CN103240817A - Resin sealing apparatus and resin sealing method - Google Patents
Resin sealing apparatus and resin sealing method Download PDFInfo
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- CN103240817A CN103240817A CN2013100512645A CN201310051264A CN103240817A CN 103240817 A CN103240817 A CN 103240817A CN 2013100512645 A CN2013100512645 A CN 2013100512645A CN 201310051264 A CN201310051264 A CN 201310051264A CN 103240817 A CN103240817 A CN 103240817A
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- 238000007789 sealing Methods 0.000 title claims abstract description 76
- 239000011347 resin Substances 0.000 title claims abstract description 43
- 229920005989 resin Polymers 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000001179 sorption measurement Methods 0.000 claims description 54
- 238000000465 moulding Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 description 53
- 239000000047 product Substances 0.000 description 21
- 238000010521 absorption reaction Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000748 compression moulding Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- -1 and (in addition Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention provides a resin sealing apparatus and a resin sealing method, and the baseplate can be sucked on an upper die steadily without being influenced by the position of the holes on outer circle of the baseplate. The resin sealing apparatus (100) has an upper die (110) and a lower die (130) that can get close to or far from the upper die (110) relatively, and the resin is sealed by sucking the baseplate (106) onto the upper die (110) through negative pressure, wherein the upper die (110) has a suction part (120A) that sucks the baseplate (106) in between the area corresponding to the sealing area (106A) sealed by resin on the baseplate (106) and the area corresponding to the hole (106B) that is set most close to the sealing area (106A).
Description
Technical field
The present invention relates to a kind of resin sealing apparatus and method of resin-sealing.
Background technology
Record resin sealing apparatus 1 as shown in Figure 6 in the patent documentation 1, its have patrix 10 and relative with patrix 10 close or away from counterdie 30, by negative pressure substrate 6 is adsorbed in patrix 10 and carries out resin-sealed.In the resin sealing apparatus 1, in not shown attraction mechanism, produce air negative pressure, and in being arranged at the stream 10B of patrix 10, transmit negative pressure to adsorption orifice 10A.Therefore, when substrate 6 being carried out to make substrate 6 stably be adsorbed in patrix 10 when resin-sealed.
Patent documentation 1: TOHKEMY 2008-302535 communique
The location that is provided with the outer peripheral portion that is arranged at substrate 6 by resin-sealed substrate 6 in the resin sealing apparatus 1 of patent documentation 1 is with hole (tooling hole) or be used for differentiating the hole (be referred to as and abbreviate as hole 6B) of the kind of substrate 6.Therefore, need avoid the position of hole 6B and a plurality of absorption 10A are located at patrix 10.That is, if do not take into full account the position of hole 6B of the outer peripheral portion of substrate 6 in advance, then can exist hole 6B and absorption 10A to interfere mutually, negative pressure is leaked and can't be obtained sufficient absorption affinity, is difficult to make substrate 6 stably to be adsorbed in the misgivings of patrix 10.
Summary of the invention
Therefore, the present invention finishes in order to address the above problem, its problem is to provide a kind of substrate etc. that is not subjected to by the influence of the position in the hole of the outer peripheral portion of moulding product, and can make resin sealing apparatus and the method for resin-sealing that stably is adsorbed in mould by the moulding product.
The present invention is by the above-mentioned problem of following solution, it is a kind of resin sealing apparatus, its have the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, to be adsorbed in the 1st mould by the moulding product by negative pressure carries out resin-sealed, in described the 1st mould, with described by the moulding product corresponding by resin-sealed sealing area zone and with corresponding zone, the hole that arranges near sealing area between the zone, have the adsorption section that this is adsorbed by the moulding product.
In other words, the present invention is not conceived to by the circumferencial direction of moulding product, but is conceived to by the moulding product adsorption section is set radially.That is, the position that the adsorption section is set be made as by the moulding product radially " zone corresponding with sealing area and with corresponding zone, (arranging near sealing area) hole between the zone ".
