CN116544154B - Temporary storage device for wafer cassette and semiconductor equipment - Google Patents
Temporary storage device for wafer cassette and semiconductor equipment Download PDFInfo
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- CN116544154B CN116544154B CN202310325613.1A CN202310325613A CN116544154B CN 116544154 B CN116544154 B CN 116544154B CN 202310325613 A CN202310325613 A CN 202310325613A CN 116544154 B CN116544154 B CN 116544154B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000006073 displacement reaction Methods 0.000 claims abstract description 55
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 7
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 28
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 238000001125 extrusion Methods 0.000 abstract description 2
- 230000001771 impaired effect Effects 0.000 abstract description 2
- 239000011435 rock Substances 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 3
- 238000010168 coupling process Methods 0.000 abstract 3
- 238000005859 coupling reaction Methods 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 97
- 238000001179 sorption measurement Methods 0.000 description 15
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a temporary storage device for a wafer cassette and semiconductor equipment, and relates to the technical field of semiconductors. The utility model provides a wafer cassette temporary storage device contains the box body, the loading board rigid coupling in end box and go up the box, the clamp plate slide respectively in end box with go up the box, the connecting rod rigid coupling in the clamp plate, the connecting rod slides and runs through the loading board, the lifter plate rigid coupling in the connecting rod, first spring housing is located the connecting rod, the roof spacing slide in the loading board, the wafer is placed on the roof, goes up box and end box block, and the clamp plate receives the extrusion of loading board respectively, drives the lifter plate that corresponds on the clamp plate respectively and takes place synchronous displacement for form negative pressure between wafer, roof and the lifter plate, accomplish then to the absorption of every wafer, make the absorption that the wafer can be stable on the roof, avoided there is dislocation between wafer and the roof and to appear between wafer and the roof to rock in the transportation process, lead to the impaired phenomenon of wafer then.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a temporary storage device for a wafer cassette and semiconductor equipment.
Background
In the back-end testing of semiconductor large-scale integrated circuits, a large number of non-patterned wafers are required to be inspected or re-inspected for defects, and in the process of transferring wafers between different process stations, a plurality of wafers of the same type are usually placed in a wafer cassette for transfer.
The existing wafer boat box is mainly provided with a plurality of slots in the box body, then wafers are placed in the slots one by one, and the situation that the wafers are damaged in the temporary storage process is avoided by realizing that the wafers are not contacted with each other through a box cover matched with the wafer boat box, but the wafer boat box is damaged in the transportation process due to dislocation between the slots and the wafers in the closing process, the existing wafer boat box cannot normally fix the wafers placed in the wafer boat box well when the wafers are temporarily stored through the slots, certain gaps exist between the wafers and the slots placed in the wafer boat box, and once the wafer boat box is greatly rocked in the transportation process, the wafers are easy to wear and even break due to the gaps existing between the wafers and the slots.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. To this end, in a first aspect, the present application provides a temporary storage device for a wafer cassette, comprising:
the box body comprises a bottom box and an upper box, and the bottom box is clamped with the upper box;
the bottom box and the upper box are respectively and evenly provided with a plurality of groups of loading components which are mutually matched, the loading components comprise a bearing plate, a pressing plate, a connecting rod, a lifting plate, a first spring and a top plate, the bearing plate is fixedly connected with the bottom box and the upper box respectively, the pressing plate is respectively sliding between the bottom box and the upper box, the pressing plate is respectively positioned between the bearing plate and the bottom box and between the bearing plate and the upper box, the connecting rod is fixedly connected with the pressing plate, the connecting rod penetrates through the bearing plate in a sliding mode, the lifting plate is fixedly connected with one end of the connecting rod, which extends into the bearing plate, the first spring is sleeved on the connecting rod, and the top plate is limited to slide on the bearing plate.
The temporary storage device for the wafer cassette has the beneficial effects that: placing the wafer on the roof, will going up box and end box block, this in-process, go up the clamp plate on box and the end box and receive the extrusion of loading board respectively, drive respectively on the clamp plate lifter plate that corresponds and take place synchronous displacement then for form the negative pressure between wafer, roof and the lifter plate, accomplish the double-sided absorption to every wafer then, make the absorption that the wafer can be stable on the roof, utilize the negative pressure to carry out stable absorption to the wafer, avoided there is dislocation between wafer and the roof and take place to rock because of the clearance between wafer and the roof in the transportation process, lead to the impaired phenomenon of wafer afterwards.
