CN110871538A - Resin molding device, method for peeling release film, and method for producing resin molded article - Google Patents

Resin molding device, method for peeling release film, and method for producing resin molded article Download PDF

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Publication number
CN110871538A
CN110871538A CN201910671683.6A CN201910671683A CN110871538A CN 110871538 A CN110871538 A CN 110871538A CN 201910671683 A CN201910671683 A CN 201910671683A CN 110871538 A CN110871538 A CN 110871538A
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China
Prior art keywords
release film
mold
resin
molding
peeling
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Granted
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CN201910671683.6A
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Chinese (zh)
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CN110871538B (en
Inventor
高田直树
高桥范行
水间敬太
川本佳久
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a resin molding device which is easy to strip a release film from a resin molding product. The resin molding device is characterized by comprising a molding die having a die (100) on one side and a die (200) on the other side which are arranged oppositely; an external air insulating member (300) surrounding the molding die and insulating the molding die from external air; a release film adsorption mechanism (220) which is connected to one or both of the mold (100) on the one side and the mold (200) on the other side and adsorbs a release film on the mold surface of the connected molds; and a pressurizing mechanism (400) for pressurizing a space surrounded by the external air insulating member (300) and pressurizing the release film in a direction of the mold surface to which the release film is adsorbed.

Description

Resin molding device, method for peeling release film, and method for producing resin molded article
Technical Field
The present invention relates to a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product.
Background
In resin molding using a mold, a mold release film may be adsorbed on a mold surface of the mold to perform resin molding (patent document 1 and the like). The release film is peeled from the resin molded product after the resin molding.
Documents of the prior art
Patent documents: japanese laid-open patent publication No. 2000-210987
Disclosure of Invention
Problems to be solved by the invention
However, if the adhesion or adhesion between the release film and the resin after molding is too strong, the release film may be difficult to peel from the resin molded article. In such a case, there is a possibility that the release film remains in the resin molded product or the resin molded product is brought to the release film side instead. When such a problem occurs, a defective product, a stoppage of operation, deterioration of productivity, and the like may occur in the production of a resin molded product.
Accordingly, an object of the present invention is to provide a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product, which are capable of easily peeling the release film from the resin molded product.
Means for solving the problems
To achieve the object, a resin molding apparatus according to the present invention includes:
a molding die having a die on one side and a die on the other side arranged opposite to each other;
an external air insulating member surrounding the molding die and insulating the molding die from external air;
a release film suction mechanism which is connected to one or both of the mold on the one side and the mold on the other side and sucks a release film on a mold surface of the connected molds;
and a pressurizing mechanism for pressurizing a space surrounded by the external air insulating member and pressurizing the release film in a direction of a mold surface on which the release film is adsorbed.
The method for peeling off a release film according to the present invention is characterized in that the release film is adhered to a molded resin and adsorbed on a mold surface of a mold, and the release film is peeled off from the molded resin in a state of being pressed in a direction toward the mold surface.
The method for producing a resin molded article of the present invention is characterized by comprising:
a mold release film adsorption step of adsorbing the mold release film to the mold surface of the molding die;
a resin molding step of molding a resin with the mold by the mold die in a state where the mold release film is adsorbed on the surface of the mold;
a release film peeling step of peeling the release film from the molded resin,
the step of peeling the release film is a step of peeling the release film from the molded resin by the method of peeling the release film of the present invention.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a resin molding apparatus, a method of peeling a release film, and a method of manufacturing a resin molded product, which are capable of easily peeling a release film from a resin molded product, can be provided.
Drawings
Fig. 1 is a schematic view illustrating a structure of a resin molding apparatus according to the present invention.
FIG. 2 is a sectional view showing one step of an example of the method for producing a resin molded article according to the present invention.
Fig. 3 is a sectional view showing another step of the same method for manufacturing a resin molded article as in fig. 2.
Fig. 4 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 5 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 6 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 7 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
Fig. 8 is a sectional view showing a further step of the same method for producing a resin molded article as in fig. 2.
FIG. 9A is a photograph of a resin molded article obtained in example 2. Fig. 9(b) is a photograph of the copper laminate sheet peeled from the resin molded article of fig. 9 (a).
FIG. 10 is a photograph of a resin molded article obtained by a comparative example, and FIG. 10(a) is a drawing. Fig. 10(b), 10(c) and 10(d) are enlarged photographs of a part of the resin molded article of fig. 10 (a).
Detailed Description
The present invention will be described in further detail with reference to examples. However, the present invention is not limited to the following description.
In the resin molding apparatus of the present invention, for example, the one mold may be a mold to which a molding object is fixed, and the other mold may be a mold having a cavity formed in a mold surface and having the release film adhered to the mold surface. In this case, for example, the other mold may have a bottom member and a side member, and the cavity may be formed by a space surrounded by the bottom member and the side member.
In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold and the other mold may be a lower mold. For example, the mold on the one side may be a lower mold, and the mold on the other side may be an upper mold.
The resin molding apparatus of the present invention may be, for example, a compression molding apparatus, a transfer molding apparatus, an extrusion molding apparatus, or the like.
In the method for peeling off a release film according to the present invention, the release film may be at least one of a resin film, a metal foil, and a rubber sheet.
In the method for peeling off a release film according to the present invention, for example, the release film is a laminate of a plurality of films, and at least one of the plurality of films is peeled off from the molded resin, and at least one of the plurality of films remains in close contact with the molded resin. In this case, for example, the plurality of films may be all metal foils.
In general, a thin film is sometimes referred to as a "film" and a relatively thick film is sometimes referred to as a "sheet" to distinguish them from each other, but in the present invention, the "film" and the "sheet" are not distinguished from each other.
