JP6376852B2 - Dressing board holding jig - Google Patents

Description

  The present invention relates to a holding jig for a dressing board.

  In a cutting apparatus, when a dressing board is used for dressing a cutting blade, the dressing board is fixed to an annular frame with a dicing tape and used for dressing, as with other workpieces.

  Normally, the workpiece is mounted on the annular frame with dicing tape by an automatic device called a tape mounter. However, the dressing board is different from the workpiece and cannot be set on the tape mounter. It is fixed to the frame with dicing tape. Therefore, it takes extra man-hours.

  Further, the dicing tape costs several tens of yen to several hundreds of yen per sheet, and it can be said that unnecessary cost is required to process a dressing board that is not a product. Therefore, a cutting apparatus has been proposed in which a table dedicated to a dressing board is provided on the outer periphery of the chuck table (Patent Document 1).

JP 2000-49120 A

  However, a cutting device provided with a table dedicated to a dressing board is not so often employed because the introduction cost is not low. On the other hand, although it takes work man-hours and running costs, a method of fixing the dressing board to the annular frame with a dicing tape has been firmly adopted for its simplicity.

  Accordingly, an object of the present invention is to provide a dressing board holding jig that can reduce the running cost of the annular frame and the dicing tape and can reduce the number of steps for fixing the dressing board to the annular frame.

In order to solve the above-mentioned problems, a holding jig for a dressing board according to the present invention is a chuck table for sucking and holding a workpiece of a workpiece unit that supports the workpiece via a tape in an opening of an annular frame. And a cutting means having a cutting blade for cutting a workpiece sucked and held by the chuck table, and a holding jig for a dressing board used in a cutting apparatus, wherein the suction force from the chuck table A plate-shaped jig body formed on the outer diameter corresponding to the annular frame, and a placement area described above of the jig body formed around includes a positional displacement restricting portion to prevent the positional deviation of the dressing board, wherein the jig body is integral with the material of plastic or metal It is characterized in that a member.
Further, in the holding jig for the dressing board, the jig body includes a convex portion provided with the placement area, and a concave portion formed on the back side of the back side of the placement area and into which the chuck table enters. Preferably, the chuck table is clamped at a position lower than the holding surface of the chuck table by the frame clamp of the chuck table.

  Moreover, in the holding jig for the dressing board, it is preferable that the misregistration restricting portion is disposed on the jig body with a thickness smaller than the thickness of the dressing board.

  Further, in the holding jig for the dressing board, the cutting device includes a cassette mounting table on which a cassette for storing a plurality of workpiece units is mounted, the cassette mounted on the cassette mounting table, and the chuck Transporting means for supporting the annular frame between the table and transporting the workpiece unit, and the jig body on which the dressing board is placed in the placement area is housed in the cassette It is possible, and it is preferable to be transported while being supported by the transport means.

  The holding jig for the dressing board of the present invention can transport and fix the dressing board in the same manner as when the work piece is held on the annular frame by the dicing tape, while eliminating the need for the annular frame and the dicing tape. it can. Thereby, the running cost of the annular frame and the dicing tape can be reduced, and the man-hour for fixing the dressing board to the annular frame can be reduced.

FIG. 1 is a perspective view illustrating a configuration example of a cutting device. FIG. 2 is a perspective view showing a configuration example of a holding jig of the dressing board. FIG. 3 is a cross-sectional view illustrating a configuration example of a holding jig of the dressing board. FIG. 4 is a cross-sectional view showing an example of use of a holding jig for a dressing board. FIG. 5 is a perspective view illustrating a configuration example of a holding jig of the dressing board according to the second embodiment. FIG. 6 is a cross-sectional view illustrating a configuration example of a holding jig of the dressing board according to the second embodiment. FIG. 7 is a cross-sectional view illustrating a usage example of the holding jig of the dressing board according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A cutting apparatus according to Embodiment 1 will be described with reference to FIG. FIG. 1 is a perspective view illustrating a configuration example of a cutting device. The cutting apparatus 1 shown in FIG. 1 moves the chuck table 3 in the X-axis direction by sucking and holding the wafer W of the wafer unit 50 that supports the wafer W through the tape 52 in the opening of the annular frame 51. A table moving means 4 and a gate-shaped first support member 5 erected on the apparatus main body 2 so as to straddle the table moving means 4 are provided. The wafer unit 50 is a workpiece unit, and the wafer W is a workpiece.

