KR20150090997A - Feed mechanism - Google Patents

Feed mechanism Download PDF

Info

Publication number
KR20150090997A
KR20150090997A KR1020150001033A KR20150001033A KR20150090997A KR 20150090997 A KR20150090997 A KR 20150090997A KR 1020150001033 A KR1020150001033 A KR 1020150001033A KR 20150001033 A KR20150001033 A KR 20150001033A KR 20150090997 A KR20150090997 A KR 20150090997A
Authority
KR
South Korea
Prior art keywords
wafer
holding
suction
pressing
maintaining
Prior art date
Application number
KR1020150001033A
Other languages
Korean (ko)
Other versions
KR102154718B1 (en
Inventor
린타로 차노
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20150090997A publication Critical patent/KR20150090997A/en
Application granted granted Critical
Publication of KR102154718B1 publication Critical patent/KR102154718B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The purpose of the present invention is to enable a maintaining table to suck and maintain a wafer even in the case of conveying a bent wafer to the maintaining table. A conveying device for conveying a wafer to a maintaining table for sucking and maintaining a wafer comprises: a maintaining head (12) including multiple suction and maintenance parts (24a-24c) for sucking and maintaining a wafer, and multiple pressing members (25a-25c) capable of moving between a pressing position of pressing the outer circumference part of a wafer arranged on the maintaining table (50) toward the maintaining table (50) and a retreating position of not being in contact with a wafer maintained on the suction and maintenance parts (24a-24c); and a maintaining head moving means (13) for moving the maintaining head (12) to and from the maintaining table (50). A gap from the maintaining table (50) can be removed and a wafer can be sucked and maintained by correcting the bending of a wafer on top of the maintaining table (50) even if the outer circumference part of the wafer is bent upward.

Description

반송 기구{FEED MECHANISM}FEED MECHANISM

본 발명은 웨이퍼를 유지 테이블로 반송하는 반송 기구에 관한 것이다.The present invention relates to a transport mechanism for transporting a wafer to a holding table.

웨이퍼에 대하여 각종 가공을 행하는 가공 장치에는, 가공 대상인 웨이퍼를 유지하는 유지 테이블을 구비하고 있다(예컨대, 특허문헌 1 참조). 이러한 유지 테이블을 구비한 가공 장치에는, 통상, 유지 테이블과 다른 부위 사이에서 웨이퍼를 반송하는 반송 기구를 구비하고 있다(예컨대, 특허문헌 2 참조).2. Description of the Related Art [0002] A processing apparatus for performing various types of processing on a wafer includes a holding table for holding a wafer to be processed (see, for example, Patent Document 1). A machining apparatus provided with such a holding table normally has a carrying mechanism for carrying the wafer between the holding table and another portion (see, for example, Patent Document 2).

일본 특허 공개 평성 제11-284056호 공보Japanese Patent Application Laid-open No. 11-284056 일본 특허 공개 제2013-144323호 공보Japanese Patent Application Laid-Open No. 2013-144323

그러나, 박화된 웨이퍼나, 유리나 실리콘, 밀봉 수지 등의 재질이 적층된 적층 웨이퍼에는, 휨이 발생하고 있는 경우가 있다. 이들 휨이 발생하고 있는 웨이퍼를 유지 테이블에 배치하면, 유지 테이블의 유지면과 웨이퍼 사이에 간극이 있기 때문에, 부압에 의해 웨이퍼를 흡인하여도, 웨이퍼를 유지할 수 없는 경우가 있다고 하는 문제가 있다.However, a laminated wafer in which materials such as thinned wafers, glass, silicon, and sealing resin are stacked may be warped. If the wafer on which these deflections occur is arranged on the holding table, there is a gap between the holding surface of the holding table and the wafer, so that there is a problem that the wafer can not be held even if the wafer is sucked by the negative pressure.

본 발명은 이러한 문제를 감안하여 이루어진 것으로서, 휨이 있는 웨이퍼를 유지 테이블로 반송한 경우라도 유지 테이블이 웨이퍼를 흡인 유지할 수 있도록 하는 것을 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to enable a holding table to hold a wafer by suction even when a wafer having a warp is conveyed to the holding table.

본 발명은 웨이퍼를 흡인 유지하는 유지 테이블에 웨이퍼를 반송하는 반송 기구로서, 웨이퍼를 흡인 유지하는 복수의 흡인 유지부와, 상기 유지 테이블에 배치된 웨이퍼의 외주부를 상기 유지 테이블을 향해 압박하는 압박 위치와 상기 흡인 유지부에 유지된 웨이퍼에 접촉하지 않는 퇴피(退避) 위치 사이에서 이동 가능한 복수의 압박 부재를 구비한 유지 헤드와, 상기 유지 헤드를 상기 유지 테이블에 대하여 접근 및 이격시키는 유지 헤드 이동 수단을 구비한다.The present invention relates to a transfer mechanism for transferring a wafer to a holding table for sucking and holding a wafer, the transfer mechanism comprising: a plurality of suction holding sections for sucking and holding the wafer; and a pressing section for pressing the outer periphery of the wafer, And a plurality of pressing members movable between a retracted position in which the retaining head is not in contact with the wafer held by the suction holding section and a holding head moving means Respectively.

