KR20100006896U - A binding structure of Chuck in Wafer Mounter - Google Patents

A binding structure of Chuck in Wafer Mounter Download PDF

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Publication number
KR20100006896U
KR20100006896U KR2020080017246U KR20080017246U KR20100006896U KR 20100006896 U KR20100006896 U KR 20100006896U KR 2020080017246 U KR2020080017246 U KR 2020080017246U KR 20080017246 U KR20080017246 U KR 20080017246U KR 20100006896 U KR20100006896 U KR 20100006896U
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South Korea
Prior art keywords
chuck
wafer
present
mounter
wafer mounter
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KR2020080017246U
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Korean (ko)
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윤점채
박준기
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윤점채
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Priority to KR2020080017246U priority Critical patent/KR20100006896U/en
Publication of KR20100006896U publication Critical patent/KR20100006896U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

본 고안은 반도체칩의 제조공정에 사용되는 웨이퍼 마운터(Wafer Mounter)에 있어서, 웨이퍼 카세트로 부터 웨이퍼를 흡착하여 로딩(Loading)하기 위한 척(Chuck)에 관한 것으로, 노브와 절개홈 및 이 절개홈에 슬라이딩 지지되는 지지편을 갖추도록하여 작업자가 신속하고 용이하게 척을 교환할 수 있어서 척의 교체로 인한 종래의 문제점을 완전히 해소시킴은 물론, 생산성을 증대시킬 수 있게 한 척체결구조에 관한 것이다. The present invention relates to a chuck for absorbing and loading a wafer from a wafer cassette in a wafer mounter used in a semiconductor chip manufacturing process. The present invention relates to a chuck fastening structure that allows the operator to quickly and easily replace the chuck by sliding the support piece so as to completely solve the conventional problems caused by the replacement of the chuck, as well as increase the productivity.

웨이퍼마운터, 척, 로딩, 웨이퍼, 절개홈,노브 Wafer Mounter, Chuck, Loading, Wafer

Description

웨이퍼 마운터의 척체결 구조{A binding structure of Chuck in Wafer Mounter}A binding structure of Chuck in Wafer Mounter

본 고안은 반도체칩의 제조공정에 사용되는 웨이퍼 마운터(Wafer Mounter)에 있어서, 웨이퍼 카세트로 부터 웨이퍼를 흡착하여 로딩(Loading)하기 위한 척(Chuck)에 관한 것이다. The present invention relates to a chuck for absorbing and loading a wafer from a wafer cassette in a wafer mounter used in a semiconductor chip manufacturing process.

본 고안은 동일 출원인에 의해 2008.12.23 일자로 특허출원(출원번호: 10-2008-0131855)된 "웨이퍼 마운터의 웨이퍼 무빙시스템"을 배경으로 하는 기술이다. The present invention is a technology based on the "wafer mounting system of the wafer mounter" patent application (application number: 10-2008-0131855) dated December 23, 2008 by the same applicant.

상기 특허출원에 의한 웨이퍼 마운터의 웨이퍼 무빙시스템은, 도1과 같이, 다수의 웨이퍼(1)들이 적층된 웨이퍼카세트(10) 수납용의 웨이퍼 포트(20)와, 이 웨이퍼 포트(20)곁에 설치되어지는 회전센서부(25)와, 상기 웨이퍼 카세트(10)내에 진입하여 웨이퍼(1)를 떠받친후 인출하여 이송시키는 아암(30)을 갖춘 스칼라 로봇(40)과, 상기 아암(30)에 의해 이송되어오는 웨이퍼(1)를 일시흡착하는 웨이퍼 흡착구 (50)와, 상기 웨이퍼 흡착구(50)에 흡착되어 있던 웨이퍼(1)가 내려져 놓여지면 얼라이닝 한 후 로보트(62)로 함께 전진이동하는 얼라이너(60)와, 상기 웨이 퍼 포트 (20)에 이웃하여 수평으로배열되어 자타입 카세트내의 간지(5)가 모아지게 되는 간지 수집통(70)과, 상기 웨이퍼 포트(20)및 간지 수집통(70)과 일직선위치에 로보트 (75)로 지지된채 수평 및 승강이동하는 척(80)으로 구성된다. The wafer moving system of the wafer mounter according to the patent application is provided with a wafer port 20 for storing a wafer cassette 10 in which a plurality of wafers 1 are stacked, as shown in FIG. A scalar robot 40 having a rotation sensor portion 25, an arm 30 which enters into the wafer cassette 10, supports the wafer 1, and draws it out and transports it, and by the arm 30. When the wafer adsorption port 50 which temporarily adsorbs the conveyed wafer 1 and the wafer 1 adsorbed to the wafer adsorption port 50 are lowered and placed, the wafer adsorbing port 50 is aligned and then moved forward together with the robot 62. An aligner 60 to which the aligner 60 is arranged and horizontally arranged adjacent to the wafer port 20 so that the lip sheet 5 in the self-shaped cassette is collected, the wafer port 20 and the lip sheet Horizontal and elevating movement while being supported by the robot 75 in the same position as the collecting cylinder 70 Is of a chuck (80).

따라서 위 발명에서와 같이 척(80)이 로보트(75)에 의해 카세트(10J)위치로 이동한 후 승강하면서 적층된 웨이퍼(1J)와 간지(5)를 차례로 흡착하여 다음 공정으로 이송시키게 된다.Therefore, as in the above invention, the chuck 80 moves to the cassette 10J position by the robot 75, and ascends and sequentially adsorbs the stacked wafer 1J and the interleaver 5 to transfer to the next process.

그런데, 상기한 척(80)은 웨이퍼의 종류와 이에 따른 웨이퍼카세트에 호환되도록 척(80)또한 그에 맞는 것으로 교체하여야 하는바, 종래에는 상기 척(80)을 볼트(도시않됨)를 이용하여 지지대에 고정시켜 사용하므로써 척 교체시에 많은 시간이 소요될 뿐만 아니라, 척이 체결될 때 까지 작업자가 무거은 척을 떠바치고 교체 작업을 해야 하므로 척을 떨어뜨리게 되어 장비의 다른 부품을 손상시키게 됨은 물론, 교체 척도 손상을 입는 문제가 있었다.However, the chuck 80 has to be replaced with a chuck 80 and a corresponding one so that the chuck 80 is compatible with the type of wafer and the wafer cassette according to the wafer. Conventionally, the chuck 80 is supported by using a bolt (not shown). Not only does it take a lot of time when the chuck is replaced, but the operator has to replace the heavy chuck and replace the chuck until the chuck is fastened, causing the chuck to fall and damaging other parts of the equipment. There was a problem with scaling.

본 고안은 종래의 척 교체시 문제점을 해결하기 위하여 척의 체결구조를 개선한 것이다.The present invention is to improve the fastening structure of the chuck in order to solve the problem when replacing the conventional chuck.

따라서, 작업자가 신속하고 용이하게 척을 교환할 수 있어서 척의 교체로 인한 종래의 문제점을 완전히 해소시킴은 물론, 생산성을 증대시킬 수 있는 효과를 얻는다.Therefore, the operator can quickly and easily replace the chuck to completely solve the conventional problem caused by the replacement of the chuck, as well as to increase the productivity.

이하, 첨부도면을 본 고안의 1실시예로 하여 그 구성과 작용을 설명하면 다음과 같다.Hereinafter, the configuration and operation of the accompanying drawings as an embodiment of the present invention will be described.

본 고안은 웨이퍼 마운터의 웨이퍼 이송용 척(80)에 있어서, 상기 척(80)의 상부면에 철(凸)자 형 단면의 절개홈(82)을 수평으로 형성시키고, 상기 척(80)이 지지되는 진공블럭(84)에는 상기 절개홈(82)에 끼워지는 철(凸)자형 지지편(86)을 형성시키며, 상기 진공블럭(84)과 척(80)에는 체결공(87,88)을 형성시켜서, 상기 체결공(87,88)에 나사결합되는 노브(89)로 결합위치가 고정되도록 구성하여 이루어지는 것을 특징으로 하는 척 체결구조이다.In the present invention, in the wafer transfer chuck 80 of the wafer mounter, an incision groove 82 having an iron cross section is formed horizontally on the upper surface of the chuck 80, and the chuck 80 is In the supported vacuum block 84, an iron shaped support piece 86 fitted into the cutting groove 82 is formed, and fastening holes 87 and 88 are formed in the vacuum block 84 and the chuck 80. The chuck fastening structure is characterized in that the coupling position is configured to be fixed by the knob 89 is screwed to the fastening holes (87,88).

도2는 본 고안의 척(80)구조도면으로, 한쌍의 수평으로 형성된 절개홈(82)이 철(凸)자형 단면을 갖춘예를 보이고 있다. 여기서 양 절개홈(82)은 지름(L)을 중심으로 한쌍이 형성된 예를 도시하였으나 반드시 한쌍으로 형성되는 것에 한정되지 않고 지름(L)위치에 한줄만 형성하거나, 아니면 세줄로 형성하여도 무방하다.Figure 2 is a structural view of the chuck 80 of the present invention, showing a pair of horizontally formed incision groove 82 has an iron-shaped cross section. Here, the two incision grooves 82 show an example in which a pair is formed around the diameter L, but is not limited to being formed in one pair, but may be formed in one line or three lines in the diameter L position. .

도3은 도2의 척(80)에 진공블럭(84)의 지지편(86)이 결합되고, 체결공(87,88)에 노브(89)가 체결된 상태를 도시한 것이다.3 illustrates a state in which the support piece 86 of the vacuum block 84 is coupled to the chuck 80 of FIG. 2, and the knob 89 is coupled to the coupling holes 87 and 88.

도4는 도4의 좌측면도로, 진공블럭(84)의 지지편(86)이 절개홈(82)에 끼워지고, 노브(89)에 의해 그 위치가 고정되도록 결합된 구조를 보여준다.FIG. 4 is a left side view of FIG. 4 showing a structure in which the support piece 86 of the vacuum block 84 is fitted into the incision groove 82, and the position thereof is fixed by the knob 89. As shown in FIG.

상기한 구성에 따른 본 고안의 적용과정을 설명한다.It describes the application process of the present invention according to the above configuration.

척(80)의 교환이나 장착을 위해서 먼저 도4의 결합상태를 해제시킨다. 이를 위해서는 노브(89)를 손으로 돌려 빼내고, 척(80)을 절개홈(82)방향으로 밀거나 당기면 상기 척(80)은 그 절개홈(80)에 진공블럭(84)의 지지편(86)이 약간 헐겁게 끼워져 있으므로 슬라이딩되면서 빠지게 된다.In order to replace or mount the chuck 80, first, the coupling state of FIG. 4 is released. To this end, the knob 89 is pulled out by hand, and when the chuck 80 is pushed or pulled in the direction of the cutting groove 82, the chuck 80 supports the 86 of the vacuum block 84 in the cutting groove 80. ) Is loosely inserted so it slides out.

척(80)을 완전히 분리시킨 후 필요한 다른 척을 상기의 역순으로 조합하여 사용하면 된다. 따라서 종래와 같이 볼트로 고정하는 경우 드라이버나 다른 장비를 이용하는 등의 불편함이 해소 되었으며, 무엇보다도 지지편(86)이 절개홈(82)내에 끼워져 있으므로 수평으로는 슬라이딩 되지만 상하로는 분리되는 일이 없으므로 교체작업시 안전하며 편리한 실용성을 얻을 수 있다. After the chuck 80 is completely separated, other necessary chucks may be used in combination in the reverse order. Therefore, when fixing with a bolt as in the prior art, the inconvenience of using a driver or other equipment has been eliminated. Above all, since the support piece 86 is inserted in the incision groove 82, it slides horizontally but is separated up and down. It is safe and convenient for replacement work.

도1은 본 고안이 적용되는 웨이퍼 마운터의 구성도,1 is a block diagram of a wafer mounter to which the present invention is applied;

도2는 본 고안의 척 구조도,2 is a chuck structure of the present invention,

도3은 본 고안이 적용된 척체결 구조도,Figure 3 is a chuck fastening structure to which the present invention is applied,

도4는 본 고안의 정면구성도이다.4 is a front configuration diagram of the present invention.

-도면의 주요 부호 설명-Description of the main symbols in the drawings

80-척(Chuck) 82-절개홈80-Chuck 82-Incision

84-진공블럭(84) 86-지지편84-vacuum block (84) 86-support

87,88-체결공 89-노브(Knob)87,88-fastener 89-Knob

Claims (1)

웨이퍼 마운터의 웨이퍼 이송용 척(80)에 있어서, 상기 척(80)의 상부면에 철(凸)자 형 단면의 절개홈(82)을 형성시키고, 상기 척(80)이 지지되는 진공블럭(84)에는 상기 절개홈(82)에 끼워지는 철(凸)자형 지지편(86)을 형성시키며, 상기 진공블럭(84)과 척(80)에는 체결공(87,88)을 형성시키고, 상기 체결공(87,88)에 나사결합되는 노브(89)를 마련하여 이루어지는 것을 특징으로 하는 척 체결구조.In the wafer transfer chuck 80 of the wafer mounter, a vacuum block is formed on the upper surface of the chuck 80 in which a cut groove 82 having an iron cross section is formed and the chuck 80 is supported. 84 is formed in the iron-shaped support piece 86 to be fitted in the cutting groove 82, the fastening holes (87, 88) are formed in the vacuum block 84 and the chuck 80, Chuck fastening structure, characterized in that provided by the knob (89) screwed to the fastening hole (87,88).
KR2020080017246U 2008-12-29 2008-12-29 A binding structure of Chuck in Wafer Mounter KR20100006896U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190033853A (en) * 2017-09-22 2019-04-01 주식회사 야스 Adhesive Chuck Structure For Efficient Change
KR20190132980A (en) * 2019-11-25 2019-11-29 주식회사 야스 Adhesive Chuck Structure For Efficient Change
CN116544154A (en) * 2023-03-30 2023-08-04 宇弘研科技(苏州)有限公司 Temporary storage device for wafer cassette and semiconductor equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190033853A (en) * 2017-09-22 2019-04-01 주식회사 야스 Adhesive Chuck Structure For Efficient Change
KR20190132980A (en) * 2019-11-25 2019-11-29 주식회사 야스 Adhesive Chuck Structure For Efficient Change
CN116544154A (en) * 2023-03-30 2023-08-04 宇弘研科技(苏州)有限公司 Temporary storage device for wafer cassette and semiconductor equipment
CN116544154B (en) * 2023-03-30 2023-10-27 宇弘研科技(苏州)有限公司 Temporary storage device for wafer cassette and semiconductor equipment

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