CN219937048U

CN219937048U - Power module

Info

Publication number: CN219937048U
Application number: CN202321049262.8U
Authority: CN
Inventors: 成章明; 周文杰; 李正凯; 谢地林; 刘剑
Original assignee: Hisense Home Appliances Group Co Ltd
Current assignee: Hisense Home Appliances Group Co Ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-10-31
Anticipated expiration: 2033-04-28

Abstract

The utility model discloses a power module, which comprises: the frame comprises a plurality of base islands and a plurality of power side pins, and the base islands and the power side pins are arranged at intervals in the transverse direction of the power module; the power chips are arranged on the base islands; the packaging body is used for packaging the plurality of base islands, a plurality of front pinholes are formed on the front face of the packaging body, a plurality of back pinholes are formed on the back face of the packaging body, the base islands positioned at the two transverse ends are respectively corresponding to the front pinholes, each base island is respectively corresponding to at least one back pinhole, one ends of the power side pins are positioned in the packaging body, and the other ends of the power side pins extend out of the packaging body. Therefore, the frame can be supported in different directions, the plastic packaging speed can be accelerated, the packaging die can be shared with other power chips, the universality of the packaging die can be improved, the research and development period can be shortened, and the research and development cost can be reduced.

Description

Power module

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a power module.

Background

In the prior art, a base island in a power module needs to be subjected to plastic packaging, a frame in the power module is deformed under the pressure of flowing colloid in the process of adding injection molding colloid into the base island, a packaging mold is needed for preventing the frame from being deformed, a thimble in the packaging mold is used for supporting the frame, but different power chips are required to adopt different packaging molds due to the change of structures, so that the universality of the packaging mold is poor, the research and development period of the power chips is longer, and the research and development cost is high.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a power module, which can share a packaging mold with other power chips, can improve the versatility of the packaging mold, can shorten the development period, and can reduce the development cost.

According to an embodiment of the utility model, a power module includes: the frame comprises a plurality of base islands and a plurality of power side pins, and the base islands and the power side pins are arranged at intervals in the transverse direction of the power module; one end of each power side pin is connected with each base island; the power chips are arranged on the base islands; the packaging body packages a plurality of the base islands, the surface, which is closer to the base islands, of the two opposite surfaces of the packaging body in the thickness direction is the back of the packaging body, the surface, which is farther away from the base islands, of the two opposite surfaces of the packaging body in the thickness direction is the front of the packaging body, a plurality of front pinholes are formed on the front of the packaging body, a plurality of back pinholes are formed on the back of the packaging body, the base islands at the two transverse ends respectively correspond to the front pinholes, each base island corresponds to at least one back pinhole, one end of each power side pin is positioned in the packaging body, and the other end of each power side pin extends out of the packaging body.

Therefore, a plurality of front pinholes are formed on the front surface of the packaging body, a plurality of back pinholes are formed on the back surface of the packaging body, the frame can be supported in different directions in the plastic packaging process, the plastic packaging speed can be accelerated, and the fully-packaged power module arranged in the way can share the packaging die with other semi-packaged power modules (such as power modules with DBC and exposed surface on one side of DBC) on the front surface of the packaging body, so that the universality of the packaging die can be improved, the research and development period can be shortened, and the research and development cost can be reduced.

According to some embodiments of the utility model, a plurality of the pinholes are provided on a side of the submount remote from the power side pin in a longitudinal direction of the submount.

According to some embodiments of the utility model, the back pinholes corresponding to two adjacent islands are at least partially offset in the lateral direction of the power module.

According to some embodiments of the utility model, the plurality of islands comprises: the power module comprises odd-numbered base islands and even-numbered base islands, wherein the odd-numbered base islands and the even-numbered base islands are arranged in a staggered manner in the transverse direction of the power module, the central connecting line of a back needle hole corresponding to the odd-numbered base islands is a first straight line, the central connecting line of the back needle hole corresponding to the even-numbered base islands is a second straight line, and the first straight line and the second straight line are parallel to each other and extend in the transverse direction of the power module.

According to some embodiments of the utility model, the central axis of the power module extending transversely is a third straight line, the central line of the front pinholes is a fourth straight line, and the third straight line and the fourth straight line are parallel to each other.

According to some embodiments of the utility model, the first line and the second line are located between the third line and the fourth line.

According to some embodiments of the utility model, the plurality of islands comprises: the first base island, the second base island, the third base island and the fourth base island that arrange in order, first base island with the third base island is the odd base island just the second base island with the fourth base island is the even base island, a plurality of openly pinhole includes: first front pinhole and second front pinhole, a plurality of back pinholes include: the power module comprises a first back needle hole, a second back needle hole, a third back needle hole, a fourth back needle hole and a fifth back needle hole, wherein the first front needle hole corresponds to a first base island, the second front needle hole corresponds to a fourth base island, the first back needle hole corresponds to the first base island, the second back needle hole corresponds to a second base island, the third back needle hole corresponds to a third base island, and the fourth back needle hole and the fifth back needle hole correspond to the fourth base island in the vertical direction of the power module.

According to some embodiments of the utility model, the first front pinhole and the second front pinhole have a center distance d1, the first back pinhole and the fifth back pinhole have a center distance d2, d1 and d2 satisfying the relation: d1 > d2.

According to some embodiments of the utility model, the plurality of power chips comprises: the three low-voltage power chips and the three high-voltage power chips are respectively arranged on the first base island, the second base island and the third base island, the three high-voltage power chips are respectively arranged on the fourth base island and are arranged at intervals in the transverse direction of the power module, and the three low-voltage power chips and the three high-voltage power chips are respectively arranged on the front face of the frame towards the packaging body.

According to some embodiments of the utility model, the projection of the back pinholes corresponding to the odd islands onto the corresponding odd islands is located within the odd islands and tangential to edges of the odd islands in a longitudinal direction away from the power side pins.

According to some embodiments of the present utility model, a projection of the pinhole corresponding to the even-numbered island on the corresponding even-numbered island is located in the even-numbered island and tangent to an edge of the even-numbered island, which is far away from the power side pin, in a longitudinal direction of the even-numbered island, a central axis of the power module extending transversely is a third straight line, the first straight line and the second straight line are located on the same side of the third straight line, and the pinhole corresponding to the odd-numbered island intersects with the third straight line.

According to some embodiments of the utility model, 1 screw hole and 2 demolding holes are respectively arranged on two sides of the package body in the length direction and symmetrical with respect to the center line of the package body in the length direction, the center of the screw hole coincides with the center line of the package body in the width direction, and the 2 demolding holes are arranged on the back surface of the package body and symmetrical with the center line of the package body in the width direction.

According to some embodiments of the utility model, an intersection point of the screw hole and the center line of the width direction of the package body, which is close to the inner side of the package body, is defined as a point A, an intersection point of a connecting line of the centers of the two demolding holes and the center line of the width direction of the package body is defined as a point B, and then the point B is located between the center of the screw hole and the point A.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1-5 are schematic side views of a power module during a plastic packaging process according to an embodiment of the utility model;

FIG. 6 is a schematic view of the lower surface of the thimble support frame according to an embodiment of the present utility model;

FIG. 7 is a schematic view of a configuration of a thimble disengaged from a lower surface of a supporting frame according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a structure of a base island according to an embodiment of the utility model;

FIG. 9 is a schematic diagram of a distribution of pinhole locations according to an embodiment of the present utility model;

FIG. 10 is a schematic diagram of a backside pinhole on a package according to an embodiment of the present utility model;

fig. 11 is a schematic view of a front pinhole on a package according to an embodiment of the present utility model.

Reference numerals:

100. a power module;

10. a frame; 11. a base island; 12. odd number islands; 13. even number of islands; 14. a first island; 15. second base

An island; 16. a third island; 17. a fourth island;

20. a package; 21. a pinhole; 22. a front pinhole; 221. a first front pinhole; 222. a second front pinhole; 23. a back pinhole; 231. a first back pinhole; 232. a second back pinhole; 233. a third back pinhole; 234. a fourth back pinhole; 235. a fifth back pinhole;

30. a first straight line; 31. a second straight line; 32. a third straight line; 33. a fourth straight line;

40. a thimble; 41. a needle ejection plate; 42. a small hole; 43. reaming; 44. a thimble sleeve;

50. screw holes; 51. a demolding hole;

60. a power side pin.

