NL1024248C2 - Method and device for encapsulating electronic components with the aid of a flexible pressure element. - Google Patents

Method and device for encapsulating electronic components with the aid of a flexible pressure element. Download PDF

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Publication number
NL1024248C2
NL1024248C2 NL1024248A NL1024248A NL1024248C2 NL 1024248 C2 NL1024248 C2 NL 1024248C2 NL 1024248 A NL1024248 A NL 1024248A NL 1024248 A NL1024248 A NL 1024248A NL 1024248 C2 NL1024248 C2 NL 1024248C2
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NL
Netherlands
Prior art keywords
carrier
encapsulating material
electronic component
electronic components
mold
Prior art date
Application number
NL1024248A
Other languages
Dutch (nl)
Inventor
Franciscus Bernardus Ant Vries
Hendrikus Johannes Bern Peters
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1024248A priority Critical patent/NL1024248C2/en
Priority to KR1020067004824A priority patent/KR20060119943A/en
Priority to PCT/NL2004/000601 priority patent/WO2005043612A1/en
Priority to CN2004800298138A priority patent/CN1868048B/en
Priority to JP2006526035A priority patent/JP2007505491A/en
Priority to TW093126868A priority patent/TWI360187B/en
Priority to MYPI20043635A priority patent/MY154814A/en
Application granted granted Critical
Publication of NL1024248C2 publication Critical patent/NL1024248C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

(Τθ) Octrooicentrum (© 1024248(Τθ) Patent Center (© 1024248

Nederland © C OCTROOI20 (21) Aanvrage om octrooi: 1024248 (5l) Int.CI.7 'r H01L21/56 © Ingediend: 09.09.2003 @ Ingeschreven: @ Octrooihouders): 10.03.2005 FICO B.V. te Duiven.The Netherlands © C. Patent 20 (21) Application for a patent: 1024248 (5l) Int.CI.7: H01L21 / 56 in Duiven.

© Dagtekening: © Uitvinder(s): 10.03.2005 Franciscus Bemardus Antonius de Vries te© Day signature: © Inventor (s): 10.03.2005 Franciscus Bemardus Antonius de Vries in

Eibergen © Uitgegeven: Hendrikus Johannes Bemardus Peters te 02.05.2005 I.E. 2005/05 Didam © Gemachtigde:Eibergen © Published: Hendrikus Johannes Bemardus Peters in 02.05.2005 I.E. 2005/05 Didam © Authorized representative:

Ir. H.Th. van den Heuvel c.s. te 5200 BN ’s-Hertogenbosch.Ir. H.Th. van den Heuvel et al. at 5200 BN 's-Hertogenbosch.

© Werkwijze en inrichting voor het met behulp van een flexibel drukelement omhullen van elektronische componenten.© Method and device for encapsulating electronic components with the aid of a flexible pressure element.

© De uitvinding heeft betrekking op een werkwijze voor het gedeeltelijk met omhulmateriaal omhullen van een samenstet van een drager met een daarmee verbonden elektronische component omvattende de bewerkings-stappen: A) het tussen een maldeel en een contra-maldeel opsluiten van ten minste een deel van de drager en de daarop bevestigde elektronische component, B) het in de vormholte brengen van een vloeibaar omhulmateriaal, en C) het na ten minste gedeeltelijke uitharding van het omhulmateriaal uit de maldelen nemen van de drager met omhulde elektronische component. De uitvinding heeft tevens betrekking op een inrichting voor toepassing van een dergelijke werkwijze.The invention relates to a method for partially enclosing a composite of a carrier with an electronic component connected thereto with encapsulating material comprising the processing steps: A) confining at least a part of a mold part and a counter mold part the carrier and the electronic component mounted thereon, B) introducing a liquid encapsulating material into the mold cavity, and C) taking the encapsulated electronic component carrier from the mold parts after at least partial curing of the encapsulating material. The invention also relates to a device for applying such a method.

co $ s- T- De inhoud van dit octrooi komt overeen met de oorspronkelijk ingediende beschrijving met conclusie(s) en O eventuele tekeningen.co $ s- T- The content of this patent corresponds to the originally filed description with claim (s) and any drawings, if any.

