CN107039293B - Semiconductor packaging mold - Google Patents
Semiconductor packaging mold Download PDFInfo
- Publication number
- CN107039293B CN107039293B CN201710397516.8A CN201710397516A CN107039293B CN 107039293 B CN107039293 B CN 107039293B CN 201710397516 A CN201710397516 A CN 201710397516A CN 107039293 B CN107039293 B CN 107039293B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 10
- 238000009434 installation Methods 0.000 abstract description 3
- 239000002775 capsule Substances 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a semiconductor packaging mold, including upper base subassembly and lower base subassembly, the upper base subassembly includes the upper padding plate, the cope match-plate pattern, go up left slide, go up left apron, go up right baffle, go up right slide, go up preceding inside baffle, go up preceding outside baffle, go up back inside baffle and last back outside baffle, go up left slide, go up preceding inside baffle, go up right slide, go up back inside baffle and cope match-plate pattern and enclose the last installation cavity that is used for installing the first half subassembly of encapsulation diaphragm capsule, the lower base subassembly includes lower left apron, lower left slide, lower left baffle, lower bolster, lower right slide, lower right baffle, lower right apron, preceding inside baffle, lower preceding outside baffle, lower back inside baffle and lower back outside baffle, lower left slide, lower preceding inside baffle, lower right slide, lower back inside baffle and lower bolster enclose there is the lower installation cavity that is used for installing the second half subassembly of encapsulation diaphragm capsule. The invention has convenient use and strong universality and can well improve the utilization rate of equipment of packaging manufacturers.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a semiconductor packaging mold.
Background
At present, a lot of manufacturers produce automatic semiconductor packaging system equipment, and correspondingly, a lot of types of equipment are produced, common packaging systems are divided into 120T, 170T and 180T, packaging mold boxes equipped for each tonnage are different in appearance, and equipment with larger tonnage is generally equipped with packaging mold boxes with larger appearance. Because the types of the automatic packaging system equipment are more, the packaging mold boxes manufactured by each manufacturer are different in structure, appearance and design concept, and do not have a uniform standard, the automatic packaging system equipment and the packaging molds manufactured by each manufacturer are not universal, in other words, it is difficult for the semiconductor packaging manufacturer to package other types of products on the same automatic packaging system equipment or use the packaging molds of other manufacturers. In the process of packaging semiconductor products, if the type of packaged products is to be replaced, the problem is solved by mostly adopting a mode of integrally replacing a packaging system or replacing a whole set of packaging molds, however, along with the trend development of lead frames towards ultra-width and ultra-length, the packaging molds and equipment are increasingly large in appearance, and are very heavy integrally, and the assembly and disassembly are very inconvenient.
Disclosure of Invention
The invention aims to solve the technical problem of providing a semiconductor packaging mold which is convenient to use, has strong universality and can well improve the equipment utilization rate of packaging manufacturers.
The technical solution of the invention is to provide a semiconductor packaging mold with the following structure, which comprises an upper base component connected with an upper platen of a press and a lower base component connected with a lower platen of the press;
the upper base assembly comprises an upper base plate, an upper template, an upper left slide way, an upper left baffle plate, an upper left cover plate, an upper right baffle plate, an upper right slide way, an upper front inner side baffle plate, an upper front outer side baffle plate, an upper rear inner side baffle plate and an upper rear outer side baffle plate, wherein the upper template is arranged at the bottom of the upper base plate;
the lower base component comprises a lower left cover plate, a lower left slide way, a lower left baffle, a lower template, a lower backing plate, a lower right slide way, a lower right baffle, a lower right cover plate, a lower front inner side baffle, a lower front outer side baffle, a lower rear inner side baffle and a lower rear outer side baffle, the lower template is arranged at the top of the lower backing plate, the lower left baffle, the lower left slide way, the lower right baffle, the lower front inner side baffle, the lower front outer side baffle, the lower rear inner side baffle and the lower rear outer side baffle are all arranged at the top of the lower template, the lower front inner side baffle and the lower rear inner side baffle are respectively attached to the inner sides of the lower front outer side baffle and the lower rear outer side baffle, the lower left slide way and the lower right slide way are respectively attached to the inner sides of the lower left baffle and the lower right baffle, a plurality of lower mounting holes for mounting the lower left slide way, the lower left baffle, the lower right slide way and the lower right baffle are arranged on the top of the lower left slide way, a lower backing plate is jointly enclosed into a lower mounting cavity for mounting a lower half module, and a pouring system is arranged on the lower backing plate.