Detailed Description

Embodiments of the present utility model will be described in detail below, by way of example with reference to the accompanying drawings.

A power module 100 according to an embodiment of the present utility model is described below with reference to fig. 1-11.

As shown in fig. 1 to 9, a power module 100 according to an embodiment of the present utility model includes: the power module comprises a frame 10, a plurality of power chips and a package body 20, wherein the frame 10 comprises a plurality of base islands 11 and a plurality of power side pins 60, the plurality of base islands 11 and the plurality of power side pins 60 are arranged at intervals in the transverse direction of the power module 100, one ends of the plurality of power side pins 60 are connected with the plurality of base islands 11, the plurality of power chips are arranged on the plurality of base islands 11, the package body 20 packages the plurality of base islands 11, the surface, which is closer to the base islands 11, of two opposite surfaces of the package body 20 in the thickness direction is the back surface of the package body, the surface, which is farther from the base islands 11, of the two opposite surfaces of the package body 20 in the thickness direction is the front surface of the package body, a plurality of front pinholes 22 are formed on the front surface of the package body, a plurality of back pinholes 23 are formed on the back surface of the package body, the base islands 11 at two ends of the transverse direction are respectively corresponding to the front pinholes 22, each base island 11 is corresponding to at least one back pinhole 23, one end of the plurality of power side pins 60 is arranged in the package body 20, and the other ends of the plurality of power side pins 60 extend out of the package body 20.

Specifically, as shown in fig. 1 to 9, the plurality of islands 11 in the frame 10 are arranged at intervals in the transverse direction of the power module 100, that is, in the length direction of the power module 100, the plurality of islands 11 are arranged at intervals, chips with different functions can be arranged on the different islands 11, some islands 11 are used for placing lower bridge chips in an inverter circuit, other islands 11 are used for placing upper bridge chips in an inverter circuit, in order to package the plurality of islands 11 with the package 20, the package 20 can be resin, the islands 11 need to be filled with the resin for plastic packaging, after the plastic packaging is completed, a plurality of front pinholes 22 are formed on the front face of the package, when the package 20 is injected, the ejector pins 40 pass through the front pinholes 22 to support the frame 10, and a plurality of back pinholes 23 are formed on the back face of the package 20, when the package 20 is injected, the ejector pins 40 penetrate through the back pinholes 23 to support the frame 10, and in the plastic packaging process, the front pinholes 22 can facilitate the ejector pins 40 penetrating through the front of the package body 20 to support the lower surface of the frame 10, or the ejector pins 40 penetrating through the lower surface of the frame 10 to support the front of the package body 20 to leave pinholes 21, the plurality of back pinholes 23 can also facilitate the ejector pins 40 penetrating through the back of the package body 20 to support the lower surface of the frame 10, so that the frame 10 can be supported in different directions, the plastic packaging speed can be increased, and the islands 11 at two transverse ends respectively correspond to the front pinholes 22 and can be molded together with the back pinholes 23, each island 11 corresponds to at least one back pinhole 23, and when the package body 20 is injected, the ejector pins 40 penetrate through the back pinholes 23 to support each island 11, the service life of the package mold can be prolonged, and the product miniaturization of the power module 100 can be further facilitated. Moreover, since the arrangement position of the front pinhole 22 is the same as that of other power modules, the same packaging mold as that of other power modules (such as a power module with DBC and exposed surface on one side of DBC) can be used at the front of the package, so that development of the front packaging mold can be omitted, the universality of the packaging mold can be improved, the development period can be shortened, and the development cost can be reduced.

