CN203198125U - Circuit board mold - Google Patents
Circuit board mold Download PDFInfo
- Publication number
- CN203198125U CN203198125U CN 201220736801 CN201220736801U CN203198125U CN 203198125 U CN203198125 U CN 203198125U CN 201220736801 CN201220736801 CN 201220736801 CN 201220736801 U CN201220736801 U CN 201220736801U CN 203198125 U CN203198125 U CN 203198125U
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- Prior art keywords
- circuit board
- mold
- bed die
- glue
- mould
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Abstract
The utility model discloses a circuit board mold which comprises an upper mold and a lower mold, wherein grooves are arranged in the lower end surface of the upper mold and the upper end surface of the lower mold, the groove of the upper mold and the groove of the lower mold form a mold chamber for containing a circuit board after the upper mold and the lower mold are buckled, a glue inlet is formed in the lower end surface of the lower mold and communicated with the mold chamber, and a vent hole is formed in the upper end surface of the upper mold and communicated with the mold chamber. In a use process, glue is poured from the glue inlet in the lower end surface of the lower mold, and then air in the chamber is discharged through the vent hole of the upper mold after the glue enters the mold chamber so as to form a vacuum environment in the mold chamber, and the quality of the formed circuit board can be improved.
Description
Technical field
The utility model relates to a kind of mould, particularly, relates to a kind of circuit board mould.
Background technology
Electric circuit in well will use a kind of silicon rubber that its surface is covered before being installed into downhole instrument usually, allowed and filled full silicon rubber between circuit board and the instrument skeleton.Like this, can make circuit board avoid the destruction of in drilling process, being impacted and shaking.Because silicon rubber is in a liquid state before curing, therefore need a kind of mould of special use to make its shaping.The mould that uses at present generally is uncovered, can't form vacuum environment in the process of can glue in mould, and colloid inside may form hole, causes the colloid forming effect relatively poor.
The utility model content
In order to solve the problems of the technologies described above, the utility model discloses a kind of circuit board mould, solve the problem that has air in the colloid and affect the quality of shaping circuit.
The disclosed circuit board mould of the utility model, comprise mold and bed die, the lower surface of mold and the upper surface of bed die are respectively arranged with groove, the groove of mold and the groove of bed die fasten the rear mould cavity that forms the energy containment circuit board at mold and bed die, the lower surface of described bed die arranges glue-feeder, described glue-feeder is connected with described mould cavity, and the upper surface of described mold arranges air vent, and described air vent is connected with described mould cavity.
Preferably, the bottom land of the groove of described mold is or/and the bottom land of the groove of described bed die arranges bar-shaped trough.
Preferably, described circuit board mould also comprises at least one jackscrew, the upper surface of described mold is provided with and the suitable screwed hole of the external screw thread of described jackscrew, and an end of described jackscrew passes described screwed hole and extends to the non-groove of the upper surface of described bed die.
Preferably, described circuit board mould also comprises at least one pair of dog screw, and described a pair of dog screw passes respectively two positioning screw holes that are arranged on two relative sides of described mold, and extends in the described mould cavity.
Preferably, described circuit board mould also comprises the sign step that is arranged in the described bed die groove.
Preferably, described mold is connected by bolt with described bed die.
Preferably, described air vent is reverse taper hole.
Preferably, described circuit board mould also comprises the bottle placer connector of the lower surface that is arranged on described bed die, described bottle placer connector is provided with the glue feeding opening that is connected with described glue-feeder, and described bottle placer connector also arranges the stifled glue plug hole that is connected with described glue feeding opening and is arranged on stifled glue plug in the described stifled glue plug hole.
The utility model in use pours into glue from the glue-feeder of the lower surface of bed die, and glue enters behind the mould cavity by the venthole of mold and discharges air in the cavity, forms vacuum environment in mould cavity, has improved the quality of shaping circuit.
Description of drawings
Fig. 1 is the structural representation of mold upper surface among the utility model embodiment;
Fig. 2 is the structural representation of mold lower surface among the utility model embodiment;
Fig. 3 is the structural representation of bed die upper surface among the utility model embodiment;
Fig. 4 is the structural representation of bed die lower surface among the utility model embodiment;
Fig. 5 is the installation diagram of circuit board mould among the utility model embodiment.
The specific embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, hereinafter in connection with accompanying drawing embodiment of the present utility model is elaborated.Need to prove, in the situation that do not conflict, the feature among the present embodiment and the embodiment is any combination mutually.
