JP6994445B2 - Resin molding equipment, release film peeling method, resin molded product manufacturing method - Google Patents

Description

The present invention relates to a resin molding apparatus, a method for peeling a release film, and a method for manufacturing a resin molded product.

In resin molding using a molding die, a release film may be adsorbed on the mold surface of the molding die to perform resin molding (Patent Document 1 and the like). The release film is peeled off from the resin molded product after resin molding.

Japanese Unexamined Patent Publication No. 2000-210987

However, if the adhesive force or the adhesive force between the release film and the resin after molding is strong, the release film may be difficult to peel off from the resin molded product. In such a case, there is a possibility that the release film remains on the resin molded product, or conversely, the resin molded product is carried to the release film side. If such a defect occurs, it may lead to the occurrence of defective products, stagnation of work, deterioration of productivity, etc. in the manufacture of resin molded products.

Therefore, an object of the present invention is to provide a resin molding apparatus in which a release film is easily peeled from a resin molded product, a method for peeling the release film, and a method for manufacturing a resin molded product.

In order to achieve this object, the resin molding apparatus of the present invention is used.
A molding die having one mold and the other mold arranged opposite to each other,
An outside air blocking member that surrounds the molding mold and can be blocked from the outside air,
A mold release film adsorption mechanism that is connected to one or both of the one mold and the other mold and adsorbs the release film on the mold surface of the connected mold.
It is characterized by comprising a pressurizing mechanism capable of pressurizing the space surrounded by the outside air blocking member and pressurizing the release film in the direction of the mold surface on which the release film is adsorbed.

In the release method of the release film of the present invention, the release film is in close contact with the molded resin and the release film adsorbed on the mold surface of the mold is pressed in the direction of the mold surface. Is characterized by peeling from the molded resin.

The method for producing a resin molded product of the present invention is as follows.
The release film adsorption process that adsorbs the release film on the mold surface of the molding mold,
A resin molding step of molding a resin by the molding mold in a state where the release film is adsorbed on the mold surface, and
The release film peeling step of peeling the release film from the molded resin is included.
The release film peeling step is a step of peeling the release film from the molded resin by the release film peeling method of the present invention.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a resin molding apparatus in which a release film is easily peeled from a resin molded product, a method for peeling the release film, and a method for manufacturing a resin molded product.

FIG. 1 is a schematic diagram illustrating the configuration of the resin molding apparatus of the present invention. FIG. 2 is a cross-sectional view showing one step in an example of the method for manufacturing a resin molded product of the present invention. FIG. 3 is a cross-sectional view showing another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 4 is a cross-sectional view showing still another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 5 is a cross-sectional view showing still another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 6 is a cross-sectional view showing still another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 7 is a cross-sectional view showing still another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 8 is a cross-sectional view showing still another step in the same method for manufacturing a resin molded product as in FIG. 2. FIG. 9A is a photograph of the resin molded product obtained in Example 2. FIG. 9B is a photograph of a copper laminated sheet after being peeled from the resin molded product of FIG. 9A. FIG. 10A is a photograph of a resin molded product obtained by a comparative example. 10 (b), (c) and (d) are enlarged photographs of a part of the resin molded product of FIG. 10 (a).

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

In the resin molding apparatus of the present invention, for example, the one mold is a mold to which the object to be molded is fixed, and the other mold has a cavity formed on the mold surface and the release on the mold surface. The mold may be a mold to which the mold film is adsorbed. Further, in this case, for example, the other mold may have a bottom surface member and a side surface member, and the cavity may be formed by a space surrounded by the bottom surface member and the side surface member.

In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold and the other mold may be a lower mold. Further, for example, conversely, the one mold may be a lower mold and the other mold may be an upper mold.

The resin molding apparatus of the present invention may be, for example, a compression molding apparatus, a transfer molding apparatus, an extrusion molding apparatus, or the like.

In the release film peeling method of the present invention, for example, the release film may be at least one selected from the group consisting of a resin film, a metal foil, and a rubber sheet.

In the method for peeling a release film of the present invention, for example, the release film is a laminate of a plurality of films, and at least one of the plurality of films is peeled from the molded resin to at least one. One sheet may be left in close contact with the molded resin. Further, in this case, for example, the plurality of films may all be metal foils.

In general, a film having a small thickness may be referred to as a "film" and a film having a relatively large thickness may be referred to as a "sheet", but in the present invention, there is no distinction between a "film" and a "sheet". do.

The method for producing a resin molded product of the present invention is, for example,
Using the resin molding apparatus of the present invention, the release film adsorption step, the resin molding step, and the release film peeling step are performed.
In the release film adsorption step, the release film is adsorbed on the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism.
In the resin molding step, resin molding is performed with the release film adsorbed between the mold surface of the one mold and the mold surface of the other mold.
In the release film peeling step, the space surrounded by the outside air blocking member is pressed by the pressurizing mechanism, and the release film is pressed in the direction of the mold surface on which the release film is adsorbed. Then, the release film may be peeled off from the molded resin.

As described above, the method for producing a resin molded product of the present invention is a step including the release film adsorption step, the resin molding step, and the release film peeling step, but includes any other steps. You can go out.

In the present invention, the "resin molding" is not particularly limited, and may be, for example, resin-sealing a component such as a chip, but it is simply molding a resin without resin-sealing. May be good. Similarly, in the present invention, the "resin molded product" is not particularly limited, and may be, for example, a resin molded product (product or semi-finished product, etc.) in which a component such as a chip is resin-sealed. It may be a product obtained by simply molding a resin, a semi-finished product, or the like. Further, in the present invention, the "resin molded product" may be a resin molded product (product, semi-finished product, etc.) itself, or may be a resin molded product in the middle of the manufacturing method of the resin molded product. For example, the "resin molded product" may be a resin molded product after the resin molding step and before the mold release step.