상기 복수의 흡인 유지부는, 상기 압박 부재보다도 내측의 내측 위치와 상기 압박 부재와 동일 원주 상의 외측 위치 사이에서 이동 가능하게 설치되는 것이 바람직하다.It is preferable that the plurality of suction holding sections are provided so as to be movable between an inner position on the inner side of the pressing member and an outer position on the same circumference of the pressing member.

본 발명에 따른 반송 기구에 의하면, 복수의 압박 부재가 웨이퍼의 외주 부분을 유지 테이블을 향해 압박하기 때문에, 웨이퍼의 외주 부분이 위쪽으로 젖혀져 있는 경우라도, 유지 테이블 상에서 웨이퍼의 휨을 교정하여 유지 테이블과의 사이의 간극을 없애고, 웨이퍼를 흡인 유지할 수 있다.According to the transporting mechanism of the present invention, since the plurality of pressing members press the outer circumferential portion of the wafer toward the holding table, even if the outer peripheral portion of the wafer is bent upward, the warping of the wafer is corrected on the holding table, The wafer can be sucked and held.

또한, 흡인 유지부가 내측 위치와 외측 위치 사이에서 이동 가능하면, 웨이퍼의 외주 부분이 위쪽으로 젖혀져 있는 경우에는, 흡인 유지부를 외측 위치에 배치함으로써, 압박 부재뿐만 아니라, 흡인 유지부로도, 웨이퍼의 외주 부분을 유지 테이블을 향해 압박할 수 있다. 또한, 웨이퍼의 외주 부분이 아래쪽으로 젖혀져 있는 경우에는, 흡인 유지부를 내측 위치에 배치함으로써, 웨이퍼의 외주 부분을 압박 부재로 누르면서, 웨이퍼의 중앙 부분을 흡인 유지부로 유지 테이블을 향해 압박할 수 있다. 이에 따라, 웨이퍼의 외주 부분이 위쪽으로 젖혀져 있는 경우라도, 아래쪽으로 젖혀져 있는 경우라도, 웨이퍼의 휨을 교정하여, 유지 테이블과의 사이의 간극을 없앨 수 있고, 유지 테이블이 웨이퍼를 흡인 유지할 수 있다.When the suction holding portion is movable between the inner position and the outer position, when the outer peripheral portion of the wafer is flipped upward, by arranging the suction holding portion at the outer position, not only the pressing member but also the suction holding portion, The outer peripheral portion can be pressed toward the holding table. In addition, when the outer peripheral portion of the wafer is bent downward, the suction holding portion can be pressed toward the holding table by the suction holding portion while the outer peripheral portion of the wafer is pressed by the pressing member by arranging the suction holding portion at the inner position . Accordingly, even when the outer peripheral portion of the wafer is bent upwardly, even if the wafer is bent downward, warping of the wafer can be corrected to eliminate the gap between the wafer and the holding table, and the holding table can hold have.

도 1은 반송 기구를 도시한 사시도.
도 2는 반송 기구가 웨이퍼를 유지하는 모습을 도시한 측면에서 본 단면도.
도 3은 반송 기구가 웨이퍼를 유지 테이블에 배치하는 모습을 도시한 측면에서 본 단면도.
도 4는 반송 기구가 웨이퍼를 유지 테이블에 압박하는 모습을 도시한 측면에서 본 단면도.
도 5는 반송 기구가 웨이퍼를 유지하는 모습을 도시한 측면에서 본 단면도.
도 6은 반송 기구가 웨이퍼를 유지 테이블에 압박하는 모습을 도시한 측면에서 본 단면도.1 is a perspective view showing a transport mechanism.
Fig. 2 is a cross-sectional view showing a state in which the transport mechanism holds the wafer. Fig.
3 is a cross-sectional view showing a state in which the transport mechanism disposes the wafer on the holding table;
4 is a cross-sectional view showing a state in which the transport mechanism presses the wafer against the holding table;
5 is a cross-sectional view of the wafer holding apparatus shown in FIG.
6 is a cross-sectional view showing a state in which the transport mechanism presses the wafer against the holding table;

도 1에 도시된 반송 기구(10)는, 예컨대 웨이퍼를 가공하는 가공 장치에 삽입된 것으로서, 예컨대 가공전에 웨이퍼가 일시적으로 배치되는 가(假)거치 테이블에 배치된 웨이퍼를, 가공시에 웨이퍼를 유지하는 유지 테이블로 반송한다. 유지 테이블은 반송 기구(10)에 의해 반송된 웨이퍼를 흡인 유지한다. 유지 테이블에 유지된 웨이퍼는, 예컨대 연삭 수단이나 절삭 수단 등의 가공 수단에 의해 가공된다. 반송 기구(10)는 반송중에 웨이퍼를 유지하는 유지 헤드(12)와, 유지 헤드(12)를 이동시키는 유지 헤드 이동 수단(13)을 구비하고 있다.The transfer mechanism 10 shown in Fig. 1 is, for example, inserted into a processing apparatus for processing wafers. For example, a wafer placed on a temporary mounting table on which wafers are temporarily placed before processing is transferred onto a wafer To the holding table to be held. The holding table holds the wafer conveyed by the conveying mechanism 10 by suction. The wafer held on the holding table is processed by processing means such as grinding means or cutting means. The transport mechanism 10 includes a holding head 12 for holding the wafer during transportation and a holding head moving means 13 for moving the holding head 12.