Among the embodiment of the present utility model, a kind of circuit board mould is disclosed, such as Fig. 1-shown in Figure 5, comprise mold 1 and bed die 2, the upper surface of the lower surface of mold 1 and bed die 2 is respectively arranged with groove 5,6, the groove 5 of mold 1 and the groove 6 of bed die 2 fasten the rear mould cavity 3 that forms energy containment circuit board 4 at mold 1 and bed die 2, the lower surface of bed die 2 arranges glue-feeder 7, glue-feeder 7 is connected with mould cavity 3, the upper surface of mold 1 arranges air vent 8, and air vent 8 is connected with mould cavity 3.
In use, first circuit board 4 is placed in the groove 6 of bed die 2 upper surfaces, then mold 1 is fastened on the bed die 2, then in mould cavity 3, inculcate glue by the glue-feeder 7 of bed die 2 lower surfaces, after glue enters mould cavity 3, by the air that the air vent 8 of mold 1 upper surface is discharged in the mould cavity 3, unnecessary glue is also discharged by air vent 8.Wherein, the shape of air vent 8 can arrange flexibly, preferably adopts up big and down small back taper, and the number of air vent 8 can arrange flexibly, and 15 air vents have been shown among Fig. 1, is distributed on the upper surface of mold 1.
As the further improvement of above-described embodiment, the bottom land of the groove 5 of mold 1 is or/and the bottom land of the groove 6 of bed die 2 arranges bar-shaped trough 9.Bar-shaped trough can guarantee that the circuit board after moulding forms muscle, the damping effect of intensifier circuit plate, and wherein, bar-shaped trough can arrange flexibly at the distribution shape of bottom land, for example, can be groined type or matrix pattern.
Further improvement as above-described embodiment, the circuit board mould also comprise four jackscrews and four screwed holes have been shown among at least one jackscrew 10(Fig. 5), the upper surface of mold 1 is provided with and the suitable screwed hole 11 of the external screw thread of jackscrew 10, and an end of jackscrew 10 passes screwed hole 11 and extends to the non-groove of the upper surface of bed die 2.Jackscrew be used for molding, convenient mold 1 and the bed die 2 of separating behind the gum forming mould cavity 3 in, can screw in jackscrew 10 in the screwed holes 11, jackscrew withstands the non-groove of bed die 2, separation mold 1 and bed die 2.
Further improvement as above-described embodiment, the circuit board mould comprises that also at least one pair of one of them screw of dog screw 12(is not shown), it is not shown that a pair of dog screw 12 passes respectively two one of them positioning screw holes of positioning screw hole 13(that are arranged on two relative sides of mold 1), and extend in the mould cavity 3.The effect of dog screw is position and the height of locating circuit board 4 in mould cavity 3, so that keep suitable position in the colloid of circuit board 4 after shaping, has guaranteed the wall thickness of colloid everywhere.
As the further improvement of above-described embodiment, the circuit board mould also comprises the sign step 14 that is arranged in bed die 2 grooves 6, is used for indicating the position of circuit board 4 joints.
As the further improvement of above-described embodiment, mold 1 is detachable the connection with bed die 2.For example, can be connected by bolt 18.
Further improvement as above-described embodiment, the circuit board mould also comprises the bottle placer connector 15 of the lower surface that is arranged on bed die 2, bottle placer connector 15 is provided with the glue feeding opening 16 that is connected with glue-feeder 7, and bottle placer connector 15 also arranges the stifled glue plug hole 17 that is connected with glue feeding opening 16 and is arranged on the stifled glue plug (not shown among Fig. 4 and Fig. 5) that blocks up in the glue plug hole 17.In order linking to each other with the filling and sealing machine of encapsulating, in the process of encapsulating, after glue is full of mould cavity 3, when unnecessary glue overflows by air vent 8, can to use stifled glue plug to block glue feeding opening 16 during bottle placer connector 15, to stop encapsulating.
Although the disclosed embodiment of the utility model as above, the embodiment that described content just adopts for the ease of understanding the utility model is not to limit the utility model.Technical staff under any the utility model in the technical field; under the prerequisite that does not break away from the disclosed spirit and scope of the utility model; can do any modification and variation in the details that reaches of implementing in form; but scope of patent protection of the present utility model still must be as the criterion with the scope that appending claims was defined.
Claims (8)
1. circuit board mould, it is characterized in that: comprise mold and bed die, the lower surface of described mold and the upper surface of described bed die are respectively arranged with groove, the groove of described mold and the groove of described bed die fasten the rear mould cavity that forms the energy containment circuit board at described mold and bed die, the lower surface of described bed die arranges glue-feeder, described glue-feeder is connected with described mould cavity, the upper surface of described mold arranges air vent, and described air vent is connected with described mould cavity.
