CN107527928B - Optical assembly packaging structure - Google Patents
Optical assembly packaging structure Download PDFInfo
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- CN107527928B CN107527928B CN201710067651.6A CN201710067651A CN107527928B CN 107527928 B CN107527928 B CN 107527928B CN 201710067651 A CN201710067651 A CN 201710067651A CN 107527928 B CN107527928 B CN 107527928B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention relates to an optical component packaging structure, comprising: the substrate is provided with a first surface and a second surface which are opposite; the barrier structure is formed on the first surface of the substrate and surrounds an accommodating area on the substrate; an optical component chip disposed on the first surface of the substrate and in the accommodating region; at least one routing wire electrically connected with the optical component chip and the external circuit; a bonding layer formed over a portion of the upper edge of the barrier structure; the light-transmitting plate is arranged on the bonding layer and completely covers the bonding layer and the accommodating area, the side edge of the light-transmitting plate exceeds the outer edge of the bonding layer, the light-transmitting plate is provided with a first surface and a second surface which are opposite, and the second surface faces the accommodating area; and the sealant completely covers the side edge of the light-transmitting plate and the outer edge of the bonding layer, and partially covers the second surface of the light-transmitting plate and the upper edge of the barrier structure. The optical assembly packaging structure can save the manufacturing cost.
Description
Technical Field
The present invention relates to an optical package, and more particularly, to an optical package with improved reliability and smaller package size.
Background
Fig. 1 is a side cross-sectional view of a conventional image sensor package structure 10, in which an image sensing chip 12 is fixed on a substrate 11 and electrically connected to an external circuit (not shown) through a wire 13 and a through hole 14 in the substrate 11, a blocking structure 15 is disposed around the image sensing chip 12, a transparent plate 16 is disposed on the blocking structure 15, so that the image sensing chip 12 is located in an accommodating space defined by the substrate 11, the blocking structure 15, and the transparent plate 16, and an outermost layer of encapsulant 17 encapsulates the fixed substrate 11, the blocking structure 15, and the transparent plate 16.
When the environment or the testing condition is severe, for example, the condition relates to a high temperature or high humidity environment, if water vapor entering from the through hole 14 condenses into small water drops on the sensing surface of the image sensing chip 12 or the lower surface of the transparent plate 16, the quality of the image captured by the image sensing chip 12 is seriously affected, and the permeated moisture also affects the electrical performance inside the package, so the quality and reliability of the whole optical assembly are greatly reduced, and the optical assembly is often not in the product specification or is not in the requirement of long-term normal use.
On the other hand, the package size of the conventional image sensor package structure 10 is often too large, so that the consumption cost of the production material cannot be reduced, and the use loss and maintenance cost of the manufacturing tool are also huge.
Moreover, the encapsulant 17 of the conventional image sensor package structure 10 is coated on the upper surface of the transparent plate 16, which is likely to contaminate the transparent plate 16 during the manufacturing process and affect the normal use of the image sensor package structure 10.
Therefore, it is one of the main objectives of the present invention to provide a miniaturized optical device package structure with high reliability without affecting the normal function.
Disclosure of Invention
In order to solve the above problems, the present invention provides a miniaturized optical package structure, which uses a reduced amount of package material and saves manufacturing cost.
In order to solve the above problems, the present invention provides an optical device package structure with better reliability, which can improve the situation that moisture enters the optical device package structure to affect the internal optical device.
The invention provides an optical component packaging structure, comprising: a substrate having a first surface and a second surface opposite to each other; a barrier structure formed on the first surface of the substrate and surrounding a receiving area on the substrate; an optical component chip disposed on the first surface of the substrate and in the accommodating region; at least one routing wire, electrically connecting the optical component chip and an external circuit; a bonding layer formed above part of the upper edge of the barrier structure; a light-transmitting plate, which is arranged on the bonding layer and completely covers the bonding layer and the accommodating area, wherein the side edge of the light-transmitting plate exceeds the outer edge of the bonding layer, the light-transmitting plate is provided with a first surface and a second surface which are opposite, and the second surface faces the accommodating area; and a sealant completely covering the side edge of the transparent plate and the outer edge of the bonding layer, and partially covering the second surface of the transparent plate and the upper edge of the barrier structure.
