CN115527957B - Cavity packaging structure and packaging method - Google Patents
Cavity packaging structure and packaging method Download PDFInfo
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- CN115527957B CN115527957B CN202211505260.5A CN202211505260A CN115527957B CN 115527957 B CN115527957 B CN 115527957B CN 202211505260 A CN202211505260 A CN 202211505260A CN 115527957 B CN115527957 B CN 115527957B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a cavity packaging structure and a packaging method, wherein the cavity packaging structure comprises: the packaging frame comprises a base island and pins arranged around the periphery of the base island, wherein one side of each pin is provided with a protruding retaining wall; the upper cover is fixedly connected with the retaining wall, and a cavity is defined by the upper cover and the packaging frame together; at least part of the plastic packaging layer plastically packages the retaining wall to one side of the packaging frame; wherein a top surface of the molding layer is used to form a cutting feature. The cutting characteristic convenient to identify is formed on the plastic packaging layer, and in the cutting process, the cutting is carried out along the preset cutting characteristic, so that the cutting accuracy of the cutting process can be effectively improved, the cutting efficiency is improved, and the product yield is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a cavity packaging structure and a packaging method.
Background
QFN (Quad Flat No-lead Package) is an emerging surface mount chip packaging technology with high density, small volume and plastic packaging material as sealing material. The QFN package is usually square or rectangular, a large-area exposed base island is arranged at the center of the bottom of a package frame, the base island has a heat conduction effect, and pins for realizing electrical connection are arranged on the periphery of the base island; the chip is attached to one side of the base island, and the chip welding pad is connected with the pin in a routing mode. The QFN package is different from a conventional DIP or SOP package in that the conductive path between the leads and the pads on the circuit board after surface mounting of the QFN package is short, the self-inductance and the wiring resistance in the package are low, and thus good electrical performance can be provided. Because QFN packages have low package thermal resistance and loss, better high frequency performance, and lower dielectric constant, they have good applications in RF chips (radio frequency chips), microwave chips, and millimeter wave chips.
As shown in fig. 1, the cavity QFN package adopts a cavity type pre-package frame 1 and a planar cover 2 fixedly connected by an adhesive 3, a cavity is formed between the planar cover 2 and the pre-package frame 1, and then the cavity is cut into a single cavity package structure. Before packaging, the pre-encapsulation frame 1 is to inject liquefied epoxy resin into a groove of a concave-convex mold, and perform plastic encapsulation on the central base island 4 and the peripheral pins 5 to form a pre-filling material 9 between the base island 4 and the pins 5 and a pre-encapsulation retaining wall 8 on the peripheral pins 5. The base island 4 of the pre-packaging frame 1 is also provided with a chip 6, and a welding pad of the chip 6 is connected with the pin 5 through a metal wire 7 in a routing way.
Because the pre-packaged frame 1 has no cutting path mark, the operation in the cutting process is difficult, manual alignment is needed, the operation efficiency is low, and abnormal cutting is easy.
In view of the above, there is a need to optimize and improve the packaging process, so as to overcome the problems of inconvenient cutting operation, low cutting efficiency and low yield in the conventional cavity-type QFN packaging process.
Disclosure of Invention
The invention solves the problem of how to improve the current situations of inconvenient cutting operation, low cutting efficiency and low yield in the existing cavity QFN packaging process.
In order to solve the above problems, the technical solution of the present invention provides a cavity package structure, including: the packaging frame comprises a base island and pins arranged around the periphery of the base island, wherein one side of each pin is provided with a protruding retaining wall; the upper cover is fixedly connected with the retaining wall, and a cavity is defined by the upper cover and the packaging frame together; and at least part of the plastic packaging layer plastically packages the retaining wall to one side of the packaging frame, wherein the top surface of the plastic packaging layer is used for forming cutting features.
As an optional technical scheme, the retaining wall and the upper cover are plastically packaged to one side of the packaging frame by the plastic packaging layer.
As an optional technical solution, the top surface of the plastic package layer is higher than the surface of the upper cover on the side away from the cavity, and the plastic package layer at least covers the peripheral area of the upper cover.
As an optional technical solution, the top surface of the plastic package layer is lower than or flush with the surface of one side of the upper cover away from the cavity; when the top surface of the plastic package layer is lower than the surface of one side of the upper cover, which is far away from the cavity, a window is formed between the plastic package layer and the upper cover.
