CN105269744A - Resin sealing apparatus and resin sealing method - Google Patents
Resin sealing apparatus and resin sealing method Download PDFInfo
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- CN105269744A CN105269744A CN201510250069.4A CN201510250069A CN105269744A CN 105269744 A CN105269744 A CN 105269744A CN 201510250069 A CN201510250069 A CN 201510250069A CN 105269744 A CN105269744 A CN 105269744A
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Abstract
The present invention relates to a resin sealing apparatus and a resin sealing method. In the resin sealing apparatus, resin materials and heat radiating plates are stably supplied to a mold cavity. The materials receiving box has a through-hole; a perimeter portion formed around the through-hole; an adsorption trough provided on the lower surface of the perimeter portion; a projecting member installed on the lower surface of the perimeter portion and protruding towards the inside; and a lifting member to ascend or descend along the inner surface of the perimeter portion. A material supply mechanism is made by integrating the materials receiving box and a release film adsorbed to the lower surface of the perimeter portion. The material supply mechanism is lifted by a material transport mechanism. The front end position of the projecting member is defined to correspond to the location of an outer periphery of the heat radiating plate. Accordingly, the heat radiating plate is configured to locate at the inner side of the projecting member position without deviating on the release film, thus enabling the heat radiating plate and the resin material to be stably transported.
Description
Technical field
The present invention relates to one and the electronic unit (being suitably called below " chip ") of the shaped like chips such as transistor, integrated circuit (IntegratedCircuit:IC) and light emitting diode (LightEmittingDiode:LED) is being carried out to resin encapsulation equipment and the resin encapsulation method of the middle uses such as the situation of resin-encapsulated.
Background technology
In recent years, semiconductor more and more to high performance, multifunction and miniaturization, with this, the tendency that the electric power being in semiconductor chip consumption more and more increases.Particularly, in the semiconductor chip such as microprocessor or power device, the heating caused by power consumption becomes large problem.The release of the heat sent to promote semiconductor chip, carries out the operation of heat sink in the lump resin-encapsulated together with semiconductor chip.
When carrying out resin-encapsulated to the plate-shaped member as heat sink together with semiconductor chip, need heat sink is not moved in die cavity during carrying out resin-encapsulated.When carrying out resin-encapsulated, heat sink moves, then because radiating effect produces the characteristic instability of deviation and goods.Therefore, very important to make heat sink not move by heat sink being aimed at accurately in die cavity.
As the resin-encapsulated shaped device of electronic unit, proposition has following resin-encapsulated shaped device (such as, with reference to [0008] section and Fig. 1 of patent document 1, Fig. 2): " a kind of resin-encapsulated shaped device of electronic unit, the electronic unit be at least made up of a mould and another mould resin-encapsulated mold for forming and be at least arranged in the resin-encapsulated die cavity of a mould, products formed is molded by utilizing liquid resin to carry out encapsulated moulding to heat sink and electronic unit when mould matched moulds, wherein, heat sink is navigated to the one or more protuberances be formed in die cavity with breakthrough status ".
Patent document 1: Japanese Laid-Open Patent Publication 2008-053509 publication
But, in resin-encapsulated shaped device disclosed in patent document 1, as described below, there is room for improvement like that.As shown in Fig. 1 of patent document 1, in die cavity 3, the fore-end 18a making to comprise the cast gate 13 watering buccal mass 14 is outstanding compared with the horizontal plane of die cavity 3 with the fore-end 18b of jemmy 10.By this fore-end (protuberance) 18a, 18b being inserted in the through hole be formed in heat sink 5, thus carry out the location of die cavity 3 and heat sink 5.Therefore, only form protuberance 18a in die cavity 3 and this two place of another protuberance 18b by configuration, just heat sink 5 easy (simply) can be navigated in die cavity 3 accurately.
This localization method needs in die cavity 3, be pre-formed two place protuberance 18a, 18b and on heat sink 5, be pre-formed two place's through holes and make it corresponding with two place protuberance 18a, 18b.Therefore, the processed complex of die cavity 3 and heat sink 5, and the time increase that machining needs.Therefore, there is room for improvement in the expense this point making mould and heat sink.
Summary of the invention
The present invention solves the problem, its object is to provide a kind of resin encapsulation equipment and resin encapsulation method, in resin encapsulation equipment, simple material feed mechanism can be used to carry out the location of plate-shaped member, and resin material and plate-shaped member are stably supplied in die cavity.
In order to solve the problem, resin encapsulation equipment involved in the present invention possesses:
Patrix; Counterdie; Be oppositely arranged with described patrix; Die cavity, is arranged at described counterdie; Feed mechanism, to described die cavity supply resin material and plate-shaped member; And clamping, matched moulds is carried out to the shaping mould at least with described patrix and described counterdie,
The feature of described resin encapsulation equipment is to possess:
Material storage frame, be arranged at described feed mechanism and top view time there is through hole;
Adsorbing mechanism, is adsorbed onto the lower surface of described material storage frame by mould release membrance in the mode at least covering the lower surface of the described material storage frame comprising described through hole;
Lift Part, can be arranged at the medial surface of described material storage frame up and down;
Extended part, is arranged at the lower face side of described material storage frame and gives prominence to from the medial surface of described material storage frame; And
Injection mechanism, described Lift Part lower surface be configured at described extended part inner side and under being positioned in the state that the plate-shaped member on described mould release membrance contacts, described resin material is dropped in the space surrounded to the described Lift Part in the inner side by described material storage frame and described plate-shaped member
Under the state at least holding described mould release membrance, described plate-shaped member and described resin material in described material storage frame, described feed mechanism is transported to the top of described counterdie,
By stopping making described mould release membrance be adsorbed onto the lower surface of described material storage frame, thus described resin material, described plate-shaped member and described mould release membrance are supplied to described die cavity in the lump from described feed mechanism.
Resin encapsulation equipment involved in the present invention has as under type:
By making the position of the front end of described extended part corresponding with the position of the periphery of described plate-shaped member, thus locate described plate-shaped member.
