JP2008235736A - Carrying device and carrying method - Google Patents

Carrying device and carrying method Download PDF

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JP2008235736A
JP2008235736A JP2007075968A JP2007075968A JP2008235736A JP 2008235736 A JP2008235736 A JP 2008235736A JP 2007075968 A JP2007075968 A JP 2007075968A JP 2007075968 A JP2007075968 A JP 2007075968A JP 2008235736 A JP2008235736 A JP 2008235736A
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holding
plate
contact
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holding surface
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JP4980761B2 (en
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Masahisa Otsuka
昌久 大塚
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Lintec Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying device and a carrying method capable of carrying a wafer by making contact with it to suck it, after adjusting the wafer and a holding surface to be parallel with each other even when they have not been parallel. <P>SOLUTION: The carrying device 10 comprises a suction plate 15 provided with the holding surface 15A for sucking a semiconductor wafer W mounted on a mounting surface TS, and an abutting member 20 provided on the outer peripheral side of the suction plate 15 and projected to the side of the mounting surface TS more than the holding surface 15A. The abutting member 20 is abutted to the mounting surface TS before the holding surface 15A and a surface Wa to be held are brought into contact and is brought into contact with the wafer W after all the abutting members 20 are abutted to the mounting surface TS to make the holding surface 15A and the surface Wa to be held be parallel, and suction and holding by the holding surface 15A are made possible. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は搬送装置及び搬送方法に係り、更に詳しくは、半導体ウエハ等の板状部材を搬送するにあたり、当該板状部材を損傷させることなく搬送することのできる搬送装置及び搬送方法に関する。   The present invention relates to a transport apparatus and a transport method, and more particularly to a transport apparatus and a transport method that can transport a plate-shaped member such as a semiconductor wafer without damaging the plate-shaped member.

半導体ウエハ(以下、単に「ウエハ」という)の搬送装置としては、当該ウエハの中央部若しくは周方向複数箇所を吸着することのできる吸盤からなる吸着保持手段が知られている。しかしながら、裏面研削によって数十μmの厚みとなる極薄化が達成されている現状において、従来装置による吸着保持方式を採用すると、ウエハに作用する局所的な吸着力により、当該ウエハを割ってしまう、という不都合を招来する。
そこで、ウエハを面で吸着保持が可能なポーラス体が頻繁に使用されるようになった。このようなポーラス体は、極小径の金属球を焼結し、研磨によって精度の高い保持面を有するため、ウエハに対して局所的に力が加わることは少ない。しかしながら、金属製であるが故にこのポーラス体が傾いてウエハに接触した場合や、接触時の衝撃によって当該ウエハを損傷させてしまう、という不都合を生じる。
As a transfer device for a semiconductor wafer (hereinafter, simply referred to as “wafer”), a suction holding means including a suction cup capable of sucking a central portion or a plurality of circumferential directions of the wafer is known. However, in the present situation where the thickness is reduced to several tens of μm by backside grinding, if the suction holding method using the conventional apparatus is adopted, the wafer is broken by the local suction force acting on the wafer. , Inconvenience.
Therefore, a porous body capable of attracting and holding a wafer by a surface has been frequently used. Such a porous body sinters a metal ball having a very small diameter and has a highly accurate holding surface by polishing, so that a local force is hardly applied to the wafer. However, since it is made of metal, there arises a disadvantage that the porous body is inclined and comes into contact with the wafer, or that the wafer is damaged by an impact at the time of contact.

特許文献1には、ウエハを吸着して保持する吸着面を有する吸着パッドと、この吸着パッドを変位可能に支持する支持機構と、前記吸着パッドを移動させる移動アームとを備えた搬送装置が開示されている。この搬送装置は、ウエハの載置面を有するテーブルが吸着パッドの吸着面に対して傾きを有している場合に、その傾きに応じて支持機構を予め調整可能に設けたものである。   Japanese Patent Application Laid-Open No. 2004-228561 discloses a transfer device including a suction pad having a suction surface that sucks and holds a wafer, a support mechanism that supports the suction pad in a displaceable manner, and a moving arm that moves the suction pad. Has been. In this transfer apparatus, when the table having the wafer mounting surface is inclined with respect to the suction surface of the suction pad, the support mechanism is provided so as to be adjustable in advance according to the tilt.