Therefore, the front surface of the package body is provided with a plurality of front pinholes 22, and the back surface of the package body is provided with a plurality of back pinholes 23, so that the frame 10 can be supported in different directions in the plastic packaging process, the plastic packaging rate can be accelerated, and the fully-packaged power module arranged in this way can share the packaging die with other semi-packaged power modules (such as power modules with DBC and exposed surface on one side of DBC) on the front surface of the package body, thereby improving the universality of the packaging die, shortening the research and development period and reducing the research and development cost.

According to some embodiments of the present utility model, as shown in fig. 10, in the longitudinal direction of the base island 11, the plurality of pinholes 21 are disposed on a side of the base island 11 away from the power side pins 60, so that the power side pins 60 can avoid interference of the pins 40 corresponding to the plurality of pinholes 21 during the molding process.

According to some embodiments of the present utility model, as shown in fig. 9, the back pinholes 23 corresponding to two adjacent islands 11 are at least partially offset in the lateral direction of the power module 100.

Because the appropriate distance d is designed from the lower surface of the frame 10 to the surface of the colloid, the larger the distance d is, the filling of the resin in the plastic packaging process is facilitated, the frame 10 is pressed down by the flowing resin to generate deformation due to the characteristic of filling flow of the resin, the distance d is further reduced, the heat dissipation performance of the product is deteriorated due to low heat conductivity of the resin, small holes 42 are easy to appear in the thinned area of the flowing resin which is pressed down and deformed by the frame 10, packaging is not utilized, and in order to avoid the generation of the small holes 42 and achieve both the heat dissipation performance of the product and the filling performance of the plastic packaging resin, a thimble 40 is needed to be added in a packaging die to support the lower surface of the frame 10.

Specifically, the packaging mold comprises a thimble 40, a thimble plate 41 and a thimble sleeve 44, wherein the thimble 40 passes through a cavity and the thimble plate 41 and is fixed by a bottom plate, the thimble 40 is ejected by an oil way provided with power to the thimble 40, after the oil way power is cut off, the thimble 40 is reset by a reset spring action or a reverse oil way, the reset positions of the thimble sleeve 44 and the thimble 40 are generally set to be higher than the cavity surface of the mold, so that resin can be prevented from being filled into the cavity and the thimble sleeve 44, two cylindrical grooves, namely pinholes 21, can be formed on a final product, and the thimble 40 is designed to be a telescopic thimble 40.

Because the ejector pins 40 need to penetrate through the ejector pin plate 41 to perform plastic packaging on two adjacent islands 11, the two adjacent islands 11 perform plastic packaging and correspond to the two adjacent counterbores 43 on the ejector pin plate 41, so that interference of the adjacent counterbores 43 on the ejector pin plate 41 is avoided, the strength design requirement of the ejector pin plate 41 is met, the distance between the adjacent islands 11 of the frame 10 in the transverse direction is not required to be changed, so that the product is miniaturized, the pinholes 21 corresponding to the two adjacent islands 11 need to be at least partially arranged in a staggered manner in the transverse direction of the power module 100, and therefore, the staggered ejector pins 40 are designed to enable the two adjacent counterbores 43 on the ejector pin plate 41 not to interfere with each other, so that the strength design requirement of the ejector pin plate 41 can be improved, the service life of a die can be prolonged, and the product miniaturization of the power module 100 can be facilitated.

According to some embodiments of the present utility model, as shown in fig. 8 and 9, the plurality of islands 11 includes: the odd-numbered base islands 12 and the even-numbered base islands 13 are staggered in the transverse direction of the power module 100, the central connecting line of the back pinholes 23 corresponding to the odd-numbered base islands 12 is a first straight line 30, the central connecting line of the back pinholes 23 corresponding to the even-numbered base islands 13 is a second straight line 31, and the first straight line 30 and the second straight line 31 are parallel to each other and extend along the transverse direction of the power module 100. The pin holes 21 corresponding to the odd-numbered islands 12 and the even-numbered islands 13 are also staggered in the transverse direction, the pin plates 41 penetrated by the pins 40 are provided with the counterbores 43 corresponding to the odd-numbered islands 12 and the even-numbered islands 13, so that the counterbores 43 corresponding to the odd-numbered islands 12 and the even-numbered islands 13 are correspondingly staggered in the transverse direction of the pin plates 41, interference of the counterbores 43 corresponding to the odd-numbered islands 12 and the even-numbered islands 13 arranged on the pin plates 41 can be avoided, stress concentration of the pin plates 41 can be prevented, the strength of the pin plates 41 can be ensured, the center line of the back pin holes 23 corresponding to the odd-numbered islands 12 is the first straight line 30, the center line of the back pin holes 23 corresponding to the even-numbered islands 13 is the second straight line 31, and correspondingly, the center line of the counterbores 43 corresponding to the odd-numbered islands 12 and the even-numbered islands 13 on the pin plates 41 is also divided into two straight lines, and the first straight lines 30 and the second straight lines 31 are parallel to each other, and the first straight lines 30 and the second straight lines 31 extend along the transverse direction of the power module 100, so that the two straight lines formed by the center lines of the pin 43 on the pin plates 41 are parallel to each other, and the stress of the pin plates 41 can be more uniformly stressed in the transverse direction.

