CN108010902A - The manufacture device of circuit block, the manufacture method of circuit block and circuit block - Google Patents

The manufacture device of circuit block, the manufacture method of circuit block and circuit block Download PDF

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Publication number
CN108010902A
CN108010902A CN201710804097.5A CN201710804097A CN108010902A CN 108010902 A CN108010902 A CN 108010902A CN 201710804097 A CN201710804097 A CN 201710804097A CN 108010902 A CN108010902 A CN 108010902A
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CN
China
Prior art keywords
resin
insulating properties
grounding electrode
solidified resin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710804097.5A
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Chinese (zh)
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CN108010902B (en
Inventor
竹内慎
田头史明
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Towa Corp
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Towa Corp
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Publication date
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Publication of CN108010902A publication Critical patent/CN108010902A/en
Application granted granted Critical
Publication of CN108010902B publication Critical patent/CN108010902B/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to the manufacture device of circuit block, the manufacture method of circuit block and circuit block.The manufacture method of circuit block with electro-magnetic screen function includes：Prepare with substrate (2), the process for being installed on the electronic unit (3) of substrate and the encapsulation prebasal plate (1) in grounding electrode provided around electronic unit (7)；First molding procedure, the shaping of insulating properties solidified resin (18) is realized using the first molding die in substrate；And second molding procedure, the shaping of electric conductivity solidified resin (27) is realized to make encapsulation metacoxal plate (28) in substrate using the second molding die (20).In the first molding procedure, a part of position (7a) and the electronic unit of grounding electrode are covered by insulating properties solidified resin, exposes grounding electrode (7b) by making the remaining position (7b) of grounding electrode expose from insulating properties solidified resin to be formed；In the second molding procedure, insulating properties solidified resin is covered by electric conductivity solidified resin and exposes grounding electrode, so that grounding electrode and the electrical connection of electric conductivity solidified resin will be exposed.

Description

The manufacture device of circuit block, the manufacture method of circuit block and circuit block
Technical field
The present invention relates to the circuit block with electro-magnetic screen function, the manufacture method of circuit block and circuit block Manufacture device.
Background technology
In electronic unit used in the wireless telecom equipment such as mobile phone or smart mobile phone, it is widely used it is a kind of in order to Prevent the leakage of electromagnetic wave that is produced from the circuit element for forming electronic unit or in order to completely cut off the electromagnetism from outside invasion Ripple, and to being electromagnetically shielded the technology of (ELECTROMAGNETIC OBSCURANT, hereinafter appropriately referred to as " shields ") around circuit element.It is for example, public A kind of groove for being formed on the insulative resin being applied on multiple circuit elements and reaching substrate is opened, by filling out in the cell Electroconductive resin is filled so as to the technology (referenced patent document 1) shielded to electronic unit.
Patent document 1：Japanese Patent Laid-Open 2010-238717 publications
However, in the electronic unit disclosed in patent document 1, there are it is following the problem of.Such as Fig. 5 institutes of patent document 1 Show, in order to manufacture electronic unit, circuit element 2A, 2B are installed on substrate 1A, and be coated with insulative resin 13A.Then, right At the position that multiple electronic units are divided, half grooving 5 is formed using cutting machine.Half grooving 5 forms and arrives following depth Untill, i.e.,：The internal layer electrode of substrate 1A is reached from the surface of insulative resin 13A.Then, by the way that electroconductive resin 13B is put Put makes its flowing in the top surface of insulative resin 13A and pressurization, so that electroconductive resin 13B is filled into half grooving 5.Such as This, in order to manufacture shielded electronic unit, in addition to coating resin and the pressurized flow process for flowing it of pressurizeing, also needs Form the groove formation process and device of half grooving 5.Increase accordingly, there exist cost of equipment, the increasing of the manufacture cost of electronic unit The problem of adding.
The content of the invention
The present invention is used to solve the above problems, and its purpose is to provide one kind can produce by electric conductivity solidified resin And there is the circuit block of electro-magnetic screen function and the circuit block of manufacture cost, the manufacture method of circuit block can be reduced And the manufacture device of circuit block.
To solve the above-mentioned problems, the manufacture method of circuit block according to the present invention is that manufacture possesses electronic circuit simultaneously And the circuit block manufacture method of the circuit block with electro-magnetic screen function, the manufacture method of the circuit block include：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the base Plate first face installation electronic unit and in grounding electrode provided around the electronic unit；
First molding procedure, using the first molding die, insulating properties is realized in described that side of first face of the substrate The shaping of solidified resin；And
Second molding procedure, then first molding procedure, using the second molding die, described the of the substrate Simultaneously the shaping of electric conductivity solidified resin is realized in that side, so that encapsulation metacoxal plate is made,
In first molding procedure, a part of portion of the grounding electrode is covered by the insulating properties solidified resin Position and the electronic unit, the remaining position by making the grounding electrode are exposed from the insulating properties solidified resin, so that Grounding electrode is exposed in formation,
In second molding procedure, the insulating properties solidified resin and institute are covered by the electric conductivity solidified resin State and expose grounding electrode, so as to expose grounding electrode and electric conductivity solidified resin electrical connection by described.
In addition, in the manufacture method of circuit block according to the present invention, " the remaining position of the grounding electrode " is Finger does not include other described positions of a part of position, grounding electrode.The explanation of the statement is applied equally in the present invention Other invention and embodiment.
To solve the above-mentioned problems, the manufacture method of circuit block according to the present invention is that manufacture possesses electronic circuit simultaneously And the circuit block manufacture method of the circuit block with electro-magnetic screen function, the manufacture method of the circuit block include：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the base Plate first face installation electronic unit and in grounding electrode provided around the electronic unit；
First molding procedure, using the first molding die, insulating properties is realized in described that side of first face of the substrate The shaping of solidified resin, thus by the insulating properties solidified resin cover the electronic unit, one of the grounding electrode The remaining position of Divisional and the grounding electrode；
Then first molding procedure, is covered using removal mechanism come the remaining position removed the grounding electrode The insulating properties solidified resin of lid, so that the remaining position of the grounding electrode is exposed exposes grounding electrode to be formed Process；And
Second molding procedure, using the second molding die, electric conductivity is realized in described that side of first face of the substrate The shaping of solidified resin, so that encapsulation metacoxal plate is made,
In second molding procedure, the insulating properties solidified resin and institute are covered by the electric conductivity solidified resin State and expose grounding electrode, so that expose grounding electrode and electric conductivity solidified resin electrical connection by described,
As first molding die, the removal mechanism and second molding die, filled using same manufacture First molding die, the removal mechanism and second molding die possessed in putting.
To solve the above-mentioned problems, the manufacture method of circuit block according to the present invention be use have the first mould with And the molding die of second mould arranged opposite with first mould, possess electronic circuit to manufacture and there is electromagnetic screen The circuit block manufacture method of the circuit block of function is covered, the manufacture method of the circuit block includes：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the base Plate first face installation electronic unit and in grounding electrode provided around the electronic unit；
Electroconductive resin material under room temperature for solid-like, paste or liquid is supplied to and is arranged in first mould Die cavity process；
In a manner of opposed with the die cavity by first face of the substrate, the encapsulation prebasal plate is configured at described The process of molding die；
Insulative resin material under room temperature for solid-like, paste or liquid is supplied to and has been fed with the electric conductivity tree The process of the die cavity of fat material；
By being molded to the molding die, so that in the die cavity, by a part of portion of the grounding electrode Position and the electronic unit are immersed in the insulating properties stir-in resin by insulative resin material generation, and by the ground connection The remaining position of electrode is immersed in the process in the electric conductivity stir-in resin by electroconductive resin material generation；
In the die cavity, by cure the insulating properties stir-in resin so as to first face of the substrate that The shaping of the insulating properties solidified resin is realized in side, make the electric conductivity stir-in resin cure and described the of the substrate Simultaneously the shaping of the electric conductivity solidified resin is realized in that side, the process for making encapsulation metacoxal plate accordingly；And
The process molded to the molding die,
In the process for making the encapsulation metacoxal plate, by the remaining position of the grounding electrode and the electric conductivity Solidified resin is electrically connected.
To solve the above-mentioned problems, the manufacture device of circuit block according to the present invention includes：
First forming module, has the first molding die；
Second forming module, has the second molding die；
Substrate supplying module, supply encapsulation prebasal plate, it is described encapsulation prebasal plate at least possess the substrate with the first face, The substrate first face installation electronic unit and in grounding electrode provided around the electronic unit；With And
Resin material supplying module, supplies insulative resin material and electroconductive resin material,
In first molding die, by making the insulative resin material solidification, cure so as to fulfill insulating properties The shaping of resin, at least a portion position of the grounding electrode and the ministry of electronics industry are covered by the insulating properties solidified resin Part,
In second molding die, make the electroconductive resin material solidification and realize and at least cover the insulating properties The shaping of the electric conductivity solidified resin of solidified resin, makes encapsulation metacoxal plate accordingly,
On the encapsulation metacoxal plate, at least described a part of position of the grounding electrode and the electronic unit are by institute The covering of insulating properties solidified resin is stated, the insulating properties solidified resin is covered by the electric conductivity solidified resin,
First forming module and second forming module can be loaded and unloaded mutually,
First forming module and second shaping mould at least one module in the block and the substrate supplying module Can mutually it be loaded and unloaded with least one module in the resin material supplying module,
The electric conductivity solidified resin is connected to the grounding electrode, has electro-magnetic screen function.
To solve the above-mentioned problems, the manufacture device of circuit block according to the present invention includes：
First forming module, has the first molding die；
Substrate supplying module, supply encapsulation prebasal plate, it is described encapsulation prebasal plate at least possess the substrate with the first face, The substrate first face installation electronic unit and in grounding electrode provided around the electronic unit；With And
Resin material supplying module, supplies insulative resin material and electroconductive resin material,
At least one module and the described first shaping in the substrate supplying module and the resin material supplying module Module can be loaded and unloaded mutually,
First molding die by realizing insulating properties solidified resin and covering the insulating properties solidified resin in the lump The shaping of electric conductivity solidified resin, so that encapsulation metacoxal plate is made,
On the encapsulation metacoxal plate, at least described a part of position of the grounding electrode and the electronic unit are by institute The covering of insulating properties solidified resin is stated, the insulating properties solidified resin is covered by the electric conductivity solidified resin,
The electric conductivity solidified resin is connected to the grounding electrode, has electro-magnetic screen function.
To solve the above-mentioned problems, circuit block according to the present invention includes：
Electronic unit, is installed on substrate；
Grounding electrode, is arranged at the substrate；
Insulating properties solidified resin, covers a part of position of grounding electrode and the electronic unit,
Electric conductivity solidified resin, covers the remaining position of the grounding electrode and the insulating properties solidified resin, and electric The remaining position of the grounding electrode is connected to, there is electro-magnetic screen function；And
Boundary portion, forms on the border of the insulating properties solidified resin and the electric conductivity solidified resin.
In accordance with the invention it is possible to produce by covering insulating properties solidified resin and being electrically connected to the conduction of grounding electrode Property solidified resin and with electro-magnetic screen function circuit block.
Brief description of the drawings
Fig. 1 is to show that what is used in the circuit block involved by present embodiment encapsulates the synoptic diagram of prebasal plate, and (a) is Top view, (b) are the line A-A sectional views of (a).
(a) of Fig. 2~(c) is to show to use resin material (the insulative resin material with insulating properties in embodiment 1 Material) come the encapsulation prebasal plate shown in Fig. 1 is molded with resin with realize intermediate molding process schematic cross sectional view.
(a) of Fig. 3~(c) is to show to use conductive resin material (electroconductive resin material in embodiment 1 Material) come the intermediate shown in Fig. 2 is molded with resin with realize encapsulation metacoxal plate molding process schematic cross sectional view.
(a) of Fig. 4~(c) is to show to carry out singualtion to the encapsulation metacoxal plate shown in Fig. 3 in embodiment 1 to manufacture The schematic cross sectional view of the process of circuit block.
(a) of Fig. 5~(c) is shown in embodiment 2 using electroconductive resin material come to the intermediate shown in Fig. 2 The schematic cross sectional view for the process being molded with resin.
(a) of Fig. 6~(c) is shown in embodiment 2 to carrying out singualtion by the encapsulation metacoxal plate of resin forming To manufacture the schematic cross sectional view of the process of circuit block.
(a) of Fig. 7~(c) is to show that the encapsulation prebasal plate shown in Fig. 1 is supplied to mold in embodiment 3 and incite somebody to action Electroconductive resin material and insulative resin material are supplied to the schematic cross sectional view of the process of lower mould.
(a) of Fig. 8~(c) is to show to make electroconductive resin material and the insulative resin shown in Fig. 7 in embodiment 3 Material solidification with realize encapsulation metacoxal plate molding process schematic cross sectional view.