In addition, the temporary storage device for the wafer cassette according to the embodiment of the application has the following additional technical characteristics:
in some embodiments of the present application, the bottom case and the upper case have the same structure, wherein the length and the width of the bottom case are respectively the same as the width and the length of the upper case, and the structures on the bottom case and the upper case are vertically arranged in the same horizontal direction.
In some embodiments of the present application, the side walls of the bottom case and the upper case are fixedly provided with buckles.
In some embodiments of the present application, sliding grooves, assembly holes and T-shaped grooves are symmetrically arranged on the side walls of the bottom case and the upper case, and the symmetrically arranged sliding grooves are respectively in sliding fit with the pressing plate.
In some embodiments of the present application, the carrier plate has a through hole, a bottom displacement cavity and a top displacement cavity, where the through hole is symmetrically disposed, the bottom displacement cavity and the top displacement cavity are communicated, and the diameter of the top displacement cavity is larger than the diameter of the bottom displacement cavity.
In some embodiments of the present application, two ends of the pressing plate are fixedly connected with clamping connectors, and the clamping connectors are in limit sliding fit with the sliding grooves.
In some embodiments of the present application, a plurality of groups of symmetrically arranged compression bars are uniformly and fixedly connected on the compression plate, and the compression bars are in sliding fit with the symmetrically arranged through holes on the bearing plate.
In some embodiments of the application, the lifter plate and the bottom displacement chamber are in sealing sliding engagement.
In some embodiments of the present application, the top plate and the top displacement cavity are in sealing sliding fit, wherein the top plate is in an annular arrangement, and a rubber ring is fixedly connected to the upper surface of the top plate in the annular arrangement.
In some embodiments of the present application, two sets of surface fixing components are respectively disposed on the bottom case and the upper case, the two sets of surface fixing components are respectively disposed along a width direction of the bottom case and a length direction of the upper case, the surface fixing components include a clamping strip, a rotating shaft, a gear and a knob, the clamping strip is symmetrically disposed on inner walls of the bottom case and the upper case, the rotating shaft is respectively connected to the bottom case and the upper case in a rotating manner, two ends of the rotating shaft respectively penetrate through the assembly holes, the gear is connected to two ends of the rotating shaft in a key manner, and the knob is connected to two ends of the rotating shaft in a transmission manner.
In some embodiments of the present application, a plurality of uniformly arranged clamping blocks are fixedly connected on the clamping strip, and the clamping blocks are in one-to-one correspondence with the pressing plates.
In some embodiments of the present application, a T-shaped bar is fixedly connected to the clamping bar, and the T-shaped bar and the T-shaped groove are in a limit sliding fit.
In some embodiments of the present application, a rack is fixedly connected to the clamping strip, and the rack is meshed with the gear.
In some embodiments of the present application, the two ends of the rotating shaft are symmetrically provided with a limit groove, one end of the knob, which faces the rotating shaft, is sleeved with a sleeve, the sleeve is fixedly connected to the assembly hole, a sliding cylinder is fixedly connected to the knob, the sliding cylinder is slidably inserted into the sleeve, the inner wall of the sliding cylinder is symmetrically provided with a limit strip, the limit strip is slidably matched with the limit groove, one end of the sliding cylinder extending into the sleeve is fixedly connected with a limit plate, and the limit plate is slidably limited to the sleeve.
In some embodiments of the present application, a limiting hole is symmetrically arranged on one side of the knob fixedly connected with the sliding barrel, a limiting post is symmetrically arranged on one side of the sleeve facing the knob, and the limiting hole and the limiting post are in sliding connection.
In some embodiments of the present application, a second spring is sleeved at one end of the sliding cylinder extending into the sleeve, and two ends of the second spring are respectively abutted against the limiting plate and the sleeve.
In another aspect, an embodiment of the present application further provides a semiconductor device, including the above-mentioned wafer cassette temporary storage device.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
In the related art, in the process of detecting the wafer or rechecking the defect, the two sides of the wafer need to be detected, but the existing wafer cassette cannot be suitable for the process of temporarily storing the wafer, and the effect of double-sided overturning of the wafer can be achieved.
