JPS6253804A - Semiconductor wafer dicing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a dicing apparatus, and more particularly to a dicing apparatus for cutting a semiconductor wafer along cutting lines arranged in a grid pattern.

<Prior Art> As is well known, in the semiconductor device manufacturing process, the surface of a substantially disk-shaped semiconductor wafer is cut into a plurality of cuts by cutting lines arranged in a grid (such cutting lines are generally called streets). It is divided into rectangular areas, and a required circuit pattern is applied to each of the rectangular areas. Next, the wafer is cut along the cutting lines, and thus a plurality of rectangular regions having circuit patterns are individually separated (the individually separated rectangular regions are generally referred to as chips). It is important to cut the wafer with sufficient precision along the cutting line, and the width of the cutting line is extremely narrow, generally on the order of several tens of micrometers.

A conventional dicing apparatus for cutting a wafer along the cutting line includes a cutting area, an alignment area, and a wafer support means. A cutting means having a rotating shaft and a cutting blade fixed thereto is disposed in the cutting region, and a detecting means for detecting a cutting line of the wafer is disposed in the alignment region. The wafer support means is mounted so as to be movable between the alignment region and the cutting region, and is also rotatably mounted. In such a dicing apparatus, wafer support means, which holds the wafer placed on its surface by vacuum suction or the like, is initially present in the alignment area. In this alignment area, the detection means detects the cutting line on the surface of the wafer, and wafer alignment is performed based on this detection. Cutting of the wafer, which is performed later in the cutting area, involves relatively linearly moving the wafer support means supporting the wafer and the cutting means in a predetermined direction extending perpendicularly to the central axis of the rotating shaft of the cutting means. This is accomplished by a cutting movement, and as mentioned above, it is important to perform the cutting of the wafer with sufficient precision along the cutting line. Aligning the wafer in the alignment zone includes positioning the wafer support means in position based on detection of a cut line such that a particular cut line on the surface of the wafer is sufficiently precisely aligned with the cut travel path during cutting. This is accomplished by positioning. Positioning the wafer support means includes rotating the wafer support means to bring the wafer into a predetermined angular position with sufficient precision. Thereafter, the wafer support means is moved to the cutting area and cutting of the wafer is performed. In such cutting, the above-mentioned cutting movement and a pinching movement in which the wafer support means and the cutting means are linearly moved relative to each other by the distance between the cutting lines in a direction perpendicular to the direction of the cutting movement are performed alternately, so that they are substantially in contact with each other. The wafer is cut along one set of cutting lines extending parallel to the top. The wafer support means or cutting means is then rotated substantially 90 degrees and said cutting movement and said pitch movement are performed again in an alternating manner, thus substantially parallel to each other and substantially perpendicular to said one set of cutting lines. The wafer is cut along the other set of cutting lines extending from . When the cutting of the wafer is thus completed, the wafer support means is returned to the alignment area, the cut wafer is removed from the wafer support means, and the next wafer to be cut is placed on the wafer support means.

Problems to be Solved> The conventional dicing apparatus as described above has a serious problem of low dicing efficiency.

To elaborate on this point, firstly, the conventional dicing apparatus is provided with only one wafer support means, and while the wafer support means is present in the alignment area and the alignment is performed. cannot perform cutting in the cutting zone, and conversely cannot perform alignment in the alignment zone while the wafer support means is present in the cutting zone and cutting is being performed. As mentioned above, the width of the cutting line is extremely narrow, so it takes a certain amount of time to detect the cutting line with sufficient precision using a pattern matching method, and as mentioned above, it is difficult to align the wafer with sufficient precision. For these reasons, it is practically impossible to complete the alignment in a very short period of time, and it takes a considerable amount of time not only to carry out the cutting but also to carry out the alignment. I need. Therefore, in the conventional dicing equipment, which requires at least the time for alignment and the time for cutting to cut a single wafer, the wafer dicing efficiency is limited, and the wafer dicing efficiency is limited. It was not possible to achieve high dicing efficiency.

Second, in conventional dicing machines, the cutting means disposed in the cutting zone has only one cutting blade, and therefore one cutting movement can only cut along one cutting line. The wafer can only be cut using the same method. Therefore, in order to cut the wafer along a large number of cutting lines existing on the surface of the wafer, it is necessary to perform the above-mentioned cutting movements in a number corresponding to the number of cutting lines, and it is necessary to perform the above-mentioned cutting movements as many times as there are cutting lines. time is required. Due to these facts, in the conventional dicing apparatus, the wafer dicing efficiency is limited, and a sufficiently high dicing efficiency cannot be achieved.

<Object of the Invention> The present invention has been made in view of the above facts, and its main purpose is to provide a new and excellent wafer dicing apparatus with improved dicing efficiency.

Another object of the present invention is to provide a novel and superior method which can perform alignment of the next wafer in the alignment zone while cutting a wafer in the cutting zone, thereby improving dicing efficiency. It is an object of the present invention to provide a wafer dicing apparatus that has the following characteristics.

Still another object of the present invention is to appropriately cope with changes in the spacing between mutually parallel cutting lines so that two or more mutually parallel cutting lines can be cut by one cutting movement. It is an object of the present invention to provide a new and excellent wafer dicing device capable of cutting a wafer along the wafer, thereby improving dicing efficiency.

<Summary of the Invention> According to one aspect of the present invention, there is provided a dicing apparatus for cutting a semiconductor wafer along cutting lines arranged in a grid pattern, the dicing apparatus comprising: a cutting area; at least one alignment area; a cutting means disposed in the cutting area; a detection means disposed in the alignment area for detecting a cutting line of the wafer; and a detection means movable between the alignment area and the cutting area. and two wafer support means rotatably mounted, a main moving means for moving the wafer support means, and a rotation means attached to each of the wafer support means for rotating the wafer support means. wafer transport means including means for positioning one of the wafer support means in the cutting area;
While the wafer supported by the one of the wafer support means is being cut by the cutting means, the other of the wafer support means is positioned in the alignment area and the wafer supported by the other of the wafer support means is cut. A dicing apparatus is provided, characterized in that the cutting line of the wafer is detected by the detection means, and based on the detection, alignment including rotating the other of the wafer support means is provided. be done.

According to another aspect of the present invention, there is provided a dicing apparatus for cutting a semiconductor wafer along cutting lines arranged in a grid, comprising a cutting means and a wafer supporting means, the cutting means and the wafer supporting means. The wafer supported by the wafer support means is cut by the cutting means by relatively linearly moving the wafer support means in a predetermined direction; Assuming that the linear movement direction is the X-axis direction, there are two rotating shafts extending in the y-axis direction perpendicular to the X-axis direction, a cutting blade fixed to each of the rotating shafts, and a blade for rotating the rotating shafts. the cutting means further includes rotating means, one of the rotating shafts being mounted so as to be linearly movable relative to the other in the y-axis direction, and the cutting means further rotating the one of the rotating shafts with respect to the other There is provided a dicing apparatus characterized in that it includes a cutting blade interval setting means for relatively linearly moving the cutting blade in the y-axis direction.

<Preferred Specific Example of the Invention> Hereinafter, an example of a dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, in the illustrated example, one cutting area 2 and two alignment areas 4A and 4B are defined. Cutting area 2 includes alignment areas 4A and 4B.
In other words, the alignment areas 4A and 4B are arranged on both sides of the cutting area 2, respectively. The specific example shown includes a wafer conveyance means indicated by the number 6 as a whole;
a cutting means, generally designated by the number 8, disposed in the cutting area 2;
Detection means 10 arranged in the alignment areas 4A and 4B, respectively
A and IOB.

