CN107685412B

CN107685412B - Molding die, resin molding apparatus, and method for manufacturing resin molded product

Info

Publication number: CN107685412B
Application number: CN201710573768.1A
Authority: CN
Inventors: 田村孝司
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2016-08-03
Filing date: 2017-07-14
Publication date: 2020-03-06
Anticipated expiration: 2037-07-14
Also published as: CN107685412A; TWI669202B; KR102037098B1; JP2018020477A; TW201805133A; KR20180015568A; JP6827283B2

Abstract

The invention provides a molding die, a resin molding device and a method for manufacturing a resin molded product. The object is to reduce the manufacturing cost of a mold used for manufacturing a variety of resin molded products. The molding die (17) is a molding die having a first die (18) and a second die (2) which are arranged to face each other, the first die (18) is provided with a frame-shaped member (6) and an inner member (5) which is arranged inside the frame-shaped member (6), the frame-shaped member (6) and the inner member (5) are capable of moving relative to each other in the vertical direction, a step portion (7) is provided on the outer periphery of the profile of the inner member (5), the first member (19) is capable of being attached to a position of the frame-shaped member (6) corresponding to the step portion (7), and the second member is capable of being attached to the inner member (5).

Description

Molding die, resin molding apparatus, and method for manufacturing resin molded product

Technical Field

The present invention relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product, which are used in the case of resin-packaging chip-shaped electronic devices such as transistors, Integrated Circuits (ICs), and Light Emitting Diodes (LEDs).

Background

Conventionally, an object such as a substrate or a semiconductor wafer on which a semiconductor chip is mounted is resin-sealed using a resin molding apparatus. In a resin molding apparatus, a mold arranged to face each other is clamped to seal an object with resin. For example, a mold used in a resin molding apparatus using a compression molding method is disclosed (see patent document 1).

Patent document 1: japanese patent laid-open publication No. 2005-88395

However, the molding die disclosed in patent document 1 has the following problems. As shown in fig. 1 of patent document 1, the molding die is configured by a plurality of component parts such as a cavity 22, a cavity support block 24, a jig 26, a jig setting block 28, and a jig locking block 29. The size and shape of the object to be resin-sealed are various. If the size or shape of the object is different, it is necessary to newly fabricate the molding die. If there are many component parts for constructing the mold, the manufacturing cost of the mold increases. If a large number of products are produced in a small amount, the manufacturing cost of the molding die is significantly increased. In addition, this also has a problem of a decrease in productivity.

Disclosure of Invention

The present invention has been made to solve the above-described problems, and an object thereof is to provide a mold, a resin molding apparatus, and a method for manufacturing a resin molded article, which can reduce the manufacturing cost of the mold used for manufacturing a plurality of types of resin molded articles and can improve the productivity in molding a plurality of types of resin molded articles.

In order to solve the above problems, a mold of the present invention is a mold having a first mold and a second mold disposed opposite to each other,

the first mold includes a frame-shaped member and an inner member disposed inside the frame-shaped member,

the frame-like member and the inner member are capable of moving relative to each other in the vertical direction,

a step is provided on the outer periphery of the profile of the inner part,

a first member is attachable to the frame-like member at a position corresponding to the step portion,

a second part can be mounted on the inner part.

the inner member is interchangeable between a member having a shape in which a stepped portion is provided on an outer peripheral portion of the mold surface and a member having a shape in which the stepped portion is not provided,

a first member can be attached to the frame-shaped member at a position corresponding to the step portion.

a step is provided on the outer periphery of the profile of the inner part, and a second part can be mounted on the inner part,

the frame-like member is interchangeable between a member having a shape in which a protruding portion protruding to a position corresponding to the step portion is provided and a member having a shape in which the protruding portion is not provided.

According to the present invention, the production cost of a mold used for producing a multi-product resin molded product can be reduced, and the productivity in molding a multi-product resin can be improved.

Drawings

Fig. 1 is a schematic view showing a molding die used as a first embodiment in a molding die of embodiment 1, wherein (a) is a plan view and (b) is a sectional view taken along line a-a.

Fig. 2 is a schematic diagram showing a second embodiment of a mold used in the mold according to embodiment 1, wherein (a) is a plan view and (B) is a sectional view taken along line B-B.

Fig. 3 is a schematic view showing a mold used as a third embodiment in the mold according to embodiment 1, wherein (a) is a plan view and (b) is a cross-sectional view taken along line C-C.

Fig. 4 is a schematic view showing a molding die used as a fourth embodiment in the molding die of embodiment 1, wherein (a) is a plan view and (b) is a cross-sectional view taken along line D-D.

Fig. 5 (a) and (b) are schematic cross-sectional views each showing a mold used as a fifth embodiment of the mold according to embodiment 1.

Fig. 6 is a schematic view showing a molding die used as a sixth mode in the molding die of embodiment 2, wherein (a) is a plan view and (b) is a cross-sectional view taken along line E-E.

Fig. 7 is a schematic diagram showing a mold used as a seventh mode in the mold according to embodiment 2, wherein (a) is a plan view and (b) is a sectional view taken along line F-F.

Fig. 8 is a plan view schematically showing an apparatus in the resin molding apparatus according to embodiment 3.

Fig. 9 (a) to (d) are schematic cross-sectional views showing a process for producing a resin molded article in embodiment 3.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. Any drawings in this document are for ease of understanding and are drawn schematically with appropriate omissions or exaggerations. The same reference numerals are given to the same constituent elements, and the description thereof is appropriately omitted. In the present document, "resin molding" refers to molding of a resin by a mold, and is a conceptual expression including "resin encapsulation" in which an encapsulation resin portion is molded by a mold. The term "resin molded article" refers to a product including at least a resin portion after resin molding, and is a conceptual expression of a substrate after encapsulation including a form in which a semiconductor chip mounted on a substrate described later is resin-molded by a molding die and resin-encapsulated.

[ embodiment 1]

(Structure of Forming die)

The mold of the present invention is a mold capable of producing resin molded articles of different sizes or shapes by selectively attaching a part of the mold. The molding die is composed of a common part used in common for all products and a selective part used corresponding to a specific product. In embodiment 1, a case is described in which a substrate such as a printed circuit board or a lead frame, which is an object to be resin-molded, is resin-molded. Next, the structure of each of the five molding dies used in embodiment 1 will be described with reference to fig. 1 to 5. The selection member is a member that is selectively attached to other selection members.

The following describes first to fifth embodiments as specific examples of embodiment 1 of the present invention.

(first mode)

The structure of a mold used as a first embodiment, which is an example of embodiment 1, will be described with reference to fig. 1. The mold shown in fig. 1 is used, for example, in a resin molding apparatus using a compression molding method. The molding die shown in the first aspect is, for example, a molding die used in a case where a substrate to be resin-molded is rectangular in shape and large in size. Since the substrate to be resin-molded is large, the cavity provided in the molding die corresponding to the substrate is also large.

