JPH07122888A - Transfer jig for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the bending of an outer lead due to a transfer jig when a semiconductor device is transferred from tray to tray. CONSTITUTION:A sucking port 5 is provided on the lower surface of a transfer jig 3 at a position which respectively faces each of a plurality of semiconductor devices mounted on a tray. The sucking port is made to communicate with a vaccum-pump connecting port linked to an external vacuum source. A closing member 7 is mounted at the unnecessary sucking port so that the member 7 can be freely attached and detached in order to suck the intended semiconductor device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transfer jig used for transferring semiconductors from tray to tray in the manufacture of semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device stored in a tray has been transferred to another tray by pinching it one by one using tweezers. As a technique for transferring without using tweezers, for example, Japanese Patent Laid-Open No. 59-1896.
According to Japanese Laid-Open Patent Publication No. 44-44, as shown in FIG. 4, a jig 10 having a slide plate 13 that can move along the lower surface of a tray having a hole 12 is vertically stacked, and a slide plate of an upper tray on which a semiconductor device is mounted is mounted. The semiconductor device was slid and transferred from the upper tray to the lower tray.

[0003]

In these conventional jigs, when the semiconductor device is transferred from one tray to another tray, a part of the tray touches the external leads of the semiconductor device, which causes lead bending and leads. It was difficult to maintain the molding size of. Further, since the tray having the slide plate on the lower surface is configured to drop the semiconductor device from the upper tray to the lower tray, there is a problem that lead bending occurs when the semiconductor device is dropped.

[0004]

A transfer jig of the present invention is for transferring a semiconductor device between trays in which a plurality of holes for accommodating the semiconductor device are arranged at positions corresponding to each other. In the transfer jig, the lower surface of the transfer jig is provided with at least one suction port for vacuum suction of the semiconductor device at a position corresponding to each of the plurality of holes of the tray. , These suction ports
The transfer jig is connected to a vacuum connection port which is connected to an external vacuum source, and a closing member for selectively airtightly closing the suction port is detachably attached to the suction port. It has the structure provided.

Although one suction port is provided for each semiconductor device, two or more suction ports may be provided to enhance the suction force. At the outer end of the suction port to which the closing member is not attached for sucking the semiconductor device, a seal member for keeping airtight with the semiconductor device when the semiconductor device is sucked is detachably provided.

[0006]

When the semiconductor device 1 stored in the hole on the tray is transferred to another tray, the packing 4 is sucked into the suction port 5 for sucking the semiconductor device 1 to be transferred, and the suction port 5 is not sucked. A transfer jig 3 with a rubber lid 7 attached
As shown in FIG. 3, the trays 9 in which the semiconductor devices 1 are housed are superposed from above and the respective suction ports 5 are engaged with the corresponding semiconductor devices 1. At this time, the vacuum portion 6 of the transfer jig 3 is evacuated from the vacuum pump connection port 8 by a vacuum pump (not shown) to adsorb the semiconductor device 1. Next, the semiconductor device 1 is sucked and transferred to the transfer jig 3
Are stacked on the empty tray from above, the vacuum state is released, the semiconductor device 1 is transferred to the empty tray, and then the transfer jig 3 is removed to complete the transfer of the semiconductor device 1.

[0007]

The present invention will be described below with reference to the drawings. As shown in FIG. 3, the transfer jig 3 has a shape corresponding to the shape of the tray 9 in which holes for accommodating the semiconductor devices 1 to be transferred are arranged on the upper surface, and the lower surface thereof has
As shown in FIG. 1A, a plurality of suction ports 5 for sucking the semiconductor device 1 are provided at positions corresponding to the holes arranged on the tray 9. These suction ports 5 communicate with a vacuum pump connection port 8 provided on the transfer jig 3 as shown in FIG. 3 via a vacuum section 6 provided inside the jig 3.

At the lower end of the suction port 5, a packing 4 which is a sealing member made of rubber or the like for maintaining airtightness when the semiconductor device 1 is sucked is provided. When selectively adsorbing, a rubber lid 7 as a closing member can be attached to the adsorption port 5 that does not adsorb as shown in FIG. 1B to prevent adsorption.
Around the suction port 5 on the lower surface of the transfer jig 3, there is provided a protrusion 14 for engaging and positioning around the upper end of the semiconductor device 1 when the semiconductor device 1 is sucked. When the semiconductor 3 is adsorbed, the external lead 2
It has a structure that does not touch the. With such a configuration, when the semiconductor device 1 is adsorbed by the adsorption port 5, the external lead 2 is fixed without contacting any part of the transfer jig 3, so that the external lead of the semiconductor device is fixed. It is possible to prevent the occurrence of bending. In addition, the transfer jig 3
When the semiconductor device 1 is transferred to the empty tray, the jig 3 is superposed on the empty tray, the vacuum is released, and the semiconductor device is transferred. Therefore, the bending of the external lead caused by the drop occurs. There is no such thing.

FIG. 2 is a cross-sectional view of a jig for picking up a semiconductor device according to the second embodiment of the present invention. By providing the suction ports 5 in two places, the degree of fixation of the semiconductor device 1 at the time of suction is reinforced.

[0010]

As described above, according to the present invention, when a semiconductor device is transferred, the vacuum suction is used so that the external lead of the semiconductor device comes into contact with the transfer jig and the semiconductor device is placed on the tray. Since the drop is prevented, the bending rate of the external leads of the semiconductor device during the transfer operation is significantly reduced. A comparison between the lead bending occurrence rate according to the conventional technique and the lead bending occurrence rate according to the present invention is shown in FIG.

[Brief description of drawings]

FIG. 1A is a partial sectional view of an embodiment of a transfer jig of the present invention. FIG. 3B is a partial cross-sectional view of an example of the transfer jig of the present invention.

FIG. 2 is a partial sectional view of a second embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a transfer operation by the transfer jig of the present invention.

FIG. 4 is a sectional view of a conventional example.

FIG. 5 is a diagram showing a lead bending occurrence rate.

[Explanation of symbols]

 1 semiconductor device 2 external lead 3 transfer jig 4 seal member 5 suction port 6 vacuum part 7 closed part 8 vacuum pump connection port 9 tray 10 conventional jig

Claims (4)

[Claims] 1. A transfer jig for transferring semiconductor devices between trays in which a plurality of holes for accommodating semiconductor devices are arranged at positions corresponding to each other, wherein a lower surface of the transfer jig. At least one suction port for suctioning the semiconductor device by vacuum is provided at a position corresponding to each of the plurality of holes in the tray, and these suction ports are provided in the transfer jig. The suction port is connected to a vacuum pump connection port connected to an external vacuum source, and the suction port is detachably provided with a closing member for selectively hermetically closing the suction port. Characteristic semiconductor device transfer jig. 2. The transfer jig for a semiconductor device according to claim 1, wherein one suction port is provided at a position corresponding to each of the plurality of holes of the tray. 3. The transfer jig for a semiconductor device according to claim 1, wherein two suction ports are provided at positions corresponding to each of the plurality of holes of the tray. 4. A seal member is detachably provided at an outer end portion of the suction port to which the closing member is not attached so as to maintain airtightness between the semiconductor device and the semiconductor device when the semiconductor device is sucked. The semiconductor device transfer jig according to any one of 1.