TWI618202B - Resin packaging device and resin packaging method - Google Patents

Resin packaging device and resin packaging method Download PDF

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Publication number
TWI618202B
TWI618202B TW105125929A TW105125929A TWI618202B TW I618202 B TWI618202 B TW I618202B TW 105125929 A TW105125929 A TW 105125929A TW 105125929 A TW105125929 A TW 105125929A TW I618202 B TWI618202 B TW I618202B
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resin
mold
substrate
cavity
molding
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TW105125929A
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Chinese (zh)
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TW201717336A (en
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Shinji Takase
Hideki Tokuyama
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

本發明提供一種可兼顧基板的彎曲抑制和基板的兩個表面成型的樹脂封裝裝置以及樹脂封裝方法。樹脂封裝裝置為在基板的兩個表面進行樹脂封裝的樹脂封裝裝置，包含：第一成型模組，包含上模以及下模中的一個；第二成型模組，包含上模以及下模中的另一個和中間模；前述中間模在前述第二成型模組中，配置在前述上模的下方或前述下模的上方，前述中間模包含用於將前述基板的前述另一個表面側進行樹脂封裝的型腔，通過前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接，形成可將傳遞成型用的樹脂向前述上型腔內注入的樹脂流路。 The present invention provides a resin package device and a resin package method which can achieve both bending suppression of a substrate and molding of both surfaces of a substrate. The resin encapsulating device is a resin encapsulating device for performing resin encapsulation on both surfaces of the substrate, comprising: a first molding module including one of an upper mold and a lower mold; and a second molding module including the upper mold and the lower mold And the intermediate mold; the intermediate mold is disposed under the upper mold or above the lower mold in the second molding module, and the intermediate mold includes resin encapsulating the other surface side of the substrate The cavity is formed by a surface of the intermediate mold that abuts against the lower surface of the upper mold or the upper surface of the lower mold to form a resin flow path into which the resin for transfer molding is injected into the upper cavity.

Description

樹脂封裝裝置以及樹脂封裝方法 Resin packaging device and resin packaging method

本發明關於一種樹脂封裝裝置以及樹脂封裝方法。 The present invention relates to a resin encapsulating device and a resin encapsulating method.

在球柵陣列(Ball Grid Array，BGA)封裝等電子部件的製造製程的樹脂封裝步驟中，一般僅在基板的一個表面進行樹脂封裝。但是，在對應動態隨機存取記憶體(Dynamic Random Access Memory，DRAM)的板上晶片(Chip On Board，COB)封裝、視窗球柵陣列(WindowBGA，WBGA，商品名)封裝的製造製程的樹脂封裝步驟中，要求除了在基板的一個表面之外還在另一個表面的部分區域進行樹脂封裝(例如，專利文獻1)。 In the resin encapsulation step of the manufacturing process of an electronic component such as a Ball Grid Array (BGA) package, resin encapsulation is generally performed only on one surface of the substrate. However, the resin package of the manufacturing process of the chip on board (COB) package and the window ball grid array (WindowBGA, WBGA, trade name) package corresponding to the dynamic random access memory (DRAM) In the step, it is required to perform resin encapsulation in a partial region of the other surface in addition to one surface of the substrate (for example, Patent Document 1).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

專利文獻1：特開2001-53094號公報。 Patent Document 1: JP-A-2001-53094.

為了在前述基板的兩個表面進行樹脂封裝，已知有在前述基板上開孔(從基板的一個表面向另一個表面流入樹脂的孔，以下稱之為“開口”)，並以傳遞成型在前述基板的一個表面進行樹脂封裝，同時從該開口向另一個表面側回轉樹脂，在前述另一個表面進行樹脂封裝的樹脂封裝方 法。 In order to perform resin encapsulation on both surfaces of the aforementioned substrate, it is known to open a hole in the substrate (a hole in which a resin flows from one surface of the substrate to the other surface, hereinafter referred to as an "opening"), and transfer molding One surface of the substrate is resin-sealed while the resin is rotated from the opening to the other surface side, and the resin encapsulation side of the other surface is resin-sealed. law.

另一方面，最近隨著可攜式設備等的高密度化，要求在基板的一個表面以及另一個表面(兩個表面)的幾乎整個面上安裝有晶片的封裝。在前述封裝的製造製程中，需要在前述基板的兩個表面的各面的幾乎整個面進行樹脂封裝。 On the other hand, recently, with the increase in density of portable devices and the like, it is required to mount a package of a wafer on almost one surface of one surface and the other surface (two surfaces) of the substrate. In the manufacturing process of the above package, it is necessary to perform resin encapsulation on almost the entire surface of each of the two surfaces of the substrate.

但是，在前述封裝的製造中，在使用前述樹脂封裝方法同時將前述基板的兩個表面進行樹脂封裝時，會出現一方(上模或者下模)的型腔(上模腔或者下模腔)先被樹脂填充的情況。例如下模的型腔(下型腔)先被樹脂填充的情況下，會出現基板凸狀彎曲(變形)的問題。這是因為，如果通過傳遞成型在兩個表面同時進行樹脂封裝，由於重力、流動阻力等，會出現一方的型腔先被樹脂填充的情況。此時，樹脂從基板的一個表面側向另一個表面側通過基板的開口流動。於是，由於樹脂從基板的開口流動時的流動阻力，可能會使基板向前述另一個表面側鼓起。這樣，就會在基板為鼓起的狀態下，另一方的型腔被樹脂填充。通過一方以及另一方的型腔被樹脂填充，樹脂壓施加在基板上，但是施加在基板的一個表面以及另一個表面的樹脂壓是相同壓力(一方以及另一方的型腔由基板的開口連接，因此樹脂壓相同)，並不產生將基板從鼓起的狀態恢復到平坦狀態的力。因此，以基板的另一個表面側鼓起的狀態進行樹脂固化，進而以基板鼓起的狀態(已變形的狀態)完成成型。亦即，如果使用前述樹脂封裝方法在前述基板的一個 表面以及另一個表面(兩個表面)同時進行封裝，可能會發生前述基板的變形。 However, in the manufacture of the aforementioned package, when the two surfaces of the substrate are resin-sealed at the same time using the aforementioned resin encapsulation method, a cavity (upper or lower cavity) of one (upper or lower mold) may appear. The case of being filled with resin first. For example, in the case where the cavity (lower cavity) of the lower mold is first filled with a resin, there is a problem that the substrate is convexly bent (deformed). This is because if the resin is packaged simultaneously on both surfaces by transfer molding, one of the cavities is first filled with the resin due to gravity, flow resistance, and the like. At this time, the resin flows through the opening of the substrate from one surface side to the other surface side of the substrate. Thus, the flow resistance of the resin flowing from the opening of the substrate may cause the substrate to bulge toward the other surface side. Thus, the other cavity is filled with the resin in a state where the substrate is bulged. The cavity of one of the other and the other cavity are filled with resin, and the resin pressure is applied to the substrate, but the resin pressure applied to one surface and the other surface of the substrate is the same pressure (one cavity and the other cavity are connected by the opening of the substrate, Therefore, the resin pressure is the same), and does not generate a force for returning the substrate from the bulged state to the flat state. Therefore, the resin is cured in a state in which the other surface side of the substrate is bulged, and the molding is completed in a state in which the substrate is bulged (deformed state). That is, if the aforementioned resin encapsulation method is used in one of the aforementioned substrates The surface and the other surface (both surfaces) are simultaneously packaged, and deformation of the aforementioned substrate may occur.

於是，本發明的目的是提供一種能夠兼顧基板的彎曲抑制和基板的兩個表面成型的樹脂封裝裝置以及樹脂封裝方法。 Accordingly, an object of the present invention is to provide a resin package device and a resin package method which are capable of achieving both the suppression of the bending of the substrate and the molding of both surfaces of the substrate.

為了達成前述目的，本發明的樹脂封裝裝置是一種在基板的兩個表面進行樹脂封裝的樹脂封裝裝置，其包含：第一成型模組和第二成型模組；前述第一成型模組為壓縮成型用成型模組；前述第二成型模組為傳遞成型用成型模組；通過前述第一成型模組，可將前述基板的一個表面以壓縮成型進行樹脂封裝，通過前述第二成型模組，可將前述基板的另一個表面以傳遞成型進行樹脂封裝；前述第一成型模組包含上模以及下模中的一個；前述第二成型模組包含上模以及下模中的另一個、和中間模；前述中間模在前述第二成型模組中，配置在前述上模的下方或前述下模的上方；前述中間模包含將前述基板的前述另一個表面側進行樹脂封裝的型腔；在前述第二成型模組中，通過前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接，形成可將傳遞成型用樹脂注入到前述上型腔內的樹脂流路。 In order to achieve the above object, the resin encapsulating device of the present invention is a resin encapsulating device for resin encapsulation on both surfaces of a substrate, comprising: a first molding module and a second molding module; and the first molding module is compressed a molding module for molding; the second molding module is a molding module for transfer molding; and the first molding module can seal one surface of the substrate by compression molding, and through the second molding module, The other surface of the substrate may be resin-molded by transfer molding; the first molding module includes one of an upper mold and a lower mold; and the second molding module includes the other of the upper mold and the lower mold, and the middle The intermediate mold is disposed below the upper mold or above the lower mold in the second molding module; the intermediate mold includes a cavity for resin-sealing the other surface side of the substrate; In the second molding module, a surface of the intermediate mold is abutted against a lower surface of the upper mold or an upper surface of the lower mold to form a transferable Type implant into the cavity of the resin flow path resin.

本發明的樹脂封裝方法是，一種在基板的兩個表面進行樹脂封裝的樹脂封裝方法，前述樹脂封裝方法使用本發明的前述樹脂封裝裝置而進行，包含以下步驟：抵接步驟， 使前述中間模在前述中間模的型腔的周邊部分和前述基板的前述另一個表面抵接；第一樹脂封裝步驟，通過前述第一成型模組，將前述基板的前述一個表面以壓縮成型進行樹脂封裝；以及第二樹脂封裝步驟，在前述抵接步驟以及前述第一樹脂封裝步驟之後，在前述第二成型模組中，以前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接、並且前述中間模在前述中間模的型腔的周邊部分與前述基板的前述另一個表面抵接的狀態下，通過由前述第二成型模組將前述傳遞成型用流動樹脂通過前述樹脂流路向前述中間模的型腔內注入，而將前述基板的前述另一個表面以傳遞成型進行樹脂封裝。 The resin encapsulation method of the present invention is a resin encapsulation method in which a resin encapsulation is performed on both surfaces of a substrate, and the resin encapsulation method is performed using the resin encapsulating device of the present invention, and includes the following steps: abutting step, The intermediate mold is abutted on the peripheral portion of the cavity of the intermediate mold and the other surface of the substrate; and the first resin encapsulating step is performed by compression molding on the first surface of the substrate by the first molding module a resin encapsulation step; and a second resin encapsulation step, after the abutting step and the first resin encapsulation step, in the second molding module, a surface of the intermediate mold and a lower surface of the upper mold or the foregoing The upper surface of the mold abuts, and the intermediate mold is in a state in which the peripheral portion of the cavity of the intermediate mold abuts against the other surface of the substrate, and the flow molding resin for transfer molding is formed by the second molding module. The resin flow path is injected into the cavity of the intermediate mold, and the other surface of the substrate is subjected to transfer molding to perform resin encapsulation.

根據本發明，可提供一種能夠兼顧基板的彎曲抑制和基板的兩個表面成型的樹脂封裝裝置以及樹脂封裝方法。 According to the present invention, it is possible to provide a resin package device and a resin package method capable of achieving both the suppression of the bending of the substrate and the molding of both surfaces of the substrate.

1‧‧‧晶片 1‧‧‧ wafer

2‧‧‧基板 2‧‧‧Substrate

3‧‧‧引線 3‧‧‧ lead

4‧‧‧倒裝晶片 4‧‧‧Flip Chip

5‧‧‧球狀端子 5‧‧‧Spherical terminals

6‧‧‧平坦端子 6‧‧‧flat terminal

10‧‧‧上下模成型模組 10‧‧‧Up and down molding module

11‧‧‧安裝基板 11‧‧‧Installation substrate

20a、150a‧‧‧顆粒樹脂 20a, 150a‧‧‧Particle resin

20b、30a、150b、971a‧‧‧熔融樹脂(流動性樹脂) 20b, 30a, 150b, 971a‧‧‧ molten resin (liquid resin)

20、30、150、971‧‧‧封裝樹脂 20, 30, 150, 971‧‧‧ encapsulation resin

140A‧‧‧內部貫通孔 140A‧‧‧Internal through holes

31A‧‧‧不用樹脂部 31A‧‧‧Without the resin department

40、130‧‧‧脫模膜 40, 130‧‧‧ release film

80‧‧‧裝載機 80‧‧‧Loader

140‧‧‧樹脂框部件 140‧‧‧Resin frame parts

200、900‧‧‧上模 200,900‧‧‧上模

203‧‧‧上模外氣遮斷部件 203‧‧‧External air shut-off parts

204A、204B、303‧‧‧O形環 204A, 204B, 303‧‧‧ O-rings

205‧‧‧上模的孔 205‧‧‧ hole in the upper mold

210‧‧‧上模基塊 210‧‧‧Upper block

220‧‧‧上模主塊 220‧‧‧Upper main block

230‧‧‧上模中心塊 230‧‧‧Upper mold center block

240、322、602、702、1030‧‧‧彈性部件 240, 322, 602, 702, 1030‧‧‧ elastic parts

250、950‧‧‧中間模 250, 950‧‧‧ intermediate mode

253、901‧‧‧上型腔 253, 901‧‧‧ upper cavity

254‧‧‧樹脂流路 254‧‧‧Resin flow path

255‧‧‧注入口 255‧‧‧Injection

300、700‧‧‧下模 300, 700‧‧‧

301、730‧‧‧下模基塊 301, 730‧‧‧ lower mold block

302‧‧‧下模外氣遮斷部件 302‧‧‧Under-outside air-shielding parts

305、960‧‧‧容器 305, 960‧‧‧ containers

306、970‧‧‧柱塞 306, 970‧‧‧ plunger

310、701‧‧‧下型腔 310, 701‧‧‧ lower cavity

315‧‧‧容器塊 315‧‧‧ container block

320、710‧‧‧下型腔底面部件 320, 710‧‧‧ lower cavity bottom part

321、720‧‧‧下型腔框部件 321, 720‧‧‧ lower cavity frame parts

310、701‧‧‧下型腔 310, 701‧‧‧ lower cavity

500‧‧‧第一成型模組 500‧‧‧First molding module

600‧‧‧基板保持部件(上模) 600‧‧‧Substrate holding parts (upper mold)

601、1001‧‧‧型腔 601, 1001‧‧‧ cavity

603‧‧‧空氣通道 603‧‧‧Air passage

604‧‧‧空氣孔 604‧‧‧Air holes

610‧‧‧連通部件 610‧‧‧Connected parts

620‧‧‧型腔上表面以及框部件 620‧‧‧The upper surface of the cavity and the frame parts

630、930‧‧‧凸部件 630, 930‧‧ ‧ convex parts

640‧‧‧板部件 640‧‧‧ board parts

650‧‧‧高壓氣體源 650‧‧‧High pressure gas source

711‧‧‧滑孔 711‧‧ ‧Slide hole

800‧‧‧第二成型模組 800‧‧‧Second molding module

1000‧‧‧基板保持部件(下模) 1000‧‧‧Substrate holding parts (lower mold)

1010‧‧‧型腔下表面部件 1010‧‧‧ cavity lower surface parts

1020‧‧‧型腔框部件 1020‧‧‧ cavity frame parts

1040‧‧‧基礎部件 1040‧‧‧Basic components

1100‧‧‧基板搬運機構 1100‧‧‧Substrate handling mechanism

X、Y‧‧‧箭頭 X, Y‧‧‧ arrows

圖1(a)為說明實施例1的樹脂封裝裝置的一個實例的截面圖。圖1(b)為說明圖1(a)的樹脂封裝裝置的變形例的截面圖。 Fig. 1(a) is a cross-sectional view showing an example of a resin encapsulating apparatus of Embodiment 1. Fig. 1(b) is a cross-sectional view for explaining a modification of the resin sealing device of Fig. 1(a).

圖2為示例實施例1的樹脂封裝方法的一個實例的一個步驟的截面圖。 2 is a cross-sectional view showing one step of one example of the resin encapsulation method of Exemplary Embodiment 1.