The method for producing a resin molded article of the present invention can be, for example,
the step of adsorbing the release film, the step of molding the resin, and the step of peeling the release film are performed using the resin molding apparatus of the present invention,
in the release film adsorption step, the release film is adsorbed to the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism,
in the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold with a release film being adsorbed,
in the release film peeling step, the space surrounded by the outside air blocking member is pressurized by the pressurizing mechanism, and the release film is peeled from the molded resin in a state where the release film is pressurized in a direction of a mold surface to which the release film is adsorbed.
The method of producing a resin molded article of the present invention is a process including the step of adsorbing the release film, the step of molding the resin, and the step of peeling the release film, as described above, but may include any other steps.
In the present invention, "resin molding" is not particularly limited, and may be, for example, a method of resin-sealing a component such as a chip, or may be a method of resin-molding only without resin-sealing. Similarly, in the present invention, the "resin molded article" is not particularly limited, and may be, for example, a resin molded article (product, semi-product, or the like) obtained by resin-sealing a component such as a chip, or may be a product, semi-product, or the like obtained by molding only a resin without resin-sealing. In the present invention, the "resin molded article" may be a resin molded article (product, semi-finished product, or the like) itself, or may be a resin molded article in the middle of a method for producing a resin molded article. For example, the "resin molded article" may be a resin molded article after the resin molding step is performed and before the mold releasing step is performed.
In the present invention, the "resin molding" may be, for example, resin molding of one or both surfaces of the object to be molded. However, the present invention is not limited to this, and for example, only resin molding may be performed without using a molding object. Further, for example, although the component such as the chip fixed to one or both surfaces of the object to be molded can be resin-sealed, only one or both surfaces of the object to be molded may be resin-molded without resin-sealing the component.
In the present invention, the "object to be molded" is, for example, a substrate.
In the present invention, the method of "resin molding" is not particularly limited as long as it is a method of resin molding using a release film, and may be compression molding, for example, but may also be transfer molding, extrusion molding, or the like.
In the present invention, "resin molding" means, for example, a state in which a resin is cured (hardened) to mold the cured resin. The hardness of the cured resin is not particularly limited, and may be, for example, a degree that the cured resin does not deform or a degree that is necessary for protecting a chip or the like sealed with the resin, and the magnitude of the hardness is not particularly limited. In the present invention, the curing (hardening) of the resin may be not limited to a state in which the resin is completely cured (hardened), but may be a state in which the resin is further curable.
In the present invention, "placing" also includes "fixing".
In general, "electronic component" refers to both a case of a chip before resin encapsulation and a case of a state in which the chip has been resin-encapsulated, but in the present invention, a case of simply referring to "electronic component" refers to an electronic component in which a chip is resin-encapsulated (electronic component as a finished product) unless otherwise specified. Specifically, the "chip" of the present invention includes, for example, chips of passive elements such as resistors, capacitors, and inductors, semiconductor chips such as diodes, transistors, Integrated Circuits (ICs), and semiconductor elements for power control, and chips such as sensors and filters. In the present invention, the resin-sealed component is not limited to a chip, and may be at least one of a chip, a lead, a bump, an electrode, a wiring pattern, and the like, or may include a component that is not chip-shaped.
The substrate (also referred to as a frame or an insert) as an object to be resin-molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a semiconductor wafer such as a silicon wafer, a ceramic substrate, a metal substrate, or the like, or may be, for example, a Circuit board (Circuit board) such as a printed Circuit board. When such a molding object is resin-molded, the resin molding may be particularly referred to as "resin sealing". In the present invention, "resin molding" includes "resin sealing", and for example, only one surface of the substrate may be resin molded, or both surfaces may be resin molded. The substrate may be, for example, a mounting substrate having a chip mounted on one or both surfaces thereof, or may be a substrate having only wiring. The method of mounting the chip is not particularly limited, but examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component having a chip encapsulated with a resin can be manufactured by resin-encapsulating one or both surfaces of a mounting substrate.
The use of the substrate to be resin-molded by the resin molding apparatus or the resin molding method of the present invention is not particularly limited. Examples of the applications of the substrate include a power control module substrate, a high-frequency module substrate for a mobile communication terminal, an engine control substrate for a transportation device or the like, a motor control substrate, a drive system control substrate, and the like. The shape of the substrate may be any shape or form as long as it can be molded, and for example, a substrate having a rectangular or circular shape in a plan view may be used.
In the present invention, the "resin molded article" is not particularly limited, and may be, for example, an electronic component in which a chip is resin-sealed by compression molding or the like. The "resin molded article" in the present invention may be an intermediate product used for manufacturing a single or a plurality of electronic components such as a semiconductor product and a circuit module, for example. In the present invention, the "resin molded article" is not limited to the electronic component in which the chip is resin-encapsulated and the intermediate product thereof, and may be other resin molded articles.
In the present invention, the resin material (resin used for resin molding) is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, the resin composition may be a composite material containing a part of a thermosetting resin or a thermoplastic resin. Examples of the form of the resin to be supplied to the resin sealing apparatus include granular resin, flowable resin, sheet resin, plate resin, and powdery resin.
In the present invention, the "fluid resin" is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term "liquid" means a liquid that has fluidity at room temperature (room temperature) and flows by an applied force, and the magnitude of the fluidity, in other words, the degree of viscosity is not particularly limited. That is, in the present invention, the "liquid resin" refers to a resin that has fluidity at normal temperature (room temperature) and flows by an applied force. In the present invention, the "molten resin" refers to a resin that is in a liquid state by being heated and melted, and has fluidity. The form of the molten resin is not particularly limited, and may be, for example, a form that can be supplied to a cavity of a mold.