The semiconductor packaging die is characterized in that an upper die box base plate is arranged at the top of an upper mounting cavity, and a lower die box base plate is arranged at the bottom of a lower mounting cavity.
The semiconductor packaging die is characterized in that an upper heating device and a lower heating device are respectively arranged on an upper die plate and a lower die plate, an upper heat insulation plate is arranged between an upper backing plate and the upper die plate, and a lower heat insulation plate is arranged between the lower backing plate and the lower die plate.
After adopting the structure, compared with the prior art, the semiconductor packaging mold has the following advantages: when a packaging manufacturer packages other types of products on the same automatic packaging system device, the packaging system does not need to be integrally replaced or a whole set of packaging mold does not need to be replaced like the prior art, only the slide way, the baffle and the cover plate around the upper mounting cavity and the lower mounting cavity are removed and replaced, then the upper half assembly and the lower half assembly of the packaging mold box produced by different manufacturers are respectively installed in the upper mounting cavity and the lower mounting cavity, and finally the slide way, the baffle and the cover plate after replacement are installed back, in other words, only part of parts are replaced, so that the purposes of being suitable for producing different types of products and being suitable for packaging mold boxes with different specifications are achieved; the arrangement of the upper backing plate and the lower backing plate enables the automatic packaging system to be installed on different automatic semiconductor packaging system equipment through screws. In conclusion, the invention has the advantages of simple and convenient use, strong universality, capability of well improving the utilization rate of equipment of packaging manufacturers and great saving of production cost.
The arrangement of the upper die box base plate and the lower die box base plate can facilitate the installation of the upper half assembly and the lower half assembly of the packaging die box to be adjusted by an installer.
The upper heating device and the lower heating device are convenient for heating the packaging materials in the upper half assembly and the lower half assembly of the packaging mold box, and the upper heat insulation plate and the lower heat insulation plate can effectively prevent the heat generated by the upper heating device and the lower heating device from being transferred to the upper platen of the press and the lower platen of the press.
Drawings
FIG. 1 is a schematic cross-sectional structure view of a semiconductor package mold according to the present invention;
fig. 2 is a schematic longitudinal sectional view of a semiconductor package mold according to an embodiment of the invention.
Detailed Description
The semiconductor package mold of the present invention will be described in further detail with reference to the accompanying drawings and the following detailed description:
in this embodiment, as shown in fig. 1, the semiconductor package mold of the present invention includes an upper base assembly for connecting with the upper platen of the press and a lower base assembly for connecting with the lower platen of the press.