圖3為示例和圖2相同的樹脂封裝方法的另一步驟的截面圖。 3 is a cross-sectional view showing another step of the same resin encapsulation method as that of FIG. 2.

圖4為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 4 is a cross-sectional view showing still another step of the same resin encapsulation method as that of FIG. 2.

圖5為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 5 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖6為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 6 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖7為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 7 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖8為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 8 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖9為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 9 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖10為示例和圖2相同的樹脂封裝方法的又一步驟的截面圖。 Fig. 10 is a cross-sectional view showing still another step of the same resin encapsulation method as Fig. 2.

圖11為說明實施例2的樹脂封裝裝置的第一成型模組以及通過其被樹脂封裝的基板的截面圖。 Fig. 11 is a cross-sectional view showing a first molding module of the resin package device of the second embodiment and a substrate encapsulated by the resin.

圖12為說明實施例2的樹脂封裝裝置的第二成型模組以及通過其被樹脂封裝的基板的截面圖。 Fig. 12 is a cross-sectional view showing a second molding module of the resin package device of the second embodiment and a substrate sealed by the resin.

圖13為示例實施例2的樹脂封裝方法的一個實例的一個步驟的截面圖。 Fig. 13 is a cross-sectional view showing one step of one example of the resin encapsulation method of Exemplary Embodiment 2.

圖14為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 Figure 14 is a cross-sectional view showing still another step of the same resin encapsulation method of Figure 13.

圖15為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 Figure 15 is a cross-sectional view showing still another step of the same resin encapsulation method of Figure 13.

圖16為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 Figure 16 is a cross-sectional view showing still another step of the same resin encapsulation method of Figure 13.

圖17為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 Figure 17 is a cross-sectional view showing still another step of the same resin encapsulation method of Figure 13.

圖18為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 Figure 18 is a cross-sectional view showing still another step of the same resin encapsulation method of Figure 13.

圖19為示例和圖13相同樹脂封裝方法的又一步驟的截面圖。 19 is a cross-sectional view showing still another step of the same resin encapsulation method of FIG.

圖20(a)~圖20(b)為示例通過本發明的樹脂封裝裝置被封裝樹脂的基板的截面圖。 20(a) to 20(b) are cross-sectional views illustrating a substrate on which a resin is encapsulated by the resin sealing device of the present invention.

下文中，以舉例的方式對本發明進行更詳細的說明。但是，本發明不限於以下說明。 Hereinafter, the present invention will be described in more detail by way of examples. However, the invention is not limited to the following description.

在本發明中，“樹脂封裝”表示樹脂硬化(固化)的狀態，但在後述的兩個表面一起成型的情況下不限於此。亦即，在本發明中，在後述的兩個表面一起成型的情況下，“樹脂封裝”為至少樹脂在模具閉合時充滿型腔的狀態即可，樹脂未硬化(固化)而為流動狀態也可。 In the present invention, the term "resin encapsulation" means a state in which the resin is cured (cured), but the case where the two surfaces described later are molded together is not limited thereto. That is, in the present invention, in the case where the two surfaces to be described later are molded together, the "resin encapsulation" is a state in which at least the resin is filled in the cavity when the mold is closed, and the resin is not cured (cured) but also in a flowing state. can.

本發明的樹脂封裝裝置如上所述，包含第一成型模組和第二成型模組，前述第一成型模組為壓縮成型用成型模組，前述第二成型模組為傳遞成型用成型模組，通過前述第一成型模組可將前述基板的一個表面以壓縮成型進行樹脂封裝，通過前述第二成型模組可將前述基板的另一個表面以傳遞成型進行樹脂封裝。在本發明的樹脂封裝裝置中，通過壓縮成型用的成型模組，先將前述基板的一個表面以壓縮成型進行樹脂封裝(先以壓縮成型在一方的型腔 中填充樹脂)。在本發明中使用的基板上，不需要設置使樹脂從基板的一個表面向另一個表面流動的開口。而且，由於不需要設置開口，不會出現樹脂從基板的一個表面側通過開口向基板的另一個表面側流動的情況。因此，不會發生由樹脂通過基板的開口時的流動阻力引起的基板變形(彎曲)。並且，將基板的另一個表面進行樹脂封裝時，由於將基板的前述一個表面以壓縮成型用樹脂支撐，即使從基板的前述另一個表面側施加樹脂壓也可以抑制基板的彎曲。因此，在本發明中，可兼顧基板的彎曲抑制和基板的兩個表面成型。 As described above, the resin encapsulating device of the present invention includes a first molding module and a second molding module, wherein the first molding module is a molding module for compression molding, and the second molding module is a molding module for transfer molding. One surface of the substrate can be resin-molded by compression molding through the first molding module, and the other surface of the substrate can be resin-molded by transfer molding through the second molding module. In the resin package device of the present invention, one surface of the substrate is first subjected to compression molding by a molding module for compression molding (first compression molding is performed on one cavity). Filled with resin). On the substrate used in the present invention, it is not necessary to provide an opening for allowing resin to flow from one surface of the substrate to the other surface. Moreover, since it is not necessary to provide the opening, there is no possibility that the resin flows from the one surface side of the substrate to the other surface side of the substrate through the opening. Therefore, deformation (bending) of the substrate due to flow resistance when the resin passes through the opening of the substrate does not occur. Further, when the other surface of the substrate is resin-sealed, since the one surface of the substrate is supported by the compression molding resin, the bending of the substrate can be suppressed even if the resin pressure is applied from the other surface side of the substrate. Therefore, in the present invention, both the bending suppression of the substrate and the two surface molding of the substrate can be achieved.

前述以往的方法，亦即在基板上開開口通過傳遞成型將前述基板的兩個表面進行樹脂封裝的方法中，有在前述基板上開開口而產生的費用問題。並且，從該開口將樹脂回轉到下表面側進行樹脂封裝的情況下，還會出現將前述一個表面直至整個面進行樹脂封裝為止的流動距離變長、氣泡產生、作為結構部件的引線等變形的問題。 In the above conventional method, that is, a method of resin-sealing both surfaces of the substrate by transfer molding on the substrate, there is a problem in that the opening is opened in the substrate. In addition, when the resin is packaged by rotating the resin to the lower surface side from the opening, the flow distance from the one surface to the entire surface of the resin package may be increased, bubbles may be generated, and the lead wire as a structural member may be deformed. problem.

相比之下，在本發明中，首先由於不需要在前述基板開開口，並可在前述基板的兩個表面進行樹脂封裝，因此不產生在前述基板開開口的費用，並且前述兩個表面的樹脂封裝的流動距離也短，可抑制氣泡的產生、引線的變形。 In contrast, in the present invention, first, since it is not necessary to open an opening in the foregoing substrate, and resin encapsulation can be performed on both surfaces of the foregoing substrate, the cost of opening the opening in the substrate is not generated, and the two surfaces are The flow distance of the resin package is also short, and generation of bubbles and deformation of the leads can be suppressed.

並且，本發明的樹脂封裝裝置可為例如將前述基板的下表面以壓縮成型進行樹脂封裝，將前述基板的上表面以傳遞成型進行樹脂封裝的裝置。亦即，在本發明的樹脂封裝裝置中，可以為：前述第一成型模組包含下模，前述第 二成型模組包含上模以及中間模，通過前述第一成型模組可將前述基板的下表面以壓縮成型進行樹脂封裝，通過前述第二成型模組可將前述基板的上表面以傳遞成型進行樹脂封裝，前述中間模在前述第二成型模組中，配置在前述上模的下方，前述中間模的型腔為用於將前述基板的上表面側進行樹脂封裝的上型腔，在前述第二成型模組中，可通過前述中間模的上表面和前述上模的下表面抵接，從而形成前述樹脂流路。但是，本發明的樹脂封裝裝置不限於此，相反，還可為將前述基板的上表面以壓縮成型進行樹脂封裝，將前述基板的下表面以傳遞成型進行樹脂封裝的裝置。亦即，在本發明的樹脂封裝裝置中，可以為：前述第一成型模組包含上模，前述第二成型模組包含下模以及中間模，通過前述第一成型模組可將前述基板的上表面以壓縮成型進行樹脂封裝，通過前述第二成型模組可將前述基板的下表面以傳遞成型進行樹脂封裝，前述中間模在前述第二成型模組中，配置在前述下模的上方，前述中間模的型腔為用於將前述基板的下表面側進行樹脂封裝的下型腔，在前述第二成型模組中，通過前述中間模的下表面和前述下模的上表面抵接，形成前述樹脂流路。 Further, the resin sealing device of the present invention may be, for example, a device in which the lower surface of the substrate is resin-molded by compression molding, and the upper surface of the substrate is resin-molded by transfer molding. That is, in the resin package device of the present invention, the first molding module may include a lower mold, the foregoing The second molding module includes an upper mold and an intermediate mold. The lower surface of the substrate can be resin-molded by compression molding through the first molding module, and the upper surface of the substrate can be transferred and formed by the second molding module. In the resin package, the intermediate mold is disposed under the upper mold in the second molding module, and the cavity of the intermediate mold is an upper cavity for resin-sealing the upper surface side of the substrate. In the two molding module, the resin flow path can be formed by abutting the upper surface of the intermediate mold and the lower surface of the upper mold. However, the resin sealing device of the present invention is not limited thereto, and instead, the upper surface of the substrate may be resin-molded by compression molding, and the lower surface of the substrate may be resin-molded by transfer molding. That is, in the resin packaging device of the present invention, the first molding module may include an upper mold, and the second molding module includes a lower mold and an intermediate mold, and the substrate may be formed by the first molding module. The upper surface is resin-molded by compression molding, and the lower surface of the substrate is resin-molded by transfer molding by the second molding module, and the intermediate mold is disposed above the lower mold in the second molding module. The cavity of the intermediate mold is a lower cavity for resin-sealing the lower surface side of the substrate, and in the second molding module, the lower surface of the intermediate mold abuts against the upper surface of the lower mold, The aforementioned resin flow path is formed.

並且，根據本發明，將上模以及下模的一方以脫模膜覆蓋進行壓縮成型的同時，可在另一方進行傳遞成型。下文中，對前述第一成型模組包含下模，前述第二成型模組包含上模以及中間模的情況進行說明。亦即，在這樣的情況下，在本發明的樹脂封裝裝置中，前述中間模設置有上 型腔。通過將上模和中間模抵接在上型腔中形成供給樹脂的樹脂流路。而且，通過該樹脂流路，成為將供給到下模容器中的樹脂以柱塞注入到中間模的上型腔中的結構。因此，可以不在下模的下型腔周邊部分設置樹脂流路(通過設置中間模，能夠不將樹脂流路通過下模的下型腔的周邊部分而高效地迂回)。因此，即使在下模的模面(下型腔)上覆蓋脫模膜的情況下，也可不在下模和脫模膜的邊界(間隙)部分上設置樹脂流路。因此，樹脂也可不在下模和脫模膜的邊界(間隙)上流動，降低了樹脂從下模和脫模膜的邊界(空隙)進入下模的可能性。結果，即使使用脫模膜也可穩定地進行壓縮成型，因此較佳。如更具體地進行說明的，一般在下模進行壓縮成型時，將下模的模面以脫模膜覆蓋。這是為了例如使已成型的樹脂封裝產品的脫模變得容易，或者，為了防止下模的各部件之間(例如，下型腔底面部件和下型腔框部件之間)的間隙中進入壓縮成型用樹脂。但是，在為了在上模進行傳遞成型而將樹脂流路設置在下模的下型腔周邊的情況下，由於傳遞成型用樹脂在下模和脫模膜的邊界(間隙)上流動，樹脂有可能從下模和脫模膜的邊界(間隙)進入下模。另一方面，根據本發明，如上所述通過上模和中間模抵接形成樹脂流路。因此，可將傳遞成型用的前述樹脂流路與下模和脫模膜的邊界(間隙)隔離。於是，根據本發明，可防止傳遞成型用的樹脂進入下模和脫模膜的邊界(間隙)。因此，根據本發明，可將下模的模面以脫模膜覆蓋而進行壓縮成型，且在上模以及中 間模中進行傳遞成型。如上所述，對前述第一成型模組包含下模，前述第二成型模組包含上模以及中間模的情況進行了說明，但與其相反的情況中也相同。亦即，在前述第一成型模組包含上模，前述第二成型模組包含下模以及中間模的情況中，也可根據相同的機理而可將上模的模面以脫模膜覆蓋而進行壓縮成型，且在下模以及中間模中進行傳遞成型。 Further, according to the present invention, one of the upper mold and the lower mold is subjected to compression molding while being covered with a release film, and transfer molding can be performed on the other side. Hereinafter, a description will be given of a case where the first molding module includes a lower mold and the second molding module includes an upper mold and an intermediate mold. That is, in such a case, in the resin package device of the present invention, the aforementioned intermediate mold is provided with Cavity. A resin flow path for supplying a resin is formed by abutting the upper mold and the intermediate mold in the upper cavity. Further, the resin flow path is configured to inject the resin supplied into the lower mold container into the upper cavity of the intermediate mold by the plunger. Therefore, the resin flow path can be provided not in the peripheral portion of the lower cavity of the lower mold (by providing the intermediate mold, the resin flow path can be efficiently bypassed without passing through the peripheral portion of the lower cavity of the lower mold). Therefore, even in the case where the release film is covered on the die face (lower cavity) of the lower mold, the resin flow path may not be provided on the boundary (gap) portion of the lower mold and the release film. Therefore, the resin can also flow on the boundary (gap) of the lower mold and the release film, reducing the possibility that the resin enters the lower mold from the boundary (void) of the lower mold and the release film. As a result, compression molding can be stably performed even if a release film is used, which is preferable. As described in more detail, generally, when the lower mold is subjected to compression molding, the mold surface of the lower mold is covered with a release film. This is for example to facilitate demolding of the formed resin-encapsulated product, or to prevent entry into the gap between the components of the lower mold (for example, between the lower cavity bottom member and the lower cavity frame member). Resin for compression molding. However, in the case where the resin flow path is provided in the periphery of the lower cavity of the lower mold for transfer molding in the upper mold, the resin may flow from the boundary (gap) of the lower mold and the release film due to the transfer molding resin. The boundary (gap) of the lower mold and the release film enters the lower mold. On the other hand, according to the present invention, the resin flow path is formed by abutting the upper mold and the intermediate mold as described above. Therefore, the resin flow path for transfer molding can be isolated from the boundary (gap) between the lower mold and the release film. Thus, according to the present invention, it is possible to prevent the resin for transfer molding from entering the boundary (gap) of the lower mold and the release film. Therefore, according to the present invention, the molding surface of the lower mold can be compression-molded by covering the release film, and in the upper mold and the middle Transfer molding is performed in the mold. As described above, the case where the first molding die includes the lower die and the second molding die includes the upper die and the intermediate die has been described, but the same is true in the opposite case. That is, in the case where the first molding module includes an upper mold, and the second molding module includes a lower mold and an intermediate mold, the mold surface of the upper mold may be covered with a release film according to the same mechanism. Compression molding is carried out, and transfer molding is performed in the lower mold and the intermediate mold.

對本發明的樹脂封裝裝置而言，上下模成型模組(1個成型模組)可兼作前述第一成型模組和前述第二成型模組。這種情況下，可通過前述第一成型模組將前述基板的前述一個表面以壓縮成型進行樹脂封裝後，通過前述第二成型模組將前述基板的前述另一個表面以傳遞成型進行樹脂封裝。因此，可通過使用一個成型模組將前述基板的兩個表面進行一併成型而提高生產效率，也將結構簡化，從而能降低成本。 In the resin package device of the present invention, the upper and lower mold forming modules (one molding module) can double as the first molding module and the second molding module. In this case, the one surface of the substrate may be resin-encapsulated by compression molding after the first molding module, and the other surface of the substrate may be resin-molded by transfer molding by the second molding module. Therefore, the production efficiency can be improved by integrally molding the two surfaces of the substrate by using one molding module, and the structure can be simplified, thereby reducing the cost.

本發明的樹脂封裝裝置，如上所述，可為將前述基板的前述一個表面以壓縮成型進行樹脂封裝後，將前述基板的前述另一個表面以傳遞成型進行樹脂封裝。像這樣將前述基板的兩個表面進行樹脂封裝的話，可容易地以將設置在基板(另一個表面)上的端子從封裝樹脂露出的狀態進行成型。露出前述端子的目的在於與基板進行電連接。 In the resin sealing device of the present invention, as described above, after the one surface of the substrate is resin-molded by compression molding, the other surface of the substrate is subjected to transfer molding to perform resin encapsulation. When the two surfaces of the substrate are resin-sealed as described above, the terminals provided on the substrate (the other surface) can be easily molded in a state where the terminals are exposed from the sealing resin. The purpose of exposing the aforementioned terminals is to electrically connect to the substrate.

