JPH0437098A - Electronic component installing device - Google Patents

Abstract

PURPOSE:To perform automatically and efficiently a cleaning of a suction nozzle by a method wherein the title device is provided with a suction means for removing foreign substances, which are clogged in a component suction nozzle tip, to the outside of the nozzle tip. CONSTITUTION:A component suction nozzle 1 is positioned over an opening part of a prescribed air passage 4 and thereafter, a lever 7 is detached and a piston 2 is made to press to the nozzle 2 by a spring 8. The tip of the nozzle is closely adhered to an opening surface of the passage 4 by a rubber packing 9. Simultaneously, the opening surface A of the passage 4 is coincided with an opening surface B of a suction air passage and the passage 4 of the piston is connected to an air passage 5 of a cylinder. As a result, a vacuum suction force is generated at the tip of the nozzle 1 via the passage 4 and clogging foreign substances in the tip of the nozzle are made to eliminate. In such a way, a cleaning of the nozzle 1 can be efficiently performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for mounting, for example, minute electronic components onto an electronic circuit board.

[Prior Art] Electronic component mounting devices are widely used as means for assembling electrical and electronic components such as semiconductor chips and chip resistors into predetermined devices and products. In recent years, electronic components have become chip-shaped and are following a trend toward miniaturization.

2. Description of the Related Art Conventionally, a component suction nozzle using hollow vacuum means has been used to take out, for example, a microchip type electronic component from a component supply device and mount it on a predetermined substrate or the like. That is, the electric/electronic components are picked up, moved, and mounted onto a predetermined board or the like using the suction force of a vacuum.

With the miniaturization of electronic components in recent years, the nozzle opening area has also been reduced due to the miniaturization of vacuum suction nozzles.

[Problems to be Solved by the Invention] However, in the prior art described above, there was no function to clean the nozzle when the component suction nozzle became clogged with foreign matter. Therefore, when proceeding with the mounting process of microelectronic components, if dust or other foreign matter clogs the micronozzle opening, the equipment must be stopped and the foreign matter removed manually, which reduces equipment availability. There was a problem that this resulted in a decrease in the number of electronic components and a decrease in the mounting rate of electronic components.

SUMMARY OF THE INVENTION In order to solve the above-mentioned conventional problems, it is an object of the present invention to provide an electronic component mounting device that can automatically perform nozzle cleaning work at any time and maintain and improve the mounting rate of electronic components. be.

[Means for Solving the Problems] In order to achieve the above object, the electronic component mounting device of the present invention picks up components by using a plurality of component suction nozzles or one component suction nozzle provided on the circumference of a rotatable disk. An electronic component mounting device that sucks and holds an electronic component supplied from a supply section and mounts the electronic component in a predetermined position, the suction means for removing foreign matter clogging the component suction nozzle port to the outside of the nozzle port. It is characterized by having the following.

Further, the electronic component mounting apparatus of the present invention is provided with a plurality of air suction holes of the suction means on the same flat plate.

Further, the electronic component mounting apparatus of the present invention includes a degree of vacuum measuring means provided on the component suction nozzle, and a determining means for issuing a nozzle cleaning instruction when the degree of vacuum is equal to or higher than a predetermined degree of vacuum.

[Function] According to the configuration of the present invention described above, the suction nozzle can be efficiently cleaned because a suction means is provided for removing foreign matter clogging the component suction nozzle opening to the outside of the nozzle opening.

Further, according to the configuration of the present invention in which a plurality of air suction holes of the suction means are provided on the same flat plate, a plurality of component suction nozzles can be cleaned at the same time.

Further, according to the above-mentioned structure of the present invention, which includes a vacuum degree measuring means provided on the component suction nozzle and a judgment means for issuing a nozzle cleaning instruction when the vacuum degree is equal to or higher than a predetermined vacuum degree, the component suction nozzle is automatically operated. Can be cleaned.

[Embodiment] Hereinafter, a suction nozzle cleaning device according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 5 shows the external appearance of an electronic component mounting apparatus according to an embodiment of the present invention. The electronic components are sequentially delivered to predetermined positions by the supply section 4, and the component suction nozzle 1 sucks and holds the electronic components. Head section 2 having a large number of component suction nozzles 1
By rotating, electronic components are mounted on the printed circuit board 3.

FIG. 1 shows a cross section of the nozzle cleaning device.

According to the figure, a piston 2 having an air passage 4 opened coaxially with the nozzle opening is disposed on the lower surface of the orbit of a rotating suction nozzle 1, and the piston 2 is surrounded by a cylinder 3.
It is in close contact with The air passage 4 of the piston 2 has an opening A on the cylinder contact surface, and the cylinder 3 similarly has an opening B of the air passage 5 on the contact surface parallel to the nozzle axis direction. The air passage 5 has a vacuum pump 6 at its tip, and maintains a predetermined vacuum pressure at the opening B at all times. Also,
A compression spring 8 is inserted between the piston 2 and the cylinder 3, and the piston 2 is pressed and held downward by a lever 7 during the parts mounting process.

FIG. 2 shows a cross section during nozzle cleaning. During nozzle cleaning, after positioning the component suction nozzle 1 above a predetermined opening of the air passage 4, the lever 7 is removed and the piston 2 is pressed against the component suction nozzle 1 by the spring 8. The rubber packing 9 brings the nozzle tip and the air passage opening into close contact. At the same time, the air passage opening surface A and the air supply passage opening surface B coincide, and the air passage 4 of the piston and the air passage 5 of the cylinder are connected, so that a vacuum suction force is generated at the tip of the nozzle 1 via the air passage 4. Remove foreign matter clogging the nozzle tip. For this purpose, it is preferable that the vacuum force of the vacuum pump 6, the air passage 5, and the air passage 4 be larger (lower when expressed in vacuum degree) than the suction force of the component suction nozzle 1.

FIG. 3 shows the arrangement of the nozzle cleaning process with respect to the rotation of the head 2 of an electronic component mounting apparatus having ten suction nozzles. As shown in the figure, a nozzle cleaning unit 13 is provided below the head rotation track 11, and the nozzle is cleaned by moving the lever up and down based on the above-described configuration. In addition, in FIG. 3, 12 is a component supply section, and 14 is a component mounting section.

The nozzle cleaning unit 13 can be installed at any location between the component supply section 12 and the component mounting section 14. Also the third
In the figure, the head rotation orbit is clockwise, but it can also be counterclockwise.

Figure 4 shows the process of determining the degree of vacuum Po when the suction rate of electronic components is within the permissible range by measuring the degree of vacuum P in the suction nozzle when the head rotation orbit is clockwise, and In comparison, when the actual degree of vacuum P of the suction nozzle increases due to nozzle clogging and becomes P≧PO, means for issuing a nozzle cleaning command, and positioning a predetermined nozzle at a cleaning position in response to the nozzle cleaning command; It has a means for moving the lever 7 up and down as shown in FIG. 1, and it is possible to automatically clean the nozzle before the mounting rate of electronic components decreases.

As described above, according to the present embodiment, the piston 2 has the vacuum suction passage 4 whose opening is oriented on the operating trajectory of the suction nozzle 1, and the piston 2 is configured to press the opening against the suction nozzle 1. The spring 8 attached to the piston 2 is in close contact with the periphery of the piston 2, and when the vacuum suction opening in the suction nozzle 1 is pressed, the air suction passage 5 of the vacuum pump 6 provided outside and the vacuum inside the piston 2 are Since the cylinder 3 has a structure in which it is connected to the suction passage 4, it is possible to prevent a decrease in the suction power of electronic components and stabilize and improve the component mounting rate. Also,
A piston 2 having a vacuum suction passage 4 and a cylinder 3 having a vacuum suction passage 5 are arranged so that the valves are automatically opened and closed by vertical movement of the piston 2. By providing the opening 4 below the rotating orbital surface of the suction nozzle 1, the load on the vacuum pump 6 can be reduced when the component suction nozzle 1 is not being cleaned.

In addition, the suction nozzle can be cleaned without disassembling, removing and cleaning the suction nozzle, and the interruption time of component mounting work can be significantly reduced.

[Effects of the Invention] As described above, according to the present invention, the suction nozzle can be automatically and efficiently cleaned because a suction means is provided to remove foreign matter clogging the component suction nozzle to the outside of the nozzle. The excellent effect of being able to do this can be achieved.

Further, according to the configuration of the present invention in which a plurality of air suction holes of the suction means are provided on the same flat plate, a plurality of component suction nozzles can be cleaned at the same time.

Further, according to the above-mentioned structure of the present invention, which includes a vacuum degree measuring means provided on the component suction nozzle and a judgment means for issuing a nozzle cleaning instruction when the vacuum degree is equal to or higher than a predetermined vacuum degree, the component suction nozzle is automatically operated. Can be cleaned.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a front view of a nozzle cleaning device that is currently being installed and is not performing normal nozzle cleaning according to an embodiment of the present invention, and FIG.
3 is a functional explanatory diagram of each station for each mounting head, FIG. 4 is a control flowchart in one embodiment of the present invention, and FIG. FIG. 1 is a perspective view of an electronic component mounting machine according to an embodiment of the invention, and a function explanatory diagram of each station of a mounting head. 1... Suction nozzle 2... Piston 3... Cylinder 4... Air suction passage 5... Air suction passage 6... Vacuum pump 7... Lever
8...Spring 9...Rubber gasket 1o...
・Pressure gauge 11... Head rotation orbit 12... Component supply section 13... Nozzle cleaning unit 14... Component mounting section

Claims (3)

[Claims] (1) Electronic components supplied from the component supply section are sucked and held by multiple or one component suction nozzle provided on the circumference of a rotatable disk, and the electronic components are mounted in a predetermined position. 1. An electronic component mounting apparatus comprising: a suction means for removing foreign matter clogging the component suction nozzle port to the outside of the nozzle port. (2) The electronic component mounting apparatus according to claim 1, wherein a plurality of air suction holes of the suction means are provided on the same flat plate. (3) The electronic component mounting apparatus according to claim 1, further comprising a degree of vacuum measuring means provided on the component suction nozzle, and a determining means for issuing a nozzle cleaning instruction when the degree of vacuum is equal to or higher than a predetermined degree of vacuum.