When the upper box and the bottom box are fixedly connected through buckles, the pressing plates on the two sides of the top and the bottom are in a state of being far away from the bearing plate, the corresponding rotating shafts of the rotating shafts are rotated through rotating the rotating shafts on the two sides of the top and the bottom, the corresponding racks are driven by the gears to drive the clamping strips to displace, the pressing plates are pressed by the corresponding clamping blocks, namely, the stroke of the pressing plates is fixed, when the wafer in the box body needs to be overturned or whichever side needs to be detected, the box body forming the clamping is only required to be overturned, the bottom box or the upper box on the upper side is removed, when the bottom box or the upper box on the upper side is removed, the knob on the bottom is not moved, specifically, the knob on the top side is reversely rotated, the corresponding clamping blocks are separated from the pressing of the pressing plates, and then the pressing plates are displaced towards the bearing plate under the action of the first springs, the rubber ring positioned on the upper surface of the wafer loses the adsorption force to the upper surface of the wafer at the moment, and the knob at the bottom is not moved, so that the rubber ring at the bottom still has the adsorption force to the lower surface of the wafer, the wafer can be stably adsorbed by the rubber ring at the bottom side when the bottom box or the upper box positioned at the upper side is taken down, the wafer is prevented from misplacement or falling off, meanwhile, the top plate is in unsealed sliding fit in the top displacement cavity, namely, the top plate has a certain displacement stroke in the top displacement cavity, and the elastic deformation capacity of the rubber ring is matched, so that the strength of the adsorption force to the wafer in the negative pressure forming process can be well slowed down, the damage of the wafer in the stable adsorption process is avoided, and in the embodiment, after the adsorption force positioned at the upper side disappears, the adsorption force at the bottom side acts, the rubber ring at the lower side of the wafer can be prevented, the top plate moves downwards along the top displacement cavity under the action of the suction force, so that the wafer can be further displaced from the upper surface of the bearing plate to the inside of the bearing plate by a certain distance, the wafer is further protected, and the phenomena of falling, dislocation and the like are avoided.
In the related art, whether the suction force on two sides of the wafer exists or not is realized only through the direct rotation of the knob, and the knob rotates due to the fact that false touch possibly occurs in the transferring process in the practical application, so that the adsorption force on one side or two sides of the wafer is lost, the wafer is not firmly fixed in the box body, and the phenomena of shaking, dislocation and the like possibly occur in the box body due to further initiation of the wafer.
In the use, when needing to rotate the knob, need to pull the knob outwards, the in-process of pulling, the knob will drive the limiting plate and take place axial displacement in the sleeve, and extrude the second spring in it, simultaneously, spacing hole on the knob will take place to break away from with spacing post on the sleeve, it is to be noted, until the knob drives the limiting plate when the displacement is to the limit in the sleeve, the fibre strip still slides grafting with the spacing groove this moment, realize that sliding key relation between knob and the pivot always exists, wait that spacing hole and spacing post take place to break away from after, can realize the rotation of knob this moment, in this embodiment, the joint between spacing hole and the spacing post forms the locking to the knob, can avoid the knob to take place the phenomenon of rotation just directly just can take place under the mistake touch state, otherwise, only need to align spacing hole and spacing post after rotating the knob, under the elastic action of second spring, the limiting plate will drive the knob and reset, form the rotation locking state to the knob again.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a temporary cassette register according to an embodiment of the present application;
FIG. 2 is a schematic bottom view of a temporary cassette register according to an embodiment of the application;
FIG. 3 is a schematic view of the structure of a case according to an embodiment of the present application;
FIG. 4 is a structural explosion of a loading assembly according to an embodiment of the present application;
FIG. 5 is a partial structural explosion of a loading assembly according to an embodiment of the present application;
FIG. 6 is a partial structural cross-sectional view of a loader assembly according to an embodiment of the application;
FIG. 7 is a schematic illustration of the position of a faceted assembly according to an embodiment of the present application;
FIG. 8 is an exploded view of the structure of a faceted assembly in accordance with an embodiment of the present application;
FIG. 9 is an enlarged schematic view of A of FIG. 8 in accordance with an embodiment of the application;
FIG. 10 is an exploded view of the structure between the knob and the shaft according to an embodiment of the present application;
FIG. 11 is an exploded view of another view between a knob and a shaft according to an embodiment of the present application;
fig. 12 is an exploded view and a partial sectional view of a structure between a knob and a rotary shaft according to an embodiment of the present application.