In one embodiment, the outer edge of the encapsulant is aligned with the outer edge of the barrier structure.
In one embodiment, the molding compound covers the outer edge of the barrier structure more completely and partially covers the first surface of the substrate, and the outer edge of the molding compound is aligned with the side edge of the substrate.
In one embodiment, an included angle between the upper edge of the encapsulant and the extending plane of the first surface of the transparent plate is between 5 degrees and 60 degrees.
In one embodiment, the optical device chip is an image sensor chip.
In one embodiment, a plurality of optical microstructures are disposed on the sensing surface of the image sensor chip.
In one embodiment, the image sensing chip is stacked on a circuit chip.
In an embodiment, the package further includes a plurality of pads connected to the at least one wire, each pad being disposed on the first surface of the substrate or the upper edge of the isolation structure.
In one embodiment, the substrate has a plurality of through holes penetrating through the first surface and the second surface of the substrate, the openings of the through holes on the first surface of the substrate are located under the optical device chip, the blocking structure or the encapsulant, and a protective film is formed between the openings and the optical device chip, the blocking structure or the encapsulant.
In one embodiment, the transparent plate has a step-shaped side edge, and the sealant completely covers the step-shaped side edge.
The invention provides an optical component packaging structure, comprising: a substrate having a first surface and a second surface opposite to each other; a barrier structure formed on the first surface of the substrate and surrounding a receiving area on the substrate; an optical component chip disposed on the first surface of the substrate and in the accommodating region; at least one routing wire, electrically connecting the optical component chip and an external circuit; a light-transmitting plate, which is arranged on the barrier structure and completely covers the accommodating area; and a sealing colloid completely covering the side edge of the light-transmitting plate and the outer edge of the blocking structure, wherein the substrate is internally provided with a plurality of through holes which penetrate through the first surface and the second surface of the substrate, the openings of the through holes on the first surface of the substrate are positioned below the optical component chip, the blocking structure or the sealing colloid, a protective film is formed between the openings and the optical component chip, the blocking structure or the sealing colloid, and the routing is electrically connected to the external circuit through the through holes.
In one embodiment, the protective film is a solder mask.
In one embodiment, the through hole is filled with a conductive material, solder mask or resin.
In one embodiment, the display device further includes a bonding layer located between the transparent plate and the barrier structure, wherein the transparent plate completely covers the bonding layer and the side edge of the transparent plate exceeds the outer edge of the bonding layer.
Drawings
Fig. 1 is a side sectional view of a conventional image sensor package structure.
Fig. 2 is a side cross-sectional view of an optical device package structure according to an embodiment of the invention.
Fig. 3 is a side cross-sectional view of an optical assembly package structure according to another embodiment of the invention.
Fig. 4 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 5 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 6 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 7 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 8 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 9 is a side cross-sectional view of an optical component package structure according to yet another embodiment of the invention.
Fig. 10 is a side cross-sectional view of an optical assembly package structure according to yet another embodiment of the invention.
FIG. 11A is a top view of a substrate design for creating an optical device package structure according to one embodiment of the present invention.
Fig. 11B is a side view of an optical component package structure produced using the substrate design of fig. 11A.
Fig. 12A is a top view of a substrate design for creating an optical device package structure according to another embodiment of the invention.
Fig. 12B is a side view of an optical component package structure produced using the substrate design of fig. 12A.
Fig. 13A is a top view of a substrate design for producing an optical device package structure according to yet another embodiment of the invention.
Fig. 13B is a side view of an optical component package structure produced using the substrate design of fig. 13A.
Detailed Description
Some exemplary embodiments that achieve the features and advantages of the present invention will be described in detail in the following description. It is to be understood that the invention is capable of modification in various respects, all without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.
