such as resistors, capacitors, and inductors. In addition, the resin-molded article may include a sensor, an oscillator, an exciter, and the like.

In each embodiment, a part of the ground electrode and the semiconductor wafer are covered with an insulating curing resin, and the remaining portion of the ground electrode is electrically connected to the conductive curing resin. Accordingly, the circuit component is electromagnetically shielded with the conductive curable resin. Furthermore, since the entire surface of the circuit component is covered with the conductive curing resin, the heat radiation effect can be improved in addition to the electromagnetic shielding effect.

It is also possible to adopt a structure in which the ground electrode and the conductive curing resin are not electrically connected. In this case, the conductive curing resin has a heat radiation function and does not have an electromagnetic shielding function.

As described above, the method of manufacturing a circuit component according to the above embodiment is a method of manufacturing a circuit component that manufactures a circuit component having an electronic circuit and an electromagnetic shielding function, and includes the step of preparing a substrate before packaging, the substrate including at least The first surface of the substrate, the electronic components mounted on the first surface of the substrate, and the ground electrode provided around the electronic components; the first molding step uses a first molding mold to achieve insulation on the first surface of the substrate Molding of a curable resin; and a second molding step, followed by the first molding step, using a second molding mold, the conductive curable resin is molded on the first side of the substrate to produce a packaged substrate. In the first molding step, a part of the ground electrode and the electronic component are covered with an insulating curing resin, and the remaining portion of the ground electrode is exposed from the insulating curing resin to form an exposed ground electrode. In the second molding step, The conductive curable resin covers the insulating curable resin and exposes the ground electrode, thereby electrically connecting the exposed ground electrode and the conductive curable resin.

According to this manufacturing method, a part of the ground electrode and the electronic component can be covered with the insulating curable resin, and the remaining portion of the ground electrode can be electrically connected to the conductive curable resin. Therefore, it is possible to manufacture a circuit component that is electromagnetically shielded by a conductive curing resin. In addition, it is possible to reduce the manufacturing cost of circuit components.

Further, in the method for manufacturing a circuit component according to the above embodiment, the first molding die and the second molding die are included in the same manufacturing apparatus.

According to this manufacturing method, it is possible to realize the molding of the insulating curing resin and the conductive curing resin by using the same manufacturing apparatus. Therefore, the manufacturing cost of a circuit component can be reduced.

The method for manufacturing a circuit component according to the above embodiment is a circuit component manufacturing method for manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function, and includes a step of preparing a package substrate before the package including at least a first surface having a first surface. A substrate, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; in a first molding step, a first molding die is used to realize the insulation curing resin on the first surface side of the substrate; Molding to cover the electronic part, a part of the ground electrode, and the remaining part of the ground electrode with an insulating curing resin; then the first molding step uses a removal mechanism to remove the insulating curing resin covering the remaining part of the ground electrode, so that A step of forming the exposed ground electrode by exposing the remaining portion of the ground electrode; and a second molding step, which uses a second molding die to form a conductive cured resin on the first side of the substrate to produce a packaged substrate. In the second molding step, the conductive curable resin covers the insulating curable resin and exposes the ground electrode, thereby electrically connecting the exposed ground electrode and the conductive curable resin. The first molding die, the removing mechanism, and the second molding die are included in the same manufacturing apparatus.

According to this manufacturing method, the remaining portion of the ground electrode can be exposed by the removal mechanism, so that the remaining portion of the ground electrode can be electrically connected to the conductive cured resin. Therefore, it is possible to manufacture a circuit component that is electromagnetically shielded by a conductive curing resin.

Furthermore, in the method for manufacturing a circuit component according to the above embodiment, the first molding step includes the following steps: (1) a step of clamping the first molding mold; (2) a step of supplying an insulating flowing resin to the cavity from the outside of the cavity of the first molding mold after the mold clamping, through the flow path and the opening of the first molding mold, respectively; (3) A step of molding the insulating cured resin is achieved by curing the insulating flowing resin supplied to the cavity; (4) a step of opening the first molding mold.

According to this manufacturing method, resin molding of the insulating curing resin can be achieved by a transfer molding method or an injection molding method.

Furthermore, in the method of manufacturing a circuit component according to the above embodiment, the first molding step includes the following steps: (1) supplying the insulating resin material that is solid, pasty, or liquid at room temperature to the first A step of forming a cavity in the mold; (2) immersing at least a part of the ground electrode and the electronic component in the cavity of the insulating flow generated by the insulating resin material by clamping the first mold; A step in the resin; (3) a step of molding the insulating cured resin by curing the insulating flowing resin in the cavity; and (4) a step of opening the first molding mold.

