KR20150141153A - Resin sealing apparatus and resin sealing method - Google Patents

Resin sealing apparatus and resin sealing method Download PDF

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Publication number
KR20150141153A
KR20150141153A KR1020150081128A KR20150081128A KR20150141153A KR 20150141153 A KR20150141153 A KR 20150141153A KR 1020150081128 A KR1020150081128 A KR 1020150081128A KR 20150081128 A KR20150081128 A KR 20150081128A KR 20150141153 A KR20150141153 A KR 20150141153A
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KR
South Korea
Prior art keywords
plate
resin
release film
resin material
receiving frame
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KR1020150081128A
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Korean (ko)
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KR101659690B1 (en
Inventor
게이타 미즈마
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Abstract

In a resin sealing apparatus, a resin material and a heat radiation plate are stably supplied to a cavity. In a material accommodation frame (1), prepared are: a through-hole (2); an edge part (3) formed around the through-hole (2); an adsorption groove (4) provided on a lower plane of the edge part (3); a protrusion member (5) which is attached to a lower side of the edge part (3) and protrudes inwardly; and an elevation member (6) which is elevated along an inner side of the edge part (3). A material supply tool (1A) is constituted by integrating the material accommodation frame (1) and a release film (9) adsorbed onto the lower plane of the edge part (3). The material supply tool (1A) is lifted up by a material conveying tool (7). A position of a front end of the protrusion member (5) is determined in correspondence to a position of the outer circumference of the heat radiation plate (10). Therefore, the heat radiation plate (10) and a resin material (11) can be stably transferred, without being deviated while the heat radiation plate (10) is arranged in the protrusion member (5), on the release film (9).

Description

[0001] Resin sealing apparatus and resin sealing method [0002]

INDUSTRIAL APPLICABILITY The present invention relates to a resin composition for use in resin sealing of a chip type electronic component (hereinafter referred to as " chip " as appropriate) such as a transistor, an integrated circuit (IC) or a light emitting diode A sealing device and a resin sealing method.

2. Description of the Related Art In recent years, semiconductors have become increasingly sophisticated, multifunctional, and miniaturized, and the power consumed by semiconductor chips tends to increase more and more. In particular, in a semiconductor chip such as a microprocessor or a power device, heat generation due to power consumption is a serious problem. In order to promote the emission of heat generated by the semiconductor chips, the heat sinks are collectively sealed with the semiconductor chips at the same time to perform resin sealing.

When resin-sealing the plate-like member as the heat sink together with the semiconductor chip, it is necessary to prevent the heat sink from moving in the cavity while sealing the resin. When the heat sink is moved while the resin is sealed, the heat radiation effect is not uniform and the characteristics of the product are not stable. Therefore, it is important to precisely align the heat sink in the cavity to prevent the heat sink from moving.

A resin-encapsulating molding apparatus for electronic parts, characterized by comprising: a mold for resin-sealing molding of an electronic part consisting of at least one frame and the other frame; and a heat-radiating plate and an electronic component in a resin- A resin encapsulation molding apparatus for an electronic part for molding a molded article by molding with a fluid resin at the time of molding is characterized in that the heat dissipation plate is positioned in a through state with respect to one or a plurality of projections formed in the cavity " (See, for example, paragraph [0008] of Patent Document 1, Figs. 1 and 2).

Patent Document 1: JP-A-2008-053509

However, the resin seal molding apparatus disclosed in Patent Document 1 has room for improvement as described below. The tip portion 18a of the gate piece 14 including the gate orifice 13 of the gate piece 14 and the tip portion 18b of the ejector pin 10 are formed in the cavity 3 as shown in Fig. And protrudes beyond the horizontal plane of the cavity 3. The cavity 3 and the heat sink 5 are positioned by inserting the tip portions (protruding portions) 18a and 18b into the through holes formed in the heat sink 5. Therefore, the heat radiating plate 5 can be easily (simply) positioned in the cavity 3 and can be positioned at a high precision by simply arranging the two portions of the projecting portion 18a and the other projecting portion 18b in the cavity 3. [ You can decide.

In this positioning method, two portions of through holes are previously formed in the heat sink 5 so as to correspond to the two portions 18a and 18b and the two portions 18a and 18b in the cavity 3 There is a need. Therefore, the processing of the cavity 3 and the heat sink 5 becomes complicated, and the time required for machining is increased. Therefore, there is room for improvement in terms of the cost of manufacturing the mold and the heat sink.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a resin-sealing apparatus capable of positioning a plate-like member using a simple material supply mechanism and stably supplying a resin material and a plate- And a method thereof.

In order to solve the above problems, a resin-

A feeding mechanism for feeding a resin material and a plate-shaped member to the cavity; and a mixing mechanism for fitting at least a forming die having the upper die and the lower die to each other to form an upper die, a lower die provided opposite to the upper die, Wherein the resin sealing device comprises:

A material receiving frame provided in the supply mechanism and having a through hole as viewed in a plan view,

A suction mechanism for suctioning the release film to the lower surface of the material receiving frame so as to at least cover the lower surface of the material receiving frame including the through hole,

An elevating member provided so as to be able to move up and down on an inner surface of the material receiving frame;

A protruding member provided on a lower surface side of the material accommodating frame and protruding from an inner surface of the material accommodating frame;

And a space surrounded by the elevating member and the plate member on the inside of the material receiving frame in a state in which the lower surface of the elevating member is in contact with the plate member disposed on the release film, An injection mechanism for injecting a resin material

And,

The supply mechanism is transported upward of the lower mold with the release film, the plate-like member and the resin material held in at least the material receiving frame,

The resin material, the plate member and the release film are collectively supplied to the cavity from the supply mechanism by stopping the adsorption of the release film on the lower surface of the material receiving frame.

In the resin-sealing apparatus according to the present invention,

The plate member is positioned by making the position of the tip end of the projecting member correspond to the position of the outer periphery of the plate member,

.

Further, in the resin-sealing apparatus according to the present invention,

The plate-like member is a heat sink or an electromagnetic shield plate,

.

Further, in the resin-sealing apparatus according to the present invention,

The resin material is any one of a granular, granular, powder, paste, or liquid resin at room temperature.

.

Further, in the resin-sealing apparatus according to the present invention,

A supply module for supplying the plate-like member and the resin material to the supply mechanism,

At least one molding module having the molding mold and the mold-

Further comprising:

Wherein the supply module and the one molding module are detachable,

The one molding module is detachable with respect to the other molding module,

.

Further, in the resin-sealing apparatus according to the present invention,

Wherein the supply module is divided into a plate-shaped member supply module for supplying the plate-like member and a resin material supply module for supplying the resin material,

Wherein the plate-like member supply module and the resin material supply module are detachable,

.

In order to solve the above problems, a resin sealing method according to the present invention is a resin sealing method using a mold having at least a lower mold provided opposite to the upper mold and the upper mold facing each other, and supplying a resin material and a plate-like member to a cavity provided in the lower mold And a step of molding the molding die, the resin sealing method comprising:

A step of disposing the plate-shaped member on a release film,

Disposing a material receiving frame having a through hole as viewed in plan on the release film;

Positioning the plate-shaped member by a projecting member projecting from an inner surface of the material receiving frame;

A step of adsorbing the release film on the lower surface of the material receiving frame;

Wherein a space surrounded by the elevating member and the plate member on the inner side of the material receiving frame in a state in which the lower surface of the elevating member provided on the inner surface of the material receiving frame is in contact with the plate- A step of injecting a material,

The step of collectively transporting at least the material receiving frame, the release film, the plate member and the resin material above the lower mold

/ RTI >

In the supplying step, the resin material, the plate member and the release film are collectively supplied to the cavity by stopping the adsorption of the release film on the lower surface of the material receiving frame.

In the resin sealing method according to the present invention,

In the positioning step, the plate member is positioned by associating the position of the tip of the projecting member with the position of the outer periphery of the plate member.

.

Further, in the resin sealing method according to the present invention,

The plate-like member is a heat sink or an electromagnetic shield plate,

.

Further, in the resin sealing method according to the present invention,

The resin material is any one of a granular, granular, powder, paste, or liquid resin at room temperature.

.

Further, in the resin sealing method according to the present invention,

Preparing a supply module for supplying the plate-shaped member and the resin material;

Preparing at least one molding module having the molding die and the mold releasing mechanism

Further comprising:

Wherein the supply module and the one molding module are detachable,

The one molding module is detachable with respect to the other molding module,

.

Further, in the resin sealing method according to the present invention,

Wherein the supply module is divided into a plate-shaped member supply module for supplying the plate-shaped member and a resin material supply module for supplying the resin material,

Wherein the plate-like member supply module and the resin material supply module are detachable,

.

According to the present invention, in a material receiving frame having a through-hole used in a resin-sealing apparatus, an adsorption mechanism for adsorbing a release film to a lower surface of a material receiving frame, an elevating member ascending and descending from the inner surface of the material receiving frame, A protruding member is provided. A supply mechanism for supplying the resin material and the plate-shaped member is constituted by integrating the release film adsorbed on the lower surface of the material receiving frame and the material receiving frame. The supply mechanism carries the resin material accommodated in the space surrounded by the elevating member and the plate member in the cavity while the lower surface of the elevating member is in contact with the plate member disposed inside the protruding member. In this manner, the resin material, the plate member, and the release film can be collectively supplied to the cavity with the plate member and the resin material disposed on the release film inside the protrusion member.

1 (a) to 1 (d) are schematic sectional views showing a process of accommodating a heat sink and a resin material in a material receiving frame in the first embodiment of the resin sealing apparatus according to the present invention.
2 (a) to 2 (c) are schematic sectional views showing a process of supplying a heat radiating plate and a resin material to a cavity using the material receiving frame shown in Fig.
3 (a) and 3 (b) are schematic cross-sectional views illustrating a process of resin-sealing a chip mounted on a substrate.
4 is a plan view showing an outline of the apparatus in the second embodiment of the resin encapsulation device according to the present invention.

1, the material receiving frame 1 is provided with a through hole 2 having an opening at the top and bottom, a peripheral edge 3 formed around the through hole 2, A protruding member 5 attached to the lower surface of the peripheral edge portion 3 and protruding inward and a lifting member 6 lifting and lowering along the inner surface of the peripheral edge portion 3 are provided. The release film 9 is adsorbed on the lower surface of the peripheral edge portion 3. The material receiving frame 1 and the release film 9 adsorbed on the lower surface of the peripheral edge 3 are integrated to constitute the material supply mechanism 1A. The material feeding mechanism 1A is lifted by the material feeding mechanism 7. The position of the tip of the projecting member 5 is determined corresponding to the position of the outer periphery of the heat sink 10. [ The heat radiation plate 10 and the resin material 11 can be stably transported without being displaced in a state where the heat radiation plate 10 is disposed inside the projecting member 5 from above the release film 9 .

(Example 1)

The material receiving frame 1 used in the first embodiment of the resin sealing apparatus according to the present invention will be described with reference to Figs. Any drawings in the present application document are drawn schematically so that they are omitted or exaggerated appropriately in order to make them easy to understand. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

The material receiving frame 1 of the resin encapsulating device shown in Fig. 1 has a through hole 2 having an opening at the top and bottom, a peripheral edge 3 formed around the through hole 2, A projecting member 5 attached to the lower surface of the peripheral edge portion 3 and protruding inwardly and a lifting member 6 lifted and lowered along the inner surface of the peripheral edge portion 3, Respectively. The material conveying mechanism 7 is a conveying mechanism for holding and moving the material receiving frame 1. [ The material conveying mechanism 7 moves the material receiving frame 1 above the X-Y table 8. On the X-Y table 8, a release film 9 is coated. On the release film 9, for example, a heat sink (heat sink) 10 which is a plate-shaped member accommodated in the material receiving frame 1 is disposed.

In the material receiving frame 1, the elevating member 6 is formed in an inverted L-shape and has a convex portion 6a extending in the horizontal direction and a convex portion 6b extending in the vertical direction. The elevating member 6 falls due to its own weight and stops when the lower surface of the convex portion 6a of the elevating member 6 comes into contact with the upper surface of the projecting member 5. [ The protruding member 5 attached to the underside of the peripheral edge portion 3 serves as a stopper for stopping the lifting member 6 from dropping due to its own weight. The lower surface of the convex portion 6b of the elevation member 6 is positioned below the distance d determined by the lower surface of the peripheral edge portion 3 with the elevation member 6 stopped. The predetermined distance d is set to about 0.5 mm to 2 mm depending on the amount of resin to be supplied, the hardness of the release film, and the like.

The protruding member 5 is provided so as to be able to adjust the distance L between the opposed protruding members 5 in the horizontal direction. At least two projecting members (5) are attached to the inner surface of the peripheral edge (3). The positions of the tips of these projecting members (5) are made to correspond to the positions of the outer periphery of the heat sink (10). Specifically, the position of the tip end of the projecting member 5 is set to a position spaced apart by a minute gap from the position of the maximum outer periphery in consideration of dimensional accuracy in the heat radiating plate 10. In addition, it is preferable that the inner surface in the vicinity of the lower surface of the projecting member 5 is a tapered surface that retreats toward the outer side (toward the peripheral edge 3) toward the lower surface. Thus, the heat sink 10 disposed inside the protruding member 5 can be positioned. The shape of the projecting member 5 may be a circular shape along the opening below the through hole 2.

The peripheral portion 3 is formed of a metal that is easy to process, such as aluminum. The elevating member 6 is preferably formed of a metal material or a ceramic material having wear resistance such as stainless steel or chrome steel so that the bottom surface of the convex portion 6b does not proceed to wear. The protruding member 5 is also preferably formed of a metal material or ceramics material having wear resistance such as stainless steel or chrome steel so that wear of the upper surface or the side does not proceed. The synthetic rubber may be embedded in the lower surface of the peripheral edge portion 3 to form the suction groove 4 in the synthetic rubber. By embedding synthetic rubber, adhesion of the lower surface of the peripheral edge portion 3 can be improved. As the synthetic rubber, it is preferable to use heat-resistant silicone rubber, fluorine rubber or the like.

As shown in Fig. 1 (a), the material transport mechanism 7 includes a holding portion 7a for holding the material receiving frame 1 sandwiched therebetween in the transverse direction, and a holding portion 7b connected to the holding portion 7a, And a holding portion 7b which can be moved. The peripheral portion of the release film adsorbed on the lower surface of the peripheral edge portion 3 can be sandwiched between the upper and lower sides by the holding portion 7a and the holding portion 7b provided in the material transport mechanism 7 as described later. The lower surface of the convex portion 6a of the elevation member 6 comes into contact with the upper surface of the projecting portion 5 when the material receiving frame 7 is moved by the material conveying mechanism 7 and the elevating member 6 is stopped .

The operation of accommodating the heat sink 10 and the resin material 11 using the material receiving frame 1 will be described with reference to Figs. 1 (a) to 1 (d). As shown in Fig. 1A, a rectangular release film 9 supplied from a release film supply mechanism (not shown) is placed on the XY table 8 so as to prevent wrinkles or slackness from occurring, do. As the release film 9, it is preferable to use a release film 9 having a certain degree of hardness so that a tensile force is applied. After the release film 9 is coated, the release film 9 is adsorbed on the X-Y table 8 by an adsorption mechanism (not shown). The release film 9 is cut, leaving only a necessary portion of the release film 9 being adsorbed. In Fig. 1 (a), the release film 9 is cut slightly larger than the X-Y table 8.

Next, the heat sink 10 is disposed at a predetermined position on the release film 9. As the heat sink 10, for example, a material having high thermal conductivity such as copper or aluminum is used. Next, the material conveying mechanism 7 is used to move the material receiving frame 1 above the X-Y table 8 and stop. The lower surface of the convex portion 6a of the elevating member 6 is brought into contact with the upper surface of the projecting member 5 during the period in which the material receiving frame 1 is moved and stopped, State. The lower surface of the convex portion 6b of the elevation member 6 is lowered by a distance d defined by the lower surface of the peripheral edge portion 3. [

Next, as shown in Fig. 1 (b), the material receiving frame 1 is lowered and placed on the release film 9 adsorbed on the X-Y table 8. In this process, the lower surface of the convex portion 6b of the elevation member 6, which is lowered by a distance d determined from the lower surface of the peripheral edge portion 3, first comes into contact with the upper surface of the heat sink 10. Further, by lowering the material receiving frame 1, the elevation member 6 is lifted along the inner surface of the peripheral portion 3 by receiving reaction from the X-Y table 8 (heat sink 10). Further, the material receiving frame 1 is lowered, and the lower surface of the peripheral edge portion 3 is brought into contact with the release film 9. In this state, the lifting member 6 is lifted by a distance d determined from the lower surface of the peripheral edge portion 3, that is, the upper surface of the release film 9. The lower surface of the elevating member 6 contacts the upper surface of the heat dissipating plate 10 and the lower surface of the peripheral edge portion 3 contacts the release film 9 so that the material receiving frame 1 is disposed on the XY table 8 .

