TWI753181B - Resin molding apparatus and resin molded product manufacturing method - Google Patents

Abstract

The present invention provides a resin molding apparatus capable of suppressing warpage of a resin molded article. including: a molding die including a first die provided with a cavity, and a second die provided with a molding object mounting portion to which a molding object is mounted; a molding die heating mechanism that heats the molding die to a temperature range in which the thermosetting resin is cured the temperature inside; the temperature maintaining chamber that accommodates the intermediate molded product formed by the molding object and the incompletely cured thermosetting resin produced in the molding die and maintains the temperature within the temperature range; and the intermediate molded product The conveying mechanism conveys the intermediate molded product from the molding die to the temperature maintaining chamber while maintaining the intermediate molded product at a temperature higher than room temperature and equal to or lower than the upper limit of the temperature range.

Description

Resin molding apparatus and resin molded product manufacturing method

The present invention relates to a resin molding apparatus and a method for producing a resin molded product using the resin molding apparatus.

In order to protect electronic parts from the environment such as light, heat, moisture, etc., electronic parts are usually sealed by resin. Resin molding methods such as compression molding and transfer molding are used for resin sealing. In the compression molding method, a molding die including a lower die and an upper die is used, a resin material is supplied to the cavity of the lower die, and after the object to be molded is assembled in the upper die, the lower die is placed on the lower die in order to soften or melt the resin material. The mold and the upper mold are heated and the molds are closed to perform resin molding. In the transfer molding method, a cavity is provided in one of the upper mold and the lower mold, and after assembling the object to be molded in the other, the lower mold and the upper mold are heated while the two are closed, and a column is used. The plug supplies resin into the cavity, whereby resin molding is performed.

In the case of resin molding, the resin is usually cured in several tens of seconds to several minutes from the start of mold clamping to the extent that the shape can be maintained, but until it is completely cured, it must be maintained at a temperature within a predetermined range for several hours to ten hours. . Therefore, in the molding die, the mold is opened when the resin is cured to the extent that the shape can be maintained, and the intermediate molded product formed of the molding object and the resin that has not been completely cured is taken out, and is called after After cure (or post cure) treatment, a resin molded article formed of a molding object and a completely cured resin is produced (for example, Patent Document 1). In the post-curing treatment, first, the taken out intermediate molded product is conveyed into a temperature maintaining chamber provided outside the molding die. Next, the resin is completely cured by maintaining the temperature within a predetermined range for several hours to ten hours in a temperature maintaining chamber.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 06-151491

As described above, the resin molded product obtained by transferring the intermediate molded product from the molding die to the temperature maintaining chamber and post-curing may cause warpage. When warpage occurs in a resin molded product, for example, in a resin molded product in which electronic components mounted on a substrate are sealed with resin, there is a concern that the electronic components are peeled off or damaged from the substrate due to stress.

The subject to be solved by the present invention is to provide a resin molding apparatus and a resin molding manufacturing method which can suppress the occurrence of warpage in a resin molding.

The resin molding apparatus of the present invention, which was formed to solve the above problems, is an apparatus for resin molding by sealing an object to be molded with a thermosetting resin, and is characterized by comprising: a) a molding die including a first mold cavity provided with a first mold cavity. a mold, and a second mold provided with a molding object mounting portion for mounting the molding object; b) a forming mold heating mechanism, which heats the forming mold to a temperature within the temperature range for curing the thermosetting resin; c) a temperature maintaining chamber, which heats the forming object and the incompletely cured material produced in the forming mold an intermediate molded product formed of the thermosetting resin is accommodated and maintained at a temperature within the temperature range; and d) an intermediate molded product conveying mechanism for maintaining the intermediate molded product at a temperature higher than room temperature and within the temperature range The temperature below the upper limit of , is transferred from the molding die to the temperature maintaining chamber.

The method for producing a resin molded article according to the present invention is a method for producing a resin molded article by sealing an object to be molded with a thermosetting resin, and is characterized by comprising: an intermediate molded article production step of heating the thermosetting resin by using a molding die At a temperature within the curing temperature range, resin molding is performed to produce an intermediate molded product formed of the object to be molded and the thermosetting resin that is not completely cured; the intermediate molded product conveying step maintains the intermediate molded product at a temperature higher than room temperature and below the upper limit of the temperature range, while being transferred from a molding die to a temperature maintaining chamber; and a resin curing step by maintaining the intermediate molded product at the temperature in the temperature maintaining chamber The thermosetting resin is completely cured at a temperature within the range, thereby producing a resin molded product.

