JPH07283171A - Chuck table provided with sub-table - Google Patents

Abstract

PURPOSE:To correct a deviation caused by a new blade in indexing when a blade is replaced with a new one in dicing by a method wherein a sub-table provided adjacent to a main chuck table which holds a work such as a semiconductor wafer is made to hold a small work piece by suction. CONSTITUTION:A sub-table 14 is fixed extending in the direction of an X axis through the intermediary of a stay 16 to the certain spot of a movable table 15 on which a main cluck table 10 is mounted. Suction holes 20 are provided on the surface of the sub-table 14 so as to attract a small work 17 by suction or the upside of the sub-table 14 is formed of a porous member 21 and made to communicate with a suction source. The sub-table 14 is provided with a suction section to hold the small work 17 of 100mm<2> area or the like, and the periphery of the suction section is flat and level with the upside of the main chuck table 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chuck table with a sub table for a dicing device for cutting semiconductor wafers and the like.

[0002]

2. Description of the Related Art In a dicing apparatus, as shown in FIG. 5, a cassette 1 in which an object to be cut such as a semiconductor wafer is stored is placed in a cassette placement area A, and a loading / unloading means 2 is used.
To carry out the object to be cut in the cassette 1 to the standby area B,
It is carried to the chuck table 4 by the carrying means 3 having a turning arm. Chuck table 4 holding this work
Is moved right below the alignment means 5, the cutting line (street) is aligned and then moved to the cutting region C, and the dicing is performed by the rotary blade 7 attached to the tip of the spindle 6. After the dicing, the chuck table 4 is returned to the original position, and the object to be cut is transported to the cleaning unit 9 by the second transport unit 8 to be spin-cleaned and dried. Thereafter, the object to be cut is returned to the standby area B by the carrying means 3 and is housed in the cassette 1 by the carrying-in / out means 2.

[0003]

The blade 7 must be properly replaced because it is worn or damaged.
When the blade was replaced during the dicing of the object to be cut, a slight displacement of the cutting groove by the new blade might occur. This is due to an error in the thickness of the new blade and an error in tightening the spindle. The present invention has been made to solve such a conventional problem, when the blade is replaced in the middle of dicing, the small cutting object prepared in the sub-table is trial-cut and the deviation of the cutting groove is measured by the alignment means, An object of the present invention is to provide a chuck table with a sub-table, which is capable of continuously performing dicing in consideration of the error.

[0004]

As a means for technically solving this problem, the present invention provides a main chuck table for holding an object to be cut such as a semiconductor wafer, and a main chuck table adjacent to the main chuck table. A sub-table provided is a chuck table with a sub-table configured to suck and hold a small piece of an object to be cut. Further, the gist is that a setup means for adjusting the blade in the vertical direction is further included.

[0005]

[Operation] When exchanging the blade during dicing, move the new blade by a predetermined amount to cut the small piece of work piece that has been suction-held on the sub-table, and measure the amount of deviation by observing the cutting groove with alignment means. However, by adding this amount of deviation, it becomes possible to continue precise dicing. Also, the cut amount can be adjusted by adjusting the vertical direction of the new blade by the setup means.

[0006]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 10 denotes a main chuck table in the dicing device, and a frame 11
An object to be cut 13 (semiconductor wafer) fixed via an adhesive tape 12 is held on the.

Reference numeral 14 is a sub-table, which is provided at a main part of the movable table 15 to which the main chuck table 10 is attached.
A plurality of suction holes 2 are attached to the surface of the sub-table so as to be attached so as to project in the X-axis direction via the stay 16 so as to be capable of suction-holding the small piece workpiece 17 as shown in FIGS. 1 (b) and 1 (c).
0 is formed, or the upper surface of the sub-table is composed of the porous member 21 and communicates with the suction source.

The sub-table 14 is, for example, 10 mm.
It has a suction portion for sucking and holding a small piece 17 to be cut, and its peripheral portion is a flat surface and is flush with the upper surface of the main chuck table 10. or,
The sub-table 14 does not obstruct the mounting of the frame 11 on the main chuck table 10 so that the blade 7 can cut the small-piece cut object 17, and the small-piece cut object 1 can be cut by the microscope of the alignment means 5.
7 is set at a position where it can be observed.

Reference numeral 18 is a non-contact type setup means, which is attached to an important part of the movable table 15 so as to extend in the X-axis direction so as to face the sub table via a stay 19 and has a pair of sensors 18a inside. The blade is mounted between the sensors 18a to detect the position of the blade and to detect wear and damage of the blade.

The chuck table with the sub-table according to the present invention is constructed as described above, and when the blade 7 needs to be replaced during the dicing of the workpiece 13, a new blade 7'is attached to the tip of the spindle 6. After the attachment, the blade 7'is moved by a predetermined amount (L) from the reference position (P) shown in FIG. 2 to test-cut the small piece workpiece 17 on the sub table 14 as shown in FIG.

Then, the main chuck table 10 is moved to the X position.
The small piece to be cut 17 is moved in the axial direction to be positioned directly below the alignment means 5, and the cutting groove 17a which is trially cut as shown in FIG. 4 is observed with the microscope 5a and the deviation amount from the hairline (S) which is the reference line. Measure Δy.

The amount of deviation Δy is Y caused by a thickness error of the new blade 7'and a tightening error on the spindle 6.
It corresponds to the amount of displacement in the axial direction. Therefore, the amount of deviation Δy can be added, that is, corrected, and dicing can be continued.

At this time, the new blade 7'attached to the spindle 6 is inserted into the set-up means 18 to detect the vertical position of the blade by the sensor 18a, and the new blade 7'position in the Z-axis direction, that is, the cut amount. Adjust.

In this way, by adjusting the Y-axis direction (indexing amount) and the Z-axis direction (cutting amount) of the new blade 7'after the blade replacement, precise dicing by the new blade 7'is continued. Can be done.

[0015]

As described above, according to the present invention,
In the chuck table of the dicing machine, a main chuck table and a small sub-table attached to this main chuck table were provided, and a small piece workpiece for trial cutting was held on the sub-table, so the blade was replaced during dicing. In this case, after the new blade is mounted, the small piece of the object to be cut is trial-cut, and the cutting groove is observed by the alignment means to correct the deviation in the indexing direction, which brings about the effect that the precise dicing can be continuously performed.
Further, by using the setup means together, it is possible to correct the cutting amount of the new blade.

[Brief description of drawings]

FIG. 1A is a perspective view of a main part showing an embodiment of the present invention,
(b), (c) is an explanatory view showing an adsorption mechanism, respectively.

FIG. 2 is a plan view of the same.

FIG. 3 is an explanatory view showing a cutting state of a small piece to be cut by a new blade.

FIG. 4 is an explanatory diagram showing a state in which a deviation amount of a cutting groove is measured by alignment means.

FIG. 5 is a perspective view showing an example of a dicing device.

[Explanation of symbols]

1 ... Cassette 2 ... Carrying in / out means 3 ... Conveying means
4 ... Chuck table 5 ... Alignment means 6 ... Spindle 7 ... Blade 8 ... Second transfer means 9 ... Cleaning means 10
… Main chuck table 11… Frame 12
... Adhesive tape 13 ... Cutting object 14 ... Sub table 15 ... Movable stand 16 ... Stay 17 ... Small piece cutting object 17a ... Cutting groove 18 ... Setup means 18a ... Sensor 19 ... Stay 20 ... Suction hole 21 ... Porous member

Claims (2)

[Claims] 1. A main chuck table for holding an object to be cut such as a semiconductor wafer, and a sub-table arranged adjacent to the main chuck table,
The sub-table is a chuck table with a sub-table, which is configured to be capable of sucking and holding a small piece of an object to be cut. 2. The chuck table with a sub-table according to claim 1, further comprising setup means for adjusting the blade in the vertical direction.