MY154814A - Method and device for encapsulating electronic components using a flexible pressure element - Google Patents

Method and device for encapsulating electronic components using a flexible pressure element

Info

Publication number
MY154814A
MY154814A MYPI20043635A MYPI20043635A MY154814A MY 154814 A MY154814 A MY 154814A MY PI20043635 A MYPI20043635 A MY PI20043635A MY PI20043635 A MYPI20043635 A MY PI20043635A MY 154814 A MY154814 A MY 154814A
Authority
MY
Malaysia
Prior art keywords
electronic components
pressure element
flexible pressure
encapsulating electronic
carrier
Prior art date
Application number
MYPI20043635A
Inventor
De Vries Franciscus Bernardus Antonius
Peters Hendrikus Johannes Bernardus
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY154814A publication Critical patent/MY154814A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

THE INVENTION RELATES TO A METHOD FOR PARTIALLY ENCAPSULATING WITH ENCAPSULANT (9) AN ASSEMBLY OF A CARRIER (3) WITH AN ELECTRONIC COMPONENT (1) CONNECTED THERETO, COMPRISING THE PROCESSING STEP OF: A) ENCLOSING AT LEAST A PART OF THE CARRIER (3) AND THE ELECTRONIC COMPONENT (1) MOUNTED THEREON BETWEEN A MOULD PART (4) AND A COUNTER-MOULD PART (5), B) INTRODUCING A LIQUID ENCAPSULANT (9) INTO THE MOULD CAVITY (6), AND C) REMOVING THE CARRIER (3) WITH ENCAPSULATED ELECTRONIC COMPONENT (1) FROM THE MOULD PARTS (4) AFTER AT LEAST PARTIAL CURING OF THE ENCAPSULANT (9). THE INVENTION ALSO RELATES TO A DEVICE FOR APPLYING SUCH A METHOD.
MYPI20043635A 2003-09-09 2004-09-08 Method and device for encapsulating electronic components using a flexible pressure element MY154814A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1024248A NL1024248C2 (en) 2003-09-09 2003-09-09 Method and device for encapsulating electronic components with the aid of a flexible pressure element.

Publications (1)

Publication Number Publication Date
MY154814A true MY154814A (en) 2015-07-31

Family

ID=34464875

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20043635A MY154814A (en) 2003-09-09 2004-09-08 Method and device for encapsulating electronic components using a flexible pressure element

Country Status (7)

Country Link
JP (1) JP2007505491A (en)
KR (1) KR20060119943A (en)
CN (1) CN1868048B (en)
MY (1) MY154814A (en)
NL (1) NL1024248C2 (en)
TW (1) TWI360187B (en)
WO (1) WO2005043612A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102335853B1 (en) * 2014-01-14 2021-12-07 아피쿠 야마다 가부시키가이샤 Resin mold tooling and resin-molding method
NL2015091B1 (en) * 2015-07-06 2017-01-30 Besi Netherlands Bv Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
DE102017131110A1 (en) * 2017-12-22 2019-06-27 Osram Opto Semiconductors Gmbh METHOD FOR EMBEDDING OPTOELECTRONIC COMPONENTS INTO A LAYER

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9500238A (en) * 1995-02-09 1996-09-02 Fico Bv Casing device with compensation element.
NL1000777C2 (en) * 1995-07-11 1997-01-14 3P Licensing Bv Method of encapsulating an electronic component, electronic component suitable for use in performing this method and encapsulated component obtained using the method.
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
JPH1075040A (en) * 1996-08-30 1998-03-17 Toshiba Chem Corp Method for manufacturing resin-coated circuit board
US5766535A (en) * 1997-06-04 1998-06-16 Integrated Packaging Assembly Corporation Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
US6081997A (en) * 1997-08-14 2000-07-04 Lsi Logic Corporation System and method for packaging an integrated circuit using encapsulant injection
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
JP2002009096A (en) * 2000-06-20 2002-01-11 Apic Yamada Corp Method and apparatus for resin sealing
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
NL1019042C2 (en) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Method for encapsulating a chip and / or other object.
KR100400496B1 (en) * 2001-12-13 2003-10-08 서화일 Mold for used in multi flip-chip underfill encapsulation process
US6844606B2 (en) * 2002-02-04 2005-01-18 Delphi Technologies, Inc. Surface-mount package for an optical sensing device and method of manufacture

Also Published As

Publication number Publication date
KR20060119943A (en) 2006-11-24
TW200514175A (en) 2005-04-16
JP2007505491A (en) 2007-03-08
NL1024248C2 (en) 2005-03-10
WO2005043612A1 (en) 2005-05-12
CN1868048B (en) 2011-06-01
CN1868048A (en) 2006-11-22
TWI360187B (en) 2012-03-11

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