對本發明的樹脂封裝裝置而言，前述樹脂流路向前述中間模的型腔的注入口較佳位於前述中間模的型腔中心點附近的正上方或正下方。例如在前述第二成型模組包含上 模以及中間模，前述中間模的型腔為用於將前述基板的上表面側進行樹脂封裝的上型腔的情況下，前述樹脂流路向前述上型腔的注入口較佳位於前述上型腔中心點附近的正上方。相反，在前述第二成型模組包含下模以及中間模，前述中間模的型腔為用於將前述基板的下表面側進行樹脂封裝的下型腔的情況下，前述樹脂流路向前述下型腔的注入口較佳位於前述下型腔中心點附近的正下方。因此，前述傳遞成型用樹脂從前述中心點附近向前述中間模的型腔外周大致均勻地流動。於是，例如和前述樹脂從前述中間模的型腔的一端側向另一端側流動的情況相比，可高效地排出前述中間模的型腔內的殘留空氣，因此能抑制氣泡的出現。更具體地，例如可分散前述中間模的型腔內的殘留空氣，並從設置在前述中間模的型腔外周的通氣孔排出。並且，如果前述樹脂從前述中間模的型腔的中心點附近向外周流動，和前述樹脂從前述中間模的型腔的一端側向另一端側流動的情況相比，由於流動距離變短，因此可抑制引線的變形。更具體地，例如在前述中間模的型腔的一端側設置有前述注入口的情況，由於在前述注入口側的樹脂通過量很多，因此引線很容易變形。相比之下，將前述注入口設置在前述中心點附近，在前述樹脂從前述中間模的型腔的中心點附近向外周流動時，就可使前述上型腔內的樹脂通過量接近均一。因此可抑制引線的變形。 In the resin package device of the present invention, the injection port of the resin flow path to the cavity of the intermediate mold is preferably located directly above or below the vicinity of the center point of the cavity of the intermediate mold. For example, in the foregoing second molding module includes In the mold and the intermediate mold, in the case where the cavity of the intermediate mold is an upper cavity for resin-sealing the upper surface side of the substrate, the injection port of the resin flow path to the upper cavity is preferably located in the upper cavity Just above the center point. On the other hand, in the case where the second molding die includes a lower die and an intermediate die, and the cavity of the intermediate die is a lower cavity for resin-sealing the lower surface side of the substrate, the resin flow path is toward the lower mold. The injection port of the cavity is preferably located directly below the center point of the aforementioned lower cavity. Therefore, the transfer molding resin flows substantially uniformly from the vicinity of the center point to the outer periphery of the cavity of the intermediate mold. Then, for example, compared with the case where the resin flows from the one end side to the other end side of the cavity of the intermediate mold, the residual air in the cavity of the intermediate mold can be efficiently discharged, so that the occurrence of air bubbles can be suppressed. More specifically, for example, residual air in the cavity of the intermediate mold can be dispersed and discharged from a vent hole provided in the outer periphery of the cavity of the intermediate mold. Further, if the resin flows from the vicinity of the center point of the cavity of the intermediate mold to the outer circumference, and the resin flows from the one end side to the other end side of the cavity of the intermediate mold, since the flow distance becomes shorter, The deformation of the lead wire can be suppressed. More specifically, for example, in the case where the injection port is provided on one end side of the cavity of the intermediate mold, since the amount of resin passing through the injection port side is large, the lead wire is easily deformed. In contrast, the injection port is disposed near the center point, and when the resin flows from the vicinity of the center point of the cavity of the intermediate mold to the outer periphery, the resin throughput in the upper cavity is made nearly uniform. Therefore, deformation of the lead wire can be suppressed.

本發明的樹脂封裝裝置可進一步包含起模桿。前述起模桿例如可設置成可從前述第一成型模組以及前述第二成 型模組中至少一個所具備的成型模組的型腔面上進出。這種情況下，前述起模桿例如在模具打開時，其前端可上升或下降從而從前述型腔面突出，在模具閉合時，其前端可上升或下降從而不從前述型腔面突出。另外，前述起模桿可例如設置在前述下模的型腔的底面部以及前述中間模的上型腔的上表面部中的任一處。此時，前述起模桿例如在前述上模以及前述下模中的一個和前述中間模的模具打開時，其前端可從前述下模的型腔底面部或前述中間模的上型腔上表面部突出，在前述上模以及前述下模中的一個和前述中間模的模具閉合時，其前端不從前述下模的型腔底面部或前述中間模的上型腔上表面部突出而可埋藏。因此，可容易地從前述下模以及中間模將完成樹脂封裝後的基板以及樹脂封裝後的不用樹脂部分脫模，因此較佳。另外，設置有前述起模桿的成型模組例如可以是上模、下模，也可以是上模以及下模兩者。 The resin package device of the present invention may further comprise a ejector pin. The ejector pin may be disposed, for example, from the first molding module and the second component. At least one of the molding modules of the type module has a cavity surface in and out. In this case, the ejector pin may, when the mold is opened, may be raised or lowered to protrude from the cavity surface, and when the mold is closed, the front end thereof may be raised or lowered so as not to protrude from the cavity surface. Further, the ejector pin may be provided, for example, at any of the bottom surface portion of the cavity of the lower mold and the upper surface portion of the upper cavity of the intermediate mold. At this time, the ejector pin, for example, when one of the aforementioned upper mold and the lower mold and the mold of the intermediate mold are opened, the front end thereof may be from the bottom surface portion of the lower mold or the upper surface of the upper mold of the intermediate mold. a portion protruding, when one of the upper mold and the lower mold and the mold of the intermediate mold are closed, the front end of the mold is not protruded from the bottom surface portion of the lower mold or the upper surface portion of the upper mold of the lower mold, and is buryable . Therefore, it is possible to easily release the resin-encapsulated substrate and the resin-free portion after the resin package from the lower mold and the intermediate mold, which is preferable. Further, the molding die provided with the above-mentioned ejector pin may be, for example, an upper die or a lower die, or may be both an upper die and a lower die.

本發明的樹脂封裝裝置進一步包含不用樹脂分離設備。前述不用樹脂分離設備在將前述基板的兩個表面進行樹脂封裝後，可從前述完成樹脂封裝的基板上分離不用樹脂部分。對前述不用樹脂分離設備沒有特別的限制，例如可列舉使用澆口切斷、打澆口等公知方法的分離用夾具等。 The resin package device of the present invention further comprises a resin separation device. The foregoing non-resin separation apparatus can separate the non-resin portion from the substrate on which the resin package is completed after resin-sealing both surfaces of the foregoing substrate. The above-mentioned resin-free separating apparatus is not particularly limited, and examples thereof include a separating jig using a known method such as gate cutting or gate, and the like.

本發明的樹脂封裝裝置可包含裝載機。前述裝載機例如回收不用樹脂部並排出。並且，通過裝載機具備的真空裝置、刷等，清潔例如前述第一成型模組以及第二成型模組，並清潔例如前述上模和前述中間模和前述下模。 The resin encapsulating device of the present invention may comprise a loader. The aforementioned loader is, for example, recovered without using a resin portion and discharged. Then, for example, the first molding module and the second molding module are cleaned by a vacuum device, a brush, or the like provided in the loader, and the upper mold, the intermediate mold, and the lower mold are cleaned, for example.

本發明的樹脂封裝裝置可進一步包含基板搬運機構以及樹脂搬運機構。前述基板搬運機構向各成型模組的規定位置上搬運被樹脂封裝的基板。前述基板搬運機構可搬運被樹脂封裝前的基板和被樹脂封裝後的基板中的僅一者，也可搬運兩者。搬運被樹脂封裝前的基板的樹脂搬運機構和搬運被樹脂封裝後的基板的樹脂搬運機構可相同也可相異。前述樹脂搬運機構例如向前述下型腔上搬運供給到前述下模的壓縮成型用樹脂。前述樹脂搬運機構例如可向容器的位置上搬運板狀的樹脂。向下型腔上搬運樹脂的樹脂搬運機構和向容器的位置上搬運板狀的樹脂的樹脂搬運機構可相異也可相同。並且，前述樹脂封裝裝置可為例如前述基板搬運機構兼作前述樹脂搬運機構的結構。 The resin sealing device of the present invention may further include a substrate transfer mechanism and a resin transfer mechanism. The substrate transport mechanism transports the resin-encapsulated substrate to a predetermined position of each of the molding modules. The substrate transport mechanism can transport only one of the substrate before being encapsulated by the resin and the substrate after being encapsulated by the resin, and both of them can be transported. The resin transport mechanism that transports the substrate before being encapsulated by the resin and the resin transport mechanism that transports the substrate after the resin is packaged may be the same or different. The resin conveying mechanism conveys, for example, the compression molding resin supplied to the lower mold to the lower cavity. The resin conveying mechanism can convey a plate-shaped resin to the position of the container, for example. The resin transfer mechanism that transports the resin to the lower cavity and the resin transfer mechanism that transports the plate-shaped resin to the position of the container may be different or the same. Further, the resin sealing device may have a configuration in which the substrate transfer mechanism also serves as the resin transfer mechanism.

本發明的樹脂封裝裝置可進一步包含基板翻轉機構。前述基板翻轉機構可翻轉被樹脂封裝的基板的上下。 The resin package device of the present invention may further comprise a substrate turning mechanism. The substrate inverting mechanism can reverse the upper and lower sides of the substrate encapsulated by the resin.

對本發明的樹脂封裝裝置而言，例如可在通過壓縮成型用的成型模組進行壓縮成型時，為了吸收樹脂量的偏差，在構成壓縮成型用成型模組的型腔的塊(部件)上設置彈簧，在前述樹脂上施加壓力。並且，可在構成前述型腔的塊(部件)上安裝圓頭絲杠或者液壓桿等，通過直線移動進行加壓。 The resin-sealed device of the present invention can be provided, for example, in a block (component) constituting a cavity of a molding module for compression molding in order to absorb variations in the amount of resin when compression molding is performed by a molding die for compression molding. A spring applies pressure to the aforementioned resin. Further, a ball screw or a hydraulic rod or the like can be attached to a block (member) constituting the cavity, and pressurization can be performed by linear movement.

對本發明的樹脂封裝裝置而言，可在前述下模上設置或不設置用於使已成型的樹脂封裝產品從成型模組脫模變得容易的脫模膜。 In the resin package device of the present invention, a release film for facilitating mold release of the molded resin packaged product from the molding die can be provided on the lower mold.

另外，例如在型腔中含有的空氣、和樹脂中含有的水 分等通過加熱成為氣體的氣體等含在封裝樹脂內時，會出現產生孔隙(氣泡)的情況。出現氣泡就可能會降低樹脂封裝產品的耐久性或可靠性。於是，為了按照需求減少孔隙(氣泡)，可包含用於以真空(減壓)狀態進行樹脂封裝成型的真空泵等。 In addition, for example, air contained in a cavity and water contained in a resin When a gas or the like which is heated into a gas is contained in the encapsulating resin, pores (air bubbles) may be generated. The presence of air bubbles may reduce the durability or reliability of the resin packaged product. Then, in order to reduce voids (bubbles) as required, a vacuum pump or the like for performing resin encapsulation molding in a vacuum (reduced pressure) state may be included.

作為通過本發明的樹脂封裝裝置進行樹脂封裝的基板，例如，可為其兩個表面上安裝有晶片的安裝基板。作為前述安裝基板可舉例的有，如圖20(a)中所示，其兩個表面的一方上設置有晶片1和將前述晶片1以及基板2進行電連接的引線3，其兩個表面的另一方上設置有倒裝晶片4和作為外部端子的球狀端子5的安裝基板11。 As a substrate to be resin-sealed by the resin package device of the present invention, for example, a mounting substrate on which wafers are mounted on both surfaces thereof may be used. As the mounting substrate, as shown in FIG. 20(a), one of the two surfaces is provided with a wafer 1 and a lead 3 for electrically connecting the wafer 1 and the substrate 2, the two surfaces of which are provided On the other hand, a mounting substrate 11 on which a flip chip 4 and a ball terminal 5 as an external terminal are provided is provided.

在這裡，在將具有上述結構的基板的兩個表面進行成型的情況下，有必要至少從一個表面露出球狀端子5。在壓縮成型側露出球狀端子5的情況下，較佳將球狀端子5按壓在脫模膜上並露出。並且，按照需求，可為了將球狀端子5露出而對封裝樹脂進行研磨處理。另一方面，在傳遞成型側露出端子的情況下，較佳例如圖20(b)中的安裝基板所示，代替球狀端子5，將露出面作為平坦端子6，以設置在傳遞成型用的成型模組的模具上的凸部進行預合模，將平坦端子6按壓並使其露出。另外，圖20(b)的安裝基板11除了未將圖20(a)的安裝基板11的球狀端子5設置在前述上表面上，而是設置在前述下表面而作為平坦端子6以外，和圖20(a)的安裝基板11相同。由此，能切實地露出，所以較佳。 Here, in the case of molding both surfaces of the substrate having the above structure, it is necessary to expose the spherical terminals 5 from at least one surface. When the spherical terminal 5 is exposed on the compression molding side, it is preferable to press the spherical terminal 5 against the release film and expose it. Further, the encapsulating resin may be subjected to a rubbing treatment in order to expose the spherical terminal 5 as needed. On the other hand, when the terminal is exposed on the transfer molding side, for example, as shown in the mounting substrate in FIG. 20(b), instead of the spherical terminal 5, the exposed surface is used as the flat terminal 6, and is provided for transfer molding. The convex portion on the mold of the molding module is pre-closed, and the flat terminal 6 is pressed and exposed. In addition, the mounting substrate 11 of FIG. 20(b) is provided not on the upper surface of the mounting substrate 11 of FIG. 20(a) but on the lower surface as the flat terminal 6, and The mounting substrate 11 of Fig. 20(a) is the same. Therefore, it can be reliably exposed, which is preferable.

本發明中，被樹脂封裝的基板不限於圖20(a)以及圖20(b)的各安裝基板11，可任意選擇。作為前述被樹脂封裝的基板，可以例如晶片1、倒裝晶片4以及球狀端子5(或平坦端子6)中的至少一個如圖20(a)以及圖20(b)這樣安裝在基板2的一個表面上，也可安裝在基板2的兩個表面上。並且，例如如果對前述基板可進行電連接(例如，對前述基板連接電源回路、訊號回路等)，也可沒有前述端子。另外，對基板2、晶片1、倒裝晶片4以及球狀端子5(或平坦端子6)的各形狀、各大小，沒有特別的限制。 In the present invention, the substrate encapsulated by the resin is not limited to the respective mounting substrates 11 of FIGS. 20(a) and 20(b), and can be arbitrarily selected. As the substrate to be resin-encapsulated, at least one of, for example, the wafer 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) may be mounted on the substrate 2 as shown in FIGS. 20(a) and 20(b). On one surface, it can also be mounted on both surfaces of the substrate 2. Further, for example, if the substrate is electrically connected (for example, a power supply circuit, a signal circuit, or the like is connected to the substrate), the terminal may not be provided. Further, the shape and the size of each of the substrate 2, the wafer 1, the flip chip 4, and the ball terminal 5 (or the flat terminal 6) are not particularly limited.

作為通過本發明的樹脂封裝裝置被樹脂封裝的基板，可舉例的有行動通訊終端用的高頻模組基板等。在前述行動通訊終端用的基板中，為了在前述基板的兩個表面進行樹脂封裝，可在托架部開開口，但還是希望有一種不需要開前述開口的樹脂封裝成型法。並且，在前述行動通訊終端用的基板小型化、部件高密度地內置的情況下，開前述開口進行樹脂封裝成型有時較為困難。對此，本發明的樹脂封裝裝置，如上所述，不需要開前述開口，就可將前述基板的兩個表面進行樹脂封裝，可適用於這樣的小型、部件高密度地內置的基板。作為通過本發明的樹脂封裝裝置被樹脂封裝的基板，沒有特別的限制，例如可舉例的有電力控制用模組基板、機械控制用基板等。 As a substrate which is resin-sealed by the resin sealing device of the present invention, a high-frequency module substrate for a mobile communication terminal or the like can be exemplified. In the substrate for the mobile communication terminal, in order to perform resin encapsulation on both surfaces of the substrate, the opening can be opened in the bracket portion, but a resin encapsulation molding method in which the opening is not required is desired. In addition, when the substrate for the mobile communication terminal is downsized and the components are densely built, it may be difficult to open the opening and perform resin encapsulation molding. On the other hand, in the resin sealing device of the present invention, as described above, the two surfaces of the substrate can be resin-sealed without opening the opening, and the substrate can be applied to such a small-sized, high-density substrate. The substrate to be resin-sealed by the resin sealing device of the present invention is not particularly limited, and examples thereof include a power control module substrate, a mechanical control substrate, and the like.