Further, in the present invention, "resin molding" may be, for example, resin molding one or both surfaces of an object to be molded. However, the present invention is not limited to this, and for example, resin molding may be simply performed without using a molding target. Further, for example, parts such as chips fixed to one or both surfaces of the object to be molded may be resin-sealed, but the parts are not resin-sealed and only one or both surfaces of the object to be molded are resin-sealed. It may be molded.

In the present invention, the "molding object" is, for example, a substrate.

In the present invention, the method of "resin molding" is not particularly limited as long as it performs resin molding using a release film, and may be, for example, compression molding, but for example, transfer molding, extrusion molding, or the like. May be good.

In the present invention, "resin molding" means, for example, a state in which the resin is cured (solidified) and the cured resin is molded. The hardness of the cured resin is not particularly limited, and may be, for example, to the extent that the cured resin is not deformed or to the extent necessary for protecting the resin-sealed chips and the like, regardless of the hardness. Further, in the present invention, the curing (solidification) of the resin is not limited to the state in which the resin is completely cured (solidified), and may be in a state in which the resin can be further cured.

In the present invention, "mounting" also includes "fixing".

In general, the "electronic component" may refer to a chip before being resin-sealed or a state in which the chip is resin-sealed. Unless otherwise specified, it refers to an electronic component whose chip is resin-sealed (electronic component as a finished product). Specifically, the "chip" in the present invention is, for example, a chip of a passive element such as a resistor, a capacitor, or an inductor, a diode, a transistor, an IC (Integrated Circuit), a semiconductor chip such as a semiconductor element for power control, or a sensor. Examples include chips such as filters. Further, in the present invention, the resin-sealed component is not limited to the chip, and may be, for example, at least one such as a chip, a wire, a bump, an electrode, and a wiring pattern, and includes a non-chip-shaped component. It is also good.

The substrate (also referred to as a frame or an interposer) to be molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited, but for example, a semiconductor such as a lead frame, a wiring board, or a silicon wafer. It may be a wafer, a ceramic substrate, a metal substrate, or the like, and may be, for example, a circuit board such as a printed circuit board. When such a molded object is resin-molded, the resin molding may be particularly referred to as "resin sealing". In the present invention, "resin molding" includes "resin sealing", and for example, only one surface of the substrate may be resin molded, or both sides may be resin molded. Further, the substrate may be, for example, a mounting substrate on which a chip is mounted on one surface or both sides thereof, or a substrate in which only wiring is performed. The method of mounting the chip is not particularly limited, and examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component in which a chip is resin-sealed may be manufactured by resin-sealing one or both sides of a mounting substrate.

Further, the use of the substrate resin-molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited. Applications of the substrate include, for example, a power control module substrate, a high frequency module substrate for a mobile communication terminal, a motor control substrate used for transportation equipment, a motor control substrate, a drive system control substrate, and the like. Further, the shape of the substrate may be any shape or form as long as it can be molded, and for example, a rectangular or circular substrate may be used in a plan view.

In the present invention, the "resin molded product" is not particularly limited, but may be, for example, an electronic component in which a chip is resin-sealed by compression molding or the like. Further, the "resin molded product" in the present invention may be, for example, an intermediate product for manufacturing a single or a plurality of electronic components such as a semiconductor product and a circuit module. Further, the "resin molded product" in the present invention is not limited to an electronic component in which a chip is resin-sealed and an intermediate product thereof, and other resin molded products and the like may be used.

In the present invention, the resin material (resin for resin molding) is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. .. Further, it may be a thermosetting resin or a composite material containing a thermoplastic resin as a part. Examples of the form of the resin supplied to the resin sealing device include granular resin, fluid resin, sheet-like resin, tablet-like resin, powder-like resin and the like.

Further, in the present invention, the "fluid resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resins and molten resins. Further, in the present invention, "liquid" means that it has fluidity at room temperature (room temperature) and flows by applying a force, and it does not matter whether the fluidity is high or low, in other words, the degree of viscosity. That is, in the present invention, the "liquid resin" refers to a resin that has fluidity at room temperature (room temperature) and flows by applying a force. Further, in the present invention, the "molten resin" refers to a resin that is melted by heating and becomes liquid and has fluidity. The form of the molten resin is not particularly limited, but is, for example, a form that can be supplied to a mold cavity or the like.

In the present invention, the molding die is not particularly limited, but may be, for example, a mold, a ceramic mold, or the like.

Hereinafter, specific examples of the present invention will be described with reference to the drawings. For convenience of explanation, each figure is schematically drawn by omitting or exaggerating as appropriate.

In this embodiment, an example of the resin molding apparatus of the present invention, a method of peeling the release film of the present invention using the same, and an example of a method of manufacturing the resin molded product of the present invention are shown.

FIG. 1 schematically shows the configuration of the resin molding apparatus of this embodiment. In the figure, the molding die and the outside air blocking member are shown in a cross-sectional view.