The heat sink 10 is disposed inside the protruding member 5 attached to the material receiving frame 1 with the material receiving frame 1 disposed on the X-Y table 8. As described above, at least two protruding members 5 are attached to the inner surface of the peripheral edge portion 3. The heat radiating plate 10 disposed inside the protruding member 5 can be positioned by making the positions of the tips of these protruding members 5 correspond to the position of the outer circumference of the heat radiating plate 10. [ Therefore, in the process of transporting the heat sink 10 using the material transport mechanism 7, the heat sink 10 can be prevented from moving in the horizontal direction by the protruding member 5. [

The opening below the through hole 2 is closed by the material receiving frame 1, the release film 9 and the heat sink 10 in a state where the material receiving frame 1 is disposed on the XY table 8 . Thereby, the material receiving frame 1, the release film 9, and the heat sink 10 are integrated, and the through hole 2 functions as the resin material accommodating portion 2A for accommodating the resin material. Specifically, a space surrounded by the elevating member 6 above the heat sink 10 is called a resin material accommodating portion 2A.

Next, as shown in Fig. 1 (c), a predetermined amount of the resin material 11 is charged into the resin material accommodating portion 2A from the resin material introducing mechanism (not shown). As the resin material 11, a granular, powder, granular or paste type resin or a liquid type resin at room temperature (liquid type resin) or the like can be used. When the liquid type resin is used, the liquid type resin is discharged to the resin material receiving portion 2A by the dispenser. In this embodiment, a case where a granular resin (granular resin) is used as the resin material 11 will be described.

Next, as shown in Fig. 1 (d), the adsorption to the release film 9 by the X-Y table 8 is released. Thereafter, the release film 9 is sucked to the lower surface of the peripheral edge portion 3 by sucking the release film 9 using the suction groove 4 provided in the material receiving frame 1. Then, as shown in Fig. In this state, the material receiving frame 1, the release film 9, the heat sink 10, and the resin material 11 are integrated. In this way, the component element in which the material receiving frame 1 and the release film 9 are integrated functions as the material supply mechanism 1A.

Next, the heat transfer plate 10 and the resin material 11 housed in the material supply mechanism 1A and the material supply mechanism 1A are collectively held by using the material transport mechanism 7. Then, The material conveying mechanism 7 holds the material receiving frame 1 between the transverse direction by the holding portion 7a. The holding portion 7b provided in the material transport mechanism 7 is lifted to hold the peripheral portion of the release film 9 between the holding portion 7a and the holding portion 7b. A tension acting on the release film 9 toward the outward direction can be applied by using the material transport mechanism 7.

Next, the material feeding mechanism 1A is lifted from the X-Y table 8 by the material feeding mechanism 7. By lifting the material supply mechanism 1A, the elevation member 6, the heat sink 10, and the resin material 11 are caused to fall by their own weight. A tension acting on the release film 9 toward the outward direction is applied by the material conveying mechanism 7 in order to prevent the elevating member 6, the heat sink 10 and the resin material 11 from dropping. The material conveying mechanism 7 applies the tension to the release film 9 having a certain degree of hardness so that the elevation member 6 and the heat sink 10 and the resin material 11 do not fall, 9). The heat radiation plate 10 and the resin material 11 can be collectively transported without being displaced in a state where the heat radiation plate 10 is disposed inside the projecting member 5 from above the release film 9 .

When the heat sink 10 is light and the resin material 11 is a small amount, the release film 9 is merely absorbed by using the suction holes 4, so that the lift member 6, the heat sink 10, 11 can be held on the release film 9 without dropping. In this case, the elevating member 6, the heat sink 10, and the resin material 11 press down the release film 9 adsorbed on the lower surface of the peripheral edge portion 3 by their magnetic weights. As a result, tension is applied to the release film 9.

The resin material 11 is conveyed while being held in the space surrounded by the elevating member 6, that is, the resin material accommodating portion 2A, on the heat sink 10. This allows the lifting member 6 to block the movement of the resin material 11 from the resin material accommodating portion 2A toward the outer side (peripheral portion 3). In other words, it is possible to prevent the resin material 11 from entering between the lower surface of the material receiving frame 1 and the upper surface of the release film 9 in a state in which the lower surface of the elevating member 6 and the heat sink 10 are in close contact with each other . The resin material 11 accommodated in the heat dissipating plate 10 and the resin material accommodating portion 2A can be held by the material transport mechanism 7 without attaching the resin material 11 to the lower surface of the material accommodating frame 1. [ Can be transported in a stable state.

The structure of the cavity 13 and the operation of supplying the heat sink 10 and the resin material 11 to the cavity 13 will be described with reference to Fig. 2 (a), the lower mold 12 is provided with a cavity 13 to which the resin material 11, the heat sink 10, and the release film 9 are supplied. The cavity 13 is formed slightly larger than the resin material accommodating portion 2A. Specifically, it is preferable that the cavity 13 is formed so that the convex portion 6b of the elevation member 6 is inserted into the cavity 13. [ In other words, the material receiving frame 1 is formed so that the convex portion 6b of the elevation member 6 is inserted into the cavity 13. [ Therefore, the cavity 13 and the heat sink 10 are formed to have substantially the same size.