According to this manufacturing method, resin molding of an insulating curable resin can be achieved by a compression molding method.

The method for manufacturing a circuit component according to the above embodiment is a circuit component manufacturing method for manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function by using a molding mold having a first mold and a first mold disposed opposite to the first mold. A second mold, the manufacturing method includes: The step of preparing a package front substrate, the package front substrate includes at least a substrate having a first surface, electronic components mounted on the first surface of the substrate, and a ground electrode provided around the electronic components; A step of supplying a paste-like or a liquid-state conductive resin material to a cavity provided in a first mold; a step of disposing a substrate before packaging on a molding mold so that a first surface of the substrate faces the cavity; A step of supplying a solid, pasty, or liquid insulating resin material at room temperature to a cavity to which a conductive resin material has been supplied; by clamping the molding die, a part of the ground electrode is placed in the cavity. A step of soaking parts and electronic parts in an insulating flowing resin made of an insulating resin material, and soaking the remaining part of the ground electrode in a conductive flowing resin made of a conductive resin material; The insulating flowing resin is cured, thereby molding the insulating curing resin on the first side of the substrate, and the conductive flowing resin is cured, so that A first side surface of the conductive substrate is achieved cured resin molding, whereby manufacturing steps after the package substrate; and a molding die of a mold opening step. In the step of manufacturing the packaged substrate, the remaining portion of the ground electrode is electrically connected to the conductive curing resin.

According to this manufacturing method, a part of the ground electrode and the electronic component can be covered with the insulating curable resin by one resin molding, and the remaining portion of the ground electrode can be electrically connected to the conductive curable resin. Therefore, it is possible to manufacture a circuit component that is electromagnetically shielded by a conductive curing resin. In addition, it is possible to further reduce the manufacturing cost of circuit components.

Furthermore, in the method of manufacturing a circuit component according to the above-mentioned embodiment, the substrate has a plurality of regions separated by a dummy line, and in each of the plurality of regions, an electronic component mounted on a first surface of the substrate and an electronic component mounted on the electronic component are provided. The surrounding ground electrode is provided, and the manufacturing method further includes a step of manufacturing a plurality of circuit parts corresponding to each of the plurality of regions by cutting the packaged substrate along a virtual line.

According to this manufacturing method, the circuit board is manufactured by cutting the resin-encapsulated post-package substrate along virtual lines. Therefore, it is possible to further reduce the manufacturing cost of the circuit component.

Furthermore, in the method of manufacturing a circuit component according to the above embodiment, the dummy line is composed of any one of the following lines: (1) intersecting line segments extending across the entire substrate; (2) intersecting lines extending across the entire substrate (3) a line segment or curve extending over the entire substrate, and a polyline included in each region; (4) a line segment or curve extending over the entire substrate, and a curve included in each region.

According to this manufacturing method, circuit components having various shapes can be manufactured.

The device for manufacturing a circuit component according to the above embodiment is configured as follows, including: a first molding module having a first molding mold; a second molding module having a second molding mold; a substrate supply module for supplying a substrate before packaging, The pre-package substrate includes at least a substrate having a first surface, electronic components mounted on the first surface of the substrate, and a ground electrode provided around the electronic components; and a resin material supply module that supplies an insulating resin material and a conductive material. Sex resin material. In the first molding mold, the insulating resin material is cured to form the insulating curing resin, and at least a part of the ground electrode and the electronic component are covered with the insulating curing resin. In the second molding mold, the conductive material is made conductive. The solid resin material is cured, so that the conductive cured resin covering at least the insulating cured resin is formed, and the post-packaged substrate is produced accordingly; on the post-packaged substrate, at least a part of the ground electrode and the electronic component are covered with the insulating cured resin. The insulating curing resin is covered by the conductive curing resin; the first molding module and the second molding module can be detached from each other; in the first molding module and the second molding module, At least one of the modules can be attached to and detached from at least one of the substrate supply module and the resin material supply module; the conductive curing resin is connected to the ground electrode and has an electromagnetic shielding function.

According to this structure, the molding of the insulating curable resin and the conductive curable resin can be realized by a single manufacturing apparatus. The conductive cured resin and the ground electrode can be electrically connected to electromagnetically shield the electronic component. Therefore, it is possible to reduce the equipment cost and reduce the manufacturing cost of circuit components.

Furthermore, the device for manufacturing a circuit component according to the above-mentioned embodiment has a structure in which the first molding module and the second molding module employ any one of a compression molding method, a transfer molding method, and an injection molding method.

