JP4292329B2 - Electronic component cutting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to an electronic component such as an IC package.ofIt relates to a cutting device. More specifically, an electronic component for cutting a wiring board such as an IC package molded with a resin for each electronic component that is a product.ofIt relates to a cutting device.
[0002]
[Prior art]
Along with the high integration of semiconductors, a semiconductor device is manufactured by cutting a wiring board package mounted with a semiconductor such as an IC chip, such as a BGA (ball grid array), and resin-molded, that is, sealing a resin. Various methods have been proposed for individually cutting off the stopped IC packages.
[0003]
As an example of a method for separating a chip region in which a semiconductor element is formed, a method of cutting with a diamond saw using a diamond blade is one example. In addition, before dicing the semiconductor substrate, a treatment such as coating the back surface of the semiconductor substrate with a polyamide-based resin and bonding it to a dicing tape may be performed.
[0004]
Further, as a separation method, it is also known to cut the substrate in different directions with a grindstone that rotates at high speed by changing the direction of the table on which the semiconductor substrate is placed. In such a cutting process, a plurality of parts are arranged in advance and taped before cutting, and after cutting, cleaning is performed using a cleaning liquid to remove chips adhering to the product. Is currently underway.
[0005]
[Problems to be solved by the invention]
However, the conventional manufacturing methods have individual problems such as environmental aspects and cutting efficiency, and have not always improved efficiency. In other words, regarding the point of tape application, in addition to requiring tape application before cutting, when cutting with the tape applied, the grinding stone being cut becomes clogged, making it impossible to work or the product becoming defective. There was a problem. For this reason, it has been a disadvantage that cutting efficiency is poor and processing time is required.
[0006]
In addition, since cleaning after cutting was performed with cleaning water, there is a risk of heavy metal dissolution. Due to environmental issues, wastewater treatment is specially performed to clear cleaning water, resulting in a special burden and high cost. It was. In particular, a large amount of water is generally used for cleaning after cutting the IC package. If the IC package is poured into the drainage channel as it is, there is a risk that it may cause pollution caused by heavy metals such as copper. In addition, the use of water for cleaning also has the risk that water will invade the peeled portions and fine cracked portions of the laminated portion, corroding the laminated portion, and leaking, resulting in a defective product.
[0007]
For the cutting itself, there are many examples in which the same grindstone is used to index the table on which the wiring board or the like is mounted and change the direction, and the cutting in the different direction is performed again with the same grindstone. In comparison, the cutting time becomes longer. In the case of mass production, it is based on the process of configuring the line and performing the flow work, but generally the line is fixed as a dedicated line, so it is not flexible and the equipment is expensive and expensive. The space for it was also large.
[0008]
In particular, when a different wiring board or the like is changed, expensive jigs and tools have to be changed, and skill of processing is required, and time for replacement is also required. Even when the finished product was collected and stored, the case was stored again with the solder ball part facing down after reversing from the state after cutting. For this reason, storage also took time. Thus, the conventional method of cutting a wiring board such as an IC package mainly using a cleaning solution has been a problem associated with environmental pollution. For this reason, the cutting method which raises cutting efficiency and does not have environmental pollution has been desired.
[0009]
  The present invention has been made based on the above technical background and social background, and achieves the following objects.
  An object of the present invention is to provide an electronic component that uses compressed air and a sublimating jet, makes it possible to cut a wiring board with a cooling effect, does not use water, and is environmentally friendly and economical.ofTo provide a cutting device.
  Another object of the present invention is to improve the production efficiency of an electronic component by spraying a sublimation jetting body onto a cutting grindstone to prevent clogging of the cutting grindstone.ofTo provide a cutting device.
  Still another object of the present invention is to provide an electronic component that easily removes dust adhering by spraying a sublimation spray body onto a cutting portion.ofTo provide a cutting device.
  Still another object of the present invention is to reduce the total cost related to cutting by not using water.ofTo provide a cutting device.