유지 헤드(12)는 가거치 테이블 및 유지 테이블의 유지면과 평행한 XY 평면에 평행한 원판형의 중앙부(21)와, XY 평면에 평행한 평면 내에서 중앙부(21)로부터 외측을 향해 방사형으로 연장되는 6개의 아암부(22a∼22c, 23a∼23c)와, 각 아암부(23a∼23c)에 설치된 3개의 흡인 유지부(24a∼24c)와, 각 아암부(22a∼22c)에 설치된 3개의 압박 부재(25a∼25c) 및 3개의 압박 이동 수단(26a∼26c)을 구비하고 있다.The holding head 12 has a disk-shaped central portion 21 parallel to the XY plane parallel to the holding surface of the holding table and the holding table, and a radial portion 21 radially outward from the central portion 21 in a plane parallel to the XY plane Three suction portions 24a to 24c provided on the respective arm portions 23a to 23c and three suction portions 24a to 24c provided on the respective arm portions 22a to 22c, (25a to 25c) and three pressing and moving means (26a to 26c).

인접한 아암부(22a∼22c, 23a∼23c) 사이의 각도는 모두 60°이다. 또한, 흡인 유지부(24a∼24c)는 역지 밸브(42)를 통해 진공원 등의 흡인원(41)에 접속되며, 웨이퍼를 흡인 유지한다. 흡인 유지부(24a∼24c)는 아암부(23a∼23c)를 따라 직경 방향으로 이동 가능하게 구성되어 있다.The angles between the adjacent arm portions 22a to 22c, 23a to 23c are all 60 degrees. The suction holding sections 24a to 24c are connected to a suction source 41 such as a vacuum source through a check valve 42 and hold the wafer by suction. The suction holding portions 24a to 24c are configured to be movable in the radial direction along the arm portions 23a to 23c.

유지 헤드(12)의 중심[중앙부(21)의 중심축]과 각 압박 부재(25a∼25c) 사이의 거리는, 반송 기구(10)가 반송하는 웨이퍼의 반경보다 약간 작고, 압박 부재(25a∼25c)가 웨이퍼의 외주 부분을 압박하도록 배치되어 있다.The distance between the center of the holding head 12 (central axis of the central portion 21) and each of the pressing members 25a to 25c is slightly smaller than the radius of the wafer to be transported by the carrying mechanism 10 and the pressing members 25a to 25c Is disposed so as to press the outer peripheral portion of the wafer.

유지 헤드(12)의 중심과 각 흡인 유지부(24a∼24c) 사이의 거리는, 흡인 유지부(24a∼24c)의 직경 방향의 이동에 따라 변화된다. 각 흡인 유지부(24a∼24c)가 유지 헤드(12)의 중심에서 가장 떨어진 위치에 있는 경우, 유지 헤드(12)의 중심과 각 흡인 유지부(24a∼24c) 사이의 거리는 유지 헤드(12)의 중심과 각 압박 부재(25a∼25c) 사이의 거리와 같고, 각 흡인 유지부(24a∼24c)는 각 압박 부재(25a∼25c)와 동일 원주 상에 위치한다. 이 때의 흡인 유지부(24a∼24c)의 위치를 「외측 위치」라고 부른다. 흡인 유지부(24a∼24c)가 외측 위치에 있는 경우, 흡인 유지부(24a∼24c)는 웨이퍼의 외주 부분을 흡인 유지한다. 한편, 각 흡인 유지부(24a∼24c)가 유지 헤드(12)의 중심에 가장 가까운 위치에 있는 경우, 유지 헤드(12)의 중심과 각 흡인 유지부(24a∼24c) 사이의 거리는 유지 헤드(12)의 중심과 각 압박 부재(25a∼25c) 사이의 거리보다도 작고, 각 흡인 유지부(24a∼24c)는 각 압박 부재(25a∼25c)를 지나는 원주보다도 내측에 위치한다. 이 때의 흡인 유지부(24a∼24c)의 위치를 「내측 위치」라고 부른다. 흡인 유지부(24a∼24c)가 내측 위치에 있는 경우, 흡인 유지부(24a∼24c)는 웨이퍼의 중앙에 가까운 위치를 흡인 유지한다.The distance between the center of the holding head 12 and each of the suction holding portions 24a to 24c is changed in accordance with the movement of the suction holding portions 24a to 24c in the radial direction. The distance between the center of the holding head 12 and each of the suction holding portions 24a to 24c is smaller than the distance between the center of the holding head 12 and the suction holding portions 24a to 24c when each of the suction holding portions 24a to 24c is located at the farthest position from the center of the holding head 12. [ And the respective suction holding portions 24a to 24c are located on the same circumference as the respective pressing members 25a to 25c. The position of the suction holding portions 24a to 24c at this time is referred to as " outer position ". When the suction holding portions 24a to 24c are at the outer positions, the suction holding portions 24a to 24c hold the outer peripheral portion of the wafer by suction. The distance between the center of the holding head 12 and each of the suction holding portions 24a to 24c is smaller than the distance between the center of the holding head 12 and each of the suction holding portions 24a to 24c when the suction holding portions 24a to 24c are closest to the center of the holding head 12. [ 12 and each of the suction holding portions 24a to 24c is located further inside than the circumferential portion passing through each of the pressing members 25a to 25c. The positions of the suction holding portions 24a to 24c at this time are referred to as " inner position ". When the suction holding portions 24a to 24c are in the inner position, the suction holding portions 24a to 24c suck and hold a position close to the center of the wafer.