In the present invention, the molding die is not particularly limited, and may be, for example, a metal die, a ceramic die, or the like.
Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the drawings are schematically illustrated with appropriate omission, exaggeration, and the like.
[ example 1]
In the present embodiment, an example of the resin molding apparatus of the present invention, a method for peeling off a release film of the present invention using the same, and an example of a method for producing a resin molded product of the present invention are shown.
Fig. 1 schematically shows the structure of a resin molding apparatus according to the present embodiment. In this figure, the molding die and the external air insulating member are shown in a sectional view.
As shown in fig. 1, the resin molding apparatus includes a molding die, an outside air insulating member 300, a release film suction mechanism 220, and a pressing mechanism 400. The molding die has an upper die 100 and a lower die 200. The mold surface of the upper mold 100 and the mold surface of the lower mold 200 face each other. The upper die 100 is fixed to the lower surface of the upper die holding member 110. The lower die 200 is fixed to the upper surface of the lower die holding member 210. The upper mold 100 is a mold for fixing the substrate 10, as will be described later. The lower mold 200 is a mold having a cavity formed in a mold surface and a release film adhered to the mold surface, as described later. As described above, in the present embodiment, the upper mold corresponds to the "one-side mold" of the present invention, the lower mold corresponds to the "other-side mold" of the present invention, and the substrate corresponds to the "molded object" of the present invention. The external air insulation member 300 is attached to the lower surface of the upper mold holding member 110 and the upper surface of the lower mold holding member 210 so as to surround the peripheries of the upper mold 100 and the lower mold 200, respectively. As will be described later, the outside air isolation member 300 surrounds the molding dies (the upper die 100 and the lower die 200) together with the upper die holding member 110 and the lower die holding member 210, and can isolate the molding dies from the outside air.
The upper die 100 is formed by attaching a film pressing portion 103 and a clamping portion 104 to an upper die main body 102 (see also fig. 2). The film pressing portion 103 is attached to a lower portion of the upper die main body 102 via an upper die elastic member 103 s. In this embodiment, a spring is used as the upper elastic member. The film pressing portion 103 is movable up and down by the expansion and contraction of the upper elastic member 103 s. Then, as described later, the release film can be pressed against the lower mold side member 201 by the film pressing part 103. As shown in the drawing, the clamp portion 104 is fixed to the lower surface of the upper mold body 102 so that the substrate 10 is sandwiched between the clamp portion 104 and the lower surface of the upper mold body 102. In fig. 1, for simplicity of illustration, only the film pressing portion 103 is illustrated on the right side, and only the clamping portion 104 is illustrated on the left side, but actually, the film pressing portion 103 and the clamping portion 104 are disposed on both sides. However, this is merely an example, and the arrangement positions of the film pressing portion 103 and the clamping portion 104 are not limited to this and may be arbitrary.
The upper body 102 and the upper holding member 110 are provided with through holes 100B and 300B penetrating from the upper surface to the lower surface thereof. The lower end of the through hole 100B opens on the fixing surface of the substrate 10 in the lower surface of the upper die main body 102. As described later, the substrate 10 can be sucked to the upper die main body 102 by sucking and depressurizing the inside of the through hole 100B. The lower end of the through hole 300B is opened on the peripheral portion of the fixing surface of the substrate 10. As described later, the space surrounded by the external air insulating member 300 can be made negative in pressure by sucking and reducing the pressure inside the through-hole 300B.
The lower die 200 has a lower die bottom surface member 202 and a lower die side surface member 201. The lower die side member 201 is attached to a peripheral edge portion of the upper surface of the lower die bottom member 202 via a lower die elastic member 201 s. The lower mold bottom member 202 corresponds to a "bottom member" of the "other mold" of the present invention. The lower mold side member 201 corresponds to a "side member" of the "other mold" of the present invention. In this embodiment, a spring is used as the lower elastic member. The lower-die side member 201 is vertically movable by the extension and contraction of the lower-die elastic member 201 s. As shown in the drawing, the cavity 200A is formed by a space surrounded by a central portion of the upper surface of the lower die bottom member 202 (a portion where the lower die side member 201 is not attached) and the inner surface of the lower die side member 201. As will be described later, resin for resin molding can be accommodated in the cavity 200A.
Through holes 200B, 201A, and 201B are provided in the lower die side member 201, the lower die bottom member 202, and the lower die holding member 210. As shown in fig. 1, the through-hole 200B has a lower end opened from the lower surface of the lower mold bottom member 202 to the lower surface of the lower mold holding member 210, and the other end connected to the gap between the lower mold bottom member 202 and the lower mold side member 201, and forms the through-hole 200B together with the gap. The through-hole 201A penetrates the lower mold holding member 210, and further penetrates from the lower surface of the lower mold bottom member 202 to the upper surface of the inner edge portion of the lower mold side member 201. The through-hole 201B penetrates the lower mold holding member 210, and further penetrates from the lower surface of the lower mold bottom member 202 to the upper surface of the outer edge portion of the lower mold side member 201. As described later, the inside of the through holes 200B, 201A, and 201B is sucked by the release film suction means 220 and the pressure is reduced, whereby the release film can be sucked to the mold surface of the lower mold 200. Then, as described later, resin molding is performed between the mold surface of the upper mold 100 and the mold surface of the lower mold 200 in a state where the release film is absorbed. In fig. 1, for simplicity of illustration, only the through-hole 201A is illustrated in the right lower mold side member 201, and only the through-hole 201B is illustrated in the left lower mold side member 201, but actually, the through-hole 201B is disposed outside the through-hole 201A. However, this is an example, and the lower mold side member 201 may have through holes for sucking the release film, or may have through holes, and the arrangement thereof may be arbitrary.