  Still another object of the present invention is to improve the quality of electronic components by collecting dust in the cutting process and cleaning the electronic components in order to protect the electronic components being cut.ofTo provide a cutting device.
[0013]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention employs the following means.
  The electronic component cutting device of the present invention comprises:
  A positioning and fixing device for positioning and fixing a plate-shaped electronic component that is transported by a carrier and sealed with a resin;
  A cutting device for cutting the electronic component positioned and fixed by the positioning and fixing device;
  A compressed air supply device having a compressed air injection body provided near the cutting device for blowing compressed air at a cutting portion of the electronic component;
  A coolant supply device having a coolant injection port provided near the cutting device for injecting a coolant to be sublimated to a cutting portion of the electronic component;
  Electronic component cutting device comprisingIn
  The coolant supply device supplies liquid carbon dioxide gas to the coolant injection port and sprays dry ice powder.ShootDeviceThe
  The compressed air injection body and the coolant injection body are combined parts.The compressed air and the dry ice powder body are injected from the injection port (30a) of the injection port body (30).It is characterized by that.
  This combination can effectively inject the coolant into the cutting part with air momentum, enhance the cooling effect, cure the cutting part by cooling, improve the cutting efficiency by brittle fracture, and cut by injection Smooth removal of chips can be achieved.
[0015]
  Further, the compressed air jet is supplied from the compressed air supply device.ShootThe coolant injection into the passage supplied to the mouth or from the coolant supply device.ShootIn the route supplied to the mouthDuring the path of at least one ofWhat provided the ultrasonic generator is good. By applying ultrasonic vibration, it becomes possible to easily remove the adhering dust.
[0016]
Furthermore, it is preferable to provide a dust collector for collecting dust generated during cutting at the cutting portion of the cutting device. Further, it is preferable to provide a cleaning device for cleaning the cut electronic component. Furthermore, a storage device for storing the cut electronic component may be provided. Further, it is preferable that the coolant injection body or the compressed air injection body is provided in a cleaning unit of the cleaning device.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an example of an electronic component 1 to be cut by the apparatus of the present invention, which is commercialized by final cutting. FIG. 2 is an overall shape diagram showing a plate-like wiring board 3 as an electronic component before being cut. 3 shows an enlarged cross-sectional view of the portion of FIG. 2, and FIG. 4 further shows an enlarged cross-sectional view of the portion of FIG. The details will be described below.
[0018]
An electronic component 1 shown in FIG. 1 is an electronic component that is cut by the apparatus of the present invention and is generally called an IC package and is an electronic component in which an IC chip 2 is incorporated. The wiring board 3 is a wiring board such as a plate-like printed board before the electronic component 1 is cut. The wiring board 3 is an assembly in which a plurality of IC chips 2 are arranged as one of electronic-related parts, and the whole is protected by a protective mold 8 made of synthetic resin. Thus, the wiring board 3 forms an assembly of IC packages.
[0019]
In recent years, the IC package has been highly integrated, and the capacity of the IC package has been accelerated accordingly. However, the outer dimensions have become smaller, and the technology of the IC package itself has been greatly developed. As an example, there is a so-called BGA (ball grid array) applied to a mobile phone or the like. This BGA is a miniaturized electrode with a narrower pitch, and leads are arranged in an area array on the lower surface of the IC package.
[0020]
The present invention is applicable to the above-described BGA, and relates to a cutting technique in which the IC package is cut from the plate-like wiring board 3 and cut as a single product, that is, the electronic component 1. Next, this IC package will be described. The wiring board 3 is formed by laminating a plurality of thin films 6 of thermosetting resin such as epoxy. Between the thin films 6, metal lead wires 10 such as copper are wired so as not to cross each other, and are connected so as to sew between the upper and lower films 6, 6a, 6b. A plurality of IC chips 2 are laminated on the film 6 in a lattice shape and attached.
[0021]
Terminals of solder balls 7 connected to the IC chip 2 are provided on the lower surface of the IC package on which the IC chip 2 is mounted. This solder ball 7 is effective by facilitating mounting. Further, the upper surface of the IC chip 2 is covered with a protective mold 8 including a bonding wire 9 in order to protect the IC chip 2. This protective mold 8 is made of a thin thermosetting synthetic resin. The bonding wire 9 is a connection from the IC chip 2.