As shown in FIG. 1, this resin molding apparatus includes a molding mold, an outside air blocking member 300, a mold release film adsorption mechanism 220, and a pressure mechanism 400. The molding die has an upper die 100 and a lower die 200. The mold surface of the upper mold 100 and the mold surface of the lower mold 200 face each other. The upper mold 100 is fixed to the lower surface of the upper mold holding portion 110. The lower mold 200 is fixed to the upper surface of the lower mold holding portion 210. The upper mold 100 is a mold to which the substrate 10 is fixed, as will be described later. As will be described later, the lower mold 200 is a mold in which a cavity is formed on the mold surface and the release film is adsorbed on the mold surface. As described above, in the present embodiment, the upper mold corresponds to the "one mold" of the present invention, the lower mold corresponds to the "other mold" of the present invention, and the substrate corresponds to the "molding object" of the present invention. Applicable. The outside air blocking member 300 is attached to the lower surface of the upper mold holding member 110 and the upper surface of the lower mold holding member 210 so as to surround the upper mold 100 and the lower mold 200, respectively. As will be described later, the outside air blocking member 300 can be shielded from the outside air by surrounding the molding die (upper die 100 and lower die 200) together with the upper die holding member 110 and the lower die holding member 210.

The upper mold 100 is formed by attaching a film retainer 103 and a clamper 104 to the upper mold main body 102 (see also FIG. 2). The film retainer 103 is attached to the lower part of the upper mold main body 102 via the upper mold elastic member 103s. In this embodiment, a spring is used as the upper mold elastic member. The film retainer 103 can move up and down by expanding and contracting the upper elastic member 103s. Then, as will be described later, the release film can be pressed against the lower mold side surface member 201 by the film retainer 103. As shown in the figure, the clamper 104 can fix the substrate 10 by sandwiching it between the lower surface of the substrate main body 102 and the clamper 104. In FIG. 1, for simplification of illustration, only the film presser 103 is shown on the right side and only the clamper 104 is shown on the left side. However, in reality, the film presser 103 and the clamper 104 are arranged on both sides, respectively. Has been done. However, this is an example, and the arrangement positions of the film retainer 103 and the clamper 104 are not limited to this and are arbitrary.

The upper die main body 102 and the upper die holding member 110 are provided with through holes 100B and 300B penetrating from the upper surface to the lower surface thereof. The lower end of the through hole 100B is open to the fixed surface of the substrate 10 on the lower surface of the substrate main body 102. As will be described later, the substrate 10 can be attracted to the upper mold main body 102 by sucking the inside of the through hole 100B to reduce the pressure. The lower end of the through hole 300B is open to the outer peripheral portion of the fixed surface of the substrate 10. As will be described later, by sucking the inside of the through hole 300B to reduce the pressure, the space surrounded by the outside air blocking member 300 can be made negative pressure.

The lower mold 200 has a lower mold bottom surface member 202 and a lower mold side surface member 201. The lower mold side surface member 201 is attached to the peripheral edge of the upper surface of the lower mold bottom surface member 202 via the lower mold elastic member 201s. The lower mold bottom member 202 corresponds to the "bottom member" in the "other mold" of the present invention. The lower mold side member 201 corresponds to the "side member" in the "other mold" of the present invention. In this embodiment, a spring is used as the lower elastic member. The lower mold side member 201 can move up and down by expanding and contracting the lower mold elastic member 201s. Further, as shown in the figure, the cavity 200A is formed by the space surrounded by the central portion of the upper surface of the lower mold bottom member 202 (the portion where the lower mold side surface member 201 is not attached) and the inner surface of the lower mold side surface member 201. It is formed. As will be described later, the resin for resin molding can be accommodated in the cavity 200A.

Through holes 200B, 201A and 201B are provided in the lower mold side surface member 201, the lower mold bottom surface member 202 and the lower mold holding member 210. As shown in FIG. 1, the through hole 200B has a lower end open from the lower surface of the lower mold bottom member 202 to the lower surface of the lower mold holding member 210, and the other end is a gap between the lower mold bottom member 202 and the lower mold side surface member 201. A through hole 200B is formed together with the gap. The through hole 201A penetrates the lower mold holding member 210, and further penetrates from the lower surface of the lower mold bottom surface member 202 to the upper surface of the inner edge portion of the lower mold side surface member 201. The through hole 201B penetrates the lower mold holding member 210, and further penetrates from the lower surface of the lower mold bottom surface member 202 to the upper surface of the outer edge portion of the lower mold side surface member 201. As will be described later, the release film can be adsorbed on the mold surface of the lower mold 200 by sucking the insides of the through holes 200B, 201A and 201B by the release film adsorption mechanism 220 to reduce the pressure. Then, as will be described later, resin molding is performed with the release film adsorbed between the mold surface of the upper mold 100 and the mold surface of the lower mold 200. In addition, in FIG. 1, for simplification of illustration, only the through hole 201A is shown in the lower mold side member 201 on the right side, and only the through hole 201B is shown in the lower mold side surface member 201 on the left side. The through hole 201B is arranged outside the through hole 201A. However, this is an example, and the lower mold side surface member 201 may or may not have a through hole for adsorbing the release film, and even if there is a through hole, the arrangement thereof is arbitrary.

The release film adsorption mechanism 220 is a vacuum pump in this embodiment. As shown in FIG. 1, the release film adsorption mechanism 220 is branched via the manifold 230 by the pipe 1000 and is connected to the lower ends of the through holes 200B, 201A and 201B, respectively. As shown in the figure, each pipe 1000 is provided with valves V1, V2, V3 and gauges G1, G2, G3, respectively. The valves V1, V2, and V3 in the middle of the pipe 1000 connected to the through holes 200B, 201A, and 201B can be opened and closed independently.