作為前述樹脂，沒有特別的限制，例如可為環氧樹脂和矽酮樹脂等熱固性樹脂，也可為熱塑性樹脂。並且，還可為部分含有熱固性樹脂或熱塑性樹脂的複合樹脂。作為 被供給的樹脂的形態，可舉例的有顆粒樹脂、流動性樹脂、片狀樹脂、板狀樹脂、粉狀樹脂等。在本發明中，前述流動性樹脂只要是具有流動性的樹脂就沒有特別的限制，例如可舉例的有液狀樹脂、熔融樹脂等。在本發明中，前述液狀樹脂為，例如在室溫下為液體或具有流動性的樹脂。在本發明中，前述熔融樹脂為，例如通過熔融成為液狀或具有流動性的狀態的樹脂。前述樹脂的形態只要是可供給到成型模組的型腔和容器等中的形態，也可為其他的形態。 The resin is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or an oxime resin, or a thermoplastic resin. Further, it may be a composite resin partially containing a thermosetting resin or a thermoplastic resin. As The form of the resin to be supplied may, for example, be a pellet resin, a fluid resin, a sheet resin, a plate resin, a powder resin or the like. In the present invention, the fluidity resin is not particularly limited as long as it is a fluid resin, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin is, for example, a liquid which is liquid or fluid at room temperature. In the present invention, the molten resin is, for example, a resin which is in a liquid state or has a fluidity state by melting. The form of the resin may be in other forms as long as it can be supplied to a cavity, a container, or the like of the molding module.

另外，一般“電子部件”有指進行樹脂封裝前的晶片的情況，也有指將晶片進行了樹脂封裝的狀態的情況，但在本發明中，僅稱“電子部件”時除非另外指明，表示前述晶片已進行樹脂封裝的電子部件(作為成品的電子部件)。在本發明中，“晶片”是指進行樹脂封裝前的晶片，具體地，可舉例的有IC、半導體晶片、電力控制用的半導體元件等晶片。在本發明中，進行樹脂封裝前的晶片為了和樹脂封裝後的電子部件區分，為了方便起見稱為“晶片”。但是，本發明的“晶片”如果是進行樹脂封裝前的晶片就沒有特別的限制，也可以不是晶片狀。 In addition, the term "electronic component" generally refers to a case where a wafer before resin encapsulation is performed, and a case where a wafer is resin-sealed. However, in the present invention, only "electronic component" is used unless otherwise specified. The wafer has been subjected to resin-packaged electronic components (as a finished electronic component). In the present invention, the "wafer" refers to a wafer before resin encapsulation, and specifically, a wafer such as an IC, a semiconductor wafer, or a semiconductor element for power control can be exemplified. In the present invention, the wafer before resin encapsulation is distinguished from the electronic component after resin encapsulation, and is referred to as a "wafer" for the sake of convenience. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in the form of a wafer.

在本發明中，“倒裝晶片”是指在IC晶片表面部的電極(焊盤)上具有稱為凸點(bump)的鼓包狀突起電極的IC晶片，或如上所述的晶片形態。將此晶片向下(面朝下)安裝在印刷基板等的接線部分上。前述倒裝晶片例如作為無引線接合法用晶片或安裝方法的一種而使用。 In the present invention, "flip-chip" refers to an IC wafer having a bulge-like bump electrode called a bump on an electrode (pad) on the surface portion of the IC wafer, or a wafer form as described above. This wafer is mounted downward (face down) on a wiring portion of a printed circuit board or the like. The flip chip described above is used, for example, as one of a wafer for wire bonding method or a mounting method.

本發明的樹脂封裝方法可為如上所述的在基板的兩個 表面進行樹脂封裝的方法，包含：第一樹脂封裝步驟，將前述基板的一個表面以壓縮成型進行樹脂封裝；和第二樹脂封裝步驟，在第一樹脂封裝步驟後將前述基板的另一個表面以傳遞成型進行樹脂封裝。在本發明的樹脂封裝方法中，由於先將前述基板的前述一個表面以壓縮成型進行樹脂封裝，因此在將前述另一個表面進行樹脂封裝時，前述一個表面被壓縮成型用樹脂支撐，從而即使從前述另一個表面側對基板施加樹脂壓也可以抑制基板的彎曲。因此，在本發明中，可兼顧基板的彎曲抑制和基板的兩個表面成型。另外，在本發明的樹脂封裝方法中，例如可先將前述基板的下表面以壓縮成型進行樹脂封裝，其後將前述基板的上表面以傳遞成型進行樹脂封裝。亦即，本發明的樹脂封裝方法為在基板的兩個表面進行樹脂封裝的樹脂封裝方法，其使用前述本發明的樹脂封裝裝置而進行，可包含：抵接步驟，將前述中間模在前述上型腔周邊部分和前述基板的上表面抵接；第一樹脂封裝步驟，通過前述第一成型模組將前述基板的下表面以壓縮成型進行樹脂封裝；和第二樹脂封裝步驟，在前述抵接步驟以及前述第一樹脂封裝步驟之後，在前述中間模的上表面和前述上模的下表面抵接，且前述中間模在前述上型腔周邊部分和前述基板的上表面抵接的狀態下，通過前述第二成型模組，將前述傳遞成型用的流動樹脂通過前述樹脂流路注入到前述上型腔內，從而將前述基板的上表面以傳遞成型進行樹脂封裝。 The resin encapsulation method of the present invention may be two of the substrates as described above a method of performing resin encapsulation on a surface, comprising: a first resin encapsulation step of resin encapsulating one surface of the substrate by compression molding; and a second resin encapsulation step of disposing another surface of the substrate after the first resin encapsulation step Transfer molding for resin encapsulation. In the resin encapsulation method of the present invention, since the one surface of the substrate is first subjected to resin encapsulation by compression molding, when the other surface is resin-sealed, the one surface is supported by the resin for compression molding, so that even The application of the resin pressure to the substrate by the other surface side can also suppress the bending of the substrate. Therefore, in the present invention, both the bending suppression of the substrate and the two surface molding of the substrate can be achieved. Further, in the resin encapsulation method of the present invention, for example, the lower surface of the substrate may be resin-molded by compression molding, and then the upper surface of the substrate may be resin-molded by transfer molding. That is, the resin encapsulation method of the present invention is a resin encapsulation method of performing resin encapsulation on both surfaces of a substrate, which is performed using the resin encapsulating apparatus of the present invention described above, and may include an abutting step of arranging the intermediate mold on the foregoing a peripheral portion of the cavity abuts against the upper surface of the substrate; a first resin encapsulating step of resin encapsulating the lower surface of the substrate by compression molding by the first molding module; and a second resin encapsulating step at the abutting After the step and the first resin encapsulation step, the upper surface of the intermediate mold abuts against the lower surface of the upper mold, and the intermediate mold is in a state where the peripheral portion of the upper cavity abuts against the upper surface of the substrate, The flow molding resin for transfer molding is injected into the upper cavity through the resin flow path by the second molding die, and the upper surface of the substrate is resin-molded by transfer molding.

並且，對本發明的樹脂封裝方法而言，在前述第二樹 脂封裝步驟中，如上所述，在前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接的狀態下，將前述傳遞成型用流動樹脂通過前述樹脂流路注入到前述中間模的型腔內。由此，如上所述，可不在壓縮成型用模具和將其覆蓋的脫模膜的邊界(間隙)部分上設置樹脂流路。因此，可將前述傳遞成型用的樹脂流路與前述壓縮成型用模具和前述脫模膜的邊界(間隙)隔離。於是，根據本發明的樹脂封裝方法，可減少傳遞成型用的樹脂進入下模和脫模膜的邊界(間隙)的可能性。因此，根據本發明的樹脂封裝方法，可將上模以及下模中一方的模表面以脫模膜覆蓋而進行壓縮成型，並且，通過上模以及下模中另一方和中間模進行傳遞成型。 And, in the resin encapsulation method of the present invention, in the aforementioned second tree In the fat encapsulation step, as described above, the transfer molding flow resin is injected into the resin flow path in a state where one surface of the intermediate mold abuts against the lower surface of the upper mold or the upper surface of the lower mold. The cavity of the aforementioned intermediate mold. Thereby, as described above, the resin flow path can be provided not at the boundary (gap) portion of the compression molding die and the release film covering the same. Therefore, the resin flow path for transfer molding can be isolated from the boundary (gap) between the compression molding die and the release film. Thus, according to the resin encapsulation method of the present invention, the possibility that the resin for transfer molding enters the boundary (gap) of the lower mold and the release film can be reduced. Therefore, according to the resin encapsulation method of the present invention, one of the upper mold and the lower mold can be compression-molded by covering with a release film, and transfer molding can be performed by the other of the upper mold and the lower mold and the intermediate mold.

本發明的樹脂封裝方法可為，如上所述，將前述基板的一個表面以壓縮成型進行樹脂封裝後，將前述基板的另一個表面以傳遞成型進行樹脂封裝。像這樣將前述基板的兩個表面進行樹脂封裝的話，可容易地以將設置在傳遞成型面(前述上表面)上的端子從封裝樹脂露出的狀態進行成型。露出前述端子的目的在於與基板電連接。 In the resin encapsulation method of the present invention, as described above, after one surface of the substrate is resin-molded by compression molding, the other surface of the substrate is subjected to transfer molding to perform resin encapsulation. When the two surfaces of the substrate are resin-sealed as described above, the terminals provided on the transfer molding surface (the upper surface) can be easily molded in a state of being exposed from the sealing resin. The purpose of exposing the aforementioned terminals is to electrically connect to the substrate.

本發明的樹脂封裝方法可為，使用本發明的前述樹脂封裝裝置，在前述第一樹脂封裝步驟中，通過前述下模將前述基板的下表面以壓縮成型進行樹脂封裝，在前述第二樹脂封裝步驟中，在前述第一樹脂封裝步驟後，通過前述上模，將前述基板的上表面以傳遞成型進行樹脂封裝。 In the resin encapsulating method of the present invention, in the first resin encapsulating step, the lower surface of the substrate is resin-molded by compression molding in the first resin encapsulating step, and the second resin encapsulation is performed in the second resin encapsulation step. In the step, after the first resin encapsulation step, the upper surface of the substrate is subjected to resin molding by transfer molding through the upper mold.

本發明的樹脂封裝方法可為，使用本發明的前述樹脂 封裝裝置，使前述樹脂流路向前述中間模的型腔的注入口位於前述型腔中心點附近的正上方或正下方。 The resin encapsulation method of the present invention may be the use of the aforementioned resin of the present invention In the packaging device, the injection port of the resin flow path to the cavity of the intermediate mold is located directly above or directly below the center point of the cavity.

本發明的樹脂封裝方法可使用設置有可從前述第一成型模組以及前述第二成型模組中至少一個所具備的成型模組的型腔面上進出的起模桿的本發明的前述樹脂封裝裝置而進行。這種情況下，本發明的樹脂封裝方法可包含：在模具打開時，前述起模桿的前端上升或下降從而從前述型腔面突出的步驟，以及在模具閉合時，前述起模桿的前端上升或下降從而不從前述型腔面突出的步驟。 In the resin encapsulating method of the present invention, the resin of the present invention provided with a ejector rod that can be fed in and out of a cavity surface of a molding module provided in at least one of the first molding module and the second molding module can be used. It is carried out by encapsulating the device. In this case, the resin encapsulating method of the present invention may include a step of ascending or descending the front end of the ejector rod to protrude from the cavity surface when the mold is opened, and a front end of the ejector rod when the mold is closed. The step of ascending or descending so as not to protrude from the aforementioned cavity surface.

本發明的樹脂封裝方法可使用本發明的前述樹脂封裝裝置，並可包含在前述基板的兩個表面進行樹脂封裝後，從完成前述樹脂封裝的基板上分離不用樹脂部分的不用樹脂分離步驟。 The resin encapsulating method of the present invention can use the aforementioned resin encapsulating device of the present invention, and can include a resin-free separating step of separating the resin-free portion from the substrate on which the resin encapsulation is completed, after resin-encapsulating the both surfaces of the substrate.

下文中，將基於圖式對本發明的具體實施例進行說明。各圖式為了便於說明，進行了適當省略、誇張等而示意性地進行描述。並且，在下文中的各實施例以及圖式中，對第一成型模組(壓縮成型用的成型模組)包含下模、第二成型模組(傳遞成型用的成型模組)包含上模以及中間模的實例進行說明。但是，如上所述，本發明並不限於此，可以是第一成型模組(壓縮成型用的成型模組)包含上模，第二成型模組(傳遞成型用的成型模組)包含下模以及中間模。 Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically described for convenience of explanation, appropriately omitted, exaggerated, and the like. Further, in each of the following embodiments and drawings, the first molding module (molding module for compression molding) includes a lower mold and a second molding module (molding module for transfer molding) including an upper mold and An example of an intermediate mold will be described. However, as described above, the present invention is not limited thereto, and the first molding module (molding module for compression molding) may include an upper mold, and the second molding module (molding module for transfer molding) may include a lower mold. And the intermediate mode.

[實施例1] [Example 1]

在本實施例中，首先對本發明的樹脂封裝裝置的一個 例子進行說明，其次對本發明的樹脂封裝方法的一個例子進行說明。另外，在本實施例中使用的基板和圖20(a)的基板2相同。 In the present embodiment, first of the resin encapsulating device of the present invention An example will be described, and an example of the resin encapsulating method of the present invention will be described next. In addition, the substrate used in the present embodiment is the same as the substrate 2 of FIG. 20(a).

在本實施例的樹脂封裝裝置中，上下模成型模組(一個成型模組)兼作前述第一成型模組和前述第二成型模組。前述上下模成型模組中設置有上模、中間模以及下模、前述上模以及前述中間模為傳遞成型用成型模組，前述下模為壓縮成型用成型模組。 In the resin package device of the present embodiment, the upper and lower mold forming modules (one molding module) also serve as the first molding module and the second molding module. The upper and lower mold forming modules are provided with an upper mold, an intermediate mold, and a lower mold, the upper mold and the intermediate mold are transfer molding molding modules, and the lower mold is a compression molding molding module.

圖1(a)表示本實施例的樹脂封裝裝置。如圖1(a)中所示，上下模成型模組10由上模200、中間模250、以及和上模200相對配置的下模300組成。在下模300的模面(上表面)上，如圖所示，例如可吸附(安裝)固定用於使已被成型的樹脂封裝產品從成型模組脫模變得容易的脫模膜40。 Fig. 1(a) shows a resin package device of this embodiment. As shown in FIG. 1(a), the upper and lower mold forming modules 10 are composed of an upper mold 200, an intermediate mold 250, and a lower mold 300 disposed opposite to the upper mold 200. On the die face (upper surface) of the lower die 300, as shown, for example, a release film 40 for fixing the resin packaged product to be molded from the molding die can be adsorbed (mounted).

在本實施例的樹脂封裝裝置中，上模200為傳遞成型用成型模組，包含例如上模基塊210、上模主塊220、上模中心塊230以及具有O形環204A以及O形環204B的上模外氣遮斷部件203。 In the resin package device of the present embodiment, the upper mold 200 is a transfer molding module, and includes, for example, an upper mold base 210, an upper mold main block 220, an upper mold center block 230, and an O-ring 204A and an O-ring. The upper die outer air blocking member 203 of 204B.

