CN105666745A - BGA (Ball Grid Array) molding die - Google Patents
BGA (Ball Grid Array) molding die Download PDFInfo
- Publication number
- CN105666745A CN105666745A CN201610129891.XA CN201610129891A CN105666745A CN 105666745 A CN105666745 A CN 105666745A CN 201610129891 A CN201610129891 A CN 201610129891A CN 105666745 A CN105666745 A CN 105666745A
- Authority
- CN
- China
- Prior art keywords
- bar
- gear
- moulding
- frame bar
- adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 74
- 238000007493 shaping process Methods 0.000 claims description 26
- 239000002775 capsule Substances 0.000 claims description 14
- 238000004804 winding Methods 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000001447 compensatory effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0022—Multi-cavity moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Abstract
The invention discloses a BGA (Ball Grid Array) molding die, which comprises a die holder; a plurality of charging barrels are evenly arranged at the middle part of the die holder longitudinally; each of the left side and the right side of the charging barrels is provided with a die box; each die box comprises a plurality of cavities; every two cavities are isolated through a cavity molding strip module; each cavity molding strip module consists of two adjacent molding strips; longitudinal position adjustment devices and transverse position adjustment devices are arranged in each cavity border strip; each longitudinal position adjustment device comprises a left adjustment unit and a right adjustment unit; each left adjustment unit and the corresponding right adjustment unit are symmetrically distributed; each of the left adjustment units and the right adjustment units comprises a moving piece and a fixed piece; and each moving piece is fixedly connected with end parts of the corresponding molding strips. According to the BGA molding die disclosed by the invention, each longitudinal position adjustment device comprises the left adjustment unit and the right adjustment unit, so that the corresponding two molding strips can be separately adjusted in position so as to meet a small change of dimensions of a substrate in each cavity of the corresponding die box.
Description
Technical field:
The present invention relates to technical field of semiconductor encapsulation, specifically, it relates to a kind of BGA molding die.
Background technology:
In the MOLDING technique of semiconductor packages, due to the singularity of baseplate material, the control accuracy of its portion size of substrate of the different model of different manufacturers cannot meet the requirement of encapsulation. Substrate is exactly pcb board in fact, and a lot of size is merely able to accomplish ± about 0.1mm. In MOLDING technique, owing to its minimum particle of rings of material epoxy resins is less than this size, there is the problem that plastic cement overflows, equipment cannot operation automatically.
The substrate that the measure taked at present is different batches carrys out its size of compensatory control by changing the pilot pin of bias, it is ensured that gap is less than the minimum particle of epoxy resin, and equipment can operation automatically. Prior art adopts the locator means (being the technical publications of a kind of BGA molding die of CN104552672A with specific reference to application publication number) of cam pin, although in the location of BGA molding die, the needle point width of existing eccentric pilot pin can according to the installation pin hole change processing of pilot pin, but Problems existing changes pilot pin all to need to be dismantled by mould again to assemble every time, also there is assembling while consuming time and wrong other problem etc. occurs, eccentric pilot pin processing request height in addition, cost height.
For solving the problems of the technologies described above, the application for a patent for invention that application publication number is CN104552672A discloses a kind of BGA molding die, comprise die holder, the middle part of die holder is linearly evenly placed with multiple barrel, the both sides of barrel are provided with diaphragm capsule, diaphragm capsule has the die cavity of multiple linearly evenly arrangement, the arragement direction of die cavity is identical with the arragement direction of barrel, it is formed with die cavity bar between every two adjacent die cavities, on diaphragm capsule removable be fixedly connected with towards barrel slide preset pieces, preset pieces is fitted with the first pilot pin, die cavity article is provided with the 2nd pilot pin. The BGA molding die provided in foregoing invention application, position is adjusted with auxiliary positioning block after common circular pilot pin design and installation, simple and fast, also there will not be and repeat to assemble the various problems that may cause due to mould, easily process, structure simply, the change of the certain limit substrate size that do not take up space, can adapt to, change simple, stable equipment operation, with low cost, reduce various unnecessary adjustment and installation risk simultaneously, substantially increase production efficiency and equipment efficiency of usage.
