TW201546977A - Resin sealing apparatus and resin sealing method - Google Patents

Abstract

The present invention relates to a resin sealing apparatus and a resin sealing method. In the resin sealing apparatus, resin materials and heat radiating plates are stably supplied to a mold cavity. The materials receiving box has a through-hole; a perimeter portion formed around the through-hole; an adsorption trough provided on the lower surface of the perimeter portion; a projecting member installed on the lower surface of the perimeter portion and protruding towards the inside; and a lifting member to ascend or descend along the inner surface of the perimeter portion. A material supply mechanism is made by integrating the materials receiving box and a release film adsorbed to the lower surface of the perimeter portion. The material supply mechanism is lifted by a material transport mechanism. The front end position of the projecting member is defined to correspond to the location of an outer periphery of the heat radiating plate. Accordingly, the heat radiating plate is configured to locate at the inner side of the projecting member position without deviating on the release film, thus enabling the heat radiating plate and the resin material to be stably transported.

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing of a wafer-shaped electronic component (hereinafter referred to as "wafer" as appropriate) such as a transistor, an integrated circuit (IC), and a light emitting diode (LED). A resin sealing device and a resin sealing method used in the case.

In recent years, semiconductors have been increasingly developed into high performance, multi-functionality, and miniaturization, and the power consumed in semiconductor wafers has been increasing. In particular, in a semiconductor wafer such as a microprocessor or a power device, heat generation due to power consumption becomes a big problem. In order to promote the release of heat from the semiconductor wafer, an operation of sealing the heat sink together with the semiconductor wafer is performed.

When the plate-like member as the heat dissipation plate is resin-sealed together with the semiconductor wafer, it is necessary to prevent the heat dissipation plate from moving in the cavity during the resin sealing. When the heat sink moves while the resin is sealed, the characteristics of the product are unstable due to variations in the heat radiation effect. Therefore, it is important to make the heat sink not move by precisely aligning the heat sink into the cavity.

As a resin sealing and molding apparatus for an electronic component, there has been proposed a resin sealing molding apparatus (for example, refer to paragraph [0008] of Patent Document 1 and FIGS. 1 and 2): "A resin sealing and molding apparatus for an electronic component, at least a resin sealing molding mold for an electronic component composed of one mold and another mold, and a resin sealing cavity provided at least in one mold, by using a mold At the time of mold clamping, the heat-dissipating plate and the electronic component are package-molded by a fluid resin to form a molded article in which the heat dissipation plate is positioned in a penetrating state to one or a plurality of protrusions formed in the cavity.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-053509

However, in the resin sealing and molding apparatus disclosed in Patent Document 1, there is room for improvement as described below. As shown in FIG. 1 of Patent Document 1, in the cavity 3, the front end portion 18a of the gate 13 including the gate block 14 and the front end portion 18b of the ejector rod 10 are protruded from the level surface of the cavity 3. The front end portions (projecting portions) 18a, 18b are inserted into the through holes formed in the heat radiating plate 5, whereby the positioning of the cavity 3 and the heat radiating plate 5 is performed. Therefore, the heat dissipation plate 5 can be easily (simplified) and accurately positioned in the cavity 3 only by arranging the projections 18a and the other projections 18b in the cavity 3.

This positioning method requires two protrusions 18a and 18b to be formed in the cavity 3 in advance, and two through holes are formed in advance on the heat dissipation plate 5 so as to correspond to the two protrusions 18a and 18b. Therefore, the processing of the cavity 3 and the heat dissipation plate 5 is complicated, and the time required for processing increases. Therefore, there is room for improvement in the cost of making molds and heat sinks.

The present invention has been made to solve the above problems, and an object thereof is to provide a resin sealing device and a resin sealing method in which a plate member can be positioned using a simple material supply mechanism, and a resin material and a plate member can be stably supplied. Into the cavity.

In order to solve the above problems, the resin sealing device according to the present invention includes: an upper mold; a lower mold; opposite to the upper mold; a cavity provided to the lower mold; and a supply mechanism for supplying a resin material to the cavity And a plate member; and a clamping mechanism, having at least the The upper mold and the lower mold forming mold are clamped, and the method includes a material storage frame provided in the supply mechanism and having a through hole in a plan view, and an adsorption mechanism covering at least the through hole. The material receiving frame has a lower surface that adsorbs the release film to the lower surface of the material receiving frame; the lifting member is vertically disposed on the inner side surface of the material receiving frame; and the protruding member is disposed on the a lower surface side of the material receiving frame and protruding from an inner side surface of the material receiving frame; and an input mechanism disposed on the lower surface of the lifting member and disposed inside the protruding member and placed on the release film a state in which the upper plate member is in contact with the resin material in a space surrounded by the lifting member and the plate member in the inner side of the material housing frame; at least in the material housing frame In a state where the release film, the plate member, and the resin material are present, the supply mechanism is carried over the lower mold, and the release film is stopped from being adsorbed to the material. The lower surface, so that the resin material, the plate-like member and the release film fed from the feed mechanism together into the mold cavity.

The resin sealing device according to the present invention has a state in which the plate-shaped member is positioned by making the position of the tip end of the projecting member correspond to the position of the outer periphery of the plate-like member.

Further, the resin sealing device according to the present invention has a surface in which the plate member is a heat dissipation plate or an electromagnetic shielding plate.

Further, the resin sealing device according to the present invention has a state in which the resin material is in a granular form, a granular form, a powder form, a paste form or a liquid resin at a normal temperature. Any of them.

Further, the resin sealing device according to the present invention has the following aspect: further comprising: a supply module for supplying the plate member and the resin material to the supply mechanism; and having the forming die and the At least one forming module of the clamping mechanism; the supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules.