Fig. 2 is a side cross-sectional view of an optical device package structure according to an embodiment of the invention, in which the optical device package structure 20 includes a substrate 21, an optical device chip 22, a barrier structure 25, a bonding layer 28, a transparent plate 26, and an encapsulant 27. Wherein the substrate 21 (e.g., a plastic substrate) has a first surface 211 and a second surface 212 opposite to each other, the optical device chip 22 is fixed on the first surface 211 of the substrate 21 (e.g., by an adhesive layer, a glue, or a die bond epoxy), the working surface (sensing surface) 221 of the optical device chip 22 faces away from the substrate 21, i.e., the transparent plate 26, the first surface 211 of the substrate 21 is further provided with a bonding pad 231 electrically connected to pins, pads, wires or electrodes (not shown) on the second surface 212, the optical device chip 22 is electrically connected to the bonding pad 231 by a bonding wire 23, and the number of the bonding pads 231 and the number of the bonding wires 23 are configured according to actual requirements, so that the sensing signal of the optical device chip 22 can be transmitted to an external circuit (not shown) or receive a driving signal from the external circuit. The optical device chip 22 of the present invention is, for example, an image sensor chip, but is not limited thereto, and any other optical device chip that is susceptible to moisture can utilize the package structure of the embodiments of the present invention to improve the weather resistance and reliability thereof.
The barrier structure 25 is disposed above the substrate 21 and surrounds the optical device chip 22, the barrier structure 25 may be made of the same material as the substrate 21, such as plastic, or elastomer or silicone for isolating the external environment and protecting the optical device chip 22, the barrier structure 25 may be fixed on the first surface 211 of the substrate 21 by a known method, and preferably, the barrier structure 25 may be attached on the first surface 211 of the substrate 21 by a laminating film (31).
The transparent plate 26 has a first surface 261 and a second surface 262 opposite to each other, wherein the second surface 262 faces the optical device chip 22, the transparent plate 26 is disposed over the optical device chip 22 by the blocking structure 25, i.e., a gap is formed between the transparent plate 26 and the optical device chip 22, the transparent plate 26 may be an optical glass, a lens or a transparent plate, and further may have a single-sided coating or a double-sided coating, and any one of the single-sided coating or the double-sided coating may include an anti-reflection layer, an infrared ray transmission layer, an infrared ray resistance layer or an ultraviolet ray resistance layer, etc. having special effects.
A ring of bonding layer 28 (formed by coating, for example) is disposed between the barrier structure 25 and the transparent plate 26, and the material of the bonding layer is glass-adhesive (GME), especially the glass has better adhesion, so that the substrate 21, the barrier structure 25, the bonding layer 28 and the transparent plate 26 enclose an accommodating area 35 of a closed space, and the optical device chip 22 is disposed in the accommodating area 35. The inner edge 281 of the bonding layer 28 does not substantially extend beyond the inner edge 251 of the barrier structure 25, for example, the inner edge 281 of the bonding layer 28 is aligned with the inner edge 251 of the barrier structure 25, or the inner edge 281 of the bonding layer 28 is located between the inner edge 251 and the outer edge 252 of the barrier structure 25, so that the coated resin does not flow into the accommodating region 35 to contact the wires; in addition, the side edge 263 of the transparent plate 26 exceeds the outer edge 282 of the bonding layer 28, i.e., the upper surface of the bonding layer 28 is completely covered by the transparent plate 26. The height D2 of the bonding layer 28 and the height D1 of the barrier structure 25 together define the height of the receiving area 35, so the distance between the optical device chip 22 and the first surface 261 of the transparent plate 26, i.e. the working distance of the optical device chip 22, can be controlled by adjusting the height D1 of the barrier structure 25 and/or the height D2 of the bonding layer 28, and the height of which can be selected according to the process difficulty, reliability, and other parameters, and when the working distance is longer, the imaging of particles or contamination on the first surface 261 of the transparent plate 26 is less obvious, but the overall height of the package is increased, and the height of the receiving area 35 is increased, which affects the reliability.