Prior art, die cavity bar is designed to regulate by trace, to meet the encapsulation of the multiple BGA of size trace change, but there is certain problem in above technical scheme: when die cavity bar regulates, adjacent two die cavity size certainly will be caused to become big, a size diminishes, certain so like this package dimension that cannot meet all BGA.
Summary of the invention:
It is an object of the invention to for prior art not enough, it is provided that a kind of shaping bar designs in a pair, and the BGA molding die that each shaping bar can carry out separately adjusting.
For achieving the above object, the present invention provides a kind of BGA molding die, comprise die holder, the middle part of die holder is longitudinally evenly placed with multiple barrel, the left and right sides of barrel is provided with diaphragm capsule, described diaphragm capsule comprises the interior frame bar of longitudinally setting, the outside moulding longitudinally arranged, the first frame bar of arranged transversely, the 2nd frame bar of arranged transversely, and described diaphragm capsule is isolated into multiple die cavity by mold cavity forming bar module; Described interior frame bar is positioned at the side of barrel, and described interior frame bar, outside moulding, the first frame bar, the 2nd frame bar form total die cavity of frame type; Moulding is evenly provided with outside die cavity some longitudinal apparatus for adjusting position; First frame bar and the 2nd frame bar are separately installed with horizontal position setting device;
Outside described die cavity, the device guide groove longitudinally run through is offered in moulding inside; Outside described die cavity moulding inner side-wall offered chute, outer side wall offered gear install groove; Described longitudinal apparatus for adjusting position comprises mobile body, regulates left unit and regulate right unit; Described mobile body is plugged in outside die cavity in moulding inner chamber; Regulate left unit and regulate right unit symmetry to be plugged in the square groove of the symmetrical distribution of mobile body; The left unit of described adjustment is identical with the right modular construction of adjustment; The left unit of described adjustment and the right unit of adjustment include square protuberance and connection section; Described square protuberance activity is plugged in square groove; Described square protuberance offers penetrating room, square chamber, left and right; The two lateral walls of room, square chamber is provided with the first tooth bar and the 2nd tooth bar, first tooth bar and the first gears meshing, 2nd tooth bar and the 2nd gears meshing, described first gear is fixed on the first gear shaft, the two ends of the first gear shaft are articulated on the sidewall of square groove, described 2nd gear is articulated on the 2nd gear shaft, and the two ends of the 2nd gear shaft are articulated on the sidewall of square groove; On the sidewall of described square groove, screw mandrel is revolved in pivot joint about, it is parallel with the 2nd gear shaft with the first gear shaft that screw mandrel is revolved in left and right, screw mandrel is revolved through room, square chamber in left and right, left and right is revolved screw mandrel and is comprised left-handed screw mandrel section and dextrorotation screw mandrel section, in left-handed screw mandrel section, spiral shell connects left-handed nut, in dextrorotation screw mandrel section, spiral shell meets right handed unt, left-handed nut is fixed with left frictionshoe, right handed unt is fixed with right frictionshoe, the end of left frictionshoe and the end of right frictionshoe are all movably set on the 2nd gear shaft, and described left frictionshoe and right frictionshoe are positioned at the both sides of the 2nd gear;
Described mold cavity forming bar module is made up of two adjacent shaping bars; Shaping bar one end and outside moulding are slidably matched, and the other end and the interior frame bar of shaping bar are slidably matched, and shaping bar can vertically move along outside moulding and interior frame bar; Regulate left unit and regulate the connection section of right unit to stretch out installation cavity and be connected with the end winding support of shaping bar;
Outside described die cavity, the gear of moulding outer side wall is installed and is articulated with the 3rd gear shaft on the upper and lower wall of groove; On described 3rd gear shaft, level is fixed with the 3rd gear; The external sidewall of described movement forms the 3rd tooth bar; 3rd gear engages with the 3rd tooth bar.
Preferred as technique scheme, one end and first frame bar of described outside moulding are slidably matched, and the other end and the 2nd frame bar of outside moulding are slidably matched;Described horizontal position setting device structure is identical with the right unit of adjustment with the left unit of adjustment, and the connection section of described horizontal position setting device is horizontally disposed with; Horizontal position setting device connection section in one end of described outside moulding and the first frame bar is connected; The outside the other end of moulding and the horizontal position setting device connection section of the 2nd frame bar are connected.