特開2003−158167号公報JP 2003-158167 A

しかしながら、特許文献1に記載された搬送装置にあっては、二つのテーブル間でしかその効果を発揮することができない。従って、三つ以上のテーブル間でウエハを搬送する場合において、それぞれのテーブルに個性的な傾きがある場合には、その傾きに対応できないものとなり、結果的に、ウエハを損傷から保護することはできない。しかも、前記移動機構を予め調整若しくは設定する作業が必要となるものであり、作業も煩雑となる。   However, in the transfer device described in Patent Document 1, the effect can be exhibited only between two tables. Therefore, when a wafer is transferred between three or more tables, if each table has a unique inclination, the inclination cannot be accommodated, and as a result, the wafer can be protected from damage. Can not. In addition, an operation for adjusting or setting the moving mechanism in advance is required, and the operation becomes complicated.

[発明の目的]
本発明は、このような不都合に着目して案出されたものであり、その目的は、ウエハ等の板状部材を搬送するに際し、当該板状部材の載置面や板状部材の被保持面に傾きがあっても、当該傾きに追従した変位を可能として保持部材と板状部材の被保持面とを自動的に平行とし、当該保持部材が傾いてウエハに接触することを防止して板状部材を搬送することのできる搬送装置及び搬送方法を提供することにある。
[Object of invention]
The present invention has been devised by paying attention to such inconveniences. The purpose of the present invention is to carry a plate-like member mounting surface or a plate-like member when a plate-like member such as a wafer is transferred. Even if the surface is inclined, the holding member and the surface to be held of the plate-like member are automatically made parallel so that the displacement following the inclination can be made, and the holding member is prevented from inclining and contacting the wafer. It is providing the conveying apparatus and conveying method which can convey a plate-shaped member.

前記目的を達成するため、本発明は、載置面に載置された板状部材を保持する保持手段と、この保持手段を揺動可能に連結するとともに、当該保持手段を移動して前記板状部材を搬送する駆動手段とを備えた搬送装置において、
前記保持手段は前記板状部材を保持する保持面を有するとともに、当該保持面と前記板状部材の被保持面との相対位置を平行に調整する平行調整手段を含み、
前記平行調整手段は、前記保持面と板状部材の被保持面とが接触する前に前記載置面に当接して前記保持面と板状部材の被保持面とを平行に保つ当接部材を備えて構成される、という構成を採っている。
In order to achieve the above object, the present invention provides a holding means for holding a plate-like member placed on a placement surface, and the holding means is slidably connected, and the holding means is moved to move the plate. In a conveying apparatus provided with a driving means for conveying a shaped member,
The holding means includes a holding surface for holding the plate-like member, and includes a parallel adjusting means for adjusting the relative position between the holding surface and the held surface of the plate-like member in parallel.
The parallel adjustment means is a contact member that contacts the mounting surface before the holding surface and the held surface of the plate-like member contact to keep the holding surface and the held surface of the plate-like member parallel to each other. It is configured to be equipped with.

また、本発明は、板状部材の載置面を備えた載置手段と、前記板状部材を保持する保持面を備えた保持手段と、当該保持手段を移動して前記板状部材を搬送する駆動手段とを含む搬送装置において、
前記保持手段及び/又は載置手段は、前記保持面と前記板状部材の被保持面との相対位置を平行に調整する平行調整手段を含み、
前記平行調整手段は、前記保持面と板状部材の被保持面とが接触する前に前記載置面及び/又は保持面の周囲に当接して前記保持面と板状部材の被保持面とを平行に保つ当接部材を備える、という構成を採ってもよい。
The present invention also provides a mounting means having a mounting surface for a plate-like member, a holding means having a holding surface for holding the plate-like member, and transporting the plate-like member by moving the holding means. And a driving device including:
The holding means and / or the placing means includes parallel adjusting means for adjusting the relative position of the holding surface and the held surface of the plate-like member in parallel,
The parallel adjusting means abuts on the mounting surface and / or the periphery of the holding surface before the holding surface and the held surface of the plate-shaped member come into contact with each other. Alternatively, a configuration may be adopted in which a contact member that keeps the two in parallel is provided.

本発明において、前記保持面は、少なくとも前記板状部材の平面形状に略対応する大きさを備えた吸着プレートに設けられ、前記当接部材は、前記吸着プレートの外周側複数箇所に設けられている。   In the present invention, the holding surface is provided on a suction plate having a size substantially corresponding to at least a planar shape of the plate-like member, and the contact member is provided at a plurality of locations on the outer peripheral side of the suction plate. Yes.

