CN203876150U - Electronic packaging mould - Google Patents
Electronic packaging mould Download PDFInfo
- Publication number
- CN203876150U CN203876150U CN201420287752.6U CN201420287752U CN203876150U CN 203876150 U CN203876150 U CN 203876150U CN 201420287752 U CN201420287752 U CN 201420287752U CN 203876150 U CN203876150 U CN 203876150U
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- China
- Prior art keywords
- material feeding
- feeding groove
- packaging
- guiding gutter
- groove
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004100 electronic packaging Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims description 135
- 238000003860 storage Methods 0.000 abstract description 5
- 239000011148 porous material Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000005022 packaging material Substances 0.000 abstract 7
- 238000002347 injection Methods 0.000 abstract 3
- 239000007924 injection Substances 0.000 abstract 3
- 238000005345 coagulation Methods 0.000 description 19
- 230000015271 coagulation Effects 0.000 description 19
- 238000005538 encapsulation Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 5
- 241001466460 Alveolata Species 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
Abstract
The utility model relates to the field of electronic packaging, and provides an electronic packaging mould which comprises an upper mould and a lower mould, wherein an injection tank, a guide tank, a storage tank and an exhaust tank which are sequentially communicated are arranged at the top of the lower mould, the injection tank penetrates out from the side wall of one side of the lower mould, the exhaust tank penetrates out from the side wall of the other side of the lower mould, a packaging hole is arranged at the bottom of the guide tank and used for accommodating an electronic element arranged at one side of a packaging substrate, and the upper mould is used for pressing the packaging substrate on the top of the lower mould so that the packaging substrate is connected with openings of the injection tank, the guide tank, the storage tank and the exhaust tank in a sealing manner. Bubbles are easily mixed in a packaging material when the packaging material passes through the electronic element in the packaging hole, the packaging material in which the bubbles are mixed continuously flows in the storage tank, and the packaging material containing the bubbles in the guide tank is gradually replaced by a newly-injected packaging material, so that no bubbles or pores are contained in the packaging material formed in the guide tank in a solidifying manner, and thus the packaging quality is improved; meanwhile, the packaging material in the storage tank can be recycled without being wasted.
Description
Technical field
The utility model relates to Electronic Packaging field, particularly a kind of Electronic Packaging mould.
Background technology
Electronic Packaging is that each electronic component in integrated circuit is noted to last layer shell by encapsulating mould; not only play a part to lay, fix, seal, protect chip and increased thermal conductivity energy; but also be the bridge of linking up electronic component Inner-world and external circuit; contact on chip is wired on the pin of package casing, and these pins connect by the wire on printed circuit board (PCB) and other devices again.The general flow of Electronic Packaging is, first electronic component is bonded on base plate for packaging,, after material solidification moulding to be packaged, electronic component is communicated with to shell and bonding substrate thereof and together cuts down in order to using at the periphery of electronic component note last layer encapsulating material by Electronic Packaging mould.For a lot of electronic products, encapsulation technology is all unusual the key link.
Existing Electronic Packaging mould generally comprises the upper die and lower die that are bonded with each other together, between upper die and lower die, be provided with die cavity, the structure of die cavity is determined according to the shape of electronic component in integrated circuit, and die cavity is provided with sprue for injecting encapsulating material and the exhaust outlet for Exhaust Gas.When encapsulation, the base plate for packaging of bonding electronic component is placed between upper die and lower die, encapsulating material is injected in die cavity through sprue, the gas in die cavity is discharged from exhaust outlet, and encapsulating material is coagulation forming in die cavity, completes encapsulation.
But, in actual production, notify irregularly due to the shape of electronic component, when encapsulating material is when the electronic component, easily gas is sneaked in encapsulating material, at middle formation bubble or the pore of encapsulating material, affect package quality.
Utility model content
(1) technical problem that will solve
The technical problems to be solved in the utility model is easily to contain bubble or pore in the encapsulating material of the packaged moulding of existing Electronic Packaging mould, and package quality is exerted an influence.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides a kind of Electronic Packaging mould, comprise upper die and lower die, the top of described counterdie is provided with the material feeding groove being communicated with successively, guiding gutter, stock chest and air discharge duct, described material feeding groove runs through a side sidewall of described counterdie, described air discharge duct runs through the opposite side sidewall of described counterdie, the bottom land of described guiding gutter is provided with encapsulated holes, the electronic component arranging for holding base plate for packaging one side, described patrix is for being pressed on described base plate for packaging at the top of described counterdie, make described base plate for packaging and described material feeding groove, guiding gutter, the notch of stock chest and air discharge duct is tightly connected.
Preferably, be also communicated with the discharge groove of flat between described guiding gutter and described stock chest, described discharge groove can be tightly connected with described base plate for packaging.
Preferably, the thickness of described discharge groove is 0.01-0.02mm.
Preferably, be also communicated with the feed well of flat between described material feeding groove and described guiding gutter, described feed well can be tightly connected with described base plate for packaging.
Preferably, it is characterized in that, the thickness of described feed well is 0.01-0.02mm.
Preferably, described guiding gutter is multiple tracks.
What preferably, described encapsulated holes was longitudinal arrangement at the bottom land of described guiding gutter is multiple.
Preferably, the bottom of described counterdie is plane.
Preferably, described material feeding groove, guiding gutter, stock chest and air discharge duct are the groove shape panel that is embedded in described counterdie top.
Preferably, described material feeding groove comprises main material feeding groove and secondary material feeding groove, the sidewall of described counterdie is run through in one end of described main material feeding groove, described secondary material feeding groove is communicated with the side at described main material feeding groove, described material feeding groove is communicated with by described secondary material feeding groove and described guiding gutter, and the other end of described main material feeding groove is communicated with described stock chest.
(3) beneficial effect
A kind of Electronic Packaging mould that the utility model provides, in the process of encapsulation, encapsulating material is injected in guiding gutter by sprue, because it easily sneaks into bubble when the electronic component by encapsulated holes, the encapsulating material of sneaking into bubble continues to be injected in stock chest, in this process, the encapsulating material newly being injected gradually containing alveolate encapsulating material in guiding gutter replaces, make in the encapsulating material of final coagulation forming not bubbles or pore, thereby improve package quality, and encapsulating material recoverable in stock chest, does not produce waste.
Brief description of the drawings
Fig. 1 is the schematic diagram of the counterdie of a kind of Electronic Packaging mould of the utility model embodiment mono-.
Fig. 2 is the schematic diagram of the counterdie of a kind of Electronic Packaging mould of the utility model embodiment bis-.
Fig. 3 is the schematic diagram of the encapsulating material after the moulding of the utility model embodiment bis-.
Wherein:
1, material feeding groove; 11, main material feeding groove; 12 level material feeding grooves; 2, guiding gutter; 3, stock chest; 4, air discharge duct; 5, encapsulated holes; 6, feed well; 7, discharge groove; 8, sprue groove; 9, bolt hole; The encapsulating material of coagulation forming in a, main material feeding groove; The encapsulating material of coagulation forming in b, secondary material feeding groove; The encapsulating material of coagulation forming in c, stock chest; The encapsulating material of coagulation forming in d, guiding gutter.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is described in further detail.Following examples are used for illustrating the utility model, but are not used for limiting scope of the present utility model.
Embodiment mono-
As Fig. 1, a kind of Electronic Packaging mould that the utility model embodiment mono-provides, comprise upper die and lower die, the top of counterdie is provided with the material feeding groove 1 being communicated with successively, guiding gutter 2, stock chest 3 and air discharge duct 4, material feeding groove 1 runs through a side sidewall of counterdie, be used for injecting encapsulating material, air discharge duct 4 runs through the opposite side sidewall of counterdie, for Exhaust Gas, the bottom land of guiding gutter 2 is provided with encapsulated holes 5, for holding the electronic component of base plate for packaging one side, electronic component is chip or the LED diode etc. in integrated circuit, because upper die and lower die are generally metal material or other hard materials, and the encapsulation of electronic component is comparatively strict to the requirement of encapsulation precision, meet the cell body that encapsulation precision requires if directly offer on counterdie, difficulty of processing to counterdie is very big, therefore preferably by material feeding groove 1, guiding gutter 2, stock chest 3 and encapsulation groove are all set to be embedded in the groove shape panel at counterdie top, groove shape panel adopts DC53 material, the intensity of DC53 material, toughness is all very outstanding, especially comparatively outstanding in cold work die steel, with DC53 manufacture instrument seldom there is crackle and cracking, greatly improve service life, patrix is for being pressed on base plate for packaging the top of counterdie, make base plate for packaging and material feeding groove 1, guiding gutter 2, the notch of stock chest 3 and air discharge duct 4 is tightly connected, all sides of upper die and lower die are relatively set with bolt hole 9, upper mould cover is located on base plate for packaging and with counterdie and is bolted connection, due to the not installing electronic elements of the back side of base plate for packaging, therefore it is plane that the bottom of patrix is set to, can make it evenly exert pressure to base plate for packaging, thereby make the opposite side of base plate for packaging and the material feeding groove 1 at counterdie top, guiding gutter 2, between the notch of stock chest 3 and air discharge duct 4, have better sealing effectiveness.
When encapsulation, by material feeding groove 1, encapsulating material is injected in guiding gutter 2, for different electronic components, use different encapsulating materials, encapsulating material is in the time of the encapsulated holes 5 through guiding gutter 2 bottom lands, due to the out-of-shape of electronic component, around electronic component, easily sneak into bubble, continue under the effect of pressure, to flow in stock chest 3 with alveolate encapsulating material, gas in stock chest 3 is discharged by air discharge duct 4, in this process, the encapsulating material that encapsulating material with bubble in guiding gutter 2 is newly injected gradually replaces, make the finally not bubbles of encapsulating material of coagulation forming in guiding gutter 2, improve package quality, and the recyclable recycling of encapsulating material in stock chest 3 and material feeding groove 1, do not produce waste.
Preferably, between guiding gutter 2 and stock chest 3, be also communicated with the discharge groove 7 of flat, discharge groove 7 can be tightly connected with base plate for packaging, in the time being with alveolate encapsulating material to be injected into guiding gutter 2 with discharge groove 7 intersection, liquid encapsulating material is not easy by narrow discharge groove 7, gas in encapsulating material is easier to by discharge groove 7 by contrast, be that encapsulating material is when by discharge groove 7, bubble wherein is easily separated from encapsulating material, make the volume of the encapsulating material that enters into stock chest 3 relatively less, can reduce thus the volume of stock chest 3.And because discharge groove 7 is flat, encapsulating material coagulation forming is wherein laminar, easily fracture, make the convenient separation of the encapsulating material of coagulation forming in the encapsulating material of coagulation forming in stock chest 3 and guiding gutter 2, and encapsulating material in stock chest 3 can also carry out recycling, thereby do not produce waste.Same, between material feeding groove 1 and guiding gutter 2, be communicated with the feed well 6 of flat, feed well 6 can be tightly connected with base plate for packaging, encapsulating material coagulation forming in feed well 6 is laminar, encapsulating material in material feeding groove 1 is easily separated with the encapsulating material in guiding gutter 2, thus convenient recycling.The thickness of discharge groove 7 and feed well 6 is preferably 0.01-0.02mm, neither affects the patency of encapsulating material, can make again encapsulating material wherein easily fracture after coagulation forming.
Preferably, guiding gutter 2 is multiple tracks, is communicated with side by side between above-mentioned feed well 6 and discharge groove 7, accordingly, the width of material feeding groove 1, feed well 6, discharge groove 7 and storage compartment increases accordingly, and material feeding groove 1 runs through the sidewall of patrix top side by sprue groove 8, so that material feeding.Preferably, encapsulated holes 5 is the many rows of longitudinal arrangement at the bottom land of guiding gutter 2, can carry out batch encapsulation to electronic component.Before encapsulation, array in a row electronic component is bonded on base plate for packaging, makes it corresponding with the encapsulated holes 5 in many row's guiding gutters 2, after encapsulation, then by cutting machine, each electronic component is separated, thereby greatly improved packaging efficiency.
Encapsulation process:
Upper die and lower die are arranged on clapper die spotting press; base plate for packaging is placed in top side at counterdie; the electronic component of base plate for packaging bottom side is inserted in the encapsulated holes of guiding gutter bottom; patrix is pressed on to the top side of base plate for packaging; by bolt, upper die and lower die are engaged; evenly exerting pressure to the top side of base plate for packaging in the bottom of patrix planar structure, makes the bottom side of base plate for packaging and the sprue groove at counterdie top, material feeding groove, feed well, arranges guiding gutter, discharge groove, discharge groove and air discharge duct more and be tightly connected.Inject encapsulating material by material feeding groove, encapsulating material passes through feed well successively, guiding gutter, discharge groove, stock chest and air discharge duct, in the time of the packed element of encapsulating material by electron plate, due to the surface imperfection of packed element, easily make gas sneak in encapsulating material, along with the continuation of encapsulating material is injected, the bubble of packed component ambient gradually packed material is taken away, in the time being injected into the intersection of guiding gutter and discharge groove with the encapsulating material of bubble, because discharge groove is flat, liquid encapsulating material is not easy to enter, by contrast, bubble in encapsulating material is easier to preferentially enter into exhaust passage, compared with directly injecting stock chest with encapsulating material, the volume by rear shared stock chest with bubble encapsulating material of equal volume is less.The encapsulating material newly being injected gradually with alveolate encapsulating material in guiding gutter replaces, and makes the not bubbles of encapsulating material being finally shaped in guiding gutter.Because feed well and discharge groove are flat, the encapsulating material of moulding in feed well and discharge groove is easily fractureed, also recoverable of encapsulating material wherein, thereby do not produce waste.
Embodiment bis-
As Fig. 2 and Fig. 3, a kind of Electronic Packaging mould that the utility model embodiment bis-provides, substantially identical with the Electronic Packaging mould of above-described embodiment one, something in common repeats no more, its difference part is: material feeding groove is divided into main material feeding groove 11 and secondary material feeding groove 12, the rugosity of main material feeding groove 11 is 2-3 times of secondary material feeding groove 12, the sidewall of bed die is run through in one end of main material feeding groove 11, secondary stock chest 12 is communicated with the side at main material feeding groove 12, introduce encapsulating material by main material feeding groove 11, secondary material feeding groove 12 is directly communicated with one end of multiple guiding gutters 2, the other end of multiple guiding gutters 2 is directly communicated with stock chest 3, the other end of main material feeding groove 11 is communicated with stock chest 3.After forming materials to be packaged, in main material feeding groove, in the encapsulating material b of the encapsulating material a of coagulation forming coagulation forming in secondary material feeding groove and stock chest, between the encapsulating material c of coagulation forming, form and support, if be only connected by the encapsulating material d of coagulation forming in guiding gutter between the encapsulating material c of coagulation forming in the encapsulating material b of coagulation forming and stock chest in secondary material feeding groove, in the process of the demoulding, easily cause guiding gutter in the encapsulating material d of coagulation forming bend and damage electronic component.Preferably, be also communicated with secondary material feeding groove, multiple tracks guiding gutter and the stock chest of same structure at the opposite side of main material feeding groove 11, main material feeding groove is fully utilized, increased the output of encapsulation, improved packaging efficiency.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model know-why; can also make some improvement and replacement, these improvement and replacement also should be considered as protection domain of the present utility model.
Claims (10)
1. an Electronic Packaging mould, it is characterized in that, comprise upper die and lower die, the top of described counterdie is provided with the material feeding groove (1) being communicated with successively, guiding gutter (2), stock chest (3) and air discharge duct (4), described material feeding groove (1) runs through a side sidewall of described counterdie, described air discharge duct (4) runs through the opposite side sidewall of described counterdie, the bottom land of described guiding gutter (2) is provided with encapsulated holes (5), the electronic component arranging for holding base plate for packaging one side, described patrix is for being pressed on described base plate for packaging at the top of described counterdie, make described base plate for packaging and described material feeding groove (1), guiding gutter (2), the notch of stock chest (3) and air discharge duct (4) is tightly connected.
2. Electronic Packaging mould according to claim 1, it is characterized in that, the discharge groove (7) that is also communicated with flat between described guiding gutter (2) and described stock chest (3), described discharge groove (7) can be tightly connected with described base plate for packaging.
3. Electronic Packaging mould according to claim 2, is characterized in that, the thickness of described discharge groove (7) is 0.01-0.02mm.
4. Electronic Packaging mould according to claim 1, it is characterized in that, the feed well (6) that is also communicated with flat between described material feeding groove (1) and described guiding gutter (2), described feed well (6) can be tightly connected with described base plate for packaging.
5. Electronic Packaging mould according to claim 4, is characterized in that, the thickness of described feed well (6) is 0.01-0.02mm.
6. according to the Electronic Packaging mould described in claim 1-5 any one, it is characterized in that, described guiding gutter (2) is multiple tracks.
7. Electronic Packaging mould according to claim 6, is characterized in that, what described encapsulated holes (5) was longitudinal arrangement at the bottom land of described guiding gutter (2) is multiple.
8. Electronic Packaging mould according to claim 1, is characterized in that, the bottom of described counterdie is plane.
9. Electronic Packaging mould according to claim 1, it is characterized in that, described material feeding groove (1), guiding gutter (2), stock chest (3) and air discharge duct (4) are the groove shape panel that is embedded in described counterdie top.
10. Electronic Packaging mould according to claim 1, it is characterized in that, described material feeding groove (1) comprises main material feeding groove (1) and secondary material feeding groove (1), the sidewall of described counterdie is run through in one end of described main material feeding groove (1), described secondary material feeding groove (1) is communicated with the side at described main material feeding groove (1), described material feeding groove (1) is communicated with by described secondary material feeding groove (1) and described guiding gutter (2), and the other end of described main material feeding groove (1) is communicated with described stock chest (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420287752.6U CN203876150U (en) | 2014-05-30 | 2014-05-30 | Electronic packaging mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420287752.6U CN203876150U (en) | 2014-05-30 | 2014-05-30 | Electronic packaging mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203876150U true CN203876150U (en) | 2014-10-15 |
Family
ID=51676691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420287752.6U Expired - Fee Related CN203876150U (en) | 2014-05-30 | 2014-05-30 | Electronic packaging mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203876150U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875313A (en) * | 2015-04-23 | 2015-09-02 | 昆山群悦精密模具有限公司 | Degassing electronic packaging mold |
-
2014
- 2014-05-30 CN CN201420287752.6U patent/CN203876150U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104875313A (en) * | 2015-04-23 | 2015-09-02 | 昆山群悦精密模具有限公司 | Degassing electronic packaging mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |