JP2000049120A - Cutting device - Google Patents

Cutting device

Info

Publication number
JP2000049120A
JP2000049120A JP21071998A JP21071998A JP2000049120A JP 2000049120 A JP2000049120 A JP 2000049120A JP 21071998 A JP21071998 A JP 21071998A JP 21071998 A JP21071998 A JP 21071998A JP 2000049120 A JP2000049120 A JP 2000049120A
Authority
JP
Japan
Prior art keywords
cutting
dresser board
dressing
chuck
dresser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21071998A
Other languages
Japanese (ja)
Inventor
Susumu Kamikura
Susumu Nii
享 上倉
進 仁井
Original Assignee
Disco Abrasive Syst Ltd
株式会社ディスコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Syst Ltd, 株式会社ディスコ filed Critical Disco Abrasive Syst Ltd
Priority to JP21071998A priority Critical patent/JP2000049120A/en
Publication of JP2000049120A publication Critical patent/JP2000049120A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Summary] [PROBLEMS] When dressing a rotating blade in a cutting device for performing a cutting process on a workpiece held on a chuck table by a rotating blade, complicated work is not required and cutting productivity is reduced. In addition, the alignment should not be deviated even if dressing is performed during cutting. SOLUTION: A dresser board is disposed so as to be adjacent to a chuck table and a surface thereof is located substantially on the same plane as the surface of the chuck table. Eliminating the attachment / detachment of the wafer prevents re-alignment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer with a rotating blade, and more particularly, to a cutting device for improving productivity by efficiently dressing a rotating blade. It is about.

[0002]

2. Description of the Related Art In a cutting apparatus 30 shown in FIG. 4, for example, when cutting a semiconductor wafer W, the semiconductor wafer W is suction-held on a chuck table 12 rotatably (θ-rotated) on a cutting feed table 11. Then, the cutting feed table 11 moves in the X-axis direction and the alignment means 1
3, a region to be cut is detected by a process such as pattern matching, and the region to be cut and the rotary blade 14 are aligned (aligned) in the Y-axis direction. And further, the cutting feed table 11
The semiconductor wafer W is cut by the rotating blade 14 by moving in the X-axis direction.

[0003] By continuing the cutting, the rotating blade 14
If the crushing occurs, the cutting ability is reduced. Therefore, it is necessary to improve the cutting ability by dressing the rotary blade 14 by dressing. Therefore, a dresser board 1 in which green carborundum and alundum-based abrasive grains are solidified into a plate shape by a resin bond or the like before cutting the next semiconductor wafer during cutting or after cutting of the semiconductor wafer W is completed.
5 is placed on the chuck table 12, and the dresser board 15 is cut by the rotating blade 14 as shown in FIG.

[0004]

However, in order to perform dressing during cutting, it is necessary to remove the semiconductor wafer W from the chuck table 12 and mount the dresser board 15 thereon. After dressing, the dresser board 1 is removed from the chuck table 12.
5 must be removed and the semiconductor wafer W must be mounted again. As described above, in order to perform dressing in the middle of cutting, a complicated operation is required, which causes a decrease in productivity.

On the other hand, when dressing is performed after the semiconductor wafer W is cut and before the next semiconductor wafer is cut, the dresser board 15 needs to be mounted and demounted, although there is no trouble in mounting and demounting the semiconductor wafer W. Contributes to a decrease in gender.

When dressing is performed during cutting, the semiconductor wafer W is re-mounted after the dressing, so that it is necessary to perform alignment again, which also causes a reduction in productivity. Further, re-alignment may cause a deviation in the alignment accuracy, resulting in a lack of cutting accuracy.

As described above, when performing dressing of the rotary blade, complicated work is not required so that the productivity of cutting is not reduced, and even if dressing is performed during cutting, there is no deviation in alignment. Doing so has a problem to be solved.

[0008]

SUMMARY OF THE INVENTION As a specific means for solving the above-mentioned problems, the present invention provides a chuck table for holding a workpiece, and a rotary machine for cutting the workpiece held on the chuck table. A cutting device comprising at least a cutting means including a blade, wherein the dresser board is disposed so that the dresser board is located adjacent to the chuck table and the surface thereof is substantially coplanar with the surface of the chuck table. I will provide a.

The dresser board holding means is disposed adjacent to the chuck table, and the dresser board is detachably mounted on the dresser board holding means. The dresser board holding means holds the dresser board by suction. The suction area is formed, the dresser board is removably disposed in the suction area, the chuck table is disposed in the cutting feed table so as to be rotatable by θ, and the dresser board holding means is disposed on the cutting feed table. Being disposed, the workpiece is a semiconductor wafer,
An additional requirement is that the cutting process be dicing.

[0010] In the cutting apparatus thus configured, the dresser board is disposed adjacent to the chuck table holding the workpiece, so that the dressing can be easily performed at any time. In addition, when dressing is performed in the middle of cutting, in both cases of dressing after cutting the workpiece and before cutting the next workpiece, there is no need to attach and detach the semiconductor wafer and the dresser board, which is complicated. In the case where dressing is performed in the middle of cutting, the semiconductor wafer does not need to be attached or detached, so that re-alignment is not required. Further, by disposing the dresser board on substantially the same plane as the surface of the chuck table, even when dressing is performed during cutting, it is not necessary to set up again.

In addition, since the dresser board is detachably disposed on the dresser board holding means, it is easy to replace the dresser board. Particularly, the dresser board is sucked and held in the suction area of the dresser board holding means. The dresser board can be easily replaced. Further, the chuck table is disposed on the cutting feed table so as to be able to rotate θ, and the dresser board holding means is disposed on the cutting feed table, so that the dresser board holding means does not rotate, and the θ rotation of the chuck table does not occur. Dressing is performed without being affected by the above.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As an example of an embodiment of the present invention, a cutting device 10 shown in FIG. 1 will be described as an example. Since the cutting device 10 is configured substantially similarly to the conventional cutting device 30 shown in FIG. 4, the same portions are denoted by the same reference numerals, and description thereof will be omitted.

The cutting apparatus 10 shown in FIG. 1 is different from the conventional cutting apparatus 30 shown in FIG.
2 in that the dresser board holding means 16 is arranged at a position adjacent to the dresser board 2.

In the present embodiment, the dresser board holding means 16 has a fixing portion 17 fixed to an end of the cutting feed table 11 as shown in FIG. Has a suction area 19 having a suction force.

The suction area 19 is supplied with a suction force by a negative pressure through a pipe 20 from a suction source (not shown). The dresser board 21 is detachably attached to the suction area 19. The dresser board 21 is not limited to the case where the dresser board 21 is held by suction, but it is desirable that the dresser board 21 be easily attached and detached.

FIG. 2 shows a state in which the cutting feed table 11 is closer to the rotary blade 14 than the case of FIG. 1 due to the movement of the cutting feed table 11 in the X-axis direction.
The rotating blade 14 is mounted on a tip of a spindle 23 rotatably supported by a spindle housing 22 and is a cutting water supply nozzle 2 which is a nozzle for supplying cutting water.
The periphery of the blade cover 25 is covered by a blade cover 25 provided with the cover 4. The rotating blade 14, the spindle housing 22, the spindle 23, the cutting water supply nozzle 24, and the blade cover 25 constitute a cutting unit 26, and the cutting unit 26 is movable in the Y-axis direction and the Z-axis direction.

As shown in FIG. 3, the dresser board 21
Is held in the suction area 19 of the dresser board holding means 16, the upper surface of the dresser board 21 is positioned substantially flush with the surface of the chuck table 12. Then, for example, when dressing the rotary blade 14 from the state of FIG. 2, the cutting feed table 11 is moved in the R direction, and the rotary blade 14 is brought into contact with the dresser board 21 to cut the dresser board 21.
The setting of the rotating blade 14 is performed. At this time, the upper surface of the dresser board 21 and the surface of the chuck table 12 are located on substantially the same plane, and the accuracy of the cutting depth is not required at the time of dressing. Similarly, dressing can be performed by controlling the cutting means 26 in the Z-axis direction. Therefore, it is not necessary to perform the work of setting up the reference position for controlling the cutting depth of the dresser board 21. Since setup is not performed during dressing, it is not necessary to perform setup when cutting the semiconductor wafer W is restarted.