Preferred as technique scheme, described connection section comprises slide block, is located at the connection block of slide block side, and described square protuberance is connected with slide block, and block connects described shaping bar with being connected.
Preferred as technique scheme, the end winding support that screw mandrel is revolved in described left and right has the first adjustment block, and the end winding support of described first gear shaft has the 2nd adjustment block, and described first adjustment block and the 2nd adjustment block all offer " one " font groove; Described outside moulding offers the first adjusting hole being connected with device guide groove and the 2nd adjusting hole, and described first adjustment block is positioned at the bottom of the first adjusting hole, and described 2nd adjustment block is positioned at the bottom of the 2nd adjusting hole.
Preferred as technique scheme: the end winding support of described 3rd gear shaft has the 3rd adjustment block, and the 3rd adjustment block is all offered " one " font groove; Described outside moulding offers the 3rd adjusting hole installed groove and be connected with gear, and described 3rd adjustment block is positioned at the bottom of the 3rd adjusting hole.
The useful effect of the present invention is: longitudinal apparatus for adjusting position comprises and regulates left unit and regulate right unit, can be adjusted separately the position of two shaping bars, with the slight change of the size of substrate met in each diaphragm capsule die cavity.
Accompanying drawing illustrates:
Fig. 1 is the structural representation of a kind of BGA molding die of the present invention;
Fig. 2 be in Fig. 1 BGA molding die through local analyse and observe after structural representation;
Fig. 3 is C place enlarged view in Fig. 1;
Fig. 4 is B place enlarged view in Fig. 2;
Fig. 5 is the structural representation of the involved longitudinal apparatus for adjusting position 10 of the present invention;
Fig. 6 is the structural representation of longitudinal apparatus for adjusting position 10 after local is analysed and observe in Fig. 5;
Fig. 7 is the vertical view of Fig. 5;
Fig. 8 is the structural representation of longitudinal apparatus for adjusting position 10 after local is analysed and observe in Fig. 7;
Fig. 9 is A place enlarged view in Fig. 8;
In figure, 10, mobile body; 101, square groove; 102, screw mandrel is revolved in left and right; 1021, the first adjustment block; 103, left frictionshoe; 104, right frictionshoe; 11, left unit is regulated; 110, connection section; 1101, slide block; 1102, block is connected; 111, square protuberance; 112, room, square chamber; 113, the first tooth bar; 114, the 2nd tooth bar; 115, the first gear; 116, the 2nd gear; 117, the first gear shaft; 1171, the 2nd adjustment block; 118, the 2nd gear shaft; 12, right unit is regulated; 20, die holder; 30, barrel; 40, diaphragm capsule; 41, interior frame bar; 42, moulding outside die cavity; 4201, the first adjusting hole; 4202, the 2nd adjusting hole; 426, chute; 427, device guide groove; 4281, the 3rd tooth bar; 4282, the 3rd gear; 4283, the 3rd gear shaft; 4284, the 3rd adjusting hole; 4285, the 3rd adjustment block; 429, groove installed by gear; 43, the first frame bar; 44, the 2nd frame bar; 45, mold cavity forming bar module; 451, shaping bar; 51, horizontal position setting device.