Further, the resin sealing device according to the present invention has the following aspect: the supply module is divided into a plate member supply module for supplying a plate member, and a resin material supply module for supplying the resin material, the plate The member supply module and the resin material supply module are detachable.

In order to solve the above problems, the resin sealing method according to the present invention includes: supplying a resin material and a plate to a cavity provided in the lower mold using a molding die having at least an upper mold and a lower mold disposed opposite to the upper mold And a step of clamping the forming mold, comprising: placing the plate member on the release film; and arranging the material receiving frame having the through hole in a plan view a step of the release film; a step of positioning the plate member by a projecting member protruding from an inner side surface of the material housing frame; and adsorbing the release film to a lower surface of the material containment frame a step of lowering the lifting member disposed on the inner side of the material receiving frame a step of feeding the resin material into a space surrounded by the elevating member and the plate member in an inner side of the material housing frame in a state of being in contact with the plate member; and at least the material a step of transporting the receiving frame, the release film, the plate member and the resin material to the upper portion of the lower mold; and in the step of supplying, stopping the adsorption film by stopping The resin material, the plate member, and the release film are collectively supplied into the cavity to the lower surface of the material receiving frame.

The resin sealing method according to the present invention has the following aspect: in the step of positioning, positioning the board by correspondingly positioning a position of a front end of the protruding member with a position of an outer circumference of the plate member Shaped member.

Further, the resin sealing method according to the present invention has a surface in which the plate member is a heat dissipation plate or an electromagnetic shielding plate.

Moreover, the resin sealing method according to the present invention has any one of the following: the resin material is any one of a granular, granular, powder, paste or liquid resin at normal temperature.

Further, the resin sealing method according to the present invention has the following aspects: further comprising: a step of preparing a supply module for supplying the plate member and the resin material; and preparing to have the forming die and the The step of at least one forming module of the clamping mechanism; the supply module and the one forming module are detachable, and the one forming module is detachable with respect to the other forming modules.

Further, the resin sealing method according to the present invention has the following aspects: The supply module is divided into a plate-shaped member supply module that supplies the plate-shaped member, and a resin material supply module that supplies the resin material, the plate-shaped member supply module and the resin material supply module Can be loaded and unloaded.

According to the present invention, the material housing frame having the through hole used in the resin sealing device is provided with an adsorption mechanism for adsorbing the release film to the lower surface of the material container frame, and the lifting member for lifting and lowering on the inner side surface of the material container frame. And an extension member that protrudes from the inner side of the material containment frame. The supply mechanism for supplying the resin material and the plate material is constituted by integrating the material container frame and the release film adsorbed to the lower surface of the material container frame. In a state where the lower surface of the elevating member is in contact with the plate-like member disposed inside the projecting member, the supply mechanism transports the resin material accommodated in the space surrounded by the elevating member and the plate member into the cavity. Thereby, in a state in which the plate-shaped member and the resin material are disposed on the release film on the inner side of the projecting member, the resin material, the plate-shaped member, and the release film can be collectively supplied into the cavity.

1‧‧‧Material containment frame

1A‧‧‧Material supply organization (supply organization)

2‧‧‧through holes

2A‧‧‧Resin material storage department (space)

3‧‧‧The Peripheral Department

4‧‧‧Adsorption tank (adsorption mechanism)

5‧‧‧Extension

6‧‧‧ Lifting members

6a, 6b‧‧‧ convex

7‧‧‧Material transport agency

7a, 7b‧‧‧ Keeping Department

8‧‧‧X-Y Workbench

9‧‧‧ release film

10‧‧‧Dissipation plate (plate member)

11‧‧‧Resin materials

11A‧‧‧ molten resin (resin material)

12‧‧‧Down mold (forming die)

13‧‧‧ cavity

14‧‧‧Upper mold (forming die)

15‧‧‧ cavity bottom member

16‧‧‧ wafer

17‧‧‧ Sealed front substrate

18‧‧‧ Sealing members

19‧‧‧ hardened resin

20‧‧‧Resin sealing device

21‧‧‧Substrate supply and storage module

22A, 22B, 22C‧‧‧ Forming modules

23‧‧‧Material supply module (supply module)

24‧‧‧ Sealed front substrate supply unit

25‧‧‧Sealed substrate

26‧‧‧Seaned substrate storage unit

27‧‧‧Substrate Placement Department

28‧‧‧Substrate transport agency

29‧‧‧Molding mechanism

30‧‧‧ Release film supply mechanism

31‧‧‧ Cleaning institutions

32‧‧‧Resin input organization (input organization)

33‧‧‧Dissipation plate supply mechanism

D‧‧‧established distance

S1, P1, C1, M1‧‧‧ established location

(a) to (d) of FIG. 1 are schematic cross-sectional views showing a process of accommodating a heat dissipation plate and a resin material in a material storage frame in the first embodiment of the resin sealing device according to the present invention.

2(a) to 2(c) are schematic cross-sectional views showing a process of supplying a heat dissipation plate and a resin material into a cavity using the material storage frame shown in Fig. 1.

(a) and (b) of FIG. 3 are schematic cross-sectional views showing a process of resin-sealing a wafer mounted on a substrate.

FIG. 4 is a plan view showing a schematic configuration of the apparatus in the second embodiment of the resin sealing device according to the present invention.