The chuck table 12 is rotated by θ when necessary when cutting the semiconductor wafer W. The chuck table 12 is rotatably supported by the cutting feed table 11. Does not rotate, so that the dresser board holding means 16 does not rotate, and dressing can be performed without being affected by the θ rotation of the chuck table 12.

Further, since the dresser board 21 is held by the exclusive dresser board holding means 16, even when dressing is performed during cutting, the semiconductor wafer W is removed from the chuck table 12 and the dresser board 21 is mounted. This eliminates the need for such an operation, and improves productivity as compared with the related art. Furthermore, since the dressing is performed without removing the semiconductor wafer W from the chuck table 12, there is no need to perform the alignment again when the cutting of the semiconductor wafer W is restarted after the dressing. Therefore, the cutting can be continued without causing a displacement.

In addition, since the dresser board 21 is held by the exclusive dresser board holding means 16, when dressing is performed during cutting, the semiconductor wafer W is cut before cutting the next semiconductor wafer. In any case of dressing, the dresser board 21 can be always placed on the dresser board holding means 16, so that dressing can be performed at any time. That is, since the dressing can be performed immediately when the sharpness of the rotary blade 14 is reduced, the productivity is improved, and a decrease in the quality of the workpiece due to the reduced sharpness of the rotary blade 14 can be avoided.

The dresser board 21 is configured to be attracted to the dresser board holding means 16 so that
The dresser board 21 can be attached and detached very easily, and the dresser board can be quickly replaced.

Since the dresser board holding means 16 is fixed to the cutting feed table 11, it moves in the X-axis direction as the cutting feed table 11 moves in the X-axis direction (cutting feed). That is, since the dresser board 21 is always near the chuck table 12, even when the rotary blade 14 is dressed during the cutting of the semiconductor wafer W, the dressing can be performed only by slightly cutting and feeding the cutting feed table 11. it can.

After the dressing, the cutting of the semiconductor wafer W can be easily restarted by moving the cutting feed table 11 in the L direction.

[0024]

As described above, in the cutting device according to the present invention, the dresser board is disposed adjacent to the chuck table for holding the workpiece,
Because dressing can be done easily at any time,
Productivity is improved. Further, for example, if dressing is performed immediately when the sharpness of the rotating blade is reduced, it is possible to avoid a decrease in the quality of the workpiece due to the reduced sharpness of the rotating blade.

In addition, when dressing is performed during cutting, and when dressing is performed before cutting the next workpiece after cutting the workpiece, it is necessary to attach and detach the semiconductor wafer and the dresser board. This eliminates complicated work and improves productivity, and in the case of dressing in the middle of cutting, it is not necessary to attach and detach a semiconductor wafer, so that re-alignment is not required, contributing to improved productivity. . In addition, since re-alignment is not required, there is no deviation in alignment unlike the related art, and the accuracy of cutting is secured.

Further, by arranging the dresser board on substantially the same plane as the surface of the chuck table, even if dressing is performed during cutting, it is not necessary to set up the dresser again, thereby improving productivity.

In addition, since the dresser board is detachably disposed on the dresser board holding means, it is easy to replace the dresser board. In particular, the dresser board is sucked and held in the suction area of the dresser board holding means. Since the dresser board can be easily replaced, for example, if it becomes necessary to replace the dresser board with a new one during dressing, the dresser board can be quickly replaced with a new one. Is hardly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a cutting device according to the present invention.

FIG. 2 is an enlarged perspective view showing an example of a configuration of a dresser board holding means provided in the cutting device.

FIG. 3 is an explanatory view showing a state in which dressing is performed using a dresser board mounted on the cutting device.

FIG. 4 is a perspective view showing a conventional cutting device.

FIG. 5 is an explanatory view showing a state in which dressing is performed using a dresser board placed on a chuck table in the cutting apparatus.