The molding compound 27 is formed on a portion of the first surface 211 of the substrate 21, and can effectively reduce moisture from entering the receiving area 35, the molding compound 27 is made of a molding compound (molding compound), an outer edge 272 of the molding compound is aligned with the side edge 213 of the substrate 21, an inner edge 271 completely covers the side edge 263 of the transparent plate 26, the outer edge 282 of the bonding layer 28, and the outer edge 252 of the blocking structure 25, and an upper edge 273 of the molding compound is substantially flush with the first surface 261 of the transparent plate 26. Because the outer edge 282 of the bonding layer 28 is recessed from the side edge 263 of the light-transmitting plate 26 and the outer edge 252 of the barrier structure 25 (i.e., the distance from the inner edge 281 of the bonding layer 28 to the outer edge 282 is smaller than the distance from the inner edge 281 of the bonding layer 28 to the side edge 263 of the light-transmitting plate 26 and the distance from the inner edge 281 of the bonding layer 28 to the outer edge 252 of the barrier structure 25), the inner edge 271 of the encapsulant 27 contacts and adheres to the side edge 263 of the light-transmitting plate 26, a portion of the second surface 262 of the light-transmitting plate 26 (between the outer edge 282 of the bonding layer 28 and the side edge 263 of the light-transmitting plate 26), the outer edge 282 of the bonding layer 28, a portion of the upper edge 253 of the barrier structure 25 (between the outer edge 282 of the bonding layer 28 and the outer edge 252 of the barrier structure 25), and the outer edge 252 of the barrier structure 25, the encapsulant 27 adheres to a portion, the interfacial stress between the contact surfaces of the transparent plate 26, the bonding layer 28 and the barrier structure 25 can be reduced, thereby providing a tighter engagement or fitting effect. In addition, when the upper edge 273 of the molding compound 27 does not exceed the first surface 261 of the transparent plate 26, the contamination of the transparent plate 26 due to the overflowing of the molding compound can be avoided in the manufacturing process, so as to ensure the normal function of the optical device package structure 20, and reduce the trouble of subsequent cleaning in the manufacturing process, and the use amount of the molding compound 27 can be reduced by removing the portion of the molding compound 27 protruding out of the transparent plate 26, thereby reducing the manufacturing cost.
The completed optical device package structure 20 must undergo a post-package temperature cycling test (e.g., AEC-Q100 test as a specification of automotive electronic products), wherein in the stage of testing mechanical stress, the optical device package structure 20 undergoes a temperature change of-65 ℃ to 150 ℃ for thousands of times to detect whether the optical device package structure 20 can withstand thermal expansion and contraction without generating interfacial peeling, and the laminated film 31 between the barrier structure 25 and the substrate 21 can absorb structural stress to prevent delamination between the substrate 21 and the barrier structure 25, thereby effectively improving the weather resistance and reliability of the optical device package structure 20.
In order to electrically connect the pads 231, wires, traces or circuits on the first surface 211 of the substrate 21 with the pins, leads, pads, traces or electrodes on the second surface 212, a conductive structure such as through holes (via) is usually disposed under the pads 231 and penetrates between the first surface 211 and the second surface 212. referring to fig. 3, the optical device package structure 20 of the present invention can be further improved, the openings of the through holes (via) 24 on the first surface 211 of the substrate 21 can be located under the optical device chip 22, the barrier structure 25, the encapsulant 27 or other circuit chips (not shown), if there is the laminated film 31, the laminated film 31 can be located under the laminated film 31, and the wires 232 on the first surface 211 of the substrate 21 cooperate with the wires 232 to complete the communication between the external circuits and the inside of the optical device package structure 20, and a protective film 32 is further covered on the wires 232, the protection film 32 is, for example, solder mask (green paint), and can protect the wiring 232 from being scratched or oxidized and corroded due to contact with the outside air, and provide a solder mask function to prevent short circuit or open circuit. In addition, because of the obstruction of the optical device chip 22, the isolation structure 25, the encapsulant 27 and the protection film 32, moisture is less likely to enter the accommodating region 35, so that the quality of the optical device package structure 20 can be maintained for a long time, and the weather resistance and reliability of the optical device package structure are greatly improved.