압박 이동 수단(26a∼26c)은, 예컨대 선단에 압박 부재(25a∼25c)가 접속된 로드와, 로드를 XY 평면에 대하여 직교하는 ±Z 방향으로 이동시키는 실린더를 구비하고, 로드를 이동시킴으로써 압박 부재(25a∼25c)를 ±Z 방향으로 이동시킨다. 실린더는, 예컨대 로드를 2단계로 늘릴 수 있는 2단계 스트로크 실린더이다. 압박 이동 수단(26a∼26c)이 압박 부재(25a∼25c)를 +Z 방향으로 이동시키면, 압박 부재(25a∼25c)는 흡인 유지부(24a∼24c)에 흡인 유지된 웨이퍼에 접촉하지 않는 위치로 퇴피한다. 이 때의 압박 부재(25a∼25c)의 위치를 「퇴피 위치」라고 부른다. 한편, 압박 이동 수단(26a∼26c)이 압박 부재(25a∼25c)를 -Z 방향으로 이동시키면, 압박 부재(25a∼25c)가 웨이퍼에 접촉하고, 웨이퍼를 -Z 방향으로 압박한다. 이 때의 압박 부재(25a∼25c)의 위치를 「압박 위치」라고 부른다. 압박 위치에는, ±Z 방향에 있어서, 압박 부재(25a∼25c)의 선단이, 흡인 유지부(24a∼24c)의 선단보다도 -Z측에 위치하는 「제1 압박 위치」와, 흡인 유지부(24a∼24c)의 선단과 동일한 높이에 위치하는 「제2 압박 위치」가 있다.The pressing and moving means 26a to 26c are provided with a rod to which the pressing members 25a to 25c are connected at the tip and a cylinder for moving the rod in the ± Z direction orthogonal to the XY plane, Thereby moving the members 25a to 25c in the ± Z direction. The cylinder is, for example, a two-stage stroke cylinder in which the load can be increased in two steps. When the pressing and moving means 26a to 26c move the pressing members 25a to 25c in the + Z direction, the pressing members 25a to 25c are moved to the positions where they do not contact the wafer held by the suction holding portions 24a to 24c . The positions of the pressing members 25a to 25c at this time are referred to as " retracted positions ". On the other hand, when the pressing and moving means 26a to 26c move the pressing members 25a to 25c in the -Z direction, the pressing members 25a to 25c contact the wafer and press the wafer in the -Z direction. The position of the pressing members 25a to 25c at this time is referred to as " pressing position ". In the pressing position, the tip ends of the pressing members 25a to 25c are positioned at the -Z side with respect to the tip ends of the suction holding portions 24a to 24c in the + Z direction and the "first pressing position" Quot; second pressing position " which is located at the same height as the tip of the first pressing position 24a to 24c.

유지 헤드 이동 수단(13)은 유지 헤드(12)를 지지하는 지지부(31)와, 지지부(31)가 선단에 설치된 아암(32)과, 아암(32)을 이동시키는 축부(33)를 구비하고 있다. 축부(33)는 아암(32)을 XY 평면 내에서 회동시키고, 아암(32)을 ±Z 방향으로 이동시킨다. 이에 따라, 유지 헤드(12)가 이동하여, 반송해야 할 웨이퍼가 배치된 가거치 테이블이나 웨이퍼의 반송 목적지인 유지 테이블에 유지 헤드(12)가 접근하거나 혹은 가거치 테이블이나 유지 테이블로부터 유지 헤드(12)가 이격된다.The holding head moving means 13 includes a supporting portion 31 for supporting the holding head 12, an arm 32 provided at the tip of the supporting portion 31, and a shaft portion 33 for moving the arm 32 have. The shaft portion 33 rotates the arm 32 in the XY plane, and moves the arm 32 in the + Z direction. Thus, the holding head 12 is moved so that the holding head 12 approaches the stationary table on which the wafer to be transported is placed or the wafer transfer destination, or the holding head 12 is moved from the stationary table or the holding table 12) are spaced apart.

다음에, 웨이퍼를 반송하는 절차에 대해서 설명한다. 이하에서는, 흡인 유지부(24a∼24c) 중 임의의 하나를 흡인 유지부(24)로서, 압박 부재(25a∼25c) 중 임의의 하나를 압박 부재(25)로서, 이동 수단(26a∼26c) 중 임의의 하나를 이동 수단(26)으로서 설명한다.Next, a procedure for carrying the wafers will be described. Any one of the suction holding portions 24a to 24c may be used as the suction holding portion 24 and any one of the pressing members 25a to 25c may be used as the pressing member 25 and the moving means 26a to 26c, Will be described as the moving means 26. Fig.

(1) 웨이퍼의 중앙이 오목한 경우(1) When the center of the wafer is concave

도 2에 도시된 바와 같이 웨이퍼(60)의 외주 부분이 +Z 방향으로 젖혀져 있는 경우(중앙이 오목한 경우)는, 흡인 유지부(24)를 외주측으로 이동시켜 외측 위치에 위치시키고, 압박 이동 수단(26)이 압박 부재(25)를 +Z 방향으로 이동시켜 퇴피 위치에 위치시킨다. 이 상태에서, 유지 헤드 이동 수단(13)이 아암(32)을 회동시켜, 가거치 테이블 등에 배치된 웨이퍼(60)의 +Z 방향으로 유지 헤드(12)를 위치시키고, 유지 헤드 이동 수단(13)이 아암(32)을 -Z 방향으로 이동시켜, 흡인 유지부(24)를 웨이퍼(60)의 외주 부분에 접촉시킨다. 그 후, 역지 밸브(42)(도 1 참조)를 개방하여 흡인원(41)(도 1 참조)에 의한 흡인을 시작하고, 흡인 유지부(24)가 웨이퍼(60)를 흡인 유지한다.As shown in Fig. 2, when the outer peripheral portion of the wafer 60 is bent in the + Z direction (the center is concave), the suction holding portion 24 is moved to the outer peripheral side to be positioned at the outer position, The means 26 moves the pressing member 25 in the + Z direction and places it in the retreat position. In this state, the holding head moving means 13 rotates the arm 32 to position the holding head 12 in the + Z direction of the wafer 60 arranged on the mounting table or the like, and the holding head moving means 13 Moves the arm 32 in the -Z direction so that the suction holding portion 24 is brought into contact with the outer peripheral portion of the wafer 60. Thereafter, the check valve 42 (see Fig. 1) is opened to start suction by the suction source 41 (see Fig. 1), and the suction holding portion 24 sucks and holds the wafer 60.

도 3에 도시된 바와 같이, 유지 테이블(50)은 역지 밸브(44)를 통해 진공 등의 흡인원(43)에 접속된 유지면(51)을 구비하고 있다. 유지 헤드 이동 수단(13)이 아암(32)을 +Z 방향으로 이동시켜, 흡인 유지부(24)에 유지된 웨이퍼(60)를 들어올리고, 유지 헤드 이동 수단(13)이 아암(32)을 회동시켜, 웨이퍼(60)의 반송 목적지인 유지 테이블(50)의 +Z 방향으로 유지 헤드(12)를 위치시킨다. 그리고, 유지 헤드 이동 수단(13)이 아암(32)을 -Z 방향으로 하강시켜, 흡인 유지부(24)에 유지된 웨이퍼(60)를 유지 테이블(50)의 유지면(51)에 배치한다.3, the holding table 50 is provided with a holding surface 51 connected to a suction source 43 such as vacuum through a check valve 44. [ The holding head moving means 13 moves the arm 32 in the + Z direction to lift the wafer 60 held by the suction holding portion 24 and the holding head moving means 13 moves the arm 32 And the holding head 12 is positioned in the + Z direction of the holding table 50, which is the destination of the transfer of the wafer 60. The holding head moving means 13 moves the arm 32 down in the -Z direction and places the wafer 60 held by the suction holding portion 24 on the holding surface 51 of the holding table 50 .

다음에, 도 4에 도시된 바와 같이, 역지 밸브(42)(도 1 참조)를 폐쇄하여 흡인원(41)(도 1 참조)에 의한 흡인을 정지하여 흡인 유지부(24)가 웨이퍼(60)를 풀어주고, 압박 이동 수단(26)이 압박 부재(25)를 -Z 방향으로 이동시켜 제1 압박 위치에 위치시키고, 웨이퍼(60)의 외주 부분을 -Z 방향으로 압박한다. 그 후, 역지 밸브(44)를 개방하여 흡인원(43)에 의한 흡인을 시작하고, 유지 테이블(50)이 웨이퍼(60)를 흡인 유지한다. 압박 부재(25)가 웨이퍼(60)의 외주 부분을 -Z 방향으로 압박함으로써, 웨이퍼(60)의 휨이 교정되어, 웨이퍼(60)와 유지면(51) 사이의 간극이 없어진다. 이 상태에서 유지 테이블(50)이 흡인함으로써, 웨이퍼(60)를 확실하게 유지할 수 있다. 또한, 압박 부재(25)를 제1 압박 위치가 아니라, 제2 압박 위치에 위치시켜도 좋다. 그렇게 하면, 압박 부재(25)뿐만 아니라, 흡인 유지부(24)로도 웨이퍼(60)를 압박할 수 있다.Next, as shown in Fig. 4, the check valve 42 (see Fig. 1) is closed to stop the suction by the suction source 41 (see Fig. 1) And the pressing and moving means 26 moves the pressing member 25 in the -Z direction to the first pressing position and presses the outer peripheral portion of the wafer 60 in the -Z direction. Thereafter, the check valve 44 is opened to start suction by the suction source 43, and the holding table 50 sucks and holds the wafer 60. The pressing member 25 presses the outer peripheral portion of the wafer 60 in the -Z direction so that the warping of the wafer 60 is corrected and the gap between the wafer 60 and the holding surface 51 is lost. By holding the holding table 50 in this state, the wafer 60 can be reliably held. Further, the pressing member 25 may be placed at the second pressing position instead of the first pressing position. In this way, not only the pressing member 25 but also the suction holding section 24 can press the wafer 60.