In addition, when being that being arranged at by the location of the outer peripheral portion of moulding product is that tooling hole is when constituting with the hole by this hole only, the present invention can also grasp into following structure, it is a kind of resin sealing apparatus, its have the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, to be adsorbed in the 1st mould by the moulding product by negative pressure carries out resin-sealed, wherein, in described the 1st mould, with described by the moulding product corresponding by resin-sealed sealing area zone and with corresponding zone, the zone that forms tooling hole between the zone, have the adsorption section that this is adsorbed by the moulding product.
In addition, the present invention can also grasp into following method, it is a kind of method of resin-sealing, its use the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, to be adsorbed in the 1st mould by the moulding product by negative pressure carries out resin-sealed, it is characterized in that, this method of resin-sealing comprises following operation, and the adsorption section that is arranged at described the 1st mould is being adsorbed by the moulding product this with the described zone corresponding by resin-sealed sealing area by the moulding product with the zone between the corresponding zone, the hole that arranges near the sealing zone.
The invention effect
According to the present invention, be not subjected to stably to be adsorbed in mould by the influence of the position in the hole of the outer peripheral portion of moulding product and can make by the moulding product.
Description of drawings
Fig. 1 is the schematic diagram of resin sealing apparatus of using an example of embodiments of the present invention.
Fig. 2 is the schematic diagram of the relation of the counterdie side surface of patrix of the resin sealing apparatus shown in the presentation graphs 1 and substrate.
Fig. 3 is the schematic diagram of the part of the counterdie side surface shown in the presentation graphs 2 and substrate.
Fig. 4 is the schematic diagram that expression is adsorbed in the relation of the substrate of patrix and adsorption section.
Fig. 5 is the schematic diagram of the resin-sealed step of expression.
Fig. 6 is the schematic diagram of representing resin sealing apparatus in the past.
Among the figure: 1, the 100-resin sealing apparatus, 4, the 104-mold release film, 6, the 106-substrate, 6A, the 106A-sealing area, 6B, the 106B-hole, 10, the 110-patrix, the 10A-adsorption orifice, 10B-stream, 30, the 130-counterdie, 32, the 132-compression molding, 34, the 134-heater, 36,136-frame mould, 36A, 118A, the 136A-through hole, 38, the 138-spring, the 108-resin, 114-the 1st patrix, 114A-the 1st stream, 116-the 2nd patrix, 116A-counterdie side surface, 116B-the 1st patrix side surface, 118-external mold, the 120-internal mold, the 120A-adsorption section, 120B-the 2nd stream, 120C-relaying groove, 120D-runs through the road, the 150-die cavity.
The specific embodiment
Below with reference to the accompanying drawings the example of embodiments of the present invention is described.
Fig. 1 is the schematic diagram of resin sealing apparatus of using an example of embodiments of the present invention.Feature to summary is carried out following explanation.
As shown in Figure 1, resin sealing apparatus 100 has patrix 110(the 1st mould) and can be relative with patrix 110 near or away from counterdie 130(the 2nd mould), by negative pressure with substrate 106(by the moulding product) be adsorbed in patrix 110 and carry out resin-sealed.At this, patrix 110 with substrate 106 zone corresponding by resin-sealed sealing area 106A and with the corresponding zone of the hole 106B that arranges near sealing area 106A between the zone, have the adsorption section 120A that substrate 106 is adsorbed.
In addition, mold release film 104 is supplied to continuum of states (not shown) and can stretches.Mold release film 104 can improve by resin-sealed substrate 106(moulding product) be formed at the fissility of the die cavity 150 between counterdie 130 and the substrate 106 when resin-sealed and can prevent the pollution of die cavity 150.Substrate 106 for example is glass epoxy substrate, and (in addition, substrate also can be lead frame etc. to be equipped with not shown a plurality of semiconductor chips etc. at the surperficial middle body of a side.At this moment, for the feeding of hoop material etc. and hole (sprocket hole) that arranges etc. also is contained in hole 106B described later).As shown in Figure 4, when resin-sealed, form the sealing area 106A that surrounds with double dot dash line in the mode that covers them by resin, only have substrate portion (in addition, the part of the frame shape that with dashed lines surrounds among Fig. 4 is represented adsorption section 120A) at its outer peripheral portion.Outer peripheral portion at substrate 106 is provided with the hole that the location is used hole (tooling hole) or is used for differentiating the kind of substrate 106, and they are referred to as hole 106B.Certainly also can only constitute hole 106B by tooling hole.In addition, even the hole 106B in the present embodiment refers to desire and adsorbs with negative pressure by adsorption section 120A, absorption affinity is the hole of impaired and so on form also, though for example comprise the hole of running through substrate 106 and do not run through substrate 106 the hole and for as the mark that forms small ladder difference also can between substrate 106 and adsorption section 120A, produce the gap that can't fully adsorb by adsorption section 120A.Resin 108 is pre-formed with predetermined shape and weight in the mode of filling sealing area 106A, but also can be powdery, granular or aqueous.In the present embodiment, substrate 106, resin 108 are disposed at die cavity 150 by not shown loading machine respectively.