The release film adsorption mechanism 220 is a vacuum pump in this embodiment. As shown in fig. 1, the release film suction mechanism 220 is divided by a pipe 1000 via a manifold 230 and connected to the lower ends of the through holes 200B, 201A, and 201B, respectively. As shown in the drawing, the pipes 1000 are provided with valves V1, V2, and V3 and meters G1, G2, and G3, respectively. The valves V1, V2, and V3 connected to the middle of the pipe 1000 in the through holes 200B, 201A, and 201B can be opened and closed independently of each other.
The outside air blocking member 300 is attached to the peripheral edge portions of the upper mold holding member 110 and the lower mold holding member 210, respectively. O-rings 300A having elasticity are respectively provided between the upper mold holding member 110 and the upper side outside air insulating member 300, between the upper side outside air insulating member 300 and the lower side outside air insulating member 300, and between the lower side outside air insulating member 300 and the lower mold holding member 210.
The resin molding apparatus of fig. 1 further includes a molding object suction mechanism 120 and an outside air blocking member internal pressure reducing mechanism 320. These are in this embodiment vacuum pumps, respectively. The molding object suction mechanism 120 is connected to the upper end of the through hole 100B of the upper mold 100 by a pipe 1004. As shown in the drawing, a pipe 1004 connected to the molding object suction mechanism 120 is provided with a valve V4 and a meter G4. Further, an appropriate number of through holes 100B may be provided according to the size of the molding object, and a plurality of molding object suction means may be provided to suck the plurality of through holes 100B. The outside air insulating member internal decompression mechanism 320 is connected to the upper end of the through hole 300B of the upper mold via a pipe 1006. The pipe 1006 is provided with a leak valve LV in addition to the valve V5 and the meter G5.
The pressurizing mechanism 400 is a compressor in the present embodiment. The pressurization mechanism 400 is connected to the pipe 1006 of the inside decompression mechanism 320 of the outside air insulating member via a pipe 1100. As shown in the drawing, valves V6 and V7 are provided in the middle of the pipe 1100 and at positions closer to the inside pressure reducing mechanism 320 of the external air insulating member than the portion where the pipe 1100 is connected to the pipe 1006. When the space surrounded by the external air insulating member 300 is not pressurized, the connection between the pipe 1100 and the pipe 1106 is blocked by closing the valve 6, and when the pressure is applied, the pipe 1100 and the side of the pipe 1006 connected to the through hole 300B can be connected by opening the valve 6 and closing the valve 7. As described later, the space surrounded by the outside air blocking member 300 is pressurized by the pressurizing mechanism 400, whereby the mold release film can be pressurized in the direction of the mold surface of the lower mold 200 to which the mold release film is sucked. For this pressurization, for example, a gas can be fed into the space surrounded by the external air insulating member 300 by the pressurization mechanism 400. The gas to be fed is not particularly limited, and compressed air, compressed nitrogen gas or the like can be used, but compressed air is preferred because it is simple.
Next, a method for producing a resin molded article and a method for peeling off a release film according to the present invention using the resin molding apparatus of fig. 1 will be described by way of example using schematic step cross-sectional views of fig. 2 to 8. In fig. 2 to 8, the same components as those in fig. 1 are denoted by the same reference numerals. However, for convenience of illustration, the shape and the like may be different from those of fig. 1. In fig. 2 to 8, for convenience of illustration, only a part of the mold (the upper mold 100 and the lower mold 200) and the outside air insulating member 300 is enlarged and illustrated. In fig. 2 to 8, through holes 201A and 201B formed in the lower die 200 are not shown in order to avoid complication of the drawing.
First, as shown in fig. 2, the substrate 10 is clamped and fixed between the lower surface of the upper mold body 102 and the clamp portion 104. Although not shown in fig. 2, a component such as a chip may be fixed to the lower surface of the substrate 10 (the surface opposite to the fixing surface to the upper die main body 102). Further, as shown in the figure, the release film 11 is carried to a position on the mold surface of the lower mold 200 together with the resin material 20a placed thereon. The tool and method for placing the resin material 20a on the release film 11 are not particularly limited, and for example, a known tool and method such as a feeder may be used as appropriate. The tool and method for conveying the release film 11 and the resin material 20a to the position of the mold surface of the lower mold 200 are not particularly limited, and for example, a known tool and method such as a loader may be used as appropriate. The resin material 20a is a granular resin in the present embodiment, but is not limited thereto, and may be a sheet-like resin, a liquid resin, a plate-like resin, a semisolid fluid resin, or the like.
Next, as shown in fig. 3 to 4, a release film adsorption step is performed. First, as shown in fig. 3, the release film 11 and the resin material 20a are transferred to the lower mold 200. Further, as indicated by arrows 201A and 201B, the inside of through holes 201A and 201B in lower die side member 201 is depressurized by release film suction mechanism 220 (not shown in fig. 2 to 8). Thereby, the release film 11 is adsorbed on the upper surface of the lower mold side member 201, and the wrinkle of the release film is spread by applying tension to the release film 11 disposed in the cavity 200A.