As shown in FIG. 1, the material accommodation frame 1 is provided with a through hole 2 having an opening along the upper and lower sides, a peripheral edge portion 3 formed around the through hole 2, and an adsorption groove 4 provided on the lower surface of the peripheral edge portion 3; The output member 5 is attached to the lower surface side of the peripheral edge portion 3 and protrudes inward; and the elevating member 6 moves up and down along the inner side surface of the peripheral edge portion 3. A release film 9 is adsorbed on the lower surface of the peripheral portion 3. The material supply mechanism 1A is configured by integrating the material container frame 1 and the release film 9 adsorbed to the lower surface of the peripheral edge portion 3. The material supply mechanism 1A is lifted by the material transport mechanism 7. The position of the front end of the projecting member 5 is determined to correspond to the position of the outer circumference of the heat dissipation plate 10. Therefore, the position of the heat dissipation plate 10 in the state of being disposed inside the extension member 5 is not shifted on the release film 9, and the heat dissipation plate 10 and the resin material 11 can be stably conveyed.

(Example 1)

The material container frame 1 used in the first embodiment of the resin sealing device according to the present invention will be described with reference to Figs. 1 to 3 . Any of the figures in the present application is appropriately omitted or exaggerated for ease of understanding to be schematically drawn. The same reference numerals are used for the same components, and the description is omitted as appropriate.

The material container frame 1 included in the resin sealing device shown in FIG. 1 includes a through hole 2 having an opening along the upper and lower sides, a peripheral edge portion 3 formed around the through hole 2, and an adsorption groove 4 provided under the peripheral edge portion 3. The projecting member 5 is attached to the lower surface side of the peripheral edge portion 3 and protrudes inward; and the elevating member 6 is raised and lowered along the inner side surface of the peripheral edge portion 3. The material transport mechanism 7 is a transport mechanism that holds and moves the material storage frame 1. The material transport mechanism 7 moves the material containing frame 1 above the X-Y table 8. The release film 9 is covered on the X-Y table 8. Release A heat dissipation plate (heat sink) 10 as a plate-like member housed in the material housing frame 1 is placed on the film 9 for example.

In the material container frame 1, the elevation member 6 is formed in an inverted L shape, and has a convex portion 6a extending in the horizontal direction and a convex portion 6b extending in the vertical direction. The elevating member 6 is dropped by its own weight, and is stopped by the lower surface of the convex portion 6a of the elevating member 6 coming into contact with the upper surface of the projecting member 5. The projecting member 5 attached to the lower surface side of the peripheral portion 3 functions as a stopper that prevents the elevating member 6 from falling due to its own weight. In a state where the elevating member 6 is stopped, the lower surface of the convex portion 6b of the elevating member 6 is located below the lower surface of the peripheral edge portion 3 at a predetermined distance d. The predetermined distance d is set to about 0.5 mm to 2 mm depending on the amount of resin supplied and the hardness of the release film.

The projecting member 5 is provided to be able to adjust the distance L between the opposing projecting members 5 in the horizontal direction. The projecting member 5 is attached to at least two or more sides on the inner side surface of the peripheral edge portion 3. The position of the front end of these projecting members 5 is made to correspond to the position of the outer periphery of the heat radiating plate 10. Specifically, the position of the tip end of the extension member 5 is a position at which a minute gap is separated from the position of the maximum outer circumference of the heat dissipation plate 10 in consideration of dimensional accuracy. Further, it is preferable that the inner side surface in the vicinity of the lower surface of the projecting member 5 is a tapered surface that retreats toward the outer side (toward the peripheral edge portion 3) as it approaches the lower surface. Thereby, the positioning of the heat dissipation plate 10 disposed inside the extension member 5 can be performed. The shape of the projecting member 5 may also be an annular shape along an opening below the through hole 2.

The peripheral portion 3 is formed of, for example, a metal that is easily processed such as aluminum. The elevating member 6 is preferably formed of a wear-resistant metal material such as stainless steel or chrome steel, or a ceramic material or the like so that the bottom surface of the convex portion 6b is not worn. The elevating member 5 is also preferably formed of a wear-resistant metal material such as stainless steel or chrome steel, or a ceramic material or the like so that the upper surface and the side surface are not accelerated. Further, synthetic rubber may be embedded in the lower surface side of the peripheral portion 3, and the adsorption groove 4 may be formed on the synthetic rubber. By burying When the synthetic rubber is incorporated, the adhesion of the lower surface of the peripheral portion 3 can be improved. As the synthetic rubber, a ruthenium rubber or a fluororubber having heat resistance is preferably used.

As shown in Fig. 1(a), the material transport mechanism 7 has a holding portion 7a that sandwiches and holds the material container frame 1 from the lateral direction, and a holding portion 7b that is connected to the holding portion 7a and can be moved up and down. As will be described later, the holding portion 7a and the holding portion 7b provided in the material conveying mechanism 7 can hold and hold the peripheral portion of the release film that is adsorbed to the lower surface of the peripheral edge portion 3 from above and below. When the material container frame 1 is moved by the material transport mechanism 7, the lower surface of the convex portion 6a of the elevating member 6 comes into contact with the upper surface of the projecting member 5, whereby the elevating member 6 is stopped.

The operation of housing the heat dissipation plate 10 and the resin material 11 by using the material housing frame 1 will be described with reference to (a) to (d) of FIG. 1 . As shown in Fig. 1(a), first, the long release film 9 supplied from a release film supply mechanism (not shown) is placed on the X-Y table 8, so that wrinkles or slack are not generated. As the release film 9, it is preferable to use a release film 9 having a certain degree of hardness to apply tension. After the release film 9 is covered, the release film 9 is adsorbed onto the X-Y table 8 by an adsorption mechanism (not shown). The release film 9 is cut to retain only the necessary portion of the release film 9 after adsorption. In (a) of FIG. 1, the release film 9 is cut to be slightly larger than the X-Y table 8.