Below, structure is elaborated.
As shown in Figure 1, but resin sealing apparatus 100 possess the patrix 110 that is fixed in not shown fixation clip and be installed on can with respect to fixation clip near or away from the counterdie 130 of not shown dynamic pressure plate.
Described patrix 110 has a plurality of mould important documents.That is, as shown in Figure 1, patrix 110 has the 1st patrix 114(the 1st mould important document that is fixed in the fixation clip side) and be installed on the 2nd patrix 116(the 2nd mould important document of the counterdie side of the 1st patrix 114).Be provided with not shown heater in the inside of the 1st patrix 114, it is set as predetermined temperature.And, in the 1st patrix 114, be formed with the 1st stream 114A that is delivered in the negative pressure that produces in the not shown attraction mechanism.In the 1st stream 114A, the 2nd stream 120B through being arranged at the 2nd patrix 116 and be communicated with adsorption section 120A.
As shown in Figure 1, the 2nd patrix 116 has internal mold 120(the 3rd mould important document) and be embedded with (being provided with through hole 118A's) external mold 118(the 4th mould important document of internal mold 120) (that is, the 2nd patrix 116 is made as the nest structure).In addition, internal mold 120 and external mold 118 are fixed in the 1st patrix 114 by not shown bolt etc.Be provided with the relaying groove 120C that constitutes adsorption section 120A and the 2nd stream 120B and run through road 120D at internal mold 120.
As shown in Figure 2, adsorption section 120A is on counterdie side surface 116A(the 2nd die side surface of internal mold 120) form the groove shape along external mold 118, and be made as the annular shape that surrounds sealing area 106A.That is, adsorption section 120A is formed at the end (junction surface) that internal mold 120 and external mold 118 adjoin each other.Zone between the zone that the zone of adsorption section 120A is made as the zone corresponding with the sealing area 106A that surrounds with double dot dash line and the hole 106B that surrounds with the with dashed lines that arranges near sealing area 106A is corresponding.Namely, as shown in Figure 3, in the zone of adsorption section 120A, the end 120AB of the sealing area side of adsorption section 120A does not enter the inside of sealing area 106A and rests on the position of end 106AA, and the end 120AA of the sealing area opposition side of adsorption section 120A is defined in to the position of the end 106BA of the sealing area side of the hole 106B that arranges near sealing area 106A (still, allow and surpass end 106BA in the deviation range on making), i.e. the negative pressure zone that can not leak and in fact can not cause negative pressure to descend.In addition, among Fig. 2, Fig. 3, the symbol 106D that dots represents the end of substrate 106.
As shown in Figure 1, relaying groove 120C and the 1st stream 114A(stream on the 1st patrix 114 of being arranged at that transmits negative pressure) be communicated with and arrange along external mold 118 at the 1st patrix side surface 116B.In addition, relaying groove 120C also is made as annular shape, reduces the pressure loss of negative pressure in the 2nd stream 120B.
As shown in Figure 1 and Figure 2, run through road 120D so that adsorption section 120A and relaying groove 120C arrange a plurality of along the mode that external mold 118 is communicated with.
As shown in Figure 1, described counterdie 130 has compression molding 132 and frame mould 136.Compression molding 132 is through spring 138 supporting frame moulds 136.Be provided with heater 134 in the compression molding 132, it is set as predetermined temperature.In frame mould 136, be formed with through hole 136A, and side is chimeric that compression molding 132 arranged within it.Therefore, frame mould 136 can move to the Z direction with respect to compression molding 132.In addition, also be formed with not shown stream at counterdie 130, thus, can be in the surface of counterdie 130 absorption mold release film 104.In addition, in the present embodiment, constitute adsorption section 120A at patrix 110, but also can in counterdie, possess the structure identical with patrix 110 and make substrate be adsorbed in counterdie.