(a) of Fig. 9~(c) is shown in embodiment 3 to carrying out singualtion by the encapsulation metacoxal plate of resin forming To manufacture the schematic cross sectional view of the process of circuit block.
Figure 10 is the top view for showing the summary of resin molding apparatus in embodiment 4.
Figure 11 is the top view for showing the summary of manufacture device in embodiment 5.
(a) of Figure 12~(c) is to show to manufacture by the way that multiple electronic units are molded with resin in embodiment 6 The schematic cross sectional view of the various circuit blocks gone out.
Description of reference numerals
1 encapsulation prebasal plate
2nd, 77,88,95 substrate
3 semiconductor chips (electronic unit)
4th, 79,89,96 electrode of substrate
5 pad electrodes
6th, 78 bonding wire
7th, 80,90,97 grounding electrode
A part of positions of 7a
7b residues position
8 solder resists
9 cutting lines
10 regions
11 first molding dies
12 molds
13 times moulds
14 die cavitys (the first die cavity)
15th, 25,31,36 mold release film
16th, 38 particulate resins (insulative resin material)
17 stir-in resins (insulating properties stir-in resin)
18th, 43,82,91,98 insulating properties solidified resin
19 intermediates
20 second molding dies
21 molds (the first mould, the second mould)
22 times moulds (the second mould, the first mould)
23 die cavitys (the second die cavity)
24 configuring areas
26th, 37 flaky resins (electroconductive resin material)
27th, 33,42,83,92,99 electric conductivity solidified resin
28th, 34,35 encapsulation metacoxal plate
29 rotating swords
30th, 35,46,74,84,93 circuit block
32 fluid resins (electric conductivity stir-in resin)
39 electric conductivity stir-in resins
40 insulating properties stir-in resins
41 liquid resin mixed layers
44th, 100 solidified resin mixing unit
47 resin molding apparatus (manufacture device)
48 substrates supply storage module (substrate supplying module)
49 first forming modules
50 second forming modules
51 resin material supplying modules
52 encapsulation prebasal plate supply units
53 encapsulation metacoxal plate incorporating sections
54 substrate placement sections
55 baseplate conveying mechanisms
56th, 57 clamping
58 material conveyers
59 material transfer parts
60 particulate resin feed mechanisms
61 particulate resin injection mechanisms
62 flaky resin feed mechanisms
63 fluid resin emitting mechanisms
64 mold release film feed mechanisms
65 manufacture devices
66 cutting modules
67 cutting tables
68 moving mechanisms
69 rotating mechanisms
70th, 71 mandrel
72nd, 73 rotating sword
75th, 76,85,86,87,94 electronic unit
81 convex blocks
Embodiment
Hereinafter, refer to the attached drawing illustrates embodiment according to the present invention.On any in present specification One attached drawing, for ease of understanding, suitably omits or is turgidly schematically described.For identical knot Structure key element, adds identical reference numeral and suitably omits the description.In addition, in present specification, " electronic unit " is included not At least a portion of the so-called semiconductor chip and semiconductor chip that are packaged by resin etc. is packed by resin etc. The semiconductor chip of form afterwards.In addition, " circuit block " passes through electric conductivity solidified resin quilt including at least one electronic unit The circuit block of the structure of shielding.
[embodiment 1]
(structure of encapsulation prebasal plate)
With reference to figure 1, to the knot of the encapsulation prebasal plate used in the circuit block of embodiment 1 according to the present invention Structure illustrates.
As shown in (a) of Fig. 1, encapsulation prebasal plate 1 is that substrate is virtually divided into the multiple regions of clathrate and each The substrate of electronic unit is installed in region.In the present embodiment, show that multiple semiconductors as electronic unit are installed The encapsulation prebasal plate of chip.Encapsulation prebasal plate 1 includes substrate 2 and the multiple semiconductor chips 3 installed on a substrate 2.As Substrate 2, such as use glass epoxide laminate, printed base plate, ceramic substrate etc..As semiconductor chip 3, such as it is provided with micro- Processor, high-frequency element, power device etc..In Fig. 1, the formation of semiconductor chip 3 is made have the interarea of circuit upward and in base Semiconductor chip 3 is installed on plate 2.
The surface of substrate 2 is provided with multiple electrode of substrate 4.Though illustration omitted, electrode of substrate 4 is via in substrate 2 The wiring and be connected respectively in the via hole wiring of the inside of substrate 2 setting in the setting of the back side of substrate 2 that surface is set Outer electrode.Electrode of substrate 4, wiring, via hole wiring and outer electrode preferably using the small copper (Cu) of such as resistivity or Aluminium (Al) etc..As shown in (b) of Fig. 1, multiple electrode of substrate 4 are electrically connected respectively to the pad electricity formed on semiconductor chip 3 Pole 5.Electrode of substrate 4 and pad electrode 5 are connected by the bonding wire 6 being made of gold thread or copper wire.
Special electrodes among multiple electrode of substrate 4, which are formed, to be used to the current potential of semiconductor chip 3 being set to earthing potential Grounding electrode (ground electrode) 7.As shown in (a) of Fig. 1, grounding electrode 7 is included semiconductor chip 3 and multiple electrode of substrate 4 The wiring pattern for the frame-shaped that surrounding is surrounded.In the present embodiment, in the regional for being provided with semiconductor chip 3, including The part for being directly connected to bonding wire 6 of grounding electrode 7 and most peripheral formed frame-shaped wiring pattern including, be referred to as grounded Electrode 7.
On the surface of substrate 2, in addition to the surface of electrode of substrate 4 and grounding electrode 7, it is additionally provided with as insulating properties tree The solder resist 8 of fat overlay film.
Before packaging on substrate 1, substrate 2 is divided into the multiple regions of clathrate, is cut for cut off regional Broken string 9 along the X direction with Y-direction (dotted line shown in (a) of Fig. 1 on horizontal and vertical) and set respectively.By multiple The regional 10 that cutting line 9 surrounds is respectively equivalent to become the area by the shielded circuit block of electric conductivity solidified resin Domain.
(resin forming process and singualtion operation)
With reference to figure 2~4, for for example using the resin molding apparatus using compression forming methods, to the encapsulation shown in Fig. 1 Prebasal plate 1 is molded with resin to make encapsulation metacoxal plate, and carries out singualtion to encapsulation metacoxal plate to manufacture circuit block Process illustrates.In addition, as described below, the resin molding apparatus used in the present embodiment is to possess (with reference to figure 10) There is molding first molding die for realizing insulating properties solidified resin and realize the second one-tenth molding of electric conductivity solidified resin The manufacture device of pattern tool.
With reference to figure 2, the knot of molding first molding die to realizing insulating properties solidified resin in resin molding apparatus Structure illustrates.As shown in (a) of Fig. 2, the first molding die 11 includes mold 12 and arranged opposite with mold 12 Lower mould 13.In lower mould 13, die cavity 14 is provided with, insulative resin material is fed into the die cavity 14.
With reference to figure 2, said for using insulative resin material come the process that encapsulation prebasal plate 1 is molded with resin It is bright.First, in the first molding die 11, the state after molding mold 12 and lower mould 13 is set in advance.Then, use Encapsulation prebasal plate 1 shown in Fig. 1, is transported to the assigned position of the lower section of mold 12 by baseplate conveying mechanism (with reference to figure 10).
Then, encapsulation prebasal plate 1 is made to increase using baseplate conveying mechanism, and will be encapsulated by adsorbing or clamping (not shown) Prebasal plate 1 is fixed on the type face of mold 12.Prebasal plate 1 is encapsulated so as to be provided with the side facing to downside of semiconductor chip 3 Formula is fixed in the type face of mold 12.
Then, mold release film 15 is supplied to lower mould 13.Using the adsorbing mechanism (not shown) being arranged in lower mould 13, Mold release film 15 is adsorbed in a manner of along the type face of in die cavity 14, lower mould 13.As mold release film 15, can make With any one in the mold release film or the mold release film of strip for being cut into thin rectangular shape.In addition, according to resin material not Together, there is also the situation without using mold release film 15.In fig. 1 it is illustrated that supply is cut into the example of the mold release film 15 of thin rectangular shape Son.
Then, using material conveyer (with reference to figure 10), insulative resin material is supplied to and is arranged on lower mould 13 In die cavity 14.As insulative resin material, it is for instance possible to use the thermosetting resin such as epoxy resin or silicone resin.Make For resin material, can use under room temperature be powdered, graininess, sheet etc. solid-like resin or room temperature under be liquid No matter (viscosity size.It is hereinafter same.) resin (fluid resin) etc..In the present embodiment, supply graininess is shown Resin (particulate resins) 16 using the example as insulative resin material.Specifically, particulate resins 16 are fed into It is adsorbed in the mold release film 15 of die cavity 14.
Although the here, example to mold release film 15 and particulate resins 16 to be transported to lower mould 13 in different processes It is illustrated, but it's not limited to that.For example, configuring material storage frame in mold release film 15, and particulate resins 16 are thrown Enter among material storage frame.Material conveyer is used in this condition, mold release film 15 and material storage frame is (same in the lump When) it is transported to lower mould 13.Hereby it is possible to mold release film 15 and particulate resins 16 are supplied to die cavity 14 in the lump.
Then, particulate resins 16 are heated by the heater (not shown) being arranged in lower mould 13.Pass through Heated, so that particulate resins 16 melt and generate the liquid resin (insulating properties stir-in resin) with insulating properties 17.In addition, in the case where fluid resin is supplied to die cavity 14 as insulative resin material, the fluid resin itself is suitable In insulating properties stir-in resin 17.
Then, as shown in (b) of Fig. 2, lower mould 13 is made to increase using clamping (with reference to figure 10), with to mold 12 and lower mould 13 molded.By being molded, so that the semiconductor chip 3 for being installed on encapsulation prebasal plate 1 is impregnated into In the insulating properties stir-in resin 17 being full of in die cavity 14.After being molded to mold 12 and lower mould 13, in use Mould 12 and lower mould 13, apply pressure to the insulating properties stir-in resin 17 in die cavity 14.
Then, using the heater (not shown) being arranged in lower mould 13, according in order to make the insulation with insulating properties Property stir-in resin 17 cures and the required time, and insulating properties stir-in resin 17 is heated.Make insulating properties stir-in resin 17 solid Change, so as to fulfill the shaping of the solidified resin (insulating properties solidified resin) 18 with insulating properties.A part of position of grounding electrode 7 7a and be installed on encapsulation prebasal plate 1 semiconductor chip 3 by it is corresponding with the shape of die cavity 14 and molding insulating properties cure Resin 18 is by carry out resin-encapsulated.Relative to encapsulation prebasal plate 1, a part of the position 7a and semiconductor chip 3 of grounding electrode 7 are logical Insulating properties solidified resin 18 is crossed by carry out resin-encapsulated.By process so far, intermediate 19 is formed.Set on curing The hardness of fat, as long as in order to protect the influence by the grade of semiconductor chip 3 that solidified resin covers from external force, external environment condition etc. And enough hardness.
In the state of after mold 12 and lower mould 13 are molded, overlook when die cavity 14 peripheral part and encapsulation before base The grounding electrode 7 of plate 1 is overlapping.Therefore, a part of position 7a (that side near apart from semiconductor chip 3) leaching of grounding electrode 7 Stain is into insulating properties stir-in resin 17.On the other hand, the remaining position 7b of grounding electrode 7 is (apart from remote that of semiconductor chip 3 Side) it is not impregnated with insulating properties stir-in resin 17, but be clamped by the type face of lower mould 13.Accordingly, base before packaging In the case that plate 1 is molded with resin by insulative resin material (particulate resins 16), a part of portion of grounding electrode 7 Position 7a and semiconductor chip 3 are molded with resin.On the other hand, the remaining position 7b of grounding electrode 7 not by carry out resin into Type, and as the state exposed from the surface of grounding electrode 7.
Then, as shown in (c) of Fig. 2, using clamping, mold 12 and lower mould 13 are molded.In upper mold The type face of tool 12, is fixed with intermediate 19.The remaining position 7b of grounding electrode 7 is not by carry out resin-encapsulated and from grounding electrode The state that 7 surface is exposed.Then, using baseplate conveying mechanism, intermediate 19 is taken out from the first molding die 11.
In intermediate 19, it is desirable to it is desirable that the region exposed from insulating properties solidified resin 18 (includes at least ground connection electricity Region including the remaining position 7b of pole 7) in do not form solidified resin.In order to make it possible the requirement, can use following Method.First method is to use above-mentioned mold release film 15.Second method is to paste resin film on substrate 1 before packaging, should Resin film has the corresponding opening of scope with forming insulating properties solidified resin 18.By forming insulating properties solidified resin 18 Resin film is removed afterwards, so that the region for being pasted with resin film is exposed from insulating properties solidified resin 18.3rd method It is by sandblasting processing, water jet machining, cleaning etc., by it is desirable that what the region exposed from insulating properties solidified resin 18 was formed Relatively thin insulating properties solidified resin removes.