在上模基塊210的外周位置上例如設置有上模外氣遮斷部件203。上模外氣遮斷部件203，如下文中所述，例如可隔著下述的O形環204B和下模外氣遮斷部件302抵接，從而使型腔內成為外氣遮斷狀態。在上模外氣遮斷部件203的上端面(被上模基塊210以及上模外氣遮斷部件203夾著的部分)上例如設置有外氣遮斷用O形環204A。並且，上模外氣遮斷部件203的下端面上例如也設置有外 氣遮斷用O形環204B。進一步，上模基塊210上例如設置有用於將模具內空間部的空氣強制吸引從而減壓的上模的孔(貫通孔)205。並且，上模200例如固定在上下模成型模組10的固定盤(省略圖示)上。並且，在上模200、中間模250或上下模成型模組10上例如設置有用於將上模200以及中間模250進行加熱的加熱裝置(省略圖示)。通過以前述加熱裝置加熱上模200，上型腔253內的樹脂被加熱並固化(熔融並固化)。另外，前述加熱裝置可設置於例如上模200、中間模250以及下模300中的任一個上，只要能加熱上模200、中間模250以及下模300中的至少一個，其位置就不受限制。 An upper outer mold gas shutoff member 203 is provided, for example, at an outer peripheral position of the upper mold base 210. The upper mold outer air shutoff member 203 can be brought into contact with the lower outer air blocking member 302 via the following O-ring 204B, for example, as described below, so that the inside of the cavity is in an outside air shutoff state. An O-ring 204A for external air blocking is provided, for example, on the upper end surface of the upper die outer air blocking member 203 (portion sandwiched by the upper die base member 210 and the upper die outer air blocking member 203). Further, for example, the lower end surface of the upper die outer air blocking member 203 is also provided with an outer surface. O-ring 204B for gas interruption. Further, the upper mold base 210 is provided with, for example, a hole (through hole) 205 for forcibly sucking the air in the space inside the mold to decompress the upper mold. Further, the upper mold 200 is fixed to, for example, a fixed disk (not shown) of the upper and lower mold forming modules 10. Further, for the upper mold 200, the intermediate mold 250, or the upper and lower mold forming modules 10, for example, a heating device (not shown) for heating the upper mold 200 and the intermediate mold 250 is provided. By heating the upper mold 200 with the aforementioned heating means, the resin in the upper cavity 253 is heated and solidified (melted and solidified). In addition, the foregoing heating device may be disposed on, for example, any one of the upper mold 200, the intermediate mold 250, and the lower mold 300, as long as at least one of the upper mold 200, the intermediate mold 250, and the lower mold 300 can be heated, the position thereof is not limit.

中間模250配置在上模200和下模300的中間。中間模250例如包含將基板2的上表面側進行樹脂封裝的上型腔253。並且，通過中間模250的上表面和上模200的下表面抵接，可形成將傳遞成型用的樹脂注入到上型腔253內的樹脂流路254。在樹脂流路254上，連接有樹脂加壓用的容器305。配置在容器305內部的柱塞306，通過設置在上下模成型模組10上的柱塞驅動機構(省略圖示)，可在上下方向上進行移動。向容器305(柱塞306上)供給(設置)樹脂，並通過向接近上模200以及中間模250的方向移動柱塞306，使柱塞306按壓樹脂，樹脂就可通過樹脂流路254從注入口255注入到上型腔253中。 The intermediate mold 250 is disposed in the middle of the upper mold 200 and the lower mold 300. The intermediate mold 250 includes, for example, an upper cavity 253 that resin-packages the upper surface side of the substrate 2. Further, by the upper surface of the intermediate mold 250 abutting on the lower surface of the upper mold 200, the resin flow path 254 for injecting the resin for transfer molding into the upper cavity 253 can be formed. A container 305 for pressurizing the resin is connected to the resin flow path 254. The plunger 306 disposed inside the container 305 is movable in the vertical direction by a plunger driving mechanism (not shown) provided on the upper and lower mold forming modules 10. The resin is supplied (disposed) to the container 305 (on the plunger 306), and the plunger 306 is pressed against the resin by moving the plunger 306 in the direction approaching the upper mold 200 and the intermediate mold 250, and the resin can be discharged from the resin flow path 254. The inlet 255 is injected into the upper cavity 253.

下模300為壓縮成型用成型模組，包含例如下型腔底面部件320。下型腔框部件321、複數個彈性部件322、具 有O形環303的下模外氣遮斷部件302、包圍容器305的容器塊315以及下模基塊301。下模300通過下型腔底面部件320以及下型腔框部件321構成下型腔310。下型腔框部件321配置成例如將下型腔底面部件320包圍的結構。下型腔框部件321以及下型腔底面部件320安裝設置成例如隔著複數個彈性部件322載置在下模基塊301上的狀態。在下模基塊301的外周位置上例如設置有下模外氣遮斷部件302。下模外氣遮斷部件302配置在例如上模外氣遮斷部件203以及外氣遮斷用的O形環204A以及O形環204B的正下方。在下模外氣遮斷部件302的下端面(被下模基塊301以及下模外氣遮斷部件302夾著的部分)上，例如設置有外氣遮斷用O形環303。通過具有上述結構，在上下模閉合模具時，通過包含O形環204A以及O形環204B的上模外氣遮斷部件203和包含O形環303的下模外氣遮斷部件302經由O形環204B接合，可使型腔內成為外氣遮斷狀態。 The lower mold 300 is a molding module for compression molding, and includes, for example, a lower cavity bottom surface member 320. Lower cavity frame member 321 , a plurality of elastic members 322 , The lower mold outer air blocking member 302 having the O-ring 303, the container block 315 surrounding the container 305, and the lower mold base block 301. The lower mold 300 constitutes the lower cavity 310 through the lower cavity bottom surface member 320 and the lower cavity frame member 321 . The lower cavity frame member 321 is configured to surround, for example, the lower cavity bottom surface member 320. The lower cavity frame member 321 and the lower cavity bottom surface member 320 are mounted in a state of being placed on the lower mold base block 301 via a plurality of elastic members 322, for example. At the outer peripheral position of the lower mold base block 301, for example, a lower mold outer air shutoff member 302 is provided. The lower mold outer air shutoff member 302 is disposed, for example, directly below the upper outer mold air shutoff member 203 and the outer air blocking O-ring 204A and the O-ring 204B. The lower end surface of the lower mold outer air shutoff member 302 (portion sandwiched by the lower mold base block 301 and the lower mold outer air shutoff member 302) is provided with, for example, an outer air blocking O-ring 303. By having the above structure, when the upper and lower molds close the mold, the upper mold outer air blocking member 203 including the O-ring 204A and the O-ring 204B and the lower mold outer air blocking member 302 including the O-ring 303 are passed through the O shape. When the ring 204B is engaged, the inside of the cavity can be made into an external air shutoff state.

在下模300的下型腔310的底面部上，可進一步設置有起模桿(省略圖示)。前述起模桿可以是一個，也可以是複數個。前述各起模桿可在前述上模以及中間模和前述下模的模具打開時，其前端上升從而從下模300的下型腔310的底面突出，在前述上模以及中間模和前述下模的模具閉合時，其前端下降從而不從下模300的下型腔310的底面突出。 A ejector pin (not shown) may be further provided on the bottom surface portion of the lower cavity 310 of the lower mold 300. The aforementioned ejector pins may be one or plural. Each of the ejector pins can be raised from the bottom surface of the lower cavity 310 of the lower die 300 when the molds of the upper mold and the intermediate mold and the lower mold are opened, in the upper mold and the intermediate mold and the lower mold. When the mold is closed, its front end is lowered so as not to protrude from the bottom surface of the lower cavity 310 of the lower mold 300.

本實施例的樹脂封裝裝置可進一步包含不用樹脂分離 裝置(省略圖示)。前述不用樹脂分離裝置在將前述基板的兩個表面進行樹脂封裝後，可從完成前述樹脂封裝的基板上分離不用樹脂部分。 The resin encapsulating device of this embodiment may further comprise no resin separation Device (not shown). In the above-described resin-free packaging apparatus, after the resin is encapsulated on both surfaces of the substrate, the resin-free portion can be separated from the substrate on which the resin package is completed.

另外，在本發明中，中間模250的注入口255的位置可設置在任意場所，但是例如圖1(b)中所示，較佳設置在上型腔的中心點附近的正上方的位置。由此，如上所述，前述傳遞成型用樹脂從前述中心點附近向前述上型腔外周大致均勻地流動，從而可抑制氣泡的出現。關於可抑制氣泡的出現的理由，具體如前文所述。並且，和前述樹脂從前述上型腔的一端側向另一端側流動的情況相比，由於流動距離變短，因此可抑制引線的變形。關於由於流動距離變短因此可抑制引線的變形理由，具體如前文前述。圖1(b)中所示的樹脂封裝裝置除了前述注入口位於上型腔253的中心點附近的正上方的位置以外，和圖1(a)中所示的樹脂封裝裝置相同。 Further, in the present invention, the position of the injection port 255 of the intermediate mold 250 may be set at any position, but as shown, for example, in Fig. 1(b), it is preferably disposed at a position directly above the center point of the upper cavity. As a result, as described above, the transfer molding resin flows substantially uniformly from the vicinity of the center point toward the outer periphery of the upper cavity, thereby suppressing the occurrence of bubbles. The reason for suppressing the occurrence of bubbles is specifically as described above. Further, as compared with the case where the resin flows from one end side to the other end side of the upper cavity, the flow distance is shortened, so that deformation of the lead wire can be suppressed. Regarding the reason why the lead wire is deformed because the flow distance is shortened, it is as described above. The resin package device shown in Fig. 1(b) is the same as the resin package device shown in Fig. 1(a) except that the aforementioned injection port is located directly above the center point of the upper cavity 253.

接下來，將使用圖2至圖10對本實施例的樹脂封裝方法進行說明。下文中，對使用本實施例的樹脂封裝裝置的樹脂封裝方法進行說明。更具體地，圖2至圖10的樹脂封裝裝置和圖1(a)的樹脂封裝裝置相同。前述樹脂封裝方法通過上下模成型模組10而進行前述第一樹脂封裝步驟以及前述第二樹脂封裝步驟。 Next, the resin encapsulation method of the present embodiment will be described using FIGS. 2 to 10. Hereinafter, a resin encapsulation method using the resin encapsulating apparatus of the present embodiment will be described. More specifically, the resin package device of FIGS. 2 to 10 is the same as the resin package device of FIG. 1(a). The resin encapsulation method performs the first resin encapsulation step and the second resin encapsulation step by the upper and lower mold molding modules 10.

本實施例的樹脂封裝方法中，在前述第一樹脂封裝步驟之前進行在下文中說明的成型模組升溫步驟、脫模膜供給步驟、基板供給步驟、抵接步驟以及樹脂供給步驟。前 述成型模組升溫步驟、脫模膜供給步驟、前述基板供給步驟以及前述樹脂供給步驟在前述樹脂封裝方法中，是任選的構成要素。 In the resin encapsulation method of the present embodiment, the molding module heating step, the release film supply step, the substrate supply step, the abutting step, and the resin supply step, which will be described later, are performed before the first resin encapsulation step. before The molding module heating step, the release film supply step, the substrate supply step, and the resin supply step are optional constituent elements in the resin encapsulation method.

首先，以加熱裝置(省略圖示)加熱成型模組(上模200以及下模300)，使溫度上升到成型模組(上模200以及下模300)可固化(熔融並固化)樹脂的溫度(成型模組升溫步驟)為止。然後，如圖2中所示，抵接中間模250的上表面和上模200的下表面。然後，向下模300供給脫模膜40(脫模膜供給步驟)。另外，在前述脫模膜供給步驟中，僅向下模300供給脫模膜40，並且如後述的，可向脫模膜40追加供給顆粒樹脂20a。或者，在前述脫模膜供給步驟中，可將載置有顆粒樹脂20a的脫模膜40和顆粒樹脂20a一起供給到下模300中。然後，向上模200供給基板2(基板供給步驟)。然後，將基板2例如以基板夾或吸孔(省略圖示)固定(吸附並固定)在中間模250上。在此，使中間模250在上型腔253的周邊部分和基板2的上表面抵接(抵接步驟)。 First, the molding module (the upper mold 200 and the lower mold 300) is heated by a heating device (not shown) to raise the temperature to a temperature at which the molding module (the upper mold 200 and the lower mold 300) can cure (melt and solidify) the resin. (formation module heating step) up to. Then, as shown in FIG. 2, the upper surface of the intermediate mold 250 and the lower surface of the upper mold 200 are abutted. Then, the release film 40 is supplied to the lower mold 300 (release film supply step). Further, in the release film supply step, only the release film 40 is supplied to the lower mold 300, and as described later, the particulate resin 20a can be additionally supplied to the release film 40. Alternatively, in the above-described release film supply step, the release film 40 on which the particulate resin 20a is placed and the particulate resin 20a may be supplied together into the lower mold 300. Then, the substrate 2 is supplied to the upper mold 200 (substrate supply step). Then, the substrate 2 is fixed (adsorbed and fixed) to the intermediate mold 250 by, for example, a substrate holder or a suction hole (not shown). Here, the intermediate mold 250 is brought into contact with the upper surface of the substrate 2 at the peripheral portion of the upper cavity 253 (abutting step).

而且，如圖2中所示，向下型腔310中供給顆粒樹脂20a(樹脂供給步驟)。如上所述，在前述脫模膜供給步驟中，可將脫模膜40和顆粒樹脂20a一起供給到下模300中。亦即，前述脫模膜供給步驟可兼作前述樹脂供給步驟。並且，在前述樹脂供給步驟中，可以在供給顆粒樹脂20a的同時、或者另外地，向容器305內供給板狀樹脂(省略圖示)。或者，前述板狀樹脂可事先被供給到容器305內。然 後，通過在前述成型模組升溫步驟中以前述加熱裝置(省略圖示)事先加熱下模300，使顆粒樹脂20a熔融，變成如圖3中所示的熔融樹脂(流動性樹脂)20b。進一步，通過升溫的容器305(以及下模300)使容器305內的板狀樹脂(省略圖示)被加熱而熔融，變成如圖3中所示的熔融樹脂(流動性樹脂)30a。另外，前述樹脂供給步驟還可以和前述基板供給步驟同時進行。 Moreover, as shown in FIG. 2, the particulate resin 20a is supplied into the lower cavity 310 (resin supply step). As described above, in the above-described release film supply step, the release film 40 and the particulate resin 20a can be supplied together into the lower mold 300. That is, the release film supply step can also serve as the resin supply step. Further, in the resin supply step, a plate-shaped resin (not shown) may be supplied into the container 305 at the same time as or while the pellet resin 20a is supplied. Alternatively, the aforementioned plate-like resin may be supplied into the container 305 in advance. Of course After that, the lower mold 300 is heated in advance by the heating means (not shown) in the heating step of the molding module, and the pellet resin 20a is melted to become a molten resin (flowable resin) 20b as shown in FIG. Further, the plate-shaped resin (not shown) in the container 305 is heated and melted by the container 305 (and the lower mold 300) which is heated, and becomes molten resin (flowable resin) 30a as shown in FIG. Further, the resin supply step may be performed simultaneously with the substrate supply step.

然後，如圖4至圖5中所示，進行前述第一樹脂封裝步驟。在本實施例中，通過前述第一樹脂封裝步驟，將基板2的下表面以壓縮成型進行樹脂封裝，作為以壓縮成型進行樹脂封裝的方法中的一個實例，具體進行在下文中說明的中間模閉合步驟以及下型腔樹脂填充步驟。 Then, as shown in FIGS. 4 to 5, the aforementioned first resin encapsulation step is performed. In the present embodiment, the lower surface of the substrate 2 is resin-encapsulated by compression molding by the aforementioned first resin encapsulation step, as an example of a method of performing resin encapsulation by compression molding, specifically performing the intermediate mold closure explained hereinafter. The step and the lower cavity resin filling step.

首先，如圖4中所示，下模300通過驅動機構(省略圖示)被提升並進行中間模的閉合(中間模閉合步驟)。在此狀態下，上模外氣遮斷部件203以及下模外氣遮斷部件302經由O形環204B接合，模具內成為外氣被遮斷的狀態。然後，開始從上模200的孔205向如圖4中所示的箭頭方向X的吸引，使模具內減壓。此時，為了充分減壓，可暫時停止下模300。 First, as shown in FIG. 4, the lower mold 300 is lifted by a drive mechanism (not shown) and the intermediate mold is closed (intermediate mold closing step). In this state, the upper-mold external air shutoff member 203 and the lower-mold outer air shutoff member 302 are joined via the O-ring 204B, and the inside of the mold is in a state in which the outside air is blocked. Then, suction from the hole 205 of the upper mold 200 to the arrow direction X as shown in Fig. 4 is started to decompress the inside of the mold. At this time, in order to sufficiently reduce the pressure, the lower mold 300 can be temporarily stopped.