[0022]
The wiring board 3 is an assembly of the IC packages, and the IC chips 2 between the IC packages are recessed or covered with a protective mold 8 and are in the same plane, and the outer shape is a commercially available plate-like chocolate confectionery. It is similar and is a single board. The cutting portion is a concave portion between the IC chips 2, and the wiring board 3 is engraved or printed with cutting position marks 4 and 5 for recognizing the cutting position by an optical recognition device. Next, the cutting device of the present invention will be described in detail.
[0023]
(Overall configuration of the cutting device S)
FIG. 5 is an external view showing the overall configuration of the cutting device S of the present invention. The cutting device S recognizes the cutting position of the wiring board 3 to be cut and the cutting position of the wiring board 3 to be cut, a fixing device that positions and fixes the wiring board 3, a cutting device that cuts the wiring board 3, Dust collector that collects dust generated by cutting, cleaning device for product (electronic component 1) that is a cut IC package, and cooling device that cools and cleans the processing cutting part that forms the main part of the present invention And a storage portion 13 for storing the electronic component 1 after cutting.
[0024]
In FIG. 5, the wiring board 3 is conveyed through the conveying unit 11 from the left side facing the cutting device S. The central part of FIG. 5 is the processing part 12, and this processing part has the two 1st cutting processing apparatuses 17, the 2nd cutting processing apparatus 18, and its related apparatus. In addition, each of the accessory devices associated with the cutting processing includes a CCD camera 15 as a recognition device, a mounting table 19 on which the wiring board 3 is mounted, and a holding member as the devices related to the first cutting processing device 17. 20, a first cutting device 17, a dust collector 23, a rotating brush 41, and the like are installed. FIG. 5 shows the second cutting device 18 and the CCD camera 16 attached to the second cutting device 18.
[0025]
Since the first cutting device 17 has two dedicated processing portions in the present embodiment, each of the above-mentioned attachment devices is attached to each of the cutting devices. Further, a control device 14 for controlling the operation of each of these devices is provided in the upper portion of the processing unit 12. A storage unit 13 is arranged on the right side in FIG. 5 and is composed of a product carry-out device, a product storage box, and the like. The processing unit 12 described above is provided with a dust collector that collects dust after cutting, which will be described later, a cooling device that cools and cleans the cutting unit, a cleaning device, and the like.
[0026]
Furthermore, the overall configuration will be outlined. The transport unit 11 disposed on the left side in FIG. 5 is provided with a transport device, which holds the wiring board 3 and transports it to the processing unit 12. A CCD camera 15 as a recognition device is provided in the vicinity of the transport end so as to recognize the cutting position mark 4 stamped on the wiring board 3. A first cutting device 17 is disposed on the left side of the processing unit 12, and the first cutting device 17 is a device that cuts only one direction of the wiring board 3. The cut wiring board 3 is cut after being cut into the band-shaped wiring board 3 and then transferred to the second cutting device 18 by the transfer device. At this time, the CCD camera 16 as the second recognition device recognizes the second cutting position mark 5.
[0027]
The second cutting device 18 is installed adjacent to the first cutting device 17 while changing the direction by 90 degrees with respect to the first cutting device 17. The wiring board 3 is transferred from the first cutting device 17 to the second cutting device 18 two by two as it is by the transport device. The wiring board 3 is positioned and fixed on the basis of the position where the cutting position mark 5 is recognized by the CCD camera 16 recognizing the cutting position mark 5 as described above.
[0028]
After the wiring board 3 is positioned and fixed, the wiring board 3 is positioned at a position changed by 90 degrees with respect to the first cutting direction, and then cut by the second cutting device 18. An injection port body 30 (to be described later) is provided at a cutting portion of the first and second cutting processing devices 17 and 18 to perform cooling and cleaning.