The material feeding mechanism 1A is moved to a position above the predetermined position of the lower die 12 and stopped by using the material feeding mechanism 7 as shown in Fig. The elevating member 6, the heat sink 10, and the resin material 11 do not fall off because the tensile force acting in the outward direction is applied to the release film 9 held by the material transport mechanism 7. [ Therefore, the heat sink 10 maintains a state in which the heat sink 10 is disposed on the release film 9 inside the protruding member 5. Next, the material supply mechanism 1A is lowered and placed on the mold face of the lower mold 12. Fig. In this state, the release film 9, the heat sink 10, and the resin material 11 are not yet supplied into the cavity 13.

2 (b), after the material supply mechanism 1A is disposed on the mold surface of the lower mold 12, the mold releasing film 10 formed by the suction groove 4 of the peripheral edge portion 3 Release the adsorption on. By arranging the material supply mechanism 1A on the mold surface of the lower mold 12, the material supply mechanism 1A receives heat from a heater (not shown) built in the lower mold 12. [ The releasing film 9 is softened and elongated by receiving heat. The release film 9 is adsorbed to the suction holes (not shown) provided in the cavity 13 and the lower mold 12 while the release film 9 is softened. Thereby, the release film 9 is adsorbed so as to correspond to the shape of the cavity 13 without causing wrinkles or looseness.

The mold releasing film 9 is attracted to the cavity 13 so that the elevating member 6 falls and the heat radiating plate 10 and the resin material 11 are supplied into the cavity 13. Since the release film 9, the heat sink 10 and the resin material 11 are collectively supplied into the cavity 13, the heat sink 10 can be surely supplied into the cavity 13. [ Since the heat sink 10 is formed to have substantially the same size as that of the cavity 13, the heat sink 10 hardly moves after being supplied into the cavity 13. Since the resin material 11 is supplied into the cavity 13 together with the elevation member 6, the resin material 11 does not scatter out from the resin material accommodating portion 2A. Therefore, the heat sink 10 and the predetermined amount of the resin material 11 can be supplied to the cavity 13 stably.

2 (c), the releasing film 9, the heat sink 10, and the resin material 11 are collectively supplied to the cavity 13, and then the material is transported by the material transport mechanism 7 So that the material receiving frame 1 is lifted from the lower mold 12. Only the material receiving frame 1 is held by the material conveying mechanism 7 because the releasing film 9, the heat sink 10 and the resin material 11 are supplied to the cavity 13. In this state, the lower surface of the convex portion 6b of the elevation member 6 is lowered by the distance d determined by the lower surface of the peripheral edge portion 3. Thus, the release film 9, the heat sink 10, and the resin material 11 can be stably supplied to the cavity 13 from the material supply mechanism 1A.

With reference to Fig. 3, a description will be given of a configuration example of a molding die and an operation of resin sealing in the resin encapsulation device. As shown in Fig. 3 (a), in the resin-sealing apparatus, the lower die 12 is provided with the upper die 14 facing each other. The upper mold 14 and the lower mold 12 constitute a mold. The lower mold 12 is provided with a cavity bottom face member 15 for pressing the molten resin 11A heated in the cavity 13 and melted. The upper die 14 is fixed to the unsealed substrate 17 on which the chip 16 is mounted by suction or clamping. Between the mold surface of the upper mold 14 and the mold surface of the lower mold 12, there is provided a seal member 18 for blocking the cavity 13 from the outside air when molding the mold.

3 (a), the unsealed substrate 17 is conveyed to a predetermined position of the upper die 14 by a substrate supply mechanism (not shown) in a die open state, . The material feeding mechanism 1A is transported to a predetermined position of the lower mold 12 by the material transport mechanism 7 (see Fig. 2), and the resin material 11, the heat sink 10 and the release film 9 are collectively transported To the cavity (13) provided in the lower mold (12). The resin material 11 supplied to the lower mold 12 is heated to produce the molten resin 11A.

Next, as shown in Fig. 3 (b), the upper die 14 and the lower die 12 are mated by a coupling mechanism (not shown). The chip 16 mounted on the unsealed substrate 17 is immersed in the molten resin 11A in the cavity 13. [ By the drive mechanism (not shown), the cavity bottom face member 15 is moved upward to press the molten resin 11A. Subsequently, the cured resin 19 is formed by heating the molten resin 11A. In this state, the chips 16 mounted on the unsealed substrate 17 are resin-sealed with the cured resin 19. The surface of the cured resin 19 (the surface opposite to the substrate 17 before sealing) is fixed in a state in which the heat sink 10 is exposed. After the resin sealing is completed, the upper mold 14 and the lower mold 12 are opened. After the mold is opened, the sealed substrate on which the heat sink 10 is fixed to the surface is extracted.

It is preferable to suck the inside of the cavity 13 blocked from the outside air to reduce the pressure by using a vacuum processing mechanism (not shown) in the process of forming the upper die 14 and the lower die 12. As a result, air remaining in the cavity 13, bubbles contained in the molten resin 11A, and the like are discharged to the outside of the mold.

According to the present embodiment, in the material receiving frame 1, the projecting member 5 projecting inwardly and the elevating member 6 ascending and descending along the peripheral edge 3 are provided on the lower surface side of the peripheral edge portion 3 . The elevating member 6 falls due to its own weight and comes into contact with the projecting member 5 and stops. The material receiving frame 1 and the release film 9 are integrated to constitute the material supply mechanism 1A. A tension is applied to the release film 9 by the material transport mechanism 7 so that the elevation member 6 and the heat sink 10 do not fall down even when the material transport mechanism 7 lifts the material supply mechanism 1A. do. In addition, the position of the tip end of the projecting member 5 is determined corresponding to the position of the outer periphery of the heat sink 10. By applying a tensile force to the release film 9, the heat sink 10 is disposed on the release film 9 inside the protrusion member 5 without dropping the elevation member 6 or the heat sink 10 State can be maintained. Therefore, the heat sink 10 can be stably transported without shifting the position of the heat sink 10.

Since the position of the heat sink 10 is not shifted, it is possible to carry the resin material 11 in a state in which the resin material 11 is accommodated on the heat sink 10 in the resin material accommodating portion 2A. The lifting member 6 can block the movement of the resin material 11 from the resin material accommodating portion 2A toward the outer side (peripheral edge 3). It is possible to prevent the resin material 11 from entering between the lower surface of the material receiving frame 1 and the upper surface of the release film 9 in a state in which the lower surface of the elevating member 6 and the heat sink 10 are in close contact with each other. Therefore, the resin material 11 accommodated in the resin material accommodating portion 2A can be stably transported by the material transport mechanism 7 without adhering the resin material 11 to the lower surface of the material accommodating frame 1 .

Since the resin material 11 can be prevented from entering between the lower surface of the material receiving frame 1 and the upper surface of the release film 9, It is no longer necessary to attach them. Therefore, the resin material 11 adhered to the lower surface of the material receiving frame 1 does not harden after being heated, melted, and fixed as a cured product. Since the cured product is not formed, it is easy to automatically perform the cleaning of the material receiving frame 1 by using, for example, a brush. Therefore, since the time required for maintenance can be reduced, workability and productivity in the resin-sealing apparatus can be improved.

According to the present embodiment, the resin material 11, the heat sink 10, and the release film 9 put into the resin material accommodating portion 2A can be removed by the material transport mechanism 7, The lower surface of the heat sink 10 and the heat sink 10 are supplied into the cavity 13 in a state in which they are in close contact with each other. The mold releasing film 9, the heat sink 10 and the resin material 11 are collectively supplied to the cavity 13, so that the heat sink 10 can be surely supplied into the cavity 13. In addition, it is possible to prevent the resin material 11 from scattering to the outside from the resin material accommodating portion 2A. Therefore, since the heat sink 10 and the predetermined amount of the resin material 11 can be stably supplied to the cavity 13, the quality of the product can be improved.

Further, according to the present embodiment, the falling of the elevating member 6 is stopped by the projecting members 5 provided in the material receiving frame 1. Therefore, it is not necessary to provide a control mechanism or the like for controlling the movement of the elevating member 6, and the resin material accommodating portion 2A can be formed with a very simple structure. Therefore, the material supply mechanism 1A can be configured in a simple manner, and the configuration of the resin-sealing apparatus can be simplified, and the cost can be reduced.

(Example 2)

Referring to Fig. 4, a second embodiment of the resin sealing apparatus according to the present invention will be described. The resin sealing apparatus 20 shown in Fig. 4 includes a substrate supply / storage module 21, three molding modules 22A, 22B, and 22C, and a material supply module 23 as constituent elements. The substrate supply and storage module 21 as a component, the forming modules 22A, 22B and 22C and the material supply module 23 can be attached and detached to and from each other, . The molding module 22B is mounted on the molding module 22A and the molding module 22B is mounted on the molding module 22B while the material supply module 23 is mounted on the molding module 22B in a state where the substrate supply / storage module 21 and the molding module 22A are mounted. Can be mounted.

The substrate supply and storage module 21 is provided with a pre-sealing substrate supply portion 24 for supplying a substrate 17 before sealing, a sealed substrate storage portion 26 for housing the sealed substrate 25, A substrate arranging section 27 for transferring the substrate 17 and the sealed substrate 25 and a substrate transport mechanism 28 for transporting the substrate 17 before sealing and the substrate 25 after sealing are provided. The substrate placement section 27 moves in the Y direction within the substrate supply and storage module 21. [ The substrate transport mechanism 28 moves in the X direction and the Y direction in the substrate supply and storage module 21 and the respective molding modules 22A, 22B, and 22C. The predetermined position S1 is a position where the substrate transport mechanism 28 waits in a state in which it does not operate.

Each of the molding modules 22A, 22B and 22C is provided with a lower mold 12 capable of ascending and descending and an upper mold 14 (see Fig. 3) arranged opposite to the lower mold 12. Each of the molding modules 22A, 22B and 22C has a molding mechanism 29 (a circular portion indicated by a chain double-dashed line) for opening and closing the upper die 14 and the lower die 12. A cavity 13 to which the release film 9, the heat sink 10 and the resin material 11 are supplied is provided in the lower mold 12. [ The lower mold 12 and the upper mold 14 need only move relative to each other and can be opened and closed.

The material supply module 23 is provided with a release film supply mechanism 30 for supplying the release film 9 (see Fig. 1) on the XY table 8, the XY table 8, A material conveying mechanism 7 for conveying the material receiving frame 1A and the material receiving frame 1A and a resin material receiving portion 2A for receiving the resin material 11 and a heat sink supply mechanism 33 for supplying the heat sink 10 (see FIG. 1) are provided. The X-Y table 8 moves in the X and Y directions within the material supply module 23. [ The material transport mechanism 7 moves in the X direction and the Y direction in the material supply module 23 and the respective molding modules 22A, 22B, and 22C. The predetermined position M1 is a position to wait while the material transport mechanism 7 is not operating.

Referring to Fig. 4, the operation of resin-sealing by using the resin-sealing apparatus 20 will be described. First, in the substrate supply / storage module 21, the unsealed substrate 17 is sent from the unseasoned substrate supply section 24 to the substrate arrangement section 27. Next, the substrate transport mechanism 28 is moved in the -Y direction from the predetermined position S1 to receive the unsealed substrate 17 from the substrate arrangement section 27. Then, The substrate transport mechanism 28 is returned to the predetermined position S1. Next, the substrate transport mechanism 28 is moved in the + X direction up to the predetermined position P1 of the forming module 22B, for example. Next, in the forming module 22B, the substrate transport mechanism 28 is moved in the -Y direction to stop at the predetermined position C1 on the lower die 12. Then, Next, the substrate transport mechanism 28 is moved upward to fix the pre-sealing substrate 17 to the upper mold 14 (see Fig. 3). The substrate transport mechanism 28 is returned to the predetermined position S1 of the substrate supply / storage module 21. [

Next, in the material supply module 23, the release film 9 supplied from the release film supply mechanism 30 to the X-Y table 8 is cut to a predetermined size. Next, the heat radiating plate 10 is transported from the heat radiating plate supply mechanism 33 and placed on the release film 9 coated on the X-Y table 8. Next, the material conveying mechanism 7 is moved in the -Y direction from the predetermined position M1, and the material receiving frame 1 whose inner surface has been cleaned by the cleaning mechanism 31 is received. Next, the material transport mechanism 7 is moved in the -Y direction. In the XY table 8, the heat sink 10 disposed on the release film 9 is disposed inside the material receiving frame 1 so as to be disposed inside the protruding member 5 (see Fig. 1) provided in the material receiving frame 1. [ Is placed on the release film (9). The material transport mechanism 7 is returned to the predetermined position M1. Next, the X-Y table 8 is moved in the + X direction to stop the resin material accommodating portion 2A at a predetermined position below the resin material injecting mechanism 32. Then, Next, the predetermined amount of the resin material 11 is supplied from the resin material charging mechanism 32 to the resin material accommodating portion 2A by moving the X-Y table 8 in the X direction and the Y direction. And returns the X-Y table 8 to its original position.

Next, the material transport mechanism 7 is moved in the -Y direction from the predetermined position M1 to receive the material supply mechanism 1A (see Fig. 1) arranged on the X-Y table 8. The material transport mechanism 7 is returned to the predetermined position M1. Next, the material transport mechanism 7 is moved in the -X direction to the predetermined position P1 of the forming module 22B. Next, in the forming module 22B, the material transport mechanism 7 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 12. [ Next, the material conveying mechanism 7 is lowered to supply the resin material 11, the heat sink 10, and the release film 9 to the cavity 13. The material transport mechanism 7 is returned to the predetermined position M1.

Next, in the molding module 22B, the lower mold half 12 is moved upward by the mold releasing mechanism 29 to mold the upper mold half 14 (see Fig. 3) and the lower mold half 12 together. After the predetermined time has elapsed, the upper mold 14 and the lower mold 12 are opened. Next, the substrate transfer mechanism 28 is moved from the predetermined position S1 of the substrate supply / storage module 21 to the predetermined position C1 on the lower die 12, and the hardened resin 19 (see Fig. 3) And the sealed substrate 25 on which the heat sink 10 is fixed is received on the surface of the sealing resin. Then, the substrate transport mechanism 28 is moved to transfer the sealed substrate 25 to the substrate disposing portion 27. The sealed substrate 25 is stored in the sealed substrate storage portion 26 from the substrate storage portion 27. [ Thus, resin sealing is completed.

In the present embodiment, three molding modules 22A, 22B, and 22C are arranged and mounted in the X direction between the substrate supply / storage module 21 and the material supply module 23. [ The substrate supply / storage module 21 and the material supply module 23 may be formed as one module, and one molding module 22A may be arranged in the X direction. Thus, the molding modules 22A, 22B, ... can be increased or decreased. Therefore, since the configuration of the resin molding apparatus 20 can be optimized in correspondence with the production form and the production amount, the productivity can be improved.

In this embodiment, the heat supply plate supply mechanism 33 for supplying the heat radiation plate 10 is provided in the material supply module 23. The present invention is not limited thereto and the heat radiating plate supply mechanism 33 for supplying the heat radiating plate 10 can be provided as a heat radiating plate supply module instead of the material supply module 23. In this case, a heat sink supply module is mounted between the molding module 22C and the material supply module 23. The heat sink supply module may be separated from the molding module 22C and the material supply module 23. [ In this way, the resin sealing apparatus 20 can be constructed only by adding the heat sink supply module to the conventional apparatus.

In each of the embodiments, the resin encapsulation device and the resin encapsulation method used for resin encapsulation of the semiconductor chip have been described. The resin-sealed object may be a semiconductor chip such as an IC or a transistor, or a passive element chip. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a lead frame, a printed board, and a ceramics substrate is resin-sealed with a cured resin. Therefore, the present invention can also be applied to manufacturing a multi-chip package, a multi-chip module, a hybrid IC, and the like.

In each of the embodiments, a heat sink (heat sink) for cooling and discharging heat emitted from the semiconductor chip is collectively sealed together with the semiconductor chip. The present invention is not limited to this, and an electromagnetic shielding plate (shield plate) for shielding electromagnetic waves emitted by semiconductor chips or for suppressing adverse effects caused by electromagnetic waves radiated from the outside may be collectively sealed. In this case, a metal plate, a conductive resin plate, or the like can be used as the plate member.

The present invention is not limited to the above-described embodiments, but may be appropriately combined, modified, or selected as necessary within the scope of the present invention.

1: Material receiving frame 1A: Material feeding mechanism (feeding mechanism)
2: through hole 2A: resin material receiving portion (space)
3: peripheral portion 4: suction groove (suction mechanism)
5: projecting member 6: elevating member
6a, 6b: convex portion 7: material conveying mechanism
7a, 7b: holding portion 8: XY table
9: release film 10: heat sink (plate member)
11: resin material 11A: molten resin (resin material)
12: Lower mold (molding mold) 13: Cavity
14: upper mold (forming mold) 15: cavity bottom surface member
16: chip 17: pre-sealing substrate
18: Seal member 19: Cured resin
20: resin sealing device 21: substrate supply / storage module
22A, 22B, 22C: forming module 23: material supplying module (supplying module)
24: pre-sealing substrate feeder 25: sealing end substrate
26: sealing end substrate storage portion 27: substrate positioning portion
28: substrate transport mechanism 29:
30: release film feeding mechanism 31: cleaning mechanism
32: Resin feeding mechanism (feeding mechanism) 33: Heat sink feeding mechanism
d: predetermined distance S1, P1, C1, M1: predetermined position

Claims (12)

A feeding mechanism for feeding a resin material and a plate-shaped member to the cavity; and a mixing mechanism for fitting at least a forming die having the upper die and the lower die to each other to form an upper die, a lower die provided opposite to the upper die, Wherein the resin sealing device comprises:
A material receiving frame provided in the supply mechanism and having a through hole as viewed in a plan view,
A suction mechanism for suctioning the release film to the lower surface of the material receiving frame so as to at least cover the lower surface of the material receiving frame including the through hole,
An elevating member provided so as to be able to move up and down on an inner surface of the material receiving frame;
A protruding member provided on a lower surface side of the material accommodating frame and protruding from an inner surface of the material accommodating frame;
And a space surrounded by the elevating member and the plate member on the inside of the material receiving frame in a state in which the lower surface of the elevating member is in contact with the plate member disposed on the release film, An injection mechanism for injecting a resin material
And,
The supply mechanism is transported upward of the lower mold with the release film, the plate-like member and the resin material held in at least the material receiving frame,
The resin material, the plate-like member, and the release film are collectively supplied to the cavity from the supply mechanism by stopping the adsorption of the release film to the lower surface of the material receiving frame. The method according to claim 1,
And the position of the tip end of the projecting member is made to correspond to the position of the outer periphery of the plate-like member, whereby the plate-like member is positioned. 3. The method of claim 2,
Wherein the plate member is a heat radiating plate or an electromagnetic shielding plate. The method of claim 3,
Wherein the resin material is any one of a granular, granular, powder, paste, or liquid resin at room temperature. 5. The method according to any one of claims 1 to 4,
A supply module for supplying the plate-like member and the resin material to the supply mechanism,
At least one molding module having the molding mold and the mold-
Further comprising:
Wherein the supply module and the one molding module are detachable,
Wherein the one molding module is detachable with respect to the other molding module. 6. The method of claim 5,
Wherein the supply module is divided into a plate-shaped member supply module for supplying the plate-shaped member and a resin material supply module for supplying the resin material,
Wherein the plate-like member supply module and the resin material supply module are attachable and detachable. A resin molding method comprising a step of supplying a resin material and a plate-shaped member to a cavity provided in the lower mold, using a mold having at least a lower mold facing the upper mold and the upper mold facing each other, and a step of molding the mold ,
A step of disposing the plate-shaped member on a release film,
Disposing a material receiving frame having a through hole as viewed in plan on the release film;
Positioning the plate-shaped member by a projecting member projecting from an inner surface of the material receiving frame;
A step of adsorbing the release film on the lower surface of the material receiving frame;
Wherein a space surrounded by the elevating member and the plate member on the inner side of the material receiving frame in a state in which the lower surface of the elevating member provided on the inner surface of the material receiving frame is in contact with the plate- A step of injecting a material,
The step of collectively transporting at least the material receiving frame, the release film, the plate member and the resin material above the lower mold
/ RTI >
Wherein the resin material, the plate member, and the release film are collectively supplied to the cavity by stopping the adsorption of the release film to the lower surface of the material receiving frame. 8. The method of claim 7,
Wherein the step of positioning comprises positioning the plate-like member by positioning the position of the tip of the projecting member to the position of the outer periphery of the plate-like member. 9. The method of claim 8,
Wherein the plate member is a heat sink or an electromagnetic shield plate. 10. The method of claim 9,
Wherein the resin material is any one of a granular, granular, powder, paste, or liquid resin at room temperature. 11. The method according to any one of claims 7 to 10,
Preparing a supply module for supplying the plate-shaped member and the resin material;
Preparing at least one molding module having the molding die and the mold releasing mechanism
Further comprising:
Wherein the supply module and the one molding module are detachable,
Wherein the one molding module is detachable with respect to the other molding module. 12. The method of claim 11,
Wherein the supply module is divided into a plate-shaped member supply module for supplying the plate-shaped member and a resin material supply module for supplying the resin material,
Wherein the plate-like member supply module and the resin material supply module are attachable and detachable.
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JP6298719B2 (en) 2018-03-20
TW201546977A (en) 2015-12-16

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