  The chuck table 3 has a holding surface 3a for holding the wafer W. The holding surface 3a is in communication with a vacuum suction source (not shown), and sucks and holds the wafer W by the negative pressure of the vacuum suction source. The chuck table 3 is rotatably arranged around an axis parallel to the vertical direction by a rotating means (not shown).

  The table moving means 4 has a table moving base 4 a that supports the chuck table 3. The table moving base 4a is engaged with a ball screw (not shown) extending in parallel with the X-axis direction, and is moved in the X-axis direction by a drive source configured by a pulse motor or the like.

  The first support member 5 having a gate shape is provided with a first transport unit 6 and a second transport unit 7. On the front surface of the first support member 5, a cassette 8 for accommodating a plurality of wafer units 50, a cassette mounting table 8 a for mounting the cassette 8, a pair of rails 9 for temporarily placing the wafer W, and a wafer W A cleaning table 10 for cleaning is disposed.

  The first transport means 6 is attached to the first support member 5 so as to be movable in the Y and Z axis directions, and is driven by an actuator (not shown). The second transport unit 7 is attached to the first support member 5 so as to be movable in the X, Y, and Z axis directions, and is driven by an actuator (not shown). The first and second transfer means 6 and 7 function as transfer means for supporting the annular frame 51 between the cassette 8 and the chuck table 3 and transferring the wafer unit 50. For example, the first transfer means 6 takes out the wafer unit 50 before cutting from the cassette 8 and temporarily places it on the pair of rails 9, and sucks and holds the annular frame 51 of the wafer unit 50 temporarily placed on the rails 9. Then, it is conveyed to the chuck table 3. After cutting on the chuck table 3, the second transport means 7 sucks and holds the annular frame 51 of the wafer unit 50 placed on the chuck table 3 and transports it to the cleaning table 10. After cleaning the wafer W after cutting with the cleaning table 10, the first transfer means 6 transfers the wafer unit 50 to the rail 9 and temporarily places it, and then stores it in the cassette 8.

  On the back surface of the first support member 5, there is provided a second support member 13 having a portal shape that is erected on the apparatus main body 2 so as to straddle the table moving means 4. The second support member 13 is provided with a first cutting means 11 and a second cutting means 12 facing each other. Each of the cutting means 11 and 12 is attached so as to be movable in the Y and Z axis directions, and is driven by an actuator (not shown). The first cutting means 11 includes a cutting blade 11 a that cuts the wafer W sucked and held by the chuck table 3 from one side. Similarly, the second cutting means 12 includes a cutting blade 12a for cutting the wafer W sucked and held by the chuck table 3 from the other side.

  Next, a configuration example of the holding jig for the dressing board will be described. FIG. 2 is a perspective view showing a configuration example of a holding jig of the dressing board. FIG. 3 is a cross-sectional view illustrating a configuration example of a holding jig of the dressing board.

  The holding jig 30A of the dressing board 15 shown in FIG. 2 includes a plate-shaped jig body 31a, a placement area 32 on which the dressing board 15 is placed, and a misregistration restricting portion 33 that prevents misalignment of the dressing board 15. With.

  The material of the jig body 31 a is plastic or metal, and the jig body 31 a is formed to have an outer diameter corresponding to the annular frame 51. That is, the jig body 31 a is formed in the same outer peripheral shape as the annular frame 51 of the wafer unit 50. This is because the holding jig 30 </ b> A is accommodated in the cassette 8 as in the wafer unit 50, and the holding jig 30 </ b> A is transferred by the first and second transfer means 6 and 7 as in the wafer unit 50. Here, the cassette 8 stores the wafer units 50 stacked at regular intervals, but the intervals are larger than the height H1 when the dressing board 15 is placed on the holding jig 30A. Yes. Thereby, the holding jig 30 </ b> A can be inserted into the cassette 8 and stored in the same manner as the wafer unit 50. The first and second transport means 6 and 7 transport the annular frame 51 by sucking and holding the same, but the holding jig 30A also transports the outer peripheral portion of the jig body 31a by sucking and holding the same.

  Two placement areas 32 are provided near the center of the jig body 31a, and areas are set in accordance with the shape of the square dressing board 15. A through hole 34 for applying a suction force from the chuck table 3 is formed in the mounting region 32. A predetermined number of through holes 34 are formed at equal intervals over the entire placement region 32. This is because the dressing board 15 is brought into close contact with the placement region 32- by applying an equal suction force to the surface of the dressing board 15 in contact with the placement region 32. The mounting region 32 is coated with a non-slip member 320 having a high frictional force, such as silicon resin, so that the dressing board 15 is not easily slipped. Of course, the through hole 34 is also formed in the non-slip member 320 applied to the placement region 32.

  The misregistration restricting portion 33 is formed around the placement region 32 of the jig main body 31a, and prevents misalignment of the dressing board 15. For example, the misregistration restricting portion 33 has a substantially L shape, is formed with a thickness smaller than the thickness of the dressing board 15, and is disposed on one diagonal line of the placement region 32. Since the positional deviation restricting portion 33 is disposed only on one diagonal line, the number of parts can be reduced with a simple configuration, and the used dressing board 15 can be easily detached from the jig body 31a. More preferably, the thickness of the misregistration restricting portion 33 is formed to be thinner than the uncut amount of the dressing board 15 by the cutting blade 11a during dressing. As a result, the entire surface of the dressing board 15 can be used.

  Next, a usage example of the holding jig 30A of the dressing board 15 will be described. FIG. 4 is a cross-sectional view showing an example of use of a holding jig for a dressing board. The holding jig 30A on which the dressing board 15 is placed is stored in the cassette 8 in advance by an operator. The holding jig 30 </ b> A is taken out from the cassette 8 by the first conveying means 6, temporarily placed on the pair of rails 9, and conveyed to the chuck table 3. The holding jig 30 </ b> A performs dressing while being sucked and held by the chuck table 3.

  For example, the holding jig 30 </ b> A shown in FIG. 4 is placed on the holding surface 3 a of the chuck table 3, and the jig main body 31 a is sandwiched by the frame clamp 3 b of the chuck table 3. At this time, the dressing board 15 is sucked and held by the jig body 31a by the negative pressure received from the holding surface 3a through the through hole 34 of the jig body 31a. Furthermore, the movement of the dressing board 15 in the X-axis direction and the Y-axis direction is restricted by the positional deviation restricting portion 33. In this state, the cutting blade 11a cuts the dressing board 15 to perform dressing (sharpening) of the cutting blade 11a.

  Even if the dressing board 15 is dressed from the X-axis direction by the cutting blade 11 a, the dressing board 15 is sucked and held by the jig body 31 a, the movement of the dressing board 15 is restricted by the misalignment restricting portion 33, and the slip preventing member 320 prevents the dressing board 15 from slipping. Therefore, there is no deviation from the placement area 32. Moreover, since the thickness of the positional deviation restricting portion 33 is thinner than the thickness of the dressing board 15, the cutting blade 11a can be prevented from coming into contact with the positional deviation restricting portion 33 when the cutting blade 11a is sharpened. The cutting blade 11a is sharpened when the cutting blade 11a is crushed and needs to be sharpened, or when the cutting blade 11a is worn and replaced with a new cutting blade.

  After the dressing process is completed, the holding jig 30 </ b> A placed on the chuck table 3 is transported to the rail 9 and temporarily placed by the second transport means 7. The holding jig 30 </ b> A temporarily placed on the rail 9 is accommodated in the cassette 8 by the first conveying means 6. In addition, after the dressing is completed, an operator may collect the holding jig 30 </ b> A temporarily placed on the rail 9 by the second transport unit 7 without accommodating it in the cassette 8.

  As described above, according to the holding jig 30 </ b> A of the dressing board 15 according to the first embodiment, the jig body 31 a is formed to have an outer diameter corresponding to the annular frame 51, and penetrates to apply the suction force from the chuck table 3. A placement region 32 in which the hole 34 is formed and the dressing board 15 is placed, and a misalignment restricting portion 33 that prevents misalignment of the dressing board 15 are provided. Thereby, since the jig body 31a is held by the first and second transfer means 6 and 7 in the same manner as the annular frame 51, the holding jig 30A can be transferred in the same manner as the wafer unit 50. Further, since the holding jig 30A is given a negative pressure to the through hole 34 of the placement region 32 by the chuck table 3, the dressing board 15 can be adsorbed and fixed to the jig body 31a. In addition, since the holding jig 30A restricts the movement of the dressing board 15 by the misalignment restricting portion 33, the dressing board 15 can be cut well as expected without being left behind. Accordingly, dressing can be performed in the same manner as when the dressing board 15 is held on the annular frame 51 by the tape 52 while the annular frame 51 and the tape 52 are unnecessary. Thereby, the running cost of the annular frame 51 and the tape 52 can be reduced, and the man-hour for fixing the dressing board 15 to the annular frame 51 by the tape 52 can be reduced.