_l Octrooicentrum Nederland is het Bureau voor de Industriële Eigendom, een agentschap van het ministerie van Z Economische Zaken_l The Netherlands Patent Office is the Office for Industrial Property, an agency of the Ministry of Economic Affairs

Claims (1)

10 Het middels omhulmateriaal omhullen van op een drager bevestigde elektronische componenten betreft een algemeen toegepaste techniek. Daarbij wordt gebruikelijk de drager met nog niet omhulde elektronische componenten tussen twee maldelen ingeklemd op zodanige wijze dat er vormholten rond de te omhullen elektronische componenten (met name, maar niet exclusief, halfgeleider componenten) worden 15 gevormd. Vervolgens wordt er op gebruikelijke wijze middels een plunjer-systeem verwarmd (vloeibaar) omhulmateriaal door toevoerkanalen naar de vormholten getransporteerd zodanig dat de vormholten worden gevuld met het omhulmateriaal. Na het ten minste gedeeltelijk uitharden van het omhulmateriaal worden de maldelen uiteen bewogen zodanig dat de drager voorzien van de nu met omhulmateriaal afgedekte 20 elektronische componenten losgenomen kan worden van de maldelen. Een dergelijk proces wordt ook wel aangeduid als “transfer molding”. Er bestaat ook een behoefte om middels “transfer molding” op een drager geplaatste elektronische componenten slechts gedeeltelijk te omhullen. Dit wil zeggen zodanig in te bedden in omhulmateriaal dat nog een deel van de elektronische component vrij blijft. Hiermee is het bijvoorbeeld 25 mogelijk om elektronische componenten slechts deels te omhullen waarbij het vrijblijvende deel van de elektronische component een sensor vormt (bijvoorbeeld een sensor gevoelig voor licht, druk, temperatuur en/of chemische stoffen), een warmtewisselaar vormt of bruikbaar is voor de in- of uitvoer van optische gegevens. Het is echter problematisch dergelijke deels vrij te laten elektronische componenten op 30 beheersbare wijze te omhullen met behulp van de bestaande technieken, dat wil zeggen zodanig te omhullen dat slechts het vrij te laten deel van de elektronische component vrij blijft zonda* daarbij de elektronische component te beschadigen. Tevens bestaat er behoefte middels “transfer molding” elektronische componenten te omhullen waarbij een specifiek deel (of specifieke delen) van de drager worden vrijgelaten door het 1024248 I 2 I omhulmateriaal. Een voorbeeld hiervan is het omhullen van elektronische componenten I die worden omhuld tot zogeheten “leadless packages”. Daarbij zijn de elektrische I verbindingen geïntegreerd in de drager waardoor deze dragerdelen vrij dienen te blijven I van omhulmateriaal. Tot op heden wordt hiertoe ondermeer gebruik gemaakt van tape I I S die op de vrij te blijven delen van de drager wordt gekleefd. Het gebruik van dergelijke I tape is arbeidsintensief, kostbaar en leid niet altijd tot het gewenste resultaat. I Doel van de onderhavige uitvinding is het op eenvoudige wijze verschaffen van een I werkwijze en inrichting voor het deels van omhulmateriaal vrijlaten van een samenstel I 10 van een drager met een daarmee verbonden elektronische component. Hiertoe verschaft de uitvinding een werkwijze van het in aanhef genoemde type met het I kenmerk dat voor toevoer van het vloeibaar omhulmateriaal aan de vormholte volgens I bewerkingsstap B) een flexibel drukverdelend lichaam tegen het samenstel van de I IS drager met daarop bevestigde elektronisch component wordt gedrongen. Met een I drukverdelend lichaam wordt bedoeld een lichaam vervaardigd uit een vervormbaar medium, bijvoorbeeld ook wel aangeduid als een “gel” en in de handel ondermeer verkrijgbaar onder de handelsnaam “Gel-Pak®”. Een dergelijk materiaal, bijvoorbeeld I vervaardigd als een laag gel (of “gel film”) heeft als zeer belangrijk voordeel dat 20 hiermee de belasting die lokaal op de elektronische component en/of op de drager wordt uitgeoefend beperkt kan blijven. Meer in het bijzonder kan deze belasting beperkt I blijven voor aanvang van de toevoer van het omhulmateriaal naar de vormholte. Het I tussen een maldeel en een contra-maldeel opsluiten van ten minste een deel van de drager en de daarop bevestigde elektronische component is mogelijk door het I 25 overeenkomstig bewerkingsstap A) op een maldeel plaatsen van een van de I elektronische component afgekeerde eerste zijde van de drager en het tegen een tweede, I de elektronische component dragende, zijde van de drager dringen van het contra- maldeel. Daarbij kan dan gelijktijdig met het verplaatsen van de maldelen het flexibel drukverdelend lichaam tegen de van de drager afgekeerde zijde van de elektronische 30 component worden gedrongen. Een belangrijk voordeel van het gebruik van één of I meerdere drukverdelende lichamen (ten minste één drukverdelend lichaam) is dat I afwijkingen in dimensies van de te omhullen elektronische componenten en/of de I drager waarop zij bevestigd zijn kunnen (en zullen) worden gecompenseerd door het I I drukverdelend lichaam. Aldus kan een goede aansluiting (met een gelijkmatige I 1024248Encapsulating electronic components mounted on a carrier by means of encapsulating material is a generally used technique. The carrier with not yet encapsulated electronic components is usually clamped between two mold parts in such a way that mold cavities are formed around the electronic components to be encapsulated (in particular, but not exclusively, semiconductor components). Subsequently, heated (liquid) encapsulating material is