TW201925064A - Conveying device, resin forming device, and method for manufacturing resin molded product inhibits the temperature rise of the resin in the conveying process - Google Patents

Abstract

The present invention relates to a conveying device, a resin forming device, and a method for manufacturing a resin molded product, which inhibits the temperature rise of the resin in the conveying process. The conveying device (11) comprises an object holding member (24) for holding a resin molding object (13); a heating unit (29) provided on the object holding member (24) and heating the resin molding object (13); a resin holding member (25) that holds the resin (16); a cooling section (31) for cooling the resin (16) held by the resin holding member (25); and a cover member (38) surrounding the periphery of the resin holding member (25).

Description

Transport device, resin molding device, and method of manufacturing resin molded article

The present invention relates to a transfer device for transporting a resin, a resin molding device, and a method for producing a resin molded article.

As a prior art, for example, Patent Document 1 discloses a small and inexpensive resin sealing device that does not cause unevenness in temperature of a substrate. This resin sealing device preheats the substrate 90 on which the electronic component is mounted on at least one side surface by a preheater unit 60, and clamps it by the upper and lower metal molds of the molding unit 40 and the molding unit 40. The electronic component is resin-sealed by the substrate 90, and the resin sealing device is characterized in that the preheater unit 60 is detachably integrated with an unloader unit 70, and the unloader unit 70 is The substrate 90 and the tablet 91 are supplied to the molding unit 30 and the molding unit 40 to reciprocate, and the preheater unit 60 can be moved to the vicinity of the molding unit 30 and the molding unit 40 via the unloader unit 70. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-140047

[Problems to be Solved by the Invention] In the resin sealing device disclosed in Patent Document 1, the substrate 90 and the sheet 91 are conveyed to the molding unit 30 in a state in which the preheater unit 60 and the unloader unit 70 are integrated. Near unit 40. Therefore, the substrate 90 and the sheet 91 are preheated during the conveyance by the preheater unit 60. Therefore, there is a concern that the sheet 91 is heated by the heat from the preheater unit 60, and the temperature is increased to cause thermal deformation.

The present invention has been made to solve the problems described above, and an object of the invention is to provide a conveying apparatus, a resin molding apparatus, and a method of producing a resin molded article which are capable of suppressing an increase in temperature of a resin during conveyance.

[Means for Solving the Problems] In order to solve the above-described problems, the transport apparatus of the present invention includes an object holding member that holds a resin molded object, and a heating unit that is provided on the object holding member and heats the resin molded object. a resin holding member that holds the resin, a cooling portion that cools the resin held by the resin holding member, and a lid member that surrounds the periphery of the resin holding member. The resin molding apparatus of the present invention includes the above-described conveying device. In the method of producing a resin molded article of the present invention, the resin molded article is produced by the above-described resin molding product, and the resin molded article is subjected to resin molding of the resin molded object conveyed by the transfer device.

[Effects of the Invention] According to the present invention, it is possible to suppress an increase in the temperature of the resin during the conveyance.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. All the figures in the present application are omitted or exaggerated for the sake of easy understanding. The same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted.

[Embodiment 1] (Configuration of Resin Molding Apparatus) A configuration of a resin molding apparatus of the present invention will be described with reference to Fig. 1 . The resin molding apparatus 1 shown in Fig. 1 is, for example, a resin molding apparatus using a transfer molding method. The resin molding apparatus 1 has a substrate 2. Four tie bars 3 as holding members are fixed to the four corners of the base 2. The fixed platen 4 facing the base 2 is fixed to the upper portion of the four tie bars 3 extending upward. Between the base 2 and the fixed platen 4, and the respective movable platens 5 of the base 2 and the fixed platen 4 are respectively fitted to the four tie bars 3.

A mold clamping mechanism 6 for moving the movable platen 5 up and down is provided on the base 2. The mold clamping mechanism 6 raises and lowers the movable platen 5 to perform mold opening and closing of the forming die. The mold clamping mechanism 6 is configured by a combination of a drive source and a transmission member. For example, a combination of a servo motor and a ball screw, a combination of a cylinder and a rod, and the like are used as the mold clamping mechanism 6. As the mold clamping mechanism 6, a crank link mechanism can also be used.

The upper mold 7 is fixed to the lower surface of the fixed platen 4. Below the upper mold 7, a lower mold 8 is disposed opposite to the upper mold 7. The lower mold 8 is fixed to the upper surface of the movable platen 5. The upper mold 7 and the lower mold 8 together constitute a forming mold 9. A heater 10 as a heating member is appropriately provided in the upper mold 7 and the lower mold 8. The upper mold 7 and the lower mold 8 are heated by the heater 10 to about 170 ° C to 180 ° C. It is preferable that the upper mold 7 and the lower mold 8 are heated up to a temperature at which the resin material supplied to the molding die 9 can be heated and melted.

In a state in which the molding die 9 is opened, a transfer device 11 that supplies a resin molding object and a resin material to the molding die 9 in a batch, for example, is disposed between the upper die 7 and the lower die 8 . For example, a lead frame 13 or the like on which a semiconductor chip 12 is mounted as a resin molding object is supplied to the arrangement region 14 of the lower mold 8. The semiconductor chip 12 is connected to the lead frame 13 via, for example, a bonding wire 15 . The conveying device 11 in the present embodiment is a conveying device that supplies the resin molding object and the resin material to the forming die 9 in batches.

A can 17 is provided in the lower mold 8, and the can 17 accommodates, for example, a sheet-like resin 16 formed by tableting as a resin material. A plunger 18 for pressing a fluid resin that heats and melts the contained sheet-like resin 16 is provided in the tank 17. The plunger 18 is coupled to the drive mechanism 19 via a transmission member. The drive mechanism 19 is provided inside the movable platen 5 or outside the movable platen 5. The plunger 18 is lifted and lowered in the tank 17 by the drive mechanism 19.

The chamber 20 is disposed in the upper mold 7 opposite to the arrangement region 14 of the lower mold 8. Further, a cull concave portion 21 is provided at a position of the upper mold 7 facing the tank 17. The collecting recess 21 and the chamber 20 communicate via a runner 22 as a resin passage. The molten fluid resin is injected into the chamber 20 from the tank 17 via the collecting recess 21 and the runner 22 .

Furthermore, in the present embodiment, the case where the chamber 20 is provided in the upper mold 7 is shown. However, the present invention is not limited thereto, and a chamber can be provided in each of the upper mold 7 and the lower mold 8. In this case, the semiconductor chip 12 mounted on the lead frame 13 is sealed with a resin by a hardening resin formed in a cavity provided in the upper mold 7 and the lower mold 8.

(Manufacturing Method of Resin Molded Article) A method of producing a resin molded article in which the lead frame 13 on which the semiconductor chip 12 is mounted is resin-molded, for example, will be described with reference to Fig. 1 .

As shown in Fig. 1, first, the upper mold 7 and the lower mold 8 are opened in the resin molding apparatus 1. Next, the lead frame 13 on which the semiconductor chip 12 is mounted and the sheet-like resin 16 are transferred between the upper mold 7 and the lower mold 8 by the transfer device 11. The conveying device 11 is a conveying device that conveys the lead frame 13 and the sheet-like resin 16 in batches to the forming die 9.