The illustrated wafer transport means 6 includes two stationary support rails 12 extending substantially horizontally and parallel to each other and fixed to a suitable support structure (not shown). Each of the support rails 12 is formed from a substantially straight elongate member having a T-shaped cross section. For convenience of explanation, the direction in which the support rail 12 extends is assumed to be the X-axis direction. Two main movable frames 14A and 14B are slidably mounted on the support rail 12. The main movable frames 14A and 14B have horizontal plates 16A and 16B, respectively, and four pillars 18A and 1 that hang down from the four corners of the lower surfaces of the horizontal plates 16A and 16B.
8B. Grooves having a T-shaped cross section corresponding to the cross-sectional shape of the support rail 12 are formed at the lower ends of the four pillars 18A and 18B, and by engaging the grooves with the support rail 12, the main Movable frame 14
A and 14B are separately and independently mounted to be slidable along the support rail 12 in the X-axis direction. Main movable frame 14A
and 14B are respectively attached with main moving means 20A and 20B for moving these in the X-axis direction. The main moving means 2OA attached to the main movable frame 14A includes a male threaded rod 22A rotatably attached to a support structure (not shown) and extending in the X-axis direction, and a deceleration mechanism 24A attached to the support structure. Through male threaded rod 22
A drive source 26A, which may be a pulse motor, is drivingly connected to A.
Contains. On the other hand, a connecting member 28A that hangs downward is fixed to the lower surface of the horizontal plate 16A, and a through female threaded hole extending in the X-axis direction is formed in the connecting member 28A. Then, the male threaded rod 22 is inserted into this female threaded hole.
A is screwed together. Therefore, when the threaded rod 22A is rotated by the drive source 26A, the main movable frame 14A is linearly moved in the X-axis direction. Similarly, the main movement source 20B attached to the main movable frame 1'4B also has a male threaded rod 2.
2B, and a drive source 26B that is drivingly connected to the male threaded rod 22B via a deceleration mechanism 24B.
The male threaded rod 22B is screwed into a through female threaded hole formed in a connecting member 28B fixed to the lower surface of the rod 6B. Therefore, the male threaded rod 22 is driven by the drive source 26B.
When B is rotated, the main movable frame 14B is moved linearly in the X-axis direction.

Referring to FIG. 2 as well as FIG. 1, a sub movable frame 30A is attached to the main movable frame 14A. Two support rails 32A extending substantially horizontally and substantially perpendicularly to the X-axis direction are formed on the upper surface of the horizontal plate 16A of the main movable frame 14A. For convenience of explanation, the direction in which the support rail 32A exists is assumed to be the y-axis direction. The cross-sectional shape of each of the support rails 32A is T-shaped.

The sub movable frame 30A has a horizontal plate 34A.
Two protrusions 36A extending parallel to each other are formed on the lower surface of A. A groove having a T-shaped cross section corresponding to the cross-sectional shape of the support rail 32A is formed in each of the protrusions 36A, and the groove is connected to the support rail 32A.
2A, the sub movable frame 30A is mounted so as to be slidable in the y-axis direction along the support rail 32A. The sub movable frame 3OA is attached with sub moving means 38A for moving it in the y-axis direction. The sub-moving means 38A includes a male threaded loft 40A rotatably mounted on the lower surface of the horizontal plate 16A of the main movable frame 14A and extending in the y-axis direction, and a male threaded rod loft 40A mounted on the lower surface of the horizontal plate 16A and connected via a deceleration mechanism 42A. 40A, which may be a pulse motor. A slot 46A extending in the y-axis direction is formed in the horizontal plate 16A of the main movable frame 14A, and a connecting member 48A that hangs downward through the slot 46A is fixed to the lower surface of the horizontal plate 34A of the sub movable frame 3OA. has been done. A through female threaded hole extending in the y-axis direction is formed in this connecting member 48A, and the male threaded rod 40A is screwed into this female threaded hole.

Therefore, when the male threaded rod 40A is rotated by the drive source 44A, the sub movable frame 30A is rotated relative to the main movable frame 14A.
is moved linearly in the y-axis direction.

A wafer support means 50A is attached to the sub movable frame 30A. As shown in FIG. 2, the wafer support means 50A has a horizontal disk 52A on which the wafer W is placed on its upper surface, and a shaft 54A that extends substantially vertically from the center of the lower surface of the disk 52A. On the other hand, the sub movable frame 30A
A substantially vertical through-hole is formed in the center of the horizontal plate 34A, and the shaft 54A is rotatably mounted in the through-hole via an appropriate bearing member 56A. A wafer support means 50A is attached to the sub-movable frame 30A so as to be rotatable about an extending central axis. The wafer support means 50A is provided with a rotation means 58A for rotating the wafer support means 50A. This rotating means 58A is connected to the sub-movable frame 3 via a mounting member 59A.
It includes a drive source 60A, which may be a pulse motor, mounted on the lower surface of the horizontal plate 34A of 0A. The drive source 60A is connected to the shaft 54A of the wafer support means 50A via a deceleration mechanism 62A.
Therefore, the wafer support means 50A is rotated by the drive source 60A. At least a portion of the disk 52A of the wafer support means 50A is formed of a porous material such as porous ceramic, and a suitable suction passage (not shown) is formed in the shaft 54A of the wafer support means 50A. ing. This suction path is connected to a vacuum a64A via a conduit having a control valve 63A. When the suction path is connected to the vacuum source 64A, air is suctioned through the disk 52A, thus
i on top! ! The placed wafer W is vacuum-adsorbed onto the disk 52A. Instead of forming at least a portion of the disk 52A from a porous material, a plurality of suction holes may be formed in the disk 52A.

To explain with reference to FIG. 1, similarly, the main movable frame 1
A sub movable frame 30B is also mounted on the sub movable frame 30B so as to be movable in the y-axis direction, and a wafer support means 50B is mounted on the sub movable frame 30B so as to be rotatable about a central axis extending substantially vertically. Then, this is placed in the sub movable frame 30B.
A sub-moving means 38B is attached for linearly moving the wafer in the axial direction, and a rotating means (not shown) for rotating the wafer supporting means 50B is attached. Sub movable frame 30B and sub moving means 3 attached thereto
8B, the wafer support means 50B, and the rotation means attached thereto (not shown) are connected to the sub movable frame 3 described above.
0A and the sub-moving means 38A attached thereto, the wafer supporting means 50A and the rotating means 58 attached thereto
They may be the same as A, so detailed explanations thereof will be omitted.

Next, the detection means 10A disposed in the alignment area 4A
I will explain about it. Referring to FIG. 1, a stationary support 66A fixed to a suitable support structure (not shown) is disposed above the alignment area 4A. A movable frame 68A is provided on the lower surface of this support stand 66A.
is installed. Two support rails 70 extending in the y-axis direction and having a T-shaped cross section are provided on the lower surface of the support stand 66A.
A (Only a small portion of these are shown in Figure 1)
is formed. On the other hand, two 1Jt72A having a T-shaped cross section corresponding to the cross-sectional shape of the support rail 70A are formed on the upper surface of the movable frame 68A, and by engaging the grooves 72A with the support rail 70A, A movable frame 68A is mounted slidably along the support rail 70A in the y-axis direction. The movable frame 68A has
A moving means 74A is attached for moving this in the y-axis direction. This moving means 74A is a support stand 66A.
A male threaded long door 6A is rotatably mounted on the top surface and extends in the y-axis direction, and a drive #80A, which may be a pulse motor, is mounted on the top surface of the support base 66A and drivingly connected to the male threaded long door 6A via a speed reducer 78A. Contains.