[0029]
The wiring board 3 cut by the second cutting device 18 becomes a prototype of the electronic component 1. The wiring board 3 transported after being cut from the second cutting device 18 enters a cleaning process and is brushed by the rotating brush 41. When the brushing is finished in the cleaning process, the wiring board 3 is inverted as a product of the electronic component 1 and stored in the product storage box 45. In the present invention, a series of operations are systematically automated and aggregated as described above, and the devices are combined into a cutting device S. Although the overall configuration is as described above, each device will be further described.
[0030]
(Conveying section 11 of cutting device S)
Although not shown, the wiring board 3 conveyed from the outside of the cutting device S via the conveying unit 11 is positioned and conveyed at a predetermined position by the loader unit of the conveying device with the solder ball surface facing up. The transport unit 11 also serves as a storage and stores a plurality of wiring boards 3. At the time of cutting, the wiring board 3 is conveyed toward the cutting device 17 by the loader unit one by one.
[0031]
(Processing part 12 of the cutting device S)
The processing unit 12 includes a holding member 20 that is a positioning and fixing device for the conveyed wiring board 3, a CCD camera 15 that is a recognition device for positioning, a first cutting processing device 17 for the fixed wiring board 3, and A second cutting device 18, a conveying device for conveying the wiring board 3 from the first cutting device 17 to the second cutting device 18, a positioning fixing device (not shown) for positioning and fixing the conveyed wiring board 3, positioning Cleaning the dust-collecting device 23 for collecting dust generated by the CCD camera 16 for fixing, the first cutting processing device 17 and the second cutting processing device 18, and the wiring board 3 cut by the second cutting processing device 18. The cleaning device 40 and the like are configured.
[0032]
FIG. 6 is a three-dimensional view showing a holding member 20 that is a positioning and fixing device corresponding to the first cutting device 17. The conveyed wiring board 3 is placed on the placing table 19. The mounting table 19 has a vertically long shape and is provided with a cut groove 19a in the center and penetrates vertically. This cut groove 19a is a groove for allowing the rotary cutting tool 27 to pass through during cutting. A dust collection port 22 for collecting dust generated during cutting is connected to the cut groove 19a. Dust from the dust collection port 22 is guided to the dust collection device 23.
[0033]
Accordingly, dust-like chips generated in the lower part of the mounting table 19 during the cutting are sucked and collected by the dust collecting device 23 through the dust collection port 22. In addition, a plurality of small holes 19b are provided around the cut groove 19a of the mounting table 19 along the groove. This is for adsorbing and holding the wiring board 3 on the mounting table 19, and the wiring board 3 is adsorbed on the mounting table 19 by the suction force of the dust collector 23 through the small holes 19 b. At this time, the dust generated along with the cutting is sucked at the same time, so the suction force to the mounting table 19 is not so strong and is used supplementarily.
[0034]
In order to have the role of stably fixing, a dedicated suction fixing device independent of the dust collecting device 23 may be provided and sucked. The method of holding with the suction force is not necessary if the wiring board 3 is relatively large and heavy, but the necessity arises if the wiring board 3 is small and light. The wiring board 3 passes under the recognition device, that is, the CCD camera 15 before being mounted on the mounting table 19.
[0035]
The CCD camera 15 recognizes a figure of the position of the solder ball 7 on the wiring board 3 or recognizes a cutting position mark 4 provided in advance on the wiring board 3 to specify the position. Since the positional relationship between the CCD camera 15 and the mounting table 19 is determined, when the wiring board 3 is mounted on the mounting table 19, accurate positioning with respect to the rotary cutting tool 27 is performed by arithmetic processing. Next, the correctly placed wiring board 3 is fixed by the holding member 20 waiting above this.