As will be described later, in order to improve the adhesion between the lead frame 13 and the cured resin, the lead frame 13 is preheated during the transfer. This is because the lead frame 13 is heated in advance by the heater to prevent the lead frame 13 from being rapidly heated and deformed by the heat of the heated molding die, whereby the adhesion is deteriorated. A thermosetting resin is used as the sheet-like resin 16. Therefore, when the temperature of the sheet-like resin 16 rises during the conveyance, the sheet-like resin 16 may be deteriorated or deteriorated. When the temperature of the sheet-like resin 16 further rises, a part of the sheet-like resin 16 may be melted and adhered to the conveying device 11. Therefore, it is important in the conveying device 11 that the temperature rise of the sheet-like resin 16 is suppressed during the process of conveying the sheet-like resin 16.

Next, the transport device 11 supplies the lead frame 13 on which the semiconductor chip 12 is mounted to the arrangement region 14 provided in the lower mold 8. Further, the conveying device 11 supplies the sheet-like resin 16 to the can 17 provided in the lower mold 8. In this case, it is preferable that the upper mold 7 and the lower mold 8 are heated up to a temperature at which the sheet-like resin 16 can be heated and melted using the heaters 10 provided in the upper mold 7 and the lower mold 8 (for example, 170 ° C to 180 ° C) °C or so).

In this case, the conveying device 11 supplies the lead frame 13 and the sheet-like resin 16 to the lower mold 8 in different processes. However, the present invention is not limited thereto, and the transfer device 11 may supply the lead frame 13 and the sheet-like resin 16 to the lower mold 8 at the same time.

Next, the movable platen 5 is raised by the mold clamping mechanism 6. Thereby, the upper mold 7 and the lower mold 8 are closed. The semiconductor chip 12 mounted on the lead frame 13 is housed in the chamber 20 provided in the upper mold 7. By clamping the molding die 9, the sheet-like resin 16 supplied to the can 17 is heated and melted by the heater 10 to produce a fluid resin.

Next, the drive mechanism 19 is used to raise the plunger 18 to press the melted fluid resin. The fluid resin is injected into the chamber 20 from the tank 17 via the collecting recess 21 and the runner 22 . In a state where the chamber 20 is filled with the fluid resin, the fluid resin is further heated, whereby the cured resin is molded. Thereby, the semiconductor chip 12 mounted on the lead frame 13 is sealed with a resin by a hardening resin. In other words, the lead frame 13 equipped with the semiconductor chip 12 is subjected to resin molding.

Next, the movable platen 5 is lowered by the mold clamping mechanism 6, whereby the upper mold 7 and the lower mold 8 are opened. The resin molded article obtained by molding the resin is taken out from the molding die 9, and the unnecessary resin molded portion formed in the collecting recess 21 and the runner 22 is stripped. At this stage, the resin molded article is completed.

(Configuration of the conveying device and the resin holding member) The configuration of the conveying device 11 and the resin holding member used in the first embodiment will be described with reference to Figs. 2 to 3(b).

As shown in FIG. 2, the conveyance apparatus 11 includes, for example, a conveyance unit 23, an object holding member 24 that holds a resin molding object, and a resin holding member 25 that holds the resin. In the conveyance device 11, the object holding member 24 is disposed on both sides of the conveyance unit 23, and a plurality of resin holding members 25 are disposed in the resin placement portion 26 provided in the center portion of the conveyance unit 23. In this case, the conveying device 11 has two object holding members 24 and three resin holding members 25. In the first embodiment, the transfer device 11 transports the lead frame 13 on which the semiconductor chip 12 is mounted as a resin molding object and the sheet-like resin 16 as a resin in a batch.

As shown in (a) of FIG. 2, three semiconductor chips 12 are mounted in each lead frame 13. Three resin holding members 25 are disposed in the resin disposing portion 26, and the sheet-like resin 16 is held in each of the resin holding members 25. The number of the semiconductor chips 12 mounted on the lead frame 13 and the number of the resin holding members 25 disposed in the resin arrangement portion 26 can be arbitrarily set.

In the object holding member 24, the lead frame 13 disposed on the base 27 is held by the base 27 by the lead frame pressing plate 28. A heater 29, which is a heating portion for preheating the lead frame 13 during the process of transporting the lead frame 13, is provided in the base 27. The lead frame 13 is preheated to about 100 ° C to 170 ° C using the heater 29 . Thereby, the adhesion between the lead frame 13 and the cured resin can be improved at the time of resin molding.

As shown in FIG. 2, the resin holding member 25 includes, for example, four lead-shaped guide members 30 that support the sheet-like resin 16, and a shutter 31 as an opening and closing member. The four guide members 30 in the shape of a pin are disposed in the resin arrangement portion 26 and attached to the bottom surface of the transport unit 23 . In the resin arrangement portion 26, the shutter 31 can be moved (opened and closed) by a drive mechanism (not shown). As shown in FIG. 3(b), the shutter 31 is formed in an L shape. The sheet-like resin 16 supported by the four guide members 30 is held by the resin holding member 25 by the bottom surface portion of the L-shaped shutter 31.

In the L-shaped shutter 31, for example, a through hole 32 as a hollow passage is formed in order to supply a gas for cooling. The through hole 32 has, for example, a gas supply port 33 that supplies gas at the upper portion and a gas discharge port 34 that discharges gas at the lower portion. The gas for cooling is supplied to the through hole 32, whereby the shutter 31 itself is cooled. The sheet-like resin 16 held in the resin holding member 25 is cooled by the cooled shutter 31. Therefore, the shutter 31 functions as a cooling portion that cools the sheet-like resin 16 . The through hole 32 which is a hollow passage formed in the shutter 31 functions as a gas supply unit that supplies a gas for cooling. Here, the sheet-like resin 16 is effectively cooled by coming into contact with the cooled shutter 31.

The gas for cooling is discharged from the gas supply port 33 formed in the upper portion of the shutter 31 via the through hole 32 through the gas supply port 33 formed in the upper portion of the shutter 31. Further, the sheet-like resin 16 held in the resin holding member 25 is directly cooled by the cooling gas discharged from the gas discharge port 34. In addition, since the sheet-like resin 16 is supported by the four guide members 30 in the shape of a pin, the sheet-like resin 16 is compared with a structure that supports the periphery of the sheet-like resin 16 with a relatively large area. The area that can come into contact with the gas for cooling discharged from the through hole 32 becomes large. Therefore, the effect of cooling the sheet-like resin 16 can be further improved. As the gas for cooling, compressed air, nitrogen (N ₂ ), argon (Ar), helium (He), or the like is used.

In this case, it is possible to reduce the influence of heat received from the heater 29 provided in the object holding member 24 (refer to (b) of FIG. 2). This heat is considered to be mainly the radiant heat of the heater 29, but it also includes heat that is thermally conducted from the heater 29 by the structure of the transfer device. Therefore, the temperature rise of the sheet-like resin 16 can be suppressed during the process of conveying the sheet-like resin 16. Further, in the case of a structure that is hardly affected by the heat of heat conduction from the heater 29, the shutter 31 and the guide member 30 can be configured by a thermally conductive material having a high thermal conductivity, and the resin holding member 25 itself can be more strongly applied. Cool down.

As shown in FIG. 3(b), the communication path 35 is formed in the transport unit 23 so as to be connected to the gas supply port 33 formed in the shutter 31 of each of the resin holding members 25. In a state in which the sheet-like resin 16 is held in the resin holding member 25, the communication passage 35 is formed to be continuous with all the gas supply ports 33 formed in the respective shutters 31. The communication path 35 is connected to the gas supply unit 37 via a gas introduction port 36 provided in the transfer unit 23, for example. The gas supply unit 37 supplies compressed air, nitrogen, argon, helium, or the like to the through hole 32 of the shutter 31. Further, although not shown, an opening and closing valve that controls the supply (start and stop) of the supply of the cooling gas and a mass flow that controls the flow rate of the gas are provided between the gas supply unit 37 and the gas introduction port 36. Controller, etc.