A slot 82A extending in the y-axis direction is formed in the support base 66A, and the slot 82A is formed in the upper surface of the movable frame 68A.
A connecting member 84A that protrudes upward through 2A is fixed. A female screw hole extending in the y-axis direction is formed in the connecting member 84A, and the male screw door 6A is screwed into the female screw hole. Therefore, drive tA8
When the male threaded Ron door 6A is rotated by 0A, the movable frame 68A is linearly moved in the y-axis direction with respect to the support base 66A.

A microscope 86A constituting optical input means of the detection means 10A is attached to the movable frame 68A. The optical center axis of the microscope 86A, which requires relatively low magnification, extends substantially vertically. For convenience of explanation, the direction of the optical center axis of the microscope 86A, that is, the vertical direction is defined as a biaxial direction. The detection means 10A includes an electronic processing means (not shown) that appropriately processes the image (therefore, the image of a part of the surface of the wafer W placed on the wafer support means 50A) entered through the microscope 86A. (not included) is also included.

Such a processing means detects a cutting line on the surface of the wafer W by performing a pattern matching process or the like. As this processing means, for example, Patent Application No. 162031 filed in 1982 by the present applicant (filing date: 05/05/1980, title of invention 2 automatic precision positioning system)
, Patent Application No. 32576 (filing date: 1982)
February 24, 1981, Invention Title: 2 Automatic Precision Positioning System), 1988 Patent Application No. 100658 (Filing date: May 21, 1980, Invention Title: 2 Automatic Precision Positioning System), 1988 Patent Application No. 264488 (filing date: December 17, 1985, title of invention: automatic precision positioning system) and Patent Application No. 44713 (filing date: March 8, 1985, title of invention: automatic precision positioning system) The means disclosed in the specification and drawings of "Automatic precision alignment system with automatic key pattern setting means" are preferably used.

Therefore, a detailed explanation of the processing means will be left to the specification and drawings of the patent application and will be omitted in this specification. The detection means 10A further includes a CRT for enlarging and visually displaying the image incident on the microscope 86A.
It also includes display means 88A, which may be a cathode ray tube. This display means 88A is mounted on a suitable support structure (not shown).

Similarly, a stationary support base 66B is also provided at the top of the alignment area 4B.
, a movable frame (i8B) and a moving means 74B are disposed, a microscope 86B constituting the optical input means of the detection means 10B is attached to the movable frame 68B, and the detection means 10B is equipped with an electronic processing means. and display means 88B.These means provided in connection with alignment area 4B may be substantially the same as the above-described means provided in connection with alignment area 4A, and therefore may be A detailed explanation of the means will be omitted.

Next, the cutting means 8 provided in the cutting area 2 will be explained. Referring to FIG. 1, disposed above the cutting zone 2 is a stationary support 90 secured to a suitable support structure (not shown). This support stand 90 has a horizontal plate part 92 and side plate parts 94 that hang down from both sides of this horizontal plate part 92, respectively. A movable main support frame 96 having a horizontal plate portion 98 and side plate portions 100 hanging downward from both sides of the horizontal plate portion 98 is attached to the support stand 90 . On the lower surface of the horizontal plate portion 92 of the support stand 90, y
Two protrusions 102 extending in the axial direction are provided, and each of the protrusions 102 is formed with a groove extending in the y-axis direction and having a T-shaped cross section. On the other hand, the main support frame 9
Two support rails 104 having a T-shaped cross-sectional shape corresponding to the cross-sectional shape of the groove are formed on the upper surface of the horizontal plate portion 98 of No. 6. Then, the support rail 10 is placed in the groove.
4, the main support frame 96 is attached to the support base 90 so as to be movable in the y-axis direction along the groove. The main support frame 96 is attached with a y-axis direction moving means 106 for moving it in the y-axis direction. This moving means 106 includes a male threaded rod 108 rotatably mounted on the upper surface of the horizontal plate portion 92 of the support base 90 and extending in the y-axis direction, and a male threaded rod 108 mounted on the upper surface of the horizontal plate portion 92 of the support base 90 and having a deceleration Ja 110. and a drive source 112, which may be a pulse motor, drivingly coupled to the externally threaded rod 108 via. A slot 114 extending in the y-axis direction is formed in the horizontal plate portion 92 of the support stand 90, and a connecting member 116 that protrudes upward through the slot 114 is formed on the upper surface of the horizontal plate portion 98 of the main support frame 96. Fixed. A through female threaded hole extending in the y-axis direction is formed in this connecting member 116, and the male threaded rod 108 is inserted into this female threaded hole.
are screwed together. Therefore, when the male threaded rod 108 is rotated by the drive source 112, the main support frame 96 is linearly moved in the y-axis direction with respect to the support base 90.

Referring to FIG. 3 as well as FIG. 1, on the lower surface of the horizontal plate portion 98 of the main support frame 96, there are a pair of suspension plates 118 and 119 hanging downward at a predetermined interval in the y-axis direction.
is fixed. And such a pair of suspension plates 118
and a support shaft 12 extending in the y-axis direction at the lower end of 119.
0 is mounted so as to be movable in the y-axis direction. Support shaft 12
0 is provided with a cutting blade interval setting means 122 for moving it in the y-axis direction. To explain this setting means 122, a pair of suspension plates 124 and 125 that hang downward at a predetermined interval in the y-axis direction are also fixed to the lower surface of the horizontal plate portion 98 of the main support frame 96. The setting means 122 includes a male threaded rod 126 that is rotatably mounted between a pair of suspension plates 124 and 125 and extends in the y-axis direction, and a male threaded rod 126 that is mounted on the suspension plate 125 and driven via a deceleration mechanism 128. and a coupled drive aiii 130, which may be a pulse motor. A connecting member 132 extending upward is fixed to the rear end of the support shaft 120. This connecting member 132
is formed with a through female threaded hole extending in the y-axis direction,
The male threaded rod 126 is screwed into this female threaded hole. Therefore, the drive source 130 causes the male threaded rod 12 to
When the support shaft 12 is rotated, the support shaft 12 is rotated relative to the main support frame 96.
0 is moved linearly in the y-axis direction.

A first sub-support frame 134 and a second sub-support frame 136 are attached to the support shaft 120. First sub-support frame 1
34 has a hollow cylindrical main portion 138 and a pair of connecting arms 140 and 142 that protrude from the main portion 138 at a predetermined distance in the y-axis direction. A pair of connecting arms 1
40 and 142 are pivotally connected to the support shaft 120, and thus the first sub-support frame 134 is mounted on the main support frame 96 so as to be pivotable about the central axis of the support shaft 120. A sleeve 144 is loosely fitted to the support shaft 120 between the suspension plate 118 to which the support shaft 120 is attached and the connecting arm 140 of the first sub-support frame 134, and similarly, the sleeve 144 is loosely fitted to the support shaft 120. The connecting arm 142 between the suspension plate 119 and the first sub-support frame 134 on which the
A sleeve (not shown) is loosely fitted onto the support shaft 120 between the support shaft 120 and the support shaft 120 . Such a sleeve prevents the first sub-support frame 134 from moving in the y-axis direction with respect to the suspension plates 118 and 119, and therefore prevents the first sub-support frame 134 from moving in the y-axis direction with respect to the main support frame 96. prevent it from moving. The second sub-support frame 136 includes the hollow cylindrical main portion 14
6 and a connecting arm 148 protruding from the main portion 146. The connecting arm 148 is rotatably connected to the support shaft 120, and thus the second sub-support frame 136 is attached to the main support frame 96 so as to be rotatable about the central axis of the support shaft 120. Sleeves 150 are fixed to the support shaft 120 on both sides of the connection arm 148 of the second sub-support frame 136 .