Embodiment:
As shown in Figure 1 and Figure 2, a kind of BGA molding die, comprise die holder 20, the middle part of die holder is longitudinally evenly placed with multiple barrel 30, the left and right sides of barrel 30 is provided with diaphragm capsule 40, described diaphragm capsule 40 comprises the interior frame bar 41 of longitudinally setting, the outside moulding 42 longitudinally arranged, the first frame bar 43 of arranged transversely, the 2nd frame bar 44 of arranged transversely, and described diaphragm capsule 40 is isolated into multiple die cavity 401 by mold cavity forming bar module 45;Described interior frame bar 41 is positioned at the side of barrel 30, and described interior frame bar 41, outside moulding 42, first frame bar 43, the 2nd frame bar 44 form total die cavity of frame type; Moulding 42 is evenly provided with outside die cavity some longitudinal apparatus for adjusting position; It is symmetrically installed with horizontal position setting device 51 in first frame bar 43 and the 2nd frame bar 44;
As shown in Fig. 4, Fig. 6, outside described die cavity, the device guide groove 427 longitudinally run through is offered in moulding 42 inside, outside described die cavity moulding 42 inner side-wall offered chute 426, outer side wall offered gear install groove 429, described longitudinal apparatus for adjusting position comprises mobile body 10, regulates left unit 11 and regulate right unit 12, described mobile body 10 is plugged in outside die cavity in moulding 42 inner chamber, regulate left unit and regulate right unit symmetry to be plugged in the square groove 101 of the mobile symmetrical distribution of body 10, the left unit of described adjustment is identical with the right modular construction of adjustment, the left unit of described adjustment and the right unit of adjustment include square protuberance 111 and connection section 110, the activity of described square protuberance 111 is plugged in square groove 101, described square protuberance 111 offers penetrating room, square chamber 112, left and right, the two lateral walls of room, square chamber is provided with the first tooth bar 113 and the 2nd tooth bar 114, first tooth bar 113 engages with the first gear 115,2nd tooth bar 114 engages with the 2nd gear 116, described first gear is fixed on the first gear shaft 117, the two ends of the first gear shaft 117 are articulated on the sidewall of square groove, described 2nd gear 116 is articulated on the 2nd gear shaft 118, and the two ends of the 2nd gear shaft 118 are articulated on the sidewall of square groove 101, on the sidewall of described square groove 101, screw mandrel 102 is revolved in pivot joint about, it is parallel with the 2nd gear shaft 118 with the first gear shaft 117 that screw mandrel 102 is revolved in left and right, screw mandrel 102 is revolved through room, square chamber 112 in left and right, left and right is revolved screw mandrel 102 and is comprised left-handed screw mandrel section and dextrorotation screw mandrel section, in left-handed screw mandrel section, spiral shell connects left-handed nut, in dextrorotation screw mandrel section, spiral shell meets right handed unt, left-handed nut is fixed with left frictionshoe 103, right handed unt is fixed with right frictionshoe 104, the end of left frictionshoe 103 and the end of right frictionshoe 104 are all movably set on the 2nd gear shaft 118, described left frictionshoe 103 and right frictionshoe 104 are positioned at the both sides of the 2nd gear 116,
As shown in Figure 2, Figure 4 shows, described mold cavity forming bar module 45 is made up of two adjacent shaping bars 451; Shaping bar 451 one end and outside moulding 42 are slidably matched, and the other end and the interior frame bar 41 of shaping bar 451 are slidably matched, and shaping bar 451 can vertically move along outside moulding 42 and interior frame bar 41; Regulate left unit and regulate the connection section 110 of right unit to stretch out installation cavity and be connected with the end winding support of shaping bar 451;
As shown in Figure 2, Figure 4 shows, outside described die cavity, the gear of moulding 42 outer side wall is installed and is articulated with the 3rd gear shaft 4283 on groove about 429 wall; On described 3rd gear shaft 4283, level is fixed with the 3rd gear 4282; Described mobile body 10 outer side wall forms the 3rd tooth bar 4281; 3rd gear 4282 engages with the 3rd tooth bar 4281.
As shown in Fig. 2, Fig. 6; One end and first frame bar 43 of described outside moulding 42 are slidably matched, and the other end and the 2nd frame bar 44 of outside moulding 42 are slidably matched; Described horizontal position setting device structure is identical with the right unit of adjustment with the left unit of adjustment, and the connection section 110 of described horizontal position setting device is horizontally disposed with;Horizontal position setting device connection section 110 in one end of described outside moulding 42 and the first frame bar 43 is connected; The outside the other end of moulding 42 and the horizontal position setting device connection section 110 of the 2nd frame bar 44 are connected.
As shown in Figure 5, Figure 7, described connection section 110 comprises slide block 1101, is located at the connection block 1102 of slide block side, and described square protuberance 111 is connected with slide block, and block 1102 connects described shaping bar 451 with being connected.