As shown in fig. 1 (b), the mold 1 includes an upper mold 2 and a lower mold 3 disposed opposite to the upper mold 2. The lower die 3 includes a base 4 serving as a base of the lower die 3, an inner member 5 fixed to the base 4, and a frame member 6 provided so as to surround the inner member 5. The frame member 6 has a rectangular opening 6 a. In the inner member 5, a step portion 7 is provided on an outer peripheral portion of a profile of the inner member 5. Therefore, the inner member 5 includes an upper member 5a for constructing an upper portion of the inner member 5 and a lower member 5b for constructing a lower portion of the inner member 5. An elastic member 8 such as a spring for supporting the frame-shaped member 6 is provided between the frame-shaped member 6 and the base 4.

The base 4, the inner member 5, the frame-like member 6, and the elastic member 8 of the lower die 3 are common members used for all products. At the position of the step portion 7, a selection member is provided corresponding to the size, shape, or the like of the substrate to be resin-molded. Thus, even in the case where products to be molded are different, the molding dies can be used in common by mounting a selective member suitable for the products on a common member.

The inner member 5 can be lifted and lowered along the rectangular opening 6a of the frame-like member 6. In other words, the frame-like member 6 and the inner member 5 are relatively moved in the vertical direction. The gap between the inner surface of the frame-like member 6 and the outer surface of the lower member 5b of the inner member 5 serves as a sliding portion 9 on which the inner member 5 (the lower member 5b of the inner member 5) slides.

In the first embodiment, the bottom surface member 10 as the selection member is attached to the step portion 7 of the inner member 5. The bottom member 10 is fitted into the step portion 7 of the inner member 5. The bottom surface member 10 is attached to the step portion 7 as follows: the upper surface of the bottom member 10 is aligned with the upper surface of the inner member 5 (the upper member 5a of the inner member 5), and the outer side surface of the bottom member 10 is aligned with the outer side surface of the inner member 5 (the lower member 5b of the inner member 5). Therefore, as shown in fig. 1 (b), a space surrounded by the inner surface of the frame-like member 6, the inner member 5, and the upper surface of the bottom member 10 constitutes a cavity 11 in the lower die 3.

The gap between the inner surface of the frame-like member 6 and the outer surface of the bottom member 10 serves as a sliding portion 12 for sliding the bottom member 10. The sliding portion (gap) 9 communicates with the sliding portion (gap) 12. Therefore, the inner member 5 and the bottom member 10 can be integrally lifted and lowered along the sliding portions 9 and 12.

A large-sized substrate 14 on which, for example, a semiconductor chip 13 is mounted is supplied to the upper die 2. The substrate 14 is fixed to the upper mold 2 by clamping or suction so that the surface on which the semiconductor chip 13 is mounted faces downward. In the present embodiment, a case is shown in which the substrate 14 is sucked and fixed to the upper die 2 by a suction mechanism (not shown) through a plurality of suction holes 15 provided in the upper die 2. The molding die 1 shown in the first mode is a molding die used in a case where the substrate 14 to be resin-molded is large. More specifically, the size of the substrate 14 is larger than the size of the substrate 24 of the second embodiment shown in fig. 2 and the size of the substrate 35 of the third embodiment shown in fig. 3, which will be described later.

The release film 16 for facilitating the release of the resin molded product is supplied to the lower mold 3. The release film 16 is sucked along the mold surface of the cavity 11 by a suction mechanism (not shown). In the first embodiment, the release film 16 is sucked onto the mold surface of the cavity 11 through the slide portion 12 and the slide portion 9.

According to the first aspect, the bottom surface member 10 as the selection member is attached to the step portion 7 of the inner member 5. Thus, the cavity 11 in the lower die 3 is formed by the inner surface of the frame-like member 6 and the upper surfaces of the inner member 5 and the bottom member 10. In the mold 1 shown in the first embodiment, a cavity 11 having a large size can be provided in the lower mold 3 by attaching the bottom member 10 as an optional member. Therefore, the semiconductor chip 13 mounted on the large-sized substrate 14 can be resin-packaged using the mold 1.

(second mode)

The structure of a mold used as a second embodiment, which is an example of embodiment 1, will be described with reference to fig. 2. The molding die shown in the second mode is a molding die used in a case where a substrate to be resin-molded is small. Since the substrate to be resin-molded is small, the cavity is also small corresponding to the substrate. Here, the case where the substrate and the cavity are small means a case where the substrate and the cavity are smaller in size than the substrate of the first embodiment shown in fig. 1.

As shown in fig. 2 (b), the mold 17 includes an upper mold 2 and a lower mold 18 disposed to face the upper mold 2. As in the first embodiment, the lower die 18 includes a base 4 serving as a base of the lower die 18, an inner member 5 fixed to the base 4, and a frame member 6 surrounding the inner member 5. A step 7 is provided on the outer periphery of the profile of the inner part 5. The inner member 5 includes an upper member 5a for constructing an upper portion of the inner member 5 and a lower member 5b for constructing a lower portion of the inner member 5. An elastic member 8 such as a spring is provided between the frame-like member 6 and the base 4. The lower die 18 is configured by the same elements as those of the first embodiment. These component parts are component parts common to all products. More specifically, the base 4, the inner member 5, and the frame-like member 6 are common component members for the lower mold 3 according to the first embodiment (fig. 1) and the fifth embodiment (fig. 5a) described later, the lower mold 18 according to the second embodiment (fig. 2) and the fifth embodiment (fig. 5b) described later, the lower mold 28 according to the third embodiment (fig. 3) described later, and the lower mold 38 according to the fourth embodiment (fig. 4) described later.

In the second embodiment, a side member 19 as an optional member is attached to an inner upper portion of the frame-like member 6. As shown in fig. 2 (b), the side member 19 is attached to a position corresponding to the step portion 7 of the inner member 5. The side member 19 is attached to the inner upper portion of the frame-like member 6 such that the upper surface of the side member 19 is aligned with the upper surface of the frame-like member 6. The lower die 18 has a cavity 20 in the lower die 18, which is defined by the inner surface of the side member 19 and the upper surface of the inner member 5 (the upper member 5a of the inner member 5). An elastic member 21 for supporting the side member 19 is provided between the side member 19 and the lower member 5b of the inner member 5.

The gap between the inner surface of the side member 19 attached to the upper portion of the frame-like member 6 and the outer surface of the upper member 5a of the inner member 5 is a sliding portion 22 on which the upper member 5a slides. The sliding portion 22 (gap) communicates with the sliding portion 9 (gap) via the step portion 7. Therefore, the upper member 5a of the inner member 5 moves up and down along the slide portion 22, and the lower member 5b of the inner member 5 moves up and down along the slide portion 9.

A substrate 24 having a small size and mounted with a semiconductor chip 23 is supplied to the upper die 2. The substrate 24 is sucked onto the upper mold 2 by being sucked through the plurality of suction holes 15 provided in the upper mold 2 so that the surface on which the semiconductor chip 23 is mounted faces downward.

The molding die 17 shown in the second mode is a molding die used in a case where the substrate 24 to be resin-molded is small. Therefore, the substrate 24 is sucked using the suction holes 15 covered within the size range of the substrate 24 among the suction holes 15 provided in the upper die 2. The suction holes 15a not covered in the size range of the substrate 24 are suction holes that do not contribute to the suction of the substrate 24. Therefore, when the substrate 24 is sucked, the suction hole 15a is closed by the fixing member 25 or the like to prevent air leakage. Alternatively, it is also possible to connect the suction holes 15a and the suction holes 15 for sucking the substrate 24 to different suction mechanisms, respectively, and to suck the substrate 24 using only the suction mechanism connected to the suction holes 15.