The inside of the through hole 24 is filled with a filler 241 according to a manufacturing process or a requirement, and the filler 241 may be a conductive material such as electroplated copper, a solder mask or a resin, so as to increase stability of electrical connection or further prevent moisture from penetrating into the accommodating area 35. The openings of the through holes 24 on the second surface 212 of the substrate 21 can be connected to pins, leads, pads, wires or electrodes (not shown) by different packaging types, such as Ball Grid Array (BGA), Leadless (LCC), Land Grid Array (LGA), Quad Flat Package (QFP), quad flat no-lead (QFN), or other packaging types. The through hole structure of the present embodiment can be applied to all embodiments described later and is not described in detail in each embodiment.
Fig. 4 to 10 show various embodiments and variations of the optical device package structure of the present invention, and only the main different features are described below, other non-mentioned devices may be used with similar devices in all embodiments of the present invention, and the materials, functions, and appearances thereof are not described again, and it should be noted that the main differences in the embodiments may also be applied to other embodiments, and are not limited to the embodiments shown in the individual drawings.
In fig. 4, a plurality of optical microstructures 222 can be disposed on the working surface (sensing surface) 221 of the optical device chip 22 to form a microlens array for providing diffraction, focusing or calibration functions to enhance the sensing effect of the optical device chip 22.
In fig. 5, if the molding compound 27 ' is formed by curing a liquid molding compound (liquid compound), the upper edge 273 ' of the molding compound 27 ' may not be parallel to the first surface 261 of the transparent plate 26, for example, the upper edge 273 ' of the molding compound 27 ' may form an angle θ with the extending plane of the first surface 261 of the transparent plate 26, and the angle θ is between about 5 degrees and 60 degrees according to the adhesion and cohesion of the liquid molding compound to the transparent plate 26.
In fig. 6, more than one chip may be disposed in the receiving area 35, such as the optical device chip 22 and the circuit chip 42 stacked in the figure, wherein the optical device chip 22 may be an image sensing chip and the circuit chip 42 may be an Image Signal Processor (ISP) or a Digital Signal Processor (DSP), the first surface 211 of the substrate 21 is disposed with a plurality of bonding pads 231 and 431, the optical device chip 22 above the stack structure is electrically connected to the bonding pad 231 by a bonding wire 23, and the circuit chip 42 below the stack structure is electrically connected to the bonding pad 431 by a bonding wire 43, so as to realize a multi-chip package (multi-chip package), and integrate a plurality of chips in one package structure, which saves a lot of space compared with individual packages, and is helpful for reducing the volume of an electronic product.
In fig. 7, the position of the bonding pad 231 electrically connected to the optical device chip 22 can be moved from the first surface 211 of the substrate 21 to the upper surface of the barrier structure 25, and the inner edge 281 of the bonding layer 28 is not aligned with the inner edge 251 of the barrier structure 25, but the inner edge 252 of the barrier structure 25 is moved to make a portion of the upper edge 253 of the barrier structure 25 for placing the bonding pad 231, in this embodiment, a conductive structure (not shown) is disposed inside the barrier structure 25 such that the bonding pad 231 can be electrically connected to an internal circuit or an external circuit (not shown). For the multi-chip package structure, there are a plurality of corresponding pads 231 in the receiving area 35, and according to different structure designs, all the pads 231 can be selectively placed on the first surface 211 of the substrate 21 or the upper edge 253 of the isolation structure 25, or partially placed on the first surface 211 of the substrate 21 and partially placed on the upper edge 253 of the isolation structure 25.
In fig. 8, the optical device package 20 may further include at least one passive device 51, wherein the passive device 51 is disposed on the upper edge 253 of the barrier structure 25 and is covered and protected by the encapsulant 27'. In this embodiment, the barrier structure 25 is internally disposed with a conductive structure (not shown) so that the passive element 51 can be electrically connected to an internal circuit or an external circuit (not shown).
In fig. 9, the transparent plate 26 'has a step-shaped side edge 263', and the inner edge 271 'of the encapsulant 27' completely covers the step-shaped side edge 263 'of the transparent plate 26', so that the contact area between the encapsulant 27 'and the transparent plate 26' in different directions is increased, and a tighter engagement or embedding effect is provided, so that the bonding between the encapsulant 27 'and the transparent plate 26' is firmer, and the reliability of the optical device package 20 is higher.
In fig. 10, because the outer edge 282 of the bonding layer 28 is recessed from the side edge 263 of the transparent plate 26 and the outer edge 252 of the blocking structure 25 (i.e. the distance from the inner edge 281 of the bonding layer 28 to the outer edge 282 is smaller than the distance from the inner edge 281 of the bonding layer 28 to the side edge 263 of the transparent plate 26 and the distance from the inner edge 281 of the bonding layer 28 to the outer edge 252 of the blocking structure 25), as mentioned above, the interfacial stress between the contact surfaces of the transparent plate 26 and the bonding layer 28 can be reduced, so as to provide a tighter engagement or engagement effect, therefore, the usage amount of the encapsulant 57 can be further reduced on the premise that the engagement force is increased, the portion of the outer edge 572 of the encapsulant 57 protruding from the outer edge 252 of the blocking structure 25 is gradually reduced, even the two portions are aligned, and therefore, the encapsulant 57 does not contact the substrate 21, i.e. the inner edge of the encapsulant 57 contacts and adheres to the side edge 263 of the transparent plate, The outer edge 282 of the bonding layer 28 and a part of the upper edge 253 of the barrier structure 25 (between the outer edge 282 of the bonding layer 28 and the outer edge 252 of the barrier structure 25) can reduce the area of the substrate 21 and the amount of the encapsulant 57, and achieve the effects of miniaturization of the package structure and reduction of the manufacturing cost.
The features included in the embodiments related to fig. 3-10 include via locations, optical microstructures, top edge of encapsulant bevel, stacked chips, pad location modification, passive components, stepped side edges of transparent plates, small-sized structures, etc. that can be applied to the embodiment of fig. 2 alone or in combination, it should be noted that the present invention is not limited to the aspects shown in the respective figures.
Fig. 11A shows a substrate design for forming the optical device package structure of the present invention, a blocking structure 25 is formed above a substrate 21 having a through hole, a wiring, and a protective film (solder mask), the blocking structure 25 exposes the substrate 21 to be a part of the accommodating area 35, and a groove 65 is provided around the accommodating area 35, then steps of attaching a chip, connecting and routing, forming a bonding layer, placing a transparent plate, etc. are completed in the accommodating area 35, then an encapsulant is coated integrally, the height of the encapsulant is substantially flush with the surface of the transparent plate, or a little recess is formed between the two units, and finally a cutting operation is performed along the groove 65, so as to obtain the optical device package structure shown in the side view of fig. 11B, where substantially the entire package structure is covered by the encapsulant 27', and only the blocking structures 25 at four corners are exposed.
Fig. 12A shows another substrate design for forming the optical device package structure of the present invention, in which the blocking structure 25 is formed above the substrate 21 with through holes, wires and protective film (solder mask), the blocking structure 25 is only formed around the accommodating area 35, the two units are separated by the space 66, then the steps of attaching chips, connecting and routing, forming a bonding layer, placing a transparent plate, etc. are completed in the accommodating area 35, then the whole package body is coated with a sealant, the height of the sealant is substantially flush with the surface of the transparent plate, or the two units are slightly recessed, and finally, the cutting operation is performed along the space 66, so as to obtain the optical device package structure shown in the side view of fig. 12B, and it can be seen that the whole structure is covered by the sealant 27'.
Fig. 13A shows another substrate design for forming the optical device package structure of the present invention, in which a blocking structure 25 is formed above a substrate 21 with through holes, wires and a protective film (solder mask), the blocking structure 25 exposes the substrate 21 to become a part of the accommodating area 35, then the steps of attaching a chip, connecting wires, forming a bonding layer, placing a transparent plate, etc. are completed in the accommodating area 35, then a sealant is integrally coated, the height of the sealant is substantially flush with the surface of the transparent plate, or the space between the two units is slightly recessed, and finally, a cutting operation is performed, so as to obtain the optical device package structure shown in fig. 10, fig. 13B is a side view thereof, the sealant 57 covers the blocking structure 25 without contacting the substrate 21, and the outer edge 252 of the blocking structure 25 is aligned with the side edge 213 of the substrate 21.
It should be noted that the number of cells in the substrate shown in fig. 11A-13A is only for illustrative purposes and is not intended to limit the scope of the present invention, and the number can be adjusted according to the actual design and requirement of the process line width.
In summary, the present invention provides the recessed bonding layer to increase the fixing and adhesion capability of the encapsulant, so as to reduce the usage amount of the package material and prevent the contamination of the transparent plate, and further, the approach of blocking the entry of moisture is used to greatly delay the entry of moisture into the optical device package structure, thereby achieving the effects of improving the weather resistance and reliability of the optical device package structure and reducing the package size.
Claims (7)
1. An optical package assembly, comprising:
a substrate having a first surface and a second surface opposite to each other;
the barrier structure is formed on the first surface of the substrate and surrounds an accommodating area on the substrate;
an optical component chip disposed on the first surface of the substrate and in the accommodating region;
at least one routing wire, electrically connecting the optical component chip and an external circuit;
a bonding layer formed above part of the upper edge of the barrier structure;
a light-transmitting plate, which is arranged on the bonding layer and completely covers the bonding layer and the accommodating area, wherein the side edge of the light-transmitting plate exceeds the outer edge of the bonding layer, the light-transmitting plate is provided with a first surface and a second surface which are opposite, and the second surface faces the accommodating area; and
and the sealant completely covers the side edge of the light-transmitting plate and the outer edge of the bonding layer, and partially covers the second surface of the light-transmitting plate and the upper edge of the barrier structure, and the outer edge of the sealant is aligned with the outer edge of the barrier structure.
2. The optical package according to claim 1, wherein an angle between the upper edge of the encapsulant and the extending plane of the first surface of the transparent plate is between 5 degrees and 60 degrees.
3. The optical device package structure of claim 1, further comprising a plurality of pads connected to the at least one wire bond, each pad disposed on the first surface of the substrate or the upper edge of the barrier structure.
4. The optical device package according to claim 1, wherein the substrate has a plurality of through holes penetrating through the first surface and the second surface of the substrate, the openings of the through holes on the first surface of the substrate are located under the optical device chip, the blocking structure or the encapsulant, and a protective film is formed between the openings and the optical device chip, the blocking structure or the encapsulant.
5. The optical device package according to claim 1, wherein the transparent plate has a stepped side edge, and the encapsulant completely covers the stepped side edge.
6. An optical package assembly, comprising:
a substrate having a first surface and a second surface opposite to each other;
the barrier structure is formed on the first surface of the substrate and surrounds an accommodating area on the substrate;
an optical component chip disposed on the first surface of the substrate and in the accommodating region;
at least one routing wire, electrically connecting the optical component chip and an external circuit;
a light-transmitting plate, which is arranged on the barrier structure and completely covers the accommodating area;
the bonding layer is positioned between the light-transmitting plate and the barrier structure, the light-transmitting plate completely covers the bonding layer, and the side edge of the light-transmitting plate exceeds the outer edge of the bonding layer; and
the sealing colloid completely covers the side edge of the light-transmitting plate and the outer edge of the connecting layer, and the outer edge of the sealing colloid is aligned with the outer edge of the barrier structure;
the substrate is provided with a plurality of through holes penetrating through the first surface and the second surface of the substrate, openings of the through holes on the first surface of the substrate are positioned below the optical component chip, the blocking structure or the sealing colloid, a protective film is formed between the openings and the optical component chip, the blocking structure or the sealing colloid, the protective film is solder mask, and the routing wire is electrically connected to the external circuit through the through holes.