Icon: 1. a case body; 11. a bottom box; 12. loading the box; 13. a buckle; 14. a chute; 15. a fitting hole; 16. a T-shaped groove; 2. a loading assembly; 21. a carrying plate; 211. a through hole; 212. a bottom displacement chamber; 213. a top displacement chamber; 22. a pressing plate; 221. a clamping joint; 222. a compression bar; 23. a connecting rod; 24. a lifting plate; 25. a first spring; 26. a top plate; 27. a rubber ring; 3. a surface fixing component; 31. clamping strips; 311. a clamping block; 312. a T-bar; 313. a rack; 32. a rotating shaft; 321. a limit groove; 33. a gear; 34. a knob; 341. a slide cylinder; 342. a limit bar; 343. a limiting plate; 344. a limiting hole; 345. a sleeve; 346. a limit column; 347. and a second spring.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, based on the embodiments of the application, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the application.
As shown in fig. 1 to 12, a temporary storage device for a wafer cassette according to an embodiment of the present application includes a cassette body 1, wherein the cassette body 1 includes a bottom case 11 and an upper case 12, and the bottom case 11 and the upper case 12 are engaged to form a completed temporary storage device.
Wherein, the bottom case 11 and the upper case 12 are respectively and evenly provided with a plurality of groups of loading components 2 which are mutually matched, the loading components 2 comprise a bearing plate 21, a pressing plate 22, a connecting rod 23, a lifting plate 24, a first spring 25 and a top plate 26, the bearing plate 21 is fixedly connected with the bottom case 11 and the upper case 12 respectively, the pressing plate 22 slides between the bearing plate 21 and the bottom case 11 and between the bearing plate 21 and the upper case 12 respectively, the connecting rod 23 is fixedly connected with the pressing plate 22, the connecting rod 23 slides and penetrates through the bearing plate 21, the lifting plate 24 is fixedly connected with one end of the connecting rod 23 extending into the bearing plate 21, the first spring 25 is sleeved on the connecting rod 23, and the top plate 26 is limited and slides on the bearing plate 21.
In addition, the temporary storage device for the wafer cassette according to the embodiment of the application has the following additional technical characteristics:
as shown in fig. 1 and 2, the bottom case 11 and the upper case 12 have the same structure, wherein the length and width of the bottom case 11 are the same as the width and length of the upper case 12, respectively, and the structures on the bottom case 11 and the upper case 12 are vertically arranged in the same horizontal direction.
Further, the side walls of the bottom box 11 and the upper box 12 are fixedly provided with buckles 13, so that the bottom box 11 and the upper box 12 are conveniently fixed together, and wafers placed in the bottom box are prevented from falling in the transferring process.
Further, the side walls of the bottom case 11 and the upper case 12 are symmetrically provided with a sliding groove 14, an assembly hole 15 and a T-shaped groove 16, and the symmetrically arranged sliding grooves 14 are respectively in sliding fit with a pressing plate 22.
The pressing plate 22 is uniformly disposed in the bottom case 11 along the longitudinal direction of the bottom case 11, and is adapted to a plurality of carrier plates 21 uniformly disposed in the bottom case 11 along the same direction, and the pressing plate 22 is uniformly disposed on the upper case 12 along the width direction of the upper case 12, and is adapted to a plurality of carrier plates 21 uniformly disposed in the upper case 12 along the same direction.
Further, the carrier 21 has a through hole 211, a bottom displacement cavity 212 and a top displacement cavity 213, the through hole 211 is symmetrically arranged, the bottom displacement cavity 212 is communicated with the top displacement cavity 213, and the diameter of the top displacement cavity 213 is larger than that of the bottom displacement cavity 212.
Further, two ends of the pressing plate 22 are fixedly connected with clamping connectors 221, and the clamping connectors 221 are in limit sliding fit with the sliding grooves 14 to limit the displacement direction of the pressing plate 22.
Further, a plurality of groups of symmetrically arranged compression bars 222 are uniformly and fixedly connected on the compression plate 22, and the compression bars 222 are respectively in sliding fit with the symmetrically arranged through holes 211 on the bearing plate 21, and it should be noted that, as shown in fig. 1 and 2, the compression bars 222 extend out of the bearing plate 21.
Further, lift plate 24 is in sealing sliding engagement with bottom displacement chamber 212.
Further, the top plate 26 and the top displacement cavity 213 are in a sealed sliding fit, wherein the top plate 26 is in an annular arrangement, and a rubber ring 27 is fixedly connected to the upper surface of the top plate 26 in the annular arrangement.
It should be noted that, the displacement distance of the lift plate 24 in the bottom displacement chamber 212 is greater than the displacement distance of the top plate 26 in the top displacement chamber 213, so that the lift plate 24 forms a negative pressure among the lift plate 24, the top plate 26 and the wafer in the process of displacing the lift plate 24 toward the bottom of the bottom displacement chamber 212.