transported through feed channels to the mold cavities in the usual manner by means of a plunger system such that the mold cavities are filled with the encapsulating material. After the encapsulating material has at least partially hardened, the mold parts are moved apart such that the carrier provided with the electronic components which are now covered with encapsulating material can be detached from the mold parts. Such a process is also referred to as "transfer molding". There is also a need to only partially enclose electronic components placed on a carrier by means of "transfer molding". This means embedding in encapsulating material in such a way that a part of the electronic component remains free. This makes it possible, for example, to enclose electronic components only partially, the non-binding part of the electronic component forming a sensor (for example a sensor sensitive to light, pressure, temperature and / or chemical substances), forming a heat exchanger or being usable for the import or export of optical data. However, it is problematic to encapsulate such electronic components in a controllable manner using the existing techniques, that is to say encapsulate such that only the part of the electronic component to be released remains free without the electronic component. to damage. There is also a need for "transfer molding" to encapsulate electronic components in which a specific part (or specific parts) of the carrier is released by the encapsulating material 1024248 I 2 I. An example of this is the encapsulation of electronic components I which are encased in so-called "leadless packages". The electrical connections are thereby integrated in the carrier, so that these carrier parts must remain free of encapsulating material. To date, tape I IS has been used for this purpose which is adhered to the parts of the carrier that remain free. The use of such I tape is labor intensive, expensive and does not always lead to the desired result. The object of the present invention is to provide in a simple manner a method and device for releasing, partly from encapsulating material, an assembly of a carrier with an electronic component connected thereto. To this end, the invention provides a method of the type mentioned in the preamble, characterized in that for supplying the liquid encapsulating material to the mold cavity according to processing step B), a flexible pressure-distributing body is urged against the assembly of the I IS carrier with an electronic component mounted thereon . By a pressure-distributing body is meant a body made of a deformable medium, for example also referred to as a "gel" and commercially available inter alia under the trade name "Gel-Pak®". Such a material, for example I manufactured as a layer of gel (or "gel film"), has the very important advantage that with it the load exerted locally on the electronic component and / or on the carrier can be limited. More in particular, this load can remain limited before the start of the supply of the encapsulating material to the mold cavity. Locking at least a part of the carrier and the electronic component mounted thereon between a mold part and a counter-mold part is possible by placing the first side of the first component of the electronic component, which is corresponding to processing step A) on a mold part. the carrier and urging the counter-part part against a second side of the carrier carrying the electronic component. Thereby, simultaneously with the displacement of the mold parts, the flexible pressure-distributing body can be urged against the side of the electronic component remote from the carrier. An important advantage of using one or more pressure distributing bodies (at least one pressure distributing body) is that deviations in dimensions of the electronic components to be encapsulated and / or the carrier to which they are mounted can (and will) be compensated by the II pressure-distributing body. A good connection (with a uniform I 1024248) can thus be achieved
NL1024248A 2003-09-09 2003-09-09 Method and device for encapsulating electronic components with the aid of a flexible pressure element. NL1024248C2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL1024248A NL1024248C2 (en) 2003-09-09 2003-09-09 Method and device for encapsulating electronic components with the aid of a flexible pressure element.
KR1020067004824A KR20060119943A (en) 2003-09-09 2004-08-30 Method and device for encapsulating electronic components using a flexible pressure element
PCT/NL2004/000601 WO2005043612A1 (en) 2003-09-09 2004-08-30 Method and device for encapsulating electronic components using a flexible pressure element
CN2004800298138A CN1868048B (en) 2003-09-09 2004-08-30 Method and device for encapsulating electronic components using a flexible pressure element
JP2006526035A JP2007505491A (en) 2003-09-09 2004-08-30 Method and apparatus for encapsulating electronic components using flexible pressure elements
TW093126868A TWI360187B (en) 2003-09-09 2004-09-06 Method and device for encapsulating electronic com
MYPI20043635A MY154814A (en) 2003-09-09 2004-09-08 Method and device for encapsulating electronic components using a flexible pressure element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1024248A NL1024248C2 (en) 2003-09-09 2003-09-09 Method and device for encapsulating electronic components with the aid of a flexible pressure element.
NL1024248 2003-09-09