With reference to figure 3, the knot of molding second molding die to realizing electric conductivity solidified resin in resin molding apparatus Structure illustrates.As shown in (a) of Fig. 3, the second molding die 20 includes mold 21 and arranged opposite with mold 21 Lower mould 22.In lower mould 22, die cavity 23 is provided with, electroconductive resin material is fed into the die cavity 23.In die cavity 23 Around, it is provided with the configuring area 24 for for example configuring flaky resin.Configuring area 24, which is arranged to include when overlooking, to be arranged on Whole die cavity 23 in lower mould 22.
" when overlooking, A includes the such statements of B " and means " observing A and B along the direction described as top view During overlapping state, A completely includes B, and there are a part of A on the outside of the B on the whole periphery of B ".
Three-dimensionally see, the die cavity 23 being arranged in the lower mould 22 of the second molding die 20, which includes, is arranged on the first shaping mould Die cavity 14 in the lower mould 13 of tool 11 (with reference to figure 2).In other words, in the type face for making lower mould 22 and the type face weight of lower mould 13 In the state of conjunction, the volume (volume) of die cavity 23 is set to be greater than the volume (volume) of die cavity 14.Also, the size of die cavity 23 It is set to the size for being more than die cavity 14 in X-direction, Y-direction and Z-direction.
With reference to figure 3~4, for intermediate 19 is molded with resin by electroconductive resin material to make base after encapsulation Plate, and singualtion is carried out to encapsulation metacoxal plate and is illustrated with manufacturing the process of circuit block.As insulative resin material, example Such as, the thermosetting resins such as epoxy resin or silicone resin can be used.As resin material, it is powder that can use under room temperature It is resin of liquid etc. under the solid-like resin or room temperature of shape, graininess, sheet etc..
First, as shown in (a) of Fig. 3, in the second molding die 20, it is set to after molding mold 21 and lower mould 22 State.Then, will be from the first molding die 11 (with reference to figure 2) in taking-up using baseplate conveying mechanism (with reference to figure 10) Mesosome 19 is transported to the assigned position of the lower section of mold 21.Then, intermediate 19 is increased using baseplate conveying mechanism, and pass through Intermediate 19, is fixed on the type face of mold 21 by absorption or clamping.
Then, mold release film 25 and electroconductive resin material are supplied to lower mould 22.In the present embodiment, showing will be de- Mould film 25 and electroconductive resin material are supplied to the example of die cavity 23 in the lump.For example, show by resin (the sheet tree of sheet Fat) 26 adhered to as electroconductive resin material in mold release film 25 in the state of, flaky resin 26 is supplied to die cavity 23 Example.The flaky resin 26 used in the present embodiment is the flaky resin for having flexibility.Therefore, flaky resin 26 passes through It is heated and stretches.
As shown in (a) of Fig. 3, using material conveyer (with reference to figure 10), the mold release film of flaky resin 26 will be adhered with 25 are supplied to lower mould 22.Flaky resin 26 between the configuring area 24 that is arranged in lower mould 22 to clip mold release film 25 Mode is configured on configuring area 24.It is adhered with here, showing and being used as using the mold release film for being cut into thin rectangular shape The example of the mold release film 25 of flaky resin 26.Not limited to this, can also adhere to flaky resin in the mold release film of strip.
Conductive flaky resin 26 is that silver is added in the thermosetting resin such as in epoxy resin or silicone resin (Ag), the electroconductive particle such as metallic, carbon particle such as copper (Cu), aluminium (Al), nickel (Ni) and form.For flaky resin 26, species and the additive amount of added electroconductive particle can be passed through to be controlled to electric conductivity and angularity.Comprising Pyroconductivity possessed by the flaky resin 26 of electroconductive particle is more than heat possessed by the particulate resins 16 with insulating properties Conductivity.This point is also identical in the following embodiments.
Then, as shown in (b) of Fig. 3, using the adsorbing mechanism (not shown) being arranged in lower mould 22, with along die cavity 23 and configuring area 24 in, the mode in the type face of lower mould 22 adsorbs mold release film 25.In this case, due to viscous The flaky resin 26 with flexibility, therefore flaky resin 26 is also together with mold release film 25 along die cavity 23 and configuring area The type face of in 24, lower mould 22 and configure.Mold release film 25 and flaky resin 26 are due to by from being arranged on lower mould 22 In heater radiant heat and stretch, therefore can along the type face of in die cavity 23 and configuring area 24, lower mould 22 and Configuration.In this way, conductive flaky resin 26 is fed into die cavity 23.
Then, as shown in (c) of Fig. 3, lower mould 22 is made to increase using clamping (with reference to figure 10), with to mold 21 and lower mould 22 molded.Three-dimensionally see, the die cavity 23 being arranged in the lower mould 22 of the second molding die 20, which includes, to be set Put the die cavity 14 in the lower mould 13 of the first molding die 11 (with reference to figure 2).Therefore, die cavity 23, which includes, takes shape in intermediate 19 Insulating properties solidified resin 18.By being molded, the insulating properties solidified resin 18 of intermediate 19 is taken shape in by seamlessly (substantially Closely) it is inserted into the space by die cavity 23, strictly surrounded by flaky resin 26.In this condition, grounding electrode 7 Exposing surface remaining position 7b and conductive flaky resin 26 be in contact.
Then, using the heater (not shown) being arranged in lower mould 22, flaky resin 26 is heated and makes it Fusing.And then according in order to make the liquid resin after fusing (electric conductivity stir-in resin) cure and required time, to flowing Property resin is heated.Cure liquid resin, so as to fulfill conductive solidified resin (electric conductivity solidified resin) 27 shaping.Electric conductivity solidified resin 27 is fixed on due to curing on insulative resin 18.The remaining position of grounding electrode 7 7b and electric conductivity solidified resin 27 are electrically connected.Therefore, it is possible to make 27 electrically conducting of grounding electrode 7 and electric conductivity solidified resin. Hereby it is possible to semiconductor chip 3 is electromagnetically shielded by electric conductivity solidified resin 27.Pass through process so far, envelope Dress metacoxal plate 28 is formed.In the boundary portion of insulating properties solidified resin 18 and electric conductivity solidified resin 27, formed with interface.
Then, as shown in (a) of Fig. 4, using clamping, mold 21 and lower mould 22 are molded.To centre The encapsulation metacoxal plate 28 that body 19 obtains after being molded with resin is fixed in the type face of mold 21.Then, transported using substrate Mechanism, takes out encapsulation metacoxal plate 28 from the second molding die 20.
Then, as shown in (b) of Fig. 4, for example, using with rotating sword 29 topping machanism, to encapsulation metacoxal plate 28 into Row cut-out (is fully cut).Using rotating sword 29, along being arranged at the cutting line 9 of encapsulation metacoxal plate 28 (with reference to figure 1 (a)), encapsulation metacoxal plate 28 is cut off.
As shown in (c) of Fig. 4, by cutting off encapsulation metacoxal plate 28 to carry out singualtion, so as to produce each circuit Component 30.Electric conductivity solidified resin 27 and grounding electrode 7 are electrically connected.Therefore, there is circuit block 30 semiconductor chip 3 to pass through The structure so as to be electromagnetically shielded by the grounding wire is surrounded by electric conductivity solidified resin 27.In insulating properties solidified resin 18 and electric conductivity solidified resin 27 boundary portion, formed with interface.
(action effect)
The manufacture method of the circuit block of present embodiment is that manufacture possesses electronic circuit and has electro-magnetic screen function Circuit block 30 circuit block manufacture method, including：Prepare the process of encapsulation prebasal plate 1, the encapsulation prebasal plate 1 is at least Possess the substrate 2 with the first face, the semiconductor chip 3 of electronic unit be installed as in the first face of substrate 2 and half Grounding electrode 7 provided around conductor chip 3；First molding procedure, using the first molding die 11, the first of substrate 2 Realize the shaping of insulating properties solidified resin 18 in that side of face；And second molding procedure, then the first molding procedure, uses second Molding die 20, in the first face of substrate 2, the shaping of electric conductivity solidified resin 27 is realized in that side, so as to make encapsulation metacoxal plate 28.In the first molding procedure, a part of the position 7a and semiconductor core of grounding electrode 7 are covered by insulating properties solidified resin 18 Piece 3, the remaining position 7b by making grounding electrode 7 expose from insulating properties solidified resin 18, expose grounding electrode so as to be formed 7b；In the second molding procedure, insulating properties solidified resin 18 is covered by electric conductivity solidified resin 27 and exposes grounding electrode 7b, So as to which grounding electrode 7b will be exposed and electric conductivity solidified resin 27 is electrically connected.
According to the manufacture method, by insulating properties solidified resin 18 to a part of position 7a of grounding electrode 7 and in substrate 2 Interarea installation semiconductor chip 3 carry out resin-encapsulated.Remaining position by electric conductivity solidified resin 27 to grounding electrode 7 7b carries out resin-encapsulated.Accordingly, electric conductivity solidified resin 27 and grounding electrode 7 are electrically connected.Therefore, it is possible to be consolidated by electric conductivity Change resin 27 to be electromagnetically shielded semiconductor chip 3.Further, it is possible to reduce the manufacture cost of circuit block 30.
The circuit block of present embodiment is set to such as lower structure, including：Semiconductor chip 3, is mounted to the electronics of substrate Component；Grounding electrode 7, is arranged at substrate 2；Insulating properties solidified resin 18, covers a part of position 7a of grounding electrode 7 and partly leads Body chip 3；Electric conductivity solidified resin 27, covers the remaining position 7b and insulating properties solidified resin 18 of grounding electrode 7, and is electrically connected The remaining position 7b of grounding electrode 7 is connected to, there is electro-magnetic screen function；And boundary portion, in insulating properties solidified resin 18 with leading The border of electrical solidified resin 27 is formed.
According to the structure, a part of position 7a of grounding electrode 7 can be covered with insulating properties solidified resin 18 and is installed on The semiconductor chip 3 of substrate 2, and the remaining position 7b and electric conductivity solidified resin 27 of grounding electrode 7 are electrically connected.Accordingly, it is capable to Enough semiconductor chip 3 is electromagnetically shielded by electric conductivity solidified resin 27.
According to the present embodiment, first, encapsulation prebasal plate 1 is carried out using insulative resin material (particulate resins 16) Resin forming.Accordingly, encapsulation prebasal plate to a part of position 7a of grounding electrode 7 and is installed on by insulating properties solidified resin 18 1 semiconductor chip 3 carries out resin-encapsulated, to realize the shaping of intermediate 19.The remaining position 7b of grounding electrode 7 is not carried out Resin-encapsulated, and the state exposed as surface.Then, using electroconductive resin material (flaky resin 26) to intermediate 19 into Row resin forming.Accordingly, resin is carried out to the remaining position 7b of the grounding electrode 7 of intermediate 19 by electric conductivity solidified resin 27 Encapsulation, to realize the shaping of encapsulation metacoxal plate 28.Electric conductivity solidified resin 27 and grounding electrode 7 are electrically connected.Therefore, it is possible to logical Electric conductivity solidified resin 27 is crossed to be electromagnetically shielded semiconductor chip 3.Singualtion is carried out to encapsulation metacoxal plate 28 and is produced Circuit block 30 there is semiconductor chip 3 to be surrounded by electric conductivity solidified resin 27 so as to the structure that is electromagnetically shielded by the grounding wire.
In addition, pyroconductivity possessed by the electric conductivity solidified resin 27 comprising electroconductive particle, which is more than insulating properties, cures tree Pyroconductivity possessed by fat 18.Therefore, electric conductivity solidified resin 27 has heat sinking function, so producing with excellent heat dissipation The circuit block 30 of property.This point is also identical in the following embodiments.
According to the present embodiment, in resin molding apparatus, it is provided with and realizes molding the of insulating properties solidified resin 18 A molding tool 11 and molding second molding die 20 for realizing electric conductivity solidified resin 27.Use the first molding die 11, the semiconductor core of encapsulation prebasal plate 1 to a part of position 7a of grounding electrode 7 and is installed on by insulating properties solidified resin 18 Piece 3 carries out resin-encapsulated.Using the second molding die 20, the remaining position by electric conductivity solidified resin 27 to grounding electrode 7 7b carries out resin-encapsulated.Hereby it is possible to it is electrically connected electric conductivity solidified resin 27 and grounding electrode 7, so as to consolidate by electric conductivity Change resin 27 to be electromagnetically shielded semiconductor chip 3.Using resin molding apparatus, can be produced by resin forming twice The circuit block 30 of shielding construction.Without using the device in addition to resin molding apparatus, it becomes possible to produce shielding construction Circuit block 30.Therefore, it is possible to the manufacture cost for suppressing cost of equipment, reducing circuit block 30.