In order to more effectively cool the sheet-like resin 16, it is preferable to increase the flow rate of the gas for cooling supplied to the resin holding member 25. In addition to this, it is preferred to also increase the flow rate of the gas. Further, the number of the gas introduction ports 36 provided in the transport unit 23 is not limited to one, and a plurality of gas introduction ports 36 may be provided. In this case, each gas introduction port 36 may be connected to the gas supply unit 37. In this case, it is possible to reduce the supply unevenness of the gas for cooling, and to more effectively cool the sheet-like resin 16.

As shown in FIGS. 2 to 3( b ), the cover member 38 is provided to surround the periphery of the plurality of resin holding members 25 disposed in the resin arrangement portion 26 . By providing the cover member 38, it is possible to reduce the influence of heat received from the heater 29 provided in the object holding member 24 (refer to (b) of FIG. 2). In order to be more effective, it is preferable to constitute the cover member 38 with a heat insulating material. By providing the cover member 38, the cooling effect in the cover member 38 can be improved, and the temperature rise of the sheet-like resin 16 can be further suppressed.

The gas for cooling supplied from the gas supply unit 37 sequentially passes through the gas introduction port 36 and the communication path 35 of the transport unit 23, the gas supply port 33 of the shutter 31 constituting the resin holding member 25, the through hole 32, and the gas discharge port 34, The space inside the cover member 38 is discharged from the cover member 38 to the outside. Since the gas for cooling flows in the space inside the cover member 38, the sheet-like resin 16 and the guide member 30 are directly cooled by the gas for cooling. Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed. Further, in the drawings of the present application, the flow of the gas is indicated by a thick arrow (one-sided arrow) in order to clarify the flow of the gas for cooling.

Since the cover member 38 is provided so as to surround the periphery of the plurality of resin holding members 25, even if the resin powder or the like which is generated by deterioration of the sheet-like resin 16 is scattered during the conveyance of the sheet-like resin 16, it can be accommodated in the cover member 38. Inside. Therefore, it is possible to suppress the resin molding apparatus 1 from being contaminated by resin powder or the like. In addition, by adding a dust collecting portion DC (dust collector) having a dust collecting function to the lid member 38, the resin powder or the like can be prevented from flying in the lid member 38 by the gas for cooling. In this case, it is possible to suppress the resin holding member 25 from being contaminated by resin powder or the like.

Further, by collecting the resin powder using the dust collecting portion DC, the flow rate of the cooling gas supplied to the resin holding member 25 can be increased. Thereby, the effect of cooling the sheet-like resin 16 can be further improved.

(Operation of Transfer and Supply of Resin) The operation of transporting the sheet-like resin 16 by the transfer device 11 and supplying the sheet-like resin 16 to the can 17 provided in the lower mold 8 will be described with reference to FIGS. 1 to 3(b).

First, as shown in Fig. 1, in the resin molding apparatus 1, the upper mold 7 and the lower mold 8 are opened. Next, the lead frame 13 and the sheet-like resin 16 on which the semiconductor chip 12 is mounted are transferred between the upper mold 7 and the lower mold 8 by using the transport device 11 (see FIG. 2).

As shown in FIG. 3(b), during the conveyance of the sheet-like resin 16, the sheet-like resin 16 is held by the resin holding member 25 by the guide member 30 and the L-shaped stopper 31. In a state where the sheet-like resin 16 is held by the resin holding member 25, the gas supply port 33 of the shutter 31 is connected to the communication path 35 of the transport unit 23. Therefore, during the conveyance of the sheet-like resin 16, the cooling gas is supplied to the through hole 32, and the sheet-like resin 16 is cooled by the shutter 31.

Next, the cover member 38 surrounding the resin holding member 25 is moved to the outside of the conveying device 11 by a moving mechanism (not shown).

Next, as shown in FIG. 3(b), the L-shaped shutter 31 is moved in the right direction of the drawing by using a drive mechanism (not shown). Thereby, the shutter 31 is opened and the sheet-like resin 16 is supplied to the tank 17 provided in the lower mold 8 (refer to FIG. 1). The shutter 31 is movable in the direction indicated by the arrows on both sides. When the shutter 31 is opened, the communication passage 35 of the gas supply port 33 of the shutter 31 and the conveying unit 23 is blocked. Therefore, in a state where the shutter 31 is opened, the gas for cooling is not supplied to the through hole 32.

In this way, while the sheet-like resin 16 is being conveyed, in other words, while the sheet-like resin 16 is held by the resin holding member 25, the gas for cooling can be supplied to the shutter 31, and the shutter 31 can be used. The sheet-like resin 16 is cooled. Therefore, it is possible to reduce the influence of heat received from the heater 29 provided in the object holding member 24 (see (b) of FIG. 2), and it is possible to suppress an increase in the temperature of the sheet-like resin 16 during the conveyance.

After the sheet-like resin 16 is supplied to the tank 17 (see FIG. 1) provided in the lower mold 8, the shutter 31 is maintained in an open state. Thereby, the state in which the supply of the gas for cooling is stopped is maintained in the resin holding member 25. Therefore, it is possible to suppress the temperature of the temperature-raising molding die from fluctuating due to the gas for cooling. In this way, the timing, time, flow rate, and the like for cooling the sheet-like resin 16 held in the resin holding member 25 can be arbitrarily controlled.

Further, the supply of the gas for cooling can be controlled by an on-off valve or a mass flow controller (not shown) provided between the gas supply unit 37 and the gas introduction port 36. In this case as well, the timing, time, flow rate, and the like for cooling the sheet-like resin 16 held in the resin holding member 25 can be arbitrarily controlled.

(Operation and Effect) The transport device 11 of the present embodiment includes the object holding member 24 and holds the lead frame 13 as a resin molding object, and the heater 29 as a heating portion is provided in the object holding member 24 The lead frame 13 is heated; the resin holding member 25 holds the sheet-like resin 16 as a resin; the shutter 31 as a cooling portion cools the sheet-like resin 16 held in the resin holding member 25; and the cover member 38, surrounding the periphery of the resin holding member 25.

According to this configuration, the lead frame 13 during the conveyance is preheated by the heater 29, and the adhesion between the lead frame 13 and the cured resin is improved. Thereby, the sheet-like resin 16 is also affected by the heat of the heater 29. Therefore, the conveyance device 11 is provided with a shutter 31 that cools the sheet-like resin 16 held in the resin holding member 25 and a cover member 38 that surrounds the periphery of the resin holding member 25. In this case, the influence of the heat received from the heater 29 during the conveyance of the sheet-like resin 16 can be reduced, and the temperature rise of the sheet-like resin 16 can be suppressed.

More specifically, according to the present embodiment, the lead frame 13 and the sheet-like resin 16 are conveyed in batches using the transfer device 11. In order to improve the adhesion between the lead frame 13 and the hardened resin, the lead frame 13 is preheated by the heater 29 during the transfer. Thereby, the sheet-like resin 16 is also affected by the heat of the heater 29. Therefore, the through hole 32 is provided in the shutter 31 constituting the resin holding member 25, and the gas for cooling is supplied to the through hole 32. The shutter 31 itself is cooled by the gas for cooling. Thereby, the sheet-like resin 16 held in the resin holding member 25 can be cooled by the shutter 31. Therefore, even if the lead frame 13 is preheated during the conveyance, the temperature rise of the sheet-like resin 16 can be suppressed.