According to this configuration, various molding methods can be used to manufacture a circuit component that is electromagnetically shielded by a conductive curable resin. In addition, it is possible to reduce the manufacturing cost of circuit components.

Furthermore, the device for manufacturing a circuit component according to the above embodiment is configured as follows: the first molding die has a first cavity, and the second molding die has a second cavity. Three-dimensionally, the shape of the second cavity includes the first cavity. The shape of the cavity.

According to this structure, molding of the insulating curing resin is achieved in the first cavity, and molding of the conductive curing resin covering the insulating curing resin is achieved in the second cavity. Therefore, it is possible to manufacture a circuit component that is electromagnetically shielded by a conductive curing resin.

Furthermore, the apparatus for manufacturing a circuit component according to the above embodiment is configured to further include a cutting module having a cutting mechanism; a first molding module, a second molding module, a substrate supply module, and a resin material supply module; At least one module and the cutting module can be attached to and detached from each other; the cutting mechanism performs at least one of the following operations: (1) The operation of cutting the insulating cured resin to expose the remaining part of the ground electrode provided on the first surface of the substrate, excluding a part of the ground electrode, from the insulating cured resin; And cut off the operation.

According to this configuration, a cutting module having a cutting mechanism is further added to the manufacturing apparatus. The cutting mechanism can be used to cut the insulating cured resin to expose the ground electrode or cut the packaged substrate.

The device for manufacturing a circuit component according to the above embodiment is configured as follows, including: a first molding module having a first molding die; and a substrate supply module for supplying a substrate before packaging, the substrate before packaging includes at least a substrate having a first surface. A substrate, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module that supplies an insulating resin material and a conductive resin material. At least one of the substrate supply module and the resin material supply module can be attached to and detached from the first molding module; the first molding mold collectively realizes the insulating curing resin and the conductive curing resin covering the insulating curing resin. Molding to make a packaged substrate; on the packaged substrate, at least a part of the ground electrode and electronic components are covered with an insulating curing resin, the insulating curing resin is covered with a conductive curing resin; the conductive curing resin is connected to the ground electrode , With electromagnetic shielding function.

According to this structure, it is possible to realize the molding of the insulating curable resin and the conductive curable resin together using only one mold. The conductive cured resin and the ground electrode can be electrically connected to electromagnetically shield the electronic component. Therefore, it is possible to further reduce equipment costs and further reduce the manufacturing cost of circuit components.

Furthermore, the apparatus for manufacturing a circuit component according to the above embodiment is configured to further include a cutting module having a cutting mechanism; at least one of a first molding module, a substrate supply module, and a resin material supply module and cutting Modules can be attached to and detached from each other; the cutting mechanism performs the operation of cutting the packaged substrate together.

According to this configuration, a cutting module having a cutting mechanism is further added to the manufacturing apparatus. A cutting mechanism can be used to cut the substrate after packaging.

The circuit component of the above embodiment has the following structure, including: an electronic component mounted on a substrate; a ground electrode provided on the substrate; an insulating curing resin covering a part of the ground electrode and the electronic component; and a conductive curing resin covering the ground electrode The remaining portion of the insulating curing resin is electrically connected to the remaining portion of the ground electrode and has an electromagnetic shielding function; and a boundary portion is formed at the boundary between the insulating curing resin and the conductive curing resin.

According to this configuration, a part of the ground electrode and the electronic component can be covered with the insulating curable resin, and the remaining part of the ground electrode can be electrically connected to the conductive curable resin. Therefore, it is possible to manufacture a circuit component that is electromagnetically shielded by a conductive curing resin.

Furthermore, the boundary portion of the circuit component of the above embodiment is an interface formed at the boundary between the insulating curable resin and the conductive curable resin.

According to this structure, an interface exists in the boundary part of an insulating curable resin and a conductive curable resin.

Furthermore, the boundary portion of the circuit component of the above embodiment is a cured resin mixed portion formed at the boundary between the insulating curable resin and the conductive curable resin.

According to this structure, since the cured resin mixing portion is interposed therebetween, a strong bonding force is obtained between the insulating cured resin and the conductive cured resin. Therefore, it is possible to further improve the adhesion between the insulating curable resin and the conductive curable resin.

Furthermore, the circuit component of the said embodiment further has a side surface which has a processing trace.

According to this configuration, the circuit board can be manufactured by cutting the packaged substrate after the resin sealing.

The present invention is not limited to the embodiments described above, and may be arbitrarily and appropriately combined, changed, or selectively adopted within a range not departing from the spirit of the present invention.