According to the present invention, the occurrence of warpage in the resin molded article can be suppressed.

10: Resin molding device

11: Compression forming device

111: Forming die

1111: Lower die

11111: Bottom member

11112: Peripheral Wall Components

1112: Upper die

112: Forming die heater

113: Thermal insulation

114: elastic member

1151: Baseplate

1152: Lower movable platform

1153: Upper movable platform

1154: Fixed platform

116: connecting rod

117: toggle link

12: The first conveying mechanism

121: Transfer mechanism heater

13: Temperature maintenance room

14: The second conveying mechanism

15: Cooling mechanism

151: Mounting table for cooling mechanism

152: Cooling water circulation mechanism

16: The third conveying mechanism

161: Arm of the third conveying mechanism

17: Cooling and pressurizing mechanism

171: Mounting table for cooling and pressing mechanism

172: Lower Plate

173: Upper Plate

174: Peltier element

175: exhaust hole

18: Finished product storage department

30: Resin molding unit

31: Material receiving components

311: Substrate receiving part

312: Resin material supply device

32: Forming Components

33: Pull out components

36: Main conveying path

37: Sub transport path

38: Non-heated conveying device

C: mold cavity

F: Release film

M: Intermediate molded product

P: resin material

PM: Resin molded product

S: substrate

S1~S8: Steps

T: Resin material transfer tray

FIG. 1 is a plan view showing the overall configuration of an embodiment of a resin molding apparatus of the present invention.

2 is a schematic configuration diagram (left diagram) and a partial enlarged view (right diagram) showing a compression molding apparatus including a molding die and a molding die heating mechanism in the resin molding apparatus of the present embodiment.

FIG. 3 is a schematic configuration diagram showing a cooling and pressurizing mechanism in the resin molding apparatus of the present embodiment.

4 is a flowchart showing the operation of the resin molding apparatus of the present embodiment and one embodiment of the resin molding method of the present invention.

FIGS. 5( a ) to 5( g ) are schematic views showing the operation of the compression molding apparatus in the resin molding apparatus of the present embodiment.

6(a) and 6(b) are schematic diagrams showing the operation of the cooling and pressing mechanism in the resin molding apparatus of the present embodiment.

7 is a plan view showing an example of a resin molding unit as another embodiment of the resin molding apparatus of the present invention.

In the resin molding apparatus and resin molded product manufacturing method of the present invention, when resin molding is performed in the molding die, the molding die is heated to a temperature within a temperature range in which the thermosetting resin is cured by the molding die heating mechanism. In this way, the thermosetting resin is gradually cured in the molding die, but as described above, it is necessary to complete the curing of the thermosetting resin. Therefore, an intermediate molded product is obtained by opening the mold before the thermosetting resin is completely cured. Then, the intermediate molded product is transferred from the molding die to the temperature maintaining chamber by the resin molded product transfer mechanism. Then, in the temperature maintaining chamber, the resin molded product is heated at a temperature within the above-mentioned temperature range for a predetermined time, whereby the resin is completely cured. In addition, since the temperature of the temperature maintaining chamber can achieve the purpose of completely curing the resin as long as it is a temperature within the above-mentioned temperature range, it does not need to be the same temperature as the temperature at which the molding die is heated.

In the conventional resin molding apparatus and resin molded product manufacturing method, when the intermediate molded product is transferred from the molding die to the temperature maintaining chamber, the intermediate molded product is cooled by passing through a space at room temperature, and then placed in the temperature maintaining chamber. heat again. In this way, the temperature of the intermediate molded product is temporarily lowered and then increased, and there is a difference in the linear expansion coefficient between the substrate and the resin, that is, the difference in the length of expansion when the substrate and the resin are subjected to the same temperature change. , resulting in warpage in the resin molded product finally obtained. Therefore, in the resin molding apparatus and the resin molding method of the present invention, in the resin molding conveying mechanism, the intermediate molding is performed while maintaining the resin molding at a temperature higher than room temperature and below the upper limit of the temperature range. The product is transported to the temperature maintenance room. Thereby, since the temperature change can be suppressed more than the case where a resin molded product passes in the space of room temperature, it can suppress that a warpage occurs in a resin molded product.