This sleeve 150 prevents the second sub-support frame 136 from moving in the y-axis direction with respect to the support shaft 120. As described above, when the main support frame 96 and the support shaft 120 attached thereto are moved in the y-axis direction by the y-axis direction moving means 106 (FIG. 1), the first Both the sub-support frame 134 and the second sub-support frame 136 are moved in the y-axis direction. On the other hand, when the support shaft 120 is moved in the y-axis direction with respect to the main support frame 96 by the cutting blade interval setting means 122, the first sub-support frame 134 is not moved in the y-axis direction, and the second Only the sub-support frame 136 is moved in the y-axis direction together with the support shaft 120.

Continuing the explanation with reference to FIG. 3, a rotary shaft 152A is rotatably attached to the main portion 138 of the first sub-support frame 134, and a blade for rotating the rotary shaft 152A is attached to the main portion 138 of the first sub-support frame 134. A rotating means 154A is attached. The rotating means 154A has an output shaft connected to an appropriate joint means 1.
D drivingly connected to the rotating shaft 152A by 56A.
CC morph is good. The rotating shaft 152A protrudes forward beyond the main portion 138, and a thin disc-shaped cutting blade 158A is fixed to the protruding end thereof.

Similarly, in the main portion 146 of the second sub-support frame 136,
A rotating means 1 which may be a DC motor, on which a rotating shaft 152B is rotatably mounted and whose output shaft is drivingly connected to the rotating shaft 152B via an appropriate joint means 156B.
54B is installed. A thin disk-shaped cutting blade 158B is fixed to the protruding end of the rotary shaft 152B that protrudes forward beyond the main portion 146. The cutting blades 158A and 158B may be of any type known per se containing natural or synthetic diamond abrasive grains suitable for cutting wafers.

The cutting means 8 further includes the rotating shafts 152A and 152B.
and cutting blades 158A and 1 fixed thereto.
It includes biaxial movement means for moving 58B up and down in two axes. In the illustrated example, the z-axis direction moving means includes a first z-axis direction moving means for pivoting the first sub-support frame 134 about the central axis of the support shaft 120.
and a second pivoting means 160B for pivoting the second sub-support frame 136 about the central axis of the support shaft 120.

To explain with reference to FIG. 3, the first pivoting means 160
A is a connecting member 162A whose one end is fixed to one inner surface of the side plate portion 100 of the main support frame 96 and whose other end extends upward.
It includes a support frame 164A fixed to the lower surface of the horizontal plate portion 98 of the main support frame 96 via the support frame 164A. This support frame 164
On the top surface of A is a male threaded rod 166 extending in the X-axis direction.
A is rotatably mounted, and a drive source 170A, which may be a pulse motor, is mounted and is drivingly connected to the male threaded rod 166A via a suitable speed reduction mechanism 168A. The first pivot movement means 160A further includes an actuation member 174A extending biaxially through a slot 172A formed in the support frame 164A.

A through female threaded hole extending in the X-axis direction is formed at the upper end of the operating member 174A, and the vaginal threaded rod 166A is screwed into this female threaded hole.

On the other hand, at the tip of the connecting arm 142 of the first sub-support frame 134, there is an abbreviated non-operating member 17 extending upward therefrom.
6A is integrally formed. The free end of the non-actuating member 176A, which preferably has a semicircular cross-sectional shape, is brought into contact with one side of the lower end of the actuating member 174A.

When the male threaded rod 166A is rotated by the drive source 170A to move the actuating member 174A in the direction shown by the arrow 17B, the free end of the non-actuating member 176A moves in the direction shown by the arrow 178 in response to the movement of the actuating member 174A. I am forced to do it. The first sub-support frame 134 is pivoted about the central axis of the support shaft 120 in the direction shown by the arrow 180, thereby causing the rotating shaft 152A and the cutting blade 158A fixed thereto to rise in an arc. I am forced to do it. Conversely, when the drive source 170A rotates the male threaded rod 166A to move the actuating member 174A in the direction indicated by the arrow 182, the first
Due to its own weight, the sub-support frame 134 of the support shaft 1
20 in the direction shown by arrow 184, and the free end of the non-actuating member 176A continues to abut one side of the lower end of the actuating member 174A. Thus,
Rotating shaft 152A and cutting blade 15 fixed thereto
8A is lowered in an arc.

The second pivoting means 160B disposed in relation to the second sub-support frame 136 is also similar to the first pivoting means 160A.
The horizontal plate part 98 of the main support frame 96 is connected to the horizontal plate part 98 of the main support frame 96 via a connecting member 162B whose one end is fixed to the other inner surface of the side plate part 100 of the main support frame 96 and whose other end extends upward. It includes a support frame 164B fixed to the lower surface of. On the upper surface of this support frame 164B, a male threaded rod 166B extending in the X-axis direction is rotatably mounted, and a pulse motor drivingly connected to the pressure threaded rod 166B via an appropriate speed reduction mechanism 168B. A good drive #170B is installed.

The second pivoting means 160B further includes the support frame 164.
includes an actuating member 174B extending biaxially through a slot 172B formed in B. A through female threaded hole extending in the X-axis direction is formed at the upper end of the operating member 174B, and the male threaded rod 166B is screwed into the female threaded hole. On the other hand, the second sub-support frame 1
An abbreviated non-operating member 176B extending upward from the tip of the 36 connecting arms 148 is integrally formed. The free end of the non-actuating member 176B, which preferably has a semicircular cross-sectional shape, is connected to the actuating member 1.
It is brought into contact with one side of the lower end of 74B. Drive #1
70B to rotate the male threaded rod 166B,
When the actuating member 174B is moved in the direction shown by the arrow 182, the non-actuating member 17 is moved in accordance with the movement of the actuating member 174B.
The free end of 6B is moved in the direction shown by arrow 182. Thus, the second sub-support frame 136 supports the support shaft 120.
The rotary shaft 152B and the cutting blade 158B fixed to the rotary shaft 152B are thereby raised in an arc. On the contrary, drive a! X170B rotates the male threaded rod 166B to move the actuating member 174B in the direction of arrow 178.
When the second sub-support frame 136 is moved in the direction indicated by arrow 180, the second sub-support frame 136 is caused to pivot in the direction indicated by an arrow 180 about the central axis of the support shaft 120 due to its own weight, and the non-operating member The free end of 176B is the actuating member 17
It continues to be in contact with one side of the lower end of 4B. In this way, the rotating shaft 152B and the cutting blade 158B fixed thereto are lowered in a circular arc.

FIG. 4 illustrates an example of a semiconductor wafer W diced by the dicing apparatus according to the present invention. - A large number of cutting lines CLI and Cl3 arranged in a grid are arranged on the surface of the wafer W, which is approximately disk-shaped except for a flat part F called an orientation flat. A large number of rectangular areas RA are defined by lines CLl and Cl3. Cutting line CLl
and Cl3 extend parallel to each other at a predetermined distance P1, and substantially perpendicular to the first set of cut lines CLI and extend parallel to each other at a predetermined distance P2. A second set of cutting lines CL2 extending in parallel
Contains. Adjacent cutting line interval PL in the first set of cutting lines CLI and second set of cutting lines CL2
Although the adjacent cutting line spacing P2 in may be substantially the same in some cases, they are usually different from each other (P1hP2).
. A required circuit pattern is applied to each of the rectangular areas RA.