Further, the sheet-like resin 16 held in the resin holding member 25 can be directly cooled by the cooling gas discharged from the gas discharge port 34 formed in the shutter 31. Thereby, the cooling effect of the sheet-like resin 16 can be further improved.

In addition to this, the cover member 38 is provided so as to surround the periphery of the resin holding member 25. By providing the cover member 38, the influence of heat received from the heater 29 can be further reduced. Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed.

According to the present embodiment, in the process of transporting the lead frame 13 and the sheet-like resin 16, even if the lead frame 13 is preheated, the temperature rise of the sheet-like resin 16 can be suppressed. Thereby, it is possible to suppress a part of the sheet-like resin 16 from being melted and adhering to the resin holding member 25 during the conveyance. Therefore, it is possible to reduce the conveyance failure of the sheet-like resin 16 and to suppress the failure that the sheet-like resin 16 cannot be supplied to the molding die 9. Thereby, the yield of the resin molded article is improved. In addition to this, the number or time of cleaning the conveying device 11 or the resin molding device 1 can be reduced. Furthermore, the number of times of maintenance can be reduced. Therefore, the utilization rate of the resin molding apparatus 1 can be improved.

According to the present embodiment, it is possible to suppress the temperature rise of the sheet-like resin 16 during the process of conveying the lead frame 13 and the sheet-like resin 16. Thereby, deterioration or deterioration of the sheet-like resin 16 can be suppressed. Therefore, the yield of the resin molded article can be improved and the quality can be improved.

In addition, it is possible to suppress generation of resin powder, a single piece, or the like from the sheet-like resin 16 due to deterioration or deterioration of the sheet-like resin 16 . Thereby, scattering of resin powder or the like can be suppressed and the resin molding apparatus 1 can be contaminated. Therefore, the productivity of the resin molding apparatus 1 can be improved.

According to the present embodiment, the dust collecting portion DC can be added to the lid member 38. Thereby, it is possible to suppress the resin powder or the like from flying in the lid member 38 due to the gas for cooling. In addition, the flow rate of the cooling gas supplied to the resin holding member 25 can be increased, and the effect of cooling the sheet-like resin 16 can be further improved.

[Embodiment 2] (Configuration of Resin Holding Member) The configuration of the resin holding member used in the second embodiment will be described with reference to Figs. 4(a) and 4(b). Unlike the first embodiment, the gas discharge port constituting the shutter of the resin holding member is provided on both side surfaces of the lower portion of the shutter. The other configuration is basically the same as that of the first embodiment, and thus the description thereof is omitted.

As shown in FIGS. 4(a) and 4(b), the resin holding member 39 includes four lead-shaped guide members 30 and an L-shaped shutter 40. A cover is formed at the bottom of the L-shaped shutter 40, and a gas discharge port 41 is formed at both lower sides of the shutter 40. Therefore, the through hole 42 which is a hollow passage is formed in an inverted T shape. The through hole 42 has a through hole 42a as a portion extending in the vertical direction and a through hole 42b as a portion extending in the horizontal direction. The gas for cooling is discharged from the gas discharge port 41 through the gas supply port 33 of the shutter 40 through the through hole 42a and the through hole 42b. Therefore, the distance over which the gas for cooling can flow can be lengthened, and the effect of cooling the shutter 40 itself can be improved.

The position where the gas supply port 33 of the L-shaped shutter 40 is disposed in the resin arrangement portion 26 is the same position as in the first embodiment. Therefore, the position of the communication path 35 formed in the transport unit 23 is also the same as that in the first embodiment. The other configuration is the same as that of the first embodiment, and thus the description thereof will be omitted.

According to the present embodiment, the bottom of the L-shaped shutter 40 is covered, and the gas discharge port 41 is provided on both side surfaces of the lower portion of the shutter 40. In the case where the resin powder or the like is dropped on the bottom surface of the lid member 38, the cooling gas can be discharged from the side discharge port 41 to suppress the flying of the resin powder or the like in the lid member 38. Also in the present embodiment, the same effects as those of the first embodiment are obtained.

[Embodiment 3] (Configuration of Resin Holding Member) The configuration of the resin holding member used in the third embodiment will be described with reference to Figs. 5(a) and 5(b). The difference from the first embodiment is that the side surface of the shutter constituting the resin holding member is directly in contact with the sheet-like resin 16. The other configuration is basically the same as that of the first embodiment, and thus the description thereof is omitted.

As shown in FIGS. 5(a) and 5(b), the resin holding member 43 includes four guide members 30 in a pin shape and an L-shaped shutter 44. The difference from the first embodiment is the shape of the L-shaped shutter 44 and the position at which the shutter 44 is disposed at the resin arrangement portion 26. The width of the bottom surface portion of the L-shaped shutter 44 is formed to be smaller than the interval between the guide members 30. Thereby, the side surface of the L-shaped shutter 44 can be directly contacted with the sheet-like resin 16. In this case, the position where the L-shaped shutter 44 is disposed in the resin arrangement portion 26 is different from that in the first embodiment. Therefore, in a state where the sheet-like resin 16 is held by the resin holding member 43, the communication path 45 is formed to be connected to the gas supply port 33 formed in the shutter 44, respectively. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted.

According to the present embodiment, the side surface of the shutter 44 constituting the resin holding member 43 is directly in contact with the sheet-like resin 16. Thereby, the sheet-like resin 16 can be cooled more effectively. Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed. Also in the present embodiment, the same effects as those of the first embodiment are obtained.

[Embodiment 4] (Configuration of Resin Holding Member) The configuration of the resin holding member used in the fourth embodiment will be described with reference to Figs. 6(a) and 6(b). The difference from the first embodiment is that a through hole that is a hollow passage for supplying a gas for cooling is formed in the four guide members. The other configuration is basically the same as that of the first embodiment, and thus the description thereof is omitted.

As shown in FIGS. 6(a) and 6(b), the resin holding member 46 includes four lead-shaped guide members 47 and an L-shaped shutter 48. A through hole 49 as a hollow passage is formed in each of the four lead-shaped guide members 47. The guide member 47 can be cooled by supplying the gas for cooling to the through hole 49, and the sheet-like resin 16 held in the resin holding member 46 can be cooled by the guide member 47. Therefore, the guide member 47 functions as a cooling portion that cools the sheet-like resin 16 . The through hole 49 formed in the guide member 47 functions as a gas supply unit that supplies a gas for cooling. Since the sheet-like resin 16 is cooled by the four guide members 47, the cooling effect of the sheet-like resin 16 can be further improved. Further, in this case, the through hole is not formed in the L-shaped shutter 48.

The gas for cooling is discharged from the gas discharge port 51 of the guide member 47 through the through hole 49 from the gas discharge port 51. The sheet-like resin 16 can be directly cooled by the cooling gas discharged from the gas discharge port 51. Thereby, the cooling effect of the sheet-like resin 16 can be further improved. In addition, in order to further effectively cool the sheet-like resin 16, it is preferable to form the guide member 47 and the L-shaped stopper 48 by a thermally conductive material having a high thermal conductivity, thereby strongly reinforcing the resin holding member 46 itself. Cool down.