According to some embodiments of the present utility model, as shown in fig. 9, a central axis of the power module 100 extending in a lateral direction is a third straight line 32, a central line of the front pinholes 22 is a fourth straight line 33, and the third straight line 32 and the fourth straight line 33 are parallel to each other. The third straight line 32 and the fourth straight line 33 extending transversely of the power module 100 are arranged in parallel, so that the plurality of ejector pins 40 can be arranged in different directions conveniently, interference can be avoided, and deformation of the frame 10 can be prevented.

According to some embodiments of the present utility model, as shown in fig. 9, the first straight line 30 and the second straight line 31 are located between the third straight line 32 and the fourth straight line 33, so that the arrangement of the ejector pins 40 in the package mold may be further facilitated.

According to an embodiment of the present utility model, as shown in fig. 8 and 9, the plurality of islands 11 includes: the first base island 14, the second base island 15, the third base island 16 and the fourth base island 17 are sequentially arranged, the first base island 14 and the third base island 16 are odd base islands 12, the second base island 15 and the fourth base island 17 are even base islands 13, and the plurality of front pinholes 22 comprise: a first front surface pinhole 22 and a second front surface pinhole 22, and a plurality of back surface pinholes 23 include: the first back side pinhole 231, the second back side pinhole 232, the third back side pinhole 233, the fourth back side pinhole 234, and the fifth back side pinhole 235, in the vertical direction of the power module 100, the first front side pinhole 22 corresponds to the first island 14, the second front side pinhole 22 corresponds to the fourth island 17, the first back side pinhole 231 corresponds to the first island 14, the second back side pinhole 232 corresponds to the second island 15, the third back side pinhole 233 corresponds to the third island 16, and the fourth back side pinhole 234 and the fifth back side pinhole 235 each correspond to the fourth island 17. Specifically, in the vertical direction of the power module 100, that is, in the thickness direction of the power module 100, the front surface of the package body 20 and the ejector plate 41 are formed with the counterbores 43 corresponding to the first front surface pinhole 22 and the second front surface pinhole 22, and the rear surface of the package body 20 and the ejector plate 41 are formed with the counterbores 43 corresponding to the first rear surface pinhole 231, the second rear surface pinhole 232, the third rear surface pinhole 233, the fourth rear surface pinhole 234 and the fifth rear surface pinhole 235, so that interference between the counterbores 43 of the ejector plate 41 adapted thereto can be avoided, and in the plastic packaging process, the fourth rear surface pinhole 234 and the fifth rear surface pinhole 235 support the fourth base island 17 through the ejector pins 40 penetrating therethrough, so that the fourth base island 17 can be prevented from tilting.

According to some embodiments of the present utility model, as shown in fig. 9, the center distance of the first front needle hole 22 and the second front needle hole 22 is d1, the center distance of the first back needle hole 231 and the fifth back needle hole 235 is d2, and d1 and d2 satisfy the relationship: d1 > d2, so, in the plastic packaging process, the positions of the thimble 40 of the first front pinhole 22 and the thimble 40 of the second front pinhole 22, the thimble 40 of the first back pinhole 231 and the thimble 40 of the fifth back pinhole 235 can be prevented from being completely overlapped, and the positioning of the base island 11 in the package body 20 can be facilitated.