The dicing action of the wafer W in the above-described dicing apparatus according to the present invention will be explained as follows.

To explain with reference to FIGS. 1 and 3, in the dicing apparatus as described above, before actually dicing the wafer W, the cutting blades 158A and 158B in the cutting means 8, the detecting means 10A and the IOH
Mutual alignment in the y-axis direction with the optical centers of microscopes 86A and 86B at is performed. In an example of such a mutual alignment operation, first, the main support frame 96 mounted movably in the y-axis direction with respect to the stationary support base 90 of the cutting means 8 is positioned at a predetermined initial position, and the main support frame 96 is positioned at a predetermined initial position. The second sub-support frame 136, which is attached to the frame 96 so as to be movable in the y-axis direction, is positioned at a predetermined initial position. In this way, in principle, the first sub-support frame 13
4, and the y-axis position of the cutting blade 158A fixed to the rotating shaft 152A attached to the second sub-support frame 136. The directional positions match each other. Next, in the wafer transport means 6, the main moving means 2OA positions the main movable frame 14A in the alignment area 4A, and the main moving means 20B moves the main movable frame 14B into the cutting area 6, as shown by solid lines in FIG. position. The main movable frame 14 existing in the cutting area 6
A dummy wafer (this dummy wafer may be one without cut lines CLI and Cl3 and a circuit pattern) is placed on the wafer support means 50B mounted on the wafer support means 50B, and is held by suction. After that, in the cutting means 8, the first turning means 160A
The sub-support frame 134 is rotated by a predetermined angle in the direction shown by the arrow 184 in FIG.
It is lowered to a cutting position where it interferes with the dummy wafer on the wafer support means 50B (at this time, the other cutting blade 158B is raised to a non-cutting position where it does not interfere with the dummy wafer on the wafer support means 50B).
. The rotating means 154A is then biased to move the cutting blade 158A in the direction indicated by arrow 186, for example, ts, o.
The main movable frame 14B is rotated at a speed of oo to 20,0OOr, p, m, and the main movable frame 14B is moved by a predetermined amount in the direction shown by the arrow 188 by the main moving means 20B at a relatively low speed of, for example, about 100 mm per second. The dummy wafer is actually cut by the cutting blade 158A.

Thereafter, the rotation of the cutting blade 158A is stopped, and the first auxiliary support frame 134 is rotated by a predetermined angle in the direction indicated by the arrow 180 in FIG. 3 by the first pivoting means 160A. The dummy wafer on the wafer support means 50B is raised to a non-cutting position where it does not interfere with the dummy wafer.

Next, as shown by the two-dot chain line in FIG.
B moves the main movable frame 14B in the direction shown by arrow 188 and positions it in the alignment area 4B. Thereafter, the actual cutting line on the dummy wafer is observed by looking at the display means 88B that visually displays the image input to the microscope 86B. Then, it is checked whether the optical center of the microscope 86B, ie, the center of the display surface of the display means 88B, and the actual cutting line precisely match in the y-axis direction. When the actual cutting line and the optical center of the microscope 86B do not precisely match in the y-axis direction, the movable frame 68B and the microscope 86B attached thereto are moved by the required amount in the y-axis direction by the moving means 74B, The position of the optical center of the microscope 86B in the y-axis direction is precisely matched with the actual cutting line. Thus,
Mutual alignment of cutting blade 158A and detection means 10B is established. Thereafter, in substantially the same manner as described above, the cutting blade 158A (!: detection means 10A
Perform mutual alignment with. That is, the main moving means 20A
The main movable frame 14A is moved in the direction shown by the arrow 188 and positioned in the cutting area 6. Next, the main movable frame 1
A dummy wafer is placed on the wafer support means 50A mounted on the wafer 4A, and is held by suction. After that, the cutting blade 158A is lowered to the cutting position.

Next, the cutting blade 158A is rotated in the direction shown by arrow 186, and the main movable frame 14A is moved by a predetermined amount in the direction shown by arrow 188 by the main moving means 20A, so that the cutting blade 158A actually cuts the dummy wafer. Thereafter, the cutting blade 158
The rotation of the cutting blade 158A is stopped, and the cutting blade 158A is
is raised to the non-cutting position, and then the main moving means 20A
The main movable frame 14A is moved in the direction shown by the arrow 190 and positioned in the alignment area 4A. After that,
By looking at the display means 88A that visually displays the image input to the microscope 86A, the actual cutting line on the dummy wafer can be observed, and if necessary, the moving means 74A
The movable frame 68A and the microscope 86 attached thereto
A is moved a required amount in the y-axis direction, and the position of the optical center of the microscope 86A in the y-axis direction is precisely matched with the above-mentioned actual cutting line. Mutual alignment of cutting blade 158A and detection means 10A is thus established.

In one example of a mutual alignment operation, mutual alignment verification of the initial position of cutting blade 158A and the initial position of cutting blade 158B is also performed. In such confirmation, the main movable frame 14A (or main movable frame 14B) is in the cutting area 6.
A dummy wafer is placed on the wafer support means 50A mounted on the main movable frame 14A and held by suction.

Next, the second auxiliary support frame 136 is rotated by a predetermined angle φ in the direction indicated by the arrow 180 in FIG. (At this time, the other cutting blade 1
58A has been raised to the non-cutting position). Next, the rotating means 154B is energized to rotate the cutting blade 158.
B is rotated in the direction shown by arrow 186, and the main movable frame 14A is moved by a predetermined amount in the direction shown by arrow 188, so that the cutting blade 158B actually cuts the dummy wafer. Thereafter, the cutting blade 158
B is stopped from rotating, and the second rotation movement means 16
0B, the second sub-support frame 136 is indicated by the arrow 18 in FIG.
The cutting blade 158B is rotated by a predetermined angle in the direction indicated by 4, thereby raising the cutting blade 158B to a non-cutting position where it does not interfere with the dummy wafer on the wafer support means 50A. Then,
The main movable frame 14A is moved by the arrow 190 by the main moving means 20A.
Move it in the direction shown by and position it in the alignment area 4A. Thereafter, by viewing the display means 88A that visually displays the image input to the microscope 86A, the position of the actual cutting line of the dummy wafer in the y-axis direction can be determined by the microscope 86A.
Check whether it precisely matches the optical center of A. If the position of the actual cutting line in the y-axis direction is shifted from the optical center of the microscope 86A, the cutting blade spacing setting means 122 in the cutting means 8 adjusts the second sub-support frame 136 by the amount of the shift. the initial position of the cutting blade 158B is modified by moving the cutting blade 158B in the y-axis direction by
The axial position matches the y-axis position of the cutting blade 158A at its initial position with sufficient precision.