Publications (1)

Publication Number Publication Date
NL1024248C2 true NL1024248C2 (en) 2005-03-10

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Application Number Title Priority Date Filing Date
NL1024248A NL1024248C2 (en) 2003-09-09 2003-09-09 Method and device for encapsulating electronic components with the aid of a flexible pressure element.

Country Status (7)

Country Link
JP (1) JP2007505491A (en)
KR (1) KR20060119943A (en)
CN (1) CN1868048B (en)
MY (1) MY154814A (en)
NL (1) NL1024248C2 (en)
TW (1) TWI360187B (en)
WO (1) WO2005043612A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6422447B2 (en) * 2014-01-14 2018-11-14 アピックヤマダ株式会社 Resin mold and resin molding method
NL2015091B1 (en) * 2015-07-06 2017-01-30 Besi Netherlands Bv Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
DE102017131110A1 (en) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh METHOD FOR EMBEDDING OPTOELECTRONIC COMPONENTS INTO A LAYER

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
EP0753888A2 (en) * 1995-07-11 1997-01-15 " 3P" Licensing B.V. Method for encapsulating an electronic component and article obtained thereby
JPH1075040A (en) * 1996-08-30 1998-03-17 Toshiba Chem Corp Method for manufacturing resin-coated circuit board
US5958466A (en) * 1997-06-04 1999-09-28 Ipac, Inc. Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
WO2003028086A1 (en) * 2001-09-26 2003-04-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip and/or other article

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
JP2002009096A (en) * 2000-06-20 2002-01-11 Apic Yamada Corp Method and apparatus for resin sealing
KR100400496B1 (en) * 2001-12-13 2003-10-08 서화일 Mold for used in multi flip-chip underfill encapsulation process
US6844606B2 (en) * 2002-02-04 2005-01-18 Delphi Technologies, Inc. Surface-mount package for an optical sensing device and method of manufacture

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0726598A1 (en) * 1995-02-09 1996-08-14 Fico B.V. Moulding apparatus with compensation element
EP0753888A2 (en) * 1995-07-11 1997-01-15 " 3P" Licensing B.V. Method for encapsulating an electronic component and article obtained thereby
JPH1075040A (en) * 1996-08-30 1998-03-17 Toshiba Chem Corp Method for manufacturing resin-coated circuit board
US5958466A (en) * 1997-06-04 1999-09-28 Ipac, Inc. Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
WO2003028086A1 (en) * 2001-09-26 2003-04-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip and/or other article

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30) *

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