Claims (16)

A method for manufacturing a circuit component includes manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function. The method for manufacturing a circuit component includes a step of preparing a substrate before packaging. The substrate before packaging includes at least a substrate having a first surface. An electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; the first molding step uses a first molding die to achieve insulation curing on the first surface side of the substrate Resin molding; and a second molding step, followed by the first molding step, using a second molding die, the conductive cured resin is molded on the first surface side of the substrate to produce a packaged substrate. In the first molding step, a part of the ground electrode and the electronic component are covered with the insulating curing resin, and the remaining portion of the ground electrode is exposed from the insulating curing resin to form an exposed ground electrode. In the two molding steps, the conductive curing resin and the exposed grounding resin are covered with the conductive curing resin. , Thereby exposing the ground electrode and the electrically connected conductive curable resin. The method for manufacturing a circuit component according to item 1 of the scope of patent application, wherein as the first molding die and the second molding die, the first molding die, the removal mechanism, and the second Forming mold. A method for manufacturing a circuit component includes manufacturing a circuit component having an electronic circuit and an electromagnetic shielding function. The method for manufacturing a circuit component includes a step of preparing a substrate before packaging. The substrate before packaging includes at least a substrate having a first surface. An electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; the first molding step uses a first molding die to achieve insulation curing on the first surface side of the substrate Resin molding, so that the electronic component, a part of the ground electrode, and the remaining part of the ground electrode are covered with the insulating curing resin; then, in the first molding step, the remaining part of the ground electrode is removed using a removing mechanism A step of exposing the remaining portion of the ground electrode to form the exposed ground electrode by covering the insulating cured resin; and a second molding step, using a second molding die, implemented on the first side of the substrate Molding of a conductive curing resin to produce a packaged substrate, and in this second molding step Covering the insulating curing resin and the exposed ground electrode with the conductive curing resin, thereby electrically connecting the exposed ground electrode and the conductive curing resin as the first molding die, the removing mechanism, and the second molding die , The first molding die, the removing mechanism, and the second molding die provided in the same manufacturing apparatus are used. The method for manufacturing a circuit component according to item 1 or 3 of the scope of patent application, wherein the first molding step includes the following steps: (1) a step of clamping the first molding mold; (2) from the mold clamping A process of supplying an insulating flowing resin to the cavity of the subsequent cavity of the first molding die through the flow path and the opening of the first molding die, respectively; (3) by A step of curing the insulating flowing resin supplied to the cavity to realize the molding of the insulating cured resin; and (4) a step of opening the first molding mold. The method for manufacturing a circuit component according to item 1 or 3 of the scope of patent application, wherein the first molding step includes the following steps: (1) supplying a solid, pasty, or liquid insulating resin material at ordinary temperature The process of reaching the cavity of the first forming mold after the mold is opened; (2) clamping the first forming mold so that at least a part of the ground electrode and the electrons are in the cavity; A step of immersing a part in an insulating flowing resin produced from the insulating resin material; (3) a step of curing the insulating flowing resin by curing the insulating flowing resin in the mold cavity; and ( 4) A step of opening the first molding die. A circuit component manufacturing method using a molding mold having a first mold and a second mold disposed opposite to the first mold to manufacture a circuit component having an electronic circuit and an electromagnetic shielding function, and a method for manufacturing the circuit component The method includes the steps of preparing a pre-package substrate, the pre-package substrate having at least a substrate having a first surface, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; A process of supplying a solid, pasty or liquid conductive resin material to a cavity provided in the first mold; in a manner that the first surface of the substrate is opposed to the cavity, A step of disposing a substrate in the molding die; a step of supplying an insulating resin material that is solid, pasty, or liquid at normal temperature to the cavity to which the conductive resin material has been supplied; A mold such that a part of the ground electrode and the electronic component are immersed in the mold cavity in the insulating flowing resin generated from the insulating resin material And a step of immersing the remaining part of the ground electrode in a conductive flowing resin generated from the conductive resin material; in the mold cavity, by curing the insulating flowing resin to be on the first side of the substrate Forming the insulating cured resin on one side, curing the conductive flowing resin, and forming the conductive curing resin on the first side of the substrate, and manufacturing the packaged substrate according to the process; and The molding die performs a mold opening step. In the step of manufacturing the packaged substrate, the remaining portion of the ground electrode is electrically connected to the conductive curing resin, and between the insulating curing resin and the conductive curing resin. A boundary portion is formed, and the boundary portion is an interface between the insulating curing resin and the conductive curing resin, and is composed of a curing resin mixing portion of the insulating curing resin and the conductive curing resin. The method for manufacturing a circuit component according to any one of claims 1, 