Further, as shown by an arrow 200B in fig. 4, the inside of the through hole 200B connecting the gap between the lower die side surface member 201 and the lower die bottom surface member 202 is subjected to reduced pressure suction by the release film suction mechanism 220. As a result, the release film 11 is further tensioned to spread the wrinkles, and the release film 11 is sucked to the cavity surface of the cavity 200A. As a result, as shown in the drawing, the resin material 20A is placed in the cavity 200A in a state of being placed on the release film 11. The order of attracting the release film 11 to the lower mold 200 is not limited to the above-described order, and the release film 11 may be attracted to the cavity surface of the cavity 200A so as not to wrinkle, and may be appropriately changed depending on the type of the release film 11.
Then, as indicated by an arrow 100B in fig. 4, the inside of the through hole 100B of the upper die main body 102 is subjected to reduced pressure suction by the molding object suction means 120 (not shown in fig. 2 to 8). As a result, the entire upper surface of the substrate 10 is attracted to the lower surface of the upper die main body 102 and is fixed more firmly. Further, for example, in the stage of fig. 2 or 3, the suction of the substrate 10 to the upper mold main body 102 may be started as described above.
In this embodiment, the mold is preheated by a heater (not shown) provided inside the mold, and the resin material 20A starts to melt together with the release film 11 at the time when the resin material is placed in the cavity 200A, and then becomes the molten resin 20 b. The preheating of the mold may be performed prior to the mold release film suction step (fig. 3 to 4) or simultaneously with the mold release film suction step. Further, the preliminary heating of the molding die may be performed after the mold release film adsorption step.
Next, as shown in fig. 5 to 8, a resin sealing step and a release film peeling step are performed. The step of peeling the release film is a step of peeling the release film from the molded resin by the method of peeling the release film of the present invention, as described above.
First, lower mold holding member 210 is raised, and lower mold 200 is raised together with outside air blocking member 300. As a result, as shown in fig. 5, the upper and lower outside air isolation members 300 are first closed via the respective O-rings 300A, and the molding dies (the upper die 100 and the lower die 200) are isolated from the outside air by the upper die holding member 110, the lower die holding member 210, and the outside air isolation member 300. The space S surrounded by the upper mold holding member 110, the lower mold holding member 210, and the outside air insulating member 300 is hereinafter sometimes referred to as "inside of the outside air insulating space". Almost simultaneously with the closing of the outside air insulation member 300, the film pressing portion 103 is in contact with the lower mold side member 201 via the release film 11, and the release film 11 is sandwiched between the lower mold side member 210 and the film pressing portion 103. At this time, the upper mold 100 and the lower mold 200 are not yet closed, and the substrate 10 and the molten resin 20b are not yet in contact. In this state, as indicated by arrow 300B, the internal decompression mechanism 320 (not shown in fig. 2 to 8) of the through hole 300B of the upper mold 100 is decompressed by the external air insulating member. At this time, the valve V6 is closed, and the valves V5, V7 are opened. This causes the inside of the outside air insulation space S to be negative pressure.
Thereafter, as shown in fig. 6, the lower die holding member 210 (lower die 200) is further raised. Thereby, the substrate 10 is brought into contact with the molten resin 20 b. At this time, when other components (for example, chips, leads, and the like) are fixed to the lower surface of the substrate 10, these other components are immersed in the molten resin 20b, and the lower surface of the substrate 10 is in contact with the molten resin 20b in the end. In this way, the cavity 200A is filled with the molten resin 20b, and the upper mold 100 and the lower mold 200 are clamped. After the mold closing, the valve V5 connected to the outside air insulating member internal decompression mechanism 320 is closed, and the leak valve LV is opened to return the inside of the outside air insulating space S to the atmospheric pressure. The timing of returning the inside of the external air insulation space S to the atmospheric pressure may be performed after the mold is closed and before the solidification of the molten resin 20b is completed.
Further, as shown in fig. 7 to 8, the molten resin 20b is hardened (solidified) to complete the resin molding step, and at the same time, a release film peeling step is performed.
First, as shown in fig. 7, the molten resin 20b is solidified. For example, when the molten resin 20b is a thermosetting resin, the mold may be further heated by a heater inside the mold to form the cured resin 20. For example, when the molten resin 20b is a thermoplastic resin, the molten resin 20b may be hardened to be the solidified resin 20 by stopping heating of the mold and naturally cooling or by rapidly cooling the mold. In the present embodiment, the cured resin 20 corresponds to the "molded resin" of the present invention. Further, since a force for raising the lower mold 200 is also applied to the lower mold holding member 210 after the mold closing, the molten resin 20b is solidified while being compressed.
After the completion of the solidification of the molten resin 20B, the valve V7 is closed, the valve V6 (see fig. 1) is opened, and as shown by an arrow 300c in fig. 7, compressed air is fed from the pressurizing mechanism 400 into the external air-insulated space S through the through-hole 300B of the upper mold, thereby making the inside of the external air-insulated space S positive pressure. The "positive pressure" is not particularly limited, and may be, for example, more than 1 atmosphere (about 1.013X 10)5Pa) of 2kgf/cm, depending on the type of the release film and the type of the resin, and the degree of adhesion between the release film and the cured resin2(about 1.96X 10)5Pa) above, 3kgf/cm2(about 2.94X 10)5Pa) above, 4kgf/cm2(about 3.92X 10)5Pa) above, 5kgf/cm2(about 4.9X 10)5Pa) or more, e.g. is5kgf/cm2Below, or 4kgf/cm2Below, or 3kgf/cm2Below, or 2kgf/cm2The following may be also used. The pressure applied to the inside of the external air insulation space S is, usually, 1kgf/cm2Above 5kgf/cm2The following suitable pressure is preferred for ease of use. Thereby, the release film 11 is pressed in the direction of the mold surface of the lower mold 200. Specifically, as shown by arrows 201a2, 201b2, and 200b2 in fig. 7, the positive pressure (pressurization) in the outside air insulation space S applies a positive pressure to all the members present in the outside air insulation space S, and therefore, the release film 11 is pressurized in the direction of the mold surface of the lower mold 200. The pressurizing force acts as a force for enhancing the suction force (the suction force of the release film 11) from the through holes 201A, 201B, and 200B. Further, as shown by an arrow 100b2 in fig. 7, the substrate 10 is pressurized in the direction of the mold surface of the upper mold 100 by the positive pressure (pressurization) in the outside air insulation space S. The pressurizing force acts as a force for enhancing the suction force (the suction force of the substrate 10) from the through hole 100B.