As shown in Fig. 3, Fig. 6, the end winding support that screw mandrel 102 is revolved in described left and right has the first adjustment block 1021, and the end winding support of described first gear shaft 117 has the 2nd adjustment block 1171, and described first adjustment block 1021 and the 2nd adjustment block 1171 all offer " one " font groove; Described outside moulding 42 offers the first adjusting hole 4201 and the 2nd adjusting hole 4202 that are connected with device guide groove 427, and described first adjustment block 4201 is positioned at the bottom of the first adjusting hole 4201, and described 2nd adjustment block position 1171 is in the bottom of the 2nd adjusting hole 4202.
As shown in Figure 3, the end winding support of described 3rd gear shaft 4283 has and all offers " one " font groove in the 3rd adjustment block the 4285, three adjustment block 4285; Described outside moulding 42 offers the 3rd adjusting hole 4284 installed groove 429 and be connected with gear, and described 3rd adjustment block position 4285 is in the bottom of the 3rd adjusting hole 4284.
When specifically operating, the workflow that BGA molding die of the present invention adjusts shaping bar position is as follows:
The first, rotate the 3rd gear shaft 4283 and drive the 3rd gear the 4282, three gear 4282 to drive the 3rd tooth bar 4281, drive the 3rd tooth bar 4281 to drive mobile body 10 entirety motion;
2nd, operation regulates left unit 11 and regulates right unit 12: revolve screw mandrel 102 about turn, left frictionshoe 103 and right frictionshoe 104 and the 2nd gear 116 are disengaged; Turn first gear shaft 117, first gear shaft 117 drives the first gear 115 to rotate, first gear 115 drives the first tooth bar 113 on the sidewall of room 112 1, square chamber overhanging, first tooth bar 113 drives square protuberance 111 overhanging in square groove 101, square protuberance 111 drives and regulates left unit 11 (regulating right unit 12) to move in installation cavity, so, moving body drives shaping bar 451 to do vertically moving of trace along outside moulding 42 and interior frame bar 41 by connection section 110; Meanwhile, the 2nd tooth bar 114 on another sidewall of room, square chamber 112 declines, and the 2nd tooth bar 114 drives the 2nd gear 116 to rotate around the 2nd gear shaft 118;
3rd, when shaping bar 451 longitudinally moves to predetermined position, screw mandrel 102 is revolved about turn, left-handed nut and right handed unt drive left frictionshoe 103 and right frictionshoe 104 to clamp the 2nd gear 116 respectively, to lock the 2nd gear 116, the locking of the 2nd gear 116 makes the 2nd tooth bar 114 lock, and the locking of the 2nd tooth bar 114 makes square protuberance 111 be positioned in square groove 101, and then makes shaping bar 451 position keep stable.
Above content is only the better embodiment of the present invention, for the those of ordinary skill of this area, according to the thought of the present invention, all will change in specific embodiments and applications, and this description should not be construed as limitation of the present invention.
Claims (5)
1. a BGA molding die, comprise die holder (20), the middle part of die holder is longitudinally evenly placed with multiple barrel (30), the left and right sides of barrel (30) is provided with diaphragm capsule (40), described diaphragm capsule (40) comprises the interior frame bar (41) of longitudinally setting, the outside moulding (42) longitudinally arranged, first frame bar (43) of arranged transversely, the 2nd frame bar (44) of arranged transversely, and described diaphragm capsule (40) is isolated into multiple die cavity (401) by mold cavity forming bar module (45);Described interior frame bar (41) is positioned at the side of barrel (30), total die cavity of described interior frame bar (41), outside moulding (42), the first frame bar (43), the 2nd frame bar (44) formation frame type; Moulding (42) is evenly provided with outside die cavity some longitudinal apparatus for adjusting position; It is symmetrically installed with horizontal position setting device (51) in first frame bar (43) and the 2nd frame bar (44); It is characterized in that:
Outside described die cavity, the device guide groove (427) longitudinally run through is offered in moulding (42) inside, outside described die cavity moulding (42) inner side-wall offered chute (426), outer side wall offered gear install groove (429), described longitudinal apparatus for adjusting position comprises mobile body (10), regulates left unit (11) and regulate right unit (12), described mobile body (10) is plugged in moulding outside die cavity (42) inner chamber, regulate left unit and regulate right unit symmetry to be plugged in the square groove (101) of mobile body (10) symmetrical distribution, the left unit of described adjustment is identical with the right modular construction of adjustment, the left unit of described adjustment and the right unit of adjustment include square protuberance (111) and