CN206742195U - Semiconductor packaging mold - Google Patents
Semiconductor packaging mold Download PDFInfo
- Publication number
- CN206742195U CN206742195U CN201720622785.5U CN201720622785U CN206742195U CN 206742195 U CN206742195 U CN 206742195U CN 201720622785 U CN201720622785 U CN 201720622785U CN 206742195 U CN206742195 U CN 206742195U
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- plate
- slideway
- baffle
- outer side
- side baffle
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Abstract
A kind of semiconductor packaging mold,Including top base component and bottom base component,Top base component includes upper padding plate,Cope plate,Upper left slideway,Upper right baffle-plate,Upper left cover,Upper right cover plate,Upper right shell body,Upper right slideway,Go forward inner side baffle,Go forward outer side shield,Inner side baffle and upper rear outer side shield after upper,Upper left slideway,Go forward inner side baffle,Upper right slideway,Inner side baffle and cope plate are with the upper installation cavity for installing encapsulation diaphragm capsule upper half component after upper,Bottom base component includes lower left cover,Bottom left slideway,Lower right baffle-plate,Lower template,Lower bolster,Bottom right slideway,Lower right shell body,Bottom right cover plate,Inner side baffle before lower,Outer side shield before lower,Inner side baffle and lower rear outer side shield after lower,Bottom left slideway,Inner side baffle before lower,Bottom right slideway,Inner side baffle and lower template are with the lower installation cavity for installing encapsulation diaphragm capsule lower half component after lower.The utility model is easy to use, versatile, can improve the utilization rate of encapsulation plant equipment well.
Description
Technical field
Field of semiconductor package is the utility model is related to, is especially a kind of semiconductor packaging mold.
Background technology
At present, it is very more to produce the producer of semiconductor automatic packaging system equipment, the device category accordingly manufactured
More, conventional package system is divided into 120T, 170T, 180T, all area in shape of the encapsulation diaphragm capsule provisioned in every kind of tonnage
Not, the larger equipment of usual tonnage is equipped with the larger encapsulation diaphragm capsule of profile.Because the species of automatic packaging system equipment is more, and
Each manufactured encapsulation diaphragm capsule out of manufacturer differs in structure, profile and design concept, does not have each other
One unified standard, therefore, the automatic packaging system equipment and encapsulating mould that each producer is produced be not general, in other words,
Semiconductor packages producer is difficult that other types of product is encapsulated in same automatic packaging system equipment, or uses other factories
The encapsulating mould of business.During packaged semiconductor product, if to change the product type of encapsulation, mostly using entirety more
Change package system or change the mode of a whole set of encapsulating mould to solve the above problems, but as leadframe is to ultra-wide, overlength
Trend development, the profile of encapsulating mould and equipment is increasing, overall very heavy, and dismounting is got up extremely inconvenient.
Utility model content
The technical problems to be solved in the utility model be to provide it is a kind of easy to use, it is versatile, can improve well
Encapsulate the semiconductor packaging mold of plant equipment utilization rate.
Technical solution of the present utility model is to provide a kind of semiconductor packaging mold with following structure, including
For the top base component being connected with press upper platen and the bottom base component for being connected with press lower platen；
The top base component include upper padding plate, cope plate, upper left slideway, upper right baffle-plate, upper left cover, upper right cover plate,
Upper right shell body, upper right slideway, inner side baffle of going forward, outer side shield of going forward, upper rear inner side baffle and upper rear outer side shield, upper mould
Plate is mounted in upper padding plate bottom, upper left slideway, upper right baffle-plate, upper right slideway, upper right shell body, inner side baffle of going forward, outer side block of going forward
Plate, upper rear inner side baffle and upper rear outer side shield are mounted in cope plate bottom, inner side baffle of going forward and upper rear inner side baffle point
The inner side of go forward outer side shield and upper rear outer side shield is not abutted in, and upper left slideway and upper right slideway abut in right baffle-plate respectively
With the inner side of upper right shell body, cope plate bottom surface, which is provided with, some to be used to install left slideway, upper right baffle-plate, upper right slideway and upper right
The upper installing hole of baffle plate, upper left cover and upper right cover plate are attached separately to the bottom of right baffle-plate and upper right shell body, upper left slideway, on
Preceding inner side baffle, upper right slideway, it is upper after surrounded jointly between inner side baffle and cope plate one be used for install encapsulation diaphragm capsule upper half
The upper installation cavity of component；
The bottom base component include lower left cover, bottom left slideway, lower right baffle-plate, lower template, lower bolster, bottom right slideway,
Lower right shell body, bottom right cover plate, lower preceding inner side baffle, lower preceding outer side shield, lower rear inner side baffle and lower rear outer side shield, lower mould
Plate is at the top of lower bolster, lower right baffle-plate, bottom left slideway, bottom right slideway, lower right shell body, lower preceding inner side baffle, lower preceding outer side block
At the top of lower template, lower preceding inner side baffle and lower rear inner side baffle are distinguished for plate, lower rear inner side baffle and lower rear outer side shield
Abut in it is lower before outer side shield and it is lower after outer side shield inner side, bottom left slideway and bottom right slideway abut in respectively lower right baffle-plate with
The inner side of lower right shell body, lower template top surface are provided with some for installing bottom left slideway, lower right baffle-plate, bottom right slideway and bottom right gear
The lower mounting hole of plate, bottom left slideway, lower preceding inner side baffle, bottom right slideway, it is lower after surrounded jointly between inner side baffle and lower template
One is used to install the lower installation cavity for encapsulating diaphragm capsule lower half component, and running gate system and liftout system are housed in lower template and lower bolster
System.