Next, the heat dissipation plate 10 is placed at a predetermined position on the release film 9. As the heat sink 10, for example, a material having high thermal conductivity such as copper or aluminum is used. Next, using the material transport mechanism 7, the material containing frame 1 is moved to the upper side of the X-Y table 8 and stopped. While the material holding frame 1 is being moved and stopped, the lower surface of the convex portion 6a of the elevating member 6 is in contact with the upper surface of the projecting member 5, and the elevating member 6 is in a stopped state. The lower surface of the convex portion 6b of the elevating member 6 is lowered by a predetermined distance d from the lower surface of the peripheral edge portion 3.

Next, as shown in FIG. 1(b), the material containing frame 1 is lowered and placed on Adsorbed onto the release film 9 on the X-Y table 8. In this process, the lower surface of the convex portion 6b of the elevating member 6 which is lowered by a predetermined distance d from the lower surface of the peripheral portion 3 is first brought into contact with the upper surface of the heat radiating plate 10. Further, by lowering the material containing frame 1, the elevating member 6 is lifted from the inner side surface of the peripheral edge portion 3 by the reaction from the X-Y table 8 (heat radiating plate 10). Further, the lower surface of the peripheral edge portion 3 is brought into contact with the release film 9 by lowering the material containing frame 1. In this state, the elevating member 6 is lifted from the lower surface of the peripheral edge portion 3, that is, the upper surface of the release film 9, at a predetermined distance d. The lower surface of the elevating member 6 is in contact with the upper surface of the heat radiating plate 10, and the lower surface of the peripheral portion 3 is in contact with the release film 9, so that the material containing frame 1 is placed on the X-Y table 8.

In a state where the material container frame 1 is placed on the X-Y table 8, the heat dissipation plate 10 is disposed inside the extension member 5 attached to the material container frame 1. As described above, the projecting member 5 is attached to at least two or more sides on the inner side surface of the peripheral edge portion 3. The position of the front end of the projecting member 5 is made to correspond to the position of the outer periphery of the heat radiating plate 10, whereby the heat radiating plate 10 disposed inside the extending member 5 can be positioned. Therefore, in the process of transporting the heat dissipation plate 10 using the material transport mechanism 7, the heat dissipation plate 10 can be prevented from moving in the horizontal direction by the projecting member 5.

In a state where the material container frame 1 is placed on the X-Y table 8, the opening below the through hole 2 is closed by the material container frame 1, the release film 9, and the heat dissipation plate 10. Thereby, the material container frame 1, the release film 9 and the heat dissipation plate 10 are integrated, and the through hole 2 functions as the resin material storage portion 2A that houses the resin material. Specifically, a space surrounded by the elevation member 6 on the heat dissipation plate 10 is referred to as a resin material storage portion 2A.

Then, as shown in FIG. 1( c ), a predetermined amount of the resin material 11 is introduced into the resin material accommodating portion 2A from a resin material feeding mechanism (not shown). As the resin material 11, a granular, powdery, granular, paste-like resin or a liquid resin (liquid resin) at normal temperature can be used. Wait. When the liquid resin is used, the liquid resin is discharged to the resin material accommodating portion 2A by the dispenser. In the present embodiment, a case where a particulate resin (particle resin) is used as the resin material 11 will be described.

Next, as shown in FIG. 1(d), the adsorption of the release film 9 by the X-Y table 8 is released. Thereafter, the release film 9 is sucked by the adsorption groove 4 provided in the material container frame 1 to adsorb the release film 9 to the lower surface of the peripheral portion 3. In this state, the material containing frame 1, the release film 9, the heat radiating plate 10, and the resin material 11 are integrated. In this way, the constituent elements in which the material containing frame 1 and the release film 9 are integrated are functioning as the material supply mechanism 1A.

Next, the material supply mechanism 1 is used to hold the material supply mechanism 1A and the heat dissipation plate 10 and the resin material 11 housed in the material supply mechanism 1A. The material transport mechanism 7 holds and holds the material containing frame 1 from the lateral direction by the holding portion 7a. Moreover, the holding portion 7b provided in the material conveying mechanism 7 is raised, and the holding portion 7a and the holding portion 7b sandwich the peripheral portion of the release film 9 and hold it. The tension acting in the outward direction can be applied to the release film 9 by using the material conveying mechanism 7.

Next, the material supply mechanism 1A is lifted from the X-Y table 8 by the material transport mechanism 7. By lifting the material supply mechanism 1A, the elevating member 6, the heat dissipation plate 10, and the resin material 11 fall due to their own weight. In order to prevent the elevating member 6, the heat radiating plate 10, and the resin material 11 from falling, the material conveying mechanism 7 applies a tension acting outward in the release film 9. The material conveying mechanism 7 applies tension to the release film 9 having a certain degree of hardness, whereby the lifting member 6, the heat dissipation plate 10, and the resin material 11 can be held on the release film 9 without falling. Therefore, the position of the heat dissipation plate 10 in the state of being disposed inside the extension member 5 is not shifted on the release film 9, and the heat dissipation plate 10 and the resin material 11 can be collectively transported.

When the heat dissipation plate 10 is light and the resin material 11 is small, the lift member 6, the heat dissipation plate 10, and the resin material 11 can be held on the release film 9 only by using the adsorption holes 4 to adsorb the release film 9. Make it not fall. In this case, the elevating member 6, the heat radiating plate 10, and the resin material 11 are pressed downward by the release film 9 adsorbed to the lower surface of the peripheral edge portion 3 by their own weight. Thereby, tension is applied to the release film 9.