[Embodiment 2]
Next, a configuration example of the holding jig for the dressing board according to the second embodiment will be described. FIG. 5 is a perspective view illustrating a configuration example of a holding jig of the dressing board according to the second embodiment. FIG. 6 is a cross-sectional view illustrating a configuration example of a holding jig of the dressing board according to the second embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  The holding jig 30B of the dressing board 15 is used when the frame clamp 3c is clamped at a position lower than the holding surface 3a of the chuck table 3 (see FIG. 7). For example, the support surface 3 f of the support base portion 3 d of the frame clamp 3 c holds the annular frame 51 at a position lower than the holding surface 3 a of the chuck table 3 by the height H 4.

  The holding jig 30 </ b> B includes a jig body 31 b, a placement area 32 on which the dressing board 15 is placed, and a misregistration restricting portion 33 that prevents misalignment of the dressing board 15. The jig body 31 b includes a convex portion 35, an edge portion 36, and a concave portion 37, and the edge portion 36 is formed with an outer diameter corresponding to the annular frame 51. That is, the jig body 31 b is formed in the same outer peripheral shape as the annular frame 51 of the wafer unit 50. The convex portion 35 of the jig main body 31 b is formed at a position higher than the edge portion 36, and is formed to have approximately the same size as the holding surface 3 a of the chuck table 3. A concave portion 37 is formed on the back surface side of the jig body 31b, and the depth H3 of the concave portion 37 is equal to the height H4 of the holding surface 3a of the chuck table 3 from the support surface 3f of the support base portion 3d of the frame clamp 3c. It is height. The material of the jig body 31b is plastic or metal. Two placement areas 32 are provided in the vicinity of the center of the convex portion 35 in the jig main body 31 a, and areas are set according to the shape of the square dressing board 15.

  A through hole 34 for applying a suction force from the chuck table 3 is formed in the mounting region 32. A non-slip member 320 is applied to the placement region 32 so that the dressing board 15 is difficult to slip. The misregistration restricting portion 33 is formed around the placement region 32 of the jig main body 31b, and prevents misalignment of the dressing board 15.

  The holding jig 30B on which the dressing board 15 is placed in the placement region 32 is housed in the cassette 8 in the same manner as the wafer unit 50, and is supported and transported by the first and second transport means 6 and 7. For example, the interval at which the wafer units 50 are stacked on the cassette 8 is larger than the height H2 when the dressing board 15 is placed on the holding jig 30B. As a result, the holding jig 30 </ b> B can be inserted and accommodated in the cassette 8 in the same manner as the wafer unit 50. Incidentally, since the holding jig 30B has the convex portion 35, the height H2 of the holding jig 30B is configured to be higher than the height H1 of the holding jig 30A. For this reason, when the height H2 of the holding jig 30B is higher than the interval at which the wafer units 50 are stacked on the cassette 8, a space for two steps of the cassette 8 is secured to accommodate the holding jig 30B. It may be. The first and second transport means 6 and 7 transport the holding jig 30 </ b> B by sucking and holding the edge 36 of the jig main body 31 b in the same manner as the annular frame 51.

  Next, an example of using a dressing board holding jig will be described. FIG. 7 is a cross-sectional view showing an example of use of a holding jig for a dressing board. In the holding jig 30B shown in FIG. 7, the convex portion 35 is placed on the holding surface 3a of the chuck table 3, and the edge portion 36 is held by the frame clamp 3c.

  The frame clamp 3c has a claw portion 3e that is rotated by an actuator and faces the support base portion 3d. When the holding jig 3B is placed on the chuck table 3, the edge 36 of the holding jig 30B is supported by the support base 3d, and the claw 3e is rotated to rotate the claw 3e and the support base 3d. As a result, the edge 36 is clamped and the holding jig 30 </ b> B is fixed to the chuck table 3.