In the transport unit 23, the communication path 52 is formed so as to be connected to each of the gas supply ports 50 formed in the four guide members 47 constituting each of the resin holding members 46. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted.

According to the present embodiment, the through holes 49 are formed in the four guide members 47 constituting the resin holding member 46, respectively. By supplying the gas for cooling to the through hole 49, the sheet-like resin 16 can be further efficiently cooled. Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed. Also in the present embodiment, the same effects as those of the first embodiment are obtained.

[Embodiment 5] (Configuration of the conveying device and the resin holding member) The configuration of the conveying device and the resin holding member used in the fifth embodiment will be described with reference to Figs. 7(a) to 8(b). Unlike the first embodiment, the resin holding member is configured by a housing member that accommodates the sheet-like resin and a shutter that is an opening and closing member, and a hollow passage is formed to surround the periphery of the housing member. The other configuration is basically the same as that of the first embodiment, and thus the description thereof is omitted.

As shown in Fig. 7 (a) and Fig. 7 (b), the conveying device 53 includes, for example, a conveying unit 54, an object holding member 24 that holds the resin molding object, and a resin holding member 55 that holds the resin. In the conveyance device 53, the object holding member 24 is disposed on both sides of the conveyance unit 54, and a plurality of resin holding members 55 are disposed in the resin placement portion 56 provided in the center portion of the conveyance unit 54. In this case, the conveying device 53 has two object holding members 24 and five resin holding members 55. In the fifth embodiment, the transfer device 53 transports the lead frame 57 on which the semiconductor chip 12 is mounted and the sheet-like resin 16 in batches.

As shown in FIG. 7(a), five semiconductor chips 12 are mounted in each lead frame 57. Five resin holding members 55 are disposed in the resin disposing portion 56, and the sheet-like resin 16 is held in each of the resin holding members 55. The number of the semiconductor chips 12 mounted on the lead frame 57 and the number of the resin holding members 55 disposed in the resin arrangement portion 56 can be arbitrarily set.

As shown in FIGS. 7( a ) and 7 ( b ), the resin holding member 55 includes, for example, a housing member 58 that accommodates the sheet-like resin 16 and a shutter 59 that is an opening and closing member. The accommodating member 58 is disposed in the resin arranging portion 56 and attached to the bottom surface of the transport unit 54. In the resin arrangement portion 56, the shutter 59 can be moved (opened and closed) by a drive mechanism (not shown). As shown in FIG. 7(a), the shutter 59 is formed in a plate shape, for example. The sheet-like resin 16 accommodated in the accommodating member 58 is held by the resin holding member 55 by a plate-shaped shutter 59. In this case, each of the housing members 58 is provided with a plate-shaped shutter 59. However, a plate-shaped shutter that is continuous in correspondence with all of the housing members 58 may be provided.

The resin arrangement portion 56 is composed of a plurality of resin holding members 55 and an outer frame 60 as a frame-shaped member. The outer frame 60 is attached to the bottom surface of the transport unit 54. In the resin arranging portion 56 , the accommodating member 58 is disposed inside the outer frame 60 and attached to the bottom surface of the transport unit 54 . The height of the outer frame 60 and the height of the housing member 58 are set to be the same height. Therefore, a space is formed between the outer peripheral surface of the accommodating member 58 and the outer frame 60 so as to surround the accommodating member 58. This space constitutes, for example, a through passage 61 which is a hollow passage for supplying a gas for cooling in order to cool the sheet-like resin 16 . Therefore, as shown in FIG. 7(b), the through passage 61 has a gas supply portion 62 that supplies gas to the upper portion and a gas discharge portion 63 that discharges gas at the lower portion.

By cooling the accommodating member 58 itself by supplying the gas for cooling to the through passage 61, the sheet-like resin 16 held in the resin holding member 55 is cooled by the accommodating member 58. Therefore, the accommodating member 58 functions as a cooling portion that cools the sheet-like resin 16 . The through passage 61 formed to surround the periphery of the housing member 58 functions as a gas supply unit that supplies a gas for cooling. The gas for cooling is discharged from the gas supply unit 62 through the through passage 61 from the gas discharge unit 63. As the gas for cooling, compressed air, nitrogen, argon, helium or the like is used.

By cooling the sheet-like resin 16 by the gas for cooling, the influence of heat received from the heater 29 provided in the object holding member 24 can be reduced. Therefore, it is possible to suppress an increase in the temperature of the sheet-like resin 16 during the conveyance.

As shown in FIGS. 7(b) and 8(b), in the transport unit 54, the communication path 64 is formed so as to be connected to the gas supply unit 62 that surrounds the through path 61 of each of the storage members 58. The communication path 64 is connected to the gas supply unit 37 via the gas introduction port 65 provided in the transfer unit 54. The gas supply unit 37 supplies compressed air, nitrogen, argon, helium, or the like to the through passage 61. In the same manner as in the first embodiment, the gas supply unit 37 and the gas introduction port 65 are provided with an on-off valve that controls the supply (start and stop) of the supply of the cooling gas, and controls the flow rate of the gas. Mass flow controllers, etc.

In order to more effectively cool the sheet-like resin 16, it is preferable to provide a plurality of gas introduction ports 65 provided in the conveying unit 54. In addition to this, it is preferable to increase the flow rate of the cooling gas supplied to the through passage 61 and to increase the flow rate of the gas. In this case, it is possible to reduce the supply unevenness of the gas for cooling, and to more effectively cool the sheet-like resin 16.

In the present embodiment, after the sheet-like resin 16 is supplied to the tank 17 (see FIG. 1) provided in the lower mold 8, the gas for cooling is stopped by an on-off valve or a mass flow controller (not shown). supply. Thereby, it is possible to suppress the temperature of the temperature-raising molding die from fluctuating due to the gas for cooling. The timing, time, flow rate, and the like for cooling the sheet-like resin 16 are arbitrarily controlled by the on-off valve and the mass flow controller.

In the present embodiment, the cover member 38 is also provided to surround the periphery of the plurality of resin holding members 55 disposed in the resin disposing portion 56. In the same manner as in the first embodiment, by providing the cover member 38, it is possible to reduce the influence of heat received from the heater 29 provided in the object holding member 24 (see FIG. 7(b)). Further, the dust collecting portion DC having the dust collecting function can be added to the lid member 38.

According to the present embodiment, a through passage 61 as a hollow passage for supplying a gas for cooling is provided between the outer peripheral surface of the accommodating member 58 and the outer frame 60. The gas for cooling is supplied to the through passage 61, whereby the sheet-like resin 16 is cooled by the accommodating member 58. Since the through passage 61 is formed to surround the periphery of the accommodation member 58, the sheet-like resin 16 can be further effectively cooled. Therefore, even if the lead frame 57 is preheated during the conveyance, the temperature rise of the sheet-like resin 16 can be further suppressed. Also in the present embodiment, the same effects as those of the first embodiment are obtained.

[Embodiment 6] (Configuration of resin arrangement portion) The configuration of the resin arrangement portion used in the sixth embodiment will be described with reference to Figs. 9(a) to 9(c). Unlike the fifth embodiment, the bottom plate is provided on the bottom surface side of the resin disposing portion, and the gas discharge port is provided in the outer frame of the resin disposing portion. The other configuration is basically the same as that of the fifth embodiment, and thus the description thereof is omitted.

As shown in Fig. 9 (a) to Fig. 9 (c), the resin arrangement portion 66 includes a resin holding member 55 having a housing member 58 and a shutter 59 shown in the fifth embodiment, and an outer frame 67 as a frame member. And a bottom plate 68 that covers the space formed between the outer peripheral portion of the housing member 58 and the outer frame 67. The bottom plate 68 is provided in such a manner as to be fitted into a space between the housing member 58 and the outer frame 67. The position at which the resin holding member 55 is attached to the conveying unit 54 is the same position as that of the fifth embodiment. Therefore, in the resin arrangement portion 66, the position of the gas supply portion 62 to which the cooling gas is supplied is also formed at the same position as that of the fifth embodiment.

As shown in Fig. 9 (a) and Fig. 9 (c), for example, a gas discharge port 69 for discharging a gas for cooling is provided at four corners of the outer frame 67 of the resin disposing portion 66. As shown in FIGS. 9(b) and 9(c), a communication passage 70 is formed by providing a gas discharge port 69 for causing the cooling gas supplied from the gas supply unit 62 to face the outer frame 67. A hollow passage through which the gas discharge ports 69 provided at the four corners flow. The communication path 70 has a communication path 70a as a portion that allows gas to flow in the vertical direction, and a communication path 70b as a portion that allows gas to flow in the horizontal direction.

The transport unit 54 can use the same transport unit as that of the fifth embodiment. Therefore, the communication path 64 is formed in the transfer unit 54 so as to be connected to the gas supply unit 62 of the resin arrangement portion 66, respectively. The gas for cooling is sequentially discharged from the gas discharge port 69 through the gas introduction port 65 of the transfer unit 54 and the communication path 64, the gas supply unit 62 of the resin arrangement portion 66, and the communication path 70 (70a, 70b).

By supplying the cooling gas to the communication passage 70 (70a, 70b), the accommodating member 58 itself can be cooled, and the sheet-like resin 16 held in the resin holding member 55 can be cooled by the accommodating member 58. Since the bottom plate 68 is provided in the resin arrangement portion 66, the accommodation member 58 is surrounded by the closed communication passage 70. Therefore, the sheet-like resin 16 can be further effectively cooled. The other configuration is the same as that of the fifth embodiment, and thus the description thereof is omitted.

According to the present embodiment, the resin arranging portion 66 is provided with a bottom plate 68 that covers the space formed between the outer peripheral surface of the accommodating member 58 and the outer frame 67. Further, a gas discharge port 69 for discharging the gas for cooling is provided at the four corners of the outer frame 67. The housing member 58 is surrounded by a closed communication passage 70. By supplying the gas for cooling to the communication path 70, the sheet-like resin 16 can be further effectively cooled. Therefore, even if the lead frame 57 is preheated during the conveyance, the temperature rise of the sheet-like resin 16 can be further suppressed. Also in the present embodiment, the same effects as those of the fifth embodiment are obtained.

In the present embodiment, the gas discharge ports 69 through which the cooling gas is discharged are provided at the four corners of the outer frame 67. However, the present invention is not limited thereto, and a plurality of gas discharge ports 69 for discharging the gas for cooling may be provided on each of the four surfaces surrounding the outer frame of the resin holding member 55. Thereby, the flow of the gas for cooling can be made smoother.

[Embodiment 7] (Configuration of the conveying device and the resin holding member) The configuration of the conveying device and the resin holding member used in the seventh embodiment will be described with reference to Figs. 10(a) to 11(b). Unlike the first embodiment, a Peltier element as a cooling element and graphite having a high thermal conductivity are used as a cooling portion for cooling the sheet-like resin. The other configuration is basically the same as that of the first embodiment, and thus the description thereof is omitted.

As shown in FIGS. 10( a ) and 10 ( b ), the conveying device 71 includes, for example, a conveying unit 72 , an object holding member 24 , and a resin holding member 73 . The object holding member 24 and the lead frame 13 are the same as those shown in the first embodiment. Three resin holding members 73 are disposed in the resin disposing portion 74, and the sheet-like resin 16 is held in each of the resin holding members 73.

The resin holding member 73 includes four lead members 75 in a pin shape and an L-shaped shutter 48. The four guiding members 75 are connected to the Peltier element 78 as a cooling element, for example, via graphite 76 and graphite 77 as heat conductive members. As shown in FIG. 10( b ), one end of the graphite 76 is connected to the guide member 75 , and the other end of the graphite 76 penetrates the transport unit 72 and extends to the upper surface of the transport unit 72 . As shown in FIGS. 10( a ) and 10 ( b ), one end of the graphite 77 disposed on the upper surface of the transport unit 72 has, for example, a portion extending in parallel and connected to the other end of the four graphites 76 . The other end of the graphite 77 is connected to the Peltier element 78. The L-shaped stopper 48 is the same as the shutter shown in the fourth embodiment, and a through hole is not formed.

(a) and (b) of FIG. 10 show a case where the sheet-like resin 16 held in each of the resin holding members 73 is cooled by one Peltier element 78, and each resin holding member 73 correspondingly sets the Peltier element 78. However, the present invention is not limited thereto, and as long as the cooling effect of the Peltier element 78 is sufficient, one Peltier element 78 may be disposed corresponding to the plurality of resin holding members 73. The position at which the Peltier element 78 is disposed can be set to any position in the upper surface of the transport unit 72 where the graphite 77 can be disposed.

As shown in Fig. 11 (b), the Peltier element 78 is an element which causes an endothermic phenomenon and a heat release phenomenon by flowing a direct current from the direct current voltage source 79. For example, by flowing a direct current from the direct current voltage source 79, one of the electrodes of the Peltier element 78 becomes a cooling portion 78a that is cooled by endothermic heat from the periphery, and the other electrode of the Peltier element 78 becomes heated by the periphery. Heated heating portion 78b. The Peltier element 78 is a cooling element that cools the sheet-like resin 16 as an object to be cooled, for example, by using the cooling portion 78a.

As shown in FIGS. 10( a ) to 11 ( b ), the graphite 76 and the graphite 77 thermally connect the cooling portion 78 a of the Peltier element 78 to the guiding member 75 . Graphite 76 and graphite 77 are, for example, members having a thermal conductivity which is about 2 to 5 times that of copper and which is extremely inferior to diamond. The Peltier element 78 thermally transfers heat of cooling from the cooling portion 78a of the Peltier element 78 to the guiding member 75 via the graphite 77 and the graphite 76. Thereby, the guiding member 75 is cooled by the cooling heat from the Peltier element 78. The sheet-like resin 16 can be cooled by the cooled guide member 75. Therefore, the Peltier element 78, the graphite 77, the graphite 76, and the guiding member 75 function as a cooling portion that cools the sheet-like resin 16. Further, the shape of the graphite 76 and the graphite 77 is preferably a shape in which the cooling heat from the Peltier element 78 is efficiently conducted to the guiding member 75.

By cooling the sheet-like resin 16 by using the Peltier element 78, it is possible to reduce the influence of heat received from the heater 29 provided in the object holding member 24. Therefore, the temperature rise of the sheet-like resin 16 can be suppressed.

In this case, in order to efficiently transfer the cooling heat of the cooling portion 78a of the Peltier element 78 to the guiding member 75, the graphite 76 having a very high thermal conductivity is disposed between the Peltier element 78 and the guiding member 75. Graphite 77. However, the present invention is not limited thereto, and a member having a high thermal conductivity such as copper may be disposed between the Peltier element 78 and the guiding member 75. In addition to this, it is preferable to use a member having a high thermal conductivity and high wear resistance as the guide member 75 itself. The guiding member 75 itself may also be constituted by graphite.

