CN218447811U

CN218447811U - Packaging mold and packaging structure

Info

Publication number: CN218447811U
Application number: CN202222748397.5U
Authority: CN
Inventors: 韩慧聪; 李成军; 倪亮亮
Original assignee: Jiejie Semiconductor Co ltd
Current assignee: Jiejie Semiconductor Co ltd
Priority date: 2022-10-18
Filing date: 2022-10-18
Publication date: 2023-02-03
Anticipated expiration: 2032-10-18

Abstract

The application discloses packaging mold and packaging structure, relate to semiconductor package technical field, the packaging mold of this application, including the frame plate and set up respectively in last mould and the lower mould of frame plate both sides, set up the through-hole on the frame plate so that be formed with the die cavity between last mould and the lower mould, through-hole department is used for placing and treats the encapsulation chip, it is formed with first runner to go up between mould and the frame plate, form the second runner between lower mould and the frame plate, same one side intercommunication of first runner and second runner and die cavity, the opposite side of die cavity is provided with the gas vent, molten state's plastic packaging material gets into the die cavity through first runner and second runner respectively. The application provides a packaging mold and packaging structure injects the plastic packaging material of molten state from the both sides of waiting to encapsulate the chip simultaneously through two runners and two runners, can prevent that the air from staying in the die cavity, avoids the production of gas pocket.

Description

Packaging mold and packaging structure

Technical Field

The application relates to the technical field of semiconductor packaging, in particular to a packaging mold and a packaging structure.

Background

The lead frame packaging technology is the most basic and common packaging technology, is widely applied to packaging of various consumer electronic products and industrial electronic products, and has the advantages of high technical maturity, low cost, strong compatibility and the like. The lead frame is mainly packaged by using a packaging mold, and the sizes of different packaging forms are different, so that the corresponding packaging molds are different. At present, plastic packaging of packaging forms such as Transistor Out (TO) packaging and Dual In-line packaging (DIP) packaging In the industry mainly adopts plastic packaging dies with a plurality of cavities, and the specific packaging technical steps comprise: (1) Placing the frame with the bonded chip in a plastic package mold, and (2) closing the mold under the action of a plastic package press; (3) Under the conditions of high temperature and high pressure, the injection molding rod injects the molten plastic package material into a plastic package cavity formed by a plastic package mold; (4) After the plastic packaging material is solidified, opening a plastic packaging mold through a plastic packaging press, and taking out the frame after injection molding and solidification; (5) baking and curing the injection-molded and cured frame; (6) And separating and molding the plastic-packaged chip from the frame by adopting punching molding equipment to finish product packaging.

In the existing packaging technology, in the step (3), a plastic packaging material in a molten state flows into a plastic packaging cavity through a runner and a pouring gate, and is blocked by a chip structure, the plastic packaging material can be divided into an upper part and a lower part to be injected simultaneously, due to the gravity, the position of the pouring gate and the like, the plastic packaging material in the molten state injected downwards flows faster, reaches the other end of the plastic packaging cavity first, then rolls upwards and reversely to meet the part flowing upwards from the upper part of the chip, and when the upper space distance is smaller or a large-volume plastic packaging body product is encountered due to the higher chip structure, gas is easy to remain in the cavity and cannot be discharged, and air holes are formed.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a packaging mold and packaging structure, pour into the plastic packaging material of fusibility from the both sides of chip simultaneously through two runners and two runners, can prevent that the air from staying in the die cavity, avoid the production of gas pocket.

An embodiment of the application provides a packaging mold on the one hand, including the frame plate and set up respectively in the last mould and the lower mould of frame plate both sides, set up the through-hole on the frame plate so that be formed with the die cavity between last mould and the lower mould, through-hole department is used for placing and treats the encapsulation chip, it is formed with first runner to go up between mould and the frame plate, form the second runner between lower mould and the frame plate, first runner and second runner and the same one side intercommunication of die cavity, the opposite side of die cavity is provided with the gas vent, the plastic packaging material of molten condition gets into the die cavity through first runner and second runner respectively.

As an implementation mode, the side wall of the through hole protrudes inwards to form a lower support, an upper support opposite to the lower support is further arranged in the cavity, and the upper support and the lower support are used for clamping the chip to be packaged.

As an implementation mode, a plurality of cavities arranged in a row-by-row mode are formed between the upper die and the lower die, each first flow channel comprises a first main flow channel and a plurality of first branch flow channels connected with one side of the corresponding first main flow channel respectively, the first main flow channels are arranged between every two adjacent rows of cavities, the first branch flow channels are communicated with the cavities in the same row respectively, the second flow channels correspond to the second main flow channels and the second branch flow channels arranged on the corresponding first main flow channels, and the second branch flow channels are communicated with the cavities respectively.

As a practical mode, a plurality of cavities arranged in a row-by-row mode are formed between the upper die and the lower die, each first flow channel comprises a first main flow channel and a plurality of first branch flow channels connected with two sides of the first main flow channel respectively, the first main flow channels are arranged between every two adjacent rows of cavities at intervals, the first branch flow channels are communicated with the two rows of cavities on two sides of the first main flow channel respectively, the second flow channels are provided with a second main flow channel and a second branch flow channel corresponding to the first main flow channel, and the second branch flow channels are communicated with the cavities respectively.

As an implementation manner, the first main runner and the second main runner are arranged in a staggered manner, and a spare hole is formed between two adjacent first sub-runners and between two adjacent second sub-runners of the frame plate, and the spare hole is communicated with the second main runner or the first main runner, so that the encapsulation material cured on the frame plate is removed through the spare hole after encapsulation is completed.

As a practical way, one side of each of the two adjacent first branch flow channels, which is close to the first main flow channel, is communicated with the first main flow channel; and one sides of the two adjacent second branch flow channels, which are close to the second main flow channel, are communicated with each other and are communicated with the second main flow channel.

As an implementation mode, the lower bracket comprises a connecting plate connected with the side wall of the through hole and a bearing plate connected with the connecting plate, the connecting plate and the frame plate have a first included angle, the bearing plate is parallel to the frame plate, and the bearing plate is used for placing a chip to be packaged.

As a practical manner, the ratio of the distance between the plane on which the receiving plate is located and the plane on which the frame plate is located to the thickness of the chip to be packaged in the direction perpendicular to the frame plate is 2:1.

as an implementable manner, the exhaust port is formed between the upper die and the frame plate, and extends as a strip-shaped hole along the edge of the frame plate that contacts the upper die.

The embodiment of this application on the other hand provides a packaging structure, adopts above-mentioned packaging mold to mould plastics the encapsulation and forms, including relative upper bracket and the lower carriage that sets up, is provided with the chip between upper bracket and the lower carriage to and the encapsulation body of encapsulation at upper bracket, lower carriage and chip periphery.

The beneficial effects of the embodiment of the application include:

the utility model provides a packaging mold, including the frame plate and set up mould and lower mould on the frame plate both sides respectively, set up the through-hole on the frame plate so that be formed with the die cavity between last mould and the lower mould, through-hole department is used for placing and treats the encapsulation chip, be formed with first runner between last mould and the frame plate, form the second runner between lower mould and the frame plate, first runner and second runner and the same one side intercommunication of die cavity, the opposite side of die cavity is provided with the gas vent, molten state's plastic packaging material gets into the die cavity through first runner and second runner respectively, when packaging mold is used for the encapsulation and treats the encapsulation chip, will treat the encapsulation chip and set up in through-hole department, divide into upper portion and lower part with the die cavity, molten state's plastic packaging material is injected into the upper portion and the lower part of die cavity by first runner and second runner respectively, until filling upper portion and lower part are full, in plastic packaging material flow process, extrude the inside air of die cavity, through the setting of two runners, make the plastic packaging material of first runner and the second runner can reach the opposite side of die cavity simultaneously from the opposite side of treating the encapsulation chip, thereby make the air vent of setting in setting up in the die cavity, can prevent the gas vent of air from keeping, avoid the production of air vent.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a package mold according to an embodiment of the present disclosure;

fig. 2 is a second schematic structural diagram of a packaging mold according to an embodiment of the present disclosure;

fig. 3 is a third schematic structural diagram of a package mold according to an embodiment of the present disclosure;

fig. 4 is a fourth schematic structural diagram of a package mold according to an embodiment of the present disclosure.

Icon: 10-packaging the mould; 11-a frame plate; 12-upper mould; 13-lower mould; 14-a chip to be packaged; 15-a first flow channel; 151-a first main flow channel; 152-a first shunt channel; 16-a second flow channel; 161-a second main flow channel; 162-a second sub-channel; 17-lower support; 171-a connecting plate; 172-bearing plates; 18-upper support; 19-spare well.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "center", "vertical", "horizontal", "inside", "outside", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when products of the application are used, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

The application provides a packaging mold 10, as shown in fig. 1, fig. 2 and fig. 3, including frame plate 11 and set up respectively in last mould 12 and the lower mould 13 of frame plate 11 both sides, set up the through-hole on the frame plate 11 so that be formed with the die cavity between last mould 12 and the lower mould 13, the through-hole department is used for placing and treats packaged chip 14, it is formed with first runner 15 to go up between mould 12 and the frame plate 11, form second runner 16 between lower mould 13 and the frame plate 11, first runner 15 and second runner 16 communicate with the same side of die cavity, the opposite side of die cavity is provided with the gas vent, the plastic packaging material of molten state gets into the die cavity through first runner 15 and second runner 16 respectively.

In the use process of the packaging mold 10, due to the arrangement of the frame plate 11 and the chip 14 to be packaged, the cavity is divided into an upper part and a lower part, the first flow channel 15 is communicated with the upper part, the plastic packaging material flowing into the first flow channel 15 fills the upper part, the second flow channel 16 is communicated with the lower part, the plastic packaging material flowing into the second flow channel 16 fills the lower part, when the plastic packaging material of the first flow channel 15 and the plastic packaging material of the second flow channel 16 reach the other side of the cavity at the same time, air in the cavity is extruded out of the cavity through the air outlet at the other side of the cavity, and the phenomenon that air bubbles are formed due to reverse coiling caused by unbalanced filling of the two sides of the chip is avoided.

It should be noted that, in a normal case, the sizes of the upper and lower spaces in the cavity at both sides of the chip 14 to be packaged are the same, and when the flow rates of the plastic molding materials in the molten state in the first flow channel 15 and the second flow channel 16 are the same, the plastic molding materials flowing into the cavity from both sides of the chip 14 to be packaged can reach the other side of the cavity at the same time, and in a normal case, a certain pressure is applied to the flow channel to push the plastic molding materials to flow, in the embodiment of the present application, the flow rate of the plastic molding materials in the first flow channel 15 is the same as the flow rate of the plastic molding materials in the second flow channel 16 by applying the same pressure to the first flow channel 15 and the second flow channel 16. Of course, those skilled in the art may also set the upper portion and the lower portion with different space sizes, and the flow rates of the plastic sealing materials in the molten state in the first flow channel 15 and the second flow channel 16 may be set to different values corresponding to different space sizes. The molding material of the first runner 15 and the molding material of the second runner 16 may reach the other side of the cavity at the same time.

As to the fixing manner of the chip 14 to be packaged in the through hole, the embodiment of the application is not limited, and for example, a support may be used for supporting.

When the packaging mold 10 is used for packaging the chip 14 to be packaged, the chip 14 to be packaged is arranged at the through hole, the cavity is divided into an upper part and a lower part, the plastic packaging material in a molten state is injected into the upper part and the lower part of the cavity respectively through the first flow channel 15 and the second flow channel 16 until the upper part and the lower part are filled with the plastic packaging material, the air inside the cavity is extruded in the flowing process of the plastic packaging material, the two flow channels are arranged, the plastic packaging material of the first flow channel 15 and the second flow channel 16 can reach the other side of the cavity from the two sides of the chip 14 to be packaged simultaneously, the air is discharged from the air outlet arranged on the other side of the cavity, the air can be prevented from being remained in the cavity, and air holes are prevented from being generated.

Optionally, as shown in fig. 4, a lower support 17 is formed by protruding a sidewall of the through hole into the through hole, an upper support 18 opposite to the lower support 17 is further disposed in the cavity, and the upper support 18 and the lower support 17 are used for clamping the chip 14 to be packaged.

The chip 14 to be packaged is clamped by arranging the upper support 18 and the lower support 17, so that the stability of fixing the chip 14 to be packaged is improved, and on one hand, the chip 14 to be packaged is prevented from shifting due to impact on the chip 14 to be packaged in the flowing process of the plastic packaging material, so that the chip packaging is misplaced; on the other hand, the chip 14 to be packaged is prevented from being displaced due to the impact of the chip 14 to be packaged in the flowing process of the plastic packaging material, so that the through hole is leaked, the plastic packaging material in the first flow channel 15 flows through the lower part of the through hole, and the lower part filling speed is too high.

The side wall of the through hole is formed with a lower support 17 protruding inwards the through hole, so that the lower support 17 is fixedly connected with the frame plate 11, the position of the lower support 17 is fixed, and the stability of fixing the chip 14 to be packaged is further improved.

In an implementation manner of the embodiment of the present application, a plurality of cavities arranged in a row-to-row manner are formed between the upper die 12 and the lower die 13, the first flow channel 15 includes a first main flow channel 151 and a plurality of first branch flow channels 152 connected to one side of the first main flow channel 151, the first main flow channel 151 is disposed between two adjacent rows of cavities, the first branch flow channels 152 are respectively communicated with the cavities located in the same row, the second flow channel 16 is provided with a second main flow channel 161 and a second branch flow channel 162 corresponding to the first main flow channel 151, and the second branch flow channels 162 are respectively communicated with the cavities.

In practical use, the frame plate 11 is usually provided with a plurality of through holes arranged in a row-column manner for placing a plurality of chips 14 to be packaged, which can significantly improve the efficiency of chip packaging, corresponding to the plurality of chips 14 to be packaged, the upper mold 12 includes a plurality of upper cavities, the upper cavities are arranged to be attached to one side of the frame plate 11 to form the upper portions of the cavities, the lower mold 13 includes a plurality of lower cavities, the lower cavities are arranged to be attached to the other side of the frame plate 11 to form the lower portions of the cavities, the plastic package material in the first main flow channel 151 is injected into the upper portions of the cavities through the first branch flow channels 152, the plastic package material in the second main flow channel 161 is injected into the lower portions of the cavities through the second branch flow channels 162, thereby realizing simultaneous injection of the cavities, and realizing packaging of the plurality of chips 14 to be packaged in one-time injection process.

Optionally, as shown in fig. 1 and fig. 2, a plurality of cavities arranged in a row-to-row manner are formed between the upper die 12 and the lower die 13, the first flow channel 15 includes a first main flow channel 151 and a plurality of first branch flow channels 152 respectively connected to two sides of the first main flow channel 151, the first main flow channel 151 is disposed between two adjacent rows of cavities at intervals, the first branch flow channels 152 are respectively communicated with two rows of cavities on two sides of the first main flow channel 151, the second flow channel 16 corresponds to a second main flow channel 161 and a second branch flow channel 162 disposed on the first main flow channel 151, and the second branch flow channel 162 is communicated with the cavities.

First runner 152 communicates with two rows of cavities of first sprue 151 both sides respectively, second runner 162 communicates in two rows of cavities of the both sides of second runner 162 respectively, make first sprue 151 can be simultaneously for injecting the plastic packaging material in the upper portion of two rows of cavities, second sprue 161 can be simultaneously for injecting the plastic packaging material in the lower part of two rows of cavities, thereby first sprue 151 and second sprue 161's number has been reduced, reduce the waste of plastic packaging material in the runner on the one hand, on the other hand reduces the volume that the runner occupied.

In an implementable manner of the embodiment of the present application, as shown in fig. 3, the first main flow channel 151 and the second main flow channel 161 are disposed in a staggered manner, the spare holes 19 are opened between two adjacent first sub flow channels 152 and between two second sub flow channels 162 of the frame plate 11, and the spare holes 19 are communicated with the second main flow channel 161 or the first main flow channel 151, so as to remove the potting material cured on the frame plate 11 through the spare holes 19 after the potting is completed.

After the main injection of the plastic packaging material is completed, the plastic packaging material remaining in the first main flow channel 151 and the second main flow channel 161 is solidified, a material column is formed, the material column is attached to the frame plate 11, when the upper die 12 and the lower die 13 are separated from the frame plate 11, the material column is not easily separated from the frame plate 11, the first main flow channel 151 and the second main flow channel 161 are arranged in a staggered manner in the embodiment of the application, the frame plate 11 is located between two adjacent first branch flow channels 152 and between two second branch flow channels 162, the spare hole 19 is formed, the spare hole 19 is communicated with the second main flow channel 161 or the first main flow channel 151, so that the packaging material solidified on the frame plate 11 is removed through the spare hole 19 after the packaging is completed.

Alternatively, as shown in fig. 1, two adjacent first sub-channels 152 are communicated with one side of the first main channel 151, and are communicated with the first main channel 151; the adjacent two second sub-runners 162 communicate with one side of the second main runner 161 close to the second main runner 161 and communicate with the second main runner 161.

In order to further reduce the volume occupied by the runners, the adjacent two first sub runners 152 are communicated with one side close to the first main runner 151 and communicated with the first main runner 151, so that the adjacent two first sub runners 152 share one runner; thereby reducing the number of flow channels. Like the first sub-channels 152, two adjacent second sub-channels 162 are communicated with one side close to the second main channel 161 and communicated with the second main channel 161, so that two adjacent second sub-channels 162 share one channel; thereby reducing the number of flow channels.

In an implementation manner of the embodiment of the present application, as shown in fig. 4, the lower frame 17 includes a connecting plate 171 connected to the sidewall of the through hole and a receiving plate 172 connected to the connecting plate 171, the connecting plate 171 has a first angle with the frame plate 11, the receiving plate 172 is parallel to the frame plate 11, and the receiving plate 172 is used for placing the chip 14 to be packaged thereon.

As will be appreciated by those skilled in the art, the chip 14 to be packaged is generally plate-shaped, and in order to achieve stable clamping of the chip 14 to be packaged, the upper bracket 18 is provided with a connecting plate 171 and a receiving plate 172, and the receiving plate 172 is parallel to the frame plate 11, so as to facilitate placement of the chip 14 to be packaged.

Alternatively, as shown in fig. 4, the ratio of the distance between the plane on which the receiving plate 172 is located and the plane on which the frame plate 11 is located to the thickness of the chip 14 to be packaged in the direction perpendicular to the frame plate 11 is 2:1.

the distance between the plane where the bearing plate 172 is located and the plane where the frame plate 11 is located is set to be half of the thickness of the chip 14 to be packaged, so that the space of the upper portion of the cavity occupied by the chip 14 to be packaged and the space of the lower portion of the cavity are equal, the space of the upper portion of the cavity is equal to the space of the lower portion of the cavity, and when plastic package materials are injected for plastic package, the plastic package materials can reach the other side of the cavity at the same time.

In an implementable manner of the embodiment of the application, the air outlet is formed between the upper die 12 and the frame plate 11 and extends as a strip-shaped hole along the edge of the frame plate 11 in contact with the upper die 12.

Set up the gas vent into the bar hole, when plastic packaging material injected into the die cavity, can make things convenient for the air in the die cavity to discharge fast, set up the gas vent into the bar hole that extends along the frame plate 11 with the limit of last mould 12 contact for after the lower part of the upper portion of die cavity and die cavity was filled, plastic packaging material reachd bar hole department simultaneously, avoided the too much overflow of plastic packaging material.

The embodiment of the application also discloses a packaging structure, which is formed by injection molding and packaging by adopting the packaging mold 10 and comprises an upper support 18 and a lower support 17 which are arranged oppositely, wherein a chip is arranged between the upper support 18 and the lower support 17, and a plastic package body is packaged at the periphery of the upper support 18, the lower support 17 and the chip. The packaging structure is formed by injection molding of the packaging module, so that fewer bubbles are in the packaging structure, and the packaging quality is improved.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The utility model provides a packaging mold, its characterized in that, include the frame plate and set up respectively in last mould and lower mould of frame plate both sides, the through-hole has been seted up on the frame plate so that go up the mould with be formed with the die cavity between the lower mould, through-hole department is used for placing and treats the encapsulation chip, go up the mould with be formed with first runner between the frame plate, the lower mould with form the second runner between the frame plate, first runner with the second runner with the same one side intercommunication of die cavity, the opposite side of die cavity is provided with the gas vent, and the plastic packaging material of molten condition passes through respectively first runner with the second runner gets into in the die cavity.

2. The package mold of claim 1, wherein a lower frame protrudes from a sidewall of the through hole into the through hole, an upper frame opposite to the lower frame is further disposed in the cavity, and the upper frame and the lower frame are used for clamping the chip to be packaged.

3. The package mold according to claim 1, wherein a plurality of cavities are formed between the upper mold and the lower mold, the first flow channel includes a first main flow channel and a plurality of first branch flow channels connected to one side of the first main flow channel, the first main flow channel is disposed between two adjacent rows of cavities, the first branch flow channels are respectively communicated with the cavities in the same row, the second flow channel is disposed corresponding to a second main flow channel and a second branch flow channel of the first main flow channel, and the second branch flow channels are respectively communicated with the cavities.

4. The package mold according to claim 1, wherein a plurality of cavities arranged in a row are formed between the upper mold and the lower mold, the first flow channel includes a first main flow channel and a plurality of first branch flow channels respectively connected to two sides of the first main flow channel, the first main flow channel is disposed between two adjacent rows of cavities at intervals, the first branch flow channels are respectively communicated with two rows of cavities on two sides of the first main flow channel, the second flow channel is provided with a second main flow channel and a second branch flow channel corresponding to the first main flow channel, and the second branch flow channels are respectively communicated with the cavities.

5. The package mold according to claim 3 or 4, wherein the first main runner and the second main runner are disposed in a staggered manner, and a spare hole is opened between two adjacent first sub-runners and between two adjacent second sub-runners, and the spare hole is communicated with the second main runner or the first main runner so as to remove the encapsulating material cured on the frame plate through the spare hole after the encapsulation is completed.

6. The package mold according to claim 3, wherein two adjacent first runners are communicated with one side of the first main runner and are communicated with the first main runner; and one sides of the adjacent two second branch flow channels, which are close to the second main flow channel, are communicated with each other and are communicated with the second main flow channel.

7. The package mold of claim 2, wherein the bottom bracket comprises a connecting plate connected to the sidewall of the through hole and a receiving plate connected to the connecting plate, the connecting plate and the frame plate have a first included angle, the receiving plate is parallel to the frame plate, and the receiving plate is used for placing a chip to be packaged thereon.

8. The package mold according to claim 7, wherein a ratio of a distance between a plane on which the receiving plate is located and a plane on which the frame plate is located to a thickness of the chip to be packaged in a direction perpendicular to the frame plate is 2:1.

9. the package mold according to claim 1, wherein the vent is formed between the upper mold and the frame plate and extends as a strip-shaped hole along an edge of the frame plate contacting the upper mold.

10. A package structure, formed by injection molding with the package mold according to any one of claims 1 to 9, comprising an upper support and a lower support disposed opposite to each other, a chip disposed between the upper support and the lower support, and a molding compound encapsulated around the upper support, the lower support, and the chip.