JPH11111744A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity, by pouring resin into a first cavity through a runner gate from a plurality of pots in a forming die and into the cavities other than the first cavity through connecting gates formed so as to connecting the cavities on a printed substrate. SOLUTION: Grooves, each of which is formed for making a part of wiring pattern region sealed with resin as a package 6 on a printed substrate 1 communicate with a part of the other wiring pattern region, are formed such that the ends thereof are included in cavities 7, thereby forming connecting gates 5. Resin is poured into the cavities through the connecting gates 5 and hence resin flowing through the connecting gates 5 is formed only in a level flush with the printed substrate 1 after the packages 6 are formed. This can substantially reduce a load applied to a punching device to easily punch the printed substrate 1 and improve the wear resistance of the punching device to elongate a punching life, which improves productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device for preventing a problem that occurs when an individual semiconductor package is cut.

[0002]

2. Description of the Related Art As a resin method for a semiconductor device, a resin sealing method generally called a transfer molding method is widely used. This will be described below with reference to FIG.

In FIG. 3A, a plurality of semiconductor elements are arrayed on a printed circuit board 1. A plurality of resin tablets in a plurality of pots (not shown) disposed outside along the longitudinal direction of the printed board 1 in a state where the printed board 1 is placed in the molding die 2 are connected to the plurality of resin tablets. Each pressure is applied by the plunger 3. The resin E heated and melted here flows into the runner 4 of the molding die 2 by the pressure of the plunger 3, and further flows into the first cavity 7a forming the first package 6a through the gate 5 connected to the runner 4. Then, it flows to the second cavity 7b forming the second package 6b through the connection gate 8a communicating between the respective cavities of the molding die 2, and further flows to the third cavity 7c forming the third package 6c through the connection gate 8b. Flow into In this manner, the packages 6a, 6b, and 6c are completed, and in a subsequent final step, the packages are individually cut from the printed circuit board 1 by a cutting device.

[0003]

However, in the above-described resin method, the connecting gates 8a and 8b that allow the resin to be injected through the cavities are formed on the upper mold side of the molding die 2. As shown in FIG. 2B, the resin flowing through the connection gates remains as the residual resin M on the printed circuit board 1 even after each package is formed by resin sealing. This residual resin resin M imposes an extra load on the punch at the time of individual cutting of the package in the final process, impairs the punching property, and causes the printed circuit board near the residual resin M to be crushed during punching, This causes abrasion of the punch and shortens the punching life, which is a factor that lowers productivity.

The present invention has been made in view of the above circumstances, and does not cause the printed circuit board to be crushed when each package is individualized, and reduces the wear of the punch to improve the productivity. It is an object of the present invention to provide a method for manufacturing a semiconductor device which contributes to improvement.

[0005]

According to the first aspect of the present invention, a wiring pattern is formed on an upper surface, and a plurality of semiconductor chips electrically connected to the wiring pattern are formed and arranged. A method of manufacturing a semiconductor device in which a printed circuit board is set in a molding die, and a resin is injected into each cavity of the molding die to seal the semiconductor chip. Runner from the pot,
A semiconductor device, wherein a resin is injected into the first cavity through a gate, and the resin is injected into each cavity after the first cavity through a connection gate formed so as to communicate each cavity with the printed circuit board. In the manufacturing method.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below in detail with reference to the accompanying drawings. 1A to 1C are diagrams showing a first embodiment of a method for manufacturing a semiconductor device according to the present invention, and FIG. 2 is a diagram showing a second embodiment according to the present invention. First, in FIG. 1A, a plurality of wiring patterns having an independent function are formed for each unit on the upper surface of a printed board 1 made of, for example, glass cloth epoxy resin, BT resin, etc., and are electrically connected to the wiring patterns. Semiconductor chips are arranged in a plurality.

Then, the printed circuit board 1 is formed into a molding die 2.
Is set in a concave portion formed in the lower mold L, and the upper mold U is lowered to clamp a mold in a plurality of pots (not shown) disposed outside along the longitudinal direction of the printed circuit board 1. Are pressed by a plurality of plungers 3 respectively. The resin E heated and melted here flows through the runner 4 of the upper mold U of the molding die 2 by the pressure of the plunger 3, and further passes through the gate 5 connected to the runner 4 to form the first cavity 7a forming the first package 6a. Is injected into.

Subsequently, the resin E injected into the first cavity 7a passes through the connecting gate 8a formed in the groove on the printed circuit board 1 so as to communicate between the first cavity 7a and the second cavity 7b. Is injected into the second cavity 7b forming the second package 6b, and further injected from the second cavity 7b into the third cavity 7c forming the third package 6c through the connection gate 8b. Thus, each cavity 7a, 7b, 7c
Is filled with resin, and the packages 6a, 6b, 6c as shown in FIG.

As described above, according to the present invention, the connecting gate does not communicate between the cavities of the upper die, but a part of the wiring pattern area which is resin-sealed as a package on the printed board and another wiring pattern area. The end of the groove formed so as to communicate with a part of the cavity is included in each cavity, and this is used as a connection gate to inject the resin between the cavities. Even if the resin remains on the printed circuit board after the package is formed, this residual resin is formed only at the same height as the printed circuit board, so that the load on the punch can be greatly reduced compared to the conventional method. From this, the punching of the printed circuit board is made much easier, and the better punching improves the wear resistance of the punch and maintains the punching life longer Made to be.

The gate 5 and the connecting gate 8
As shown in FIG. 3C, the inlets a and 8b are formed near the corners of the rectangular cavity facing the entrance side and the exit side of the resin E, respectively. .

The connection gates 8a and 8b may be formed in a side end surface in a tapered shape in consideration of the fluidity of the resin, or may be provided with an R.

Furthermore, a dummy groove similar to the connection gate may be provided on the printed circuit board in the final cavity portion where the resin is injected, and this may be used to release air.

Further, the connection gates 8a, 8b
Is formed in a groove shape on the printed circuit board, but may be formed in a slit shape as shown in FIG. 2, and in this case, resin injection similar to the above embodiment is possible.

[0014]

As described above, according to the present invention, the connecting gate for communicating the resin between the cavities is formed not in the upper die but in a groove shape communicating with the vicinity of the corner of each package of the printed circuit board. After the formation of each package, the height of the resin remaining in the connection gate portion does not protrude from the plane of the printed circuit board. Therefore, even in the case of individual cutting of each package, an extra load is not given to the punch and the punching property is not affected, and the cutting is favorably performed without crushing the printed circuit board.
The abrasion resistance of the punch has also been improved, making it possible to maintain a longer punching life. As a result, the productivity of the semiconductor device can be improved.

[Brief description of the drawings]

FIG. 1 shows a method of manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 shows a method of manufacturing a semiconductor device according to another embodiment of the present invention.

FIG. 3 is a diagram showing a method of manufacturing a semiconductor device according to a conventional technique.

[Explanation of symbols]

 1, printed circuit board 2, molding die 3, plunger 4, runner 5, gate 6, package 7, cavity 8, connection gate

Claims (1)

[Claims] 1. A plurality of wiring patterns are formed on an upper surface,
A printed circuit board formed by arranging a plurality of semiconductor chips electrically connected to the wiring pattern is set in a molding die, and a resin is injected into each cavity of the molding die to remove the semiconductor chip. A method for manufacturing a semiconductor device to be sealed, comprising: injecting a resin from a plurality of pots in a molding die through a runner and a gate into a first cavity to communicate each cavity with the printed circuit board. A method of manufacturing a semiconductor device, comprising: injecting a resin into each cavity after the first cavity through a gate.