[0036]
The holding member 20 has a configuration similar to the mounting table 19, and sandwiches the wiring board 3 with the mounting table 19. That is, the holding member 20 is lowered toward the wiring board 3 placed on the placing table 19 and sandwiches the wiring board 3. Similarly to the mounting table 19, the holding member 20 has a cut groove 21 through which the rotary cutting tool 27 can pass. Although not shown in the drawing, a lower portion of the pressing member 20 is made of a resilient synthetic resin, rubber, or the like, and is provided with a protrusion for preventing energization or charging. The protrusions prevent the wiring board 3 from being distorted when the wiring board 3 is fixed, and prevent dust-like chips from being scattered around.
[0037]
As described above, the wiring board 3 is clamped and fixed by the mounting table 19 and the holding member 20 and then cut by the first cutting device 17. The first cutting device 17 will be described with reference to FIG. A base 24 of the first cutting device 17 is fixed to an end of a conveying device (not shown), and an upper portion of the base 24 forms a guide so that a saddle 25 of the first cutting device 17 can be moved forward and backward. Guided across.
[0038]
The head 26 is fixed to the guide portion. In addition to the saddle, there is a moving axis for the movement of the head 26, and the head 26 moves in two axial directions. However, if the wiring board 3 side is configured to move, the head 26 may move only in one axial direction. The wiring boards 3 are conveyed one by one. The position of the wiring board 3 is identified by recognizing the cutting position mark 4 by the CCD camera 15 as a recognition device, and after the wiring board 3 is fixed on the mounting table 19, the wiring board 3 is moved by moving the head 26. Disconnect. Further, a driving device for these guides is not shown, but is a servo motor or the like, and the driving mechanism is performed via a ball screw (not shown).
[0039]
FIG. 8 is a configuration diagram of the head 26 in which the rotary cutting tool 27 is disassembled, and FIG. 9 is a configuration diagram of the head 26 to which the rotary cutting tool 27 is attached. The configuration of the head 26 will be described with reference to this figure. A rotary cutting tool 27 is rotatably attached to the head 26. The rotary cutting tool 27 is a diamond grindstone having a thin disk shape and is supported by the spindle 26a. The spindle 26a is supported by the head 26 and rotates at a high speed. The outer shape of the head 26 is a square in the present embodiment. Unlike the example shown in FIG. 8, the diamond grindstone is thin, so that only the cutting edge involved in actual cutting is projected from the holder.
[0040]
Vent holes 26b penetrating the four corners of the head 26 are provided (see FIG. 8). Dust generated along with the cutting is sucked to the rear of the head 26 through the vent hole 26b. The sucked dust is collected by the dust collecting device 23 via the dust collecting hose 23b. Although the outer shape of the head 26 is a square, when it is a cylinder, a pipe corresponding to the vent hole 26b may be used. When this pipe is used, a square partition cover may be provided and supported at the front portion of the head 26. In this way, the same effect as when the head 26 is square can be obtained. However, the rectangular shape allows a configuration that facilitates cooling, and other devices can be attached to the head 26.
[0041]
On the other hand, the rotary cutting tool 27 is bolted to the spindle 26a by a bolt 29 via a flange 28. Further, the head 26 is provided with a tool cover 27a so as to cover a cutting processing range around the rotary cutting tool 27. The dust sealed by the tool cover 27a is collected by the dust collector 23 through the vent hole 26b.
[0042]
Further, by placing the wiring board 3 below the rotary cutting tool 27 and rotating the wiring board 3 so that the rotation direction is downward, the chips are guided to the lower side, so that the chips are not discharged upward. Ingenuity is also made. The processing unit 12 is provided with a second cutting device 18 for changing the direction of the wiring board 3 and cutting again. However, since the configuration is substantially the same and the same function is provided, the following description will be made on the first cutting processing. Centering on the device 17.
[0043]
FIG. 10 shows an injection body 30 that is a part of the cooling device in a state where a dry ice powder body 30 b (cooling agent to be sublimated) is sprayed on the cutting portion of the first cutting processing device 17. The three spray nozzle bodies 30 are installed, and the dry ice powder body 30b is sprayed from the respective spray nozzles 30a toward the rotary cutting tool 27 of the first cutting device 17 cutting the wiring board 3. The three injection ports 30 a are arranged so that the dry ice powder body 30 b can be uniformly injected on the front and back of the rotary cutting tool 27. Although not shown, a dust collecting device is provided below the cutting portion, and sucks and collects powdered chips generated along with the cutting and dust including the dry ice powder.