また、前記当接部材は、前記保持面よりも前記載置面側に突出する軸状に設けられているとともに、前記載置面に対して進退可能に設けられる、という構成を採ることが好ましい。   In addition, it is preferable that the contact member is provided in a shaft shape that protrudes toward the placement surface from the holding surface, and is provided so as to be movable back and forth with respect to the placement surface. .

更に、前記保持手段は、緩衝手段を介して前記駆動手段に支持される、という構成を採るとよい。   Furthermore, the holding means may be configured to be supported by the driving means via a buffer means.

また、本発明は、載置面に載置された板状部材を相対する保持面で保持して搬送する搬送方法において、
前記板状部材の被保持面と前記保持面とを平行とした状態で当該保持面と板状部材の被保持面とを接触させ、
次いで、前記保持面で前記板状部材の被保持面を保持して搬送する、という手法を採っている。
Further, the present invention relates to a transport method for transporting a plate-like member placed on a placement surface while holding the plate-like member facing each other.
Bringing the holding surface of the plate-shaped member and the holding surface of the plate-shaped member into contact with each other in a state where the holding surface of the plate-shaped member and the holding surface are parallel to each other;
Next, a method is adopted in which the holding surface of the plate-like member is held and transported by the holding surface.

前記搬送方法において、前記板状部材の被保持面に保持面を接触させる際の衝撃を緩衝する、という方法を採るとよい。   In the transport method, a method of buffering an impact when the holding surface is brought into contact with the held surface of the plate-like member may be adopted.

本発明によれば、平行調整手段の当接部材が、保持面と板状部材の被保持面との接触に先だって載置面に当接し、それらが平行となるように調整するため、保持面は、板状部材に対して常に平行な状態で接触することとなる。従って、板状部材の被保持面に対して保持面が傾いて接触することがなくなり、当該板状部材の割れ等の損傷を効果的に防止することができる。
また、搬送先となる載置面が傾いている場合においても、当接部材が載置面に先に接触し、板状部材の被載置面と載置面とが平行な状態となって移載されるため、板状部材の割れ等を防止することとなる。
更に、当接部材が軸状に設けられて進退可能に設けられた構成により、当接部材が載置面に突き当たった際の衝撃もなく、平行調整を円滑に行うことが可能となる。
また、保持手段と駆動手段とが緩衝手段を介して連結されていることで、保持面と板状部材の被保持面とが接触した際や、載置面と板状部材の被載置面とが接触した際の衝撃も吸収されるので、板状部材を割ってしまうような不都合は生じない。
According to the present invention, the abutting member of the parallel adjusting means abuts on the mounting surface prior to the contact between the holding surface and the held surface of the plate-like member, and the holding surface is adjusted so that they are parallel. Will always contact the plate-like member in a parallel state. Therefore, the holding surface is not inclined and comes into contact with the held surface of the plate-like member, and damage such as cracking of the plate-like member can be effectively prevented.
In addition, even when the placement surface that is the transport destination is inclined, the contact member comes into contact with the placement surface first, and the placement surface and the placement surface of the plate-like member are in a parallel state. Since it is transferred, cracking of the plate-like member is prevented.
Further, the configuration in which the contact member is provided in a shaft shape so as to be able to advance and retreat enables smooth parallel adjustment without an impact when the contact member hits the placement surface.
Further, since the holding means and the driving means are connected via the buffer means, when the holding surface comes into contact with the held surface of the plate-like member, or when the mounting surface and the plate-like member placed surface Since the impact when the contact is made is also absorbed, there is no inconvenience of breaking the plate member.

以下、本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1には、本実施形態に係る搬送装置の概略斜視図が示され、図2には、その一部を断面した要部概略側面図が示されている。これらの図において、搬送装置10は、板状部材としてのウエハWを保持する保持手段11と、この保持手段11を介してウエハWを搬送する駆動手段12と、保持手段11を揺動可能な状態で前記駆動手段12に支持させる連結手段13と、保持手段11がウエハWに接触する際の衝撃を吸収若しくは緩和する緩衝手段14とを備えて構成されている。ここで、ウエハWは、載置手段としてのテーブルTの上面を載置面TSとして載置され、その上面が被保持面Wa、下面が被載置面Wbとされる。   FIG. 1 shows a schematic perspective view of a transfer apparatus according to the present embodiment, and FIG. 2 shows a schematic side view of a main part with a part thereof cut. In these drawings, the transfer device 10 can hold the holding means 11 that holds the wafer W as a plate-like member, the driving means 12 that transfers the wafer W via the holding means 11, and the holding means 11 can be swung. The connecting unit 13 is supported by the driving unit 12 in a state, and the buffer unit 14 absorbs or reduces the impact when the holding unit 11 contacts the wafer W. Here, the wafer W is placed with the upper surface of the table T as the placing means as the placement surface TS, and the upper surface is the held surface Wa and the lower surface is the placement surface Wb.

前記保持手段11は、図2に示されるように、下面側にウエハWの保持面15Aを有するポーラス体によって形成された吸着プレート15と、スペーサ16を介して吸着プレート15を支持する平面視略円盤状の支持プレート17と、前記保持面15AとウエハWとを平行に調整する平行調整手段18とを含んで構成されている。保持面15Aには、ウエハWを吸着保持する図示しない複数の吸引口が形成されおり、これら吸引口は図示しない減圧装置に接続されている。なお、本実施形態における吸着プレート15は、ウエハWの直径よりも大きい直径を備えたものが採用されているが、少なくともウエハWの平面形状に略対応した大きさを備えたものであれば足りる。   As shown in FIG. 2, the holding unit 11 is substantially in plan view for supporting the suction plate 15 via a suction plate 15 formed by a porous body having a holding surface 15 </ b> A of the wafer W on the lower surface side and a spacer 16. It includes a disk-shaped support plate 17 and parallel adjusting means 18 for adjusting the holding surface 15A and the wafer W in parallel. The holding surface 15A is formed with a plurality of suction ports (not shown) for sucking and holding the wafer W, and these suction ports are connected to a decompression device (not shown). In this embodiment, the suction plate 15 having a diameter larger than the diameter of the wafer W is employed, but at least a suction plate 15 having a size substantially corresponding to the planar shape of the wafer W is sufficient. .

前記平行調整手段18は、保持面15Aと被保持面Waとが接触する前に前記載置面TSに当接して保持面15Aと被保持面Waとを平行に保つ軸状の当接部材20により構成されている。この当接部材20は、前記支持プレート17の外周近傍において、当該支持プレート17の周方向略120度間隔を隔てた位置に設けられている。ここで、当接部材20は、支持プレート17に固定されたブッシュ21を介して軸方向(図2中上下方向)に沿って進退可能に設けられており、上端側にストッパ23が固定されている一方、下端側にはばね受け部材24が固定されている。このばね受け部材24とブッシュ21との間にはコイルばね25が介装されており、当該コイルばね25の付勢力により、前記ストッパ23の下面がブッシュ21の上端面に着座する状態を初期位置として保ち、当該初期位置において、当接部材20の先端すなわち図2中下端が前記保持面15Aよりも載置面TS側に突出している。   The parallel adjusting means 18 is in contact with the mounting surface TS before the holding surface 15A and the held surface Wa come into contact with each other, and holds the holding surface 15A and the held surface Wa in parallel. It is comprised by. The abutting member 20 is provided in the vicinity of the outer periphery of the support plate 17 at a position spaced approximately 120 degrees in the circumferential direction of the support plate 17. Here, the contact member 20 is provided so as to be able to advance and retreat along the axial direction (vertical direction in FIG. 2) via a bush 21 fixed to the support plate 17, and a stopper 23 is fixed to the upper end side. On the other hand, a spring receiving member 24 is fixed to the lower end side. A coil spring 25 is interposed between the spring receiving member 24 and the bush 21. The state where the lower surface of the stopper 23 is seated on the upper end surface of the bush 21 by the biasing force of the coil spring 25 is the initial position. In this initial position, the tip of the contact member 20, that is, the lower end in FIG. 2, protrudes from the holding surface 15A toward the placement surface TS.

前記駆動手段12は、X軸方向に延びるX軸ロボット30と、当該X軸ロボット30を介してX軸方向に移動可能に支持されたスライダ31と、このスライダ31の前面に固定されたZ軸ロボット33と、このZ軸ロボット33に一端側が支持される一方、他端側(先端側)が前記保持手段11を支持するように設けられたプレート状のアーム部材34とにより構成されている。従って、X軸ロボット30及びZ軸ロボット33の駆動により、吸着プレート15は、アーム部材34を介してX軸及びZ軸方向に移動可能となる。   The driving means 12 includes an X-axis robot 30 extending in the X-axis direction, a slider 31 supported so as to be movable in the X-axis direction via the X-axis robot 30, and a Z-axis fixed to the front surface of the slider 31. One end side is supported by the Z-axis robot 33, and the other end side (front end side) is configured by a plate-like arm member 34 provided to support the holding means 11. Accordingly, the suction plate 15 can be moved in the X-axis and Z-axis directions via the arm member 34 by driving the X-axis robot 30 and the Z-axis robot 33.

前記連結手段13は、前記支持プレート17と前記アーム部材34の先端側に位置する緩衝手段14との間に設けられている。この連結手段13は、概略的に図示されたユニバーサルジョイント36により構成されており、下方に突出する軸37が支持プレート17の中央部に連結され、保持手段11をフレキシブルに回動可能に支持している。これにより、全ての当接部材20が載置面TSに当接したときに被保持面Waと保持面15Aとが平行となるように設定されている。   The connecting means 13 is provided between the support plate 17 and the buffer means 14 located on the distal end side of the arm member 34. The connecting means 13 is constituted by a universal joint 36 shown schematically, and a shaft 37 protruding downward is connected to the central portion of the support plate 17 to support the holding means 11 so as to be able to rotate flexibly. ing. Accordingly, the held surface Wa and the holding surface 15A are set to be parallel when all the contact members 20 are in contact with the placement surface TS.

前記緩衝手段14は、前記ユニバーサルジョイント36の上端に連結された連結板40と、この連結板40の周方向略120度間隔を隔てた位置に立設されるとともに、前記アーム部材34を貫通して延びる3本の昇降軸42と、この昇降軸42が貫通する状態で当該昇降軸42と前記アーム部材34との間に設けられたブッシュ43と、各昇降軸42の上端を相互に連結するように固定された頂板44と、当該頂板44とアーム部材34にその両端が固定されたコイルばね45とを備えて構成されている。コイルばね45は、頂板44を上方に付勢する付勢力を有するが、前記保持手段11及び連結手段13の重量により、その付勢力に抗して幾分縮んだ状態が初期状態となる。   The buffer means 14 is erected at a position separated from the connecting plate 40 connected to the upper end of the universal joint 36 by an interval of about 120 degrees in the circumferential direction of the connecting plate 40, and penetrates the arm member 34. The three elevating shafts 42 extending in parallel, the bush 43 provided between the elevating shaft 42 and the arm member 34 in a state where the elevating shaft 42 penetrates, and the upper ends of the elevating shafts 42 are connected to each other. And a coil spring 45 having both ends fixed to the top plate 44 and the arm member 34. The coil spring 45 has an urging force that urges the top plate 44 upward. However, due to the weight of the holding means 11 and the connecting means 13, the coil spring 45 is somewhat contracted against the urging force as an initial state.

次に、本実施形態に係る搬送装置10を用いたウエハ搬送方法について、図3ないし図6をも参照しながら説明する。ここでは、テーブルTの載置面TSと前記初期状態における保持手段11とは平行でないものとし、ウエハWの被載置面Wbと被保持面Waとは平行であるものとする(図2参照)。   Next, a wafer transfer method using the transfer apparatus 10 according to the present embodiment will be described with reference to FIGS. Here, it is assumed that the mounting surface TS of the table T and the holding means 11 in the initial state are not parallel, and the mounting surface Wb and the held surface Wa of the wafer W are parallel (see FIG. 2). ).

駆動手段12の駆動により保持手段11がテーブルTの上方に位置した状態で、Z軸ロボット33が駆動して保持手段11を下降させると、図3に示されるように、保持面15AがウエハWに接触する前に、同図中右側に位置する当接部材20の先端(下端)が載置面TSに当接する。そして、更に保持手段11を下降させると、図4に示されるように、ユニバーサルジョイント36を介して保持手段11全体が同図中左回りに回転し、それまで当接していなかった他の当接部材20を順次載置面TSに当接させることとなる。この時点では、保持面15AとウエハWとは依然として被接触状態に保たれる。   When the Z-axis robot 33 is driven to lower the holding unit 11 in a state where the holding unit 11 is positioned above the table T by driving the driving unit 12, the holding surface 15A is moved to the wafer W as shown in FIG. Before the contact, the front end (lower end) of the contact member 20 located on the right side in FIG. When the holding means 11 is further lowered, as shown in FIG. 4, the entire holding means 11 rotates counterclockwise in the drawing via the universal joint 36, and other abutments that have not been abutted until then. The members 20 are sequentially brought into contact with the placement surface TS. At this time, the holding surface 15A and the wafer W are still kept in contact with each other.

全ての当接部材20の先端が当接した時点で、保持面15Aと被保持面Waとは平行に向き合った状態となる。この状態で更に保持手段11を下降させると、保持面15Aがコイルばね25の付勢力に抗して下方に押し下げられることとなる。ここで、保持面15Aは、各当接部材20がブッシュ21に沿って摺動することによって、被保持面Waとの平行度が高精度に維持されつつウエハWに接近することとなる。
そして、図5に示されるように、保持面15Aに被保持面Waが接触し、当該ウエハWは、図示しない減圧装置の吸引により吸着プレート15に保持されることとなる。この吸着プレート15とウエハWとの接触の際の衝撃は、緩衝手段14のコイルばね45が延びて保持手段11が上昇することによって緩衝され、ウエハWの損傷を防止するようになっている。
When the tips of all the contact members 20 are in contact, the holding surface 15A and the held surface Wa are in a state of facing each other in parallel. If the holding means 11 is further lowered in this state, the holding surface 15 </ b> A is pushed downward against the urging force of the coil spring 25. Here, the holding surface 15 </ b> A approaches the wafer W while maintaining parallelism with the held surface Wa with high accuracy as each contact member 20 slides along the bush 21.
As shown in FIG. 5, the held surface Wa comes into contact with the holding surface 15A, and the wafer W is held by the suction plate 15 by suction of a decompression device (not shown). The impact at the time of contact between the suction plate 15 and the wafer W is buffered by the coil spring 45 of the buffer means 14 extending and the holding means 11 rising, thereby preventing the wafer W from being damaged.

図6に示されるように、ウエハWが保持面15Aに吸着保持された状態で、Z軸シリンダ33を駆動して保持手段11を上昇させると、保持手段11は、ユニバーサルジョイント36を介してニュートラル位置に復帰し、この状態で、図示しない別途のテーブル等の載置面に移載される。この際、移載先の載置面と保持手段11とが平行でない場合であっても、ウエハWを載置する前に当接部材20が先に載置面に接触し、被載置面Wbと載置面とが平行な状態となって載置されることとなる。   As shown in FIG. 6, when the holding means 11 is raised by driving the Z-axis cylinder 33 in a state where the wafer W is attracted and held on the holding surface 15 </ b> A, the holding means 11 is neutralized via the universal joint 36. It returns to the position, and in this state, it is transferred to a mounting surface such as a separate table (not shown). At this time, even if the placement surface of the transfer destination and the holding means 11 are not parallel, the contact member 20 first contacts the placement surface before placing the wafer W, and the placement surface Wb and the placement surface are placed in a parallel state.

従って、このような実施形態によれば、保持面15Aと被保持面Waとの接触に先だって、当接部材20の先端と載置面TSとの接触により保持面15Aと被保持面Waとが平行になるように調整可能としたから、保持面15Aは被保持面Waに対して平行な状態で接触するようになる。従って、傾いて接触することによるウエハの割れを確実に防止することができる。
また、緩衝手段14は、保持面15Aと被保持面Wa、又は、載置面と被載置面Wbとが接触したときの衝撃を緩和するため、ウエハWの損傷を回避することができる。
Therefore, according to such an embodiment, prior to the contact between the holding surface 15A and the held surface Wa, the holding surface 15A and the held surface Wa are brought into contact with each other by the contact between the tip of the contact member 20 and the placement surface TS. Since it can be adjusted to be parallel, the holding surface 15A comes into contact with the held surface Wa in a parallel state. Therefore, it is possible to reliably prevent the wafer from being cracked due to contact with the tilt.
Further, since the buffer means 14 reduces the impact when the holding surface 15A and the held surface Wa or the placement surface and the placement surface Wb come into contact with each other, damage to the wafer W can be avoided.

更に、当接部材20は、その先端が保持面15Aより載置面TS側に突出しているとともに、載置面TSの傾きに応じて軸方向に変位して平行を維持するものであるため、ウエハWが載置される面がどのような状態であっても、これに自動的に追従することとなり、作業者による設定等一切を不要として煩雑な作業を回避することができる。   Furthermore, the abutting member 20 has a tip protruding from the holding surface 15A toward the placement surface TS, and is displaced in the axial direction according to the inclination of the placement surface TS to maintain parallelism. Regardless of the state of the surface on which the wafer W is placed, it automatically follows this, and it is possible to avoid complicated operations without any setting by the operator.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。
すなわち、本発明は、主に特定の実施形態に関して特に図示、説明されているが、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施形態に対し、形状、位置若しくは配置等に関し、必要に応じて当業者が様々な変更を加えることができるものである。
As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

例えば、前記実施形態では、保持手段11に平行調整手段18を設けた場合を図示説明したが、本発明はこれに限定されるものではない。すなわち、平行調整手段18を構成する当接部材をテーブルT内に設け、その先端側を載置面TSから突出させて軸方向に進退可能とし、当該当接部材の先端(上端)を吸着プレート15の外周側に当接可能として平行を維持することもできる。また、平行調整手段18は保持手段11及びテーブルTの双方に、相互に干渉しない状態で設けることも可能である。   For example, in the above-described embodiment, the case where the parallel adjusting means 18 is provided in the holding means 11 is illustrated and described, but the present invention is not limited to this. That is, an abutting member constituting the parallel adjusting means 18 is provided in the table T, and the tip end side of the abutting member protrudes from the mounting surface TS so as to advance and retreat in the axial direction. It is also possible to maintain parallelism so as to be able to come into contact with the outer peripheral side of 15. Further, the parallel adjusting means 18 can be provided on both the holding means 11 and the table T in a state where they do not interfere with each other.

更に、前記実施例では、ウエハWの被載置面Wbと被保持面Waとが平行である場合を説明したが、図7に示されるようにそれらが平行でない場合は、全ての当接部材20が載置面TSに当接したときに、保持面15Aと被保持面Waとが平行になるように前記当接部材20とストッパ23とを調整しておけばよい。   Furthermore, in the above-described embodiment, the case where the mounting surface Wb and the held surface Wa of the wafer W are parallel to each other has been described. However, if they are not parallel as shown in FIG. The contact member 20 and the stopper 23 may be adjusted so that the holding surface 15A and the held surface Wa are parallel when the 20 comes into contact with the placement surface TS.

また、駆動手段12は、吸着プレート15をX軸、Z軸の直交二軸方向に移動可能とするものを採用したが、本発明はこれに限定されるものではなく、Y軸方向へも移動可能とすることもできる。加えて、駆動手段12の構造も図示構成例以外のものを採用することができ、例えば、自由端が三次元方向に移動可能となるロボットアーム等を用いてもよい。   Moreover, although the drive means 12 employ | adopted what can move the adsorption | suction plate 15 to the orthogonal | vertical biaxial direction of an X-axis and a Z-axis, this invention is not limited to this, It moves also to a Y-axis direction. It can also be possible. In addition, the structure of the driving means 12 may be other than the configuration example shown in the figure. For example, a robot arm whose free end is movable in a three-dimensional direction may be used.

更に、本発明における板状部材は半導体ウエハWに限定されるものではなく、ガラス板、鋼板、または、樹脂板等、その他の板状部材も対象とすることができ、半導体ウエハは、シリコンウエハや化合物ウエハであってもよい   Furthermore, the plate-like member in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer is a silicon wafer. Or a compound wafer

本実施形態に係る搬送装置の概略斜視図。The schematic perspective view of the conveying apparatus which concerns on this embodiment. 前記搬送装置の一部を断面した要部概略側面図。The principal part schematic side view which cut down a part of said conveying apparatus. 一つの当接部材が載置面に当接した初期段階を示す要部概略側面図。The principal part schematic side view which shows the initial stage in which one contact member contact | abutted to the mounting surface. 全ての当接部材が載置面に当接した段階を示す要部概略側面図。The principal part schematic side view which shows the step which all the contact members contacted the mounting surface. 保持面がウエハに接触した状態を一部断面した要部概略側面図。The principal part schematic side view which carried out the partial cross section of the state which the holding surface contacted the wafer. ウエハを保持した保持手段がテーブルから上方に離れた状態を示す要部概略側面図。The principal part schematic side view which shows the state which the holding means holding the wafer left | separated upwards from the table. ウエハの被載置面と被保持面とが平行でない場合において、全ての当接部材が載置面に当接した段階を示す変形例の説明図。Explanatory drawing of the modification which shows the step which all the contact members contact | abutted to the mounting surface, when the mounting surface of a wafer and a to-be-held surface are not parallel.

符号の説明Explanation of symbols

10 搬送手段
11 保持手段
12 駆動手段
13 連結手段
14 緩衝手段
15 吸着プレート
15A 保持面
18 平行調整手段
20 当接部材
36 ユニバーサルジョイント
T テーブル(載置手段)
TS 載置面
W 半導体ウエハ(板状部材)
DESCRIPTION OF SYMBOLS 10 Conveyance means 11 Holding means 12 Drive means 13 Connection means 14 Buffer means 15 Suction plate 15A Holding surface 18 Parallel adjustment means 20 Contact member 36 Universal joint T Table (mounting means)
TS mounting surface W Semiconductor wafer (plate-like member)

Claims (7)

載置面に載置された板状部材を保持する保持手段と、この保持手段を揺動可能に連結するとともに、当該保持手段を移動して前記板状部材を搬送する駆動手段とを備えた搬送装置において、
前記保持手段は前記板状部材を保持する保持面を有するとともに、当該保持面と前記板状部材の被保持面との相対位置を平行に調整する平行調整手段を含み、
前記平行調整手段は、前記保持面と板状部材の被保持面とが接触する前に前記載置面に当接して前記保持面と板状部材の被保持面とを平行に保つ当接部材を備えて構成されていることを特徴とする搬送装置。
A holding means for holding the plate-like member placed on the placement surface, and a driving means for moving the holding means to convey the plate-like member while connecting the holding means so as to be swingable. In the transport device,
The holding means includes a holding surface for holding the plate-like member, and includes a parallel adjusting means for adjusting the relative position between the holding surface and the held surface of the plate-like member in parallel.
The parallel adjustment means is a contact member that contacts the mounting surface before the holding surface and the held surface of the plate-like member contact to keep the holding surface and the held surface of the plate-like member parallel to each other. A conveying apparatus comprising:
板状部材の載置面を備えた載置手段と、前記板状部材を保持する保持面を備えた保持手段と、当該保持手段を移動して前記板状部材を搬送する駆動手段とを含む搬送装置において、
前記保持手段及び/又は載置手段は、前記保持面と前記板状部材の被保持面との相対位置を平行に調整する平行調整手段を含み、
前記平行調整手段は、前記保持面と板状部材の被保持面とが接触する前に前記載置面及び/又は保持面の周囲に当接して前記保持面と板状部材の被保持面とを平行に保つ当接部材を備えて構成されていることを特徴とする搬送装置。
A mounting unit having a mounting surface for the plate-like member; a holding unit having a holding surface for holding the plate-like member; and a driving unit for moving the holding unit to convey the plate-like member. In the transport device,
The holding means and / or the placing means includes parallel adjusting means for adjusting the relative position of the holding surface and the held surface of the plate-like member in parallel,
The parallel adjusting means abuts on the mounting surface and / or the periphery of the holding surface before the holding surface and the held surface of the plate-shaped member come into contact with each other. A conveying device comprising a contact member that keeps them parallel to each other.
前記保持面は、少なくとも前記板状部材の平面形状に略対応する大きさを備えた吸着プレートに設けられ、前記当接部材は、前記吸着プレートの外周側複数箇所に設けられていることを特徴とする請求項1又は2記載の搬送装置。 The holding surface is provided on a suction plate having a size substantially corresponding to at least a planar shape of the plate-like member, and the contact member is provided at a plurality of locations on the outer peripheral side of the suction plate. The transfer apparatus according to claim 1 or 2. 前記当接部材は、前記保持面よりも前記載置面側に突出する軸状に設けられているとともに、前記載置面に対して進退可能に設けられていることを特徴とする請求項1、2又は3記載の搬送装置。 2. The contact member is provided in a shaft shape protruding toward the placement surface from the holding surface, and is provided so as to be able to advance and retreat with respect to the placement surface. 2. The transfer device according to 2 or 3. 前記保持手段は、緩衝手段を介して前記駆動手段に支持されていることを特徴とする請求項1ないし4の何れかに記載の搬送装置。 The transport apparatus according to claim 1, wherein the holding unit is supported by the driving unit via a buffer unit. 載置面に載置された板状部材を相対する保持面で保持して搬送する搬送方法において、
前記板状部材の被保持面と前記保持面とを平行とした状態で当該保持面と板状部材の被保持面とを接触させ、
次いで、前記保持面で前記板状部材の被保持面を保持して搬送することを特徴とする搬送方法。
In the conveying method of holding and conveying the plate-like member placed on the placing surface with the opposite holding surface,
Bringing the holding surface of the plate-shaped member and the holding surface of the plate-shaped member into contact with each other in a state where the holding surface of the plate-shaped member and the holding surface are parallel to each other;
Then, the holding method of the plate-like member is held by the holding surface and transferred.
前記板状部材の被保持面に保持面を接触させる際の衝撃を緩衝することを特徴とする請求項6記載の搬送方法。 The transport method according to claim 6, wherein an impact when the holding surface is brought into contact with the held surface of the plate-like member is buffered.
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