4 as mentioned above! The dicing operation of the wafer W performed after performing the preliminary mutual alignment operation is as follows. In the above-described dicing apparatus according to the present invention, when one of the two main movable frames 14A and 14B in the wafer transfer means 6, for example, the main movable frame 14B, is present in the cutting area 2, the two main movable frames The other of the frames 14A and 14B, ie, the main movable frame 14A, exists in the alignment area 4A. Then, in the cutting area 2, dicing of the wafer W, which has already been placed on the wafer support means 50B as described later in the alignment area 4B and held there by suction, and aligned as required, is performed. . During this time, in the alignment area 4A, the control valve 63A (FIG. 2) is first switched to disconnect the suction path of the wafer support means 50A from the vacuum a 64A, which will be described later in the cutting area 2. The suction of the wafer W diced as required is stopped, and the wafer W is taken out from above the wafer support means 50A by an appropriate loading/unloading means (not shown). The next wafer W to be gripped is placed on the wafer support means 50A by the unloading means.The wafer W to be gripped is placed on the wafer support means 50A by itself. As is well known, the wafer W is attached to a frame (not shown) surrounding the wafer W with a tape attached across the back surface of the wafer W and the back surface of the frame, and placed on the wafer support means 50A. In either case, the wafer W is placed with the surface on which the cutting lines CLl and Cl3 (FIG. 4) are arranged facing upward, and with its flat part F as a reference or the surface on which it is mounted. The positioning formed on the frame is placed on the wafer support means 50A within a certain degree of error, although it is not sufficiently precise, with the notch as a reference.Next, the control valve 63A (FIG. 2) is placed on the wafer support means 50A. is switched again, the suction path of the wafer support means 50A is connected to the vacuum fi 64A, and thus the wafer W
is sucked and held on the wafer support means 50A. After that, based on the detection of specific cutting lines CLl and/or Cl3 on the surface of the wafer W by the detection means 10A,
Sufficiently precise alignment is performed automatically. Such alignment detects the inclination of the cutting line CLI (or Cl3) with respect to the X-axis direction reference line extending in the X-axis direction through the optical center of the microscope 86A in the detection means 10A,
The rotation means 58A (FIG. 2) rotates the wafer support means 50A in accordance with the detected inclination, thus
Cutting line CLI (or Cl
3) to be parallel to each other with sufficient precision. Furthermore, in the specific example shown in the figure, a deviation in the position in the y-axis direction between the reference line in the X-axis direction and the specific cutting line CLI (or Cl3) is detected, and the sub-movable frame is moved by the sub-movement means 38A according to the detected deviation. 30A in the y-axis direction with respect to the main movable frame 14A, and thus the y-axis direction position of the specific cutting line CLI (or Cl3) can be made to match the y-axis direction position of the above-mentioned X-axis direction reference line with sufficient precision. include. Such automatic alignment is disclosed in the above-mentioned patent application No. 16203 of 1982.
1, 1981 Patent Application No. 32576, 1989 Patent Application No. 100658, 1989 Patent Application No. 26448
No. 8 and Application No. 44,713 of 1985, the detailed description thereof can be conveniently accomplished by means as detailed in the specification and drawings of patent application no. The description will be left to the books and drawings and will be omitted in this specification.

In alignment area 4A, 1% stage 5 is set as described above.
When the alignment of the wafer W placed on 0A and attracted thereto is completed, and also in the cutting area 2, dicing of the wafer W placed on and held on the wafer support means 50B is completed. , wafer support means 5
0B is moved to the alignment area 4B, and the wafer support means 5QA is moved to the cutting area 2.

More specifically, the main moving means 20B is used as the main moving means. At the same time, the main movable frame 14 is moved by the main moving means 20A.
A is moved in the direction shown by arrow 188 and brought into cutting zone 2 . In the alignment area 4B,
Substantially the same procedure as described above in connection with alignment area 4A is performed. That is, while the main movable frame 14B is stationary at a predetermined position, first, the suction of the wafer W by the wafer support means 50B is stopped, and the already diced wafer W is transferred to the appropriate loading and unloading means (
(not shown) is taken out from the wafer support means 50B, and then the next wafer W to be picked up is placed on the wafer support means 50B and held there by suction by the loading and unloading means, and then, A specific cutting line C on the surface of the wafer W by the detection means 10B
Based on the detection of LI and/or Cl3, a sufficiently precise automatic alignment is performed. On the other hand, in the cutting area 2, dicing of the wafer W held by suction on the wafer support means 50A is performed.

Referring to FIG. 1 and FIG. 3, the dicing of the wafer W performed in the cutting area 2 will be described in detail as follows. Immediately before dicing of the wafer W is actually performed in the cutting area 2, the entire wafer W held by suction on the wafer support means 50A is directed not only to the cutting blade 158B but also to the cutting blade 158A in the direction shown by the arrow 190. The main movable frame 14A is moved from the center of the cutting area 2 in the
It is stopped at a one-sided offset position in the direction indicated by 90. The cutting blade spacing setting means 122 in the cutting means 8 then cuts the support shaft 120 and the second sub-support frame 13.
6 is moved a predetermined distance in the y-axis direction, and accordingly, the rotating shaft 152B attached to the second sub-support frame 136 and the cutting blade 158B fixed to the tip thereof are moved a predetermined distance in the y-axis direction from the initial position. be done. Cutting blade 15
The predetermined distance movement of 8B precisely matches the adjacent cutting line interval PI in the first set of cutting lines CLI (or the adjacent cutting line interval P2 in the second set of cutting lines CL2) in the wafer W to be cut; Alternatively, it is important that it be precisely an integral multiple thereof (see also FIG. 4). In this way, the distance in the y-axis direction between the cutting blade 158A and the cutting blade 158B is set to precisely match the above-mentioned adjacent cutting line distance PI (or P2), or to be precisely an integral multiple thereof. Next, the first auxiliary support frame 134 is pivoted in the direction shown by the arrow 184 in FIG. 3 by the first pivoting means 160A to lower the cutting blade 158A to a predetermined cutting position, and the second pivoting means 160A 16
0B, the second sub-support frame 136 is indicated by the arrow 18 in FIG.
The cutting blade 158B is turned in the direction indicated by 0 to lower the cutting blade 158B to a predetermined cutting position. Cutting blade 158A
The cutting position of 158B and wafer support means 50
Cutting blades 158A and 15 slightly more than the surface of A
It can be set so that the lower end of the outer peripheral edge of 8B is located upward. Thus, when the wafer W is cut by the cutting blades 158A and 158B as described below, if the wafer W is adsorbed by itself on the wafer support means 50A, the wafer W will be slightly attached to the back surface of the wafer W. Even if the wafer W is partially cut with uncut portions remaining, and therefore the wafer W is cut along all the cutting lines CL1 and Cl3, the wafer W is cut into individual rectangles w4MiR.
(In this case, as is well known to those skilled in the art, by applying a slight force to the wafer W in a later step, the remaining uncut portions are broken and the individual pieces are rectangular area RA is separated). On the other hand, when the wafer W attached to the frame with the tape as described above is adsorbed onto the wafer support means 50A, the wafer W is cut over its entire thickness, but the tape is not cut. Therefore, the wafer W is cut along all cutting lines CLI and Cl.
3, the wafer W is cut into individual rectangular areas RA
are completely separated, but the individual rectangular areas RA continue to be held together by the tape (in this case, in a later step, the tape is removed and the individual rectangular areas RA are are actually separated).

Thereafter, blade rotation means 154A and 154B are energized to move cutting blades 158A and 158B in the direction of arrow 1.
For example, from 15.000 to 20.00 in the direction indicated by 86.
It is rotated at speeds of Or, p, and m. and again,
The main movable frame 14A is moved by the main moving means 20A from the one-side offset position to the other-side offset position in the direction indicated by the arrow 188 at a relatively low speed of, for example, about 100 seconds per second.

In the other side offset position, the wafer support means 50
The entire wafer W suctioned and held on A is positioned at some distance from not only the cutting blade 158A but also the cutting blade 158B in the direction indicated by the arrow 188. Thus, while the main movable frame 14A is being moved to cut, the rotating cutting blade 158A is cutting along one cutting line C.
The wafer W is cut along LI (or Cl3), and at the same time, the rotating cutting blade 158B cuts the wafer W along another cutting line CLI (or Cl3).