In addition, resin encapsulation equipment involved in the present invention has as under type:
Described plate-shaped member is heat sink or electromagnetic shielding plate.
In addition, resin encapsulation equipment involved in the present invention has as under type:
Described resin material is any one in granular, graininess, powdery, pasty state or resin aqueous at normal temperatures.
In addition, resin encapsulation equipment involved in the present invention has as under type:
Possess further:
For supplying the supplying module of described plate-shaped member and described resin material to described feed mechanism; With
There is at least one forming module of described shaping mould and described clamping,
Described supplying module and a described forming module can load and unload,
A described forming module can load and unload relative to other forming module.
In addition, resin encapsulation equipment involved in the present invention has as under type:
Described supplying module is split into the plate-shaped member supplying module of supply plate-shaped member and the resin material supplying module of the described resin material of supply,
Described plate-shaped member supplying module and described resin material supplying module can load and unload.
In order to solve above-mentioned problem, resin encapsulation method involved in the present invention comprises: the shaping mould using the counterdie at least having patrix and be oppositely arranged with described patrix, to the operation of the die cavity supply resin material and plate-shaped member that are arranged at described counterdie; And described shaping mould is carried out to the operation of matched moulds,
The feature of described resin encapsulation method is, comprising:
Mould release membrance loads the operation of described plate-shaped member;
Material storage frame during top view with through hole is configured in the operation on described mould release membrance;
The operation of described plate-shaped member is located by the extended part given prominence to from the medial surface of described material storage frame;
Described mould release membrance is made to be adsorbed onto the operation of the lower surface of described material storage frame;
Under the state that the lower surface of the Lift Part on the medial surface that can be arranged at described material storage frame up and down contacts with described plate-shaped member, drop into the operation of described resin material to the space that the described Lift Part in the inner side by described material storage frame and described plate-shaped member surround; And
The operation of the top of described counterdie is transported in the lump to material storage frame, described mould release membrance, described plate-shaped member and described resin material described in major general,
In the operation of described supply, by stopping making described mould release membrance be adsorbed onto the lower surface of described material storage frame, thus described resin material, described plate-shaped member and described mould release membrance are supplied in die cavity in the lump.
Resin encapsulation method involved in the present invention has as under type:
In the operation of described location, by making the position of the front end of described extended part corresponding with the position of the periphery of described plate-shaped member, thus locate described plate-shaped member.
In addition, resin encapsulation method involved in the present invention has as under type:
Described plate-shaped member is heat sink or electromagnetic shielding plate.
In addition, resin encapsulation method involved in the present invention has as under type:
Described resin material is any one in granular, graininess, powdery, pasty state or resin aqueous at normal temperatures.
In addition, resin encapsulation method involved in the present invention has as under type:
Comprise further:
Prepare the operation of the supplying module for supplying described plate-shaped member and described resin material; And
Prepare the operation with at least one forming module of described shaping mould and described clamping,
Described supplying module and a described forming module can load and unload,
A described forming module can load and unload relative to other forming module.
In addition, resin encapsulation method involved in the present invention has as under type:
Described supplying module is split into the resin material supplying module of plate-shaped member supplying module and the described resin material of supply supplying described plate-shaped member,
Described plate-shaped member supplying module and described resin material supplying module can load and unload.
According to the present invention, having in the material storage frame of through hole of using in resin encapsulation equipment is provided with: adsorbing mechanism, is adsorbed onto the lower surface of material storage frame by mould release membrance; Lift Part, the medial surface of material storage frame is elevated; And extended part, give prominence to from the medial surface of material storage frame.By by material storage frame and be adsorbed onto material storage frame lower surface mould release membrance integration and be configured for supplying the feed mechanism of resin material and board-like material.Under the state that the lower surface of Lift Part contacts with the plate-shaped member of the inner side being configured at extended part, the resin material be housed in the space that surrounded by Lift Part and plate-shaped member is transported in die cavity by feed mechanism.Thus, under the state mould release membrance in the inner side of extended part being configured with plate-shaped member and resin material, resin material, plate-shaped member and mould release membrance can be supplied in die cavity in the lump.
Accompanying drawing explanation
(a) ~ (d) of Fig. 1 represents schematic cross sectional views heat sink and resin material being housed in the process in material storage frame in the embodiment 1 of resin encapsulation equipment involved in the present invention.
(a) ~ (c) of Fig. 2 represents the schematic cross sectional views using the material storage frame shown in Fig. 1 heat sink and resin material to be supplied to the process in die cavity.
(a), (b) of Fig. 3 is the schematic cross sectional views representing the process of the chip that substrate is installed being carried out to resin-encapsulated.
Fig. 4 is the top view of the general configuration representing device in the embodiment 2 of resin encapsulation equipment involved in the present invention.
Detailed description of the invention
As shown in Figure 1, be provided with in material storage frame 1: through hole 2, vertically has opening; Circumference 3, is formed at through hole 2 around; Adsorption tank 4, is arranged at the lower surface of circumference 3; Extended part 5, is arranged on the lower face side of circumference 3 and gives prominence to towards inner side; With Lift Part 6, the peripherally medial surface lifting in portion 3.Mould release membrance 9 is adsorbed with at the lower surface of circumference 3.By the constituent material feed mechanism 1A by material storage frame 1 and mould release membrance 9 integration of lower surface being adsorbed onto circumference 3.Material feed mechanism 1A is lifted by material delivery mechanism 7.The position of the front end of extended part 5 is confirmed as corresponding with the position of the periphery of heat sink 10.Therefore, heat sink 10 can not offset at the state upper/lower positions of the inner side being configured in extended part 5 on mould release membrance 9, stably can transport heat sink 10 and resin material 11.
(embodiment 1)
With reference to Fig. 1 ~ Fig. 3, the material storage frame 1 used in the embodiment 1 of resin encapsulation equipment involved in the present invention is described.Arbitrary width figure in present specification all suitably omits for ease of understanding or exaggerates schematically to draw.Identical Reference numeral is used to identical structural element, and suitably omits the description.