It will be appreciated that when a wafer is placed on the rubber ring 27, the space from the bottom side of the wafer up to the upper side of the lifter plate 24 will form a sealed cavity.
It should be further noted that the top of the rubber ring 27 is flush with the upper surface of the carrier plate 21, and it is understood that when the wafer is placed on the rubber ring 27, the wafer is located higher than the carrier plate 21, so that when the upper case 12 and the bottom case 11 are in press connection, both sides of the wafer are abutted by the rubber ring 27, and a sealing connection between the wafer and the rubber ring 27 is further ensured.
The rubber ring 27 is in a semicircular hollow design, as shown in fig. 6, so that the rubber ring 27 can play a role in buffering and can deform to a certain extent.
The following describes a process of using a temporary cassette storage device according to an embodiment of the present application with reference to the accompanying drawings:
in particular use, the wafer can be placed on the rubber ring 27 on each carrying plate 21 which is uniformly arranged, at this time, under the elastic action of the first springs 25, the lifting plate 24 will abut against the top plate 26, the top plate 26 is at the top of the top displacement cavity 213, the pressing plate 22 is located between the carrying plate 21 and the bottom box 11 and is close to the carrying plate 21, the pressing rod 222 thereon also penetrates through the through hole 211 and extends out of the carrying plate 21, after placing the wafer, the upper box 12 is pressed against the bottom box 11, and the upper box 12 and the bottom box 11 are fixedly locked by the buckle 13, in this process, the pressing rods 222 respectively extended from the upper box 12 and the bottom box 11 will abut against the carrying plate 21 on the bottom box 11 and the upper box 12, and under the abutting of the carrying plate 21, the pressing plate 22 is driven to respectively move towards the inner wall directions of the upper box 12 and the bottom box 11, and the displacement of the carrying plates 21 which are far away from each other and originally close to each other, the lifting plates 24 on the carrying plates are driven by the displacement of the pressing plates 22 to move the lifting plates 24 on the carrying plates to move towards the bottom direction of the bottom displacement cavity 212 (taking the bottom displacement cavity 212 on the bottom box 11 as a reference), in the displacement process of the lifting plates 24, the space among the wafer, the rubber rings 27, the top plate 26 and the lifting plates 24 at the moment forms negative pressure, so that the lower surface of the wafer is adsorbed on the rubber rings 27, meanwhile, when the wafer is placed on the rubber rings 27, the position of the wafer is higher than that of the carrying plates 21, so that it can be understood that the rubber rings 27 on the upper box 12 synchronously adsorb the upper surface of the wafer when the upper box 12 is pressed onto the bottom box 11, avoid transporting in-process box body 1 rocking great and cause its interior wafer to appear rocking and produce wearing and tearing, and avoided box body 1 confined in-process wafer to appear misplacing, after transporting, directly open buckle 13, remove last box 12, depression bar 222 at this moment breaks away from the conflict, under the effect of first spring 25, will drive lifter plate 24 and rise in bottom displacement chamber 212 for originally the negative pressure that lifter plate 24 formed between the wafer resumes, then makes the adsorption affinity between wafer and the rubber ring 27 disappear, is convenient for take off the wafer.
In the related art, in the process of detecting the wafer or rechecking the defect, the two sides of the wafer need to be detected, but the existing wafer cassette cannot be suitable for the process of temporarily storing the wafer, and the effect of double-sided overturning of the wafer can be achieved.
According to some embodiments of the present application, as shown in fig. 9-12, two sets of surface fixing assemblies 3 are respectively disposed on the bottom case 11 and the upper case 12, the two sets of surface fixing assemblies 3 are respectively disposed along the width direction of the bottom case 11 and the length direction of the upper case 12, the surface fixing assemblies 3 include a clamping strip 31, a rotating shaft 32, a gear 33 and a knob 34, the clamping strip 31 is symmetrically disposed on the inner walls of the bottom case 11 and the upper case 12, the rotating shaft 32 is respectively connected to the bottom case 11 and the upper case 12 in a rotating manner, two ends of the rotating shaft 32 respectively penetrate through the assembly holes 15, the gear 33 is connected to two ends of the rotating shaft 32 in a key manner, and the knob 34 is connected to two ends of the rotating shaft 32 in a transmission manner.