Conventionally, instead of using bonding wires for wiring, a method called Wafer Level Package (WLP) is used, that is, a method in which electronic components are mounted on a chip formed of a semiconductor such as silicon and then resin-sealed. to carry out In resin molding, the warpage of the resin molded product obviously occurs. The reason for this is that the difference in thermal expansion coefficient between semiconductors such as silicon and the resin used for resin sealing is larger than that of the material of the substrate to be wired by the bonding wire. According to the resin molding apparatus and the resin molding manufacturing method of this invention, even when resin molding is performed by WLP as mentioned above, the warpage of a resin molding can be suppressed effectively.

In the resin molding apparatus of the present invention, the temperature maintained in the intermediate molded product conveying mechanism is desirably a temperature within the temperature range (that is, within a temperature range in which the thermosetting resin is cured). Likewise, in the method for producing a resin molded product of the present invention, the temperature maintained in the intermediate molded product conveying step is desirably a temperature within the temperature range. Thereby, (although it is higher than room temperature), compared with the case of maintaining the temperature below the said temperature range, the warpage of a resin molded product can be suppressed further. In addition, the thermosetting resin of the intermediate molded product can be cured during transportation.

It is desirable that the resin molding apparatus of the present invention further includes a cooling mechanism for cooling the resin molded product produced by maintaining the temperature within the temperature range in the temperature maintaining chamber. Likewise, it is desirable that the method for producing a resin molded article of the present invention further includes a cooling step for cooling the resin molded article produced in the resin curing step. By cooling the resin molded product using these cooling mechanisms or cooling steps, handling of the resin molded product becomes easy. As the cooling mechanism, a mechanism including a cooling water circulation mechanism, a mechanism including a peltier element, or a mechanism including both can be used.

In the resin molding apparatus of the present invention, it is desirable that the cooling mechanism further includes a pressurizing mechanism for applying pressure to the resin molded article during cooling of the resin molded article. pressure. Likewise, in the method for producing a resin molded product of the present invention, it is desirable that the resin molded product is pressurized in the cooling step. By applying pressure during cooling of the resin molded product, the occurrence of warpage in the resin molded product due to temperature change during cooling can be suppressed.

Hereinafter, more specific embodiments of the resin molding apparatus and the resin molding method of the present invention will be described with reference to FIGS. 1 to 7 .

(1) Configuration of the resin molding apparatus of the present embodiment

In FIG. 1, the whole structure of the resin molding apparatus 10 which is one Embodiment of this invention is shown in plan view. The resin molding apparatus 10 includes a compression molding apparatus 11 including a molding die 111 and a heater (molding die heating mechanism) 112 to be described later, a first conveyance mechanism (corresponding to the intermediate molded product conveyance mechanism) 12 , and a temperature maintenance chamber 13 . , a second conveyance mechanism 14 , a cooling mechanism 15 , a third conveyance mechanism 16 , a cooling and pressurizing mechanism (corresponding to the cooling mechanism provided with the pressurizing mechanism) 17 , and a finished product storage portion 18 . 1 , the resin molding apparatus 10 includes: a resin material feeding part for feeding the resin material into a resin material feeding tray for feeding the resin material to the molding die 111; and a material conveying mechanism for feeding the resin material A resin material supply tray containing a resin material or a substrate as an object to be molded is conveyed to the molding die 111 , a substrate holding portion that holds the substrate, and the like.

As shown in FIG. 2 , the compression molding apparatus 11 used in the resin molding apparatus of the present embodiment includes two sets of molding dies 111 including a lower die 1111 and an upper die 1112 . A molding die heater (molding die heating mechanism) 112 is provided on the lower die 1111 and the upper die 1112 of each molding die 111, respectively. Between the forming die heater 112 and the platform (below) described later Between the movable platform 1152, the upper movable platform 1153 or the fixed platform 1154), the heat insulating material 113 is used for heat insulation. A substrate can be mounted on the lower surface of the upper mold 1112 . The lower mold 1111 includes a plate-shaped bottom member 11111 whose plate surface faces the vertical direction, and a peripheral wall member 11112 that slides up and down along the side surface of the bottom member 11111 , and the bottom surface of the peripheral wall member 11112 is held by the elastic member 114 . The cavity C is formed by the upper surface of these bottom surface members 11111 and the inner surface of the peripheral wall member 11112 . There is a slight gap between the side surface of the bottom surface member 11111 and the inner surface of the peripheral wall member 11112, and a vacuum pump (not shown) is used to suck the gas in the cavity C from the gap. A mold film is used to cover the inner surface of the cavity C.

The molding die heater 112 is for heating the molding die 111 at a predetermined temperature within a temperature range capable of curing the resin material in a state where the molten resin material formed of the thermosetting resin is supplied in the cavity C. (Hereinafter, the predetermined temperature, that is, the heating temperature in the mold heater 112 is referred to as "first predetermined temperature"), and the amount of heat generated is adjusted.