In the present embodiment, insulating properties solidified resin 18 and electric conductivity solidified resin 27 are realized by compression forming methods The resin forming of both sides.Not limited to this, can realize insulating properties solidified resin 18 by transfer molding process or jet forming method Resin forming, and realize by compression forming methods the resin forming of electric conductivity solidified resin 27.Alternatively, biography can also be passed through The method of forming or jet forming method are passed to realize the resin forming of 27 both sides of insulating properties solidified resin 18 and electric conductivity solidified resin.This Outside, can also respectively using single device come realize the resin of insulating properties solidified resin 18 and electric conductivity solidified resin 27 into Type.
In the present embodiment, by (region is equivalent to circuit portion with the regional 10 that is surrounded by multiple cutting lines 9 Part 30) corresponding die cavity 14,23 is arranged in each molding die 11,20 (lower mould 13,22).Not limited to this, can also incite somebody to action Die cavity comprising regional 10 is arranged in each molding die 11,20.In this case, cut-out encapsulation metacoxal plate 28 and Carrying out in the circuit block 30 after singualtion, a part for electric conductivity solidified resin 27 is electrically connected to grounding electrode 7, so as to It is enough that semiconductor chip 3 is electromagnetically shielded.In (b) of the part equivalent to Fig. 4 of above-mentioned electric conductivity solidified resin 27 The part of left end and the part of right end.
As variation, the surface (lower surface and side shown in (c) of Fig. 2) of insulating properties solidified resin 18 can be set For rough surface.Surface (face of that side to connect with insulating properties stir-in resin 17) by making mold release film 15 becomes rough surface, So as to make the surface of insulating properties solidified resin 18 become rough surface.Accordingly, insulating properties solidified resin 18 and electric conductivity cure The bond area increase of resin 27.It is close between insulating properties solidified resin 43 and electric conductivity solidified resin 42 therefore, it is possible to improve Conjunction property.
As the main material and the main material of composition electroconductive resin material for forming insulative resin material, heat has been used Thermosetting resin.As these main materials, thermosetting resin can also be replaced and use thermoplastic resin.
Encapsulation metacoxal plate 28 is illustrated equivalent to the embodiment of multiple circuit blocks 30.Not limited to this, may be used also With using structure of the encapsulation metacoxal plate 28 equivalent to a circuit block 30.For example, the large scale circuit component of Power Control use etc. 30 equivalent to the circuit substrate with said structure.Furthermore, it is possible in the presence of the encapsulation metacoxal plate equivalent to multiple circuit blocks 30 28 become the situation of trading object.Accordingly, there exist situation of the encapsulation metacoxal plate 28 equivalent to the circuit block as product.
As electroconductive resin material, the flaky resin 26 added in thermosetting resin after electroconductive particle has been used. Instead of electroconductive particle, conducting fibre (metallic fiber, carbon fiber etc.), electric conductivity paper tinsel (metal foil etc.) can also use.With Several variations of upper explanation are readily applicable in other embodiment.
[embodiment 2]
(resin forming process and singualtion operation)
With reference to figure 5~6, in embodiment 2, the intermediate 19 shown in embodiment 1 (Fig. 2) is carried out resin into Type carries out singualtion to encapsulation metacoxal plate and is illustrated with manufacturing the process of circuit block to make encapsulation metacoxal plate.With reality The difference for applying mode 1 is, is not the die cavity that mold release film and resin material are supplied to the second molding die 20 in the lump 23, but mold release film and resin material are supplied using different processes.On process in addition, due to the first shaping mould The structure of 11 and second molding die 20 of tool is identical with embodiment 1, and and the description is omitted.
First, as shown in (a) of Fig. 5, in the second molding die 20, intermediate 19 is fixed on to the type of mold 21 Face.
Then, mold release film 31 is supplied to lower mould 22.As mold release film 31, it can use and be cut into thin rectangular shape Any one in mold release film or the mold release film of strip.Then, (do not schemed using the adsorbing mechanism being arranged in lower mould 22 Show), in a manner of along the type face of in die cavity 23 and configuring area 24, lower mould 22, mold release film 31 is adsorbed.
Then, as shown in (b) of Fig. 5, for example, using material conveyer (with reference to figure 10), by the resin (liquid of liquid Resin) 32 it is supplied to die cavity 23 as electroconductive resin materials.Fluid resin 32 is, for example, (to be divided using fluid resin emitting mechanism Orchestration) etc. be fed into die cavity 23.In such a situation it is preferred to (runny) fluid resin using low viscosity.
Then, as shown in (c) of Fig. 5, using clamping (with reference to figure 10), mold 21 and lower mould 22 are closed Mould.It is same with embodiment 1, three-dimensionally see, the die cavity 23 being arranged in the lower mould 22 of the second molding die 20 includes setting Die cavity 14 in the lower mould 13 of the first molding die 11.Therefore, by being molded to the second molding die 20, so that Between the type face of in die cavity 23, the lower mould 22 of fluid resin 32 and insulating properties solidified resin 18 and in configuring area 24 , flowed between the type face of lower mould 22 and intermediate 19.Accordingly, the surface of insulating properties solidified resin 18 and grounding electrode 7 Remaining position 7b is impregnated into conductive fluid resin (electric conductivity stir-in resin) 32.
Then, as shown in (a) of Fig. 6, using the heater (not shown) being arranged in lower mould 22, electric conductivity is flowed Resin 32 is heated to realize the shaping of conductive solidified resin (electric conductivity solidified resin) 33.Electric conductivity cures tree Fat 33 is fixed on due to curing in insulating properties solidified resin 18.The remaining position 7b and electric conductivity of grounding electrode 7 cure tree Fat 33 is electrically connected.Therefore, it is possible to make 33 electrically conducting of grounding electrode 7 and electric conductivity solidified resin.Hereby it is possible to pass through conduction Property solidified resin 33 is electromagnetically shielded semiconductor chip 3.By process so far, encapsulation metacoxal plate 34 is formed.
Then, as shown in (b) of Fig. 6, mold 21 and lower mould 22 are molded.Then, using substrate transveyer Structure, takes out encapsulation metacoxal plate 34 from the second molding die 20.
Then, as shown in (c) of Fig. 6, using the topping machanism with rotating sword 29, encapsulation metacoxal plate 34 is cut It is disconnected.By being cut off along the cutting line 9 for being arranged at encapsulation metacoxal plate 34 by metacoxal plate 34 is encapsulated to carry out singualtion, so as to manufacture Go out each circuit block 35.Electric conductivity solidified resin 33 and grounding electrode 7 are electrically connected.Therefore, circuit block 35 has and partly leads Body chip 3 is surrounded the structure so as to be electromagnetically shielded by the grounding wire by electric conductivity solidified resin 33.
Since the circuit block 35 produced in embodiment 2 can be realized and the circuit block 30 shown in embodiment 1 Identical effect, and the description is omitted.
In addition, in the present embodiment, fluid resin 32 is supplied to as electroconductive resin material and is arranged on the second one-tenth Die cavity 23 in the lower mould 22 of pattern tool 20.Not limited to this, can be pre- using accordingly being carried out with the shape of die cavity 23 in advance Conductive flaky resin after shaping.In such a case, it is possible to after making mold release film 31 be adsorbed in die cavity 23, supply Give die cavity 23 shape accordingly carry out it is preforming after flaky resin.
[embodiment 3]
(resin forming process and singualtion operation)
With reference to figure 7~9, in embodiment 3, to 1 tree of encapsulation prebasal plate shown in embodiment 1 (Fig. 1) Fat shaping carries out singualtion to encapsulation metacoxal plate and is illustrated with manufacturing the process of circuit block to make encapsulation metacoxal plate. It is with the difference of embodiment 1, electroconductive resin material and insulative resin material both sides is supplied to a shaping Mould (the second molding die) is molded with resin.Therefore, in embodiment 3, for using only shown in embodiment 1,2 The second molding die 20 example that is molded with resin of encapsulation prebasal plate 1 illustrated.
First, as shown in (a) of Fig. 7, in the second molding die 20, encapsulation prebasal plate 1 is fixed on mold 21 Type face.
Then, mold release film 36 is supplied to lower mould 22.Using the adsorbing mechanism being arranged in lower mould 22, with along mould The mode in the type face of in chamber 23 and configuring area 24, lower mould 22, adsorbs mold release film 36.
Then, as shown in (b) of Fig. 7, using material conveyer (with reference to figure 10), by the resin (flaky resin) of sheet 37 are used as electroconductive resin material to be supplied to die cavity 23.Flaky resin 37 be accordingly carried out with the shape of die cavity 23 in advance in advance into Flaky resin after type.Therefore, flaky resin 37 is with along the side in the type face of in die cavity 23 and configuring area 24, lower mould 22 Formula is configured.
Then, as shown in (c) of Fig. 7, using material conveyer (with reference to figure 10), by granular resin (graininess Resin) 38 it is supplied to die cavity 23 as insulative resin materials.Specifically, particulate resins 38 are fed into flaky resin 37 On.
Flaky resin 37 and particulate resins 38 preferably comprise the resin material of identical type (for example, epoxy resin, silicone Resin etc.) to be used as main material.In addition, the main material that main material and particulate resins 38 that flaky resin 37 is included are included It is preferred that with identical characteristic (for example, the relation of time and viscosity etc.) under certain temperature.During resin forming, shape The liquid resin mixed layer (aftermentioned) mixed into conductive resin and insulative resin.Liquid resin mixed layer is Form electroconductive resin molecule and form insulative resin molecule each other thermal diffusion and formed.
Then, as shown in (a) of Fig. 8, by the heater (not shown) being arranged in lower mould 22, to flaky resin 37 Heated with particulate resins 38.Flaky resin 37 is melted to generate conductive liquid resin by heating (electric conductivity stir-in resin) 39.Similarly, particulate resins 38 are melted and generates the liquid resin (insulation with insulating properties Property stir-in resin) 40.In the boundary portion of electric conductivity stir-in resin 39 and insulating properties stir-in resin 40, mixed formed with liquid resin Close layer 41 (part clipped in figure by dotted line).Liquid resin mixed layer 41 is to form electroconductive resin and insulative resin Molecule each other thermal diffusion and formed, equivalent to the intermediate layer for including adjacent resin material respectively.
Then, as shown in (b) of Fig. 8, using clamping (with reference to figure 10), mold 21 and lower mould 22 are closed Mould.Accordingly, a part of the position 7a and semiconductor chip 3 of grounding electrode 7 are impregnated into insulating properties stir-in resin 40, grounding electrode 7 remaining position 7b is impregnated into electric conductivity stir-in resin.On the side of electric conductivity stir-in resin 39 and insulating properties stir-in resin 40 Portion of boundary, maintains 41 intervenient state of liquid resin mixed layer.
Then, as shown in (c) of Fig. 8, according in order to cure each liquid resin and the required time, to mobility tree Fat is heated to realize the shaping of solidified resin.Electric conductivity stir-in resin 39 is heated to realize electric conductivity solidified resin 42 shaping.Insulating properties stir-in resin 40 is heated to realize the shaping of insulating properties solidified resin 43.To liquid resin Mixed layer 41 is heated to realize the shaping of solidified resin mixing unit 44.Accordingly, a part of position 7a of grounding electrode 7 and half Conductor chip 3 is by insulating properties solidified resin 43 by carry out resin-encapsulated.The remaining position 7b of grounding electrode 7 is consolidated by electric conductivity Change resin 42 by carry out resin-encapsulated.Formed with solidified resin between insulating properties solidified resin 43 and electric conductivity solidified resin 42 Mixing unit 44.The remaining position 7b and electric conductivity solidified resin 42 of grounding electrode 7 are electrically connected.Therefore, it is possible to make grounding electrode 7 With 42 electrically conducting of electric conductivity solidified resin.Hereby it is possible to electromagnetism is carried out to semiconductor chip 3 by electric conductivity solidified resin 42 Shielding.By process so far, encapsulation metacoxal plate 45 is formed.
In the present embodiment, between insulating properties solidified resin 43 and electric conductivity solidified resin 42 formed with solidified resin Mixing unit 44.Solidified resin mixing unit 44 is to form insulating properties solidified resin 43 and the molecule of electric conductivity solidified resin 42 is warm each other The region that diffusion and each molecule are combined into.Accordingly, obtained between insulating properties solidified resin 43 and electric conductivity solidified resin 42 Powerful engaging force.Therefore, it is possible to make insulating properties solidified resin 43 and electric conductivity solidified resin 42 more firmly fix.
Then, as shown in (a) of Fig. 9, using clamping, mold 21 and lower mould 22 are molded.In upper mold The type face of tool 21, is fixed with encapsulation metacoxal plate 45.Then, using baseplate conveying mechanism, envelope is taken out from the second molding die 20 Fill metacoxal plate 45.