In the second embodiment, the release film 26 is supplied to the lower mold 18 in the same manner as in the first embodiment. The release film 26 is sucked along the mold surface of the cavity 20 by a suction mechanism (not shown). In the second embodiment, the release film 26 is sucked onto the mold surface of the cavity 20 through the slide portion 22, the step portion 7, and the slide portion 9.

According to the second aspect, the side member 19 as the selection member is attached to the inner upper portion of the frame member 6. Thus, the cavity 20 in the lower die 18 is configured by the inner surface of the side member 19 and the inner member 5 (the upper member 5a of the inner member 5). In the mold 17 shown in the second embodiment, a side member 19 as an optional member is attached, whereby a cavity 20 having a small size can be provided in the lower mold 18. Therefore, the semiconductor chip 23 mounted on the substrate 24 having a small size can be resin-packaged using the mold 17.

As shown in the first and second embodiments, a stepped portion 7 is provided on the outer peripheral portion of the profile of the inner member 5. The inner member 5 includes an upper member 5a for constructing an upper portion of the inner member 5 and a lower member 5b for constructing a lower portion of the inner member 5. The planar area of the upper member 5a of the inner member 5 corresponds to the smallest planar area of the cavity, and the planar area of the lower member 5b of the inner member 5 corresponds to the largest planar area of the cavity. Therefore, the size of the cavity that can be used in the lower mold is set by the planar area of the upper member 5a and the planar area of the lower member 5b of the inner member 5.

(third mode)

The structure of a mold used as a third embodiment, which is an example of embodiment 1, will be described with reference to fig. 3. The mold according to the third aspect is used for resin molding of a substrate having an intermediate size between the sizes of the substrates according to the first and second aspects.

As shown in fig. 3 (b), the mold 27 includes an upper mold 2 and a lower mold 28 disposed opposite to the upper mold 2. The lower die 28 includes a base 4, an inner member 5 fixed to the base 4, and a frame-like member 6 surrounding the inner member 5. A step 7 is provided on the outer periphery of the profile of the inner part 5. The inner member 5 includes an upper member 5a for constructing an upper portion of the inner member 5 and a lower member 5b for constructing a lower portion of the inner member 5. An elastic member 8 is provided between the frame-like member 6 and the base 4. The lower mold 28 is configured by the same elements as those of the first and second embodiments.

In the third aspect, a bottom surface member 29 as an optional member is attached to the step portion 7 of the inner member 5. The bottom member 29 is attached to the step portion 7 of the inner member 5 such that the upper surface of the bottom member 29 is aligned with the upper surface of the inner member 5 (the upper member 5a of the inner member 5).

A side member 30 as an optional member is attached to an inner upper portion of the frame member 6. The side member 30 is attached to a position corresponding to the step portion 7 of the inner member 5. The side member 30 is attached to the inner upper portion of the frame-like member 6 such that the upper surface of the side member 30 is aligned with the upper surface of the frame-like member 6.

The lower die 28 has a cavity 31 in the lower die 28 defined by the inner surface of the side member 30 and the upper surfaces of the inner member 5 and the bottom member 29. An elastic member 32 for supporting the side member 30 is provided between the side member 30 and the lower member 5b of the inner member 5.

The gap between the inner surface of the side member 30 attached to the upper portion of the frame-like member 6 and the outer surface of the bottom member 29 attached to the upper member 5a of the inner member 5 is a sliding portion 33 in which the upper member 5a and the bottom member 29 slide together. The sliding portion (gap) 33 communicates with the sliding portion (gap) 9 via the step portion 7. Therefore, the upper member 5a and the bottom member 29 of the inner member 5 move up and down along the slide portion 33, and the lower member 5b of the inner member 5 moves up and down along the slide portion 9.

The intermediate substrate 35 on which the semiconductor chip 34 is mounted is supplied to the upper mold 2. The substrate 35 is sucked onto the upper mold 2 by being sucked through the plurality of suction holes 15 provided in the upper mold 2 so that the surface on which the semiconductor chip 34 is mounted faces downward.

The molding die 27 shown in the third mode is a molding die used in a case where the size of the substrate 35 to be resin-molded is an intermediate size. As in the second embodiment, the substrate 35 is sucked by the suction holes 15 provided in the suction holes 15 of the upper die 2 and covered within the size range of the substrate 35. The suction holes 15a not covered within the size range of the substrate 35 are blocked by the fixing member 25 to prevent air leakage.

The release film 36 is supplied to the lower mold 28. The release film 36 is sucked along the mold surface of the cavity 31 by a suction mechanism (not shown). In the third embodiment, the release film 36 is sucked onto the mold surface of the cavity 31 through the slide portion 33, the step portion 7, and the slide portion 9.

According to the third aspect, the bottom surface member 29 as the selection member is attached to the step portion 7 of the inner member 5. A side member 30 as an optional member is attached to an inner upper portion of the frame member 6. Thus, the cavity 31 in the lower die 28 is formed by the inner side surface of the side member 30 and the upper surfaces of the inner member 5 and the bottom member 29. In the mold 27 shown in the third embodiment, a bottom member 29 and a side member 30, which are optional members, are attached, so that a cavity 31 having an intermediate size can be provided in the lower mold 28. Therefore, the semiconductor chip 34 mounted on the intermediate-sized substrate 35 can be resin-packaged using the mold 27. The intermediate-sized cavity 31 means that the size of the cavity 31 of the third embodiment is between the size of the cavity 11 of the first embodiment and the size of the cavity 20 of the second embodiment.

As shown in the first to third aspects, a stepped portion 7 is provided on the outer peripheral portion of the profile of the inner member 5. A bottom member as an optional member may be attached to the step portion 7 of the inner member 5. On the other hand, a side member as an optional member may be attached to a position corresponding to the stepped portion 7 of the inner member 5 in the inner upper portion of the frame-like member 6. Therefore, by selectively attaching the bottom member and the side member as the option members, a cavity of an arbitrary size can be provided in the lower mold. Thus, even if the substrates are different in size, resin molding can be performed by merely exchanging and mounting the option member.

(fourth mode)

The structure of a mold used as a fourth embodiment, which is an example of embodiment 1, will be described with reference to fig. 4. The mold shown in the fourth aspect is used when the shape of the resin molded article obtained by resin molding is different from the shapes of the resin molded articles shown in the first to third aspects. In other words, the mold cavity of the fourth aspect is different from the mold cavity of the first to third aspects.

As shown in fig. 4 (b), the mold 37 includes an upper mold 2 and a lower mold 38 disposed opposite the upper mold 2. The lower die 38 includes a base 4, an inner member 5 fixed to the base 4, a frame-like member 6 surrounding the inner member 5, and an elastic member 8 provided between the frame-like member 6 and the base 4. These structures are the same as the first to third modes.

In the fourth aspect, as shown in fig. 4 (a), for example, a bottom member 39 having a polygonal (hexagonal) shape in plan view is attached to the step portion 7 of the inner member 5 as an optional member. The bottom member 39 is fitted to the outer surface of the upper member 5a of the inner member 5. The bottom member 39 is attached to the step portion 7 of the side member 5 such that the upper surface of the bottom member 39 is aligned with the upper surface of the inner member 5.

A side member 40 formed in a shape (polygonal (hexagonal) shape) corresponding to the bottom member 39 is attached as an optional member to the inner upper portion of the frame-like member 6. As shown in fig. 4 (a), the side surface member 40 has a polygonal opening 40a corresponding to the shape of the bottom surface member 39. The side member 40 is attached to the inner upper portion of the frame-like member 6 such that the upper surface of the side member 40 is aligned with the upper surface of the frame-like member 6.

The lower die 38 has a cavity 41 in the lower die 38 defined by the inner surface of the side member 40 and the upper surfaces of the inner member 5 and the bottom member 39. The cavity 41 has a polygonal shape corresponding to the shape of the bottom surface member 39. An elastic member 42 for supporting the side member 40 is provided between the side member 40 and the lower member 5b of the inner member 5.

The gap between the inner surface of the side member 40 attached to the upper portion of the frame-like member 6 and the outer surface of the bottom member 39 attached to the upper member 5a of the inner member 5 is a sliding portion 43 in which the upper member 5a and the bottom member 39 slide integrally. The sliding portion (gap) 43 communicates with the sliding portion (gap) 9 via the step portion 7.

A substrate 46 on which a semiconductor chip 44 including a high-voltage device and a control system semiconductor chip 45 are mounted is supplied to the upper mold 42. The substrate 46 is attracted to the upper mold 2 so that the surface on which the semiconductor chips 44 and 45 are mounted faces downward. The suction holes 15a not covered within the size range of the base plate 46 are blocked by the fixing member 25 to prevent air leakage.

The release film 47 is supplied to the lower mold 38. The release film 47 is sucked along the mold surface of the cavity 41 by a suction mechanism (not shown). In the fourth embodiment, the release film 47 is sucked to the mold surface of the cavity 41 through the slide portion 43, the step portion 7, and the slide portion 9.

According to the fourth aspect, the bottom surface member 39 having a polygonal shape is attached as the optional member to the step portion 7 of the inner member 5. A side member 40 corresponding to the shape of the bottom member 39 is attached as an optional member to the inner upper portion of the frame-like member 6. Thus, the cavity 41 having a polygonal shape can be formed in the lower die 38 by the inner surface of the side member 40 and the upper surfaces of the inner member 5 and the bottom member 39. Therefore, a resin molded article having a polygonal shape can be manufactured using the mold 37.

In the fourth aspect, a bottom surface member 39 having a polygonal shape is attached as an optional member to the step portion 7 of the inner member 5. Without being limited thereto, a bottom member having a circular shape, an elliptical shape, a trapezoidal shape, or a special shape may be attached to the step portion 7 of the inner member 5 as an optional member. Therefore, by selecting the shapes of the bottom surface member and the side surface member as the selection member in accordance with the product, a resin molded article having an arbitrary shape can be manufactured.

(fifth mode)

A structure of a mold used as a fifth embodiment as an example of embodiment 1 will be described with reference to fig. 5. The mold according to the fifth aspect is a mold capable of adjusting the thickness of a resin molded product by changing the depth of the cavity.

The mold shown in fig. 5 (a) is used for resin molding of a large-sized substrate. As shown in fig. 5a, in the mold 1 according to the first embodiment (fig. 1), a plate-like member 48 as an optional member is attached to the upper surfaces of the inner member 5 (the upper member 5a of the inner member 5) and the bottom member 10. In other words, the plate-like member 48 is mounted on the mold surface of the cavity 11. This allows the depth of the cavity 11 to be arbitrarily changed. The release film 16 is disposed on the plate-like member 48. In the structure of fig. 5 (a), the bottom member 10 may be omitted.

The mold shown in fig. 5 (b) is used for resin molding of a small-sized substrate. As shown in fig. 5b, in the mold 17 according to the second embodiment (fig. 2), a plate-like member 49 as an optional member is attached to the upper surface of the inner member 5 (the upper member 5a of the inner member 5). A plate-like member 49 is mounted on the mold surface of the cavity 20. This allows the depth of the cavity 20 to be arbitrarily changed. The release film 26 is disposed on the plate member 49.

According to the fifth aspect, the plate-like member as the option member is attached to the mold surface of the cavity. This enables the depth of the cavity to be arbitrarily changed. Therefore, the thickness of the resin molded product can be adjusted by changing the depth of the cavity in accordance with the product. The plate-like member can be fitted to a cavity having any size and shape.

As shown in the first to fifth aspects, in embodiment 1 of the present invention, the lower mold includes the base 4, the inner member 5, the frame-like member 6, and the elastic member 8, which are common members. The bottom surface member, the side surface member, and the plate-like member as the selection members can be selectively mounted on the lower die in accordance with the shape, size (area), and thickness of the resin molded product. Therefore, even if the product is different, resin molding can be performed by manufacturing and mounting only a part of the selected member without newly manufacturing a set of molding dies. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, the delivery time for manufacturing the molding die can be shortened. In addition, productivity of resin molding can be improved.

(Effect)

In embodiment 1, the

molds

1 and 17 have the following structures: that is, the molding dies 1 and 17 have lower dies 3 and 18 as first dies and an upper die 2 as a second die, which are disposed to face each other, the lower dies 3 and 18 include a frame-like member 6 and an inner member 5 disposed inside the frame-like member 6, the frame-like member 6 and the inner member 5 are relatively movable in the vertical direction, a step portion 7 is provided on an outer peripheral portion of a mold surface of the inner member 5, a side member 19 as a first member is attachable to a position of the frame-like member 6 corresponding to the step portion, and a bottom member 19 as a second member is attachable to the inner member 5.

With such a configuration, the inner member 5 and the frame-like member 6 can be made common to all products, and the bottom member 10 and the side members 19 can be made selectable members selected according to a specific product. Therefore, a cavity having an arbitrary shape, size, and depth can be provided in the lower die corresponding to the product. Even if the substrate to be resin-molded is different, resin molding can be performed by making and mounting only a part of the selected parts without newly making a set of molding dies. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, the delivery time for manufacturing the molding die can be shortened. In addition, productivity of resin molding can be improved.

According to the first aspect, the bottom member 10 as an optional member is attached to the step portion 7 of the inner member 5 of the lower mold 3. Thus, the cavity 11 in the lower die 3 is formed by the inner surface of the frame-like member 6 and the upper surfaces of the inner member 5 and the bottom member 10. By attaching the bottom member 10 as an optional member to the inner member 5, a cavity 11 having a large size can be provided in the lower die 3. Therefore, the semiconductor chip 13 mounted on the large-sized substrate 14 can be resin-packaged using the mold 1.

According to the second aspect, the lower die 18 is provided with the side member 19 as the optional member attached to the inner upper portion of the frame member 6. Thereby, the cavity 20 in the lower die 18 is constructed by the inner surface of the side member 19 and the upper surface of the inner member 5. By attaching the side member 19 as the optional member to the frame-like member 6, the cavity 20 having a small size can be provided in the lower die 18. Therefore, the semiconductor chip 23 mounted on the substrate 24 having a small size can be resin-packaged using the mold 17.

According to the third aspect, the lower mold 28 is provided with the bottom member 29 as the optional member attached to the step portion 7 of the inner member 5, and the side member 30 as the optional member attached to the inner upper portion of the frame-like member 6. Thus, the cavity 31 in the lower die 28 is formed by the inner side surface of the side member 30 and the upper surfaces of the inner member 5 and the bottom member 29. By attaching the bottom member 29 as the option member to the inner member 5 and attaching the side member 19 as the option member to the frame-like member 6, the cavity 31 having an intermediate size can be provided in the lower die 28. Therefore, the semiconductor chip 34 mounted on the intermediate-sized substrate 35 can be resin-packaged using the mold 27.

According to the fourth aspect, the lower mold 38 is attached with the bottom member 39 having a polygonal shape as an optional member to the step portion 7 of the inner member 5, and the side member 40 corresponding to the shape of the bottom member 39 as an optional member to the inner upper portion of the frame-like member 6. Thus, a cavity 41 having a polygonal shape is formed in the lower die 38 by the inner side surface of the side member 40 and the upper surfaces of the inner member 5 and the bottom member 39. By attaching the bottom member 39 having a different shape to the inner member 5 and attaching the side member 40 having a shape corresponding to the bottom member 39 to the frame-like member 6, the cavities 41 having a different shape can be provided in the lower die 38. Therefore, resin molded articles having different shapes can be manufactured using the mold 37.

According to a fifth aspect, a plate-like member as an optional member is attached to the cavity surface of the lower mold. This enables the depth of the cavity to be arbitrarily changed. Therefore, the depth of the cavity can be changed according to the product to adjust the thickness of the resin molded product. The plate-like member can be attached to a cavity having an arbitrary shape and size.

According to embodiment 1, the lower mold includes the base 4, the inner member 5, the frame-like member 6, and the elastic member 8, which are common members. The bottom member, the side member, and the plate-like member as the selection member can be selectively mounted on the lower die in accordance with the shape, size, and thickness of the resin molded product. Thus, even if the product is different, resin molding can be performed by manufacturing and mounting only a part of the selected member without newly manufacturing a set of molding dies. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, the delivery time for manufacturing the molding die can be shortened. In addition, productivity of resin molding can be improved.

[ embodiment 2]

Next, a sixth aspect and a seventh aspect, which are specific examples of embodiment 2 of the present invention, will be described.

(sixth mode)

A structure of a mold used as a sixth embodiment as an example of embodiment 2 will be described with reference to fig. 6. The mold described in embodiment 2 is used for resin-sealing a wafer having a circular shape such as a silicon wafer as an object to be resin-molded. In the sixth aspect, a mold for resin-sealing a silicon wafer having a diameter of 300mm as a maximum wafer, for example, will be described.

As shown in fig. 6 (b), the mold 50 includes an upper mold 51 and a lower mold 52 disposed opposite to the upper mold 51. The lower die 52 includes a base 53, an inner member 54 fixed to the base 53, and a frame member 55 surrounding the inner member 54. The inner part 54 is provided with a step 56 at the outer periphery of the profile of the inner part 54. The inner member 54 includes an upper member 54a for constructing an upper portion of the inner member 54 and a lower member 54b for constructing a lower portion of the inner member 54. As shown in fig. 6 (a), the upper member 54a and the lower member 54b of the inner member 54 have a circular shape. An elastic member 57 for supporting the frame-like member 55 is provided between the frame-like member 55 and the base 53.

In embodiment 2, there are common members as in embodiment 1, and the base 53, the inner member 54, the frame-like member 55, and the elastic member 57 of the lower mold 52 are common members used in common for resin molding of wafers having different diameters in a seventh embodiment to be described later. A selection member is provided at the position of the step portion 56 in correspondence with the diameter of the wafer. Even if the diameter of the wafer is different, the wafer can be resin-packaged by exchanging only the selection member.

In embodiment 2, a mold capable of resin-sealing a wafer having a diameter of, for example, 150mm (6 inches) to 300mm (12 inches) will be described. When the mold is closed, the upper mold 51 and the lower mold 52 clamp the periphery of the wafer within a range of 5mm from the end of the wafer. Thus, the diameter of the upper member 54a of the inner member 54 is set to 140mm (see fig. 7 a), and the diameter of the lower member 54b of the inner member 54 is set to 290mm (see fig. 6 a). The diameter of the resin-encapsulatable wafer can be set by the diameters of the upper member 54a and the lower member 54b of the inner member 54.

The frame member 55 and the inner member 54 move relative to each other in the vertical direction. The gap between the inner surface of the frame-like member 55 and the outer surface of the lower member 54b of the inner member 54 is a sliding portion 58 on which the inner member 54 (the lower member 54b of the inner member 54) slides.

In a sixth embodiment which is an example of embodiment 2, a bottom surface member 59 which is an optional member is attached to the step portion 56 of the inner member 54. The bottom member 59 has an annular shape and is fitted into the step portion 56 of the inner member 54. The bottom surface member 59 is attached to the step portion 56 such that the upper surface of the bottom surface member 59 is aligned with the upper surface of the inner member 54 and the outer side surface of the bottom surface member 59 is aligned with the outer side surface of the inner member 54. Therefore, as shown in fig. 6 (b), a cavity 60 in the lower die 52 is configured by a space surrounded by the inner surface of the frame-like member 55 and the upper surfaces of the inner member 54 and the bottom member 59.

The gap between the inner surface of the frame-like member 55 and the outer surface of the bottom member 59 is a sliding portion 61 through which the bottom member 59 slides. The sliding portion (gap) 61 communicates with the sliding portion (gap) 58. Therefore, the inner member 54 and the bottom member 59 are integrally lifted and lowered along the sliding

portions

58 and 61.

A 300mm wafer 63 with semiconductor chips 62 mounted thereon, for example, is supplied to the upper die 51. The 300mm wafer 63 is sucked onto the upper die 51 by being sucked through a plurality of suction holes 64 provided in the upper die 2 with the surface mounted with the semiconductor chip 62 facing downward.

A release film 65 for facilitating the release of the resin-encapsulated wafer is supplied to the lower mold 52. The release film 65 is sucked along the mold surface of the cavity 60 by a suction mechanism (not shown). In the sixth embodiment, the release film 65 is sucked onto the mold surface of the cavity 60 through the slide portion 61 and the slide portion 58.

According to the sixth aspect, the bottom surface member 59 as the selection member is attached to the step portion 56 of the inner member 54. Thus, the cavity 60 in the lower die 52 is configured by the inner surface of the frame-like member 55 and the upper surfaces of the inner member 54 and the bottom member 59. In the mold 50 shown in the sixth embodiment, a cavity 60 corresponding to a 300mm wafer 63 can be provided in the lower mold 52 by attaching a bottom member 59 as an optional member. Therefore, the semiconductor chip 62 mounted on the 300mm wafer 63 can be resin-packaged using the mold 50.

(seventh mode)

A structure of a mold used as a seventh aspect as an example of embodiment 2 will be described with reference to fig. 7. The case where the mold shown in the seventh aspect is a mold for resin-sealing a silicon wafer having a diameter of 150mm as a smallest wafer will be described.

As shown in fig. 7 (b), the mold 66 includes an upper mold 51 and a lower mold 67 disposed opposite to the upper mold 51. The lower die 67 includes a base 53, an inner member 54 fixed to the base 53, a frame member 55 surrounding the inner member 54, and an elastic member 57 provided between the frame member 55 and the base 53. These structures are the same as the sixth mode.

In the seventh aspect, a side member 68 as an optional member is attached to an inner upper portion of the frame member 55. The side member 68 has an annular shape and is attached to a position corresponding to the step portion 56 of the inner member 54. The side member 68 is attached to the inner upper portion of the frame-like member 55 such that the upper surface of the side member 68 is aligned with the upper surface of the frame-like member 55. In the lower mold 67, a cavity 69 in the lower mold 67 is configured by a space surrounded by the inner surface of the side member 68 and the upper surface of the inner member 54. An elastic member 70 for supporting the side member 68 is provided between the side member 68 and the lower member 54b of the inner member 54.

The gap between the inner surface of the side member 68 attached to the upper portion of the frame-like member 55 and the outer surface of the upper member 54a of the inner member 54 is a sliding portion 71 on which the upper member 54a slides. The sliding portion (gap) 71 communicates with the sliding portion (gap) 58 via the step portion 56.

The 150mm wafer 73 with the semiconductor chip 72 mounted thereon is supplied to the upper die 51. The 150mm wafer 73 is sucked onto the upper die 51 by being sucked through the plurality of suction holes 64 provided in the upper die 51 so that the surface on which the semiconductor chip 72 is mounted faces downward. As in embodiment 1, the suction holes 64a not covered within the size range of the 150mm wafer 73 are blocked by the fixing member 74 to prevent air leakage.

The release film 75 is supplied to the lower mold 67. The release film 75 is sucked along the mold surface of the cavity 69 by a suction mechanism (not shown). In the seventh aspect, the release film 75 is sucked onto the mold surface of the cavity 69 through the slide portion 71, the step portion 56, and the slide portion 58.

According to the seventh aspect, the side member 68 as the selection member is attached to the inner upper portion of the frame member 55. Thereby, the cavity 69 in the lower die 67 is configured by the inner side surface of the side member 68 and the upper surface of the inner member 54. In the mold 66 shown in the seventh aspect, a side member 68 is attached as an optional member, whereby a cavity 69 corresponding to a 150mm wafer 73 can be provided in the lower mold 67. Therefore, the semiconductor chip 72 mounted on the 150mm wafer 73 can be resin-packaged using the mold 66.

In embodiment 2, as in embodiment 1, a plate-like member as an optional member can be attached to the cavity surface. This enables the depth of the cavity to be arbitrarily changed. Therefore, even when the wafer is resin-sealed, the thickness of the resin molded product can be adjusted.

(Effect)

In embodiment 2, the molding dies 50 and 66 have the following configurations: that is, the molding dies 50 and 66 have lower dies 52 and 67 as first dies and an upper die 51 as a second die, which are disposed to face each other, the lower dies 52 and 67 include a frame-like member 55 and an inner member 54 disposed inside the frame-like member 55, the frame-like member 55 and the inner member 54 are relatively movable in the vertical direction, a stepped portion 56 is provided on an outer peripheral portion of a mold surface of the inner member 54, a side member 68 as a first member is attachable to a position of the frame-like member 55 corresponding to the stepped portion 56, and a bottom member 59 as a second member is attachable to the inner member 54 selectively to the side member 68.

With this configuration, the inner member 54 and the frame-like member 55 can be made common to the resin-encapsulatable wafers, and the bottom surface member 59 and the side surface member 68 can be made selectable members selected according to the diameter of the wafers to be resin-encapsulated. Therefore, a cavity corresponding to the wafer of the aperture to be resin-sealed can be provided in the lower mold. Even if the diameter of the wafer is different, resin molding can be performed by manufacturing and mounting only a part of the selection member without newly manufacturing a set of molding dies. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, the delivery time for manufacturing the molding die can be shortened. In addition, productivity of resin molding can be improved.

According to the sixth aspect, the lower die 52 is attached with the bottom member 59 as an optional member to the step portion 56 of the inner member 54. Thus, the cavity 60 in the lower die 52 is configured by the inner surface of the frame-like member 55 and the upper surfaces of the inner member 54 and the bottom member 59. By attaching the bottom member 59 as an optional member to the inner member 54, the cavity 60 corresponding to the 300mm wafer 63 can be provided in the lower die 52. Therefore, the semiconductor chip 62 mounted on the 300mm wafer 63 can be resin-packaged using the mold 50.

According to the seventh aspect, the lower mold 67 is provided with a side member 68 as an optional member attached to an inner upper portion of the frame-like member 55. Thereby, the cavity 69 in the lower die 67 is configured by the inner side surface of the side member 68 and the upper surface of the inner member 54. By attaching the side member 68 as an optional member to the frame-like member 55, the cavity 69 corresponding to the 150mm wafer 73 can be provided in the lower die 67. Therefore, the semiconductor chip 72 mounted on the 150mm wafer 73 can be resin-packaged using the mold 66.

According to embodiment 2, the lower mold includes a base 53, an inner member 54, a frame-like member 55, and an elastic member 57, which are common members. The bottom surface member, the side surface member, and the plate-like member as the optional members can be selectively mounted on the lower die in accordance with the diameter of the wafer to be resin-encapsulated. Thus, even if the diameter of the wafer is different, resin sealing can be performed by manufacturing and mounting only a part of the optional members, and it is not necessary to newly manufacture a set of molding dies. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, the delivery time for manufacturing the molding die can be shortened. In addition, productivity of resin molding can be improved.

According to embodiment 2, a mold capable of resin-sealing a silicon wafer having a bore of 150mm to 300mm is described. Not limited to this, a mold capable of resin-sealing a 450mm wafer having a large diameter may be used. On the contrary, a mold capable of resin-sealing a wafer having a diameter of 50mm to 125mm as a wafer having a smaller diameter may be used. In addition, not only the silicon wafer but also the compound semiconductor wafer may be resin-packaged.

[ embodiment 3]

(Structure of resin Molding apparatus)

Embodiment 3 showing the structure of a resin molding apparatus including a mold according to the present invention will be described with reference to fig. 8. The resin molding apparatus shown in fig. 8 is a resin molding apparatus using a compression molding method. The present invention is applicable to a resin molding method for a printed circuit board, a lead frame, or the like.

The resin molding apparatus 76 includes a substrate supply and storage block 77, three molding blocks 78A, 78B, and 78C, and a resin supply block 79 as components. The substrate supply and storage module 77, the molding modules 78A, 78B, and 78C, and the resin supply module 79, which are components, are detachable from and exchangeable with respect to other components.

The substrate supply and storage module 77 is provided with: a package front substrate supply unit 81 for supplying the package front substrate 80; a rear substrate housing portion 83 for housing the rear substrate 82; a substrate mounting portion 84 for connecting the front substrate 80 and the rear substrate 82; and a substrate carrying mechanism 85 for carrying the front substrate 80 and the rear substrate 82. The predetermined position S1 is a position at which the substrate conveyance mechanism 85 is standing by in an unoperated state.

Each of the molding modules 78A, 78B, and 78C is provided with a molding die 1 as shown in the first embodiment (fig. 1), for example. The mold 1 includes an upper mold 2 and a lower mold 3 which is disposed opposite to the upper mold 2 and can be moved up and down. Each of the molding modules 78A, 78B, and 78C includes a mold clamping mechanism 86 (a portion indicated by a two-dot chain line in fig. 8) for clamping and opening the upper mold 2 and the lower mold 3. A cavity 11 as a space to be supplied with a resin material is provided in the lower die 3. The lower mold 3 is provided with a release film supply mechanism 87 for supplying a long release film 16 (see fig. 1).

The resin supply module 79 is provided with: an X-Y table 88; a resin material housing portion 89 for housing a resin material; a resin material charging mechanism 90 for charging the resin material storage portion 89 with a resin material; and a resin material conveying mechanism 91 for conveying the resin material accommodating portion 89. The predetermined position R1 is a position at which the resin material conveying mechanism 91 stands by in an unoperated state.

The substrate supply and storage module 77 is provided with a control unit CTL. The control unit CTL controls conveyance of the pre-package substrate 80 and the post-package substrate 82, conveyance of the resin material, heating of the mold 1, mold closing and mold opening of the mold 1, and the like. In other words, the control unit CTL controls operations of the substrate supply and storage module 77, the molding modules 78A, 78B, and 78C, and the resin supply module 79. The control unit CTL may be provided in each of the molding modules 78A, 78B, and 78C, in the resin supply module 79, or outside each of the modules. The control section CTL may be configured as a plurality of control sections at least a part of which is separated in accordance with an operation as a control target.

(operation for producing resin molded article)

With reference to fig. 8 and 9, an operation of manufacturing a resin molded product using the resin molding apparatus 76 will be described. First, in the substrate supply and storage module 77, the package front substrate 80 is sent from the package front substrate supply unit 81 to the substrate placement unit 84. Next, the substrate transport mechanism 85 moves in the-Y direction from the predetermined position S1 and receives the pre-package substrate 80 from the substrate placement unit 84. The substrate transport mechanism 85 returns to the predetermined position S1.

Next, for example, the substrate transport mechanism 85 moves in the + X direction to a predetermined position M1 of the molding module 78B. Next, in the molding module 78B, the substrate conveying mechanism 85 moves in the-Y direction and stops at a predetermined position C1 above the lower mold 3. Next, the substrate transport mechanism 85 is raised to supply the pre-package substrate 80 onto the mold surface of the upper mold 2 (see fig. 9 (a)). The substrate transport mechanism 85 returns to the predetermined position S1 of the substrate supply and storage module 77.

Next, in the resin supply module 79, the resin material accommodating portion 89 placed on the X-Y table 88 is moved in the-Y direction, and the resin material accommodating portion 89 is stopped at a predetermined position below the resin material loading mechanism 90. By moving the X-Y table 88 in the X direction and the Y direction, a predetermined amount of resin material is charged from the resin material charging mechanism 90 into the resin material storage portion 89. The X-Y table 88 on which the resin material storage portion 89 is placed is returned to the original position.

Next, the resin material conveying mechanism 91 moves in the-Y direction from the predetermined position R1, and receives the resin material accommodating portion 89 placed on the X-Y table 88. The resin material conveying mechanism 91 returns to the predetermined position R1.

Subsequently, the resin material conveying mechanism 91 moves in the-X direction to a predetermined position M1 of the molding module 78B. Next, in the molding block 78B, the resin material conveying mechanism 91 is moved in the-Y direction and stopped at a predetermined position C1 above the lower mold 3. The resin material conveying mechanism 91 is lowered to supply the resin material 92 into the cavity 11 (see fig. 9 (a)). The resin material conveying mechanism 91 returns to the predetermined position R1. Fig. 9 shows a case where a granular resin is used as the resin material 92.

Next, as shown in fig. 9 (b), a resin material 92 is melted to produce a flowable resin 93. The lower mold 3 is raised by the mold clamping mechanism 86 to clamp the upper mold 2 and the lower mold 3. By clamping, the semiconductor chip 94 mounted on the pre-package substrate 80 is immersed in the molten flowable resin 93 in the cavity 11.

Next, as shown in fig. 9 (c), the lower mold 3 is further raised to raise the inner member 5, thereby applying a predetermined resin pressure to the flowable resin 93 in the cavity 11. Next, the fluid resin 93 is heated by a heater (not shown) provided in the lower mold 3 for a time period necessary for curing the fluid resin 93. The hardening resin 95 is formed by hardening the flowable resin 93. Thus, the chip 94 mounted on the package front substrate 80 is resin-packaged by the cured resin 95 molded in accordance with the shape of the cavity 11.

Next, as shown in fig. 9 (d), after the fluid resin 93 is cured, the upper mold 2 and the lower mold 3 are opened by the mold clamping mechanism 86. A molded article 96 (a rear package substrate 82) after resin packaging is fixed to the mold surface of the upper mold 2.

Next, the substrate transport mechanism 85 is moved from the predetermined position S1 of the substrate supply and storage module 77 to the predetermined position C1 below the lower mold 2, thereby receiving the packaged substrate 82. Subsequently, the substrate transfer mechanism 85 moves and delivers the packaged substrate 82 to the substrate placement portion 84. The post-package substrate 82 is accommodated in the post-package substrate accommodating portion 83 from the substrate mounting portion 84. At this stage, the resin encapsulation is completed.

(Effect)

According to embodiment 3, a part of a mold used in a resin molding apparatus can be selectively attached. The molding die is constructed of a common member used in common for all products and selective members used corresponding to the respective products. The selection member can be selectively attached to the common member of the mold according to the shape, size and thickness of the resin molded product. Thus, even if the product is different, only a part of the selected parts can be manufactured and mounted without newly manufacturing a set of molding dies. Therefore, the manufacturing cost of the mold can be reduced for the resin molding apparatus. Further, the delivery date of the manufacturing mold can be shortened. In addition, productivity of resin molding can be improved.

Embodiment 3 shows a case where the molding die shown in the first embodiment (fig. 1) is provided on a molding die block. Not limited to this, the molding dies shown in the second to seventh aspects (fig. 2 to 7) may be provided corresponding to the resin molded product. The resin molding apparatus can cope with various products by exchanging only selected parts of the molding die.

In each embodiment, a case where a cavity is provided in a lower mold is shown. Not limited to this, the same effect is obtained also when the cavity is provided in the upper mold. When the cavity is provided in the upper mold, a mold including a frame-like member and an inner member disposed inside the frame-like member is disposed on the upper side, and a mold corresponding to the mold is disposed on the lower side. Therefore, in this case, the bottom surface member, the side surface member, and the plate-like member, which are selectively attached selection members, are also disposed on the upper mold.

The present invention can also be applied to a resin molding apparatus for molding a general resin molded product. The present invention is applicable not only to the case of resin-encapsulating electronic components, but also to the case of manufacturing optical elements such as lenses, reflectors (reflection plates), light guide plates, and optical modules, and other resin products by resin molding.

As described above, the mold according to each embodiment of the present invention has the following structure: that is, the first mold is provided with a frame-shaped member and an inner member disposed inside the frame-shaped member, the frame-shaped member and the inner member are movable relative to each other in the vertical direction, a step portion is provided on the outer periphery of the profile surface of the inner member, the first member can be attached to the frame-shaped member at a position corresponding to the step portion, and the second member can be attached to the inner member.

According to this configuration, by selectively attaching the first member or the second member, it is possible to provide a molding die capable of resin-molding objects having different sizes or shapes. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, productivity of resin molding can be improved.

Further, the mold according to each embodiment of the present invention has the following structure: in the case where the first member is attached to the frame-like member, a gap between the first member side surface and the inner member side surface which are opposed to each other and a gap between the frame-like member side surface and the inner member side surface which are opposed to each other at a position where the first member is not attached communicate.

According to this configuration, by attaching the first member to the frame-like member, it is possible to provide a mold capable of resin-molding an object having a small size. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, productivity of resin molding can be improved.

Further, the mold according to each embodiment of the present invention has the following structure: in the case where the second member is attached to the inner member, a gap between the side face of the second member and the side face of the frame-like member which face each other and a gap between the side face of the frame-like member which faces each other at a position where the second member is not attached and the inner member communicate.

According to this configuration, by attaching the second member to the inner member, it is possible to provide a mold capable of resin-molding a large-sized object. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, productivity of resin molding can be improved.

Further, the mold according to each embodiment of the present invention has the following structure: when the first member is attached to the frame-like member, the elastic member can be attached between the first member and the inner member.

According to this configuration, by attaching the first member to the frame-like member, it is possible to provide a mold capable of resin-molding an object having a small size. Therefore, the manufacturing cost of the molded article used for manufacturing the resin molded article can be reduced. In addition, productivity of resin molding can be improved.

The molding die according to each embodiment of the present invention has the following structure: that is, the first mold is provided with a frame-like member and an inner member disposed inside the frame-like member, the frame-like member and the inner member are movable relative to each other in the vertical direction, the inner member is interchangeable between a member having a shape in which a stepped portion is provided on the outer periphery of the mold surface and a member having a shape in which a stepped portion is not provided, and the first member can be attached to the frame-like member at a position corresponding to the stepped portion.

According to this configuration, by exchanging the inner member, it is possible to provide a mold capable of resin-molding objects having different sizes or shapes. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, productivity of resin molding can be improved.

The molding die according to each embodiment of the present invention has the following structure: that is, the first mold is provided with a frame-like member and an inner member disposed inside the frame-like member, the frame-like member and the inner member are movable relative to each other in the vertical direction, a step portion is provided on an outer peripheral portion of a molded surface of the inner member, and the second member can be attached to the inner member, and the frame-like member is interchangeable between a member having a shape provided with a protruding portion protruding to a position corresponding to the step portion and a member having a shape not provided with the protruding portion.

According to this configuration, by replacing the frame-like member, it is possible to provide a mold capable of resin-molding objects having different sizes or shapes. Therefore, the manufacturing cost of the mold used for manufacturing the resin molded product can be reduced. In addition, productivity of resin molding can be improved.

The resin molding apparatus according to embodiment 3 is configured using any of the above-described molds.

According to this configuration, by using any of the above-described molds, objects having different sizes or shapes can be resin-molded.

The method for producing a resin molded article according to each embodiment of the present invention performs resin molding using a resin disposed in a cavity formed by a frame-shaped member and an inner member.

According to this method, cavities having different sizes or shapes can be formed by the frame-like member and the inner member, and resin molding can be performed using the resin disposed in the cavities.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selectively employed as needed within a scope not departing from the spirit of the present invention.

Description of the reference numerals

1. 17, 27, 37, 50, 66 forming die

2. 51 Upper die (second die, first die)

3. 18, 28, 38, 52, 67 lower die (first die, second die)

4. 53 base station

5. 54 inner side parts

5a, 54a upper part

5b, 54b lower part

6. 55 frame-shaped member

6a, 40a opening

7. 56 step part

8. 57 elastic member

9. 12, 22, 33, 43, 58, 61, 71 sliding part

10. 29, 39, 59 bottom part (second part)

11. 20, 31, 41, 60, 69 cavities

13. 23, 34, 44, 45, 62, 72 semiconductor chips

14. 24, 35, 46 substrate

15. 15a, 64a suction hole

16. 26, 36, 47, 65 and 75 release film

19. 30, 40, 68 side part (first part)

21. 32, 42, 70 elastic component

25. 74 fixing part

48. 49 plate-like member

63300 mm wafer

73150 mm wafer

76 resin molding apparatus

77 substrate supply and storage module

78A, 78B, 78C forming module

79 resin supply module

80 packaging front substrate

81 packaging front substrate supply part

82 rear substrate

83 substrate receiving part after packaging

84 substrate mounting part

85 base plate conveying mechanism

86 locking mechanism

87 release film supply mechanism

88X-Y workbench

89 resin material container

90 resin material feeding mechanism

91 resin material conveying mechanism

92 resin Material (resin)

93 flowable resin

94 semiconductor chip

95 hardening resin

96 resin molded article

CTL control part

S1, R1, M1, C1 specify the positions

Claims

1. A molding die has a first die and a second die arranged opposite to each other,

a step is provided on the outer periphery of the profile of the inner part,

on said inner part a second part can be mounted,

the mold is usable in at least two states including a first state in which the first member is attached to the frame-shaped member and the second member is not attached to the inner member, and a second state in which the first member is not attached to the frame-shaped member and the second member is attached to the inner member.

2. The forming die according to claim 1,

the mold is usable in three states, i.e., the first state, the second state, and a third state in which the first member is attached to the frame-shaped member and the second member is attached to the inner member.

3. The forming die according to claim 1,

in a state where the first member is attached to the frame-like member, a gap between a side surface of the first member and a side surface of the inner member facing each other and a gap between a side surface of the frame-like member and a side surface of the inner member facing each other at a position where the first member is not attached communicate.

4. The forming die according to claim 1,

in a state where the second member is attached to the inner member, a gap between a side surface of the second member and a side surface of the frame-like member, which face each other, and a gap between a side surface of the frame-like member and the inner member, which face each other at a position where the second member is not attached, communicate.

5. The forming die according to claim 2,

in the third state, a gap between a side surface of the first member and a side surface of the second member which face each other and a gap between a side surface of the frame-like member and a side surface of the inner member which face each other at a position where the first member and the second member are not attached communicate.

6. The molding die according to claim 1, 2, 3 or 5,

an elastic member may be attached between the first member and the inner member in a state where the first member is attached to the frame-shaped member.

7. A molding die has a first die and a second die arranged opposite to each other,

the inner part is interchangeable between a part having a shape provided with a step at an outer periphery of the mold surface and a part having a shape not provided with the step,

the forming die can be used in a state in which a member having a shape provided with the stepped portion is used as the inner member and the first member is attached to the frame-like member, and in a state in which a member having a shape not provided with the stepped portion is used as the inner member and the first member is not attached to the frame-like member.

8. A resin molding apparatus comprising the molding die according to any one of claims 1 to 7.

9. A method for producing a resin molded product, using the molding die according to any one of claims 1 to 7,

the manufacturing method comprises the following steps: the resin molding is performed using a resin disposed in a cavity formed by the frame-shaped member and the inner member.