The upper base component comprises an upper base plate 10, an upper die plate 12, an upper left slideway 14, an upper left baffle 13, an upper left cover plate 15, an upper right cover plate 16, an upper right baffle 18, an upper right slideway 19, an upper front inner side baffle, an upper front outer side baffle, an upper rear inner side baffle and an upper rear outer side baffle, wherein the upper die plate 12 is arranged at the bottom of the upper base plate 10, the upper left slideway 14, the upper left baffle 13, the upper right slideway 19, the upper right baffle 18, the upper front inner side baffle, the upper front outer side baffle, the upper rear inner side baffle and the upper rear outer side baffle are arranged at the bottom of the upper die plate 12, the upper front inner side baffle and the upper rear inner side baffle are respectively attached to the inner sides of the upper front outer side baffle and the upper rear outer side baffle, the upper left slideway 14 and the upper right slideway 19 are respectively attached to the inner sides of the upper left baffle 13 and the upper right baffle 18, a plurality of upper mounting holes for mounting the upper left baffle 14, the upper left baffle 13, the upper right slideway 19 and the upper right baffle 18 are arranged on the bottom of the upper left side baffle 13 and the upper left baffle 16, and the upper baffle 14 and an upper right baffle box are arranged between the upper left slideway 14 and the upper baffle 14, and the upper right baffle 16 are jointly used for forming an upper inner side baffle box for mounting hole for mounting a half upper side baffle 14 and an upper side baffle box for mounting a front inner side baffle 14 and an upper baffle box for mounting a half upper side baffle 14 and an upper side baffle 17;
the lower base component comprises a lower left cover plate 30, a lower left slide way 32, a lower left baffle 31, a lower template 33, a lower cushion plate 35, a lower right slide way 39, a lower right baffle 40, a lower right cover plate 41, a lower front inner baffle, a lower front outer baffle, a lower rear inner baffle and a lower rear outer baffle, wherein the lower template 33 is arranged at the top of the lower template 35, the lower left baffle 31, the lower left slide way 32, the lower right slide way 39, the lower right baffle 40, the lower front inner baffle, the lower front outer baffle, the lower rear inner baffle and the lower rear outer baffle are all arranged at the top of the lower template 33, the lower front inner baffle and the lower rear inner baffle are respectively attached to the inner sides of the lower front outer baffle and the lower rear outer baffle, the lower left slide way 32 and the lower right slide way 39 are respectively attached to the inner sides of the lower left baffle 31 and the lower right baffle 40, a plurality of lower mounting holes 330 for mounting the lower left baffle 32, the lower left baffle 31, the lower right slide way 39 and the lower right baffle 40 are arranged on the top surface of the lower template 33, a lower template 33 and a lower template assembly is enclosed into a semi-pouring system, and a lower template assembly is enclosed by a lower template assembly 37 and a lower template assembly. The gating system and the ejector system are conventional technologies, and therefore, the detailed structure thereof is not described herein.
With reference to fig. 2, when a packaging manufacturer packages other types of products on the same automatic packaging system device, it is not necessary to replace the packaging system as a whole or replace the whole set of packaging mold as in the prior art, but only the upper left slide way 14, the upper left baffle 13, the upper left cover plate 15, the upper right cover plate 16, the upper right baffle 18, the upper right slide way 19, the upper front inner baffle, the upper front outer baffle, the upper rear inner baffle and the upper rear outer baffle around the upper mounting cavity 17, and the lower left cover plate 30, the lower left slide way 32, the lower left baffle 31, the lower right slide way 39, the lower right baffle 40, the lower right cover plate 41, the lower front inner baffle, the lower front outer baffle, the lower rear inner baffle and the lower rear outer baffle around the lower mounting cavity 37 are removed and replaced, and then the upper half assembly 50 and the lower half assembly 51 of the packaging mold box produced by different manufacturers are respectively installed into the upper mounting cavity 17 and the lower mounting cavity 37, and finally the slide way, the baffles and the cover plate are replaced, in other words, the invention only achieves the purpose of replacing parts of different types and being suitable for different packaging mold boxes; the arrangement of the upper and lower pads 10 and 35 allows the present invention to be mounted on different semiconductor automatic packaging system apparatuses by means of screws. In conclusion, the invention has the advantages of simple and convenient use, strong universality, capability of well improving the utilization rate of equipment of packaging manufacturers and great saving of production cost. When the semiconductor packaging mold is produced, the slide way, the baffle plate and the cover plate with various specifications can be simultaneously manufactured, so that a packaging manufacturer can replace the semiconductor packaging mold according to the specification of a self-packaged product and a used packaging mold box in the actual production process, and the universal purpose of the semiconductor packaging mold is further achieved. The arrangement of the plurality of upper mounting holes and the plurality of lower mounting holes 330 enables the upper left baffle 13, the upper right baffle 18, the lower left baffle 31 and the lower right baffle 40 to have a plurality of gears to be mounted, and therefore universality is improved.