[Explanation of symbols]

10 Cutting device 11 Cutting feed table 12
... Chuck table 13 ... Alignment means 14 ... Rotating blade 1
5 ... dresser board 16 ... dresser board holding means 17 ... fixed part
18 holding part 19 suction area 20 piping 21 dresser board 22 spindle housing 23 spindle 24 cutting water supply nozzle 25 blade cover
26 cutting means 30 cutting equipment

Claims (5)

[Claims]
1. A cutting apparatus comprising at least a chuck table for holding a workpiece and a cutting means including a rotary blade for performing a cutting process on the workpiece held on the chuck table. And a dressing board provided with a dresser board such that a surface of the dresser board is substantially flush with a surface of the chuck table.
2. The cutting device according to claim 1, wherein a dresser board holding means is provided adjacent to the chuck table, and the dresser board is removably mounted on the dresser board holding means.
3. The dresser board holding means has a suction area for sucking and holding the dresser board.
The cutting device according to claim 2, wherein the dresser board is detachably provided in the suction area.
4. The cutting feed table is provided so as to be rotatable by θ, and the dresser board holding means is provided on the cutting feed table.
3. The cutting device according to claim 1.
5. The cutting apparatus according to claim 1, wherein the workpiece is a semiconductor wafer, and the cutting is dicing.
JP21071998A 1998-07-27 1998-07-27 Cutting device Pending JP2000049120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21071998A JP2000049120A (en) 1998-07-27 1998-07-27 Cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21071998A JP2000049120A (en) 1998-07-27 1998-07-27 Cutting device

Publications (1)

Publication Number Publication Date
JP2000049120A true JP2000049120A (en) 2000-02-18

Family

ID=16593975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21071998A Pending JP2000049120A (en) 1998-07-27 1998-07-27 Cutting device

Country Status (1)

Country Link
JP (1) JP2000049120A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025946A (en) * 2000-07-05 2002-01-25 Disco Abrasive Syst Ltd Dressing method of cutting blade and cutting apparatus
JP2008300556A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame clamp
JP2008300555A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame unit for dicing
CN101941248A (en) * 2009-07-07 2011-01-12 株式会社迪思科 Topping machanism
JP2011009324A (en) * 2009-06-24 2011-01-13 Disco Abrasive Syst Ltd Dress board holding table and cutting device
JP2012044096A (en) * 2010-08-23 2012-03-01 Disco Abrasive Syst Ltd Cutting device
JP2013120794A (en) * 2011-12-06 2013-06-17 Tokyo Seimitsu Co Ltd Dicing device
CN104139462A (en) * 2013-05-09 2014-11-12 株式会社迪思科 Chip cutting method
JP2014233768A (en) * 2013-05-31 2014-12-15 株式会社ディスコ Cutting device
JP2016000434A (en) * 2014-06-11 2016-01-07 株式会社ディスコ Dressing board holding jig
KR20180086133A (en) 2017-01-20 2018-07-30 가부시기가이샤 디스코 Cutting apparatus
US10688616B2 (en) * 2017-04-21 2020-06-23 Disco Corporation Cutting apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025946A (en) * 2000-07-05 2002-01-25 Disco Abrasive Syst Ltd Dressing method of cutting blade and cutting apparatus
JP2008300555A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame unit for dicing
JP2008300556A (en) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd Frame clamp
JP2011009324A (en) * 2009-06-24 2011-01-13 Disco Abrasive Syst Ltd Dress board holding table and cutting device
CN101941248A (en) * 2009-07-07 2011-01-12 株式会社迪思科 Topping machanism
JP2012044096A (en) * 2010-08-23 2012-03-01 Disco Abrasive Syst Ltd Cutting device
JP2013120794A (en) * 2011-12-06 2013-06-17 Tokyo Seimitsu Co Ltd Dicing device
KR20140133451A (en) 2013-05-09 2014-11-19 가부시기가이샤 디스코 Wafer cutting method
CN104139462A (en) * 2013-05-09 2014-11-12 株式会社迪思科 Chip cutting method
JP2014233768A (en) * 2013-05-31 2014-12-15 株式会社ディスコ Cutting device
JP2016000434A (en) * 2014-06-11 2016-01-07 株式会社ディスコ Dressing board holding jig
KR20180086133A (en) 2017-01-20 2018-07-30 가부시기가이샤 디스코 Cutting apparatus
US10361102B2 (en) 2017-01-20 2019-07-23 Disco Corporation Cutting apparatus
US10688616B2 (en) * 2017-04-21 2020-06-23 Disco Corporation Cutting apparatus

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