As shown in FIGS. 10(b) and 11(b), the Peltier element 80 can be connected to the lower surface of the cover member 38 surrounding the resin holding member 73. The cooling unit 80a and the heating unit 80b are formed by flowing a direct current from the DC voltage source 81. The cooling portion 80a of the Peltier element 80 is thermally coupled to the lower surface of the cover member 38. In this case, it is preferable to form the cover member 38 from graphite or copper having high thermal conductivity.

The cooling heat is thermally conducted from the cooling portion 80a of the Peltier element 80, and the lid member 38 itself is cooled. The inside of the cover member 38 is cooled by the cooled cover member 38. Thereby, the sheet-like resin 16 held in the inside of the lid member 38 can be further cooled. The Peltier element 80 and the lid member 38 function as a cooling portion that cools the sheet-like resin 16 . Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed.

In this case, a plurality of Peltier elements 80 are attached to the lower surface of the cover member 38. However, it is not limited thereto, and a plurality of Peltier elements 80 may be attached to the side surface of the cover member 38. In addition, as shown in FIG. 11(b), a DC voltage source 79 may be provided corresponding to each of the Peltier elements 78 for each of the DC voltage sources for causing a direct current to flow to the Peltier element, or may be associated with a plurality of Pale. The splicing element 80 is correspondingly provided with a DC voltage source 81.

Further, although not shown, in order to stably use the Peltier element 78 and the Peltier element 80, it is preferable to connect the heat sink to the heating element 78b and the heating portion of the Peltier element 78 and the Peltier element 80 in advance. 80b side. Thereby, it is possible to suppress the Peltier element 78 and the Peltier element 80 from becoming high in temperature and causing a problem in the solder joint portion.

According to the present embodiment, the guide member 75 constituting the resin holding member 73 is thermally connected to the Peltier element 78 as a cooling element via the graphite 76 and the graphite 77 as the heat conductive members. By causing a direct current to flow to the Peltier element 78, the cooling heat is thermally conducted from the cooling portion 78a of the Peltier element 78 via the graphite 77 and the graphite 76, and the guiding member 75 is cooled. The sheet-like resin 16 can be cooled by the cooled guide member 75. Therefore, the temperature rise of the sheet-like resin 16 can be suppressed.

Further, the Peltier element 80 is also thermally connected to the lower surface of the cover member 38. The cover member 38 itself is cooled by causing a direct current to flow to the Peltier element 80 to heat the cooling heat from the cooling portion 80a of the Peltier element 80. Thereby, the sheet-like resin 16 held in the inside of the cover member 38 can be further cooled. Therefore, the temperature rise of the sheet-like resin 16 can be further suppressed.

According to the present embodiment, the sheet-like resin 16 is cooled by thermally conducting the cooling heat from the Peltier element 78 and the Peltier element 80. Since the gas for cooling is not used, the environment is not impaired, and the configuration of the cooling portion is also simple, and maintenance inspection can be facilitated. In addition, when there is a resin powder or the like that has fallen on the bottom surface of the lid member 38, it is possible to suppress the resin powder or the like from flying in the lid member 38 due to the gas for cooling. Also in the present embodiment, the same effects as those of the first embodiment are obtained.

In the present embodiment, the Peltier element 78 and the Peltier element 80 are provided on the upper surface of the transport unit 72 and the lower surface of the cover member 38, respectively. However, the present invention is not limited thereto, and the cooling effect of the Peltier element 78 provided on the upper surface of the transport unit 72 (the effect of suppressing the temperature rise of the sheet-like resin 16) is sufficient, and the lower surface of the cover member 38 may not be provided. Ear post element 80.

In each of the embodiments, an example in which a cylindrical sheet-like resin is used as the shape of the sheet-like resin 16 is exemplified. However, the shape of the sheet-like resin may be a quadrangular prism shape, a disk shape, or a flat shape. There is no particular requirement as long as it is a resin having a shape of a solid shape.

As described above, the transport apparatus of the above-described embodiment includes the object holding member that holds the resin molded object, the heating unit that is provided on the object holding member and heats the resin molded object, and the resin holding member. The resin is held; the cooling portion cools the resin held by the resin holding member; and the cover member surrounds the periphery of the resin holding member.

According to this configuration, the resin held by the resin holding member is cooled by the cooling portion. Further, the periphery of the resin holding member is surrounded by the cover member. Therefore, it is possible to reduce the influence of heat received from the outside, thereby suppressing the temperature rise of the resin.

Furthermore, in the conveying apparatus of the above-described embodiment, the cooling unit includes a gas supply unit that is provided in the resin holding member and that is formed by a hollow passage that supplies the gas.

According to this configuration, the cooling gas is supplied to the hollow passage of the cooling unit to cool the cooling unit. Therefore, the resin can be cooled by the cooled cooling portion.

Furthermore, in the conveyance device of the above-described embodiment, the hollow passage is formed from the gas supply port provided in the upper portion of the resin holding member toward the gas discharge port provided in the lower portion of the resin holding member. The gas discharged from the outlet flows inside the cover member.

According to this configuration, the cooling gas is supplied to the hollow passage provided in the resin holding member to cool the cooling portion. Further, the resin is cooled by the gas for cooling discharged to the lid member. Therefore, the resin can be cooled more effectively.

Furthermore, in the conveyance device of the above-described embodiment, the hollow passage is formed from the gas supply port provided in the upper portion of the resin holding member toward the gas discharge port provided on the side surface of the resin holding member, and is arranged from the gas discharge port. The gas discharged from the outlet flows inside the cover member.

According to this configuration, when there is a resin powder or the like that has fallen on the bottom surface of the lid member, it is possible to suppress the resin powder or the like from flying in the lid member due to the gas for cooling.

Furthermore, in the conveyance device of the above-described embodiment, the resin holding member includes a guide member and an opening and closing member.

According to this configuration, the resin holding member is configured by the guiding member and the opening and closing member, and the resin held by the resin holding member can be cooled by the guiding member or the opening and closing member.

Furthermore, in the conveyance device of the above-described embodiment, the resin holding member includes a housing member and an opening and closing member.

According to this configuration, the resin holding member is configured by the accommodating member and the opening and closing member, and the resin held by the resin holding member can be cooled by the accommodating member.

Furthermore, in the conveyance device of the above-described embodiment, the hollow passage is formed in the guide member or the opening and closing member.

According to this configuration, the hollow passage is formed in the guide member or the opening and closing member. The resin can be cooled by supplying a gas for cooling to a hollow passage.

Furthermore, in the conveyance device of the above-described embodiment, the hollow passage is formed to surround the periphery of the accommodation member.

According to this configuration, a hollow passage is formed to surround the periphery of the housing member. The resin can be cooled by supplying a gas for cooling to a hollow passage.

Further, in the conveying apparatus of the above-described embodiment, the cooling unit includes a Peltier element and a thermally conductive member that thermally connects the Peltier element to the guiding member.

According to this configuration, the cooling portion is configured by the Peltier element, the thermally conductive member, and the guiding member. The guide member is cooled by the thermal conductive member using the Peltier element. Thus, the resin can be cooled by the guiding member.

Further, in the conveying device of the above embodiment, the cooling portion is a Peltier element thermally connected to the lid member.

