CN104875313A - Degassing electronic packaging mold - Google Patents
Degassing electronic packaging mold Download PDFInfo
- Publication number
- CN104875313A CN104875313A CN201510197333.2A CN201510197333A CN104875313A CN 104875313 A CN104875313 A CN 104875313A CN 201510197333 A CN201510197333 A CN 201510197333A CN 104875313 A CN104875313 A CN 104875313A
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- CN
- China
- Prior art keywords
- electronic packaging
- mold
- backform
- formula electronic
- packaging mould
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Abstract
The invention discloses a degassing electronic packaging mold. The degassing electronic packaging mold is characterized by comprising a bottom mold (1) and a top mold (2), wherein the bottom mold (1) comprises a plurality of parallel platforms (3) and a plurality of parallel mold cavities (4) for accommodating electronic elements, and the parallel platforms (3) and the mold cavities (4) are arranged at intervals; the two ends of the platform (3) and the mold cavity (4) are provided with a charge tank (5) and a residual material discharge tank (6); the connection ends of the mold cavities (4) and the charge tank (5) are provided with discharge holes (7); the connection ends of the mold cavities (4) and the residual material discharge tank (6) are provided with discharge holes (8); the bottom end of the residual material discharge tank (6) is provided with a vacuum hole (10) connected with a vacuum pump (11). The degassing electronic packaging mold provided by the invention has a good degassing effect, and is especially suitable for degassing and packaging of the packaging materials with relatively high viscosity and poor fluidity.
Description
Technical field
The present invention relates to a kind of degassed formula Electronic Packaging mould, belong to technical field of electronic encapsulation.
Background technology
Electronic Packaging is exactly install the shell of integrated circuit built-in chip external application, plays and lays fixing seal, Protective IC built-in chip, strengthens the effect of the ability of environmental adaptation.Existing Electronic Packaging mould generally has the backform and bed die that are used in conjunction with each other, and the contact surface of backform and bed die is owing to being all more smooth plane, the bad control in installation site when backform and bed die are installed, need adjust the accurate installation that could realize backform and bed die repeatedly.
In addition, existing Electronic Packaging mould does not generally have degasser, even if minority encapsulating mould has degassed function, general is also rely on encapsulating material self flowing to be vented, this kind of exhaust mode exhaust effect is poor, is easy to residual bubble, thus affects package quality in encapsulating material; And the type of flow of the encapsulating material injected in existing Electronic Packaging mould, only rely on the encapsulating material that feed well injects liquid continuously and enter die cavity and clout blow tank to promote encapsulating material, especially for the encapsulating material that viscosity ratio is larger, be unfavorable for very much the even perfusion of encapsulating material in die cavity, and be also extremely unfavorable for the exhaust of tough encapsulating material.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of degasifying effect good, and especially the exhaust of the encapsulating material that calculated viscosity is large and tough encapsulating material are completely evenly full of the degassed formula Electronic Packaging mould of die cavity; Further, the invention provides a kind of structure simple, the degassed formula Electronic Packaging mould that backform and bed die quick position are installed.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
Degassed formula Electronic Packaging mould, it is characterized in that: comprising: bed die and backform, described bed die comprises the spaced platform of some run-in indexs and the die cavity for putting electronic device, the two ends of described platform and die cavity arrange feed well and clout blow tank respectively, the link of described die cavity and described feed well is provided with charging hole, and the link of described die cavity and described clout blow tank is provided with discharge opening; The bottom of described clout blow tank is provided with vacuum hole, and described vacuum hole is connected with vavuum pump.
Described platform is provided with some locating dowels, the lower surface of described backform be provided with described locating dowel with the use of locating hole.
Described backform is also provided with the quick clip be fixedly connected with described bed die.
The shape of described locating dowel comprises cylindrical, triangle or trapezoidal, and the number of described locating dowel is at least 2.
The sidewall of described feed well is provided with material hole.
The lower surface of described backform is provided with antiseize membrane.
The material of described antiseize membrane comprises polypropylene, PET, PP or PE.
After encapsulating material coagulation forming in die cavity, complete the encapsulation of electronic devices and components.
One provided by the invention degassed formula Electronic Packaging mould, the setting of vacuum hole and vavuum pump, facilitates the degassed of encapsulating material, the encapsulating material that especially calculated viscosity is large degassed; Simultaneously the setting of vavuum pump, can flow to discharge end by feed end fast by encapsulating material, and the encapsulating material of especially comparatively large for viscosity ratio, poor fluidity, also can be extracted into discharge end fast by encapsulating material, make encapsulating material evenly pour into whole die cavity; The setting of locating dowel and locating hole, achieves the location and installation of backform and bed die, and once mounting can be successful, and installation rate is fast; The setting of antiseize membrane, is beneficial to the demoulding of the encapsulating material after coagulation forming; The setting of quick clip, makes backform and bed die compact siro spinning technology, be convenient in liquid condition encapsulating material coagulation forming and encapsulated moulding rear surface is smooth.One provided by the invention degassed formula Electronic Packaging mould, degasifying effect is good, especially degassed the and encapsulation of the encapsulating material of larger, the poor fluidity of calculated viscosity.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of backform in the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is further described.
As shown in Figure 1 and 2, degassed formula Electronic Packaging mould, it is characterized in that: comprising: bed die 1 and backform 2, described bed die 1 comprises the spaced platform 3 of some run-in indexs and the die cavity 4 for putting electronic device, the two ends of described platform 3 and die cavity 4 arrange feed well 5 and clout blow tank 6 respectively, described die cavity 4 is provided with charging hole 7 with the link of described feed well 5, and described die cavity 4 is provided with discharge opening 8 with the link of described clout blow tank 6; The bottom of described clout blow tank 6 is provided with vacuum hole 10, and described vacuum hole 10 is connected with vavuum pump 11.
Described platform 3 is provided with some locating dowels 9, the lower surface of described backform 2 be provided with described locating dowel 9 with the use of locating hole.
Described backform 2 is also provided with the quick clip be fixedly connected with described bed die 1.
The shape of described locating dowel 9 comprises cylindrical, triangle or trapezoidal, and the number of described locating dowel 9 is at least 2.
The sidewall of described feed well 5 is provided with material hole.
The lower surface of described backform 2 is provided with antiseize membrane.
The material of described antiseize membrane comprises polypropylene, PET, PP or PE.
During encapsulation, locating dowel is aimed at locating hole, complete the location and installation of backform and bed die, then quick clip is closed, clamp backform and bed die, making between backform and bed die is sealing, then opens vavuum pump, time in mould in vacuum state, inject encapsulating material by material hole again, after material solidification to be packaged, close vavuum pump, the demoulding, completes encapsulation.
The above is only the preferred embodiment of the present invention; be noted that for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. degassed formula Electronic Packaging mould, it is characterized in that: comprising: bed die (1) and backform (2), described bed die (1) comprises the spaced platform of some run-in indexs (3) and the die cavity (4) for putting electronic device, the two ends of described platform (3) and die cavity (4) arrange feed well (5) and clout blow tank (6) respectively, described die cavity (4) is provided with charging hole (7) with the link of described feed well (5), and described die cavity (4) is provided with discharge opening (8) with the link of described clout blow tank (6); The bottom of described clout blow tank (6) is provided with vacuum hole (10), and described vacuum hole (10) is connected with vavuum pump (11).
2. degassed formula Electronic Packaging mould according to claim 1, is characterized in that: described platform (3) is provided with some locating dowels (9), the lower surface of described backform (2) be provided with described locating dowel (9) with the use of locating hole.
3. degassed formula Electronic Packaging mould according to claim 1, is characterized in that: described backform (2) is also provided with the quick clip be fixedly connected with described bed die (1).
4. degassed formula Electronic Packaging mould according to claim 2, is characterized in that: the shape of described locating dowel (9) comprises cylindrical, triangle or trapezoidal, and the number of described locating dowel (9) is at least 2.
5. degassed formula Electronic Packaging mould according to claim 1, is characterized in that: the sidewall of described feed well (5) is provided with material hole.
6. degassed formula Electronic Packaging mould according to claim 1, is characterized in that: the lower surface of described backform (2) is provided with antiseize membrane.
7. degassed formula Electronic Packaging mould according to claim 6, is characterized in that: the material of described antiseize membrane comprises polypropylene, PET, PP or PE.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510197333.2A CN104875313A (en) | 2015-04-23 | 2015-04-23 | Degassing electronic packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510197333.2A CN104875313A (en) | 2015-04-23 | 2015-04-23 | Degassing electronic packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104875313A true CN104875313A (en) | 2015-09-02 |
Family
ID=53943112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510197333.2A Pending CN104875313A (en) | 2015-04-23 | 2015-04-23 | Degassing electronic packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104875313A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310553A (en) * | 1993-04-22 | 1994-11-04 | Toowa Kk | Method and apparatus for molding resin sealing of electronic part |
| CN101180170A (en) * | 2005-11-04 | 2008-05-14 | 东和株式会社 | Molding apparatus for resin encapsulation of electronic part |
| CN102950700A (en) * | 2011-08-19 | 2013-03-06 | 汕头华汕电子器件有限公司 | Semiconductor device plastic packaging vacuumizing apparatus |
| CN203198125U (en) * | 2012-12-27 | 2013-09-18 | 中国海洋石油总公司 | Circuit board mold |
| CN203876150U (en) * | 2014-05-30 | 2014-10-15 | 单井精密工业(昆山)有限公司 | Electronic packaging mould |
| CN204640645U (en) * | 2015-04-23 | 2015-09-16 | 昆山群悦精密模具有限公司 | Degassed formula Electronic Packaging mould |
-
2015
- 2015-04-23 CN CN201510197333.2A patent/CN104875313A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310553A (en) * | 1993-04-22 | 1994-11-04 | Toowa Kk | Method and apparatus for molding resin sealing of electronic part |
| CN1099189A (en) * | 1993-04-22 | 1995-02-22 | 东和株式会社 | Moulded resin is with the method and apparatus of seal electronic element |
| CN101180170A (en) * | 2005-11-04 | 2008-05-14 | 东和株式会社 | Molding apparatus for resin encapsulation of electronic part |
| CN102950700A (en) * | 2011-08-19 | 2013-03-06 | 汕头华汕电子器件有限公司 | Semiconductor device plastic packaging vacuumizing apparatus |
| CN203198125U (en) * | 2012-12-27 | 2013-09-18 | 中国海洋石油总公司 | Circuit board mold |
| CN203876150U (en) * | 2014-05-30 | 2014-10-15 | 单井精密工业(昆山)有限公司 | Electronic packaging mould |
| CN204640645U (en) * | 2015-04-23 | 2015-09-16 | 昆山群悦精密模具有限公司 | Degassed formula Electronic Packaging mould |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150902 |
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| RJ01 | Rejection of invention patent application after publication |