Then, as shown in (b) of Fig. 9, using the topping machanism with rotating sword 29, encapsulation metacoxal plate 45 is cut It is disconnected.Using rotating sword 29, along the cutting line 9 for being arranged at encapsulation metacoxal plate 45, encapsulation metacoxal plate 45 is cut off.
As shown in 9 (c), by cutting off encapsulation metacoxal plate 45 to carry out singualtion, so as to produce each circuit portion Part 46.Formed with solidified resin mixing unit 44 between insulating properties solidified resin 43 and electric conductivity solidified resin 42, electric conductivity is solid Change resin 42 and grounding electrode 7 is electrically connected.Therefore, circuit block 46 has semiconductor chip 3 by electric conductivity solidified resin 42 Surround the structure so as to be electromagnetically shielded by the grounding wire.
(action effect)
The manufacture method of the circuit block of present embodiment be using molding die 20 come manufacture possess electronic circuit and The circuit block manufacture method of circuit block 46 with electro-magnetic screen function, the molding die 20, which has, is used as the first mould Lower mould 22 and the mold 21 as second mould arranged opposite with lower mould 22, the manufacture method include：It is accurate The process of standby encapsulation prebasal plate 1, the encapsulation prebasal plate 1 at least possess the substrate 2 with the first face, in the first face of substrate 2 It is installed as the semiconductor chip 3 of electronic unit and in grounding electrode 7 provided around semiconductor chip 3；By room temperature The process for being supplied to the die cavity 23 being arranged in lower mould 22 down for the electroconductive resin material 37 of solid-like, paste or liquid； In a manner of opposed with die cavity 23 by the first face of substrate 2, the process that is configured at molding die 20 of prebasal plate 1 will be encapsulated；By room temperature Down the die cavity 23 for being fed with electroconductive resin material 37 is supplied to for the insulative resin material 38 of solid-like, paste or liquid Process；By being molded to molding die 20, so that in die cavity 23, by a part of position 7a of grounding electrode 7 and half Conductor chip 3 is immersed in the insulating properties stir-in resin 40 generated by insulative resin material 38, and by the residue of grounding electrode 7 Position 7b is immersed in the process in the electric conductivity stir-in resin 39 generated by electroconductive resin material 37；In die cavity 23, pass through Cure insulating properties stir-in resin 40, so as to realize the shaping of insulating properties solidified resin 43 in that side of the first face of substrate 2, lead to Crossing cures electric conductivity stir-in resin 39, so that realize the shaping of electric conductivity solidified resin 42 in that side of the first face of substrate 2, The process for making encapsulation metacoxal plate 45 accordingly；And to process that molding die 20 is molded.Metacoxal plate 45 is encapsulated making Process in, the remaining position 7b and electric conductivity solidified resin 42 of grounding electrode 7 are electrically connected.
According to the manufacture method, conductive flaky resin 37 and the particulate resins 38 with insulating properties are supplied To the die cavity 23 being arranged in molding die 20 (lower mould 22).By being carried out at the same time to flaky resin 37 and particulate resins 38 Heating, so as to carry out resin envelope to a part of the position 7a and semiconductor chip 3 of grounding electrode 7 by insulating properties solidified resin 43 Dress, and resin-encapsulated is carried out to the remaining position 7b of grounding electrode 7 by electric conductivity solidified resin 42.Hereby it is possible to by conduction Property solidified resin 42 and grounding electrode 7 are electrically connected., can be by electric conductivity solidified resin 42 to partly leading by a resin forming Body chip 3 is electromagnetically shielded.Therefore, it is possible to further reduce the manufacture cost of circuit block 46.
According to the present embodiment, first, electroconductive resin material (flaky resin 37) is supplied to die cavity 23.Then, supply Give insulative resin material (particulate resins 38).Flaky resin 37 is melted to generate electric conductivity stir-in resin 39.By particle Shape resin 38 is melted to generate insulating properties stir-in resin 40.Cure electric conductivity stir-in resin 39 and insulating properties stir-in resin 40, So as to fulfill the shaping of electric conductivity solidified resin 42 and insulating properties solidified resin 43.By insulating properties solidified resin 43 to ground connection electricity A part of the position 7a and semiconductor chip 3 of pole 7 carry out resin-encapsulated, and by electric conductivity solidified resin 42 to grounding electrode 7 Remaining position 7b carry out resin-encapsulated.Hereby it is possible to grounding electrode 7 and electric conductivity solidified resin 42 are electrically connected.Accordingly, it is capable to Enough semiconductor chip 3 is electromagnetically shielded by electric conductivity solidified resin 42.Singualtion is carried out to encapsulation metacoxal plate 45 and is made There is the circuit block 46 produced semiconductor chip 3 structure so as to be electromagnetically shielded by the grounding wire is surrounded by electric conductivity solidified resin 42.
According to the present embodiment, by electroconductive resin material (flaky resin 37) and insulative resin material (graininess tree Fat 38) both sides are supplied to a molding die (the second molding die 20) to be molded with resin.Accordingly, cured by insulating properties Resin 43 carries out resin-encapsulated to a part of the position 7a and semiconductor chip 3 of grounding electrode 7, and passes through electric conductivity solidified resin The remaining position 7b of 42 pairs of grounding electrodes 7 carries out resin-encapsulated., can be by grounding electrode 7 and conduction by a resin forming Property solidified resin 42 is electrically connected.Therefore, it is possible to be electromagnetically shielded by electric conductivity solidified resin 42 to semiconductor chip 3.And And semiconductor chip 3 can be electromagnetically shielded due to the use of a molding die and by a resin forming, therefore energy Enough suppress cost of equipment, further reduce the manufacture cost of circuit block 46.
According to the present embodiment, solidified resin is formed between electric conductivity solidified resin 42 and insulating properties solidified resin 43 to mix Conjunction portion 44.By forming solidified resin mixing unit 44, so that between insulating properties solidified resin 43 and electric conductivity solidified resin 42 Obtain powerful engaging force.Therefore, it is possible to further improve between insulating properties solidified resin 43 and electric conductivity solidified resin 42 Adaptation.
[embodiment 4]
(structure of resin molding apparatus)
With reference to figure 10, the resin molding apparatus (manufacture device) involved by embodiment 4 is illustrated.Shown in Figure 10 Resin molding apparatus 47 is the resin molding apparatus using compression forming methods used in embodiment 1~3.
Resin molding apparatus 47 includes the substrate supply storage module 48 respectively as structural element, the first forming module 49th, the second forming module 50 and resin material supplying module 51.Substrate supply storage module 48 as structural element, the A molding block 49, the second forming module 50, resin material supplying module 51 is respectively relative to other structural elements being capable of phase Mutually handling, and can replace.
It is provided with substrate supplies storage module 48：Encapsulate prebasal plate supply unit 52, the supply encapsulation (reference of prebasal plate 1 Fig. 1)；Encapsulate metacoxal plate incorporating section 53, storage encapsulation metacoxal plate 28,34,45 be ((b) of (a), Fig. 6 with reference to figure 4, Fig. 9's (a))；Substrate placement section 54, transmits encapsulation prebasal plate 1 and encapsulation metacoxal plate 28,34,45；And baseplate conveying mechanism 55, transport Encapsulate prebasal plate 1 and encapsulation metacoxal plate 28,34,45.Substrate placement section 54 is supplied in storage module 48 in substrate and moved along the Y direction It is dynamic.Baseplate conveying mechanism 55 is in 48 and first forming module 49 of substrate supply storage module, the second forming module 50 along X Direction, Y-direction and Z-direction movement.It is standby that assigned position S1 is that baseplate conveying mechanism 55 carries out under idle state Position.
In the first forming module 49, main molding first molding die 11 for realizing insulating properties solidified resin is provided with (with reference to figure 2).First molding die 11 includes mold 12 (with reference to figure 2) and arranged opposite with mold 12 and can lift Lower mould 13.In the first molding die 11, the molding that mold 12 and lower mould 13 are molded and molded is provided with Mechanism 56 (the circular part represented with double dot dash line).Die cavity 14 is arranged in lower mould 13, (the ginseng of insulative resin material 16 Examine (a) of Fig. 2) it is fed into the die cavity 14.
In the second forming module 50, main molding second molding die 20 for realizing electric conductivity solidified resin is provided with (with reference to figure 3).Second molding die 20 includes mold 21 (with reference to figure 3) and arranged opposite with mold 21 and can lift Lower mould 22.In the second molding die 20, the molding that mold 21 and lower mould 22 are molded and molded is provided with Mechanism 57 (the circular part represented with double dot dash line).Die cavity 23 is arranged in lower mould 22, electroconductive resin material 26, 32nd, 37 ((b), (b) of Fig. 7 of (b), Fig. 5 with reference to figure 3) and insulative resin material 38 are supplied to (with reference to (c) of figure 7) To the die cavity 23.Three-dimensionally see, die cavity 23 includes die cavity 14.
It is provided with resin material supplying module 51：Material conveyer 58, by resin material or is cut into thin length The mold release film of square shape is supplied to die cavity；And material transfer part 59, material is delivered to material conveyer 58.And then setting It is provided with fat material supplying module 51：Particulate resin feed mechanism 60, supplies particulate resins；Particulate resin injection mechanism 61, particulate resins are put into particulate resins feed mechanism 60；Flaky resin feed mechanism 62, supplies flaky resin； Fluid resin emitting mechanism 63, supplies fluid resin；And mold release film feed mechanism 64, the mold release film of the thin rectangular shape of supply.
In resin material supplying module 51, material transfer part 59 is moved with Y-direction along the X direction.Material conveyer 58 in resin material supplying module 51, the first forming module 49 and the second forming module 50 along the X direction, Y-direction and Z Move in direction.Material transfer part 59 is by particulate resins feed mechanism 60, fluid resin feed mechanism 63, flaky resin and thin The mold release film of rectangular shape is delivered to material conveyer 58.Material conveyer 58 is by particulate resins feed mechanism 60, liquid The mold release film of resin emitting mechanism 63, flaky resin and thin rectangular shape is transported to the first forming module 49 or the second forming module 50.Assigned position R1 is that material conveyer 58 carries out standby position under idle state.
Control unit CTL is provided with substrate supplies storage module 48.After control unit CTL is to encapsulation prebasal plate 1 and encapsulation The transport of substrate 28,34,45, the selection of resin material and transport, the heating of molding die, the molding of molding die and die sinking etc. It is controlled.In other words, control unit CTL carries out supplying substrate storage module 48, the first forming module 49, the second forming module 50 and resin material supplying module 51 in the control respectively operated.Control unit CTL can also be arranged on the first forming module 49, It in second forming module 50, can also be arranged in resin material supplying module 51, the outside of each module can also be arranged on.Control Portion CTL processed can also be formed with multiple control units, and the plurality of control unit made at least according to the operation as control object Part separation forms.
On the operation of resin molding apparatus 47, due to being described in detail in embodiment 1~3 to encapsulating prebasal plate 1 The process being molded with resin, therefore in this description will be omitted.
(action effect)
Resin molding apparatus 47 as the manufacture device of the circuit block of present embodiment is set to such as lower structure, including： First forming module 49, has the first molding die 11；Second forming module 50, has the second molding die 20；Substrate supplies Module 48, supply encapsulation prebasal plate 1, the encapsulation prebasal plate 1 at least possess the substrate with the first face, in the first face of substrate The electronic unit of installation and in grounding electrode provided around electronic unit；And resin material supplying module 51, supply Insulative resin material and electroconductive resin material.In the first molding die 11, by making insulative resin material solidification, from And realize the shaping of insulating properties solidified resin, at least a portion position and the electricity of grounding electrode are covered by insulating properties solidified resin Subassembly；In the second molding die 20, by making electroconductive resin material solidification, cure so as to fulfill insulating properties is at least covered The shaping of the electric conductivity solidified resin of resin, makes encapsulation metacoxal plate 28 accordingly；After packaging on substrate 28, grounding electrode is extremely Few a part of position and electronic unit are covered by insulating properties solidified resin, and insulating properties solidified resin is covered by electric conductivity solidified resin Lid；First forming module 49 and the second forming module 50 can be loaded and unloaded mutually；First forming module 49 and the second forming module 50 In at least one module can be mutual with least one module in substrate supplying module 48 and resin material supplying module 51 Handling；Electric conductivity solidified resin is connected to grounding electrode, has electro-magnetic screen function.
According to the structure, in resin molding apparatus 47, using the first molding die 11 and pass through insulating properties solidified resin Encapsulation prebasal plate 1 to be molded with resin, using the second molding die 20 and by electric conductivity solidified resin come before to encapsulation Substrate 1 is molded with resin.Using resin molding apparatus 47 and by resin forming twice, thus by electric conductivity solidified resin and Grounding electrode is electrically connected.Hereby it is possible to semiconductor chip is electromagnetically shielded.Therefore, it is possible to suppress cost of equipment, reduce electricity The manufacture cost of circuit unit.