The material storage frame 1 that shown in Fig. 1, resin encapsulation equipment has possesses: through hole 2, vertically has opening; Circumference 3, is formed at through hole 2 around; Adsorption tank 4, is arranged at the lower surface of circumference 3; Extended part 5, is arranged on the lower face side of circumference 3 and gives prominence to towards inner side; With Lift Part 6, the peripherally medial surface lifting in portion 3.Material delivery mechanism 7 keeps material storage frame 1 and the conveyer moved it.Material delivery mechanism 7 makes material storage frame 1 move to the top of X-Y table 8.X-Y table 8 is coated with mould release membrance 9.Mould release membrance 9 is placed with such as the heat sink (fin) 10 of the plate-shaped member be housed in material storage frame 1.
In material storage frame 1, Lift Part 6 is formed as down the shape of L-shaped, has the protuberance 6a extended in the horizontal direction and the protuberance 6b extended along vertical direction.Lift Part 6 falls because of deadweight, is contacted and stop by the lower surface of the protuberance 6a of Lift Part 6 with the upper surface of extended part 5.The extended part 5 being arranged on the lower face side of circumference 3 plays the effect of the block stoping Lift Part 6 to fall because of deadweight.Under the state that Lift Part 6 stops, the lower surface of the lower surface distance circumference 3 of the protuberance 6b of Lift Part 6 is positioned at below with predetermined distance d.According to the hardness etc. of supplied amount of resin and mould release membrance, predetermined distance d is set to about 0.5mm ~ 2mm.
Extended part 5 is set to adjust the distance L between relative extended part 5 in the horizontal direction.Extended part 5 is at least provided with two or more on the medial surface of circumference 3.Make the position of the front end of these extended parts 5 corresponding with the position of the periphery of heat sink 10.Specifically, make the position of the front end of extended part 5 be the maximum periphery considering dimensional accuracy from heat sink 10 position separate the position in small gap.In addition, the medial surface near the lower surface of extended part 5 is preferably made to be more close to lower surface (towards circumference 3) conical surface of retreating more toward the outer side.Thereby, it is possible to be configured the location of the heat sink 10 in the inner side of extended part 5.The shape of extended part 5 can also be the ring-type of the opening of the below along through hole 2.
The metal that circumference 3 is such as easily processed by aluminium etc. is formed.Lift Part 6 preferably has the metal material of wearability or ceramic material etc. by stainless steel or chromium steel etc. and is formed, and weares and teares do not accelerate to make the bottom surface of protuberance 6b.The Lift Part 5 also preferred metal material or ceramic material etc. having a wearability by stainless steel or chromium steel etc. is formed, and does not accelerate to make upper surface and flank wear.In addition, synthetic rubber can also be imbedded in the lower face side of circumference 3, and on synthetic rubber, form adsorption tank 4.By imbedding synthetic rubber, the close property of the lower surface of circumference 3 can be improved.As synthetic rubber, preferably use the silicon rubber with heat resistance or fluorubber etc.
As shown in (a) of Fig. 1, material delivery mechanism 7 has: maintaining part 7a, from laterally clamping material storage frame 1 and keep; With maintaining part 7b, be connected with maintaining part 7a and can be elevated.As described later, can by being arranged at maintaining part 7a and the maintaining part 7b of material delivery mechanism 7, from clamp up and down the lower surface being adsorbed onto circumference 3 mould release membrance circumference and keep.When making material storage frame 1 move by material delivery mechanism 7, the lower surface of the protuberance 6a of Lift Part 6 contacts with the upper surface of extended part 5, and Lift Part 6 stops thus.
With reference to (a) ~ (d) of Fig. 1, the action using material storage frame 1 such as to accommodate heat sink 10 and resin material 11 is described.As shown in (a) of Fig. 1, first, X-Y table 8 covers the mould release membrance 9 of the strip supplied from mould release membrance feed mechanism (not shown), and make it not produce fold or lax.As mould release membrance 9, preferably use the mould release membrance 9 of the hardness had to a certain degree to apply tension force.After covering mould release membrance 9, by adsorbing mechanism (not shown), mould release membrance 9 is adsorbed onto in X-Y table 8.Cutting mould release membrance 9, only retains the necessary part of the mould release membrance 9 after absorption.In (a) of Fig. 1, mould release membrance 9 is cut into slightly larger than X-Y table 8.
Then, the assigned position mounting heat sink 10 on mould release membrance 9.As heat sink 10, such as, use the material that the thermal conductivity such as copper or aluminium is high.Then, use material delivery mechanism 7, make material storage frame 1 move to the top of X-Y table 8 and stop.During making material storage frame 1 movement and during stopping, the lower surface of the protuberance 6a of Lift Part 6 contacts with the upper surface of extended part 5, and Lift Part 6 is the state stopped.The lower surface decline predetermined distance d of the lower surface distance circumference 3 of the protuberance 6b of Lift Part 6.
Then, as shown in (b) of Fig. 1, material storage frame 1 is declined, be positioned on the mould release membrance 9 that is adsorbed onto in X-Y table 8.In this process, first the lower surface of the protuberance 6b of the Lift Part 6 of the lower surface decline predetermined distance d of distance circumference 3 contacts with the upper surface of heat sink 10.In addition, by making material storage frame 1 decline, Lift Part 6 is subject to reaction from X-Y table 8 (heat sink 10) and peripherally the medial surface in portion 3 lifts.In addition, by making material storage frame 1 decline, the lower surface of circumference 3 is contacted with mould release membrance 9.In this condition, Lift Part 6 lifts from the lower surface of circumference 3 and the upper surface of mould release membrance 9 with predetermined distance d.Contacted with the upper surface of heat sink 10 by the lower surface of Lift Part 6, and the lower surface of circumference 3 contacts with mould release membrance 9, thus material storage frame 1 is positioned in X-Y table 8.