(2) 웨이퍼의 중앙이 볼록한 경우(2) When the center of the wafer is convex

도 5에 도시된 바와 같이 웨이퍼(60)의 외주 부분이 -Z 방향으로 젖혀져 있는 경우(중앙이 볼록한 경우)는, 흡인 유지 이동 수단이 흡인 유지부(24)를 중심측으로 이동시켜 내측 위치에 위치시키고, 압박 이동 수단(26)이 압박 부재(25)를 -Z 방향으로 이동시켜 퇴피 위치에 위치시킨다. 이 상태에서, 유지 헤드 이동 수단(13)이 아암(32)을 회동시켜, 가거치 테이블 등에 배치된 웨이퍼(60)의 +Z 방향으로 유지 헤드(12)를 위치시키고, 유지 헤드 이동 수단(13)이 아암(32)을 -Z 방향으로 이동시켜, 흡인 유지부(24)를 웨이퍼(60)의 중앙 부근에 접촉시킨다. 그 후, 역지 밸브(42)(도 1 참조)를 개방하여 흡인원(41)(도 1 참조)에 의한 흡인을 시작하고, 흡인 유지부(24)가 웨이퍼(60)를 흡인 유지한다.As shown in FIG. 5, when the outer peripheral portion of the wafer 60 is bent in the -Z direction (the center is convex), the suction holding and moving means moves the suction holding portion 24 toward the center, And the pressing and moving means 26 moves the pressing member 25 in the -Z direction and places it in the retreat position. In this state, the holding head moving means 13 rotates the arm 32 to position the holding head 12 in the + Z direction of the wafer 60 arranged on the mounting table or the like, and the holding head moving means 13 Moves the arm 32 in the -Z direction so that the suction holding portion 24 is brought into contact with the vicinity of the center of the wafer 60. Thereafter, the check valve 42 (see Fig. 1) is opened to start suction by the suction source 41 (see Fig. 1), and the suction holding portion 24 sucks and holds the wafer 60.

다음에, 유지 헤드 이동 수단(13)이 아암(32)을 +Z 방향으로 이동시켜, 흡인 유지부(24)에 유지된 웨이퍼(60)를 들어올리고, 유지 헤드 이동 수단(13)이 아암(32)을 회동시켜, 웨이퍼(60)의 반송 목적지인 유지 테이블(50)의 +Z 방향으로 유지 헤드(12)를 위치시킨다. 그리고, 유지 헤드 이동 수단(13)이 아암(32)을 -Z 방향으로 하강시켜, 흡인 유지부(24)에 유지된 웨이퍼(60)를 유지 테이블(50)의 유지면(51)에 배치한다.Next, the holding head moving means 13 moves the arm 32 in the + Z direction to lift the wafer 60 held by the suction holding portion 24, and the holding head moving means 13 moves the arm 60 32 are rotated to position the holding head 12 in the + Z direction of the holding table 50, which is the transfer destination of the wafer 60. The holding head moving means 13 moves the arm 32 down in the -Z direction and places the wafer 60 held by the suction holding portion 24 on the holding surface 51 of the holding table 50 .

도 6에 도시된 바와 같이, 압박 이동 수단(26)이 압박 부재(25)를 -Z 방향으로 이동시켜 제2 압박 위치에 위치시키고, 유지 헤드 이동 수단(13)이 아암(32)을 -Z 방향으로 하강시켜, 압박 부재(25)로 웨이퍼(60)의 외주 부분을 -Z 방향으로 압박하고, 흡인 유지부(24)로 웨이퍼(60)의 중앙 부근을 -Z 방향으로 압박한다. 그 후, 역지 밸브(44)를 개방하여 흡인원(43)에 의한 흡인을 시작하여 유지 테이블(50)이 웨이퍼(60)를 흡인 유지하고, 역지 밸브(42)(도 1 참조)를 폐쇄하여 흡인원(41)(도 1 참조)에 의한 흡인을 정지하여 흡인 유지부(24)가 웨이퍼(60)를 풀어준다.The pressing and moving means 26 moves the pressing member 25 in the -Z direction to the second pressing position and the holding head moving means 13 moves the arm 32 to the -Z The outer peripheral portion of the wafer 60 is pressed by the pressing member 25 in the -Z direction and the vicinity of the center of the wafer 60 is pressed by the suction holding portion 24 in the -Z direction. Thereafter, the check valve 44 is opened to start suction by the suction source 43, the holding table 50 sucks and holds the wafer 60, and the check valve 42 (see Fig. 1) is closed The suction by the suction source 41 (see FIG. 1) is stopped, and the suction holding unit 24 releases the wafer 60.