According to the present embodiment, in resin material supplying module 51, it is respectively arranged with：Particulate resins feed mechanism 60, particulate resins of the supply with insulating properties；Flaky resin feed mechanism 62, supplies conductive flaky resin；With And fluid resin emitting mechanism 63, supply conductive fluid resin.Therefore, using resin molding apparatus 47, Neng Gouru The shaping of insulating properties solidified resin and electric conductivity solidified resin is realized shown in embodiment 1~3 using various manufacture methods.According to This, can carry out resin-encapsulated by insulating properties solidified resin to a part of the position 7a and semiconductor chip 3 of grounding electrode 7, And resin-encapsulated is carried out to the remaining position 7b of grounding electrode 7 by electric conductivity solidified resin.
According to the present embodiment, can be by insulating properties solidified resin to grounding electrode 7 in resin molding apparatus 47 A part of position 7a and the progress resin-encapsulated of semiconductor chip 3 for being installed on encapsulation prebasal plate 1, and pass through electric conductivity solidified resin Resin-encapsulated is carried out to the remaining position 7b of grounding electrode 7.Hereby it is possible to electric conductivity solidified resin and grounding electrode 7 is set to be electrically connected Connect, so as to be electromagnetically shielded by electric conductivity solidified resin to semiconductor chip 3.Therefore, using only resin molding apparatus 47, Semiconductor chip 3 can be just electromagnetically shielded.Without using the device in addition to resin molding apparatus, it becomes possible to produce The circuit block 30,35,46 of shielding construction.Therefore, it is possible to suppress cost of equipment, reduce being manufactured into for circuit block 30,35,46 This.
In the present embodiment, in order to corresponding with the various manufacture methods as shown in embodiment 1~3, in resinous wood Expect in supplying module 51, be respectively arranged with：Particulate resins feed mechanism 60, particulate resins of the supply with insulating properties；Piece Shape resin feed mechanism 62, supplies conductive flaky resin；And fluid resin emitting mechanism 63, supply have conduction The fluid resin of property.Showing can be supplied to particulate resins, flaky resin and fluid resin as resin material The apparatus structure of die cavity, but not limited to this.As long as it can at least supply insulative resin material and electroconductive resin material Apparatus structure.Therefore, the structure of resin material supplying module 51 can further be simplified.
For example, in the manufacture method of embodiment 1, it is convenient to omit supply the liquid tree of conductive fluid resin Fat emitting mechanism 63.In the manufacture method of embodiment 2, it is convenient to omit supply the sheet tree of conductive flaky resin Fat feed mechanism 62.In the manufacture method of embodiment 3, it is convenient to omit supply the liquid tree of conductive fluid resin Fat emitting mechanism 63 and forming module 49.Hereby it is possible to further suppress cost of equipment.Therefore, it is possible to further reduce electricity The manufacture cost of circuit unit 30,35,46.
In addition, in flaky resin feed mechanism 62, can prepare to adhere in mold release film according to the difference of manufacture method Flaky resin 26 with flexibility or accordingly carry out with the shape of die cavity in advance it is preforming after flaky resin 37.
In addition, for mold release film, the de- of the mold release film that supplies thin rectangular shape is provided with resin material supplying module 51 Mould film feed mechanism 64, but not limited to this.For example, it is also possible in 11 and second shaping mould of molding die of the first forming module 49 The mold release film feed mechanism of the mold release film of supply strip is set in the molding die 20 of block 50.
In resin molding apparatus 47, if manufacture method is defined to one kind, dress corresponding thereto can be set to Put structure.By being set to this kind of apparatus structure, so as to further suppress cost of equipment.
It can make substrate supply storage module 48 and the integration of resin material supplying module 51 and be set to material supplying products Store module.Material supplying products store module and at least one module in the first forming module 49 and the second forming module 50 (for example, first forming module 49) can be loaded and unloaded mutually, and can be replaced.Such case is equivalent to 49 quilt of the first forming module It is loaded and unloaded on substrate supply storage module and the situation of resin material supplying module both sides.
[embodiment 5]
With reference to figure 11, the manufacture device involved by embodiment 5 is illustrated.Manufacture device 65 shown in Figure 11 be The manufacture device after cutting module 66 is further added in resin molding apparatus 47 shown in embodiment 4.Except cutting module Structure and action outside 66 is identical with the resin molding apparatus 47 shown in embodiment 4, and and the description is omitted.
As shown in figure 11, in manufacture device 65, for example, the second forming module 50 and resin material supplying module 51 it Between be provided with cutting module 66.Cutting module 66 can mutually be loaded and unloaded and can replaced relative to other structural elements.
In module 66 is cut, for example, being provided with the cutting used in the process cut off to encapsulation metacoxal plate Platform 67.Cutting table 67 can be moved along the Y direction by moving mechanism 68, and can be along θ directions by rotating mechanism 69 Rotate.Encapsulation metacoxal plate is placed on cutting table 67 by baseplate conveying mechanism 55.
In module 66 is cut, for example, be provided with for the encapsulation metacoxal plate Jing Guo resin-encapsulated is cut off two A mandrel 70,71.In two mandrels 70,71, rotating sword 72,73 is respectively arranged with.Rotating sword 72,73 is with same thickness Rotating sword.By two mandrels 70,71, encapsulation metacoxal plate is cut off and is singulated along cutting line.
According to the present embodiment, it is further additional in manufacture device 65 that cutting module 66 is set.Hereby it is possible to using same One device cuts off the encapsulation metacoxal plate Jing Guo resin-encapsulated to carry out singualtion.Therefore, it is possible to omit base after encapsulation The process that plate passes to other topping machanism etc., so as to further cut down the manufacture cost of circuit block.
In the present embodiment, the situation identical to the thickness of rotating sword 72,73 possessed by two mandrels 70,71 carries out Explanation.Not limited to this, can be set to make the thickness of rotating sword 72,73 different.For example, can make the thickness of rotating sword 72 compared with Thickness, and make the thinner thickness of rotating sword 73.By flexibly using the thickness of rotating sword 72,73, so as to according to different purposes To use mandrel 70,71.
In this case, encapsulation metacoxal plate is cut using the mandrel 70 with the thicker rotating sword 72 of thickness It is disconnected.The thicker rotating sword 72 of thickness is the rotating sword for being cut off at cutting line to encapsulation metacoxal plate.On the other hand, make With the mandrel 71 of the rotating sword 73 with thinner thickness, such as can be formed in the insulating properties solidified resin Jing Guo resin-encapsulated The narrow groove of width.The rotating sword 73 of thinner thickness is the rotating sword for forming groove.By in through cutting and the groove that is formed Electric conductivity solidified resin is filled, so as to produce shielded circuit block.
Furthermore, it is possible to increase laser processing device in module 66 is cut.By the laser processing device, can also pass through Cross the groove that formation width is narrow in the insulating properties solidified resin of resin-encapsulated.If it is the case, it can then make two mandrels 70th, the thickness of rotating sword 72,73 is thicker possessed by 71, and two mandrels 70,71 are set to be used to cut off encapsulation metacoxal plate To carry out the mandrel of singualtion.
[embodiment 6]
With reference to figure 12, to being illustrated by the various circuit blocks manufactured by embodiments of the present invention.These circuits Component is that multiple electronic units (including semiconductor chip before resin-encapsulated) are electromagnetically shielded by the grounding wire by electric conductivity solidified resin The circuit block of modular structure.
As shown in (a) of Figure 12, circuit block 74 is that two electronic units 75 and an electronic unit 76 are (all partly to lead The state of body chip) circuit block that is electromagnetically shielded by the grounding wire by electric conductivity solidified resin.
Circuit block 74 includes substrate 77 and is installed on two electronic units 75 and an electronic unit 76 of substrate 77. Two electronic units 75 are connected to electrode of substrate 79 or grounding electrode 80 by bonding wire 78 respectively.Electronic unit 76 passes through convex block 81 are connected to electrode of substrate 79 or grounding electrode 80.
A part of position of grounding electrode 80, two electronic units 75 and an electronic unit 76 are consolidated by insulating properties Change resin 82 by carry out resin-encapsulated.The remaining position of grounding electrode 80 is by electric conductivity solidified resin 83 by carry out resin envelope Dress.Accordingly, grounding electrode 80 and electric conductivity solidified resin 83 are electrically connected.Therefore, by two electronic units 75 and an electronics The circuit block 74 that 76 modularization of component forms is electromagnetically shielded by the grounding wire by electric conductivity solidified resin 83.
As shown in (b) of Figure 12, circuit block 84 is that electronic unit 85, electronic unit 86 and electronic unit 87 are (all By the electronic unit of resin-encapsulated) circuit block that is electromagnetically shielded by the grounding wire by electric conductivity solidified resin.
Circuit block 84 includes substrate 88 and is installed on the electronic unit 85,86,87 of substrate 88.Electronic unit 85,86, 87 are connected to electrode of substrate 89 or grounding electrode 90 by convex block 81 respectively.
Set with electronic unit 85,86,87 by insulating properties solidified resin 91 at a part of position of grounding electrode 90 Fat encapsulates.The remaining position of grounding electrode 90 is by electric conductivity solidified resin 92 by carry out resin-encapsulated.Accordingly, grounding electrode 90 It is electrically connected with electric conductivity solidified resin 92.Therefore, the circuit block 84 that 85,86,87 modularization of electronic unit forms is passed through Electric conductivity solidified resin 92 is electromagnetically shielded by the grounding wire.
As shown in (c) of Figure 12, circuit block 93 is that electronic unit 75,76 (state of semiconductor chip) passes through electric conductivity Solidified resin is electromagnetically shielded by the grounding wire and circuit block that electronic unit 94 (state of semiconductor chip) is not electromagnetically shielded by the grounding wire.
Circuit block 93 includes substrate 95 and is installed on the electronic unit 75,76,94 of substrate 95.Electronic unit 75,94 Electrode of substrate 96 or grounding electrode 97 are connected to by bonding wire 78 respectively.Electronic unit 76 is passed through using flip-chip bond Convex block (convex electrode) 81 is connected to electrode of substrate 96 or grounding electrode 97.
A part of position, electronic unit 75,76,94 and the electrode of substrate 96 of grounding electrode 97 are cured by insulating properties to be set Fat 98 is by carry out resin-encapsulated.The remaining position of grounding electrode 97 is by electric conductivity solidified resin 99 by carry out resin-encapsulated. Formed with solidified resin mixing unit 100 between insulating properties solidified resin 98 and electric conductivity solidified resin 99.Accordingly, grounding electrode 97 It is electrically connected with electric conductivity solidified resin 99.Therefore, circuit block 93 passes through electric conductivity solidified resin as electronic unit 75,76 99 be electromagnetically shielded by the grounding wire and circuit block that electronic unit 94 is not electromagnetically shielded by the grounding wire.It so, it is possible to produce only to specific electronics The circuit block that component is electromagnetically shielded.
According to the present embodiment, using resin molding apparatus, and insulating properties solidified resin and electric conductivity solidified resin are passed through Multiple electronic units to be molded with resin.Hereby it is possible to the grounding electrode for surrounding multiple electronic units and electric conductivity are consolidated Change resin to be electrically connected.Therefore, it is possible to produce the mould being electromagnetically shielded by electric conductivity solidified resin to multiple electronic units The circuit block of block structure.Further, it is possible to reduce the manufacture cost of circuit block.
In various embodiments, using using the resin molding apparatus of compression forming methods to make encapsulation metacoxal plate, and it is right Encapsulation metacoxal plate carries out singualtion to manufacture circuit block.Not limited to this, can use and use transfer molding process or ejection formation The resin molding apparatus of method.In the case of using these devices, the effect identical with each embodiment can be also realized.Using In the case of these devices, in resin molding apparatus, preferably will be left in solidified resin in the circuit block as product with The solidified resin (useless resin) not stayed in circuit block separates (cast gate cutting (ゲ ー ト カ ッ ト), gate cutting (ゲ ー ト Block レーク))。
In various embodiments, show a case that for mold release film to be supplied to the die cavity being arranged in lower mould.It is not limited to This, in the case where mold release film not being supplied to die cavity, can also manufacture circuit block.
In various embodiments, show a case that die cavity being arranged in lower mould.Not limited to this, is set by die cavity In the case of in mold, same effect can be also realized.In addition, in the case where die cavity is arranged in mold, can Encapsulation prebasal plate is configured at lower mould, and the resin material under room temperature for liquid is supplied on encapsulation prebasal plate.Make In the case of electronic unit is installed on substrate with flip-chip bond, in addition under room temperature being the resin material of liquid, It can also use under solid-like resin, room temperature as the resin material of paste.