connection section (110), the activity of described square protuberance (111) is plugged in square groove (101), described square protuberance (111) offers penetrating room, square chamber (112), left and right, the two lateral walls of room, square chamber is provided with the first tooth bar (113) and the 2nd tooth bar (114), first tooth bar (113) engages with the first gear (115), 2nd tooth bar (114) engages with the 2nd gear (116), described first gear is fixed on the first gear shaft (117), the two ends of the first gear shaft (117) are articulated on the sidewall of square groove, described 2nd gear (116) is articulated on the 2nd gear shaft (118), and the two ends of the 2nd gear shaft (118) are articulated on the sidewall of square groove (101), on the sidewall of described square groove (101), screw mandrel (102) is revolved in pivot joint about, it is parallel with the 2nd gear shaft (118) with the first gear shaft (117) that screw mandrel (102) is revolved in left and right, screw mandrel (102) is revolved through room, square chamber (112) in left and right, left and right is revolved screw mandrel (102) and is comprised left-handed screw mandrel section and dextrorotation screw mandrel section, in left-handed screw mandrel section, spiral shell connects left-handed nut, in dextrorotation screw mandrel section, spiral shell meets right handed unt, left-handed nut is fixed with left frictionshoe (103), right handed unt is fixed with right frictionshoe (104), the end of left frictionshoe (103) and the end of right frictionshoe (104) are all movably set on the 2nd gear shaft (118), described left frictionshoe (103) and right frictionshoe (104) are positioned at the both sides of the 2nd gear (116),
Described mold cavity forming bar module (45) is made up of two adjacent shaping bars (451); Shaping bar (451) one end and outside moulding (42) are slidably matched, the other end and the interior frame bar (41) of shaping bar (451) are slidably matched, and shaping bar (451) can vertically move along outside moulding (42) and interior frame bar (41); Regulate left unit and regulate the connection section (110) of right unit to stretch out installation cavity and be connected with the end winding support of shaping bar (451);
Outside described die cavity, the gear of moulding (42) outer side wall is installed and is articulated with the 3rd gear shaft (4283) on the upper and lower wall of groove (429); The upper level of described 3rd gear shaft (4283) is fixed with the 3rd gear (4282); Described mobile body (10) outer side wall forms the 3rd tooth bar (4281); 3rd gear (4282) engages with the 3rd tooth bar (4281).
2. a kind of BGA molding die according to claim 1, it is characterized in that: one end and first frame bar (43) of described outside moulding (42) are slidably matched, the other end and the 2nd frame bar (44) of outside moulding (42) are slidably matched;Described horizontal position setting device structure is identical with the right unit of adjustment with the left unit of adjustment, and the connection section (110) of described horizontal position setting device is horizontally disposed with; Horizontal position setting device connection section (110) in one end of described outside moulding (42) and the first frame bar (43) is connected; The other end of outside moulding (42) and horizontal position setting device connection section (110) of the 2nd frame bar (44) are connected.
3. a kind of BGA molding die according to claim 1, it is characterized in that: the connection block (1102) that described connection section (110) comprises slide block (1101), is located at slide block side, described square protuberance (111) is connected with slide block, and block (1102) connects described shaping bar (451) with being connected.
4. a kind of BGA molding die according to claim 1, it is characterized in that: the end winding support that screw mandrel (102) is revolved in described left and right has the first adjustment block (1021), the end winding support of described first gear shaft (117) has the 2nd adjustment block (1171), and described first adjustment block (1021) and the 2nd adjustment block (1171) all offer " one " font groove; The first adjusting hole (4201) being connected with device guide groove (427) and the 2nd adjusting hole (4202) are offered in described outside moulding (42), described first adjustment block (4201) is positioned at the bottom of the first adjusting hole (4201), and described 2nd adjustment block position (1171) is in the bottom of the 2nd adjusting hole (4202).
5. a kind of BGA molding die according to claim 1, it is characterized in that: the end winding support of described 3rd gear shaft (4283) has the 3rd adjustment block (4285), and the 3rd adjustment block (4285) all offers " one " font groove; Described outside moulding (42) offers the 3rd adjusting hole (4284) installed groove (429) and be connected with gear, and described 3rd adjustment block position (4285) is in the bottom of the 3rd adjusting hole (4284).