然後，如圖5中所示，下模300通過驅動機構(省略圖示)被提升到倒裝晶片4以及球狀端子5浸漬在下型腔310內的流動性樹脂20b中的位置為止，在該位置上暫時停止下模300(下型腔樹脂填充步驟)。另外，熔融樹脂(流動性樹脂)20b為低黏度，即使從下模側對基板2施加樹脂壓使 基板暫時產生彎曲，但通過之後在上型腔253中填充熔融樹脂(流動性樹脂)30a，從上模側對基板施加樹脂壓，從而可減低基板的彎曲，在基板的彎曲變得不成為問題時，在此時間點上可提升下模300到對下型腔施加樹脂壓的位置為止。 Then, as shown in FIG. 5, the lower mold 300 is lifted to a position where the flip chip 4 and the spherical terminal 5 are immersed in the fluid resin 20b in the lower cavity 310 by a driving mechanism (not shown), where The lower mold 300 is temporarily stopped at the position (the lower cavity resin filling step). Further, the molten resin (flowable resin) 20b has a low viscosity, and even if a resin pressure is applied to the substrate 2 from the lower mold side, After the substrate is temporarily bent, the molten resin (fluid resin) 30a is filled in the upper cavity 253, and the resin pressure is applied to the substrate from the upper mold side, whereby the bending of the substrate can be reduced, and the bending of the substrate does not become a problem. At this point of time, the lower die 300 can be raised to a position where the resin pressure is applied to the lower cavity.

然後，如圖6至圖7中所示，進行前述第二樹脂封裝步驟。在本實施例中，作為通過前述第二樹脂封裝步驟將基板2的上表面以傳遞成型進行樹脂封裝的前述以傳遞成型進行樹脂封裝的方法的一個實例，具體進行在下文中說明的上型腔樹脂填充步驟以及模具打開步驟。 Then, as shown in FIGS. 6 to 7, the aforementioned second resin encapsulation step is performed. In the present embodiment, as an example of the above-described method of performing resin encapsulation by transfer molding by transfer molding the upper surface of the substrate 2 by the aforementioned second resin encapsulating step, the upper cavity resin described below is specifically performed. The filling step and the mold opening step.

首先，如圖6中所示，例如通過柱塞驅動機構(省略圖示)將柱塞306提升到在上型腔253中填充流動性樹脂30a的位置為止，在該位置上暫時停止柱塞306(上型腔樹脂填充步驟)。在前述上型腔樹脂填充步驟中，通過使傳遞成型用流動性樹脂30a向樹脂流路254內流動，再注入到上型腔253內，將基板2的上表面以傳遞成型進行樹脂封裝。在前述上型腔樹脂填充步驟中，如圖7中所示，進一步同時提升下模300以及柱塞306，可通過下型腔310內的流動性樹脂20b對基板2的下表面施加樹脂壓。並且，在已經由下型腔310內的流動性樹脂20b對基板2的下表面施加樹脂壓的情況下，可不提升下模300而僅提升柱塞306。像這樣基板2的下表面由壓縮成型用的流動性樹脂20b支撐著，從而即使從基板的上表面側向下表面側施加樹脂壓，也可抑制基板的彎曲。 First, as shown in FIG. 6, the plunger 306 is lifted to a position where the fluid resin 30a is filled in the upper cavity 253, for example, by a plunger driving mechanism (not shown), at which the plunger 306 is temporarily stopped. (Upper cavity resin filling step). In the upper cavity resin filling step, the transfer molding fluid resin 30a flows into the resin flow path 254, is injected into the upper cavity 253, and the upper surface of the substrate 2 is resin-molded by transfer molding. In the aforementioned upper cavity resin filling step, as shown in FIG. 7, the lower mold 300 and the plunger 306 are further lifted at the same time, and the resin pressure can be applied to the lower surface of the substrate 2 through the fluid resin 20b in the lower cavity 310. Further, in the case where the resin pressure has been applied to the lower surface of the substrate 2 by the fluid resin 20b in the lower cavity 310, the plunger 306 can be lifted without lifting the lower mold 300. The lower surface of the substrate 2 is supported by the fluid resin 20b for compression molding, and the bending of the substrate can be suppressed even if the resin pressure is applied from the upper surface side to the lower surface side of the substrate.

然後，如圖8中所示，當流動性樹脂20b以及流動性樹脂30a固化，並形成封裝樹脂20以及封裝樹脂30後，例如可下降下模300和中間模250而打開模具(模具打開步驟)。這種情況下，下模300和中間模250可由夾子(省略圖示)等固定。 Then, as shown in FIG. 8, after the fluid resin 20b and the fluid resin 30a are cured, and the encapsulating resin 20 and the encapsulating resin 30 are formed, for example, the lower mold 300 and the intermediate mold 250 can be lowered to open the mold (mold opening step). . In this case, the lower mold 300 and the intermediate mold 250 may be fixed by a clip (not shown) or the like.

像這樣，本實施例的樹脂封裝方法由於通過壓縮成型用成型模組先將基板2的下表面以壓縮成型進行樹脂封裝，因此在將上表面以傳遞成型進行樹脂封裝時，基板2的下表面由壓縮成型用的流動性樹脂20b支撐，因此即使從上表面側對基板施加樹脂壓也可以抑制基板2的彎曲。因此，在本實施例中，可兼顧基板2的彎曲抑制和基板2的兩個表面的成型。並且，由於可通過使用一個成型模組將基板2的兩個表面進行一併成型，因而可提高生產效率，也簡化了結構，因此可降低費用。並且，雖然在本實施例中並未圖示，但通過將上表面以傳遞成型進行樹脂封裝，可以設置在基板2的上表面的端子從封裝樹脂中露出的狀態進行成型。對此在實施例2(圖11至圖19)中進行說明。 As described above, since the resin encapsulation method of the present embodiment first encapsulates the lower surface of the substrate 2 by compression molding by the molding module for compression molding, when the upper surface is resin-molded by transfer molding, the lower surface of the substrate 2 is used. Since it is supported by the fluid resin 20b for compression molding, bending of the substrate 2 can be suppressed even if a resin pressure is applied to the substrate from the upper surface side. Therefore, in the present embodiment, the suppression of the bending of the substrate 2 and the molding of both surfaces of the substrate 2 can be achieved. Further, since the two surfaces of the substrate 2 can be integrally molded by using one molding module, the production efficiency can be improved and the structure can be simplified, so that the cost can be reduced. Further, although not illustrated in the present embodiment, the resin is encapsulated by transfer molding on the upper surface, and the terminal provided on the upper surface of the substrate 2 can be molded in a state of being exposed from the sealing resin. This is explained in the second embodiment (Figs. 11 to 19).

另外，本實施例的樹脂封裝方法中，在前述第二樹脂封裝步驟中，中間模250的上表面和上模200的下表面抵接，形成用於向中間模250的上型腔253供給樹脂的樹脂流路254。而且，成為通過該樹脂流路254，傳遞成型用的流動性樹脂30a從注入口255注入到中間模的上型腔253的結構。通過這樣形成樹脂流路254，可以不在下模300 和脫模膜40的邊界(間隙)部分上設置樹脂流路。因此，如圖2至圖7中所示，即使在下模300上貼附脫模膜40進行壓縮成型，也可防止傳遞成型用的流動性樹脂30a進入下模和脫模膜40的邊界(間隙)。 Further, in the resin encapsulation method of the present embodiment, in the second resin encapsulating step, the upper surface of the intermediate mold 250 abuts against the lower surface of the upper mold 200 to form a resin for supplying the upper cavity 253 of the intermediate mold 250. Resin flow path 254. Further, the resin flow path 254 is configured such that the fluid resin 30a for transfer molding is injected from the injection port 255 into the upper cavity 253 of the intermediate mold. By forming the resin flow path 254 in this way, the lower mold 300 can be omitted. A resin flow path is provided on a boundary (gap) portion of the release film 40. Therefore, as shown in FIGS. 2 to 7, even if the release film 40 is attached to the lower mold 300 for compression molding, the flowable resin 30a for transfer molding can be prevented from entering the boundary between the lower mold and the release film 40 (gap ).

在圖7中所示的不用樹脂部31A例如貼附在上模200的情況下，可通過設置在上模200的起模桿(省略圖示)使不用樹脂部31A從上模200脫模。並且，在不用樹脂部31A例如貼附在中間模250的情況下，可通過上升起模桿使不用樹脂部31A從中間模250脫模。 When the non-resin portion 31A shown in FIG. 7 is attached to the upper mold 200, for example, the unused resin portion 31A can be released from the upper mold 200 by a ejector rod (not shown) provided in the upper mold 200. Further, when the resin portion 31A is not attached to the intermediate mold 250, for example, the unused resin portion 31A can be released from the intermediate mold 250 by raising the ejector pin.

然後，如圖8中所示，使裝載機80進入前述打開的模具內，裝載機80回收不用樹脂部31A。例如裝載機80可通過真空裝置、刷等清潔上模200和中間模250。之後，可從模具內退出裝載機80。另外，裝載機80也可兼作搬運基板2、流動性樹脂20b以及流動性樹脂30a的搬運裝置，還可兼作搬出不用樹脂部31A的不用樹脂搬出裝置。 Then, as shown in Fig. 8, the loader 80 is brought into the previously opened mold, and the loader 80 recovers the unused resin portion 31A. For example, the loader 80 can clean the upper mold 200 and the intermediate mold 250 by a vacuum device, a brush, or the like. Thereafter, the loader 80 can be withdrawn from the mold. In addition, the loader 80 can also serve as a conveyance device for transporting the substrate 2, the fluid resin 20b, and the fluid resin 30a, and can also serve as a non-removable resin carry-out device for carrying out the resin-free portion 31A.

然後，如圖9中所示，例如通過驅動機構(省略圖示)提升下模300而再次閉合模具。並且，解除下模300和中間模250之間的固定，並固定上模200和中間模250。這種情況下，上模200和中間模250可例如通過夾子等固定。 Then, as shown in FIG. 9, the mold is closed again by, for example, lifting the lower mold 300 by a driving mechanism (not shown). Also, the fixing between the lower mold 300 and the intermediate mold 250 is released, and the upper mold 200 and the intermediate mold 250 are fixed. In this case, the upper mold 200 and the intermediate mold 250 may be fixed by, for example, a clip or the like.

然後，如圖10中所示，例如可下降下模300打開模具。這種情況下，可通過設置在上模200上的起模桿(省略圖示)頂出而脫模，從而不讓完成樹脂封裝(完成成型)的基板2貼在中間模250上。並且，使裝載機80進入模具內，裝載機80也可回收完成樹脂封裝(完成成型)的基板2和脫模膜 40。這種情況下，可一併回收，也可分別回收完成樹脂封裝(完成成型)的基板2以及脫模膜40。之後，裝載機80可通過真空裝置、刷等清潔下模300和中間模250。之後，從模具內退出裝載機80。 Then, as shown in FIG. 10, for example, the lower mold 300 can be lowered to open the mold. In this case, the mold can be released by ejector pins (not shown) provided on the upper mold 200, so that the substrate 2 on which the resin package (finished molding) is completed is not attached to the intermediate mold 250. Further, the loader 80 is brought into the mold, and the loader 80 can also recover the substrate 2 and the release film which are completed by resin encapsulation (finishing). 40. In this case, the substrate 2 and the release film 40 which are completed by resin encapsulation (finishing) may be separately recovered. Thereafter, the loader 80 can clean the lower mold 300 and the intermediate mold 250 by a vacuum device, a brush, or the like. Thereafter, the loader 80 is withdrawn from the mold.

在本實施例的樹脂封裝方法中，進一步，在從成型模組一併回收完成樹脂封裝(完成成型)的基板2以及不用樹脂部31A後，可通過前述不用樹脂分離裝置(省略圖示)分離完成樹脂封裝(完成成型)的基板2以及不用樹脂部31A。另外，在分離完成樹脂封裝(完成成型)的基板2以及不用樹脂部31A後，可以從上下模成型模組10一併或分別回收完成樹脂封裝(完成成型)的基板2以及不用樹脂部31A。 In the resin encapsulation method of the present embodiment, after the substrate 2 and the resin portion 31A which have been subjected to resin encapsulation (complete molding) are collectively recovered from the molding module, the resin separation device (not shown) can be separated by the aforementioned resin separation device (not shown). The substrate 2 for resin encapsulation (finishing) and the resin portion 31A are not used. In addition, after the substrate 2 for resin encapsulation (finishing) and the resin portion 31A are not separated, the substrate 2 and the resin-free portion 31A which are completed by resin encapsulation (complete molding) may be collectively or separately recovered from the upper and lower mold forming modules 10.

並且，在本實施例中，以壓縮成型先填充成型模組的兩個型腔中的下型腔。由此，如上所述，可兼顧基板的彎曲(變形)抑制和基板的兩個表面的成型。其理由為，壓縮成型可調整向型腔供給的樹脂(壓縮成型用樹脂)的樹脂量。例如，在調整樹脂體積的情況下，如果知道樹脂的比重，就可通過測量供給樹脂的重量進行調整。具體地，例如將壓縮成型用樹脂量設定成和基板為平坦狀態時的下型腔體積大致相同，並向下型腔供給壓縮成型用樹脂並填充。這樣，至少可抑制由於樹脂量的過於不足而引起的基板的鼓起或凹陷。之後，即使向上型腔填充樹脂，從基板的另一個表面側施加樹脂壓，由於和下型腔大致相同體積的壓縮成型用樹脂從基板的下表面側進行支撐，因此也可 在基板平坦的狀態下完成成型。 Moreover, in the present embodiment, the lower cavity in the two cavities of the molding module is first filled by compression molding. Thereby, as described above, both the bending (deformation) suppression of the substrate and the molding of both surfaces of the substrate can be achieved. The reason for this is that the amount of resin of the resin (compression molding resin) supplied to the cavity can be adjusted by compression molding. For example, in the case of adjusting the volume of the resin, if the specific gravity of the resin is known, it can be adjusted by measuring the weight of the supplied resin. Specifically, for example, the amount of the resin for compression molding is set to be substantially the same as the volume of the lower cavity when the substrate is in a flat state, and the resin for compression molding is supplied to the lower cavity and filled. Thus, at least the swelling or depression of the substrate due to the excessive shortage of the amount of the resin can be suppressed. After that, even if the resin is filled into the upper cavity, the resin pressure is applied from the other surface side of the substrate, and since the compression molding resin having substantially the same volume as the lower cavity is supported from the lower surface side of the substrate, it is also possible. The molding is completed in a state where the substrate is flat.

另一方面，例如在以傳遞成型先填充一方的型腔的情況下，通過柱塞的上下位置而改變供給到前述一方的型腔的樹脂量。因此，會有由於樹脂量過於不足而引起基板鼓起或凹陷的可能性。所以，較佳先以壓縮成型填充一方的型腔。 On the other hand, for example, when one cavity is first filled by transfer molding, the amount of resin supplied to the one cavity is changed by the vertical position of the plunger. Therefore, there is a possibility that the substrate is swollen or dented due to an insufficient amount of the resin. Therefore, it is preferred to first fill one of the cavities by compression molding.

此外，在以壓縮成型先填充下型腔的情況下，如果熔融狀態的壓縮成型用的樹脂的黏度高，向下型腔填充該樹脂時會出現強抵抗力作用在基板上的情況。在這種情況下，樹脂未填充整個下型腔，未填充部分的體積使基板鼓起。在這種情況下，可通過在上型腔中填充樹脂，從基板的上表面側對基板施加樹脂壓，從而使鼓起的基板平坦化，並使整個下型腔被樹脂填充。 Further, in the case where the lower cavity is first filled by compression molding, if the viscosity of the resin for compression molding in a molten state is high, a strong resistance may be exerted on the substrate when the resin is filled into the lower cavity. In this case, the resin does not fill the entire lower cavity, and the volume of the unfilled portion causes the substrate to bulge. In this case, the resin can be applied to the substrate from the upper surface side of the substrate by filling the resin in the upper cavity, thereby flattening the bulged substrate and filling the entire lower cavity with the resin.