The resin material 11 is conveyed in a state in which the resin material accommodating portion 2A which is a space surrounded by the elevating member 6 and which is accommodated in the heat dissipating plate 10 is held. Thereby, the resin material 11 can be cut from the resin material accommodating portion 2A toward the outside (the peripheral edge portion 3) by the elevating member 6. In other words, in a state where the lower surface of the elevating member 6 is in close contact with the heat radiating plate 10, the resin material 11 can be prevented from entering between the lower surface of the material containing frame 1 and the upper surface of the release film 9. Therefore, the heat transfer plate 10 and the resin material 11 accommodated in the resin material accommodating portion 2A can be transported in a stable state by the material transport mechanism 7, without the resin material 11 adhering to the lower surface of the material containing frame 1.

The structure of the cavity 13 and the operation of supplying the heat dissipation plate 10 and the resin material 11 to the cavity 13 will be described with reference to Fig. 2 . As shown in (a) of FIG. 2, a cavity 13 to which the resin material 11, the heat dissipation plate 10, and the release film 9 are to be supplied is provided in the lower mold 12. The cavity 13 is formed to be slightly larger than the resin material housing portion 2A. Specifically, it is preferable that the cavity 13 is formed in a size such that the convex portion 6b of the elevating member 6 can be inserted into the cavity 13. In other words, the material accommodation frame 1 is formed such that the convex portion 6b of the elevation member 6 can be inserted into the cavity 13. Therefore, the cavity 13 and the heat dissipation plate 10 are formed to be almost the same size.

As shown in FIG. 2(a), the material supply mechanism 7 is used to move the material supply mechanism 1A to a predetermined position of the lower mold 12 and stop. Since the material transport mechanism 7 is on hold The release film 9 is applied with a tension acting in the outward direction, so that the elevation member 6, the heat dissipation plate 10, and the resin material 11 do not fall. Therefore, the heat radiating plate 10 maintains the state of being disposed on the release film 9 inside the projecting member 5. Next, the material supply mechanism 1A is lowered and placed on the parting surface of the lower mold 12. In this state, the release film 9, the heat dissipation plate 10, and the resin material 11 are not supplied into the cavity 13.

Next, as shown in FIG. 2(b), after the material supply mechanism 1A is placed on the parting surface of the lower mold 12, the adsorption of the release film 10 by the adsorption groove 4 of the peripheral portion 3 is released. By placing the material supply mechanism 1A on the parting surface of the lower mold 12, the material supply mechanism 1A receives heat from a heater (not shown) built in the lower mold 12. The release film 9 softens and stretches due to heat. The release film 9 is adsorbed by an adsorption hole (not shown) provided in the cavity 13 and the lower mold 12 in a state where the release film 9 is softened. Thereby, the release film 9 is adsorbed so as to correspond to the shape of the cavity 13 without wrinkles or sagging.

The release film 9 is sucked into the cavity 13 so that the elevation member 6 falls while the heat dissipation plate 10 and the resin material 11 are supplied into the cavity 13. Since the release film 9, the heat dissipation plate 10, and the resin material 11 are collectively supplied into the cavity 13, the heat dissipation plate 10 can be reliably supplied into the cavity 13. Since the heat dissipation plate 10 is formed to have almost the same size as the cavity 13, it does not substantially move after being supplied into the cavity 13. Since the resin material 11 is supplied into the cavity 13 together with the elevating member 6, it does not scatter from the resin material accommodating portion 2A to the outside. Therefore, the heat dissipation plate 10 and the predetermined amount of the resin material 11 can be stably supplied into the cavity 13.

Next, as shown in FIG. 2(c), after the release film 9, the heat dissipation plate 10, and the resin material 11 are collectively supplied into the cavity 13, the material receiving frame 1 is removed from the lower mold by the material conveying mechanism 7. 12 lifted up. Since the release film 9, the heat dissipation plate 10, and the resin material 11 are supplied to the cavity 13 Therefore, only the material containing frame 1 is held by the material transport mechanism 7. In this state, the lower surface of the convex portion 6b of the elevating member 6 is lowered by a predetermined distance d from the lower surface of the peripheral portion 3. Thereby, the release film 9, the heat dissipation plate 10, and the resin material 11 can be stably supplied from the material supply mechanism 1A into the cavity 13.

The configuration example of the molding die and the operation of the resin sealing in the resin sealing device will be described with reference to Fig. 3 . As shown in FIG. 3(a), in the resin sealing device, the upper mold 14 is provided opposite to the lower mold 12. The upper mold 14 and the lower mold 12 constitute a forming mold. The lower mold 12 is provided with a cavity bottom member 15 for pressing the molten resin 11A heated and melted in the cavity 13. A sealed front substrate 17 on which the wafer 16 is mounted is attached to the upper mold 14 or fixed by a clip. A sealing member 18 for cutting the cavity 13 from the outside air at the time of mold clamping is provided between the parting surface of the upper mold 14 and the parting surface of the lower mold 12.

First, as shown in FIG. 3(a), in a state where the mold is opened, the sealed front substrate 17 is transported to a predetermined position of the upper mold 14 by a substrate supply mechanism (not shown), and is fixed to the upper mold 14. . The material supply mechanism 1A is transported to a predetermined position of the lower mold 12 by the material transport mechanism 7 (refer to FIG. 2), and the resin material 11, the heat dissipation plate 10, and the release film 9 are collectively supplied to the type set to the lower mold 12. In the cavity 13. The molten resin 11A is produced by heating the resin material 11 supplied to the lower mold 12.

Next, as shown in FIG. 3(b), the upper mold 14 and the lower mold 12 are clamped by a mold clamping mechanism (not shown). The wafer 16 mounted on the sealing front substrate 17 is immersed in the molten resin 11A in the cavity 13 by mold clamping. The cavity bottom member 15 is moved upward by a drive mechanism (not shown) to pressurize the molten resin 11A. Next, the cured resin 19 is formed by heating the molten resin 11A. In this state, the wafer 16 mounted on the front substrate 17 is sealed. The hardened resin 19 is sealed with a resin. The heat sink 10 is adhered to the surface of the hardened resin 19 (the surface opposite to the front substrate 17 before sealing) in an exposed state. After the resin sealing is completed, the upper mold 14 and the lower mold 12 are opened. After the mold is opened, the sealed substrate on which the heat dissipation plate 10 is adhered is taken out.