As an optional technical scheme, the upper cover and the retaining wall are fixedly connected through adhesive, wherein the adhesive is exposed out of the window.
As an optional technical scheme, a chip or a component is arranged on the base island, and a welding pad of the chip or the component is electrically connected with the pin; wherein the chip or the component is located in the cavity.
The invention also provides a packaging method, which comprises the following steps:
providing a pre-plastic package material, wherein the pre-plastic package material is used for plastically packaging a packaging frame, forming a filling material between a base island and a pin of the packaging frame, and forming a protruding retaining wall on the pin;
providing a plastic packaging material, and plastically packaging the retaining wall to one side of the packaging frame by using the plastic packaging material to form a plastic packaging layer;
preparing a cutting feature on a top surface of the plastic encapsulation layer; and
and cutting along the cutting features to obtain the cavity packaging structure.
As an optional technical solution, providing a plastic package material, wherein before or after the step of plastically packaging the retaining wall to one side of the package frame to form a plastic package layer, the plastic package material further comprises: providing an upper cover, and coating viscose glue on one side of the upper cover or the retaining wall; the viscose fixed connection the upper cover to barricade one side, the upper cover with the encapsulation frame limits out a cavity jointly.
As an optional technical solution, the step of preparing the cutting feature on the top surface of the plastic package layer includes: forming a recess on the top surface of the plastic packaging layer in a laser cutting or etching or mold injection molding mode; wherein the recess serves as the cutting feature.
As an optional technical scheme, the top surface is higher than or lower than or flush with the surface of one side, away from the cavity, of the upper cover.
Compared with the prior art, the cavity packaging structure comprises the plastic packaging layer formed on the outer side of the retaining wall of the packaging frame, and the cutting feature convenient to identify is formed on the plastic packaging layer. In addition, the plastic package layer is coated on the outermost side of the cavity packaging structure, and the air tightness of the cavity can be effectively improved. Furthermore, the plastic package layer can also be used for limiting the upper cover so as to ensure that the alignment between the upper cover and the packaging frame is more accurate; or a window is formed between the plastic packaging layer and the upper cover, so that the glue discharging condition of the glue between the upper cover and the retaining wall of the packaging frame can be visually checked.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a side view of a conventional cavity package structure.
Fig. 2 is a schematic side view of a cavity package structure according to an embodiment of the invention.
Fig. 3 is a schematic top view of the package frame in fig. 2.
Fig. 4 is a schematic side view illustrating a manufacturing process of the cavity package structure in fig. 2.
Fig. 5 is a schematic side view of a cavity package structure according to another embodiment of the invention.
Fig. 6 is a schematic side view illustrating a process of manufacturing the cavity package structure of fig. 5.
Fig. 7 is a schematic side view of a cavity package structure according to another embodiment of the invention.
Fig. 8 is a schematic side view illustrating a process of manufacturing the hollow package structure of fig. 7.
Fig. 9 is a flowchart of a packaging method provided in another embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to embodiments and accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention aims to provide a cavity packaging structure and a packaging method thereof, which are used for solving the problems of low cutting precision, efficiency and yield of the cutting process of the conventional QFN packaging process. In order to overcome the problems, a secondary plastic packaging process is introduced on the basis of the existing packaging process, and cutting features are formed on a plastic packaging layer of the secondary plastic packaging process, so that cutting accuracy of the cutting process can be effectively improved, cutting efficiency is improved, and product yield is improved by cutting along the cutting features in the cutting process. In addition, the plastic packaging layer formed by the secondary plastic packaging process is coated on the outermost side of the cavity packaging structure, and the air tightness of the cavity can be effectively improved. Furthermore, the plastic packaging layer formed by the secondary plastic packaging process can also be used for limiting the upper cover, so that the alignment between the upper cover and the packaging frame is more accurate.
As shown in fig. 2 to 4, in an embodiment of the present invention, a cavity package structure 100 is provided, which includes: the packaging frame 10 comprises a base island 40 and a pin 50 surrounding the periphery of the base island 40, wherein a protruding retaining wall 80 is arranged on one side of the pin 50; the upper cover 20 is fixedly connected to the retaining wall 80, and the upper cover 20 and the package frame 10 together define a cavity 102; and the plastic packaging layer 101 surrounds the outer surface of the retaining wall 80, and the plastic packaging layer 101 plastically packages the retaining wall 80 and the upper cover 20 to one side of the package frame 10.