Then, utilize Fig. 5 that the resin-sealed step based on resin sealing apparatus 100 is described.
At first, patrix 110 and counterdie 130 away from die opening state (Fig. 5 (A)) under, mold release film 104 is disposed on the counterdie 130, and makes mold release film 104 be adsorbed in the surface of counterdie 130.In addition, under this state, patrix 110 and counterdie 130 are set as the steady temperature (for example 175 degree) when resin-sealed.
Then, make substrate 106 close to adsorption section 120A by not shown loading machine.At this moment, make the not shown attraction mechanism action that is communicated with adsorption section 120A.So, produce absorption affinity through the 1st stream 114A, the 2nd stream 120B at the adsorption section 120A of the counterdie side surface 116A that is arranged at the 2nd patrix 116.And adsorption section 120A is adsorbing substrate 106 with substrate 106 zone corresponding by resin-sealed sealing area 106A with the zone between the corresponding zone of the hole 106B that arranges near sealing area 106A.And, the die cavity 150 configuration resin 108(Fig. 5 (B) on mold release film 104).
Then, make counterdie 130 gradually near patrix 110.So the external mold 118 of the 2nd patrix 116 and frame mould 136 be through mold release film 104 and substrate 106 butts, and fixedly mold release film 104 and substrate 106.And, constitute air-tight state by patrix 110 and counterdie 130.At this moment, by the not shown mechanism of decompressor, carry out the decompression (Fig. 5 (C)) of the die cavity 150 of formation between patrix 110 and counterdie 130.
In addition, make patrix 110 and counterdie 130 close gradually.And, become under the state of predetermined pressure at the resin of the inside of die cavity 150, carry out the resin-sealed matched moulds (Fig. 5 (D)) of finishing of sealing area 106A.
Then, carry out the die sinking of patrix 110 and counterdie 130.And, when not shown mould unloading machine moves to the precalculated position of patrix 110, in the 1st stream 114A, the 2nd stream 120B, carry compressed air.And, make by resin-sealed substrate 106(moulding product) and from 116 demouldings of the 2nd patrix, and take out with unloader.
Like this, in the present embodiment, the zone corresponding with the sealing area 106A of substrate 106 and with the corresponding zone of the hole 106B that arranges near sealing area 106A between the zone, have the adsorption section 120A that substrate 106 is adsorbed.Namely, even the position of hole 106B upwards changed in week of substrate 106, the position that adsorption section 120A is set be substrate 106 radially " zone corresponding with sealing area 106A and with the corresponding zone of (arranging near sealing area 106A) hole 106B between the zone ".Therefore, the leakage that can eliminate the negative pressure that causes because of hole 106B also can avoid absorption affinity to descend.Especially, big or small identical (the comprising the identical situation that is considered as) of substrate 106 and sealing area 106A, simultaneously the quantity of semiconductor chip or diverse other kinds are carried out also can adsorbing substrate 106 accurately and stably even the position of hole 106B changes when resin-sealed.Simultaneously, owing to be not formed with adsorption section 120A in the zone corresponding with the sealing area 106A of substrate 106, even so need expend bigger pressure when resin-sealed, therefore its pressure also can't directly put on the part of the substrate corresponding with the position of adsorption section 120A 106, can prevent the distortion of the substrate 106 that causes because of adsorption section 120A or breakage etc.
And adsorption section 120A forms the groove shape in the present embodiment, and is set as the annular shape that surrounds sealing area 106A, so even the width of adsorption section 120A is narrower, also can increase the adsorption area to substrate 106 that is formed by adsorption section 120A.Therefore, can more stably adsorb substrate 106.In addition, the adsorption section may not one be decided to be the groove shape, and the adsorption section also may not be continuous, can be provided with a plurality of intermittently.As the shape of adsorption section of this moment, can the applicable line shape or circular shape etc.