The clamping strips 31 are fixedly connected with a plurality of uniformly arranged clamping blocks 311, and the clamping blocks 311 are in one-to-one correspondence with the pressing plates 22, as shown in fig. 7, and the clamping blocks 311 on the bottom box 11 are respectively positioned on the same side of the pressing plates 22 in an initial state.
Further, the T-shaped bar 312 is fixedly connected to the clamping bar 31, and the T-shaped bar 312 and the T-shaped groove 16 are in limit sliding fit to limit the displacement direction of the clamping bar 31.
Further, a rack 313 is fixedly connected to the clamping bar 31, and the rack 313 is meshed with the gear 33.
It should be noted that the height of the clamping block 311 is not greater than the displacement distance of the pressing plate 22.
It can be understood that when the pressing plate 22 is displaced downward on the bottom case 11, the clamping block 311 can displace on the bottom case 11 through the displacement of the clamping strip 31, so that the clamping block 311 displaces to the upper surface of the pressing plate 22, and the pressing limit is caused to the pressing plate 22.
It can be understood that when the upper case 12 and the bottom case 11 are fixedly connected by the buckle 13, the pressing plates 22 on both sides of the top and the bottom are in a state of being far away from the receiving plate 21, the corresponding rotating shafts 32 of the rotating shafts 34 are rotated by rotating the rotating shafts 34 on both sides of the top and the bottom, the corresponding racks 313 are driven by the gears 33 to displace with the clamping bars 31, the pressing plates 22 are pressed by the corresponding clamping blocks 311, that is, the stroke of the pressing plates 22 is fixed, when the wafer in the case 1 needs to be overturned or whichever side needs to be detected, only the case 1 forming the clamped connection needs to be overturned, then the bottom case 11 or the upper case 12 positioned above is removed, when the bottom case 11 or the upper case 12 positioned above is removed, the bottom rotating shaft 34 is not moved, in particular, the rotating shafts 34 positioned on the top side is reversely rotated, the corresponding clamping blocks 311 are separated from the pressing of the pressing plate 22, so that the pressing plate 22 moves towards the direction of the bearing plate 21 under the action of the first spring 25, the rubber ring 27 positioned on the upper surface of the wafer loses the adsorption force to the upper surface of the wafer, and the knob 34 at the bottom is not moved, so that the rubber ring 27 at the bottom still has the adsorption force to the lower surface of the wafer, so that the wafer can still be firmly adsorbed by the rubber ring 27 at the bottom to avoid misplacement or falling of the wafer when the bottom box 11 or the upper box 12 positioned at the upper side is taken down, meanwhile, because the top plate 26 is not in sealing sliding fit in the top displacement cavity 213, namely the top plate 26 has a certain displacement stroke in the top displacement cavity 213 and is matched with the elastic deformation capability of the rubber ring 27, the strength of the adsorption force to the wafer in the process of forming negative pressure can be well slowed down, the wafer is prevented from being damaged in the process of being firmly adsorbed, in this embodiment, after the adsorption force on the upper side disappears, the bottom side adsorption force acts, so that the rubber ring 27 and the top plate 26 on the lower side of the wafer can descend along the top displacement cavity 213 under the action of the adsorption force, and the wafer can be further displaced from the upper surface of the carrier plate 21 to a certain distance inside the carrier plate 21, so as to further protect the wafer and avoid the phenomena of falling, dislocation and the like.
In the related art, whether the suction force on both sides of the wafer exists is realized only by directly rotating the knob 34, and in actual application, the knob 34 may rotate due to false touch in the transferring process, so that the adsorption force on one side or both sides of the wafer is lost, the wafer is not firmly fixed in the box body 1, and further the phenomena of shaking, dislocation and the like of the wafer in the box body 1 may be caused.
According to some embodiments of the present application, as shown in fig. 10-12, two ends of the rotating shaft 32 are symmetrically provided with a limiting groove 321, one end of the knob 34 facing the rotating shaft 32 is sleeved with a sleeve 345, the sleeve 345 is fixedly connected to the assembly hole 15, wherein a sliding cylinder 341 is fixedly connected to the knob 34, the sliding cylinder 341 is slidably inserted into the sleeve 345, and the inner wall of the sliding cylinder 341 is symmetrically provided with a limiting bar 342, the limiting bar 342 and the limiting groove 321 are slidably matched, so that a sliding key connection is formed between the knob 34 and the rotating shaft 32, one end of the sliding cylinder 341 extending into the sleeve 345 is fixedly connected with a limiting plate 343, the limiting plate 343 is slidably limited to the sleeve 345, and the axial displacement distance of the rotating shaft 32 is limited by the limiting plate 343.