The outside air blocking member 300 is attached to the peripheral edges of the upper mold holding member 110 and the lower mold holding member 210, respectively. Between the upper mold holding member 110 and the upper outside air blocking member 300, between the upper outside air blocking member 300 and the lower outside air blocking member 300, and between the lower outside air blocking member 300 and the lower mold holding member 210. An elastic O-ring 300A is provided between the two.

The resin molding apparatus of FIG. 1 further has a molding object adsorption mechanism 120 and an outside air blocking member internal pressure reducing mechanism 320. These are vacuum pumps in this embodiment, respectively. The object adsorption mechanism 120 to be molded is connected to the upper end of the through hole 100B of the upper die 100 by a pipe 1004. As shown in the figure, a valve V4 and a gauge G4 are provided on the pipe 1004 connected to the molding object suction mechanism 120. An appropriate number of through holes 100B can be provided according to the size of the object to be molded, and a plurality of suction mechanisms for the object to be molded are provided so as to adsorb these plurality of through holes 100B. You may. The internal decompression mechanism 320 of the outside air shutoff member is connected to the upper end of the through hole 300B of the upper die by the pipe 1006. The pipe 1006 is provided with a leak valve LV in addition to the valve V5 and the gauge G5.

The pressurizing mechanism 400 is a compressor in this embodiment. The pressurizing mechanism 400 is connected to the pipe 1006 of the external air blocking member internal depressurizing mechanism 320 via the pipe 1100. As shown in the figure, valves V6 and V7 are provided in the middle of the pipe 1100 and at positions closer to the outside air shutoff member internal decompression mechanism 320 than the position where the pipe 1100 is connected to the pipe 1006, respectively. When not pressurizing the space surrounded by the space surrounded by the outside air blocking member 300, the connection between the pipe 1100 and the pipe 1006 is cut off by closing the valve V6, and when pressurizing, the valve V6 is opened and the valve V7 is closed. As a result, the pipe 1100 and the side of the pipe 1006 connected to the through hole 300B can be connected. As will be described later, the release film can be pressed in the direction of the mold surface of the lower mold 200 on which the release film is adsorbed by pressurizing the space surrounded by the outside air blocking member 300 by the pressurizing mechanism 400. Is. In order to perform this pressurization, for example, the gas may be sent by the pressurizing mechanism 400 into the space surrounded by the outside air blocking member 300. The gas to be sent is not particularly limited, and compressed air, compressed nitrogen, or the like can be used, but compressed air is convenient and preferable.

Next, using the schematic process sectional views of FIGS. 2 to 8, the method of manufacturing the resin molded product of the present invention and the method of peeling the release film using the resin molding apparatus of FIG. 1 will be given as examples. explain. In FIGS. 2 to 8, the same components as those in FIG. 1 are indicated by the same reference numerals. However, for convenience of illustration, the shape and the like may be different from those in FIG. Further, in FIGS. 2 to 8, for convenience of illustration, only a part of the molding die (upper die 100 and lower die 200), the outside air blocking member 300, and the like is shown in an enlarged manner. Further, in FIGS. 2 to 8, in order to avoid complicating the drawings, the through holes 201A and 201B formed in the lower mold 200 are not shown.

First, as shown in FIG. 2, the substrate 10 is sandwiched and fixed between the lower surface of the upper mold main body 102 and the clamper 104. Although not shown in FIG. 2, a member such as a chip may be fixed to the lower surface of the substrate 10 (the surface opposite to the fixed surface with respect to the upper mold main body 102). Further, as shown in the figure, the release film 11 is conveyed to the position of the mold surface of the lower mold 200 together with the resin material 20a placed on the release film 11. The means and method for placing the resin material 20a on the release film 11 are not particularly limited, and for example, known means and methods such as a feeder may be appropriately used. The means and method for transporting the release film 11 and the resin material 20a to the position of the mold surface of the lower mold 200 are not particularly limited, and for example, known means and methods such as a loader may be appropriately used. Further, the resin material 20a is a granular resin in this embodiment, but is not limited to this, and is not limited to, for example, a sheet-like resin, a liquid resin, a tablet-like resin, a semi-solid fluid resin, or the like. May be.

Next, as shown in FIGS. 3 to 4, a release film adsorption step is performed. First, as shown in FIG. 3, the release film 11 and the resin material 20a are delivered to the lower mold 200. Further, as shown by arrows 201a and 201b, the inside of the through holes 201A and 201B in the lower mold side member 201 is depressurized by the release film adsorption mechanism 220 (not shown in FIGS. 2 to 8). As a result, the release film 11 is attracted to the upper surface of the lower mold side member 201, tension is applied to the release film 11 arranged on the cavity 201A, and wrinkles of the release film are smoothed.

Further, as shown by the arrow 200b in FIG. 4, the inside of the through hole 200B communicating with the gap between the lower mold side surface member 201 and the lower mold bottom surface member 202 is depressurized by the release film suction mechanism 220 and sucked. As a result, tension is further applied to the release film 11 to smooth out wrinkles, and the release film 11 is adsorbed on the cavity surface of the cavity 200A. As a result, as shown in the figure, the resin material 20a is placed in the cavity 200A in a state of being placed on the release film 11. The order in which the release film 11 is adsorbed on the lower mold 200 is not limited to the above-mentioned order, and it is sufficient that the release film 11 can be adsorbed on the cavity surface of the cavity 200A so as not to cause wrinkles. It can be changed as appropriate according to the type.