Further, the compression molding apparatus 11 includes a base 1151 , four connecting rods 116 (only two are shown in FIG. 2 ) erected on the base 1151 , and toggle links 117 provided on the base 1151 . On the connecting rod 116 , the lower movable platform 1152 and the upper movable platform 1153 are kept movable up and down, and a fixed platform 1154 is fixed on the upper end of the connecting rod 116 . In one of the two sets of forming molds 111 , the lower mold 1111 is installed on the upper surface of the lower movable platform 1152 with the heat insulating material 113 interposed therebetween, and the upper mold 1112 is installed on the upper movable platform with the forming mold heater 112 interposed therebetween. Lower surface of platform 1153. In the other molding die 111, the lower die 1111 is installed on the upper movable platform 1153 with the heat insulating material 113 interposed therebetween. The upper surface of the upper mold 1112 is disposed on the lower surface of the fixed platform 1154 across the forming mold heater 112 .

The first transfer mechanism 12 is a device that transfers the intermediate molded product produced in the compression molding apparatus 11 from the compression molding apparatus 11 to the temperature maintaining chamber 13 . The first conveyance mechanism 12 is provided with: a placement part on which the intermediate molded product is placed; and a conveyance mechanism heater 121 as a heater that heats the placement part above room temperature to a temperature range in which the thermosetting resin is cured The predetermined temperature below the upper limit of (hereinafter, the predetermined temperature, that is, the heating temperature in the first conveyance mechanism 12 is referred to as a "second predetermined temperature"). Here, if the second predetermined temperature is higher than room temperature, even if it is lower than the lower limit of the temperature range in which the thermosetting resin is cured, it is acceptable, but in order to further promote the curing of the thermosetting resin, it is desirable to be in the temperature range.

The temperature maintaining chamber 13 is a room for accommodating the intermediate molded product carried in from the first conveying mechanism 12, and has a temperature adjusting device that maintains the inside at a predetermined temperature within a temperature range in which the thermosetting resin is cured (hereinafter, the predetermined temperature is The temperature in the temperature maintaining chamber 13 is referred to as "third predetermined temperature"). In the present embodiment, 64 intermediate molded products can be accommodated in the temperature maintaining chamber 13 .

The second conveyance mechanism 14 is a device for conveying a resin molded article formed by heating the intermediate molded article in the temperature maintaining chamber 13 for a predetermined time, from the temperature maintaining chamber 13 to the cooling mechanism 15 . Unlike the first conveyance mechanism 12, the second conveyance mechanism 14 is not provided with a heater. In addition, the 2nd conveyance mechanism 14 is used also when carrying in the intermediate molded product into the finished product storage part 18 so that it may mention later.

The cooling mechanism 15 is a resin molded product carried in from the temperature maintaining chamber 13 device for cooling. In the present embodiment, the cooling mechanism 15 includes a mounting table 151 on which a resin molded product is mounted, and a cooling water circulation mechanism 152 for bringing the pipe through which cooling water passes into contact with the mounting table 151 . Instead of the cooling water circulation mechanism 152 or in addition to the cooling water circulation mechanism 152 , the Peltier element may be brought into contact with the mounting table 151 . Further, the purpose of the cooling mechanism 15 is to remove residual heat from the resin molded product before the processing in the cooling and pressurizing mechanism 17, and it is not necessary to cool the resin molded product to room temperature.

The third conveying mechanism 16 is a device for conveying the resin molded product from the cooling mechanism 15 to the cooling and pressing mechanism 17 . Similarly to the second conveyance mechanism 14, the third conveyance mechanism 16 is also not provided with a heater. In addition, the third conveyance mechanism 16 is also used when the intermediate molded product is carried into the finished product storage section 18 .

As shown in FIG. 3, the cooling and pressurizing mechanism 17 includes: a mounting table 171 having a cylindrical shape on which a resin molded product is mounted; The column of 171 is inserted through; the fixed upper plate 173 is opposite to the mounting table 171 and the lower plate 172; the moving mechanism (not shown) makes the mounting table 171 and the lower plate 172 move up and down respectively; and the Peltier element 174, It is provided so as to be in contact with the upper plate 173 . The lower plate 172 and the upper plate 173 have the same plane shape as the substrate of the resin molded product produced by the resin molding apparatus 10, or a plane shape capable of enclosing the substrate. On the other hand, the upper surface of the mounting table 171 has a smaller planar shape than the substrate of the resin molded product.