[0044]
The dry ice powder body 30b is injected together with the compressed air. As shown in FIGS. 11 and 12, the injection device includes a compressed air supply device 31 (cooling device) and a coolant supply device, ie, dry ice supply. The apparatus (cooling apparatus) 32 is comprised. FIG. 11 shows the respective tanks of the compressed air supply device 31 and the dry ice supply device 32, that is, the compressed air tank 31a and the compressed carbon dioxide tank 32a, and the compressed air supply device 31 has a gauge 33 at the supply port. A flow controller 34 with a check valve is provided, and a gauge 35 and a flow controller 36 with a check valve are also provided at the supply port of the dry ice supply device 32.
[0045]
FIG. 12 shows a configuration of a supply system of liquid carbon dioxide gas that is a source of compressed air and dry ice up to a cutting section by an apparatus that stores these compressed air tanks 31a and 32a. Compressed air from the compressed air supply device 31 is guided to the injection port body 30 via the flow rate regulator 37. An ultrasonic generator 38 is provided in this supply path, and ultrasonic vibration is applied to the compressed air by passing the compressed air through the ultrasonic generator 38. This ultrasonic vibration is not necessarily required, but it is effective when attached. In this embodiment, the ultrasonic device is provided in the compressed air supply path. However, the ultrasonic apparatus may be provided on either side because the same effect can be obtained by providing it in the liquid carbon dioxide supply path.
[0046]
Also from the dry ice supply device 32, liquid carbon dioxide gas that becomes the source of powdered dry ice is guided to the injection port body 30 through the flow rate regulator 39. The liquid carbon dioxide gas guided to the jet body 30 sublimates when it is ejected from the jet port 30a. At this time, the compressed ice is jetted to the outside and the powder body 30b of dry ice is instantaneously discharged to the cutting portion. It becomes a mist and is injected from the injection port 30a. By this jetting, the cutting part is cooled and washed. The size of the injection port 30a is obtained by changing the hole area depending on the cutting conditions such as the cutting target.
[0047]
In order to obtain the optimal injection force that meets the cutting conditions, select the injection pressure and adjust the flow controller. These adjustments are performed by the operation panel of the control device 14. Although details are not shown, conditions are displayed on a liquid crystal display screen, and necessary setting conditions are input to perform setting work. When the powdered dry ice is released to the outside and sprayed to the cutting part, it sublimates and takes away the surrounding heat, thereby bringing about a cooling effect of the cutting part. At this time, since the ultrasonic vibration is given to the compressed air, the wiring board 3 which is the ejected cutting component is given the ultrasonic vibration, and the dust adhered firmly which is difficult to remove by normal cleaning can be removed. it can.
[0048]
Further, the high-temperature cutting heat generated at the time of cutting is taken away, and the dry ice powder sublimation heat leads to cooling, and fine dry ice is sprayed onto the cutting portion, thereby forcibly removing adhering dust and the like. This also has the effect of dry honing (also called dry shot), as seen in the case of removing and cleaning by spraying fine mineral powder. Furthermore, it is possible to prevent clogging of the grindstone by spraying it onto the grindstone which is the rotary cutting tool 27 for cutting. This is because even if the grindstone is clogged during cutting, the clogging is instantaneously removed by the shot effect.
[0049]
The three injection ports 30a described above are arranged to inject not only the cutting portion of the cutting portion but also the grindstone to be cut. By applying the present invention as described above, it is possible to perform cooling and cleaning without the need for water-cooling cleaning, etc., and further improve the cutting condition of the grindstone with the effect of preventing clogging and extend the life of the grindstone. It became a thing. There was no generation of harmful substances other than chips, and as a result, the operating rate of the cutting device was improved and the productivity of electronic parts was improved. Next, in consideration of the presence of fine burrs and the like generated in the cut portion after cutting, the removal must be performed. The apparatus will be described below.