The timing of starting the pressurization in the outside air insulation space S is not particularly limited as long as it is after the mold is closed. For example, the pressurization in the outside air insulation space S may be started simultaneously with completion of the solidification of the molten resin 20b, or the pressurization in the outside air insulation space S may be started prior to completion of the solidification of the molten resin 20 b. The "completion of the solidification of the molten resin 20 b" may be such that the molten resin 20b is not completely solidified, for example, solidified to a degree that it can be released from the mold. The time for pressurizing the inside of the outside air barrier space S is not particularly limited as long as the inside of the outside air barrier space S is maintained at a positive pressure immediately before the release film 11 is peeled off upon opening the mold and a sufficient time is allowed for the force for pressing the release film 11 in the direction of the mold surface of the lower mold bottom member 201, and can be appropriately set in consideration of piping resistance and the like, as will be described later.
Thereafter, as shown in fig. 8, the lower mold holding member 210 is lowered, the lower mold 200 and the outside air blocking member 300 are lowered, and the upper mold 100 and the lower mold 200 are opened. During this period, the compressed air is continuously supplied into the outside air insulation space S, and the inside of the outside air insulation space S is made to be a positive pressure. Thereby, as shown in the drawing, the release film 11 closely attached to the cured resin 20 is peeled off from the cured resin 20. Specifically, the release film 11 is peeled from the lower mold 200 (the lower mold bottom member 202) and pulled upward as the lower mold 200 descends, because the cured resin 20 formed on the substrate adheres to the portion of the cavity 200A. On the other hand, the inside of the outside air insulation space S is positive pressure until the outside air insulation member 300 is completely opened. Therefore, the portion of the release film 11 not in contact with the cured resin 20, that is, the portion adsorbed to the lower mold side member 201 is pressed in the direction of the mold surface of the lower mold side member 201 by the pressure (positive pressure). Accordingly, the release film 11 is pressed in the direction of the mold surface with a larger force than in the case of simple suction. As a result, the force for peeling the release film from the cured resin 20 becomes large, and the release film becomes easy to peel from the cured resin 20. At this time (at the time of opening the mold), as described above, the curable resin 20 may not be completely cured, and may be cured to such an extent that the mold can be released.
At this time, the substrate 10 is adsorbed to the upper mold 200. Therefore, the substrate 10 is held by the positive pressure in the outside air insulating space S with a larger force than the case of simple suction until the outside air insulating member 300 is completely opened, like the sucked portion of the release film 11. When the lower mold 200 is lowered, the substrate 10 remains in the upper mold 100 together with the molded cured resin 20 and the release film 11 adhering thereto thereunder. As described above, since the release film 11 is pulled downward together with the lower die 200 by the lowering of the lower die 200, the release film 11 gradually peels off from the edge portion D of the cured resin 20 as shown in fig. 8.
The resin molding step and the release film peeling step are performed as described above, and the resin molded article 30 in which one surface of the substrate is resin-molded with the cured resin 20 is manufactured. In the resin molding step and the release film peeling step, the suction of the release film 11 to the lower mold 200 may be appropriately stopped by opening and closing the valves V1 to V3 so that the respective steps are appropriately performed. For example, when opening the mold, the valve V1 may be closed to release the release film 11 from the through hole 200B so that the release film 11 is easily peeled off from the lower mold bottom member 202. Further, as shown by an arrow 200c in fig. 8, a pressurizing mechanism and a valve may be provided in the middle of the pipe 1000 connecting the through-hole 200B, and when the mold is opened, after adsorption of the release film 11 from the through-hole 200B is released, compressed gas (for example, compressed air) may be introduced from the through-hole 200B into the outside air blocking space S. This facilitates removal of the resin molded product 30 from the cavity 200A of the lower mold 200. The timing and time of introducing the compressed gas from through-hole 200B may be appropriately set, but it is preferable to stop the injection of the compressed gas before film pressing portion 103 is separated from lower die 200, and to perform suction of release film 11 from through-hole 200B again. With such a setting, the release film 11 gradually peels from the edge portion D of the cured resin 20 (i.e., the periphery of the resin molded article 30) toward the center thereof while being inflated like a balloon during peeling, and thus the peeling of the release film is more uniformly performed. The compressed air fed into the external air insulation space S may be stopped at any time after the release film 11 is completely peeled from the cured resin 20. Thereafter, the lower die holding member 210 stops descending, the pressure reduction of the through holes 200B, 201A, and 201B of the lower die 200 is released, and the release film 11 is peeled and recovered from the die surface of the lower die 200 by an appropriate method. The manufactured resin molded article 30 can be conveyed out of the resin molding apparatus by an appropriate conveying apparatus (not shown), for example.
When the release film is adsorbed to the mold surface of the mold only by adsorption by the decompression, the adsorption force is a pressure difference between the pressure in the decompressed through- holes 200B, 201A, 201B and the pressure in the external air insulation space S. At this time, since the degree of vacuum is not less than 0, the maximum adsorption force of the mold release film is about 1.033kgf/cm when the atmosphere in the external air insulating space S is atmospheric pressure2(1.013×105Pa) is added. In contrast, in the present invention, as described above, the space surrounded by the external air insulating member (inside the external air insulating space) is pressurized to a pressure (positive pressure) higher than the atmospheric pressure, whereby the pressure difference between the pressure inside the decompressed through- holes 200B, 201A, 201B and the pressure inside the external air insulating space S can be set to about 1.033kgf/cm2The above. That is, the pressure toward the sucked side can be further applied to the sucked release film 11, and the release can be performedThe force with which the mold film is pressed against the mold surface side of the molding die is increased. Thus, the force for peeling the release film is increased, and the release film is easily peeled from the resin molded product. As a result, according to the present invention, the problem of mold release of the resin molded article, product failure, and the like can be suppressed or prevented.
In this embodiment, the molding object is held by suction generated by pressure reduction in the mold, as well as being held by the clamp portion. When the molding object is large, the molding object is likely to be bent or wrinkled only when the end portion is clamped by the clamp portion, and therefore, suction by reduced pressure is often used. Although the suction force generated by the decompression of the molding object can be more firmly held in the molding die than in the case of merely clamping, the maximum suction force is about 1.013 × 10 in the case of the atmospheric pressure in the external air insulation space S as in the case of the release film5Pa. However, according to the present invention, the suction force of the object to be molded can be enhanced by setting the pressure (positive pressure) in the space S surrounded by the external air insulating member to a pressure higher than the atmospheric pressure, as in the case of the release film. As a result, the force for peeling the resin molded article from the release film is further increased, and therefore the resin molded article and the release film are more easily peeled. As a result, the molded object is not carried away by the lower mold during mold opening, and problems of mold release of the resin molded product, product failure, and the like can be suppressed or prevented.
In the present embodiment, as shown in fig. 1, the circuit (piping) for pressurizing the inside of the external air insulation space S also serves as a circuit (piping) 1006 for depressurizing the inside of the external air insulation space S. However, the present invention is not limited to this, and for example, a dedicated circuit (pipe) for pressurizing the inside of the outside air insulation space S may be separately provided.
The mechanism for holding (fixing) the substrate (object to be molded) on the upper mold is not particularly limited. The mechanism may be clamped, for example, only by the clamping portion, but preferably, as in the present embodiment, suction by reduced pressure is used. This increases the force for attracting the substrate, and also increases the force for peeling off the release film.
In the present embodiment, the upper mold is a mold for fixing a substrate (object to be molded), and the lower mold is a mold for sucking a release film. However, the present invention is not limited to this, and for example, the lower mold may be a mold for fixing a substrate (object to be molded) and the upper mold may be a mold for sucking a release film.
In recent years, the number of types of release films used for resin molding has increased. However, when the adhesion or adhesion between the release film and the resin is strong, there is a possibility that the release film remains in the resin molded article or the resin molded article remains on the side of the release film as described above. However, according to the present invention, such a problem of mold release can be suppressed or prevented.
Fig. 2 to 8 illustrate a case where the release film 11 is a single film. However, the present invention is not limited thereto, and the release film may be a laminate of a plurality of films (hereinafter, may be referred to as "laminate") as described above. Thus, for example, in the release film peeling step shown in fig. 7 to 8, at least one of the plurality of films constituting the release film 11 can be peeled from the cured resin 20, and at least one of the plurality of films remains in close contact with the cured resin 20. Each film constituting the plurality of films is not particularly limited, and may be, for example, a metal foil. The metal foil may be, for example, a copper foil, an aluminum foil, a gold foil, a silver foil, or a palladium film.
[ example 2]
In recent years, a new molding technique has been required in which copper (Cu) foil or the like, which is a wiring material later, is added to the surface of a resin molded article at the same time as molding. In this case, for example, a laminate sheet, which is a laminate of a substrate and a copper foil, is used as a release film, and only the substrate is peeled off from the molded resin, and the copper foil remains in close contact with the molded resin. In this case, if the peel strength (adhesive force) between the substrate and the copper foil is larger than the suction force of the laminate to the mold surface of the mold, a problem may occur in the peeling between the substrate and the copper foil. However, even in this case, if the method of peeling off the mold release film according to the present invention is used, as described above, the suction force of the mold release film can be enhanced by pressurizing the space surrounded by the external air insulating member (inside the external air insulating space), and the force of pressing the mold release film against the mold surface side of the mold can be increased. Therefore, according to the present invention, the base material and the copper foil can be stably peeled. The base material is not particularly limited as long as it can form a laminate together with the copper foil, and for example, the base material may be a copper (Cu) foil. That is, the laminate sheet may be a laminate of a plurality of copper foils. As described above, each film in the laminate of the plurality of films is not limited to the copper foil and the like, and is arbitrary.
In example 2, in the resin molding apparatus of example 1, a method of peeling off a release film and a method of manufacturing a resin molded article were performed using a copper laminate sheet as the release film 11. Specifically, a copper laminate comprising a copper base material having a thickness of 18 μm and a copper foil having a thickness of 3 μm was used. As the object 10, a rectangular substrate (substrate on which a chip or the like is not mounted) of 320mm is used. As the resin material 20a, a thermosetting granular resin is used. The substrate is adsorbed by the reduced pressure on the upper mold, and in the step of peeling the release film, 4.5kgf/cm is applied to the inside of the external air-isolated space S while the solidification of the molten resin is completed2(about 4.41X 10)5Pa) and then opening the mold to peel off the copper laminate. Except for this, the method for peeling off the release film and the method for producing the resin molded article in example 2 were performed in the same manner as the method described in example 1.