In addition, the Peltier element 174 may be disposed on the lower plate 172, or may be disposed on both the lower plate 172 and the upper plate 173, respectively. Can also replace Peltier element 174, or in addition to the Peltier element 174, a pipe through which cooling water of the cooling water circulation mechanism passes is brought into contact with the lower plate 172 and/or the upper plate 173. A suction hole 175 is provided on the upper surface of the mounting table 171 , and a resin molded product can be adsorbed on the upper surface of the mounting table 171 by sucking gas from the suction hole 175 using a vacuum pump (not shown).

The finished product storage unit 18 is a room for storing resin molded products (finished products) completed by cooling and pressurizing by the cooling and pressurizing mechanism 17 . A plurality of finished product storage units 18 are provided adjacent to the room in which the second conveyance mechanism 14 is installed and the room in which the third conveyance mechanism 16 is installed. The resin molded product is conveyed by the third conveyance mechanism 16 and the second conveyance mechanism 14 in the finished product storage unit 18 adjacent to the room in which the second conveyance mechanism 14 is installed, and is adjacent to the room in which the third conveyance mechanism 16 is installed. In the finished product storage section 18 of , it is conveyed by the third conveyance mechanism 16 .

(2) Operation of the resin molding apparatus of the present embodiment and the method for producing a resin molded product of the present embodiment

4-6(b), the operation|movement of the resin molding apparatus of this embodiment, and the manufacturing method of the resin molding of this embodiment are demonstrated. 4 is a flowchart showing the operation of the resin molding apparatus and the method for manufacturing a resin molded product according to the present embodiment, FIGS. 5( a ) to 5 ( g ) are schematic diagrams showing the operation of the compression molding apparatus 11 , FIG. a) and FIG. 6(b) are schematic diagrams showing the operation of the cooling and pressurizing mechanism 17 .

First, in the compression molding apparatus 11, using the molding die 111, the resin material P is heated by the molding die heater 112 to a temperature within a temperature range in which the resin material P formed of a thermosetting resin is cured, and resin molding is performed. , thereby producing an intermediate molded product M (step S1 ).

Here, the details of the operation in step S1 will be described with reference to FIGS. 5( a ) to 5 ( g ). In addition, the compression molding apparatus 11 has two molding dies 111, and the operations of the two molding dies are the same. First, on the lower surface of the upper mold 1112, the substrate S on which a plurality of electronic components are mounted is assembled with the mounting surface facing the lower side ( FIG. 5( a )). Next, the resin material transfer tray T is carried in between the lower mold 1111 and the upper mold 1112 ( FIG. 5( b )). The resin material transfer tray T is provided on the bottom surface of a frame-shaped member having a space corresponding to the planar shape of the cavity C in the center, and a release film F is stretched and provided so as to cover the space. On the resin material transfer tray T, the resin material P is injected into the space above the release film F in the resin material injection part.

Next, after the resin material transfer tray T carried in between the lower mold 1111 and the upper mold 1112 is lowered, gas is sucked from the gap between the side surface of the bottom surface member 11111 and the inner surface of the peripheral wall member 11112 and adsorbed to the resin material. On the transfer tray T, the release film F is detached from the resin material transfer tray T. Thereby, the inner surface of the cavity C of the lower mold 1111 is covered with the release film F, and the resin material P is supplied into the cavity C ( FIG. 5( c )).

Next, the lower mold 1111 and the upper mold 1112 are heated to the first predetermined temperature by the molding mold heater 112 . Thereby, the resin material P in the cavity C of the lower mold 1111 is initially melted or softened ( FIG. 5( d )). As described above, when the resin material P is melted or softened, the lower movable platform 1152 is raised by the toggle link 117 . Thereby, first, the lower mold 1111 of the lower molding mold 111 abuts against the upper mold 1112, the upper movable platform 1153 on which the upper mold 1112 is assembled rises, and the lower mold 1111 of the upper molding mold 111 abuts against the upper mold 1112 catch. Further, the lower movable platform 1152 is moved by the toggle link 117 The two molding dies 111 are respectively clamped by rising up ( FIG. 5( e )).