[0050]
FIG. 13 shows the cleaning device 40. The cleaning device 40 includes a rotating brush 41, a dust collecting hose 42, a scraper 43, and a cover 44. The rotating brush 41 is formed by arranging thin brushes in a cylindrical shape, and the object is the wiring board 3. Therefore, the rotating brush 41 is made of a soft material, and dust adhered to the wiring board 3 by brushing by rotation, or Remove burrs, etc. The scraper 43 is comb-shaped, and contacts the rotating brush 41 via the ground wire to remove the charging of the rotating brush 41.
[0051]
A cover 44 is provided to cover the rotating brush 41 and the scrubber 43, and a dust collecting hose 42 is attached to one end of the cover 44. The dust collecting hose 42 collects the dust after brushing in a dust collector. Is for. An injection port body 30 is attached to the cleaning device. The spray body 30 is not necessarily required, but if it is installed to ensure cleaning of the brushed electronic component, the same effect as described above can be obtained. Furthermore, although not shown, it is even more effective when ultrasonic vibration is applied.
[0052]
(Product storage box 45 of the cutting device S)
The product storage box 45 is a device that stores the electronic component 1 that has been cleaned as a product. Although not shown, the electronic component 1 held by the clamping member is opened and stored in the product storage box 45 by the storage and transport device in an organized state. Although this storage form is not shown, it is performed in a three-dimensional operation by a robot of the storage and transfer device. A plurality of product storage boxes 45 are prepared. When one product storage box 45 has been stored, the product storage boxes 45 are unloaded and the next product storage box 45 is continuously placed at a predetermined position, and the same operation is continued.
[0053]
The present invention is configured as described above. Next, the operation will be described. The wiring board 3 conveyed with the solder ball surface facing upward is positioned on the mounting table 19 by the CCD camera 15 recognizing the cutting position mark 4. Subsequently, the holding member 20 waiting at the top is lowered to fix the wiring board 3. This fixing is performed by a protrusion at the bottom of the holding member 20.
[0054]
After being fixed, the first cutting device 17 passes through the mounting table 19 and the cut groove 20a of the holding member 20, cuts the wiring board 3 with the rotary cutting tool 27, and cuts out the elongated belt-like wiring board 3. At this time, the powder body 30b of the sublimated dry ice is sprayed from the spray body 30 provided in the cutting part, and the cutting part and the rotary cutting tool 27 are cooled. At the same time, dust such as chips is sucked and collected by the dust collector 23. The cut out wiring board 3 is positioned by recognizing the cutting position mark 5 by the CCD camera 16 on the mounting table of the second cutting processing apparatus without changing the direction.
[0055]
Subsequently, as in the case of the first cutting device 17, the holding member 20 is lowered to fix the wiring board 3. After fixing, it cut | disconnects with the 2nd cutting processing apparatus 17, and the plate-shaped wiring board 3 becomes an electronic component. This cutting is performed simultaneously by sending two rows simultaneously. The finally cut wiring board 3 is clamped by the bar-shaped clamping member as the electronic component 1 and passed through the cleaning device. The electronic component 1 is turned upside down during this conveyance process. The electronic component 1 that has been cleaned and has the solder ball surface down is stored in the product storage box 45 as a product by a robot.
[0056]
If the thickness of the grindstone of the rotary cutting tool 27 in the cutting apparatus is thick, heat is easily generated along with the cutting, and if it is thin, the strength is limited and the crack tends to break. The selection of this thickness is made optimal according to the conditions of the wiring board to be cut. The coolant injection conditions are set by the operation panel as described above.
[0057]
【The invention's effect】
  Electronic component of the present inventionofIn the cutting device, the wiring board was cut using a sublimation coolant, for example, a dry ice powder, without using a method of using water such as cooling water or washing water at the cutting portion of the cutting device. For this reason, adhesion of metals that are easy to melt even at low temperatures such as aluminum and copper is prevented, the cooling effect is great, and since it is dry cleaning, the risk of pollution caused by cleaning water etc. has been eliminated . In addition, the clogging of the cutting grindstone was prevented, so that the life of the grindstone was extended and the productivity of electronic parts was improved.