Specifically, a limiting hole 344 is symmetrically arranged on one side of the knob 34 fixedly connected with the sliding cylinder 341, a limiting column 346 is symmetrically arranged on one side of the sleeve 345 facing the knob 34, and the limiting hole 344 and the limiting column 346 are in sliding connection, so that a clamping connection is formed between the knob 34 and the sleeve 345.
Further, a second spring 347 is sleeved at one end of the sliding tube 341 extending into the sleeve 345, and two ends of the second spring 347 are respectively abutted against the limiting plate 343 and the sleeve 345.
It will be appreciated that the knob 34 in the initial state is closest to the sleeve 345, i.e. the knob 34 is closest to the cartridge 1, under the influence of the second spring 347.
Specifically, when the knob 34 needs to be rotated during use, the knob 34 needs to be pulled outwards, in the process of pulling, the knob 34 drives the limiting plate 343 to axially displace in the sleeve 345 and extrudes the second spring 347 in the sleeve, meanwhile, the limiting hole 344 on the knob 34 is separated from the limiting post 346 on the sleeve 345, it needs to be noted that when the knob 34 drives the limiting plate 343 to displace to the limit in the sleeve 345, the fiber strip 342 is still in sliding connection with the limiting groove 321 at this time, that is, the sliding key connection relationship between the knob 34 and the rotating shaft 32 is always maintained, after the limiting hole 344 and the limiting post 346 are separated, the knob 34 can be rotated at this time, in this embodiment, the phenomenon that the knob 34 can be directly rotated in the error contact state can be avoided, otherwise, after the knob 34 is rotated, the limiting hole 344 and the limiting post 346 are only aligned, and the limiting plate is driven by the elastic action of the second spring 347 to reset the knob 34, and the knob 34 can be reset to the locked state.
In another aspect, an embodiment of the present application further provides a semiconductor device, including the above-mentioned wafer cassette temporary storage device.
It should be noted that, specific model specifications of the first spring 25, the rack 313, the gear 33 and the second spring 347 need to be determined by selecting a model according to an actual specification of the device, and a specific model selection calculation method adopts a prior art in the art, so that detailed descriptions thereof are omitted.
The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (5)
1. The temporary storage device for the wafer cassette is characterized by comprising:
the box body (1), the box body (1) comprises a bottom box (11) and an upper box (12), and the bottom box (11) is clamped with the upper box (12);
the bottom box (11) and the upper box (12) are respectively and uniformly provided with a plurality of groups of loading assemblies (2) which are mutually matched, each loading assembly (2) comprises a bearing plate (21), a pressing plate (22), a connecting rod (23), a lifting plate (24), a first spring (25) and a top plate (26), the bearing plates (21) are respectively fixedly connected to the bottom box (11) and the upper box (12), the pressing plates (22) are respectively and slidably arranged between the bottom box (11) and the upper box (12), the pressing plates (22) are respectively arranged between the bearing plates (21) and the bottom box (11) and between the bearing plates (21) and the upper box (12), the connecting rods (23) are fixedly connected to the pressing plates (22), the connecting rods (23) are slidably penetrated through the bearing plates (21), the lifting plates (24) are fixedly connected to one ends of the connecting rods (23) extending into the bearing plates (21), the first springs (25) are sleeved on one ends of the connecting rods (23), and the top plates (21) are slidably arranged between the bearing plates (21).
The bearing plate (21) is provided with a through hole (211), a bottom displacement cavity (212) and a top displacement cavity (213), the through hole (211) is symmetrically arranged, the bottom displacement cavity (212) is communicated with the top displacement cavity (213), and the diameter of the top displacement cavity (213) is larger than that of the bottom displacement cavity (212);
clamping connectors (221) are fixedly connected to the two ends of the pressing plate (22), and the clamping connectors (221) are in limit sliding fit with the sliding grooves (14);
a plurality of groups of symmetrically arranged compression bars (222) are uniformly and fixedly connected to the compression plate (22), and the compression bars (222) are in sliding fit with the through holes (211) symmetrically arranged on the bearing plate (21);
the lifting plate (24) and the bottom displacement cavity (212) are in sealing sliding fit;
the top plate (26) is in sealing sliding fit with the top displacement cavity (213), the top plate (26) is in annular arrangement, and a rubber ring (27) is fixedly connected to the upper surface of the top plate (26) in annular arrangement.