7. The optical device package according to claim 6, wherein the through hole is filled with a conductive material, solder resist or resin.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106120055A TWI648848B (en) | 2016-06-21 | 2017-06-15 | Optical component package structure |
| US15/623,596 US10170508B2 (en) | 2016-06-21 | 2017-06-15 | Optical package structure |
| JP2017120827A JP6473778B2 (en) | 2016-06-21 | 2017-06-20 | Optical sealing structure |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662352608P | 2016-06-21 | 2016-06-21 | |
| US62/352,608 | 2016-06-21 | ||
| US201662353154P | 2016-06-22 | 2016-06-22 | |
| US62/353,154 | 2016-06-22 |
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| CN107527928A CN107527928A (en) | 2017-12-29 |
| CN107527928B true CN107527928B (en) | 2020-04-07 |
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| CN201710067651.6A Active CN107527928B (en) | 2016-06-21 | 2017-02-07 | Optical assembly packaging structure |
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| JP (1) | JP6473778B2 (en) |
| CN (1) | CN107527928B (en) |
| TW (1) | TWI648848B (en) |
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| CN115903300B (en) * | 2021-08-18 | 2024-06-07 | 庆鼎精密电子（淮安）有限公司 | Backlight plate and manufacturing method thereof |
| CN113691229B (en) * | 2021-08-25 | 2023-11-28 | 北京超材信息科技有限公司 | Acoustic device package structure |
| CN114284161A (en) * | 2021-12-23 | 2022-04-05 | 江苏中科智芯集成科技有限公司 | Semiconductor chip packaging method and chip packaging structure |
| CN115241297B (en) * | 2022-09-23 | 2023-01-31 | 江苏长电科技股份有限公司 | Chip packaging structure and manufacturing method thereof |
| CN115527957B (en) * | 2022-11-29 | 2023-03-24 | 江苏长电科技股份有限公司 | Cavity packaging structure and packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
| US6603183B1 (en) * | 2001-09-04 | 2003-08-05 | Amkor Technology, Inc. | Quick sealing glass-lidded package |
| EP1357605A1 (en) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Image sensor semiconductor package with castellation |
| CN1577875A (en) * | 2003-07-29 | 2005-02-09 | 许程翔 | Horizontal control image sensing chip packaging structure and packaging method thereof |
| TWM264648U (en) * | 2004-10-21 | 2005-05-11 | Chipmos Technologies Inc | Image sensor package |
| CN1921126A (en) * | 2005-08-25 | 2007-02-28 | 矽格股份有限公司 | Photo-sensor packaging structure |
| TWI349983B (en) * | 2007-11-07 | 2011-10-01 | Advanced Semiconductor Eng | Memes package structure |
| TW201104850A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure with large air cavity |
| TW201104747A (en) * | 2009-07-29 | 2011-02-01 | Kingpak Tech Inc | Image sensor package structure |
| TWI511243B (en) * | 2009-12-31 | 2015-12-01 | Xintec Inc | Chip package and fabrication method thereof |
| JP2012069851A (en) * | 2010-09-27 | 2012-04-05 | Sony Corp | Method of manufacturing solid state image pickup device, and solid state image pickup device |
| CN103021598B (en) * | 2011-09-26 | 2016-05-25 | 聚鼎科技股份有限公司 | Over-current protecting element |
| JP5875821B2 (en) * | 2011-09-30 | 2016-03-02 | 太陽インキ製造株式会社 | Photosensitive resin composition, cured film thereof and printed wiring board |
| TWI540709B (en) * | 2012-12-28 | 2016-07-01 | 群豐科技股份有限公司 | Optoelectronic package and method of manufacturing the same |
| JP6221299B2 (en) * | 2013-03-28 | 2017-11-01 | 日本電気株式会社 | Hermetic sealing body and hermetic sealing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107527928A (en) | 2017-12-29 |
| JP6473778B2 (en) | 2019-02-20 |
| TW201810634A (en) | 2018-03-16 |
| JP2017228779A (en) | 2017-12-28 |
| TWI648848B (en) | 2019-01-21 |
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Effective date of registration: 20230116 Address after: Taipei City, Taiwan Chinese Zhongzheng District Yanping Road No. 83 6 floor Patentee after: TONG HSING ELECTRONIC INDUSTRIES, Ltd. Address before: No. 84, Taihe Road, Zhubei City, Xinzhu County Patentee before: KINGPAK TECHNOLOGY Inc. |