[0058]
Further, the dust attached can be easily removed by spraying a fine dry ice powder to produce a shot effect. Furthermore, since no cleaning water or the like is used, no apparatus for cleaning water treatment is required, so that the total cost associated with cutting is reduced. As a result, stable cutting work can be performed for a long time, and a product with a constant quality can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a product cut by a cutting device of the present invention.
FIG. 2 is an overall view of a wiring board cut by the cutting device of the present invention.
FIG. 3 is a cross-sectional view showing a partially enlarged view of FIG. 2;
FIG. 4 is a cross-sectional view showing a partially enlarged view of FIG. 3;
FIG. 5 is an external view showing the entire cutting apparatus of the present invention.
FIG. 6 is an external view showing a configuration of a fixing device.
FIG. 7 is an external view of a head showing a moving configuration.
FIG. 8 is an external view of a head to which a cover is attached, showing a state in which the rotary cutting tool is disassembled.
FIG. 9 is an external view of a head showing a state where a rotary cutting tool is assembled.
FIG. 10 is a plan view in which a cooling device is provided at a cutting portion.
FIG. 11 is a side view showing a compressed air tank of an air supply device and a liquid carbon dioxide tank of a dry ice supply device.
FIG. 12 is an explanatory diagram showing a system configuration for injecting a coolant.
FIG. 13 is an external view showing a cleaning device.
[Explanation of symbols]
1 ... Electronic components
2 ... IC chip
3 ... Wiring board
4, 5 ... Cutting position mark
7 ... Solder balls
8 ... Protective mold
11 ... Conveying section
12 ... Machining part
13 ... Storage section
14 ... Control device
15, 16 ... CCD camera
17, 18 ... Cutting device
19 ... mounting table
20: Holding member
23 ... Dust collector
27 ... Rotary cutting tool
30 ... Injection nozzle
31 ... Compressed air supply device
32 ... Dry ice supply device
38 ... Ultrasonic generator
40 ... Cleaning device
45 ... Product storage box

Claims (6)

A positioning and fixing device for positioning and fixing a plate-shaped electronic component that is transported by a carrier and sealed with a resin;
A cutting device for cutting the electronic component positioned and fixed by the positioning and fixing device;
A compressed air supply device having a compressed air injection body provided near the cutting device for blowing compressed air at a cutting portion of the electronic component;
In an electronic component cutting device comprising: a coolant supply device having a coolant injection port body that is provided in the vicinity of the cutting processing device and injects a coolant that sublimates the cutting portion of the electronic component .
The coolant supply apparatus, Ri apparatus der for morphism injection of dry ice powder material supplying liquid carbon dioxide into the coolant injection port body,
The compressed air injection port member and the cooling agent injection port body constitutes coalesced component der Ru injection port body (30), said dry ice powder body and the compressed air is the injection port body (30) The electronic device cutting apparatus is characterized by being ejected from an ejection port (30a) . The electronic component cutting device according to claim 1 ,
The compressed from the air supply device in the path to be supplied to the compression air Kibuki morphism port body, or the coolant at least one of said pathway in the path to be supplied to the coolant jetting port body from the supply device cutting device for an electronic component, characterized in that a ultrasonic wave generating device. The electronic component cutting device according to claim 1 or 2 ,
An electronic component cutting device, wherein a dust collecting device for collecting dust generated during cutting is provided at a cutting portion of the cutting processing device. The electronic component cutting device according to claim 1 or 2 ,
An electronic component cutting apparatus comprising a cleaning device for cleaning the cut electronic component. The electronic component cutting device according to claim 1 or 2 ,
An electronic component cutting device comprising a storage device for storing the cut electronic component. The electronic component cutting device according to claim 4 ,
The electronic component cutting device according to claim 1, wherein the coolant spray port body or the compressed air spray body is provided in a cleaning section of the cleaning device.

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