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610129891.XA CN105666745B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding dies |
| CN201711198733.0A CN107993944B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711133121.3A CN107696350B8 (en) | 2016-03-08 | 2016-03-08 | BGA molding die |
| CN201710842619.0A CN107553789B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding die |
| CN201711198730.7A CN107962713B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711133122.8A CN107901293B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201710842618.6A CN107571429B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610129891.XA CN105666745B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding dies |
Related Child Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711198733.0A Division CN107993944B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201710842618.6A Division CN107571429B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201711133121.3A Division CN107696350B8 (en) | 2016-03-08 | 2016-03-08 | BGA molding die |
| CN201710842619.0A Division CN107553789B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding die |
| CN201711198730.7A Division CN107962713B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711133122.8A Division CN107901293B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105666745A true CN105666745A (en) | 2016-06-15 |
| CN105666745B CN105666745B (en) | 2017-12-22 |
Family
ID=56307183
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710842618.6A Expired - Fee Related CN107571429B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201710842619.0A Expired - Fee Related CN107553789B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding die |
| CN201610129891.XA Expired - Fee Related CN105666745B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding dies |
| CN201711133122.8A Active CN107901293B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201711198733.0A Active CN107993944B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711198730.7A Active CN107962713B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711133121.3A Expired - Fee Related CN107696350B8 (en) | 2016-03-08 | 2016-03-08 | BGA molding die |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710842618.6A Expired - Fee Related CN107571429B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201710842619.0A Expired - Fee Related CN107553789B (en) | 2016-03-08 | 2016-03-08 | A kind of BGA molding die |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711133122.8A Active CN107901293B (en) | 2016-03-08 | 2016-03-08 | Working method of BGA (ball grid array) molding die |
| CN201711198733.0A Active CN107993944B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711198730.7A Active CN107962713B (en) | 2016-03-08 | 2016-03-08 | BGA (ball grid array) molding die for semiconductor packaging and working method thereof |
| CN201711133121.3A Expired - Fee Related CN107696350B8 (en) | 2016-03-08 | 2016-03-08 | BGA molding die |
Country Status (1)
| Country | Link |
|---|---|
| CN (7) | CN107571429B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039293A (en) * | 2017-05-31 | 2017-08-11 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989471A (en) * | 1996-07-25 | 1999-11-23 | Advanced Systems Automation Limited | BGA mould assembly for encapsulating BGA substrates of varying thickness |
| CN104552672A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | BGA molding mold |
| CN105328829A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Ball grid array (BGA) molding mold |
| CN205522126U (en) * | 2016-03-08 | 2016-08-31 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA mould utensil of moulding |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4946633A (en) * | 1987-04-27 | 1990-08-07 | Hitachi, Ltd. | Method of producing semiconductor devices |
| JP2003007741A (en) * | 2001-06-19 | 2003-01-10 | Rohm Co Ltd | Method for manufacturing semiconductor device |
| CN201405485Y (en) * | 2009-04-30 | 2010-02-17 | 成都尚明工业有限公司 | Highly-effective energy-saving semiconductor plastic-encapsulated mold |
| JP4933596B2 (en) * | 2009-07-09 | 2012-05-16 | 日本航空電子工業株式会社 | Resin molded product |
| CN201645752U (en) * | 2010-02-09 | 2010-11-24 | 东莞朗诚模具有限公司 | Mold device packaged by high-voltage device |
-
2016
- 2016-03-08 CN CN201710842618.6A patent/CN107571429B/en not_active Expired - Fee Related
- 2016-03-08 CN CN201710842619.0A patent/CN107553789B/en not_active Expired - Fee Related
- 2016-03-08 CN CN201610129891.XA patent/CN105666745B/en not_active Expired - Fee Related
- 2016-03-08 CN CN201711133122.8A patent/CN107901293B/en active Active
- 2016-03-08 CN CN201711198733.0A patent/CN107993944B/en active Active
- 2016-03-08 CN CN201711198730.7A patent/CN107962713B/en active Active
- 2016-03-08 CN CN201711133121.3A patent/CN107696350B8/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5989471A (en) * | 1996-07-25 | 1999-11-23 | Advanced Systems Automation Limited | BGA mould assembly for encapsulating BGA substrates of varying thickness |
| CN104552672A (en) * | 2014-12-08 | 2015-04-29 | 南通富士通微电子股份有限公司 | BGA molding mold |
| CN105328829A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Ball grid array (BGA) molding mold |
| CN205522126U (en) * | 2016-03-08 | 2016-08-31 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA mould utensil of moulding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039293A (en) * | 2017-05-31 | 2017-08-11 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
| CN107039293B (en) * | 2017-05-31 | 2023-03-14 | 安徽大华半导体科技有限公司 | Semiconductor packaging mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107553789A (en) | 2018-01-09 |
| CN107993944B (en) | 2019-12-10 |
| CN105666745B (en) | 2017-12-22 |
| CN107553789B (en) | 2019-11-08 |
| CN107571429B (en) | 2019-12-20 |
| CN107696350A (en) | 2018-02-16 |
| CN107696350B8 (en) | 2020-02-04 |
| CN107696350B (en) | 2019-12-20 |
| CN107571429A (en) | 2018-01-12 |
| CN107962713A (en) | 2018-04-27 |
| CN107993944A (en) | 2018-05-04 |
| CN107901293A (en) | 2018-04-13 |
| CN107962713B (en) | 2021-01-15 |
| CN107901293B (en) | 2019-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105251866B (en) | Cylindrical member sidewise punching mould | |
| CN105666745A (en) | BGA (Ball Grid Array) molding die | |
| CN104552672B (en) | BGA molding mold | |
| CN106564167B (en) | A kind of straight PIN needle plug-in unit base axial direction side core-pulling insert injection moulding mode structure of list | |
| CN215040046U (en) | Discharging support frame | |
| CN203665950U (en) | 3D printer with height-adjustable model workbench | |
| CN205522126U (en) | BGA mould utensil of moulding | |
| CN104400938A (en) | Mould core capable of being deviated left and right | |
| CN105328829A (en) | Ball grid array (BGA) molding mold | |
| CN206123585U (en) | Plane mobile Workbench | |
| CN104108148A (en) | Demolding structure of product with female thread | |
| CN203844109U (en) | Improved three-plate mold | |
| CN206967894U (en) | What a kind of mold insert can push up outside inlays mechanism and the mould with the mechanism | |
| CN206106265U (en) | Novel adjustable torsion mould structure | |
| CN214323288U (en) | Modular elevation adjusting tool platform for steel box girder production and processing | |
| CN107696490A (en) | A kind of powder of 3D printer puts down device | |
| CN105328031B (en) | A kind of Box-Shaped Drawing test mould of length and width Parameter adjustable | |
| CN204585745U (en) | A kind of mouth of a river cutting machine | |
| CN206475180U (en) | A kind of adjustment tool of manipulator fixture | |
| CN106217771A (en) | A kind of master mold, mould, injection-moulding device and die cavity acupoint depth method of adjustment thereof | |
| CN213106493U (en) | High-stability auxiliary positioning device for die manufacturing | |
| CN220050914U (en) | Die accessory precision machining fixing jig | |
| CN210880832U (en) | Lower die plate mounting structure of injection blow molding machine | |
| CN203031749U (en) | Integrated-plate continuous forming device achieving adjustable length dimensions and positions | |
| CN207359563U (en) | A kind of clamping apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Xiao Xingjin Inventor before: Ye Weiran |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171130 Address after: 362400 Fujian County of Anxi Province Zhou Tao Xiang Da Xin Cun Da Xin Nan No. 70 Applicant after: Xiao Xingjin Address before: Yang Shu Lu Wuxing District 313000 Zhejiang city of Huzhou province No. 18 Applicant before: ZHEJIANG QIAO XING CONSTRUCTION GROUP HUZHOU INTELLIGENT SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190306 Address after: 215000 Hengjing Industrial Building, 2588 Swan Dang Road, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: QIDUO PRECISION PLASTIC (SUZHOU) CO.,LTD. Address before: 362400 Daxincun Daxinnan 70, Taozhou Township, Anxi County, Fujian Province Patentee before: Xiao Xingjin |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |