CN107527928A - Optical module encapsulating structure - Google Patents
Optical module encapsulating structure Download PDFInfo
- Publication number
- CN107527928A CN107527928A CN201710067651.6A CN201710067651A CN107527928A CN 107527928 A CN107527928 A CN 107527928A CN 201710067651 A CN201710067651 A CN 201710067651A CN 107527928 A CN107527928 A CN 107527928A
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- optical module
- substrate
- light
- passing board
- barrier structure
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- 230000001070 adhesive effect Effects 0.000 claims abstract description 62
- 210000001364 upper extremity Anatomy 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims description 8
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- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
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- 239000003973 paint Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 9
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- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
The present invention relates to a kind of optical module encapsulating structure, including：Substrate, there is relative first surface and second surface；Barrier structure, it is formed on the first surface of the substrate, the holding area on the substrate；Optical module chip, it is positioned on the first surface of the substrate and in the holding area；An at least routing, it is electrically connected with the optical module chip and external circuit；Bonding layer, it is formed above the part upper limb of the barrier structure；Light-passing board, it is positioned on the bonding layer, is completely covered the bonding layer and the holding area, the lateral margin of the light-passing board exceeds the outer rim of the bonding layer, and the light-passing board has relative a first surface and second surface, and the second surface is towards the holding area；And adhesive body, the lateral margin of the light-passing board and the outer rim of the bonding layer is completely covered, and part covers the second surface of the light-passing board and the upper limb of the barrier structure.Above-mentioned optical module encapsulating structure can save manufacturing cost.
Description
Technical field
It is espespecially a kind of to there is preferable reliability and compared with small package size the present invention relates to a kind of optical module encapsulating structure
Optical module encapsulating structure.
Background technology
Fig. 1 is the side sectional view of existing image sensor package 10, wherein, image sensing chip 12 is fixed on base
On plate 11, and outside line (not illustrating), image sensing chip are electrically connected to through the through hole 14 in routing 13 and substrate 11
Barrier structure 15 is provided with around 12, light-passing board 16 is placed on barrier structure 15 so that image sensing chip 12 is located at substrate
11st, in the accommodation space that barrier structure 15 and light-passing board 16 surround, substrate 11, barrier is then coated and fixed in outermost adhesive body 17
Structure 15 and light-passing board 16.
When environment or test condition sternness, such as its condition is related to high temperature or high humidity environment, enters from through hole 14
If aqueous vapor condenses into droplet in the sensing face of image sensing chip 12 or the lower surface of light-passing board 16, image will be had a strong impact on
The quality of the pick-up image of sensor chip 12, the moisture of infiltration can also influence the electric property inside encapsulation, therefore whole optics group
Part quality and reliability, which all produce, to decline to a great extent, and does not often conform to the demand of product specification or long-term normal use.
On the other hand, the package dimension of existing image sensor package 10 is often excessively huge, not only produces material
The consumed cost of material can not decline, and use consume and the maintenance cost for manufacturing instrument are also very huge.
Furthermore the adhesive body 17 of existing image sensor package 10 is coated to the upper surface of light-passing board 16, easily
Light-passing board 16 is polluted in processing procedure, influences the normal use of the function of image sensor package 10.
Therefore, under conditions of normal function is not influenceed, a kind of optics for minimizing and there is high-reliability performance is proposed
Assembly encapsulation structure is one of development main object of the present invention.
The content of the invention
In order to solve the above problems, the present invention proposes a kind of miniaturized optical assembly encapsulation structure, the encapsulating material used
It can be reduced, save manufacturing cost.
In order to solve the above problems, the present invention proposes a kind of optical module encapsulating structure for having preferable reliability, can improve
Aqueous vapor enters in optical module encapsulating structure the situation for influenceing internal optical.
The present invention provides a kind of optical module encapsulating structure, including：One substrate, there is relative first surface and the second table
Face；One barrier structure, it is formed on the first surface of the substrate, the holding area one of on the substrate；One optical module
Chip, it is positioned on the first surface of the substrate and in the holding area；An at least routing, it is electrically connected with the optics group
Part chip and an external circuit；One bonding layer, it is formed above the part upper limb of the barrier structure；One light-passing board, is positioned over this
On bonding layer, the bonding layer and the holding area is completely covered, the lateral margin of the light-passing board exceeds the outer rim of the bonding layer, the printing opacity
Plate has relative a first surface and second surface, and the second surface is towards the holding area；And an adhesive body, it is completely covered
The lateral margin of the light-passing board and the outer rim of the bonding layer, and part covers second surface and the barrier structure of the light-passing board
The upper limb.
In one embodiment, the outer rim of the adhesive body is alignd with the outer rim of the barrier structure.
In one embodiment, the outer rim of the barrier structure is more completely covered in the adhesive body, and part covers being somebody's turn to do for the substrate
First surface, the outer rim of the adhesive body are alignd with the lateral margin of the substrate.
In one embodiment, the extension plane of the upper limb of the adhesive body and the first surface of the light-passing board is in an angle,
The angle is between 5 degree~60 degree.
In one embodiment, the optical module chip is an image sensing chip.
In one embodiment, multiple optical microstructures are set in the sensing face of the image sensing chip.
In one embodiment, the image sensing chip is stacked on a circuit chip.
In one embodiment, multiple weld pads are further included, at least a routing is connected with this, and each weld pad is arranged at the substrate
On the first surface or the barrier structure the upper limb.
In one embodiment, there are multiple through holes in the substrate, penetrate the first surface and the second surface of the substrate,
Those through holes in the opening of the first surface of the substrate are located under the optical module chip, the barrier structure or the adhesive body
Side, a diaphragm is formed between those openings and the optical module chip, the barrier structure or the adhesive body.
In one embodiment, the light-passing board has a stepped lateral margin, and the stepped lateral margin is completely covered in the adhesive body.
The present invention provides a kind of optical module encapsulating structure, including：One substrate, there is relative first surface and the second table
Face；One barrier structure, it is formed on the first surface of the substrate, the holding area one of on the substrate；One optical module
Chip, it is positioned on the first surface of the substrate and in the holding area；An at least routing, it is electrically connected with the optics group
Part chip and an external circuit；One light-passing board, it is positioned on the barrier structure, the holding area is completely covered；An and sealing
Body, the lateral margin of the light-passing board and the outer rim of the barrier structure is completely covered, wherein, there are multiple through holes in the substrate, through this
First surface and the second surface of substrate, those through holes are to be located at the optics group in the opening of the first surface of the substrate
Below part chip, the barrier structure or the adhesive body, those openings and the optical module chip, the barrier structure or the adhesive body
Between form a diaphragm, the routing is electrically connected to the external circuit by the through hole.
In one embodiment, the diaphragm is a solder mask.
In one embodiment, conductive material, solder mask or resin are packed in the through hole.
In one embodiment, a bonding layer is further included, between the light-passing board and the barrier structure, the light-passing board is complete
The lateral margin for covering the bonding layer and the light-passing board exceeds the outer rim of the bonding layer.
Brief description of the drawings
Fig. 1 is the side sectional view of existing image sensor package.
Fig. 2 is the side sectional view according to the optical module encapsulating structure of one embodiment of the invention.
Fig. 3 is the side sectional view according to the optical module encapsulating structure of another embodiment of the present invention.
Fig. 4 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Fig. 5 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Fig. 6 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Fig. 7 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Fig. 8 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Fig. 9 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Figure 10 is the side sectional view according to the optical module encapsulating structure of further embodiment of this invention.
Figure 11 A are for the substrate design top view for the optical module encapsulating structure for generating one embodiment of the invention.
Figure 11 B is generate the side view of optical module encapsulating structure using Figure 11 A substrate design.
Figure 12 A are for the substrate design top view for the optical module encapsulating structure for generating another embodiment of the present invention.
Figure 12 B is generate the side view of optical module encapsulating structure using Figure 12 A substrate design.
Figure 13 A are for the substrate design top view for the optical module encapsulating structure for generating further embodiment of this invention.
Figure 13 B is generate the side view of optical module encapsulating structure using Figure 13 A substrate design.
Embodiment
Realizing some exemplary embodiments of feature of present invention and advantage will describe in detail in follow-up explanation.It should be understood that
It is that the present invention can have various changes in different aspects, it is neither departed from the scope of the present invention, and explanation therein
And accompanying drawing inherently is illustrated as being used, and it is not used to the limitation present invention.
Fig. 2 is according to the side sectional view of the optical module encapsulating structure of one embodiment of the invention, optical module encapsulation knot
Structure 20 includes substrate 21, optical module chip 22, barrier structure 25, bonding layer 28, light-passing board 26 and adhesive body 27.Wherein,
Substrate 21 (being, for example, plastic base) has relative first surface 211 and second surface 212, and optical module chip 22 is fixed on
On the first surface 211 of substrate 21 (such as then resin (die bond epoxy) etc. is solid with adhesion layer, colloid or chip
Mode), the working face (sensing face) 221 of optical module chip 22 is directed away from the direction of substrate 21, i.e. towards light-passing board
26, being set in addition on the first surface 211 of substrate 21 can be with the pin on second surface 212, pin, connection pad, wiring or electricity
The weld pad 231 that pole etc. (not illustrating) is electrically connected with, optical module chip 22 are completed to be electrically connected with by routing 23 and weld pad 231,
The quantity of weld pad 231 and routing 23 configures according to actual demand, the sensing signal of optical module chip 22 is sent to outside
Circuit (not illustrating) receives drive signal from external circuit.The optical module chip 22 of the present invention is, for example, image sensing core
Piece, but this is not limited to, it is any easily by other optical module chips sealing using various embodiments of the present invention of influence of moisture
Assembling structure is to improve its weatherability and reliability.
Side is provided with barrier structure 25 on the base plate (21, is centered around the periphery of optical module chip 22, barrier structure 25 can
With identical with the material of substrate 21, such as plastics, elastomer or silica gel also can be used in addition, for isolating external environment condition and protecting
Optical module chip 22, barrier structure 25 can utilize known mode to be fixed on the first surface 211 of substrate 21, preferably,
Barrier structure 25 is attached on the first surface 211 of substrate 21 using laminate film (lamination film) 31.
Light-passing board 26 has relative a first surface 261 and second surface 262, and wherein second surface 262 is towards optics group
Part chip 22, light-passing board 26 are crossed on the top of optical module chip 22, that is, light-passing board 26 and optics group by barrier structure 25
There is gap, light-passing board 26 can be optical glass, lens or printing opacity plate body, can further have between part chip 22
There are coating single side or a double-sided coating, and any film plating layer of coating single side or double-sided coating can include anti-reflecting layer, infrared
Line penetrated bed, infrared resistant layer or uvioresistant layer etc. have the film layer of special-effect.
A circle bonding layer 28 (such as being formed with coating method), its material are provided between barrier structure 25 and light-passing board 26
Matter can be glass then resin (glass mount epoxy, GME), have preferable tackness, therefore base especially for glass
Plate 21, barrier structure 25, bonding layer 28 and light-passing board 26 cross the holding area 35 of confined space, and optical module chip 22 is just put
Put in holding area 35.The inner edge 281 of bonding layer 28 generally without departing from the inner edge 251 of barrier structure 25, for example connects
The inner edge 281 for closing layer 28 is alignd with the inner edge 251 of barrier structure 25, or the inner edge 281 of bonding layer 28 is located at barrier structure 25
Inner edge 251 and outer rim 252 between, the resin that is so coated with may not flow into holding area 35 and be contacted with wire rod；In addition, printing opacity
The lateral margin 263 of plate 26 then exceeds the outer rim 282 of bonding layer 28, that is, the upper surface of bonding layer 28 is covered by light-passing board 26 completely.
The height D2 of bonding layer 28 and the height D1 sum totals of barrier structure 25 define the height of holding area 35, therefore can be adjusted by
The height D1 of the barrier structure 25 and/or height D2 of bonding layer 28 come control optical module chip 22 arrive light-passing board 26 the first table
The distance between face 261, that is, the operating distance of optical module chip 22, as the height of whichever to be adjusted, then visual processing procedure is difficult
The parameters such as Yi Du, reliability are selected, when operating distance is bigger, in the particulate on the first surface 261 of light-passing board 26 or
Unobvious are got in the imaging of pollution, but increase packaging body whole height, and the height of increase holding area 35, for reliability
It can influence.
Adhesive body 27 is formed on the part first surface 211 of substrate 21, can effectively be slowed down aqueous vapor and be entered holding area
35 situation, the material of adhesive body 27 is model adhesive body (molding compound), its outer rim 272 and the lateral margin of substrate 21
213 alignment, the lateral margin 263 of light-passing board 26, the outer rim 282 of bonding layer 28 and barrier structure 25 is then completely covered in inner edge 271
Outer rim 252, its upper limb 273 generally flush with the first surface 261 of light-passing board 26.Because the outer rim 282 of bonding layer 28 is than saturating
The lateral margin 263 of tabula rasa 26 and the outer rim 252 of barrier structure 25 inside contract that (i.e. the inner edge 281 of bonding layer 28 is less than to the distance of outer rim 282
The distance of the lateral margin 263 of light-passing board 26 is arrived in the inner edge 281 of bonding layer 28, and the outer rim of barrier structure 25 is arrived again smaller than the inner edge 281 of bonding layer 28
252 distance), therefore the inner edge 271 of adhesive body 27 contacts and is attached on the lateral margin 263 of light-passing board 26, the part of light-passing board 26
Second surface 262 (between the lateral margin 263 of the outer rim 282 of bonding layer 28 to light-passing board 26), the outer rim 282 of bonding layer 28, barrier
The part upper limb 253 (between the outer rim 252 of the outer rim 282 of bonding layer 28 to barrier structure 25) and barrier structure of structure 25
25 outer rim 252, adhesive body 27 are simultaneously attached on the part first surface 211 of substrate 21 (outer rim 252 of barrier structure 25 arrive substrate
Between 21 lateral margin 213), the contact area of different directions between adhesive body 27 and other assemblies is added, light-passing board can be reduced
26th, the interfacial stress between 25 each contact surface of bonding layer 28 and barrier structure, there is provided more close occlusion or chimeric effect.Separately
Outside, when adhesive body 27 upper limb 273 without departing from light-passing board 26 first surface 261 when, can reach in processing procedure and avoid excessive glue
And polluteing light-passing board 26, it is ensured that the function of optical module encapsulating structure 20 is normal, can also reduce the trouble that processing procedure subsequently cleans,
And the part of adhesive body 27 of protrusion light-passing board 26 is subtracted out, the usage amount of adhesive body 27 can be reduced, and reduce manufacturing cost.
The optical module encapsulating structure 20 of completion has to pass through temperature cycling test (temperature cycle after encapsulation
Test), such as the AEC-Q100 of auto electronic product specification test, wherein in the stage of test mechanical stress, optics group
Part encapsulating structure 20 can pass through thousands of -65 DEG C~150 DEG C temperature to be changed back and forth, whether to detect optics assembly encapsulation structure 20
It can withstand and expand with heat and contract with cold without producing each interface peeling, the foregoing laminate film between barrier structure 25 and substrate 21
31 with absorbing structure stress can avoid that delamination (delamination) phenomenon occurs between substrate 21 and barrier structure 25, can
Effectively improve the weatherability and reliability of optical module encapsulating structure 20.
In order that weld pad 231, wiring, wiring (trace) or circuit and second surface on the first surface 211 of substrate 21
Pin, pin, connection pad, wiring or electrode on 212 are electrically connected, it is necessary to are had through first surface 211 and second surface
Conductive structure between 212, such as the general lower sections for being located at weld pad 231 of through hole (through hole/via) more, it is of the invention
Optical module encapsulating structure 20 then can be improved further, referring to Fig. 3, through hole (through hole) 24 is in substrate 21 first
The opening on surface 211 can be located at optical module chip 22, barrier structure 25, adhesive body 27 or other circuit chips (not illustrating)
Lower section, if laminate film 31 can then be located at the lower section of laminate film 31, coordinate the wiring 232 on the first surface 211 of substrate 21,
Complete connection external circuit and inside optical module encapsulating structure 20, the top of wiring 232 covers layer protecting film 32, diaphragm again
32 be, for example, solder mask (green paint), can protect wiring 232 not by scratch or with contacting external air and produce oxidation and corrosion,
And anti-welding function is provided, avoid causing short circuit or open circuit, it is noted that number of openings and relative position in figure are only to illustrate, and are not had to
In restriction embodiments of the present invention.In addition, because optical module chip 22, barrier structure 25, adhesive body 27 and diaphragm 32
Obstruction, aqueous vapor is more difficult to enter holding area 35, therefore optical module encapsulating structure 20 can keep quality for a long time, significantly
Improve its weatherability and reliability.
Then visual processing procedure or demand inside through hole 24, are packed to filler 241, filler 241 can be that electro-coppering etc. is led
Electric material, solder mask or resin, holding area 35 is penetrated into increase the stabilization of electrical connection or further moisture-barrier.It is logical
Hole 24 can then coordinate different packing forms and pin, pin, connection pad, wiring or electricity in the opening of the second surface 212 of substrate 21
Pole etc. (not illustrating) connect, such as ball grid array (ball grid array, BGA), without pin (leadless chip
Carrier, LCC), planar lattice array (land grid array, LGA), quad-flat-pack (quad flat
Package, QFP), quad flat non-pin (quad flat no-lead, QFN) or other packing forms.The present embodiment leads to
Pore structure can be applied to all embodiments described hereinafter without being repeated in each embodiment.
A variety of implementation patterns of the optical module encapsulating structure of Fig. 4~Figure 10 display present invention and change, only illustrate below
Main different feature, other components do not mentioned can be general with the similar component that is previously mentioned in all embodiments of the invention, its material
Matter, function, outward appearance etc. repeat no more, and please note that the main dissimilarity in each embodiment also applies to other embodiment, and
It is not limited to the pattern shown by indivedual schemas.
In Fig. 4, the needs depending on application can set multiple light on the working face (sensing face) 221 of optical module chip 22
Micro-structural 222 is learned, such as microlens array is formed, to provide the specific functions such as diffraction, focusing or correction, to strengthen optics group
The sensing effect of part chip 22.
In Fig. 5, generated if adhesive body 27 ' is solidified by liquid adhesive body (liquid compound), adhesive body 27 '
Upper limb 273 ' parallel state, such as the upper limb 273 ' of adhesive body 27 ' may not be presented with the first surface 261 of light-passing board 26
Can and the extension plane of the first surface 261 of light-passing board 26 be in an angle theta, according to liquid adhesive body to the adhesive force of light-passing board 26 with
The cohesive force of itself, angle theta are ranged approximately between 5 degree~60 degree.
More than one chip can be set in Fig. 6, in holding area 35, such as the optical module chip that storehouse is set in figure
22 and circuit chip 42, wherein optical module chip 22 can be image sensing chip and circuit chip 42 can be signal of video signal
Process chip (image signal processor, ISP) or digital signal processing chip (digital signal
Processor, DSP), multiple weld pads 231 and 431 are set on the first surface 211 of substrate 21, the optics group above stack architecture
Part chip 22 is electrically connected with using routing 23 and weld pad 231, and the circuit chip 42 of lower section is electrically connected using routing 43 and weld pad 431
Connect, can so realize multi-chip package (multi-chip package), integrate multiple chips in an encapsulating structure, than
Indivedual encapsulation save many spaces, help to reduce the volume of electronic product.
In Fig. 7, the position of weld pad 231 being electrically connected with optical module chip 22 can be by the first surface 211 of substrate 21
The upper surface of barrier structure 25 is moved on to, now the inner edge 281 of bonding layer 28 is not alignd with the inner edge 251 of barrier structure 25, but
The upper limb 253 for vacating partial obstruction structure 25 is moved to the outer rim 252 of barrier structure 25, for placing weld pad 231, in this embodiment
In, conductive structure (not illustrating) is disposed with inside barrier structure 25 and allows weld pad 231 and internal circuit or external circuit (not
Illustrate) it is electrically connected with.For multichip packaging structure, there are multiple corresponding weld pads 231 in holding area 35, according to different knots
Structure designs, and whole weld pads 231 can be selectively placed on the first surface 211 of substrate 21 or the upper limb of barrier structure 25
253, or be partially disposed on the first surface 211 of substrate 21 and be partially disposed in the upper limb 253 of barrier structure 25.
In Fig. 8, optical module encapsulating structure 20 can further include at least one passive component 51, and passive component 51 is set
Put on the upper limb 253 of barrier structure 25, coated and be protected by adhesive body 27 '.In this embodiment, in barrier structure 25
Portion is disposed with conductive structure (not illustrating) and passive component 51 is electrically connected with internal circuit or external circuit (not illustrating)
Connect.
In Fig. 9, light-passing board 26 ' has stepped (step cut) lateral margin 263 ', and the inner edge 271 ' of adhesive body 27 ' is completely
The stepped lateral margin 263 ' of light-passing board 26 ' is covered, therefore adds the contact of adhesive body 27 ' and light-passing board 26 ' in different directions
Area, there is provided more close occlusion or chimeric effect, make the combination of adhesive body 27 ' and light-passing board 26 ' more firm, optical module
The reliability of encapsulating structure 20 is higher.
In Figure 10, because the outer rim 282 of bonding layer 28 is than the lateral margin 263 of light-passing board 26 and the outer rim of barrier structure 25
252 inside contract that (i.e. the distance of the inner edge 281 of bonding layer 28 to outer rim 282 arrives the lateral margin 263 of light-passing board 26 less than the inner edge 281 of bonding layer 28
Distance, again smaller than the inner edge 281 of bonding layer 28 arrive the outer rim 252 of barrier structure 25 distance), light-passing board 26 can be reduced as previously described
And the interfacial stress between the contact surface of bonding layer 28, there is provided more close occlusion or chimeric effect, so in snap-in force lifting
Under the premise of, the usage amount of adhesive body 57 can be further reduced, the outer rim 572 of adhesive body 57 is protruded from the outer rim of barrier structure 25
252 part gradually reduces, or even is alignment to both, therefore adhesive body 57 does not contact with substrate 21, i.e. adhesive body 57
Inner edge 571 contacts and is attached on the lateral margin 263 of light-passing board 26, (the outer rim of bonding layer 28 of portion second surface 262 of light-passing board 26
282 to light-passing board 26 lateral margin 263 between), the outer rim 282 of bonding layer 28, (the bonding layer of part upper limb 253 of barrier structure 25
28 outer rim 282 is between the outer rim 252 of barrier structure 25), the area of substrate 21 can be reduced and reduce making for adhesive body 57
Dosage, while reach the effect of encapsulating structure miniaturization and manufacturing cost reduction.
The characteristics of included in Fig. 3~Figure 10 related embodiments, is including on lead to the hole site, optical microstructures, adhesive body inclined-plane
Edge, stack chip, bond pad locations change, passive component, the stepped lateral margin of light-passing board, small scale structures etc. can answer alone or in combination
With the embodiment to Fig. 2, it should be noted that the invention is not restricted to the pattern shown by indivedual schemas.
Figure 11 A show the substrate design for generating optical module encapsulating structure of the present invention, completed through hole, wiring,
The top of substrate 21 of diaphragm (solder mask) forms barrier structure 25, and barrier structure 25 can expose as the part of holding area 35
Substrate 21, and the groove 65 provided in the surrounding of holding area 35, then complete to attach chip, even in holding area 35
Take line, form bonding layer, put the steps such as light-passing board, then overall coating adhesive body, the height of adhesive body generally with thoroughly
Tabula rasa surface flushes, or some are recessed between two units, carries out cutting operation finally along groove 65, can obtain such as figure
Optical module encapsulating structure shown in 11B side views, substantially whole encapsulating structure are covered by adhesive body 27 ', only reveal in corner
Go out the barrier structure 25 of part.