Further, in the process of clamping the upper mold 14 and the lower mold 12, it is preferable to suction the inside of the cavity 13 cut from the outside air by using a vacuuming mechanism (not shown) to reduce the pressure. In this manner, the air remaining in the cavity 13 and the air bubbles and the like contained in the molten resin 11A are discharged to the outside of the molding die.

According to the present embodiment, the material housing frame 1 is provided with the projecting member 5 that protrudes inward along the lower surface side of the peripheral edge portion 3 and the elevating member 6 that ascends and descends along the peripheral edge portion 3. The elevating member 6 falls due to its own weight and stops in contact with the projecting member 5. The material supply mechanism 1A is configured by integrating the material container frame 1 and the release film 9. The tension is applied to the release film 9 by the material conveying mechanism 7, so that even if the material conveying mechanism 7 lifts the material supply mechanism 1A, the lifting member 6 and the heat dissipation plate 10 do not fall. Further, the position of the front end of the projecting member 5 is determined to correspond to the position of the outer circumference of the heat dissipation plate 10. By applying tension to the release film 9, the state in which the heat dissipation plate 10 is disposed on the release film 9 can be maintained inside the extension member 5 without dropping the elevation member 6 and the heat dissipation plate 10. Therefore, the position of the heat dissipation plate 10 is not shifted, and the heat dissipation plate 10 can be stably conveyed.

Further, since the position of the heat dissipation plate 10 is not shifted, the resin material 11 can be conveyed while the resin material 11 is held in the heat dissipation plate 10 in the resin material storage portion 2A. The resin material 11 can be cut by the elevating member 6 and moved from the resin material accommodating portion 2A toward the outside (the peripheral portion 3). In a state where the lower surface of the elevating member 6 is in close contact with the heat dissipation plate 10, the resin material 11 can be prevented from entering the lower surface of the material containing frame 1 and the upper surface of the release film 9. between. Therefore, the resin material 11 accommodated in the resin material accommodating portion 2A can be stably conveyed by the material transport mechanism 7 without adhering the resin material 11 to the lower surface of the material containing frame 1.

Further, since the resin material 11 can be prevented from entering between the lower surface of the material containing frame 1 and the upper surface of the release film 9, the resin material 11 does not adhere to the lower surface of the material containing frame 1. Therefore, the resin material 11 adhering to the lower surface of the material containing frame 1 is not hardened after being heated and melted, and is adhered as a cured product. Since the hardened material is not formed, it is easy to automatically clean the material containing frame 1 using, for example, a brush or the like. Therefore, the time required for maintenance can be reduced, and the operability and productivity of the resin sealing device can be improved.

Further, according to the present embodiment, the resin material 11, the heat sink 10, and the resin material 11 are placed in the resin material accommodating portion 2A in a state where the lower surface of the elevating member 6 is in close contact with the heat dissipating plate 10 by the material transporting mechanism 7. The film 9 is supplied into the cavity 13 at the same time. Since the release film 9, the heat dissipation plate 10, and the resin material 11 are collectively supplied into the cavity 13, the heat dissipation plate 10 can be reliably supplied into the cavity 13. In addition, it is possible to prevent the resin material 11 from scattering from the resin material accommodating portion 2A to the outside. Therefore, the heat dissipation plate 10 and the predetermined amount of the resin material 11 can be stably supplied into the cavity 13, so that the quality of the product can be improved.

Further, according to the present embodiment, the falling of the elevating member 6 is stopped by the projecting member 5 provided to the material containing frame 1. Therefore, it is not necessary to provide a control mechanism or the like for controlling the operation of the elevating member 6, and the resin material accommodating portion 2A can be formed with a very simple structure. Therefore, the material supply mechanism 1A can be made to have a simple structure, and the cost can be reduced by making the structure of the resin sealing device simple.

(Example 2)

A second embodiment of the resin sealing device according to the present invention will be described with reference to Fig. 4 . The resin sealing device 20 shown in FIG. 4 includes a substrate supply and storage module 21 as a component, three molding modules 22A, 22B, and 22C, and a material supply module 23. The substrate supply and storage module 21 as a component element, the molding modules 22A, 22B, and 22C and the material supply module 23 can be detachably attached to each other with respect to each of the other components, and can be replaced. For example, in a state in which the substrate supply and storage module 21 and the molding module 22A are mounted, the molding module 22B can be attached to the molding module 22A, and the material supply module 23 can be attached to the molding module 22B.

The substrate supply and storage module 21 is provided with a pre-sealed substrate supply unit 24 for supplying the pre-sealed substrate 17, a sealed substrate storage unit 26 for accommodating the sealed substrate 25, and a substrate mounting portion 27 for transferring the pre-sealed substrate. 17 and the sealed substrate 25; and the substrate transport mechanism 28, transporting the sealed front substrate 17 and the sealed rear substrate 25. The substrate mounting portion 27 moves in the Y direction in the substrate supply and storage module 21. The substrate transport mechanism 28 moves in the X direction and the Y direction in the substrate supply and storage module 21 and each of the molding modules 22A, 22B, and 22C. The predetermined position S1 is a position in which the substrate conveyance mechanism 28 is in an inoperative state and is in a standby state.