Further, as shown by the arrow 100b in FIG. 4, the inside of the through hole 100B of the upper mold main body 102 is depressurized by the molding object suction mechanism 120 (not shown in FIGS. 2 to 8) and sucked. As a result, the entire upper surface of the substrate 10 is attracted to the lower surface of the upper mold main body 102 and is more firmly fixed. In addition, for example, at the stage of FIG. 2 or FIG. 3, the adsorption of the substrate 10 to the upper mold main body 102 may be started in this way.

In this embodiment, the molding die is constantly preheated by a heater (not shown) provided inside the molding die, and the resin material 20a is melted from the time when it is placed in the cavity 200A together with the release film 11. It begins to grow and eventually becomes the molten resin 20b. The preheating of the molding die may be performed prior to the release film adsorption step (FIGS. 3 to 4) or at the same time as the release film adsorption step. Further, the preheating of the molding die may be started after the release film adsorption step.

Next, as shown in FIGS. 5 to 8, a resin sealing step and a release film peeling step are performed. As described above, the release film peeling step is a step of peeling the release film from the molded resin by the release film peeling method of the present invention.

First, the lower mold holding member 210 is raised, and the lower mold 200 is raised together with the outside air blocking member 300. As a result, as shown in FIG. 5, first, the upper and lower outside air blocking members 300 are closed via the respective O-rings 300A, and the molding dies (upper die 100 and lower die 200) hold the upper die holding member 110 and the lower die. It is shielded from the outside air by the member 210 and the outside air blocking member 300. The space S surrounded by the upper mold holding member 110, the lower mold holding member 210, and the outside air blocking member 300 may be hereinafter referred to as "inside the outside air blocking space". Almost at the same time as the outside air blocking member 300 closes, the film retainer 103 contacts the lower mold side surface member 201 via the release film 11, and the release film 11 is between the lower side surface member 210 and the film retainer 103. Be pinched. At this time, the upper mold 100 and the lower mold 200 have not been molded yet, and the substrate 10 and the molten resin 20b have not yet come into contact with each other. In this state, as shown by the arrow 300b, the inside of the through hole 300B of the upper die 100 is depressurized by the outside air blocking member internal decompression mechanism 320 (not shown in FIGS. 2 to 8). At this time, the valves V6 are closed and the valves V5 and V7 are open. As a result, the inside of the outside air blocking space S is made negative pressure.

After that, as shown in FIG. 6, the lower mold holding member 210 (lower mold 200) is further raised. As a result, the substrate 10 comes into contact with the molten resin 20b. At this time, when other members (for example, chips, wires, etc.) are fixed to the lower surface of the substrate 10, these other members are immersed in the molten resin 20b, and eventually the lower surface of the substrate 10 comes into contact with the molten resin 20b. do. In this way, the molten resin 20b is filled in the cavity 200A, and the upper mold 100 and the lower mold 200 are molded. After the mold is closed, the valve V5 connected to the outside air shutoff member internal decompression mechanism 320 is closed, the leak valve LV is opened, and the inside of the outside air shutoff space S is returned to atmospheric pressure. The timing for returning the inside of the outside air blocking space S to the atmospheric pressure may be set after the mold is compacted until the curing of the molten resin 20b is completed.

Further, as shown in FIGS. 7 to 8, the molten resin 20b is solidified (cured) to complete the resin molding step, and the release film peeling step is performed.

First, as shown in FIG. 7, the molten resin 20b is solidified. For example, when the molten resin 20b is a thermosetting resin, the molding die may be further heated by a heater inside the molten resin 20b to obtain the cured resin 20. Further, for example, when the molten resin 20b is a thermoplastic resin, the molten resin 20b may be solidified to be a cured resin 20 by stopping the heating of the molding die and allowing it to cool, or by rapidly cooling the molding die. .. In this embodiment, the cured resin 20 corresponds to the "molded resin" of the present invention. Even after the mold is fastened, the lower mold holding member 210 is subjected to a force so as to raise the lower mold 200, so that the molten resin 20b is cured while being compressed.

When the curing of the molten resin 20b is completed, the valve V7 is closed and the valve V6 is opened (see FIG. 1). Compressed air is sent in to create positive pressure in the outside air blocking space S. This "positive pressure" is not particularly limited, but is, for example, a pressure exceeding ¹ atm (about 1.013 × 105 Pa), the type of release film, the type of resin, and the adhesion between the release film and the cured resin. Depending on the strength of the sex, for example, 2 kgf / cm ² (about 1.96 × 10 ⁵ Pa) or more, 3 kgf / cm ² (about 2.94 × 10 ⁵ Pa) or more, 4 kgf / cm ² (about 3.92). × 10 ⁵ Pa) or more, 5 kgf / cm ² (about 4.9 × 10 ⁵ Pa) or more, for example, 5 kgf / cm ² or less, 4 kgf / cm ² or less, or 3 kgf / cm ² or less, or 2 kgf / It may be cm ² or less. As the pressure applied to the outside air blocking space S, an appropriate pressure of 1 kgf / cm ² or more and 5 kgf / cm ² or less is usually preferable because it is easy to use. As a result, the release film 11 is pressed in the direction of the mold surface of the lower mold 200. More specifically, as shown by arrows 201a2, 201b2, and 200b2 in FIG. 7, positive pressure (pressurization) in the outside air blocking space S applies positive pressure to all the members existing in the outside air blocking space S, and the members are separated from each other. The mold film 11 is pressed in the direction of the mold surface of the lower mold 200. This pressing force acts as a force to reinforce the suction force (adhesive force of the release film 11) from the through holes 201A, 201B and 200B. Further, as shown by the arrow 100b2 in FIG. 7, the substrate 10 is pressurized in the direction of the mold surface of the upper mold 100 by the positive pressure (pressurization) in the outside air blocking space S. This pressing force acts as a force to reinforce the suction force (the suction force of the substrate 10) from the through hole 100B.