And in the present embodiment, patrix 110 has as the internal mold 120 of mould important document and external mold 118.And adsorption section 120A is formed at the junction surface of internal mold 120 and external mold 118.Therefore, form adsorption section 120A easily.And, only dismantle that internal mold 120 just can be eliminated the reason resin leakage and the obstruction of the adsorption section 120A that the dust that causes, dust etc. cause, and maintenance management easily.
And, in the present embodiment, during desire increase and decrease absorption affinity, also can only change change relaying groove 120C, run through road 120D, and the internal mold 120 of the shape of adsorption section 120A get final product, even therefore substrate 106 big or small identical for example, and when the weight of the substrate after resin-sealed 106 changes greatly, can be therewith correspondingly easily and change the performance of absorption affinity with low cost.
In addition, patrix forms as one and the mould important document becomes 1, also can the adsorption section directly be set at this.Perhaps, patrix also can directly be divided into the outside and inboard 2 mould important documents, that is, patrix directly becomes the nest structure, and stream and adsorption section are formed at the junction surface in the mould in inboard or the outside.Perhaps, patrix also can not become the nest structure, and does not form the adsorption section at the junction surface.Perhaps, also can non-relay groove as stream, and stream is arranged at the inside of the mould in inboard or the outside.
In addition, also can make substrate be adsorbed in counterdie.
That is, according to present embodiment, be not subjected to the influence of position of hole 106B of the outer peripheral portion of substrate 106, and can make substrate 106 stably be adsorbed in patrix 110 as mould.
The present invention is for example understood present embodiment, but the invention is not restricted to present embodiment.That is, self-evident, the change that in the scope that does not break away from main idea of the present invention, can improve and design.
And in the above-mentioned embodiment, mold release film is supplied to continuum of states, but the invention is not restricted to this.For example, mold release film also can form oblong-shaped and be supplied to.Perhaps, can not use mold release film at counterdie yet.
And, in the above-mentioned embodiment, resin sealing apparatus 100 is for directly disposing the resin sealing apparatus that is compressed into pattern of resin 108 in die cavity 150, but the invention is not restricted to this, also can be resin put into tank body, and will be the resin of fusion be filled in the resin sealing apparatus of the delivery type of die cavity through eddy current portion or flow path portion.
In the above-mentioned embodiment, patrix is installed and also to be fixed in fixation clip, but the invention is not restricted to this, can be made as counterdie install and be fixed in fixation clip and patrix can near or away from direction mobile.
Utilizability on the industry
Resin sealing apparatus of the present invention for example can be widely used in substrate (comprising lead frame) that is equipped with semiconductor chip etc. is undertaken in the resin-sealed purposes by the moulding product.
The application advocates the priority based on the Japanese patent application of on February 14th, 2012 application 2012-029989 number.All the elements of its application are applied in this specification by reference.
Claims (7)
1. resin sealing apparatus, its have the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, will be adsorbed in the 1st mould by the moulding product by negative pressure and carry out resin-sealedly, it is characterized in that,
In described the 1st mould, described by the moulding product by the zone between resin-sealed sealing area The corresponding area and the hole The corresponding area that arranges near the sealing zone, have the adsorption section that this is adsorbed by the moulding product.
2. resin sealing apparatus, its have the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, will be adsorbed in the 1st mould by the moulding product by negative pressure and carry out resin-sealedly, it is characterized in that,
In described the 1st mould, described by the moulding product by resin-sealed sealing area The corresponding area and form zone between the regional The corresponding area of tooling hole, have the adsorption section that this is adsorbed by the moulding product.
3. resin sealing apparatus as claimed in claim 1 or 2 is characterized in that,
Described adsorption section forms the groove shape.
4. as each described resin sealing apparatus in the claim 1～3, it is characterized in that,
Described adsorption section is made as the annular shape that surrounds described sealing area.
5. as each described resin sealing apparatus in the claim 1～4, it is characterized in that,
Described the 1st mould has a plurality of mould important documents,
Be formed with described adsorption section at the junction surface of these a plurality of mould important documents.
6. as each described resin sealing apparatus in the claim 1～5, it is characterized in that,
Described the 1st mould has internal mold and is embedded with the external mold of this internal mold,
Junction surface at this internal mold and this external mold is formed with described adsorption section.