압박 부재(25)가 웨이퍼(60)의 외주 부분을 -Z 방향으로 압박하고, 흡인 유지부(24)가 웨이퍼(60)의 중앙 부근을 -Z 방향으로 압박함으로써, 웨이퍼(60)의 휨이 교정되어, 웨이퍼(60)와 유지면(51) 사이의 간극이 없어진다. 이 상태에서 유지 테이블(50)이 흡인함으로써, 웨이퍼(60)를 확실하게 유지할 수 있다.The pressing member 25 presses the outer peripheral portion of the wafer 60 in the -Z direction and the suction holding portion 24 presses the vicinity of the center of the wafer 60 in the -Z direction so that the warpage of the wafer 60 And the clearance between the wafer 60 and the holding surface 51 is eliminated. By holding the holding table 50 in this state, the wafer 60 can be reliably held.

또한, 흡인 유지부의 수는 3개로 한정되지 않고, 4개 이상이어도 좋다. 마찬가지로, 압박 부재의 수는 3개로 한정되지 않고, 4개 이상이어도 좋다. 또한, 흡인 유지부(24a∼24c)가 외측 위치에 있는 경우에 있어서의 중심으로부터의 거리는 압박 부재(25a∼25c)의 중심으로부터의 거리보다도 커도 좋다. 또한, 흡인 유지부(24a∼24c)뿐만 아니라, 압박 부재(25a∼25c)도 직경 방향으로 이동하는 구성이어도 좋다.In addition, the number of the suction holding portions is not limited to three, but may be four or more. Similarly, the number of the pressing members is not limited to three, and may be four or more. The distance from the center when the suction holding portions 24a to 24c are at the outer position may be larger than the distance from the center of the pressing members 25a to 25c. In addition to the suction holding sections 24a to 24c, the pressing members 25a to 25c may also move in the radial direction.

10 : 반송 기구 12 : 유지 헤드
21 : 중앙부 22a∼22c, 23a∼23c : 아암부
24, 24a∼24c : 흡인 유지부 25, 25a∼25c : 압박 부재
26, 26a∼26c : 압박 이동 수단 13 : 유지 헤드 이동 수단
31 : 지지부 32 : 아암
33 : 축부 41, 43 : 흡인원
42, 44 : 역지 밸브 50 : 유지 테이블
51 : 유지면 60 : 웨이퍼10: transport mechanism 12: retaining head
21: central portions 22a to 22c, 23a to 23c:
24, 24a to 24c: suction holding sections 25, 25a to 25c:
26, 26a to 26c: pressing and moving means 13: holding head moving means
31: Support part 32:
33: shaft portion 41, 43: suction source
42, 44: check valve 50: retaining table
51: holding face 60: wafer

Claims (2)

웨이퍼를 흡인 유지하는 유지 테이블로 웨이퍼를 반송하는 반송 기구에 있어서,
웨이퍼를 흡인 유지하는 복수의 흡인 유지부와, 상기 유지 테이블에 배치된 웨이퍼의 외주부를 상기 유지 테이블을 향해 압박하는 압박 위치와 상기 흡인 유지부에 유지된 웨이퍼에 접촉하지 않는 퇴피(退避) 위치 사이에서 이동 가능한 복수의 압박 부재를 구비한 유지 헤드와,
상기 유지 헤드를 상기 유지 테이블에 대하여 접근 및 이격시키는 유지 헤드 이동 수단
을 구비한 반송 기구.A transfer mechanism for transferring a wafer to a holding table for holding a wafer by suction,
A plurality of suction holding portions for holding the wafer by suction; a pressing position for pressing the outer peripheral portion of the wafer disposed on the holding table toward the holding table and a retracted position not contacting the wafer held by the suction holding portion; A holding head having a plurality of pressing members that are movable in a predetermined direction;
A holding head moving means for moving the holding head to and from the holding table,
. 제1항에 있어서, 상기 복수의 흡인 유지부는, 상기 압박 부재보다도 내측의 내측 위치와 상기 압박 부재와 동일 원주 상의 외측 위치 사이에서 이동 가능하게 설치되는 것인 반송 기구.The transport mechanism according to claim 1, wherein the plurality of suction-holding portions are provided so as to be movable between an inner position on the inner side of the pressing member and an outer position on the same circumference as the pressing member.
KR1020150001033A 2014-01-30 2015-01-06 Feed mechanism KR102154718B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-015444 2014-01-30
JP2014015444A JP6255259B2 (en) 2014-01-30 2014-01-30 Transport mechanism