3, or 6, wherein the substrate has a plurality of regions separated by a virtual line, and the plurality of regions are provided with The electronic component mounted on the first surface of the substrate and the ground electrode provided around the electronic component, and the method of manufacturing the circuit component further includes: cutting the packaged substrate along the virtual line, Thereby, a process of producing a plurality of circuit components corresponding to each of the plurality of regions. The method for manufacturing a circuit component according to item 7 of the scope of patent application, wherein the virtual line is composed of any one of the following lines: (1) intersecting line segments extending over the entire substrate; (2) the entire line Intersecting curves extending across the substrate; (3) line segments or curves extending across the substrate, and polylines included in each of the regions; (4) line segments or curves extending across the substrate, and at each The curve contained in this area. A device for manufacturing a circuit component includes: a first molding module having a first molding mold; a second molding module having a second molding mold; a substrate supply module for supplying a substrate before packaging; A first substrate, an electronic component mounted on the first surface of the substrate, and a ground electrode provided around the electronic component; and a resin material supply module that supplies an insulating resin material and a conductive resin material, In the first molding die, the insulating resin material is cured to realize the molding of the insulating curing resin. At least a part of the ground electrode and the electronic component are covered by the insulating curing resin. In the method, the conductive resin material is cured to form a conductive cured resin covering at least the insulating cured resin, and a post-packaged substrate is manufactured according to the method. On the post-packaged substrate, at least the part of the ground electrode and the Electronic components are covered with the insulating curing resin, and the insulating curing resin is covered with the conductive curing resin Cover, the first molding module and the second molding module can be detached from each other, at least one of the first molding module and the second molding module, the substrate supply module and the resin material supply mold At least one module in the group can be attached to and detached from each other. The conductive curing resin is connected to the ground electrode and has an electromagnetic shielding function. The device for manufacturing a circuit component according to item 9 of the scope of the patent application, wherein the first molding module and the second molding module adopt any one of a compression molding method, a transfer molding method, and an injection molding method. The circuit component manufacturing device according to item 9 of the scope of the patent application, wherein the first molding die has a first cavity, the second molding die has a second cavity, and the shape of the second cavity is three-dimensionally viewed. Contains the shape of the first cavity. The device for manufacturing a circuit component according to item 9 of the scope of patent application, further comprising: a cutting module having a cutting mechanism, the first molding module, the second molding module, the substrate supply module, and the resin At least one of the material supply module and the cutting module can be attached to and detached from each other. The cutting mechanism performs at least one of the following operations: (1) cutting the insulating cured resin so that the The ground electrode provided on the first surface does not include the operation of exposing the remaining part of the part from the insulating cured resin; (2) the operation of cutting the packaged substrate together. A device for manufacturing a circuit component includes a first molding module having a first molding die, and a substrate supply module for supplying a substrate before packaging. The substrate before packaging includes at least a substrate having a first surface, and the first Electronic components mounted on one side, and a ground electrode provided around the electronic components; and a resin material supply module for supplying an insulating resin material and a conductive resin material, the substrate supply module and the resin material supply module At least one of the modules and the first molding module can be attached to and detached from each other, and the first molding mold simultaneously molds the insulating curing resin and the conductive curing resin covering the insulating curing resin to form a packaged substrate, On the packaged substrate, at least a part of the ground electrode and the electronic component are covered with the insulating curing resin, the insulating curing resin is covered with the conductive curing resin, and the conductive curing resin is connected to the ground electrode , With electromagnetic shielding function. The device for manufacturing a circuit component according to item 13 of the scope of patent application, further comprising: a cutting module having a cutting mechanism, at least one of the first molding module, the substrate supply module, and the resin material supply module. A module and the cutting module can be attached to and detached from each other, and the cutting mechanism performs an operation of cutting the packaged substrate together. A circuit component includes: an electronic component mounted on a substrate; a ground electrode provided on the substrate; an insulating curing resin covering a part of the ground electrode and the electronic component; a conductive curing resin covering a remaining part of the ground electrode And the insulating cured resin, which is electrically connected to the remaining portion of the ground electrode, has an electromagnetic shielding function; and a boundary portion is formed at a boundary between the insulating cured resin and the conductive cured resin, and the boundary portion is An interface formed at a boundary between the insulating curable resin and the conductive curable resin, and the boundary portion is a cured resin mixed portion formed at a boundary between the insulating curable resin and the conductive curable resin. The circuit component according to item 15 of the scope of patent application, wherein the circuit component is provided with a side surface having a processing mark.