Semiconductor packaging mold described in the utility model, wherein, it is provided with upper diaphragm capsule backing plate, lower installation at the top of upper installation cavity
Bottom of chamber portion is provided with lower diaphragm capsule backing plate.
Semiconductor packaging mold described in the utility model, wherein, heating dress is respectively provided with cope plate and lower template
Put and lower heater, upper thermal insulation board is provided between upper padding plate and cope plate, lower thermal insulation board is provided between lower bolster and lower template.
After above structure, compared with prior art, the utility model semiconductor packaging mold has advantages below：When
Encapsulate producer when encapsulating other types of product in same automatic packaging system equipment, without again as prior art it is whole
Body changes package system or changes a whole set of encapsulating mould, only need to be by around upper installation cavity in the utility model and lower installation cavity
Slideway, baffle plate and cover plate are removed and changed, then by the encapsulation diaphragm capsule upper half component and lower half group of different manufacturers production
Part is respectively charged into installation cavity and lower installation cavity, is finally again reinstalled the slideway after replacing, baffle plate and cover plate, in other words,
The utility model, which has only been changed part and just reached, is applicable production different type product and applicable different size encapsulation diaphragm capsule
Purpose；The setting of upper padding plate and lower bolster causes the utility model to be arranged on different semiconductor automatic packagings by screw
On system equipment.In summary, the utility model uses very simple and convenient, and versatility is stronger, can be good at improving
The utilization rate of plant equipment is encapsulated, while also greatlys save production cost.
The setting of upper diaphragm capsule backing plate and lower diaphragm capsule backing plate can facilitate installer to encapsulation diaphragm capsule upper half component and lower half
The setting height(from bottom) of component is adjusted.
Upper heater and lower heater are easy to carry out the encapsulating compound in encapsulation diaphragm capsule upper half component and lower half component
Heating, and upper thermal insulation board and lower thermal insulation board can effectively prevent heat caused by heater and lower heater from being appeared on the stage to press
Plate and press lower platen transmission.
Brief description of the drawings
Fig. 1 is that the vertical of the utility model semiconductor packaging mold regards cross section structure diagram；
Fig. 2 is that the vertical of the embodiment of the utility model semiconductor packaging mold one regards cross section structure diagram.
Embodiment
The utility model semiconductor packaging mold is described in further detail with reference to the accompanying drawings and detailed description：
As shown in figure 1, in this embodiment, the utility model semiconductor packaging mold includes being used for and press
The top base component and the bottom base component for being connected with press lower platen of platen connection.
The top base component include upper padding plate 10, cope plate 12, upper left slideway 14, upper right baffle-plate 13, upper left cover 15,
Upper right cover plate 16, upper right shell body 18, upper right slideway 19, inner side baffle of going forward, outer side shield of going forward, it is upper after inner side baffle and on
Outer side shield afterwards, cope plate 12 are mounted in the bottom of upper padding plate 10, upper left slideway 14, upper right baffle-plate 13, upper right slideway 19, upper right shell body
18th, go forward inner side baffle, outer side shield of going forward, it is upper after inner side baffle and it is upper after outer side shield be mounted in the bottom of cope plate 12,
Inner side baffle of going forward and upper rear inner side baffle abut in the inner side of go forward outer side shield and upper rear outer side shield, upper left slideway respectively
14 and upper right slideway 19 abut in the inner side of right baffle-plate 13 and upper right shell body 18 respectively, the bottom surface of cope plate 12 is provided with some use
In the upper installing hole for installing left slideway 14, upper right baffle-plate 13, upper right slideway 19 and upper right shell body 18, upper left cover 15 and upper right
Cover plate 16 is attached separately to the bottom of right baffle-plate 13 and upper right shell body 18, upper left slideway 14, inner side baffle of going forward, upper right slideway
19th, surrounded jointly between inner side baffle and cope plate 12 after upper one be used for install encapsulate the upper installation cavity of diaphragm capsule upper half component
17；
The bottom base component include lower left cover 30, bottom left slideway 32, lower right baffle-plate 31, lower template 33, lower bolster 35,
Bottom right slideway 39, lower right shell body 40, bottom right cover plate 41, lower preceding inner side baffle, it is lower before outer side shield, it is lower afterwards inner side baffle and under
Outer side shield afterwards, lower template 33 is mounted in the top of lower bolster 35, lower right baffle-plate 31, bottom left slideway 32, bottom right slideway 39, lower right shell body
40th, lower preceding inner side baffle, lower preceding outer side shield, lower rear inner side baffle and lower rear outer side shield are mounted in the top of lower template 33, under
Preceding inner side baffle and lower rear inner side baffle abut in the inner side of lower preceding outer side shield and lower rear outer side shield, bottom left slideway 32 respectively
Abut in the inner side of lower right baffle-plate 31 and lower right shell body 40 respectively with bottom right slideway 39, the top surface of lower template 33 is provided with some be used for
The lower mounting hole 330 of bottom left slideway 32, lower right baffle-plate 31, bottom right slideway 39 and lower right shell body 40 is installed, bottom left slideway 32, it is lower before
Inner side baffle, bottom right slideway 39, it is lower after surrounded jointly between inner side baffle and lower template 33 one be used for install encapsulation diaphragm capsule under
Running gate system and liftout system are housed on the lower installation cavity 37 of half component, lower template 33 and lower bolster 35.Running gate system and liftout
System is routine techniques, therefore its concrete structure does not repeat herein.
With reference to Fig. 2, when encapsulating producer and encapsulating other types of product in same automatic packaging system equipment, without
Integral replacing package system or a whole set of encapsulating mould of replacing as prior art again, upper in the utility model it will need to only install
Upper left slideway 14, upper right baffle-plate 13, upper left cover 15, upper right cover plate 16, upper right shell body 18, upper right slideway 19 around chamber 17,
Go forward inner side baffle, outer side shield of going forward, it is upper after inner side baffle and it is upper after outer side shield, and the bottom left around lower installation cavity 37
Cover plate 30, bottom left slideway 32, lower right baffle-plate 31, bottom right slideway 39, lower right shell body 40, bottom right cover plate 41, lower preceding inner side baffle, under
Preceding outer side shield, lower rear inner side baffle and lower rear outer side shield are removed and changed, the encapsulation for then producing different manufacturers
Diaphragm capsule upper half component 50 and lower half component 51 are respectively charged into installation cavity 17 and lower installation cavity 37, finally again by the cunning after replacing
Road, baffle plate and cover plate reinstall, and in other words, the utility model has only changed part and just reached applicable production different type production
Product and the purpose for being applicable different size encapsulation diaphragm capsule；The setting of upper padding plate 10 and lower bolster 35 causes the utility model to pass through screw
It can be arranged in different semiconductor automatic packaging system equipment.In summary, the utility model uses very simple
Convenient, versatility is stronger, can be good at improving the utilization rate of encapsulation plant equipment, while also greatlys save production cost.
When the utility model semiconductor packaging mold produces, the slideway, baffle plate and cover plate of plurality of specifications can be produced simultaneously, for envelope
Producer is filled in actual production process, the specification of the product encapsulated according to itself and the encapsulation diaphragm capsule used, it is changed,
And then the utility model is set to reach general purpose.The setting of some upper installing holes and lower mounting hole 330 cause right baffle-plate 13,
Upper right shell body 18, lower right baffle-plate 31 and lower right shell body 40 have multiple gears to install, and improve versatility.
The upper top of installation cavity 17 is provided with upper diaphragm capsule backing plate 20, and the lower bottom of installation cavity 37 is provided with lower diaphragm capsule backing plate 36, upper diaphragm capsule
The setting of backing plate 20 and lower diaphragm capsule backing plate 36 can facilitate installer to encapsulation diaphragm capsule upper half component 50 and lower half component 51
Setting height(from bottom) is adjusted, and can also be removed as needed, or changes the upper diaphragm capsule backing plate 20 of other thickness and lower diaphragm capsule
Backing plate 36.
Upper heater 21 is housed on cope plate 12, lower heater 38, the upper He of heater 21 are housed in lower template 33
Lower heater 38 is easy to heat the encapsulating compound in encapsulation diaphragm capsule upper half component 50 and lower half component 51, the two heating
Device is commercially available prod, therefore its concrete structure does not repeat herein.Upper thermal insulation board 11 is provided between upper padding plate 10 and cope plate 12,
Lower thermal insulation board 34 is provided between lower bolster 35 and lower template 33, upper thermal insulation board 11 and lower thermal insulation board 34 can effectively prevent heating from filling
Heat caused by 21 and lower heater 38 is put to press upper platen and press lower platen transmission.