In various embodiments, to including one or more semiconductor chips (or electronic unit or by resin-encapsulated Electronic unit) the manufacture method of circuit block be illustrated.The object of resin forming can be IC chip, crystal tube core The chip of the active components such as piece, LED chip or the passive member such as the chip of active component and resistance, capacitor, inductor Chipset existing for the chip hybrid of part.In addition, in the object of resin forming, sensor, oscillator, excitation can also be included Device etc..
In various embodiments, a part of position with insulating properties solidified resin covering grounding electrode and semiconductor chip, And the remaining position of grounding electrode and electric conductivity solidified resin are electrically connected.Accordingly, by electric conductivity solidified resin to circuit portion Part is electromagnetically shielded.And then since the whole surface of circuit block is covered by electric conductivity solidified resin, in electromagnetic screen Cover outside effect, additionally it is possible to improve heat dissipation effect.
The structure that can also be electrically connected using grounding electrode and electric conductivity solidified resin.In this case, it is conductive Property solidified resin have heat sinking function without electro-magnetic screen function.
As described above, the manufacture method of the circuit block of the above embodiment, which is manufacture, possesses electronic circuit and with electricity The circuit block manufacture method of the circuit block of magnetic screen function, including：Prepare the process of encapsulation prebasal plate, base before the encapsulation Plate at least possesses the substrate with the first face, the electronic unit installed in the first face of substrate and around electronic unit The grounding electrode of setting；First molding procedure, using the first molding die, in the first face of substrate, that side realizes that insulating properties is consolidated Change the shaping of resin；And second molding procedure, then the first molding procedure, using the second molding die, the first of substrate The shaping of electric conductivity solidified resin is realized in that side of face, so as to make encapsulation metacoxal plate.In the first molding procedure, pass through insulation Property solidified resin covering grounding electrode a part of position and electronic unit, by making the remaining position of grounding electrode from insulating properties Expose in solidified resin, expose grounding electrode so as to be formed；In the second molding procedure, covered by electric conductivity solidified resin exhausted Edge solidified resin and expose grounding electrode, so that grounding electrode will be exposed and electric conductivity solidified resin is electrically connected.
According to the manufacture method, insulating properties solidified resin can be used to cover a part of position and the ministry of electronics industry of grounding electrode Part, and the remaining position of grounding electrode and electric conductivity solidified resin are electrically connected.Cured therefore, it is possible to produce by electric conductivity The circuit block that resin is electromagnetically shielded by the grounding wire.Further, it is possible to reduce the manufacture cost of circuit block.
Further, in the manufacture method of the circuit block of the above embodiment, the first molding die and the second shaping Mould is included in same manufacture device.
According to the manufacture method, same manufacture device is used, it becomes possible to realize that insulating properties solidified resin and electric conductivity cure The shaping of resin.Therefore, it is possible to reduce the manufacture cost of circuit block.
The manufacture method of the circuit block of the above embodiment is that manufacture possesses electronic circuit and with electromagnetic shielding work( The circuit block manufacture method of the circuit block of energy, including：Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least has Connecing for the substrate with the first face, the electronic unit installed in the first face of substrate and provided around electronic unit Ground electrode；First molding procedure, using the first molding die, in the first face of substrate, insulating properties solidified resin is realized in that side Shaping, so as to pass through the surplus of insulating properties solidified resin overlay electronic component, a part of position of grounding electrode and grounding electrode Remaining part position；Then the first molding procedure, is consolidated the insulating properties that the remaining position of grounding electrode covers to remove using removal mechanism Change resin, so that the process for exposing grounding electrode is exposed and formed at the remaining position of grounding electrode；And second molding procedure, Using the second molding die, the shaping of electric conductivity solidified resin is realized in that side of the first face of substrate, so that after making encapsulation Substrate.In the second molding procedure, insulating properties solidified resin is covered by electric conductivity solidified resin and exposes grounding electrode, so that Grounding electrode will be exposed and electric conductivity solidified resin is electrically connected.First molding die, removal mechanism and the second molding die bag It is contained in same manufacture device.
According to the manufacture method, expose by removal mechanism the remaining position of grounding electrode, by grounding electrode Remaining position and electric conductivity solidified resin be electrically connected.It is electromagnetically shielded by the grounding wire therefore, it is possible to produce by electric conductivity solidified resin Circuit block.
And then in the manufacture method of the circuit block of the above embodiment, the first molding procedure includes following process：
(1) process molded to the first molding die；
(2) from the outside of die cavity possessed by the first molding die after molding, divide successively via the first molding die The flow path and opening not having, the process that insulating properties stir-in resin is supplied to die cavity；
(3) cured by making to be fed into the insulating properties stir-in resin of die cavity, so as to fulfill insulating properties solidified resin into The process of type；
(4) process molded to the first molding die.
According to the manufacture method, the tree of insulating properties solidified resin can be realized by transfer molding process or jet forming method Fat is molded.
And then in the manufacture method of the circuit block of the above embodiment, the first molding procedure includes following process：
(1) will be that the insulative resin material of solid-like, paste or liquid is supplied to the first shaping after die sinking under room temperature The process of die cavity possessed by mould；
(2) by being molded to the first molding die, so that by least a portion position of grounding electrode in die cavity The process in the insulating properties stir-in resin generated by insulative resin material is immersed in electronic unit；
(3) by curing insulating properties stir-in resin in die cavity, so as to fulfill the molding work of insulating properties solidified resin Sequence；
(4) process molded to the first molding die.
According to the manufacture method, the resin forming of insulating properties solidified resin can be realized by compression forming methods.
The manufacture method of the circuit block of the above embodiment be using molding die come manufacture possess electronic circuit and The circuit block manufacture method of circuit block with electro-magnetic screen function, the molding die have the first mould and with the One mould the second mould arranged opposite, the manufacture method include：Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate At least possess the substrate with the first face, the electronic unit installed in the first face of substrate and set around electronic unit The grounding electrode put；Electroconductive resin material under room temperature for solid-like, paste or liquid is supplied to and is arranged on the first mould In die cavity process；In a manner of opposed with die cavity by the first face of substrate, encapsulation prebasal plate is configured to the work of molding die Sequence；Insulative resin material under room temperature for solid-like, paste or liquid is supplied to and has been fed with electroconductive resin material The process of die cavity；By being molded to molding die, so that in die cavity, by a part of position of grounding electrode and the ministry of electronics industry Part is immersed in the insulating properties stir-in resin generated by insulative resin material, and by the remaining position of grounding electrode be immersed in by Process in the electric conductivity stir-in resin of electroconductive resin material generation；In die cavity, by curing insulating properties stir-in resin, So as to realize the shaping of insulating properties solidified resin in that side of the first face of substrate, by curing electric conductivity stir-in resin, from And the shaping of electric conductivity solidified resin is realized in that side of the first face of substrate, the process for making encapsulation metacoxal plate accordingly；And The process molded to molding die.In the process for making encapsulation metacoxal plate, by the remaining position of grounding electrode and conduction Property solidified resin be electrically connected.
According to the manufacture method, by a resin forming, the one of insulating properties solidified resin covering grounding electrode can be used Partial portion and electronic unit, and the remaining position of grounding electrode and electric conductivity solidified resin are electrically connected.Therefore, it is possible to manufacture Go out the circuit block being electromagnetically shielded by the grounding wire by electric conductivity solidified resin.Further, it is possible to further reduce being manufactured into for circuit block This.
And then in the manufacture method of the circuit block of the above embodiment, substrate is more with being divided into by dummy line A region, in multiple regions, is respectively arranged with the electronic unit in the installation of the first face of substrate and the week in electronic unit The grounding electrode of setting is enclosed, and the manufacture method further comprises：Cut off by the way that metacoxal plate will be encapsulated along dummy line, from And make the process with the corresponding multiple circuit blocks of regional in multiple regions.
According to the manufacture method, by cutting off the encapsulation metacoxal plate by resin-encapsulated along dummy line, so as to manufacture Go out circuit block.Therefore, it is possible to further reduce the manufacture cost of circuit block.
And then in the manufacture method of the circuit block of the above embodiment, dummy line is by any one following line structures Into：
(1) the cross one another line segment extended on whole substrate；
(2) the cross one another curve extended on whole substrate；
(3) line segment or curve that extend on whole substrate and the broken line included in regional；
(4) line segment or curve that extend on whole substrate and the curve included in regional.
According to the manufacture method, can produce with variously-shaped circuit block.
The manufacture device of the circuit block of the above embodiment is set to such as lower structure, including：First forming module, has the A molding has；Second forming module, has the second molding die；Substrate supplying module, supply encapsulation prebasal plate, the encapsulation Prebasal plate at least possesses the substrate with the first face, the electronic unit installed in the first face of substrate and in electronic unit Provided around grounding electrode；And resin material supplying module, supply insulative resin material and electroconductive resin material. In first molding die, by making insulative resin material solidification, so as to fulfill the shaping of insulating properties solidified resin, pass through insulation Property solidified resin covering grounding electrode at least a portion position and electronic unit；In the second molding die, by making conduction Property resin material cure, so as to fulfill at least cover insulating properties solidified resin electric conductivity solidified resin shaping, make accordingly Encapsulate metacoxal plate；After packaging on substrate, at least a portion position of grounding electrode and electronic unit are by insulating properties solidified resin Covering, insulating properties solidified resin are covered by electric conductivity solidified resin；First forming module and the second forming module can be filled mutually Unload；First forming module and the second shaping mould at least one module in the block and substrate supplying module and resin material supplying module In at least one module can mutually load and unload；Electric conductivity solidified resin is connected to grounding electrode, has electro-magnetic screen function.
According to the structure, pass through a manufacture device, it becomes possible to realize insulating properties solidified resin and electric conductivity solidified resin Shaping.Electric conductivity solidified resin and grounding electrode can be electrically connected, to be electromagnetically shielded to electronic unit.Accordingly, it is capable to Enough suppress cost of equipment, reduce the manufacture cost of circuit block.
And then the manufacture device of the circuit block of the above embodiment is set to such as lower structure：First forming module and second Forming module uses any one method in compression forming methods, transfer molding process and jet forming method.
According to the structure, various forming methods can be used, to manufacture what is be electromagnetically shielded by the grounding wire by electric conductivity solidified resin Circuit block.Further, it is possible to reduce the manufacture cost of circuit block.
And then the manufacture device of the circuit block of the above embodiment is set to such as lower structure：First molding die has the One die cavity, the second molding die have the second die cavity, three-dimensionally see, the shape of the second die cavity includes the shape of the first die cavity.
According to the structure, the shaping of insulating properties solidified resin is realized in the first die cavity, covering is realized in the second die cavity The shaping of the electric conductivity solidified resin of insulating properties solidified resin.Therefore, it is possible to produce by electric conductivity solidified resin by electromagnetism The circuit block of shielding.
And then the manufacture device of the circuit block of the above embodiment is set to such as lower structure：It is further equipped with that there is cutting The cutting module of mechanism；In first forming module, the second forming module, substrate supplying module and resin material supplying module At least one module can be loaded and unloaded mutually with cutting module；Cutting mechanism carries out at least one operation in operations described below：
(1) by cutting insulating properties solidified resin, make among the grounding electrode of the first face of substrate setting not The operation that remaining position including a part of position is exposed from insulating properties solidified resin；
(2) operation for cutting off encapsulation metacoxal plate in the lump.
According to the structure, further increase the cutting module with cutting mechanism in the manufacturing apparatus.Using cutting mechanism, Insulating properties solidified resin can be cut so that grounding electrode exposes or will encapsulation metacoxal plate cut-out.
The manufacture device of the circuit block of the above embodiment is set to such as lower structure, including：First forming module, has the A molding has；Substrate supplying module, supply encapsulation prebasal plate, the encapsulation prebasal plate at least possess the base with the first face Plate, substrate the first face install electronic unit and in grounding electrode provided around electronic unit；And resinous wood Expect supplying module, supply insulative resin material and electroconductive resin material.Substrate supplying module and resin material supplying module In at least one module can mutually be loaded and unloaded with the first forming module；First molding die by realizing that insulating properties cures in the lump The shaping of the electric conductivity solidified resin of resin and covering insulating properties solidified resin, so as to make encapsulation metacoxal plate；Base after packaging On plate, at least a portion position of grounding electrode and electronic unit are covered by insulating properties solidified resin, insulating properties solidified resin quilt Electric conductivity solidified resin covers；Electric conductivity solidified resin is connected to grounding electrode, has electro-magnetic screen function.
According to the structure, using only a molding die, it becomes possible to realize that insulating properties solidified resin and electric conductivity are consolidated in the lump Change the shaping of resin.Electric conductivity solidified resin and grounding electrode can be electrically connected, to be electromagnetically shielded to electronic unit.Cause This, can further suppress cost of equipment, further reduce the manufacture cost of circuit block.
