CN217562561U - Lead frame of semiconductor chip - Google Patents
Lead frame of semiconductor chip Download PDFInfo
- Publication number
- CN217562561U CN217562561U CN202220379840.3U CN202220379840U CN217562561U CN 217562561 U CN217562561 U CN 217562561U CN 202220379840 U CN202220379840 U CN 202220379840U CN 217562561 U CN217562561 U CN 217562561U
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- CN
- China
- Prior art keywords
- positioning
- lead
- semiconductor chip
- lead frame
- packaging
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor chip's lead frame, include: the unit body comprises a packaging body and a packaging positioning groove, and the packaging positioning groove is arranged on the outer side of the packaging body in a surrounding manner; the positioning piece comprises an outer pin and a transverse rib, and the outer pin is arranged on the outer side of the packaging positioning groove; the stress release groove is arranged on one side of the positioning piece; and the casting runner hole is arranged on one side of the positioning piece, which is far away from the stress release groove, and is used for injection molding materials. The utility model discloses can guarantee product strength and quality, subsequent cutting process of being convenient for avoids the product to take place deformation or damage.
Description
Technical Field
The utility model relates to a semiconductor electronic component technical field especially relates to a semiconductor chip's lead frame.
Background
Along with the rapid development of semiconductors in recent years, electronic products are increasingly applied to daily life, wherein the products of surface mount diodes and surface mount triodes are most widely applied, due to the increase of market demand, the appearance of a lead frame bearing a chip is increasingly large, the density of packaged products in a unit area is also increasingly high, and the density of the frame is improved while the density of the frame is improved, so that the surface mount diodes and the surface mount triodes are applicable to different occasions, various grades of green environment-friendly resins with different electrical properties are different in viscosity, flowability, forming temperature and the like, the diameters and the materials of gold wires connected with the chip are continuously and alternately used for adapting to different use environments, the materials of the gold wires are pure gold, pure aluminum and the like, and the diameters of the gold wires are also different.
The semiconductor often has insufficient product strength in the packaging process, and the produced product is deformed and uneven or damaged to influence subsequent cutting or other processing.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor chip's lead frame, it can guarantee product intensity and quality, and subsequent cutting process of being convenient for avoids the product to take place deformation or damage.
In order to solve the technical problem, the utility model provides a semiconductor chip's lead frame, include:
the unit body comprises a packaging body and a packaging positioning groove, and the packaging positioning groove is arranged on the outer side of the packaging body in a surrounding manner;
the positioning piece comprises an outer pin and a transverse rib, and the outer pin is arranged on the outer side of the packaging positioning groove;
the stress release groove is arranged on one side of the positioning piece;
and the casting runner hole is arranged on one side, far away from the stress release groove, of the positioning piece and is used for injecting and molding materials.
Preferably, the package body comprises two base islands and two pin wiring areas, the two sides of each of the two base islands are provided with the pin wiring areas, and a gold wire is connected between each of the base islands and the pin wiring areas.
Preferably, an injection molding glue inlet is formed in one end of the packaging positioning groove, and the injection molding glue inlet is formed in one end face, close to the casting runner hole, of the packaging positioning groove.
Preferably, in the above technical solution, the number of the unit bodies and the positioning members is set to be plural, and frame side rails are arranged at the bottoms of the plural unit bodies and the positioning members.
Preferably, the positioning member further comprises a positioning plate, the positioning plate is arranged at two sides close to the unit bodies, the number of the outer pins is set to be multiple, the outer pins are evenly arranged on the surface of the positioning plate, and transverse ribs are filled between the positioning plate and the packaging positioning grooves.
Preferably, the stress relief groove and the casting runner hole are arranged on the surface of the frame side rail and communicated with the frame side rail, the surface of the frame side rail is further provided with a first positioning hole and a second positioning hole, and the first positioning hole and the second positioning hole are sequentially arranged on the outer side of the unit body.
Preferably, the number of the stress relief grooves and the number of the casting runner holes are multiple, and the stress relief grooves and the casting runner holes are respectively arranged on two sides of the unit body.
Preferably, the base island and the lead routing area are respectively provided with a first lead and a second lead at one end, and the first lead and the second lead are oppositely arranged.
As the optimization of the technical scheme, the first pin and the second pin are both perpendicular to the injection molding glue inlet, and the transverse rib is arranged around the outer sides of the first pin and the second pin.
Preferably, notches are uniformly formed in the surface of the unit body, and scribing grooves are uniformly formed in the surfaces of the first pin and the second pin.