Blade rotating means 154A and 154B are then deenergized to stop rotation of cutting blades 158A and 158B. Then, the first sub-support frame 134 is caused to pivot in the direction shown by the arrow 180 in FIG. The second sub-support frame 136 is moved to the third position by the second pivoting means 160B.
The cutting blade 158B is turned in the direction shown by an arrow 184 in the figure to raise the cutting blade 158B to a non-cutting position where it does not interfere with the wafer W. Then, the main support frame 96 is moved by a predetermined path # in the y-axis direction by the y-axis direction moving means 106 in the cutting means 8, so that the cutting blades 158A and 158
Both of B are moved a predetermined distance in the y-axis direction. As is easily understood, the above-mentioned movement of the cutting blades 158A and 158B by the predetermined distance is a so-called pitch feed, and the distance between adjacent cutting lines PI in the first set of cutting lines CLI (or the distance between adjacent cutting lines PI in the second set of cutting lines CL2) is It is important that the distance between adjacent cutting lines (P2) is precisely matched or exactly an integral multiple thereof. On the other hand, the main movable frame 14A is moved back from the other side offset position to the one side offset position in the direction indicated by arrow 190 by the main moving means 20A.

Thereafter, cutting blade 158 is cut as described above.
A and 158B cut the wafer W.

Therefore, in the above-mentioned cutting procedure, the main movable frame 14A
Although the cutting of the wafer W is not performed while the main movable frame 14A is moved back from the A side offset position to the one side offset position, if desired, the cutting can be performed even when the main movable frame 14A is moved back. Blades 158A and 158B
The cutting blades 158A and 158B can cut the wafer W by lowering them to the cutting position and rotating them. In this case, when the main movable frame 14A moves back, the cutting blade 158
Rotating the cutting blades 158A and 158B in a direction opposite to that indicated by arrow 186 causes the cutting blades 158A and 158B to
It is preferable from the viewpoint of the cutting characteristics of the wafer W by the method.

The cutting procedure as described above, including the cutting movement of the main movable frame 14A, the pitch feeding of the cutting blades 158A and 158B, and the return movement of the main movable frame 14A, is repeatedly performed, thus moving the wafer W to its first set of cutting lines. Cut along all of the CLI (or the second set of cutting lines CL2). Thereafter, while the main movable frame 14A is stopped at the one-sided offset position, the wafer support means 50A is rotated substantially 90 degrees by the rotation means 58A, and the wafer support means 50A is thus attracted to the wafer support means 50A. Rotate the wafer W by 90 degrees. In addition, when the adjacent cutting line interval P1 in the first set of cutting lines CLI and the adjacent cutting line interval P2 in the second set of cutting lines CL2 are different from each other, the cutting blade interval setting means 122 controls the support shaft. 120 and the second sub-support frame 136 by a required distance in the y-axis direction, and therefore move the rotating shaft 152B attached to the second sub-support frame 136 and the cutting blade 158B fixed to the tip thereof in the y-axis direction. move the required distance. Thus, cutting blade 1
58A and the cutting blade 158B in the y-axis direction precisely match the adjacent cutting line interval P2 in the second set of cutting lines CL2 (or the adjacent cutting line interval PI in the first set of cutting lines CL1), or Reset to an exact integer multiple. Thereafter, the above-described cutting procedure including the cutting movement of the main movable frame 14A, the pitch feeding of the cutting blades 158A and 158B, and the return movement of the main movable frame 14A is repeated. Thus, the wafer W is cut along all of the remaining second set of cutting lines CL2 (or first set of cutting lines CL1).

Of course, dicing of the wafer W attracted to the wafer support means 50B attached to the main movable frame 14B is performed in the same manner as the cutting procedure described above.

The configuration and operation of a specific example of the dicing apparatus according to the present invention have been described above in detail with reference to the accompanying drawings.
It goes without saying that the present invention is not limited to these specific examples, and that various modifications and changes can be made without departing from the scope of the present invention.

<Effects of the Invention> In the dicing apparatus configured according to the present invention as described above, the wafer transport means 6 includes two wafer support means 50A and 50B, and the wafer transport means 6 includes two wafer support means 50A and 50B, and a single cutting area 2
In one wafer support means 50A (or 50B)
While performing the cutting of the wafer W supported by the other wafer support means 50B (or 50A), the wafer W supported by the other wafer support means 50B (or 50A) can be aligned in the alignment area 4B (or 4A). . Therefore, the dicing time required for dicing one wafer W can be substantially reduced to only the time required to actually cut the wafer W in the cutting area 2, thus greatly improving dicing efficiency. be able to. Furthermore, the cutting means 8 includes two cutting blades 158A and 158B;
The 8B interval can be set as appropriate. Therefore, even if the cutting line interval on the wafer W changes, no problem will occur, and by one relative cutting movement of the cutting means 8 and the wafer support means 50A or 50B in a predetermined direction, The wafer W can be cut along two mutually parallel cutting lines, and the time required to actually cut the wafer W in the cutting area 2 is also significantly shortened, which also improves dicing efficiency. can be significantly improved. If desired, the cutting means 8 may be provided with three or more cutting blades whose mutual spacing can be appropriately set, and the cutting means 8 and the wafer support means 50A or 50B may be provided with one or more cutting blades in a predetermined direction. It is also possible to cut the wafer W along three or more mutually parallel cutting lines by the relative cutting movement twice.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the main parts of dicing H according to the present invention. FIG. 2 is a cross-sectional view showing the main movable frame of the wafer transport means in the dicing apparatus of FIG. 1 and various elements attached to the main movable frame. FIG. 3 is a partially cutaway perspective view showing the main part of the cutting means in the dicing apparatus of FIG. 1; 4 is a plan view showing an example of a wafer diced by the dicing apparatus shown in FIG. 1; FIG. 2... Cutting areas 4A and 4B... Alignment area 6... Wafer transport means 8... Cutting means 10, A and IOB... Detection means 14A and 14B... Main movable frames 20A and 20B Main moving means 30A and 30B Sub movable frames 38A and 38B Sub moving means 50A and 50B Wafer supporting means 58A...
Rotating means 96...Movable main support frame 106...Y-axis direction moving means 120...Support shaft 122...Cutting blade interval setting means 134...First sub-support frame 136...Second Sub-support frames 152A and 152B...Rotating shafts 154A and 154B...Blade rotating means 158A
and 158B...cutting blade 160A...first rotational movement means (z-axis direction movement means) 160B...second rotational movement means (Z-axis direction movement means) W...semiconductor wafer

Claims (1)