Each of the molding modules 22A, 22B, and 22C is provided with a lower mold 12 that can be raised and lowered and an upper mold 14 that is disposed to face the lower mold 12 (see FIG. 3). Each of the forming modules 22A, 22B, and 22C has a mold clamping mechanism 29 (a circular portion indicated by a chain double-dashed line) for clamping and opening the upper mold 14 and the lower mold 12. The cavity 13 to which the release film 9, the heat dissipation plate 10, and the resin material 11 are to be supplied is disposed in the lower mold 12. The lower mold 12 and the upper mold 14 can be closed and opened by relative movement.

The material supply module 23 is provided with: an XY table 8; a release film supply mechanism 30, the release film 9 (see Fig. 1) is supplied to the XY table 8; a cleaning mechanism 31, a cleaning material container frame 1; Material transport mechanism 7, transport material containment frame 1 and material supply mechanism 1A; The resin material feeding mechanism 32 supplies the resin material 11 to the resin material accommodating portion 2A (see FIG. 1), and the heat sink supply mechanism 33, and supplies the heat radiating plate 10 (see FIG. 1). The X-Y table 8 moves in the X direction and the Y direction in the material supply module 23. The material transport mechanism 7 moves in the X direction and the Y direction in the material supply module 23 and each of the forming modules 22A, 22B, and 22C. The predetermined position M1 is a position in which the material transport mechanism 7 is in an inoperative state and is in a standby state.

The operation of resin sealing using the resin sealing device 20 will be described with reference to Fig. 4 . First, in the substrate supply and storage module 21, the pre-sealing substrate 17 is sent out from the pre-sealing substrate supply unit 24 to the substrate placement unit 27. Next, the substrate transport mechanism 28 is moved in the -Y direction from the predetermined position S1, and the pre-sealed substrate 17 is received from the substrate mounting portion 27. The substrate transport mechanism 28 is returned to the predetermined position S1. Next, for example, the substrate transport mechanism 28 is moved in the +X direction to a predetermined position P1 in the forming module 22B. Next, in the molding module 22B, the substrate conveyance mechanism 28 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 12. Next, the substrate transport mechanism 28 is moved upward to fix the sealed front substrate 17 to the upper mold 14 (see FIG. 3). The substrate transport mechanism 28 is returned to the substrate supply and accommodates a predetermined position S1 in the module 21.

Next, in the material supply module 23, the release film 9 supplied from the release film supply mechanism 30 to the X-Y table 8 is cut into a predetermined size. Next, the heat dissipation plate 10 is carried by the heat sink supply mechanism 33, and placed on the release film 9 covering the X-Y table 8. Next, the material conveying mechanism 7 is moved in the -Y direction from the predetermined position M1, thereby receiving the material containing frame 1 for cleaning the inner side surface by the cleaning mechanism 31. Next, the material conveying mechanism 7 is moved in the -Y direction. In the XY table 8, the material container frame 1 is placed on the release film 9 so that the heat dissipation plate 10 placed on the release film 9 is placed on the extension member 5 provided in the material container frame 1 (refer to The inside of Figure 1). The material transport mechanism 7 is returned to the predetermined position M1. Next, make the X-Y table 8 along +X When the direction moves, the resin material accommodating portion 2A is stopped at a predetermined position below the resin material input mechanism 32. Then, by moving the X-Y table 8 in the X direction and the Y direction, a predetermined amount of the resin material 11 is supplied from the resin material feeding mechanism 32 to the resin material accommodating portion 2A. Return the X-Y table 8 to its original position.

Next, the material conveying mechanism 7 is moved in the -Y direction from the predetermined position M1 to receive the material supply mechanism 1A (see FIG. 1) placed on the X-Y table 8. The material transport mechanism 7 is returned to the predetermined position M1. Next, the material conveying mechanism 7 is moved in the -X direction to the predetermined position P1 of the forming module 22B. Next, in the forming module 22B, the material conveying mechanism 7 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 12. Next, the material conveying mechanism 7 is lowered, whereby the resin material 11, the heat dissipation plate 10, and the release film 9 are supplied into the cavity 13. The material transport mechanism 7 is returned to the predetermined position M1.

Next, in the forming module 22B, the lower mold 12 is moved upward by the mold clamping mechanism 29 to mold the upper mold 14 (see FIG. 3) and the lower mold 12. After the lapse of the predetermined time, the upper mold 14 and the lower mold 12 are opened. Then, the substrate transport mechanism 28 is moved from the predetermined position S1 at which the substrate 21 is supplied and stored in the module 21 to the predetermined position C1 on the lower mold 12, and the surface of the encapsulating resin composed of the cured resin 19 (see FIG. 3) is received. The sealed rear substrate 25 with the heat dissipation plate 10 adhered thereto. Next, the substrate transport mechanism 28 is moved, and the sealed substrate 25 is transferred to the substrate mounting portion 27. The sealed substrate 25 is housed in the sealed substrate receiving portion 26 from the substrate placing portion 27 . In this way, the resin seal is completed.

In the present embodiment, three molding modules 22A, 22B, and 22C are arranged in the X direction between the substrate supply and storage module 21 and the material supply module 23. The substrate supply and storage module 21 and the material supply module 23 can also be a module, and the module is along the X. A forming module 22A is mounted in the direction of alignment. Thereby, the molding modules 22A, 22B, ... can be increased or decreased. Therefore, the structure of the resin molding apparatus 20 can be optimized in accordance with the production method and the production amount, and the productivity can be improved.

Further, in the present embodiment, the heat sink supply mechanism 33 that supplies the heat dissipation plate 10 is disposed in the material supply module 23. Not limited to this, the heat sink supply mechanism 33 that supplies the heat sink 10 may be newly provided as a heat sink supply module, and is not provided in the material supply module 23. In this case, the heat sink supply module is mounted between the forming module 22C and the material supply module 23. The heat sink supply module can also be separated from the forming module 22C and the material supply module 23. Thus, the resin sealing device 20 can be configured only by adding a heat sink supply module to a conventional device.