The timing at which the pressurization in the outside air blocking space S is started is not particularly limited as long as the molding die is molded. For example, the pressurization in the outside air shutoff space S may be started at the same time as the curing of the molten resin 20b is completed, or the pressurization in the outside air shutoff space S may be started prior to the completion of the curing of the molten resin 20b. “Completion of curing of the molten resin 20b” does not mean that the molten resin 20b is completely cured, for example, it may be cured to such an extent that it can be released from the mold. Further, during the time for pressurizing the inside of the outside air blocking space S, a force that presses the release film 11 toward the mold surface of the lower mold bottom member 201 acts immediately before the mold is opened and the release film 11 is peeled off, as described later. As described above, the time is not particularly limited as long as it is sufficient to keep the inside of the outside air cutoff space S at a positive pressure, and it can be appropriately set in consideration of piping resistance and the like.

After that, as shown in FIG. 8, the lower holding member 210 is lowered, the lower mold 200 and the outside air blocking member 300 are lowered, and the upper mold 100 and the lower mold 200 are opened. During this period, the compressed air is continuously sent into the outside air shutoff space S, and the inside of the outside air cutoff space S is kept at a positive pressure. As a result, as shown in the figure, the release film 11 in close contact with the cured resin 20 is peeled off from the cured resin 20. Specifically, since the release film 11 is adhered to the cured resin 20 formed on the substrate at the portion of the cavity 200A, it is removed from the lower mold 200 (lower mold bottom member 202) as the lower mold 200 descends. It peels off and is pulled upward. On the other hand, the inside of the outside air blocking space S is positive pressure until the outside air blocking member 300 is completely opened. Therefore, in the portion of the release film 11 that is not in contact with the cured resin 20, that is, the portion that is adsorbed by the lower mold side member 201, this pressure (positive pressure) causes the direction of the mold surface of the lower mold side member 201. Is pressurized to. Therefore, the release film 11 is pressed in the direction of the mold surface with a larger force than when it is simply adsorbed. As a result, the force for peeling the release film 11 from the cured resin 20 is increased, and the release film 11 is easily peeled from the cured resin 20. At this time (at the time of mold opening), as described above, the cured resin 20 may be cured to such an extent that it can be released from the mold, even if it is not completely cured.

At this time, the substrate 10 is adsorbed on the upper mold 200. Therefore, as in the case where the release film 11 is adsorbed, the substrate 10 is subjected to a larger force than when it is simply adsorbed by the positive pressure in the outside air blocking space S until the outside air blocking member 300 is completely released. Is retained. When the lower mold 200 is lowered, the substrate 10 is left in the upper mold 100 together with the molded cured resin 20 and the release film 11 bonded under the molded resin 20. As described above, since the release film 11 is pulled downward together with the lower mold 200 by the lowering of the lower mold 200, the release film 11 is gradually peeled off from the edge D of the cured resin 20 as shown in FIG. I will do it.

As described above, the resin molding step and the release film peeling step are performed, and the resin molded product 30 in which one surface of the substrate 10 is resin-molded with the cured resin 20 is manufactured. In the resin molding step and the release film peeling step, the adsorption of the release film 11 to the lower mold 200 may be appropriately stopped by opening and closing the valves V1 to V3 so that each step is appropriately performed. For example, in order to facilitate the release of the release film 11 from the lower mold bottom member 202 at the time of mold opening, the valve V1 may be closed to release the adsorption of the release film 11 from the through hole 200B. Further, as shown by the arrow 200c in FIG. 8, a pressurizing mechanism and a valve are provided in the middle of the pipe 1000 connected to the through hole 200B, and the suction of the release film 11 from the through hole 200B is released when the mold is opened. Then, the compressed gas (for example, compressed air) may be put into the outside air blocking space S through the through hole 200B. This makes it easy to remove the resin molded product 30 from the cavity 200A of the lower mold 200. The timing and time for charging the compressed gas from the through hole 200B may be appropriately set, but before the film retainer 103 separates from the lower mold 200, the injection of the compressed gas is stopped and the release film from the through hole 200B is released. It is desirable to set the adsorption of 11 to be performed again. By setting in this way, the release film 11 becomes inflated like a balloon while being peeled off, from the edge D of the cured resin 20 (that is, around the resin molded product 30) toward the center thereof. Since the peeling is gradually performed, the peeling of the release film is made more uniform. The compressed air sent into the outside air blocking space S may be stopped at any time after the release film 11 is completely peeled off from the cured resin 20. After that, the lower mold holding member 210 stops descending, the depressurization of the through holes 200B, 201A, and 201B of the lower mold 200 is released, and the release film 11 is peeled off from the mold surface of the lower mold 200 and recovered by an appropriate means. Will be done. Further, the manufactured resin molded product 30 can be transported to the outside of the resin molding apparatus by, for example, an appropriate transport means (not shown).