2. The cassette buffer of claim 1, wherein: the bottom box (11) and the upper box (12) are identical in structure, wherein the length and the width of the bottom box (11) are respectively identical to the width and the length of the upper box (12), and the structures on the bottom box (11) and the upper box (12) are vertically arranged in the same horizontal direction.
3. The cassette buffer of claim 1, wherein: the side walls of the bottom box (11) and the upper box (12) are fixedly provided with buckles (13).
4. The cassette buffer of claim 1, wherein: the side walls of the bottom box (11) and the upper box (12) are symmetrically provided with sliding grooves (14), assembly holes (15) and T-shaped grooves (16) respectively, and the symmetrically arranged sliding grooves (14) are in sliding fit with the pressing plates (22) respectively.
5. A semiconductor device comprising a cassette temporary storage device according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325613.1A CN116544154B (en) | 2023-03-30 | 2023-03-30 | Temporary storage device for wafer cassette and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325613.1A CN116544154B (en) | 2023-03-30 | 2023-03-30 | Temporary storage device for wafer cassette and semiconductor equipment |
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| Publication Number | Publication Date |
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| CN116544154A CN116544154A (en) | 2023-08-04 |
| CN116544154B true CN116544154B (en) | 2023-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310325613.1A Active CN116544154B (en) | 2023-03-30 | 2023-03-30 | Temporary storage device for wafer cassette and semiconductor equipment |
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| CN (1) | CN116544154B (en) |
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| JPS61220352A (en) * | 1985-03-26 | 1986-09-30 | Seiei Kosan Kk | Wafer loader |
| CN101259921A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic conveying device for wafer |
| KR20100006896U (en) * | 2008-12-29 | 2010-07-08 | 윤점채 | A binding structure of Chuck in Wafer Mounter |
| JP2012164748A (en) * | 2011-02-04 | 2012-08-30 | Shin Etsu Polymer Co Ltd | Wafer protection jig and wafer handling method |
| KR20130015239A (en) * | 2011-08-02 | 2013-02-13 | 조국환 | Apparatus for manufacturing cassette to transport the wafers |
| KR20130021942A (en) * | 2011-08-24 | 2013-03-06 | 주식회사 포틱스 | The solar cell wafer magazine for using belt-type |
| CN207503940U (en) * | 2017-12-12 | 2018-06-15 | 武汉新芯集成电路制造有限公司 | It is a kind of loading the cassette of wafer and diffusion furnace |
| CN111092037A (en) * | 2019-12-10 | 2020-05-01 | 王尧 | Shockproof and easy-to-clean wafer box |
| CN111354664A (en) * | 2018-12-20 | 2020-06-30 | 中芯集成电路（宁波）有限公司 | Wafer cassette and semiconductor device including the same |
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2023
- 2023-03-30 CN CN202310325613.1A patent/CN116544154B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61220352A (en) * | 1985-03-26 | 1986-09-30 | Seiei Kosan Kk | Wafer loader |
| CN101259921A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic conveying device for wafer |
| KR20100006896U (en) * | 2008-12-29 | 2010-07-08 | 윤점채 | A binding structure of Chuck in Wafer Mounter |
| JP2012164748A (en) * | 2011-02-04 | 2012-08-30 | Shin Etsu Polymer Co Ltd | Wafer protection jig and wafer handling method |
| KR20130015239A (en) * | 2011-08-02 | 2013-02-13 | 조국환 | Apparatus for manufacturing cassette to transport the wafers |
| KR20130021942A (en) * | 2011-08-24 | 2013-03-06 | 주식회사 포틱스 | The solar cell wafer magazine for using belt-type |
| CN207503940U (en) * | 2017-12-12 | 2018-06-15 | 武汉新芯集成电路制造有限公司 | It is a kind of loading the cassette of wafer and diffusion furnace |
| CN111354664A (en) * | 2018-12-20 | 2020-06-30 | 中芯集成电路（宁波）有限公司 | Wafer cassette and semiconductor device including the same |
| CN111092037A (en) * | 2019-12-10 | 2020-05-01 | 王尧 | Shockproof and easy-to-clean wafer box |
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| Publication number | Publication date |
|---|---|
| CN116544154A (en) | 2023-08-04 |
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Denomination of invention: A crystal boat box temporary storage device and semiconductor equipment Granted publication date: 20231027 Pledgee: Shanghai Bank Co.,Ltd. Suzhou Branch Pledgor: Yuhongyan Technology (Suzhou) Co.,Ltd. Registration number: Y2024980043569 |