[實施例2] [Embodiment 2]

其次，對本發明的另一實施例，即對本發明的樹脂封裝裝置以及本發明的樹脂封裝方法的另一實例進行說明。本實施例中使用的基板除了平坦端子6的數量不同，以及平坦端子6和倒裝晶片4設置在相同側以外，和圖20(b)中所示的基板2大致相同。另外，平坦端子6的數量在本實施例(圖11至圖19)中為2個，在圖20(b)中為3個，這些數僅僅只是示例，絲毫不限制本發明。晶片1、引線3、倒裝晶片4以及球狀端子5(實施例1以及圖20(a))也是一樣的。 Next, another embodiment of the present invention, that is, another example of the resin encapsulating device of the present invention and the resin encapsulating method of the present invention will be described. The substrate used in the present embodiment is substantially the same as the substrate 2 shown in FIG. 20(b) except that the number of the flat terminals 6 is different, and the flat terminals 6 and the flip chip 4 are disposed on the same side. Further, the number of the flat terminals 6 is two in the present embodiment (Figs. 11 to 19), and three in Fig. 20(b), and these numbers are merely examples, and the present invention is not limited at all. The wafer 1, the lead 3, the flip chip 4, and the ball terminal 5 (the embodiment 1 and FIG. 20(a)) are also the same.

本實施例的樹脂封裝裝置包含：具有壓縮成型用的下 模的第一成型模組、以及具有傳遞成型用的上模以及中間模的第二成型模組兩個成型模組，並可通過前述第一成型模組的下模將前述基板的下表面以壓縮成型進行樹脂封裝，可通過前述第二成型模組的上模以及中間模將前述基板的上表面以傳遞成型進行樹脂封裝。進一步，本實施例的樹脂封裝裝置可包含例如基板搬運機構。 The resin packaging device of the embodiment includes: a lower portion for compression molding a first molding module of the mold, and two molding modules having a second molding module for transferring the upper mold and the intermediate mold, and the lower surface of the substrate is formed by the lower mold of the first molding module The resin is encapsulated by compression molding, and the upper surface of the substrate is transferred and molded by the upper mold and the intermediate mold of the second molding module. Further, the resin package device of the present embodiment may include, for example, a substrate transfer mechanism.

圖11為說明本實施例的樹脂封裝裝置的第一成型模組500以及通過其進行樹脂封裝的基板2的截面圖。如圖11中所示，第一成型模組500包含：基板保持部件(上模)600和與基板保持部件(上模)600相對配置的下模700。 Fig. 11 is a cross-sectional view showing the first molding module 500 of the resin package device of the present embodiment and the substrate 2 through which the resin is packaged. As shown in FIG. 11, the first molding module 500 includes a substrate holding member (upper mold) 600 and a lower mold 700 disposed opposite to the substrate holding member (upper mold) 600.

基板保持部件(上模)600由例如和壓縮機、壓縮空氣罐等高壓氣體源650連接的連通部件610、型腔上表面以及框部件620、將安裝在基板2上的平坦端子6露出的凸部件630、複數個彈性部件602以及板部件640組成。型腔上表面以及框部件620具有型腔601。連通部件610和型腔上表面以及框部件620例如通過複數個彈性部件602，安裝設置成向板部件640垂下的狀態。前述連通部件610上設置有例如用於通過高壓氣體源650將壓縮空氣壓送至型腔601中的空氣通道(空氣道)603。型腔上表面以及框部件620例如為具有型腔601的上型腔上表面部件和將上型腔上表面部件包圍的框部件被一體化的結構。在型腔601上表面上，設置有複數個用於使連通部件610的空氣通道603和型腔601連通的空氣孔604。 The substrate holding member (upper mold) 600 is, for example, a communication member 610 connected to a high-pressure gas source 650 such as a compressor or a compressed air tank, a cavity upper surface, and a frame member 620, and a convex portion that exposes the flat terminal 6 mounted on the substrate 2 The component 630, the plurality of elastic members 602, and the plate member 640 are composed. The upper surface of the cavity and the frame member 620 have a cavity 601. The communication member 610 and the upper surface of the cavity and the frame member 620 are mounted in a state of being suspended from the plate member 640 by, for example, a plurality of elastic members 602. The communication member 610 is provided with, for example, an air passage (air passage) 603 for pumping compressed air into the cavity 601 by the high-pressure gas source 650. The upper surface of the cavity and the frame member 620 are, for example, a structure in which an upper cavity upper surface member having a cavity 601 and a frame member surrounding the upper cavity upper surface member are integrated. On the upper surface of the cavity 601, a plurality of air holes 604 for communicating the air passage 603 of the communication member 610 and the cavity 601 are provided.

在本實施例中，凸部件630較佳設置在例如和平坦端 子6的上表面接觸的位置等即使按壓基板2也沒關係的部分上，以不讓基板2由於用第一成型模組500進行樹脂封裝而彎曲。 In this embodiment, the male member 630 is preferably disposed, for example, at a flat end. The position at which the upper surface of the sub-6 is in contact with each other, etc., does not allow the substrate 2 to be bent by resin encapsulation by the first molding module 500, even if the substrate 2 is pressed.

下模700為壓縮成型用的成型模組，其包含：例如下型腔底面部件710、下型腔框部件720、複數個彈性部件702以及下模基塊730。下模700在由下型腔底面部件710以及下型腔框部件720包圍的位置構成下模的型腔(下型腔)701。下型腔底面部件710安裝設置成例如載置在下模基塊730上的狀態。下型腔框部件720設置成例如在隔著複數個彈性部件702載置在下模基塊730上的狀態下包圍下型腔底面部件710。並且，通過下型腔底面部件710和下型腔框部件720的間隙形成滑孔711。如下文中所述，基於通過滑孔711的吸引，例如可吸附脫模膜等。在下模700上設置有例如用於加熱下模700的加熱裝置(省略圖示)。通過以前述加熱裝置加熱下模700，而加熱固化(熔融並固化)下型腔701內的樹脂。下模700例如可通過設置在第一成型模組500上的驅動機構(省略圖示)，在上下方向上移動。並且，關於下模700的下模外氣遮斷部件，為了簡化而省略圖示以及詳細說明。 The lower mold 700 is a molding module for compression molding, and includes, for example, a lower cavity bottom surface member 710, a lower cavity frame member 720, a plurality of elastic members 702, and a lower mold base block 730. The lower mold 700 constitutes a cavity (lower cavity) 701 of the lower mold at a position surrounded by the lower cavity bottom surface member 710 and the lower cavity frame member 720. The lower cavity bottom surface member 710 is mounted to be placed, for example, on the lower mold base block 730. The lower cavity frame member 720 is disposed to surround the lower cavity bottom surface member 710, for example, in a state in which the plurality of elastic members 702 are placed on the lower mold base 730. Further, the sliding hole 711 is formed by the gap between the lower cavity bottom surface member 710 and the lower cavity frame member 720. As described later, based on the attraction through the slide hole 711, for example, a release film or the like can be adsorbed. A heating device (not shown) for heating the lower mold 700 is provided on the lower mold 700, for example. The resin in the lower cavity 701 is heat-cured (melted and solidified) by heating the lower mold 700 with the aforementioned heating means. The lower mold 700 can be moved in the vertical direction by, for example, a drive mechanism (not shown) provided on the first molding die set 500. Further, the lower mold outer air shutoff member of the lower mold 700 is omitted from illustration and detailed description for the sake of simplicity.

圖12為說明本實施例的樹脂封裝裝置的第二成型模組800以及通過其進行樹脂封裝的基板2的截面圖。如圖12中所示，第二成型模組800包含：例如上模900、中間模950以及與上模900相對配置的基板保持部件(下模)1000。 Fig. 12 is a cross-sectional view showing the second molding module 800 of the resin package device of the present embodiment and the substrate 2 through which the resin is packaged. As shown in FIG. 12, the second molding module 800 includes, for example, an upper mold 900, an intermediate mold 950, and a substrate holding member (lower mold) 1000 disposed opposite to the upper mold 900.

上模900包含上模基塊210、上模主塊220、上模中心塊230以及複數個彈性部件240，除了上模主塊220通過複數個彈性部件240向上模基塊210垂下以外，和實施例1的圖1(a)的上模200相同。另外，關於上模900的上模外氣遮斷部件，為了簡化而省略圖示以及詳細說明。 The upper mold 900 includes an upper mold base block 210, an upper mold main block 220, an upper mold center block 230, and a plurality of elastic members 240, except that the upper mold main block 220 is suspended by the plurality of elastic members 240 to the upper mold base block 210, and is implemented. The upper mold 200 of Fig. 1(a) of the first example is the same. In addition, the upper mold outer air shutoff member of the upper mold 900 is omitted from illustration and detailed description for the sake of simplicity.

中間模950除了在上型腔面的一部分上安裝有凸部件930以外，和實施例1的圖1(a)的中間模250相同。 The intermediate mold 950 is the same as the intermediate mold 250 of Fig. 1(a) of the first embodiment except that the convex member 930 is attached to a part of the upper cavity surface.

基板保持部件(下模)1000為載置通過第一成型模組500而上表面被樹脂封裝的基板2的板，例如由型腔下表面部件1010、將型腔下表面部件1010包圍的型腔框部件1020、複數個彈性部件1030以及基礎部件1040形成。基板保持部件(下模)1000通過型腔下表面部件1010以及型腔框部件1020構成型型腔1001。型腔下表面部件1010以及型腔框部件1020安裝設置成隔著複數個彈性部件1030載置在基礎部件1040上的狀態。基板2如圖12中所示，樹脂封裝區域被容納在型腔1001中而載置在基板保持部件(下模)1000上。在第二成型模組800上設置有例如用於加熱容器960的加熱裝置(省略圖示)。通過前述加熱裝置(省略圖示)加熱容器960，從而加熱固化(熔融並固化)供給(設置)到容器960中的樹脂。基板保持部件(下模)1000例如可通過設置在第二成型模組800上的基板保持部件驅動機構(省略圖示)，在上下方向上移動。 The substrate holding member (lower mold) 1000 is a plate on which the substrate 2 whose upper surface is resin-sealed by the first molding module 500 is placed, for example, a cavity lower surface member 1010 and a cavity surrounding the cavity lower surface member 1010. A frame member 1020, a plurality of elastic members 1030, and a base member 1040 are formed. The substrate holding member (lower mold) 1000 constitutes the cavity 1001 through the cavity lower surface member 1010 and the cavity frame member 1020. The cavity lower surface member 1010 and the cavity frame member 1020 are mounted in a state in which the plurality of elastic members 1030 are placed on the base member 1040. As shown in FIG. 12, the substrate 2 is housed in the cavity 1001 and placed on the substrate holding member (lower mold) 1000. A heating device (not shown) for heating the container 960 is provided on the second molding module 800, for example. The container 960 is heated by the aforementioned heating means (not shown) to heat-cure (melt and solidify) the resin supplied (set) into the container 960. The substrate holding member (lower mold) 1000 can be moved in the vertical direction by, for example, a substrate holding member driving mechanism (not shown) provided on the second molding module 800.

另外，在本實施例的第一成型模組500(圖11)中，代替向型腔601中供給壓縮空氣的結構，可將型腔601以凝 膠狀固體填滿。通過以前述凝膠狀固體按壓基板2，可抑制基板2的彎曲。 In addition, in the first molding module 500 (FIG. 11) of the present embodiment, instead of supplying the compressed air to the cavity 601, the cavity 601 can be condensed. The gelatinous solid is filled. By pressing the substrate 2 with the gelled solid as described above, the bending of the substrate 2 can be suppressed.

其次，將使用圖13至圖19對本實施例的樹脂封裝方法進行說明。下文中，對使用本實施例的樹脂封裝裝置的樹脂封裝方法進行說明，但本實施例的樹脂封裝方法不限於使用前述樹脂封裝裝置。 Next, the resin encapsulation method of the present embodiment will be described using Figs. 13 to 19 . Hereinafter, a resin encapsulation method using the resin package device of the present embodiment will be described, but the resin encapsulation method of the present embodiment is not limited to the use of the aforementioned resin encapsulation device.

在本實施例的樹脂封裝方法中，在前述第一樹脂封裝步驟之前進行在下文中說明的基板供給步驟以及樹脂供給步驟。各步驟在前述樹脂封裝方法中，為任選的構成要素。 In the resin encapsulation method of the present embodiment, the substrate supply step and the resin supply step which will be described later are performed before the aforementioned first resin encapsulation step. Each step is an optional component in the resin encapsulating method described above.

首先，如圖13中所示，通過基板搬運機構1100向第一成型模組500的基板保持部件(上模)600供給基板2，並通過基板夾和吸孔(省略圖示)固定基板2(基板供給步驟)。在基板供給步驟後，退出基板搬運機構1100。 First, as shown in FIG. 13, the substrate 2 is supplied to the substrate holding member (upper mold) 600 of the first molding module 500 by the substrate transfer mechanism 1100, and the substrate 2 is fixed by the substrate holder and the suction holes (not shown) ( Substrate supply step). After the substrate supply step, the substrate transport mechanism 1100 is withdrawn.

然後，在基板保持部件(上模)600和下模700之間進入樹脂搬運機構(省略圖示)。通過前述樹脂搬運機構，如圖14中所示，將脫模膜130、載置在脫模膜130上的樹脂框部件140以及供給到樹脂框部件140的內部貫通孔140A的顆粒樹脂150a搬運到下模700中。並且，通過從下型腔底面部件710和下型腔框部件720的間隙處的滑孔711向圖14中所示的箭頭方向Y吸引而吸附脫模膜130，從而向下型腔701中供給脫模膜130和顆粒樹脂150a(樹脂供給步驟)。之後，退出前述樹脂搬運機構以及樹脂框部件140。 Then, a resin transfer mechanism (not shown) is entered between the substrate holding member (upper mold) 600 and the lower mold 700. As shown in FIG. 14, the release film 130, the resin frame member 140 placed on the release film 130, and the particulate resin 150a supplied to the internal through-hole 140A of the resin frame member 140 are conveyed to the resin transfer mechanism to the resin transfer mechanism. In the lower mold 700. Further, the release film 130 is adsorbed by the suction hole 711 at the gap between the lower cavity bottom surface member 710 and the lower cavity frame member 720 toward the arrow direction Y shown in FIG. 14 to be supplied to the lower cavity 701. The release film 130 and the particulate resin 150a (resin supply step). Thereafter, the resin conveying mechanism and the resin frame member 140 are withdrawn.

然後，如圖15至圖16中所示，進行本實施例的前述第一樹脂封裝步驟。在本實施例中，通過前述第一樹脂封 裝步驟，使用具有下模700的前述第一成型模組500，將基板2的下表面以壓縮成型進行樹脂封裝。 Then, as shown in FIGS. 15 to 16, the aforementioned first resin encapsulation step of the present embodiment is performed. In the embodiment, the first resin seal is passed through In the mounting step, the lower surface of the substrate 2 is resin-molded by compression molding using the first molding module 500 having the lower mold 700.

具體地，首先，如圖15中所示，通過以加熱裝置(省略圖示)升溫的下模700，顆粒樹脂150a被加熱並熔融成為熔融樹脂(流動性樹脂)150b。然後，如圖15中所示，下模700通過驅動機構(省略圖示)提升，在填充在下型腔701內的熔融樹脂(流動性樹脂)150b中浸漬安裝在基板2下表面的晶片1以及引線3。與此同時，或在稍後的時間點，高壓氣體源650在圖15的箭頭方向上，向基板保持部件(上模)600供給和成型壓相同壓力的空氣。由此，既可抑制基板的彎曲，又可將基板2的下表面進行樹脂封裝。 Specifically, first, as shown in FIG. 15, the pellet resin 150a is heated and melted into a molten resin (flowable resin) 150b by the lower mold 700 heated by a heating device (not shown). Then, as shown in FIG. 15, the lower mold 700 is lifted by a driving mechanism (not shown), and the wafer 1 mounted on the lower surface of the substrate 2 is immersed in the molten resin (flowable resin) 150b filled in the lower cavity 701, and Lead 3. At the same time, or at a later point in time, the high-pressure gas source 650 supplies and shapes air of the same pressure to the substrate holding member (upper mold) 600 in the direction of the arrow of FIG. Thereby, the bending of the substrate can be suppressed, and the lower surface of the substrate 2 can be resin-sealed.

然後，如圖16中所示，在熔融樹脂(流動性樹脂)150b固化，形成封裝樹脂150後，通過驅動機構(省略圖示)下降下模700，並打開模具(模具打開步驟)。在打開模具時，例如如圖16中所示，也可解除通過滑孔711的吸引。然後，在打開模具後，通過基板搬運機構1100向第二成型模組800搬運下表面已成型的基板2(第二模搬運步驟)。 Then, as shown in FIG. 16, after the molten resin (flowable resin) 150b is solidified to form the encapsulating resin 150, the lower mold 700 is lowered by a driving mechanism (not shown), and the mold is opened (mold opening step). When the mold is opened, for example, as shown in FIG. 16, the suction through the slide hole 711 can also be released. Then, after the mold is opened, the substrate 2 on which the lower surface has been formed is transported to the second molding module 800 by the substrate conveyance mechanism 1100 (second mold conveyance step).