When the release film is adsorbed on the mold surface of the mold only by adsorption by depressurization, the adsorption force is the pressure difference between the pressure in the depressurized through holes 200B, 201A and 201B and the pressure in the outside air blocking space S. Here, since the degree of vacuum cannot be lower than 0, when the inside of the outside air blocking space S is at atmospheric pressure, the suction force of the release film is about 1.033 kgf / cm ² (1.013 × 10 ⁵ Pa) at the maximum. ). On the other hand, in the present invention, as described above, the through hole 200B is depressurized by pressurizing the space surrounded by the outside air blocking member (inside the outside air blocking space) to a pressure higher than the atmospheric pressure (positive pressure). The pressure difference between the pressure inside the 201A and 201B and the pressure inside the outside air shutoff space S can be set to about 1.033 kgf / cm ² or more. That is, pressure can be further applied to the sucked release film 11 toward the sucked side, and the force for pressing the release film against the mold surface side of the molding die can be increased. As a result, the force for peeling the release film is increased, so that the release film can be easily peeled from the resin molded product. As a result, according to the present invention, it is possible to suppress or prevent mold release defects, product defects, etc. of the resin molded product.

In this embodiment, the object to be molded is not only sandwiched by a clamper but also held in the molding die by adsorption by reduced pressure. When the object to be molded is large, the object to be molded tends to bend or wrinkle simply by sandwiching the end portion with a clamper, so adsorption by reduced pressure is often used. By such adsorption by decompression of the object to be molded, it can be held in the mold more firmly than in the case of mere pinching, but as in the case of the release film, when the inside of the outside air blocking space S is atmospheric pressure, The maximum adsorption force is about 1.013 × ¹⁰⁵ Pa. However, according to the present invention, by setting the pressure (positive pressure) in the space S surrounded by the outside air blocking member to be higher than the atmospheric pressure, the adsorption force of the object to be molded is reinforced as in the case of the release film. can do. As a result, the force for peeling the resin molded product from the release film is further increased, so that the resin molded product and the release film are more easily peeled off. As a result, when the mold is opened, the object to be molded is not taken to the lower mold, and it is possible to suppress or prevent mold release defects, product defects, etc. of the resin molded product.

In this embodiment, the circuit (piping) for pressurizing the inside of the outside air shutoff space S also serves as the circuit (piping) 1006 for reducing the pressure inside the outside air cutoff space S, as shown in FIG. .. However, the present invention is not limited to this, and for example, a dedicated circuit (piping) for pressurizing the inside of the outside air shutoff space S may be separately provided.

Further, the mechanism for holding (fixing) the substrate (molded object) to the upper mold is not particularly limited. The mechanism may be, for example, only pinching by a clamper, but it is preferable to use adsorption by reduced pressure as in this embodiment. As a result, the force for adsorbing the substrate increases, and the force for peeling the release film also increases.

Further, in this embodiment, the upper mold is a mold to which the substrate (molding object) is fixed, and the lower mold is a mold to which the release film is adsorbed. However, as described above, the present invention is not limited to this, and for example, the lower mold is a mold to which the substrate (molding object) is fixed, and the upper mold is a mold to which the release film is adsorbed. May be good.

In recent years, variations of mold release films used for resin molding have increased. However, when the adhesive force or the adhesive force between the release film and the resin is strong, as described above, the release film remains in the resin molded product, or conversely, the resin molded product is brought to the release film side. There is a risk of mold release failure. However, according to the present invention, such a mold release defect can be suppressed or prevented.

Further, in FIGS. 2 to 8, the case where the release film 11 is a single film is illustrated. However, the present invention is not limited to this, and as described above, the release film may be a laminate of a plurality of films (hereinafter, may be referred to as a “laminate sheet”). Thereby, for example, in the release film peeling step shown in FIGS. 7 to 8, at least one of the plurality of films constituting the release film 11 is peeled from the cured resin 20 and at least one is peeled from the cured resin. It can be left in close contact with 20. Each film constituting the plurality of films is not particularly limited, and may be, for example, a metal foil. The metal foil may be, for example, copper foil, aluminum foil, gold foil, silver foil or palladium foil.

In recent years, there is a need for a new molding technique in which a copper (Cu) foil or the like, which is later used as a wiring material, is applied to the surface of a resin molded product at the same time as molding. In this case, for example, a laminated sheet, which is a laminate of a base material and a copper foil, is used as a release film, and only the base material is peeled off from the molded resin, and the copper foil is left in close contact with the molded resin. In this case, if the peeling strength (adhesion force) between the base material and the copper foil is larger than the suction force of the laminated sheet on the mold surface of the mold, there is a possibility that a problem may occur in the peeling between the base material and the copper foil. However, even in this case as well, according to the release film peeling method of the present invention, as described above, by pressurizing the space surrounded by the outside air blocking member (inside the outside air blocking space), the adsorption force of the release film is increased. It can be reinforced and the force to press the release film against the mold surface side of the mold can be increased. Therefore, according to the present invention, the base material and the copper foil can be stably peeled off. The base material is not particularly limited as long as it is a sheet capable of forming a laminated sheet together with the copper foil, and for example, the base material may also be a copper (Cu) foil. That is, the laminated sheet may be a laminated body of a plurality of copper foils. Further, as described above, each film in the laminated body of the plurality of films is not limited to copper foil or the like, and is arbitrary.

In Example 2, in the resin molding apparatus of Example 1, a method of peeling the release film and a method of manufacturing a resin molded product were carried out using a copper laminated sheet as the release film 11. Specifically, as the copper laminated sheet, a laminated sheet composed of a copper base material having a thickness of 18 μm and a copper foil having a thickness of 3 μm was used. As the object to be molded 10, a 320 mm square substrate (one on which a chip or the like is not mounted) was used. As the resin material 20a, a thermosetting granular resin was used. The substrate is adsorbed to the upper mold by depressurization, and at the same time as the curing of the molten resin is completed in the release film peeling step, ^4.5 kgf / cm ² (about 4.41 × 105 Pa) is placed in the outside air blocking space S. ) Was applied, then the mold was opened and the copper laminated sheet was peeled off. Other than these, the release film peeling method and the resin molded product manufacturing method of Example 2 were carried out in the same manner as the method described in Example 1.

