JPH04109652A - Dicing device - Google Patents

Dicing device

Info

Publication number
JPH04109652A
JPH04109652A JP2228912A JP22891290A JPH04109652A JP H04109652 A JPH04109652 A JP H04109652A JP 2228912 A JP2228912 A JP 2228912A JP 22891290 A JP22891290 A JP 22891290A JP H04109652 A JPH04109652 A JP H04109652A
Authority
JP
Japan
Prior art keywords
wafer
shape
recognized
cutting region
recognizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2228912A
Other languages
Japanese (ja)
Other versions
JP3023566B2 (en
Inventor
Kazuhiro Yagi
Toshihiko Ishikawa
Mikio Sakuma
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2228912A priority Critical patent/JP3023566B2/en
Publication of JPH04109652A publication Critical patent/JPH04109652A/en
Application granted granted Critical
Publication of JP3023566B2 publication Critical patent/JP3023566B2/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16883802&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH04109652(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To suitably align a wafer and to further set a cutting region of the wafer to a minimum limit by providing a shape recognition part, recognizing a wafer shape, aligning and cutting it.
CONSTITUTION: Shape recognition means 10 of a wafer W for recognizing the profile shape of the wafer W is provided, and the wafer is aligned and cut based on the shape of the recognized wafer W. That is, the shape of the wafer is recognized at each wafer, a reference pattern position is suitably decided based on the recognized shape, and a cutting region is decided based on the recognized wafer shape. Thus, since a suitable alignment can be executed and a minimum cutting region is obtained, high throughput of dicing can be performed.
COPYRIGHT: (C)1992,JPO&Japio
JP2228912A 1990-08-30 1990-08-30 Dicing equipment Expired - Fee Related JP3023566B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2228912A JP3023566B2 (en) 1990-08-30 1990-08-30 Dicing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2228912A JP3023566B2 (en) 1990-08-30 1990-08-30 Dicing equipment

Publications (2)

Publication Number Publication Date
JPH04109652A true JPH04109652A (en) 1992-04-10
JP3023566B2 JP3023566B2 (en) 2000-03-21

Family

ID=16883802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2228912A Expired - Fee Related JP3023566B2 (en) 1990-08-30 1990-08-30 Dicing equipment

Country Status (1)

Country Link
JP (1) JP3023566B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614080A2 (en) * 1993-03-05 1994-09-07 Tokyo Seimitsu Co.,Ltd. Apparatus for recognizing the shape of a semiconductor wafer
JP2008153338A (en) * 2006-12-15 2008-07-03 Disco Abrasive Syst Ltd Dividing method of wafer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140243A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Dicing device
JPS5972151A (en) * 1982-10-18 1984-04-24 Toshiba Corp Aligner for orientation flat
JPS61128540A (en) * 1984-11-27 1986-06-16 Toshiba Corp Appearance inspection equipment for semiconductor substrate
JPS6253804A (en) * 1984-12-27 1987-03-09 Disco Abrasive Systems Ltd Semiconductor wafer dicing device
JPS62120039A (en) * 1985-11-20 1987-06-01 Sankyo Seiki Mfg Co Ltd Image processor
JPS63249349A (en) * 1987-04-06 1988-10-17 Toshiba Corp Detection of inclination of semiconductor wafer
JPS649303A (en) * 1987-07-01 1989-01-12 Nec Corp Wafer positioning apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55140243A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Dicing device
JPS5972151A (en) * 1982-10-18 1984-04-24 Toshiba Corp Aligner for orientation flat
JPS61128540A (en) * 1984-11-27 1986-06-16 Toshiba Corp Appearance inspection equipment for semiconductor substrate
JPS6253804A (en) * 1984-12-27 1987-03-09 Disco Abrasive Systems Ltd Semiconductor wafer dicing device
JPS62120039A (en) * 1985-11-20 1987-06-01 Sankyo Seiki Mfg Co Ltd Image processor
JPS63249349A (en) * 1987-04-06 1988-10-17 Toshiba Corp Detection of inclination of semiconductor wafer
JPS649303A (en) * 1987-07-01 1989-01-12 Nec Corp Wafer positioning apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0614080A2 (en) * 1993-03-05 1994-09-07 Tokyo Seimitsu Co.,Ltd. Apparatus for recognizing the shape of a semiconductor wafer
EP0614080A3 (en) * 1993-03-05 1995-01-25 Tokyo Seimitsu Co Ltd Apparatus for recognizing the shape of a semiconductor wafer.
JP2008153338A (en) * 2006-12-15 2008-07-03 Disco Abrasive Syst Ltd Dividing method of wafer

Also Published As

Publication number Publication date
JP3023566B2 (en) 2000-03-21

Similar Documents

Publication Publication Date Title
TW344093B (en) Method for manufacturing completely circular semiconductor wafers
JPH04276645A (en) Dicing method of compound semiconductor wafer
JPH04109652A (en) Dicing device
JPH04128727A (en) Diaphragm device
JPH0442949A (en) Semiconductor device with dicing slit
JPH0393251A (en) Semiconductor device and its manufacture
JPH02159010A (en) Manufacture of semiconductor device
JPH04213845A (en) Package for semiconductor
JPH02122517A (en) Method for detecting position and mark for detecting position
JPS63136546A (en) Laser-trimming device
JPH0474443A (en) Die bonding apparatus and die bonding method using the same
JPS62126635A (en) Aligning pattern for semiconductor wafer
JPH04146647A (en) Alignment method of semiconductor wafer
JPH0265153A (en) Semiconductor device
JPH04103118A (en) Positional deviation detecting device for mask and wafer
JPH04233250A (en) Semiconductor dicing equipment
JPH04288816A (en) Forming method for alignment marker
JPH03283528A (en) Semiconductor integrated circuit device
JPS5426666A (en) Positioning method of semiconductor wafer
JPS62193121A (en) Pattern position aligning method
JPH03183153A (en) Manufacture of semiconductor device
JPH04290456A (en) Positioning method for wafer
JPH04326550A (en) Chip separation method
JPS62219187A (en) Character recognizing device
JPH03135009A (en) Alignment system with wide detection angle of field and high accuracy

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090121

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100121

Year of fee payment: 10

LAPS Cancellation because of no payment of annual fees