Publications (2)

Publication Number Publication Date
KR20150090997A true KR20150090997A (en) 2015-08-07
KR102154718B1 KR102154718B1 (en) 2020-09-10

Family

ID=53731546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150001033A KR102154718B1 (en) 2014-01-30 2015-01-06 Feed mechanism

Country Status (4)

Country Link
JP (1) JP6255259B2 (en)
KR (1) KR102154718B1 (en)
CN (1) CN104821288B (en)
TW (1) TWI611499B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6859075B2 (en) * 2016-11-04 2021-04-14 株式会社東京精密 Wafer transfer holding device
JP6879807B2 (en) * 2017-04-07 2021-06-02 株式会社ディスコ Processing equipment
CN113003185A (en) * 2021-02-23 2021-06-22 胡慧红 Flat pasting equipment for wafer photoetching development
CN118315325B (en) * 2024-06-11 2024-09-20 华芯(嘉兴)智能装备有限公司 Wafer adsorption control method and system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284056A (en) 1998-03-27 1999-10-15 Disco Abrasive Syst Ltd Absorbing and fixing apparatus
JP2009107097A (en) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd Machining apparatus
KR20100036166A (en) * 2008-09-29 2010-04-07 우시오덴키 가부시키가이샤 Arm for transferring substrate
JP2012156415A (en) * 2011-01-28 2012-08-16 Lintec Corp Support device and support method of plate-like member
JP2013144323A (en) 2012-01-13 2013-07-25 Disco Corp Carrying method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796249B2 (en) * 2001-09-14 2011-10-19 株式会社ディスコ Plate-like object conveyance mechanism and dicing apparatus equipped with the conveyance mechanism
JP4371939B2 (en) * 2004-08-03 2009-11-25 パナソニック株式会社 Board loading apparatus, component mounting apparatus, and board loading method
JP4841355B2 (en) * 2006-08-08 2011-12-21 日東電工株式会社 Method for holding semiconductor wafer
TWM312404U (en) * 2006-11-07 2007-05-21 Hiwin Tech Corp Arm mechanism for transporting wafer
JP2008227134A (en) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd Component mounting apparatus and substrate conveying method
JP5846734B2 (en) * 2010-11-05 2016-01-20 株式会社ディスコ Transport device
TWM410333U (en) * 2011-01-18 2011-08-21 Xintec Inc Loading device
TWM421587U (en) * 2011-07-28 2012-01-21 Nutrim Technology Inc Leveling apparatus for wafer
JP5943581B2 (en) * 2011-11-01 2016-07-05 株式会社ディスコ Transport device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284056A (en) 1998-03-27 1999-10-15 Disco Abrasive Syst Ltd Absorbing and fixing apparatus
JP2009107097A (en) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd Machining apparatus
KR20100036166A (en) * 2008-09-29 2010-04-07 우시오덴키 가부시키가이샤 Arm for transferring substrate
JP2012156415A (en) * 2011-01-28 2012-08-16 Lintec Corp Support device and support method of plate-like member
JP2013144323A (en) 2012-01-13 2013-07-25 Disco Corp Carrying method

Also Published As

Publication number Publication date
JP2015142087A (en) 2015-08-03
TW201537664A (en) 2015-10-01
JP6255259B2 (en) 2017-12-27
TWI611499B (en) 2018-01-11
CN104821288B (en) 2019-04-19
KR102154718B1 (en) 2020-09-10
CN104821288A (en) 2015-08-05

Similar Documents

Publication Publication Date Title
KR20150090997A (en) Feed mechanism
CN101855720B (en) Alignment device to align plates for electronic circuits
JP2018043853A (en) Transport device and transport method
US10529610B2 (en) Apparatus and method for transferring a substrate
JP6186256B2 (en) Processing equipment
JP6011278B2 (en) Article processing system
KR20190110585A (en) Centering device
JP7148374B2 (en) Wafer delivery device
KR102486302B1 (en) Machining apparatus
JP6330437B2 (en) Loader device, plate material conveying method, and plate material processing system
KR20140120822A (en) Chuck table
JP2016042556A (en) Edge clamp transport mechanism
JP6563322B2 (en) Transport device
JP2015199162A (en) Non-contact conveyance apparatus
JP2020019605A (en) Conveying device
KR101535136B1 (en) Panel cutting device and method of transferring panel in the same
JP2017050484A (en) Robot hand
JP6916447B2 (en) Semiconductor device transport device, semiconductor device inspection system equipped with this, and semiconductor device transport method
TWI826854B (en) Cutting device and manufacturing method for cut product
JP6496919B2 (en) Bernoulli hand and semiconductor manufacturing equipment
JP2013191631A (en) Transport mechanism
JP6104711B2 (en) Work transfer device
JP6585961B2 (en) Conveying mechanism and processing device
KR101479974B1 (en) Panel cutting device and method of transferring panel in the same
JP2013166217A (en) Suction conveying method and suction conveying device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right