When the mold heater 112 is used to maintain the resin material P at the first predetermined temperature in the state where the mold is clamped as described above, the resin material P, which is a thermosetting resin, starts to harden ( FIG. 5( f )). Next, the resin material P is cured to such an extent that the shape can be maintained after a predetermined time elapses. In this stage, the mold is opened, and the intermediate molded product M formed of the resin and the substrate S in which the resin material P has been cured to some extent is taken out from the molding die 111 ( FIG. 5( g )). At this time, the inner surface of the cavity C is covered with the release film F, whereby the intermediate molded product M can be easily released from the lower mold 1111 . The time for performing mold clamping is appropriately determined according to the material of the resin material (thermosetting resin) P to be used.

Returning to the flowchart of FIG. 4 , the steps after the intermediate molded product M is produced in the molding die 111 will be described. First, the intermediate molded product M is transferred from the compression molding apparatus 11 to the temperature maintaining chamber 13 while being heated to the second predetermined temperature by the first transfer mechanism 12 (step S2). Thereby, the intermediate molded product M is suppressed from being cooled, thereby suppressing the occurrence of warpage in the intermediate molded product M. FIG.

Next, in the temperature maintaining chamber 13 , the intermediate molded product M is maintained at the third predetermined temperature for a predetermined time, whereby the thermosetting resin is completely cured, and the resin molded product PM is obtained (step S3 ). The predetermined time is appropriately determined according to the material of the thermosetting resin to be used. Here, usually, a plurality of intermediate molded products M are produced in the compression molding apparatus 11 while one intermediate molded product M is held in the temperature maintaining chamber 13 . Therefore, by setting the number of intermediate molded products that can be temporarily accommodated in the temperature maintaining chamber 13 to the above-mentioned plurality or more, even if the compression molding apparatus 11 is not in the middle The production of the intermediate molded product M may be continuously performed intermittently, and all of the produced intermediate molded product M may be accommodated in the temperature maintaining chamber 13 .

Next, the 2nd conveyance mechanism 14 mounts the resin molded article PM in which the thermosetting resin is completely hardened|cured on the mounting table 151 of the cooling mechanism 15 (step S4). In the cooling mechanism 15, the resin molded product PM is gradually cooled by passing cooling water through the pipe of the cooling water circulation mechanism 152 in contact with the mounting table 151 (step S5). Then, in a state where the resin molded product PM is cooled to some extent but the temperature is still higher than room temperature, the third conveying mechanism 16 conveys the resin molded product PM to the cooling and pressing mechanism 17 (step S6).

In the cooling and pressurizing mechanism 17, the resin molded product PM is cooled while being pressurized (step S7). Hereinafter, the details of the operation in step S7 will be described with reference to FIG. 6( a ) and FIG. 6( b ). First, the resin molded product PM is placed on the mounting table 171 by the third conveyance mechanism 16 ( FIG. 6( a )). Here, as described above, the upper surface of the mounting table 171 has a smaller planar shape than the substrate of the resin molded product PM. Therefore, when the resin molded product PM is mounted on the mounting table 171, a part of the resin molded product PM is removed from the mounting table. 171 exposed. Therefore, the arm 161 of the third transfer mechanism 16 transfers the resin molded product PM so as to support the lower side of the exposed portion, and after the resin molded product PM is placed on the mounting table 171, it is not sandwiched between the resin molded product PM and the resin molded product PM. Between the mounts 171, extraction is possible. After the resin molded article PM is placed on the mounting table 171 as described above, the resin molded article PM is adsorbed on the mounting table 171 by sucking gas from the air suction holes 175 .

Next, the mounting table 171 is raised up to the upper surface of the resin molded product PM While contacting the lower surface of the upper plate 173, the lower plate 172 is raised until the upper surface of the lower plate 172 contacts the lower surface of the resin molded product PM. Then, the mounting table 171 and the lower plate 172 are further pushed up, whereby the resin molded product PM is sandwiched between the upper plate 173 and the mounting table 171 and the lower plate 172, and the resin molded product PM is pressurized (Fig. 6(b)). At the same time, the resin molded product PM is cooled via the upper plate 173 by passing a current to the Peltier element 174 . Here, the pressure for pressurizing the resin molded product PM is determined within a range in which the warpage of the resin molded product PM can be suppressed and the resin molded product PM is not damaged by performing a preliminary experiment or the like. In this way, by performing pressurization and cooling, not only the occurrence of warpage in the resin molded article PM can be suppressed, but also the temperature of the resin molded article PM can be set to room temperature.

The resin molded product PM cooled to room temperature in the cooling and pressurizing mechanism 17 is transported to the finished product storage section 18 by the third transport mechanism 16 (or the third transport mechanism 16 and the second transport mechanism 14 ), and stored in the finished product in the accommodating part 18 (step S8). Through the above operations, one resin molded product PM is completed. Then, by continuously performing the above operations, a plurality of resin molded articles PM are continuously produced.

(3) An example of a resin molding unit

Next, the resin molding unit 30 as a modification of the resin molding apparatus 10 will be described with reference to FIG. 7 . The resin molding unit 30 of the present modification includes a material receiving unit 31 , a molding unit 32 , and a drawing unit 33 . The material receiving unit 31 is a device for receiving the resin material P and the substrate S from the outside and sending them out to the molding unit 32, and has a substrate receiving unit 311 and a resin material transfer tray T (see FIG. 5 ). (b)) The resin material supply apparatus 312 which supplies the resin material P. One or more molding units 32 are installed in one set of resin molding units 30 , and one compression molding apparatus 11 described above is installed in one molding unit 32 . Although three molding units 32 are shown in FIG. 7 , any number of molding units 32 may be provided in the resin molding unit 30 . In addition, after the resin molding unit 30 is constructed and used, the molding unit 32 may be increased or decreased. The extraction unit 33 is a unit that accommodates the temperature maintaining chamber 13 , the second conveyance mechanism 14 , the cooling mechanism 15 , the third conveyance mechanism 16 , the cooling and pressurizing mechanism 17 , and the finished product storage unit 18 .

The resin molding unit 30 is provided with a main conveyance path 36 that penetrates the material receiving unit 31 and one or more molding units 32 to reach the inlet of the temperature maintaining chamber 13 of the extraction unit 33 . In addition, in the material receiving unit 31 and each molding unit 32, a sub-conveying path 37 is provided between the main conveying path 36 and the apparatuses in the unit, and the sub-transporting path 37 which conveys the substrate S, the resin material transfer tray T, and the intermediate molded product is provided. M. The first conveyance mechanism 12 moves from each molding unit 32 to the inlet of the temperature maintaining chamber 13 in the main conveyance path 36 . In addition, a non-heating type transfer device 38 is disposed in the main transfer path 36 for transferring the substrate S and the resin material transfer tray T from the material receiving unit 31 to the molding unit 32 without heating the substrate S and the resin material transfer tray T. As shown in FIG.

The operation of the resin molding unit 30 will be described. The substrate S is held on the substrate receiving portion 311 of the material receiving unit 31 by the operator. The non-heating transfer device 38 transfers the substrate S from the substrate receiving unit 311 to the molding unit through the sub-transfer path 37 of the material receiving unit 31 , the main transfer path 36 , and one of the sub-transfer paths 37 of the molding unit 32 . 32 in the compression molding apparatus 11, thereby assembling the substrate S in the upper die 1112 of the compression molding device 11 . Next, the resin material supply device 312 supplies the resin material P to the resin material transfer tray T. Next, the non-heating transfer device 38 transfers the resin material transfer tray T to which the resin material P is supplied, from the resin material supply device 312 , through the sub transfer path 37 , the main transfer path 36 of the material receiving unit 31 , and the substrate S just now assembled on the The sub-conveyance path 37 of the molding unit 32 formed in the upper mold 1112 supplies the resin material P to the cavity C of the lower mold 1111 of the molding unit 32 . Then, the compression molding apparatus 11 produces the intermediate molded product M by the above-described method. As described above, while the compression molding is performed by one compression molding apparatus 11, the compression molding apparatus 11 located in the other molding unit 32 is subjected to the same operation as before, whereby the plurality of molding units 32 can be staggered. The intermediate molded product M is produced in parallel with time.

Next, the first conveyance mechanism 12 conveys the intermediate molded product M produced in the compression molding apparatus 11 to the second predetermined temperature, through the sub conveyance path 37 and the main conveyance path 36 of the molding unit 32 to the temperature of the extraction unit 33 . maintained in chamber 13. Hereinafter, the operations from the complete curing of resin in the temperature maintaining chamber 13 to produce the resin molded product PM to the storage of the resin molded product PM in the finished product housing portion 18 are the same as those of the resin molding apparatus 10 .

The resin molding unit 30 can efficiently manufacture a desired number of resin molded products by using the molding units 32 in the number corresponding to the number of resin molded products produced per unit time. In addition, by adding the forming unit 32, the production scale can be easily expanded.

