JP2001044225A - Manufacture of resin-sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce BGAs of the same package at a speed twice as fast by sealing two substrates in a single application of sealing process. SOLUTION: Two upper and lower substrates 1 and 2 are secured temporarily to each other via a substrate deformation preventing reinforcing plate 5 with their solder ball forming surfaces make oppose each other. The resulting substrates are located within a sealing mold 10 for sealing through a single injection of resin. The two substrates 1 and 2 sealed with the sealing resin 9 are thereafter separated from each other. Molten resin runners may be provided for the respective substrates, or a single molten resin runner may be provided only on one of the substrates 1 and 2, and both substrates 1 and 2 may have through-holes connected to the runners at their corresponding locations. This method is also applicable to the case of two upper and lower substrates, having many bonded semiconductor element units mounted thereon in a matrix form, or two upper and lower substrates having semiconductor element units of different sizes mounted thereon and an adhesive tape may be used in place of the plate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art FIG. 8 is a sectional view showing a conventional example.

[0003] In recent years, BGA packages have tended to increase due to the advantages of downsizing and weight reduction, improvement of mountability on printed boards by users, and improvement of electrical characteristics as packages. Also, like the current QFP, there is a high possibility that the number of types of packages will increase. Along with this, it is necessary to make a large capital investment in accordance with the production quantity, and it is necessary to devise ways to improve productivity and minimize the capital investment.

However, conventionally, generally, as shown in FIG. 8, a semiconductor element 43 is mounted on a single substrate 41,
A sealing resin 49 is injected from a gate 47 into a cavity formed between the mold and the semiconductor element 43 in a so-called bonded state by using an adhesive to perform resin sealing.

[0005]

In the above case, the BGA package is of a single-sided sealing type in which the top of the substrate is sealed, and the number of BGA packages that can be manufactured by one sealing process is small. Therefore, it is desired to improve the productivity by bonding the substrates so that both sides can be sealed.

An object of the present invention is to use a reinforcing plate or an adhesive tape, fix another substrate on the upper and lower surfaces of the reinforcing plate or the tape, and seal the whole with a resin, so that two encapsulation processes can be performed in one encapsulation process. An object of the present invention is to provide a method of manufacturing a resin-encapsulated semiconductor device capable of manufacturing a BGA of the same package at twice the speed because a single substrate can be enclosed.

[0007]

According to a method of manufacturing a resin-encapsulated semiconductor device of the present invention, two upper and lower substrates on which a bonded semiconductor element unit is mounted are placed with their solder ball surfaces facing each other. Temporarily fixed via a deformation prevention reinforcing plate, the upper and lower two substrates and the reinforcing plate are placed in a sealing mold, and both substrates are sealed with a single injection resin, and cooled to a predetermined temperature. Thereafter, the substrate is separated into two resin-sealed substrates.

The runner starting from the plunger pot cull for injecting the sealing resin into each semiconductor element unit may be provided on the upper and lower substrates, respectively. Alternatively, a through hole may be provided on only one side, and a through hole connected to the runner may be provided at a corresponding position on both substrates.

Further, two upper and lower substrates on which a large number of bonded semiconductor element units are mounted in a matrix are temporarily fixed via a reinforcing plate for preventing deformation of the substrates, with the solder ball surfaces of the substrates facing each other, An integrated body of the upper and lower two substrates and the reinforcing plate is arranged in one sealing mold, and the sealing resin is injected into each semiconductor element unit.
The runners starting from the plunger pot cull are provided on each of the upper and lower substrates, and the entire substrates are collectively sealed with a single injection resin, cooled to a predetermined temperature, and then two resin-sealed substrates. May be separated.

The runner may be provided only on one of the upper and lower substrates, and a through hole connected to the runner may be provided at a corresponding position on both substrates. In each of the above cases, the size of the semiconductor element units mounted on the upper and lower two substrates may be different, or a device using an adhesive tape instead of the reinforcing plate is preferable.

[0011]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of a method for manufacturing a resin-sealed semiconductor device according to the present invention, and FIG.
In this embodiment, culls and runners are separately provided in the upper and lower parts, and a schematic cross-sectional view showing a relationship with an adjacent semiconductor element unit, (b) is a schematic plan view of (a), and FIG.
FIG. 2 is a schematic cross-sectional view showing a relationship with an adjacent semiconductor element unit in which a cull and a runner are provided only below in this embodiment, and FIG. 2B is a schematic plan view of FIG.

In the method of manufacturing a semiconductor device according to the present invention, as shown in FIG. 1, two substrates 1 and 2 are fixed to a reinforcing plate 5 for preventing deformation of the substrates 1 and 2, and the substrates 1 and 2 are bonded together. Both surfaces of the two substrates 1 and 2 are sealed.

In the method of manufacturing a semiconductor device according to the present invention, FIG.
Two substrates 1 bonded as shown in FIG.
2 is fixed to a reinforcing plate 5 made to prevent deformation of the substrates 1 and 2 using an adhesive 5a or the like. Although not shown, holes and insertion rods are often used to prevent the upper and lower molds from being displaced. In any case, a semiconductor device including two substrates 1 and 2 is manufactured by one encapsulation process. The gate 7 and the runner are punched out and removed.

Next, a second embodiment will be described.

FIG. 4 is a schematic cross-sectional view showing the relationship between adjacent units and culls and runners separately provided in a second embodiment in which a large number of semiconductor element units are collectively sealed. FIG. 6 is a schematic cross-sectional view showing a relationship with an adjacent unit in which a cull and a runner are similarly provided only below in the embodiment.

The difference between the second embodiment and the first embodiment is that, in the case of the first embodiment, the semiconductor element unit is sealed in individual cavities. In the case of the second embodiment, the entire semiconductor element units on one side are collectively and entirely sealed. Therefore, the mold does not have individual cavities (recesses) corresponding to individual units. The resin is separated into individual pieces by dicing.

In the case of this embodiment, the shape of the mold is simple, the length of the cull is short, and the cost up to resin sealing is reduced. However, there is a factor of cost increase corresponding to the increase in the dicing depth, so the embodiment is selected according to the actual situation.

Next, a third embodiment will be described.

FIG. 6 is a cross-sectional view showing a third embodiment in which the sizes of the semiconductor element units mounted on the upper and lower substrates in FIG. 1 are different.

The difference between this embodiment and the first embodiment is that two types of BGA packages are manufactured by bonding two substrates 1 and 2 on which semiconductor elements 3 and 4 of different sizes are mounted. It is. In other words, there is an advantage that capital investment for one mold 10 is sufficient without manufacturing two enclosing molds in response to the trend of packages of various kinds in small quantities. The punching of the gates 7, 8 and the runners 12a and 12b is performed by the gate 8, the shorter runner 12b,
This is performed from the side of the larger package (semiconductor element 4) first.

Next, a fourth embodiment will be described.

FIG. 7 is a sectional view showing a fourth embodiment in which an adhesive tape is used instead of the reinforcing plate in FIG. In this case, although the reinforcing strength is slightly low, the cost and workability are high.

[0024]

As described above, according to the present invention, two upper and lower substrates are temporarily fixed to each other with the solder ball surfaces of the substrates facing each other and a reinforcing plate for preventing deformation of the substrates, and are placed in a sealing mold. Since the two substrates are sealed at once and then separated into two resin-sealed substrates, two substrates can be sealed in one encapsulation process.
Has the effect of being able to provide a method of manufacturing a resin-encapsulated semiconductor device capable of producing the same at twice the speed. The size of the semiconductor element units mounted on the upper and lower substrates may be different, and an adhesive tape may be used instead of the reinforcing plate.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a method for manufacturing a resin-sealed semiconductor device of the present invention.

FIG. 2A is a schematic cross-sectional view showing the relationship between an adjacent semiconductor element unit and a cull and a runner provided separately in the upper and lower parts in this embodiment, and FIG. 2B is a schematic plan view of FIG. It is.

FIG. 3A is a schematic cross-sectional view showing a relationship with an adjacent semiconductor element unit in which a cull and a runner are provided only below in this embodiment, and FIG. 3B is a schematic plan view of FIG. It is.

FIG. 4 shows a second method for enclosing a large number of semiconductor element units at once.
FIG. 8 is a schematic cross-sectional view showing a relationship with an adjacent unit in which a cull and a runner are separately provided in the upper and lower parts in the embodiment.

FIG. 5 is a schematic cross-sectional view showing a relationship with an adjacent unit in which a cull and a runner are similarly provided only below in the embodiment.

FIG. 6 is a cross-sectional view showing a third embodiment example in which semiconductor element units mounted on upper and lower substrates have different sizes.

FIG. 7 is a sectional view showing a fourth embodiment in which an adhesive tape is used instead of a reinforcing plate.

FIG. 8 is a sectional view showing a conventional example.

[Explanation of symbols]

 1, 2, 41 Substrate 3, 4, 43 Semiconductor element 5 Reinforcement plate 5a Adhesive 6 Adhesive tape 7, 8, 47 Gate 9, 49 Sealing resin 10 Sealing mold 11a, 11b Cull 12a, 12b Runner 12c Runner (Rise part)

Claims (7)

[Claims] An upper substrate and a lower substrate on which a bonded semiconductor element unit is mounted are temporarily fixed via a reinforcing plate for preventing deformation of the substrate, with the solder ball surfaces of the substrates facing each other. And the integrated body of the reinforcing plate is placed in a sealing mold, the two substrates are sealed with a single injection resin, cooled to a predetermined temperature, and then separated into two resin-sealed substrates. A method for manufacturing a resin-encapsulated semiconductor device, comprising: 2. The resin sealing device according to claim 1, wherein runners starting from the plunger pot culls for injecting the sealing resin into the respective semiconductor element units are provided on the upper and lower substrates, respectively. A method for manufacturing a fixed semiconductor device. 3. A runner starting from a plunger pot cull for injecting a sealing resin into each semiconductor element unit is provided on only one of the upper and lower substrates, and the runner corresponding to both substrates is provided. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein a through hole connected to the runner is provided at a location. 4. An upper and lower substrate on which a large number of bonded semiconductor element units are mounted in a matrix,
With the solder ball surfaces of the substrate facing each other and temporarily fixed via a substrate deformation preventing reinforcing plate, an integrated body of the upper and lower two substrates and the reinforcing plate is arranged in one sealing mold, Runners starting from the plunger pot culls for injecting the sealing resin into each semiconductor element unit are provided on each of the upper and lower substrates, and the entirety of both substrates is collectively sealed with one injection resin. A method for manufacturing a resin-sealed semiconductor device, comprising cooling to a predetermined temperature and separating the substrate into two resin-sealed substrates. 5. An upper and lower substrate on which a number of bonded semiconductor element units are mounted in a matrix,
With the solder ball surfaces of the substrate facing each other and temporarily fixed via a substrate deformation preventing reinforcing plate, an integrated body of the upper and lower two substrates and the reinforcing plate is arranged in one sealing mold, The runner starting from the plunger pot cull for injecting the sealing resin into each semiconductor element unit is provided only on one of the upper and lower substrates, and the runner is provided at a corresponding location on both substrates. A resin-sealed semiconductor device is provided, in which connected through-holes are provided, the whole of both substrates is collectively sealed with one injection resin, cooled to a predetermined temperature, and then separated into two resin-sealed substrates. Production method. 6. The method of manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein the sizes of the semiconductor element units mounted on the upper and lower two substrates are different. 7. The method according to claim 1, wherein an adhesive tape is used instead of the reinforcing plate.