2. circuit board mould as claimed in claim 1, it is characterized in that: the bottom land of the groove of described mold is or/and the bottom land of the groove of described bed die arranges bar-shaped trough.
3. circuit board mould as claimed in claim 1, it is characterized in that: described circuit board mould also comprises at least one jackscrew, the upper surface of described mold is provided with and the suitable screwed hole of the external screw thread of described jackscrew, and an end of described jackscrew passes described screwed hole and extends to the non-groove of the upper surface of described bed die.
4. circuit board mould as claimed in claim 1, it is characterized in that: described circuit board mould also comprises at least one pair of dog screw, described a pair of dog screw passes respectively two positioning screw holes that are arranged on two relative sides of described mold, and extends in the described mould cavity.
5. circuit board mould as claimed in claim 1 is characterized in that: described circuit board mould also comprises the sign step that is arranged in the described bed die groove.
6. circuit board mould as claimed in claim 1, it is characterized in that: described mold is connected by bolt with described bed die.
7. circuit board mould as claimed in claim 1, it is characterized in that: described air vent is reverse taper hole.
8. circuit board mould as claimed in claim 1, it is characterized in that: described circuit board mould also comprises the bottle placer connector of the lower surface that is arranged on described bed die, described bottle placer connector is provided with the glue feeding opening that is connected with described glue-feeder, and described bottle placer connector also arranges the stifled glue plug hole that is connected with described glue feeding opening and is arranged on stifled glue plug in the described stifled glue plug hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220736801 CN203198125U (en) | 2012-12-27 | 2012-12-27 | Circuit board mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220736801 CN203198125U (en) | 2012-12-27 | 2012-12-27 | Circuit board mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203198125U true CN203198125U (en) | 2013-09-18 |
Family
ID=49142264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220736801 Expired - Lifetime CN203198125U (en) | 2012-12-27 | 2012-12-27 | Circuit board mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203198125U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875313A (en) * | 2015-04-23 | 2015-09-02 | 昆山群悦精密模具有限公司 | Degassing electronic packaging mold |
| CN107135611A (en) * | 2017-06-01 | 2017-09-05 | 中国石油集团渤海钻探工程有限公司 | Drilling tool circuit board embedding adhesive dispenser and application method |
| CN111688084A (en) * | 2020-06-17 | 2020-09-22 | 中国科学院地质与地球物理研究所 | Circuit board encapsulating mould |
| WO2021218611A1 (en) * | 2020-04-26 | 2021-11-04 | 上纬新材料科技股份有限公司 | Device for making high-viscosity adhesive test board |
| CN114311451A (en) * | 2021-09-22 | 2022-04-12 | 中国石油大学胜利学院 | Glue injection method for downhole instrument |
-
2012
- 2012-12-27 CN CN 201220736801 patent/CN203198125U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875313A (en) * | 2015-04-23 | 2015-09-02 | 昆山群悦精密模具有限公司 | Degassing electronic packaging mold |
| CN107135611A (en) * | 2017-06-01 | 2017-09-05 | 中国石油集团渤海钻探工程有限公司 | Drilling tool circuit board embedding adhesive dispenser and application method |
| CN107135611B (en) * | 2017-06-01 | 2023-08-15 | 中国石油天然气集团有限公司 | Drilling tool circuit board pouring sealant device and use method thereof |
| WO2021218611A1 (en) * | 2020-04-26 | 2021-11-04 | 上纬新材料科技股份有限公司 | Device for making high-viscosity adhesive test board |
| CN111688084A (en) * | 2020-06-17 | 2020-09-22 | 中国科学院地质与地球物理研究所 | Circuit board encapsulating mould |
| CN114311451A (en) * | 2021-09-22 | 2022-04-12 | 中国石油大学胜利学院 | Glue injection method for downhole instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100010 Chaoyangmen North Street, Dongcheng District, Dongcheng District, Beijing Co-patentee after: CHINA OILFIELD SERVICES Ltd. Patentee after: CHINA NATIONAL OFFSHORE OIL Corp. Address before: 100010 Chaoyangmen North Street, Dongcheng District, Dongcheng District, Beijing Co-patentee before: CHINA OILFIELD SERVICES Ltd. Patentee before: CHINA NATIONAL OFFSHORE OIL Corp. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130918 |