The utility model provides a lead frame of semiconductor chip, it has the cell cube, the setting element, stress relief groove and casting runner hole, the encapsulation constant head tank location is will encapsulate the constant head tank location by the setting element again after the encapsulation constant head tank of cell cube will encapsulate the body fixed, can be convenient for subsequent cutting when guaranteeing product strength, guarantee product quality, and the first locating hole and the second locating hole of controlling the dispersion can carry out the operation processing respectively, be convenient for adjust according to the processing demand, and the production cost is reduced, stress relief groove can be at the in-process release stress of moulding plastics simultaneously, avoid the in-process product to take place deformation or damage, guarantee the quality of product.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the basic unit and the positioning member of the present invention;
FIG. 3 is a schematic structural diagram of the basic unit of the present invention;
fig. 4 is a schematic view of the edge surface of the basic unit body of the present invention.
In the figure: 1 unit body, 11 packaging bodies, 111 base islands, 112 pin wiring areas, 113 gold wire leads, 12 packaging positioning grooves, 121 injection molding glue inlet, 2 positioning pieces, 21 outer pins, 22 transverse ribs, 3 frame side rails, 4 stress relief grooves, 5 casting runner holes, 51 first positioning holes, 52 second positioning holes, 6 first pins, 7 second pins, 8 notches and 9 wiring grooves.
Detailed Description
To make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention are described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of the present invention provides a lead frame of a semiconductor chip, including:
the unit body 1 comprises a packaging body 11 and a packaging positioning groove 12, and the packaging positioning groove 12 is arranged on the outer side of the packaging body 11 in a surrounding mode;
the positioning piece 2 comprises an outer pin 21 and a transverse rib 22, wherein the outer pin 21 is arranged outside the packaging positioning groove 12;
the stress release groove 4 is arranged on one side of the positioning piece 2;
and the casting runner hole 5 is arranged on one side, far away from the stress release groove 4, of the positioning piece 2, and the casting runner hole 5 is used for injection molding materials.
This embodiment provides a semiconductor chip's lead frame, it has the cell cube 1, setting element 2, stress relief groove 4 and casting runner hole 5, the encapsulation constant head tank 12 of cell cube 1 will encapsulate the constant head tank 12 location by setting element 2 after with the encapsulation 11 is fixed again, can be convenient for subsequent cutting when guaranteeing product strength, guarantee product quality, and control the first locating hole 51 and the second locating hole 52 of dispersion and can carry out the operation processing respectively, be convenient for adjust according to the processing demand, and the production cost is reduced, stress relief groove 4 can be at the in-process release stress of moulding plastics simultaneously, avoid the in-process product to take place deformation or damage, guarantee the quality of product.
In a further implementation manner of this embodiment, the package body 11 includes two base islands 111 and two pin bonding areas 112, the two base islands 111 are respectively provided with the pin bonding areas 112 on two sides, and a gold wire 113 is connected between the base island 111 and the pin bonding area 112.
In this embodiment, a chip is placed on the base island 111, the pin bonding areas 112 on both sides of the base island 111 are connected to the chip in the base island 111 through gold wires 113, and the pins 7 are connected to the outside through the pin bonding areas 112, so that the chip is mounted and connected.
In a further implementation manner of the present embodiment, an injection molding glue inlet 121 is disposed at an end of the packaging positioning groove 12, and the injection molding glue inlet 121 is disposed at an end surface of the packaging positioning groove 12 close to the casting runner hole 5.
The injection molding glue inlet 121 in this embodiment injects glue, and the unit body 1 is molded by gradually injecting the glue.
In a further implementation manner of this embodiment, the number of the unit bodies 1 and the positioning members 2 is set to be multiple, and the bottom of the multiple unit bodies 1 and the positioning members 2 are provided with the frame side rails 3.
A plurality of unit bodies 1 and setting element 2 in this embodiment arrange in proper order and set up 3 surfaces on the cabinet of frame side, can carry out the production and the processing of a plurality of unit bodies 1 simultaneously, and production efficiency is high.
In the further implementation manner of this embodiment, the positioning member 2 further includes positioning plates disposed on two sides of the unit body 1, the number of the outer pins 21 is set to be multiple and uniformly disposed on the surface of the positioning plate, and the transverse ribs 22 are filled between the positioning plate and the package positioning grooves 12.
The positioning piece 2 in the embodiment positions the unit bodies 1 on the inner side, so that the strength of the product can be ensured, the subsequent cutting is facilitated, and the product quality is ensured.
In a further implementation manner of this embodiment, the stress relief groove 4 and the casting runner hole 5 are disposed on the surface of the frame side rail 3 and are communicated with the frame side rail 3, the surface of the frame side rail 3 is further provided with a first positioning hole 51 and a second positioning hole 52, and the first positioning hole 51 and the second positioning hole 52 are sequentially arranged outside the unit body 1.
In a further implementation manner of this embodiment, the number of the stress relief grooves 4 and the number of the casting runner holes 5 are both multiple, and the stress relief grooves 4 and the casting runner holes 5 are respectively disposed on two sides of the unit body 1.