Under the state that material storage frame 1 is positioned in X-Y table 8, be configured with heat sink 10 in the inner side of the extended part 5 being installed on material storage frame 1.As aforementioned, extended part 5 is at least provided with two or more on the medial surface of circumference 3.By making the position of the front end of these extended parts 5 corresponding with the position of the periphery of heat sink 10, thus can bond-allocating in the heat sink 10 of the inner side of extended part 5.Therefore, in use, material delivery mechanism 7 transports in the process of heat sink 10, heat sink 10 can not moved in the horizontal direction by extended part 5.
Under the state that material storage frame 1 is positioned in X-Y table 8, the opening of the below of through hole 2 is blocked by material storage frame 1, mould release membrance 9 and heat sink 10.Thus, material storage frame 1, mould release membrance 9 and heat sink 10 are integrated, thus through hole 2 plays function as the resin material resettlement section 2A accommodating resin material.Specifically, the space surrounded on heat sink 10 and by Lift Part 6 is called resin material resettlement section 2A.
Then, as shown in (c) of Fig. 1, the resin material 11 of ormal weight is dropped into from resin material injection mechanism (not shown) to resin material resettlement section 2A.As resin material 11, the resin or resin aqueous at normal temperatures (fluid resin) etc. of graininess, powdery, granular, pasty state can be used.When using fluid resin, spray fluid resin by distributor mechanism to resin material resettlement section 2A.In the present embodiment, the situation using particulate resins (particulate resin) to be used as resin material 11 is described.
Then, as shown in (d) of Fig. 1, the absorption of X-Y table 8 pairs of mould release membrances 9 is removed.Afterwards, by using the adsorption tank 4 being arranged at material storage frame 1 to aspirate mould release membrance 9, thus mould release membrance 9 is adsorbed onto the lower surface of circumference 3.In this condition, material storage frame 1, mould release membrance 9, heat sink 10 and resin material 11 are integrated.So, the structural element that is integrated of material storage frame 1 and mould release membrance 9 as material feed mechanism 1A to play function.
Then, use material delivery mechanism 7, keep material feed mechanism 1A and the heat sink 10 be housed in material feed mechanism 1A and resin material 11 in the lump.Material delivery mechanism 7 is clamped material storage frame 1 by maintaining part 7a from horizontal and keep.In addition, make the maintaining part 7b being arranged at material delivery mechanism 7 increase, clamp the circumference of mould release membrance 9 by maintaining part 7a and maintaining part 7b and keep.By using material delivery mechanism 7, the tension force of direction effect toward the outside can be applied to mould release membrance 9.
Then, by material delivery mechanism 7, material feed mechanism 1A is lifted from X-Y table 8.By lifting material feed mechanism 1A, Lift Part 6, heat sink 10 and resin material 11 fall because of deadweight.In order to prevent Lift Part 6, heat sink 10 and resin material 11 from falling, applied the tension force of outward direction effect by material delivery mechanism 7 pairs of mould release membrances 9.The mould release membrance 9 of material delivery mechanism 7 to the hardness had to a certain degree applies tension force, Lift Part 6, heat sink 10 and resin material 11 can be made thus to remain on mould release membrance 9, and make it to fall.Therefore, heat sink 10 can not offset at the state upper/lower positions of the inner side being configured in extended part 5 on mould release membrance 9, can transport heat sink 10 and resin material 11 in the lump.
When heat sink 10 is comparatively light and resin material 11 is a small amount of, adsorbs mould release membrance 9 by means of only use adsorption hole 4, Lift Part 6, heat sink 10 and resin material 11 just can be made to remain on mould release membrance 9, and make it to fall.In this case, Lift Part 6, heat sink 10 and resin material 11 press downward the mould release membrance 9 of the lower surface being adsorbed onto circumference 3 because of their deadweight.Thus, tension force is applied to mould release membrance 9.
Resin material 11 is transported under the state keeping resin material 11 to be housed in space and the resin material resettlement section 2A surrounded on heat sink 10 and by Lift Part 6.Thereby, it is possible to cut off resin material 11 from resin material resettlement section 2A (circumference 3) movement toward the outer side by Lift Part 6.In other words, under the state that lower surface and the heat sink 10 of Lift Part 6 are close to, can prevent resin material 11 from entering between the lower surface of material storage frame 1 and the upper surface of mould release membrance 9.Therefore, it is possible to the resin material 11 transporting heat sink 10 by material delivery mechanism 7 with stable state and be housed in the 2A of resin material resettlement section, and resin material 11 is not made to be attached to the lower surface of material storage frame 1.
With reference to Fig. 2, be described to the structure of die cavity 13 and to the action that die cavity 13 supplies heat sink 10 and resin material 11.As shown in (a) of Fig. 2, in counterdie 12, be provided with the die cavity 13 of resin material 11 to be supplied, heat sink 10 and mould release membrance 9.Die cavity 13 is formed as slightly larger than resin material resettlement section 2A.Specifically, the preferred die cavity 13 protuberance 6b be formed as Lift Part 6 can be inserted into the size in die cavity 13.In other words, material storage frame 1 is formed in the protuberance 6b mode that can be inserted in die cavity 13 of Lift Part 6.Therefore, die cavity 13 and heat sink 10 are formed as almost identical size.
As shown in (a) of Fig. 2, the assigned position using material delivery mechanism 7 to make material feed mechanism 1A move to counterdie 12 stops.Because material delivery mechanism 7 is to the tension force keeping the mould release membrance 9 stopped to apply direction effect toward the outside, therefore Lift Part 6, heat sink 10 and resin material 11 can not fall.Therefore, heat sink 10 maintains the state be configured on mould release membrance 9 in the inner side of extended part 5.Then, material feed mechanism 1A is declined, and is positioned on the die joint of counterdie 12.In this condition, mould release membrance 9, heat sink 10 and resin material 11 are not yet supplied in die cavity 13.
Then, as shown in (b) of Fig. 2, after on die joint material feed mechanism 1A being positioned in counterdie 12, the absorption of adsorption tank 4 pairs of mould release membrances 10 of circumference 3 is removed.By being positioned on the die joint of counterdie 12 by material feed mechanism 1A, thus material feed mechanism 1A is subject to heat from the heater (not shown) being built in counterdie 12.Mould release membrance 9 softens because being subject to heat and stretches.Under the state that mould release membrance 9 is softening, adsorb mould release membrance 9 by the adsorption hole (not shown) being arranged at die cavity 13 and counterdie 12.Thus, mould release membrance 9 is adsorbed into corresponding with the shape of die cavity 13 and is not produced fold or sagging.
Be adsorbed in die cavity 13 by mould release membrance 9, thus while Lift Part 6 whereabouts, heat sink 10 and resin material 11 are fed in die cavity 13.Because mould release membrance 9, heat sink 10 and resin material 11 are supplied in die cavity 13 in the lump, therefore, it is possible to heat sink 10 is supplied in die cavity 13 effectively.Because heat sink 10 is formed as the size almost identical with die cavity 13, therefore substantially do not move after being supplied in die cavity 13.Because resin material 11 is fed in die cavity 13 together with Lift Part 6, therefore can not disperse to outside from resin material resettlement section 2A.Therefore, it is possible to the resin material 11 of heat sink 10 and ormal weight is stably supplied in die cavity 13.
Then, as shown in (c) of Fig. 2, after mould release membrance 9, heat sink 10 and resin material 11 are supplied in die cavity 13 in the lump, by material delivery mechanism 7, material storage frame 1 is lifted from counterdie 12.Because mould release membrance 9, heat sink 10 and resin material 11 are fed in die cavity 13, therefore only material storage frame 1 is kept by material delivery mechanism 7.In this condition, the lower surface decline predetermined distance d of the lower surface distance circumference 3 of the protuberance 6b of Lift Part 6.Thereby, it is possible to mould release membrance 9, heat sink 10 and resin material 11 are stably supplied to die cavity 13 from material feed mechanism 1A.
With reference to Fig. 3, the structure example of the shaping mould in resin encapsulation equipment and the action of resin-encapsulated are described.As shown in (a) of Fig. 3, in resin encapsulation equipment, patrix 14 is relatively set with counterdie 12.Patrix 14 and counterdie 12 form shaping mould.Be provided with in counterdie 12 for heating and the die cavity bottom part 15 of the molten resin 11A of melting by being pressed in die cavity 13.Patrix 14 is adsorbed or is fixed with by clip the encapsulation prebasal plate 17 of chip 16.Seal member 18 when the die is closed for being cut off from extraneous air by die cavity 13 is set between the die joint and the die joint of counterdie 12 of patrix 14.
First, as shown in (a) of Fig. 3, under the state of die sinking, by substrate feed mechanism (not shown), encapsulation prebasal plate 17 is transported to the assigned position of patrix 14, and is fixed on patrix 14.By material delivery mechanism 7 (with reference to Fig. 2), material feed mechanism 1A is transported to the assigned position of counterdie 12, and resin material 11, heat sink 10 and mould release membrance 9 are supplied in the lump are arranged in the die cavity 13 of counterdie 12.Molten resin 11A is generated by the heating resin material 11 be supplied in counterdie 12.
Then, as shown in (b) of Fig. 3, by clamping (not shown), matched moulds is carried out to patrix 14 and counterdie 12.By matched moulds, the chip 16 that encapsulation prebasal plate 17 is installed is immersed in the molten resin 11A in die cavity 13.By driving mechanism (not shown), die cavity bottom part 15 moved up molten resin 11A pressurizeed.Then, hardening resin 19 is formed by heating and melting resin 11A.In this condition, encapsulate the chip 16 that prebasal plate 17 is installed and pass through hardening resin 19 by resin-encapsulated.Heat sink 10 adheres on the surface (with the face of encapsulation prebasal plate 17 opposition side) of hardening resin 19 with the state exposed.After resin-encapsulated terminates, die sinking is carried out to patrix 14 and counterdie 12.After die sinking, taking out adhesion from the teeth outwards has the encapsulation metacoxal plate of heat sink 10.
In addition, preferably carrying out in the process of matched moulds to patrix 14 and counterdie 12, aspirating in the die cavity 13 cut off from extraneous air by using vacuum device (not shown) and reduce pressure.So, the bubble etc. comprised in residual in die cavity 13 air and molten resin 11A is discharged to the outside of shaping mould.
According to the present embodiment, the Lift Part 6 that the extended part 5 that the lower face side arranging peripherally portion 3 in material storage frame 1 is given prominence to towards inner side and peripherally portion 3 are elevated.Lift Part 6 falls because of deadweight, and contacts with extended part 5 and stop.By the constituent material feed mechanism 1A by material storage frame 1 and mould release membrance 9 integration.Apply tension force by material delivery mechanism 7 pairs of mould release membrances 9, even if make material delivery mechanism 7 lift material feed mechanism 1A, Lift Part 6 and heat sink 10 also can not fall.In addition, the position of the front end of extended part 5 is confirmed as corresponding with the position of the periphery of heat sink 10.By applying tension force to mould release membrance 9, can maintain in the inner side of extended part 5 state mould release membrance 9 being configured with heat sink 10, and not making Lift Part 6 and heat sink 10 fall.Therefore, the position of heat sink 10 can not offset, and can stably transport heat sink 10.
In addition, because the position of heat sink 10 can not offset, therefore, it is possible to transport resin material 11 under the state keeping resin material 11 to be housed in the 2A of resin material resettlement section on heat sink 10.Resin material 11 can be cut off from resin material resettlement section 2A (circumference 3) movement toward the outer side by Lift Part 6.Under the state that lower surface and the heat sink 10 of Lift Part 6 are close to, can prevent resin material 11 from entering between the lower surface of material storage frame 1 and the upper surface of mould release membrance 9.Therefore, it is possible to stably transported the resin material 11 be housed in the 2A of resin material resettlement section by material delivery mechanism 7, and resin material 11 is not made to be attached to the lower surface of material storage frame 1.
In addition, owing to can prevent resin material 11 from entering between the lower surface of material storage frame 1 and the upper surface of mould release membrance 9, therefore resin material 11 can not be attached to the lower surface of material storage frame 1.Therefore, the resin material 11 being attached to the lower surface of material storage frame 1 also can not be adhered as hardening thing in the after-hardening of heating and melting.Due to can not hardening thing be formed, be therefore easy to use such as brush etc. automatically to carry out the clean of material storage frame 1.Therefore, it is possible to cut down the time required for safeguarding, thus operability and the productivity ratio of resin encapsulation equipment can be improved.
In addition, according to the present embodiment, by material delivery mechanism 7, under the state that lower surface and the heat sink 10 of Lift Part 6 are close to, the resin material 11 put in the 2A of resin material resettlement section, heat sink 10 and mould release membrance 9 are supplied in die cavity 13 in the lump.Due to mould release membrance 9, heat sink 10 and resin material 11 are supplied in die cavity 13 in the lump, therefore, it is possible to heat sink 10 is supplied in die cavity 13 effectively.In addition, can prevent resin material 11 from dispersing to outside from resin material resettlement section 2A.Therefore, it is possible to be stably supplied in die cavity 13 by the resin material 11 of heat sink 10 and ormal weight, thus the quality of product can be improved.
In addition, according to the present embodiment, stopped the whereabouts of Lift Part 6 by the extended part 5 being arranged at material storage frame 1.Therefore, without the need to arranging the controlling organization etc. of the action for controlling Lift Part 6, resin material resettlement section 2A can be formed with very simple structure.Therefore, it is possible to make material feed mechanism 1A be simple structure, and by making the structure of resin encapsulation equipment also be simple, expense can be reduced.
(embodiment 2)
With reference to Fig. 4, the embodiment 2 of resin encapsulation equipment involved in the present invention is described.The substrate that resin encapsulation equipment 20 shown in Fig. 4 possesses respectively as structural element supplies and receives module 21, three forming modules 22A, 22B, 22C and material supplying module 23.Substrate as structural element supplies and receives module 21, forming module 22A, 22B, 22C and material supplying module 23 and can load and unload each other relative to each other structural element, and can change.Such as, to supply and under the state of receiving module 21 and forming module 22A being provided with substrate, can on forming module 22A installation forming module 22B, and on forming module 22B mounting material supplying module 23.
Supply at substrate and receive in module 21 and be provided with: encapsulation prebasal plate supply unit 24, supply encapsulation prebasal plate 17; Encapsulation metacoxal plate incorporating section 26, storage encapsulation metacoxal plate 25; Substrate-placing portion 27, for delivering encapsulation prebasal plate 17 and encapsulation metacoxal plate 25; With baseplate conveying mechanism 28, transport encapsulation prebasal plate 17 and encapsulation metacoxal plate 25.Substrate-placing portion 27 supplies at substrate and receives in module 21 and moves along Y-direction.Baseplate conveying mechanism 28 supplies at substrate and receives in module 21 and each forming module 22A, 22B, 22C and moves with Y-direction in X direction.Assigned position S1 is that baseplate conveying mechanism 28 is in idle state and standby position.
The patrix 14 (with reference to Fig. 3) being provided with the counterdie 12 that can be elevated and being oppositely disposed with counterdie 12 in each forming module 22A, 22B, 22C.Each forming module 22A, 22B, 22C have the clamping 29 (circular portion represented with double dot dash line) patrix 14 and counterdie 12 being carried out to matched moulds and die sinking.The die cavity 13 of mould release membrance 9 to be supplied, heat sink 10 and resin material 11 is arranged at counterdie 12.Counterdie 12 and patrix 14 can carry out matched moulds and die sinking by relative movement.
Be provided with in material supplying module 23: X-Y table 8; Mould release membrance feed mechanism 30, is supplied in X-Y table 8 by mould release membrance 9 (with reference to Fig. 1); Cleaning mechanism 31, cleaning material collecting frame 1; Material delivery mechanism 7, transports material storage frame 1 and material feed mechanism 1A; Resin material injection mechanism 32, drops into resin material 11 to resin material resettlement section 2A (with reference to Fig. 1); With heat sink feed mechanism 33, supply heat sink 10 (with reference to Fig. 1).X-Y table 8 moves with Y-direction in X direction in material supplying module 23.Material delivery mechanism 7 moves with Y-direction in X direction in material supplying module 23 and each forming module 22A, 22B, 22C.Assigned position M1 is that material delivery mechanism 7 is in idle state and standby position.
With reference to Fig. 4, the action using resin encapsulation equipment 20 to carry out resin-encapsulated is described.First, supply at substrate and receive in module 21, sending encapsulation prebasal plate 17 from encapsulation prebasal plate supply unit 24 to substrate-placing portion 27.Then, baseplate conveying mechanism 28 is made to move from assigned position S1 edge-Y-direction and receive encapsulation prebasal plate 17 from substrate-placing portion 27.Baseplate conveying mechanism 28 is turned back to assigned position S1.Then, such as, baseplate conveying mechanism 28 is made to move to assigned position P1 in forming module 22B along+X-direction.Then, in forming module 22B, baseplate conveying mechanism 28 is made to move along-Y-direction and make it stop at assigned position C1 on counterdie 12.Then, make baseplate conveying mechanism 28 move up and encapsulation prebasal plate 17 is fixed on patrix 14 (with reference to Fig. 3).Baseplate conveying mechanism 28 is turned back to substrate supply and receive the assigned position S1 in module 21.
Then, in material supplying module 23, by from mould release membrance feed mechanism 30, the mould release membrance 9 be supplied in X-Y table 8 cuts into prescribed level.Then, transport heat sink 10 by heat sink feed mechanism 33, and be positioned on the mould release membrance 9 that covers in X-Y table 8.Then, material delivery mechanism 7 is moved from assigned position M1 edge-Y-direction, thus receive the material storage frame 1 being cleaned medial surface by cleaning mechanism 31.Then, material delivery mechanism 7 is made to move along-Y-direction.In X-Y table 8, material storage frame 1 is positioned on mould release membrance 9, is configured in the inner side of the extended part 5 (with reference to Fig. 1) being arranged at material storage frame 1 to make the heat sink 10 be positioned on mould release membrance 9.Material delivery mechanism 7 is turned back to assigned position M1.Then, X-Y table 8 is made to move along+X-direction, thus make resin material resettlement section 2A stop at the assigned position of the below of resin material injection mechanism 32.Then, by making X-Y table 8 move with Y-direction in X direction, the resin material 11 of ormal weight is supplied from resin material injection mechanism 32 to resin material resettlement section 2A.X-Y table 8 is turned back to original position.
Then, material delivery mechanism 7 is moved from assigned position M1 edge-Y-direction, thus receive the material feed mechanism 1A (with reference to Fig. 1) be positioned in X-Y table 8.Material delivery mechanism 7 is turned back to assigned position M1.Then, material delivery mechanism 7 is made to move to the assigned position P1 of forming module 22B along-X-direction.Then, in forming module 22B, material delivery mechanism 7 is made to move along-Y-direction and make it stop at assigned position C1 on counterdie 12.Then, material delivery mechanism 7 is declined, thus resin material 11, heat sink 10 and mould release membrance 9 are supplied in die cavity 13.Material delivery mechanism 7 is turned back to assigned position M1.
Then, in forming module 22B, by clamping 29, counterdie 12 is moved up, with counterdie 12, matched moulds is carried out to patrix 14 (with reference to Fig. 3).In the stipulated time through afterwards, die sinking is carried out to patrix 14 and counterdie 12.Then, by making baseplate conveying mechanism 28 supply and the assigned position S1 receiving module 21 moves to the assigned position C1 counterdie 12 from substrate, the adhesive surface being received in the potting resin be made up of hardening resin 19 (with reference to Fig. 3) has the encapsulation metacoxal plate 25 of heat sink 10.Then, baseplate conveying mechanism 28 is moved, and deliver encapsulation metacoxal plate 25 to substrate-placing portion 27.Encapsulation metacoxal plate 25 is accommodated in encapsulation metacoxal plate incorporating section 26 from substrate-placing portion 27.So, resin-encapsulated is completed.
In the present embodiment, supply and receive between module 21 and material supplying module 23 at substrate, arrangement is provided with three forming modules 22A, 22B, 22C in X direction.Substrate can also be made to supply and receive module 21 and material supplying module 23 is a module, and arranging installation forming module 22A in X direction on that module.Thereby, it is possible to increase and decrease forming module 22A, 22B ...Therefore, it is possible to correspondingly make the structure optimization of resin molding apparatus 20 with the mode of production and output, thus the raising of productivity ratio can be realized.
In addition, in the present embodiment, the heat sink feed mechanism 33 of supply heat sink 10 is arranged in material supplying module 23.Be not limited thereto, the heat sink feed mechanism 33 of supply heat sink 10 can also be reset as heat sink supplying module, and not be arranged in material supplying module 23.In this case, heat sink supplying module is arranged between forming module 22C and material supplying module 23.Heat sink supplying module can also be separated from forming module 22C with material supplying module 23.Like this, just resin encapsulation equipment 20 can be formed by means of only adding heat sink supplying module in existing device.
In addition, in embodiments, be illustrated about the resin encapsulation equipment used when carrying out resin-encapsulated to semiconductor chip and resin encapsulation method.The object carrying out resin-encapsulated can be the semiconductor chip such as IC, transistor, also can be the chip of passive element.When utilizing hardening resin to carry out resin-encapsulated to the one or more chips be arranged on the substrates such as lead frame, printed base plate, ceramic substrate, applicable the present invention.Therefore, when manufacture multi-chip package, multi-chip module, Mixed LB films etc., also the present invention can be suitable for.
In embodiments, show the situation of the heat sink (fin) that undertaken cooling by the heat that sends of release semiconductor chip resin-encapsulated in the lump together with semiconductor chip.Be not limited thereto, can also will be used for cutting off electromagnetic wave that semiconductor chip sends or be used for dysgenic electromagnetic shielding plate (sealing plate) resin-encapsulated in the lump that suppresses the electromagnetic wave flown here from outside to bring.In this case, metallic plate and electroconductive resin plate etc. can be used to be used as plate-shaped member.
The present invention is not limited to above-mentioned each embodiment, without departing from the scope of spirit of the present invention, can as required, arbitrarily and proper combination and changing, or optionally adopt.
Description of reference numerals
1 material storage frame
1A material feed mechanism (feed mechanism)
2 through holes
2A resin material resettlement section (space)
3 circumferences
4 adsorption tanks (adsorbing mechanism)
5 extended parts
6 Lift Parts
6a, 6b protuberance
7 material delivery mechanisms
7a, 7b maintaining part
8X-Y workbench
9 mould release membrances
10 heat sinks (plate-shaped member)
11 resin materials
11A molten resin (resin material)
12 counterdies (shaping mould)
13 die cavities
14 patrixes (shaping mould)
15 die cavity bottom part
16 chips
17 encapsulation prebasal plates
18 seal members
19 hardening resins
20 resin encapsulation equipments
21 substrates supply and receive module
22A, 22B, 22C forming module
23 material supplying modules (supplying module)
24 encapsulation prebasal plate supply units
25 encapsulation metacoxal plates
26 encapsulation metacoxal plate incorporating sections
27 substrate-placing portions
28 baseplate conveying mechanisms
29 clampings
30 mould release membrance feed mechanisms
31 cleaning mechanisms
32 resin injection mechanisms (injection mechanism)
33 heat sink feed mechanisms
D predetermined distance
S1, P1, C1, M1 assigned position
Claims (12)
1. a resin encapsulation equipment, possesses: patrix; Counterdie, is oppositely arranged with described patrix; Die cavity, is arranged at described counterdie; Feed mechanism, to described die cavity supply resin material and plate-shaped member; And clamping, matched moulds is carried out to the shaping mould at least with described patrix and described counterdie,
The feature of described resin encapsulation equipment is to possess:
Material storage frame, be arranged at described feed mechanism and top view time there is through hole;
Adsorbing mechanism, is adsorbed onto the lower surface of described material storage frame by mould release membrance in the mode at least covering the lower surface of the described material storage frame comprising described through hole;
Lift Part, can be arranged at the medial surface of described material storage frame up and down;
Extended part, is arranged at the lower face side of described material storage frame and gives prominence to from the medial surface of described material storage frame; And
Injection mechanism, described Lift Part lower surface be configured at described extended part inner side and under being positioned in the state that the plate-shaped member on described mould release membrance contacts, described resin material is dropped in the space surrounded to the described Lift Part in the inner side by described material storage frame and described plate-shaped member
Under the state at least holding described mould release membrance, described plate-shaped member and described resin material in described material storage frame, described feed mechanism is transported to the top of described counterdie,
By stopping making described mould release membrance be adsorbed onto the lower surface of described material storage frame, thus described resin material, described plate-shaped member and described mould release membrance are supplied to described die cavity in the lump from described feed mechanism.
2. resin encapsulation equipment according to claim 1, is characterized in that,
By making the position of the front end of described extended part corresponding with the position of the periphery of described plate-shaped member, thus locate described plate-shaped member.
3. resin encapsulation equipment according to claim 2, is characterized in that,
Described plate-shaped member is heat sink or electromagnetic shielding plate.
4. resin encapsulation equipment according to claim 3, is characterized in that,
Described resin material is any one in granular, graininess, powdery, pasty state or resin aqueous at normal temperatures.
5. the resin encapsulation equipment according to any one of Claims 1 to 4, is characterized in that,
Possess further:
For supplying the supplying module of described plate-shaped member and described resin material to described feed mechanism; With
There is at least one forming module of described shaping mould and described clamping,
Described supplying module and a described forming module can load and unload,
A described forming module can load and unload relative to other forming module.
6. resin encapsulation equipment according to claim 5, is characterized in that,
Described supplying module is split into the resin material supplying module of plate-shaped member supplying module and the described resin material of supply supplying described plate-shaped member,
Described plate-shaped member supplying module and described resin material supplying module can load and unload.
7. a resin encapsulation method, comprising: the shaping mould using the counterdie at least having patrix and be oppositely arranged with described patrix, to the operation of the die cavity supply resin material and plate-shaped member that are arranged at described counterdie; And described shaping mould is carried out to the operation of matched moulds,
The feature of described resin encapsulation method is, comprising:
Mould release membrance loads the operation of described plate-shaped member;
Material storage frame during top view with through hole is configured in the operation on described mould release membrance;
The operation of described plate-shaped member is located by the extended part given prominence to from the medial surface of described material storage frame;
Described mould release membrance is made to be adsorbed onto the operation of the lower surface of described material storage frame;
Under the state that the lower surface of the Lift Part on the medial surface that can be arranged at described material storage frame up and down contacts with described plate-shaped member, drop into the operation of described resin material to the space that the described Lift Part in the inner side by described material storage frame and described plate-shaped member surround; And
The operation of the top of described counterdie is transported in the lump to material storage frame, described mould release membrance, described plate-shaped member and described resin material described in major general,
In the operation of described supply, by stopping making described mould release membrance be adsorbed onto the lower surface of described material storage frame, thus described resin material, described plate-shaped member and described mould release membrance are supplied in described die cavity in the lump.
8. resin encapsulation method according to claim 7, is characterized in that,
In the operation of described location, by making the position of the front end of described extended part corresponding with the position of the periphery of described plate-shaped member, thus locate described plate-shaped member.
9. resin encapsulation method according to claim 8, is characterized in that,
Described plate-shaped member is heat sink or electromagnetic shielding plate.
10. resin encapsulation method according to claim 9, is characterized in that,
Described resin material is any one in granular, graininess, powdery, pasty state or resin aqueous at normal temperatures.
11. resin encapsulation methods according to any one of claim 7 ~ 10, is characterized in that,
Comprise further:
Prepare the operation of the supplying module for supplying described plate-shaped member and described resin material; And
Prepare the operation with at least one forming module of described shaping mould and described clamping,
Described supplying module and a described forming module can load and unload,
A described forming module can load and unload relative to other forming module.
12. resin encapsulation methods according to claim 11, is characterized in that,
Described supplying module is split into the resin material supplying module of plate-shaped member supplying module and the described resin material of supply supplying described plate-shaped member,
Described plate-shaped member supplying module and described resin material supplying module can load and unload.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014118565A JP6298719B2 (en) | 2014-06-09 | 2014-06-09 | Resin sealing device and resin sealing method |
| JP2014-118565 | 2014-06-09 |
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| Publication Number | Publication Date |
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| CN105269744A true CN105269744A (en) | 2016-01-27 |
| CN105269744B CN105269744B (en) | 2018-04-20 |
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| CN201510250069.4A Active CN105269744B (en) | 2014-06-09 | 2015-05-15 | Resin encapsulation equipment and resin encapsulation method |
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| JP (1) | JP6298719B2 (en) |
| KR (1) | KR101659690B1 (en) |
| CN (1) | CN105269744B (en) |
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Also Published As
| Publication number | Publication date |
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| TW201546977A (en) | 2015-12-16 |
| KR101659690B1 (en) | 2016-09-26 |
| JP2015233039A (en) | 2015-12-24 |
| KR20150141153A (en) | 2015-12-17 |
| JP6298719B2 (en) | 2018-03-20 |
| CN105269744B (en) | 2018-04-20 |
| TWI570862B (en) | 2017-02-11 |
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