Further, in each of the embodiments, a resin sealing device and a resin sealing method used for resin sealing a semiconductor wafer have been described. The resin-sealed article may be a semiconductor wafer such as an IC or a transistor, or may be a passive component wafer. The present invention can be applied to resin sealing of one or a plurality of wafers mounted on a substrate such as a lead frame, a printed substrate, or a ceramic substrate by a curing resin. Therefore, the present invention can also be applied to the manufacture of a multi-chip package, a multi-chip module, a hybrid IC or the like.

In each of the embodiments, a case where a heat dissipation plate (heat sink) that is cooled by releasing heat generated by a semiconductor wafer is collectively sealed with a semiconductor wafer is shown. Not limited to this, it is also possible to collectively seal the electromagnetic shielding plate (sealing plate) for cutting off electromagnetic waves emitted from the semiconductor wafer or for suppressing adverse effects caused by electromagnetic waves flying from the outside. In this case, a metal plate, a conductive resin plate, or the like can be used as the plate member.

The present invention is not limited to the above embodiments, without departing from the gist of the present invention. Within the scope of the invention, it may be changed as needed or arbitrarily and appropriately combined, or may be selectively employed.

1‧‧‧Material containment frame

1A‧‧‧Material supply organization (supply organization)

2‧‧‧through holes

2A‧‧‧Resin material storage department (space)

3‧‧‧The Peripheral Department

4‧‧‧Adsorption tank (adsorption mechanism)

5‧‧‧Extension

6‧‧‧ Lifting members

6a, 6b‧‧‧ convex

7‧‧‧Material transport agency

7a, 7b‧‧‧ Keeping Department

8‧‧‧X-Y Workbench

9‧‧‧ release film

10‧‧‧Dissipation plate (plate member)

11‧‧‧Resin materials

Claims (12)

A resin sealing device comprising: an upper mold; a lower mold disposed opposite to the upper mold; a cavity disposed in the lower mold; a supply mechanism supplying a resin material and a plate member to the cavity; and clamping a mechanism for clamping a molding die having at least the upper mold and the lower mold, comprising: a material storage frame provided in the supply mechanism and having a through hole in a plan view; and an adsorption mechanism to at least The release film is adsorbed to the lower surface of the material receiving frame so as to cover the lower surface of the material receiving frame including the through hole; and the lifting member is vertically disposed on the inner side surface of the material receiving frame; An output member is disposed on a lower surface side of the material receiving frame and protrudes from an inner side surface of the material receiving frame; and an input mechanism is disposed on a lower surface of the lifting member and disposed on an inner side of the protruding member The resin material is placed in a space surrounded by the elevating member and the plate member in the inner side of the material receiving frame in a state in which the plate member placed on the release film is in contact; In a state in which the release film, the plate member, and the resin material are held in the material housing frame, the supply mechanism is transported to the upper side of the lower mold, and the suspension is caused by The release film is adsorbed to the lower surface of the material containment frame, thereby supplying the resin material, the plate member, and the release film together from the supply mechanism into the cavity. The resin sealing device according to claim 1, wherein the plate-shaped member is positioned by correspondingly positioning a position of a front end of the protruding member with a position of an outer circumference of the plate-shaped member. The resin sealing device of claim 2, wherein the plate member is a heat dissipation plate or an electromagnetic shielding plate. The resin sealing device according to claim 3, wherein the resin material is any one of a granular, granular, powder, paste or liquid resin at normal temperature. The resin sealing device according to any one of claims 1 to 4, further comprising: a supply module for supplying the plate member and the resin material to the supply mechanism; and having the forming The mold and the at least one forming module of the clamping mechanism, the supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules. The resin sealing device of claim 5, wherein the supply module is divided into a plate member supply module that supplies the plate member and a resin material supply module that supplies the resin material, The plate member supply module and the resin material supply module are detachable. A resin sealing method comprising: a step of supplying a resin material and a plate member to a cavity provided in the lower mold using a molding die having at least an upper mold and a lower mold disposed opposite to the upper mold; and The step of mold clamping of the molding die, comprising: a step of placing the plate member on the release film; and a step of disposing a material storage frame having a through hole in the plan view on the release film Positioning the plate member by a projecting member protruding from an inner side surface of the material housing frame a step of adsorbing the release film to a lower surface of the material receiving frame; contacting a lower surface of the lifting member disposed on an inner side surface of the material receiving frame with the plate member a state in which the resin material is introduced into a space surrounded by the elevating member and the plate member in the inner side of the material housing frame; and at least the material housing frame and the release film are And the step of transporting the plate member and the resin material together over the lower mold, in the step of supplying, stopping the adsorption of the release film to the material containment frame a surface to thereby supply the resin material, the plate member, and the release film together into the cavity. The resin sealing method of claim 7, wherein in the positioning step, the position is determined by correspondingly positioning a position of a front end of the protruding member with a position of an outer circumference of the plate member Plate member. The resin sealing method of claim 8, wherein the plate member is a heat dissipation plate or an electromagnetic shielding plate. The resin sealing method according to claim 9, wherein the resin material is any one of a granular, granular, powder, paste or liquid resin at normal temperature. The resin sealing method according to any one of claims 7 to 10, further comprising: a step of preparing a supply module for supplying the plate member and the resin material; and preparing to have the forming die And a step of at least one forming module of the clamping mechanism; The supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules. The resin sealing method of claim 11, wherein the supply module is divided into a plate member supply module that supplies the plate member and a resin material supply module that supplies the resin material, The plate member supply module and the resin material supply module are detachable.