然後，通過圖16中所示的基板搬運機構1100，如圖17中所示，向第二成型模組800的基板保持部件(下模)1000搬運基板2。然後，抵接第二成型模組800的中間模950的上表面和上模900的下表面。此步驟可在通過基板搬運機構1100向基板2的基板保持部件(下模)1000搬運之前進行。然後，通過樹脂搬運機構(省略圖示)向容器供給板狀樹脂，進一步通過以加熱裝置(省略圖示)升溫的容 器(以及下模1000)加熱而熔融板狀樹脂，成為如圖17中所示的熔融樹脂(流動性樹脂)971a(樹脂供給步驟)。基板搬運機構1100可進行前述板狀樹脂的供給。 Then, the substrate 2 is transported to the substrate holding member (lower mold) 1000 of the second molding module 800 as shown in FIG. 17 by the substrate conveyance mechanism 1100 shown in FIG. Then, the upper surface of the intermediate mold 950 of the second molding module 800 and the lower surface of the upper mold 900 are abutted. This step can be performed before the substrate holding member (lower mold) 1000 of the substrate 2 is transported by the substrate transport mechanism 1100. Then, the plate-shaped resin is supplied to the container by a resin transfer mechanism (not shown), and further heated by a heating device (not shown) The heater (and the lower mold 1000) is heated to melt the plate-like resin, and becomes a molten resin (flowable resin) 971a (resin supply step) as shown in FIG. The substrate transport mechanism 1100 can supply the plate-shaped resin.

然後，如圖18中所示，通過進行上模900以及中間模950和基板保持部件(下模)1000的模具閉合，使中間模950在上型腔的周邊部分和基板2的上表面抵接(抵接步驟)。此時，如圖18中所示，使安裝在中間模950的上型腔面上的凸部件930的下表面抵接在基板2上表面安裝的平坦端子6的上表面並按壓。 Then, as shown in FIG. 18, by performing the mold closing of the upper mold 900 and the intermediate mold 950 and the substrate holding member (lower mold) 1000, the intermediate mold 950 is brought into contact with the upper surface of the substrate 2 at the peripheral portion of the upper cavity. (Abutment step). At this time, as shown in FIG. 18, the lower surface of the convex member 930 mounted on the upper cavity surface of the intermediate mold 950 is brought into contact with the upper surface of the flat terminal 6 mounted on the upper surface of the substrate 2 and pressed.

進一步，如圖18至圖19中所示，進行本實施例的前述第二樹脂封裝步驟。亦即，通過第二成型模組800將基板2的上表面以傳遞成型進行樹脂封裝。具體地，首先，如圖18中所示，將基板保持部件(下模)1000通過基板保持部件驅動機構(省略圖示)提升並夾住基板2。然後，如圖19中所示，柱塞970通過柱塞驅動機構(省略圖示)上升，在上型腔901中填充流動性樹脂971a，並進一步使流動性樹脂971a固化，成為如圖19所示的封裝樹脂971。這樣，將基板2的上表面以封裝樹脂971進行樹脂封裝並成型。此時，如上所述，由於平坦端子6的上表面和凸部件930的下表面抵接並被按壓，因此不被熔融樹脂971a浸漬。因此，可以以平坦端子6的上表面從封裝樹脂971露出的狀態進行樹脂封裝。 Further, as shown in FIGS. 18 to 19, the aforementioned second resin encapsulation step of the present embodiment is performed. That is, the upper surface of the substrate 2 is resin-molded by transfer molding by the second molding module 800. Specifically, first, as shown in FIG. 18, the substrate holding member (lower mold) 1000 is lifted and sandwiched by the substrate holding member driving mechanism (not shown). Then, as shown in FIG. 19, the plunger 970 is raised by a plunger driving mechanism (not shown), the fluidity resin 971a is filled in the upper cavity 901, and the fluid resin 971a is further solidified, as shown in FIG. The encapsulating resin 971 is shown. Thus, the upper surface of the substrate 2 is resin-sealed and molded with the encapsulating resin 971. At this time, as described above, since the upper surface of the flat terminal 6 and the lower surface of the convex member 930 abut against each other and are pressed, they are not impregnated with the molten resin 971a. Therefore, the resin package can be performed in a state where the upper surface of the flat terminal 6 is exposed from the sealing resin 971.

這樣，本實施例的樹脂封裝方法由於先通過壓縮成型用的成型模組將前述基板2的下表面以壓縮成型進行樹脂 封裝，因此在將上表面以傳遞成型進行樹脂封裝時，下表面通過壓縮成型用樹脂而支撐，這樣即使從上表面側對基板施加樹脂壓也可抑制基板的彎曲。因此，在本實施例中，可兼顧基板的彎曲抑制和基板的兩個表面的成型。並且，在本實施例中，由於將上表面以傳遞成型進行樹脂封裝，因此可容易地以設置在基板(上表面)的端子從封裝樹脂露出的狀態進行成型。 Thus, in the resin encapsulation method of the present embodiment, the lower surface of the substrate 2 is first subjected to compression molding by a molding module for compression molding. Since the lower surface is supported by the resin for compression molding when the upper surface is resin-molded by transfer molding, the bending of the substrate can be suppressed even if the resin pressure is applied to the substrate from the upper surface side. Therefore, in the present embodiment, the suppression of the bending of the substrate and the molding of both surfaces of the substrate can be achieved. Further, in the present embodiment, since the upper surface is resin-molded by transfer molding, it can be easily molded in a state where the terminal provided on the substrate (upper surface) is exposed from the sealing resin.

並且，本發明的樹脂封裝方法在前述第二樹脂封裝步驟中，以前述中間模950的上表面和前述上模900的下表面抵接，並且前述中間模950在前述上型腔的周邊部分和前述基板2的上表面抵接的狀態下，使前述傳遞成型用流動樹脂971a向前述樹脂流路流動。由此，不會使流動的流動性樹脂971a向前述基板2的下表面側漏出，並可向前述上型腔內注入。並且，在本實施例中，由於通過下模的壓縮成型和通過上模以及中間模的傳遞成型以不同的模組進行，因此例如即使將前述下模以脫模膜覆蓋進行壓縮成型，也可防止傳遞成型用樹脂進入下模和脫模膜之間。 Further, in the resin encapsulating method of the present invention, in the second resin encapsulating step, the upper surface of the intermediate mold 950 abuts against the lower surface of the upper mold 900, and the intermediate mold 950 is in the peripheral portion of the upper cavity and In the state in which the upper surface of the substrate 2 is in contact with each other, the transfer molding flow resin 971a flows into the resin flow path. Thereby, the flowing fluid resin 971a does not leak to the lower surface side of the substrate 2, and can be injected into the upper cavity. Further, in the present embodiment, since the compression molding by the lower mold and the transfer molding by the upper mold and the intermediate mold are performed in different modules, for example, even if the lower mold is covered with a release film for compression molding, The transfer molding resin is prevented from entering between the lower mold and the release film.

在本實施例中，和實施例1同樣地，可使不用樹脂部(省略圖示)脫模，也可使用前述裝載機回收完成樹脂封裝(完成成型)的基板2以及脫模膜130，也可回收前述不用樹脂部，也可清潔成型模，也可使用框部件進行樹脂封裝方法。 In the present embodiment, as in the first embodiment, the resin 2 (not shown) can be released from the mold, and the substrate 2 and the release film 130 which have been subjected to resin encapsulation (finishing) can be recovered by the loader. The above-mentioned resin-free portion can be recovered, and the molding die can be cleaned, or the resin component can be used for the resin sealing method.

本發明不限於上述的實施例，在不脫離本發明要旨的範圍內，根據所需，可進行任意且適當的組合、變更或選 擇而採用。 The present invention is not limited to the above-described embodiments, and any and appropriate combinations, changes, or selections may be made as needed within the scope of the gist of the present invention. Choose to use.

Claims (9)

一種樹脂封裝裝置，用於將基板的兩個表面進行樹脂封裝，前述樹脂封裝裝置包含第一成型模組和第二成型模組；前述第一成型模組為壓縮成型用成型模組；前述第二成型模組為傳遞成型用成型模組；通過前述第一成型模組可將前述基板的一個表面以壓縮成型進行樹脂封裝，通過前述第二成型模組可將前述基板的另一個表面以傳遞成型進行樹脂封裝；前述第一成型模組包含上模以及下模中的一個；前述第二成型模組包含上模以及下模中的另一個和中間模；前述中間模在前述第二成型模組中，配置在前述上模的下方或者前述下模的上方；前述中間模包含用於在前述基板的前述另一個表面側進行樹脂封裝的型腔；在前述第二成型模組中，通過前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接，形成可將傳遞成型用樹脂注入到前述型腔內的樹脂流路。 a resin encapsulating device for resin encapsulating two surfaces of a substrate, the resin encapsulating device comprising a first molding module and a second molding module; the first molding module being a molding module for compression molding; The second molding module is a molding module for transfer molding; one surface of the substrate can be resin-molded by compression molding through the first molding module, and the other surface of the substrate can be transmitted through the second molding module. Forming and performing resin encapsulation; the first molding module includes one of an upper mold and a lower mold; the second molding module includes the other of the upper mold and the lower mold and the intermediate mold; and the intermediate mold is in the second molding mold a group disposed below the upper mold or above the lower mold; the intermediate mold includes a cavity for resin encapsulation on the other surface side of the substrate; and in the second molding module, One surface of the intermediate mold abuts against the lower surface of the upper mold or the upper surface of the lower mold to form a resin for transfer molding into the aforementioned cavity A resin flow path. 如請求項1所記載之樹脂封裝裝置，其中前述第一成型模組包含下模； 前述第二成型模組包含上模以及中間模；通過前述第一成型模組可將前述基板的下表面以壓縮成型進行樹脂封裝，通過前述第二成型模組可將前述基板的上表面以傳遞成型進行樹脂封裝；前述中間模在前述第二成型模組中，配置在前述上模的下方；前述中間模的型腔為用於將前述基板的上表面側進行樹脂封裝的上型腔；在前述第二成型模組中，通過前述中間模的上表面和前述上模的下表面抵接，形成前述樹脂流路。 The resin packaging device of claim 1, wherein the first molding module comprises a lower mold; The second molding module includes an upper mold and an intermediate mold. The lower surface of the substrate can be resin-molded by compression molding through the first molding module, and the upper surface of the substrate can be transmitted through the second molding module. Forming and encapsulating the resin; the intermediate mold is disposed under the upper mold in the second molding module; and the cavity of the intermediate mold is an upper cavity for resin-sealing the upper surface side of the substrate; In the second molding module, the resin flow path is formed by the upper surface of the intermediate mold being in contact with the lower surface of the upper mold. 如請求項1或2所記載之樹脂封裝裝置，其中前述樹脂封裝裝置包含具有上模、中間模以及下模的上下模成型模組；前述上下模成型模組兼作前述第一成型模組和前述第二成型模組；可通過前述第一成型模組將前述基板的前述一個表面以壓縮成型進行樹脂封裝後，通過前述第二成型模組將前述基板的前述另一個表面以傳遞成型進行樹脂封裝。 The resin encapsulating device according to claim 1 or 2, wherein the resin encapsulating device comprises a top and bottom mold forming module having an upper mold, an intermediate mold, and a lower mold; the upper and lower mold forming modules also serve as the first molding module and the aforementioned a second molding module; after the one surface of the substrate is resin-molded by the first molding module, the other surface of the substrate is transferred into a resin package by the second molding module . 如請求項1或2所記載之樹脂封裝裝置，其中前述基板為在其兩個表面上安裝有晶片的安裝基板。 The resin package device according to claim 1 or 2, wherein the substrate is a mounting substrate on which a wafer is mounted on both surfaces thereof. 如請求項1或2所記載之樹脂封裝裝置，其中前述樹脂流路向前述中間模的型腔的注入口位於前述中間模的型腔的中心點的正上方或正下方。 The resin package device according to claim 1 or 2, wherein the injection port of the resin flow path to the cavity of the intermediate mold is located directly above or below the center point of the cavity of the intermediate mold. 如請求項1或2所記載之樹脂封裝裝置，其中前述樹脂封裝裝置進一步包含起模桿；前述起模桿設置成可從前述第一成型模組以及前述第二成型模組中至少一個所具備的成型模組的型腔面上進出；前述起模桿在模具打開時，其前端可上升或下降從而從前述型腔面突出；在模具閉合時，其前端可上升或下降從而不從前述型腔面突出。 The resin encapsulating device according to claim 1 or 2, wherein the resin encapsulating device further comprises a ejector rod; the ejector rod is provided to be provided from at least one of the first molding module and the second molding module The molding module enters and exits on the cavity surface; when the mold opening is opened, the front end thereof may rise or fall to protrude from the cavity surface; when the mold is closed, the front end thereof may rise or fall so as not to be of the foregoing type The cavity surface is prominent. 如請求項6所記載之樹脂封裝裝置，其中前述起模桿設置在前述下模的型腔的底面部以及前述中間模的上型腔的上表面部中的任一處；前述起模桿在前述上模以及前述下模中的一個和前述中間模的模具打開時，其前端可從前述下模的型腔的底面部或前述中間模的上型腔的上面表部突出；在前述上模以及前述下模中的一個和前述中間模的模具閉合時，其前端可不從前述下模的型腔的底面部或前述中間模的上型腔的上表面部突出而埋藏。 The resin packaging device according to claim 6, wherein the ejector pin is disposed at any one of a bottom surface portion of the cavity of the lower mold and an upper surface portion of the upper cavity of the intermediate mold; When the mold of the upper mold and the lower mold and the mold of the intermediate mold are opened, the front end thereof may protrude from the bottom surface portion of the cavity of the lower mold or the upper surface portion of the upper cavity of the intermediate mold; When one of the lower molds and the mold of the intermediate mold are closed, the front end thereof may be buried without being protruded from the bottom surface portion of the cavity of the lower mold or the upper surface portion of the upper mold of the intermediate mold. 如請求項1或2所記載之樹脂封裝裝置，其中前述樹脂封裝裝置進一步包含不用樹脂分離裝置；前述不用樹脂分離裝置在前述基板的兩個表面進行樹脂封裝後，可從完成前述樹脂封裝的基板上分離不用樹脂部分。 The resin encapsulating device according to claim 1 or 2, wherein the resin encapsulating device further comprises a resin separating device; the resin separating device is not resin-separating device after the resin is encapsulated on both surfaces of the substrate, and the substrate is completed from the resin encapsulation The upper part is not separated from the resin. 一種樹脂封裝方法，其將基板的兩個表面進行樹脂封裝，前述樹脂封裝方法使用在請求項1至8中任一項所記載之樹脂封裝裝置進行，並包含以下步驟：抵接步驟，使前述中間模在前述中間模的型腔的周邊部分和前述基板的前述另一個表面抵接；第一樹脂封裝步驟，通過前述第一成型模組將前述基板的前述一個表面以壓縮成型進行樹脂封裝；以及第二樹脂封裝步驟，在前述抵接步驟以及前述第一樹脂封裝步驟之後，在前述第二成型模組中，在前述中間模的一個表面和前述上模的下表面或前述下模的上表面抵接，並且前述中間模在前述中間模的型腔的周邊部分和前述基板的前述另一個表面抵接的狀態下，使前述傳遞成型用的流動樹脂通過前述樹脂流路向前述中間模的型腔內注入，從而將前述基板的前述另一個表面以傳遞成型進行樹脂封裝。 A resin encapsulation method for resin encapsulating two surfaces of a substrate, wherein the resin encapsulation method is carried out using the resin encapsulation apparatus according to any one of claims 1 to 8, and comprising the following steps: abutting step, The intermediate mold abuts on the peripheral portion of the cavity of the intermediate mold and the other surface of the substrate; the first resin packaging step, the first surface of the substrate is formed by compression molding by the first molding module; And a second resin encapsulating step, after the abutting step and the first resin encapsulating step, in the second molding module, on a surface of the intermediate mold and a lower surface of the upper mold or the lower mold The surface is abutted, and the intermediate mold is in a state in which the peripheral portion of the cavity of the intermediate mold abuts against the other surface of the substrate, and the flow resin for transfer molding passes through the resin flow path toward the intermediate mold. The cavity is injected so that the other surface of the aforementioned substrate is subjected to transfer molding for resin encapsulation.
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