And then the manufacture device of the circuit block of the above embodiment is set to such as lower structure：It is further equipped with that there is cutting The cutting module of mechanism；At least one module in first forming module, substrate supplying module and resin material supplying module Can mutually it be loaded and unloaded with cutting module；Cutting mechanism is into being about to encapsulate the operation cut off in the lump of metacoxal plate.
According to the structure, further increase the cutting module with cutting mechanism in the manufacturing apparatus.Using cutting mechanism, Can be by encapsulation metacoxal plate cut-out.
The circuit block of the above embodiment is set to such as lower structure, including：Electronic unit, is installed on substrate；Grounding electrode, It is arranged at substrate；Insulating properties solidified resin, covers a part of position and the electronic unit of grounding electrode；Electric conductivity solidified resin, Remaining position and the insulating properties solidified resin of grounding electrode are covered, and is electrically connected to the remaining position of grounding electrode, there is electricity Magnetic screen function；And boundary portion, formed in insulating properties solidified resin and the border of electric conductivity solidified resin.
According to the structure, insulating properties solidified resin can be used to cover a part of position and the electronic unit of grounding electrode, and The remaining position of grounding electrode and electric conductivity solidified resin are electrically connected.Therefore, it is possible to produce by electric conductivity solidified resin The circuit block being electromagnetically shielded by the grounding wire.
And then the boundary portion of the circuit block of the above embodiment is in insulating properties solidified resin and electric conductivity solidified resin Border formed interface.
According to the structure, in the boundary portion Presence of an interface of insulating properties solidified resin and electric conductivity solidified resin.
And then the boundary portion of the circuit block of the above embodiment is in insulating properties solidified resin and electric conductivity solidified resin Border formed solidified resin mixing unit.
According to the structure, since solidified resin mixing unit is mediate, consolidate in insulating properties solidified resin with electric conductivity Powerful engaging force is obtained between change resin.Therefore, it is possible to further improve insulating properties solidified resin and electric conductivity solidified resin Between adaptation.
And then the circuit block of the above embodiment is further equipped with：Side with cutter trade.
According to the structure, by the way that the encapsulation metacoxal plate Jing Guo resin-encapsulated is cut off, so as to produce circuit block.
, without departing from the spirit and scope of the present invention, can basis the present invention is not limited to above-mentioned each embodiment Need, be combined arbitrarily and suitably, change or optionally use.

Claims (18)

1. a kind of manufacture method of circuit block, manufacture possesses electronic circuit and the circuit block with electro-magnetic screen function, The manufacture method of the circuit block includes：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the substrate The electronic unit of first face installation and in grounding electrode provided around the electronic unit；
First molding procedure, using the first molding die, realizes that insulating properties cures in described that side of first face of the substrate The shaping of resin；And
Second molding procedure, then first molding procedure, using the second molding die, in first face of the substrate The shaping of electric conductivity solidified resin is realized in that side, so that encapsulation metacoxal plate is made,
In first molding procedure, by the insulating properties solidified resin cover the grounding electrode a part of position and The electronic unit, the remaining position by making the grounding electrode is exposed from the insulating properties solidified resin, so as to be formed Expose grounding electrode,
In second molding procedure, the insulating properties solidified resin and the dew are covered by the electric conductivity solidified resin Go out grounding electrode, so as to expose grounding electrode and electric conductivity solidified resin electrical connection by described.
2. the manufacture method of circuit block according to claim 1, wherein,
It is the first one-tenth described using possessing in same manufacture device as first molding die and second molding die Pattern tool, the removal mechanism and second molding die.
3. a kind of manufacture method of circuit block, manufacture possesses electronic circuit and the circuit block with electro-magnetic screen function, The manufacture method of the circuit block includes：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the substrate The electronic unit of first face installation and in grounding electrode provided around the electronic unit；
First molding procedure, using the first molding die, realizes that insulating properties cures in described that side of first face of the substrate The shaping of resin, so as to cover a part of portion of the electronic unit, the grounding electrode by the insulating properties solidified resin Position and the remaining position of the grounding electrode；
Then first molding procedure, is removed the remaining position covering of the grounding electrode using removal mechanism The insulating properties solidified resin, so that the work for exposing grounding electrode with formation is exposed at the remaining position of the grounding electrode Sequence；And
Second molding procedure, using the second molding die, realizes that electric conductivity cures in described that side of first face of the substrate The shaping of resin, so that encapsulation metacoxal plate is made,
In second molding procedure, the insulating properties solidified resin and the dew are covered by the electric conductivity solidified resin Go out grounding electrode, so that expose grounding electrode and electric conductivity solidified resin electrical connection by described,
As first molding die, the removal mechanism and second molding die, using in same manufacture device First molding die, the removal mechanism and second molding die possessed.
4. the manufacture method of the circuit block according to claim 1 or 3, wherein,
First molding procedure includes following processes：
(1) process molded to first molding die；
(2) from the outside of die cavity possessed by first molding die after molding, successively via first molding die The flow path and opening having respectively, the process that insulating properties stir-in resin is supplied to the die cavity；
(3) by curing the insulating properties stir-in resin for being fed into the die cavity, cure so as to fulfill the insulating properties The molding process of resin；
(4) process molded to first molding die.
5. the manufacture method of the circuit block according to claim 1 or 3, wherein,
First molding procedure includes following processes：
(1) will be that the insulative resin material of solid-like, paste or liquid is supplied to first shaping after die sinking under room temperature The process of die cavity possessed by mould；
(2) by being molded to first molding die, so that by least institute of the grounding electrode in the die cavity State a part of position and the electronic unit is immersed in the insulating properties stir-in resin by insulative resin material generation Process；
(3) by curing the insulating properties stir-in resin in the die cavity, so as to fulfill the insulating properties solidified resin Molding process；
(4) process molded to first molding die.
6. a kind of manufacture method of circuit block, using with the first mould and arranged opposite with first mould second The molding die of mould, to manufacture the circuit block for possessing electronic circuit and there is electro-magnetic screen function, the circuit block Manufacture method include：
Prepare the process of encapsulation prebasal plate, the encapsulation prebasal plate at least possesses the substrate with the first face, in the substrate The electronic unit of first face installation and in grounding electrode provided around the electronic unit；
To be that the electroconductive resin material of solid-like, paste or liquid is supplied to the mould being arranged in first mould under room temperature The process of chamber；
In a manner of opposed with the die cavity by first face of the substrate, the encapsulation prebasal plate is configured at the shaping The process of mould；
Insulative resin material under room temperature for solid-like, paste or liquid is supplied to and has been fed with the electroconductive resin material The process of the die cavity of material；
By being molded to the molding die so that in the die cavity, by a part of position of the grounding electrode and The electronic unit is immersed in the insulating properties stir-in resin by insulative resin material generation, and by the grounding electrode Remaining position be immersed in by the electroconductive resin material generation electric conductivity stir-in resin in process；
In the die cavity, by making the insulating properties stir-in resin cure so as in described that side of first face of the substrate Realize the shaping of the insulating properties solidified resin, make the electric conductivity stir-in resin cure and in first face of the substrate The shaping of the electric conductivity solidified resin is realized in that side, the process for making encapsulation metacoxal plate accordingly；And to the shaping mould Have the process molded,
In the process for making the encapsulation metacoxal plate, the remaining position of the grounding electrode and the electric conductivity are cured Resin is electrically connected.
7. the manufacture method of the circuit block described in any one in claim 1,3 or 6, wherein,
The substrate has the multiple regions being divided into by dummy line,
In the multiple region, be respectively arranged with the substrate first face installation the electronic unit and The grounding electrode provided around the electronic unit,
Also, the manufacture method of the circuit block further comprises：By along the dummy line by the encapsulation metacoxal plate Cut-out, so as to make the process with the corresponding multiple circuit blocks of regional in the multiple region.
8. the manufacture method of circuit block according to claim 7, wherein,
The dummy line is made of any one following lines：
(1) the cross one another line segment extended on the whole substrate；
(2) the cross one another curve extended on the whole substrate；
(3) line segment or curve that extend on the whole substrate and the broken line included in each region；
(4) line segment or curve that extend on the whole substrate and the curve included in each region.
9. a kind of manufacture device of circuit block, including：
First forming module, has the first molding die；
Second forming module, has the second molding die；
Substrate supplying module, supply encapsulation prebasal plate, the encapsulation prebasal plate at least possess the substrate with the first face, described Substrate first face installation electronic unit and in grounding electrode provided around the electronic unit；And
Resin material supplying module, supplies insulative resin material and electroconductive resin material,
In first molding die, by making the insulative resin material solidification, so as to fulfill insulating properties solidified resin Shaping, at least a portion position of the grounding electrode and the electronic unit are covered by the insulating properties solidified resin,
In second molding die, make the electroconductive resin material solidification and realize that at least covering the insulating properties cures The shaping of the electric conductivity solidified resin of resin, makes encapsulation metacoxal plate accordingly,
On the encapsulation metacoxal plate, at least described a part of position of the grounding electrode and the electronic unit are by described exhausted Edge solidified resin covers, and the insulating properties solidified resin is covered by the electric conductivity solidified resin,
First forming module and second forming module can be loaded and unloaded mutually,
First forming module and second shaping mould at least one module in the block and the substrate supplying module and institute At least one module stated in resin material supplying module can be loaded and unloaded mutually,
The electric conductivity solidified resin is connected to the grounding electrode, has electro-magnetic screen function.
10. the manufacture device of circuit block according to claim 9, wherein,
First forming module and second forming module use compression forming methods, transfer molding process and jet forming method In any one method.
11. the manufacture device of circuit block according to claim 9, wherein,
First molding die has the first die cavity,
Second molding die has the second die cavity,
Three-dimensionally see, the shape of second die cavity includes the shape of first die cavity.
12. the manufacture device of circuit block according to claim 9, wherein,
It is further equipped with：Module is cut, there is cutting mechanism,
First forming module, second forming module, the substrate supplying module and resin material supply mould At least one module in the block can be loaded and unloaded mutually with the cutting module,
The cutting mechanism carries out at least one operation in operations described below：
(1) by cutting the insulating properties solidified resin, make to connect described in the setting of first face of the substrate Do not include the operation that the remaining position at a part of position is exposed from the insulating properties solidified resin among ground electrode；
(2) operation for cutting off the encapsulation metacoxal plate in the lump.
13. a kind of manufacture device of circuit block, including：
First forming module, has the first molding die；
Substrate supplying module, supply encapsulation prebasal plate, the encapsulation prebasal plate at least possess the substrate with the first face, described Substrate first face installation electronic unit and in grounding electrode provided around the electronic unit；And
Resin material supplying module, supplies insulative resin material and electroconductive resin material,
At least one module and first forming module in the substrate supplying module and the resin material supplying module Can mutually it load and unload,
First molding die by realizing insulating properties solidified resin and covering the conduction of the insulating properties solidified resin in the lump The shaping of property solidified resin, so that encapsulation metacoxal plate is made,
On the encapsulation metacoxal plate, at least a portion position of the grounding electrode and the electronic unit are by the insulating properties Solidified resin covers, and the insulating properties solidified resin is covered by the electric conductivity solidified resin,
The electric conductivity solidified resin is connected to the grounding electrode, has electro-magnetic screen function.
14. the manufacture device of circuit block according to claim 13, wherein,
It is further equipped with：Module is cut, there is cutting mechanism,
At least one module in first forming module, the substrate supplying module and the resin material supplying module Can mutually it be loaded and unloaded with the cutting module,
The cutting mechanism is into being about to the operation cut off in the lump of encapsulation metacoxal plate.
15. a kind of circuit block, including：
Electronic unit, is installed on substrate；
Grounding electrode, is arranged at the substrate；
Insulating properties solidified resin, covers a part of position of the grounding electrode and the electronic unit；
Electric conductivity solidified resin, covers the remaining position of the grounding electrode and the insulating properties solidified resin, and is electrically connected To the remaining position of the grounding electrode, there is electro-magnetic screen function；And
Boundary portion, forms on the border of the insulating properties solidified resin and the electric conductivity solidified resin.
16. circuit block according to claim 15, wherein,
The boundary portion is the interface formed on the border of the insulating properties solidified resin and the electric conductivity solidified resin.
17. circuit block according to claim 15, wherein,
The boundary portion is the solidified resin formed on the border of the insulating properties solidified resin and the electric conductivity solidified resin Mixing unit.
18. circuit block according to claim 15, wherein,
The circuit block possesses：Side with cutter trade.
CN201710804097.5A 2016-10-31 2017-09-08 Circuit component, method for manufacturing circuit component, and apparatus for manufacturing circuit component Active CN108010902B (en)

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JP6654994B2 (en) 2020-02-26
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