Embodiment described above is only that preferred embodiment of the present utility model is described, not to this practicality
New scope is defined, and on the premise of the utility model design spirit is not departed from, those of ordinary skill in the art are to this
The various modifications and improvement that the technical scheme of utility model is made, all should fall into the scope of protection of the utility model.
Claims (3)
- A kind of 1. semiconductor packaging mold, it is characterised in that：Including the top base component for being connected with press upper platen and For the bottom base component being connected with press lower platen；The top base component includes upper padding plate (10), cope plate (12), upper left slideway (14), upper right baffle-plate (13), upper left cover Plate (15), upper right cover plate (16), upper right shell body (18), upper right slideway (19), inner side baffle of going forward, outer side shield of going forward, it is upper after Inner side baffle and it is upper after outer side shield, the cope plate (12) is mounted in upper padding plate (10) bottom, the upper left slideway (14), on Right baffle-plate (13), upper right slideway (19), upper right shell body (18), inner side baffle of going forward, outer side shield of going forward, it is upper after inner side baffle with And it is upper after outer side shield be mounted in cope plate (12) bottom, it is described to go forward inner side baffle and upper inner side baffle afterwards abuts in respectively The inner side of preceding outer side shield and upper rear outer side shield, the upper left slideway (14) and upper right slideway (19) abut in left gear respectively The inner side of plate (13) and upper right shell body (18), cope plate (12) bottom surface be provided with it is some be used for install left slideway (14), The upper installing hole of upper right baffle-plate (13), upper right slideway (19) and upper right shell body (18), the upper left cover (15) and upper right cover plate (16) be attached separately to the bottom of right baffle-plate (13) and upper right shell body (18), the upper left slideway (14), inner side baffle of going forward, on Right slideway (19), it is upper after surrounded jointly between inner side baffle and cope plate (12) one be used for install encapsulate diaphragm capsule upper half component Upper installation cavity (17)；The bottom base component includes lower left cover (30), bottom left slideway (32), lower right baffle-plate (31), lower template (33), underlay Plate (35), bottom right slideway (39), lower right shell body (40), bottom right cover plate (41), lower preceding inner side baffle, it is lower before outer side shield, it is lower after Inner side baffle and it is lower after outer side shield, the lower template (33) mounted in lower bolster (35) top, the lower right baffle-plate (31), under Left slideway (32), bottom right slideway (39), lower right shell body (40), lower preceding inner side baffle, it is lower before outer side shield, it is lower afterwards inner side baffle and Outer side shield is at the top of lower template (33) after lower, the lower preceding inner side baffle and lower rear inner side baffle abut in respectively it is lower before The inner side of outer side shield and lower rear outer side shield, the bottom left slideway (32) and bottom right slideway (39) abut in lower right baffle-plate respectively (31) and lower right shell body (40) inner side, lower template (33) top surface be provided with it is some be used for install bottom left slideway (32), under The lower mounting hole (330) of right baffle-plate (31), bottom right slideway (39) and lower right shell body (40), the bottom left slideway (32), it is lower before in Side shield, bottom right slideway (39), it is lower after surrounded jointly between inner side baffle and lower template (33) one be used for install encapsulation diaphragm capsule The lower installation cavity (37) of lower half component, running gate system and liftout system are housed on the lower template (33) and lower bolster (35).
- 2. semiconductor packaging mold according to claim 1, it is characterised in that：It is provided with the top of the upper installation cavity (17) upper Diaphragm capsule backing plate (20), lower installation cavity (37) bottom are provided with lower diaphragm capsule backing plate (36).
- 3. semiconductor packaging mold according to claim 2, it is characterised in that：The cope plate (12) and lower template (33) On be respectively provided with heater (21) and lower heater (38), between the upper padding plate (10) and cope plate (12) be provided with it is upper Thermal insulation board (11), lower thermal insulation board (34) is provided between the lower bolster (35) and lower template (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720622785.5U CN206742195U (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720622785.5U CN206742195U (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206742195U true CN206742195U (en) | 2017-12-12 |
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ID=60568274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720622785.5U Active CN206742195U (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206742195U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039293A (en) * | 2017-05-31 | 2017-08-11 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
| CN115332095A (en) * | 2022-10-12 | 2022-11-11 | 安徽大华半导体科技有限公司 | QFN large substrate packaging mold and method |
-
2017
- 2017-05-31 CN CN201720622785.5U patent/CN206742195U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039293A (en) * | 2017-05-31 | 2017-08-11 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
| CN107039293B (en) * | 2017-05-31 | 2023-03-14 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
| CN115332095A (en) * | 2022-10-12 | 2022-11-11 | 安徽大华半导体科技有限公司 | QFN large substrate packaging mold and method |
| CN115332095B (en) * | 2022-10-12 | 2022-12-27 | 安徽大华半导体科技有限公司 | QFN large substrate packaging mold and method |
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