7. method of resin-sealing, its use the 1st mould and can be relative with the 1st mould near or away from the 2nd mould, will be adsorbed in the 1st mould by the moulding product by negative pressure and carry out resin-sealedly, it is characterized in that,
This method of resin-sealing comprises following operation, the adsorption section that is arranged at described the 1st mould described by the moulding product by the zone between resin-sealed sealing area The corresponding area and the hole The corresponding area that arranges near the sealing zone, this is adsorbed by the moulding product.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012029989A JP5877083B2 (en) | 2012-02-14 | 2012-02-14 | Resin sealing device and resin sealing method |
| JP2012-029989 | 2012-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103240817A true CN103240817A (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100512645A Pending CN103240817A (en) | 2012-02-14 | 2013-02-16 | Resin sealing apparatus and resin sealing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5877083B2 (en) |
| KR (1) | KR101417577B1 (en) |
| CN (1) | CN103240817A (en) |
| TW (1) | TW201332737A (en) |
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|---|---|---|---|---|
| CN104708752A (en) * | 2013-11-28 | 2015-06-17 | 东和株式会社 | Method and apparatus for supplying resin material of compression molding apparatus |
| CN106426710A (en) * | 2015-08-11 | 2017-02-22 | 东和株式会社 | Resin molding apparatus and resin molding method and molding die |
| CN107685412A (en) * | 2016-08-03 | 2018-02-13 | 东和株式会社 | The manufacture method of shaping mould, resin molding apparatus and synthetic resin |
| CN108688050A (en) * | 2017-03-29 | 2018-10-23 | 东和株式会社 | The manufacturing method of shaping mould, resin molding apparatus, resin molding method and synthetic resin |
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| CN110341109A (en) * | 2019-07-10 | 2019-10-18 | 安徽宏飞钓具有限公司 | A kind of production of bionic fish bait is with can pinpoint mold |
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| JP2000015667A (en) * | 1998-06-30 | 2000-01-18 | Nissha Printing Co Ltd | Mold for injection molding and manufacture of molding with design |
| CN1941308A (en) * | 2005-09-27 | 2007-04-04 | 东和株式会社 | Method of resin seal moulding electronic component and apparatus therefor |
| JP2007230138A (en) * | 2006-03-02 | 2007-09-13 | Apic Yamada Corp | Apparatus and method for resin molding |
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| Publication number | Priority date | Publication date | Assignee | Title |
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- 2013-02-16 CN CN2013100512645A patent/CN103240817A/en active Pending
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104708752A (en) * | 2013-11-28 | 2015-06-17 | 东和株式会社 | Method and apparatus for supplying resin material of compression molding apparatus |
| CN104708752B (en) * | 2013-11-28 | 2017-06-06 | 东和株式会社 | The resin material supply method and feedway of compression molding apparatuss |
| CN106426710A (en) * | 2015-08-11 | 2017-02-22 | 东和株式会社 | Resin molding apparatus and resin molding method and molding die |
| CN106426710B (en) * | 2015-08-11 | 2019-02-19 | 东和株式会社 | Resin molding apparatus and resin molding method and shaping mould |
| CN107685412A (en) * | 2016-08-03 | 2018-02-13 | 东和株式会社 | The manufacture method of shaping mould, resin molding apparatus and synthetic resin |
| CN107685412B (en) * | 2016-08-03 | 2020-03-06 | 东和株式会社 | Molding die, resin molding apparatus, and method for manufacturing resin molded product |
| CN108688050A (en) * | 2017-03-29 | 2018-10-23 | 东和株式会社 | The manufacturing method of shaping mould, resin molding apparatus, resin molding method and synthetic resin |
| CN108688050B (en) * | 2017-03-29 | 2020-12-11 | 东和株式会社 | Molding die, resin molding device, resin molding method, and method for manufacturing resin molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101417577B1 (en) | 2014-07-08 |
| KR20130093532A (en) | 2013-08-22 |
| JP5877083B2 (en) | 2016-03-02 |
| JP2013166272A (en) | 2013-08-29 |
| TW201332737A (en) | 2013-08-16 |
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