As shown in fig. 3 and 4, in the cavity package structure 100, the upper cover 20 and the package frame 10 are fixed in advance by the adhesive 30, a cavity 102 between the upper cover 20 and the package frame 10 is formed in advance, and then the retaining wall 80 and the outer side of the upper cover 20 are filled with a molding compound to form a molding compound layer 101, wherein a top surface 104 of the molding compound layer 101 is higher than an outer side surface of the upper cover 20 away from the cavity 102. Preferably, the molding layer 101 is disposed around the periphery of the upper cover 20.
With continued reference to fig. 4, the top surface 104 of the molding layer 101 is formed with cutting features 103, and the cutting features 103 are, for example, recesses formed on the top surface 104, wherein the recesses can be formed by laser cutting, etching, injection molding, and the like. In the dicing process, the dicing tool performs dicing along the recesses, thereby obtaining the individual cavity package structures 100. In other embodiments of the present invention, the cutting feature may be other easily identifiable cutting marks, such as a cutting line comprising a plurality of discrete protrusions or grooves.
In the packaging manufacturing process of the cavity packaging structure 100, the cavity 102 is formed first, then plastic packaging is performed, and the retaining wall 80 and the upper cover 20 are subjected to plastic packaging together by the plastic packaging layer 101, so that the air tightness of the cavity 102 is improved, and the packaging stability of the cavity packaging structure is improved.
As shown in fig. 2 and 3, the package frame 10 is, for example, a QFN package frame, the base island 40 and the leads 50 are molded with a pre-molding compound, a pre-filling material 90 is formed between the leads 50 and the base island 40, and the retaining walls 80 are formed on the leads 50, that is, the retaining walls 80 and the pre-filling material 90 are formed in a single molding process. It should be noted that, in other embodiments of the present invention, the pre-molding compound may first mold the base island and the pins, and then form the protruding retaining walls at the pins.
As shown in fig. 3, the flat package substrate includes, for example, a plurality of package frames 10 arranged in an array, and the retaining walls 80 are formed by injection molding, so that a plastic mold can be selected, and the spacing between the retaining walls 80 of adjacent package frames 10 can be reduced, so as to arrange more package frames 10 on the package substrate, thereby increasing the arrangement density of the package frames 10 in the package substrate, increasing the number of package structures in a unit area, and reducing the package cost.
Further, a chip or device 60 is mounted on the base island 40, and a bonding pad of the chip or device 60 is wire-bonded to the pin 50 through a metal wire 70. The chip or component 60 and the metal lines 70 are co-located in the cavity 102.
In this embodiment, the retaining wall 80 is located on the leads 50, and preferably, the retaining wall 80 protrudes from the middle portion of the leads 50. In addition, the retaining wall 80 is disposed around the periphery of the foundation island 40 and has a ring structure.
It should be noted that, since the cavity package structure 100 is a package structure based on a QFN package frame, when the cavity package structure 100 is mounted on a circuit board, the leads 50 need to be electrically connected to pads on the circuit board, and therefore, after being cut along the cutting feature 103, the plastic package layer 101 covers the outer peripheral surface of the retaining wall 80.
In addition, referring to fig. 4, the cutting feature 103 on the top surface 104 of the molding layer 101 is opposite to at least a partial region of the lead 50 located outside the retaining wall 80.
As shown in fig. 5 and 6, the present invention further provides a cavity package structure 200, which is different from the cavity package structure 100 in that in the cavity package structure 200, a molding layer 201 is formed before a cavity 202, preferably, a top surface 204 of the molding layer 201 is higher than a highest position of a retaining wall 80, and a portion of the molding layer 201 higher than the retaining wall 80 limits the position of the upper cover 20, so as to improve the accuracy of the alignment between the upper cover 20 and the package frame 10.