The top of the upper mounting cavity 17 is provided with an upper die box backing plate 20, the bottom of the lower mounting cavity 37 is provided with a lower die box backing plate 36, the upper die box backing plate 20 and the lower die box backing plate 36 are arranged, so that an installer can conveniently adjust the mounting heights of the upper half assembly 50 and the lower half assembly 51 of the packaging die box, and the upper die box backing plate 20 and the lower die box backing plate 36 with other thicknesses can be detached as required or replaced.
The upper heating device 21 is installed on the upper mold plate 12, the lower heating device 38 is installed on the lower mold plate 33, the upper heating device 21 and the lower heating device 38 are convenient for heating the encapsulating material in the upper half component 50 and the lower half component 51 of the encapsulating mold box, and the two heating devices are commercially available products, so the specific structure thereof is not described herein. An upper heat insulation plate 11 is arranged between the upper backing plate 10 and the upper template 12, a lower heat insulation plate 34 is arranged between the lower backing plate 35 and the lower template 33, and the upper heat insulation plate 11 and the lower heat insulation plate 34 can effectively prevent heat generated by the upper heating device 21 and the lower heating device 38 from being transferred to the upper platen and the lower platen of the press.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention by those skilled in the art should fall within the protection scope of the present invention without departing from the design spirit of the present invention.
Claims (3)
1. A semiconductor packaging mold is characterized in that: comprises an upper base component connected with an upper platen of the press and a lower base component connected with a lower platen of the press;
the upper base component comprises an upper backing plate (10), an upper template (12), an upper left slideway (14), an upper left baffle (13), an upper left cover plate (15), an upper right cover plate (16), an upper right baffle (18), an upper right slideway (19), an upper front inner baffle, an upper front outer baffle, an upper rear inner baffle and an upper rear outer baffle, wherein the upper template (12) is arranged at the bottom of the upper backing plate (10), the upper left slideway (14), the upper left baffle (13), the upper right slideway (19), the upper right baffle (18), the upper front inner baffle, the upper front outer baffle, the upper rear inner baffle and the upper rear outer baffle are all arranged at the bottom of the upper template (12), go up preceding interior side shield and last back interior side shield and paste respectively and lean on the inboard of outer side shield and last back exterior side shield before last, go up left side slide (14) and last right slide (19) and paste respectively and lean on the inboard of last left side shield (13) and last right side shield (18), be equipped with a plurality of last mounting holes that are used for installing left side slide (14), last left side shield (13), last right slide (19) and last right side shield (18) on cope match-plate pattern (12) bottom surface, go up left side apron (15) and last right side apron (16) and adorn the bottom of last left side shield (13) and last right side shield (18) respectively, enclose into one jointly between last left side slide (14), last preceding interior side shield, last right slide (19), last back interior side shield and cope match-plate pattern (12) and be used for installing and encapsulating die box An upper mounting cavity (17) of the upper half-assembly;
the lower base component comprises a lower left cover plate (30), a lower left slide way (32), a lower left baffle plate (31), a lower template (33), a lower backing plate (35), a lower right slide way (39), a lower right baffle plate (40), a lower right cover plate (41), a lower front inner baffle plate, a lower front outer baffle plate, a lower rear inner baffle plate and a lower rear outer baffle plate, wherein the lower template (33) is arranged at the top of the lower backing plate (35), the lower left baffle plate (31), the lower left slide way (32), the lower right slide way (39), the lower right baffle plate (40), the lower front inner baffle plate, the lower front outer baffle plate, the lower rear inner baffle plate and the lower rear outer baffle plate are all arranged at the top of the lower template (33), the lower front inner side baffle and the lower rear inner side baffle are respectively attached to the inner sides of the lower front outer side baffle and the lower rear outer side baffle, the lower left slide (32) and the lower right slide (39) are respectively attached to the inner sides of the lower left baffle (31) and the lower right baffle (40), a plurality of lower mounting holes (330) used for mounting the lower left slide (32), the lower left baffle (31), the lower right slide (39) and the lower right baffle (40) are formed in the top surface of the lower template (33), a lower mounting cavity (37) used for mounting the lower half assembly of the packaging mold box is formed by the lower left slide (32), the lower front inner side baffle, the lower right slide (39), the lower rear inner side baffle and the lower template (33) in a surrounding mode, and a pouring system and a jacking are mounted on the lower template (33) and the lower template (35) A system;
the upper left slideway (14), the upper left baffle (13), the upper left cover plate (15), the upper right cover plate (16), the upper right baffle (18), the upper right slideway (19), the upper front inner baffle, the upper front outer baffle, the upper rear inner baffle and the upper rear outer baffle can be disassembled and replaced;
the lower left cover plate (30), the lower left slide way (32), the lower left baffle (31), the lower right slide way (39), the lower right baffle (40), the lower right cover plate (41), the lower front inner baffle, the lower front outer baffle, the lower rear inner baffle and the lower rear outer baffle can be disassembled and replaced.