According to some embodiments of the present utility model, as shown in fig. 9, the projection of the back pinholes 23 corresponding to the odd-numbered islands 12 onto the corresponding odd-numbered islands 12 is located within the odd-numbered islands 12 and tangential to the edges of the odd-numbered islands 12 in the longitudinal direction away from the power side pins 60. This facilitates the arrangement of the ejector pins 40 and also ensures the supporting effect on each of the islands 11, so that deformation thereof can be avoided.

According to some embodiments of the present utility model, the projections of the pinholes 21 corresponding to the even-numbered islands 13 on the corresponding even-numbered islands 13 are located in the even-numbered islands 13, the pinholes 21 are tangential to the edges of the even-numbered islands 13, which are far away from the power-side pins 60, in the longitudinal direction of the even-numbered islands 13, the central axis of the power module 100 extending transversely is a third straight line 32, the first straight line 30 and the second straight line 31 are located on the same side of the third straight line 32, and the pinholes 21 corresponding to the odd-numbered islands 12 intersect the third straight line 32, so that the arrangement of the ejector pins 40 can be facilitated, and the space in the power module 100 can be reasonably utilized, so that a plurality of power chips can be packaged in the power module 100.

According to some embodiments of the present utility model, as shown in fig. 9, 1 screw hole 50 and 2 demolding holes 51 are respectively provided on both sides of the package 20 in the length direction and symmetrical with respect to the center line of the package 20 in the length direction, the center of the screw hole 50 coincides with the center line of the package 20 in the width direction, and the 2 demolding holes 51 are provided on the back of the package and symmetrical with the center line of the package 20 in the width direction. Wherein, the center of the screw hole 50 coincides with the center line of the width direction of the package 20, so that the package 20 can be conveniently fixed, and in addition, 2 demolding holes 51 are arranged on the back of the package, and the 2 demolding holes 51 are symmetrical with the center line of the width direction of the package 20, so that damage to the package 20 can be avoided in the demolding process, and deformation of the package 20 can be avoided.

According to the embodiment of the present utility model, as shown in fig. 9, the intersection of the screw hole 50 and the center line of the package body 20 in the width direction, and the intersection near the inside of the package body 20 is defined as a point a, the intersection of the center line of the two mold release holes 51 and the center line of the package body 20 in the width direction is defined as a point B, and the point B is located between the center of the screw hole 50 and the point a. In this way, demolding can be facilitated, damage to the package body 20 in the demolding process can be avoided, the service life of the packaging mold can be prolonged, and miniaturization of the product of the power module 100 can be facilitated.

According to some embodiments of the utility model, the plurality of power chips comprises: three low-voltage power chips and three high-voltage power chips, three low-voltage power chips set up respectively in first base island 14, second base island 15 and third base island 16, and three high-voltage power chips all set up on fourth base island 17 and set up at the horizontal interval of power module 100, and three low-voltage power chips and three high-voltage power chips all are located frame 10 and face towards the encapsulation body front. Each low-voltage base island 11 is correspondingly provided with one low-voltage power chip, each high-voltage base island 11 is provided with three high-voltage power chips, each power chip can be composed of two chips of Insulated Gate Bipolar Transistors (IGBTs) and field effect transistors (FRDs), and can also be composed of 1 RC-IGBT (IGBTs and FRDs are integrated in one chip), so that the power module 100 comprising a plurality of low-voltage power chips and high-voltage power chips can be smaller in size, and miniaturization of products can be achieved.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A power module, comprising:

the frame comprises a plurality of base islands and a plurality of power side pins, and the base islands and the power side pins are respectively arranged at intervals in the transverse direction of the power module; one end of each power side pin is connected with each base island;

the power chips are arranged on the base islands;

the packaging body packages a plurality of base islands, the surface, which is closer to the base islands, of two opposite surfaces of the packaging body in the thickness direction is the back of the packaging body, the surface, which is farther away from the base islands, of the two opposite surfaces of the packaging body in the thickness direction is the front of the packaging body, a plurality of front pinholes are formed on the front of the packaging body, a plurality of back pinholes are formed on the back of the packaging body, the base islands at two transverse ends respectively correspond to the front pinholes, each base island corresponds to at least one back pinhole, one ends of the power side pins are positioned in the packaging body, and the other ends of the power side pins extend out of the packaging body.

2. The power module of claim 1, wherein a plurality of the pinholes are provided in a longitudinal direction of the submount on a side of the submount remote from the power side pins.

3. The power module of claim 1, wherein the back pinholes corresponding to two adjacent islands are at least partially offset in a lateral direction of the power module.

4. A power module in accordance with claim 3, wherein a plurality of said islands comprise: the power module comprises odd-numbered base islands and even-numbered base islands, wherein the odd-numbered base islands and the even-numbered base islands are arranged in a staggered manner in the transverse direction of the power module, the central connecting line of a back needle hole corresponding to the odd-numbered base islands is a first straight line, the central connecting line of the back needle hole corresponding to the even-numbered base islands is a second straight line, and the first straight line and the second straight line are parallel to each other and extend in the transverse direction of the power module.

5. The power module of claim 4, wherein a central axis of the power module extending transversely is a third straight line, and a central line of the front pinholes is a fourth straight line, and the third straight line and the fourth straight line are parallel to each other.

6. The power module of claim 5, wherein the first line and the second line are located between the third line and the fourth line.

7. The power module of claim 5, wherein a plurality of the islands comprise: the first base island, the second base island, the third base island and the fourth base island that arrange in order, first base island with the third base island is the odd base island just the second base island with the fourth base island is the even base island, a plurality of openly pinhole includes: first front pinhole and second front pinhole, a plurality of back pinholes include: the power module comprises a first back needle hole, a second back needle hole, a third back needle hole, a fourth back needle hole and a fifth back needle hole, wherein the first front needle hole corresponds to a first base island, the second front needle hole corresponds to a fourth base island, the first back needle hole corresponds to the first base island, the second back needle hole corresponds to a second base island, the third back needle hole corresponds to a third base island, and the fourth back needle hole and the fifth back needle hole correspond to the fourth base island in the vertical direction of the power module.

8. The power module of claim 7, wherein the first front side pinhole and the second front side pinhole have a center distance d1, the first back side pinhole and the fifth back side pinhole have a center distance d2, and d1 and d2 satisfy the relationship: d1 > d2.

9. The power module of claim 7 wherein a plurality of the power chips further comprise: the three low-voltage power chips and the three high-voltage power chips are respectively arranged on the first base island, the second base island and the third base island, the three high-voltage power chips are respectively arranged on the fourth base island and are arranged at intervals in the transverse direction of the power module, and the three low-voltage power chips and the three high-voltage power chips are respectively arranged on the front face of the frame towards the packaging body.

10. The power module of claim 4, wherein a projection of the back pinholes corresponding to the odd islands onto the corresponding odd islands is within the odd islands and tangential to edges of the odd islands in a longitudinal direction away from the power side pins.

11. The power module of claim 4, wherein a projection of the pinhole corresponding to the even-numbered land on the corresponding even-numbered land is located in the even-numbered land and tangent to an edge of the even-numbered land in a longitudinal direction away from the power-side pin, a central axis of the power module extending transversely is a third straight line, the first straight line and the second straight line are located on the same side of the third straight line, and the pinhole corresponding to the odd-numbered land intersects the third straight line.

12. The power module according to claim 1, wherein 1 screw hole and 2 demolding holes are respectively provided on both sides of the package body in the length direction symmetrically with respect to the center line of the package body in the length direction, the center of the screw hole coincides with the center line of the package body in the width direction, and the 2 demolding holes are provided on the back surface of the package body and symmetrically with the center line of the package body in the width direction.

13. The power module of claim 12, wherein an intersection of the screw hole with the package width direction centerline and near the package inside is defined as point a, an intersection of two of the stripper hole center lines with the package width direction centerline is defined as point B, and the point B is located between the screw hole center and point a.