Figure 12 A show another substrate design for generating optical module encapsulating structure of the present invention, complete through hole, cloth
Line, the top of substrate 21 of diaphragm (solder mask) form barrier structure 25, and barrier structure 25 is made only in around holding area 35,
Separated between two units with interval 66, then complete in the holding area 35 to attach chip, connection routing, formed bonding layer,
The steps such as light-passing board are put, then overall coating adhesive body, the height of adhesive body generally flush with printing opacity plate surface, or
Some are recessed between two units, carry out cutting operation finally along interval 66, can obtain the optics as shown in Figure 12 B side views
Assembly encapsulation structure, it can be seen that total is covered by adhesive body 27 '.
Figure 13 A show another substrate design for generating optical module encapsulating structure of the present invention, complete through hole, cloth
Line, the top of substrate 21 of diaphragm (solder mask) form barrier structure 25, and barrier structure 25 can expose as holding area 35
Partial substrate 21, then complete to attach chip in holding area 35, connect routing, form bonding layer, putting light-passing board etc.
Step, then overall to be coated with adhesive body, the height of adhesive body generally flushes with printing opacity plate surface, or between two units
Some are recessed, finally carry out cutting operation, can obtain optical module encapsulating structure as shown in Figure 10, and Figure 13 B are its side view,
Adhesive body 57 is covered on barrier structure 25, is not contacted with substrate 21, the outer rim 252 of barrier structure 25 and the lateral margin of substrate 21
213 alignment.
It should be noted that the element number shown in Figure 11 A~Figure 13 A in substrate is only that signal is used, it is not intended to limit the invention
Scope, the visual processing procedure line width of its quantity adjusts according to actual design and demand.
In summary, the bonding layer that the present invention inside contracts by providing increases fixation and the adhesive ability of adhesive body, uses and subtracts
The usage amount of few encapsulating material simultaneously can avoid polluting light-passing board, the approach entered in addition by barrier aqueous vapor, significantly postpone aqueous vapor
Into inside optical module encapsulating structure, reach the weatherability for improving optical module encapsulating structure and reliability and reduce encapsulation chi
The effect of very little.
Claims (11)
1. a kind of optical module encapsulating structure, it is characterised in that include：
One substrate, there is relative first surface and second surface；
One barrier structure, it is formed on the first surface of the substrate, the holding area on the substrate；
One optical module chip, it is positioned on the first surface of the substrate and in the holding area；
An at least routing, it is electrically connected with the optical module chip and an external circuit；
One bonding layer, it is formed above the part upper limb of the barrier structure；
One light-passing board, it is positioned on the bonding layer, the bonding layer and the holding area is completely covered, the lateral margin of the light-passing board exceeds
The outer rim of the bonding layer, the light-passing board have relative a first surface and second surface, and the second surface is towards the holding area；
And
One adhesive body, the lateral margin of the light-passing board and the outer rim of the bonding layer is completely covered, and part covers the light-passing board
The upper limb of the second surface and the barrier structure.
2. optical module encapsulating structure as claimed in claim 1, it is characterised in that the outer rim of the adhesive body and the barrier structure
Outer rim alignment.
3. optical module encapsulating structure as claimed in claim 1, it is characterised in that the barrier knot is more completely covered in the adhesive body
The outer rim of structure, and part covers the first surface of the substrate, the outer rim of the adhesive body is alignd with the lateral margin of the substrate.
4. optical module encapsulating structure as claimed in claim 1, it is characterised in that the upper limb of the adhesive body and the light-passing board
The extension plane of the first surface is in an angle, and the angle is between 5 degree~60 degree.
5. optical module encapsulating structure as claimed in claim 1, it is characterised in that also including multiple weld pads, with this at least one
Routing connects, and each weld pad is arranged on the first surface of the substrate or the upper limb of the barrier structure.
6. optical module encapsulating structure as claimed in claim 1, it is characterised in that there are multiple through holes in the substrate, penetrate
First surface and the second surface of the substrate, those through holes are to be located at the optics in the opening of the first surface of the substrate
Below device wafer, the barrier structure or the adhesive body, those openings and the optical module chip, the barrier structure or the sealing
A diaphragm is formed between body.
7. optical module encapsulating structure as claimed in claim 1, it is characterised in that the light-passing board has a stepped lateral margin,
The stepped lateral margin is completely covered in the adhesive body.
8. a kind of optical module encapsulating structure, it is characterised in that include：
One substrate, there is relative first surface and second surface；
One barrier structure, it is formed on the first surface of the substrate, the holding area on the substrate；
One optical module chip, it is positioned on the first surface of the substrate and in the holding area；
An at least routing, it is electrically connected with the optical module chip and an external circuit；
One light-passing board, it is positioned on the barrier structure, the holding area is completely covered；And
One adhesive body, the lateral margin of the light-passing board and the outer rim of the barrier structure is completely covered,
Wherein, there are multiple through holes in the substrate, through the first surface and the second surface of the substrate, those through holes are in this
The opening of the first surface of substrate is those openings below the optical module chip, the barrier structure or the adhesive body
A diaphragm is formed between the optical module chip, the barrier structure or the adhesive body, the routing is electrically connected by the through hole
It is connected to the external circuit.
9. optical module encapsulating structure as claimed in claim 8, it is characterised in that the diaphragm is a solder mask.
10. optical module encapsulating structure as claimed in claim 8, it is characterised in that conductive material is packed in the through hole, is prevented
Weldering paint or resin.
11. optical module encapsulating structure as claimed in claim 8, it is characterised in that also including a bonding layer, positioned at the printing opacity
Between plate and the barrier structure, the lateral margin of the bonding layer and the light-passing board is completely covered beyond the outer of the bonding layer in the light-passing board
Edge.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106120055A TWI648848B (en) | 2016-06-21 | 2017-06-15 | Optical component package structure |
| US15/623,596 US10170508B2 (en) | 2016-06-21 | 2017-06-15 | Optical package structure |
| JP2017120827A JP6473778B2 (en) | 2016-06-21 | 2017-06-20 | Optical sealing structure |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662352608P | 2016-06-21 | 2016-06-21 | |
| US62/352,608 | 2016-06-21 | ||
| US201662353154P | 2016-06-22 | 2016-06-22 | |
| US62/353,154 | 2016-06-22 |
Publications (2)
| Publication Number | Publication Date |
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| CN107527928A true CN107527928A (en) | 2017-12-29 |
| CN107527928B CN107527928B (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710067651.6A Active CN107527928B (en) | 2016-06-21 | 2017-02-07 | Optical assembly packaging structure |
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| Country | Link |
|---|---|
| JP (1) | JP6473778B2 (en) |
| CN (1) | CN107527928B (en) |
| TW (1) | TWI648848B (en) |
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| CN113691229A (en) * | 2021-08-25 | 2021-11-23 | 北京超材信息科技有限公司 | Acoustic device packaging structure |
| CN115241297A (en) * | 2022-09-23 | 2022-10-25 | 江苏长电科技股份有限公司 | Chip packaging structure and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6473778B2 (en) | 2019-02-20 |
| JP2017228779A (en) | 2017-12-28 |
| TW201810634A (en) | 2018-03-16 |
| CN107527928B (en) | 2020-04-07 |
| TWI648848B (en) | 2019-01-21 |
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Effective date of registration: 20230116 Address after: Taipei City, Taiwan Chinese Zhongzheng District Yanping Road No. 83 6 floor Patentee after: TONG HSING ELECTRONIC INDUSTRIES, Ltd. Address before: No. 84, Taihe Road, Zhubei City, Xinzhu County Patentee before: KINGPAK TECHNOLOGY Inc. |