According to this configuration, the cooling portion is configured by the Peltier element connected to the cover member. The cover member is cooled using a Peltier element. Therefore, the resin can be cooled by the cover member.

Further, in the conveying device of the above-described embodiment, the cover member includes a dust collecting portion.

According to this configuration, by providing the dust collecting portion in the lid member, it is possible to suppress the resin powder or the like from flying in the lid member.

Further, the resin molding apparatus includes the conveying apparatus of the above embodiment.

According to this configuration, by using the conveying device of the above-described embodiment, it is possible to suppress an increase in the temperature of the resin during the conveyance.

Further, in the method of producing a resin molded article, the resin molding object conveyed by the conveying device is subjected to resin molding using the resin molding apparatus of the above-described embodiment.

According to this method, by using the conveying device included in the resin molding apparatus of the above-described embodiment, it is possible to suppress an increase in the temperature of the resin during the conveyance.

The present invention is not limited to the above-described embodiments, and may be combined, changed, or selectively used arbitrarily and appropriately, as needed within the scope of the gist of the invention.

1‧‧‧Resin forming device

2‧‧‧Base

3‧‧‧ tied

4‧‧‧ fixed platen

5‧‧‧ movable platen

6‧‧‧Clamping mechanism

7‧‧‧上模

8‧‧‧下模

9‧‧‧ Forming die

10‧‧‧heater

11, 53, 71‧‧‧Transporting device

12‧‧‧Semiconductor chip

13, 57‧‧‧ lead frame (resin molding object)

14‧‧‧Configuration area

15‧‧‧bonding line

16‧‧‧Flake Resin (Resin)

17‧‧‧ cans

18‧‧‧Plunger

19‧‧‧ drive mechanism

20‧‧‧ chamber

21‧‧‧ Collection recess

22‧‧‧Runner

23, 54, 72‧‧‧ transport unit

24‧‧‧Object holding member

25, 39, 43, 46, 55, 73‧‧‧ resin holding members

26, 56, 66, 74‧‧‧ Resin Configuration Department

27‧‧‧Abutment

28‧‧‧ lead frame press plate

29‧‧‧heater (heating section)

30‧‧‧Guide members

31, 40, 44‧‧ ‧ blocking (cooling section, opening and closing member)

32, 42, 42a, 42b, 49‧‧‧through holes (hollow passage, gas supply)

33, 50‧‧‧ gas supply port

34, 41, 51, 69‧‧‧ gas discharge

35, 45, 52, 64‧‧ ‧ connected roads

36, 65‧‧‧ gas inlet

37‧‧‧Gas Supply Department

38‧‧‧Cover components

47, 75‧‧‧ Guide member (cooling section)

48, 59‧‧ ‧Blocks (opening and closing members)

58‧‧‧ housing member (cooling unit)

60, 67‧‧‧ frame

61‧‧‧through road (hollow passage, gas supply)

62‧‧‧Gas Supply Department

63‧‧‧ gas discharge department

68‧‧‧floor

70, 70a, 70b‧‧‧ connected roads (hollow passages, gas supply parts)

76, 77‧‧‧ graphite (thermal conductive member, cooling unit)

78, 80‧‧‧Paltier components (cooling section)

78a, 80a‧‧‧ Cooling Department

78b, 80b‧‧‧ heating department

79, 81‧‧‧ DC voltage source

DC‧‧‧Dust Department

Fig. 1 is a schematic configuration diagram showing an outline of a resin molding apparatus of the present invention. 2 is a schematic view showing a conveying device in the first embodiment, wherein (a) of FIG. 2 is a schematic bottom view, and (b) of FIG. 2 is a schematic cross-sectional view. 3(a) and 3(b) are schematic views showing a resin holding member in the first embodiment, wherein Fig. 3(a) is a schematic bottom view, and Fig. 3(b) is a cross-sectional view taken along line A-A. 4(a) and 4(b) are schematic views showing a resin holding member in a second embodiment, wherein Fig. 4(a) is a schematic bottom view, and Fig. 4(b) is a cross-sectional view taken along line B-B. 5(a) and 5(b) are schematic views showing a resin holding member in a third embodiment, wherein Fig. 5(a) is a schematic bottom view, and Fig. 5(b) is a cross-sectional view taken along line C-C. 6(a) and 6(b) are schematic views showing a resin holding member in a fourth embodiment, wherein Fig. 6(a) is a schematic bottom view, and Fig. 6(b) is a cross-sectional view taken along line D-D. 7(a) and 7(b) are schematic views showing the conveying device in the fifth embodiment, wherein Fig. 7(a) is a schematic bottom view and Fig. 7(b) is a schematic cross-sectional view. 8(a) and 8(b) are schematic views showing a resin holding member in a fifth embodiment, wherein Fig. 8(a) is a schematic bottom view, and Fig. 8(b) is a cross-sectional view taken along line E-E. 9(a) to 9(c) are schematic views showing a resin arrangement portion in a sixth embodiment, wherein Fig. 9(a) is a schematic bottom view, and Fig. 9(b) is a FF line sectional view, and Fig. 9(c) ) is a cross-sectional view of the GG line. 10(a) and 10(b) are schematic views showing a conveying device in a seventh embodiment, wherein Fig. 10(a) is a schematic bottom view, and Fig. 10(b) is a schematic cross-sectional view. 11(a) and 11(b) are schematic views showing a resin holding member in a seventh embodiment, wherein Fig. 11(a) is a schematic bottom view, and Fig. 11(b) is a cross-sectional view taken along line H-H.

Claims (13)

A conveying apparatus comprising: a target holding member that holds a resin molding object; a heating unit that is provided on the object holding member and that heats the resin molding object; and a resin holding member that holds the resin; The cooling portion cools the resin held by the resin holding member, and the cover member surrounds the periphery of the resin holding member. The conveying device according to claim 1, wherein the cooling unit includes a gas supply unit that is provided in the resin holding member and that is formed by a hollow passage that supplies a gas. The conveying device according to the second aspect of the invention, wherein the hollow passage is directed from a gas supply port provided in an upper portion of the resin holding member toward a gas discharge port provided in a lower portion of the resin holding member. Forming, the gas discharged from the gas discharge port flows inside the cover member. The conveying device according to the second aspect of the invention, wherein the hollow passage is directed from a gas supply port provided in an upper portion of the resin holding member toward a gas discharge port provided on a side surface of the resin holding member. Forming, the gas discharged from the gas discharge port flows inside the cover member. The conveying device according to any one of claims 2 to 4, wherein the resin holding member includes a guiding member and an opening and closing member. The conveying device according to any one of claims 2 to 4, wherein the resin holding member includes a housing member and an opening and closing member. The conveying device according to claim 5, wherein the hollow passage is formed in the guiding member or the opening and closing member. The conveying device according to claim 6, wherein the hollow passage is formed to surround a periphery of the accommodating member. The conveying device according to claim 5, wherein the cooling portion includes a Peltier element and a thermally conductive member that thermally connects the Peltier element to the guiding member. The conveying device according to any one of claims 1 to 4, wherein the cooling portion is a Peltier element thermally connected to the cover member. The conveying device according to any one of claims 1 to 4, wherein the cover member includes a dust collecting portion. A resin molding apparatus comprising the conveying apparatus according to any one of the items 1 to 11. A method of producing a resin molded article, wherein the resin molded article is produced by the resin molding device according to claim 12, wherein the resin molded article is produced by the transfer device The material is subjected to resin molding.