  The dressing board 15 is sucked and held by the jig body 31b by the negative pressure received from the holding surface 3a through the through hole 34 of the jig body 31b. Furthermore, the movement of the dressing board 15 in the X-axis direction and the Y-axis direction is restricted by the positional deviation restricting portion 33. In this state, the cutting blade 11a cuts the dressing board 15 to sharpen the cutting blade 11a. Even if the dressing board 15 is dressed from the X-axis direction by the cutting blade 11a, the dressing board 15 is sucked and held by the jig main body 31b, the movement of the dressing board 15 is restricted by the positional deviation restricting portion 33, and the slipping member 320 is further prevented from slipping. Therefore, there is no deviation from the placement area 32.

  As described above, the holding jig 30B of the dressing board 15 according to the second embodiment can be applied to a cutting device that pulls and clamps the annular frame 51, and is similar to the holding jig 30A of the first embodiment. The dressing board 15 can be dressed in the same manner as when the dressing board 15 is held on the annular frame 51 by the tape 52.

  In addition, although it demonstrated that the position shift control part 33 was substantially L-shaped and was arrange | positioned on one diagonal of the mounting area | region 32, what is necessary is just to be able to control the movement of the dressing board 15, and it is the above-mentioned structure. It is not limited. For example, the misregistration restricting portion may be arranged by adding a substantially L-shaped member also on the other diagonal line of the placement region 32, or surrounding the entire circumference of the placement region 32. You may make it arrange | position the member of a rectangular frame. Further, the misregistration restricting portion may be arranged upright so as to support the columnar member at two points with respect to each side of the placement region 32. In addition, since the position deviation restricting portion is particularly loaded in the rotation direction (X-axis direction) of the cutting blade, the member that supports the load in the X-axis direction is stronger than the member that supports the load in the Y-axis direction. It may be anything. For example, it is conceivable that the support range of the member that supports the load in the X-axis direction is wider than the support range of the member that supports the load in the Y-axis direction.

  Moreover, although the example which arrange | positions the mounting area | region 32 in two places was demonstrated, it is not limited to this. For example, the placement regions 32 may be arranged at a total of four locations, two in the X-axis direction for each of the cutting blades 11a and 12a. Thereby, since the dressing board 15 can be mounted twice, it becomes possible to perform dressing continuously and work efficiency can be improved.

DESCRIPTION OF SYMBOLS 1 Cutting device 3 Chuck table 3a Holding surface 3b, 3c Frame clamp 8 Cassette 8a Cassette mounting base 11 1st cutting means 11a Cutting blade 12 2nd cutting means 12a Cutting blade 15 Dressing board 30A, 30B Holding jig 31a, 31b Jig body 32 Placement region 320 Non-slip member 33 Position shift restricting portion 34 Through hole 35 Protruding portion 36 Edge portion 50 Wafer unit 51 Annular frame 52 Tape W Wafer

Claims (4)

Cutting having a chuck table for sucking and holding a workpiece of a workpiece unit that supports the workpiece via a tape in an opening of the annular frame, and a cutting blade for cutting the workpiece sucked and held by the chuck table A holding jig for a dressing board used in a cutting apparatus comprising:
A plate-shaped jig body formed on the outer diameter corresponding to the annular frame, comprising a mounting region in which a through hole for applying a suction force from the chuck table is formed and a dressing board is mounted;
A misalignment restricting portion that is formed around the placement area of the jig body and prevents the misalignment of the dressing board ;
The dressing board holding jig , wherein the jig body is an integral member made of plastic or metal .   The jig main body includes a convex portion provided with the placement area, and a concave portion formed on a back surface of the back side of the placement area and into which the chuck table enters, and the jig table is configured by the frame clamp of the chuck table. The dressing board holding jig according to claim 1, wherein the holding jig is held at a position lower than a holding surface of the chuck table. 3. The dressing board holding jig according to claim 1, wherein the misregistration restricting portion is disposed on the jig body with a thickness smaller than a thickness of the dressing board. The cutting device supports the annular frame between a cassette mounting table for mounting a cassette that accommodates a plurality of workpiece units, and the cassette and the chuck table mounted on the cassette mounting table. Conveying means for conveying the workpiece unit.
The jig body on which the dressing board is placed in the placement area can be accommodated in the cassette, and is supported and transported by the transport means . The holding jig of the dressing board as described in any one of them .

Images