2. The semiconductor package mold of claim 1, wherein: an upper die box base plate (20) is arranged at the top of the upper mounting cavity (17), and a lower die box base plate (36) is arranged at the bottom of the lower mounting cavity (37).
3. The semiconductor package mold of claim 2, wherein: an upper heating device (21) and a lower heating device (38) are respectively arranged on the upper template (12) and the lower template (33), an upper heat insulation plate (11) is arranged between the upper backing plate (10) and the upper template (12), and a lower heat insulation plate (34) is arranged between the lower backing plate (35) and the lower template (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710397516.8A CN107039293B (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710397516.8A CN107039293B (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107039293A CN107039293A (en) | 2017-08-11 |
| CN107039293B true CN107039293B (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710397516.8A Active CN107039293B (en) | 2017-05-31 | 2017-05-31 | Semiconductor packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107039293B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786294A (en) * | 2018-12-29 | 2019-05-21 | 铜陵三佳山田科技股份有限公司 | The mould bases of the multiple rows of automatic diaphragm capsule of ultra-wide suitable for automatic packaging system |
| CN110265528B (en) * | 2019-06-26 | 2020-08-18 | 台州保镖电子有限公司 | Full-automatic LED packaging machine and packaging method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4723899A (en) * | 1984-11-12 | 1988-02-09 | Michio Osada | Molding apparatus for enclosing semiconductor chips with resin |
| JP2004042407A (en) * | 2002-07-11 | 2004-02-12 | Fuji Electric Holdings Co Ltd | Molding mold for resin-sealing semiconductor device |
| CN105666745A (en) * | 2016-03-08 | 2016-06-15 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA (Ball Grid Array) molding die |
| CN206742195U (en) * | 2017-05-31 | 2017-12-12 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105719975B (en) * | 2014-08-15 | 2019-01-08 | 恩智浦美国有限公司 | The floating mould of semiconductor packages |
-
2017
- 2017-05-31 CN CN201710397516.8A patent/CN107039293B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4723899A (en) * | 1984-11-12 | 1988-02-09 | Michio Osada | Molding apparatus for enclosing semiconductor chips with resin |
| JP2004042407A (en) * | 2002-07-11 | 2004-02-12 | Fuji Electric Holdings Co Ltd | Molding mold for resin-sealing semiconductor device |
| CN105666745A (en) * | 2016-03-08 | 2016-06-15 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA (Ball Grid Array) molding die |
| CN206742195U (en) * | 2017-05-31 | 2017-12-12 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107039293A (en) | 2017-08-11 |
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Effective date of registration: 20230822 Address after: 230601, 2nd Floor, Building A, Intelligent Science and Technology Park (South District), No. 3435 Qinglongtan Road, Economic and Technological Development Zone, Hefei City, Anhui Province Patentee after: Anhui Zhonghe Semiconductor Technology Co.,Ltd. Address before: No. 919, Wenqu Road, high tech Zone, Hefei City, Anhui Province, 230088 Patentee before: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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