Specifically, after the package frame 10 completes the mounting and wire bonding of the chip or device 60, a mold and a molding compound are provided, a molding layer 201 is formed on the outer peripheral surface of the retaining wall 80, and a cutting feature 203 is formed on a top surface 204 of the molding layer 201, preferably, the cutting feature 203 is a concave portion, and the concave portion is opposite to at least a partial region of the lead 50. The concave part and the plastic package layer 201 are formed by one-time injection molding of a mold. The top surface 204 of the plastic package layer 201 is higher than the retaining wall 80, and the higher portion is surrounded on the outer side of the retaining wall 80 to define an assembly cavity, the adhesive 30 is coated on the upper cover 20, the adhesive 30 is opposite to the top of the retaining wall 80, the upper cover 20 is assembled into the assembly cavity, the alignment of the upper cover 20 and the retaining wall 80 is completed, and the closed cavity 202 is formed.
As shown in fig. 5 and 6, the top surface 204 of the molding layer 201 is substantially flush with a side surface of the upper cover 20 away from the cavity 202, for obtaining a flat package structure. The plastic package layer 201 covers the side of the upper cover 20, so that the air tightness of the cavity 202 is improved.
As shown in fig. 7 and 8, the present invention further provides a cavity package structure 300, which is different from the cavity package structure 100 in that in the cavity package structure 300, a molding compound 301 is formed in front of a cavity 302, preferably, a top surface 304 of the molding compound 301 is lower than the highest position of the retaining wall 80, a window 306 is formed between the top surface 304 of the molding compound 301 and the upper cover 20, and the window 306 is used for detecting the fixing condition between the upper cover 20 and the retaining wall 80.
Specifically, after the package frame 10 is mounted and wire-bonded with the chip or device 60, a mold and a molding compound are provided, a molding layer 301 is formed on the outer peripheral surface of the dam 80, and a cutting feature 303 is formed on a top surface 304 of the molding layer 301, preferably, the cutting feature 303 is a T-shaped recess, and a lowest position 305 of the T-shaped recess is opposite to at least a partial region of the lead 50. Wherein, the T-shaped concave part and the plastic package layer 301 are formed by one-time injection molding of a mold. The upper cover 20 is coated with the adhesive 30, the adhesive 30 is opposite to the top of the retaining wall 80, and the upper cover 20 is assembled to complete the fixed connection of the upper cover 20 and the retaining wall 80 to form the closed cavity 302.
A window 306 is formed between the upper cover 20 and the top surface 304 of the plastic package layer 301, and the adhesive 30 is exposed from the window 306, so that the connection condition between the adhesive 30 and the upper cover 20 and the retaining wall 80 can be visually detected.
In addition, in the cutting process of the present embodiment, the cutting tool cuts along the lowest position 305 of the T-shaped recess.
As shown in fig. 9, the present invention further provides a packaging method, which includes:
providing a pre-plastic package material, wherein the pre-plastic package material is used for plastically packaging a packaging frame, a filling material is formed between a base island and a pin of the packaging frame, and a protruding retaining wall is formed on the pin;
providing a plastic packaging material, and plastically packaging the retaining wall to one side of the packaging frame by using the plastic packaging material to form a plastic packaging layer;
preparing a cutting feature on a top surface of the plastic encapsulation layer; and
and cutting along the cutting features to obtain the cavity packaging structure.
In the above packaging method, before or after the step of forming the plastic package layer from the plastic package material plastic package retaining wall to one side of the package frame, the method further comprises: providing an upper cover, and coating viscose glue on one side of the upper cover or the retaining wall; the viscose is fixedly connected with the upper cover to one side of the retaining wall, and the upper cover and the packaging frame define a cavity together.
In a preferred embodiment, the step of preparing the cutting feature on the top surface of the molding layer comprises: forming a recess on the top surface by laser cutting or etching or die injection; wherein the recess serves as the cutting feature.
In a preferred embodiment, the top surface is higher than, lower than or flush with a side surface of the upper cover away from the cavity.
The invention provides a cavity packaging structure and a packaging method thereof, wherein the cavity packaging structure comprises a plastic packaging layer formed on the outer side of a retaining wall of a packaging frame, and cutting features convenient to identify are formed on the plastic packaging layer. In addition, the plastic package layer is coated on the outermost side of the cavity packaging structure, and the air tightness of the cavity can be effectively improved. Furthermore, the plastic package layer can also be used for limiting the upper cover so as to ensure that the alignment between the upper cover and the packaging frame is more accurate; or a window is formed between the plastic packaging layer and the upper cover, so that the glue discharging condition of the glue between the upper cover and the retaining wall of the packaging frame can be visually checked.
The technical features of the different embodiments of the present invention may be combined with each other as long as they do not conflict with each other. It is to be noted that the present invention may take various other embodiments, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A cavity package structure, comprising:
the packaging frame comprises a base island and pins arranged around the periphery of the base island, wherein one side of each pin is provided with a protruding retaining wall;
the upper cover is fixedly connected with the retaining wall, and a cavity is defined by the upper cover and the packaging frame together; and
the plastic packaging layer is used for plastically packaging the retaining wall to one side of the packaging frame;
wherein a top surface of the molding layer is used to form a cutting feature.
2. The cavity packaging structure according to claim 1, wherein the molding compound molds the dam and the upper cover to a side of the packaging frame.
3. The cavity package structure of claim 2, wherein the top surface of the molding layer is higher than a side surface of the upper cover away from the cavity, and the molding layer covers at least a peripheral region of the upper cover.
4. The cavity packaging structure of claim 1, wherein a top surface of the molding layer is lower than or flush with a side surface of the upper cover away from the cavity;
when the top surface of the plastic package layer is lower than the surface of one side of the upper cover, which is far away from the cavity, a window is formed between the plastic package layer and the upper cover.
5. The cavity packaging structure of claim 4, wherein the top cover is fixedly connected to the retaining wall by an adhesive, and the adhesive is exposed from the window.
6. The cavity packaging structure according to claim 1, wherein a chip or a component is disposed on the base island, and a pad of the chip or the component is electrically connected to the pin; wherein the chip or the component is located in the cavity.
7. A method of packaging, the method comprising:
providing a pre-plastic package material, wherein the pre-plastic package material is used for plastically packaging a packaging frame, forming a filling material between a base island and a pin of the packaging frame, and forming a protruding retaining wall on the pin;
providing a plastic packaging material, and plastically packaging the retaining wall to one side of the packaging frame by using the plastic packaging material to form a plastic packaging layer;
preparing a cutting feature on a top surface of the plastic encapsulation layer; and
and cutting along the cutting features to obtain the cavity packaging structure.
8. The method for packaging according to claim 7, wherein before or after the step of forming the molding layer from the dam wall to the side of the package frame by the molding compound, the step of providing the molding compound further comprises:
providing an upper cover, and coating viscose glue on one side of the upper cover or the retaining wall;
the viscose is fixedly connected with the upper cover to one side of the retaining wall, and the upper cover and the packaging frame define a cavity together.
9. The method of claim 8, wherein the step of forming the cut feature on the top surface of the molding layer comprises:
forming a recess on the top surface of the plastic packaging layer in a laser cutting or etching or mould injection molding mode;
wherein the recess serves as the cutting feature.
10. The packaging method according to claim 9, wherein the top surface is higher than, lower than or flush with a side surface of the upper cover away from the cavity.
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| CN202211505260.5A CN115527957B (en) | 2022-11-29 | 2022-11-29 | Cavity packaging structure and packaging method |
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| CN202211505260.5A CN115527957B (en) | 2022-11-29 | 2022-11-29 | Cavity packaging structure and packaging method |
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|---|---|---|---|---|
| CN201936875U (en) * | 2010-09-04 | 2011-08-17 | 江苏长电科技股份有限公司 | Double-sided graphic chip normal-mounting module packaging structure |
| JP2014192442A (en) * | 2013-03-28 | 2014-10-06 | Nec Corp | Hermetic sealing body and hermetic sealing method |
| CN107527928A (en) * | 2016-06-21 | 2017-12-29 | 胜丽国际股份有限公司 | Optical module encapsulating structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357605A1 (en) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Image sensor semiconductor package with castellation |
| US10170508B2 (en) * | 2016-06-21 | 2019-01-01 | Kingpak Technology Inc. | Optical package structure |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201936875U (en) * | 2010-09-04 | 2011-08-17 | 江苏长电科技股份有限公司 | Double-sided graphic chip normal-mounting module packaging structure |
| JP2014192442A (en) * | 2013-03-28 | 2014-10-06 | Nec Corp | Hermetic sealing body and hermetic sealing method |
| CN107527928A (en) * | 2016-06-21 | 2017-12-29 | 胜丽国际股份有限公司 | Optical module encapsulating structure |
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