As a comparative example, a release film peeling method and a resin molded product manufacturing method were carried out in the same manner as in Example 2 except that the copper laminated sheet was peeled off without applying positive pressure in the release film peeling step.

FIG. 9A shows a photograph of the resin molded product obtained in Example 2. FIG. 9B shows a photograph of the copper laminated sheet after peeling from the resin molded product of FIG. 9A. Further, FIG. 10A shows a photograph of the resin molded product obtained by the comparative example. 10 (b), (c) and (d) show enlarged photographs of a part of the resin molded product of FIG. 10 (a).

As shown in FIG. 9A, in the resin molded product obtained by the release film peeling method and the resin molded product manufacturing method of Example 2, the copper foil remains on the entire surface of the resin molded product and comes into contact with the resin. No copper foil remained on the part that was not formed, that is, outside the edge portion (edge portion D in FIG. 8) of the resin molded product. As described above, in Example 2, the copper foil of the laminated sheet and the base material could be appropriately peeled off. The fact that the peeling at the edge of the resin molded product (edge D in FIG. 8) was successful is that the copper foil was resin-molded in the copper laminated sheet (FIG. 9 (b)) after peeling from the resin molded product. It can be seen from the fact that the shape of the product does not peel off cleanly and there is no peeling of excess copper foil at the boundary. On the other hand, in the comparative example, as shown in FIG. 10A, the copper foil remained on the entire surface of the resin molded product, but as shown by the arrow portions in FIGS. 10B to 10D, the resin molding was performed. A part of the copper foil of the copper laminated sheet that had not adhered to the product was not peeled off and remained on the edge of the resin molded product. As described above, in the comparative example, the laminated sheet copper foil and the base material could not be properly peeled off.

The present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. be.

10 Substrate (molding object)
11 Release film 20 Curing resin (molded resin)
20a Resin material 20b Molten resin 30 Resin molded product 100 Upper mold 100B Through hole 102 Upper mold body 103 Film presser 103s Upper mold elastic member 104 Clamper 110 Upper mold holding member 120 Molding object suction mechanism 200 Lower mold 200A Cavity 200B Through hole 201A , 201B Through hole 201 Lower side surface member 201s Lower mold elastic member 202 Lower mold bottom member 210 Lower mold holding member 220 Release film suction mechanism 300 Outside air blocking member 300B Through hole 320 Outside air blocking member Internal depressurizing mechanism 400 Pressurizing mechanism 1000, 1004, 1006, 1100 Piping S Outside air shutoff space V1 to V7 Valves G1 to G5 Gate valve LV Leak valve

Claims (10)

A molding die having one mold and the other mold arranged opposite to each other,
An outside air blocking member that surrounds the molding mold and can be blocked from the outside air,
A mold release film adsorption mechanism that is connected to one or both of the one mold and the other mold and adsorbs the release film on the mold surface of the connected mold.
It is provided with a pressurizing mechanism capable of sending a gas into a space surrounded by the outside air blocking member to pressurize the space and pressurizing the release film in the direction of the mold surface on which the release film is adsorbed. A resin molding device characterized by this. One of the molds is a mold to which the object to be molded is fixed.
The resin molding apparatus according to claim 1, wherein the other mold is a mold in which a cavity is formed on the mold surface and the release film is adsorbed on the mold surface. The other mold has a bottom member and a side member, and has a bottom member and a side member.
The resin molding apparatus according to claim 2, wherein the cavity is formed by a space surrounded by the bottom surface member and the side surface member. The resin molding apparatus according to any one of claims 1 to 3, wherein one of the molds is an upper mold and the other mold is a lower mold. The mold is surrounded by an outside air blocking member to block it from the outside air, gas is sent into the space surrounded by the outside air blocking member to pressurize the space, and then the resin is adhered to the resin molded in the molding mold. The release film is characterized by peeling the release film from the molded resin in a state where the release film adsorbed on the mold surface of the mold surface is pressed in the direction of the mold surface. How to peel off. The release film is a laminate of a plurality of films.
The method for peeling a release film according to claim 5, wherein at least one of the plurality of films is peeled from the molded resin, and at least one is left in close contact with the molded resin. The method for peeling a release film according to claim 5 or 6, wherein the release film is at least one selected from the group consisting of a resin film, a metal foil, and a rubber sheet. The method for peeling a release film according to claim 6, wherein the plurality of films are all metal foils. The release film adsorption process that adsorbs the release film on the mold surface of the molding mold,
A resin molding step of molding a resin by the molding mold in a state where the release film is adsorbed on the mold surface, and
The release film peeling step of peeling the release film from the molded resin is included.
The release film peeling step is a step of peeling the release film from the molded resin by the release film peeling method according to any one of claims 5 to 8. Manufacturing method of molded products. Using the resin molding apparatus according to any one of claims 1 to 4, the release film adsorption step, the resin molding step, and the release film peeling step are performed.
In the release film adsorption step, the release film is adsorbed on the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism.
In the resin molding step, resin molding is performed with the release film adsorbed between the mold surface of the one mold and the mold surface of the other mold.
In the release film peeling step, the space surrounded by the outside air blocking member is pressed by the pressurizing mechanism, and the release film is pressed in the direction of the mold surface on which the release film is adsorbed. The method for manufacturing a resin molded product according to claim 9, wherein the release film is peeled off from the molded resin.

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