As a comparative example, a method for releasing a release film and a method for producing a resin molded article were carried out in the same manner as in example 2, except that the copper laminate sheet was released without applying a positive pressure in the release film releasing step.
Fig. 9(a) shows a photograph of the resin molded article obtained in example 2. Fig. 9(b) shows a photograph of the copper laminate sheet peeled from the resin molded article of fig. 9 (a). Fig. 10(a) shows a photograph of a resin molded article obtained by the comparative example. Fig. 10(b), (c) and (d) are enlarged photographs of a part of the resin molded article of fig. 10 (a).
As shown in fig. 9(a), in the resin molded article obtained by the method for peeling off the release film and the method for producing the resin molded article of example 2, the copper foil remains on the entire surface of the resin molded article, and no copper foil remains in a portion not in contact with the resin, that is, in a portion outside the edge portion (edge portion D in fig. 8) of the resin molded article. Thus, in example 2, the copper foil and the substrate of the laminate sheet were appropriately peeled. In the case of the edge portion (edge portion D in fig. 8) of the resin molded product, the peeling was smoothly completed, and it was also found from the fact that the copper foil was cleanly peeled and removed in the shape of the resin molded product in the copper laminated sheet (fig. 9(b)) peeled from the resin molded product, and no excess copper foil was peeled at the boundary portion. On the other hand, in the comparative example, although the copper foil remained on the entire surface of the resin molded article as shown in fig. 10(a), a part of the copper foil of the copper laminated sheet not bonded to the resin molded article failed to peel off and remained on the edge portion of the resin molded article as shown by the arrow portions in fig. 10(b) to 10 (d). In this way, in the comparative example, the peeling of the laminated copper foil and the substrate was not properly performed.
The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and employed as needed within a scope not departing from the gist of the present invention.
This application claims priority based on japanese patent application publication 2018-163339, filed on 31/8, the disclosure of which is incorporated herein by reference in its entirety.
Description of the symbols
10 substrate (object to be molded)
11 mold release film
20 curing resin (Molding resin)
20a resin material
20b molten resin
30 resin molded article
100 upper mould
100B through hole
102 upper die main body
103 film pressing part
103s upper die elastic component
104 clamping part
110 upper die holding member
120 molded object suction mechanism
200 lower die
200A die cavity
200B through hole
201A, 201B through hole
201 lower die side part
201s lower die elastic component
202 lower die bottom part
210 lower die holding member
220 demoulding membrane adsorption mechanism
300 external air insulating member
300B through hole
320 internal pressure reducing mechanism of external air isolation component
400 pressurizing mechanism
1000. 1004, 1006, 1100 piping
S external air isolation space
V1-V7 valve
G1-G5 instrument
LV leakage valve

Claims (10)

1. A resin molding device is characterized by comprising:
a molding die having a die on one side and a die on the other side arranged opposite to each other;
an external air insulating member surrounding the molding die and insulating the molding die from external air;
a release film suction mechanism which is connected to one or both of the mold on the one side and the mold on the other side and sucks a release film on a mold surface of the connected molds;
and a pressurizing mechanism for pressurizing a space surrounded by the external air insulating member and pressurizing the release film in a direction of a mold surface on which the release film is adsorbed.
2. The resin molding apparatus as claimed in claim 1, wherein
The mold on one side is a mold for fixing a molding object,
the other mold is a mold in which a cavity is formed on the mold surface and the release film is adsorbed on the mold surface.
3. The resin molding apparatus as claimed in claim 2, wherein
The other side of the mould has a bottom part and a side part,
the cavity is formed by a space surrounded by the bottom surface member and the side surface member.
4. The resin molding apparatus as claimed in any one of claims 1 to 3, wherein the mold on the one side is an upper mold and the mold on the other side is a lower mold.
5. A method for peeling a release film, characterized in that the release film adhered to a molded resin and adsorbed on a mold surface of a mold is peeled from the molded resin in a state of being pressed in a direction of the mold surface.
6. The method for peeling off a release film as claimed in claim 5, wherein
The release film is a laminate of a plurality of films,
at least one of the plurality of films is peeled from the molded resin, and at least one of the plurality of films remains in close contact with the molded resin.
7. The method of releasing a release film according to claim 5 or 6, wherein the release film is at least one of a resin film, a metal foil, and a rubber sheet.
8. The method of peeling a release film according to claim 6, wherein each of the plurality of films is a metal foil.
9. A method for producing a resin molded article, comprising:
a mold release film adsorption step of adsorbing the mold release film to the mold surface of the molding die;
a resin molding step of molding a resin with the mold by the mold die in a state where the mold release film is adsorbed on the surface of the mold;
a release film peeling step of peeling the release film from the molded resin,
the release film peeling step is a step of peeling the release film from the molded resin by the release film peeling method according to any one of claims 5 to 8.
10. The method for producing a resin molded article according to claim 9, wherein
Performing the release film adsorption step, the resin molding step, and the release film peeling step using the resin molding apparatus according to any one of claims 1 to 4,
in the release film adsorption step, the release film is adsorbed to the mold surface of the mold connected to the release film adsorption mechanism by the release film adsorption mechanism,
in the resin molding step, resin molding is performed between the mold surface of the one mold and the mold surface of the other mold with the release film being adsorbed,
in the release film peeling step, the space surrounded by the outside air blocking member is pressurized by the pressurizing mechanism, and the release film is peeled from the molded resin in a state where the release film is pressurized in a direction of a mold surface to which the release film is adsorbed.
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