In the example of the resin molding unit 30 shown here, only one extraction unit is provided As a result of adding the molding unit 32 to the unit 33, when the intermediate molded product M is produced in excess of the number that can be accommodated in the temperature maintaining chamber 13, a plurality of extraction units 33 may be provided. In this case, the temperature maintaining chamber 13 in each extraction unit 33 is moved from the position shown in FIG. 7 so that the main conveyance path 36 penetrates the plurality of extraction units 33 .

The present invention is not limited to the above-described embodiment.

For example, in the above-described embodiment, the compression molding apparatus 11 having two sets of the forming dies 111 is used, but the forming dies 111 may be only one set or three or more sets. In addition, a transfer molding device may be used instead of the compression molding device 11 .

In addition, in the above-described embodiment, two types of cooling mechanisms, the cooling mechanism 15 and the cooling and pressurizing mechanism 17 (which do not have a pressurizing mechanism) are used, but only any one of these mechanisms may be used. The cooling method is not limited to the above-mentioned cooling water circulation mechanism or Peltier element, and an air cooling device or the like may be used. In addition, a cooling mechanism may not be provided in the resin molding apparatus, but the resin molded product taken out from the temperature maintaining chamber 13 may be cooled naturally. Alternatively, in the cooling mechanism 15 or the cooling and pressurizing mechanism 17, in order to prevent the resin molded article from cooling rapidly, the resin molded article may be heated to a temperature between room temperature and the temperature of the temperature maintenance chamber 13 in the initial stage. In a state where the heat medium is in contact, temperature control is performed so as to gradually lower the temperature of the heat medium.

10‧‧‧Resin molding equipment

11‧‧‧Compression forming device

12‧‧‧First conveying mechanism

121‧‧‧Transfer mechanism heater

13‧‧‧Temperature maintenance room

14‧‧‧Second transfer mechanism

15‧‧‧Cooling mechanism

151‧‧‧Mounting table for cooling mechanism

152‧‧‧Cooling water circulation mechanism

16‧‧‧The third conveying mechanism

17‧‧‧Cooling and pressurizing mechanism

18‧‧‧Completed product storage department

Claims (6)

A resin molding apparatus, which is an apparatus for resin molding by sealing an object to be molded with a thermosetting resin, comprising: a molding die, including a first die provided with a cavity, and a device for mounting the object to be molded. a second mold of the object mounting part, the mold is fixed on a platform of a compression molding apparatus; a mold heating mechanism heats the mold to a temperature within a temperature range in which the thermosetting resin is cured; a temperature maintenance chamber , accommodate the intermediate molded product formed by the molding object and the incompletely cured thermosetting resin produced in the molding die, and maintain the temperature within the temperature range; the intermediate molded product conveying mechanism transfers the The intermediate molded product is taken out from the molding die, and is transferred from the molding die to the temperature maintaining chamber while maintaining a temperature higher than room temperature and below the upper limit of the temperature range, and the intermediate molding is performed. The product conveying mechanism conveys only the intermediate molded product; and the cooling mechanism cools the resin molded product produced by maintaining the temperature within the temperature range in the temperature maintaining chamber; the cooling mechanism further includes a pressurizing mechanism, The resin molded article is pressurized during cooling of the resin molded article. The resin molding apparatus according to claim 1, wherein the temperature maintained in the intermediate molded product conveying mechanism is a temperature within the temperature range. The resin molding apparatus according to claim 1 or claim 2, wherein the cooling mechanism includes a cooling water circulation mechanism. The resin molding apparatus according to claim 1 or claim 2, wherein the cooling mechanism includes a Peltier element. A method for producing a resin molded product, characterized in that it is a method for producing a resin molded product by sealing a molded object with a thermosetting resin, comprising: an intermediate molded product production step of using a molding die while heating to the thermosetting resin The temperature within the temperature range for resin curing is performed while resin molding is performed to produce an intermediate molded product formed of the object to be molded and the thermosetting resin that is not completely cured; the intermediate molded product conveying step is to transfer the intermediate molded product from the taken out from the molding die and conveyed from the molding die to the temperature maintaining chamber while maintaining the temperature at a temperature higher than room temperature and below the upper limit of the temperature range, the intermediate molded product conveying step only conveys the intermediate molded product; the resin a curing step for producing a resin molded article by maintaining the intermediate molded article at a temperature within the temperature range in the temperature maintaining chamber to completely cure the thermosetting resin; and a cooling step for converting the thermosetting resin The resin molded article produced in the resin curing step is cooled; in the cooling step, the resin molded article is pressurized. The method for producing a resin molded product according to claim 5, wherein the temperature maintained in the intermediate molded product conveying step is a temperature within the temperature range.

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