In a further implementation manner of the present embodiment, the base island 111 and the pin wiring region 112 are respectively provided with a first pin 6 and a second pin 7 at one end, and the first pin 6 and the second pin 7 are oppositely arranged.
The first pins 6 and the second pins 7 in the embodiment are arranged in a staggered manner and are uniformly connected with the packaging body 11, so that the uniformity and flatness of the whole product are ensured.
In a further implementation manner of this embodiment, the first pin 6 and the second pin 7 are both perpendicular to the injection molding glue inlet 121, and the transverse rib 22 is disposed around the outer sides of the first pin 6 and the second pin 7.
The transverse ribs 22 in this embodiment support the first pins 6 and the second pins 7, so that the pins are prevented from being broken, and the transverse ribs 22 are cut off in subsequent processing operations.
In a further implementation manner of this embodiment, the surface of the unit body 1 is uniformly provided with the notches 8, and the surfaces of the first leads 6 and the second leads 7 are uniformly provided with the scribing grooves 9.
The notch 8 in this embodiment can enhance the combination with the molding compound, and the scribing groove 9 realizes the performance of water resistance and enhanced air tightness in the packaging body 11, thereby improving the overall reliability.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A lead frame for a semiconductor chip, comprising:
the unit body (1) comprises a packaging body (11) and packaging positioning grooves (12), wherein the packaging positioning grooves (12) are arranged on the outer side of the packaging body (11) in a surrounding mode;
the positioning piece (2) comprises outer pins (21) and transverse ribs (22), and the outer pins (21) are arranged on the outer side of the packaging positioning groove (12);
the stress release groove (4) is arranged on one side of the positioning piece (2);
and the casting runner hole (5) is arranged on one side, away from the stress release groove (4), of the positioning piece (2), and the casting runner hole (5) is used for injection molding materials.
2. The lead frame of a semiconductor chip according to claim 1, wherein the package body (11) comprises two base islands (111) and two pin bonding areas (112), the two base islands (111) are provided with the pin bonding areas (112) on two sides, and a gold wire (113) is connected between the base islands (111) and the pin bonding areas (112).
3. The lead frame of a semiconductor chip according to claim 2, wherein an injection molding glue inlet (121) is formed at one end of the package positioning slot (12), and the injection molding glue inlet (121) is formed at one end face of the package positioning slot (12) close to the casting runner hole (5).
4. The lead frame of a semiconductor chip according to claim 3, wherein the number of the unit bodies (1) and the positioning members (2) is plural, and a frame side rail (3) is provided at the bottom of the plural unit bodies (1) and the positioning members (2).
5. The lead frame of a semiconductor chip according to claim 3, wherein the positioning member (2) further comprises positioning plates disposed at two sides near the unit body (1), the number of the outer pins (21) is set to be plural and uniformly disposed on the surface of the positioning plate, and transverse ribs (22) are filled between the positioning plate and the package positioning grooves (12).
6. The lead frame of a semiconductor chip according to claim 4, wherein the stress relief groove (4) and the casting runner hole (5) are disposed on the surface of the frame side rail (3) and communicate with the frame side rail (3), the surface of the frame side rail (3) is further provided with a first positioning hole (51) and a second positioning hole (52), and the first positioning hole (51) and the second positioning hole (52) are sequentially disposed outside the unit body (1).
7. The lead frame for semiconductor chips according to claim 1, wherein the stress relief grooves (4) and the casting runner holes (5) are provided in plural numbers, and the stress relief grooves (4) and the casting runner holes (5) are respectively provided on both sides of the unit body (1).
8. Lead frame for a semiconductor chip according to claim 5, wherein the base island (111) and the lead bonding area (112) are respectively provided with a first lead (6) and a second lead (7) at one end, and the first lead (6) and the second lead (7) are oppositely arranged.
9. The lead frame of a semiconductor chip according to claim 8, wherein the first lead (6) and the second lead (7) are both perpendicular to the injection molding glue inlet (121), and the transverse rib (22) is disposed around the outer sides of the first lead (6) and the second lead (7).
10. Lead frame for semiconductor chips according to claim 8, characterized in that the unit body (1) has notches (8) uniformly formed on the surface thereof, and the first lead (6) and the second lead (7) have scribe grooves (9) uniformly formed on the surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220379840.3U CN217562561U (en) | 2022-02-24 | 2022-02-24 | Lead frame of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220379840.3U CN217562561U (en) | 2022-02-24 | 2022-02-24 | Lead frame of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217562561U true CN217562561U (en) | 2022-10-11 |
Family
ID=83468066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220379840.3U Active CN217562561U (en) | 2022-02-24 | 2022-02-24 | Lead frame of semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217562561U (en) |
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2022
- 2022-02-24 CN CN202220379840.3U patent/CN217562561U/en active Active
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