[Claims] 1. A dicing device for cutting a semiconductor wafer along cutting lines arranged in a grid pattern, the dicing device having a cutting area, at least one alignment area, and disposed in the cutting area. a detection means disposed in the alignment area for detecting the cutting line of the wafer; two wafer support means, a main moving means for moving the wafer support means, and two rotation means for rotating the wafer support means, each separately and independently attached to each of the wafer support means; wafer transport means including a means for positioning one of the wafer support means in the cutting area, while the wafer supported by the one of the wafer support means is being cut by the cutting means; , the other of the wafer support means is positioned in the alignment area, the detection means detects the cutting line of the wafer supported by the other of the wafer support means, and based on the detection, the wafer support means A dicing apparatus characterized in that the dicing apparatus is capable of performing alignment including rotating the other of the dicing apparatus. 2, two of the alignment areas, one of the wafer support means is movable between one of the alignment areas and the cutting area, and the other of the wafer support means is movable between one of the alignment areas and the cutting area; The dicing device according to claim 1, which is movable between the other of the mating areas and the cutting area. 3. The dicing device according to claim 2, wherein the cutting area is arranged between the two alignment areas. 4. The dicing apparatus according to claim 3, wherein each of the wafer support means is linearly movable between each of the alignment areas and the cutting area. 5. One linear movement direction of the wafer support means and the other linear movement direction of the wafer support means match each other, and the wafer transfer means are separately and independently attached to each of the wafer support means. The cutting means includes a rotation shaft rotatably mounted, a cutting blade fixed to the rotation shaft, and a blade rotation means for rotating the rotation shaft. , when the linear movement direction of the wafer support means is the x-axis direction, the rotation axis of the cutting means extends in the y-axis direction perpendicular to the x-axis direction, and each of the wafer support means in the cutting area 5. The dicing apparatus according to claim 4, wherein each of the wafer supporting means is moved in the x-axis direction when the wafer supported by the wafer is cut by the cutting means. 6. The wafer transfer means further includes two main movable frames mounted so as to be linearly movable in the x-axis direction, and the wafer support means is rotatably mounted on the main movable frames, Each of the main moving means is drivingly coupled to the main movable frame to linearly move the main movable frame in the x-axis direction, thus moving the wafer support means linearly in the x-axis direction, and the rotating means to move the main movable frame linearly in the x-axis direction. 6. The dicing apparatus according to claim 5, wherein the dicing apparatus is drivingly connected to a wafer support means and directly rotationally drives the wafer support means. 7. The wafer transfer means is further drive-coupled to two sub movable frames mounted on each of the main movable frames and to each of the sub movable frames so as to be linearly movable in the y-axis direction. (2) linearly moving each of the sub-movable frames in the y-axis direction;
7. The dicing apparatus according to claim 6, wherein the wafer support means is rotatably mounted on each of the sub movable frames. 8. The rotating shaft of the cutting means is mounted so as to be movable linearly in the y-axis direction and movably in the z-axis direction perpendicular to both the x-axis direction and the y-axis direction, and The means are
Furthermore, in order to linearly move the rotating shaft in the y-axis direction,
The dicing apparatus according to claim 5, comprising an axial movement means and a z-axis movement means for moving the rotating shaft in the z-axis direction. 9. The cutting means connects the rotating shaft and the cutting blade to two parts, respectively.
one of the rotating shafts is mounted so as to be linearly movable relative to the other in the y-axis direction, and the cutting means includes:
9. The dicing apparatus according to claim 8, further comprising cutting blade interval setting means for linearly moving said one of said rotating shafts relative to said other in said y-axis direction. 10. The cutting means further includes a main support frame attached to the main support frame so as to be linearly movable in the y-axis direction, a first sub-support frame attached to the main support frame, and a first sub-support frame attached to the main support frame so as to be linearly movable in the y-axis direction. a second sub-support frame attached to the main support frame, the other of the rotating shafts is rotatably attached to the first sub-support frame, and the one of the rotating shafts is attached to the second sub-support frame; The y-axis moving means is rotatably mounted on the frame and is drive-coupled to the main support frame to linearly move the main support frame in the y-axis direction, thus moving both rotation axes in the y-axis direction. and the cutting blade spacing setting means is drivingly connected to the second sub-support frame to move the second sub-support frame linearly in the y-axis direction, thus causing the one of the rotating shafts to move linearly in the y-axis direction. to move linearly in the y-axis direction,
A dicing apparatus according to claim 9. 11. The dicing apparatus according to claim 10, wherein the cutting means includes two blade rotating means separately attached to each of the rotating shafts. 12, the main support frame has a support shaft extending in the y-axis direction;
11. The dicing apparatus according to claim 10, wherein the first sub-support frame and the second sub-support frame are attached to the support shaft. 13. The first sub-support frame and the second sub-support frame are separately and independently mounted to be rotatable about the central axis of the support shaft, and the z-axis direction moving means is a first pivoting motion means and a second pivoting motion means separately and independently attached to the sub-support frame and the second sub-support frame, the first pivoting motion means and the second pivoting motion means; Each of the means pivots each of the first sub-support frame and the second sub-support frame, respectively, about the central axis of the support shaft, so that the other and the one of the rotating shafts, respectively, 13. The dicing device according to claim 12, wherein the dicing device is moved in the axial direction. 14. A dicing device for cutting a semiconductor wafer along cutting lines arranged in a grid, comprising a cutting means and a wafer supporting means, the cutting means and the wafer supporting means being relative to each other in a predetermined direction. The wafer supported by the wafer support means is cut by the cutting means, and the cutting means aligns the direction of relative linear movement between the cutting means and the wafer support means with the x-axis direction. Then, it includes two rotating shafts extending in the y-axis direction perpendicular to the x-axis direction, a cutting blade fixed to each of the rotating shafts, and a blade rotation means for rotating the rotating shafts, and One of the rotation axes is y relative to the other
The cutting means is mounted to be relatively linearly movable in the axial direction, and the cutting means further includes a cutting blade spacing for linearly moving the one of the rotating shafts relative to the other in the y-axis direction. A dicing device comprising setting means. 15. The wafer support means is mounted so as to be movable in the x-axis direction, and a moving means for moving the wafer support means in the x-axis direction is provided, and the wafer support means is supported by the wafer support means. 15. The dicing apparatus according to claim 14, wherein when the wafer is cut by the cutting means, the wafer supporting means is moved in the x-axis direction by the moving means. 16. The rotating shaft of the cutting means is mounted so as to be linearly movable in the y-axis direction and movable in the z-axis direction perpendicular to both the x-axis direction and the y-axis direction, and The means further includes a y-axis direction moving means for linearly moving the rotary shaft in the y-axis direction, and a z-axis direction moving means for moving the rotary shaft in the z-axis direction. The dicing device according to scope item 15. 17. The cutting means further includes a main support frame attached to the main support frame so as to be linearly movable in the y-axis direction, a first sub-support frame attached to the main support frame, and a first sub-support frame attached to the main support frame so as to be linearly movable in the y-axis direction. a second sub-support frame attached to the main support frame, the other of the rotating shafts is rotatably attached to the first sub-support frame, and the one of the rotating shafts is attached to the second sub-support frame; The y-axis moving means is rotatably mounted on the frame and is drive-coupled to the main support frame to linearly move the main support frame in the y-axis direction, thus moving both rotation axes in the y-axis direction. and the cutting blade spacing setting means is drivingly connected to the second sub-support frame to move the second sub-support frame linearly in the y-axis direction, thus causing the one of the rotating shafts to move linearly in the y-axis direction. to move linearly in the y-axis direction,
A dicing apparatus according to claim 16. 18. The dicing apparatus according to claim 17, wherein the cutting means includes two blade rotating means separately attached to each of the rotating shafts. 19, the main support frame has a support shaft extending in the y-axis direction;
18. The dicing apparatus according to claim 17, wherein the first sub-support frame and the second sub-support frame are attached to the support shaft. 20. The first sub-support frame and the second sub-support frame are separately and independently mounted to be rotatable about the central axis of the support shaft, and the z-axis direction moving means is a first pivoting motion means and a second pivoting motion means separately and independently attached to the sub-support frame and the second sub-support frame, the first pivoting motion means and the second pivoting motion means; Each of the means pivots each of the first sub-support frame and the second sub-support frame, respectively, about the central axis of the support shaft, so that the other and the one of the rotating shafts, respectively, 20. The dicing device according to claim 19, wherein the dicing device is moved in the axial direction.